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Curriculum Vitae Adrian O'Shaughnessy Personal Details Bawnmore Cottage https://www.linkedin.com/in/adrianoshaughnessy Ballinakill +353 87 7496482(m) Co Laois HYPERLINK "mailto:[email protected]" [email protected] _________________________________________________________ ___________________________ Profile Widely considered to be an expert in nanometer and finFet layout. Extensive layout management and principal lead experience at 10nmFF, 16nmFF, 20nm, 28nm, 32nm, 45nm, 65nm and 90nm full custom mask design with some experience with place and route physical design. Eighteen yearsexpert experience in RF/Baseband/Power products. Extensive layout lead experience in putting complete mixed-signal IC’s together. Proven capability to interface with analog design engineers in product definition phase to include: floor planning, power routing, ESD, block physical design size estimations, layout effort estimations, and other tasks. Proven team leadership capabilities. Including defining, directing and reviewing the other layout engineers work. Able to interface with digital P&R team in implementing both digital-on-top and analog-on-top flows. Good understanding of packaging needs and constraints including interface with packaging team. Superior layout skills including critical device and signal layout techniques. Understanding of multiple voltage domains and techniques to ensure proper physical designs. Expert knowledge of physical design techniques for volume manufacturing Has a deep understanding of various silicon process effects that can kill silicon performance such as CD variation, Dishing, Implant shadowing, Mask misalignment, Over/Under Etch, Lithography shadowing etc. Extensive expertise on every conceivable verification suite out there; Calibre, Assura, Hercules, PVS etc. Experienced team leader with a proven track record of meeting critical deadlines and design tapeouts. Has trained countless Design and Layout Engineers across Germany, France, UK, Ireland and the States. Excellent communicator with an ability to develop and maintain relationships at all levels. Highly experienced in all aspects of IC layout including laying out of: LNA, Mixer, VGA/PGA, DAC, ADC, Bias, OP-Amp, Filters, VCO, PLL, Charge-pump, Divers, I/O ring etc Experienced public speaker who has spoken and presented at various technical conferences. _____________________________________________________________________________________ Key Competencies and Skills Highly motivated team lead specializing in team/project/management of deep sub-micron and finFet layout. Collaborative leader who develops positive working relationships Excellent track record in leadership and innovation consulting Proven ability to meet critical deadlines and design tapeouts Significant knowledge in all aspects of expert layout techniques Excellent creativity and problem-solving ability Excellent media skills, including considerable experience in public speaking Endura Technologies June 15 to date Game changing, patented technology for the next generation of application processors. Improving energy efficiency for all operating modes including standby. Principal Lead Layout Successful management and tapeout of numerous 10nmFF and 28nm chips. Participate in all critical aspects of product implementation including bump map definition and placement, ESD implementation, chip level floor-planning, block level creation, debug and full verification, power routing concepts Develop detailed layout guidelines for best practice strategy to reduce risk on silicon such as latch-up prevention and parasitic reduction.

Adrian O'Shaughnessy CV 2017

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Page 1: Adrian O'Shaughnessy CV 2017

Curriculum Vitae

Adrian O'Shaughnessy

Personal Details

Bawnmore Cottage https://www.linkedin.com/in/adrianoshaughnessy

Ballinakill +353 87 7496482(m)

Co Laois

HYPERLINK "mailto:[email protected]"

[email protected] _________________________________________________________

___________________________

Profile

Widely considered to be an expert in nanometer and finFet layout. Extensive layout management and principal lead

experience at 10nmFF, 16nmFF, 20nm, 28nm, 32nm, 45nm, 65nm and 90nm full custom mask design with some

experience with place and route physical design. Eighteen years’ expert experience in RF/Baseband/Power products.

Extensive layout lead experience in putting complete mixed-signal IC’s together. Proven capability to interface with

analog design engineers in product definition phase to include: floor planning, power routing, ESD, block physical

design size estimations, layout effort estimations, and other tasks. Proven team leadership capabilities. Including

defining, directing and reviewing the other layout engineers work. Able to interface with digital P&R team in

implementing both digital-on-top and analog-on-top flows. Good understanding of packaging needs and constraints

including interface with packaging team. Superior layout skills including critical device and signal layout

techniques. Understanding of multiple voltage domains and techniques to ensure proper physical designs. Expert

knowledge of physical design techniques for volume manufacturing

Has a deep understanding of various silicon process effects that can kill silicon performance such as CD variation,

Dishing, Implant shadowing, Mask misalignment, Over/Under Etch, Lithography shadowing etc. Extensive

expertise on every conceivable verification suite out there; Calibre, Assura, Hercules, PVS etc. Experienced team

leader with a proven track record of meeting critical deadlines and design tapeouts. Has trained countless Design

and Layout Engineers across Germany, France, UK, Ireland and the States. Excellent communicator with an ability

to develop and maintain relationships at all levels. Highly experienced in all aspects of IC layout including laying

out of: LNA, Mixer, VGA/PGA, DAC, ADC, Bias, OP-Amp, Filters, VCO, PLL, Charge-pump, Divers, I/O ring etc

Experienced public speaker who has spoken and presented at various technical conferences.

_____________________________________________________________________________________

Key Competencies and Skills

Highly motivated team lead specializing in team/project/management of deep sub-micron and finFet layout.

Collaborative leader who develops positive working relationships

Excellent track record in leadership and innovation consulting

Proven ability to meet critical deadlines and design tapeouts

Significant knowledge in all aspects of expert layout techniques

Excellent creativity and problem-solving ability

Excellent media skills, including considerable experience in public speaking

Endura Technologies June 15 – to date

Game changing, patented technology for the next generation of application processors. Improving energy efficiency

for all operating modes including standby.

Principal Lead Layout

Successful management and tapeout of numerous 10nmFF and 28nm chips.

Participate in all critical aspects of product implementation including bump map definition and placement, ESD

implementation, chip level floor-planning, block level creation, debug and full verification, power routing concepts

Develop detailed layout guidelines for best practice strategy to reduce risk on silicon such as latch-up prevention and

parasitic reduction.

Page 2: Adrian O'Shaughnessy CV 2017

Guide layout team towards successful tape outs.

Estimations of layout timescales plus any subsequent re-estimations due to design changes.

Instigation of peer reviews for critical and major layout blocks.

Expert Layout IC Ltd Sept 11 – June 15

Expert Layout IC is my own consulting/contracting company

Key Achievements

Secured continuous contracts from leading technology companies including Intel, Xilinx and IC Mask Design.

Extensive critical layout design on 20nm node

Consulted on a range of critical layout challenges such as high speed matching, reduction in parasitics etc.

Developed and optimised a Hercules verification flow for a key customer. This role also included dynamic power

integrity analysis using Apache RedHawk

Spinning of various blocks using IC Compiler

Silansys Technologies May 11 – Sept 11

Silansys was founded in January 2002 to deliver turnkey ASIC product and IC Design Services for complex Mixed-

Signal intensive products.

Principal Layout Engineer

Supervision and management of various complex layout projects ranging across a variety of technology nodes

including 40 nanometer and 28 nanometer

Continually updated layout methodologies across various layout fields including Matching, Parasitics, Noise

Isolation, Supply Considerations etc

Preparation and updating of training material

Provide on-site training

Key advisor on all technical problems within the company and on-site

Several customers site visits to UK per year

IC Mask Design Aug 07 – May 11

Founded in 2002, IC Mask Design is Ireland's first independently owned Integrated Circuit Physical Design

Company.

Senior Layout Engineer Introduced key strategies for optimal RF/Baseband layout

Successfully help train 600+ engineers worldwide

Developed and maintained key layout training material for the company

Trained all staff with respects to RF/Analog layout

Ensured all layouts reach and maintain a standard of excellence

Worked and engaged with customers across the world which also included working on customer sites for extended

periods of time

Day to day dealing with senior management, contractors, customers and suppliers

Frontier Silicon May 05 – Mar 07

Frontier Silicon is the world's leading supplier of innovative semiconductor, module and software solutions for

digital radio and connected audio systems.

Page 3: Adrian O'Shaughnessy CV 2017

Project Layout Engineer Ported .18 micron layout designs down to .13 micron

Meet key layout challenges at the .13 micron process

Layout of a variety of baseband blocks including Bandgaps, Biasing circuitry, Voltage Regulators etc.

Key Achievements

Beng (HONS) Electronic Engineering which was completed on a three year part-time basis.

Parthus Ceva Mary 00 – May 05

Ceva is the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for the handset,

portable and consumer electronics markets.

Layout Engineer

Layout of varying structures on a .18 micron process

Spinning of digital blocks from RTL to GDSII

Qualifications

Leaving Certificate Salesian College, Laois 1991

Cert in Computers and Electronics Institute of Technology, Carlow

1999

Diploma in Computers and Electronics Institute of Technology, Carlow 2000

Bachelor Degree (Honours) in Electronic Engineering Institute of Technology, Tallaght 2006

Interests

Family time, Home music recording, Fitness, Electronics

Excellent references can be supplied on request

Adrian O'Shaughnessy

Page 4: Adrian O'Shaughnessy CV 2017