Advanced From Technologies to Markets Packaging Quarterly

© 2021

From Technologies to Markets

Q1 2021

Advanced Packaging

Quarterly Market Monitor

Sample

2

• Stefan CHITORAGA

• AnalystSemiconductor Packaging

› Experience

7+ years in electronics package development and design

› At Yole

Packaging, assembly and substrates

› Education

M.Sc of Engineering in Electroncis and Computer

Science

SEMICONDUCTOR PACKAGING TEAM

Santosh KUMAR

Principal Analyst

Semiconductor Packaging

› Experience

15+ years in semiconductor industry

› At Yole

Package, assembly and substrates and Manufacturing

› Education

M.Sc in Materials Science and Engineering, Electronics

Packaging

Favier SHOO

Team Lead Analyst

Semiconductor Packaging

› Experience

8+ years in technology, packaging and manufacturing

› At Yole


› Education

Bachelor in Materials Engineering (Hons)

Minor in Entrepreneurship

Vaibhav TRIVEDI

Senior AnalystSemiconductor Packaging

› Experience

12+ in electronics business

› At Yole


› Education

M.Sc in Materials Science and Engineering

© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021

http://www.yole.fr/

© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 3

ADVANCED PACKAGING MONITOR - EVOLUTION

Advanced Packaging Monitor

Fan out Package Monitor (Wafer & Panel Level)

WLCSP / Fan-In Package Monitor

2.5D/3D Stacked Package

FCBGA Package

FCCSP Package

System In Package (SiP)

Module I

Module III

Module IV

2019 Q4 released

2020 Q1 released

2021 Q1

Publication Date

Module II

2020 Q3 released

2020 Q4 released

Module V

Module VI 2021 Q3

http://www.yole.fr/


ADVANCED PACKAGING MONITOR SCOPE

The main objectives of this monitor are the following:

• Near-term market dynamics on quarterly basis

• Long-term market dynamics for 2019-2025

• CapEx & Capacity per major players

• Market share of major OSAT/Foundry players

• Package ASP per given market/platform

• Device/application adoption for advanced packaging technologies

The Fan-Out, WLCSP / Fan-In, 3D Stack (NEW), FCBGA (NEW), FCBGA, and FCCSP (NEW) markets are studied from the following angles:

• Supply and demand

• End-user applications and key growth drivers/areas

• Process technologies

• Device application Mix

• Production, CapEx, Revenue and Package ASP

• **WLCSP components used in RF-SiP packages are NOT included in the WLCSP category – This will be provided in future update to the monitor

• 3D stacked package include Logic & DRAM wafers (NEW): 3D Stacked package includes HBM, 3DS DRAM, 3D NAND, 3D SoC/SoIC, 3D stacked CMOS Image Sensors

• FC package family will be added in future update of the Advanced Packaging Monitor

• Revenue & ASP reflect packaging service only. Final Test is NOT included.

http://www.yole.fr/

5

ADVANCED PACKAGING MONITOR METHODOLOGY

Mobile/Consumer etc. Markets

End systems/ Phones/

Wearables

Device such as PMIC/ SoC etc.

Package Type

# of Die, components,

Package Construction

# of Wafers

OSAT/Foundry Suppliers

Supplier market share per package

Top-down approach

Bottom-up approach

MONITOR

Consumer Automotive

Medical

IndustrialTelecom &

Infrastructure

Mobile


http://www.yole.fr/

http://www.yole.fr/


KEY TERMS & DEFINITIONS AS USED IN THIS MONITOR

FCCSP:

• Defined as a package that is processed as strip based typically ranging from 5 x 5 to 13 x 13

• Typical BOM (Bill of Materials) include substrate, mold, solder balls, and in some cases underfill

• FCCSP substrate typically are 2L or 4L substrate and with some ETS based

• FCCSP revenue is defined as services that include wafer backgrinding, die singulation and fc assembly on the substrate and also include bill of materials such as substrate and assembly materials such as mold.

• FCCSP wafer bumping is separately reported in terms of wafer volume & revenue & supplier market share

FCBGA:

• Defined as a singulated package (Not Strip based processing for assembly)

• Typically larger than 15 x 15 and can go as high as 60 x 60 in high end applications

• Typically includes Lid and TIM 1 (Thermal Interface Material) for cooling purposes

• BOM (Bill of Materials) also include HDI (High Density Interconnect) substrate

• FCBGA revenue is defined as die prep that includes backgrinding, die singulation and fc assembly on the substrate

• FCBGA wafer bumping is separately reported in terms of wafer volume & revenue & supplier market share

WLP:

• Defined as a wafer level package that is processed based on wafer level manufacturing process

• WLP package can have the same package size as the starting die dimensions such as in the case of WLCSP

• WLP package can have increased package size than the die size as seen in many FO (Fan-out) packages.

• WLP package BOM does NOT include any substrate.

• However, WLP BOM can include assembly materials such as backside lamination, mold compound in the case of fan-out package

http://www.yole.fr/

TABLE OF CONTENTS▪ KEY METRICS AT A GLANCE 12

▪ Revenue (WLP, WLCSP, FO, 3D, FCBGA, FCCSP)

▪ Shipments (WLP, WLCSP, FO, 3D, FCBGA, FCCSP)

▪ Market Share (WLP, WLCSP, FO, 3D, FCBGA, FCCSP)

▪ Summary of WLCSP, FOWLP & FO-PLP, 3D, FCBGA, FCCSP

market dynamics

▪ ANALYST COMMENTARY & MARKET DYNAMICS 27

▪ SYSTEM DEMAND 36

▪ WLCSP Package demand

▪ Fo package demand

▪ 3d STACKED PACKAGE DEMAND

▪ Fcbga package demand (new)

▪ FCCSP PACKAGE DEMAND (NEW)

▪ FCCSP PKG MARKET DYNAMICS 45

▪ FCCSP Package Market dynamics – summary

▪ Revenue – historical & forecast

▪ Shipments – historical & forecast

▪ Supplier Market shares (OSAT/FOUNDRY/IDM)/

▪ Long term/Near term dynamics & FC CapEx

▪ FCCSP PACKAGE SUPPLY 62

▪ FCBGA PACKAGING MARKET DYNAMICS 65



▪ Supplier Market shares (OSAT/FOUNDRY/IDM)

▪ Long term/Near term dynamics

▪ FCBGA PACKAGE SUPPLY 80

▪ 3D STACKED PACKAGING MARKET DYNAMICS 83

▪ 3D STACKED Market dynamics – summary



▪ Supplier Market shares (OSAT/FOUNDRY/IDM)

▪ Long term/Near term dynamics

▪ 3D STACKED PACKAGE SUPPLY 96

http://www.yole.fr/

TABLE OF CONTENTS

▪ WLCSP MARKET DYNAMICS 99



▪ Supplier Market shares (OSAT/FOUNDRY)

▪ WLCSP ASP per markets & size

▪ Near-term shipment & pricing outlook

▪ WLCSP supply 113

▪ FO MARKET DYNAMICS 117

▪ FOWLP/FOPLP Market dynamics – summary



▪ Supplier Market shares (OSAT/FOUNDRY)

▪ FOWLP ASP per markets & size

▪ Near-term shipment & pricing outlook

▪ Capex & Capacity

▪ FO PACKAGE SUPPLY 138

http://www.yole.fr/

TABLE OF CONTENTS▪ SUPPLIER DETAILS (FCBGA, FANOUT, WLCSP, & 3D

STACKED IC PACKAGE) 142

Foundry

▪ TSMC

▪ UMC

IDM

▪ INTEL

▪ SONY

▪ SAMSUNG

▪ TI

Manufacturers/Players

▪ MICRON

▪ SK HYNIX

▪ YMTC

▪ SEMCO

▪ ASE w/SPIL

▪ JCET

▪ AMKOR

▪ PTI

▪ TFME

▪ NEPES LAWEH/DECA

▪ CHINA WLCSP

▪ HUATIAN

http://www.yole.fr/

10

WHO SHOULD BE INTERESTED IN THIS MONITOR

Equipment & material suppliers:o To identify new business opportunities and prospects

o To understand the differentiated value of your products and technologies

o To identify technology trends, challenges and precise requirements

o To evaluate your Advanced Packaging technologies’ market potential

o To position your company in the market

o To monitor and benchmark your competitors

OSATs, IDMs & Foundries:o To understand technology trends related to Advanced Packaging platforms

o To spot new opportunities and define diversification strategies

o To understand the overall Advanced Packaging market

o To monitor and benchmark potential competitors

o To understand the supply chains involved in Advanced Packaging

R&D organizations:o To evaluate the potential of future technologies and products

o Identify market needs for new applications

o To understand the bottle necks of the Advanced Packaging technology anddirect their resources to solve the technical issues

o To identify the best candidates for technology transfers

o To identify the partners for consortia

Financial & Strategic investors: To identify new business opportunities and prospects

To understand the market potential of Advanced Packaging

To understand which players will benefit from Advanced Packaging adoption

To understand the players that are investing in the Advanced Packaging business

OEMs & Integrators: To understand technology trends in Advanced Packaging platforms

To spot new opportunities and define diversification strategies

To understand the overall Advanced Packaging market

To monitor and benchmark potential competitors

To understand the supply chains including the equipment / material suppliers


http://www.yole.fr/

11

GLOSSARY

Abbreviation Meaning

APE Application Processor Engine

ASIC Application-Specific Integrated Circuit

BEOL Back-end Of Line

BGA Ball Grid Array

CSP Chip Scale Package

DSP Digital Signal Processor

ECD Electro-Chemical Deposition

EMC Epoxy Mold Compound

ePLP embedded Package-level-Packaging

ePoP embedded Package-on-Package

eWLB embedded wafer-level BGA

F2F Face to face

FC Flip-Chip

FCIP Flip-Chip In Package

FO Fan-Out

FOWLP Fan-Out Wafer-level Packaging

FPGA Field-Programmable Gate Array

HDI High Density Interconnect

HPC High Processing Computer

HVM High Volume Manufacturing

HD FO High Density Fan-Out

IC Integrated Circuits

IDM Integrated Device Manufacturers

IO Inputs/Outputs

IP Intellectual Property

Abbreviation Meaning

IPD Integrated Passive Devices

L/S Line/Space

LVM Low Volume Manufacturing

MCM Multi Chip Module

MCP Multi Chip Package

OEM Original Equipment Manufacturer

OSAT Outsource Semiconductor Assembly and Test

PCB Printed Circuit Board

PMIC Power Management Integrated Circuit

PMU Power Management Unit

PoP Package on Package

PVD Physical Vapor Deposition

PWB Printed Wiring Board

QFN Quad flat No lead package

RCC Resin Coated Copper

RCP Redistributed Chip Package

RDL Redistribution Layer

SiP System in Package

SoC System on Chip

TMV Through-Mold-Via

TPV Through-Package-Via

TSV Through-Silicon-Via

UBM Under Bump Metalization

WLCSP Wafer-Level Chip Scale Package

WLFO Wafer-Level Fan Out


http://www.yole.fr/

KEY METRICS AT A GLANCE

FOR WLP, WLCSP, FAN-OUT, FCBGA, FCCSP,AND 3D

STACKED IC PACKAGES

http://www.yole.fr/


A RECORD YEAR FOR THE OSATS: 2020 OSAT RANKINGS (PER REVENUE)

Top OSATs saw 15-20% increase in 2020 revenue compare to 2019 and 2021 is expected to shape up as a “Banner Year” for OSATs.

16 776

5 051

3 951

2 679

1 623

1 282

1 019

809

784

702

517

507

487

461

437

413

370

358

341

340

314

304

292

226

192

ASE (rev w/SPIL & w/ USI)

Amkor

JCET Group

Powertech Technology

Tongfu Microelectronics

Tianshui Huatian Microelectronics

King Yuan Electronics

ChipMOS Technologies

Chipbond Technology

UTAC

Greatek Elec

SFA semicon

Orient Semiconductor Electronics

Hana Micron (Rev w/o Hana Materials)

Sigurd Microelectronics

Carsem

AOI Electronics

Tong Hsing

Formosa Advanced Technologies

Ardentec

Unisem Berhad

Nepes Corporation

Inari Amertron Berhad

Walton Advanced Engineering

Lingsen Precision Industries

TOP 25 OSAT ranking by 2020 revenue [M USD]

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TOTAL FC & WL PACKAGING MARKET DYNAMICS (FCBGA, FAN-OUT, WLCSP & 3D STACKED) - UNITS

-

20 000

40 000

60 000

80 000

2019 2020 2021 2022 2023 2024 2025 2026 2020 - 2026 CAGR

FC & WL Total Packaged Units Forecast (Mu)

FO WLCSP FCBGA FCCSP 3D Stacked

Overall Advanced Packaging form factors are expected to grow at 6% CAGR (2020-2026) with fcCSPand WLCSP leading in terms of total number of units.

http://www.yole.fr/


TOTAL FC & WL PACKAGING MARKET DYNAMICS (FCBGA, FAN-OUT, WLCSP & 3D STACKED) - REVENUE

$-

$10 000

$20 000

$30 000

$40 000

2019 2020 2021 2022 2023 2024 2025 2026 2020 - 2026 CAGR

FC & WL Package Revenue Forecast (M USD)

FO WLCSP FCBGA (Bumping) FCBGA (Assy & Sub) FCCSP (Bumping) FCCSP (Assy & Sub) 3D Stacked

Total Advanced Packaging Revenue is expected to grow at 7.9% CAGR (2020-2026) as 5G, automotive infotainment/ADAS, AI, Datacenter and wearable application megatrends continue to thrive the semiconductor eco-system

http://www.yole.fr/


Amkor

10%

ASE

23%

JCET

8%

TongFu (TFME)

3%PTI

2%Huatian

4%

Samsung

14%

Others

36%

FCCSP PACKAGING SERVICE MARKET SHARE

FCCSP PACKAGING SERVICE MARKET SHARE (2020 REVENUE)

Others**: Include Memory suppliers, smaller OSATs, direct OEM customers purchasing the substrate.

$5.5B

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17

3D STACKED PACKAGE APPLICATION MIX


HBM; 0,21%

3DS; 1,09%Si Interposer; 0,07%

Foveros; 0,02%

Co-EMIB; 0,00%

3D SoC; 0,00%

3D NAND; 0,10%

24,69%

73,82%

2019 3D Stacked Device Mix

HBM 3DS Si Interposer Foveros Co-EMIB 3D SoC 3D NAND CIS MEMS

http://www.yole.fr/

© 2020 | www.yole.fr | Advanced Packaging Market Monitor | Q4 2020 18

Amkor

6%

ASE

20%

JCET

5%

TongFu (TFME)

4%

PTI

1%Huatian

2%Intel

41%

Others

21%

FCBGA TOTAL (BUMPING & PACKAGING SERVICES) SUPPLIER MARKET SHARE (REVENUE)


http://www.yole.fr/


ADVANCED PACKAGING QUARTERLY MARKET MONITOR CONTENT


http://www.yole.fr/




http://www.yole.fr/




http://www.yole.fr/

22



http://www.yole.fr/

23

WLP MONITOR CONTENT: WLCSP & FO REVENUE PER PLAYER


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24

MONITORS AND TRACKS COMBINATION

From module technical content to market forecast and market sharesAdvanced Packaging

Quarterly Market

Monitor

Packaging Service

DRAM

& NAND

Quarterly Market

Monitor

Memory Service

Application Processor

Quarterly Market

Monitor

Computing Service

Market Monitorsby Yole Développement

› Market shares evaluation

› Market and technology forecasts

TeardownTracksby System Plus Consulting

› Design win identification

› Technology assessment

Consumer

Smartphones,

Smart Homes, Wearables

Combine the expertise of

Yole Développement

and

System Plus Consulting :

with our products, get a deep

understanding on the technology,

market and trends of the

semiconductor industry

Automotive

ADAS, Infotainment,

Connectivity© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021

http://www.yole.fr/

https://www.i-micronews.com/products/advanced-packaging-quarterly-market-monitor/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_Advanced_Packaging_Monitor_2020

https://www.i-micronews.com/products/?fwp_product_cat=monitors&fwp_post_thematic=memory

https://reverse-costing.com/teardowns/?q=&category=Connected+Devices&category=Wearables&category=Phones&category=Smart+Home&show_only_full_teardowns=on/

https://reverse-costing.com/teardowns/?q=&category=TCU&category=Infotainment&category=ADAS&category=Others&show_only_full_teardowns=on/

https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_Advanced_Packaging_Monitor_2020

25

Contact our

Sales Team

for more

information

High-End Performance Packaging: 3D/2.5D Integration 2020

Status of the Advanced Packaging Industry 2020

Fan-Out Packaging Technologies and Market 2020

WLCSP/ Fan-In Packaging Technologies and Market 2020


YOLE GROUP OF COMPANIES RELATED REPORTS

Yole Développement

http://www.yole.fr/

https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/fan-out-packaging-technologies-and-market-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/status-of-the-advanced-packaging-industry-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/wlcsp-fan-in-packaging-technologies-and-market-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/fan-out-packaging-technologies-and-market-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/wlcsp-fan-in-packaging-technologies-and-market-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

https://www.i-micronews.com/products/status-of-the-advanced-packaging-industry-2020/?pk_campaign=r_%20Advanced_Packaging_Monitor_March2021&pk_medium=relatedreports_Sample

26

Contact our

Sales Team

for more

information

RF Teardown


YOLE GROUP OF COMPANIES RELATED REPORTS

System Plus Consulting

Iphone 12 Teardown

http://www.yole.fr/

https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/

https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/

https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/

https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/

27

Yole Group of Companies, including Yole Développement,

System Plus Consulting and PISEO, are pleased to provide

you a glimpse of our accumulated knowledge.

We invite you to share our data with your own network,

within your presentations, press releases, dedicated

articles and more, but you first need approval from Yole

Public Relations department.

If you are interested, feel free to contact us right now!

We will also be more than happy to give you updated data

and appropriate formats.

Your contact: Sandrine Leroy, Dir. Public Relations

Email: [email protected]

HOW TO USE OUR DATA?

About Yole Développement | www.yole.fr | ©2021

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mailto:[email protected]?subject=I%20want%20to%20use%20webcast%20data

28About Yole Développement | www.yole.fr | ©2021

CONTACTS

Western US & Canada

Steve Laferriere - [email protected]

+ 1 310 600 8267

Eastern US & Canada

Chris Youman - [email protected]

+1 919 607 9839

Europe and RoW

Lizzie Levenez - [email protected]

+49 15 123 544 182

Benelux, UK & Spain

Marine Wybranietz - [email protected]

+49 69 96 21 76 78

India and RoA

Takashi Onozawa - [email protected]

+81 80 4371 4887

Greater China

Mavis Wang - [email protected]

+886 979 336 809 +86 136 6156 6824

Korea

Peter Ok - [email protected]

+82 10 4089 0233

Japan

Miho Ohtake - [email protected]

+81 34 4059 204

Japan and Singapore

Itsuyo Oshiba - [email protected]

+81 80 3577 3042

Japan

Toru Hosaka – [email protected]

+81 90 1775 3866

FINANCIAL SERVICES

› Jean-Christophe Eloy - [email protected]

+33 4 72 83 01 80

› Ivan Donaldson - [email protected]

+1 208 850 3914

CUSTOM PROJECT SERVICES

› Jérome Azémar, Yole Développement -

[email protected] - +33 6 27 68 69 33

› Julie Coulon, System Plus Consulting -

[email protected] - +33 2 72 17 89 85

GENERAL

› Sandrine Leroy, Public Relations

[email protected] - +33 4 72 83 01 89

› General inquiries: [email protected] - +33 4 72 83 01 80

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Documents

Advanced From Technologies to Markets Packaging Quarterly