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The Apple iPhone 6s Plus holds many IC components which are listed andreviewed in the report. All these ICs (more than 60 references) have beenopened in order to measure the real silicon area consumption. A specialfocus has been made to highlight the component structure and understandthe manufacturing process on “noteworthy” components among 4 selectedtopics: Advanced packaging, MEMS/Sensor, RF and Imaging. True innovationshave been observed in the sensors components like a new process for theMEMS microphone improving the SNR or a 3D packaging with TSV in thefingerprint sensor and many more.
Also a technological comparison with the Samsung Galaxy S6 has been madein order to understand choices made by both smartphone makers.
Apple iPhone 6s PlusTeardown & Physical Analyses of Key Components
Discover and understand Apple’s technical choices and main suppliers
MEMS/Sensors components
• Fingerprint sensor – new
generation: new packaging, new
processes (includes TSV)
• eCompass – new supplier, custom
product which has never been
used in a smartphone
• Microphone – new process
improving the SNR
• 6-Axis IMU – new reference,
custom design
• Ambient light sensor – new
reference, wafer-level package
Title: Apple iPhone 6s Plus
Pages: ~120
Date: November 2015
Format: pdf + xls
Price: EUR 3,490 (Teardown
already available, physical analyses
available beginning of December)
REVERSE TECHNOLOGY WITH:
• Smartphone Teardown
• ICs identification (manufacturer,
reference, function, package type,
size, pitch & pin count)
• ICs Silicon Area (dies size)
• PCB Characteristics (cross-
section, min. line width)
• Physical Analyses (decap-
sulation, cross-section, optical &
SEM pictures, measurement)
Imaging components
• Front and rear camera modules
• Flash LED – flip-chip integration
Packaging components
• Apple A9 Processor – advancedPackage-on-Package (PoP) structure
• Qualcomm Snapdragon – multi-chip, smallest pitch on the board
• Dialog Power management – largestball count WLP (380-ball)
RF component
• Wi-Fi & Bluetooth combo module
• Power Amplifier Module
Key inspected components:
TABLE OF CONTENTS (Preliminary)
Executive Summary
Apple iPhone 6s Plus Teardown
Electronic Board• High Resolution Pictures• ICs Identification ICs Identification (mfr., ref., fcn., pkg. type, size &
pin count)
ICs Silicon Area
Repartition by package type
Mfr. Design wins ranking
ICs Package footprint & Silicon Area ranking
• PCB Characteristics PCB Cross-Section
PCB min. line width
Advanced Packaging• Apple A9 PoP Package views & dimensions
Package Opening & Dies measurement
Package Cross-Section
• Qualcomm Snapdragon Package views & dimensions
Package Opening & Dies measurement
Package Cross-Section
• Dialog WLP Power Management Package views & dimensions
Package Cross-Section
MEMS/Sensors• Fingerprint Sensor Button Assembly View
Fingerprint sensor Cross-Section
Sensor dies measurement
• 3-Axis eCompass Package views & dimensions
Package Opening & Dies measurement
Package Cross-Section
• Microphone Package views & dimensions
Package Opening & Dies measurement
Package Cross-Section
• 6-Axis IMU Package views & dimensions
Package Opening & Die measurement
MEMS opening & sensor details
Cross-Section
• Ambient Light Sensor Package views & dimensions
Package Opening & Die measurement
Package Cross-Section
RF Devices• 5G Wi-Fi & Bluetooth Combo Chip Package views & dimensions Package Opening & Dies Measurement Package Cross-Section
• Power Amplifier Module Package views & dimensions
Package Opening & Dies measurement
Package Cross-Section
Camera Modules & Flash LED• 12Mp Rear Camera Module Module views & dimensions
Module Opening & CIS die measurement
Module Cross-Section
• 5Mp Front Camera Module Module views & dimensions
Module Opening & CIS die measurement
Module Cross-Section
• Flash LED Package views & dimensions
Package Opening & LED die measurement
Package Cross-Section
Performed by
Wilfried is Senior Project
Manager for Reverse
Costing analyses at
System Plus Consulting.
Since 1998, Wilfried is in
charge of costing analyses
of Electronic Systems and
Integrated Circuits.
Author:Wilfried Theron
Author (Lab):Audrey Lahrach
Audrey is in charge of
costing analyses for IC,
LCD & OLED Displays and
Sensor Devices. She hold
a Master degree in
Microelectronics from the
University of Nantes.
Samsung Galaxy S6 Teardown & Physical Analysis
iPhone 6 & 6 Plus Rear Cameras
iPhone 5S/6Fingerprint Sensor
Discover and understandSamsung’s technical choices andmain suppliers.
8Mpixels CMOS Image Sensors:45nm technology node / NewPackaging/Optical Image Stabilizerintegration.
The first integration of a touchfingerprint sensor and a sapphireprotective window.
Pages: 100Date: September 2015
Full report: EUR 2,490*
Pages: 177Date: November 2014
Full report: EUR 3,490*
Pages: 89Date: June 2014
Full report: EUR 2,990*
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More than 40 reports released each year on the following topics (considered for 2015):
• MEMS & Sensors (20 reports): • Gyros/Accelerometers/IMU • Oscillators/RF switches• Pressure sensors/Microphones
• Power Electronics & Systems (10 reports): • GaN and SiC devices • Inverters & modules
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &costing analyses in various domains.
• Imaging & LEDs (5 reports): • Camera modules • Infrared sensors & cameras • LEDs
• Advanced Packaging (5 reports): • WLP• TSV• Embedded Devices…
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