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ANSYS Workbench enhances electronics design flows with CAD integration and simulation automation
SIwave and Icepak two-way coupling provides electrical and thermal co-design
for PCB design
HFSS one-way coupling with Mechanical for medical device MRI compliance
DesignXplorer integration with Ansoft Designer enables comprehensive design space exploration for a complete system
Thermal-stress analysis of a computer graphics card, temperatures imported to ANSYS
Mechanical from ANSYS Icepak
Workbench CAD Integration for HFSS, Maxwell, and Q3D ExtractorNew
ANSYS Workbench for Electronics Jim DeLap and Steve Scampoli
PCB Board Model
Pad Ball
PCIConnectorPackage 1 Socket
TlineVias Vias
TLines
Package 2PCIBoard
PCIe Gen 3 DOE Channel Simulation
TX
RX
0 0 0 0 0 0 0 0
P2_Pad1_p P2_Pad1_n
P2_Pad2_p2
P2_Pad2_n2
P2_Pad3_n P2_Pad3_p
Pad3_n
Pad3_p
Pad2_p
Pad2_n
Pad1_n
Pad1_p
Ball1_n
Ball1_p
Ball2_n
Ball2_p
Ball3_n
Ball3_p
Pin1
Pin2
Pin3
Pin4
Pin5
Pin6
Pin7
Pin8
Pin9
Pin10
Pin11
Pin12
p1
p3
p5
p7
p9
p11
Die_1n
Die_1p
Die_2n
Die_2p
Die_3n
Die_3p
Pin1
Pin3
Pin5
Pin7
Pin9
Pin11
Pin2
Pin4
Pin6
Pin8
Pin10
Pin12
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
1
2
3
4
5
6
W103
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
Pin1
Pin2
Pin3
Pin4
p1
p3
p5
p7
p9
p11
Die_1n
Die_1p
Die_2n
Die_2p
Die_3n
Die_3p
ID=156
ID=157
ID=158
ID=164
ID=165
1
2
3
4
5
6
W176
1
2
3
4
5
6
W177
Pad3_n
Pad3_p
Pad2_p
Pad2_n
Pad1_n
Pad1_p
Ball1_n
Ball1_p
Ball2_n
Ball2_p
Ball3_n
Ball3_p
ID=187
1
2
3
4
5
6
W190
Multi-Domain Coupling – SIwave and HFSS one-way coupling exchange field data to
simulate the system level EMI/EMC of a PCB mounted in a case
IcePak: Thermal
SIwave as EMI Source
3D HFSS
SIwave Hybrid Field Solver Full PCB/Package S-Parameters Fields
HFSS
Arbitrary 3D FEM Solver Adaptive Meshing Industry Standard Advanced High Performance Computing
Icepak Mechanical
Power Map
Temperature
SIwave Icepak
CATIA
Parameterized HFSS Geometry HFSS MRI Cage
Steady-State and Transient Thermal
Temperature vs. Position
ANSYS DesignModeler for geometry simplification
Icepak: Avionics Case
B Field
Magnetic Forces
Displacements of mesh nodes
Stress Calculation Field Calculation
Force Distribution
Displacements Updated Mesh
Maxwell two-way coupling with Mechanical enables structural displacements to update
the mesh in Magnetostatic simulations
GbX model courtesy of
RF Power Temperature Deformation
HFSS and Mechanical two-way coupling