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©2018 by System Plus Consulting | ams Spectral Sensors: The AS726X Series 1

22, bd Benoni Goullin - Nantes Biotech44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

ams Spectral SensorsAS726X Series from ams’ PortfolioIMAGING report by Stéphane ELISABETHMay 2018 – version 1


Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o ams

o Optical Sensing Market

o Optical Sensing Technology

o ams Multi-Spectral Sensor PortFolio

Physical Analysis 18

o Summary of the Physical Analysis 19

o Package 21

Package View & Dimensions

Package Overview & Opening

Package Cross-Section:

Lenses, Adhesive & plastic Package, PCB Substrate, FOV

o Sensor Die 52

Sensor Die View & Dimensions

Sensor Die marking, Overview & Sensing Cells:

XYZ Sensor, Visible Sensor, NIR Sensor

Sensor Die Delayering & main Blocs

Sensor Die Process

Sensor Die Cross-Section

Sensor Die Process Characteristic

Physical Comparison: ams’ Ambient Ligth Sensor 66

o AS726X vs. Apple’s Custom Version

Die Comparison

Package Comparison

Cost Comparison

Sensor Manufacturing Process 70

o Global Overview

o Sensor Die Front-End Process & Fabrication Unit

o Filter Sensor Die Front-End Process & Fabrication Unit

o LGA Packaging Process & Fabrication unit

o Final Test & Packaging Fabrication unit

Cost Analysis 81

o Summary of the cost analysis 82

o Yields Explanation & Hypotheses 84

o Sensor die 86

Sensor Die Front-End Cost

Sensor Filter Front-End Cost

Sensor Die Probe Test, Thinning & Dicing

Sensor Die Wafer & Die Cost

o LGA Packaged Component 90

LGA Packaging Cost

Back End: Final Test

Component Cost

Estimated Sale Price 94

Feedbacks 98

Company services 100


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Executive Summary

• Offered as three separate devices, the AS726X multispectral sensor series provides three different sensing wavelengths,offering solutions for color matching (i.e. skin tone in the cosmetics industry) and food analysis. All three devices share thesame package (4.5 x 4.7 x 2.5 mm) and configuration.

• The AS726X sensors feature interferometric filters, allowing for a more robust, versatile approach than organic filters. Infact, the AS726 provides three different sensing behaviors in six different cells: true-color sensor, visible light sensor, andpure NIR sensor.

• This report analyzes ams’ complete multi-spectral sensor portfolio, from sensor die to packaging. This report also includesa complete analysis of the package and sensor die, along with a cost analysis and a price estimate for the device.Moreover, it features a comparison with the ams interferometric multispectral sensor currently found in the Apple iPhoneX. Overall, this report covers all of ams’ available technologies in spectral sensing.


Overview / Introduction

Company Profile & Supply Chain o amso Optical Sensingo ams’ Portfolioo Market Share

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

ams Multi-Spectral Sensor PortFolio

AS7261 JENCOLOR® XYZ SensorXYZ true-color calibrated filters with IRSelectable smart interfaces, UART or I²C

AS7262 Visible Range sensorIntegrated nano-optic filters on standard CMOS siliconStandard Sensor Interface for easy programming

AS7263 NIR SensorIntegrated nano-optic filters on standard CMOS siliconStandard Sensor Interface for easy programming




Physical Analysis o Package Overviewo Package Openingo Package Cross-Sectiono Sensor Dieo Sensor Die Cross-Section

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Summary of the Physical Analysis





Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Views & Dimensions

Package Bottom View – Optical View©2018 by System Plus Consulting

Package Side View – Optical View©2018 by System Plus Consulting

Aperture

4.7 mm

4.5

mm

2.5

mm

• Package: LGA 20-pin

• Dimensions: 4.5 x 4.7 x 2.5 mm

• Pin Pitch: 0.6 mm

• Marking:

AS7261

ABUBT

Package Top View – Optical View©2018 by System Plus Consulting





Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Opening





Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Cross-Section





Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Sensor Die – Die View & Dimensions





Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Sensor Die – Die Overview – XYZ Sensor





Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Sensor Die – Die Cross-Section – Epitaxy




Physical Analysis

Physical Comparison o Die Comparisono Package Comparisono Cost Comparison


Cost Analysis


Feedbacks

About System Plus

ams’ Ambient Light Sensor comparison




Physical Analysis

Physical Comparison

Manufacturing Process Flowo Sensor Front-Endo Filter Processo Packaging Process

Cost Analysis


Feedbacks

About System Plus

Filters Sensor Process Flow




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Yield Hypothesiso Sensor Front-End Costo Sensor Back-Endo Sensor Die & Wafer Costo Packaging Costo Component Cost


Feedbacks

About System Plus

Sensor Front-End Cost




Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Yield Hypothesiso Sensor Front-End Costo Sensor Back-Endo Sensor Die & Wafer Costo Packaging Costo Component Cost


Feedbacks

About System Plus

Component Cost




Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Estimated Selling Price

Feedbacks

About System Plus

Multi-Spectral ams AS726X series Estimated Manufacturer Price




Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• ams’ Multi-Spectral Sensor in the Apple iPhone X• ams’s Color Sensor in the Apple iPhone 8• STMicroelectronics’ Near Infrared Camera Sensor in the

Apple iPhone X• STMicroelectronics Time of Flight Proximity Sensor in the

Apple iPhone 7 Plus• MEMS Packaging: Reverse Technology Review

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• 3D Imaging and Sensing 2017• Machine Vision for Industry and Automation 2018

http://www.systemplus.fr/reverse-costing-reports/ams-multi-spectral-sensor-in-the-apple-iphone-x/

http://www.systemplus.fr/reverse-costing-reports/amss-color-sensor-in-the-apple-iphone-8/

http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-near-infrared-camera-sensor-in-the-apple-iphone-x/

http://www.systemplus.fr/reverse-costing-reports/stmicroelectronics-time-of-flight-proximity-sensor-in-the-apple-iphone-7-plus/

http://www.systemplus.fr/reverse-costing-reports/mems-packaging-reverse-technology-review/

http://www.systemplus.fr/reverse-costing-reports/mems-packaging-reverse-technology-review/

https://www.i-micronews.com/category-listing/product/p3d-imaging-and-sensing-2017.html

https://www.i-micronews.com/category-listing/product/machine-vision-for-industry-and-automation-2018.html

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ams Spectral Sensors - Home - System Plus Consulting€¦ · Company Profile 8 o ams o Optical Sensing Market o Optical Sensing Technology o ams Multi-Spectral Sensor PortFolio Physical