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Architectures for molecular electronic computers: 3. Design for a memory cell built from molecular electronic devices MITRE McLean, Virginia Greg Y. Tseng James C. Ellenbogen MP 99W0000138 October 1999

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Page 1: Architectures for molecular electronic computers: 3 ... · Molecular electronics is an approach for drastically decreasing the size and increasing the density of electronic circuits

Architectures for molecular electronic computers:3. Design for a memory cell built from molecularelectronic devices

MITREMcLean, Virginia

Greg Y. TsengJames C. Ellenbogen

MP 99W0000138October 1999

mastro
Text Box
Approved for Public Release; Distribution Unlimited Case # 05-1426
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Page 3: Architectures for molecular electronic computers: 3 ... · Molecular electronics is an approach for drastically decreasing the size and increasing the density of electronic circuits

Sponsor MITRE MSR ProgramProject No. 51MSR89GDept. W062

Approved for public release;distribution unlimited.

Copyright © 1999 by The MITRE Corporation.All rights reserved.

Greg Y. TsengJames C. Ellenbogen

MITRE Nanosystems Group

e-mail: [email protected]: http://www.mitre.org/technology/nanotech

Architectures for molecular electronic computers:3. Design for a memory cell built from molecularelectronic devices

MP 99W0000138October 1999

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ABSTRACT

This paper proposes and explains a design for a digital electronic memory cell that is built solely from molecularelectronic devices. The molecular-scale memory cell is modeled after the much larger, micron-scale cell in solid-state nanoelectronic tunneling static random access memory (TSRAM), which has been demonstrated recently.The underlying elements concerning both molecular-scale electronic devices and microelectronic memoryarchitecture are reviewed en route to their synthesis in the design of the molecular electronic TSRAM (i.e., ME-TSRAM) cell. Quantitative theoretical analysis is performed on the proposed ME-TSRAM memory cell, which is asimple planar aromatic molecule measuring only 8 nm by 5 nm. Specifically, ab initio quantum mechanicalcalculations are performed to estimate the capacitances of the various components of the proposed memory cell.On that basis, it is concluded that if it were fabricated, the ME-TSRAM cell would be likely to function as desired.Finally, various fundamental molecular memory cell design issues and architectural challenges are enumeratedand discussed. In making and analyzing these specific design proposals for molecular-scale electronic memory,this work attempts to explore the ultimate limits of electronic memory circuit miniaturization.

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TABLE OF CONTENTS

I. INTRODUCTION ........................................................................................................................ 1

II. BACKGROUND.......................................................................................................................... 4

A. Polyphenylene-based molecular electronic devices 4

1. Molecular wires 4

2. Molecular rectifying diodes 4

3. Molecular resonant-tunneling diodes 4

4. Molecular resonant-tunneling transistors 6

5. Gold nanocrystallites 6

B. Basic principles of microelectronic memory 6

C. Tunneling-based SRAM 8

III. MOLECULAR ELECTRONIC MEMORY CELL .......................................................................... 8

A. Design 8

B. Requirements upon structural and operational parameters 9

1. Capacitance 9

2. Switching times 12

C. Calculation of capacitance 12

D. Calculation of switching times 15

IV. DISCUSSION ............................................................................................................................. 15

A. Fundamental cell design issues 15

1. Combining individual devices 15

2. Charge sharing 15

3. Stabilization of bit state 15

4. Mechanisms of conductance 15

B. Architectural challenges 16

1. Energy dissipation 16

2. Addressing 16

3. Chemical assembly and defect tolerance 16

V. SUMMARY AND CONCLUSIONS .............................................................................................. 17

A. A step toward a compatible ultra-dense electronic memory 17

B. An essential step toward important societal goals 17

ABOUT THE AUTHORS................................................................................................................... 18

ACKNOWLEDGMENTS.................................................................................................................... 18

REFERENCES.................................................................................................................................. 19

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LIST OF FIGURES

Figure 1. Designs for a Tunneling-based Static Random Access Memory (TSRAM) cellwhich is implemented with molecular electronic devices ............................................................ 2

Figure 2. Tunneling-based Static Random Access Memory (TSRAM) ...................................... 3

Figure 3. Diagrams of various molecular electronic devices...................................................... 5

Figure 4. Schematic circuits for 2 by 2 cell lattices of three classes ofmicroelectronic memory .............................................................................................................. 7

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LIST OF TABLES

Table 1. Comparison of various features of the DRAM, SRAM, TSRAM, and ME-TSRAMdesigns........................................................................................................................................ 10

Table 2. Area per bit for standard, emerging, and projected solid-state electronicmemories and projected area per bit for proposed molecular electronic memory(all values are in units of square nanometers) ............................................................................ 11

Table 3. Calculations of capacitance for bit line and various candidates for storage nodein ME-TSRAM ............................................................................................................................. 14

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I. INTRODUCTION

Complementary to our earlier work on molecularelectronic logic [1,2], this paper describes a newdesign proposal for a nanometer-scale molecularelectronic memory cell. The design of the molecularelectronic memory cell is analogous to one for amicron-scale quantum-effect memory cell thatalready has been implemented successfully usingmore conventional solid-state materials [3-8]. It isdescribed in detail here how such a memory cellmight be shrunk drastically in size by implementing itusing conductive molecular wires, capacitors, andswitches that have been demonstrated in previousexperiments [9-21] or proposed in previoustheoretical investigations [1,2,22]. This molecularimplementation of an electronically addressableinformation storage cell would have dimensions ofonly approximately 8 nm by 5 nm. Two variants ofthis molecular electronic memory cell design arediagrammed in Figure 1.

Based upon this ultrasmall design, quantitativeanalyses are conducted in Sections III.C and III.D ofthis work to elucidate the principal structural andoperational parameters governing such a molecularelectronic memory cell. Particular emphasis isplaced here upon understanding and determining (1)the capacitances required to store and readinformation in the form of one or a few electrons and(2) the switching times required for the memory cellto operate at reasonable speeds. By consideringthis specific design proposal, one may examine indetail many of the fundamental cell design issuesand architectural challenges for ultrasmall molecular-scale electronic memory that also are more broadlyapplicable.

The unprecedented small dimensions of thememory cell design shown in Figure 1 would meanthat a regular two-dimensional array of suchmolecular memory cells should be capable of storingas many as 25 Gigabits of information per squaremillimeter. This is approximately one million timesas dense as digital information can be stored todayin conventional solid-state microelectronic memories[23]. In fact, since each component of the memorycell would be a single small molecule, it isreasonable to consider this design as being close tothe ultimate in miniaturization for two-dimensionalconductive electronic memory. Further, since arraysof these individually addressable molecularelectronic memory cells would be planar, withthickness comparable to that of a molecularmonolayer, the two-dimensional arrays may bestacked in three dimensions to increase theireffective planar storage density even further, withoutsignificantly increasing their effective volume. For

the reasons outlined above, including the extremelysmall size of its substituent molecular components,the designs in this work may be considered to beexplorations of the ultimate limits of electronicmemory circuit miniaturization.

The design strategy is simple for the ultra-smallmolecular electronic memory cell proposed here.The memory cell is assembled from conductivepolyphenylene-based molecular subunits [2], inaccordance with the schematic circuit diagramshown in Figure 2(a). This schematic for a quantum-effect nanoelectronic memory cell termed Tunneling-based Static Random Access Memory (TSRAM)originally was developed and demonstrated inamorphous solid semiconductor materials by van derWagt et al. of Raytheon-TI Systems [3-7].

This TSRAM approach is attractive because, asis detailed below, it combines many of theadvantages of both conventional Static RAM(SRAM) and Dynamic RAM (DRAM), while avoidingmost of their respective disadvantages. The TSRAMdesign also is particularly attractive amongst variousnanoelectronic solid-state memory designs [24-27]that might be implemented more compactly usingmolecular components. This is because TSRAMcontains only components for which molecularanalogs have been demonstrated or proposed, and,especially, TSRAM relies in its operation uponquantum effects that readily occur in these knownconductive molecular devices.

Thus, these molecular devices or subunits thatwere developed in earlier work are assembled in themolecular electronic TSRAM (ME-TSRAM)structures shown in Figure 1 in accordance with thegeneral TSRAM schematic of Figure 2(a). Thesemolecular electronic devices include molecular wiresfabricated by Tour et al. [9,10,12,13], thendemonstrated by Weiss et al. [14]. A goldnanocrystallite, demonstrated by Reifenberger et al.[20,21], is employed as a capacitor in the molecularelectronic memory cell implementation proposed inFigure 1(a). Purely molecular porphyrinicalternatives also are considered for use as acapacitor or bit storage node. Finally, thecomponent devices include two-terminal molecularresonant-tunneling diode switches that recently havebeen synthesized by Tour et al. [10,13] anddemonstrated by Reed et al. [19,28,29], plus three-terminal molecular electronic resonant-tunnelingtransistor switches proposed by Ellenbogen [2].

Below, in Section III, the specifics of the ME-TSRAM design proposal are presented, andquantitative analyses of this proposal’s principalstructural and operational parameters (capacitance

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.

CH2CH2

X

YDrain

Gate

Bit Line

Word Line...

..

...

SSource

~5 nm

...

~8 nm

Au StorageNode

Nanocrystallite

CH2CH2

Molecular TransistorV

(a) S V+

SHCH2CH2

S

GNDSHCH2CH2

Molecular RTDV

.

CH2CH2

X

YDrain

Gate

Bit Line

Word Line...

..

...

Source

~5 nm

...

~8 nm

Metallo-porphyrin

Molecular TransistorV

CH2CH2

(b) MolecularStorage

NodeN

NN

NM

V+

SHCH2CH2

GNDSHCH2CH2

Molecular RTDV

NOTE: X = Electron donating group (e.g., OCH, CH3); Y = Electron accepting group (e.g., CF3, CN);M = Metal atom (e.g., Mg, Mn, Cu, Fe, etc.)

Figure 1

Designs for a Tunneling-based Static Random Access Memory (TSRAM) cellwhich is implemented with molecular electronic devices and includes as the storage node

(a) a gold nanocrystallite and (b) a porphyrin molecule

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(a)

(b)

...

V+

Transistor

SourceDrain

Gate

Storage Node(Capacitor)

GND

... ...

...

Word Line

Bit Line

V

RTD2

V+

VSN

ISN RTD1

RTD2Stable Voltage Points

RTD1

Figure 2

Tunneling-based Static Random Access Memory (TSRAM): (a) Schematic circuit of Raytheon-TI design for aTSRAM cell and (b) current-voltage (I-V) characteristics at the storage node (SN); note the two stable points.

Adapted from [6];

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and switching times) are performed. In Section IVvarious other fundamental cell design issues andarchitectural challenges are enumerated anddiscussed. First, however, in Section II.A we providebackground on the essential elements of molecularelectronics that underlie this proposed molecularelectronic implementation of a memory designborrowed from solid-state nanoelectronics. Then, inSection II.B we describe the basic principles ofmicroelectronic memory, some of which aremanifested in the nanoelectronic TSRAM design asdescribed in Section II.C.

II. BACKGROUND

Molecular electronics is an approach fordrastically decreasing the size and increasing thedensity of electronic circuits by building them fromwires and switches that consist of individualcovalently bonded molecules [1,30,31]. Proposalsfor molecular electronic devices and systems dateback to the seminal work of Aviram and Ratner in1974 [22]. Only recently, however, haveexperimental results and associated theoreticalanalysis demonstrated that small molecules haveelectrical properties which seem to make themappropriate for use in building electrically conductivedevices and circuits [19,32-37].

Presently, there are two primary types of smallmolecules that have been proposed anddemonstrated for use in molecular electronic circuits.These two types of molecular backbones are: (a)polyphenylene chains [1,2,29], and (b) carbonnanotubes [38-46]. A number of the designconsiderations outlined here for polyphenylene-based molecular memory circuits also would apply tomolecular memories built from carbon nanotubes orother molecular-scale structures. However, only thepolyphenylene-based molecular components will bereviewed here because our proposal for molecularelectronic memory is polyphenylene-based. Inparticular, developments in regard to five types ofmolecular electronic components, which have beenreviewed more extensively elsewhere [1], will bediscussed here in brief: wires; rectifying diodes;resonant-tunneling diodes; resonant-tunnelingtransistors; and gold nanocrystallites.

A. Polyphenylene-based molecular electronicdevices

1. Molecular wires. An exciting recentdevelopment in molecular electronics is thedemonstration of the most basic polyphenylene-based electronic device: the "Tour wire" [9,10,12,13].In 1996, after extensive theoretical research [12,47-

50], these chains of organic aromatic benzene ringswere shown experimentally to conduct smallelectrical currents like wires [14,20]. A Tour wire isillustrated in part (a) of Figure 3. Previously, Tour etal. refined the synthetic techniques for conductivepolyphenylene chains (molecular wires) bydeveloping precise synthetic methods that produceenormous numbers of these molecules (~1023),every one of which is of exactly the same structureand length [11,12,51].

2. Molecular rectifying diodes. Another recentexperimental development is the demonstration ofmolecular electronic rectifying diodes or "molecularrectifiers" [15-18], which are similar to thoseproposed by Aviram and Ratner in the first scientificpaper on molecular electronics [22]. A typicalmolecular rectifier, as depicted in Figure 3(b),introduces electron acceptor and donor substituentsinto benzene ring-based structures so that itbecomes more difficult to conduct electrical currentin the reverse direction than in the forward direction(i.e., a much larger reverse bias voltage than forwardbias voltage is required to conduct current). Toextend these developments further, efforts areunderway to propose and characterizepolyphenylene-based rectifiers which should bemore appropriate in structure for building digitalcircuitry with a backbone of Tour wires [1,33].

3. Molecular resonant-tunneling diodes.Alongside the progress of rectifying diodes,molecular electronic resonant-tunneling diodes(RTDs) have been synthesized and demonstratedrecently. Shown in Figure 3(c) is a diagram of amolecular RTD that has only very recently beensynthesized by Tour [10,13] and demonstrated byReed [19,28,29]. Structurally and functionally, thisdevice is simply a molecular analog of the muchlarger solid-state RTD [31]. The RTD operates uponthe physical principle that electrons can tunnelquantum mechanically through a barrier when theenergy of the incident electrons is in alignment withone of the quantized energy levels on a narrow“island” between two barriers to electron tunneling.In an RTD, the bias voltages can be adjusted to shiftthe energy levels of the island in and out ofalignment with the energy of the incident electrons.Since there are multiple energy levels in the barrier,there are actually multiple "on" and "off" states for anRTD. Such characteristics exemplify the newpossibilities in electronic circuit design madepossible by devices which operate upon quantumeffects. This has been and will continue to beimportant and advantageous in the design ofextended nanoelectronic solid-state [52,53] andmolecular [1,2] circuitry. However, one crucial factabout diodes, whether micro-, nano-, or molecular

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(e)Au

• • •(a)

Au

AuX

R

Y

S

S

(b)

AuAu(c)

(d)

GateContact

R

XCH2CH2 S

S

Y

Au

Au

Au

SSourceContact

DrainContact

DonorComplex

AcceptorComplex

GateComplexGate Insulator

Au

Au

Au

CH2 CH2S• • •S

Figure 3

Diagrams of various molecular electronic devices: (a) Tour wire; (b) rectifying diode;(c) resonant-tunneling diode (RTD); (d) resonant-tunneling transistor (RTT); and (e) gold nanocrystallite;

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electronic, still remains: there is no amplification (or"gain") of voltage.

4. Molecular resonant-tunneling transistors.To achieve gain in a switching device, a three-terminal switch or "triode" is required. Though theyhave not been synthesized or demonstrated, variousflavors of resonant-tunneling transistors (RTTs),three-terminal devices with the ability to producegain, have been conceptualized [2]. A typicalmolecular RTT, as diagrammed in Figure 3(d),operates on the same physical principle of quantumtunneling as the RTD. However, in the RTT, theshifting of the energy levels in the tunnel barrier iscontrolled by the voltage on the third "gate" terminal,not by the bias voltage. In this scheme, a small gatevoltage modulates a much larger source-drain biasvoltage; hence, the RTT exhibits gain. Therefore,the RTT is a crucial element in designing circuitswhich require amplification [2].

5. Gold nanocrystallites. In recent years,researchers have succeeded in refining methods tosynthesize nanometer-scale clusters of gold atomsand adsorb them to molecules for the storage ofcharge and other uses [20,21]. One such cluster isdepicted in Figure 3(e). Although such clusters arenot polyphenylene-based, as are the other molecularcircuit components discussed here, they are of thesame scale and have very desirable propertiescomplementary to those of the polyphenylenes,especially for molecular electronic memories.

Developments in polyphenylene-basedmolecular electronics such as those discussedabove suggest that it may be possible to fabricateextended electronic circuits out of molecules.Research in extended circuitry is in progress andadvances have been made in designing logic circuits[1,2]. To drive the development of molecularcircuitry into the realm of memory, it is necessaryfirst to review the basic principles of microelectronicmemory.

B. Basic principles of microelectronic memory

Although data may be stored in a variety ofdevices, in this section, the term "memory" is takento refer only to fast electronically addressable digitalinformation storage, usually random access memory(RAM) with no moving mechanical parts [54]. Here,we outline defining characteristics of electronicmemory and then discuss in more detail basicprinciples of three classes of conventionalmicroelectronic memory.

Data is stored in digital electronic memories asarrays of bits, each of which has the value one or

zero. All electronically addressable memory consistsof memory "cells," each of which stores one bit. Ingeneral, a memory cell has two requirements: (1)that its state can be changed to represent a one or azero and (2) that its state can be sensed. There area number of arrangements of linked electronicallycontrolled switches (and other devices) that satisfythese requirements.

Electronically addressable memory falls into twobroad categories, read only memory (ROM) andrandom access memory (RAM). RAM is furthersubdivided into dynamic RAM (DRAM) and staticRAM (SRAM). The conventional microelectronicvariants of these three classes of memory—ROM,DRAM, and SRAM—share a number of similarfeatures. Figure 4 compares the structures of thesethree classes of microelectronic memory. Observethat they all consist of regular arrays of individualmemory cells connected to other cells by a two-dimensional lattice of wires. Each cell contains atleast one transistor-like switch, as indicated by thepresence in Figures 4(a)-(c) of the three-terminalschematic symbol for a transistor. The maindifference between these classes of memory is inthe structures of their respective memory cells. Thestructural differences give each class of memorydistinctive capabilities, as well as distinctiveoperational approaches to storing and accessinginformation.

ROM cells, as shown in Figure 4(a), store logicalones and zeros as disabled transistors (those thathave been "written" by deactivating them) andenabled transistors (those that still can be activated),respectively. This structure makes read-onlymemory unalterable—i.e., the bits cannot bechanged. It is also "nonvolatile"—i.e., the bitsremain intact even when the power is turned off [55].

In contrast, RAM is alterable and volatile. Thatis, the memory supports both read and writeoperations, but it loses its contents when the poweris turned off. Each DRAM cell shown in Figure 4(b)consists primarily of a tiny capacitor on which chargeis stored to represent a bit. However, this chargenormally dissipates within milliseconds, so DRAMrequires a mechanism for periodically refreshingstored charges.

The SRAM cell diagrammed in Figure 4(c) is a"flip-flop," a logic structure constructed from the sixtransistors connected by the combination of bar-likeand cross-like wires. (Sometimes electricalengineers refer to this structure as "cross-coupledinverters.") Inherent in this logic structure is thecontinuous feedback of signals that allows logical

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(a)

(b)

(c)

Q00 Q01

Q10 Q11

Q00 Q01

Q10 Q11

Cell 00 Cell 01

Cell 11Cell 10

Figure 4

Schematic circuits for 2 by 2 cell lattices of three classes of microelectronic memory: (a) Read Only Memory(ROM); (b) Dynamic Random Access Memory (DRAM); and (c) Static Random Access Memory (SRAM);

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ones and zeros to be stored indefinitely, or at leastuntil the power is turned off.

In comparing these two classes of RAM, we notethat SRAM is faster and requires less power,because its gate transistors are optimized for speedand its operation does not require a refresh. DRAMhas the advantage of being denser because itrequires fewer components, but it is slower andconsumes more power because each cell requiresrefreshing periodically [54-57]. Thus, DRAM andSRAM each have significant advantages anddisadvantages.

C. Tunneling-based SRAM

The advantages of both conventional DRAM andSRAM are incorporated in the new Tunneling-basedSRAM or TSRAM cell. Researchers at Raytheon-TIhave developed and tested this novel "hybrid"approach to memory design, which uses bothmicroelectronic and nanoelectronic devices [3-7]. Itis because the TSRAM exploits the uniqueproperties of quantum-effect nanoelectronic devicesthat it is able to combine the advantages of DRAMand SRAM.

Observe in Figure 2(a) that the TSRAM cell isstructurally similar to DRAM. The difference is theaddition of a pair of RTDs that together make an“RTD latch” coupled to the storage node. Note thatthe voltage at the storage node VSN determines thebias voltages across both RTDs in the latch.Because of this and the peak-valley current-voltagecharacteristics of an RTD, this latch maintains onlytwo stable voltages at the storage node [4,5], asdepicted in Figure 2(b). These two stable voltages,corresponding to high or low charge on the storagenode, are taken to represent a one or a zero,respectively. This allows a TSRAM cell, consistingof only one transistor, two RTDs, and a capacitiveelement, to store a bit statically (i.e., without globalrefresh as in DRAM) [6]. To write or read a bit, thegate is charged, allowing the phenomenon of chargesharing to alter selectively the voltage on the bit lineand the storage node.

Here we consider primarily the details for theread operation, since those set the lower bound onthe capacitance that the molecular-scale storagenode must have in order for the cell to function. Thisis of interest because it is not a given that a smallmolecular structure will have sufficient capacitanceto store information in the form of additional electriccharge.

During the read operation, if the cell was in theone state, then the bit line voltage is altered

measurably; and if the cell was in the zero state,then the bit line voltage remains unchanged. Ineither case, after charge sharing (explained in moremathematical detail in Section III.B.1) the cell will bein the zero state. Hence, refresh after readout isrequired, although global periodic refresh is not.Thus, TSRAM encompasses the advantagesinherent in both the operation of SRAM and thestructure of DRAM.

Due to its relatively simple structure, a solid-state TSRAM cell occupies only ~150 mm2 in area,which is significantly smaller than a standard solid-state microelectronic SRAM cell, though somewhatlarger than a standard DRAM cell, as expected [6].Also, the static operation of TSRAM requires muchless power than conventional memories, and it isvery fast. SPICE modeling predicts sub-nanosecondaccess times [6]. Since the TSRAM offers thesemany advantages, and a 16-cell system has beentested in solids, we choose to utilize this design asthe basis for our proposed molecular electronicmemory design. It seems likely that the quantumeffects upon which the TSRAM cell relies would bereadily adapted and even enhanced [58] byassembling such a memory cell from ultrasmallmolecular components.

III. MOLECULAR ELECTRONIC MEMORY CELL

A. Design

We combine the above-described developmentsin molecular electronic devices with the solid-stateTSRAM design to propose molecular electronicimplementations of TSRAM or ME-TSRAM, asdiagrammed in Figure 1. In Figure 1(a), observe thatthe various elements of the TSRAM design are builtfrom molecules. These molecules serve in the rolesof the wires, RTDs, and transistor needed toimplement the memory cell circuit described in theschematic in Figure 2. Further, a goldnanocrystallite serves as a capacitive storage nodefor one or a few electrons. Of the several variants ofmolecular transistors, an enhancement mode ME-RTT [2] is chosen to serve as the three-terminalswitching element in the ME-TSRAM cell because itis most similar in function to the three-terminalswitching element employed in the demonstratedsolid-state TSRAM. An enhancement-mode ME-RTT is one that is “off” (i.e., current is blocked fromflowing through it) when there is no voltage appliedto the gate and is turned “on” (i.e., current is allowedto flow through it) by a voltage applied to the gate,just as is required of a solid-state transistor in asimilar role.

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It is noteworthy that the molecular electronicmemory cell diagrammed in Figure 1(a) wouldmeasure only about 8 nm by 5 nm, which is morethan one million times smaller in area than thecorresponding solid-state TSRAM cell. In fact, itmay be reasonable to consider the present designas being the ultimate in miniaturization forconductive electronic memory, or very close to thatlimit. This and other advantages of ME-TSRAM aresummarized in Table 1, which compares the varioustypes of electronic memory that have beendiscussed above. In Table 1, a check (3) refers toan advantage while an “X” (5 ) refers to adisadvantage. Note that all three features--speed,power, and, especially, size--are advantages of ME-TSRAM.

To illustrate explicitly the size advantage andprovide further comparison, we present in Table 2the area per bit for current standard microelectronicmemories [23], emerging solid-state nanoelectronicmemory [6], and projected microelectronic memories[23] alongside our estimated size for the proposedmolecular electronic memory. It is significant to notethat a molecular TSRAM with bit area of ~40 nm2

could be over one million times smaller than its solid-state nanoelectronic counterpart, the "hybrid"TSRAM with a bit area of 1.5 × 108 nm2.Additionally, it is significant to note that the ME-TSRAM bit area still would be over one thousandtimes smaller than the bit area of 5.5 × 1 04 nm2

projected for DRAM in the year 2007.

The ME-TSRAM derives its size advantage inpart from the fact that it proposes to represent a bitby storing one or a few electrons on the goldnanocrystallite. However, this type of storage nodeprevents the memory cell from being purelymolecular. This goes beyond an issue ofnomenclature: it presents an issue for the synthesisof the memory cell. To fabricate the structure inFigure 1(a), the molecules surrounding the goldcluster would be adsorbed, not covalently bonded, toit. This could introduce a synthesis problembecause memory cells must be produced by thetrillions. This feat is likely to be routine for a purelymolecular cell [11,51], but arduous for one withdisparate types of molecular-scale components.Thus, it would be advantageous if the memory cellwere to consist of only covalently bonded molecularsubunits. It is desirable, therefore, to considerreplacing the experimentally studied goldnanocrystallite with a sort of "molecular capacitor."

Specifically, we consider replacing the goldnanocrystallite with a porphyrin molecule as thestorage node of the memory cell design in Figure1(a). Observe in Figure 1(b) the insertion into the

ME-TSRAM cell of this candidate for a molecularcapacitor results in a design for a purely molecularelectronic memory cell. It is reasonable to considera porphyrin molecule as a molecular capacitorbecause it may be inferred from experiments thatsuch molecules have a sufficiently high“capacitance,” just as is required in storage nodesfor larger microelectronic memory cells [59-60].

Porphyrins constitute a family of molecules,commonly found in nature. The structure of eachporphyrin molecule is a large macrocyclic ring oftwenty carbon atoms and four nitrogen atoms withperhaps a metal atom bound in the center [60], suchas is shown in Figure 1(b). These molecules,examples of which are hemoglobin and chlorophyll,are known to be "reaction centers" in charge transferreactions, such as those which occur inphotosynthesis. Implicit in charge transfer, theacceptance and donation of charge, is the storage ofcharge. Noting this, we may plausibly infer that aporphyrin molecule is a kind of molecular capacitor.Other candidates for molecular capacitors includethe fullerenes C6 0 and C70, which have beendiscussed elsewhere in connection with molecularelectronics [39].

Thus, to examine the efficacy of variouscandidates for a molecular storage node, and henceto analyze the key element of the ME-TSRAM, wemust consider their capacitances in a morequantitative manner. This will also give insight to theRC time constant, which is a measure of switchingtime for the memory cell. However, beforedetermining whether the various candidates for amolecular storage node meet the requirements ofcapacitance and switching times, we need first toestimate the requirements of such parameters.

B. Requirements upon structural and operationalparameters

1. Capacitance. There are two requirementsthat set the lower bounds on the capacitanceneeded in the molecular electronic storage node.The first requirement is absolute and fundamental,while the second is relative and practical.

In accordance with the relation involvingcapacitance Q = CV, a fundamental lower bound onthe capacitance C would be 0.020 aF, correspondingto maximum potential V of 8 volts being applied tostore a charge Q equivalent to one electron. Thiscapacitance is an absolute lower limit for the storagenode, because a voltage greater than approximately8 volts may dissociate or ionize various parts of themolecular memory cell.

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Design Size

DRAM

SRAM

TSRAM

ME-TSRAM

Features

Speed Power

✕Slowperiodic refresh is required

✓Fastrefresh never required

✕Inefficientperiodic refresh is required

✓Efficientrefresh never required

✕Largeuses six devices

✓Smalluses two devices

✓Small-MedDRAM + 2RTDs

Very Smallbuilt from molecules

✓ ✓

✓Fastperiodic refresh not required

✓Fastperiodic refresh not required

✓Efficientperiodic refresh not required

✓Efficientperiodic refresh not required

NOTE: ✓ = advantage; ✕ = disadvantage.

Table 1

Comparison of various features of the DRAM, SRAM, TSRAM, and ME-TSRAM designs

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Type of Memory Status Area per bit (nm2)

MITRE Molecular ElectronicMemory (MITRE projected)

~40

4Mb SRAM Standard

64Mb DRAM Standard

6.0 x 108

3.0 x 106

“Hybrid” TSRAM 1.5 x 108

1.55 x 105

5.5 x 104DRAM (projected via SIA Roadmap)

COTS*

COTS

Tested

Year 2004

Year 2007

Designed

Sol

id-s

tate

NOTE: COTS = Commercial Off The Shelf

Table 2

Area per bit for standard, emerging, and projected solid-state electronic memories and projected area per bitfor proposed molecular electronic memory (all values are in units of square nanometers)

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Defining the other, practical requirementnecessitates some further discussion about thecharge sharing that must occur before and duringthe read operation. Before a cell is read, thetransistor is “off,” and hence the bit line (BL) andstorage node (SN) are electrically separated. In thiscase, the total charge QI initially on the bit line andstorage node is the sum of their respective charges:

Q Q Q C V C VI BL SN BL BL BL SN= + = + ,

where CBL and CSN are the capacitances on thosetwo structures, respectively, and VBL and VSN are thecorresponding voltages. During the read operation,the transistor is “on,” and hence the bit line andstorage node are electrically connected. Theelectrical connection forces the bit line and storagenode to share charge in order to equilibrate to a finalvoltage. Thus, the total final charge QF is given by

Q C C VF BL SN F= +( ) ,

where VF is the final voltage of the storage node andof the bit line. Conservation of charge requires

Q Q VC V C V

C CI F FBL BL SN SN

BL SN

= ⇒ =+

+.

The quantity that is measured in reading the state ofthe node is ∆V = VF – VBL, which can be expressedas

∆V V VV V

C CF BLSN BL

BL SN

= − =−

+ 1.

Typically, before the read operation, the bit line ischarged to the storage node voltage for state zero.Thus, for state zero, charge sharing would effect nochange on the bit line voltage (∆V = 0), whereas forstate one (with higher voltage than state zero),charge sharing would effect a positive ∆V. Theextent to which this change in bit line voltage ismeasurable is related directly to the denominator of∆V. Specifically, the “transfer ratio” CSN/CBL must beat least 0.1. This serves to keep the value of ∆Vabove the thermal noise threshold of approximately0.025 volts for sensing a charge of one electron atroom temperature [61]. The transfer ratioestablishes a lower limit on the storage nodecapacitance with respect to the bit line capacitance.

Thus, to assess the efficacy of various storagenode candidates, we must also calculate thecapacitance of the bit line, which in the designs ofFigure 1 is specified to be an approximately 10-benzene long Tour wire. Initial quantum calculationsto determine CBL and other quantities have been

conducted by the authors, and they are presentedand discussed below in the next section.

2. Switching times. When the moleculartransistor is turned “on,” it provides a resistiveelectrical connection between the bit line and thestorage node. As we will show, this resistance,along with the capacitance of the storage node,provides a measure of the switching time for thememory cell circuit. The RC time constant t is ameasure of switching time and, for the TSRAM, it isdetermined by Ron, the resistance of the moleculartransistor when turned on, and the seriescombination of CBL and CSN:

τ =+

=+

RC C

C CR

CC Con

SN BL

SN BLon

SN

SN BL 1.

If we assume CSN/CBL is ~0.1, as was establishedabove, then the denominator in t is approximatelyunity. To a good approximation, then,

τ ≅ R Con SN .

Here, one can verify that t has units of time simply bynoting that R has units of volt/amp and C has unitsof charge/volt:

[ ] [ ][ ] [ ]τ = = ⋅ = =R Cvoltamp

coulombvolt

coulombamp

time .

A useful point of reference for switching times isa time on the order of 1 nanosecond (ns), whichcorresponds to that of state-of-the-art electroniccomputers operating at or around 1 Gigahertz (GHz),or 1000 Megahertz (MHz). Although it is likely thatmolecular circuits will be useful even if they operateslower than conventional microelectronic circuits [1],it is nonetheless reasonable to ask what we mustrequire if we wish molecular circuits to operate asfast as state-of-the-art microelectronic circuits.

C. Calculation of capacitance

Calculating the capacitance of the variousstorage node candidates requires a method bywhich to model generally and quantitatively thecapacitive nature of atomic- and molecular-scalestructures. For this purpose, we employ a previouslydeveloped formalism on the capacitive nature ofatomic-sized structures [62]. At the atomic scale, theconcept of capacitance becomes considerably moreinvolved than that of a constant electrostaticcapacitance [63].

The capacitance of macroscopic and micron-scale structure is a function of only its geometry and

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material properties. Especially, this bulk capacitanceis independent of the net charge on the system.However, the capacitance of an atom or a moleculehas an explicit dependence on the net charge. Thisis because of the relatively small number ofelectrons in an atom or molecule and because of theway quantum effects dominate the addition orremoval of charge in structures on the scale ofatoms and molecules [62-64].

Nonetheless, even on the nanometer scale, thequalitative notion of capacitance as the ability (i.e.,the "capacity") to store charge still is valid despitethe complexities that must be addressed whenconsidering from a quantum mechanical viewpointthe design constraints upon the memory cellproposed here.

In their 1995 paper [62], Iafrate et al. derived aformula for the capacitance C(N) of a closed N -electron system. This was achieved by using thechemical potential to derive the following connectionamong the ionization potential, the electron affinity,and the capacitive energy:

eC N

I N A N C Ne

I N A N

2 2

( )( ) ( ) ( )

( ) ( )= − ⇔ =

−.

Above, I(N) and A(N) are the ionization potential andthe electron affinity of the N -electron system,respectively, and e is the fundamental unit of charge.Their methods first were applied to computationalmodels of quantum dots, which yielded the expectedperiodicity of addition energy versus electron number[63,64]. Further, they showed that the results fromthe statistical mechanical formula above approachesclassical results from electrostatics as the number ofelectrons N gets large [62].

Thus, from knowledge of the ionization energyand electron affinity of a molecule, we may calculateits capacitance. However, Iafrate’s formula is exactonly when it is applied to closed, isolated systems,which are systems that do not couple to any othersystems. From a mathematical standpoint, closedsystems release electrons to an infinite distanceaway and also receive electrons from an infinitedistance. This is not the case for a molecularstorage node since it interacts with other nearbystructures, such as the bit line. A more completedescription of our system would include terms for theinteractions between the storage node and allstructures with which it interacts. But, for thepurposes of this paper, we employ the closedsystem approximation since preliminary analysisindicates that the interaction terms will increase thecapacitance [65]. Thus, if our calculations under theclosed system approximation indicate that a

molecular storage node has sufficient capacitance,then calculations that include interaction terms alsoshould give the same affirmative conclusion.

To calculate the capacitance of the bit line andvarious storage node candidates under the closedsystem approximation, we employed the Spartan[66] and Gaussian [67] molecular modeling softwarepackages to perform ab initio quantum mechanicalcalculations of the quantities that appear in Iafrate’sformula. In these calculations, the quantity ofinterest is the ionization energy I minus the electronaffinity A, or I – A. Employing ab initio methods todetermine the total energies of the neutral groundstate N-electron system, as well as the ground state(N – 1)-electron cation and the ground state (N + 1)-electron anion, the ionization potential and theelectron affinity for the neutral system are readilycalculated from their definitions, as follows [62]:

I N E N E N

A N E N E N

( ) ( ) ( )

( ) ( ) ( )

= − −

= − +

1

1,

where E(j) refers to the ground state energy of the j-electron system. Thus, the quantity in which we areinterested can be written as

I N A N E N E N E NE j

j( ) ( ) ( ) ( ) ( )

( )− = + − + − ≅

1 2 1

2

2∂

∂,

evaluated at j = N. Observe also that the energeticquantity of interest is a kind of finite differenceformula that approximates the second derivative ofthe energy with respect to the variation in the chargenumber.

Capacitances were estimated for the keymolecular components of the ME-TSRAM cellaccording to the formulas above. In cases wherethe values for I(N) and A(N) were not known fromexperiment, the energies E(j) were calculated usingab initio Hartree-Fock methods with basis set 6-31G*[66-67]. For molecules that did have experimentallymeasured ionization energies and electron affinities,we simply used those values without performing thesomewhat time consuming computations demandedby the Hartree-Fock method. A summary ispresented in Table 3 of all the capacitances thusdetermined for molecules relevant to this study.

Several observations can be made from theseresults, using the ideas introduced in Section III.B.1.First, from a consideration on the practical lower limiton the capacitance and assuming, therefore, that thetransfer ratio is 0.1, the calculation that a 10-benzene Tour wire bit line has capacitance 0.018 aFestablishes a lower limit of 0.0018 aF on the

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Molecule I - A

10-benzene Tour wire*

Porphyrin (naked)**

Mg-porphyrin**

Fe-porphyrin*

I (eV) A (eV)

5.25 -3.83

C70***

C60***

C (aF)

4.30

4.46

2.657.58

7.61

9.98

2.72

0.0324.93

4.89 0.032

9.08

3.79

3.80

9.65

0.018

0.50

0.67

0.33

0.042

0.042

0.017

NOTE: * Quantities calculated via Spartan quantum chemistry software package [66]** Quantities calculated via Gaussian quantum chemistry software package [67]*** Quantities experimentally measured, as tabulated in [39]

Table 3

Calculations of capacitance for bit line and various candidates for storage node in ME-TSRAM

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capacitance for the storage node. Comparing thiswith the larger fundamental lower limit of 0.020 aFgiven in Section III.B.1, it is seen that a capacitanceof at least 0.020 aF is required for the storage nodeto be effective in this ME-TSRAM design. Table 3indicates that four of the five candidates—nakedporphyrin, Mg-porphyrin, C60, and C70—satisfy thisrequirement, while the Fe-porphyrin does not.

D. Calculation of switching times

For an order-of-magnitude estimate of the RCtime constant we need only two pieces of data,namely Ron and C SN. Recent experiments haveshown that polyphenylene-based structures, such astransistor in the ME-TSRAM, have a resistance onthe order of 107 ohm [36]; hence Ron ~ 107 ohm. Ourcalculations have determined CSN to be on the orderof 10-20 F. Thus, we expect switching time of ME-TSRAM to be of order 10-13 or 10-12 s, which is farless than the upper limit of 1 ns or 10-9 s. Thisprovides an encouraging order-of-magnitudeestimation. It is necessary to observe, however, thatmeasurements of the current through apolyphenylene-based wire suggest that the currentmay only be approximately 101 1 electrons persecond [1], which does not seem to be large enoughto sustain such fast switching times. A moresophisticated formalism for the RC time constant of amolecule, which takes into account Landauerconductance [68] and other factors, presently isbeing developed [69].

IV. DISCUSSION

The preceding section presented a design formolecular electronic memory and providedcomputational results and analysis supporting itsstructural and operational efficacy. However, it isclear that many other issues and challenges must beaddressed before molecular electronic memory canbe realized in the form proposed here or in someother form. Thus, this section is devoted toenumerating and to discussing some of thesefundamental cell design issues and architecturalchallenges.

A. Fundamental cell design issues

Fundamental design issues are those that onemust consider in order to design individualmolecular-scale digital electronic memory cells thatwill perform as desired. This requires designing acell that possesses two stable states such that (1)the state can be changed to represent a one or azero and (2) the state can be sensed. In thisconnection, many issues arise when memory cell

circuits are extended down to the molecular scale.These can be addressed by various analytic andcomputational modeling techniques, but experimentsare likely to be required also to answer themdefinitively. The issues enumerated and discussedbelow apply to the ME-TSRAM cell, but likely aremore broadly applicable, as well.

1. Combining individual devices. In theimplementation of TSRAM in molecules, we haveassumed implicitly that individual molecularelectronic devices (wires, switches, and capacitors)can be bonded or “wired” together to create a circuitthat is the “sum of its parts.” By this it is meant thatthe behavior of the entire circuit is defined simply bythe combination of the electrical properties of itsindividual components. This is true to an extremelygood approximation in micron-scale solid-statecircuit design, but it is likely that it is a much poorerapproximation for molecular circuits. Becausemolecules operate in the quantum mechanicaldomain, when molecular-scale devices arecombined to form large molecular circuits, thesecomponents cannot be expected to behave in thesame way they do in isolation. This is discussed infurther detail elsewhere [1].

2. Charge sharing. Due to the issue mentionedabove regarding combinations of individual devices,there is reason to question how or if thephenomenon of charge sharing extends down to themolecular scale. That is, experiments have shownthat the equations detailed in Section III.B.1 apply inextremely good approximation to micron-scale solid-state circuits. However, because of quantum waveinterference and other effects that influence themolecular charge distribution, these equations maynot apply as well to molecular electronic circuits.

3. Stabilization of bit state. The operation ofthe ME-TSRAM as a molecular analog of solid-stateTSRAM requires establishing a bistable voltage forthe storage node. As indicated in Figure 2(b), thevoltages are stabilized by a continual small currentthat flows from V+ to ground. However, thecapacitance calculations detailed in Section III.Csuggest that only one or a few electrons are storedon the storage node at any given time. Thus, thecurrent from V+ to ground in the ME-TSRAM may bevery small. If the current is too small, it may bedifficult to stabilize the voltage VSN.

4. Mechanisms of conductance. Stronglycoupled to all the issues discussed above is theissue of how electrons are conducted throughpolyphenylene-based molecules. This conductionlikely occurs via a multiplicity of mechanisms in smallmolecules. Most of these molecular conduction

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mechanisms are different from those that dominateconduction in micron-scale metallic wires. Thispresents a significant design issue because differentmechanisms may dominate at different scales (e.g.,device scale vs. circuit scale). This issue also isdiscussed in greater detail elsewhere [1].

B. Architectural challenges

In addition to the design issues that primarilyaffect individual memory cells, there are architecturalchallenges that would affect the super-aggregationsof cells that must be present in an extendedmolecular electronic memory. The challengesenumerated and discussed below apply to the ME-TSRAM architecture, a two-dimensional lattice ofcells, but likely are more broadly applicable, as well.

1. Energy dissipation. As electrons travelthrough a molecule, some of their energy can betransferred to motions of the nuclei in the molecule,such as the internal vibrations and rotations. Theamount of energy transferred is dependent on howstrongly the electronic energy levels of the moleculecouple to the vibrational modes of the molecule.This dissipation of energy, therefore, varies with thedifferent mechanisms of conductance discussedabove. Energy dissipation is an architectural issuefor any molecular memory proposal because it willdiminish the effectiveness of electron transport andsignal transmission through a molecular structure. Inthe extreme case, it could lead to the breaking ofbonds and the destruction of the device. Dissipationis discussed in further detail elsewhere [1].

2. Addressing. A challenge for molecular-scalearchitectures is the problem of addressing individualmolecular memory cells. This problem is sometimesposed as the problem of connecting the functionalmolecular devices to “the outside world.” That is,while molecular electronics proposes to usemolecules to compute and store data, the moleculesmust be interfaced with structures with which a usermay interact for input and output (I/O) purposes. Inrecent experiments on single-molecule conductivity[36,42], these interface structures typically havebeen nanometer- or micron-scale metallic contacts(e.g., gold, platinum) that make poor electricalcontact with the molecules. The experimental setupgenerally consists of a molecule sandwichedbetween two much larger contacts or of a longmolecule placed upon up to seven larger electrodes[70]. If the addressing of a molecular memoryarchitecture were simply to extend this approach, itwould require perhaps on the order of one millionelectrodes, one placed every ten nanometers. Notonly would this present an extremely arduousassembly problem, but the close mutual proximity of

the electrodes likely would induce mutualinterference or crosstalk, corrupting the signals.Thus, an effective method of addressing mustovercome the general challenges of assembly andsignal integrity, in addition to others that may arise inspecific cases.

3. Chemical assembly and defect tolerance.As indicated above, chemical synthesis of molecularelectronic devices is highly advantageous because itcan produce rapidly and economically enormousnumbers of molecular devices (~1023), every one ofwhich is structurally the same. However, severalissues may arise in the syntheses and also in theinterconnection of these devices to form largecircuits. It is likely that a fraction of the devices willnot be operational simply because of the statisticalyields of the chemical syntheses used to make them.That is, while chemical syntheses yield operationaldevices that are all structurally the same, a feat thatis not possible by conventional microfabricationmethods [71], any series of chemical syntheses withless than one hundred percent yield will produceboth operational and non-operational devices. Also,it may not be feasible to test all of them to select outthe ones that are not operational. Further, most ofthe self-ordering chemical assembly processes thatpresently are being investigated would produce alarge amount of randomness and uncertainty in theconnectivity among large numbers of moleculardevice structures in a system.

One approach for addressing these challengesis to design an architecture that is inherently defect-tolerant. Even with many defects, the architecturewould have the capability of operating as desiredwithout physically repairing or removing defectsincorporated into the system during the assemblyprocess. Heath et al. recently discussed thedemonstration of such a defect-tolerant computerarchitecture built from solid-state components and,for that system, it was discovered that the executiontime for many algorithms was surprisingly fast,operating at 100 times faster than a high-end single-processor workstation for some of its configurations[72].

Due in part to the issues and challengesdiscussed above, it is likely that nanometer-scalesolid-state memories will be realized fully beforemolecular electronic memories are. In fact, severaltypes of nanoelectronic solid-state memory [24-27]have been proposed, analyzed, fabricated, anddemonstrated in individual nanometer-scale memorycells or small aggregations of such cells. However,the problem of fabricating trillions of solid-statenanoelectronic memory cells uniformly and defect-free is still a large obstacle [71]. On the other hand,

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the recent achievements in the synthesis ofmolecules by Tour and others demonstrate thatmolecular devices can be synthesized in very largenumbers, as large as ~1023, every one of which is ofexactly the same structure and size [51, 20, 21].These achievements in fabrication and synthesisstrongly suggest that it will be possible tomanufacture molecular-scale memory economicallyand in quantity.

V. SUMMARY AND CONCLUSIONS

A. A step toward a compatible ultra-denseelectronic memory

This paper builds upon previous research insolid-state nanoelectronic memory and molecularelectronics to present designs for molecularelectronic digital memory cells. The recent rapidrefinement of solid-state nanoelectronic devices [31]permitted the design and demonstration of the solid-state quantum-effect TSRAM, which combines theadvantages of both microelectronic DRAM andSRAM. Similarly, recent exciting developments inthe synthesis and demonstration of molecularelectronic devices inspired the ME-TSRAM designthat is detailed and discussed in this paper.

In describing this ME-TSRAM design, we haveoutlined an approach for the miniaturization ofelectronic digital memory circuitry down to themolecular scale, while preserving many of thefeatures that are both familiar and advantageous inpresent-day micron-scale designs. The ME-TSRAMis structurally similar to a microelectronic DRAM, asis suggested by the similarities between the TSRAMcell circuit diagram, displayed in Figure 2(a), and theDRAM cell circuit diagram, displayed in Figure 4(b).Also, the ME-TSRAM is operationally similar to amicroelectronic SRAM since it proposes to store bitswithout any periodic refresh (although, unlike SRAM,the ME-TSRAM must refresh a cell each time it isread. As detailed above, by preserving thesefeatures present in microelectronic designs, one isable to conceptualize a molecular electronic designthat combines the advantages of both types ofconventional memory.

Some other approaches to making nanometer-scale electronic memories [7, 24-27] also retain thisstructural and functional similarity to microelectronicmemory. However, they do not achieve the samedegree of miniaturization. On the other hand, most,if not all the proposed approaches that arecomparable to the anticipated size and density of theME-TSRAM cell are very different from present-day

microelectronic memory in their structure and in theirprinciples of operation [73-77].

Thus, with ME-TSRAM, one might be able tocontinue or exceed the Moore's Law trend [23], whileretaining the well-tested system designs andarchitectures, as well as the design flexibility, thathave helped make microelectronic memory such asuccessful technology and such a valuablecommodity.

B. An essential step toward an important societalgoal

At this stage of the miniaturization revolution, thedevelopment of molecular-scale electronic memory,such as ME-TSRAM, also appears to be a key stepwhich must be taken to further the societal goals ofcontinued technological and economic progress.The miniaturization of digital electronics, asgoverned by Moore’s Law, has been at the root ofthe information technology revolution and the rapid,dramatic, long-lived economic and technologicalprogress associated with it. Continuation of thisprosperity, therefore, demands the continuedminiaturization of digital electronics and, hence, thedevelopment of ultra-dense computer circuitry.

For a number of reasons, though, efforts todevelop ultra-dense computer circuitry are leading,inexorably, toward molecular electronics andmolecular electronic memories. Unlike micron-scaleelectronic devices and circuits, nanometer-scaleelectronic switching devices and ultra-dense circuitrythat incorporate quantum effects must takeadvantage of them if they are to operate efficiently.To take advantage of quantum effects and stilloperate at room temperature, the essential structureof a device should measure considerably less than100 nm. Further, to achieve the desired uniformity inthe function of any two or more nanometer-scale,quantum-effect devices, quantum principles dictatethat their dimensions must be the same withintolerances of approximately one atomic diameter[31]. However, this small size and degree ofprecision in the fabrication of solid-state devices andcircuits is very difficult, if not impossible, to achieveeconomically using lithographic or other presentlyavailable methods.

Molecules, on the other hand, are "natural"nanometer-scale structures. They can be made verycheaply in enormous numbers (~1023), and everymolecule of a given type is the same size andstructure down to the atomic scale and below(disregarding transient, controllable conformationalvariations) [30]. This means that individuallyconductive molecules have some very great

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advantages over conventional solid-state structuresfor making large numbers of nanometer-scaleelectronic devices and extended ultra-dense circuitryintegrated on the nanometer scale. In addition, ithas been demonstrated recently that somemolecules--notably polyphenylenes and carbonnanotubes--individually can carry surprisingly largecurrents of electrons [1].

Thus, the societally necessary effort to developultra-dense electronic computers leads, inexorably,to an effort to develop a computer made fromconductive molecular wires and devices. This, inturn, requires the development of a molecularelectronic memory, since most all architectures forelectronic computers demand a memory unit as wellas a processor. Moreover, even the processoralmost always requires a considerable amount offast, electronically addressable memory mixed inwith its logic circuits.

Thus, the development of molecular electronicmemory arguably is a key step on the critical path tofurther economic progress. More specifically, itwould be best if the ultra-dense molecular electronicmemory that is developed initially were to representan evolutionary step forward, as does ME-TSRAM.Then, the memory might even be integrated in asimple way into existing microelectronic processorarchitectures. A design for molecular electronicmemory that can meet these criteria would not onlyensure long term technological progress, but also amore rapid, smooth, and economically advantageoustransition to next-generation computers by way of"hybrid" microelectronic-molecular electroniccircuitry.

This is the special niche that the authorsenvision for a molecular electronic memory cell likethe one described in this paper. It is hoped that theME-TSRAM design will help to probe the limits ofminiaturization for a memory cell and also assist inmaking the necessary smooth transition frommicroelectronics to molecular electronics, while itpaves the way for purely molecular electroniccomputers.

ABOUT THE AUTHORS

Greg Y. Tseng began his research on ultra-densenanometer-scale electronic memories in 1997 as amember of the MITRE Nanosystems Group.Presently, he is a John Harvard Scholar at HarvardCollege and expects to receive his A.B. in Physicsand Mathematics in June 2001. Greg also isperforming research at Harvard University on carbonnanotube-based molecular electronics. He is a 1997

graduate of Thomas Jefferson High School forScience and Technology in Alexandria, Virginia,where he was a finalist in the 56th WestinghouseScience Talent Search for his research in fiber opticbiochemical sensing.

Dr. James C. Ellenbogen is Principal Scientist inthe Nanosystems Group at The MITRE Corporationand Principal Investigator of MITRE's NanosystemsModeling and Nanoelectronic Computers ResearchProject. Dr. Ellenbogen received his Ph.D. inchemical physics from the University of Georgia in1977. He is the author of a number of technicalpapers on the modeling, simulation, and testing ofmilitary systems, on the theory of command andcontrol, and on diverse topics in computer science,physics, and chemistry. He taught at severaluniversities before joining the MITRE Corporation in1984. Since 1993 he has devoted his energies tofurthering the science and technology for designingand developing electronic computers integrated onthe nanometer scale. In that effort he hascollaborated in the development of unique designsfor nanoelectronic devices and co-authored severalwidely cited technical articles on nanoelectronics.

ACKNOWLEDGMENTS

The authors are grateful to other members of theMITRE Nanosystems Group, especially David Mooreand J. Christopher Love, for their collaboration in thenanoelectronics research investigations which led upto and supported the one upon which this paper isbased. Kevin Wegener of the Nanosystems Groupalso made invaluable contributions in his carefulreading, editing, and suggestions for an earlierversion of this manuscript. Prof. Jerry Iafrate of TheUniversity of Notre Dame offered us much kindassistance in the calculation and interpretation ofmolecular capacitances, and we thank him. Further,we thank Paul van der Wagt, Gary Frazier, AlanSeabaugh, and others from the NanoelectronicsGroup at Raytheon-TI Research Laboratories forproviding us with copies of their unpublishedmanuscripts about solid-state TSRAM. We are alsograteful to Drs. William Warren and Bruce Gnade ofthe Defense Advanced Research Projects Agencyfor their encouragement of this line of investigationover the past year. We are much indebted, inaddition, to many of our other colleagues at MITREfor their invaluable long-standing support of thisresearch, notably David Lehman, Steven Huffman,Edward Palo, William Hutzler, Karen Pullen, andKerry Butterfield. This research was funded by agrant from The MITRE Corporation.

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REFERENCES

[1] J. C. Ellenbogen and J. C. Love,"Architectures for molecular electroniccomputers: 1. Logic structures and an adderbuilt from molecular electronic diodes," No.MP 98W0000183, The MITRE Corporation,McLean, VA, July 1999.

[2] J. C. Ellenbogen, "Architectures for molecularelectronic computers: 2. Logic structuresusing molecular electronic transistors," TheMITRE Corporation, McLean, VA, Manuscriptin preparation.

[3] A. C. Seabaugh et al., “Silicon-based quantumMOS technology,” Proc. 1998 GovernmentMicroelectronics Conference, Arlington, VA,pp. 377-380, 1998.

[4] J. P. A. van der Wagt, A. C. Seabaugh, and E.A. Beam III, “RTD/HFET low standby powerSRAM gain cell,” Int. Electron Device Meet.Tech. Dig., pp. 425-428, 1996.

[5] J. P. A. van der Wagt, A. C. Seabaugh, and E.A. Beam III, “RTD/HFET Low Standby PowerSRAM Gain Cell,” IEEE Electron Device Lett.,vol. 19, pp. 7-9, 1998.

[6] J. P. A. van der Wagt et al., “Tunneling-basedstatic random access memory,” Proc. 1998Government Microelectronics Conference,Arlington, VA, pp. 238-241, 1998.

[7] J. P. A. van der Wagt, “Tunneling-basedSRAM,” Proc. IEEE, vol. 87, pp. 571-595,1999.

[8] J. P. A. van der Wagt, "Memory Cell HavingNegative Differential Resistance Devices,"United States Patent No. 5,883,829, 16 March1999.

[9] J. M. Tour, R. Wu, and J. S. Schumm,“Extended Orthogonally Fused ConductingOligomers for Molecular Electronic Devices,”J. Am. Chem. Soc., vol. 113, pp. 7064-7066,1991.

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reduce the steric interence between thehydrogen atoms bonded to adjacent aromaticphenyl groups in the molecular wire.

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[76] M. Lieberman, “Molecular Electronics Basedon Quantum Dot Cellular Automata,”presented at DARPA Moletronics PrincipalInvestigator's Meeting, Ashburn, VA, 8-9 July1999. Prof. Lieberman’s work involves theminiaturization of quantum dot cells to themolecular scale. In order to implement thememory strategy proposed by Fountain andhis collaborators [73], and to achieve reliablehigh temperature operation, one wouldprobably need molecular-scale quantum dotcells of the type being developed by Prof.Lieberman and her collaborators

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