Advance Engineering Mathematics Presentation

8/14/2019 Advance Engineering Mathematics Presentation

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Card_Hz Manual,Version 4.00

Copyright 2005 Advanced Thermal Engineering, Inc.

All Rights Reserved

P. O. Box 4528Huntsville, AL 35815

USA


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Electronic PackagingFour Thermal Frame Options


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Electronic Packaging

Graphical User Interface

Input the printed wiring board

(PWB) dimensions.

Input the thermal frame values.

Move scroll bars and click

option buttons to create an

interactive trade study.

This executable (28 kb) and dynamic

link library (398 kb) operate on an MS

Windows platform (3.0 or later).


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Card_HzCircuit Card Assembly (CCA) Capacity

Make the CCA compatible with

the vibration environment. The

long edge should be in the

housing and the short edge shouldbe in the connector mating to the

motherboard.

Solve the size problem before

the vibration requirements

demand a smaller CCA.

Manage your resources before a

conflict exists between

disciplines.


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Card_HzFour Structural Solutions

Electrical Engineers use it

as a quick solution.

Industrial (Reliability)Engineers use it as a

simplified solution.

Mechanical Engineers use

it as a sanity check.


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Electronic PackagingReliability

Calculate the Reliability. The Reliability Engineers calculate the card

reliability. It is based on maximum single amplitude deflection and

the number of cycles. Less deflection is good, it creates less normal

stress acting on the longitudinal fibers of the materials. Less time invibration is good, it creates less cycles for fatigue. Dave S. Steinberg

recommends no more than 0.3% of the shorter edge be allowed for

maximum single amplitude deflection to avoid components breaking

their solder joints.


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Users Guide


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Card_HzCopyright 2005 Advanced Thermal Engineering, Inc.

All Rights Reserved

hz400.exe 28 kb

lice400.doc 4 kb

read400.doc 5 kb

vbrun300.dll 398 kb

The executable (*.exe) and

dynamic link library (*.dll) files

must be in the same directory.

The legal license is found in the

two MS Word files (*.doc).

Select the executable file to start

the program. Select buttons to

navigate the various forms.


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Card_HzLook and Feel of the Program

The selection of buttons will move the

program forward or backward throughthe interactive forms. Scroll bars and

option buttons will change default

values to unique values. Moving

through the forms will bring the user to

the final results of a particular trade

study. Every form has a button to endthe program.


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Card_Hz

Forms of the Program

Table I. Form Titles

Name Title

Start: Form 1 (Options) Introduction (Form 1 of 3)

Form 2 (Input) PWB Mechanical Design (Form 2 of 3)

Finish: Form 3 (Input/Output) Results (Form 3 of 3)


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Card_Hz

Navigating the Program

tart: orm 1

orm

inish: orm


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Card_Hz

Manipulating the Program

When the program starts

Form1 is displayed. The usermoves forward to Form 2 to

change default values and

complete his trade study on

Form 3. If the results are not

acceptable to the user, hesimply moves backward to the

various forms to update new

unique values for his design.

tart Form 1

Form 2

Finish Form 3


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Form Details


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Start: Form 1


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Start: Form 1Options

Select Forward to moveforward to the next form.

(Select End the Program if

you wish to end the program

session.)


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Form 2


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Form 2Options

1. Select PWB Width (6.200).

2. Select PWB Height (8.0).

3. Select Thermal Frame values if itis not standard aluminum plate.

4. Select Return to return to Form 1.

5. Select Forward to advance to

Form 3.

6. (Select End the Program if you

wish to end the program session.)


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Finish: Form 3


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Form 3Options

1. Select any Thermal Frame

Options option button.

2. Results are displayed for thatCCA.

3. Select Card to return to the

Form 2.

4. (Select End the Program toend the program session.)


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Form 3Details (1 of 2)

1. The CCA mass is based on high density packaging on a PWB.

2. The CCA is a lightly damped system and thus the undamped natural

frequency is used to approximate the resonant frequency.

3. The frequency is based on the single amplitude deflection of a uniformly

loaded beam fixed at two opposite sides. This span is the PWB width.Dynamic response to an input perpendicular to the plane of the PWB will

excite the built in strength of the CCA based on a classical single degree of

freedom spring, damper, and mass system.

4. The transmissibility is based on the CCA frequency (Reference 5).

5. The maximum allowable single amplitude deflection is based on 0.3 % of the

shorter edge (Reference 5).

6. The maximum sine vibration input is based on the classic spring, damper,

mass model.

7. The maximum random vibration input is based on the classic spring, damper,

mass model excited by 3 times the Root Mean Squared value at resonance.


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Form 3Details (2 of 2)

1. The shock vibration response

is based on a square wave

input of6 or 11 milliseconds.

2. The shock transmissibility cannot develop beyond 2.0

(Reference 6).

3. The maximum input is based

on the classic spring, damper,

mass system.


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Form 3

CCA Option 1

This is the basic

PWB in a chassis

held by lockingcard guides.


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Form 3

CCA Thermal Frame Option 2

Each DIP package is

mounted on a thermal

rail finger and everylead is in a plated

through hole. The rails

combine into a plane at

the edge of the PWB to

extend beyond the

PWB into the housingand mounts two wedge

locks that hold it in a

chassis slot.


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Form 3


This has a PWB with

surface mount

technology (SMT)components and a

circuit side thermal

plane. The thermal

plane extends beyond

the PWB into the

housing and mounts

two wedge locks that

hold it in a chassis

slot.


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Form 3


This is like option 3 with an

additional PWB bonded to the

thermal plane. Each PWBbonds its circuit side to the

thermal plane. The extra PWB

has jumper wires to the first

PWB, located opposite the

connector. All input and

output is managed through theconnector of the first PWB.

The thermal plane has two

wedge locks to hold it in a

chassis slot.


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References

1. Schaums Outline Series, Theory and Problems of Strength ofMaterials, 2nd Ed., William A. Nash, McGraw-Hill BookCompany, New York, N. Y., 1972.

2. Marks Standard Handbook for Mechanical Engineers, 8th Ed.,Theodore Baumeister, Editor, McGraw-Hill Book Company,

New York, N. Y., 1978.3. Principles of Dynamics, Donald T. Greenwood, Prentice-Hall,

Englewood Cliffs, New Jersey, 1965.

4. Advanced Engineering Mathematics, 3rd Ed., Erwin Kreyszig,John Wiley, New York, N. Y., 1972.

5. Vibration Analysis for Electronic Equipment, Dave S.Steinberg, John Wiley & Sons, New York, N. Y., 1973.

6. Application Selection Guide, Barry Controls, Bulletin C5-178,Barry Wright Corp., 1978.

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Advance Engineering Mathematics Presentation