ALCT and TMB Status

Martin von der Mey, EMU at CMU, October 2003 1

ALCT and TMB Status

Martin von der MeyMartin von der Mey

University of California Los AngelesUniversity of California Los Angeles

• ALCT production statusALCT production status

• TMB statusTMB status

• TMB radiation testTMB radiation test

• RAT statusRAT status


ALCT384 Boards

Analog section: Analog section: test pulse generator, test pulse generator, AFEB power, AFEB power, ADCs, DACs ADCs, DACs (other side)(other side)

24 Input signal 24 Input signal connectorsconnectors

Delay/ buffer ASICs,Delay/ buffer ASICs,2:1 bus 2:1 bus multiplexors (other multiplexors (other side)side)

80 MHz SCSI outputs80 MHz SCSI outputs(to Trigger Motherboard(to Trigger Motherboard)

Power, computer Power, computer connectorsconnectors Xilinx Mezz. boardXilinx Mezz. board

Spartan Spartan XLXL


Yangheng


ALCT Shipments By Destination (06-Oct-2003)

0

20

40

60

80

100

120

UC-FAST UF-FAST PNPI-FAST IHEP-FAST-384 IHEP-FAST-288 DUBNA-FAST SPARES-ALLTYPES

Number Left

Number Shipped

ALCT ProductionALCT Production


ALCT ProductionALCT Shipments by Type (06-Oct-2003)

0

50

100

150

200

250

ALCT-384 ALCT-672 ALCT-288

Number Left

Number Shipped


ALCT Production

ALCT Deliveries (2003)

0

100

200

300

400

500

12/3

1/02

1/14

/03

1/28

/03

2/11

/03

2/25

/03

3/11

/03

3/25

/03

4/8/

03

4/22

/03

5/6/

03

5/20

/03

6/3/

03

6/17

/03

7/1/

03

7/15

/03

7/29

/03

8/12

/03

8/26

/03

9/9/

03

9/23

/03

10/7

/03

10/2

1/03

Bo

ard

s

ALCT288

ALCT384

ALCT672

Total Boards

# Chambers (468)

Plus 10% spares (516)


ALCT Production Testing

Done.Done.All ALCT base boards All ALCT base boards

repaired. Also spares.repaired. Also spares.Prepare mezz. Cards Prepare mezz. Cards

sparesspares


Problems Encountered in testing at UCLA

• Most frequent problem Most frequent problem • On base boards: On base boards:

• Intermittent problem due to buffer (Clock Intermittent problem due to buffer (Clock fanout). Buffers replacedfanout). Buffers replaced

• Still solder bridges (50%)Still solder bridges (50%)

• Shorts inside the PCB board.Shorts inside the PCB board.

• On mezz. Cards:On mezz. Cards:

• Bad Eproms (replaced)Bad Eproms (replaced)

• Bad ball grid connections between FPGA and Bad ball grid connections between FPGA and PCB board.PCB board.


Production of spare Mezz. Boards

• Want >10 % spares.Want >10 % spares.

• Need 25 XCV600E type and 15 XCV1000E type.Need 25 XCV600E type and 15 XCV1000E type.

• Have 3 good XCV600E and 1 good XVC1000EHave 3 good XCV600E and 1 good XVC1000E

• Have 24 bad XCV600E and 10 bad XCV1000EHave 24 bad XCV600E and 10 bad XCV1000E• Already reballed about 100 mezz. Cards and remounted Already reballed about 100 mezz. Cards and remounted

on same boards (success rate 70%).on same boards (success rate 70%).

• Plan :Plan :• Remove FPGAs from non working boards and put on new Remove FPGAs from non working boards and put on new

mezz. card.mezz. card.

• Buy 5-10 XCV1000EsBuy 5-10 XCV1000Es


Problems Encountered

• Broken AFEB connectors.• Connectors are very fragile

• Shipping companies handle packages roughly

• We recently started packing very carefully

• We found a company that successfully replaces the broken connectors ($30/connector)

• Everybody should handle boards with care


Problems found (FAST)

• In shipping, connector shells got damaged (boxes handled roughly by FedEx)

• Very difficult to repair, found a company to do it

• Bottom line:• First 100 chambers tested at

ISR: 5 broken connector shells, 1 blown fuse, 1 bad channel…

• 1/38400 channels


RAT: Rpc Alct Transition module

• Inputs from ALCT and RPC sources

• Outputs through backplane to TMB.

• The RPC crate locations is now fixed and cabling can be discussed in detail

• The layout is done and submitted for board production.

• We expect to do a data interchange test with RPC in Spring.


RAT2003 LayoutVME Backplane VME Backplane

RP

C c

on

ne

cto

rsR

PC

co

nn

ec

tors

To TMB To TMB

ALCT Input connectorALCT Input connector

Spartan FPGASpartan FPGA


Trigger Motherboard (TMB)

Input Input connectorsconnectorsFrom ALCTFrom ALCT

Main FPGA Main FPGA (on back)(on back)

XILINX XCV1000EXILINX XCV1000E

Mezzanine boardMezzanine board

Input Input connectorsconnectors

From 5 CFEB’sFrom 5 CFEB’s

Generates Cathode LCT trigger with input from CFEB (comparator)Generates Cathode LCT trigger with input from CFEB (comparator)

Matches ALCT and CLCT; sends trigger primitive info via MPC to Matches ALCT and CLCT; sends trigger primitive info via MPC to Lev-1 muon trigger, sends anode and cathode hits to DMB.Lev-1 muon trigger, sends anode and cathode hits to DMB.


New TMB2003A

•New TMB2003A New TMB2003A under testunder test


TMB 2003A Status

4 TMB2003A boards assembled4 TMB2003A boards assembled2 Virtex-II Mezzanine boards assembled (Xilinx 2 Virtex-II Mezzanine boards assembled (Xilinx

XC2V4000)XC2V4000)2 Board (mostly) debugged 2 Board (mostly) debugged Board-test firmware ported from TMB2001 Board-test firmware ported from TMB2001

version.version.Beam-test firmware was modified for radiation Beam-test firmware was modified for radiation

test.test.Radiation test done.Radiation test done.


Changes TMB2001/TMB2003A

• Changes from TMB2001 to TMB2003A• 2 PHOS4 delay ASICs replaced with 3 DataDelay

Devices 3D3444(10 channels with 1-ns steps replaced with 12 channels of 2ns steps)

• Power supply regulators replaced with OSU-approved rad tolerant devices

• New signals for XC2V4000 FPGA• Virtex E mezz. Card replaced by Virtex II for faster speed• New RPC signals to the RAT2003 transition module• New voltage regulator for RAT2003 FPGA core (+1.8V)• New signals to/from DMB. Accommodate backplane

changes.• New power plane layout• Front-panel LEDs are now socketed, for faster assembly


Beam Test of TMB 2001

See Jay’s talk


TMB 2003A Hardware

What works: JTAG chain sees Mezzanine FPGA + 4 PROMs, + 2 user PROMs

Boot register passes walking 1Address register passes walking 1JTAG load command works (didn’t on TMB2001)Front panel cylon display runsVME registers read back ID, slot address, etcADC reads back voltages and currents

What doesn’t work:Some tri-state buffer outputs clamp to ~1V instead of pulling to 3.3VTest code can drive out +3.3V....it just won’t tri-stateTried Foundation and ISE compilers


TMB2003A

Board Test FirmwareAssembled 2nd TMB2003FPGA failed to load from EPROMs....fixed....bad solder on mez

ICDelay ICs 3D3444 now working...firmware fixTrying to run full-auto tests

Passes: ID register (includes VME slot address readback)VME data walking 1VME address walking 1Hard reset from VMEUser PROM JTAG ID codesUser PROM data busADC voltage & current

Fails: Digital serial numbers (both TMB and mez)SMB temperature ICAll Loop-backs


TMB Firmware

Firmware tested in 3 beam tests No big problems found Found and fixed problems with “Winner bits” New I/Os added (RPC,DMB) Added global clocks Replaced PHOS4 logic with 3D3444 (State

machine clocks data at 20MHz instead of 625 kHz)

Radiation test and beam test firmware ported to Virtex II.


New radiation Test


TMB2003A Test

Radiation TestNew state machine fires internal CLCT pattern injectorInjects 1 muon: 6 hits, non-bendingTrigger rate: 100KHz or ~10HzIncrements CFEB number each triggerChecks for correct CLCT dataChecks for any CLCT data between triggers (spurious muon)Check power-monitor IC for +5V,+3.3V,+1.5V, +1.8V errorsFlashes “running” LED at constant rate

Test board:

Connects to DMB TTL backplane driversBiColor LEDs display test resultsReset button forces FPGA reload (uses power-up IC on TMB)


Old ALCT radiation results Xilinx vs Altera

• Radiation results shows small improvements to before…

• Mean lies at 65.24 Rad compared to 59.2 Rad before…

• The main improvement (factor 5) comes due to combination of 5 chips

• (1 concentrator and 4 LCT chips into 1).


Radiation Test results

• Irradiated XC2V4000 Xilinx FPGA

• New radiation test gives 141 Rad for proton beam. Compared to 65 Rad before. (~2.5 better)

• SEU proton fluence 79.8*10 7

cm-2 (M.Huhtinen (1-4)*10 10 cm-2 for 10 LHC years)

• Also tested 6 GTLP chips up

to 5 kRads no problems.


Conclusions

• ALCT production in excellent shape ALCT production in excellent shape and mainly done. Doing spares now.and mainly done. Doing spares now.

• TMB firmware in good shape. Tested TMB firmware in good shape. Tested several times. Improvements on the several times. Improvements on the way.way.

• Received and testing TMB 2003A.Received and testing TMB 2003A.

• Done TMB radiation test. Excellent.Done TMB radiation test. Excellent.

• RAT2003 layout finished.RAT2003 layout finished.

Documents

ALCT and TMB Status