Advanced RF SiP for Cellphones - Home - System Plus ... Front-End Module & RF Components Comparison Analysis 109 o Area Repartition, Footprint, Silicon repartition, Substrate, Lid

©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Advanced RF SiP for CellphonesReverse Costing Review: Reverse Engineering & Cost Estimations

RF report by Stéphane ELISABETHNovember 2017

mailto:[email protected]


http://www.systemplus.fr/



Table of ContentsOverview / Introduction 3

o Executive Summary

o Methodology

Company Profile 6

o Skyworks Solution, Murata, Qorvo, TDK-Epcos, Broadcom

o Major Customers

o Smartphones Teardown :

o Huawei P10

o Samsung Galaxy S8

o Apple iPhone 8 Plus

o Components Summary

Market Analysis 38

o Supported Band History

o Market Forecast

o Supply Chain

Physical Analysis 42

o Physical Analysis Methodology

o Skyworks Solution 44

o Front-End Module & RF Components

Package View & Dimensions

Package Opening

Component Repartition

Package Cross-Section:

Substrate, Dimensions, Lid, Wire Bonding

Package Summary

o Murata 57


o TDK-Epcos 70


o Qorvo 83


o Broadcom 96


Comparison Analysis 109

o Area Repartition, Footprint, Silicon repartition, Substrate, Lid

Manufacturing Process 115

o Synthesis of the main parts

o Process & Fabrication Unit

o Substrate Process Flow

Cost Analysis 124

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses 126

o Dies Cost Estimation 128

Filter Die Cost

Active Die Cost

o RF SiP Packaging 131

RF SiP Packaging Cost

RF SiP Packaging Cost per steps

Packaging Component Cost

o Component 136

Component Cost

Estimated Selling Price 138

Company services 144


Overview / Introductiono Executive Summaryo Methodology

Company Profile

Smartphone Teardown

Market Analysis

Skyworks SiP Physical Analysis

Murata SiP Physical Analysis

TDK-Epcos SiP Physical Analysis

Qorvo SiP Physical Analysis

Broadcom SiP Physical Analysis

Comparison Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• In addition to Yole Développement RF SiP Packaging 2017 Market report, this comparative technologyreview has been conducted to provide insight on structure, technology and costing for RF SiP packaging onFront-End Modules in Smartphones. The report includes the study of at least 8 Front-End Modules found inthree high-end flagships smartphones (Huawei P10 Plus, Samsung Galaxy S8, Apple iPhone 8 Plus) wherefive major suppliers (Skyworks Solution, Murata, TDK-Epcos, Qorvo and Broadcom) are sharing the market.

• After a teardown of three high-end smartphones, the main RF modules have been extracted and analyzedin detail. Sizes and technologies are studied to provide a large panel of OEM’s technical and economicalchoices and an overview of the packaging market. Major players remain Broadcom/Avago, Qorvo,Skyworks Solution, Murata, Epcos/TDK and have been analyzed.

• The report includes a description of each component, major data (type of substrate, silicon proportion,Line/Space, …), comparisons for all front-end modules under analyses and a manufacturing cost estimationof the System-in-Package. Wifi and Bluetooth modules are not covered in this report.

• Note: Wifi and Bluetooth Module analyses are not included in this report


Overview / Introduction

Company Profileo Skyworks Solutiono Muratao TDK-Epcoso Qorvoo Broadcom

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks 2017 Major Customers



Company Profile

Smartphone Teardown

Market Analysiso Market History & Forecast






Comparison Analysis


Cost Analysis


About System Plus

RF Components Market Forecast

Courtesy of Yole Development



Company Profile

Smartphone Teardown

Market Analysis

Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary





Comparison Analysis


Cost Analysis


About System Plus

Skyworks RF FEM SiP Components Summary



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Packages View & Dimensions

Package Top View Package Side ViewPackage Bottom View



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Opening



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Components Repartition



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section – Dimensions



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section – Dimensions



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section – Metal Lid



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section – PCB



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Cross-Section – Wire Bonding



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Plus

Skyworks SkyOne® Solution – Package Summary



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysiso Area Repartitiono Footprint Comparisono Silicon Repartitiono Substrate Comparisono Protective Layers


Cost Analysis


About System Plus

Package Comparison – Footprint statistics



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis

Manufacturing Process Flowo Global Overviewo Packaging Processo Substrate Process

Cost Analysis


About System Plus

Global Overview



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis

Manufacturing Process Flowo Global Overviewo Packaging Processo Substrate Process

Cost Analysis


About System Plus

Skyworks Packaging Process



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso Die Costo Packaging & BE Costo Component Cost


About System Plus

RF SiP Packaging Cost


COMPANYSERVICES



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Pluso Related Reportso Company serviceso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings



Company Profile

Smartphone Teardown

Market Analysis






Comparison Analysis


Cost Analysis


About System Pluso Related Reportso Company serviceso Feedbackso Contacto Legal

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Advanced RF SiP for Cellphones - Home - System Plus ... Front-End Module & RF Components Comparison Analysis 109 o Area Repartition, Footprint, Silicon repartition, Substrate, Lid