Upload
others
View
4
Download
0
Embed Size (px)
Citation preview
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 2 & V1,0
CEA: from Research to Industry
» 16 000 employees
» 10 research centers
» 4 regional extensions
» Budget of 4.3 billion €
» 650 patents/year
» 4000 publications/year
» 50 Joint Research Laboratory
» 150 startup creations in 30 years
Direction
Tech
no
log
y
Sci
en
ce
Defense
Security
Military
Applications
Division
Nuclear
Energy
Nuclear
Energy
Division
Key Enabling
Technologies
Fundamental research
Materials Sciences Division
Life Sciences Division
Gramat Cesta
Le Ripault Valduc
DAM- IdF
Paris
Saclay Fontenay-aux-Roses
Grenoble
Marcoule Cadarache
Bordeaux
Nantes
Toulouse
Gardanne
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 3 & V1,0 3
Market Knowloedge
Pump Priming
25%
(5-10 ans)
Technology Transfer
75%
(1-3 ans)
CEA Tech: bringing competitiveness to our customers
3
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 4 & V1,0 4
CEA Tech: unique technology platforms over Europe
4
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 5 & V1,0 5 Example: nanoelectronics
CEA Tech: KETs for a broad range of industries
5
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 6 & V1,0
From an application to an embedded system
Algo/Archi matching Architecture design Silicon integration
Embedded System
Platform Design
Platform Test
Platform
Mo
del
s
Emu
lati
on
IP
The Valley of Death
C++ IC
Advanced technologies & HW/SW expertise Reusable building blocks
Turned toward market’s system needs
Evaluate usage scenario at system level Offer an adapted technology Progress on Technology Readiness Level (TRL)
Our approach
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 7 & V1,0
Integrated Components
Technologies & Tests
Embedded Systems
Applications
Integrated Systems Platforms
Emulation, Simulation Hard/Soft Integration
NanoInnov
Minatec
Components & IC Design
System in Package Miniaturization
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 8 & V1,0
Embedded System Platform
Equipment & Human Resources Emulation Tools
Eve-Synopsis Zebu : 5M ports capacity
Mentor Veloce2 : 200M gates multicore emulator
Simulation Tools (SESAM, ArchC)
40 permanent researchers
Methodologies System exploration
Architecture exploration and design
Electronic System prototyping
Embedded application exploration
Hardware/Software coherence
Middleware development
Embedded System fault tolerance, reliability & security
Veloce2 Emulator
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 9 & V1,0
COTS ANALYSIS
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 10 & V1,0
Programming single vs multi-core architectures
Single-core programming “Democratic” programming Fairly good abstraction Fairly good performance
Multi-core programming Expert programming Dedicated language No performance portability
(yet)
C C++ fortran Java
compilation
ARM powerPC Intel
OpenCL CUDA
Compilations
...
Nvidia AMD
MPI
Archi //
#1
Archi //
#2
…
HMPP OpenMP
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 11 & V1,0
Benchmarking of Parallel Architectures
Working on COTS parallel architecture benchmarking
To improve benchmarking objectivity To improve productivity when performing parallel ports on embedded systems
On-going and future research ARM-based systems benchmarking and dimensioning methodology and rules Benchmarks suites for I/Os intensive applications
Sp
ee
du
p
Parallelisation degree
Empirical
Knowledge
Database
Apps
Semi-auto statistical
methodology
Kernel/hotpoints Extraction
Best choices: - Architectures - Parallelization methods
1,E+5
1,E+6
1,E+7
1 4 8 16 36
1e3
Cyc
les
/ fr
ame
s
arm
i7
tilera
P2012
Degré de parallélisation Hig
he
r is
be
tte
r
Tem
ps
d’e
xécu
tio
n
Effi
caci
téé
ne
rgét
iqu
e
0
0,2
0,4
0,6
1 4 8 16 36
Fram
es/J
ou
le arm
i7
tilera
P2012
Lo
we
r is
be
tte
r
(estim.)
COTS platform
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 12 & V1,0
Example conclusions
Parallel programming and parallel architectures Push programming complexity way beyond
sequential programming Re-introduces a lot of human intervention in
design flows Harms the average-developer as much as the
expert-one
New methodology introduced, combining empirical experimentations with analytic analysis to allow fast architecture benchmarking and parallelization model analysis
Results demonstrate small deviation (<10%) between prediction and measures Impact of programming style (50% performance) Impact if code optimization (8 factor between naïve and
optimized implementations)
0
20
40
60
80
100
120
1 4 8 16 36
mJ
Energy spent for pedestrian detection
arm
i7
tilera
P2012
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 13 & V1,0
MODELING
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 14 & V1,0
SESAM
Processor modeling and integration
• Functional or CA ISS
• ArchC 2.0, GenIssLib, OVP…
• Mips32, STXP70, Sparcv8…
• NXP BSP CoolFlux… MPSoC
Modeling
High-level modeling
• SystemC C/C++
• AT TLM
Cosimulation
• VHDL / Verilog
Architecture & SW
Exploration
• Parameter files
• +250 parameters
• +300 statistics
• Reliability, power…
MPSoC
Simulation
• Asymetric multiprocessors
•Up to 1-10 MIPS (8 PE)
• +90% of accuracy
• NFS server
• Automatic spreadsheet
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 15 & V1,0
SW & HW prototypes comparison
Maximum error deviation between SW & HW prototypes
+/- 7%
Acceleration of simulation speed
x250
0
50
100
150
200
250
300
1
10
100
1000
Functional RTL Post-synthesis RTL on EVE
SESAM
Too
l acc
ele
rati
on
Re
al e
xecu
tio
n t
ime
(h
ou
rs)
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 16 & V1,0
EXPLORATION VIRTUAL PROTOTYPING
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 17 & V1,0
Highlights
Example : a 3D-Vision driver assistance system
Architecture sizing, design and diffusion taking into account Performance, Thermal, Power and HW/SW configuration.
An end-to-end HW/SW development
Rapid Architecture sizing in SESAM Environment :
Components on the Shelf (COTS) evaluation, based on performances, cost… and applications
High level system modeling & simulation
Thermal/Power effects are analyzed with DOCEA and ATRENTA frameworks
Hardware dependent Software is configured and customized for application with MAGILLEM Tools
FPGA DSP ARM
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 18 & V1,0
Optimization process
High performance and flexible computing board for applications of real time and actual embedded geolocalization applications
Design of a Multi-CPU, Multi-FPGAs board
X86 Host CPU SW
34/ 1512ms
POI extractor Descriptor Match Pose
Local Bundle Adjustment
or 3D recons.
RT-SW & HW
Dedicated HW acceleration: >10
SIMD, MT and Multi-frame Parallelism
55ms 25ms 48ms 5ms
<15ms
2ms 15 ms
<167ms
Pure SW execution
Parallel Board
execution Embedded CPU
HW accelerators
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 19 & V1,0
OS PharOS PsyC,
Chaine de Compilation
Modèles d’architecture (ex Boléro, Leopard)
Norme et Standards (DO168, AUTOSAR)
Validation et Intégration des OS temps réel
Dimensionnement d’architectures
Simulation
Emulation Evaluation de performances
Environnement de prototypage virtuel
DiagnoBoard DiagnoChip GMR A
uto
mo
bile
Aé
ron
auti
qu
e
Ferr
ovi
aire
Conception des systèmes embarqués et de circuits intégrés
Puissance de calcul X2 à même surface
Localisation 8X plus précise et 30x plus rapide que la puce
Livewire
Développement OS sur Architecture virtualisée
Applicati
on
APPLICATIONS
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 20 & V1,0
Fundamental research
A Business Model …
… Bridging the gap to transfer IP & know-how…
Applied Research
Pilot line
Mass production
4P
… To the industry
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 21 & V1,0
End-to-end Embedded System Design Partner
+ +
Full control Design flow
+ Front-End Back-end
Architectures Logic Synthesis Functional modeling Electrical modeling
Circuit Simulations Placement/routing
Verification Post-Layout
Overcome skills partitioning, a condition for innovation
A single partner along product maturation
Emulation Characterization & test
Functional Validation
Modeling
HW/SW Co-design
Bench labs
Industrial test on pre-series
Cliquez pour modifier le style du titre
DACLE Division 2013 © CEA. All rights reserved | 22 & V1,0 22
A CUSTOMIZED offer
A COMPETITIVE and INNOVATIVE offer
A UNIQUE offer
A PROTECTED offer
A MULTI-INDUSTRY offer
• Personal service at every stage of your innovation project
• Customized collaboration (contract, industrial transfer, local support)
CEA-Tech Offer for our customers ’ competitiveness
• Platforms and extensive patent portfolio
• Key Enabling Technologies as innovation driver
• World-class knowledge and methods
• Confidentiality and data protection
• For all industries: from traditional to high-tech
22
Centre de Grenoble 17 rue des Martyrs
38054 Grenoble Cedex
Centre de Saclay Nano-Innov PC 172
91191 Gif sur Yvette Cedex
All inquiries [email protected]