Applied Power Electronics Conference...session speaker infor-mation, exhibitor semi-nars and exhibitor list and locations, timely notifications such as cancellations and room changes,

ANAHEIM CONVENTION CENTERMARCH 17-21 | ANAHEIM, CA.

APEC 2019 Sponsors

Applied Power Electronics Conference

02 CONFERENCE AND EXPOSITION APEC 2019

APEC 2019 CONFERENCE AND EXPOSITION 1

TABLE OF CONTENTSForeword . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Our Sponsors and Partners . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Supporting Publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Schedule-at-a-Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Conference Registration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7APEC Exposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Materials Purchase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Rules, Notices, and Policies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2019 IEEE William E. Newell Power Electronics Award . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Information for Speakers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Special Events and Guest Activities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Sponsor Meetings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

PROGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Sunday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Monday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Tuesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Wednesday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41Thursday . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Dialogue Sessions Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

FLOOR PLANS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88Convention Center Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88Exposition Floor Plan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89Exhibitor Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

APEC MOBILE APPDownload the APEC 2019 mobile app to access the latest event updates and information, including session speaker infor-mation, exhibitor semi-nars and exhibitor list and locations, timely notifications such as cancellations and room changes, event reminders, and more . The app is accessible through Google Play (Android) and Apple Store (IOS devices) by search-ing ‘APEC IEEE Applied Power Electronics’ or ‘APEC 2019’ .

WI-FIWi-Fi is available throughout the Convention Center . Once connected, open your web browser and follow the prompt to input a password .

Network Name: APECPassword: Analog2019

STAY CONNECTED WITH APECBe in the know on all things APEC throughout the year – follow us on social media:

@APEC-CONF | #APEC2019

APEC: Applied Power Electronics Conference

APEC: Applied Power Electronics Conference

APEC Partnering with Analog.


FOREWORDIt is my honor and pleasure to welcome you to Anaheim and the 34th annual IEEE Applied Power Electronics Conference and Exposition (APEC 2019) .

APEC has a long-standing history of providing theoretical and application-oriented learning opportunities through a variety of educational sessions, including Professional Education Seminars, technical papers presented in lecture and dialog sessions, application-oriented Industry Sessions, thought provoking RAP Sessions, and extensive Exposition and Exhibitor Seminars . This comprehensive blend has branded APEC the Premier Event in Applied Power Electronics .

One of the best aspects of APEC is the opportunity to expand your professional network, make new connections, and reconnect with peers, friends, and colleagues . This year, you’ll have the opportunity to do so through various social happenings including Monday’s Welcome Reception, Wednesday’s Evening Social, during breaks and lunches in the Exhibit Hall, as well as Dialogue Sessions .

Each year, APEC is made possible through the tireless effort of its all-volunteer organizing committee and the three sponsoring organizations: Power Sources Manufacturers Association (PSMA), and the IEEE Power Electronics Society (PELS) and Industry Applications Society (IAS) . It is their combined dedication, expertise, and support, along with our professional conference management partner, SmithBucklin, which drives the success of this conference as a showcase of the latest advances in power electronics .

Most importantly, the continued success of APEC is due to the support of attendees like you, our exhibitor and sponsors, and volunteer teams . It is your passion and knowledge that makes APEC a memorable event that continues to grow and evolve year after year . I look forward to meeting you during these next few days and sharing in this experience with you .

Sincerely,

Ernie Parker General Chair2019 IEEE Applied Power Electronics Conference and Exposition


PARTNERSDIAMOND

GOLD

SILVER

PLATINUM

SPONSORS AND PARTNERSThank You to Our 2019 Partners and Sponsors

SPONSORSAPEC 2019 Sponsors provide financial backing (including liability)


SUPPORTING PUBLICATIONSThank You to Our

2019 Supporting Publications


SCHEDULE-AT-A-GLANCESUNDAY, MARCH 17 Time Location

Registration 8:00 a .m . – 5:00 p .m . Expo Hall D

Speaker Breakfast 8:00 a .m . – 9:00 a .m . Ballroom E

Professional Education Seminars (concurrent sessions) see page 15 for full details 9:30 a .m . – 1:00 p .m . 2nd and 3rd Floors

Break 1:00 p .m . – 2:30 p .m . Foyer

Professional Education Seminars (concurrent sessions) see page 17 for full details 2:30 p .m . – 6:00 p .m . 2nd and 3rd Floors

MONDAY, MARCH 18Registration 7:00 a .m . – 6:00 p .m . Expo Hall D


Spouse and Guest Breakfast 8:00 a .m . – 10:00 a .m . Anaheim Marriott,

Elite Ballroom 3

Professional Education Seminars (concurrent sessions) see page 19 for full details 8:30 a .m . – 12:00 p .m . 2nd and 3rd Floors

Lunch 12:00 p .m . – 1:00 p .m . On your own

Opening Plenary Session 1:00 p .m . – 5:00 p .m . Ballroom ABCD

Welcome Reception 5:00 p .m . – 8:00 p .m . Expo Hall D

MicroMouse Contest 8:00 p .m . – 10:00 p .m . Expo Hall D

TUESDAY, MARCH 19Registration 7:00 a .m . – 5:00 p .m . Expo Hall D


Spouse and Guest Breakfast 8:00 a .m . – 10:00 a .m .Elite Ballroom 1,

Anaheim Marriott

Technical Sessions (concurrent sessions) see page 26 for full details 8:30 a .m . – 10:10 a .m . 2nd and 3rd Floors

Industry Sessions (concurrent sessions) see page 23 for full details 8:30 a .m . – 11:55 a .m . 2nd Floor

Break 10:00 a .m . – 10:40 a .m . Foyer

Technical Sessions (concurrent sessions) see page 26 for full details 10:40 a .m . – 12:00 p .m . 2nd and 3rd Floors

Exhibit Hall Open 12:00 p .m . – 5:00 p .m . Expo Hall D

Lunch 12:00 p .m . – 1:30 p .m . Expo Hall D

Exhibitor Seminars #1 (concurrent sessions) 1:30 p .m . – 2:00 p .m . 2nd and 3rd Floors, Expo Hall D


Break 2:45 p .m . – 3:15 p .m . Expo Hall D



RAP Sessions (concurrent sessions) see page 32 for full details

5:00 p .m . – 6:30 p .m . Ballroom B, C, D


WEDNESDAY, MARCH 20 Time Location

Registration 7:00 a .m . – 2:00 p .m . Expo Hall D


Spouse and Guest Breakfast 8:00 a .m . – 10:00 a .m .Elite Ballroom 1,

Anaheim Marriott



Break 10:10 a .m . – 10:40 a .m . Expo Hall D

Exhibit Hall Open 10:00 a .m . – 2:00 p .m . Expo Hall D

Exhibitor Seminars #5 (concurrent sessions) 10:30 a .m . – 11:00 a .m . 2nd and 3rd Floors, Expo Hall D

Exhibitor Seminars #6 (concurrent sessions) 11:15 a .m . – 11:45 a .m . 2nd and 3rd Floors, Expo Hall D


Lunch 12:30 p .m . – 2:00 p .m . Expo Hall D

Technical Sessions (concurrent sessions) see page 48 for full details 2:00 p .m . – 3:40 p .m . 2nd and 3rd Floors

Industry Sessions (concurrent sessions) see page 42 for full details 2:00 p .m . – 5:25 p .m . 2nd Floor

Break 3:40 p .m . – 4:10 p .m . Breakout Foyers


Social Event 6:00 p .m . – 9:00 p .m . Grand Plaza

THURSDAY, MARCH 21Speaker Breakfast 7:00 a .m . – 8:00 a .m . Ballroom E

Spouse and Guest Breakfast 8:00 a .m . – 10:00 a .m . Platinum 7,

Anaheim Marriott



Break 10:10 a .m . – 10:35 a .m . Foyer



Dialogue Sessions and Lunch 11:15 a .m . – 1:45 p .m . Ballroom


Industry Sessions (concurrent sessions) see page 61 for full details 1:45 p .m . – 3:25 p .m . 2nd Floor

Break 3:25 p .m . – 3:40 p .m . Foyer


SCHEDULE-AT-A-GLANCE


CONFERENCE REGISTRATION All attendees must be registered for the conference . Prepaid conference registration is required for educational seminars, presentation sessions and dialogue sessions . To register or pick up conference materials, visit the APEC Registration Center at the Expo Hall . Please note that Technical Sessions including Dialogue and Lecture Sessions, Industry Sessions, and Professional Education Seminars are only available to specific registration types (Full Conference registration is required to attend all session types, Technical Sessions registration is required to only attend Technical and Industry Sessions, and Seminars Only registration is required to only attend the Professional Education Seminars) .

Registration Hours:Saturday, March 16 . . . . . . . . . . . . . . . 4:00 p .m . – 7:00 p .m .Sunday, March 17 . . . . . . . . . . . . . . . . 8:00 a .m . – 5:00 p .m .Monday, March 18 . . . . . . . . . . . . . . . 7:00 a .m . – 6:00 p .m .Tuesday, March 19 . . . . . . . . . . . . . . . 7:00 a .m . – 5:00 p .m .Wednesday, March 20 . . . . . . . . . . . . 7:00 a .m . – 2:00 p .m .

APEC EXPOSITION The Exposition will open on Monday, March 18 when the Plenary Session concludes .

Exposition HoursMonday, March 18 . . . . . . . . . . . . . . . 5:00 p .m . – 8:00 p .m .Tuesday, March 19 . . . . . . . . . . . . . . . 12:00 p .m . – 5:00 p .m .Wednesday, March 20 . . . . . . . . . . . . 10:00 a .m . – 2:00 p .m .

Admission Entry is granted to persons 18 or older with any APEC badge, including the free “Exhibit Hall” badge which also grants admission to the exhibitor seminars, plenary session, MicroMouse contest and RAP sessions .

Exposition Lunch and Breaks Lunch will be served in the Exhibit Hall on Tuesday from 12:00 p .m . – 1:30 p .m . and on Wednesday from 12:30 p .m . – 2:00 p .m . free of charge to all who have access to the exhibit hall . Lunch will be on your own on Sunday and Monday . The Tuesday afternoon coffee break will be in Exhibit Hall from 2:45 p .m . – 3:15 p .m . The Wednesday morning coffee break will be served in the Exhibit Hall from 10:00 a .m . – 10:30 a .m .

Exposition Giveaway During all three days of the Exposition we will be giving out prizes . At registration, everyone (Exhibit Hall registrants and exhibitors included) will be issued a raffle ticket that you will put in a drop box located in APEC HUB (Booth 539) . This will be good for all three days of raffles during the exposition .

MATERIALS PURCHASE

Purchase of Conference Proceedings and Seminar Workbooks Only copies on USB of the APEC Proceedings will be provided with the Full or Technical Sessions registration . Conference registrants can purchase extra copies of the Conference Proceedings and Seminar Workbooks on USB through Early Registration . APEC reserves the right to limit quantities of APEC Proceedings or Seminar Workbooks sold to any one person or institution .

Conference Proceedings and Seminars on USB Payment Policy For payments at the conference, APEC can accept credit cards (Master Card, Visa or American Express), checks, or money orders (payable in U .S dollars and drawn on a U .S . bank) . Checks and money orders returned unpaid will be assessed an additional handling charge of $50 .00 USD . A limited number of copies of the Conference Proceedings and Seminar Workbooks may be available for sale at registration starting at noon on Sunday, March 17 .

On-site Purchase > Conference Proceedings (USB Only): $205 .00 USD

> Seminar Workbook (USB only): $205 .00 USD

Publications purchased can be picked up at the registration desk .

Purchasing through the IEEE Post conference APEC Proceedings may be purchased through the IEEE .

IEEE Single Copy Sales445 Hoes LanePiscataway, New Jersey 08854, USAP: (800) 678-4333 (USA & Canada) or (732) 981-0060 Website: http://shop .ieee .org/ieeestore/

GENERAL INFORMATION


GENERAL INFORMATION

IMPORTANT RULES, NOTICES, AND CONFERENCE POLICIES

Badges Required for AdmissionBadges are required for admission to all APEC events and activities . Badges are obtained by registering with the conference . APEC reserves the right to deny admission to any APEC event or activity to any person not showing an appropriate badge for that activity or event .

Recording and PhotographyAttendee Recording/Photography: Video and audio recording may be conducted in the Exhibit area, the MicroMouse contest, and public areas of APEC, but nowhere else except with written permission from the Conference Chair . Still photography at APEC is permitted, but with limitations . The general principle is that people may be photographed but photographing presentations and other content is prohibited unless permission from the speaker(s) is obtained in advance . For more details, please see Show Management .

APEC Photography for Marketing Purposes: By registering for APEC 2019, you agree that any photos taken of you while at the conference by our professional photographer may be used by APEC in the future .

Showcasing/Suitcasing PolicyPlease note that while all meeting attendees are invited to the showcase, any attendee who is observed to be soliciting business in the aisles or other public spaces, in another company’s booth, or in violation of any portion of the Exhibition Policy, will be asked to leave immediately . Additional penalties may be applied . Please report any violations you may observe to Show Management . Show Management recognizes that suitcasing may also take the form of commercial activity conducted from a hotel guest room or hospitality suite; a restaurant, club, or any other public place of assembly . For the purposes of this policy, suitcasing violations may occur at venues other than the exhibition floor and at other events . Show Management must be informed of any hospitality suites, and expressed consent must be received prior to the event .

Recruitment PolicyIEEE Policy #10 .1 .24 prohibits recruiting at IEEE sponsored confer-ences . Consequently, recruiters and recruiting advertisements will not be permitted in the APEC 2019 hotel space, meeting facilities or Exhibit Hall .

Distribution of Commercial Material at APECRules for Non-Exhibitors: Distribution of commercial material in the APEC 2019 hotel space (including directly to the hotel rooms of APEC participants), meeting space and Exhibit Hall by people or organizations not participating in the Exposition is prohibited . APEC reserves the right to remove without notice any materials not in compliance with this policy .

Rules for Exhibitors: Exhibitors may only distribute commercial materials in their booth, at Exhibitor Seminars they are conducting and at press conferences they are holding . APEC reserves the right to remove without notice any materials not in compliance with this policy .

Privacy PolicyInformation Provided During Registration: Contact information, which includes your name, affiliation, and mailing address, may be provided upon request to any partners and/or supporting publication participating in the APEC 2019 Exposition . In addition, APEC may use the information you provide to contact you with information about APEC 2019 or any future APEC events . No other use will be made of the information you provide . Your information will not be sold, distributed, leased or provided to any other person or organization except as described above .

Information Provided Other than Through Registration: People who provide their names to APEC through the APEC website, direct contact, digest submission, volunteering to review, or in any way other than registering for the conference, will not have their names and contact information distributed to anyone or any organization, including APEC’s sponsors . APEC will use the contact information only for transmitting information related to APEC . Conference registrants’ names and contact information, including name, affiliation, and mailing address will be provided to exhibitors and media partners . Emails will only be provided to exhibitors through the Lead Retrieval systems used on the show floor . Registering for APEC gives permission for your name and contact information to be provided to exhibitors and media partners and for exhibitors and media partners to contact you during or after the conference . APEC will not otherwise distribute names and contact information received through the registration process .


2019 IEEE WILLIAM E. NEWELL POWER ELECTRONICS AWARD

Sponsored by the IEEE Power Electronics Society

About Patrizio VinciarelliSmaller and more efficient power modules have accelerated the evolution of distributed power architectures, enabling power systems with higher efficiency, power density, and other key performance attributes . Patrizio Vinciarelli’s patented contributions led to new power distribution architectures, Zero-Current Switching (ZCS) and Zero-Voltage Switching (ZVS) power conversion topologies, and advanced power packaging . His Factorized Power Architecture (FPA) leveraged current multiplication modules that can efficiently deliver hundreds of amperes at voltages less than 1 V . His Converter Housed in Package (CHiP) scalable packaging technology has enabled higher levels of power system efficiency and density . Vinciarelli holds 151 U .S . patents . Vinciarelli is the founder and chief executive officer of Vicor Corporation, Andover, MA, USA .

About the William E. Newell Power Electronics AwardThe IEEE William E . Newell Power Electronics Award was established in 2005 . It was established in memory of William E . Newell of the Westinghouse Research and Development Center in Pittsburgh, Pennsylvania . Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board .

PATRIZIO VINCIARELLI

For visionary leadership in the development of high-efficiency,

high-power-density power conversion components for distributed power system applications.

The award presentation will take place during the Plenary Session on Monday, March 18 beginning at 1:00 p .m .


INFORMATION FOR SPEAKERS

PROFESSIONAL EDUCATION SEMINAR SPEAKERS:Breakfast will be provided for you the morning of your presentation . You should attend the breakfast only on the morning of your seminar . During breakfast, you will receive brief instructions from the Professional Education Seminar Chairs .

Professional Education Seminar Speaker BreakfastSunday at 8:00 a.m.; Monday at 7:00 a.m. | Ballroom E

INDUSTRY SESSIONS AND LECTURE TECHNICAL SESSION SPEAKERS:You must attend a mandatory breakfast on the morning of your session . The Program Chair will host this breakfast at which you will be given your speaker ribbon and provided instructions . Immediately after breakfast you will be able to review your previously uploaded presentation with your session chair .

Industry and Lecture Technical Session Speaker Breakfast Tuesday-Thursday at 7:00 a.m. | Ballroom E

DIALOGUE TECHNICAL SESSION SPEAKERS:You must attend a mandatory breakfast on the morning of your session . During breakfast, you will receive brief instructions and will be able to mount your presentation on the poster boards in the room next door after the breakfast . Thumb tacks will be provided .

Dialogue Technical Session Speaker Breakfast Thursday at 7:00 a.m. | Ballroom E

SPEAKER READY ROOMRoom 213ASunday 8:00 a.m. – 6:00 p.m.Monday 7:00 a.m. – 1:00 p.m. Tuesday 7:00 a.m. – 5:00 p.m.Wednesday 7:00 a.m. – 4:30 p.m. Thursday 7:00 a.m. – 4:00 p.m.

The Speaker Ready room will be available to all speakers should you need to review your presentation in advance of your session or make any edits .


MICROMOUSE CONTEST Monday, March 18 | 8:00 p.m. | Expo Hall D

Enter the annual APEC MicroMouse contest or join us as a spectator for this exciting event . Participants design, build, and program robotic mice and compete to see who can navigate their way through the maze in the shortest time . The rules for the contest use a scoring system with a penalty for the time taken to map and run the maze, and a bonus for not touching the mouse . They are similar to those used at the IEE World Final held in London in 1987 except that the touch penalty has been reduced from 10 seconds to 2 seconds . The time for each contestant has also been reduced from 15 to seven minutes . Within this time limit, the MicroMouse may make up to five runs . Only one mouse per handler will be allowed this year .

Trophies and cash prizes will be awarded in the following categories based on score:

1st Place: $500 | 2nd Place: $250 | 3rd Place: $125

Trophies and cash prizes will be awarded to students in the following categories:

Best Student (based on score): $500 Fastest Run (based on run time): $150

SPECIAL EVENTS

Newport Beach Lunch CruiseMonday, March 18, 2019 | 10:00 a.m. – 2:30 p.m.

Have you been wanting to experience a boat ride tour in Newport Beach? Hornblower’s Newport Harbor tour adventures offer opportunities to soak in the sunshine, shoot photos of historical landmarks and marvel at exclusive waterfront estates . You’ll also spot marine animals and soaring seabirds, making this the most enticing sightseeing and wildlife watching around all whilst enjoying a delicious lunch on the water .

> Cost: $125 per person

SPOUSE AND GUEST ACTIVITIES APEC welcomes the spouses and guests of APEC registrants to participate in conference activities . Transportation to and from each activity will be provided from the front lobby of the Anaheim Marriott following the Spouse and Guest Breakfast . This year’s options include:

PSMA MEETINGSPower Magnetics at High FrequencySaturday, March 16, 2019 | 7:00 p.m. – 6:00 p.m.Room 304

The target audience for this workshop is all who wish to achieve higher power densities, low profile aspect ratio, higher efficiencies, and improved thermal performance . The workshop content is especially suitable for designers of power magnetic components, manufacturers of magnetic materials and magnetic structures, fabricators of magnetic components, providers of modelling and simulation software, manufacturers of test and characterization equipment . The workshop will consist of morning (ac power losses) and afternoon (thermal considerations for magnetic design) technical sessions and a lunchtime interactive technology demonstration session . The two technical lecture presentation sessions will each be followed by a panel Q&A . The technology demonstrations will also be available during the breakfast prior to the opening session and during the networking session at the end of the day’s events .

The Impact of Wideband Technologies on Application of Capacitors – A Deep Dive on Capacitor TechnologySaturday, March 16, 2019 | 7:00 p.m. – 6:00 p.m.Ballroom E

This day-long workshop will consist of morning and afternoon technical lecture presentation sessions and a lunchtime interactive technology demonstration session . Navitas Semiconductor will open the morning session with a keynote presentation on GaN technologies and its requirements on capacitors . Market-leading capacitor suppliers including KEMET, CDE, Panasonic, Faratronic and Wurth Electronics together with preeminent lecturers from universities around the world will discuss technical options and alternatives to meet the challenging requirements .

The “Technology Demonstrations” will be coincident with the luncheon period and will include interactive technology displays and/or presentations each addressing specific technical disciplines and capabilities consistent with the workshop agenda .

SATURDAY, MARCH 16

MONDAY, MARCH 18


SPECIAL EVENTS

SPOUSE AND GUEST ACTIVITIES APEC welcomes the spouses and guests of APEC registrants to participate in conference activities . Transportation to and from each activity will be provided from the front lobby of the Anaheim Marriott following the Spouse and Guest Breakfast . This year’s options include:

Fullerton Arboretum & Heritage House Tour (LUNCH INCLUDED)Tuesday, March 19, 2019 | 9:00 a.m. – 2:00 p.m.

Join one of our knowledgeable docents as they guide you on a tour through the beautiful garden . Enjoy the sights and sounds of our different garden collections through secret trails off the beaten path . Docents will take you to their favorite places in the garden and share stories and folklore . Bring your walking shoes and your enthusiasm!

> Cost: $125 per person

YOUNG PROFESSIONALS & STUDENTS RECEPTION Tuesday, March 19 | 7:00 p.m. – 10:00 p.m. Ralph Brennan’s Jazz Kitchen 1590 Disneyland Dr, Anaheim, CA 92802

All Young Professionals and Students Welcome . Sponsored by IEEE PELS and IEEE IAS

Power Electronics Society (PELS) and IEEE Industry Application Society (IAS) invite you to learn from the life journey of the biggest leaders at APEC along with an evening well-spent talking to people from across the globe . Don’t miss this opportunity to make new friends and meet new people . Please visit http://bit .ly/2rNjQFQ for more information .

WEDNESDAY EVENING RECEPTIONWednesday, March 20 | 6:00 p.m. – 9:00 p.m. Anaheim Convention Center, Grand Plaza

APEC 2019 Full Conference and Technical Session registrants will receive a social event ticket with their registration . If you have a Seminar-Only or Exhibits-Only registration or are registered as an exhibitor, you may purchase a social event ticket by visiting the registration desk . You may also purchase tickets for your guest to attend . Exhibiting companies will receive a social event ticket with their conference registration .

TUESDAY, MARCH 19

WEDNESDAY, MARCH 20

MONDAY, MARCH 18 (Continued)

IEEE POWER ELECTRONICS SOCIETY MENTORING ROUND TABLES EVENTMonday, March 18 | 7:00 p.m. – 9:30 p.m. | Ballroom E (3rd Floor)

The IEEE Power Electronics Society (“PELS”) invites you to attend this casual round table dinner as part of its mentorship program for members of all ages . Advance registration plus a $10 fee to defray the costs of the event are required . For more information, contact Donna Florek, CMP, PELS Staff at d .florek@ieee .org .


SPONSOR MEETINGS

IAS MEETINGSSUNDAY, MARCH 17 Time Location

Board Meeting 8:00 a .m . – 5:00 p .m . Elite 2 & 3

MONDAY, MARCH 18Board Meeting 8:00 a .m . – 12:00 p .m . Elite 2 & 3

IEEE PELS MEETINGSSUNDAY, MARCH 17 Time Location

International Electrotechnical Comission TC51 8:00 a .m . – 6:00 p .m . Platinum 2

International Future Energy Challenge (IFEC) Workshop 8:00 a .m . – 6:00 p .m . Platinum 3

Empower a Billion Lives (EBL) Leadership Meeting (Members Only) 11:00 a .m . – 2:55 p .m . Platinum 4

PELS Exec Team Pre-Strategy Meeting (Officers Only) 3:00 p .m . – 5:00 p .m . Platinum 4

MONDAY, MARCH 18International Electrotechnical Comission TC51 8:30 a .m . – 12:00 p .m . Platinum 8

ECCE 2019 Organizing Committee Meeting 9:00 a .m . – 10:00 a .m . Platinum 7

Energy Access Working Group and Empower a Billion Lives 9:00 a .m . – 10:30 a .m . Platinum 3

PELS Membership Committee 9:00 a .m . – 12:00 p .m . Platinum 4

PELS Fellows Committee 9:30 a .m . – 11:00 a .m . Platinum 2

FEPPCON Steering Committee 10:00 a .m . – 11:00 a .m . Platinum 7

PELS TC & Academic Chairs Lunch 11:30 a .m . – 1:00 p .m . Platinum 2

PELS Chapter Chair Forum 11:30 a .m . – 1:00 p .m . Platinum 4

Mentoring Round Tables (Separate Pre-Registration Required) 7:00 p .m . – 9:30 p .m . Ballroom E

TUESDAY, MARCH 19PELS TC1 Power and Control Core Technologies 8:30 a .m . – 10:30 a .m . Platinum 8

PELS Awards Committee 9:00 a .m . – 10:00 a .m . Platinum 4

SPEC Steering Committee 9:00 a .m . – 10:00 a .m . Platinum 3

IEEE Journal of Emerging and Selected Topics on Power Electronics (JESTPE) Steering Committee 9:00 a .m . – 10:00 a .m . Platinum 7

PELS Mentorship Committee Meeting 10:00 a .m . – 10:55 a .m . Platinum 2

IEEE Journal of Emerging and Selected Topics on Power Electronics (JESTPE) Editorial Board 10:00 a .m . – 12:00 p .m . Platinum 7

PELS Day Planning Committee 11:00 a .m . – 12:00 p .m . Platinum 4

PELS TC7 Communication Energy Systems 11:00 a .m . – 12:00 p .m . Platinum 2

PELS Digital Media/Education 1:00 p .m . – 2:00 p .m . Platinum 8

CPSS Transactions on Power Electronics and Applications Editorial Board 1:00 p .m . – 2:00 p .m . Platinum 4

PELS TC4 Vehicle and Transportation Systems Technical Committee 1:00 p .m . – 2:30 p .m . Platinum 7

eGrid Steering Committee 1:30 p .m . – 2:25 p .m . Platinum 2

PELS Standards Committee & ITRW 2:00 p .m . – 4:00 p .m . Platinum 3

Please note: All meetings on this page are located at the Marriott.


SPONSOR MEETINGS

TUESDAY, MARCH 19 (Continued) Time Location

PEDG Steering Committee 2:30 p .m . – 3:55 p .m . Platinum 2

PELS TC6 - High Performance and Emerging Technologies 2:30 p .m . – 4:00 p .m . Platinum 8

PELS Bylaws and Constitution 3:30 p .m . – 4:30 p .m . Platinum 4

PELS Industry Advisory Board 4:00 p .m . – 4:55 p .m . Platinum 2

PELS TC2 Power Conversion Systems and Components 4:00 p .m . – 5:30 p .m . Platinum 7

PELS Global Relations Committee 4:30 p .m . – 5:30 p .m . Platinum 3

Power Electronics Magazine Editorial Board 5:00 p .m . – 6:30 p .m . Platinum 2

PELS TC5 - Sustainable Energy Technical Committee 5:30 p .m . – 7:00 p .m . Platinum 4

IEEE IAS/PELS Young Professional Reception (Separate Registration Required) 7:00 p .m . – 9:00 p .m . Offsite

WEDNESDAY, MARCH 20PELS Women In Engineering (WIE) Breakfast 8:00 a .m . – 9:00 a .m . Platinum 2&3

PELS TC3 Motor Drives & Actuators 8:30 a .m . – 10:00: a .m . Platinum 4

Electronics Transformers Technical Committee (ETTC) 9:00 a .m . – 11:55 a .m . Platinum 7

PELS Products Committee 9:30 a .m . – 11:30 a .m . Platinum 2&3

PELS Cyber-Physical Security Meeting 10:30 a .m . – 12:00 p .m . Platinum 4

PELS New AdCom Member Orientation 12:00 p .m . – 1:25 p .m . Platinum 7

IEEE Transactions on Power Electronics Editorial Board 12:00 p .m . – 2:30 p .m . Platinum 2&3

PELS and CPSS Exec Team 1:30 p .m . – 2:25 p .m . Platinum 4

PELS Technical Operations Committee 2:30 p .m . – 4:30 p .m . Platinum 7

THURSDAY, MARCH 21PELS Conference Committee Breakfast 8:00 a .m . – 8:55 a .m . Platinum 3

PELS Conferences Committee 9:00 a .m . – 11:30 a .m . Elite Ballroom

PELS Administrative Committee 2:00 p .m . – 5:30 p .m . Elite Ballroom

PELS Administrative Committee Dinner (Members Only) 6:30 p .m . – 9:00 p .m . Offsite

FRIDAY, MARCH 22PELS AdCom Breakfast (Companions Welcome) 7:00 a .m . – 7:55 a .m . Elite Ballroom

PELS Administrative Committee 8:00 a .m . – 11:30 a .m . Elite Ballroom


SUNDAY, MARCH 17EDUCATIONAL PROGRAM

PROFESSIONAL EDUCATION SEMINARSAPEC strives to offer seminars with a practical mix of theory and application for the professional working in power electronics . APEC 2019 features 18 professional education seminars with a broad range of topics .

SESSION 19:30 a .m .–1:00 p .m .

S01: Design and Integration of WBG Solid State Circuit ProtectionROOM 210AB

Track: Components

Douglas Hopkins; Utkarsh Mehrotra; Bahji Ballard, NC State University, NC, USAThis seminar targets Solid State circuit protection for medium voltage or high-power systems . Advances in power electronics driven by the development of WBG devices and the proliferation of wind and solar power is shifting the way we consume and distribute electric energy . Conventional circuit protection is simply too slow to deal with the ramp rates that result from the overall reduction in inductive loads on a given system . Solid State circuit breakers offer a solution to this problem though it comes with its own challenges and limitations .

This seminar gives an in-depth exploration of solid-state circuit breaker technology and introduces a design philosophy that guides the intermediate practitioner in addressing each of these challenges . Special attention is given to the problem of energy absorption during a short circuit event, both electrical and thermal . A design example of a 6 .5 kV, 100A solid state circuit breaker is provided .

The attendee is shown, in detail, the justification for circuit breaker ratings and the motivation for the integration of protection features into power electronic circuit design . Brief tutorials in heat transfer and mechanics provide an understanding behind maximum operating limits and reliability drivers, and procedures to iterate the electrical-physical design .

9:30 a .m .–1:00 p .m .

S02: Advances in Modeling & Simulation for Magnetics & ControlROOM 303AB

Track: Control

Ray Ridley, Ridley Engineering, US, United StatesThis seminar will present the latest simulation tools for modeling complex phenomena in magnetic circuit elements and control . The results of Dowell’s equations and Steinmetz equations are presented as simple circuit models . Time domain simulation of these models provide details of losses that were previously only possible with very complex analysis that was beyond the reach of most designers . Correct simulated winding losses are produced regardless of current waveshapes .

New circuit models will also be presented for core loss of convert-ers . These models allow core loss to be calculated real-time during a simulation, eliminating the need to post-calculate flux excursion values and flux waveforms .

All of the results are easily implemented in Spice simulations provid-ing unprecedented accuracy for magnetics loss .

We will also present the latest advances in control analysis of con-verters . We will show how it is now possible to predict control trans-fer functions for control implementations that were previously too complex to analyze .

9:30 a .m .–1:00 p .m .

S03 : Embedding Passive &Active Components PCB Design, Fabrication Methodologies &Assembly Process StrategyROOM 303CD

Track: Design

Vernon Solberg, Solberg Technical ConsultingBoth uncased active and passive component elements are candidates for embedding but the process of selecting these components must be made early in the design process . Developers have realized that in addition to passive components, embedding one or more active die elements on an inner layer of the circuit in close proximity to prepack-aged semiconductor(s) mounted on the uter surface, electrical inter-face between components can be minimized, considerably improving functional performance . This closer coupling of key passive and active semiconductor elements will:

• Significantly reduce inductance

• Contribute to increasing signal speed

• Lower overall power consumption

Some components are easy candidates for integrating into the sub-strate while others may involve more complex processes and will be difficult to rationalize . And although a majority of the discrete passive and active devices may remain mounted on the outer

surfaces of the circuit board, embedding a majority of the resistor functions and one or more silicon-based semiconductor elements within the inner layers of the structure can enable greater utilization of the circuit boards outer surfaces . This half-day course furnishes a comprehensive introduction to IPC-7092, Design and Assembly Pro-cess Implementation for Embedded Components .

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SUNDAY, MARCH 17 EDUCATIONAL PROGRAM | PROFESSIONAL EDUCATION SEMINARS

9:30 a .m .–1:00 p .m .

S04: Design Issues for High Power and High Performance SiC ConvertersROOM 304AB

Track: High Power Applications

Jiangbiao He; Juan Sabate; Michael Schutten; Yash Veer Singh; Zheyu Zhang, GE Global Research Center, USAThis intermediate level seminar presents high-power silicon carbide (SiC) power converter opportunities and challenges . Multiple high-performance applications are provided: electric propulsion drives, multilevel inverters, and energy storage systems . Attendees with fundamental power converter knowledge will learn how to design SiC power systems and the associated challenges . SiC has multiple advantages over its silicon (Si) counterpart including lower losses, higher switching frequencies, higher voltage operation, and improved thermal performance . However, faster SiC switching transitions lead to electromagnetic emission problems, susceptibility difficulties, and insulation degradation .

This seminar introduces attendees to efficient and compact two-level and multilevel megawatt converters and propulsion drives enabled by SiC . The seminar provides detailed design approaches for inverter design and construction, power-stage design challenges and solu-tions, novel and cost-effective gate drive circuits, multi-stage power quality filter, switching and conduction loss calculations, and thermal management . The presentation includes detailed description for three power electronic systems using SiC . Experimental results verify the design performance . SiC power converters have undesirably large high frequency harmonics, creating electromagnetic interference (EMI) problems . Approaches for high attenuation filter development, and proper system construction techniques are derived and experi-mentally verified .

9:30 a .m .–1:00 p .m .

S05: Hybrid and Resonant Switched-Capacitor Converters: New Circuit Topologies and Control Techniques for High Power Density DesignsROOM 210CD

Track: Topology and Circuits

Robert Plawa, U.C. Berkeley, USAThis tutorial will cover the topic of hybrid and resonant switched-capacitor (SC) power converters . This class of converters has received increased atenton lately, owing to superior power density and efciency compared to conventonal approaches . Startng with a detailed overview and analysis of conventonal SC power converters, the limitatons and design constraints of SC converters will

be highlighted . Moreover, derivaton of the fast and slow switching limits, along with SC circuit analysis tools such as charge transfer analysis will be covered . The concept of sof charging in SC convert-ers through current source behavior and resonant operaton will be introduced, along with analytcal techniques for determining which SC converter topologies are amenable to this hybrid mode of operaton . Circuit and control techniques for extending the family of sof-charging SC converters will be demonstrated, along with various methods for evaluatng hybrid SC converter topologies . Figures of merit for different circuit topologies will be discussed to evaluate potental for high pow-er density and efciency, along with recent examples of high perfor-mance hardware prototypes . Finally, practcal challenges such as gate driving, startup, and capacitor voltage balancing will be discussed, along with recent proposed techniques to mitgate such difcultes .

9:30 a .m .–1:00 p .m .

S06: WBG Device Characterization for Converter Design: Challenges and SolutionsROOM 213CD

Track: Wide Bandgap

Fred Wang; Zheyu Zhang; Edward Jones, EPC, CA, USA; GE Global Research, NY, USA; University of Tennessee at Knoxville, TN, USA [respectively]At the heart of modern power electronics converters are power semiconductor devices . The emergence of wide bandgap (WBG) semiconductors, including silicon carbide (SiC) and gallium nitride (GaN), promises power electronics converters with higher efficiency, smaller size, lighter weight, and lower cost than converters using the established silicon-based devices . However, WBG devices pose new challenges for converter design and require more careful character-ization, in particular due to their fast switching speed and smaller die size . This seminar presents comprehensive methods with examples for the characterization of GaN and SiC power devices, including static, dynamic, and thermal characteristics . The seminar will have a strong focus on application-oriented device characterization, for the purposes of optimizing a WBG-based converter design . Topics will include challenges particular to GaN and SiC-based converter design, such as cross-talk, dynamic on-resistance, and parasiticeffects of

ractical loads and different topologies . The presentation will con-clude by demonstrating how a detailed device characterization can be applied to improve a converter design . The intended audience includes university professors and graduate students, practicing industry engineers, and other researchers working on WBG-based power electronics . Content will range from intermediate to advanced, and requires only a basic knowledge of device characteristics and converter design .

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SESSION 22:30 p .m .–6:00 p .m .

S07: Magnetic Design Fundamentals – What They Didn’t Tell YouROOM 303AB

Track: Components

George Slama, Wurth Electronics, United StatesThere are lots of experts showing you how to do high frequency mag-netics design - from using only one formula to pages and pages of equations . Magnetics design is about turning some electrical require-ment into a physical object that obeys the laws of electromagnetics . It also has to be manufacturable, meet changing safety standards, be reliable and low cost . Why does that transformer have a funny looking coil former? Why is that one wrapped with tape like a Christmas pres-ent? I don’t recall any mention of that . What else do you need to know in order to design, make or just specific a ‘magnetic’ component? This seminar covers a broad range of topics related to designing, specify-ing and building real magnetic components, not just samples in the lab . Learn the details that others left out .

Get background on the various types of core materials – their charac-teristics, strengths and weakness, explains all the terms, how to read datasheets and their best application . Learn about wire, winding, windings and the insulation used between them . Understand which international safety standards apply and how to implement them . Fin-ishes with design for manufacturing - why it’s important and what’s involved .

2:30 p .m .–6:00 p .m .

S08: A Comprehensive Introduction to Digital Control for Power Electronic ConvertersROOM 304AB

Track: Control

Joel Steeins; Alex Dumais, Microchip Technology, United StatesThe purpose of this presentation is to provide an in-depth introduction to designing and implementing fully digital controllers . The present-ers will cover a broad selection of topics in modeling, control design, and practical implementation . The presentation will start by review-ing topics in linear systems theory, discuss mapping from continuous-time to discretetime, control objectives, limitations on performance, shown how to represent discrete time controllers using fixed point math, show representations of fixed point controllers (direct form I, direct form II, and state space as single section or cascaded section controllers), computational errors due to finite precision will be dis-cussed, and a number of software implementations will be shown with hardware results .

2:30 p .m .–6:00 p .m .

S09: Thermal Design of Power ElectronicsROOM 303CD

Track: Design

Lauren Boteler, U.S. Army Research Laboratory, United StatesThere is a continual pull in the power electronics industry for smaller modules with increased power to improve power conversion for electric vehicle drive trains and other applications . This increased power density leads to thermal and packaging challenges that must be understood and addressed . As modules become increasingly integrated and complex, it is important for everyone in the design chain to understand the thermal challenges . This entry level tuto-rial will address basic thermal management issues as it relates to a power electronics module . The course will begin with a fundamental understanding of the three mechanisms of heat transfer (conduction, convection, and radiation) . Next, it will cover how to perform thermal resistance network calculations to understand the thermal impact of material selection, heat sink options, and geometries . As part of this analysis, various thermal terms will be defined including ther-mal resistance, heat transfer coefficients, thermal conductivity, fluid pressure drop, heat flux, and thermal spreading . Additional topics will include the pros and cons of typical thermal management solu-tions, temperature measurement options, how to read the thermal properties on a datasheet, and understanding simulation results . This tutorial will provide the background necessary to perform back-of-the-envelope thermal calculations, understand the available thermal management solutions, and appreciate the thermal management challenges facing today’s power electronics industry .

2:30 p .m .–6:00 p .m .

S10 : High Power and Medium Voltage Applications of Wide Bandgap Power DevicesROOM 210AB


Jin Wang2; Mark Scott1, 1Miami University, United States; 2The Ohio State University, United StatesThe tutorial focuses on high power applications of gallium nitride (GaN) and silicon carbide (SiC) devices . It starts with a brief introduc-tion to current development status of GaN and SiC devices . Then, common issues that are faced by both GaN and SiC devices includ-ing gate drive designs, high dv/dt caused reflective waves, short circuit capabilities, electromagnetic interference, etc, are discussed in detail . A 10 kW GaN based three-phase inverter and a 1 .7 kV SiC based 7-kV 1-MVA SiC modular multilevel converter (MMC) are the case studies presented during this lecture . For future higher voltage and higher power applications, the tutorial discusses design chal-lenges with medium voltage (3 .3 kV to 15 kV) SiC devices . Insula-tion requirements, auxiliary power supply designs, fast short circuit protection, and partial discharge related design considerations are covered in detail . Multiple examples of 3 .3 kV, 4 .5 kV and 10 kV based circuit building blocks are included as case study examples .

SUNDAY, MARCH 17 PROFESSIONAL EDUCATION SEMINARS | EDUCATIONAL PROGRAM

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2:30 p .m .–6:00 p .m .

S11: Modular High Frequency High Voltage Power Supply: Architectures, Unified Modeling Methodologies and Output Voltage Sharing TechnologiesROOM 210CD


Saijun Mao2; Braham Ferreira1, 1Delft University of Technology, Netherlands; 2Leadrive Technology (Shanghai) Co., Ltd, ChinaThis tutorial focuses on the modular high frequency high voltage power supply technologies . The modular high voltage power supply architecture with a distributed inverter, high voltage transformer and multiplier will reduce the electrical and insulation, as well as thermal stress for the key components compared with convention centralized high voltage power supply . The modular architecture helps to achieve high power density and offer the scalability of output voltage and power for high voltage power supply system . The tutorial starts with the introduction of high frequency high voltage power supply including the basics, development history, the state-of-the-art technologies and future technology trends . The architecture derivation, classifications and evaluation of high voltage power supply will be introduced firstly . Secondly, the generic steady-state circuit modeling approach for dif-ferent high voltage generation architectures will be presented . The generic model can be applied to the high voltage power supply with different architectures, different voltage multiplier topologies, stage and polarities number to simplify the analysis . Thirdly, the analysis of the output-voltage unbalance mechanism for the modular high volt-age power supply is performed considering the parameter variation of the HV transformer including the magnetizing inductance, leakage inductance and secondary winding capacitance . The output-voltage sharing mechanism of proposed coupledinductor based modular high voltage power supply with the primary-parallel-secondary-series (PPSS) configuration is given . Finally, the technology demonstrator and design examples of the modular high voltage power supply will be provided to validate the advantage of modular architectures and output sharing with the coupled-inductor solution . The audience will be the entry level and intermediate university students and engineers in industry who are interested in high voltage and pulsed power sup-ply technologies .

2:30 p .m .–6:00 p .m .

S12: Ten Most-Commonly Asked Questions on Migrating from Si to SiC MOSFET-Based Converter DesignsROOM 213CD

Track: Wide Bandgap

David Levett; Kwokwai Ma, Infineon, China; Infineon, United States

For APEC 2019 professional education seminar, we decided to turn the traditional process around and rather than us decide the topics, we decided to ask our global customer base of design and our field application engineers what questions they would want answered in a technical forum . This seminar is the result taking a world-wide survey asking the simple question “what are the questions you have related to using SiC MOSFETs”? We have taken the results and produced a list of the top 10 most common questions and will, during the semi-nar, attempt to provide detailed answers . This includes topics such as what about long term reliability, how to protect devices, can they be paralleled and how to implement synchronous rectification? As usual the emphasis will be on practical application and examples from real world applications and measurements .

SUNDAY, MARCH 17 EDUCATIONAL PROGRAM | PROFESSIONAL EDUCATION SEMINARS

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MONDAY, MARCH 18EDUCATIONAL PROGRAM

PROFESSIONAL EDUCATION SEMINARSAPEC strives to offer seminars with a practical mix of theory and application for the professional working in power electronics . APEC 2019 features 18 professional education seminars with a broad range of topics .

SESSION 38:30 a .m .–12:00 p .m .

S13: Latest Trends in Magnetic Technology for High Efficiency and High Power DensityROOM 303AB

Track: Components

Ionel Jitaru, Rompower, United StatesThere was a significant progress in semiconductor technology in the last twenty years which pushed the power conversion efficiency from low to midle 80% to low to midle 90% over the last twenty years . Durring the same time period the progeres in magnetic technology was practically negligeable . We all were wating for a „mirracle“ new core material whcih will allow us to make the next jump . Though not much publisized, in magnetic tehcnology there were many new ideas but these ideas did capture just fragments of the market due the pro-prietaty nature of these new technology . Some of these new ideas are in public domain these days but many of the engineers were not expose to them .

The goal of the seminar is to bring some light into the modern magen-tic technologies and to teach the engineers how to rethink the magen-tic design for high efficiency and high power desnity .

The seminar will present a comprehensive overview of the modern magnetic technologies presently used in power conversion and new trends in magnetics aimed to address the new demands in power con-version . In the quest for higher power densities and higher efficiency magnetic technologies were forced to adapt and then new magnetic structures were developed .

The seminar will start by presenting several key characteristics of magnetic transformers such as leakage inductance, stray inductance, inter-winding and intra-winding capacitances and their impact in power conversion performance . Methods of measuring and con-trolling these parasitic elements are also presented . The seminar will present experimental results and methods of measuring the key magnetic parameters for application ranging from low power tranformers for adapters to several KW tranformers for server and telecom applications .

The seminar will also show some present and future trends in mag-netics for higher frequency operation . A chapter will be dedicated to the new trends in magnetic technology for very high efficiency appli-cations . These new magnetic technologies are compatible with the latest technologies in power conversion aimed at very high efficiency and very high power density . The seminar will address different appli-cations such as 30W-65W AC-DC power adapters to multiple KW DC-DC converters and Power Factor Correction modules with very high efficiency . The presentation will be highlighted with design guidance, design example and experimental results .

8:30 a .m .–12:00 p .m .

S14: Systematic Approach to Control of Electrical Drives and 3-Phase ConvertersROOM 303CD

Track: Control

Tony O’Gorman1; Vladimir Blasko2, 1PESC Inc, United States; 2UTRC, United StatesThis intermediate level tutorial is intended for the practicing engineer who has some familiarity with motor control or power factor correc-tion or grid tied 3 phase converter but wants to apply more sophis-ticated control techniques . The derivation of DQ vectors will be pro-vided from first principles so a common baseline can be established . Then, the application of the DQ technique will be applied to three phase power factor and motor applications . Subsequently, current loops will be closed using standard techniques which will highlight some of the issues with these standard approaches .

In many cases where three phase current or voltage loops are closed, periodic disturbances need to be eliminated . One way to accomplish this is using the internal model principle and the application of adap-tive noise cancelling or harmonic regulators . Theoretical analysis and simulation will be used to demonstrate the effectiveness of these techniques . Methodology for tuning of voltage, speed and current regulators for electrical drives and grid tied converters will be devel-oped . Further, the impact of PWM delays, controller processing time, filtering etc will be shown using analysis and simulation . This impact will be augmented with experimental results and compared to the simulated predictions .

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8:30 a .m .–12:00 p .m .

S15: Fundamentals of Design for Reliability in Power ElectronicsROOM 304AB

Track: Design

Frede Blaabjerg; Francesco Iannuzzo; Huai Wang, Aalborg University, DenmarkThe aim of this tutorial is to provide fundamentals of design for reli-ability of power electronic systems, together with the recent findings and paradigm shifts in this research area . It will cover the reliability requirements in different industry sectors, reliability and lifetime of semiconductor modules and capacitors used in power electronic con-verters, testing of power components, and the specific designfor-reli-ability procedure for power electronic systems . A hands-on example of reliability stimation, as long as some case studies on the design-for-reliability paradigm are also presented . Finally, cuttingedge mission-profile based lifetime estimation as well as condition monitoring prin-ciples in power converters will conclude the tutorial . The approaches presented are also the common interest for the companies involved in the Center of Reliable Power Electronics (CORPE) at Aalborg Uni-versity (http://www .corpe .et .aau .dk/) . The tutorial will also present the views of the instructors on future research opportunities in the area of reliability of power electronics . Researchers and engineers who seek the basic knowledge for entering in this field, ranging from component level to system level, from physic of failure to statistical analysis are the main target audience of the seminar . Prerequisites are: circuit theory and power electronics basics .

8:30 a .m .–12:00 p .m .

S16: Electric Powertrain: Energy Systems, Power Electronics and Drives for Hybrid, Electric, and Fuel Cell VehiclesROOM 213CD


John Hayes1; Abas Goodarzi2, 1UCC, Ireland; 2US Hybrid, United StatesThe new book Electric Powertrain: Energy Systems, Power Electron-ics and Drives for Hybrid, Electric and Fuel Cell Vehicles is a struc-tured holistic textbook for the teaching of the undamental theories and applications of energy sources, power electronics, and electric machines and drives to engineering students . This four-part practical guide also acts as an industry reference . In this introductory tutorial, the authors present a three-part seminar covering Electric Vehicles & Energy Sources, Power Electronics, and Electrical Machines . The first half of the tutorial is a lively overview of electromobility with its strong California roots . Battery electric vehicles, fuel cell electric vehicles, and conventional and hybrid electrical vehicles are described, con-trasted and compared for vehicle propulsion . As the vehicle is now understood, the machines and related power electronics are next discussed . The second part of the tutorial provides an overview of the traction machines used in propulsion, with a focus on the induc-tion and IPM ac machines . The third part of the tutorial presents an integrated holistic overview of the power electronics, and discusses the propulsion, charging, accessory, and auxiliary power converters . Isolated and nonisolated dc-dc converters and traction inverters are all discussed, with an additional special focus on battery charging .

8:30 a .m .–12:00 p .m .

S17: Simulation and Analysis Applied to the Design of Buck TopologiesROOM 210AB


Christophe Basso, ON Semiconductor, FranceThis seminar continues the detailed exploration of switching con-verters using simulation, analysis and practical experiments . The buck converter is selected as a topology vehicle to explore different voltage- and current-mode control schemes (fixed frequency, quasi-square wave resonance, COT and FOT), highlighting pros and cons of each solution . Small-signal models are then presented with a discus-sion on performance and implementation of past and more modern models . The four transfer functions of the CCM buck operated in peak-current-mode-control are derived using fast analytical circuits techniques . The seminar ends with the presentation of measure-ments carried on prototypes and nicely bridges theory with practical aspects .

Using mathematical analysis and different tools such as SPICE and Mathcad®, the author maintains a permanent link between theory and practical reality . Balancing analyticalaspects and real-case examples, the seminar targets an audience with an intermediate background in the presented subject .

8:30 a .m .–12:00 p .m .

S18: What Makes SiC Better and How Do I Change My System to BenefitROOM 210CD

Track: Wide Bandgap

Xuning Zhang, Littelfuse Inc., United StatesSilicon Carbide (SiC) devices improve the power density of various converters by shrinking the size of passive components and improv-ing the power conversion efficiency . This seminar presents an in-depth summary of SiC devices and its applications to help converter designers at different levels to understand the benefits and chal-lenges brought by using SiC devices and provide design guidelines for converter designers to extract the maximum benefit from using SiC devices . The presentation will begin with an introduction of SiC tech-nology status . A summary of internal device structure and principle of operation will be discussed to understand the potential benefits from SiC technology . Detailed static and dynamic characteristics, thermal performance and device ruggedness will be discussed with related datasheet parameters to verify the superior performance of SiC devices over Si . II . Optimal implementation of SiC MOSFET will be discussed in detail from the aspects of driving voltage selection, driv-ing loss and driving power supply structures, protection design power loop optimizations . This will provide design guidelines for converter designers to implement SiC devices appropriately to ensure its maxi-mum benefits . Design examples in real applications such as solar inverters and EV chargers will be presented with real hardware and test results to verify the benefit of using SiC device in system size/weight/ cost reduction compared with Sidevices with different focus of performance improvements for different power converter designs .

MONDAY, MARCH 18 EDUCATIONAL PROGRAM | PROFESSIONAL EDUCATION SEMINARS

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PLENARY SESSIONThe APEC 2019 Plenary Session is designed to cover the history of power, the current needs in energy efficiency and the future possibilities . The plenary is made up of several presentations from respected industry leaders . Each presentation is 30-minutes in length and allows for interactive Q&A at the end of each presentation .

Presentation #1 The Future of Power Electronics in Robotics Applications 1:30 p .m . – 2:00 p .m .

SPEAKER: Peter WawerDivision President, Industrial Power Control, Infineon Technologies

By harnessing the latest advances in power electronics, control, sensors, and communica-tion, robotics are accelerating efficiency gains in our industrialized economy . From smart robots to collaborative robots, and from vir-

tual fences to energy flexibilization, robotics disciplines play a central role in the Industry 4 .0 deployment . Yet many new exciting uses for robotics have to be realized . What is the future of power electron-ics in robotics applications? From control algorithms to smart motor drives using latest power semiconductor technologies, power elec-tronics will play a key role in reaching the next level era of making our world greener and our lives safer .

Presentation #2 Overview of University Research Programs in Power Electronics 2:00 p .m . – 2:30 p .m .

SPEAKER: Robert V. WhiteChief Engineer, Embedded Power Labs (representing PSMA)

Every two years, PSMA publishes an updated Power Technology Roadmap (PTR) . The pur-pose of the PSMA Power Technology Roadmap (PTR) is to present a look at power technology and trends over the next five years . This year,

to get a different and longer-term look ahead, the PSMA selected uni-versities and research institutions that are leaders in various areas of power electronics research . These universities and institutions were invited to share information about the research that their institution would be pursuing in upcoming years, as well as provide some met-rics about their research program . The results of this survey will be presented . Areas of common interest will be highlighted along with unique activity . Observations will also be shared on potential gaps in coverage .

Presentation #3 Flywheel Energy Storage: A Utility Scale Energy Solution for the 21st Century2:30 p .m . – 3:00 p .m .

SPEAKER: Seth SandersChief Scientist and Co-Founder, Amber Kinetics

Energy storage is now emerging as an essential electric utility resource to effec-tively enable higher penetration levels of variable renewable generation resources . In California, in response to RPS mandates for

increased renewable penetration, Assembly Bill 2514, in conjunc-tion with resulting California Public Utilities Commission rulings, has called for 1 .3 GW of flexible energy storage to be incorporated into the energy mix by California utilities by 2024 . Similar actions have been enacted, or are in process, in other U .S . states, and worldwide . The talk will review the energy storage landscape, in terms of oppor-tunity, established and emerging storage technologies, and commer-cial progress . The talk will also focus on the speaker’s interests in advancing flywheel energy storage to meet utility scale challenges . In short, a flywheel functions as a battery, with kinetic energy stor-age replacing conventional electrochemical processes . Based on numerous implementations and products released during the past 20-30 years, there has been a general belief in the power systems community that flywheels are only suited to short term applications, for example in frequency regulation, grid stability enhancement, volt-age support, and in UPS and transit system applications . This is not the case, and the talk will outline how flywheels can be economi-cally designed to meet multi-hour energy shifting applications, that are essential for provision of capacity, and extended integration of variable renewable generation . Some details on product and project development at grid scale energy storage start-up Amber Kinetics will be discussed .

Break3:00 p .m . – 3:30 p .m .

MONDAY, MARCH 18 PLENARY SESSION | EDUCATIONAL PROGRAM

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Presentation #4 Power Electronics; Enabling Zero Emission Powertrains and Fuel Cell Engines 3:30 p .m . – 4:00 p .m .

SPEAKER: Abas GoodarziPresident and Chief Executive Officer, US Hybrid Corporation

This presentation gives a review of fuel cell engines enabling zero emission transporta-tion . Electric traction is recognized as the future of mobility and energy conservation with battery electric, fuel cell electric and

hybrid combustion engines as competing platforms . The combina-tion of advances in power conversion systems with rapid advances in vehicle control and autonomous driving, e .g . predictive GPS based route optimization, has enabled commercially-viable vehicles .

A Fuel Cell is a combustion-less/static engine that generates electric power directly by extracting the electrons from hydrogen to power the future transportation . Thus, power electronics are directly involved in both power generation and propulsion of the vehicles . Power elec-tronics utilizing SiC devices are integrated with the fuel cell engine to provide the highest power density and more than triple the overall efficiency (fuel in, electric power out) with zero tail pipe emission enabling global GHG reduction and Carbon-free economy . Power Electronics become the workhorse enabling future mobility by also enabling the balance of plant system for the fuel cell engines includ-ing air compressor, thermal management and fuel processing units .

Presentation #5 Improving Healthcare through Power Electronics: Opportunities in Powering Medical Devices4:00 p .m . – 4:30 p .m .

SPEAKER: Rikky MullerCo-Founder, Cortera Neurotechnologies

Smart and connected medical implants are the next frontier in the Internet of Things (IoT) and are set to revolutionize healthcare . Advancing our ability to interface technology with bio-logical environments will enable patients to be monitored and receive treatment at home,

and in the long term, have chronically implanted electronic devices seamlessly integrate with their everyday lives . The power source and the design of the power electronics in medical devices have sig-nificant impact in their form factor, function, usability and safety . This talk explores various powering modalities of medical devices, includ-ing emerging techniques for remote powering of millimeter- and micron-scale implantable devices utilizing electromagnetic power or ultrasound . Such devices will enable continuous monitoring of ner-vous system functions and will deliver bioelectronic medicine to treat neurological diseases, inflammatory diseases, respiratory diseases and more . Power designers have the opportunity to play a significant role in enabling these new devices by expanding their functionality, efficiency, safety and longevity .

Presentation #6 Power Electronics for the Space Exploration Hype 4:30 p .m . – 5:00 p .m .

SPEAKER: Fernando Gómez-CarpinteroHead of Power Engineering, Airbus Spacecraft Electronics

The space business shows a convergence of all factors and signs toward a major disrup-tion . The market is moving towards a much more dynamic environment with new players, strong private investors and new business models, which answer the demand for a hyper

connected world and for data-driven economies . These impose in the industry a tremendous pressure for shorter time to market and significant price reduction while increasing the performances of the electronics . On top of that, there is a new hype for space exploration with a clear need for higher power and higher efficiencies to drive the electrical propulsion systems . The answer from Airbus Space Elec-tronics includes the use of new technologies like GaN, the implemen-tation of digital control for smart power management, the use of COTs (Commercial Off the Shelf) EEE components and the digitalization & automation of the development process . .

MONDAY, MARCH 18 EDUCATIONAL PROGRAM | PLENARY SESSION

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INDUSTRY SESSIONSAt APEC 2019, the Industry Sessions track continues to expand . This track runs in parallel with the traditional Technical Sessions Track Speakers are invited to make a presentation only, without submitting a formal manuscript for the APEC Proceedings . This allows APEC to present information on current topics in power electronics from sources that would not otherwise be present at an industry conference . While many of these sessions are technical in nature, some also target business-oriented people such as purchasing agents, electronic system designers, regulatory engineers, and other people who support the power electronics industry . Presentations will be available through the APEC mobile app .

8:30 a .m . – 11:55 a .m .

IS01: High Frequency Magnetics; New Magnetic MaterialsROOM 210BC

CHAIR:Ed Herbert, PSMA

8:30 a .m . – 8:55 a .m .IS01.1 Materials Paradigm as Applied to New and Evolving

Power Magnetic MaterialsMichael McHenry1, P . R . Ohodnicki3, A . Leary2

1Carnegie Mellon University, United States; 2NASA Glenn Research Center, United States; 3National Energy Technology Laboratory, United States

8:55 a .m . – 9:20 a .m .IS01.2 Strain Annealed Metal Amorphous Nanocomposite

Soft Magnetic Materials: Manufacturing, Applications, Optimization, and Data SheetsSeungryul Moon2, Kevin Byerly1, Paul Ohodnicki1, M .E . McHenry1, Satoru Simizu1, Alex Leary1, Vladimir Keylin1, Ronald Noebe1, Randy Bowman1, Richard B . Beddingfield1, Subhashish Bhattacharya1

1National Energy Technology, United States; 2National Energy Technology Laboratories, United States

9:20 a .m . – 9:45 a .m .IS01.3 High Bs Ferrite Material for High Power Applications

Jun SunBs&T Frankfurt am Main GmbH, Germany

9:45 a .m . – 10:10 a .m .IS01.4 Design Considerations for High Frequency Magnetic

MaterialsJohn Lynch, Michael ArasimFair-Rite Products Corp, United States

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:05 a .m .IS01.5 Soft Magnetic Metal-Flake Composite Material Suitable

for High Frequency Power ModulesKen’Ichi Chata’NiTOKIN Corporation, a KEMET Company, Japan

11:05 a .m . – 11:30 a .m .IS01.6 New and Modified Alloy Powder Core Materials

Mark SwihartMagnetics, United States

11:30 a .m . – 11:55 a .m .IS01.7 Materials Magic – Nanocrystalline, Amorphous and

Powdered Amorphous CoresMark RineHitachi Metals America, Ltd., United States

8:30 a .m . – 11:55 a .m .

IS02: Data CenterROOM 209AB

Harry Soin, Artesyn Embedded TechnologiesMingchun Xu, Facebook

8:30 a .m . – 8:55 a .m .IS02.1 5 Common Mistakes in Point-of-Load DC-DC Converters

and How to Avoid ThemAnthony Fagnani, Pradeep ShenoyTexas Instruments, United States

8:55 a .m . – 9:20 a .m .IS02.2 3 kW Full Bridge LLC Resonant Digital Converter

Mario Di GuardoSTMicroelectronics, Italy

9:20 a .m . – 9:45 a .m .IS02.3 Optimising Light Load Efficiency in TM Boost PFCs

Billy Long, Joseph LeistenTexas Instruments, Ireland

9:45 a .m . – 10:10 a .m .IS02.4 Solid State Inrush Current Limitation

Yannick Hague, Thierry CastagnetSTMicroelectronics, France

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:05 a .m .IS02.5 ZVS Switched Capacitor (ZSC) Converter for Future Data

Center ApplicationsMatt Hunter1, Min Chen1, Christian Rainer2, Yong Zhou1, Rakesh Renganathan1

1Infineon Technologies Americas Corp., United States; 2Infineon Technologies Austria AG, Austria

TUESDAY, MARCH 19EDUCATIONAL PROGRAM

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11:05 a .m . – 11:30 a .m .IS02.6 Evaluation of GaN based Multi-Level Converters

Suvankar BiswasEfficient Power Conversion Corporation, United States

11:30 a .m . – 11:55 a .m .IS02.7 Improving Software Quality in Digital Power Control

Hamish LairdELMG Digital Power, United States

8:30 a .m . – 11:55 a .m .

IS03: Vehicle ElectrificationROOM 210A

CHAIRS:Dennis Stephens, Continental AutomotiveWeimin Zhang, ST Motors Inc.

8:30 a .m . – 8:55 a .m .IS03.1 Efficiency and Robustness for SiC MOSFETs: Key Role,

Trade-Off and Technology Improvement for Traction Inverter SolutionsMario Pulvirenti, Angelo Giuseppe Sciacca, Gionatan Montoro, Massimo NaniaSTMicroelectronics, Italy

8:55 a .m . – 9:20 a .m .IS03.2 Lifetime and Reliability Enhancement of a New IGBT

Module for Traction ApplicationsKevork HaddadSEMIKRON, Inc, United States

9:20 a .m . – 9:45 a .m .IS03.3 SiC MOSFET Based High-Efficiency Bi-Directional

On-Board Charger for EVsJianwen Shao, Binod Agrawal, Frank WeiWolfspeed, United States; Wolfspeed, China; Wolfspeed, India

9:45 a .m . – 10:10 a .m .IS03.4 ICs for the Electric Powertrain

Wouter Leten, Andrew WilsonMelexis, Belgium; Melexis, United States

10:10 a .m . – 10:40 a .m .

Break

10:40 a .m . – 11:05 a .m .IS03.5 Advantages of 3.3kV SiC-MOSFET Modules in Traction

ApplicationsMark Steiner2, Eric Motto2, Kenji Hatori11Mitsubishi Electric, Japan; 2Mitsubishi Electric US, United States

11:05 a .m . – 11:30 a .m .IS03.6 Silicon Carbide Enabling Car Electrification

Vittorio Giuffrida, Simone Buonomo, Anselmo Gianluca LibertiSTMicroelectronics, Italy

11:30 a .m . – 11:55 a .m .IS03.7 The Value of GaN HEMTs in 800V and Above Applications

Juncheng Lu1, Yunwei Li2, Zhongyi Quan2

1GaN Systems, Canada; 2University of Alberta, Canada

TUESDAY, MARCH 19 EDUCATIONAL PROGRAM | INDUSTRY SESSIONS

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8:30 a .m . – 11:55 a .m .

IS04: Getting Up To Speed on Switching: Wide Band Gap & Other High Performance ComponentsROOM 210D

CHAIRS:Stephanie Watts Butler, Texas Instruments Inc.Jaume Roig, ON Semiconductor

8:30 a .m . – 8:55 a .m .IS04.1 Magnetics Study Enables New Class of High Density AC/

DC ConvertersTom RibarichNavitas Semiconductor, United States

8:55 a .m . – 9:20 a .m .IS04.2 High Performance SiC MOSFETs and Diodes Fabricated in

High-Volume 6-Inch CMOS FabSujit Banerjee, Xuning Zhang, Michael Ketterer, Andreas Laschek-Enders, Levi Gant, Christophe Warin, Kevin Matocha, Gin ShehLittelfuse Inc., United States; Littelfuse Inc., Germany

9:20 a .m . – 9:45 a .m .IS04.3 GaN Integrated Circuits for Highest Performance Power

SuppliesThierry BouchetGaNWISE, France

9:45 a .m . – 10:10 a .m .IS04.4 GaN-on-Silicon Intelligent Power Switch Solutions

Eric MoreauExagan, France

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:05 a .m .IS04.5 Avalanche and Short-circuit Robustness of High Voltage

SiC DMOSFETsRanbir SinghGeneSiC, United States

11:05 a .m . – 11:30 a .m .IS04.6 CoolSiC Power MOSFETs: New Additions to the Portfolio

Peter FriedrichsInfineon Technologies, United States

11:30 a .m . – 11:55 a .m .IS04.7 How GaN Helps Power Supplies Achieve Extraordinary

Levels of EfficiencyEric PerssonInfineon Technologies, United States

8:30 a .m . – 11:55 a .m .

IS05: Market ResearchROOM 213B

CHAIRS:Ada Cheng, AdaclockCarl Blake, CBK Consulting

8:30 a .m . – 8:55 a .m .IS05.1 1200V SiC MOSFETs Technology Assessment by Means of

Deep Structural and Physical AnalysisAlberto Adan, Daisuke Tanaka, Louis Burgyan, Yuji KakizakiLTEC Corp., Japan; LTEC Corp., United States

8:55 a .m . – 9:20 a .m .IS05.2 What Can Power Electronics Industry Expect from SiC &

GaN?Ana VillamorYole Developpement, France

9:20 a .m . – 9:45 a .m .IS05.3 Power Semiconductor Trends and the Global Data Center

Power CrisisKevin AndersonIHS Markit, United States

9:45 a .m . – 10:10 a .m .IS05.4 Every Power Electronic Company Should Be Involved in

the Growing EV/HEV Industry: True or False?Milan Rosina, Claire TroadecYole Développement, France

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:05 a .m .IS05.5 65nm BCD for Power Management IC Sub 90nm PM

Market Trends and Technology AdvantagesErez SarigTowerJazz, Israel

11:05 a .m . – 11:30 a .m .IS05.6 Power Electronics: An Application Driven Market

Claire Troadec, Ava Villamor, Milan Rosina, Alejandra FuentesYole Developpement, France

TUESDAY, MARCH 19 INDUSTRY SESSIONS | EDUCATIONAL PROGRAM

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TECHNICAL SESSIONSAPEC professionals like you participated in a rigorous peer review process and have carefully picked over 500 papers making up APEC’s Technical Sessions . The review process highlights the most innovative technical solutions, and provides the highest quality possible . The technical program includes papers of broad appeal scheduled for oral presentation from Tuesday morning through Thursday afternoon . Papers with a more specialized focus are available for discussion with authors at the dialogue session on Thursday from 11:30 a .m . – 2:00 p .m . The various technical venues cover all areas of technical interest to the practicing power electronics professional . The papers are sure to give you many new design ideas that you can apply to your work immediately .

8:30 a .m . – 12:00 p .m .

T01: Hybrid DC-DC ConvertersROOM 211AB

DC-DC Converters

CHAIRS:Yan-Fei Liu, Queens UniversityPradeep S. Shenoy, Texas Instruments

8:30 a .m . – 8:50 a .m .T01.1 Multiphase Control for Robust and Complete Soft-

Charging Operation of Dual Inductor Hybrid ConverterTianshi Xie2, Ratul Das2, Gab-Su Seo1, Dragan Maksimovic’2, Hanh-Phuc Le2

1National Renewable Energy Laboratory, United States; 2University of Colorado Boulder, United States

8:50 a .m . – 9:10 a .m .T01.2 900V SiC Based, Hybrid, Multilevel DC/DC Topology for

1500VDC PV ApplicationBranislav Stevanovic’, Diego Serrano, Miroslav Vasic’, Pedro Alou, Jesús Angel Oliver, José Antonio CobosUniversidad Politécnica de Madrid, Spain

9:10 a .m . – 9:30 a .m .T01.3 A 48-to-12 V Cascaded Resonant Switched-Capacitor

Converter for Data Centers with 99% Peak Efficiency and 2500 W/in3 Power DensityZichao Ye1, Yutian Lei2, Robert Pilawa-Podgurski11University of California, Berkeley, United States; 2University of Illinois at Urbana-Champaign, United States

9:30 a .m . – 9:50 a .m .T01.4 A Family of Transformerless Stacked Active

Bridge ConvertersJianglin Zhu, Dragan Maksimovic’University of Colorado Boulder, United States

9:50 a .m . – 10:10 a .m .T01.5 An 80-W 94.6%-Efficient Multi-Phase Multi-Inductor

Hybrid ConverterRatul Das2, Gab-Su Seo1, Dragan Maksimovic’2, Hanh-Phuc Le2

1National Renewable Energy Laboratory, United States; 2University of Colorado Boulder, United States

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T01.6 Zero Voltage Switching for Flying Capacitor Multilevel

Converters at Nominal Conversion RatiosJan Rentmeister, Jason StauthDartmouth College, United States

11:00 a .m . – 11:20 a .m .T01.7 Two-Phase Interleaved Resonant Switched-Capacitor

DC-DC Converter with Coupled Inductors and Custom LC ResonatorPrescott McLaughlin, Phyo Kyaw, Muhammad Kiani, Charles R . Sullivan, Jason StauthDartmouth College, United States

11:20 a .m . – 11:40 a .m .T01.8 Modulation Scheme for an Effective Increase in

the Number of Levels of DC-DC Multi-Level Flying Capacitor ConvertersMichael Halamicek, Timothy McRae, Nenad Vukadinovic’, Aleksandar Prodic’University of Toronto, Canada

11:40 a .m . – 12:00 p .m .T01.9 State Space Analysis of Flying Capacitor Multilevel

DC-DC Converters for Capacitor Voltage EstimationZiyu Xia, Benjamin Dobbins, Jan Rentmeister, Jason StauthDartmouth College, United States

TUESDAY, MARCH 19 TECHNICAL SESSIONS | EDUCATIONAL PROGRAM

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8:30 a .m . – 12:00 p .m .

T02: Power Converter Modeling and SimulationROOM 212AB

Modeling and Simulation

CHAIRS:Sara Ahmed, University of Texas at San AntonioJing Xu, ABB U.S. Corporate Research Center

8:30 a .m . – 8:50 a .m .T02.1 Harmonic Transfer-Function Model of Three-Phase

Synchronous Reference Frame PLL Under Unbalanced Grid ConditionsYicheng Liao1, Xiongfei Wang1, Xiaolong Yue2, Hong Gong1

1Aalborg University, Denmark; 2Ericsson AB, Sweden

8:50 a .m . – 9:10 a .m .T02.2 Open-Code, Real-Time Emulation Testbed of

Grid-Connected Type-3 Wind Turbine System with Hardware ValidationMaximiliano Ferrari3, Michael Orendorff1, Travis Smith2, Mark Buckner2

1NextEra Energy, United States; 2Oak Ridge National Laboratory, United States; 3University of Tennessee, United States

9:10 a .m . – 9:30 a .m .T02.3 Blackbox Parameter Varying Transfer Functions Model

for Highly Nonlinear Electronic Power Converters in DC MicrogridsAirán Francés, Rafael Asensi, Javier UcedaUniversidad Politécnica de Madrid, Spain

9:30 a .m . – 9:50 a .m .T02.4 Weighting Factor Design Based on Artificial Neural

Network for Finite Set MPC Operated 3L-NPC ConverterMateja Novak, Tomislav Dragicevic, Frede BlaabjergAalborg University, Denmark

9:50 a .m . – 10:10 a .m .T02.5 Quasi-Online Low-Frequency Impedance Monitoring

Scheme for Submodule Capacitors in Modular Multilevel ConvertersDeepak Ronanki, Sheldon S WilliamsonUniversity of Ontario Institute of Technology, Canada

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T02.6 Simplified Frequency-Domain Model of Modular

Multilevel ConverterJianhang Zhu1, Jiabing Hu1, Lei Shang1, Fei Liu2, Zuoxia Bai21Huazhong University of Science and Technology, China; 2State Grid Qinghai Electric Power Company, China

11:00 a .m . – 11:20 a .m .T02.7 A Modular Multilevel Converter with Self Voltage

BalancingYunting Liu2, Fang Zheng Peng1

1Florida State University, United States; 2Michigan State University, United States

11:20 a .m . – 11:40 a .m .T02.8 Analytical Analysis of AC and DC Side Harmonics of

Three-Level Active Neutral Point Clamped Inverter with Space Vector ModulationRuirui Chen2, Jiahao Niu2, Handong Gui2, Zheyu Zhang2, Fred Wang2, Leon M . Tolbert2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States

11:40 a .m . – 12:00 p .m .T02.9 Identification of the DQ Impedance Model for Three-Phase

Power Converter Considering the Coupling Effect of the Grid ImpedanceHong Gong, Dongsheng Yang, Xiongfei WangAalborg University, Denmark

8:30 a .m . – 12:00 p .m .

T03: Photovoltaic Power Conversion SystemsROOM 213C

Renewable Energy Systems

CHAIRS:Jian Sun, RPIYongheng Yang, Aalborg University

8:30 a .m . – 8:50 a .m .T03.1 Novel Dual-Mode Micro-Inverter for Photovoltaic

AC Module ApplicationsFeng Zhang2, Yunxiang Xie2, Yanshen Hu1, Gang Chen2, Xuemei Wang2

1MOSO Electric Co. Ltd., China; 2South China University of Technology, China

8:50 a .m . – 9:10 a .m .T03.2 Current-Fed Z-Source Converter for Medium-Voltage

Medium-Frequency Isolated Solar-Photovoltaic SystemsJose M . Sandoval, Victor Cardenas, Manuel A . Barrios, Mario GonzalezUniversidad Autonoma de San Luis Potosi, Mexico

9:10 a .m . – 9:30 a .m .T03.3 Cost-Volume-Reliability Pareto Optimization of a

Photovoltaic MicroinverterYanfeng Shen, Sungyoung Song, Huai Wang, Frede BlaabjergAalborg University, Denmark

TUESDAY, MARCH 19 EDUCATIONAL PROGRAM | TECHNICAL SESSIONS

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9:30 a .m . – 9:50 a .m .T03.4 A New Single-Switch, Electrolytic Capacitor-Less

Step-Up DC/DC Converter Topology with Complete Soft-Switching Operation for Photovoltaic ApplicationKajanan Kanathipan, John LamYork University, Canada

9:50 a .m . – 10:10 a .m .T03.5 Fundamental Switching Frequency Pulse Width

Modulation of Nine-Level Current-Fed Multilevel Converter for Solar ApplicationGnana Kulothungan2, Akshay Kumar Rathore1, Dipti Srinivasan2, Jose Rodriguez3

1Concordia University, Canada; 2National University of Singapore, Singapore; 3Universidad Andres Bello, Chile

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T03.6 Power Pulsation Decoupling in a Series-Stacked

PV-Battery InverterNamwon Kim, Babak ParkhidehUniversity of North Carolina at Charlotte, United States

11:00 a .m . – 11:20 a .m .T03.7 Autonomous Power Reserve Control for Cluster of

Photovoltaic Sources in MicrogridsSilvanus Ashok D’Silva1, Praneeth Nanduri3, Sarthak Jain2, Fariba Fateh1, Mohammad B . Shadmand1, Behrooz Mirafzal11Kansas State University, United States; 2Renesas Electronics, United States; 3Schlumberger Limited, United States

11:20 a .m . – 11:40 a .m .T03.8 Economically Optimal Power Flow Management of

Grid-Connected Photovoltaic Microgrid Based on Dynamic Programming Algorithm and Grid I/O Strategy for Different Weather ScenariosYa Guo1, Su Sheng2, Norma Anglani3, Brad Lehman1

1Northeastern University, United States; 2OSRAM, United States; 3University of Pavia, Italy

11:40 a .m . – 12:00 p .m .T03.9 Modular Multilevel DC Cascaded Converter with

Battery Electrical Storage IntegrationMladen Gagic1, Kewei Huang2, Zian Qin1, Bram Ferreira1

1Delft University of Technology, Netherlands;2Delft University of Technology, China

8:30 a .m . – 12:00 p .m .

T04: Control of DC-DC ConvertersROOM 213D

Control

CHAIRS:Chao Fei, GoogleJuncheng (Lucas) Lu, GaN Systems

8:30 a .m . – 8:50 a .m .T04.1 Sliding-Mode-Based Direct Power Control of

Dual-Active-Bridge DC-DC ConvertersKerui Li, Yun Yang, Siew-Chong Tan, Ron Shu Yuen HuiUniversity of Hong Kong, Hong Kong

8:50 a .m . – 9:10 a .m .T04.2 Modeling and Control of a Four-Port DC-DC Converter for

a Hybrid Energy SystemJianwu Zeng1, Jiahong Ning1, Taesic Kim2, Vincent Winstead1

1Minnesota State University, Mankato, United States; 2Texas A&M University-Kingsville, United States

9:10 a .m . – 9:30 a .m .T04.3 Unified Current-Programmed Digital Controller for

Non-Inverting Buck-Boost Converter with Optimal Steady-State and Transient ConditionsTom Urkin, Mor Mordechai PeretzBen-Gurion University of the Negev, Israel

9:30 a .m . – 9:50 a .m .T04.4 An Integrated Regulated Resonant Switched-Capacitor

DC-DC Converter for Pol ApplicationsGiacomo Ripamonti1, Stefano Michelis1, Mario Ursino2, Stefano Saggini2, Federico Faccio1

1CERN, Switzerland; 2University of Udine, Italy

9:50 a .m . – 10:10 a .m .T04.5 Simplified Optimal Trajectory Control for 1 MHz

LLC Converter with Wide Input Voltage RangeAhmed Nabih, Mohamed H . Ahmed, Qiang Li, Fred C . LeeVirginia Polytechnic Institute and State University, United States

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T04.6 A Very Simple Analog Control for QSW-ZVS Source/Sink

DC-DC Converters with Seamless Mode TransitionAitor Vazquez, Kevin Martin, Manuel Arias, Javier SebastianUniversity of Oviedo, Spain

11:00 a .m . – 11:20 a .m .T04.7 Dynamic Interleaving of Multi-Phase Synchronous DC-DC

Converters with ZVSM A Awal, Dhrubo Rahman, Yukun Luo, Wensong Yu, Iqbal HusainNorth Carolina State University, United States


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11:20 a .m . – 11:40 a .m .T04.8 Control of Independent-Input, Parallel-Output DC/DC

Converters for Modular Battery Building BlocksMohamed Kamel2, Muneeb Rehman2, Fan Zhang1, Regan Zane2, Dragan Maksimovic’1

1University of Colorado Boulder, United States; 2Utah State University, United States

11:40 a .m . – 12:00 p .m .T04.9 Small Signal Analysis of Active Clamp Flyback Converters

in Transition Mode and Burst ModePei-Hsin LiuTexas Instruments Inc., United States

8:30 a .m . – 12:00 p .m .

T05: Drives & Inverters: Topologies & ControlROOM 303AB

Motor Drives and Inverters

CHAIRS:Arijit Banerjee, University of Illinois Urbana-ChampaignKarthik Jayaraman, Dialog Semiconductor

8:30 a .m . – 8:50 a .m .T05.1 Robust Floating Capacitor Voltage Control of Dual Inverter

Drive for Open-Ended Winding Induction MotorChatumal Perera, Siyu Leng, Gregory J . Kish, John SalmonUniversity of Alberta, Canada

8:50 a .m . – 9:10 a .m .T05.2 Coupled Inductor Design for Interleaved Three-Level

Active Neutral Point Clamped Inverters Considering EMI Noise ReductionRuirui Chen2, Jiahao Niu2, Handong Gui2, Zheyu Zhang2, Fred Wang2, Leon M . Tolbert2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States

9:10 a .m . – 9:30 a .m .T05.3 A Minimum DC-Link Capacitance Estimation and Robust

Voltage Control for an N-Phase Interleaved Boost Converter Supplying a Traction InverterRana Alizadeh2, Sebastian Gomez Jorge1, Juan Carlos Balda2, Yue Zhao2

1Universidad Nacional del Sur, Argentina; 2University of Arkansas, United States

9:30 a .m . – 9:50 a .m .T05.4 Voltage-Doubler Front-End Converter for Two-Quadrant

Switched Reluctance Motor DrivesHung-Chi Chen3, Meng-Sian Chen1, Wei-Te Su2

1Chiao Tung University, Taiwan; 2Delta Electronics Inc., Taiwan; 3National Chiao Tung University, Taiwan

9:50 a .m . – 10:10 a .m .T05.5 Masterless Interleaving Scheme for Parallel-Connected

Inverters Operating with Variable Frequency Hysteretic Current-Mode ControlSamantha Murray, Miad Nasr, Mojtaba Ashourloo, Olivier TrescasesUniversity of Toronto, Canada

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T05.6 Ripple-Compensation Improvement of Direct Digital

Controlled 34W Grid-Connected Hybrid-Frequency Inverter SystemTsai-Fu Wu, Yen-Hsiang Huang, Wei-Chi Cheng, Xiu-Ci GaoNational Tsing Hua University, Taiwan

11:00 a .m . – 11:20 a .m .T05.7 Two Degrees of Freedom Power Decoupling Method for

Single-Phase Split-Source InverterChangqing Yin, Zhen Xin, Lei Ming, Poh Chiang LohChinese University of Hong Kong, Hong Kong

11:20 a .m . – 11:40 a .m .T05.8 Characterization and Implementation of Hybrid Reverse-

Voltage-Blocking and Bidirectional Switches Using WBG Devices in Emerging Motor Drive ApplicationsHang Dai, Renato Amorim Torres, Thomas M . Jahns, Bulent SarliogluUniversity of Wisconsin-Madison, United States

11:40 a .m . – 12:00 p .m .T05.9 Pulse Energy Modulation for a Single-Phase Bridge

Inverter with Power Decoupling CapabilityShuang Xu, Liuchen Chang, Riming ShaoUniversity of New Brunswick, Canada

8:30 a .m . – 12:00 p .m .

T06: Devices and Components IROOM 303CD

Devices and Components

CHAIRS:Alex Huang, Univ of Texas at AustinPete Losee, UnitedSiC

8:30 a .m . – 8:50 a .m .T06.1 A Minimum Viable Mission Profile Emulator for IGBT

Modules in Modular Multilevel ConvertersZhongxu Wang, Huai Wang, Yi Zhang, Frede BlaabjergAalborg University, Denmark

8:50 a .m . – 9:10 a .m .T06.2 Simplified Multi-Time Scale Thermal Model Considering

Thermal Coupling in IGBT ModulesYi Zhang, Huai Wang, Zhongxu Wang, Frede BlaabjergAalborg University, Denmark


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9:10 a .m . – 9:30 a .m .T06.3 Comparison of Fast and Reliable Zero-Voltage Detection

TopologiesSteffen Beushausen, Jonas Krolzik, Johannes Voss, Rik W . De DonckerRWTH Aachen University, Germany

9:30 a .m . – 9:50 a .m .T06.4 Impact of the Case Temperature on the Reliability of SiC

MOSFETs Under Repetitive Short Circuit TestsHe Du, Paula Diaz Reigosa, Francesco Iannuzzo, Lorenzo CeccarelliAalborg University, Denmark

9:50 a .m . – 10:10 a .m .T06.5 Junction Temperature Measurement Based on

Electroluminescence Effect in Body Diode of SiC Power MOSFETChengmin Li2, Zhebie Lu2, Han Wu2, Wuhua Li2, Xiangning He2, Shan Li11Shanghai Marine Equipment Research Institute, China; 2Zhejiang University, China

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T06.6 Condition Monitoring Method for Submodule Capacitor

in Modular Multilevel ConverterHanyu Wang2, Huai Wang1, Yi Zhang1, Zhongxu Wang1, Xuejun Pei2, Yong Kang2

1Aalborg University, Denmark; 2Huazhong University of Science and Technology, China

11:00 a .m . – 11:20 a .m .T06.7 A Passive Transient Current Balancing Method for

Multiple Paralleled SiC-MOSFET Half-Bridge ModulesSizhao Lu, Xiaoting Deng, Siqi Li, Enguo RongKunming University of Science and Technology, China

11:20 a .m . – 11:40 a .m .T06.8 Comparative Study of Three Different Passive Snubber

Circuits for SiC Power MOSFETsShengsheng Liu, Hua Lin, Tao WangHuazhong University of Science and Technology, China

11:40 a .m . – 12:00 p .m .T06.9 650V GaN Based 3.3kW Bi-Directional DC-DC Converter

for High Efficiency Battery Charger with Wide Battery Voltage RangeFeng Qi, Zhan Wang, Yifeng WuTransphorm Inc., United States

8:30 a .m . – 12:00 p .m .

T07: Topologies for Grid-Tied ConvertersROOM 304AB

Power Electronics for Utility Interface

CHAIRS:Suzan Eren, Queen’s UniversityMajid Pahlevani, University of Calgary

8:30 a .m . – 8:50 a .m .T07.1 A Hybrid Snubber for Voltage-Balancing and

Self-Powering of Series-Connected DevicesVinson Jones2, Juan Carlos Balda2, Rambabu Adapa1

1Electric Power Research Institute, United States; 2University of Arkansas, United States

8:50 a .m . – 9:10 a .m .T07.2 Component Sizing and Voltage Balancing of MMC-

Based Solid-State Transformers Under Various AC-Link Excitation Voltage WaveformsLei Zhang1, Jiangchao Qin1, Qing Duan2, Wanxing Sheng2

1Arizona State University, United States; 2China Electric Power Research Institute, China

9:10 a .m . – 9:30 a .m .T07.3 A Modular Multilevel Hybrid Active Bridge DC-DC

Converter Suitable for Medium-Voltage DC Distribution GridXingping Xu1, Xuehua Wang1, Xinbo Ruan2, Yuan Xie1

1Huazhong University of Science and Technology, China; 2Nanjing University of Aeronautics and Astronautics, China

9:30 a .m . – 9:50 a .m .T07.4 Single-Stage Multiport Capacitive-Link Universal Power

Converter As a Solid-State Transformer for Nanogrid and Microgrid ApplicationsEhsan Afshari, Mahshid AmirabadiNortheastern University, United States

9:50 a .m . – 10:10 a .m .T07.5 Current-Controlled Interlinking Converter with Grid-

Supporting FunctionalitiesQing Liu, Tommaso Caldognetto, Simone BusoUniversity of Padova, Italy

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T07.6 Selective Harmonic Compensation of Three Phase Grid

Tied SEPIC Based Differential InverterAhmed Shawky, Mahmoud Abdallah Sayed, Takaharu TakeshitaNagoya Institute of Technology, Japan


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11:00 a .m . – 11:20 a .m .T07.7 Design of Interleaved Converters with Minimum

Filtering RequirementZhongyi Quan, Yun Wei Li, Changpeng JiangUniversity of Alberta, Canada

11:20 a .m . – 11:40 a .m .T07.8 Flying-Capacitor Linear Amplifier with Capacitor

Voltage Balancing Control for Efficient and Low Harmonic Power ConversionTatsuki Ohno, Masaya Katayama, Hidemine Obara, Atsuo KawamuraYokohama National University, Japan

11:40 a .m . – 12:00 p .m .T07.9 Simplified Multilevel Hybrid Microgrids Using an

Integrated AC-DC-DC ConverterJavad Khodabakhsh, Gerry MoschopoulosWestern University, Canada

8:30 a .m . – 12:00 p .m .

T08: WideBand Gap ApplicationsROOM 304CD

Power Electronics Applications

CHAIRS:Pedro Alou, Universidad Politecnica de MadridDoug Osterhout, Google Power Group

8:30 a .m . – 8:50 a .m .T08.1 Design Considerations of High-Voltage-Insulated Gate

Drive Power Supply for 10 kV SiC MOSFET in Medium-Voltage ApplicationLi Zhang2, Shiqi Ji2, Shida Gu2, Xingxuan Huang2, James Everette Palmer2, William Giewont1, Fred Wang2, Leon M . Tolbert2

1Danfoss Drives, United States; 2University of Tennessee, United States

8:50 a .m . – 9:10 a .m .T08.2 Highly Efficient and Compact GaN-Based Tracking Power

Supply System for Linear Power AmplifiersVladan Lazarevic’2, Iñigo Zubitur2, Miroslav Vasic’2, Jesús Angel Oliver2, Pedro Alou2, Greg Patchin1, Jens Eltze1, José Antonio Cobos2

1Apex Microtechnology, United States; 2Universidad Politécnica de Madrid, Spain

9:10 a .m . – 9:30 a .m .T08.3 A Reliable Ultra-Fast Three Step Short Circuit Protection

Method for E-Mode GaN HEMTsXintong Lyu2, He Li2, Yousef Abdullah2, Jin Wang2, Boxue Hu2, Zhi Yang2, Jin Wang2, Liming Liu1, Sandeep Bala1

1ABB Inc., United States; 2Ohio State University, United States

9:30 a .m . – 9:50 a .m .T08.4 Benchmarking and Qualification of Gate Drivers for

Medium Voltage (MV) Operation Using 10 kV Silicon Carbide (SiC) MOSFETsAnup Anurag1, Sayan Acharya1, Ghanshyamsinh Gohil2, Subhashish Bhattacharya1

1North Carolina State University, United States; 2University of Texas at Dallas, United States

9:50 a .m . – 10:10 a .m .T08.5 High-Frequency GaN-Based Induction Heating Versatile

Module for Flexible Cooking SurfacesHector Sarnago, Jose Miguel Burdío, Oscar LuciaUniversidad de Zaragoza, Spain

10:10 a .m . – 10:40 a .m . Break

10:40 a .m . – 11:00 a .m .T08.6 Active Gate Control for Series Connected SiC MOSFETs

Inhwan Lee, Xiu YaoUniversity at Buffalo, United States

11:00 a .m . – 11:20 a .m .T08.7 A Versatile Large-Signal High-Frequency Arbitrary

Waveform Generator Using GaN DevicesHector Sarnago2, Jose Miguel Burdío2, Tomás García- Sánchez1, Lluis M . Mir1, Oscar Lucia2

1Paris-Sud University, Gustave Roussy, Université Paris- Saclay, France; 2Universidad de Zaragoza, Spain

11:20 a .m . – 11:40 a .m .T08.8 Sequential Parallel Switching for Drain-Source

Synchronous Rectifier Efficiency and Light-Load Stability ImprovementOscar Yu, Chih-Shen Yeh, Jih-Sheng Jason LaiVirginia Polytechnic Institute and State University, United States

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RAP SESSIONSThe APEC 2019 RAP Sessions feature several exciting and contentious topics . RAP Sessions allow for exciting dialogue amongst attendees and presenters . Admission to all Rap Sessions is free with an Exhibits Only Registration .

5:00 p .m . – 6:30 p .m .

RAP SESSION 1: When Will WBG Have Significant Volume? Is the System Benefit Worth the Cost? Is WBG Reliable?BALLROOM D

Session/Track

MODERATOR: Alix Paultre, Smartalix

PANELISTS:> Sandeep Bala, ABB Corporate Research Raleigh> Tim McDonald, Chairman of JEDEC JC 70.1 > Alex Lidow, EPC> Jim Witham, GaN Systems > Chris Dries, United SiC> Filippo DiGiovanni, STMicroelectronics

Now that the availability and performance of wide-bandgap semi-conductors in the marketplace has been established, the focus is shifting from promise to reality . What application spaces face the most disruption? What opportunities are presenting themselves? The panel for this rap session includes manufacturers selling Silicon Car-bide (SiC) and Gallium Nitride (GaN) components, and the companies designing their current and future products with them . What is the current state of the wide-bandgap industry? Come participate in our rap session and find out!

5:00 p .m . – 6:30 p .m .

RAP SESSION 2: Power Supply On Chip (Pwr SoC) vs. Power Supply In Package (Pwr Sip) vs Discrete. What Is The Future?BALLROOM C

Session/Track

MODERATOR: Indumini Ranmuthu, Texas Instruments

SPEAKERS: > Hanh-Phuc Le, PwrSoC technical program chair (UC Boulder)> Charlie Sullivan, Dartmouth University> Sreenivasan Koduri, Texas Instruments Fellow> Mohamed Jatlaoui, Murata> James Doyle, Dialog Semiconductor> Martin Haug, Wurth Elektronik

There is significant trend in the industry towards higher power den-sity and integration in power supplies . This integration has given rise to complex issues such as building complete power supplies on chip, 3D packaging for power supply in single package, highly miniatur-ized passives, thermal density and efficiency . The panelists for this session includes experts from actual design of power supply on chip, 3D packaging, design of miniaturized inductors and capacitors . Come participate, ask your questions from the experts and find out the state of the art!

TUESDAY, MARCH 19 RAP SESSIONS | EDUCATIONAL PROGRAM

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5:00 p .m . – 6:30 p .m .

RAP SESSION 3 High Technology Holdup – Is Magnetics Really the Constraint or Are Magnetics Waiting for Everything Else to Catch Up?BALLROOM B

Session/Track

MODERATOR: Kevin Parmenter, Taiwan Semiconductor NA

SPEAKERS: > Ray Ridley, Ridely Engineering> Steve Tom, Texas Instruments > Dan Jitaru, Rompower> Eric Persson, Infineon > George Slama, Wurth> Larry Spaziani, GaN systems

Enormous efforts are being made to uncover new semiconduc-tor technologies and circuit topologies to supply the ever-changing demands of modern electronics . At each step, magnetics seem to be there for those companies that understand how to design them prop-erly . We will debate this and explore the constraints . Come and join this discussion about what we will need to be prepared for the next generation of power electronics .

TUESDAY, MARCH 19 EDUCATIONAL PROGRAM | RAP SESSIONS

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EXHIBITOR SEMINARS as of March 1, 2019

APEC 2019 Exhibitor Seminars will highlight new products or initiatives that companies in the power electronics industry are developing, along with allowing the opportunity for attendees to interact with other companies in the industry .

1:30 p .m . – 2:00 p .m .

Exhibitor Seminars – Session #1

Analog Devices ROOM 211AB

ADI’s Power by Linear Portfolio: Silent Switchers & Micromodule Regulator Products

PRESENTED BY: Tony Armstrong

This seminar will cover some of the basics of buck regulator opera-tion including how high di/dt and parasitic inductance in the switcher “hot” loop cause electro-magnetic noise and switch ringing . It will cover how to reduce the high frequency noise . PC-board layout is critical to the success or failure of very power supply design . It sets functional, electromagnetic interference and thermal behavior . While switching power supply layout is not black magic – it is often overlooked until it is too late in the design process . Therefore, it will discuss proven way to mitigate these potential threats of EMI genera-tion from the onset will ensure a quiet power supply . Silent Switcher technology will be shown, showing how it is constructed and it will describe how it helps to solve EMI problems without any compro-mises . Silent Switcher packaging and layout and discuss how these can enhance the overall performance of the step-down converters . From here, micromodule regulators will be introduce, indicating how they are constructed with a description of the problems they solve . It will also cover their packaging trends and their quality levels . It will demonstrate their performance characteristic both from a thermal and form factor perspective, clearly showing their increasing power den-sity in order to have a 100A output capable device in small footprint and able to deliver 100 Watts of power from 12V input to 1V output with 90 percent efficiency and only 200 LFM of air flow needed .

AVXROOM 212AB

MLCC and Tantalum Electrolytic Capacitor Interchangeability in High Capacitance Applications

PRESENTED BY: Chris Reynolds

Over the years, ceramic capacitors have been used interchangeably with tantalum in many digital applications, class II ceramics being the one electrostatic technology that can achieve the high capaci-tance values typically associated with electrolytic capacitors . We are currently at a point where more electrolytic designs are being re-considered for applications that had switched to class II ceramic in recent years . While most applications are amenable to such inter-changeability, some parametric factors arise due to the differences in technology, so these need to be taken into consideration . This paper discusses the differences between electrostatic and electrolytic tech-nologies, explaining the origin and effects of temperature and voltage coefficients, piezo and noise effects in class II ceramics, and polarity and ESR in solid tantalum electrolytic capacitors .

Infineon Technologies Americas Inc ROOM 213C

Infineon’s GaN & SiC devices for High Performance Power Electronic Applications

PRESENTED BY: Steve Bakos

Infineon will review the advancements in GaN and SiC, including the applications, performance advantages, design considerations as well as the importance of quality and reliability when considering these technologies in customer designs .

Microchip ROOM 213D

Dual-core DSCs for Digital Power Conversion

PRESENTED BY: Tom Spohrer

Low-cost digital signal controllers (DSCs) that contain multiple pro-cessing cores add a new dimension for system partitioning in digital power applications . This session will highlight the features of Micro-chip’s new dsPIC33CH family of dual-core DSCs and discuss various use cases for multi-core controllers .

TUESDAY, MARCH 19 EXHIBITOR SEMINARS | EDUCATIONAL PROGRAM

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Navitas Semiconductor EXHIBIT HALL D SHOW FLOOR: THEATER 1

What Are You Waiting For? Let’s Go GaNFast!

PRESENTED BY: Stephen Oliver

GaN has entered high-volume, mainstream production . End-customer products and roadmap applications from 24W to kW+ are highlighted . Then a 45W USB-PD fast-charger case-study details high-frequency GaNFast power IC technology, qualification ‘beyond JEDEC’, system schematic and layout, plus thermal and EMI (CE, RE) results . Discover how to become a GaNFast Design Partner!

ON Semiconductor ROOM 303AB

Satisfying the Pressured Designer’s Wish List with All the Right Tools in Just One Toolbox

PRESENTED BY: Dave Priscak

The modern electronics designer often has to be a jack of all trades - in SMEs and even mid-sized OEMs, he or she may need to design and develop solutions in analog or digital and effectively deal with challenging areas such as EMI, RFI and thermal management . This is a tough ask, made all the more difficult in an environment where available technology continues to move at a fast and exciting pace, enabling the ever-more diverse and amazing stream of end products that consumers and industry alike have grown used to having access to, but meaning the engineer is on a continuous learning curve . The final consideration to throw into the mix is time pressure - the fast moving technological environment means getting new ideas to mar-ket quickly is key to gaining market share and generating revenues from often short-lived USPs . All of this creates a comprehensive wish list from the pressured engineer . This article looks at the key items on such a notional list and considers how the tools, resources and information in the sector can help satisfy them .

Wurth Electronics EXHIBIT HALL D SHOW FLOOR: THEATER 2

Avoid Designing Custom Magnetics by using REDEXPERT

PRESENTED BY: George Slama

Designing your own custom magnetics may seem like a good idea at first . After all, you’ll get exactly what you want . But will you? Con-sider the time and effort that first goes into some type of design and then into procuring the necessary cores, bobbins, wire and later into actually winding and gapping the core . This also requires equipment since only the simplest inductors can be made by hand . The best per-forming magnetics generally use techniques (e .g . rectangular wire wound on edge) and materials (e .g . pressed composites) not avail-able outside of manufacturing facilities . This session will show you why it makes sense to use standard magnetic components and how to take advantage of the wealth of performance information avail-able to help verify your design . Based on actual testing, REDEXPERT gives you access to the world’s most accurate ac loss measurements for inductors . Discover the broad of range of solutions available for next day delivery . Learn how to easily and quickly select the right inductor, flyback transformer or wireless power transfer coil for your application .

TektronixROOM 303CD

Challenges with Testing Wide Band Gap Power Converters

PRESENTED BY: Seshank Malap

Wide Band Gap Converters are becoming mainstream across many applications in the field of power electronics to drive power density and efficiency . The design engineer is faced with increasingly com-plex challenges: navigating faster switching speeds, and minimizing parasitics to name just two .

It’s very difficult to design and optimize these circuit when using improper measurement techniques and if the designer is not using the right measurement equipment .

This seminar will offer insights on common sources of measurement errors, tips on testing methods and example measurements which will help the designer test with greater accuracy, consistency, and reliability .

TUESDAY, MARCH 19 EDUCATIONAL PROGRAM | EXHIBITOR SEMINARS

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2:15 p .m . – 2:45 p .m .


Magnetics ROOM 211AB

New Powder Core Materials for High Frequency and High Current

PRESENTED BY: Mark Swihart

Engineers find that powder cores are the best choice for many designs because of their high saturation and soft roll off with current . Even as application frequencies trend higher, powder cores continue to be the right answer in many cases . Optimized high frequency performance is essential, but “high frequency” means different things to differ-ent people . It could be 50 kHz, or 3 MHz, or anything in between . To meet the need for better overall efficiency and size across the whole range of frequencies, Magnetics has developed new materials and improved on existing ones, with more to come . In this session, the leader of Magnetics’ R&D team will explain these new materials and what is coming in the pipeline .

Mitsubishi Electric US, INC EXHIBIT HALL D SHOW FLOOR: THEATER 1

The LV100 and HV100 New Standard Modules for High Power Applications

PRESENTED BY: Eric R. Motto

This presentation will introduce the LV100 and HV100 new industry standard module packages for high power applications . Existing high power single modules in common 130mm x 140mm and 190mm x 140mm packages introduce a large stray inductance when series con-nected to form an inverter leg . This large inductance makes higher frequency operation and parallel connection challenging . Similarly, common large dual modules in 89mm x 250mm and 89mm x 172mm packages have significant internal asymmetries that cause undesir-able current and temperature imbalance when the switching speed is increased . These problems become more pronounced with state of the art IGBT chips like Mitsubishi’s 7th generation CSTBTTM (III) and practically unmanageable with SiC MOSFETs . Elimination of these limitations is the primary motivation for development of new high power modules having low and symmetric internal inductance with an optimized power terminal layout . This presentation will outline the characteristics, features, performance and line-up of these new modules .

Mouser EXHIBIT HALL D SHOW FLOOR: THEATER 2

Silicon Carbide…A Brief Overview: Where We are, Where We’re Headed, and Tips for Successful Use

PRESENTED BY: Mitch Van Ochten

Silicon Carbide continues to evolve but evolution also brings new challenges . We will take a look at the advancement in die size reduc-tion, new packages with Kelvin connections, 4th Generation SiC roadmap and our new 1700V 250A Power Module that provides the industry’s highest level of reliability while maintaining energy-saving performance . When integrating these new packages, there are many factors you should consider and we will provide guidance on choosing a Gate Driver, picking the DC/DC converter for the secondary side, minimizing stray inductance and checking for overshoot on the Gate voltage to optimize the design .

SIMPLIS Technologies ROOM 212AB

SIMPLIS Magnetic Design Module and User C-code DLL Defined Digital Device

PRESENTED BY: Tom Wilson and Andrija Stupar

A digitally controlled PFC boost converter is modeled in SIMPLIS with the control algorithm defined by a user-generated C-code DLL . Placed on the schematic like any other SIMPLIS component, the device behavior is defined by C or C++ code rather than by logic gates and other digital circuit elements .

We then design the boost inductor and analyze its performance using the new SIMPLIS Magnetics Design Module – step-by-step, select-ing the core, wire, winding arrangement, and cooling method . Results include core losses, detailed winding losses (including losses due to the air gap fringing flux), the inductance characteristic, and core and winding temperatures .

STMicroelectronics ROOM 213C

Flexible Architectures to Efficiently Convert from 48V to Intermediate Bus or Directly to POL

PRESENTED BY: Paolo Sandri

48V DC bus power distribution poses challenges on conversion effi-ciency, power density and total BOM optimization . ST offers a rich set of architectures to better fit, virtually, any need when converting from 48V to either an intermediate bus or directly to POL . The architectures for the intermediate bus can either provide a regulated output or an unregulated one .

The 48V direct conversion architectures delivers power directly to the Digital ASIC, whose cores typically requires several hundred Watts and other key challenges needs to be addressed such as the compli-ance with the specific ASIC power needs with a certain degree of sophistication in term of accuracy and mode of operations .


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Texas Instruments ROOM 213D

Isolated Gate Drivers – How Do I Know Which One’s Right for My Application?

PRESENTED BY: Nagarajan Sridhar

This seminar discusses the value of the isolated gate driver and explains how to pick the right isolated gate driver for high-power, high-voltage applications . Additionally, this seminar explores vari-ous functionality requirement modifications needed for applications trending toward the adoption of wide bandgap power devices such as SiC and GaN .

United Chemi-Con, Inc. ROOM 303AB

Advanced Capacitor Technology for Automotive Applications

PRESENTED BY: Derrick Fitzpatrick

Updated hybrid capacitor series for high power DC link and also latest technology products line up will be presented .

Yokogawa ROOM 303CD

The Next Generation in Power Measurement

PRESENTED BY: Daniel Kasamis

The WT5000 is the Next Generation in Precision of Yokogawa’s Power Analyzers product line . It is a versatile platform that delivers extraor-dinary precision and exceptional performance for the most demand-ing applications . Equipped with 7 user swappable and reconfigu-rable input elements plus 4 motor channels, the WT5000 is an ideal instrument for both electrical and mechanical power and efficiency measurements . Its highly responsive touchscreen, intuitive menu operations, and out of the box software solution make the WT5000 an ideal instrument for your testing needs . We will be highlighting key applications for motor and drive development, renewable energy, and inductive charging .

3:00 p .m . – 3:30 p .m .


Alpha and Omega Semiconductor EXHIBIT HALL D SHOW FLOOR: THEATER 2

A New Compact SMD-Type Intelligent Power Module

PRESENTED BY: In-Wha Jeong

This seminar presents a new dual-in-line surface-mount device (SMD)-type intelligent power module (IPM7) solution specialized for low power motor drives applications such as fan motors of air-conditioning systems, which require highly compact size with reliable and efficient design allowance .

CogniPower ROOM 211AB

Simplifying Efficient Low Power AC/DC Converters

PRESENTED BY: Tom Lawson

Ultra-efficient, small AC/DC converters can be surprisingly simple . We achieve 96% efficiency at 10% of full load in a power converter capable of several watts output . Transient response is excellent and cost can be competitive with the lowest- cost alternatives . The approach scales from under 1 Watt to 65 Watts Secondary-side con-trol enables easy and direct digital interfacing . Adding CogniPower Compound Converter Technology removes the upper limit . Circuit details will be provided .

Efficient Power Conversion Corporation (EPC) ROOM 212AB

GaN’s Frontal Assault on Silicon at 48 Volts

PRESENTED BY: Alex Lidow Ph.D.

In the past nine years, GaN-on-Si transistors and integrated circuits have enabled many extraordinary new applications such as LiDAR for autonomous cars, wireless power, and envelope tracking . GaN integrated circuits have started to appear in USB-C adapters, UPS systems, drones, and a host of medical devices . But the promise that GaN will crush silicon has not yet been fulfilled, until now . With pric-ing of 100 V GaN transistors equally commercial power MOSFETs, coupled with their large performance advantages, there has been a groundswell of GaN adoption occurring at 48 V input DC-DC power supplies used in everything from AI machines, high-end servers, gaming machines, and now cars . In this seminar, we will look at the front line of this adoption wave by showing examples of systems and quantifying the performance and cost edge GaN devices bring to the customer .


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Fuji Electric Corp. of America ROOM 213C

Introduction of RC-IGBT

PRESENTED BY: Alexander Theisen

High-efficiency energy usage has become an extremely important factor in achieving a low-carbon society . A key to curbing the emis-sions of CO2- a major cause of global warming - is to take effec-tive measures in the development of the power electronics devices used in the control of electric energy . Fuji Electric has developed and commercialized power semiconductors, which contribute to an overwhelming downsizing and efficiency improvement of power elec-tronics equipment . In this session, we would like to present our 7th-Generation “X Series” RC-IGBT (Reverse Conduction IGBT) technology and industrial applications .

Mersen ROOM 213D

Improving Safety & Reliability for Power Electronics

PRESENTED BY: Kian Sanjari

Session presents Mersen’s commitment to develop industry leading technologies to improve efficiency and reliability of power electronics equipment . Key topics include an Overview of High Speed Protection Fuses and innovative hybrid DC overcurrent protection devices for EV/EES applications . We will explain how Air and Liquid Cooling solu-tions provide thermal protection for semiconductor components and that efficient cooling is key to long term reliability and performance of fast switching semiconductor components . We will also present how laminated bus bars provide the most efficient connection between various components, thus limiting parasitic inductance, improving ease of assembly and integration while minimizing wiring errors and costs .

Panasonic ROOM 303AB

X-GaN Power Transistor Breakdown Mechanisms

PRESENTED BY: Tom Higuchi

GaN, which surpasses Si by performance, is increased its expectation as a next generation device .

The high performance of GaN has already been proved in many par-ties . So how about destruction?

The most important performance of Power Device is breakdown capa-bility, GaN breakdown mechanisms will be clear in this seminar .

Rogers Corporation EXHIBIT HALL D SHOW FLOOR: THEATER 1

Curamik ceramic substrates and laminated busbars solutions for Power Electronics

Presented by: Dominik Pawlik and Olivier Mathieu

Introduction to ceramic substrates and laminated busbars solutions from Rogers Corporation .

TT Electronics ROOM 303CD

OPB9000 and Adaptable Sensors: Trends, Challenges and Developments

PRESENTED BY: Sergey Komarov

Modern day sensors applications in portable medical devices, wear-ables, appliances, drones and autonomous vehicles pose new chal-lenges for product designers and sensors developers . While the tra-ditional purpose of optical sensors as motion or position transducers for non-contacting object sensing fundamentally has not changed, the variety of environments in which they operate and demand for porta-bility in a data driven world place new requirements for sensors to become highly integrated and dynamically adaptable . The OPB9000 reflective optical sensor from TT Electronics is one such device . It integrates an infrared (IR) emitter and a photodetector in one package, along with the analogue front-end circuitry, on-chip processing, and a digital interface in a surface-mount package of 4 .0 × 2 .2 × 1 .5 mm . The circuitry is encapsulated in industrial resin, making it robust and able to operate at temperatures from –40 to +85 °C . In this session we will review the main trends, challenges and developments associ-ated with adoptable sensors and their implementation in OPB9000 .


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3:45 p .m . – 4:15 p .m .


Holy Stone International ROOM 211AB

Filling in the Multilayer Ceramic Capacitor Gap

PRESENTED BY: Tom Stoddard

Filling in the Gap” is a presentation where we will discuss Multi-layer Ceramic Capacitor products that have been de-emphasized or even dropped by some of the largest MLCC manufacturers . Holy Stone Enterprise Company focuses on many of these products providing an alternate source for some of these difficult capacitors to find . Holy Stone has long been a leader in Safety Certified and High C/V MLCC’s which are precisely the area’s where many manufacturers are de-emphasizing or dropping these products entirely .

Littelfuse, Inc. ROOM 212AB

Innovative Packaging Plans for Littelfuse SiC Devices

PRESENTED BY: Christophe Warin

This presentation will focus on future packaging plans for Littelfuse SiC devices . Details to be discussed include optimization of SiC device performance in standard and innovative discrete packages as well as exploring other packaging options that include surface mount power devices (SMPD) and standard industry power modules .

Nichicon (America) Corp ROOM 213D

New Small Li-Ion Rechargeable Batteries in a Capacitor Package

PRESENTED BY: Mark Gebbia

Nichicon is introducing a new product segment, the Small Lithium Ion Rechargeable Battery . The batteries bridge the gap between standard Lithium ion batteries and EDLC’s . They have better energy capabilities than EDLC’s and higher power characteristics than rechargeable Li-ion batteries . They are available in case sizes as small as 3x7mm and energy densities reaching 39 Wh/kg . These batteries are safer than conventional Li-ion batteries even at charge/discharge rates of 20C and do not ignite from shorting internally . Come and see us for more information and stop by Booth 665 for details .

Pacific Sowa Corp C/O Epson Atmix Corp Room 303AB

High Reliability Soft Magnetic Powder for Automotive Inductors

PRESENTED BY: Yoshizawa Masahito

High reliability under sever conditions like engine rooms is required in automotive inductors . We introduce brand-new insulated soft mag-netic powder for the automotive inductors by our original insulation technology . The key factor is stability under thermal aging conditions at 150C for 1000 hours with higher heat resistance and lower hygro-scopicity than our conventional technologies . The insulation treat-ment is available for all our powders .

Ridley Engineering, Inc. EXHIBIT HALL D SHOW FLOOR: THEATER 2

Magnetics Modeling and Software

PRESENTED BY: Dr. Ray Ridley

In this session, Dr . Ridley will show how magnetics structures can be quickly and accurately translated into LTspice models . The model-ing techniques allow engineers to take their magnetics design to the next level . Powerful software algorithms solve for advanced proximity losses, giving far more accurate estimations of magnetics winding loss . The winding loss models will automatically adapt to the cur-rent waveforms seen by any given topology . For the first time, we also show how magnetics core loss can be incorporated into LTspice models for a given core and winding arrangement . The equivalent cir-cuit models react to changing duty cycles and frequency components, automatically showing how the core loss changes . The reduction in development time is substantial .

SBE, Inc. ROOM 303CD

Optimal DC Link Topologies for Best Utilization of Switch Modules

PRESENTED BY: Michael Brubaker

Advanced Si and SiC switch modules require an optimized DC link to enable maximum performance . SBE’s integrated capacitor/bus technology is ideally suited for obtaining very low ESL and parallel-ing multiple half-bridges . Examples of next generation switch mod-ules combined with ring capacitor windings surface mounted to low inductance bus structures are provided . This approach allows for the highest possible Ampere per micro-Farad rating of the DC link along with the lowest possible commutation loop inductance . Lowering the total ESL is critical to increase the operating voltage for improved efficiency and the best utilization of switching devices .


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Siemens PLMROOM 213C

Improving Power Module Thermal Design & Reliability with IGBT Testing & Automatic Calibration of Simulation Models

PRESENTED BY: Andras Vass-Varnai and Joe Proulx

For compact design of power electronics modules, thermal manage-ment at component to module level must be evaluated for optimal performance and reliability . This presentation introduces a study of multiple thermal measurements of IGBT power semiconductors within a power module, followed by calibration of detailed compact thermal models for use in improving the system level electronic cool-ing simulation accuracy of the module . This approach combines use of Simcenter T3STER thermal transient measurement technology for heat flow path analysis and thermal reliability assessment respec-tively in conjunction with automatic detailed package model calibra-tion and subsequent system level thermal simulation possible with Simcenter Flotherm software .


Schunk Carbon technology GmbH EXHIBIT HALL D SHOW FLOOR: THEATER 1

Advanced Solutions for Energy Storage and Heat Dissipation Issues in Power Electronics

PRESENTED BY: Dr. Sandra Reisinger

The composite, Aluminium Graphite (ALG), has a low density paired with a high thermal conductivity and low coefficient of thermal expansion . This makes it the ideal thermal management material for high-reliability RF, power and microelectronics applications . Schunk produces a wide range of customized parts with different plating options in various quantities . Furthermore, ALG soldering jigs and fixtures can be produced far much more sophisticated features com-pared to conventional graphite jigs and offer the advantage of higher durability . Our innovative phase change composite, Latent Heat Carbon, allows for effective buffering of temperature peaks as well as energy storage . Its unique production process allows for custom designs at attractive cost with optimal thermal properties tailored to each customer’s specific needs . Applications range from battery thermal management and climate control/HVACs in vehicles to elec-tronics cooling .

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WEDNESDAY, MARCH 20EDUCATIONAL PROGRAM

8:30 a .m . – 1010 a .m .

IS06: GaN in the Data centerROOM 210BC

CHAIRS:Mikhail Guz, IP and Technology Experts LLCNick Fichtenbaum, Navitas Semi

8:30 a .m . – 8:55 a .m .IS06.1 High Voltage GaN Devices in Server Power

Ross FoslerNexGen Power Systems Inc, United States

8:55 a .m . – 9:20 a .m .IS06.2 Evaluation of Symmetrical and Asymmetrical Scaling GaN

FETs in High Step-Down Ratio Half Bridge ConvertersJianjing Wang, Edward Jones, Michael de RooijEfficient Power Conversion Corporation, United States

9:20 a .m . – 9:45 a .m .IS06.3 Thermal Design for a High Density GaN-Based Power

StageEdward JonesEfficient Power Conversion Corporation, United States

9:45 a .m . – 10:10 a .m .IS06.4 eGaN based High-Density Unregulated 48 V to x V LLC

Converters with ≥ 98% Efficiency for Future Data CentersMohamed Ahmed1, Michael de Rooij2, Fred C . Lee1, Qiang Li11CPES Virginia TEch, United States; 2Efficiecnt Power Conversion, United States

8:30 a .m . – 10:10 a .m .

IS07: Devices and Controllers in Adapter ApplicationROOM 209AB

CHAIR:Dennis Stephens, Continental Automotive

8:30 a .m . – 8:55 a .m .IS07.1 EZDriveSM Solution for GaN E-HEMT in Adapter

ApplicationsYajie Qiu, Juncheng LuGaN Systems Inc., Canada

8:55 a .m . – 9:20 a .m .IS07.2 USB Type-C™ and Power Delivery ≤ 100W

Deric Waters, Indumini RanmuthuTexas Instruments, United States

9:20 a .m . – 9:45 a .m .IS07.3 Adaptive Digital Synchronous Rectification for Power

Supply ApplicationsIvan MassimianiSTMicroelectronics, Italy

9:45 a .m . – 10:10 a .m .IS07.4 Advanced Active Clamp Flyback Control for High-Density

AC/DC AdaptersBing LuTexas Instruments, United States

8:30 a .m . – 10:10 a .m .

IS08: Design Considerations And A Deep Dive Into Capacitor TechnologiesROOM 210A

CHAIRS:Wilmer Companioni, CompanioniFred Weber, Future Technologies Worldwide

8:30 a .m . – 8:55 a .m .IS08.1 Reaching Higher Temperatures with Film Capacitors

Rob HaywoodGORE, United States

8:55 a .m . – 9:20 a .m .IS08.2 Electrolytic Capacitors That Can Stand The Heat

Scott FrancoCornell Dublier, United States

9:20 a .m . – 9:45 a .m .IS08.3 Will The Real Supercapcitor Please Stand Up?

Stephan MenzelWurth Electronics, United States

9:45 a .m . – 10:10 a .m .IS08.4 Class 1 Ceramic Technologies for Higher Power Density

Converter ApplicationsMark LapsKEMET Electronics, United States


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8:30 a .m . – 10:10 a .m .

IS09: ModulesROOM 210D

CHAIR:David Levett, Infineon

8:30 a .m . – 8:55 a .m .IS09.1 Improved Thermal Performance for CIPOS™ Nano

Intelligent Power Modules with Carbon Fiber Thermal Interface MaterialPengwei Sun2, Hiroyuki Ryoson1

1Dexerials Corp, Japan; 2Infineon Technologies, United States

8:55 a .m . – 9:20 a .m .IS09.2 Mitsubishi Transfer Molded DIPIPMs

Michael Rogers, John DonlonMitsubishi Electric US, United States

9:20 a .m . – 9:45 a .m .IS09.3 A Modular and Scalable High Performance Power Module

for Silicon Carbide DevicesBrice McPherson, Marcelo Schupbach, Sayan Seal, Atanu Dutta, Brandon Passmore, Alex Lostetter, Ty McNutt, Jeff CasadyWolfspeed, A Cree Company, United States

9:45 a .m . – 10:10 a .m .IS09.4 A Medium Voltage (10 kV), Low Inductance, SiC Power

Module for Next-Generation Electric Power Distribution ApplicationsZach Cole, Steven Ericksen, Jonathan Hayes, Jon Kelly, Kraig Olejniczak, Brandon Passmore, Ty McNutt, Andrew Lemmon, Marshall OlimmahWolfspeed, United States

8:30 a .m . – 10:10 a .m .

IS10: WirelessROOM 213B

CHAIRS:Peter Di Maso, GaN SystemsDeepak Veereddy, Infineon Technologies

8:30 a .m . – 8:55 a .m .IS10.1 Coil Selection for Wireless Power Transfer

Anantpreet Singh AulakhWürth Electronics, United States

8:55 a .m . – 9:20 a .m .IS10.2 Improving Efficiency in Highly Resonant Wireless Power

SystemsMichael de Rooij, Yuanzhe ZhangEfficient Power Conversion Corporation, United States

9:20 a .m . – 9:45 a .m .IS10.3 50W to 1kW Wireless Power Transfer Implementation

Tiefeng ShiGaN Systems, Canada

9:45 a .m . – 10:10 a .m .IS10.4 Qi Power Control Principles and Consequences on PTx

DesignChristian Beia, Lionel CimazSTMicroelectronics, Italy; STMicroelectronics, France

2:00 p .m . – 5:25 p .m .

IS11: Current Reliability & Product Qualification Topics for SiC & GaN Wide Band Gap DevicesROOM 210D

CHAIRS:Edward Jones, Efficient Power Conversion CorporationTirthajyoti Sarkar, On Semi

2:00 p .m . – 2:25 p .m .IS11.1 Update on GaN and SiC Activities within JEDEC JC-70

CommitteeJeffrey Casady2, Stephanie Butler1

1Texas Instruments, United States; 2Wolfspeed, United States

2:25 p .m . – 2:50 p .m .IS11.2 Meeting Industry Requirements for GaN Device Reliability

Tim McDonaldInternational Rectifier, United States

2:50 p .m . – 3:15 p .m .IS11.3 650V GaN HEMT Reliability for Automotive Applications

Ronald BarrTransphorm, United States

3:15 p .m . – 3:40 p .m .IS11.4 Systematic Approach to GaN Power IC Reliability

Darshan GandhiNavitas Semiconductor, United States

3:40 p .m . – 4:10 p .m .Break

4:10 p .m . – 4:35 p .m . IS11.5- Performance, Reliability and Yield Considerations in

State-of-the-Art SiC Diode and MosFET Technologies During Ramp-UpThomas NeyerON Semiconductor, Germany

4:35 p .m . – 5:00 p .m .IS11.6 SiC Device Reliability

Don GajewskiWolfspeed, United States

5:00 p .m . – 5:25 p .m .IS11.7 GaN Reliability for Automotive: Testing Beyond AEC-Q

Robert StrittmatterEfficient Power Conversion, United States

WEDNESDAY, MARCH 20 EDUCATIONAL PROGRAM | INDUSTRY SESSIONS

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2:00 p .m . – 5:25 p .m .

IS12: Making Power Sources Small with 3D Power Packaging SolutionsROOM 210A

CHAIR:Brian Narveson, Narveson Innovative Consulting

2:00 p .m . – 2:25 p .m .IS12.1 Advanced Materials, Designs and 3D Package

Architectures for Next-Gen High-Power PackagingVenessa SmetGeorgia Tech, United States

2:25 p .m . – 2:50 p .m .IS12.2 Thermal Modeling Challenges for Multilayer Ceramic

Capacitors (MLCCs) in High Power Density AssembliesAllen TempletonKemet Electronics Corp., United States

2:50 p .m . – 3:15 p .m .IS12.3 Packaging Considerations in a High Power Density

InverterAlan MantoothUniversity of Arkansas, United States

3:15 p .m . – 3:40 p .m .IS12.4 10A DC-DC Point-of-Load Power Modules with Integrated

Inductors and Capacitors less than 1.0mm Height for Mobile PlatformsTaner DosluogluEndura Technologies, United States

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:35 p .m . IS12.5 Application of the PCB-Embedding Technology to a 3.3 kW

Power Factor CorrectorRémy Caillaud1, Johan Le Leslé2, Cyril Buttay1, Florent Morel1, Roberto Mrad2, Nicolas Degrenne2, Stefan Mollov2

1Ampere Lab, Centre National de la Recherche Scientifique, France; 2Mitsubishi Electric Research Centre Europe, France

4:35 p .m . – 5:00 p .m .IS12.6 Efficient Grid-to-Battery Power Electronics for EVs

Kraig Olejniczak2, Zach Cole2, Jonathan Hayes2, Dan Martin2, Chad O’Neal2, Ty McNutt2, Jeff Casady2, Dave Grider2, Edward VanBrunt2, John Palmour2, Andrew Lemmon1, M . Olimmah1

1University of Alabama, United States; 2Wolfspeed, United States

5:00 p .m . – 5:25 p .m .IS12.7 Realization of High Electrical Performance on-Chip

Magnetic and Thick Cu Inductor Package: Process Challenges and SolutionsTing-Li YangTSMC, Taiwan

2:00 p .m . – 5:25 p .m .

IS13: Gate DriveROOM 209AB

CHAIRS:Kevin Parmenter, Taiwan SemiconductorJim Spangler, Independent

2:00 p .m . – 2:25 p .m .IS13.1 Cost Down of Gate Drive for SiC MOSFETs

Yuequan Hu, Jianwen ShaoWolfspeed, United States

2:25 p .m . – 2:50 p .m .IS13.2 A Practical Approach to Reliable High Power Switching

Circuit with Isolated Gate DriverLong NguyenSilicon Laboratories, United States

2:50 p .m . – 3:15 p .m .IS13.3 Proposal for a High-Speed SiC MOSFET Switching Drive

MethodSeiya KitagawaROHM Semiconductor, Japan

3:15 p .m . – 3:40 p .m .IS13.4 Mixed-Signal, CMOS Isolation: State-of-the-Art and

ApplicationsKevin KilbaneSilicon Labs, United States

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:35 p .m . IS13.5 EV/HEV Automotive Power Modules Packaging

Elena BarbariniSystem Plus Consulting, France

4:35 p .m . – 5:00 p .m .IS13.6 Photonic Isolated Power Products for Fast Switching, Low

Noise Gate DriversMico Perales, Cheng-Liang Wu, Mei-Huan Yang, Kun-Hsien ChenMH GoPower Company Limited, United States; MH GoPower Company Limited, Taiwan

5:00 p .m . – 5:25 p .m .IS13.7 Silicon Carbide Gate Driver Dependencies and Methods to

Minimize Impact of ParasiticsDerek Wilson, Nitesh SatheeshAgileSwitch, LLC, United States

WEDNESDAY, MARCH 20INDUSTRY SESSIONS | EDUCATIONAL PROGRAM

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WEDNESDAY, MARCH 20 EDUCATIONAL PROGRAM | INDUSTRY SESSIONS

2:00 p .m . – 5:25 p .m .

IS14: Enablers for Transportation ElectrificationROOM 210BC

CHAIRS:Fred Weber, Future Technologies WorldwideRalph Taylor, Delphi Technologies

2:00 p .m . – 2:25 p .m .IS14.1 3D Printing for Power Electronics and Electric Motors

Burak OzpineciORNL, United States

2:25 p .m . – 2:50 p .m .IS14.2 Novel Metal-Carbon Materials Called Covetics

Iwona JasiukUniversity of Illinois at Urbana-Champaign, United States

2:50 p .m . – 3:15 p .m .IS14.3 Silicon Carbide Inverter Development, Inverter Testing

and Findings from Heavy-Duty VehicleBrij SinghJohn Deere, United States

3:15 p .m . – 3:40 p .m .IS14.4 Holistic Thermal Management

Kevin Bennion, Emily Cousineau, Bidzina Kekelia, Gilberto Moreno, Paul ParetNREL, United States

3:40 p .m . – 4:10 p .m .Break

4:10 p .m . – 4:35 p .m . IS14.5 Electrification Recycling

Chris WhalingSynthesis Partners, United States

4:35 p .m . – 5:00 p .m .IS14.6 Enabling Ultra-fast Charging of EVs with 3D Silicon Anode

Structures in Lithium BatteriesJohn BusbeeXerion, United States

5:00 p .m . – 5:25 p .m .IS14.7 Beyond Conventional Wireless Power Transfer and

Education of Electrification EngineersCharles SullivanThayer School of Engineering at Dartmouth, United States

2:00 p .m . – 5:25 p .m .

IS15: Making the Battery Outlive the Device it PowersROOM 213B

CHAIRS:Mike Hayes, Tyndall National InstituteBrian Zahnstecher, PowerRox LLC

2:00 p .m . – 2:25 p .m .IS15.1 Perspectives on Energy Harvesting for Aerospace Sensors

Stephen SavulakUTRC, United States

2:25 p .m . – 2:50 p .m .IS15.2 Microwatts AC-DC Conversion IC Design for Vibration and

RF Energy HarvestingWensi Wang, Jiaqi YuBJUT, China

2:50 p .m . – 3:15 p .m .IS15.3 A System on Chip for Energy Harvesting and Wireless

Power TransferRoberto La RosaSTMicroelectronics, Italy

3:15 p .m . – 3:40 p .m .IS15.4 Batteryless Monitoring System for Real-World Automotive

ApplicationsMarcus TaylorSilent Sensors, United Kingdom

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:35 p .m . IS15.5 Solving the Energy Harvesting and IoT Power

Consumption Measurement ChallengesPat HensleyTektronix, United States

4:35 p .m . – 5:00 p .m .IS15.6 Powering IoT Edge Devices: A Story of EnerHarv and the

Birth of an EcosystemFrancesco Carobolante1, Brian Zahnstecher2

1IoTissimo, United States; 2PowerRox, United States

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TECHNICAL SESSIONSAPEC professionals like you participated in a rigorous peer review process and have carefully picked over 500 papers making up APEC’s Technical Sessions . The review process highlights the most innovative technical solutions, and provides the highest quality possible . The technical program includes papers of broad appeal scheduled for oral presentation from Tuesday morning through Thursday afternoon . Papers with a more specialized focus are available for discussion with authors at the dialogue session on Thursday from 11:30 a .m . – 2:00 p .m . The various technical venues cover all areas of technical interest to the practicing power electronics professional . The papers are sure to give you many new design ideas that you can apply to your work immediately .

8:30 a .m . – 10:10 a .m .

T09: Converters for Data CentersROOM 211AB

DC-DC Converters

CHAIRS:Robert Pilawa-Podgurski, University of California, BerkeleyXin Zhang, IBM

8:30 a .m . – 8:50 a .m .T09.1 High-Efficiency, High-Density Isolated/Regulated 48V Bus

Converter with a Novel Planar Magnetic StructureMohamed H . Ahmed, Ahmed Nabih, Fred C . Lee, Qiang LiVirginia Polytechnic Institute and State University, United States

8:50 a .m . – 9:10 a .m .T09.2 DC-UPS Capability for the SCALDO-Assisted 48-V Google

Rack Power ArchitectureThilanga Ariyarathna, Nihal Kularatna, D . Alistair Steyn-RossUniversity of Waikato, New Zealand

9:10 a .m . – 9:30 a .m .T09.3 A 99% Efficient Dual-Phase Resonant Switched-

Capacitor-Buck Converter for 48 V Data Center Bus ConversionsStefano Saggini2, Shuai Jiang1, Mario Ursino2, Chenhao Nan1

1Google Platforms, United States; 2University of Udine, Italy

9:30 a .m . – 9:50 a .m .T09.4 A Transformer-Less Quadruple Active Half-Bridge

Converter for the Two-Stage 48V VRM ApplicationSomnath Khatua, Debaprasad Kastha, Santanu KapatIndian Institute of Technology Kharagpur, India

9:50 a .m . – 10:10 a .m .T09.5 Dynamic Bus Voltage Configuration in a Two-Stage

Multi-Phase Buck Converter to Mitigate TransientsArnab Acharya, Inder Kumar, Santanu KapatIndian Institute of Technology Kharagpur, India

8:30 a .m . – 10:10 a .m .

T10: Power Device and Module ModelingROOM 212AB


CHAIRS:Sandeep Bala, ABBRolando Burgos, Virginia Tech

8:30 a .m . – 8:50 a .m .T10.1 An Electro-Thermo-Mechanical Model Basing on

Experimental Results for Press-Pack IGBT Including MOS Side Two-Dimensional EffectsMiaosong Gu1, Xiang Cui1, Xinling Tang2, Cheng Peng1, Zhibin Zhao1

1North China Electric Power University, China; 2State Grid Smart Grid Research Institute, China

8:50 a .m . – 9:10 a .m .T10.2 Corner and Statistical SPICE Model Generation for

Shielded-Gate Trench Power MOSFETs Based on Backward Propagation of VarianceYunpeng Xiao, James Victory, Scott Pearson, Tirthajyoti Sarkar, Ashok Challa, Marc Dagan, Paul Collanton, Cristian AndreevON Semiconductor, Germany; ON Semiconductor, China; ON Semiconductor, United States

9:10 a .m . – 9:30 a .m .T10.3 New Dynamic Power MOSFET Model to Determine

Maximum Device Operating FrequencyAdam Morgan, Ajit Kanale, Kijeong Han, Jayant Baliga, Douglas HopkinsNorth Carolina State University, United States

9:30 a .m . – 9:50 a .m .T10.4 A Datasheet-Based Behavioral Model of SiC MOSFET

for Power Loss Prediction in Electromagnetic Transient SimulationYanming Xu2, Carl Ngai Man Ho2, Avishek Ghosh2, Dharshana Muthumuni11Manitoba HVDC Research Centre, Canada; 2University of Manitoba, Canada

WEDNESDAY, MARCH 20 EDUCATIONAL PROGRAM | TECHNICAL SESSIONS

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9:50 a .m . – 10:10 a .m .T10.5 Cancellation of Leakage Currents Through Power Module

Baseplate CapacitanceAaron Brovont, Andrew Lemmon, Christopher New, Blake Nelson, Brian DeboiUniversity of Alabama, United States

8:30 a .m . – 10:10 a .m .

T11: Microgrids ApplicationsROOM 213C


CHAIRS:Zeng Liu, Xi’an Jiaotong UniversityHaoyu Wang, ShanghaiTech University

8:30 a .m . – 8:50 a .m .T11.1 Enhanced Voltage Regulation of AC Microgrids with

Electric SpringsYufei He, Minghao Wang, Zhao XuHong Kong Polytechnic University, Hong Kong

8:50 a .m . – 9:10 a .m .T11.2 A Synchronous Reference Frame Based Decentralized

Control Architecture for Inverters Connected to an Autonomous MicrogridSubhrasankha Ghosh, Souvik Chattopadhyay, Sayan SamantaIndian Institute of Technology Kharagpur, India

9:10 a .m . – 9:30 a .m .T11.3 Operation of a Flexible Dynamic Boundary Microgrid

with Multiple IslandsShuying Zhen1, Yiwei Ma2, Fred Wang2, Leon M . Tolbert2

1Smith College, United States; 2University of Tennessee, United States

9:30 a .m . – 9:50 a .m .T11.4 Optimal Sizing of a PV and Battery Storage System

Using a Detailed Model of the Microgrid for Stand-Alone ApplicationsGerman Nahuel Bogado, Francisco Paz, Ignacio Galiano Zurbriggen, Martin OrdonezUniversity of British Columbia, Canada

9:50 a .m . – 10:10 a .m .T11.5 Dispatchable Virtual Oscillator Control for Decentralized

Inverter-Dominated Power Systems: Analysis and ExperimentsGab-Su Seo2, Marcello Colombino2, Irina Subotic1, Brian Johnson3, Dominic Groß1, Florian Dörfler1

1ETH Zurich, Switzerland; 2National Renewable Energy Laboratory, United States; 3University of Washington, United States

8:30 a .m . – 10:10 a .m .

T12: Rectifiers for EV ChargingROOM 213D

Transportation Power Electronics

CHAIRS:Arun K. Kadavelugu, ABB Corporate ResearchYingying Kuai, Caterpillar Inc.

8:30 a .m . – 8:50 a .m .T12.1 A Soft Switched Boost Cascaded-by-Buck Power Factor

Correction Converter for on-Board Battery Charger ApplicationJaya Sai Praneeth A .V ., Sheldon S WilliamsonUniversity of Ontario Institute of Technology, Canada

8:50 a .m . – 9:10 a .m .T12.2 A Direct Switch-Mode Three-Phase AC to DC Rectifier

with High-Frequency Isolation for Fast EV Battery ChargersErick Pool-Mazun2, Jose Sandoval2, Prasad Enjeti2, Ira Pitel11Magna Power Electronics, United States; 2Texas A&M University, United States

9:10 a .m . – 9:30 a .m .T12.3 A 12.47 kV Medium Voltage Input 350 kW EV Fast Charger

Using 10 kV SiC MOSFETXinyu Liang, Srdjan Srdic, Jehyuk Won, Erick Aponte, Kristen Booth, Srdjan LukicNorth Carolina State University, United States

9:30 a .m . – 9:50 a .m .T12.4 One-Step-Ahead Adaptive Control Scheme for Active

Rectifiers in Wild Frequency ApplicationsJoseph Benzaquen, Fariba Fateh, Mohammad B . Shadmand, Behrooz MirafzalKansas State University, United States

9:50 a .m . – 10:10 a .m .T12.5 An Interleaved 6-Level GaN Bidirectional Converter for

Level II Electric Vehicle ChargingDerek Chou, Kelly Fernandez, Robert Pilawa-PodgurskiUniversity of California, Berkeley, United States

WEDNESDAY, MARCH 20TECHNICAL SESSIONS | EDUCATIONAL PROGRAM

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8:30 a .m . – 10:10 a .m .

T13: Inverter Modulation & Control StrategiesROOM 303AB


CHAIRS:Ali Bazzi, University of Beirut/University of ConnecticutPoria Fajri, University of Nevada, Reno

8:30 a .m . – 8:50 a .m .T13.1 Decoupled Direct Digital Control with D- Process and

Average Common-Mode Voltage Model for 33W LCL ConvertersTsai-Fu Wu, Yen-Hsiang Huang, Yun-Tsung Liu, Mitradatta MisraNational Tsing Hua University, Taiwan

8:50 a .m . – 9:10 a .m .T13.2 A Robust Feedback Repetitive Control for Inverters

with LLCL Filter Connected to Weak GridYaoqin Jia, Wanrong LiXi’an Jiaotong University, China

9:10 a .m . – 9:30 a .m .T13.3 Hierarchical Model Predictive Control for Cascaded

Multilevel InvertersMitchell Easley1, Sarthak Jain2, Mohammad B . Shadmand1, Fariba Fateh1, Behrooz Mirafzal11Kansas State University, United States; 2Renesas Electronics, United States

9:30 a .m . – 9:50 a .m .T13.4 A Novel Modulation Method for Half-Bridge Based

Modular Multilevel Converters Under Submodule Failure with Reduced Switching FrequencySeok-Min Kim1, June-Seok Lee2, Kyo-Beum Lee1

1Ajou University, Korea; 2Korea Railroad Research Institute, Korea

9:50 a .m . – 10:10 a .m .T13.5 Assessment of a NPC Frequency Inverter with Low

Switching Frequency Modulation for a High Speed Rating Operation of an Induction MotorMarcos Paulo Brito Gomes2, Alex-Sander Amável Luiz1, Marcelo Martins Stopa1, Gabriel Vilkn Ramos1, Igor Amariz Pires3

1Centro Federal de Educação Tecnológica de Minas Gerais, Brazil; 2Federal University of Minas Gerais, Brazil; 3Universidade Federal de Minas Gerais, Brazil

8:30 a .m . – 10:10 a .m .

T14: Integration & EMI Considerations of Power ConvertersROOM 303CD

Power Electronics Integration and Manufacturing

CHAIRS:Yu Du, ABB Inc.Fred Weber, FTW, LLC

8:30 a .m . – 8:50 a .m .T14.1 2-D Magnetoresistive Point Field Detector-Based Current

Sensing for High-Density Power ModulesMuhammad Alvi, Minhao Sheng, Robert LorenzUniversity of Wisconsin-Madison, United States

8:50 a .m . – 9:10 a .m .T14.2 Design of Active EMI Filters with the Integrated

Passive ComponentLiyu Dai, Wenjie Chen, Yang Yang, Rui Wang, Xu YangXi’an Jiaotong University, China

9:10 a .m . – 9:30 a .m .T14.3 Failure Protection for Controller Area Network Against

EMI Emitted by Buck ConverterRyo Shirai, Toshihisa ShimizuTokyo Metropolitan University, Japan

9:30 a .m . – 9:50 a .m .T14.4 Passive Integrations for -Z Source & Dab DC-AC

Bidirectional ConverterJie Xiong3, Jianhong Jia1, Cheng Deng2

1Hunan Railway Professional Technology College, China; 2Xiangtan University, China; 3Zhejiang University, China

9:50 a .m . – 10:10 a .m .T14.5 Parasitic Inductance Modeling and Reduction for a Wire

Bonded Half Bridge SiC MOSFET Multichip Power ModuleBoyi Zhang, Shuo WangUniversity of Florida, United States

8:30 a .m . – 10:10 a .m .

T15: Optimization of Wireless Power Transfer SystemsROOM 304AB

Wireless Power Transfer

CHAIRS:Khurram Afridi, Cornell UniversityRaghav Khanna, University of Toledo

8:30 a .m . – 8:50 a .m .T15.1 Soft Switching Realization of LCCL-LC Resonant Converter

for Wireless Power Transfer ApplicationJunjie Feng, Qiang Li, Fred C . LeeVirginia Polytechnic Institute and State University, United States


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8:50 a .m . – 9:10 a .m .T15.2 Rectifier Topology Comparison in 6.78 MHz Highly

Resonant Wireless Power SystemsYuanzhe Zhang, Michael de RooijEfficient Power Conversion Corporation, United States

9:10 a .m . – 9:30 a .m .T15.3 Voltage Slope-Sensing Based Zero Voltage Switching

Detection for 6.78 MHz Wireless Power Transfer ApplicationLing Jiang, Daniel J . CostinettUniversity of Tennessee, United States

9:30 a .m . – 9:50 a .m .T15.4 A Multi-MHz Wireless Power Transfer System with Mains

Power Factor Correction Circuitry on the ReceiverJuan Arteaga, Samer Aldhaher, David Yates, Paul MitchesonImperial College London, United Kingdom

9:50 a .m . – 10:10 a .m .T15.5 Power Loss Analysis of a Back-to-Back Switching

Single-Inductor Multiple-Output InverterWeijian Jin, Albert Ting Leung Lee, Siew-Chong Tan, Ron Shu Yuen HuiUniversity of Hong Kong, Hong Kong

8:30 a .m . – 10:10 a .m .

T16: Medical/Computing/Lighting ApplicationsROOM 304CD


CHAIRS:Ed Massey, MethodeIndumini Ranmuthu, TI

8:30 a .m . – 8:50 a .m .T16.1 Capacitive Energy Storage for Magnetic Resonant Imaging

Gradient DriverYash Veer Singh, Juan A Sabate, Ruxi WangGE Global Research, United States

8:50 a .m . – 9:10 a .m .T16.2 Signal and Pattern Generation for Muscle Manipulation in

Medical ApplicationsHagit Perets Habany, Michael Evzelman, Mor Mordechai PeretzBen-Gurion University of the Negev, Israel

9:10 a .m . – 9:30 a .m .T16.3 WBG Semiconductor and Capacitor Technology

Evaluation for Pulsed Electroporation ApplicationsHector Sarnago, Jose Miguel Burdío, Oscar LuciaUniversidad de Zaragoza, Spain

9:30 a .m . – 9:50 a .m .T16.4 Active Harmonic Filtering with a Low Switching

Frequency InverterMeng-Jiang Tsai, Yu-Fan Liou, Po-Tai ChengNational Tsing Hua University, Taiwan

9:50 a .m . – 10:10 a .m .T16.5 A New Adaptive Drive Voltage Approach for LED Driver

Yang Hu, Lei Jiang, Wei Wen, Wanghui Yan, Ran DingOpple Lighting Co., Ltd., China

2:00 p .m . – 5:30 p .m .

T17: Single-Phase AC-DC ConvertersROOM 211AB

AC-DC Converters

CHAIRS:Qiang Li, Virginia TechGerry Moschopoulos, Western University

2:00 p .m . – 2:20 p .m .T17.1 Inductor Design and ZVS Control for a GaN-Based High

Efficiency CRM Totem-Pole PFC ConverterJingjing Sun, Xingxuan Huang, Nathan Strain, Daniel J . Costinett, Leon M . TolbertUniversity of Tennessee, United States

2:20 p .m . – 2:40 p .m .T17.2 An Accurate Variable on-Time Control for 400Hz CRM

Boost PFC ConvertersYu Wu, Xiaoyong Ren, Kunqi Li, Zhiliang Zhang, Qianhong ChenNanjing University of Aeronautics and Astronautics, China

2:40 p .m . – 3:00 p .m .T17.3 Fixed-Frequency Modulator for PFC with Power

Semiconductor Filter to Mitigate Oscillation in the Input CurrentKun Zhang1, Akhil Relekar1, John Wing-To Fan1, Jeff Po-Wa Chow1, Wan-Tim Chan1, Chung-Pui Tung1, Ray Ho2, Henry Shu-Hung Chung1

1City University of Hong Kong, Hong Kong; 2Mosway Semiconductor Limited, Hong Kong

3:00 p .m . – 3:20 p .m .T17.4 A Hybrid Digital Control System for LED Grow Lights

Rahil Samani, Milad Zareie, Dawood Shekari, Liam Wrubleski, Majid PahlevaniUniversity of Calgary, Canada

3:20 p .m . – 3:40 p .m .T17.5 Single-Stage LLC Charger with PFC Functionality and

Wide Input Voltage RangeMartin Wattenberg1, Ulf Schwalbe1, Martin Pfost2

1Reutlingen University, Germany; 2Technical University of Dortmund, Germany

3:40 p .m . – 4:10 p .m . Break


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4:10 p .m . – 4:30 p .m .T17.6 A New Single-Stage Bridgeless Boost Half-Bridge AC/DC

Converter with Semi-Active-RectifierAdhistira Madhyasta Naradhipa, Suhan Kang, Byeongwoo Kim, Sewan ChoiSeoul National University of Science and Technology, Korea

4:30 p .m . – 4:50 p .m .T17.7 A New Control Method for a Novel Isolated, Bridgeless

Single-Stage AC/DC Converter Used in Industrial Battery ChargersIman Askarian2, Nick Dohmeier1, Chris Botting1, Majid Pahlevani2, Andy Knight2

1Delta-Q Technologies, Canada; 2University of Calgary, Canada

4:50 p .m . – 5:10 p .m .T17.8 A High-Power-Density Electrolytic-Free Offline LED Driver

Utilizing a Merged Energy Buffer ArchitectureMausamjeet Khatua, Danish Shahzad, Saad Pervaiz, Khurram AfridiUniversity of Colorado Boulder, United States

5:10 p .m . – 5:30 p .m .T17.9 A Wide Input Voltage Range PFC Converter with

High-EfficiencyHamed Valipour, Mohammad Mahdavi, Martin OrdonezUniversity of British Columbia, Canada

2:00 p .m . – 5:30 p .m .

T18: Resonant DC-DC ConvertersROOM 212AB

DC-DC Converters

CHAIRS:Cahit Gezgin, InfineonAbey K. Mathew, IBM

2:00 p .m . – 2:20 p .m .T18.1 Effects of Secondary Leakage Inductance on the LLC

Resonant Converter—Part I: Transformer Voltage Gain and EfficiencyMostafa Noah1, Tomohide Shirakawa2, Kazuhiro Umetani2, Jun Imaoka1, Masayoshi Yamamoto1, Eiji Hiraki21Nagoya University, Japan; 2Okayama University, Japan

2:20 p .m . – 2:40 p .m .T18.2 Innovative Control Method for a Dual Independent Output

LLC Resonant ConverterAlberto Bianco2, Francesco Ciappa2, Marcello Chiaberge1, Giuseppe Scappatura2

1Politecnico di Torino, Italy; 2STMicroelectronics, Italy

2:40 p .m . – 3:00 p .m .T18.3 An Improved LLC Resonant Converter with Phase-Shift

Controlled Dynamic Series-Parallel Reconfiguration-Windings for Hold-Up ApplicationsXinxi Tang1, Yan Xing1, Hongfei Wu1, Kai Sun3, Xudong Ma2

1Nanjing University of Aeronautics and Astronautics, China; 2Southeast University, China; 3Tsinghua University, China

3:00 p .m . – 3:20 p .m .T18.4 An Investigation on Fully Zero-Voltage-Switching

Condition for High-Frequency GaN Based LLC Converter in Solid-State-Transformer ApplicationHao Wen, Jinwu Gong, Chih-Shen Yeh, Yaofei Han, Jih-Sheng Jason LaiVirginia Polytechnic Institute and State University, United States

3:20 p .m . – 3:40 p .m .T18.5 Topology Evaluation and Comparison for Isolated

Multilevel DC/DC Converter for Power Cell in Solid State TransformerYang Jiao, Milan Jovanovic’Delta Electronics Ltd., United States

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:30 p .m .T18.6 A Low Profile Stacked Transformer for High-Efficiency

High-Output-Current 380 V/12 V LLC Resonant ConvertersJahangir Afsharian2, Bing Gong1, Ning Zhu1, Dewei Xu2, Zhihua Yang11Murata Power Solution, Canada; 2Ryerson University, Canada

4:30 p .m . – 4:50 p .m .T18.7 Fixed Frequency Phase Shift Modulated LLC Resonant

Converter Adapted to Ultra Wide Output Voltage RangeQi Cao, Zhiqing Li, Bo Xue, Haoyu WangShanghaiTech University, China

4:50 p .m . – 5:10 p .m .T18.8 Suppressing Methods of Common-Mode Noise in LLC

Resonant DC-DC ConvertersYue Han, Jinxu Yang, Xinke WuZhejiang University, China

5:10 p .m . – 5:30 p .m .T18.9 Analysis of the Zero-Voltage Switching Condition in

LLC Series Resonant Converter with Secondary Parasitic CapacitorsCheng-Wei Chen, Xiaonan Zhao, Chih-Shen Yeh, Jih-Sheng Jason LaiVirginia Polytechnic Institute and State University, United States

2:00 p .m . – 5:30 p .m .

T19: Wireless Power Transfer ApplicationsROOM 213C


CHAIRS:Faisal Khan, University of Missouri at Kansas CitySheldon Williamson, University of Ontario Institute of Technology

2:00 p .m . – 2:20 p .m .T19.1 Design and Evaluation of a Multilevel Switched Capacitor

Rectifier for Wireless Fast ChargingChongwen Zhao2, Spencer Cochran2, Daniel J . Costinett2, Songnan Yang1

1FutureWei Technologies, Inc., United States; 2University of Tennessee, United States


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2:20 p .m . – 2:40 p .m .T19.2 1.2-mm Thin and Compact Direct AC-DC Converter in

Wireless Power Receiver Suitable for Wearable DevicesAtsushi Muramatsu, Hiroyuki NakamotoFujitsu Laboratories Ltd., Japan

2:40 p .m . – 3:00 p .m .T19.3 Design of an RF Power Generator for Microwave Power

Transmission SystemQi Hui, Ke Jin, Xirui ZhuNanjing University of Aeronautics and Astronautics, China

3:00 p .m . – 3:20 p .m .T19.4 Dual-Band Multi-Receiver Wireless Power Transfer:

Architecture, Topology, and ControlMing Liu, Minjie ChenPrinceton University, United States

3:20 p .m . – 3:40 p .m .T19.5 Design of Near Field Shielding Strategy by Theoretical

Calculation for a Multi-Load WPT SystemTianluan Xiao, Wenjie Chen, Yang Yang, Liyu Dai, Rui Wang, Xu YangXi’an Jiaotong University, China

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:30 p .m .T19.6 Design and Control of a Bidirectional Wireless Charging

System Using GaN DevicesHaimeng Wu1, Bowen Gu1, Xiang Wang1, Volker Pickert1, Bing Ji21Newcastle University, United Kingdom; 2University of Leicester, United Kingdom

4:30 p .m . – 4:50 p .m .T19.7 Bridgeless Rectifier Control of Wireless Power Transfer

to Improve EfficiencyWon-Jin Son, Jae Han Lee, Sangjoon Ann, Jongeun Byun, Byoung Kuk LeeSungkyunkwan University, Korea

4:50 p .m . – 5:10 p .m .T19.8 Small-Signal Phasor Modeling of an Underwater IPT

System in Constant Current DistributionAnindya Chitta Bagchi, Hongjie Wang, Tarak Saha, Regan ZaneUtah State University, United States

5:10 p .m . – 5:30 p .m .T19.9 Single-Inductor Multiple-Output (SIMO) Buck Hybrid

Converter with Simultaneous AC and DC Outputs for Multi-Coil Wireless Power Transfer ApplicationsAlbert Ting Leung Lee, Weijian Jin, Siew-Chong Tan, Ron Shu Yuen HuiUniversity of Hong Kong, Hong Kong

2:00 p .m . – 5:30 p .m .

T20: Control Strategies for Inverters and Motor DrivesROOM 213D

Control

CHAIRS:Jaber Abu Qahouq, The University of AlabamaYusi Liu, ON Semiconductor

2:00 p .m . – 2:20 p .m .T20.1 Current Control Using Pulsed Current Sampling

Considering Sampling Points and Sensor Positions for Single-Phase InverterKensuke Suzuki, Keiji WadaTokyo Metropolitan University, Japan

2:20 p .m . – 2:40 p .m .T20.2 Memory Space Adjustable Repetitive Controller Design

for Isolated Cuk InverterByeongcheol Han3, Changkyu Bai2, Jih-Sheng Jason Lai3, Minsung Kim1

1Dongguk University, Korea; 2Pohang University of Science and Technology, Korea; 3Virginia Polytechnic Institute and State University, United States

2:40 p .m . – 3:00 p .m .T20.3 Finite Control Set Model Predictive Control Strategy of

Line-Voltage Cascaded Inverter with Low-Value InductorHuan Yao2, Tingna Shi3, Xin Gu1, Zhiqiang Wang1, Guozheng Zhang1

1Tianjin Polytechnic University, China; 2Tianjin University, China; 3Zhejiang University, China

3:00 p .m . – 3:20 p .m .T20.4 A Novel 2N+1 Carrier-Based Pulse Width Modulation

Scheme for Modular Multilevel Converters with Reduced Control ComplexityDeepak Ronanki, Sheldon S WilliamsonUniversity of Ontario Institute of Technology, Canada

3:20 p .m . – 3:40 p .m .T20.5 Variable Switching Frequency Strategy Based on

Circulating Current Analysis in Paralleled Inverters with Interleaved PWMQiao Li1, Dong Jiang1, Zewei Shen1, Yechi Zhang1, Xuan Zhao1, Yingtao Ma2

1Huazhong University of Science and Technology, China; 2State Key Laboratory for Traction and Control System of EMU and Locomotive, China

3:40 p .m . – 4:10 p .m . Break


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4:10 p .m . – 4:30 p .m .T20.6 Development of a Controller Based on Compensation

of Fourier Series Coefficients of Voltage Error for Stand-Alone InvertersBunyamin Tamyurek1, Celil Yagiz2

1Eskisehir Osmangazi University, Turkey; 2KOLT Inc., Turkey

4:30 p .m . – 4:50 p .m .T20.7 Novel Power Control of Voltage-Controlled Inverters for

Grid Inertia SupportXiangjun Quan Quan, Xin Zhao, Liqi Zhang, Rong Xu, Yang Lei, Alex Q . HuangUniversity of Texas at Austin, United States

4:50 p .m . – 5:10 p .m .T20.8 Impact of Common-Mode Circuit on Variable Switching

Frequency PWM Strategy in Voltage Source InvertersQiao Li, Dong Jiang, Jianan Chen, Yechi ZhangHuazhong University of Science and Technology, China

5:10 p .m . – 5:30 p .m .T20.9 Effect of Current Measurement Timing and Antialiasing

Filter in a Single-Phase InverterJuhamatti Korhonen, Jari Honkanen, Juuso Rautio, Pertti SilventoinenLappeenranta University of Technology, Finland

2:00 p .m . – 5:30 p .m .

T21: Driving WBG DevicesROOM 303AB


CHAIRS:Alireza Dayerizadeh, North Carolina State UniversityDong Dong, Virginia Tech

2:00 p .m . – 2:20 p .m .T21.1 Influence of the Threshold Voltage Hysteresis and the

Drain Induced Barrier Lowering on the Dynamic Transfer Characteristic of SiC Power MOSFETsPatrick Hofstetter, Robert Wolfgang Maier, Mark-Matthias BakranUniversity of Bayreuth, Germany

2:20 p .m . – 2:40 p .m .T21.2 Impact of Threshold Voltage Instability on Static and

Switching Performance of GaN Devices with p-GaN GateFei Yang, Chi Xu, Bilal AkinUniversity of Texas at Dallas, United States

2:40 p .m . – 3:00 p .m .T21.3 Screen-Returned PCB Rogowski Coil for the Switch

Current Measurement of SiC DevicesLei Ming1, Zhen Xin1, Changqing Yin1, Poh Chiang Loh1, Yang Liu2

1Chinese University of Hong Kong, Hong Kong; 2Huazhong University of Science and Technology, China

3:00 p .m . – 3:20 p .m .T21.4 In Depth Analysis of Driving Loss and Driving Power

Supply Structure for SiC MOSFETsXuning Zhang, Gin Sheh, Inhwan Ji, Sujit BanerjeeMonolith Semiconductor Inc., United States

3:20 p .m . – 3:40 p .m .T21.5 Current Source Gate Drive to Reduce Switching Loss for

SiC MOSFETsHandong Gui2, Zheyu Zhang2, Ruirui Chen2, Jiahao Niu2, Leon M . Tolbert2, Fred Wang2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:30 p .m .T21.6 Transient-Immune GaN Gate Driver and Power Layout

Pramod Kumar Prasobhu2, Felix Hoffmann2, Marco Liserre1

1Christian-Albrechts-Universität zu Kiel, Germany; 2Kiel University, Germany

4:30 p .m . – 4:50 p .m .T21.7 Design of Active SiC MOSFET Gate Driver for Crosstalk

Suppression Considering Impedance Coordination Between Gate Loop and Power LoopZhebie Lu2, Chengmin Li2, Han Wu2, Wuhua Li2, Xiangning He2, Shan Li11Shanghai Marine Equipment Research Institute, China; 2Zhejiang University, China

4:50 p .m . – 5:10 p .m .T21.8 Current Source Gate Driver for Series Connected

Silicon-Carbide (SiC) MOSFETsChunhui Liu, Qin LeiArizona State University, United States

5:10 p .m . – 5:30 p .m .T21.9 Empirical Circuit Model for Output Capacitance Losses

in Silicon Carbide Power DevicesZikang Tong, Sanghyeon Park, Juan Rivas-DavilaStanford University, United States

2:00 p .m . – 5:30 p .m .

T22: Drives & Inverters: Parameter Identification, Measurement & DiagnosticsROOM 303CD


CHAIRS:Mehdi Farasat, Louisiana State UniversityMithat Kisacikoglu, University of Alabama

2:00 p .m . – 2:20 p .m .T22.1 GaN PCB Integrated Sensing System for Switch and

Capacitor CurrentsMinhao Sheng, Muhammad Alvi, Robert LorenzUniversity of Wisconsin-Madison, United States


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2:20 p .m . – 2:40 p .m .T22.2 An Integrated and Galvanically Isolated DC-to-15.3 MHz

Hybrid Current SensorTobias Funk2, Johannes Groeger2, Bernhard Wicht1

1Leibniz University Hannover, Germany; 2Reutlingen University, Germany

2:40 p .m . – 3:00 p .m .T22.3 Initial Rotor Position Estimation for Brushless

Synchronous Starter/GeneratorsShuai Mao2, Weiguo Liu2, Jichang Peng2, Ningfei Jiao2, Yu Jiang1

1AVIC Shaanxi Aero Electric Co., Ltd., China; 2Northwestern Polytechnical University, China

3:00 p .m . – 3:20 p .m .T22.4 On-Line Monitoring of Stator Inter-Turn Failures in

DTC Driven Asynchronous Motors Using Mathematical Morphological GradientHassan Eldeeb1, Alberto Berzoy2, Ahmed Saad1, Osama Mohammed1

1Florida International University, United States; 2Sonnen Batterie Inc., United States

3:20 p .m . – 3:40 p .m .T22.5 High Frequency Voltage Injection Based Fault Detection

of Rotating Rectifier for Three-Stage Synchronous Starter/Generator in the Stationary StateChenghao Sun2, Weiguo Liu2, Yujie Zhu2, Shuai Mao2, Tao Meng2, Ji Pang2, Dan Li11AVIC Shaanxi Aero Electric Co., Ltd., China; 2Northwestern Polytechnical University, China

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:30 p .m .T22.6 Phase Current Reconstruction Based on Rogowski Coils

Integrated on Gate Driver of SiC MOSFET Half-Bridge Module for Continuous and Discontinuous PWM Inverter ApplicationsSlavko Mocevic2, Jun Wang2, Rolando Burgos2, Dushan Boroyevich2, Marko Jaksic1, Mehrdad Teimor1, Brian Peaslee1

1General Motors, United States; 2Virginia Polytechnic Institute and State University, United States

4:30 p .m . – 4:50 p .m .T22.7 Determination of Cable Characteristics and Adjustment

of PWM Pulse Pattern to Minimize AC Motor Terminal Over-VoltageNandini Ganesan, Rangarajan TallamRockwell Automation Inc., United States

4:50 p .m . – 5:10 p .m .T22.8 Parameter Estimation of Permanent Magnet Synchronous

Machines Based on a New Model Considering Discretization Effects of Digital ControllersGorkem Secer2, Goksel Kizir1, Murat Sahin2

1Gazi University, Turkey; 2ROKETSAN Missiles Inc., Turkey

5:10 p .m . – 5:30 p .m .T22.9 Open-Phase Fault Control in Open-Winding PMSM System

with Common DC BusChenhui Ruan, Wei Hu, Heng Nian, Dan SunZhejiang University, China

2:00 p .m . – 5:30 p .m .

T23: Diagnostic and Fault-Tolerant Control of Renewable Energy SystemsROOM 304AB


CHAIRS:Minjie Chen, Princeton UniversityFei Lu, Drexel University

2:00 p .m . – 2:20 p .m .T23.1 Fault Remediation for Distributed Photovoltaic (PV)

SystemPalak Jain1, Jai Prakash Singh2, Sanjib Kumar Panda1

1National University of Singapore, Singapore; 2Solar Energy Research Institute of Singapore, Singapore

2:20 p .m . – 2:40 p .m .T23.2 Threshold Point Calculation Method Using Instantaneous

Phase Current for Switch Fault Diagnosis of AC-DC Converters in Hybrid Grid SystemsGeun Wan Koo, Byoung Kuk Lee, Dong-Myoung JooSungkyunkwan University, Korea

2:40 p .m . – 3:00 p .m .T23.3 FRT Capability of Three-Phase Grid-Tied Converter

with Minimized InductorSatoshi Nagai, Jun-Ichi ItohNagaoka University of Technology, Japan

3:00 p .m . – 3:20 p .m .T23.4 Photovoltaic Panel Health Diagnostic System for Solar

Power PlantsMartin Garaj2, Kelvin Yiwen Hong2, Henry Shu-Hung Chung2, Jianfeng Zhou2, Alan Wai-Lun Lo1

1Chu Hai College of Higher Education, Hong Kong; 2City University of Hong Kong, Hong Kong

3:20 p .m . – 3:40 p .m .T23.5 A Three-Phase Adaptive Active Damper for Improving the

Stability of Grid-Connected Inverters Under Weak GridZhiheng Lin, Xinbo RuanNanjing University of Aeronautics and Astronautics, China

3:40 p .m . – 4:10 p .m . Break


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4:10 p .m . – 4:30 p .m .T23.6 Experimental Assessment and Stability Analysis of a

Discrete-Time Battery Model with Multiple Constant Phase ElementsChun-Sing Cheng, Henry Shu-Hung Chung, Wing-Hong Lau, Kelvin Yi-Wen HongCity University of Hong Kong, Hong Kong

4:30 p .m . – 4:50 p .m .T23.7 Region Based Stability Analysis of Active Dampers in

AC Microgrids with Multiple Parallel Interface InvertersYan Guo3, Laijun Chen3, Xiaonan Lu2, Jianhui Wang1, Tianwen Zheng3, Shengwei Mei31Southern Methodist University, United States; 2Temple University, United States; 3Tsinghua University, China

4:50 p .m . – 5:10 p .m .T23.8 Improved Operation of DFIG System Under Harmonically

Distorted Grid Considering Inter-HarmonicsBo Pang, Heng Nian, Chao WuZhejiang University, China

5:10 p .m . – 5:30 p .m .T23.9 Modified Adaptive Virtual Impedance Method to

Compensate Mismatched Line Impedances in MicrogridsRonghui An, Zeng Liu, Jinjun LiuXi’an Jiaotong University, China

2:00 p .m . – 5:30 p .m .

T24: Transportation/Storage/GridROOM 304CD


CHAIRS:Petar Grbovic, University of Innsbruck/Innsbruck Power Electronics Lab. (i-PEL)Tae H. Kim, Futurewei (Huawei US R&D)

2:00 p .m . – 2:20 p .m .T24.1 A Bidirectional Modular DC-AC Converter with High

Frequency Isolation for Marine ApplicationAritra Basu, Gautam PoddarIndian Institute of Technology Kharagpur, India

2:20 p .m . – 2:40 p .m .T24.2 A Comparative Study of Failure-Tolerant Three-Phase

RTRUs for More Electric AircraftsAkshay Singh, Ayan Mallik, Alireza KhalighUniversity of Maryland, United States

2:40 p .m . – 3:00 p .m .T24.3 A DC-Link Capacitor Voltage Balancer Integrated Into

LLC-Based Auxiliary Power SupplyYuxiang Shi, Yu Du, Zach Pan, Eddy Aeloiza, Arun K . Kadavelugu, Liming LiuABB Inc., United States

3:00 p .m . – 3:20 p .m .T24.4 Design Considerations for Turbo Rack with Smart Battery

Backup System (BBS)Xiaoguo Liang1, Edmund Song2, Feng Jiang2, Nishi Ahuja2, Mohan Kumar2

1Intel Asia Pacific R&D Ltd., China; 2Intel Corporation, United States; 2Intel Corporation, China

3:20 p .m . – 3:40 p .m .T24.5 Bidirectional Coupled Inductor Based Hybrid Circuit

Breaker Topologies for DC System ProtectionAnindya Ray2, Kaushik Rajashekara2, Satish Naik Banavath1

1Mahindra Electric Mobility Ltd, India; 2University of Houston, United States

3:40 p .m . – 4:10 p .m . Break

4:10 p .m . – 4:30 p .m .T24.6 Voltage Support Strategy of SNOP Under Fault

CircumstanceYuze Li1, Xuejun Pei1, Yong Kang1, Yi Lu2, Feng Xu2, Chaoliang Wang2

1Huazhong University of Science and Technology, China; 2State Grid Zhejiang Electric Power Research Institute, China

4:30 p .m . – 4:50 p .m .T24.7 Non-Linear Droop Control of Parallel Split-Phase Inverters

for Residential NanogridsAlberto Berzoy1, Andres Salazar1, Farid Moghadam Khalizheli1, Carlos Restrepo1, Javad Mohammadpour Velni21Sonnen Batterie Inc., United States; 2University of Georgia, United States

4:50 p .m . – 5:10 p .m .T24.8 Stability Analysis of a Medium Voltage Cascaded

Converter System with Reduced DC-Link CapacitanceSayan Acharya, Anup Anurag, Subhashish BhattacharyaNorth Carolina State University, United States

5:10 p .m . – 5:30 p .m .T24.9 Stability Analysis of Grid-Connected VSCs Based on

Two-Port Network TheoryShih-Feng Chou, Xiongfei Wang, Frede BlaabjergAalborg University, Denmark


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EXHIBITOR SEMINARSAPEC 2019 Exhibitor Seminars will highlight new products or initiatives that companies in the power electronics industry are developing, along with allowing the opportunity for attendees to interact with other companies in the industry .

10:30 a .m . – 11:00 a .m . Exhibitor Seminars – Session #5

Coilcraft, Inc. ROOM 211AB

New Thinking Leads to Smaller Inductors and High Efficiency at High Frequency

PRESENTED BY: Len Crane

Selecting inductors and transformers for power converters often means invoking well-used rules of thumb . While these “rules” have been developed over many years and are based on real-life experi-ence, it is necessary to move beyond them to truly optimize designs and achieve new size and performance targets . While it is usually assumed that inductor losses will increase at high switching frequen-cy, for example, this presentation describes creative ways of viewing magnetic operation that can lead to surprising solutions with smaller passive components and higher efficiency .

Danfoss Silicon Power GmbHROOM 212AB

Next Gen Automotive Power Modules: DCM™ platform by Danfoss Silicon Power

PRESENTED BY: Brian L. Rowden

Danfoss has introduced the direct cooled molded (DCM) module tech-nology for traction applications in hybrid electric and battery electric vehicles . The DCM™ technology platform is truly flexible in being optimized to utilize Si, SiC or Si/SiC hybrid semiconductor setups . It ensures versatility and flexibility by allowing the customers to uti-lize scalable drive train inverters design approach . Using the same package and footprint for different inverter power classes opens the possibility to have scaling effects with the supporting hardware for the OEM’s . The presentation will demonstrate measurement results obtained from system level setups, it will also introduce performance results of SiC based power modules .

GMW Associates ROOM 213C

Test Instrumentation for Electric Vehicle Battery and Charging Systems

PRESENTED BY: Ian Walker

For current control and metering, Fluxgate-based DC/AC Transducers offer current ranges to +/-10kA, better than +/-0 .01% accuracy from dc to 2kHz, resolution of better than 4ppmrms broadband and +/-1ppm per year dc stability . Rogowski Coil Clip-Around Coils with matching Analog Integrator enable measurement of ac current in the frequency range of a few Hz to 50MHz and can be optimized for accuracy and resolution at a specific frequency; a Probe for 85kHz Inductive Power Transfer (IPT) measurements is available with +/-300A range, ampli-tude accuracy of +/-0 .3% and phase shift of <+/-1 degree . For IPT magnetic field measurement and mapping a 15x15x15mm Three-Component Magnetic Field Probe with field ranges to +/-10mT, 10kHz to 200kHz bandwidth .

NH Research ROOM 213D

Battery Emulation for Powertrain & DC Fast Charger Testing

PRESENTED BY: Martin M Weiss

There are new testing challenges for Battery Electric Vehicle’s pow-ertrain components and DC Fast Chargers that can be addressed with modern battery emulation solutions . BEV’s vehicle propulsion com-ponents and the DC Fast Chargers (CCS1, CCS2, & CHAdeMO) are designed to operate at 400VDC or at a newer 800VDC level . NHR will present our modular 600VDC/1200VDC Dual-Range Battery Emu-lator which is ideally suited for testing of powertrain components, complete skateboards and electric fueling systems . We invite you to come see how Battery Emulation is the right approach for faster, scal-able and more repeatable testing of new automotive power electronic components .

WEDNESDAY, MARCH 20EXHIBITOR SEMINARS | EDUCATIONAL PROGRAM

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OPAL-RT TECHNOLOGIES EXHIBIT HALL D SHOW FLOOR: THEATER 1

Real-Time Simulation: Helping the World Build Better Products

PRESENTED BY: Martin Belanger

For nearly 20 years, OPAL-RT has conducted extensive research and development in the field of power electronics, in order to deliver the fastest and most accurate real-time simulation . OPAL-RT plat-forms for testing and validation of electronic controls cover a wide range of applications, from renewable energy conversion to highly complex multi-modular converters (MMC) and the electric motors of tomorrow’s transportation industry . By combining precise expertise, experience and mathematical innovation, OPAL-RT has succeeded in creating the market’s fastest computing level for real-time simulation on FPGA for power electronics applications . Fast real-time simulation achieves more accurate results and increases HIL and RCP test cover-age, and now pushes back the boundaries of what is achievable with PHIL applications .

Power Integrations EXHIBIT HALL D SHOW FLOOR: THEATER 2

Death to Heatsinks

PRESENTED BY: Doug Bailey

Examine most consumer product power supplies and you will find at least one heatsink . Generally, they are made out of a piece of extruded or stamped copper or aluminum . The heatsink’s job is to couple wasted energy into the ambient environment, where it can’t do any harm . Think about the concept of “wasted energy” . Who says it’s waste? Who says that it’s OK to dispose of it and why is it wasted in the first place? In an age where advanced materials and sophisti-cated controller techniques abound, isn’t it time for a rethink? Con-sider instead that the existence of a heatsink in a product represents a quantum of failure: Failure of our society to efficiently manage our energy resources, failure of our designers to specify products that are compact, light and unobtrusive and a failure of project definition experts to leverage the technologies that are readily available . As an industry, we are continuously tempted to sacrifice energy, product utility and cost of ownership for unit cheapness, passing the electric-ity bills onto the end user and wasting resources . This presentation is an unabashedly partisan attack on the practice of heatsinking, along with a review of the materials and techniques that we can, as engi-neers, leverage now and in the future to make better products . Death to Heatsinks!!!

SEMIKRON, Inc. ROOM 303AB

Hybrid SiC Modules Optimized for Converter and Inverter Operations

PRESENTED BY: Kevork Haddad

The presentation will provide background of adding SiC diodes in power modules . Hybrid modules are a viable approach for medium to high power applications . However, converter and rectifier operations require different chip optimization due to different duty cycles in two level topologies . This optimization is necessary from the cost point of view due to high material cost of SiC . The presentation will give an overview of the SKiM platform . Also, it will pinpoint how freewheel-ing diode are stressed during converter or inverter operations . It will also introduce two newly developed and qualified hybrid SKiM mod-ules that addresses the above concerns . Further, a perfect IGBT-SiC diode pairing is achieved by replacing medium speed IGBTs with high speed chips . Performance of the new hybrid modules are compared to their Si based counterpart by way of examples and benefits are highlighted .

Typhoon HIL, Inc. ROOM 303CD

Ultra-High Fidelity Real-Time Simulation for Power Electronics and Microgrids

PRESENTED BY: Bozica Kovacevic

Typhoon HIL Inc . is the market and technology leader in the rapidly-growing field of ultra-high-fidelity controller-Hardware-in-the-Loop (C-HIL) simulation for power electronics, microgrids, and distribution networks . We provide industry- proven, vertically integrated test solu-tions along with highest-quality customer support . The company was founded in 2008 and since then has been creating products distin-guished by the ultimate ease of use, unrivaled performance, leading-edge technology, and affordability . We stand behind our seamlessly integrated technology stack, from Typhoon HIL’s application specific processors and ultra-robust numerical solver all the way to the sche-matic editor and SCADA system . The complete technology stack that empowers our customers to continuously exceed their controller soft-ware quality, performance, and time-to-market goals .

WEDNESDAY, MARCH 20 EDUCATIONAL PROGRAM | EXHIBITOR SEMINARS

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11:15 a .m . – 11:45 a .m .


AC Power Corp (Preen)ROOM 303AB

Factors in Selecting Programmable AC Power Sources

PRESENTED BY: Brian Hsu

Many industrial and commercial applications in factory, research labs, and military need AC power sources with programmable voltage and frequencies for accomplish the testing procedures or requirements . Therefore it is important to understand different types of power sources, advantages, and key parameters when doing the selection for the applications . The presentation will start with a brief history of the technology, then go into explaining the difference between various designs, their requirements as well as advantages/disadvan-tages . Illustrations will be provided .

Apex Microtechnology EXHIBIT HALL D SHOW FLOOR: THEATER 2

Pushing the Limits of Analog Power

PRESENTED BY: Jens Eltze

Apex Microtechnology’s Director of Strategic Marketing, Jens Eltze, will be discussing one of Apex’s new Power Op Amps and how to prop-erly protect the device . The PA164 is a high-density power amplifier IC that utilizes MOSFET technology and a proprietary silicon design to deliver new benchmarks in performance and thermal management . Keeping the PA164 protected at high currents and voltages is critical to device success . In this seminar, learn how fail safes such as tem-perature compensated current limit, over-current flags, and feedback loops are enlisted to ensure smooth amplifier operation .

Helix Semiconductors EXHIBIT HALL D SHOW FLOOR: THEATER 1

Realizing a Transformerless Future

PRESENTED BY: Bud Courville

It’s an all-too familiar sight in today’s homes and businesses: a tangle of cords emerging from behind a console, desk or conference table, connected to several large, bulky power supplies . TVs, DVD players, set-top boxes, sound bars, digital media devices, monitors, printers, routers, laptops…the list of devices connected to these power sup-plies is seemingly endless . It doesn’t have to be this way, accord-ing to fabless power semiconductor company Helix Semiconductors . Traditional power supplies are built around century-old methods . Transformers are the culprit here: they are big, cumbersome, heavy, inefficient, and inflexible, and they usually dictate the size and form factor of a power supply . Getting the maximum amount of power in the smallest space possible is the key to a new way of powering the world, and proprietary technology from Helix Semiconductors has accomplished exactly that . Come listen to our story and learn about how our MxC 200 and MxC 300 family of products enable a transfor-merless future .

Henkel Company ROOM 211AB

The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large Qfn Devices

PRESENTED BY: Dr. Neil Poole

When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed . The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten . As flux materials are an underlying cause of void formation, then solder paste formulation has considerable potential to influence the degree of voiding finally observed . This paper summarizes some studies concerned with the influence of an aspect of solder paste formulation – solvent choice – in conjunction with some process factors on voiding under a large (12 mm x 12 mm) QFN device .

ITG Electronics Inc. ROOM 212AB

Electrical Noise Suppression and Common Mode Choke

PRESENTED BY: Rickey Cheang

At higher frequencies the impedance of a CM choke becomes an important factor to effectively

Suppress EMI noise . This presentation will briefly discuss CM noise generators and how it can be suppressed by using a CM choke . In addition, we’ll discuss impedance improvements by using different winding techniques and wire shapes that enhance the performance and efficiency of the CM choke .

PEM Ltd ROOM 213C

Delay, Rise-Time and Slew Rate Using CWT HF Optimised Rogowski Current Sensors in Power Electronics

PRESENTED BY: Dr. Chris Hewson

PEM’s CWT range of Rogowski current sensors have been used in power electronic applications for over 25 years . Improvements in bandwidth for the new CWTHF ranges of Rogowski current sensors from PEM Ltd have opened up new application areas including mea-surements in SiC semiconductors . Understanding the limitations of high frequency bandwidth and how this relates in practice to rise-time, slew rate and delay of these new faster probes is discussed and illustrated with practical measurement examples .


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Plexim ROOM 213D

Code Generation and Real-time Simulation with PLECS and the RT Box

PRESENTED BY: Bryan Lieblick

Powerful new tools such as automatic code generation and hardware-in-the-loop testing are key to accelerating the design, programming, and validation of embedded control systems . In this seminar we will transform a PLECS simulation model of a power stage and controller into a real-time test of an embedded control system . We will show-case how to generate control code for a TI C2000 microprocessor from PLECS, and then verify the deployed control code using the PLECS RT Box in a HIL test bed . We will benchmark offline and real-time simulations, demonstrating how embedded controls can quickly be developed and tested in real-time using the PLECS toolchain .

pSemi, A Murata Company ROOM 303CD

Novel Two-stage Bucks Achieve Unprecedented Efficiency in Ultra-low Profile and Footprint for Powering DDR5 Memory, ASICs and FPGAs

PRESENTED BY: Stephen Allen

Based on a patented architecture originating from MIT, pSemi is releasing a new family of DC-DC buck converters featuring a unique two-stage architecture that dramatically reduces the dependency on inductors, improves conversion efficiency and transient performance, and yet reduces solution footprint and profile . Targeting applications such as DDR5 memory, ASICs and FPGAs, the products are being released as both discrete component form, and as fully integrated modules . The latter benefit from the dramatic reduction in inductor size, allowing the use of advanced 3D semiconductor packaging technologies to achieve the world’s smallest and most efficient fully integrated products on the market .

12:00 a .m . – 12:30 a .m .


Bose Research, Ltd ROOM 211AB

Simplifying your Power Supply Designs, including EMI & Safety

Changsung Corporation ROOM 212AB

Hybrid Magnetics

HBM Test and Measurement ROOM 213C

Accelerate Motor Testing and Development Up to 100X

PRESENTED BY: Mike Hoyer

Every lab has unique interests to characterize, test and validate elec-tric motors and drives using multiple pieces of measurement equip-ment from different suppliers . While these systems work, they often have high levels of complexity and operate much slower than an optimized system . This presentation proposes a solution specifically designed for motor and drive testing, consolidating many systems into one which allows rapid efficiency motor mapping and custom advanced real-time analysis significantly boosting productivity, capa-bility and research and development by many days .

Instek America ROOM 213D

Instek Value Proposition and Power Supply Testing Solution

Rohde & Schwarz EXHIBIT HALL D SHOW FLOOR: THEATER 1

Oscilloscopes: An All-in-One Solution for Power Electronics Design – From Switching and Frequency Response Analysis to EMI Debugging

PRESENTED BY: Mike Schnecker

Oscilloscopes are the work horse for power electronics engineers . With frequency response analysis functionality and fast and conve-nient FFT capabilities available, they become a multi-purpose instru-ment for power electronics engineers . This talk covers key topics of interest for power electronics engineers: Bode plot functionality, switching analysis and EMI debugging .

WEDNESDAY, MARCH 20 EDUCATIONAL PROGRAM | EXHIBITOR SEMINARS

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Sino Nitride Semiconductor ROOM 303AB

Advanced Manufacturing of GaN for Power Devices

PRESENTED BY: Joe Lu

Sino Nitride Semiconductor (SNS) was founded in 2009 as a GaN materials and service company . By introducing two new technologies, the laser lift-off and wet aching, high quality 2-inch bulk GaN wafer with dislocation density of 5×105 cm-2 can be achieved by vertical HVPE epitaxy . The HVPE batch reactor was designed to produce 2/4/6 inch GaN substrates at high throughput and low particulates . The deposition rate can be controlled from 2 to 100µm/hr . The quality of the GaN reveals the FWHM of 39 .9 arcsec and 47 .5 arcsec at (002) and (102) rocking curves respectively, indicating their high degree of crystalline stoichiometry . In addition, SNS launched 4-inch free-standing GaN substrates with dislocation density below 5×106cm-2 in 2018 . HEMT devices have been built to verify the material integrity in handling the high power environment .

Speedgoat Inc. ROOM 303CD

HIL Testing and Controls for Power Electronics Made Easy with Speedgoat Real-Time Solutions

PRESENTED BY: Carlos Villegas and Tony Lennon

Simulink Real-Time and HDL Coder, together with Speedgoat real-time systems, create a complete and seamless integrated real-time software and hardware environment for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) simulation . Simulink Real-Time provides a high-performance host-target prototyping environment that enables you to connect your Simulink/Simscape models to physical systems either running C code on a CPU and/or HDL code on an FPGA . Speedgoat offers a wide band of optimized hardware sufficiently equipped with high speed analog and digital inputs and outputs . Verifying and testing the control hardware with its embed-ded software against a virtual prototype of the controlled system using deterministic and equivalent real-time simulation is a proven step before proceeding to prototype hardware testing . In HIL test-ing, power electronics, power stages, sources, loads, and even a grid network are simulated in system-level models running on dedicated real-time test systems . The system lets you perform initial testing of embedded software without risking damage to hardware prototypes and develop a high degree of confidence that your software will per-form its intended functions . Advances are being made to real-time test hardware through the incorporation of FPGAs, for high speed I/O and for running the simulation, the latter presenting a new chal-lenge of programming over the more common use of C code on a microprocessor .a

West Coast Magnetics EXHIBIT HALL D SHOW FLOOR: THEATER 2

Challenges of Magnetic Component Core and Copper Loss Measurement

PRESENTED BY: Weyman Lundquist

Isolation of magnetic core and winding loss in a transformer or induc-tor from small signal measurements can prove a challenging task . The device under test must be evaluated before performing a test, to discern if it is in a range where it can be accurately measured, or if simulation is a better choice for estimating loss . If a small signal mea-surement is chosen to estimate loss, the results must be interpreted carefully . In this talk, we present measurement ranges in which wind-ing and core loss can be extracted from a small signal impedance analyzer measurement, and a method for doing so when extraction is feasible .


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THURSDAY, MARCH 21EDUCATIONAL PROGRAM

8:30 a .m . – 11:25 a .m .

IS16: Production Use Cases of Wide Band Gap SemiconductorsROOM 209AB

CHAIRS:Tim McDonald, InfineonPrimit Parikh, Transphorm

8:30 a .m . – 8:55 a .m .IS16.1 How SiC MOSFETs Enhance Efficiency, Reliability, and

Performance of Electric VehiclesJeffrey FedisonEC Power Platform, United States

8:55 a .m . – 9:20 a .m .IS16.2 Silicon Carbide Inverter Technology Development – A

Success StoryBrij SinghJohn Deere, United States

9:20 a .m . – 9:45 a .m .IS16.3 GaN ICs Enabling Next-Gen ACF for Adapter/Charger

ApplicationsXiucheng HuangNavitas, United States

9:45 a .m . – 10:10 a .m .IS16.4 Real World High Voltage GaN Design Experiences

Philip ZukTransphorm, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 11:00 a .m . IS16.5 Super High Efficiency SHE2 Telecom Rectifier Provides

Record Efficiency With Cost Effective GaN Based Power ConversionEric PerssonInfineon Technologies, United States

11:00 a .m . – 11:25 a .m .IS16.6 GaN E-HEMT Performance and Reliability in Datacenter,

Solar, and Wireless Power Production SystemsJim WithamGaNSystems, United States

8:30 a .m . – 11:25 a .m .

IS17: SiC ApplicationsROOM 210D

CHAIRS:Jeff Casady, WolfspeedChris Jones, Artesyn

8:30 a .m . – 8:55 a .m .IS17.1 Reliability of Silicon Carbide Power Modules using POL-

kW Packaging TechnologyLiqiang Yang2, Rick Eddins2, Robert George2, Christopher Kapusta2, Liang Yin2, Kaustubh Nagarkar2, Arun Gowda1, Risto Tuominen2, Dave Esler1

1GE Global Research, United States; 2General Electric, United States

8:55 a .m . – 9:20 a .m .IS17.2 A High Efficiency 3-Phase 400V 15kW Power Inverter

using SiC MOSFETs and Trans-Linked TopologyTatsuya Miyazaki3, Yuta Okawauchi2, Hirotaka Otake2, Ken Nakahara2, Mamoru Tsuruya1

1Power Assist Technology Co., Ltd., Japan; 2Rohm Co., Ltd., Japan; 3ROHM Semiconductor, Japan

9:20 a .m . – 9:45 a .m .IS17.3 High Efficiency 60kW Boost Converter for Solar Power

GenerationJulius RiceWolfspeed (a Cree Company), United States

9:45 a .m . – 10:10 a .m .IS17.4 SiC MOSFET or Si IGBT in Industrial Motor Drives?

Carmelo Parisi, Antonino Raciti, Angelo Giuseppe Sciacca, Mario PulvirentiSTMicroelectronics, Italy

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 11:00 a .m . IS17.5 An Experimental Investigation of the SiC MOSFET Gate

Voltage Glitches with Miller ClampAnselmo Gianluca Liberti, Giuseppe CatalisanoSTMicroelectronics, Italy


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11:00 a .m . – 11:25 a .m .IS17.6 SiC Modules with and Without External Diodes

Kevork HaddadSEMIKRON Inc, United States

8:30 a .m . – 11:25 a .m .

IS18: MagneticsROOM 210A

CHAIRS:George Slama, Würth ElektronikCarl Walker, Artesyn

8:30 a .m . – 8:55 a .m .IS18.1 Power Transformer Core Optimization Enables

Dramatically Increased Power DensityJohn Gallagher, David Munguia, Harvey XuPulse Electronics, United States; Pulse Electronics, Canada

8:55 a .m . – 9:20 a .m .IS18.2 3DPower™ A Tech Disruption in Power Electronics

Claudio Cabeza, Patrick FouassierPREMO, Spain; PREMO, France

9:20 a .m . – 9:45 a .m .IS18.3 High-Flux Density Nanocrystalline Materials for High-

Frequency Power ApplicationsCathal Sheehan1, Asnar Masood2, Zoran Pavlovic2, Hasan Baghbaderani2, P . Stamenov2, Paul McCloskey2

1Bourns, Ireland; 2Tyndall, Ireland

9:45 a .m . – 10:10 a .m .IS18.4 An Analysis and Optimization Tool for High-Frequency

Power MagneticsMichael SeemanEta One Power, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 11:00 a .m . IS18.5 Finite Element Modeling of Switch Mode Power Supply

MagneticsWeyman Lundquist, Shuang Feng, Mary ClarkWest Coast Magnetics, United States

11:00 a .m . – 11:25 a .m .IS18.6 High Frequency Inductors for GaN Applications:

Construction Analysis and Efficiency ComparisonJohn Gallagher, David MunguiaPulse Electronics, United States; Pulse Electronics, Canada

8:30 a .m . – 11:25 a .m .

IS19: Advances in the Adoption of Wide Band Gap Semiconductors in Commercial & Industrial ApplicationsROOM 210BC

CHAIR:James LeMunyon, PowerAmerica

8:30 a .m . – 8:55 a .m .IS19.1 Designing with UnitedSiC FETs

Pete LoseeUnited Silicon Carbide, United States

8:55 a .m . – 9:20 a .m .IS19.2 WBG Automotive Inverters and Chargers

Kevin BaiUniversity of Tennessee-Knoxville, United States

9:20 a .m . – 9:45 a .m .IS19.3 Applications for WBG Devices

Georgios DemetriadesABB, United States

9:45 a .m . – 10:10 a .m .IS19.4 GaN Power IC Adoption Takes off in Fast Charging Market

Dan KinzerNavitas Semiconductor, United States

8:30 a .m . – 11:25 a .m .

IS20: ApplicationsROOM 213B

CHAIRS:Darshan Ghandi, Navitas SemiDavide Giacomini, Infineon Technologies

8:30 a .m . – 8:55 a .m .IS20.1 Application Considerations of the Three-Level ANPC

TopologyPaul DrexhageSEMIKRON Inc., United States

8:55 a .m . – 9:20 a .m .IS20.2 SOI Level-Shift Gate-Drive IC in LED Lighting Application

Weidong Chuemployee of Infineon Technologies, United States

9:20 a .m . – 9:45 a .m .IS20.3 Design and Measurement of High Power Nanosecond

Pulse Circuits for Laser DriversJohn GlaserEfficient Power Conversion, United States

9:45 a .m . – 10:10 a .m .IS20.4 A 5kW Low Voltage Drive System for Industrial Motor

Control ApplicationsGennaro MacinaSTMicroelectronics, Italy

THURSDAY, MARCH 21 EDUCATIONAL PROGRAM | INDUSTRY SESSIONS

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10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 11:00 a .m . IS20.5 850W Quarter Brick using 3milliohm 100 V MV GaN fet

Moshe DombInfineon Technologies, United States

11:00 a .m . – 11:25 a .m .IS20.6 The Film Capacitors Technology for DC Link

Anvy ChenXiamen Faratronic CO. LTD., China

1:45 p .m . – 3:25 p .m .

IS21: GaN IntegrationROOM 210D

CHAIR:Dilip Rosbud, Dialog Semi

1:45 p .m . – 2:10 p .m .IS21.1 Fully Integrated GaN-on-Si Technology Targeting On-Chip

48V Input Power ConversionKo-Tao Lee1, Xin Zhang1, Todd Takken1, Effendi Leobandung1, Devendra Sadana1, Daniel Piedra2, Tomas Palacios2

1IBM, United States; 2Massachusetts Institute of Technology, United States

2:10 p .m . – 2:35 p .m .IS21.2 GaN Technology up to Speed: Monolithic GaN Power IC

Mike Wens, Jef ThonéMinDCet NV, Belgium

2:35 p .m . – 3:00 p .m .IS21.3 A New 650V GaNFast Half Bridge IC for AC/DC Converter

ApplicationsSantosh Sharma2, Kedar Patel1, Marco Giandalia2

1Navitas Semiconductor Inc, United States; 2Navitas Semiconductor Inc., United States

3:00 p .m . – 3:25 p .m .IS21.4 Passive Components for PCB and Substrate Embedding

Vern SolbergSolberg Technical Consulting, United States

1:45 p .m . – 3:25 p .m .

IS22: ComponentsROOM 210A

CHAIR:Reenu Garg, Infineon Technologies

1:45 p .m . – 2:10 p .m .IS22.1 Powering Autonomous Sensors for Industry 4.0 with Solid

State BatteriesDenis PaseroIlika Technologies, United Kingdom

2:10 p .m . – 2:35 p .m .IS22.2 Matching SiC MOSFET Spice Model Simulation Switching

Loss with Hardware TestingTeik Siang OngWolfspeed, A Cree Company, United States

2:35 p .m . – 3:00 p .m .IS22.3 Fulfilling the Vision Transformerless (“TL”) Conversion

Harold BlomquistHelix Semiconductors, United States

3:00 p .m . – 3:25 p .m .IS22.4 Characterization of the Humidity Effect in Film Capacitors

Lifetime for Solar Application Applying the Calibrated Accelerated Life Test (CALT) MethodAndrea Bianchi, Stefano CarboniABB, Italy

1:45 p .m . – 3:25 p .m .

IS23: TestROOM 213B

CHAIR:Greg Evans, WelComm Inc.

1:45 p .m . – 2:10 p .m .IS23.1 Filter Attenuation Measurement Method using Electrical

Fast Transient Burst (EFTB)Jared Quenzer2, Richard Spangenberg1

1Schneider Electric, United States; 2Wurth Electronics, United States

2:10 p .m . – 2:35 p .m .IS23.2 Continuous Operation Evaluation Platform for SiC

MOSFETs and DiodesChristophe Warin, Xuning Zhang, Gin Sheh, Sujit BanerjeeLittelfuse Inc., United States

2:35 p .m . – 3:00 p .m .IS23.3 Green Power Supply Testing with Regenerative Electronic

LoadsEric TurnerEA Electro-Automatik, Inc., United States

3:00 p .m . – 3:25 p .m .IS23.4 Electrical Safety Testing of Electronic Equipment

Chad ClarkVitrek, United States

THURSDAY, MARCH 21 INDUSTRY SESSIONS | EDUCATIONAL PROGRAM

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TECHNICAL SESSIONSAPEC professionals like you participated in a rigorous peer review process and have carefully picked over 500 papers making up APEC’s Technical Sessions . The review process highlights the most innovative technical solutions, and provides the highest quality possible . The technical program includes papers of broad appeal scheduled for oral presentation from Tuesday morning through Thursday afternoon . Papers with a more specialized focus are available for discussion witha uthors at the dialogue session on Thursday from 11:30 a .m . – 2:00 p .m . The various technical venues cover all areas of technical interest to the practicing power electronics professional . The papers are sure to give you many new design ideas that you can apply to your work immediately .

8:30 a .m . – 11:15 a .m .

T25: Multilevel and Multi-Phase AC-DC ConvertersROOM 211AB

AC-DC Converters

CHAIRS:Michael A.E. Andersen, Technical University of DenmarkDaniel J. Costinett, University of Tennessee

8:30 a .m . – 8:50 a .m .T25.1 Derivation of DCM/CCM Boundary and Ideal Duty-Ratio

Feedforward for Three-Level Boost RectifierMoonhyun Lee, Jong-Woo Kim, Jih-Sheng Jason LaiVirginia Polytechnic Institute and State University, United States

8:50 a .m . – 9:10 a .m .T25.2 A 6-Level Flying Capacitor Multi-Level Converter for

Single Phase Buck-Type Power Factor CorrectionEnver Candan3, Andrew Stillwell3, Nathan C . Brooks2, Rose A . Abramson2, Johan Strydom1, Robert Pilawa-Podgurski21Texas Instruments Inc., United States; 2University of California, Berkeley, United States; 3University of Illinois at Urbana-Champaign, United States

9:10 a .m . – 9:30 a .m .T25.3 Switching Performance Evaluation and Loss Analysis

of SiC-Based Neutral Point Clamped Bidirectional AC/DC ConverterYang Jiao, Milan Jovanovic’, Zhiyu ShenDelta Electronics Ltd., United States

9:30 a .m . – 9:50 a .m .T25.4 Design and Implementation of Forced Air-Cooled, 140kHz,

20kW SiC MOSFET Based Vienna PFCSiyuan Chen2, Wensong Yu2, Dennis Meyer1

1Microsemi, United States; 2North Carolina State University, United States

9:50 a .m . – 10:10 a .m .T25.5 Universal Zero-Voltage-Switching Technique for

Multi-Phase AC/DC ConverterJinyi Deng, Keyan Shi, An Zhao, Dehong XuZhejiang University, China

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T25.6 A Balanced, Unity Power Factor, 3-Phase Bridgeless

AC/DC Step-Up Transformer-Less Converter with Magnetic-Coupled Soft-Switched Step-Up Rectifiers for Wind Farm with a MVDC GridMehdi Abbasi, John LamYork University, Canada

10:55 a .m . – 11:15 a .m .T25.7 A Fault Tolerant Three-Phase Isolated AC-DC Converter

Javad Khodabakhsh, Gerry MoschopoulosWestern University, Canada

8:30 a .m . – 11:15 a .m .

T26: Magnetics Modeling, Design & ApplicationsROOM 212AB


CHAIRS:Fang Luo, University of ArkansasShuo Wang, University of Florida

8:30 a .m . – 8:50 a .m .T26.1 Optimization of PCB Layout for 1-MHz High Step-Up/Down

LLC Resonant ConvertersXiaonan Zhao, Cheng-Wei Chen, Jih-Sheng Jason LaiVirginia Polytechnic Institute and State University, United States

8:50 a .m . – 9:10 a .m .T26.2 Modeling the Effects of Printed-Circuit-Board

Parasitics on the Switching Performance of Wide-Bandgap ApplicationsJan Hammer2, Martin Ordonez2, Peter Ksiazek1

1Alpha Technologies Ltd., Canada; 2University of British Columbia, Canada

9:10 a .m . – 9:30 a .m .T26.3 Comprehensive SPICE Model for Power Inductor Losses

Stefan Ehrlich, Christopher Joffe, Hannes Thielke, Matthias Leinfelder, Martin MärzFraunhofer IISB, Germany

THURSDAY, MARCH 21 EDUCATIONAL PROGRAM | TECHNICAL SESSIONS

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9:30 a .m . – 9:50 a .m .T26.4 A Simple Analytical Technique for Evaluating the 2-D

Conductive Losses in Isolated Rectangular ConductorXiaohui Wang, Li Wang, Ling Mao, Yaojia ZhangNanjing University of Aeronautics and Astronautics, China

9:50 a .m . – 10:10 a .m .T26.5 An Improved Design Method for Gapped Inductors

Considering Fringing EffectZhe Yang2, Harish Suryanarayana1, Fred Wang2

1ABB Inc., United States; 2University of Tennessee, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T26.6 Simple Fully Analytical Copper Loss Model of Litz Wire

Made of Strands Twisted in Multiple LevelsKazuhiro Umetani1, Jesus Acero2, Hector Sarnago2, Oscar Lucia2, Eiji Hiraki11Okayama University, Japan; 2Universidad de Zaragoza, Spain

10:55 a .m . – 11:15 a .m .T26.7 Modeling of Conducted Emission for an Automotive

Motor Control InverterAli Safayet, Mohammad IslamHalla Mechatronics, United States

8:30 a .m . – 11:15 a .m .

T27: Step-up DC-DC ConvertersROOM 213C

DC-DC Converters

CHAIRS:Wisam Moussa, InfineonGab-Su Seo, National Renewable Energy Laboratory

8:30 a .m . – 8:50 a .m .T27.1 High Efficiency High Step-Up Isolated DC-DC Converter

for Photovoltaic ApplicationsChang Wang2, Mingxiao Li2, Ziwei Ouyang2, Gang Wang1

1Institute of Electrical Engineering Chinese Academy of Sciences, China; 2Technical University of Denmark, Denmark

8:50 a .m . – 9:10 a .m .T27.2 Ultra-High Power Density Full-SiC Boost Converter

Enabled by Advanced 3D-Printing TechniquesArne Hendrik Wienhausen, Alexander Sewergin, Rik W . De DonckerRWTH Aachen University, Germany

9:10 a .m . – 9:30 a .m .T27.3 Step-Up Converter with High Order Selectivity

Gwangyol Noh, Jun Lee, Jung-Ik HaSeoul National University, Korea

9:30 a .m . – 9:50 a .m .T27.4 Multiphase Interleaved High Step-Up Converters

Yifei Zheng2, Wenhao Xie1, Keyue Smedley2

1Harbin Institute of Technology, United States; 2University of California, Irvine, United States

9:50 a .m . – 10:10 a .m .T27.5 Analysis and Design of a High Step-Up Transformerless

DC-DC Converter with an Integrated L²C³D² NetworkNour Elsayad, Hadi Moradisizkoohi, Osama MohammedFlorida International University, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T27.6 DC-Shifted Harmonics-Boosted Resonant DC-DC

Converter with High-Step-Up Conversion Ratio with ZVS Over the Full Load RangeKerui Li2, Siew-Chong Tan2, Adrian Ioinovici11Holon Institute of Technology, Israel; 2University of Hong Kong, Hong Kong

10:55 a .m . – 11:15 a .m .T27.7 Integrated High-Efficiency Single-Inductor CCM Boost

Converter for Multi-Junction PV Energy HarvestingQirong Peng, Debashis Mandal, Parisa Mahmoudidaryan, Bertan Bakkaloglu, Sayfe KiaeiArizona State University, United States

8:30 a .m . – 11:15 a .m .

T28: Control Strategies for Improving Quality and PerformanceROOM 213D

Control

CHAIRS:Seungdeog Choi, Mississippi State UniversityPanagiotis Kakosimos, ABB AB Corporate Research

8:30 a .m . – 8:50 a .m .T28.1 Optimized IGBT Turn-Off Switching Performance Using

the Full Device Safe Operating AreaChristoph Lüdecke, Georges Engelmann, Rik W . De DonckerRWTH Aachen University, Germany

8:50 a .m . – 9:10 a .m .T28.2 A Fast Transient Flip Voltage Follower Based Low Dropout

Regulator with AC-Coupled Pseudo Tri-Loop Technique Without Using Any Output CapacitorTzu-Hao Chien, Ching-Jan Chen, Sheng-Teng Li, Chieh-Ju TsaiNational Taiwan University, Taiwan

9:10 a .m . – 9:30 a .m .T28.3 Control Strategy of Active Storage Unit in Pulsed Load

AC Input System to Reduce DC Bus CapacitanceLei Bai, Xiaoyong Ren, Yu Chen, Zhiliang Zhang, Qianhong Chen, Xin CaoNanjing University of Aeronautics and Astronautics, China

THURSDAY, MARCH 21 TECHNICAL SESSIONS | EDUCATIONAL PROGRAM

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9:30 a .m . – 9:50 a .m .T28.4 A Simple Control to Reduce Device Over-Voltage Caused

by Non-Active Switch Loop in Three-Level ANPC ConvertersHandong Gui2, Zheyu Zhang2, Ruirui Chen2, Ren Ren2, Jiahao Niu2, Bo Liu2, Haiguo Li2, Zhou Dong2, Fred Wang2, Leon M . Tolbert2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States

9:50 a .m . – 10:10 a .m .T28.5 Constant on-Time Multi-Mode Digital Control with

Superior Performance and Programmable FrequencyK Hariharan, Santanu Kapat, Siddhartha MukhopadhyayIndian Institute of Technology Kharagpur, India

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T28.6 Online Impedance Measurement of Cascaded DC/DC

ConvertersMarlon Granda1, Cristina Fernandez1, Pablo Zumel1, Angel Fernandez-Herrero2, Andres Barrado1

1Universidad Carlos III de Madrid, Spain; 2Universidad Politécnica de Madrid, Spain

10:55 a .m . – 11:15 a .m .T28.7 Continuous Stability Monitoring of DC Microgrids

Using Controlled InjectionRohail Hassan, Hongjie Wang, Regan ZaneUtah State University, United States

8:30 a .m . – 11:15 a .m .

T29: SiC & GaN Based Power ConvertersROOM 303AB

Power Electronics Integration and Manufacturing

CHAIRS:Victor Veliadis, North Carolina State UniversityQing Ye, Toshiba International Corporation

8:30 a .m . – 8:50 a .m .T29.1 Enhanced Heat Transfer Performance with Designed Pin

Fin Cold Plate for 50 kW High Power Density ConverterLingxi Zhang2, Ziyou Lim2, Arie Nawawi2, Yong Liu2, Josep Pou1, Rejeki Simanjorang3

1Nanyang Technological University, Singapore; 2Rolls-Royce at NTU Corporate Lab, Nanyang Technological University, Singapore; 3Rolls-Royce Electrical, Rolls-Royce Singapore Pte.Ltd, Singapore

8:50 a .m . – 9:10 a .m .T29.2 Design of an Advanced Programmable Current-Source

Gate Driver for Dynamic Control of SiC DeviceXiang Wang, Haimeng Wu, Volker PickertNewcastle University, United Kingdom

9:10 a .m . – 9:30 a .m .T29.3 Comparison of Radiated Electromagnetic Interference

(EMI) Generated by Power Converters with Silicon MOSFETs and GaN HEMTsYingjie Zhang2, Shuo Wang2, Yongbin Chu1

1Texas Instruments Inc., United States; 2University of Florida, United States

9:30 a .m . – 9:50 a .m .T29.4 A Manifold Microchannel Heat Sink for Ultra-High Power

Density Liquid-Cooled ConvertersRemco van Erp, Georgios Kampitsis, Elison MatioliÉcole Polytechnique Fédérale de Lausanne, Switzerland

9:50 a .m . – 10:10 a .m .T29.5 Design of a High-Performance DC Power Cycling

Test Setup for SiC MOSFETs Based on Switching Transient AnalysisFei Yang, Enes Ugur, Shi Pu, Bilal AkinUniversity of Texas at Dallas, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T29.6 A 30kW Three-Phase Voltage Source Inverter Based on

the Si IGBT/SiC MOSFET Hybrid SwitchLei Li, Puqi Ning, Xuhui Wen, Qiongxuan Ge, Yaohua LiInstitute of Electrical Engineering, Chinese Academy of Sciences, China

10:55 a .m . – 11:15 a .m .T29.7 Packaging Solution for SiC Power Modules with a

Fail-to-Short CapabilityIlyas Dchar3, Cyril Buttay1, Hervé Morel21Institut National des Sciences Appliquées de Lyon, France; 2Laboratoire Ampere/CNRS, France; 3Supergrid Institute, France


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8:30 a .m . – 11:15 a .m .

T30: Magnetics OptimizationROOM 303CD


CHAIRS:Seung R. Moon, Nat’l Energy Technology LaboratoryMatthew Wilkowski, Enachip

8:30 a .m . – 8:50 a .m .T30.1 Effects of Secondary Leakage Inductance on the

LLC Resonant Converter—Part II: Frequency Control Bandwidth with Respect to Load VariationMostafa Noah1, Tomohide Shirakawa2, Kazuhiro Umetani2, Jun Imaoka1, Masayoshi Yamamoto1, Eiji Hiraki21Nagoya University, Japan; 2Okayama University, Japan

8:50 a .m . – 9:10 a .m .T30.2 Computer-Aided Design and Optimization of an Integrated

Transformer with Distributed Air Gap and Leakage Path for an LLC Resonant ConverterLukas Keuck, Frank Schafmeister, Joachim BöckerUniversität Paderborn, Germany

9:10 a .m . – 9:30 a .m .T30.3 Design Guidelines for High-Power and High-Frequency

TransformersGuillermo Salinas2, Álvaro Giménez1, Jesús Angel Oliver2, Roberto Prieto2

1SENER Ingeniería y Sistemas, Spain; 2Universidad Politécnica de Madrid, Spain

9:30 a .m . – 9:50 a .m .T30.4 Improved Partial Cancellation Method for High Frequency

Core Loss MeasurementFeiyang Zhu, Qiang Li, Fred C . LeeVirginia Polytechnic Institute and State University, United States

9:50 a .m . – 10:10 a .m .T30.5 First Observations in Degradation Testing of Planar

MagneticsZhan Shen, Qian Wang, Yanfeng Shen, Huai WangAalborg University, Denmark

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T30.6 Magnetic Optimizations for High-Power Density

Bidirectional Cascaded-Buck-Boost ConverterXi Chen, Anirudh Ashok Pise, Issa BatarsehUniversity of Central Florida, United States

10:55 a .m . – 11:15 a .m .T30.7 Optimized Design of Integrated PCB-Winding Transformer

for MHz LLC ConverterYinsong Cai, Mohamed H . Ahmed, Qiang Li, Fred C . LeeVirginia Polytechnic Institute and State University, United States

8:30 a .m . – 11:15 a .m .

T31: Control Algorithms for Utility Interactive SystemsROOM 304AB


CHAIRS:Praveen Jain, Queen’s UniversityXiongfei Wang, Aalborg University

8:30 a .m . – 8:50 a .m .T31.1 Design and Analysis of a Current-Controlled Virtual

Synchronous Machine for Weak GridsJavier Roldán-Pérez1, Adrian González-Cajigas2, Alberto Rodríguez-Cabero1, Milan Prodanovic1, Pablo Zumel21IMDEA Energy Institute, Spain; 2Universidad Carlos III de Madrid, Spain

8:50 a .m . – 9:10 a .m .T31.2 A Model Predictive Voltage Control Using Virtual Space

Vectors for Grid-Forming Energy Storage ConvertersWaleed Alhosaini, Yue ZhaoUniversity of Arkansas, United States

9:10 a .m . – 9:30 a .m .T31.3 A New Power Flow Control Method for Energy Storage

Systems in Microgrids (MGs)Hadis Hajebrahimi, Sajjad Makhdoomi Kaviri, Suzan Eren, Alireza BakhshaiQueen’s University, Canada

9:30 a .m . – 9:50 a .m .T31.4 Anti-Islanding Detection Method Using Phase Shifted

Feed-Forward VoltageDong-Uk Kim, Sungmin KimHanyang University, Korea

9:50 a .m . – 10:10 a .m .T31.5 Smart Loads for Power Quality and Battery Lifetime

Improvement in NanogridsMohsen S . Pilehvar, Mohammad B . Shadmand, Behrooz MirafzalKansas State University, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T31.6 Seamless Transfer of Control Mode for Modular Multilevel

Converter with Integrated Battery Energy Storage SystemZhe Wang, Hua Lin, Yajun Ma, Zuyao Ze, Tao WangHuazhong University of Science and Technology, China

10:55 a .m . – 11:15 a .m .T31.7 Power Flow Control in Multi-Active-Bridge Converters:

Theories and ApplicationsYenan Chen1, Ping Wang1, Haoran Li2, Minjie Chen1

1Princeton University, United States; 2Tsinghua University, China


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8:30 a .m . – 11:15 a .m .

T32: Wireless Power Transfer Design TechniquesROOM 304CD


CHAIRS:Wisam Alhoor, Dialog SemiconductorFaisal Khan, University of Missouri at Kansas City

8:30 a .m . – 8:50 a .m .T32.1 A 5kW Bi-Directional Wireless Charger for Electric

Vehicles with Electromagnetic Coil Based Self-AlignmentHirokazu Matsumoto, Nameer Khan, Olivier TrescasesUniversity of Toronto, Canada

8:50 a .m . – 9:10 a .m .T32.2 Optimized Design for Wireless Coil for Electric Vehicles

Based on the Use of Magnetic Nano-ParticlesAlberto Delgado2, Jesús Angel Oliver2, José Antonio Cobos2, Jorge Rodriguez1, Alejandro Jiménez1

1Grupo Premo, Spain; 2Universidad Politécnica de Madrid, Spain

9:10 a .m . – 9:30 a .m .T32.3 Design of an EMF Suppressing Magnetic Shield for a

100-kW DD-Coil Wireless Charging System for Electric VehiclesMostak Mohammad3, Jason L . Pries1, Omer C . Onar1, Veda Prakash N . Galigekere1, Gui-Jia Su1, Saeed Anwar4, Jonathan Wilkins1, Utkarsh Dilip Kavimandan2, Devendra Patil51Oak Ridge National Laboratory, United States; 2Tennessee Technological University, United States; 3University of Akron, United States; 4University of Tennessee, United States; 5University of Texas at Dallas, United States

9:30 a .m . – 9:50 a .m .T32.4 An Optimized Parameter Design Method of WPT System

for EV Charging Based on Optimal Operation Frequency RangeYongbin Jiang, Min Wu, Shiyuan Yin, Zhongfang Wang, Laili Wang, Yue WangXi’an Jiaotong University, China

9:50 a .m . – 10:10 a .m .T32.5 High-Efficiency High-Power-Transfer-Density Capacitive

Wireless Power Transfer System for Electric Vehicle Charging Utilizing Semi-Toroidal Interleaved-Foil Coupled InductorsBrandon Regensburger1, Ashish Kumar3, Sreyam Sinha1, Jiale Xu2, Khurram Afridi11Cornell University, United States; 2Stanford University, United States; 3University of Colorado Boulder, United States

10:10 a .m . – 10:35 a .m . Break

10:35 a .m . – 10:55 a .m .T32.6 Feasibility Analysis of Nanocrystalline Cores for Polarized

and Non-Polarized IPT Charging PadsDaniel Gaona, Teng LongUniversity of Cambridge, United Kingdom

10:55 a .m . – 11:15 a .m .T32.7 Combined Foreign Object Detection and Live Object

Protection in Wireless Power Transfer Systems via Real-Time Thermal Camera AnalysisTimothy Sonnenberg, Adam Stevens, Alireza Dayerizadeh, Srdjan LukicNorth Carolina State University, United States

1:45 p .m . – 5:00 p .m .

T33: DC-DC Converter ApplicationsROOM 211AB

DC-DC Converters

CHAIRS:Zach Pan, ABB US Corporate Research CenterOlivier Trescases, University of Toronto

1:45 p .m . – 2:05 p .m .T33.1 75 MHz Discrete GaN Based Multi-Level Buck Converter

for Envelope Tracking ApplicationsAlejandro Villarruel-Parra, Andrew ForsythUniversity of Manchester, United Kingdom

2:05 p .m . – 2:25 p .m .T33.2 An 86% Efficiency, 20MHz, 3D-Integrated Buck Converter

with Magnetic Core Inductor Embedded in Interposer Fabricated by Epoxy/Magnetic-Filler Composite Build-Up SheetTakanobu Fukuoka, Yuki Karasawa, Tomoki Akiyama, Ryoutaro Oka, Shu Ishida, Tomohiro Shirasawa, Makoto Sonehara, Toshiro Sato, Kousuke MiyajiShinshu University, Japan

2:25 p .m . – 2:45 p .m .T33.3 A Novel Filter Built-in Isolated Bi-Directional DC-DC

Converter with Split WindingsShuntaro Inoue, Masanori Ishigaki, Atsuhiro Takahashi, Takahide SugiyamaToyota Central R&D Labs., Inc., Japan

2:45 p .m . – 3:05 p .m .T33.4 A Wide Operating Range Converter Using a

Variable-Inverter-Rectifier-Transformer with Improved Step-Down CapabilityIntae Moon1, Mike Ranjram1, Sombuddha Chakraborty2, David J . Perreault1

1Massachusetts Institute of Technology, United States; 2Texas Instruments Inc., United States


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3:05 p .m . – 3:25 p .m .T33.5 High Efficiency and High Power Density Weinberg

Converter Reducing Conduction Loss and Output Current Ripple for Space ApplicationsDong-Kwan Kim1, Yeonho Jeong5, Jae-Il Baek3, Jeong-Eon Park2, Cheol-Woo Lim4, Gun-Woo Moon1

1KAIST, Korea; 2Korea Aerospace research Institute, Korea; 3Princeton University, United States; 4Satellite Technology Research Center, Korea; 5University of Colorado Denver, United States

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T33.6 Practical Implementation and Efficiency Evaluation

of a Phase Shifted Full Bridge DC-DC Converter Using Radiation Hardened GaN FETs for Space ApplicationsVictor Turriate1, Brandon Witcher2, Dushan Boroyevich1, Rolando Burgos1

1Virginia Polytechnic Institute and State University, United States; 2VPT Inc., United States

4:00 p .m . – 4:20 p .m .T33.7 Hardware Implementation of a New Single Input Double

Output L-L Converter for High Voltage Auxiliary Loads in Fuel-Cell VehiclesMahajan Sagar Bhaskar2, Lazhar Ben-Brahim2, Atif Iqbal2, Sanjeevikumar Padmanaban1, Mohammad Meraj2, Syed Rahman2

1Aalborg University, Denmark; 2Qatar University, Qatar

4:20 p .m . – 4:40 p .m .T33.8 Highly Efficient EV Battery Charger Using Fractional

Charging Concept with SiC DevicesTore Kanstad, Morten Birkerod Lillholm, Zhe ZhangTechnical University of Denmark, Denmark

4:40 p .m .– 5:00 p .m .T33.9 Ultra-High Power Density Magnetic-Less DC/DC Converter

Utilizing GaN TransistorsGeorgios Kampitsis, Remco van Erp, Elison MatioliÉcole Polytechnique Fédérale de Lausanne, Switzerland

1:45 p .m . – 5:00 p .m .

T34: Soft Switching DC-DC ConvertersROOM 212AB

DC-DC Converters

CHAIRS:Hanh-Phuc Le, University of Colorado at BoulderChenhao Nan, Google

1:45 p .m . – 2:05 p .m .T34.1 Accurate Discrete-Time Modeling of an Interleaved

Current-Fed Dual Active Bridge DC-DC ConverterAvishek Pal, Santanu KapatIndian Institute of Technology Kharagpur, India

2:05 p .m . – 2:25 p .m .T34.2 An Optimized Control Scheme to Reduce the Backflow

Power and Peak Current in Dual Active Bridge ConvertersBochen Liu, Pooya Davari, Frede BlaabjergAalborg University, Denmark

2:25 p .m . – 2:45 p .m .T34.3 Extended Operational Range of Dual-Active-Bridge

Converters by Using Variable Magnetic DevicesSarah Saeed, Jorge GarcíaUniversity of Oviedo, Spain

2:45 p .m . – 3:05 p .m .T34.4 Frequency-Controlled Resonant Converter with Push-Pull

Class-E InverterShohei Saito1, Shohei Mita1, Hiroyuki Onishi2, Shingo Nagaoka2, Takeshi Uematsu2, Hiroo Sekiya1

1Chiba University, Japan; 2OMRON Corporation, Japan

3:05 p .m . – 3:25 p .m .T34.5 Partial Parallel Dual Active Bridge Converter with

Variable Voltage Gain for SOEC/SOFC SystemYudi Xiao1, Zhe Zhang1, Michael A . E . Andersen1, Brian Engelbrecht Thomsen2

1Technical University of Denmark, Denmark; 2Welltec A/S, Denmark

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T34.6 Soft Switching Method of TPS Modulated DAB Converters

with Wide Band Gap DevicesChi Shao1, Kai Shen1, Anping Tong2, Shenhua Zhang3, Yuanbin He1, Lijun Hang1

1Hangzhou Dianzi University, China; 2Shanghai Jiao Tong University, China; 3Xi’an Jiaotong University, China

4:00 p .m . – 4:20 p .m .T34.7 Single-Turn Air-Core Integrated Planar Inductor for

GaN HEMT-Based Zero-Voltage Switching Synchronous Buck ConverterWoongkul Lee, Di Han, Bulent SarliogluUniversity of Wisconsin-Madison, United States

4:20 p .m . – 4:40 p .m .T34.8 A Pareto-Optimized, Capacitively Isolated SEPIC

Converter for Wide Load Ranges and High Frequency Power ConversionDennis Bura1, Thomas Plum1, Rik W . De Doncker2

1Robert Bosch GmbH, Germany; 2RWTH Aachen University, Germany

4:40 p .m .– 5:00 p .m .T34.9 A Soft-Switching Isolated Buck-Boost Converter with

Semi-Active Rectifier for Wide Output Range ApplicationYuzheng Xia1, Jijun Ma2, Yan Xing1, Yuhui Ji2, Baolin Chen1, Hongfei Wu1

1Nanjing University of Aeronautics and Astronautics, China; 2Shanghai Institute of Space Power-Sources, China


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1:45 p .m . – 5:00 p .m .

T35: Power Electronics for TransportationROOM 213C

Transportation Power Electronics

CHAIRS:Behrooz Mirafzal, Kansas State UniversityOmer Onar, Oak Ridge National Laboratory

1:45 p .m . – 2:05 p .m .T35.1 Isolated, Bi-Directional DC-DC Converter for Fuel Cell

Electric Vehicle ApplicationsYungtaek Jang2, Milan Jovanovic’2, Misha Kumar2, Juan Ruiz2, Robert Lu1, Tony Wei11Delta Electronics Co., Ltd., China; 2Delta Electronics Ltd., United States

2:05 p .m . – 2:25 p .m .T35.2 A GaN Switched Tank Converter with Partial Power

Voltage Regulation for Electric Vehicle ApplicationsZe Ni2, Yanchao Li2, Jalen Johnson2, Mengxuan Wei2, Chengkun Liu2, Xiaofeng Lyu1, Dong Cao2

1Navitas Semiconductor, United States; 2North Dakota State University, United States

2:25 p .m . – 2:45 p .m .T35.3 A 100kW Switched-Tank Converter for Electric Vehicle

ApplicationYanchao Li, Ze Ni, Chengkun Liu, Mengxuan Wei, Dong CaoNorth Dakota State University, United States

2:45 p .m . – 3:05 p .m .T35.4 An Improved High Voltage DC–DC Converter with

Partial-Resonant Network for Enhanced Efficiency and Power Density in Electric Vehicle ApplicationsJaehyung Lee, Tae-Won Noh, Jung-Hoon Ahn, Byoung Kuk LeeSungkyunkwan University, Korea

3:05 p .m . – 3:25 p .m .T35.5 Isolated DC-DC Converter Utilizing GaN Power Device

for Automotive ApplicationHiroaki Matsumori, Takashi Kosaka, Kisho Sekido, Kitae Kim, Takashi Egawa, Nobuyuki MatsuiNagoya Institute of Technology, Japan

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T35.6 Phase-Shifted Full-Bridge DC-DC Converter with High

Efficiency and Reduced Output Filter Using Center-Tapped Clamp CircuitCheon-Yong Lim, Jung-Kyu Han, Moo-Hyun Park, Keon-Woo Kim, Gun-Woo MoonKAIST, Korea

4:00 p .m . – 4:20 p .m .T35.7 Zero Voltage Soft-Switching Phase-Shift PWM Controlled

Three-Level DC-DC Converter for Railway Auxiliary Electric Power UnitTomokazu Mishima, Yoshinobu KojiKobe University, Japan

4:20 p .m . – 4:40 p .m .T35.8 Modeling, Design, and Experimental Verification of

a WPT Level-3 Wireless Charger with Compact Secondary CouplerOmer C . Onar1, Veda Prakash N . Galigekere1, Jason L . Pries1, Gui-Jia Su1, Shenli Zou2, Saeed Anwar3, Jonathan Wilkins1, Randy Wiles1, Larry Seiber1, Cliff White1

1Oak Ridge National Laboratory, United States; 2University of Maryland, United States; 3University of Tennessee, United States

4:40 p .m .– 5:00 p .m .T35.9 A Novel Auxiliary Modular Multilevel Inverter for Electric

Vehicle ApplicationsAhmed Sheir2, Mohamed Youssef2, Mohamed Orabi11Aswan University, Egypt; 2University of Ontario Institute of Technology, Canada

1:45 p .m . – 5:00 p .m .

T36: Control ApplicationsROOM 213D

Control

CHAIRS:Martin Ordonez, The University of British ColumbiaWeiming Zhang, SF Motors

1:45 p .m . – 2:05 p .m .T36.1 Controller Evaluation of Wirelessly Distributed and

Enabled Battery Energy Storage System Under Unequal Battery Modules Capacity ValuesYuan Cao, Jaber Abu QahouqUniversity of Alabama, United States

2:05 p .m . – 2:25 p .m .T36.2 Using Feedforward Digital Control to Improve the Power

Quality of a Three-Channel BCM Boost Converter for PFC ApplicationsRobert Ryan2, John G . Hayes2, Richard Morrison1, Diarmuid Hogan1

1Advanced Energy, Ireland; 2University College Cork, Ireland

2:25 p .m . – 2:45 p .m .T36.3 Single Mode Near Minimum Deviation Controller for

Multi-Level Flying Capacitor ConvertersLiangji Lu, Tom Moiannou, Aleksandar Prodic’University of Toronto, Canada

2:45 p .m . – 3:05 p .m .T36.4 Fast Detection of Open Circuit Device Faults and Fault

Tolerant Operation of Stacked Multilevel ConvertersParham Hekmati, Ian P . Brown, Z . John ShenIllinois Institute of Technology, United States


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3:05 p .m . – 3:25 p .m .T36.5 A Novel Ripple-Coupling Constant on-Time Controlled

Buck Converter IC with Highly Digital Charge-Pump Based Error AmplifierJheng-An Juan Lu, Ching-Jan Chen, Cheng-Yang Hong, Chieh-Ju TsaiNational Taiwan University, Taiwan

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T36.6 Universal Controllers for PWM Converters: a Normalized

ApproachFranco Degioanni, Ignacio Galiano Zurbriggen, Martin OrdonezUniversity of British Columbia, Canada

4:00 p .m . – 4:20 p .m .T36.7 A Nonlinear Control Strategy to Reduce DC Bus

Capacitance in Vienna RectifierDan Tong2, Xiaoyong Ren2, Yu Chen2, Ming Xu1, Zhenyang Hao2

1FSP-Powerland Technology Inc., China; 2Nanjing University of Aeronautics and Astronautics, China

4:20 p .m . – 4:40 p .m .T36.8 MHz Level Digital PFM Controller with Suppressed

Time-Delay Within Several Ten NanosecondsYuki Matsuo, Hirotaka Nonaka, Yoichi Ishizuka, Yuichi Yokoi, Hirotaka YamashitaNagasaki University, Japan

4:40 p .m .– 5:00 p .m .T36.9 New Digital Control Method for Improving Dynamic

Performance of a Quasi-Resonant Flyback ConverterChong Wang1, Shen Xu1, Limin Yu1, Qinsong Qian1, Shengli Lu1, Weifeng Sun1, Haisong Li21Southeast University, China; 2Wuxi Chipown Micro-electronics limited, China

1:45 p .m . – 5:00 p .m .

T37: Faults and Dynamics in Grid-Tied SystemsROOM 303AB


CHAIRS:Majid Pahlevani, University of CalgaryXiaoqing Song, ABB. Inc

1:45 p .m . – 2:05 p .m .T37.1 Open-Circuit Failure Detection and Localization of Full-

Bridge Submodules for MMCs with Single Ring TheoremWeihao Zhou2, Heya Yang2, Min Chen2, Wuhua Li2, Xiangning He2, Junfei Han1

1Inner Mongolia Electric Power Research Institute, China; 2Zhejiang University, China

2:05 p .m . – 2:25 p .m .T37.2 Novel Circuit and Method for Fault Reconfiguration in

Cascaded H-Bridge Multilevel InvertersHaider Mhiesan, Roy McCann, Chris Farnell, H . Alan MantoothUniversity of Arkansas, United States

2:25 p .m . – 2:45 p .m .T37.3 An Asymmetrical Fault Current Calculation Method of

SynchronverterLili He1, Wen Huang1, Zhikang Shuai1, Z . John Shen2

1Hunan University, China; 2Illinois Institute of Technology, United States

2:45 p .m . – 3:05 p .m .T37.4 Flexible and Fault Tolerant Distributed Control Structures

for Modular Power Electronic TransformersMariam Saeed, Alberto Rodríguez, Manuel Arias, Fernando BrizUniversity of Oviedo, Spain

3:05 p .m . – 3:25 p .m .T37.5 Analysis of the Modular Multilevel Converter Under

Single Open-Circuit Fault in the Upper Active Switch of a SubmoduleQichen Yang, Maryam SaeedifardGeorgia Institute of Technology, United States

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T37.6 Improving Transient Response of VSG Controlled

Grid-Tied ConverterYawei Wang, Bangyin Liu, Shanxu DuanHuazhong University of Science and Technology, China

4:00 p .m . – 4:20 p .m .T37.7 Unified Grid Integration Algorithm for Synchronization and

Power Control of Doubly-Fed Induction GeneratorRamu Nair, Gopalaratnam NarayananIndian Institute of Science Bangalore, India

4:20 p .m . – 4:40 p .m .T37.8 Power Balance of Shunt Active Power Filter Based on

Voltage Detection: a Harmonic Power Recycler DeviceRodrigo Guzman Iturra2, Marvin Cruse2, Katharina Mütze1, Peter Thiemann2, Christian Dresel11Condensator Dominit GmbH, Germany; 2South Westphalia University of Applied Sciences, Germany

4:40 p .m .– 5:00 p .m .T37.9 A Nonlinear Adaptive Control System for Ups Systems

Fatemeh Mardani2, Nicholas Falconar2, Nabil Akel1, Rahul Khandekar1, Victor Goncalves1, Majid Pahlevani21Alpha Technologies Ltd., Canada; 2University of Calgary, Canada


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1:45 p .m . – 5:00 p .m .

T38: Motor Drive Modulation & Control StrategiesROOM 303CD


CHAIRS:Rakibul Islam, Dura Automotive SystemsZhang Zhe, Nexteer Automotive

1:45 p .m . – 2:05 p .m .T38.1 PMSM Current Management with Overcurrent Regulation

Haibo Li, Yi Qian, Sohrab Asgarpoor, Justin BradleyUniversity of Nebraska-Lincoln, United States

2:05 p .m . – 2:25 p .m .T38.2 Finite Set Predictive Torque Control Based on Sub-Divided

Voltage Vectors of PMSM with Deadbeat Control and Discrete Space Vector ModulationIbrahim Mohd Alsofyani, Seok-Min Kim, Kyo-Beum LeeAjou University, Yemen; Ajou University, Korea

2:25 p .m . – 2:45 p .m .T38.3 Novel SVPWM Based Switching Sequences for Modular

Multilevel DC to AC ConverterBalanthi Mogru Abdul Beig2, Majid Poshtan1, Saikrishna Kanukollu2

1California Polytechnic State University, United States; 2Khalifa University of Science and Technology, U.A.E.

2:45 p .m . – 3:05 p .m .T38.4 A Unified Modulation Strategy Based on Current

Prediction Control for Open-Winding PMSM with Four Bridge ArmsWei Hu, Chenhui Ruan, Heng Nian, Dan SunZhejiang University, China

3:05 p .m . – 3:25 p .m .T38.5 Voltage Redistribution-Based Anti-Windup Scheme

for Induction Motor Current Controller in the Field-Weakening RegionBo Wang, Xu Zhang, Yong Yu, Jing Zhang, Hongye Cai, Dianguo XuHarbin Institute of Technology, China

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T38.6 Sinusoidal Voltage Output Inverter for Motor Drives Using

Discontinuous Current Mode OperationHiroaki Toyoda, Minami Terada, Ryuji Iijima, Takanori Isobe, Hiroshi TadanoUniversity of Tsukuba, Japan

4:00 p .m . – 4:20 p .m .T38.7 Model Predictive Control of Five-Phase Permanent

Magnet Assisted Synchronous Reluctance MotorShamini Dharmasena, Seungdeog ChoiUniversity of Akron, United States

4:20 p .m . – 4:40 p .m .T38.8 Model Predictive Current Control for a PMSM Fed by an

Indirect Matrix Converter with Torque Ripple ReductionKeon Young Kim, Yeongsu Bak, Kyo-Beum LeeAjou University, Korea

4:40 p .m .– 5:00 p .m .T38.9 A Hybrid PWM Modulation for EMI Filter Size Reduction

in a 10 kW GaN-Based Three Phase InverterYousef Abdullah2, Will Perdikakis2, He Li2, Ke Wang2, Yue Zhang2, Xiaodan Wang2, Jin Wang2, Liming Liu1, Sandeep Bala1

1ABB Inc., United States; 2Ohio State University, United States

1:45 p .m . – 5:00 p .m .

T39: Power Converter Design for Renewable Energy ApplicationsROOM 304AB


CHAIRS:Ashish Kumar, Texas InstrumentsYinglai Xia, Texas Instruments

1:45 p .m . – 2:05 p .m .T39.1 New Surface Mount SiC MOSFETs Enable High Efficiency

High Power Density Bi-Directional on-Board Charger with Flexible DC-Link VoltageChen Wei, Jianwen Shao, Binod Agrawal, Dongfeng Zhu, Haitao XieCree Inc., United States; Cree Inc., India; Cree Inc., China

2:05 p .m . – 2:25 p .m .T39.2 Analysis and Design of Three Phase Single Stage

Isolated Flyback Based PFC Converter with a Novel Clamping CircuitSivanagaraju Gangavarapu, Akshay Kumar RathoreConcordia University, Canada

2:25 p .m . – 2:45 p .m .T39.3 Single-Phase Quasi-Z-Source Inverters: Switching Loss

Reduction Using a Quasi-Sinusoidal Modulation StrategyAhmed Abdelhakim2, Frede Blaabjerg1, Paolo Mattavelli21Aalborg University, Denmark; 2University of Padova, Italy

2:45 p .m . – 3:05 p .m .T39.4 Isolated AC-DC Interleaved Converter for MVDC Collection

Grid in HVDC Offshore Wind FarmMarcus Bezerra2, Jorge L . Wattes Oliveira Jr .1, Paulo Peixoto Praça2, Demercil de Souza Oliveira Jr .2, Luiz Henrique Silva Barreto3, Bruno R . de Almeida4

1Federal Institute of Ceará, Brazil; 2Federal University of Ceará, Brazil; 3Universidade Federal do Ceará, Brazil; 4University of Fortaleza, Brazil

3:05 p .m . – 3:25 p .m .T39.5 A Notch Prefilter for Three-Phase PLL Under Adverse

Grid ConditionsJinbo Li, Qin Wang, Peng He, Lan Xiao, Ling MaoNanjing University of Aeronautics and Astronautics, China


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3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T39.6 An Improved Modulation Strategy for the Active Voltage

Clamping HERIC InverterHui Wang2, Zhenxi Wu2, Zhongting Tang2, Hua Han2, Yongheng Yang1, Frede Blaabjerg1

1Aalborg University, Denmark; 2Central South University, China

4:00 p .m . – 4:20 p .m .T39.7 A New Modulation Strategy to Operate Bidirectional

Resonant Converter Under Extended Input RangeChangkyu Bai3, Byeongcheol Han4, Sooa Kim3, Sung-Ho Lee2, Minsung Kim1

1Dongguk University, Korea; 2Korea Atomic Energy Research Institute, Korea; 3Pohang University of Science and Technology, Korea; 4Virginia Polytechnic Institute and State University, Korea

4:20 p .m . – 4:40 p .m .T39.8 DC Voltage Control Architecture in Renewable Energy

Based Three-Level ConvertersEmanuel Serban1, Cosmin Pondiche1, Helmine Serban2, Cristian Lascu3, Octavian Cornea3

1Schneider Electric, Canada; 2Simon Fraser University, Canada; 3University Politehnica of Timisoara, Romania

4:40 p .m .– 5:00 p .m .T39.9 Impact of Background Harmonic on Filter Capacitor

Reliability in Wind TurbineDao Zhou, Yipeng Song, Frede BlaabjergAalborg University, Denmark

1:45 p .m . – 5:00 p .m .

T40: Industrial ApplicationsROOM 304CD


CHAIRS:Jesus Acero, University of ZaragozaSombuddha Chakraborty, TI

1:45 p .m . – 2:05 p .m .T40.1 Digital Current Control of Electric Arc Furnace by Parallel

Modular Three-Phase IGBT InvertersSandro Calligaro1, Roberto Petrella2

1Free University of Bolzano, Italy; 2University of Udine, Italy

2:05 p .m . – 2:25 p .m .T40.2 An Analysis of Electromagnetic Forces on Cooking

Vessels Used in Domestic Induction Heating Appliances Oriented to Identify the Properties of MaterialsJesus Acero2, Claudio Carretero2, Ignacio Lope1, Jose Miguel Burdío2

1BSH-Home Appliances, Spain; 2Universidad de Zaragoza, Spain

2:25 p .m . – 2:45 p .m .T40.3 An Assessment of a Square-Wave Series Voltage

Compensator Increasing Power Quality on Industrial Electronic Loads Compensating Voltage Sag and SwellMarcos Paulo Brito Gomes2, Igor Amariz Pires4, Sidelmo Magalhães Silva2, Braz J . Cardoso Filho4, Alysson Machado2, José Ronaldo Silveira Junior2, Alex-Sander Amável Luiz1, Samir Duarte Machado3

1Centro Federal de Educação Tecnológica de Minas Gerais, Brazil; 2Federal University of Minas Gerais, Brazil; 3Universidade Federal de Itajubá, Brazil; 4Universidade Federal de Minas Gerais, Brazil

2:45 p .m . – 3:05 p .m .T40.4 Ensemble Machine Learning Based Adaptive Arc Fault

Detection for DC Distribution SystemsVu Le, Xiu YaoUniversity at Buffalo, United States

3:05 p .m . – 3:25 p .m .T40.5 Active Common-Mode Voltage Cancelation Using

Fourth-Leg of Three-Level NPC Converter Based on IGBT for High Voltage OperationJun-Hyung Jung, Seon-Ik Hwang, Jang-Mok KimPusan national university, Korea

3:25 p .m . – 3:40 p .m . Break

3:40 p .m – 4:00 p .m .T40.6 A Regulated 48V-to-1V/100A 90.9%-Efficient Hybrid

Converter for Pol Applications in Data Centers and Telecommunication SystemsRatul Das, Hanh-Phuc LeUniversity of Colorado Boulder, United States

4:00 p .m . – 4:20 p .m .T40.7 Current Spike Suppression Techniques for Magnetic

Bearing AmplifierHsin-Che Hsieh3, Cheng-Wei Chen3, Ming-Cheng Chen2, Jih-Sheng Jason Lai3, Jin-Mu Lin1

1Industrial Technology Research Institute, Taiwan; 2National Taiwan University of Science and Technology, Taiwan; 3Virginia Polytechnic Institute and State University, United States

4:20 p .m . – 4:40 p .m .T40.8 Low-Power Photovoltaic Energy Harvesting with Parallel

Differential Power Processing Using a SEPICF . Selin Bagci3, Yu-Chen Liu1, Katherine A . Kim2

1National Ilan University, Taiwan; 2National Taiwan University, Taiwan; 3National Taiwan University of Science and Technology, Taiwan

4:40 p .m .– 5:00 p .m .T40.9 Identifying Deteriorated or Contaminated Power System

Components from RF EmissionsKyungin Nam2, Mohammad Arifur Rahman2, Jose Alexis De Abreu-Garcia2, Robert Veillette2, Michael French2, Yilmaz Sozer2, John Lauletta1

1Exacter, Inc., United States; 2University of Akron, United States


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DIALOGUE SESSIONSDialogue Session papers have been selected through the same rigorous peer-review process as papers in the oral technical sessions . They are represented by papers in the APEC Proceedings . In the Dialogue Session, you will have the opportunity to talk at length with the authors about their work, something that is not possible in oral technical sessions . For the Dialogues Session floor plan, see page 87 .

11:15 a .m . – 1:45 p .m .

D01: AC-DC ConvertersAC-DC Converters

CHAIRS:Suzan Eren, Queen’s UniversitySrdjan Lukic, NC State University

D01.1 A Boost-Full-Bridge-Type Single-Active-Bridge Isolated AC-DC ConverterYitong Li1, Adrià Junyent-Ferré1, Paul Judge2

1Imperial College London, United Kingdom; 2University of Edinburgh, United Kingdom

D01.2 6.6kW Three-Phase Interleaved Totem Pole PFC Design with 98.9% Peak Efficiency for HEV/EV Onboard ChargerXun Gong, Gangyao Wang, Manish BhardwajTexas Instruments Inc., United States; Texas Instruments Inc., Germany

D01.3 A Single-Phase Single-Stage Three-Level AC/DC Resonant Converter Operating with a Wide Output Voltage RangeEunsoo Kim, Takongmo Marius, Minji Kim, Jaesung Oh, Gangwoo Lee, Ingab HwangJeonju University, Korea

D01.4 Analysis and Design of an Interleaved Single-Stage ZVS AC-DC Boost ConverterAdel Ali Abosnina, Gerry MoschopoulosWestern University, Canada

D01.5 An AC-DC Interleaved ZCS-PWM Boost Converter with Improved Light-Load EfficiencyRamtin Rasoulinezhad, Adel Ali Abosnina, Gerry MoschopoulosWestern University, Canada

D01.6 Power Adapter with Line Voltage Control for USB Power DeliveryYang Chen, Yan-Fei LiuQueen’s University, Canada

D01.7 Single Power-Conversion AC-DC Converter Using Active-Clamp Circuit with Noncomplementary Modulation StrategySeo-Gwang Jeong2, Kwang-Seop Kim2, Jun-Seok Kim2, Owon Kwon2, Hwasoo Seok2, Minsung Kim1, Bong-Hwan Kwon2

1Dongguk University, Korea; 2Pohang University of Science and Technology, Korea

D01.8 An Improved Power-Decoupling Scheme with Grid Inductor Phase-Shift Modification for Single-Phase ConverterXiaoqing Wang, Lei Jing, Bodong Li, Ning Chen, Maohang Qiu, Min ChenZhejiang University, China

D01.9 A Novel Multiplexed Power Architecture for Improving Cross Regulation and EfficiencyAdrian Lefedjiev LefedjievPower Integrations, United States

D01.10 99% Efficiency 3-Level Bridgeless Totem-Pole PFC Implementation with Low-Voltage Silicon at Low CostTrong Tue Vu, Edgaras MickusICERGi Ltd., Ireland

D01.11 Multiphase X-Type Current Source Rectifier with Reduced Active Switch CountLouelson Costa1, Montie Vitorino1, Mauricio Corrêa1, Dushan Boroyevich2

1Federal University of Campina Grande, Brazil; 2Virginia Polytechnic Institute and State University, United States

D01.12 Control Scheme Design for Isolated Swiss-Rectifier Based on Phase-Shifted Full-Bridge TopologyBinfeng Zhang, Shaojun Xie, Xincheng Wang, Qiang Qian, Zhao Zhang, Jinming XuNanjing University of Aeronautics and Astronautics, China

D01.13 Variable on-Time (VOT) Control with Phase Leading Input Current (PLIC) Compensation for 400Hz CRM Boost PFC ConvertersYuting Zhou, Xiaoyong Ren, Zhehui Guo, Yu Wu, Zhiliang Zhang, Qianhong ChenNanjing University of Aeronautics and Astronautics, China

THURSDAY, MARCH 21 EDUCATIONAL PROGRAM | DIALOGUE SESSIONS

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11:15 a .m . – 1:45 p .m .

D02: DC-DC Converters IDC-DC Converters

CHAIRS:Brad Lehman, Northeastern UniversityTirthajyoti Sarkar, Onsemi

D02.1 Multiport Soft-Switching Bidirectional DC-DC Converter for Hybrid Energy Storage SystemsSatyaki Mukherjee2, Debranjan Mukherjee1, Debaprasad Kastha1

1Indian Institute of Technology Kharagpur, India; 2University of Colorado Boulder, United States

D02.2 A Two-Stage Rail Grade DC/DC Converter Based on GaN DeviceMinfan Fu1, Chao Fei2, Yuchen Yang2, Qiang Li2, Fred C . Lee2

1ShanghaiTech University, China; 2Virginia Polytechnic Institute and State University, United States

D02.3 Symmetrical Voltage Balancing Control for Four-Level Flying Capacitor Converter Based on Phase-Shifted PWMChe-Yu Lu2, Hung-Chi Chen2, Chung-Yi Li11Chang Gung University, Taiwan; 2National Chiao Tung University, Taiwan

D02.4 A Single-Switched High-Switching-Frequency Quasi-Resonant Flyback Converter with Zero-Current-Switching and Valley-SwitchingShen Xu1, Chong Wang1, Qinsong Qian1, Jing Zhu1, Weifeng Sun1, Haisong Li21Southeast University, China; 2Wuxi Chipown Micro-electronics limited, China

D02.5 A Study on a Three-Level Flying Capacitor Boost Converter with an Integrated LC2D Output Network for Universal Input Voltage ApplicationsNour Elsayad, Hadi Moradisizkoohi, Osama MohammedFlorida International University, United States

D02.6 An Analysis of Operation in Single-Switch High Step-Up DC-DC Converter with Three-Winding Coupled InductorMasataka Minami, Kosuke TomoedaKobe City College of Technology, Japan

D02.7 Open-Loop Power Sharing of Three-Port DC-DC Resonant ConvertersYan-Kim Tran, Francisco D . Freijedo, Drazen DujicÉcole Polytechnique Fédérale de Lausanne, Switzerland

D02.8 New Non-Isolated Interleaved Bidirectional Soft-Switching DC-DC Converter with a Low Current Stress and Low Voltage Stress Auxiliary CellLejia Sun1, Fang Zhuo1, Lei Feng1, Chengzhi Zhu2

1Xi’an Jiaotong University, China; 2Zhejiang Electric Power Corporation, China

D02.9 A Step-Up Series-Parallel Resonant Switched-Capacitor Converter with Extended Line Regulation RangeWenhao Xie2, Shouxiang Li1, Yifei Zheng3, Keyue Smedley3, Jianze Wang2, Yanchao Ji2, Jilai Yu2

1Beijing Institute of Technology, China; 2Harbin Institute of Technology, China; 3University of California, Irvine, United States

D02.10 A Novel Noncomplementary Active Clamp Flyback Control TechniqueAlberto Bianco1, Claudio Adragna1, Stefano Saggini2, Mario Ursino2, Francesco Ciappa1, Giuseppe Scappatura1

1STMicroelectronics, Italy; 2University of Udine, Italy

D02.11 Auxiliary Resonant Source Charge Extraction Circuitry for Enabling the Use of Super Junction MOSFETs in High Efficiency DC-DC ConvertersAndrew Hopkins1, Nick Simpson1, Neville McNeill21University of Bristol, United Kingdom; 2University of Strathclyde, United Kingdom

D02.12 Capacitor Voltage Balancing Control for 3LNPC LLC Resonant ConverterYu Qi1, Tao Chen1, Wenqing Mei1, Zhixue Zhang1, Zedong Zheng2, Wenguang Luo1, Liangliang Su1

1CRRC Zhuzhou Institute Co. Ltd., China; 2Tsinghua University, China

D02.13 Ultra-High Step-Up DC/DC Converter Based on Dual-Coupled-Inductors with Low Voltage Stress and Input Current Ripple for Renewable Energy ApplicationsHadi Moradisizkoohi, Nour Elsayad, Osama MohammedFlorida International University, United States

D02.14 Resonant Switched-Capacitor Converter with Multi-Resonant FrequenciesOwen Jong, Qiang Li, Fred C . LeeVirginia Polytechnic Institute and State University, United States

D02.15 A Non-Isolated High Step-Up Hybrid Resonant Converter Based on Hybrid TransformerWenhao Xie2, Yifei Zheng3, Shouxiang Li1, Jianze Wang2, Yanchao Ji2, Jilai Yu2


D02.16 12 Switch Zero-Inductor Voltage Converter TopologySamuel Webb, Yan-Fei LiuQueen’s University, Canada

D02.17 Fast Transient Current Control for Dual-Active-Bridge DC-DC Converters with Triple-Phase-ShiftJinghui Xu3, Yue Wang3, Kai Li3, Xiufang Hu3, Shiyuan Yin3, Rui Li1, Chunhui Lv2

1China Electric Power Research Institute, China; 2Liaocheng Power Supply Company State Grid Shandong Electric Power Company, China; 3Xi’an Jiaotong University, China

D02.18 Enhancing Inherent Flux Balancing in a Dual-Active Bridge Using Adaptive ModulationChristian Winter1, Jan Riedel2, Zaki Mohzani2, Raphael Mencher2, Stefan Butzmann1

1Bergische Universität Wuppertal, Germany; 2Robert Bosch GmbH, Germany

D02.19 Design and Optimization of a Wide Dynamic Range Programmable Power Supply for Data Center ApplicationsReto Christen1, Jasmin Smajic1, Arvind Sridhar2, Thomas Brunschwiler2

1HSR University of Applied Sciences of Eastern Switzerland, Switzerland; 2IBM Research - Zürich, Switzerland

THURSDAY, MARCH 21 DIALOGUE SESSIONS | EDUCATIONAL PROGRAM

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11:15 a .m . – 1:45 p .m .

D03: DC-DC Converters IIDC-DC Converters

CHAIRS:Yuxiang Shi, ABBJaehoon Baek, Korea University of Technology & Education

D03.1 A Dickson Resonant Switched-Capacitor Converter with “Indirect” Resonant Core and Continuous Conversion RatioShouxiang Li1, Ningning Zhang1, Shuhua Zheng1, Wenhao Xie2, Keyue Smedley3


D03.2 Current Sharing Control of Interleaved LLC Resonant Converter with Hybrid RectifierJiaxiang Sun1, Xinxi Tang1, Yan Xing1, Baolin Chen1, Hongfei Wu1, Kai Sun2

1Nanjing University of Aeronautics and Astronautics, China; 2Tsinghua University, China

D03.3 LLC DC-DC Converter with Flyback-Operation for Expanding the Regulation RangeHiroki Nakashima1, Hisatsugu Kato2, Yohei Araki1, Yoichi Ishizuka1

1Nagasaki University, Japan; 2Tabuchi Electric Co., Ltd., Japan

D03.4 Pareto Design and Switching Frequencies for SiC MOSFETs Applied in an 11kW Buck Converter for EV-ChargingBenjamin Strothmann, Frank Schafmeister, Joachim BöckerUniversität Paderborn, Germany

D03.5 A High-Speed, Non-Linear Control Based Voltage Droop Mitigation Technique for Integrated Voltage Regulators in Modern MicroprocessorsSivaraman Masilamani, Arvind Raghavan, Ravi Sankar Vunnam, Sarath MakalaIntel Corporation, United States

D03.6 Parasitic Parameter Effects on the dv/dt-Induced Low-Side MOSFET False Turn-on in Synchronous Buck ConvertersRuqi Li1, Joyce Zhu1, Manjing Xie2

1Cisco Inc., United States; 2Texas Instruments Inc., United States

D03.7 A Two-Phase Zero-Inductor Voltage Converter for Datacenter and Server ApplicationsSamuel Webb, Yan-Fei Liu, Tianshu LiuQueen’s University, Canada

D03.8 High-Speed ZVS-ZCS Soft-Switching CMOS Bridge Drivers for a DC-DC Fully Integrated Voltage Regulator (FIVR) Operating at 100-320MHz on 22nm Process NodeGerhard Schrom, Ravi Sankar Vunnam, Sarath Makala, Alexander LyakhovIntel Corporation, United States

D03.9 A New Bidirectional High Frequency AC-Link Microinverter Based on Dual Active Bridge TopologyAmit Bhattacharjee, Issa BatarsehUniversity of Central Florida, United States

D03.10 A Cuk Dual Resonance Core Based Dickson Resonant Switched-Capacitor Converter with Wide Conversion Ratio RangeShouxiang Li1, Shengnan Liang1, Shuhua Zheng1, Wenhao Xie2, Keyue Smedley3


D03.11 A Novel Dual Output Dual-Active-Bridge Converter with Output Voltage BalancingKisu Kim, Jeonghun Kim, Honnyong Cha, Sanghun KimKyungpook National University, Korea

D03.12 Practical Comparison of ZVZCS Interleaved Boost Converters with SiC DevicesMd Rishad Ahmed1, Yun Li1, Rebecca Todd2, Andrew Forsyth2

1CRRC Times Electric UK Innovation Centre, United Kingdom; 2University of Manchester, United Kingdom

D03.13 Research on Current Sharing Strategy of Parallel LLC Resonant ConverterYakun Wang, Xiaoyong Ren, Zhiliang Zhang, Qianhong ChenNanjing University of Aeronautics and Astronautics, China

D03.14 A 3-Bridge LLC Resonant Converter Operating with a Wide Output Voltage Control Range Using Morphing Control for Mode TransitionsJaesung Oh1, Jicheol Lee1, Minji Kim1, Sangjae Yoo1, Eunsoo Kim1, Yongseog Jeon1, Yoonsang Kook2

1Jeonju University, Korea; 2PACTECH Co., LTD, Korea

D03.15 High-Step-Up Boost Converter Based on Coupled Inductor, Voltage Lift and Clamp CellsG . A . K . Somiruwan2, L .H .P .N . Gunawardena2, Dulika Nayanasiri1, Yun Wei Li11University of Alberta, Canada; 2University of Moratuwa, Sri Lanka

D03.16 A Variable Frequency ZVS Control of a Three-Level Buck Without Zero Crossing Detection for Wide-Range Output Voltage Battery ChargersBo Liu2, Ren Ren2, Fred Wang2, Daniel J . Costinett2, Zheyu Zhang1

1GE Global Research, United States; 2University of Tennessee, United States

D03.17 A PWM Controlled Active Boost Quadrupler Resonant Converter for High Step-Up ApplicationCheng-Wei Chen, Xiaonan Zhao, Jih-Sheng Jason LaiVirginia Polytechnic Institute and State University, United States

D03.18 A New Non-Multi-Level Structured, H-Bridgeless DC/DC Bidirectional Converter with Low Voltage Stress and Complete Soft-Switching OperationReza Emamalipour, John LamYork University, Canada


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D03.19 1-kV Input 1-MHz GaN Modular Multilevel LLC ConvertersKe Xu, Zhiliang Zhang, Zhi-Wei Xu, Ming-Xie He, Haoran Li, Xiaoyong Ren, Qianhong ChenNanjing University of Aeronautics and Astronautics, China

D03.20 1-kV Input 300-Khz SiC LLC Converters with Matrix TransformersZhi-Wei Xu, Zhiliang Zhang, Haoran Li, Ming-Xie He, Jia-Cheng Tang, Ke Xu, Xiaoyong Ren, Qianhong ChenNanjing University of Aeronautics and Astronautics, China

D03.21 Dual-Loop Control for Synchronous-Conduction-Mode Tapped-Inductor Buck ConverterChih-Shen Yeh2, Xiaonan Zhao2, Ming-Cheng Chen1, Jih-Sheng Jason Lai21National Taiwan University of Science and Technology, Taiwan; 2Virginia Polytechnic Institute and State University, United States

D03.22 A 1-MHz GaN Converter with 4X Voltage RangeMing-Xie He, Xinyi Zhu, Zhiliang Zhang, Xiaoyong RenNanjing University of Aeronautics and Astronautics, China

11:15 a .m . – 1:45 a .m .

D04: Utility Interactive Converters IIPower Electronics for Utility Interface

CHAIRS:Jonathan Kimball, Missouri University of Science and TechnologyPritam Das, Binghampton University

D04.1 A Statistical Submodule Open-Circuit Failure Diagnosis Method for MMCs Enabling Failure Detection, Localization and ClassificationWeihao Zhou2, Heya Yang2, Huan Yang2, Min Chen2, Wuhua Li2, Xiangning He2, Junfei Han1

1Inner Mongolia Electric Power Research Institute, China; 2Zhejiang University, China

D04.2 Research on Large Current Interruption of Solid-State Switch for a Hybrid DCCBLei Feng1, Ruifeng Gou2, Xiaoping Yang2, Fang Zhuo1, Feng Wang1

1Xi’an Jiaotong University, China; 2Xi’an XD Power Systems Co,. Ltd., China

D04.3 An Embedded Switched-Capacitor Z-Source Inverter with Continuous Input CurrentsJing Yuan1, Yongheng Yang1, Ping Liu2, Yanfeng Shen1, Frede Blaabjerg1

1Aalborg University, Denmark; 2Hunan University, China

D04.4 A Simple Technique for in-Circuit Core Loss Measurement of Medium Frequency TransformerZhengda Zhang, Lei Zhang, Jiangchao QinArizona State University, United States

D04.5 Single Pulse Common-Mode Voltage PWM Scheme to Achieve High Power-Density for Full-SiC Three-Level Uninterruptible Power SupplySungjae Ohn2, Jianghui Yu2, Rolando Burgos2, Dushan Boroyevich2, Harish Suryanarayana1, Christopher Belcastro1

1ABB Inc., United States; 2Virginia Polytechnic Institute and State University, United States

D04.6 Series AC Arc Fault Detection Using Only Voltage WaveformsJonathan Kim2, Dorin Neacffu2, Brad Lehman2, Roy Ball11MERSEN USA Newburyport-MA, LLC, United States; 2Northeastern University, United States

D04.7 EMI Evaluation and Filter Design of a SiC-Based 3-Level UpsJianghui Yu2, Sungjae Ohn2, Rolando Burgos2, Bingyao Sun2, Dushan Boroyevich2, Harish Suryanarayana1, Christopher Belcastro1

1ABB Inc., United States; 2Virginia Polytechnic Institute and State University, United States

11:15 a .m . – 1:45 a .m .

D05: Utility Interactive Converters IPower Electronics for Utility Interface

CHAIRS:Po-Tai Cheng, National Tsing Hua University (Taiwan)Ali Khajehoddin, University of Alberta

D05.1 Generalized Space Vector Modulation for Grid-Connected Current Source Converter in Both Continuous and Discontinuous Current ModesXiaoqiang Guo, Yong Yang, Baocheng Wang, Zhigang LuYanshan University, China

D05.2 Stability Analysis and Improvement of Three-Phase Grid-Connected Power Converters with Virtual Inertia ControlJingyang Fang2, Pengfeng Lin2, Hongchang Li2, Yi Tang2, Yongheng Yang1

1Aalborg University, Denmark; 2Nanyang Technological University, Singapore

D05.3 A New Control Strategy for Hybrid Water Pumping Systems Used by Utilities in Developing CountriesAbbas Gholamshahi1, Roohollah Fadaeinedjad1, Ebrahim Mohammadi1, Gerry Moschopoulos2

1Graduate University of Advanced Technology, Iran; 2Western University, Canada

D05.4 Use of Multiple Transformer Windings for Efficiency Enhancement in the Series Transistor-Array Based Linear AC Voltage RegulatorNimesha Priyanwada Wijesooriya, Nihal Kularatna, D . Alistair Steyn-RossUniversity of Waikato, New Zealand

D05.5 A New Multinivel Converter Based on the Use of Interleaving Technique and Cascade AssociationSamuel Soares Queiroz1, Demercil de Souza Oliveira Jr .1, Paulo Peixoto Praça1, Luiz Henrique Silva Barreto2

1Federal University of Ceará, Brazil; 2Universidade Federal do Ceará, Brazil


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D05.6 Multiple Second-Order Generalized Integrators Based Comb Filter for Fast Selective Harmonic ExtractionChuan Xie2, Kai Li2, Jianxiao Zou2, Keliang Zhou3, Josep M . Guerrero1

1Aalborg University, Denmark; 2University of Electronic Science and Technology of China, China; 3University of Glasgow, United Kingdom

D05.7 Design and Analysis of Interleaved Current Fed Switched InverterSonam Acharya, Santanu K . MishraIndian Institute of Technology Kanpur, India

D05.8 Design Considerations of Tri-Mode Intelligent Solid State Circuit Breaker Using GaN TransistorsYuanfeng Zhou, Yanjun Feng, Z . John ShenIllinois Institute of Technology, United States

D05.9 Average Current Sharing Control Strategy for Parallel Operation of Ups with Low Bandwidth CommunicationSeunghoon Baek1, Younghoon Cho1, Tae-Geun Koo2

1Konkuk University, Korea; 2Sungshin Electric Co. Ltd., Korea

D05.10 Autonomous Control of Active Power Electronics Loads Considering Response Cost in Islanded MicrogridSong Zhang1, Guangqian Ding2, Yanjie Zhang1, Gaiyun Huang1

1State Grid Corporation of China Technology, China; 2University of Jinan, China

D05.11 DC Offset Compensation Algorithm in the Grid Voltage of Single-Phase Grid-Connected InverterTae-Seong Kim2, Seon-Hwan Hwang2, Jin-Soo Kim1, Jong-Won Park1

1GMB Korea, Korea; 2Kyungnam University, Korea

11:15 a .m . – 1:45 p .m .

D06: InvertersMotor Drives and Inverters

CHAIRS:Poria Fajri, University of Nevada, RenoMehdi Farasat, Louisiana State University

D06.1 A Novel DC-Link Voltage Control for Small-Scale Grid-Connected Wind Energy Conversion SystemGuanhong Song, Bo Cao, Liuchen Chang, Riming Shao, Shuang XuUniversity of New Brunswick, Canada

D06.2 A High-Efficiency Super-Junction MOSFET Based Inverter-Leg Configuration Using a Dual-Mode Switching TechniqueZhengyang Feng, Neville McNeill, Barry WilliamsUniversity of Strathclyde, United Kingdom

D06.3 Optimization of the Modulation Sequence and Proposing an Overlap Technique for Current Source InverterMahmoud Gaber, Omar Abdel-Rahim, Mohamed OrabiAswan University, Egypt

D06.4 Analysis of Circulating Harmonic Currents in Paralleled Three Level ANPC Inverters Using SVMJiahao Niu2, Ruirui Chen2, Zheyu Zhang2, Handong Gui2, Fred Wang2, Leon M . Tolbert2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States

D06.5 Impedance Estimation Using Power Monitoring Feature for Tuning AFE GainsRipunjoy Phukan2, Lixiang Wei1, Linglai Li1, Benfeng Tang1

1Rockwell Automation Inc., United States; 1Rockwell Automation Inc., China; 2Virginia Polytechnic Institute and State University, United States

D06.6 A Novel Hybrid SVPWM Modulation Algorithm for Five Level Active Neutral-Point-Clamped ConverterHui Chen, Yingjie He, Jinjun Liu, Xingxing Chen, Hongwei Xiao, Wenhao Zhi, Ruiqi ChengXi’an Jiaotong University, China

D06.7 A New Post-Fault Control Method Based on Sinusoidal Pulse Width Modulation Technique for a Neutral Point Clamped (NPC) InverterPeter Azer, Saeed Ounie, Mehdi NarimaniMcMaster University, Canada

D06.8 Interleaved SPWM of Parallel Csc System with Low Common-Mode VoltageLi Ding, Yuzhuo Li, Yun Wei LiUniversity of Alberta, Canada

D06.9 A New 5–Level Voltage Source InverterApparao Dekka, Ali Ramezani, Saeed Ounie, Mehdi NarimaniMcMaster University, Canada

D06.10 Cascaded Transformer Multilevel Inverter with Shared Leg Based on Neutral-Point ClampedFilipe A . C . Bahia1, Cursino B . Jacobina1, Nady Rocha2, Reuben P . R . Sousa1, Nayara B . Freitas1

1University Federal of Campina Grande, Brazil; 2University Federal of Paraiba, Brazil

D06.11 Design of a Single Controller for Multiple Paralleled InvertersJiahao Niu2, Ruirui Chen2, Zheyu Zhang2, Handong Gui2, Fred Wang2, Leon M . Tolbert2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States


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11:15 a .m . – 1:45 p .m .

D07: Motor DrivesMotor Drives and Inverters

CHAIRS:Sangshin Kwak, Chung-Ang University Rashmi Prasad, General Motors

D07.1 Rotational Frame Fundamental Saliency Method for Position Sensorless Control of Synchronous Reluctance MachinesTetsuya Kojima, Toshiki Suzuki, Moriyuki Hazeyama, Shinsuke KayanoMitsubishi Electric Corporation, Japan

D07.2 A High Performance Five-Phase Six-Leg VSI and the Corresponding SVPWM StrategyAn Li, Dong Jiang, Wubin Kong, Ronghai QuHuazhong University of Science and Technology, China

D07.3 High Frequency Torque Ripple Suppression for High Frequency Signal Injection Based Sensorless Control of SynRMsChengrui Li, Gaolin Wang, Guoqiang Zhang, Dianguo XuHarbin Institute of Technology, China

D07.4 Current Sensor Fault Diagnosis and Fault-Tolerant Control for Encoderless PMSM Drives Based on Dual Sliding-Mode ObserversGuoqiang Zhang, Gaolin Wang, Honglei Zhou, Chengrui Li, Guoxin Wang, Dianguo XuHarbin Institute of Technology, China

D07.5 Real Time Hardware-in-the-Loop Validation of Common Bus Inverter Low Voltage DrivesKarthik Palaniappan2, Brian Seibel2, Michael Cook2, Christian Dufour1

1Opal-RT Technologies Inc., Canada; 2Rockwell Automation Inc., United States

D07.6 Model Predictive Control Using Globe Exponential Reaching Law Sliding Mode Design Method for Induction Motor DrivesZhonggang Yin, Yanqing Zhang, Xiangqian Tong, Yanru ZhongXi’an University of Technology, China

D07.7 A Finite Control Set Model Predictive Current Control Scheme for Five-Phase PMSMs Based on Optimized Duty RatioBin Yu, Wensheng Song, Tao Tang, Song Wang, Ping YangSouthwest Jiaotong University, China

D07.8 Application of Off-Policy Integral Reinforcement Learning for H∞,Input Constrained Control of Permanent Magnet Synchronous MachineYang Yu1, Shuai Wang1, Yudong Du4, Rong Su1, Vaiyapuri Viswanathan2, Shanmukha Ramakrishna2, Chandana Gajanayake2, Amit Kumar Gupta3

1Nanyang Technological University, Singapore; 2Rolls-Royce, Singapore; 3Rolls-Royce Singapore Pte Ltd, Singapore; 4Xi’an Jiaotong University, China

D07.9 MTPA Control of Sensorless IPMSM Based on High Frequency Square-Wave Signal InjectionZhichen Lin2, Qiang Geng1, Zhanqing Zhou1, Xinmin Li1, Changliang Xia1

1Tianjin Polytechnic University, China; 2Tianjin University, China

D07.10 Investigation of Fourth-Leg for Common-Mode Noise Reduction in Three-Level Neutral Point Clamped Inverter Fed Motor DriveRuirui Chen2, Jiahao Niu2, Handong Gui2, Zheyu Zhang2, Fred Wang2, Leon M . Tolbert2, Benjamin J . Blalock2, Daniel J . Costinett2, Benjamin B . Choi11NASA Glenn Research Center, United States; 2University of Tennessee, United States

D07.11 Interior Permanent Magnet Synchronous Motor Maximum Torque Per Ampere-Position Sensorless ControlShuqi Ling2, Tingna Shi3, Zhichen Lin2, Qiang Geng1, Changliang Xia1

1Tianjin Polytechnic University, China; 2Tianjin University, China; 3Zhejiang University, China

D07.12 Power Capability Improvement of Interior Permanent Magnet Synchronous Motor Drives Using Capacitive NetworkKahyun Lee, Jung-Ik HaSeoul National University, Korea

D07.13 A Novel Configuration of DC Link EMI Filter Capacitors in Variable Frequency DrivesXuechao Wang, Lakshmi Ravi, Michael Albert, Rangarajan TallamRockwell Automation Inc., United States

D07.14 A Sensor Fault Isolation Scheme for Co-Existence of PMSM Current Sensor and Non-Sensor Imbalance FaultsHaibo Li, Yi Qian, Sohrab Asgarpoor, Hamid SharifUniversity of Nebraska-Lincoln, United States

D07.15 A Compact 50-kW Traction Inverter Design Using Off-the-Shelf ComponentsRana Alizadeh2, Tyler Adamson2, Juan Carlos Balda2, Yue Zhao2, Mehdi Asheghi1, Ken Goodson1

1Stanford University, United States; 2University of Arkansas, United States

D07.16 Reliability Improvement of Power Inverters for Low-Speed High-Power Motor DrivesYu Zou3, Sandun Kuruppu3, Jiangbiao He1, Bojian Cao2

1GE Global Research, United States; 2General Motors, United States; 3Saginaw Valley State University, United States

D07.17 High-Speed and High-Dynamic Variable Frequency Drive Using Modular Multilevel Converter and SiC DevicesJianyu Pan, Ziwei Ke, Risha Na, Julia Zhang, Longya XuOhio State University, United States

D07.18 Comprehensive Performance Comparison and Optimization of Single-Pulse Controlled Srgs for Renewable Electrical GridsLefei Ge2, Bernhard Burkhart1, Annegret Klein-Hessling2, Huihui Xu2, Rik W . De Doncker2

1ENGIRO GmbH, Germany; 2RWTH Aachen University, Germany


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11:15 a .m . – 1:45 p .m .

D08: Magnetic ComponentsDevices and Components

CHAIRS:Edward Herbert, InventorKisacikoglu Mithat, Seoul Tech

D08.1 Comparison of Coupled Vs. Non-Coupled Microfabricated Inductors in 2W 20MHz Interleaved Buck ConverterYoussef Kandeel, Maeve DuffyNational University of Ireland Galway, Ireland

D08.2 A Passive Integrated Unit of LCL Filter and Transformer for Grid-Connected InverterCheng Deng2, Masiqian Yong2, Andrés Escobar-Mejía1

1Universidad Tecnológica de Pereira, Colombia; 2Xiangtan University, China

D08.3 Hysteresis Compensation Method for Measurement Error of Hall Effect Current Sensor Considering Eddy Current Effect for Electric Vehicle at High SpeedKiseok Kim3, Kichul Hong3, Heekwang Lee2, Hyeongsub Kim1, Sunki Hong1

1Hoseo University, Korea; 2Hyundai motor, Korea; 3ITXM2M Co., Ltd., Korea

D08.4 Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB ConverterPierre Demumieux4, Oriol Avino-Salvado4, Cyril Buttay1, Christian Martin4, Fabien Sixdenier4, Charles Joubert4, Jean Sylvio Ngoua Teu Magambo2, Thomas Löher3

1Institut National des Sciences Appliquées de Lyon, France; 2Safran Tech, France; 3Technische Universität Berlin, Germany; 4Université Lyon 1, France

D08.5 Hetero-Magnetic Coupled Inductor (HMCI) for High Frequency Interleaved Multiphase DC/DC ConvertersShengchang Lu2, Chao Ding2, Yunhui Mei1, Khai Ngo2, Guoquan Lu2

1Tianjin University, China; 2Virginia Polytechnic Institute and State University, United States

D08.6 Design of CM Inductor Based on Core Loss for Radiated EMI Reduction in Power ConvertersJuntao Yao, Yiming Li, Hui Zhao, Shuo WangUniversity of Florida, United States

D08.7 A Study of Flux Distribution and Impedance in Solid and Laminar Ferrite CoresMarcin Kffcki2, Marek S . Ryłko2, John G . Hayes3, Charles R . Sullivan1

1Dartmouth College, United States; 2SMA Magnetics sp. z o.o., Poland; 3University College Cork, Ireland

D08.8 Current Balancing for Parallel Connection of Silicon Carbide MOSFETs Using Bus Bar Integrated Magnetic MaterialKazuki Matsubara, Keiji WadaTokyo Metropolitan University, Japan

D08.9 Design of High-Performance Toroidal DC-Link Inductor for Current-Source InvertersRenato Amorim Torres, Hang Dai, Thomas M . Jahns, Bulent SarliogluUniversity of Wisconsin-Madison, United States

11:15 a .m . – 1:45 p .m .

D09: Devices and Components IIDevices and Components

CHAIRS:Christina Dimarino, Virginia TechYam Siwakoti, University of Technology Sydney

D09.1 Online Condition Monitoring of IGBT Modules Using Gate-Charge IdentificationMohamed Halick Mohamed Sathik2, Prasanth Sundararajan2, Firman Sasongko2, Josep Pou1, Amit Kumar Gupta3

1Nanyang Technological University, Singapore; 2Rolls Royce NTU Corporate lab, Singapore; 3Rolls-Royce Singapore Pte Ltd, Singapore

D09.2 Challenges and Strategies for a Real-Time Implementation of a Rainflow-Counting Algorithm for Fatigue Assessment of Power ModulesAntonios Antonopoulos1, Magnar Hernes2, Salvatore D’Arco2, Dimosthenis Peftitsis1

1Norwegian University of Science and Technology, Norway; 2SINTEF Energy Research, Norway

D09.3 Soft Switching Behavior of IGCT for Resonant ConversionDragan Stamenkovic2, Umamaheswara Reddy Vemulapati1, Thomas Stiasny1, Munaf Rahimo1, Drazen Dujic2

1ABB Semiconductors, Switzerland; 2École Polytechnique Fédérale de Lausanne, Switzerland

D09.4 Real-Time, in Situ Degradation Monitoring in Power Semiconductor ConvertersTimothy Polom2, Christoph van der Broeck1, Rik W . De Doncker1, Robert Lorenz2

1RWTH Aachen University, Germany; 2University of Wisconsin-Madison, United States

D09.5 Current Measurement Issues of a High Frequency GaN Inverter in the MHz Order for Magnetic CharacterizationWilmar Martinez, Camilo SuarezKU Leuven, Belgium

D09.6 Smart Current Source Gate Driver for Fast Switching and Cross-Talk Suppression of SiC MOSFETChunhui Liu, Qin LeiArizona State University, United States

D09.7 High-Speed Searching of Optimum Switching Pattern for Digital Active Gate Drive Circuit of Full Bridge Inverter CircuitYu Shan Cheng1, Tomoyuki Mannen1, Keiji Wada1, Koutaro Miyazaki2, Makoto Takamiya2, Takayasu Sakurai21Tokyo Metropolitan University, Japan; 2University of Tokyo, Japan

D09.8 Simplified on-Line Monitoring System of MOSFET on-Resistance Based on a Semi-Empirical ModelPaolo Magnone, Andrea Petucco, Nicola Thevenet, Hossein AbediniUniversity of Padova, Italy


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D09.9 Study of the SiC JFET Reverse Conduction and Reverse Blocking CharacteristicsXiaoqing Song, Yu DuABB Inc., United States

D09.10 Hard-Switching Dynamic Rds,on Characterization of a GaN FET with an Active GaN-Based Clamping CircuitEdward Jones, Alejandro PozoEfficient Power Conversion Corporation, United States

D09.11 Series Diode Balancing and Diode Evaluation for High-Voltage High-Frequency Power ConvertersYiou He, David J . PerreaultMassachusetts Institute of Technology, United States

D09.12 A Novel Gate Driver for Active Voltage Balancing in 1.7kV Series Connected SiC MOSFETsSanket Parashar, Subhashish BhattacharyaNorth Carolina State University, United States

D09.13 Cascode GaN/SiC Power Device for MHz SwitchingJiale Xu1, Lei Gu1, Zhechi Ye2, Saleh Kargarrazi1, Juan Rivas-Davila1

1Stanford University, United States; 2Tsinghua University, China

11:15 a .m . – 1:45 p .m .

D10: Power Converter Packaging and ReliabilityPower Electronics Integration and Manufacturing

CHAIRS:Yu Du, ABB Inc.Yuzhi Zhang, ABB U.S. Corporate Research Center

D10.1 Design of a Compact, Low Inductance 1200 V, 6.5 mΩ SiC Half-Bridge Power Module with Flexible PCB Gate Loop ConnectionGrace Watt2, Amy Romero2, Rolando Burgos2, Marko Jaksic1

1General Motors, United States; 2Virginia Polytechnic Institute and State University, United States

D10.2 An in-Depth Analysis of Power-System-in-Inductor (PSI2) Technology for Power Module PackagingAndrew Yurek, Wenbo Liu, Yan-Fei LiuQueen’s University, Canada

D10.3 IoT-Based Degradation Management for Self-Healing Power ConvertersAnderson Vagner Rocha1, Danilo F . Melo1, Thales A . Carvalho Maia2, Victor N . Ferreira2, Braz J . Cardoso Filho2

1Centro Federal de Educação Tecnológica de Minas Gerais, Brazil; 2Universidade Federal de Minas Gerais, Brazil

D10.4 Design of Printed Circuit Boards for Power Electronics Utilizing Gallium Nitride Ball Grid Array Integrated Half BridgesYashar Naeimi1, Alex Q . Huang2

1North Carolina State University, United States; 2University of Texas at Austin, United States

D10.5 A 3D Folded Power Inductor with PCB Based Technology for Applications in the kW RangeJohan Le Leslé3, Corentin Darbas3, Florent Morel2, Nicolas Degrenne3, Rémy Caillaud3, Cyril Buttay1, Roberto Mrad3, Christian Vollaire2, Stefan Mollov3

1Institut National des Sciences Appliquées de Lyon, France; 2Laboratoire Ampère, France; 3Mitsubishi Electric R&D Centre Europe, France

D10.6 Comparison of High Performance Cooling Concepts for SiC Power ModulesAlexander Sewergin, Alexander Stippich, Arne Hendrik Wienhausen, Rik W . De DonckerRWTH Aachen University, Germany

D10.7 Reliability Assessment of Hybrid Capacitor Bank Using Electrolytic- and Film-Capacitors in Three-Level Neutral-Point-Clamped InvertersMengxing Chen, Haoran Wang, Huai Wang, Frede Blaabjerg, Xiongfei Wang, Donghua PanAalborg University, Denmark

D10.8 Mission Profile-Based Accelerated Testing of DC-Link Capacitors in Photovoltaic InvertersAriya Sangwongwanich1, Yanfeng Shen1, Andrii Chub2, Elizaveta Liivik2, Dmitri Vinnikov2, Huai Wang1, Frede Blaabjerg1

1Aalborg University, Denmark; 2Tallinn University of Technology, Estonia

D10.9 An Experimental Approach to Identify Source and Cause of Radiation Noise of Inverter Systems and Bare Si Power ChipsToshiya Tadakuma1, Michael Rogers2, Teruaki Nagahara1

1Mitsubishi Electric Corporation, Japan; 2Mitsubishi Electric US, INC., United States

D10.10 Performance Evaluation of a Two-Terminal Active Inductor in the DC-Link Filter of a Three-Phase Diode Bridge RectifierHaoran Wang, Huai WangAalborg University, Denmark

11:15 a .m . – 1:45 p .m .

D11: Modeling and Simulation of Power ConvertersModeling and Simulation

CHAIRS:Shilpa Marti, University of Texas at San AntonioBabak Parkhideh, University of North Carolina – Charlotte

D11.1 FPGA Resource Optimization Method for Hardware in the Loop Real-Time Simulation of Power ConvertersJia Qi Yuan, Xizheng Guo, Chenchen Wang, Xiaojie YouBeijing Jiaotong University, China

D11.2 Solution for Selective Harmonic Elimination in Asymmetric Multilevel Inverter Based on Stochastic Configuration Network and Levenberg-Marquardt AlgorithmJun Hao2, Guoshan Zhang2, Yuqing Zheng2, Wei Hu2, Kehu Yang1

1China University of Mining and Technology, China; 2Tainjin University, China


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D11.3 Averaged, Curvature-Based Model of Switched-Capacitor ConvertersMarko Krstic1, Majid Pahlevani2, Suzan Eren1, Praveen Jain1

1Queen’s University, Canada; 2University of Calgary, Canada

D11.4 A Four-Level Modular Multilevel Converter with Self Voltage Balancing and Extremely Small DC CapacitorYunting Liu2, Fang Zheng Peng1

1Florida State University, United States; 2Michigan State University, United States

D11.5 Small-Signal Modeling and Stability Analysis of MMC with the Consideration of Internal Harmonic InteractionsShiyuan Yin, Yue Wang, Taiyuan Yin, Zhang Wang, Ronghui An, Pengfan Xu, Cheng Nie, Yongbin JiangXi’an Jiaotong University, China

D11.6 Discrete-Time Modeling of a Naturally Commutated Current-Fed Dual Active Bridge DC-DC ConverterAvishek Pal, Santanu KapatIndian Institute of Technology Kharagpur, India

D11.7 State-Space Modeling and Reachability Analysis for a DC MicrogridNiloofar Ghanbari1, Parisa M . Shabestari2, Ali Mehrizi-Sani2, Subhashish Bhattacharya1

1North Carolina State University, United States; 2Washington State University, United States

D11.8 Electric-Field Simulation and Application of Detector Installing for ±800kV UHVDC-LCC ConverterChenyang Liu, Siquan Hu, Kun Han, Weizheng Yao, Zhanfeng Fan, Qiulin HuState Grid Xuji Group Corporation, China

11:15 a .m . – 1:45 p .m .

D12: Power Device and Magnetics ModelingModeling and Simulation

CHAIRS:Hui Li, Florida State UniversityRuxi Wang, GE Global Research

D12.1 Evaluation of Permanent Magnet Distribution Schemes for Toroid Power Inductor with Increased Saturation Current Using 3D Physical ModelsZhiyong Xia, Jaber Abu Qahouq, Sushma KotruUniversity of Alabama, United States

D12.2 Topology-Optimization-Based Conductor Pattern Design for Inductance Cancellation Structure to Reduce Common- and Differential-Mode NoiseKatsuya Nomura2, Atsuhiro Takahashi2, Takashi Kojima2, Shintaro Yamasaki1, Kentaro Yaji1, Hiroki Bo1, Kikuo Fujita1

1Osaka University, Japan; 2Toyota Central R&D Labs., Inc., Japan

D12.3 Optimization of Medium Frequency Transformers with Practical ConsiderationsKristen Booth, Harish Subramanyan, Xinyu Liang, Jun Liu, Srdjan Srdic, Srdjan LukicNorth Carolina State University, United States

D12.4 An Efficient Analytical Inductor Core Loss Calculation Method for Two-Level and Three-Level PWM Converters Based on a User-Friendly Loss MapJun Wang, Kfir J . Dagan, Xibo YuanUniversity of Bristol, United Kingdom

D12.5 Evaluation of an Automated Modeling Tool Applied to New 600 V, 2 a Vertical GaN TransistorsGrace Watt3, Alan Courtay2, Amy Romero3, Rolando Burgos3, Rongming Chu1, Dushan Boroyevich3

1HRL Laboratories, LLC, United States; 2Synopsys, Inc., United States; 3Virginia Polytechnic Institute and State University, United States

D12.6 Induced Chaos in Speed Controlled Switched Reluctance Motor DriveSen Li, Babak FahimiUniversity of Texas at Dallas, United States

D12.7 High Accuracy Temperaure-Dependent SOC Estimation Based on Real-Time Parameter Identification for Rechargeable Li-Ion Battery PackJinhyeong Park2, Hynsu Bae4, Sungsoo Jang3, Woonki Na1, Jonghoon Kim2

1California State University, United States; 2Chungnam National University, Korea; 3Korea Aerospace Research Institute, Korea; 4RIpower, Korea

11:15 a .m . – 1:45 p .m .

D13: ControlControl

CHAIRS:Martin Ordonez, The University of British ColumbiaLucas Lu, GaN Systems

D13.1 Adaptive Dead Time Synchronous Rectification Control for High Efficiency LLC Resonant ConverterSangcheol Moon, Chengsung Chen, Dongjin ParkON Semiconductor, Korea; ON Semiconductor, Taiwan

D13.2 An Evolutionary Method to Achieve the Maximum Efficiency Tracking with Multi-Objective Optimization Based on the Genetic AlgorithmQinsong Qian1, Qi Liu1, Shen Xu1, Weifeng Sun1, Haisong Li21Southeast University, China; 2Wuxi Chipown Micro-electronics limited, China

D13.3 Accelerated Low Gate Count Parameter Identification for Integrated Switched-Mode Power Supplies with Digital ControlSamuel Quenzer-Hohmuth2, Jonas Messner2, Steffen Ritzmann3, Thoralf Rosahl3, Bernhard Wicht1

1Leibniz University Hannover, Germany; 2Reutlingen University, Germany; 3Robert Bosch GmbH, Germany


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D13.4 An Efficiency Optimization Method for a High Frequency Quasi-ZVS Controlled Resonant Flyback ConverterShen Xu1, Weidong Shen1, Qinsong Qian1, Jing Zhu1, Weifeng Sun1, Haisong Li21Southeast University, China; 2Wuxi Chipown Micro-electronics limited, China

D13.5 Discrete Time Adaptive State Feedback Control of DC-DC Power Electronic ConvertersAnushka Dissanayake, Nishantha EkneligodaOklahoma State University, United States

D13.6 Discrete Iterative Model and Dynamical Analysis of Inductor Current Compensation on Valley V² Controlled Boost ConverterHaoyang Gan, Shengzhong He, Minrui Leng, Fuban QinSouthwest Jiaotong University, China

D13.7 A Wide Input and Output Voltage Range Battery Charger Using Buck-Boost Power Factor Correction ConverterJaya Sai Praneeth A .V ., Sheldon S WilliamsonUniversity of Ontario Institute of Technology, Canada

D13.8 A High Frequency Power and Area Efficienct Charge-Pump-Constant-on-Time Controlled DC-DC Converter Based on Dynamic-Biased Comparator with 50mV Droop and 2us 1% Settling Time for 1.15A/1ns Load StepShih-Chieh Hsu, Ching-Jan Chen, Chieh-Ju TsaiNational Taiwan University, Taiwan

D13.9 Adaptive Passivity Based Control of DC-DC Power Electronic ConvertersAnushka Dissanayake, Nishantha EkneligodaOklahoma State University, United States

D13.10 Optimal-Frequency Critical Soft Switching Method of Synchronous DC/DC Converter Based on Model Predictive ControlLiwei Zhou, Matthias PreindlColumbia University, United States

D13.11 Variable-Frequency Explicit Model Predictive Control of Wide Band Gap DC/DC Converter with Critical Soft SwitchingLiwei Zhou, Matthias PreindlColumbia University, United States

D13.12 Efficient Load Management in Electric Ships: a Model Predictive Control ApproachNasibeh Zohrabi1, Hasan Zakeri2, Sherif Abdelwahed3

1Mississippi State University, United States; 2University of Notre Dame, United States; 3Virginia Commonwealth University, United States

D13.13 Detection of Series DC Arc on a Distribution Node Using Discrete-Time Parameter Identification TechniquesKaushik Gajula, Luis Herrera, Xiu YaoUniversity at Buffalo, United States

D13.14 A Virtual Impedance Based Grid Emulator for the Performance Analysis of Distributed GenerationsNakul Narayanan K, Umanand LoganathanIndian Institute of Science, India

D13.15 Power Factor Improvement of Flyback PFC Converter Operating at the Light LoadMinsung Kim1, Oscar Montes2, Sungho Son4, Yoon-Geol Choi4, Minjae Kim3

1Dongguk University, Korea; 2North Carolina State University, United States; 3Pohang Accelerator Laboratory, Korea; 4Pohang University of Science and Technology, Korea

D13.16 Indirect Grid Current Control of LCL Filter Based Grid-Connected ConverterSubhajyoti Mukherjee, Pourya Shamsi, Mehdi Ferdowsi, Jonathan KimballMST Rolla, United States

D13.17 A Distributed Control Architecture for Cascaded H-Bridge ConverterBei Xu1, Hao Tu2, Yuhua Du2, Hui Yu2, Hui Liang1, Srdjan Lukic2

1Beijing Jiaotong University, China; 2North Carolina State University, United States

D13.18 Speed Ripple Suppression of Reduced DC-Link Capacitance IPMSM Drives for Air-Conditioning ApplicationsYin Bai, Nannan Zhao, Gaolin Wang, Guoqiang Zhang, Dianguo XuHarbin Institute of Technology, China

D13.19 A Study of Voltage Feedforward Under Weak Grid ConditionsJianjie Xiao, Hua Lin, Ting HuaHuazhong University of Science and Technology, China

D13.20 A Robust Design Strategy for Resonant Controllers Tuned Beyond the LCL Filter Resonance FrequencyXin Zhao2, Zhen Kang2, Xuanlyu Wu2, Weilin Li2, Xiaohua Wu2, Chuan Xie3, Josep M . Guerrero1

1Aalborg University, Denmark; 2Northwestern Polytechnical University, China; 3University of Electronic Science and Technology of China, China

D13.21 Single-Submodule Open-Circuit Fault Diagnosis for a Modular Multi-Level Converter Using Artificial Intelligent-Based TechniquesZiwei Ke, Jianyu Pan, Risha Na, Karun Arjun Potty, Julia Zhang, Jin Wang, Longya XuOhio State University, United States

D13.22 Current Programmed Mode Control of Multi-Level Flying Capacitor Converter Near Zero-Ripple Current RegionLiangji Lu2, Aleksandar Prodic’2, Giacomo Calabrese1, Giovanni Frattini1, Maurizio Granato1

1Texas Instruments Inc., Germany; 1Texas Instruments Inc., Italy; 2University of Toronto, Canada

D13.23 Enhanced Current Capability for Modular Multilevel Converters by a Combined Sorting Algorithm for Capacitor Voltages and Semiconductor LossesFrederik Hahn2, Markus Andresen2, Marco Liserre1

1Christian-Albrechts-Universität zu Kiel, Germany; 2

Kiel University, Germany

D13.24 Switching Sequence Synthesis for Minimizing RMS Current in a Single-Inductor-Multi-Output ConverterSounak Maji, K Hariharan, Santanu KapatIndian Institute of Technology Kharagpur, India


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D14: Applications for Wireless Power TransferWireless Power Transfer

CHAIRS:Sheldon Williamson, University of Ontario Institute of TechnologyBrian Zahnstecher, Powerrox LLC

D14.1 Two/Three-Coil Hybrid Topology for WPT Systems Charging Electric BicyclesYang Chen, Naijian Yang, Lizhou Liu, Ruimin Dai, Zhengyou He, Ruikun MaiSouthwest Jiaotong University, China

D14.2 An LCL-N Compensated Strongly-Coupled Wireless Power Transfer System for High-Power ApplicationsYiming Zhang, Zhengchao Yan, Ziwei Liang, Siqi Li, Chris MiSan Diego State University, United States

D14.3 Regulated Power Transfer Using Self-Tuned Networks for Capacitive Wireless SystemsEli Abramov, Alexander Mindel, Mor Mordechai PeretzBen-Gurion University of the Negev, Israel

D14.4 Wireless Power Transfer Coil Design for Transmitter and Receiver LCC Compensation Based on Time-Weighted Average EfficiencyAmir Masoud Bozorgi, Mehdi FarasatLouisiana State University, United States

D14.5 Analysis and Design of Hybrid Inductive and Capacitive Wireless Power Transfer SystemBo Luo, Tao Long, Limou Guo, Ruikun Mai, Zhengyou HeSouthwest Jiaotong University, China

D14.6 High-Efficiency Design and Close-Loop Power Distribution Control for Double-Frequency Double-Load Magnetically Coupled Resonant Wireless Power Transfer SystemZe Ding1, Fuxin Liu1, Yong Yang1, Xuling Chen1, Ralph M . Kennel21Nanjing University of Aeronautics and Astronautics, China; 2Technical University of Munich, Germany

D14.7 Multi-Frequency Phase-Shifted Angle Control Strategy for a Two-Phase MCR WPT System with Multiple Loads to Achieve Targeted Power Distribution and Stable Transmission PowerTianming Mei1, Xin Zhang1, Fuxin Liu1, Xuling Chen1, Ralph M . Kennel21Nanjing University of Aeronautics and Astronautics, China; 2Technical University of Munich, Germany

D14.8 A Single-Stage Three-Level AC/DC Converter for Wireless Power TransferMinji Kim, Takongmo Marius, Gangwoo Lee, Jaesung Oh, Kyungjong Yoo, Eunsoo Kim, Ingab HwangJeonju University, Korea

D14.9 Behavioral Modeling of Resonant Power Transfer Systems with Capacitive Coupling: Two-Port Network ApproachEli Abramov1, Mor Mordechai Peretz1, Ilya Zeltser2

1Ben-Gurion University of the Negev, Israel; 2Rafael Advanced Defense Systems Ltd., Israel

D14.10 Bidirectional Wireless Power Transfer System with Wireless Control for Electrical VehicleBenoit Sarrazin, Alexis Derbey, Paul Albouy, Jean-Paul Ferrieux, Gérard Meunier, Jean-Luc SchanenUniversité Grenoble Alpes, CNRS, Grenoble INP, France

D14.11 Investigation and Design of Wireless Power Transfer System for Autonomous Underwater VehicleYi Dou, Dehua Zhao, Ziwei Ouyang, Michael A . E . AndersenTechnical University of Denmark, Denmark

11:15 a .m . – 1:45 p .m .

D15: Renewable Energy SystemRenewable Energy Systems

CHAIRS:Serkan Dusmez, Texas InstrumentsSaad Pervaiz, Texas Instruments

D15.1 Adaptive Impedance Compensation of Inverters for Stable Grid Integration Based on Online Resonance DetectionWenchao Cao1, Yiwei Ma2, Fred Wang2

1Danfoss Turbocor Compressors, Inc., United States; 2University of Tennessee, United States

D15.2 A Novel Power Router with General AC and DC PortTao Zhang1, Gang Yao1, Lidan Zhou1, Nan Jin3, Junwei Cao2, Junfeng Hu2, Chuantong Hao2

1Shanghai Jiao Tong University, China; 2Tsinghua University, China; 3Zhengzhou University of Light Industry, China

D15.3 Performance Benchmark of Bypassing Techniques for Photovoltaic ModulesKamran Ali Khan Niazi1, Yongheng Yang1, Hassan Abbas Khan2, Dezso Sera1

1Aalborg University, Denmark; 2Lahore University of Management Sciences, Pakistan

D15.4 A Small Signal Model for Grid Synchronization of a Three Phase SiC-Based Filter-Less Grid-Connected PV InverterYanjun Shi, Lu Wang, Hui LiFlorida State University, United States

D15.5 Instantaneous Reactive Power Reduction of Ripple-Free Resonant Buck Converter Using Bidirectional SwitchHwasoo Seok4, Seo-Gwang Jeong4, Kwang-Seop Kim4, Adrià Junyent-Ferré2, Honnyong Cha3, Minsung Kim1

1Dongguk University, Korea; 2Imperial College London, United Kingdom; 3Kyungpook National University, Korea; 4Pohang University of Science and Technology, Korea

D15.6 Design of Zero-Current Parallel-Switched-Capacitor Voltage Equalizer for Battery StringsLizhou Liu2, Wenbing Sun2, Peibang Han2, Ruikun Mai2, Zhengyou He2, Weihua Li11Jinan University, China; 2Southwest Jiaotong University, China


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D15.7 Parameters Design of Pre-Synchronization for Multiple Virtual Synchronous Generator Based MicrogridJiaqi Wu1, Fang Zhuo1, Chengzhi Zhu2, Zhenxiong Wang1, Hao Yi1, Tongjia Wei11Xi’an Jiaotong University, China; 2Zhejiang Electric Power Corporation, China

D15.8 High Efficient Single-Phase Transformerless PV Inverter Using GaN HEMTs and Si MOSFETsZhan Wang, Feng Qi, Yifeng WuTransphorm Inc., United States

D15.9 Large-Signal Black-Box Modelling of Bidirectional Battery Charger for Electric VehiclesAntreas Naziris, Galo Guarderas, Airán Francés, Rafael Asensi, Javier UcedaUniversidad Politécnica de Madrid, Spain

D15.10 Active Voltage-Ripple Compensation in an Integrated Generator-Rectifier SystemPhuc Huynh, Arijit BanerjeeUniversity of Illinois at Urbana-Champaign, United States

D15.11 Fault-Ride-Through (FRT) Characteristics of a Power-Decoupling-Type Photoinverter SystemTaiki Onodera, Toshihisa ShimizuTokyo Metropolitan University, Japan

D15.12 A Novel Leakage Current Reduction Method Combining a PWM Method and Bypass Path with a Damping Network for Transformerless 3-Level Photovoltaic Power Conditioning SystemSeongeun Han, Jongmin Jo, Hanju ChaChungnam National University, Korea

D15.13 Energy Capturing Performance Comparison Between Duty-Cycle Control and Current Control for Photovoltaic SystemJaehyun Lee, Jongmin Jo, Hanju ChaChungnam National University, Korea

D15.14 Mitigating Distribution Power Losses of Standalone AC Microgrids Using Particle-Swarm-Optimization Control for Distributed Battery SystemsYajie Jiang, Yun Yang, Siew-Chong Tan, Ron Shu Yuen HuiUniversity of Hong Kong, Hong Kong

D15.15 A Scalable Soft-Switching Photovoltaic Inverter with Cascaded H-Bridge Cells and Galvanic IsolationMorteza Moosavi, Hamid A . ToliyatTexas A&M University, United States

D15.16 Coordinated Frequency Control of a Doubly-Fed Induction Generator and Battery Using the Flexible Power ReferenceHyewon Lee1, Moses Kang2, Jongbok Baek2, Jonghoon Kim1

1Chungnam National University, Korea; 2Korea Institute of Energy Research, Korea

D15.17 A Daily Optimization Method for a PV-Battery Microgrid Considering the Battery Lifetime and Time-of-Use PricingShuang Zhao2, Xingchen Zhao2, Chris Farnell2, H . Alan Mantooth2, Janviere Umuhoza2, Yuzhi Zhang1

1ABB Inc., United States; 2University of Arkansas, United States

D15.18 Two-Stage Dual-Buck Grid-Tied Inverters with Efficiency EnhancementLi Zhang, Tao Zhang, Yongqiang Hao, Ben WangHohai University, China

D15.19 A Two-Stage Four-Port Inverter for Hybrid Renewable Energy System IntegrationDianzhi Yu1, Jianwu Zeng1, Junhui Zhao2, Jiahong Ning1

1Minnesota State University, Mankato, United States; 2University of New Haven, United States

D15.20 A Novel High Gain Single-Phase Transformer-Less Multi-Level Micro-InverterEltaib Abdeen1, Mahmoud Gaafar1, Mohamed Orabi1, Mohamed Youssef2

1Aswan University, Egypt; 2University of Ontario Institute of Technology, Canada

D15.21 A Control Method for Dg Based on Automatic Current Slope GainGustavo P . Pontes, Jessica P . M . Rocha, Isaac S . de Freitas, Fabiano Salvadori, Camila S . GehrkeFederal University of Paraiba, Brazil

D15.22 A Novel DC Link Energy Shaping Process for Minimizing the Transient Frequency Variations in MicrogridsSalman Harasis2, Yilmaz Sozer2, Malik Elbuluk2, Haitham Abu-Rub1

1Texas A & M University, Qatar; 2University of Akron, United States

D15.23 A Wide Gain Range LLC Resonant Converter Based on Reconfigurable Bridge and Asymmetric Resonant TanksCheng Li, Haoyu WangShanghaiTech University, China

D15.24 Speed Sensorless Control Based on Stator Currents for PMSG Wind Energy Conversion SystemsNgoc Dat Dao, Dong-Choon LeeYeungnam University, Korea

D15.25 A Smooth Transfer Control Strategy for Distributed Generation Units Based on Generalized Droop ControlXin Meng, Jinjun Liu, Zeng LiuXi’an Jiaotong University, China

D15.26 Transient Performance Comparison of Modified VSG Controlled Grid-Tied ConverterYawei Wang, Bangyin Liu, Shanxu DuanHuazhong University of Science and Technology, China


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11:15 a .m . – 1:45 p .m .

D16: Transportation Power ElectronicsTransportation Power Electronics

CHAIRS:John Vigars, Allegro MicroSystemsHengzhao Yang, California State University Long Beach

D16.1 A Novel Power Balancing Technique in Neutral Point Clamping Multilevel Inverters for the Electric Vehicle Industry Under Distributed Unbalance Battery Powering SchemeAhmed Sheir, Mohamed YoussefUniversity of Ontario Institute of Technology, Canada

D16.2 An Improved Flying Restart Method of Sensorless PMSM Drive Systems Fed by an ANPC Inverter Using Repetitive Zero Voltage VectorsDong-Woo Seo, Yeongsu Bak, Sungjoon Cho, Kyuchul Bae, Kyo-Beum LeeAjou University, Korea

D16.3 Integrated Battery Charging Circuit and Model Predictive Current Controller for Hybrid Electric VehiclesHo-Sung Kang, Seok-Min Kim, Kyo-Beum LeeAjou University, Korea

D16.4 A Smooth Mode-Switching Strategy for Bidirectional OBC Base on V2G TechnologyBodong Li, Lei Jing, Xiaoqing Wang, Ning Chen, Bo Liu, Min ChenZhejiang University, China

D16.5 An Improved Low-Voltage Charging Circuit for Single-Phase Onboard Battery ChargersHoang Vu Nguyen, Dong-Choon LeeYeungnam University, Korea

D16.6 Hybrid Modulated Reconfigurable Bidirectional CLLC Converter for V2G Enabled PEV Charging ApplicationsUmar Khalid2, Haoyu Wang1

1ShanghaiTech University, China; 2ShanghaTech University, China

D16.7 A Class of GaN-Based, Radiation-Hardened Power Electronics for Jovian EnvironmentsAnsel Barchowsky, Ahmadreza Amirahmadi, Christopher Stell, Elvis Merida, Gary Bolotin, Gregory CarrNASA Jet Propulsion Laboratory, United States

D16.8 Smart Resistor for Stability Improvement of the DC Link in Turbo-Electric AircraftsKarun Arjun Potty, Eric Bauer, Christian Moya, Benedict Sim, Jin WangOhio State University, United States

D16.9 A SiC Bidirectional LLC on-Board ChargerHaoran Li, Shengdong Wang, Zhiliang Zhang, Jia-Cheng Tang, Xiaoyong Ren, Qianhong ChenNanjing University of Aeronautics and Astronautics, China

11:15 a .m . – 1:45 p .m .

D17: Misc ApplicationPower Electronics Applications

CHAIRS:Liang Jia, Google Power GroupYichao Tang, TI

D17.1 Adaptive and Fast State of Health Estimation Method for Lithium-Ion Batteries Using Online Complex Impedance and Artificial Neural NetworkZhiyong Xia, Jaber Abu QahouqUniversity of Alabama, United States

D17.2 Test Circuit Analysis and Evaluation of 400 VDC Appliance CouplerNaoki Hanaoka, Hidekazu Hoshi, Takashi TakedaNTT Facilities Inc., Japan

D17.3 Hybrid Subsea Power Cable EmulatorFrancisco Jose Viglus1, Marcelo Lobo Heldwein2

1Federal University of Santa Catarina, Brazil; 2Power Electronics Institute, Brazil

D17.4 A Comparative Study of Battery, Supercapacitor and Undersea Energy Storage Systems in Wave Energy ApplicationsJuan Nunez Forestieri, Mehdi FarasatLouisiana State University, United States

D17.5 Power Curve-Fitting Control Method with Temperature Compensation for All-Metal Induction Heating SystemsSang Min Park, Eun Su Jang, Byoung Kuk Lee, Dong-Myoung JooSungkyunkwan University, Korea

D17.6 A Low Profile Gate Drive Power SupplyRipunjoy Phukan2, Lixiang Wei1, Jiangang Hu1

1Rockwell Automation Inc., United States; 2Virginia Polytechnic Institute and State University, United States

D17.7 Experimental Analysis and Calibration of Power Losses in High Efficiency SiC ConvertersMaziar Mobarrez, Arun K . Kadavelugu, Harish Suryanarayana, Sandeep BalaABB Inc., United States

D17.8 Multi-Physic Analysis for GaN Transistor PCB LayoutBainan Sun, Kasper Lüthje Jørgensen, Zhe Zhang, Michael A . E . AndersenTechnical University of Denmark, Denmark

D17.9 A Multiplexing Ripple Cancellation LED Driver with True Single-Stage Power Conversion and Flicker-Free OperationPeng Fang2, Yan-Fei Liu1, Paresh C Sen1

1Queen’s University, Canada; 2University of Minnesota Twin Cities, United States


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D17.10 Bond Wire Damage Detection and State of Health Estimation of a 1200V, 900A Dual Pack IGBT Power Module Using the RL-Equivalent CircuitAbu Hanif2, Joshua Major1, Douglas Devoto1, Faisal Khan2

1National Renewable Energy Laboratory, United States; 2University of Missouri-Kansas City, United States

D17.11 Adaptation of Commercial Current-Controlled Inverters for Operation with Virtual Oscillator ControlMinghui Lu4, Gab-Su Seo2, Mohit Sinha3, Fernando Rodriguez1, Sairaj Dhople3, Brian Johnson4

1Enphase Energy, United States; 2National Renewable Energy Laboratory, United States; 3University of Minnesota Twin Cities, United States; 4University of Washington, United States

D17.12 Thermal Monitoring Technique for Limiting Energy Accumulation in Automotive Power Switches Within SOAEung Jung Kim, Sualp Aras, Kyle Schulmeyer, Abidur RahmanTexas Instruments Inc., United States

D17.13 Adaptive Deadtime Compensation for Magnetic Resonance Imaging DriverHuan Hu1, Juan A Sabate1, Xiaohu Liu2

1GE Global Research, United States; 2Infineon Technology, United States

D17.14 Isolated DC-DC Converter for Thermoelectric Energy Harvesting Based on a Piezoelectric TransformerCarlos Correa-Betanzo2, Carlos Lopez-Perez2, Aurelio Rodriguez2, Adolfo Lopez-Nuñez1

1Instituto Tecnológico Superior de Irapuato, Mexico; 2INTEL Tecnología de México S.A. de C.V., Mexico

D17.15 Sub-Modular Circuit Design for Self-Balancing Series-Connected IGBTs in a Modular Multilevel ConverterLu Yue, Xiu YaoUniversity at Buffalo, United States

D17.16 A Novel Time Domain Analysis of the LLC-L Resonant Converter for the Use of the CLL and LLC Resonant ConverterAmit Kumar, Abhishek Awasthi, Omid Salari, Snehal Bagawade, Praveen JainQueen’s University, Canada

11:15 a .m . – 1:45 p .m .

D18: Grid ApplicationsPower Electronics Applications

CHAIRS:Ko-Tae Lee, IBMLanhua Zhang, TI

D18.1 Two-Level Algorithm for UPQC Considering Power Electronic Converters and TransformersJian Ye, Hoay Beng Gooi, Xinan Zhang, Benfei Wang, Ujjal ManandharNanyang Technological University, Singapore

D18.2 Low Voltage Distribution Grid Used Fault Current Limiter Controlled by Inverse Voltage SourceChaoran Zhuo, Xiaotian Zhang, Xiong Zhang, Xu YangXi’an Jiaotong University, China

D18.3 Proposal of Autonomous Regenerative Snubber Circuit and Verification Effect to Indirect Matrix ConverterKoji Higashiyama2, Fumito Kusama2, Makoto Ozone2, Keiji Akamatsu2, Masakazu Michihira1

1Kobe City College of Technology, Japan; 2Panasonic Corporation, Japan

D18.4 A Modified Y-Source InverterHongpeng Liu, Yuhao Li, Zichao Zhou, Hui WuHarbin Institute of Technology, China

D18.5 Relationship of Steady-State Power Loss and Configurable Tripping Time in Z-Source Circuit BreakersSagar Bhatta2, Yucheng Zhang2, Ruiyun Fu1

1Mercer University, United States; 2Old Dominion University, United States

D18.6 Mission Profile Based Reliability Analysis of a Three-Phase PV Inverter Considering the Influence of High dv=dt on Parasitic Filter ElementsAnup Anurag, Sayan Acharya, Shruti Pal, Subhashish BhattacharyaNorth Carolina State University, United States

D18.7 Control Strategy for Core-Loss Reduction in High-Frequency TransformersNomar González-Santini, Fang Zheng PengMichigan State University, United States

D18.8 An Optimal Control Algorithm of Capacitor Voltage Balancing for Modular Multilevel ConverterXuFeng Zhang2, Na Wang1, HongJian Lin2, Tao Yin2, Ziwei Zhang2, Zeliang Shu2

1ChengDu Yunda Technology Co.,Ltd, China; 2Southwest Jiaotong University, China

D18.9 Stability Analysis of Multi-Paralleled VSCs with Mismatched ParametersYangwen Wang, Donghua Pan, Xiongfei Wang, Hong GongAalborg University, China

D18.10 Highly Efficient Half Bridge with Press-Pack Diode for MMC UseFabian Hohmann, Mark-Matthias BakranUniversity of Bayreuth, Germany


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NOTES


DIALOGUE SESSIONS FLOOR PLAN

FS

RO

OM

CR

OO

M B

RO

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A

124 - Double S

ided Poster B

oards

11'

11'11'

11'11'

11'11'

11'11'

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11'

13'

D01.1 D01.2 D01.3 D01.4 D01.5 D01.6 D01.7 D01.8 D01.9 D1.10

D01.11 D01.12 D01.13 D02.1 D02.2 D02.3 D02.4 D02.5 D02.6 D02.7

D02.8 D02.9 D02.10 D02.11 D02.12 D02.13 D02.14 D02.15 D02.16 D02.17

D02.18 D02.19 D03.1 D03.2 D03.3 D03.4 D03.6 D03.7 D03.8

D03.9

D03.5

D03.10 D03.11 D03.12 D03.13 D03.14 D03.15 D03.16 D03.17 D03.18

D03.19 D03.20 D03.21 D03.22 D04.1 D04.2 D04.3 D04.4 D04.5 D04.6

D04.7 D05.1 D05.2 D05.3 D05.4 D05.5 D05.6 D05.7 D05.8 D05.9D05.10 D05.11 D06.1 D06.2 D06.3 D06.4 D06.5 D06.6 D06.7 D06.8

D06.10 D06.11D06.9 D07.1 D07.2 D07.3 D07.4 D07.5 D07.6 D07.7

D07.9 D07.10D07.8 D07.11 D07.12 D07.13 D07.14 D07.15 D07.16 D07.17

D07.18 D08.1 D08.2 D08.3 D08.4 D08.5 D08.6 D08.7 D08.8 D08.9

D09.1 D09.2 D09.3 D09.4 D09.5 D09.6 D09.7 D09.8 D09.9 D09.10

D09.11 D09.12 D09.13 D10.1 D10.2 D10.3 D10.4 D10.5 D10.6 D10.7

D10.8 D10.9 D10.10 D11.1 D11.2 D11.3 D11.4 D11.5 D11.6 D11.7

D11.8 D12.1 D12.2 D12.3 D12.4 D12.5 D12.6 D12.7 D13.1 D13.2

D13.3 D13.4 D13.5 D13.6 D13.7 D13.8 D13.9 D13.10 D13.11 D13.12

D13.13 D13.14 D13.15 D13.16 D13.17 D13.18 D13.19 D13.20 D13.21 D13.22

D13.23 D13.24 D14.1 D14.2 D14.3 D14.4 D14.5 D14.6 D14.7 D14.8

D14.9 D14.10 D14.11 D15.1 D15.2 D15.3 D15.4 D15.5 D15.6 D15.7

D15.8 D15.9 D15.10 D15.11 D15.12 D15.13 D15.14 D15.15 D15.16 D15.17

D15.18 D15.19 D15.20 D15.21 D15.22 D15.23 D15.24 D15.25 D15.26 D16.1

D16.2 D16.3 D16.4 D16.5 D16.6 D16.7 D16.8 D16.9 D17.1 D17.2

D17.11 D17.12D17.10D17.9D17.8D17.7D17.6D17.5D17.4D17.3

D17.16D17.15D17.14D17.13 D18.1 D18.2 D18.3 D18.4 D18.5 D18.6

D18.7 D18.8 D18.9 D18.10

124 DOUBLE SIDED POSTER BOARDS


ANAHEIM CONVENTION CENTER FLOOR PLAN

LEVEL TWO

LEVEL THREE


EXPOSITION FLOOR PLAN

1011

1021

1025

1027

1031

1033

1035

1038

1039

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1047 1048

1053

1057

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10641065

1067

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1097

111

1120

1121

1123

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1125 1126

11301131

1132

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11381139

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1147

1152

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11561157

11601161

11621163

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1165 1166

11701171

11721173

11741175

11961197

1224

1226

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1233 1234

1238

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1241 1242

1247

12521253

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12601261

12621263

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12661267

12701271

12721273

1296

1352

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142

147

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153

154157

189

211

220223

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228229

230

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234235

239

241

243

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252253

256

311

320321

324

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328

332333

338339

340

341 342

347

353

355

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365

367

371

373

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411

420

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429

433

438

439 440

442443

446

447 448

452453

456457

460

461

463

464465

466467

470

471 472

474475

511

521

528529

532533

538

540

542

552

553 556

560561

562563

564

565

567

570571

572

574575

611

621

629

631

632

633

635

653

660661

664665

670671

672673

675 676

677

711

723

727

728731

732

734

739

747

749

753

755

760

761

763

764765

766767

770771

772773

774

775

811

820821

824

827

828831

832833

838

839

840843

846

847

849

852853

854855

856857

860

861

863

864

865 866

870

871

872

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897

913

926

928

930

932

938

939

941

942943

946947

948949

952953

956

960

961 962

964965

966

970

972

974

997

539

8'

Directional

3M x 6M10X20

ANAHEIM, CALIFORNIA

MARCH 17 - 21, 2019Applied Power Electronics Conference & Expo

ANAHEIM CONVENTION CENTER - EXHIBIT HALL D

17'

42'

17'

42'

7'-4"

11'-7"

Camera@9'7"Security

PipesPipes

Pipes & 13'6" H

Pipes

STAIRS

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STAIRS

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STAIRS

LOBBY

EQUIP.SOUND

EQUIP.SOUND

OPEN TO BELOW

Video Wall

VENDING MACHINES

(8'3" to the top of video wall)

17' W x 18' HROLL - UP DOOR

TRUCK DOOR

20' W x 18' HROLL - UP DOOR

TRUCK DOOR

FA

FA

FEFA

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FEC

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FE FA FA FA FA

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SDSDSDSD FSFEFSFSFEFS,FE

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FA

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SD = Smoke Detector are located at 12'7" from the floor and CANNOT be blocked.

FSSP

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FSSP

FSSP

Fire PanelDO NOTBLOCK

FSFS

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FSFS

FSSP

FSSP

FSSP

FS@17'2"SP@17'2"

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FSSP

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FS FS

FSSP

FSSP

FS FS

FS FS

FS FS

FSSP

FSSP

FSSP

FSSP

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FSSP

FSSP

FS

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FS FS

FSSP

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FSSPFS

FSFSSP

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FS = Fire Strobe are located at 6'7" from the floor; they are 5"x5" and CANNOT be blocked.

FA

FE

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FSSP

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FS@14'SP

FREIGHTDOOR

11'11"W X 32'H

CO

NC

ESSI

ON

S - K

EEP

CLE

AR

Registration

Entrance

Entrance Entrance

ChargingStation

Entrance

APEC

Cut

Out

Let

ters

Press Office13Mx15M

APEC VideoWall

Pub Bins

Private Meeting Rooms

Exhibitor SeminarTheater #2

Freeman Service Center

Sales Office20x30

Exhibitor SeminarTheater #1

Food and Beverage

Food and Beverage


EXHIBITOR BOOTH #

5S Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1120

AC POWER CORP . (Preen) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1141

ACME Electronics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . 1142

Acopian Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 846

Adaptive Power Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 371

Advanced Technology (Bazhou) Co . Ltd . . . . . . . . . . . . . . . . . . . 675

AEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1262

AgileSwitch, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 961

AIR-VAC Automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1161

Aishi Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1238

All Flex Flexible Circuits and Heaters . . . . . . . . . . . . . . . . . . . . 972

Alpha & Omega Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . 728

Altair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 560

AMETEK Programmable Power . . . . . . . . . . . . . . . . . . . . . . . . 1265

AMETHERM, INC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456

AMOGREENTECH Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1173

Amphenol Interconnect Products . . . . . . . . . . . . . . . . . . . . . . . 1047

AMX Automatrix SRL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1162

Analog Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333

AnDAPT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 342

Anhui Specialsun Electronic Technology Co ., Ltd . . . . . . . . . . . 1370

Anpec Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 856

ANSYS, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 339

APEC 2019 HUB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 539

Apex Microtechnology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470

APM Technologies (Dongguan) Co . Ltd . . . . . . . . . . . . . . . . . . . 365

ASC Capacitors-Shizuki Electric Company . . . . . . . . . . . . . . . 1031

AVX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 832

B&K Precision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1165

Baknor Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1121

BH Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1042

BMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 474

Boschman-Advanced Packaging Technology . . . . . . . . . . . . . . 1170

BOSE Research . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241

Bourns, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 774

Brownsburg Electronik . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1267

CalRamic Technologies, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . 1046

Celem Power Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 565

Central Semiconductor Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . 956

Centrotherm International AG . . . . . . . . . . . . . . . . . . . . . . . . . . 849

EXHIBITOR LISTING

Chang Sung Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 567

Chroma Systems Solutions, Inc . . . . . . . . . . . . . . . . . . . . . . . . . 865

Classic Coil Company . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 575

Cleverscope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 475

CogniPower . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732

Coil Winding Specialist, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . 947

Coilcraft, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 439

Coilmaster USA Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 574

Cooliance, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 965

Coowa, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1354

Cornell Dubilier Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 753

CPS Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 556

Cramer Magnetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 731

Cypress . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1038

D6 Industries, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 256

Danfoss Silicon Power GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . 552

Datatronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 852

Dean Technology, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 338

DEWESoft LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 966

Dexter Magnetic Technologies . . . . . . . . . . . . . . . . . . . . . . . . . 960

Digi-Key Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1060

Dino-Lite Scopes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 361

DMEGC Magnetics Co ., LTD . . . . . . . . . . . . . . . . . . . . . . . . . . . 847

Dongguan Mentech Optical & Magnetic Co ., Ltd . . . . . . . . . . . 147

dSPACE Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1242

Ducati Energia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234

EA Elektro-Automatik . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 433

Eaton . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1061

EBG Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 340

ECI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 629

EFC/Wesco . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 855

Efficient Power Conversion Corporation (EPC) . . . . . . . . . . . . . . 953

EGSTON Power Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 561

Electrocube, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 542

Electronetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363

Electronic Concepts, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 321

Electronic Systems Packaging, LLC . . . . . . . . . . . . . . . . . . . . . . 926

Electronicon Kondensatoren GmbH . . . . . . . . . . . . . . . . . . . . . 1174

Elna Magnetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 448

EMA Design Automation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1123

EXHIBITOR BOOTH #


EXHIBITOR LISTING

EMWORKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1163

Epoxies, Etc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1156

Fair-Rite Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 747

Ferrite International Co . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1133

Ferroxcube, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 734

Focused Test, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231

Fuji Electric Corp . of America . . . . . . . . . . . . . . . . . . . . . . . . . . . 827

Fujipoly America Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 872

GAN Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 553

GaNPower International Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375

Gaotune Technologies Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . . . 1027

GE Global Research . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1065

GeneSiC Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1364

GES High Voltage, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1252

GLOBALFOUNDRIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 440

Global Power Technologies Group . . . . . . . . . . . . . . . . . . . . . . 1224

GMW Associates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 861

Goldenbamboo Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 970

Good-Ark Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 671

Gowanda Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 571

Group Intellect Power Technology . . . . . . . . . . . . . . . . . . . . . . . 243

GW Instek . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 464

Haining Ferriwo Electronics Co ., LTD . . . . . . . . . . . . . . . . . . . . . 864

Hangzhou Liansheng Insulation Co ., LTD . . . . . . . . . . . . . . . . . 1261

Hangzhou Silan Microelectronics Co ., Ltd . . . . . . . . . . . . . . . . 1132

Harwin Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1257

HBM Test and Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 1270

Helix Semiconductors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 472

Henkel Electronics LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 446

Heraeus Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 564

Hesse Mechatronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 723

Hioki USA Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

Hitachi America, Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1254

Hitachi Metals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 452

Hoi Luen Electrical Manufacturer Co ., Ltd . . . . . . . . . . . . . . . . . 767

Holy Stone International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1040

Hubei Ruiyuan Electronic Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . 1035

HVM Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1175

HVR Advanced Power Components . . . . . . . . . . . . . . . . . . . . . . 838

IAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 539

ICE Components, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 635

ICEL s .r .l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1126

Ikonix USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 766

Illinois Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 755

Indium Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 357

Infineon Technologies Americas Corp . . . . . . . . . . . . . . . . . . . . 711

Innoscience Technology Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . . . 1273

Inter Outstanding Electronics Inc (IOE) . . . . . . . . . . . . . . . . . . . 771

ITELCOND SRL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1360

ITG Electronics, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 866

IWATSU ELECTRIC CO .,LTD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 943

JARO Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1125

JFE Steel Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1073

Jianghai America Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 843

Johanson Dielectrics, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239

Jovil Universal LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1157

Kaschke Components GMBH . . . . . . . . . . . . . . . . . . . . . . . . . . . 763

KDM Zhejiang NBTM Keda Magnetoelectricity Co . Ltd . . . . . . 631

KEMET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 653

Kendeil srl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227

KEPCO, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1124

Keysight Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

Kikusui America, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 676

KITAGAWA INDUSTRIES America, Inc . . . . . . . . . . . . . . . . . . . . 460

LEM USA, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1230

Li Tone Electronics Co, LTD . . . . . . . . . . . . . . . . . . . . . . . . . . . 1166

Littelfuse, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253

Lodestone Pacific . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 749

LTEC Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 765

Mag . Layers USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1233

MagnaChip Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228

Magna-Power Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 824

Magnetic Metals Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . 670

Magnetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 946

Malico Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1234

MaxLinear Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 320

Menlo Microsystems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1138

Mersen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 447

Methode Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142

MH GoPower Company Limited . . . . . . . . . . . . . . . . . . . . . . . . 1362

EXHIBITOR BOOTH # EXHIBITOR BOOTH #


Microchip Technology, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211

Micrometals, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853

MicroMouse 2019 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189

Mitsubishi Electric US, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

Mitsubishi Materials Corporation . . . . . . . . . . . . . . . . . . . . . . . 773

MK Magnetics Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 443

Molex, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

Monolithic Power Systems, Inc . . . . . . . . . . . . . . . . . . . . . . . . . 327

MORNSUN AMERICA LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 939

Mouser Electronics, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 661

MPS Industries, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 353

MTL Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355

NAC Semi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 764

Naina Semiconductor Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1263

NAMICS Technologies Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1140

Nanjing New Conda Magnetic Industrial Co . LTD . . . . . . . . . . 1164

National Magnetics Group/Ceramic Magnetics, Inc . . . . . . . . . 540

Navitas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1241

New England Wire Technologies . . . . . . . . . . . . . . . . . . . . . . . . 453

Newtons4th Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1153

NexGen Power Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1160

NH Research, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 341

NIC Components Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 373

Nichicon (America) Corporation . . . . . . . . . . . . . . . . . . . . . . . . . 665

Noratel/Plitron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 677

NORWE Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 761

Ohmite Ceramic Resistor Division . . . . . . . . . . . . . . . . . . . . . . 1057

Ohmite MFG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 727

ON Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611

OPAL-RT TECHNOLOGIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 938

Pacific Sowa Corporation; C/O Epson Atmix Corporat . . . . . . . 461

Paktron Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 633

Panasonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 913

Payton America Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 429

PCIM Europe . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 854

Pearson Electronics, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 948

PELS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 539

PEM Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 863

Pfarr Stanztechnik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 974

PIN SHINE INDUSTRIAL CO ., LTD . . . . . . . . . . . . . . . . . . . . . . . 463

Plexim . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 839

PMBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226

PMK Mess- und Kommunikationstechnik GmbH . . . . . . . . . . . . 942

Polytronics Technology Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . 1033

Power Integrations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1011

PowerAmerica . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 466

PowerELab Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 831

Powersim, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324

Premier Magnetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1366

pSemi, A Murata Company . . . . . . . . . . . . . . . . . . . . . . . . . . . 1247

PSMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 539

Pulse Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1147

PulserR, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1264

Quik-Pak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1253

RECTRON SEMICONDUCTOR . . . . . . . . . . . . . . . . . . . . . . . . . 1063

REMTEC, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235

Renco Electronics, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 739

Renesas Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 347

Richardson RFPD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 660

Ridley Engineering, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 621

Rogers Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 820

Rohde & Schwarz USA, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230

ROHM Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 521

Rubadue Wire Company, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . 833

Rubycon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1064

Samwha USA Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1039

SanRex Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 828

SBE, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 930

Schunk Carbon Technology GmbH . . . . . . . . . . . . . . . . . . . . . . . 871

Scientific Test, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 941

Semikron, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 821

Shaanxi Shinhom Enterprise Co ., Ltd . . . . . . . . . . . . . . . . . . . . 1260

Shandong Dongtai Electronics and Science Co . . . . . . . . . . . . 1025

ShengYe Electrical Co . Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 465

Shenzhen Cenker Enterprise LTD . . . . . . . . . . . . . . . . . . . . . . . . 150

Shenzhen Codaca Electronic Co ., Ltd . . . . . . . . . . . . . . . . . . . . . 673

Shenzhen Zeasset Electronic Technology Co ., Ltd . . . . . . . . . . . 457

Shindengen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1272

Shin-Etsu Silicones of America . . . . . . . . . . . . . . . . . . . . . . . . . 154

Siemens PLM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1053

EXHIBITOR LISTING

EXHIBITOR BOOTH #EXHIBITOR BOOTH #


Silanna Semiconductor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 860

Silicon Labs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 772

Simplis Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 632

Sino Nitride Semiconductor Co . Ltd . . . . . . . . . . . . . . . . . . . . . . 874

Sirectifier Electronics Tech Corp . of Jiangsu . . . . . . . . . . . . . . 1131

Sonoscan, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 857

Speedgoat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1352

SST Vacuum Reflow Systems . . . . . . . . . . . . . . . . . . . . . . . . . . 563

Standex Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 952

STAr Technologies Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1130

Stellar Industries Corp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 770

STMicroelectronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 311

Storm Power Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223

StratEdge Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

Sumida America Components Inc . . . . . . . . . . . . . . . . . . . . . . . 1021

Superworld Electronics (S) PTE LTD . . . . . . . . . . . . . . . . . . . . . . 962

Synopsys, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1135

Taiwan Chinsan Electronic Ind . Co ., Ltd . . . . . . . . . . . . . . . . . . 1067

Taiwan Semiconductor Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 562

Taiyo Kogyo Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1171

Tamura Corp . of America, Tamura HQ, Tamura China . . . . . . . . 664

TDG Holding Co ., LTD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1155

TDK Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 811

Tektronix Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 471

Teledyne LeCroy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220

Texas Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 511

Thermik Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 442

Tongfeng Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1071

Torotel Products, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1152

TowerJazz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 328

Toyochem Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1139

Transim, EEtimes, EDN, Electronic Products, . . . . . . . . . . . . . . . 528

Transphorm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533

EXHIBITOR LISTING

EXHIBITOR BOOTH #Tran-Tec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1172

Triad Magnetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252

TT Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 532

Typhoon HIL, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 467

United Chemi-Con . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 420

United SiC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332

uPI Semiconductor/Sentec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

VAC Magnetics, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 840

Ventec International Group . . . . . . . . . . . . . . . . . . . . . . . . . . . . 438

Verivolt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1266

Versatile Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 870

Viking Tech America Corporation . . . . . . . . . . . . . . . . . . . . . . . . 224

Vincotech GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 932

Vishay Intertechnology, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 411

VisIC Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 775

Vitrek-High Voltage Test & Measurement . . . . . . . . . . . . . . . . . 949

Voltage Multipliers, Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1048

Wacker Chemical Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . 964

Wakefield-Vette . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 760

Well Ascent Electronic (Ganzhou) Co ., Ltd . . . . . . . . . . . . . . . . 1255

WEMS ELECTRONICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229

West Coast Magnetics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 570

WIMA Capacitors GmbH & Co .KG . . . . . . . . . . . . . . . . . . . . . . . 928

Wolfspeed, A Cree Company . . . . . . . . . . . . . . . . . . . . . . . . . . . 529

Wurth Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 421

Xiamen Faratronic Co . Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1226

Yokogawa Corporation of America . . . . . . . . . . . . . . . . . . . . . . 538

Yole Developpement & System Plus Consulting . . . . . . . . . . . 1240

Yuan Dean Scientific Co ., LTD . . . . . . . . . . . . . . . . . . . . . . . . . . 572

ZES ZIMMER Inc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225

Zhuhai Weihan Wire Co ., Ltd . . . . . . . . . . . . . . . . . . . . . . . . . . . 672

Zurich Instruments, AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1271

EXHIBITOR BOOTH #


NOTES

330 N. Wabash Avenue, Suite 2000Chicago, IL 60611

P: +1-202-973-8664 E-mail: [email protected]

www.apec-conf.org


330 N. Wabash Avenue, Suite 2000Chicago, IL 60611

P: +1-202-973-8664 E-mail: [email protected]

www.apec-conf.org

2020

MARCH 15-19, 2020New Orleans

SAVE THE DATE!

Documents

Applied Power Electronics Conference...session speaker infor-mation, exhibitor semi-nars and exhibitor list and locations, timely notifications such as cancellations and room changes,