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Advanced wavelength dispersive XRF analysis
2830 ZT WAFER ANALYZER
Non-contact determination of layer thickness and composition
The Analytical X-ray Company
2830 ZT
Supporting the semiconductor and data storage industry – now and in the future
Semiconductor and data storage technology has advanced rapidly over recent years, and the rate of change continues to gather momentum. This places considerable pressure on the metrology techniques used to control production processes - instrumentation must keep pace with developments and meet ever more rigorous demands.
Deposited thin films and multi-layers continue to decrease in thickness while increasing in complexity. As new technologies emerge at an escalating rate, yield improvement (during process ramp up) must evolve accordingly. Flexible and cost-effective process monitoring has become increasingly critical to obtain optimal process conditions and maximum yield.
X-ray fluorescence (XRF) spectroscopy meets the key requirements of semiconductor and hard disk manufacturers. The technique is inherently suited to thin film analysis, offering exceptional precision and sensitivity for the simultaneous determination of layer thickness and composition. Moreover, XRF is compatible with a broad range of applications, facilitates straightforward stack analysis and is synonymous with high uptime and low running costs.
The 2830 ZT is designed for maximum uptime and capability. It features the latest X-ray technology, including:
•Zetatechnology,eliminatingX-raytube aging, greatly enhancing operational efficiency
•4kWSST-mAXtubeforoperationat 160 mA current to give the highest sensitivities and lowest detection limits
•FPMultisoftwareallowingsimultaneous analysis of film thickness and composition of stacks up to 16 layers
2830 ZT
Benefits
Ultimate capability for measuring film thicknessand composition
The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) Wafer Analyzer is the successor to PANalytical’s highly acclaimed PW2830. Designed specifically for the industry, it enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
The2830ZTWaferAnalyzerisequippedwithPANalytical’sadvanced4kWSST-mAX X-ray tube, featuring groundbreaking ZETA technology which eliminates
the effects of X-ray tube aging – by far the largest contributor to instrument drift. As a result, the 2830 ZT attains the highest levels of productivity and sensitivity,withexcellentlightelementperformance.What’smore,thankstoZETA technology, the 2830 ZT maintains these qualities throughout its entire lifetime.
2830 ZT application examples:
• Dielectrics: BPSG, PSG, BSG, ASG
• Dopedpolysilicon
• Barrierfilmsandstacks: Ta, TaN, WCxNy, TiN, Si3N4
• Silicides/salicides: TiSix, CoSix, WSix, NiSix
• Metallizationfilmsandstacks: Cu, AlCu, Ti, W, Au, Pt, AuGe, Ag, Sn, etc.
• Low-kdielectrics:FSG, SiOF
• High-kdielectrics: HfO2, HfAlOx, Ta2O5, etc.
• TMRandGMRrelatedfilmsand stacks: CoFe(B), AlOx, Ru, NiFe, IrMn, CrPtMn, etc.
• PRAMandFeRAMfilms: PZT, SBT, BLT, GeSbTe
• SAWandBAWfilmsandstacks: Al, Cu, AlCu, Ti, Ta, Pt
• SiGe
Unrivalled productivity• Continuouscapabilityandspeed• Maximizeduptime• Superiorlightelementcapability
Fast and cost-effective multi-layer analysis• PowerfulFundamentalParameter
software• Analysisofstacksupto16layers• Simultaneousmeasurementofup
to24elements• Intuitiveoperation
Seamless fab integration• Efficient,compactsystemdesign• Frommanualtofullyautomated
wafer loading • Compliancetoallrelevant
standards
A complete solution• Excellenttoolmatching• Completesupport
2830 ZT
Unrivalled productivity
SST-mAXfeaturesgroundbreakingZETAtechnologywhicheliminatestheeffectsofX-raytubeaging.‘Newtube’performanceismaintainedthroughoutthetube’slifetime. Together with high sensitivity, ZETA technology ensures that rapid analysis and short measurement times are maintained across the lifetime of the tube. ZETA technology strongly reduces the need for drift correction and recalibration which increases productivity and uptime of the instrument.
Continuous capability and speed
Maximized uptime
ConventionalX-raytubessuffertungsten evaporation, which causes depositsontheinsideofthetube’sberyllium window. Instrumentation using such tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements. ImplementationoftheSST-mAXinthe 2830 ZT solves this drift problem, therebymaximizinguptimeandmaintaining instrument precision over time.
50%0 2000 4000 6000 8000 10000 12000
60%
70%
80%
90%
100%
110%
Rh
L-a
lph
a in
ten
sity
Hours
SST-mAX
Typical XRFend-windowtube
Stability of SST-mAX compared to a typical end-window tube
Zeta Technology
ZETA Technology
Unrivalled productivity
Superior light element performance
Consistent and stable measurement results
Arangeofcriticalfeaturesmaximizereproducibilityandminimizemeasurement times. For example, the laser-assisted wafer height positioning system guarantees consistent and stable measurement results. This feature also makes it possible for 2830ZTtoanalyzefilmsonalargerange of substrate materials in additiontoSiwafers,includingpiezo-andpyroelectric,glassandquartzsubstrates.
21
Sc44.96
4.0880.395
4.4600.400
THE PERIODIC TABLE OF THE ELEMENTS - WDXRF
R2O/RH
IA RO/RH2
IIA R2O3
IIIB RO2
IVB R2O5
VB RO3
VIB R2O7
VIIB VIII R2O
IB RO
IIB R2O3
IIIA RO2/RH4
IVA R2O5/RH3
VA R2O7/RH
VIIA
LA
1
2
3
4
5
6
7
1
2
3
4
5
6
RO3/RH2
VIA
11
Na22.990
1.041 1.067
55
Cs132.905
30.5814.286
34.9814.619
3
Li6.941
1
H1.008
19
K39.098
3.312 3.589
37
Rb85.47
13.3731.694
14.9591.752
87
Fr(223)
85.11012.029
97.46014.768
56
Ba137.33
32.0624.465
36.3724.827
88
Ra226.02
87.41912.338
100.1115.233
12
Mg24.31
1.253 1.302
20
Ca40.08
3.6900.341
4.0120.345
38
Sr87.62
14.1401.806
15.8331.871
21
Sc44.96
4.0880.395
4.4600.400
39
Y88.906
14.9311.922
16.7351.995
22
Ti47.90
4.5080.452
4.9310.458
40
Zr91.22
15.7442.042
17.6652.124
23
V50.94
4.9490.511
5.4260.519
41
Nb92.91
16.5812.166
18.6192.257
24
Cr52.00
5.4110.573
5.9460.583
42
Mo95.94
17.4412.293
19.6052.394
25
Mn54.94
5.8940.637
6.4890.649
26
Fe55.85
6.3980.705
7.0570.718
27
Co58.93
6.9240.776
7.6480.791
28
Ni58.71
7.4710.851
8.2630.869
29
Cu63.55
8.0400.930
8.9040.950
30
Zn65.37
8.6301.012
9.5701.043
31
Ga69.74
9.2411.098
10.2631.125
32
Ge72.59
9.8741.188
10.9801.218
33
As74.92
10.5301.282
11.7241.317
34
Se78.96
11.2071.379
12.4941.419
35
Br79.904
11.9071.480
13.2891.526
43
Tc98.91
18.3252.424
20.6152.536
2
He4.003
10
Ne20.179
0.848
18
Ar39.948
2.957 3.190
36
Kr83.80
12.6311.586
14.1101.636
54
Xe131.30
29.6664.109
33.619–
86
Rn(222)
82.84311.725
94.85014.313
72
Hf178.49
55.3827.898
63.2229.021
LA
89
Ac(227)
89.77312.650
102.8315.710
93
Np237.05
99.40713.942
113.7217.747
94
Pu(239)
101.8614.276
116.9418.291
95
Am(243)
104.4314.615
120.3518.849
96
Cm(247)
107.1414.953
122.7319.399
97
Bk(247)
109.9915.304
126.4919.961
98
Cf(251)
113.0015.652
127.7920.557
99
Es(254) 100
Fm(257) 101
Md(256) 102
No(254) 103
Lr(257)
13
Al26.98
1.486 1.557
14
Si28.09
1.739 1.836
15
P30.974
2.013 2.139
16
S32.064
2.307 2.464
17
Cl35.453
2.621 2.815
9
F19.000
0.677
8
O16.000
0.525
7
N14.007
0.392
6
C12.011
0.277
5
B10.81
0.183
4
Be9.012
0.109
0
44
Ru101.1
19.2332.558
21.6532.683
45
Rh102.905
20.1652.696
22.7202.834
46
Pd106.4
21.1212.838
23.8152.990
47
Ag107.87
22.1012.984
24.9383.150
48
Cd112.41
23.1063.133
26.0913.316
49
In114.82
24.1363.286
27.2713.487
50
Sn118.69
25.1913.443
28.4813.662
51
Sb121.75
26.2713.604
29.7213.843
52
Te127.60
27.3773.769
30.9904.029
53
I126.90
28.5083.937
32.2894.220
73
Ta180.95
57.0988.145
65.2129.342
74
W183.85
58.8568.396
67.2339.671
75
Re186.2
60.6488.651
69.29810.008
76
Os190.2
62.4778.910
71.40110.354
77
Ir192.2
64.3399.174
73.54810.706
78
Pt195.09
66.2419.441
75.73511.069
79
Au196.97
68.1779.712
77.97111.440
80
Hg200.59
70.1549.987
80.24011.821
81
Tl204.37
72.16710.267
82.56212.211
82
Pb207.19
74.22110.550
84.92212.612
83
Bi208.98
76.31510.837
87.32813.021
84
Po(209)
78.45211.129
89.78113.445
85
At(210)
80.62411.425
92.28713.874
90
Th232.04
92.17412.967
105.5916.199
91
Pa231.04
94.62713.288
108.4116.699
92
U238.03
97.13113.612
111.2817.217
57
La138.91
33.2994.650
37.7955.041
58
Ce140.12
34.5664.839
39.2515.261
59
Pr140.91
35.8605.033
40.7415.488
60
Nd144.24
37.1825.229
45.2645.721
61
Pm(147)
38.5325.432
43.8185.960
62
Sm150.35
39.9115.635
45.4056.204
63
Eu151.96
41.3205.845
47.0306.455
64
Gd157.25
42.7576.056
48.6886.712
65
Tb158.92
44.2666.272
50.3746.977
66
Dy162.50
45.7246.494
52.1107.246
67
Ho164.93
47.2536.719
53.8687.524
68
Er167.26
48.8136.947
55.6727.809
69
Tm168.93
50.4067.179
57.5068.100
70
Yb173.04
52.0307.414
59.3568.400
71
Lu174.97
53.6877.654
61.2728.708
Difficult to measure with X-rays
Measured usingK-lines
Measured usingL-lines
Z
Z
Z
11
Na22.990
Sodium
1.041 1.067
12
Mg24.31
Magnesium
1.253 1.302
9
F19.000
Fluorine
0.677
8
O16.000
Oxygen
0.525
7
N14.007
Nitrogen
0.392
6
C12.011
Carbon
0.277
5
B10.81
Boron
0.183
Thekeyfeaturestomaximizingsensitvity and stability of 2830 ZT for light elements include:
• 4kWoutputSST-mAX,operatingatahigh current of 160 mA
• Dedicatedhighperformancechannelsfor light elements in the range from boron to magnesium
• Dry(oil-free)pumpsmaintainingaclean,sub-Pascalvacuumwithinthemeasurement chamber
2830 ZT
Fast and cost-effective multi-layer analysis
Powerful Fundamental Parameter analysis
PANalytical’sFundamentalParameter(FP)softwarepackage,FPMulti,isfullyintegratedintotheSuperQthinfilmplatform of the 2830 ZT. It enables the direct calculation of chemical composition and thickness of layered materialsandisidealforanalyzingboth single layer thin films and complex multi-layer film stacks.
Analysis of stacks up to 16 layersFPmodelingallowsreliablethinfilmanalysis.PANalytical’sbest-in-classalgorithms model X-ray fluorescent behavior of the elements to calculate precise layer composition and thickness. This reduces the time and cost involved in setting up thin film and multi-layer analyses.Systemcalibrationrequiresonly a minimum number of reference samplestoanalyzecomplexstacksofupto 16 layers.
Simultaneous measurement of up to 24 elementsThe 2830 ZT can be fitted with up to 24fixedmeasurementchannels,fromboron onwards. These high performance channels allow for multi-layer analysis according to specific user requirements. Furthermore, as new channels can be added at any time, the 2830 ZT offers powerful flexibility, allowing the user to keep up with the latest technologies.
Keep track of your stack
FP Multi allows analysis of complex stacks in an easy and straightforward manner. Stacks can be simulated at the touch of a button, allowing the user to determine which lines should be used in the analysis.
CoNiFeTaCoFeTaCuNiFe
Fast and cost-effective multi-layer analysis
PANalytical’s SuperQ software makes it simple to set up spot patterns for uniformity measurement over the full surface area of wafers up to 300 mm.
Measurement programs are quickly selected via clearly labeled “speed buttons” on the built-in touch screen monitor.
Intuitive operation
The2830ZTutilizesPANalytical’sprovenSuperQThinFilmsoftwareplatform. This powerful, easy-to-use thin film data collection and analysis package is renowned for its highly intuitive interface and menu. It enables simple setup of standard measurement protocolsandindividuallycustomizedprograms. User-assigned function keys orlargeon-screen‘speedbuttons’permit rapid initiation of measurement for single wafers or complete batches.
Uniformity patterns and wafer maps are easily defined with user-friendly spotlocationselection.Click-and-dragcommands allow straightforward comparison with international wafer configuration standards.
Seamless fab integration
Efficient, compact system design Withafootprintcomparabletothatof200mmXRFwaferanalyzers,the2830 ZT occupies a minimum amount of valuable cleanroom space. A very narrow face print contributes further to space savings. The 2830 ZT can even be flush-mounted into a cleanroom wall, leaving only the loading port panel apparent within the workspace.
In accordance with normal fab procedures, the 2830 ZT measures wafers in a surface-up orientation. A transferrobotandnotch/flatalignmentunit position samples on the x-y wafer stage. Vacuum pumps can be installed remotely for convenient maintenance.
The system integrates readily into plant-wide process control and quality assurancenetworks,usingSECS/GEMprotocols to communicate with the host computer.
From manual wafer loading to full automation2830 ZT accepts 100 mm to 300 mm wafers, and smaller wafers or fragments can be measured using adaptors. To ensure integration into any fabrication environment, various wafer-handling options are available:
• Manualloading• Opencassetteloadingwiththerobot
in the cleanroom atmosphere• SingleordualFOUPloadingwith
robotandalignmentunitinanISOclass 1 mini-environment
• SingleordualSMIFloadingwithrobotandalignmentunitinanISOclass 1 mini-environment
• AnycombinationofSMIF,FOUPandopen cassette loading
SingleloadportFOUPandSMIFsystems can be equipped with an internal reference position which can harbor a cassette with frequently used reference wafers. The reference position accommodatesthreewafersizesinarange of 100 to 300 mm.
2830 ZT
Seamless fab integration
Compliance to all relevant standardsPANalytical’sPW2830wasthefirstX-ray metrology system to comply with all 300 mm standards. This led to its rapid establishment as the system of choice for automated waferanalysis.Now,the2830ZTbuilds on this reputation, and is designed to accommodate all relevant industry norms and standards.
Importantly, the 2830 ZT is fullycompliantwithSECS/GEM(SemiconductorEquipmentCommunicationStandards/GenericEquipmentModel),GEM300,andAMHS(AutomaticMaterialHandlingSystem).
Completing the solution
Metrology accuracy, reproducibility and repeatability are essential for accurate resultswithinafab.However,manyorganizationsoperatefabsatmultiplelocations.Withdifferentfabsmakingthe same product, consistency of results is essential. 2830 ZT can be placed at different fab locations and matched to a‘goldstandard’referencetoolusingauniversal set of reference wafers.
This provides easy multi-production line quality control of thin film deposition and other processes. Excellent tool matching is the result of the high quality optical components, in combination with robust software algorithms.
2830 ZT
Excellent tool matching
Completing the solution
PANalyticalunderstandstheimportanceof continuity in production control. The 2830 ZT is based on proven concepts, establishedthroughoutthecompany’sXRF thin film metrology product line.
However,technologyisonlypartofa successful process control solution. Tomakesurethatusersmaximizethebenefitofthe2830ZT,PANalyticalprovides excellent technical, software and application support.
2830 ZT users can take advantage of a large knowledge base when creating new applications, training new users, or solving technical issues.
PANalyticaltakesgreatprideinofferingoutstanding customer service, and values the trust users repeatedly place intheorganization.Arangeofservicecontracts,including24/7coverageinmost areas, is available, delivered by the largest X-ray support and service force in the market.
Complete support
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PANalytical B.V.Lelyweg1,7602EAAlmeloP.O.Box13,7600AAAlmeloTheNetherlandsT +31(0)546534444F +31(0)[email protected]
Regional sales offices
AmericasT +15086471100F +15086471115
Europe, Middle East, AfricaT +31(0)546834444F +31(0)546834499
AsiaPacificT +6567412868F +6567412166
Global and near
PANalytical PANalyticalistheworld’sleadingsupplierofanalyticalinstrumentationandsoftware for X-ray diffraction (XRD) and X-ray fluorescence spectrometry (XRF), withmorethanhalfacenturyofexperience.Thematerialscharacterizationequipment is used for scientific research and development, for industrial process control applications and for semiconductor metrology. PANalytical,foundedin1948aspartofPhilips,employsaround1000peopleworldwide.ItsheadquartersareinAlmelo,theNetherlands.FullyequippedapplicationlaboratoriesareestablishedinJapan,China,theUSA,andtheNetherlands.PANalytical’sresearchactivitiesarebasedinAlmelo(NL)andonthecampusoftheUniversityofSussexinBrighton(UK).SupplyandcompetencecentersarelocatedontwositesintheNetherlands:Almelo(developmentandproduction of X-ray instruments) and Eindhoven (development and production of X-ray tubes). A sales and service network in more than 60 countries ensures unrivalled levels of customer support. ThecompanyiscertifiedinaccordancewithISO9001:2000andISO14001.
The product portfolio includes a broad range of XRD and XRF systems and software widelyusedfortheanalysisandmaterialscharacterizationofproductssuchascement, metals and steel, nanomaterials, plastics, polymers and petrochemicals, industrial minerals, glass, catalysts, semiconductors, thin films and advanced materials, pharmaceutical solids, recycled materials and environmental samples.
Visit our website at www.panalytical.com for more information about our activities.
PANalyticalispartofSpectrisplc,theprecisioninstrumentationandcontrolscompany