1

AP 5301 / 8301

Instrumental Methods of Analysis

Course Coordinator: Prof. Paul K. Chu

Electronic mail: paul.chu@cityu.edu.hk

Tel: 34427724 Fax: 27889549

2

• Encyclopedia of Materials Characterization, C. Richard Brundle, Charles A. Evans, Jr., and Shaun Wilson (Editors), Butterworth-Heinemann (1992)

• X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A. Chandler, North Holland (1987)

• Methods of Surface Analysis: Techniques and Applications, J. M. E. Walls (Editor), Cambridge University Press (1990)

• Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and Werner, John Wiley & Sons (1987)

• Surface Analytical Techniques, J. C. Riviere, Oxford University Press (1990)

• Modern Techniques of Surface Science, D. P. Woodruff and T. A. Delchar, Cambridge University Press (1994)

• Analysis of Microelectronic Material Devices, M. Grasserbauer and H. W. Werner (Editors), John Wiley & Sons (1991)

• Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J. Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L. Sawyer, and J. Michael, Kluwer (2003)

Reference Books

3

COURSE OBJECTIVES

• Basic understanding of materials characterization

techniques

• Emphasis on applications

Course Objectives

4

Classification of Techniques

• Microscopy and related techniques• Surface characterization techniques• Elemental / chemical depth profiling techniques• Non-destructive testing

5

• Light Microscopy• Scanning Electron Microscopy (SEM) / Energy

Dispersive X-Ray Spectroscopy (EDS) / Wavelength Dispersive X-Ray Spectroscopy (WDS) / X-ray Diffraction (XRD) / X-Ray Fluorescence (XRF)

• Transmission electron microscopy (TEM) / Scanning Transmission Electron Microscopy (STEM) / Electron Diffraction (ED)

Microscopy and Related Techniques

6

• Auger Electron Spectroscopy (AES)• X-ray Photoelectron Spectroscopy (XPS) or

Electron Spectroscopy for Chemical Analysis (ESCA)

• Scanning Probe Microscopy (SPM) – Scanning Tunneling Microscopy (STM), Atomic Force Microscopy (AFM), …

Surface Characterization Techniques

7

• Auger depth profiling• XPS depth profiling• Secondary Ion Mass Spectrometry (SIMS)

Depth Profiling Techniques

8

• Radiographic and Neutron Radiographic Tests• Electromagnetic & Magnetic Particle Tests• Sonic, Electrical, Mechanical, and Visual Tests• Photoelasticity Test• Liquid Penetrant Tests• Leak Tests• Acoustic Emission Tests

Non-Destructive Testing Techniques

9

Principles of Analytical Techniques

10

11

• Understand via modeling and simulation which parameters can improve product yield

• Systematically identify these parameters within the process

• Control and reduce / eliminate these parameters by identifying their root cause

• Process monitor these parameters to measure the success of contamination control efforts

Product Yield Enhancement

12

• Particles – Optical Microscopy, SEM/EDS, AES, XPS, SPM

• Residues – SEM/EDS, AES, XPS, SIMS• Stains, discoloration, hazes – SPM, SEM, XPS,

AES, SEM/EDS• General surface contamination – XPS, AES,

SEM/EDS, SIMS

Surface Contaminant Identification

13

Haze on Silicon Surface (SPM)

14

TiN Grains (SPM)

15

Imaging of Hard Disk (SPM)

16

Residues on Integrated Circuits (SEM)

17

Integrated Circuit (SEM)

18

Hard Disk Defects (AES)

19

Si Wafer Surface Contamination (XPS)

20

Depth Profiling

21

Gate Oxide Breakdown (SIMS)