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“Mini” Computing: Optimizing Design to Accelerate New Usage ModelsMike Rosenberg – Managing Director, Aleutia

Felix Tao – Lead Design Engineer, Aleutia

Kevin Lew – Customer Engineer, Intel Corporation

Robert Neil – Product Marketing Engineer, Intel Corporation

Roberta Zouain – Desktop Segment Marketing Manager, Intel Corporation

RPCS006

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary and Q&A

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary and Q&A

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4

Multiple OSs

What Makes a Mini PC a Mini PC?

SMALLLess than 3 liters

in volume

POWERFULPerformance scalable up to

Intel® Core™ i7 vPro™ processor

LOCALComputeand store

Mini PC - All the Power Without the Tower

Mini-ITX 5x5 Next Unit ofComputing

Mini Lake ComputeStick

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Mini PC Market Growth

Source: IDC

0

2

4

6

8

10

2013 2014 2015 2016 2017 2018

Millions

Mini PC Ramp

Commercial Consumer

One of the fastest Growing Segment in Desktops

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DESIGN CONSIDERATIONS

Usage Model• Productivity• Consumption• Entertainment

Form Factor• ID Consideration• Power Envelope• Thermal/Mechanical

Features• Technologies• I/O Selection

Cost• Platform Scaling• BOM target• Desired SPP

Scalable Designs for Scalable SolutionsMini-ITX

5x5

Intel® NUC

Mini Lake Ref. Design

Compute Stick

SOLUTIONSDigital ClassroomPoint of SaleHotel LobbyDigital Signage

Bank TellersPC in Conference RoomIndustrial/EmbeddedComputer Labs

Nurse’s StationDigital LibraryHospital Patient Room

Virtual Clothing BoutiqueDigital KiosksNetwork Operations Center

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary and Q&A

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Mini-ITX

Scalable Mini PC Designs

5x5 Intel® NUC Mini LakeReference Design

Compute Stick

170 x 170 mm 147 x 140 mm 102 x 102 mm 102 x 64 mm 30 x 90 mm

Intel® Core™ processorLGA Socket

UDIMM MemoryInt or Ext Graphics

3.5”/2.5”/M.2 DrivesSFX PSU

Intel Core processorLGA Socket

SODIMM MemoryInt GraphicsM.2 DrivesDC Power

Intel Core processorBGA Down

SODIMM MemoryInt GraphicsM.2 DrivesDC Power

Intel® Atom™ processorBGA Down

Memory DownInt GraphicseMMC Down

DC Power

Intel Atom processorBGA Down

Memory DownInt GraphicseMMC Down

DC Power

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Mini-ITX

Scalable Mini PC Designs

5x5 Intel® NUC Mini LakeReference Design

Compute Stick

170 x 170 mm 147 x 140 mm 102 x 102 mm 102 x 64 mm 30 x 90 mm

Intel® Core™ processorLGA Socket

UDIMM MemoryInt or Ext Graphics

3.5”/2.5”/M.2 DrivesSFX PSU

Intel Core processorLGA Socket

SODIMM MemoryInt GraphicsM.2 DrivesDC Power

Intel Core processorBGA Down

SODIMM MemoryInt GraphicsM.2 DrivesDC Power

Intel® Atom™ processorBGA Down

Memory DownInt GraphicseMMC Down

DC Power

Intel Atom processorBGA Down

Memory DownInt GraphicseMMC Down

DC Power

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary and Q&A

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Introducing… 5x5

• Board is 5.5” x 5.8” (140mm x 147mm)

- Smallest socketed board standard

- 29% smaller area than Mini-ITX standard

• Fully Featured

- Supports LGA based CPUs

- Feature rich I/O selection

- 2 channels SODIMM

- 2.5” SATA* or M.2 storage

- Wired & wireless networking options

- Support up to 65W CPU thermal design power

• Fixed length and width board dimensions

• Fixed CPU XY location on motherboard

• Value proposition

- Enables sub-1 liter socketed solution

- Provides Intel® Celeron® to Intel® Core™ i7 processor scalability

- Targeted to support both 35W and 65W TDP CPUs 5x5 measures 140x147 mm at 20,580 mm2

Mini-ITX measures 170x170 mm at 28,900 mm2.

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5x5 System Integration

Standardized Ingredients• Intel® Core™ i3/i5/i7 processors

- LGA socket for greatest flexibility

• Board

- Standardized mounting holes

- Support up to CPU w/65W TDP

• SODIMM Memory

- Dual channel performance

- Small footprint

• M.2 Storage

- Lowest Z-Height

• Chassis+Heatsink

- Complementary pair

System Considerations• Industrial Design

- Venting aesthetics

- System orientation

- Air intake top/bottom/side

• User Experience

- Hot air exhaust away from user

- Acoustics of low RPM fans

• Sub 1 Liter System Volume

- 0.85 liters @ 39mm Z-height

- Minimal heatsink Z-height @ CPU w/35W TDP

- Additional Z-height for 65W TDP and 2.5” drives

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary

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Aleutia – NUC-based FF

Making NUC Fanlessi3- 3217U 17W TDP

I3 4010U 15W TDP

Designed for challenging environments

Lamda(W/mK)

205 400 429

Δ λ - 95% 7%

Price/Kilo

$1.6 $5 $500

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Embracing Copper

i3 4010U 15W TDP @ 74 C (1% throttling)

i3 5010U 15W TDP @ 51 ̊C (0% throttling) Test conditions 22 ̊C

204 g copper mid section

44.5 ̊ C

39 ̊ C

Seek Thermal Camera images

Prime95 Torture Test

23 ̊C CPU decrease

5.5 ̊C Chassis decrease

24% Volume decrease

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Catalyst for Transformation

Uganda Solar Classroom

Computing Anywhere

CAD Workstation

Marine Server

Medical Cart

Remote Monitoring 4K EntertainmentIndustrial Automation

Digital Signage

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary

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Compute Stick Design Considerations

• System performance and BOM

- Active versus passive cooling

- Power limits

- Fan speed control acoustics

• Industrial design

- Materials selection of housing

- End User’s touch & handling areas

Exhausts toward high-touch area

Exhausts away from high-touch area

Air Flow

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Agenda• Mini PC Trends

• Design Challenges & Trade-Offs

- 5x5

- Next Unit of Computing

- Compute Stick

• Summary

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Summary

• Computing continues to expand into new areas and usages

• Mini PC’s provide opportunities for smaller desktop form factors:

- 5x5 scales to smaller footprints using standard ingredients

- Next Unit of Computing enables smaller footprints using Intel® Core™ processors

- Compute Stick adds computing with the smallest footprint

• As systems are designed smaller, skin temperature and air exhaust are key industrial design considerations

Take computing into new areas and usages not possible before

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Additional Sources of Information

• A PDF of this presentation is available from our Technical Session Catalog: www.intel.com/idfsessionsSF. This URL is also printed on the top of Session Agenda Pages in the Pocket Guide.

• Come and see our demos in the Intel Computing Innovation Exhibit located on the 2nd floor concourse

• More web based info:https://www-ssl.intel.com/content/www/us/en/mini-pc/mini-pc-overview.html

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Other Technical Sessions

Session ID Title Day Time Room

RPCS001 Overclocking 6th Generation Intel® Core processors! Tue 11:00 2008

RPCS002 Optimizing Performance and Usability of Thin and Fanless 2 in 1 Systems With Adaptive Performance Wed 11:00 2006

RPCS003 Content Independent Backlight Power Saving Technology for Mobile Devices

Wed 13:15 2008

RPCS004 Form Factor Reference Design: Developing a 2 in 1 Detachable Ultrabook™ System

Wed 14:30 2008

RPCS005 Innovation in Stationary and Portable All-in-One PCs Wed 16:00 2008

RPCS007 2015 platform implementation of USB-C Thu 09:30 2003

RPCS008 “Always Available”, Computing Devices and Applications: Intel® Ready Mode Technology

Thu 10:45 2003

RPCS009 Developer Training on Intel® Active Management Technology Thu 13:00 2003

RPCS010 Unleash Your Creativity: Develop Novel “Always-on” Apps Using the Intel® Integrated Sensor Solution Thu 14:15 2003

= DONE

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© 2015 Intel Corporation.

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Rev. 4/14/15