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Apple iPhone 6s
Complementary Teardown Report with Additional Commentary
Apple iPhone 6s Smartphone 2
Some of the information in this report may be covered by patents, mask and/or copyright protection. This report
should not be taken as an inducement to infringe on these rights.
© Chipworks Inc. 2015 all rights reserved. Chipworks and the Chipworks logo are registered trademarks of
Chipworks Inc.
BPT-1509-801
28401JMDY
Revision 1.0 Published: October 2015
About Chipworks
Founded in 1992 to provide
technical analysis capabilities to
companies seeking to grow the
potential of their IP and understand
their competitors
Headquartered in Ottawa, Canada
with over 112 employees – offices in
Canada, USA, Europe, Japan, Korea
and Taiwan
Provide solutions to over 200 global
technology, semiconductor and
electronics companies
Five in-house laboratories with
advanced tools and equipment for
in-depth, world-class analysis
Foundation of our products and services are built on
Two complementary business units
PATENT INTELLIGENCE SERVICES
COMPETITIVE TECHNICAL INTELLIGENCE
Unrivalled Ability to Match Patents to Products
The Most Accurate Analysis of High Volume Consumer Devices
We provide timely, high-quality, and independent
competitive technical analysis on which products
are winning and why.
We provide insightful, customized solutions to help IP
teams identify and fully leverage their best patents,
protect their competitive position, prepare for litigation,
and develop successful IP strategies.
Apple iPhone 6s Smartphone
Specifications
Manufacturer: Apple Inc.
Product name: iPhone 6s
Model number: A1688
Size: 67.1 mm x 138.3 mm x 7.1 mm
System: OS iOS 9
6
Apple iPhone 6s Smartphone
Specifications
7
BASIC Product Name iPhone 6s, A1688
Manufacturer Apple Inc.
Minimum Size (mm) 67.1 x 138.3 x 7.1
Weight (g) 143
BATTERY TIME Standby (hours) 3.9G: FDD-LTE: – 3.9G: TD-LTE: – 3G: WCDMA: 240 3G: CDMA: – 3G: TD-SCDMA: – 2G: GSM: –
Voice Call (minutes) 3.9G: FDD-LTE: – 3.9G: TD-LTE: – 3G: WCDMA: 840 3G: CDMA: – 3G: TD-SCDMA: – 2G: GSM: –
Video Call (minutes) n/a
Digital TV (minutes) n/a
Other n/a
Battery (size in mm) Li-ion polymer, 3.82 V, 1,715 mAh (38.17 x 95.03 x 2.87)
SYSTEM OS iOS 9
CPU / ROM / RAM CPU: Apple A9, dual-core, 1.8 GHz, embedded M9 motion co-processor
ROM: 16 GByte
RAM: 2 GByte
DISPLAY Main Display 4.7-inch, 16,777,216 colors, 750 x 1334 dot, Retina HD, IPS LCD
Sub Display n/a
COMMUNICATION Protocol (MHz) 3.9G: FDD-LTE: 700, 800, 850, 900, 1700, 1800, 1900, 2100. 2100, 2600
3.9G: TD-LTE: n/a
3G: WCDMA: 850, 900, 1700, 1900, 2100
3G: CDMA: 800, 1700, 1900, 2100
3G: TD-SCDMA: n/a
2G: GSM: 850, 900, 1800, 1900
HSDPA/HSUPA (Mbps) 3G: 42.2/5.76 LTE: 300/50
Wireless LAN 802.11 a/b/g/n/ac
Bluetooth 4.2
GPS Yes
Infrared n/a
RFID/NFC NFC
CAMERA Main Camera 12.0 MP CMOS with auto-focus, LED flash
Sub Camera 5.0 MP CMOS
SENSOR Motion Accelerometer: Yes Digital Compass: Yes Gyroscope: Yes Barometer: Yes
Gesture Recognition: n/a - - -
Ambient Light Sensor: Yes Proximity Sensor: Yes Temperature Sensor: n/a Humidity Sensor: n/a
Security Fingerprint Sensor: Yes - - -
Healthcare Heart Rate Monitor: n/a
Touch Panel Capacitive, multi touch, 3D
OTHER HDMI n/a
MicroSD (max. capacity) n/a
Waterproof/Anti-shock n/a
Apple iPhone 6s Smartphone
Application Processors – Dual Sourced
Apple has dual sourced its A9 Application Processor from Samsung (14 nm FinFET) and TSMC (16 nm FinFET). Chipworks
will be doing deep structural analysis of the TSMC process.
Chipworks is working to confirm if the process is TSMC 16FF or 16FF+. We will be able to differentiate between these two
processes once we understand the standard cell architecture and BEOL integration, where major differences are expected.
Stay tuned!
Preliminary SEM and TEM images will be available to report pre-purchasers
TSMC 16 nm FinFET
Chipworks Reports – TSMC 16 nm FinFET Process Date
Basic Functional Analysis Report (FAR-1509-803) $7,500 ~Late October
• Package photos/xrays
• Metal 1 or polysilicon die photo
• Die size measurements
• Digital, analog, and memory are annotated
• Node assessment
• IC cost estimate
Advance CMOS Essentials Project (ACE-1509-801) $12,000 ~Early December
• Concise analyst’s summary of critical device metrics, TEM-EDS results, and salient features supported by
the following image folders:
• SEM bevel: logic region and SRAM with SEM cross-section of the general device structure, metals,
dielectrics, and detail of the FEOL structures
• TEM cross-sections: parallel and perpendicular to the transistor gates
Structural Analysis Report (SAR-1504-802) $24,500 ~Late November
• TSMC FinFET process
• Top-down layer-by-layer analysis of the back end
processing
• Analysis of the front end processing including
SEM and TEM imaging
• Memory cell analysis
• Layout – detailed SEM and optical plan-view
images
Related Reports
• Samsung 14 nm FinFET suite of reports
• Intel 14 nm FinFET Cherry Trail suite of reports
• Intel 14 nm FinFET Broadwell suite of reports
APL1022 Die Mark
Apple iPhone 6s Smartphone
Chipworks tracks the key metrics that allow your marketing team to know their
market place:
• Package photos/xrays
• Metal 1 or polysilicon die photo
• Die size measurements
• Digital, analog, and memory are annotated
• Node assessment
• IC cost estimate
This is the first time we have ever found a dual sourced application processor.
It will be a unique opportunity for us to compare implementation of the same
chip from the two heavyweights in foundry services.
Not only will we be doing a functional block level comparison but we can dive
down and look at the implementation of the standard cell libraries, showing
cell layout and comparing routing efficiencies.
9
A4 A5 A6 A7 A8
Application Processors – Dual Sourced
A9 A9
Apple iPhone 6s Smartphone
Application Processors – Sneak Peak, as promised!
10
APL1022 TSMC 16 nm FinFET APL0898 Samsung 14 nm FinFET
NOTE: False color and image sharpening has been applied to the photos for the purposes of this article.
High resolution images in Chipworks reports are not retouched.
Apple iPhone 6s Smartphone
Chipworks recently completed transistor characterization of the
Samsung 14 nm FinFET process (logic). Chipworks provides
universal transistor curves that will allow you to easily compare
between foundries.
Measurements include:
AFP Image of the Measurement Area for NMOS Transistor 1
Transfer Characteristics (VDS = 0.7 V)
Extrapolated Linear VT (VDS = 0.05 V)
Transconductance (gm) (VDS = 0.7 V)
Subthreshold Swing (S) (VDS = 0.7 V)
Transfer Characteristics Versus VDS
DIBL (ΔVGS/ΔVDS)
11
Transistor Characterization Reports - compare reality to foundry targets and publications.
AFP image showing the probe locations for
NMOS transistor CPU logic
NMOS Universal
Curve
PMOS Universal
Curve
Related Transistor Reports Report Code
TSMC 16 nm FinFET (logic) Under consideration
Samsung 14 nm FinFET (logic) TCR-1504-801
Intel 14 nm FinFET (SRAM) TCR-1409-801
Apple iPhone 6s Smartphone
In-Depth Technology Benchmarking
Based on phone-level benchmarks, the otherwise identical iPhone 6s are not the same
https://m.youtube.com/watch?v=0bAeJ5fJ1M0
Apple’s Dual-Source of the A9 applications processor allows Chipworks a unique opportunity to directly
benchmark two technologies in the exact same design
– Process analysis and costing
– Standard cell implementation and routing efficiency
– Transistor characterization and capacitance modeling
– Block-level power measurements
Perf/Power/Area metric would indicate Samsung should have the lead in battery life based on area.
However, our measurement of the 14LPE process on Exynos has shown a weak NMOS, can this be the
cause of the power difference between TSMC and Samsung A9s?
12
A9(TSMC) A9(SEC) Area Perf/Power
NMOS Universal
Curve
PMOS Universal
Curve
Apple iPhone 6s Smartphone
Product Information
13
Apple iPhone 6s Smartphone
Teardown
14
display, touch panel,
and FPC #3 PCB #1
rear cover
Li-ion polymer
battery
center panel
FPC #1
FPC #2
Apple iPhone 6s Smartphone
Synaptics’ Q3 2014 acquisition of Renesas let
them reap the rewards of the Renesas design
win in the iPhone 6 and 6 plus, and Synaptics
repeats this year with the design win for the
iPhone 6s and 6s plus DDI.
Looking forward Synaptics may be able to
leverage this design win to move Apple towards
a touch screen controller and display driver
integrated solution. Chipworks first catalogued
this disruptive design in the ZTE Q7 S6 Lux..
15
Display Driver Win for Synaptics
Synaptics Touch and Display Driver Integration (TDDI) first generation, ZTE Q7 S6 Lux. Currently sampling second generation.
Touch Screen Controller
The touch screen controller was comprised of a two
chip solution in the iPhone 6, this socket was held
by Broadcom and Texas Instruments. In the iPhone
6S these two chips were combined into a single
package with a third unknown chip. The next
evolutionary step would be to move to an integrated
touch and display driver solution.
NOTE: Chips are not scaled.
According to Synaptics there are a number of key benefits to TDDI:
Best-in-Class Performance – synchronizes touch sensing and
display driving to virtually eliminate display noise and offer best-
in-class capacitive touch performance.
Thinner Form Factors – Integration of the touch sensor into the
display results in thinner form factors.
Brighter Displays – Fewer layers in the touchscreen results in a
brighter display, or longer battery life for the same brightness.
Lower System Cost – Reducing the number of components,
eliminating lamination steps and increasing manufacturing yield
lowers overall system cost for OEMs.
Synaptics iPhone 6S Display Driver IC R63318 (DDI)
Apple iPhone 6s Smartphone
Fingerprint Sensor – 2nd Generation
The last three generations of the iPhone (5, 5s, 6)
have contained the same fingerprint sensor. Apple
is now releasing their 2nd generation fingerprint
sensor. We were excited to find contacts going
from the front to the back of the die. Could this be
TSMC’s first demonstration of TSVs?
We have already launched two reports on this new
fingerprint sensor and are considering deep circuit
analysis.
16
Front Back
TSVs?
Related Fingerprint Sensor Reports Report Code
Apple iPhone 6S Fingerprint Sensor
Basic Functional Analysis Report
FAR-1510-802
Analysis Underway
Apple iPhone 6S Fingerprint Sensor
Package Report
PKG-1510-801
Analysis Underway
Apple iPhone 6S Fingerprint Sensor
Circuit Analysis Report
Under consideration
Please contact us
Apple iPhone 6s Smartphone
3D Touch
Apple has been improving its user interface across its
product lines by adding a force-based touch features
to the Macbook, Apple Watch and iPhone 6S.
Chipworks recently completed systems analysis of the
Apple Watch Force Touch sensor. This report
examines market adoption and penetration for force-
based touch, intellectual landscape, and the
technology behind the Apple Watch Force Touch. It
includes findings about the construction, connectivity,
and operation.
We have just begun system analysis of the iPhone 6S
3D Touch. Contact us to find out more!
17
top side
bottom side
right sid
e
left
sid
e
34
mm
29 mm
0.9 mm
6-pin
connector
Front Back
Related Fingerprint Sensor Reports Report Code
Apple iPhone 6S Force Touch Exploratory Report EXR-1510-801
Analysis Underway
Apple Watch Force Touch Sensor Exploratory Report EXR-1507-801
Apple Watch Force Touch Sensor
Apple iPhone 6s Smartphone 18
3D Touch – Apple’s adoption and what it may mean to the OEM World
An intellectual property perspective
On September 2, just a couple of days before Apple’s iPhone 6s announcement, Huawei announced its own Android-based
smartphone, the Mate S, with a Force Touch-inspired pressure sensitive screen.
It seems Force Touch technology applications are going to get crowded rather quickly. We decided to investigate who is
patenting in the area. In other words, who would be interested in and prepared for potential licensing and litigation? We also
wanted to find patents possibly applicable to Apple’s existing and future Force Touch products.
There are already some reports on
BlackBerry (then RIM) patenting in the area
(US9092057) at the time of their Storm
smartphone release in 2008. This report,
however, missed the point, since the patents
discussed relate more to haptic feedback
than to the force touch applied in Apple
products.
A quick keyword search shows us the
filing companies.
One glaring omission seems to be Huawei.
This is odd, as one would expect they will
become one of the preferred targets in any
potential war. Expect Huawei to go after
patent acquisitions.
Apple iPhone 6s Smartphone 19
3D Touch – Apple’s adoption and what it may mean to the OEM World
An intellectual property perspective
It is obvious that Force Touch, touch sensors, threshold value, and actuators
dominate the filings.
Which patents are potentially applicable against Apple (and other)
products?
Analyzing patenting companies and patents themselves, two companies
appear in the forefront: BlackBerry and Qualcomm. We managed to uncover a
couple of examples that we feel are applicable to Apple products.
What are patented topics?
Apple iPhone 6s Smartphone
Insert ad on Patent intel
20
Apple iPhone 6s Smartphone
PCB Dimensions and Markings
21
PCB #1
Manufacturer OPC
Dimension 57.25 mm x 96.54 mm x 0.84 mm
Layer 10
Connector (pin) 0
Connector (socket) 13
Connector (ACF) 0
Apple iPhone 6s Smartphone
PCB #1 Display Side – Cellular
22
power amplifier (Avago)
AFEM-8030 3G/4D mid band PAD Module (B1/25(2)/3/4)
power amplifier (Qorvo)
TQF6405 PAD Module (High Band)
power amplifier (Skyworks)
SKY77812-19 Low band 3G/4G PAD Module (B8/13/17(12)/20/26(5)/28AB/29)
envelope tracker (Qualcomm)
QFE1100
Apple iPhone 6s Smartphone
Power Amplifier
Chipworks has extensive circuit analysis available on leading edge power amplifier manufacturers. The number of components in
these modules is astounding, in the Avago ACPM-8010 (below) Chipworks has catalogued 23 die!
This is a hotly contested space and it is not uncommon to find several manufacturers winning in the same phone.
23
Related Power Amplifier Circuit
Analysis Reports Report Code
AVAGO ACPM-8010 Power Amplifier Circuit
Analysis Reports CAR-1507-201 Analysis Underway
Qualcomm QFE2320 RF Power Amplifier with
Antenna Switch Circuit Analysis CAR-1406-802
Qualcomm QFE2340 RF Power Amplifier with
Tx-Rx Switch Circuit Analysis CAR-1406-803
Avago ACPM-7600 Power Amplifier Circuit
Analysis Reports CAR-1311-902
Skyworks SKY85303 Power Amplifier Circuit
Analysis Report CAR-1307-901
Skyworks SKY85707 Power Amplifier Circuit
Analysis Reports CAR-1307-902
Apple iPhone 6s Smartphone
PCB #1 Display Side – Key Components
24
antenna tuning
(Qorvo)
RF1347
A9 APL0898 application
processor
(Samsung) and DRAM (Micron)
D9SND (MT53B256M64D2NL)
LED backlight Retina
Display Driver
(Texas Instruments)
3539
baseband processor
(Qualcomm) MDM9635M
accelerometer
(Bosch Sensortec)
likely BMA280
accelerometer
and gyroscope
(InvenSense)
MPU-6700
SIM card slot
(mnf. unknown)
Accelerometer and Gyroscope Reports Report Code
Bosch BMI160 Circuit Analysis Report CAR-1510-901
Invensense MPU-6500/6515 ASIC Full Analog Circuit Analysis Report CAR-1405-901
Bosch Triaxial Gyroscope ASIC from BMI055/BMG160 Circuit Analysis Report CAR-1402-901
Maxim Integrated MAX21000 3-Axis Digital Output Gyroscope ASIC Circuit Analysis Report CAR-1308-901
Apple iPhone 6s Smartphone
PCB #1 Battery Side – Cellular
25
LTE/WCDMA/CDMA/GS
M RF transceiver
and GPS (Qualcomm)
WTR3925 antenna switch (Qorvo)
RF5150
GSM/Edge PA Module USI
(Skyworks)
SKY77357
duplexer bank (Murata)
Yd G54
RF FEM (Murata)
240 M1
SAW filter (Epcos)
8ME 3BL
duplexer bank (Murata)
Ne G98
unknown (Avago)
SFI529
157714
Apple iPhone 6s Smartphone
Qualcomm RF Front End Circuit Analysis
26
• RF Transceiver WTR3925 (in Galaxy S6 Verizon)
• LTE Modem MDM9635M (in Galaxy S6 Verizon)
• Power Management PMD9635 (in Galaxy S6 Verizon)
• Envelope Tracker QFE1100
We have deep circuit analysis on the
following devices:
QFE2320: Multi-mode Multi-band
Power Amplifier with Integrated
Antenna Switch
QFE2340: High Band Multi-mode
Multi-band Power Amplifier with
Integrated Transmitter/Receiver mode
switch
WTR-xxxx Transceivers:
• WTR3925
• WTR1625L
• WTR1605L
QFE1100: Envelope Tracker
1 1 2
1
2 3
3
Apple iPhone 6s Smartphone
Qualcomm RF Front End Circuit Analysis
27
The Qualcomm WTR1605 RF Transceiver chip has
been a fabulous winner for Qualcomm. It has been
used in at least three different families of Qualcomm
components. These components have in turn been
found in a total of 89 different products from
24 different manufacturers (some are highlighted in
the image on the right).
This type of component/product information is
tracked in Chipworks' Design Win Tracker (DWT).
DWT is an annual, customizable subscription-based
service with an exclusive focus on the integrated
circuit (IC) design wins and losses in the highest
volume phones and tablets.
Design Win Tracker addresses the number one
problem faced by decision makers in the
semiconductor industry: getting accurate, timely, and
reliable information on the nature of design wins and
losses.
Apple iPhone 6s Smartphone
PCB #1 Battery Side – Key Components
28
class D audio amplifier
(Cirrus Logic)
338S1285
power management (Qualcomm)
PMD9635
likely interface IC (NXP)
1610A3
class D audio amplifier (Cirrus Logic)
338S1285
flash memory (SK Hynix)
H23QDG8UD1ACS
power management (Dialog)
338S00120-A1 (assumption)
NFC controller (NXP)
66V10
WiFi Module
(Universal Scientific Industrial)
339S00043
barometer (Bosch Sensortec)
likely BMP280
unknown
56ALHHI
6BB27
battery charger
(Texas Instruments)
SN2400AB0
audio codec (Cirrus Logic)
338S00105
power management (Texas Instruments)
TPS65730
Barometer Circuit Analysis Report Code
Bosch BMP280 CAR-1405-902
Apple iPhone 6s Smartphone
PCB #1 – Connectors
29
FPC #1
H: 0.49
display (mnf. unknown)
pin pitch: 0.35
pin # 44
L: 10.04
W: 1.67
H: 0.62
13 MP CMOS camera
(mnf. unknown)
pin pitch: 0.35
pin # 34
L: 8.10
W: 1.92
H: 0.68
PCB #1 - PCB #1
H: 0.50 PCB #1 - PCB #1
H: 0.48
LED flash, volume, and power button
(mnf. unknown)
pin pitch: 0.35
pin # 12
L: 4.52
W: 1.98
H: 0.61
Li-ion polymer battery (mnf. unknown)
L: 7.11
W: 3.86
H: 0.79
5 MP camera, light, and
proximity sensor microphone
(mnf. unknown)
pin pitch: 0.35
pin #36
L: 9.13
W: 1.86
H: 0.71
3D touch panel (mnf. unknown)
pin pitch: 0.35
pin # 22
L: 6.87
W: 1.78
H: 0.82 antenna
H: 0.51
FPC #1 (mnf. unknown)
pin pitch: 0.35
pin #40
L: 9.96
W: 1.90
H: 0.83
Apple iPhone 6s Smartphone
FPC #1 – Key Components
30
lightning connector (mnf. unknown)
headphone port (mnf. unknown)
microphone (Knowles)
5280 KSM2
microphone (Knowles)
5280 KSM2
Apple iPhone 6s Smartphone
FPC #1 – Connectors
31
lightning connector (mnf. unknown)
pin pitch: 0.635
pin # 8
L: 8.84
W: 15.87
H: 3.27 PCB #1 (mnf. unknown)
pin pitch: 0.35
pin # 40
L: 8.79
W: 1.20
H: 0.72
PCB #1
H: 0.90
Measurement Unit: millimeters (mm)
Apple iPhone 6s Smartphone
FPC #2 – Key Components
32
ring/silent switch
(mnf. unknown)
power button
(mnf. unknown)
volume button
(mnf. unknown) LED flash microphone (Knowles)
5280 KSM2
Apple iPhone 6s Smartphone
FPC #2 – Connectors
33
PCB #1
(mnf. unknown)
pin pitch: 0.35
pin # 12
L: 3.40
W: 1.24
H: 0.48
Measurement Unit: millimeters (mm)
Apple iPhone 6s Smartphone
FPC #1 – Connectors
34
lightning connector (mnf. unknown)
pin pitch: 0.635
pin # 8
L: 8.84
W: 15.87
H: 3.27 PCB #1 (mnf. unknown)
pin pitch: 0.35
pin # 40
L: 8.79
W: 1.20
H: 0.72
PCB #1
H: 0.90
Measurement Unit: millimeters (mm)
Apple iPhone 6s Smartphone
FPC #3 – Key Components
35
proximity sensor (mnf. unknown)
5 MP CMOS camera (mnf. unknown)
light sensor (mnf. unknown)
microphone (GoerTek)
529 GWM1
Apple iPhone 6s Smartphone
Time of Flight Sensor – A better solution to proximity detection
STMicroelectronics VL6180 Time of Flight Sensor
• Chipworks’ first recorded design win of the VL6180 occurred in the
BlackBerry Passport. We have since found the VL6180 in 5 different LGE
smartphones.
• The primary application of the VL6180 is the replacement of existing
proximity detection technology. Proximity sensors are used in nearly all
smartphones to detect the user’s head during a phone call. Unfortunately,
the amplitude of the reflected light varies according to the distance but
also with the reflectance level of the target, which can be as low as 3
percent for dark black hair. This can lead to ambiguous results - quite
frustrating to some users.
The VL6180 allows absolute distance to be measured independent of
target reflectance. Instead of estimating the distance by measuring the
amount of light reflected back from the object, the VL6180C precisely
measures the time the light takes to travel to the nearest object and
reflect back to the sensor.
Was used in the LG G3 as the laser autofocus for the rear facing camera
The integration of the SPAD, IR emitter and Ambient Light Sensor is an
impressive engineering feat. We expect to find many more design wins
for this disruptive technology!
Fabbed in STMicroelectronics BCD9 Process.
36
Apple iPhone 6s Smartphone
FPC #3 – Connectors
37
PCB #1 (mnf. unknown)
pin pitch: 0.35
pin # 36
L: 8.04
W: 1.42
H: 0.54
Measurement Unit: millimeters (mm)
Apple iPhone 6s Smartphone
PCB #1, FPC#1, FPC #2, and FPC #3 – Connectors Plugged
38
Apple iPhone 6s Smartphone
Others – Fingerprint Sensor
39
Apple iPhone 6s Smartphone
Others
40
vibrator (taptic engine) speaker
speaker
Apple iPhone 6s Smartphone
Main Display Dimensions
41
Measurement unit: millimeter (mm)
Display Module Size 61.17 x 110.46 x n/a (stack-on-glass)
Display Marking (location) C3F5353E4HQG873L7-A3MEQ298Q2K54
(bottom metal plate)
Display Panel Manufacturer JDI
Display Diagonal Size (inch) 4.7
Display Mode (alignment) IPS (stripe alignment)
Pixel Count (dot) 750 x 1334, Retina HD
Resolution (pixel per inch) 326
Peripheral Margin (from reverse side) Left 1.31
Top 1.34
Right 1.33
Bottom – up 0.08
Bottom – low 5.00
Seal marking: Y/N (length in mm) No
Display Component Thickness 1a: LCD Top Polarizer n/a (stack-on-touch-panel)
1b: LCD Panel n/a (stack-on-touch-panel)
1c: LCD Lower Polarizer and Reflector 0.08
2. Diffuser n/a
3: Brightness Enhancement Film 0.05
4: Brightness Enhancement Film 0.05
5: Diffuser 0.03
6: Light Guide 0.30
7: Reflector 0.07
Display Component Total Thickness (clearance) n/a (stack-on-glass)
Display Back Light LED Count (size) 12 (2.86 x 0.80 x 0.48)
Display Cable Width/Pin Pitch/Pin Count 10.49 (socket)/0.35 x 44
Apple iPhone 6s Smartphone
Main Display Detail – Pixel
42
back light: ON
front light: OFF
back light: OFF
front light: ON
back light: ON
front light: ON
Apple iPhone 6s Smartphone
Main Display Detail – Peripheral
43
LCD
(rear side)
418 μm
353 μm
406 μm
323 μm
Apple iPhone 6s Smartphone
12 MP CMOS Camera
44
camera module size: 8.45 mm x 8.31 mm x 5.61 mm
camera module marking: AW52 3842
83E1 18AE
sensor diagonal size: 6.01 mm
sensor manufacturer: unknown
sensor board thickness: 0.88 mm
Apple iPhone 6s Smartphone
iPhone 6s iSight Camera iPhone 6s FaceTime Camera
Resolution (MP) 12 5
Pixel size (µm) 1.22 1.12 (2.24 µm color filter pitch)
Aperture f/2.2
Configuration Stacked back-illuminated CMOS image sensor
Imaging chip supplier Sony
Autofocus On-chip phase-detection
autofocus (PDAF) –
Report Code DEF-1509-803 DEF-1509-804
iSight and FaceTime Camera Overview and Reports
45
1. iSight Die Photo,
Color Filters Removed
2. iSight Stacked CIS
Cross-Section
3. iSight CIS Array Corner
4. iSight Phase Pixels
5. FaceTime CIS
Array Corner
6. FaceTime Pixels
1 2 3
4 5 6
6
5
4
3
2
1
Apple iPhone 6s Smartphone
Essentially a subscription to ChipSelect Image Sensor gives you the insight we get – when we get it – from monitoring
technology as it enters mass production in high volume imaging applications.
Unlimited, 24/7 online access to
package photos, die photos, and
poly die photos
Image Sensor Design Wins
Tracking spreadsheet (monthly) Unlimited, 24/7 online access to
Chipworks’ Device Essentials
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deliverables
Recent Analysis Summary from
Chipworks Senior Technology
Analysts (tri-annually)
Annual onsite seminar delivered
by Chipworks’ Image Sensor
Sector Analyst – an important
opportunity to ask an unlimited
number of questions
Noteworthy Patents Summary
(tri-annually)
Apple iPhone 6s Smartphone
Quartz – PCB #1 Battery Side
47
Measurement unit: millimeters (mm)
FLASH
WLAN
BT
ASM
(F1) FORK-XTAL (Epson)
A533L
1.60 x 1.11 x 0.55
(F2) AT-XTAL (Epson)
2400P
E551K
1.62 x 1.09 x 0.52
(F2) AT-XTAL (KDS)
TH19.2
D527
2.07 x 1.65 x 0.57
Apple iPhone 6s Smartphone
Silicon Audio (Microphone)
48
microphone (Knowles)
5280 KSM2
microphone (Knowles)
5280 KSM2
microphone (Knowles)
5280 KSM2
microphone (GoerTek)
529 GWM1
Apple iPhone 6s Smartphone
Knowles Microphone Design Win
Our teardown of the iPhone 6S was big news
for Knowles showing a total of 3 out of 4
microphone design wins with their 5280
KSM2.
49
Related Microphone Reports Report
Knowles Microphone ASIC die mark 19380 from MacBook Circuit
Analysis (Analysis underway) CAR-1510-903
Infineon E2150C MEMS Microphone from AAC Technologies
SDM0102B-263-M02 Basic Device Overview Report CWR-1410-901
AAC Technologies SDM0102B Omnidirectional MEMS Microphone
Circuit Analysis Reports CAR-1408-902
Knowles S1129 XCO18 Microphone ASIC Circuit Analysis Reports CAR-1403-901
AAC Technologies M1729D Microphone ASIC (from iPhone 5) Full
Analog Circuit Analysis Reports CAR-1301-902
Commentary
Looking forward, we are hoping to find
microphone design wins from
newcomer Vesper MEMS. They are
producing the first piezoelectric MEMS
microphone, it's also waterproof and
dust proof.
Read more about this disruptive design
in an article from tom’s Hardware
Knowles Microphone from MacBook
Apple iPhone 6s Smartphone
Ambient Sensor
50
proximity sensor (mnf. unknown)
2.78 mm x 2.38 mm x 1.28 mm
light sensor (mnf. unknown)
1.85 mm x 1.30 mm x 0.50 mm
Apple iPhone 6s Smartphone
Antenna
51
Antennas built-in, details unknown
WLAN/BT/GPS
cellular
cellular
WLAN/Bluetooth/GPS
Apple iPhone 6s Smartphone
Antenna
52
NFC
Apple iPhone 6s Smartphone
PCB EMI
53
Apple iPhone 6s Smartphone
Touch Panel
54
Surface glass, display, and touch panel thickness 2.04
Adhesion Air gap
Touch panel material Unknown PCB #1
(mnf. unknown)
pin pitch: 0.35
pin # 44
L: 9.50
W: 1.28
H: 0.43
PCB #1 (mnf. unknown)
pin pitch: 0.35
pin # 22
L: 5.68
W: 1.09
H: 0.59
EMI shield film
fingerprint sensor (mnf. unknown)
pin pitch: 0.35
pin # 10
L: 3.19
W: 1.10
H: 0.53
3D touch panel controller
(Analog Devices)
343S00014
1522
3172076.1
display 3D touch
Measurement unit: millimeters (mm)
Apple iPhone 6s Smartphone
Power Source – Battery
55
Apple iPhone 6s Smartphone
Power Source – Charger/Holder
56
Apple iPhone 6s Smartphone
Block Diagram
57
Power Amp
ABB
MDM9635M
(Qualcomm)
Audio
338S00105
(Cirrus Logic)
DBB
MDM9635M
(Qualcomm)
APP
A9 APL0898
(Apple)
WCDMA
WTR3925
(Qualcomm)
GSM
WTR3925
(Qualcomm)
Bluetooth
339S00043
(USI)
Power Management PMD9635
(Qualcomm) 338S00120-A1
(Dialog)
Antenna SW
G54/240/G98
(Murata)
NFC
NXP66V10
(NXP)
Power Amp
Power Amp
Speaker
Headphone
Microphone
LCD/OLED
Camera WLAN
339S00043
(USI)
GPS
WTR3925
(Qualcomm)
Battery
Vibrator
Camera ISP
A9 APL0898
(Apple)
Flash Memory
H23QDG8UD1ACS
(SK Hynix)
Display Controller
A9 APL0898
(Apple)
DRAM
D9SND
(Micron)
T/P Controller
343S00014
(Analog Devices)
LTE
WTR3925
(Qualcomm)
SIM
Sensors
Apple iPhone 6s Smartphone
Technical Note
58
Unique/positive 3D touch X/Y-axis touch sensing by in-cell touch panel. Z-axis touch sensing by intendent sensing sheet.
Negative – –
Other – –
3D touch panel controller (Analog Devices)
343S00014
1522
3172076.1
in-cell sensor
for X/Y-axis external sensor
Z-axis
Apple iPhone 6s Smartphone
Key Component List
59
CATEGORY FUNCTION MARKING PACKAGE SIZE (mm) MNF REMARK
CELLULAR WCDMA TRANSCEIVER WTR3925
TCG411000
AW521
203VV08
3.93 X 3.88 X 0.53 QUALCOMM
CDMA TRANSCEIVER WTR3925
TCG411000
AW521
203VV08
3.93 X 3.88 X 0.53
QUALCOMM
LTE TRANSCEIVER WTR3925
TCG411000
AW521
203VV08
3.93 X 3.88 X 0.53
QUALCOMM
WiMAX TRANSCEIVER – – –
GSM TRANSCEIVER WTR3925
TCG411000
AW521
203VV08
3.93 X 3.88 X 0.53
QUALCOMM
POWER AMPLIFIER AVAGO
AFEM-8030
KM1528
MB065
OOMBO
4.80 X 6.72 X 0.96 AVAGO
POWER AMPLIFIER TriQuint
TQF6405
1526 CHIN
AR4912
6.71 X 4.80 X 0.90 QORVO
POWER AMPLIFIER (LOGO)
77812-19
1307380.1
1530 MX
5.62 X 8.19 X 0.94 SKYWORKS
POWER AMPLIFIER (LOGO)
77357-8
5128.1P
1529 MX
3.01 X 3.00 X 0.79 SKYWORKS
Apple iPhone 6s Smartphone
Key Component List
60
CATEGORY FUNCTION MARKING PACKAGE SIZE (mm) MNF REMARK
WIRELESS
COMM
DIGITAL TV – – –
WLAN USI 150824
339S00043
00557068
8.97 X 11.76 X 0.80 UNIVERSAL SCIENTIFIC
INDUSTRIAL
BLUETOOTH USI 150824
339S00043
00557068
8.97 X 11.76 X 0.80
UNIVERSAL SCIENTIFIC
INDUSTRIAL
GPS WTR3925
TCG411000
AW521
203VV08
3.93 X 3.88 X 0.53
QUALCOMM
RFID – – –
NFC NXP
66V10
36 02
SD528
3.96 X 4.25 X 0.64 NXP
INFRARED
PORT/CTRL
– – –
Apple iPhone 6s Smartphone
Key Component List
61
CATEGORY FUNCTION MARKING PACKAGE SIZE (mm) MNF REMARK
CONTROLLER ANALOG BASEBAND QUALCOMM
MDM9635M
1BD
AP33Y54
E152702
8.26 X 9.02 X 0.65 QUALCOMM
DIGITAL BASEBAND QUALCOMM
MDM9635M
1BD
AP33Y66
E152702
8.26 X 9.02 X 0.65
QUALCOMM
APPLICATION
PROCESSOR
A9
APL0898 339S00113
ON 155 1525
D9SND
N91BFM111Z 1531
14.45 X 14.91 X 0.97 APPLE DRAM POP
IMAGE PROCESSOR A9
APL0898 339S00113
ON 155 1525
D9SND
N91BFM111Z 1531
14.45 X 14.91 X 0.97
APPLE DRAM POP
AUDIO PROCESSOR 338S00105
SAA1EF1525
SG
4.71 X 5.33 X 0.52 CIRRUS LOGIC
USB CONTROLLER UNKNOWN UNKNOWN UNKNOWN
POWER
MANAGEMENT
QUALCOMM
PMD9635
0VV
3R51081
BU51502
19
4.16 X 4.10 X 0.54
POWER
MANAGEMENT
338S00120-A1
1531EHFB
6.76 X 6.80 X 0.56 DIALOG
BATTERY
MANAGEMENT
TI 56AX531
SN2400AB0
3.30 X 2.28 X 0.53 TEXAS
INSTRUMENTS
Apple iPhone 6s Smartphone
Key Component List
62
CATEGORY FUNCTION MARKING PACKAGE SIZE (mm) MNF REMARK
CONTROLLER
DISPLAY
CONTROLLER
A9
APL0898 339S00113
ON 155 1525
D9SND
N91BFM111Z 1531
14.45 X 14.91 X 0.97
APPLE DRAM POP
LED
CONTROLLER/DRIVER
UNKNOWN UNKNOWN UNKNOWN
Apple iPhone 6s Smartphone
Key Component List
63
CATEGORY FUNCTION MARKING PACKAGE SIZE (mm) MNF REMARK
AUDIO MICROPHONE 5280
KSM2
2.53 X 3.35 X 1.04 KNOWLES
MICROPHONE 5280
KSM2
2.53 X 3.37 X 1.08 KNOWLES
MICROPHONE 529
GWM1
2.54 X 3.36 X 1.06 GOERTEK
MICROPHONE 5280
KSM2
2.53 X 3.42 X 1.05 KNOWLES
SPEAKER CTH5355B
3FXG7T4AC
16.71 X 9.49 X 4.05 UNKNOWN
SPEAKER CTH5343H
CCGGLCKAX
20.10 X 36.01 X 4.68 UNKNOWN
MOTOR VIBRATOR 62J53648ECCGRGM15 41.37 X 5.98 X 2.85 UNKNOWN TAPTIC ENGINE
SENSOR ACCELEROMETER MP67B
165AB1
1523
3.00 X 3.06 X 0.72 INVENSENSE
ACCELEROMETER 367
LA
2.01 X 2.00 X 1.03 BOSCH SENSORTEC
DIGITAL-COMPASS UNKNOWN UNKNOWN UNKNOWN
GYROSCOPE MP67B
165AB1
1523
3.00 X 3.06 X 0.72
INVENSENSE
BAROMETER 7HY
YP
3.04 X 2.03 X 0.70 BOSCH SENSORTEC
TOUCH PANEL 343S00014
1522
3172076.1
8.55 X 3.19 X 0.50 ANALOG DEVICES
MEMORY DRAM A9
APL0898 339S00113
ON 155 1525
D9SND
N91BFM111Z 1531
14.45 X 14.91 X 0.97
MICRON APP POP
FLASH MEMORY SK hynix
H23QDG8UD1ACS
BC A1 526A
M18VR986QB
14.76 X 11.86 X 0.86 SK HYNIX
Apple iPhone 6s Smartphone 64
CIRCUIT ANALYSIS Well Organized Schematics Delivered in a Cadence-Like Environment
Chipworks analyzes analog and digital designs including, but not limited to, memories, processors,
controllers, MEMS, wireless, microphones, and antennas. Advanced laboratory capabilities enable us
to reveal full details of circuit layouts at each lithographic layer and conduct full circuit extraction.
PROCESS ANALYSIS Superior Quality Images, Analysis, and Comments
Chipworks has over 20 years of experience scrutinizing CMOS, BiCMOS, BCDMOS, and mixed signal
processes or technologies using the most sophisticated reverse engineering facilities, equipment, and
expertise in the industry.
SYSTEMS ANALYSIS Covering a Wide Range of Electronic Systems in Various Industries, Products, and Devices
We are able to perform the most difficult and demanding types of analysis, including extracting key
information from the most complex and secure chips and embedded memories to support a broad
range of competitive intelligence.
Apple iPhone 6s Smartphone
Apple iPhone 6s Smartphone 66
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Apple iPhone 6s Smartphone 67
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