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Datasheet

H10 (Data-Only)HSDPA PCI Express mini card moduleDatasheetRev. 0.2 (Preliminary)2007/06/22

COPYRIGHT BENQ Corporation

This document contains proprietary technical information which is the property of BenQ Corporation

and is issued in strict confidential and shall not be disclosed to others parties in whole or in parts

without written permission of BenQ Corporation

The documents contain information on a product, which is under development and is issued for

customer evaluation purposes only.

BENQ may make changes to product specifications at any time, without notice .


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BenQ Corporation

Mobile Communications BG

18 JiHu Road, Nei-Hu, Taipei 114, Taiwan, R.O.C.

Tel: +886-2-2799-8800

Fax: +886-2-2656-6390

http://www.BenQ.com

HISTORY

Version Date Notes

VER: 0.1 2007-APR-24 FIRST RELEASE

VER: 0.2 2007-JUN-22 Update characteristic of RF


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1. INTRODUCTION .................................................................................................... 4

1.1 Description.............................................................................................................41.2 Application Device.................................................................................................4

2. FEATURES............................................................................................................... 5

2.1 General Characteristics...........................................................................................5

2.2 RF Functionalities ..................................................................................................6

Maximum TX Power............................................................................................6

Parametric Performance ......................................................................................6

Sensitivity.............................................................................................................7

Radio Frequency ..................................................................................................7

3. HARDWARE DESCRIPTION..................................................................................... 9

3.1 System Interface......................................................................................................9

3.2 Functional Diagram ............................................................................................. 10

3.3 Pin Description .................................................................................................... 11

3.4 Terminal Definition ..............................................................................................13

3.5 Electrical Characteristics......................................................................................15

DC characteristics..............................................................................................15

Digital interface..................................................................................................16

USB Transceiver DC characteristics...................................................................16

USIM Interface...................................................................................................17

3.6 Environmental ......................................................................................................18

3.7 Physical Package...................................................................................................19

4. SOFTWARE CHARACTERISTICS............................................................................ 22

4.1 Introduction .........................................................................................................22

4.2 Software Architecture........................................................................................... 22


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1. INTRODUCTION1.1 DescriptionOverview

This document describes all the functions, features, and interfaces of the HSDPA

PCI Express Mini Card Module -- H10 from BenQ. BenQ H10 HSDPA modulesupports Tri-band WCDMA/HSDPA and Quad-band GSM/GPRS/EDGE networkconnection capability.

BenQ H10 HSDPA card can provides high speed data connection, and the dataspeed of downlink path is up to 7.2Mbps. Furthermore, users can ease to use thismodule by using the Qsyncher application software that we provide for Windows XPand Vista system.

With the BENQ H10 HSDPA module, devices are enhanced in both functionality

and usability based on state of the art wireless technology.

1.2 Application DeviceScope

BenQ H10 module is a high speed modem card with PCI Express minicard formfactor and is focusing on the Notebook, UMPC, MID and other portable devicemarketing.

Notebook

Ultra Mobile PC

Mobile Internet Device

Wireless Router

USB Modem

Car Embedded System


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2. FEATURES

2.1 General Characteristics BAND:

GSM850/EGSM900/DCS1800/PCS1900/WCDMA850/WCDMA1900/WCDMA2100Band TX RXGSM850 824~849 MHz 869~894MHz

EGSM900 880~915 MHz 925~960MHz

DCS1800 1710~1785MHz 1805~1880MHz

PCS1900 1850~1910MHz 1930~1990MHz

WCDMA850 824~849 MHz 869~894MHz

WCDMA1900 1850~1910MHz 1930~1990MHz

WCDMA2100 1920~1980MHz 2110~2170MHz

Support SIM Interface: 1.8V/3V Form factor

i. Dimension: 50.95 x 30 x 5.0 mmii. Weight: 12g

PowerOperation Voltage: 3.3V +/- 9%

Power Consumption:Speech Mode:

Band Typ Max UnitGSM850 / PCL=5 385 400 mA

EGSM900 / PCL=5 395 410 mA

DCS / PCL=0 312 325 mA

PCS / PCL=0 280 295 mA

WCDMA (all band) 720 820 mA

Standby Mode:

Typ (Average) Max (Average) UnitGSM / Page frame=2 3.5 4.5 mA

GSM / Page frame=9 2.0 3 mA

DCS / Page frame=2 3.5 4.5 mA

DCS / Page frame=9 2.0 3 mA

PCS / Page frame=2 3.5 4.5 mA

PCS / Page frame=9 2.0 3 mA

WCDMA / DRX=6 (0.64 S) 3.6 4.5 mA

WCDMA / DRX=9 (5.12 S) 1.5 3 mA


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Hardware Interface:52 Pins PCI Express Mini Card connector interface2 RF Antenna Coaxial Connectors

Software Interface:USB driverQsyncher software tool.

2.2 RF FunctionalitiesMaximum TX PowerThe performance of the transmitter meets test requirement ETSI TS 151 010-1 chapter13.3 for GSM, chapter 13.17.3 for EDGE and TS 34.121 chapter 5.2&5.4.3 for WCDMA,chapter 5.2A for HSDPA

Band Max MinGSM850 33 dBm 2dBm 5 dBm 5dBm

EGSM 33 dBm 2dBm 5 dBm 5dBm

DCS 30 dBm 2dBm 0 dBm 5dBm

PCS 30 dBm 2dBm 0 dBm 5dBm

GSM850(EDGE) 27 dBm 3dBm 5 dBm 5dBm

EGSM(EDGE) 27 dBm 3dBm 5 dBm 5dBm

DCS(EDGE) 26 dBm 3dBm 2 dBm 5dBm

PCS(EDGE) 26 dBm 3dBm 2 dBm 5dBm

UMTS-2100 24 dBm +1/-3dBm Less than -50dBm



1/15 o/ d 12/15 (HS-DPCCH) 24 dBm +1/-3dBm



Parametric PerformanceTests carried out at -20C, 25C and 60C for each voltage 3V, 3.3V and 3.6V. TheMeasured Peak Phase, RMS Phase, frequency error, power level, and static sensitivitymeets ETSI TS 151 010-1 chapter 13.1 for GSM and TS 34.121 chapter 5.13.1 for WCDMA,chapter 5.13.1A for HSDPA Band (GSM) Peak Phase Error RMS Phase ErrorGSM850


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SensitivityThe performance of the receiver meets test requirement ETSI TS 151 010-1 chapter 14.2.1for GSM, chapter 14.18.1 for EDGE and TS 34.121 chapter 6.2 for WCDMA.

Band Typical MinGSM850 -107 dBm -104 dBm

EGSM -107 dBm -104 dBm

DCS -107 dBm -103 dBm

PCS -107 dBm -103 dBm

EDGE(GMSK modulation) -107 dBm -104 dBm

EDGE(8-PSK modulation) -104 dBm -102 dBm

UMTS-2100(Primary) -109 dBm -106.7 dBm

UMTS-2100(Secondary) -109 dBm N/A

UMTS-1900 -107 dBm -104.7 dBm

UMTS-850(Primary) -109 dBm -106.7 dBm

UMTS-850(Secondary) -109 dBm N/A

Radio FrequencyGSM850 (850 MHz)Frequency Range TX 824-849 MHz; RX 869-894 MHz

Channel Spacing 200 KHz

Number of Channels 124 Carriers x 8 (TDMA)

Modulation GMSK / 8-PSK

Duplex Spacing 45 MHz

Frequency Stability +/- 0.1 ppm (Uplink TX)

Power Output 33 dBm Class 8 (2 W peak) 5 dBm

Output Impedance 50 Ohm

Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)

EGSM (900 MHz)Frequency Range TX 880-915 MHz; RX 925-960 MHz






Power Output 33 dBm Class 8 (2 W peak) 5 dBm


Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)

DCS (1800 MHz)Frequency Range TX 1710-1785 MHz; RX 1805-1880 MHz






Power Output 30 dBm 0 dBm


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Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)Compatible with phase 2 featurePCS (1900 MHz)Frequency Range TX: 1850~1910MHz; RX: 1930~1990MHz

Channel Spacing 200KHzNumber of Channels 299 Carriers x 8 (TDMA)




Power Output 30 dBm 0 dBm


Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)Compatible with phase 2 featureWCDMA_IMT (2100 MHz)Frequency Range TX: 1920~1980MHz; RX: 2110~2170MHz

Channel Raster 200KHzNumber of Channels 299 Carriers x 8 (TDMA)

Modulation QPSK



Power Output 24 dBm +1/-3dBm - less than -50dBm


Spurious Emission -67dBm(925-935MHz);-79dBm(935-960MHz);-71dBm(1805-1880MHz);-60dBm(1845-1880MHz);-41dBm(1885-1920MHz)WCDMA_PCS (1900 MHz)Frequency Range TX: 1850~1910MHz; RX: 1930~1990MHz

Channel Raster 200KHz


Modulation QPSK





Spurious Emission

WCDMA_850 (850 MHz)Frequency Range TX 824-849 MHz; RX 869-894 MHz

Channel Raster 200KHz


Modulation QPSK





Spurious Emission -60dBm(869-894MHz;1930-1990MHz;2110-2155MHz)


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3. HARDWARE DESCRIPTION

3.1 System InterfaceThe I/O connectors of H10 module are PCI EXPRESS MINI CARD and two RF antenna

connectors. Table 3-1 summarizes the 25 signals and 18 power lines that are supported bythe PCI Express Mini Card System Interface. Table 3-2 shows the antenna interface.

Table 3-1 System InterfaceSignal Group Pin no. DescriptionPower 5 3.3V power source

GND 13 Return current path

USB 2 USB serial data interface compliant to the USB 2.0 specification

PERST 1 Function reset to the card

W_DISABLE 1 Shutdown the HSDPA module

UIM 4 SIM function

LED 3 Status indicators

Table 3-2 Antenna interfaceSignal Group Connector no. DescriptionANT 2 Antenna interface


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3.2 Functional Diagram


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3.3 Pin Description

Pin Signal name Direction Description1 NC No connect

2 +3.3Vaux Power 3.3V power source

3 NC No connect

4 GND Power Return current path

5 NC No connect

6 NC No connect

7 NC No connect

8 UIM_PWR Output Power source for the USIM


10 UIM_DATA Input / Output USIM data signal

11 NC No connect

12 UIM_CLK Output USIM clock signal

13 NC No connect

14 UIM_RESET Output USIM reset signal


16 NC No connect

17 NC No connect


19 NC No connect

20 W_DISABLE Input

Active low signal.

This signal is used by the system to

shutdown the HSDPA module.


22 PERST InputActive low signal.

Function reset to the card.

23 NC No connect

24 +3.3Vaux Power 3.3V power source

25 NC No connect



28 NC No connect


30 NC No connect

31 NC No connect


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3.4 Terminal Definition

Recommend antenna connectHirose Coaxial Connectors


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System connector52 pins PCI Express Mini Card


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3.5 Electrical CharacteristicsDC characteristicsPin Function/ Name Direction Parameter Min Typ Max Unit

1 NC

2 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V

3 NC

4 GND Power Ground

5 NC

6 NC

7 NC

Supply Voltage 1.5 2.85 3.05 V8 UIM_PWR Output

Current 150 mA

9 GND Power Ground

10 UIM_DATA Input / Output

11 NC

12 UIM_CLK Output

13 NC

14 UIM_RESET Output

15 GND Power Ground

16 NC

17 NC

18 GND Power Ground

19 NC

Logic High Input Voltage 1.69 2.6 2.9 V20 W_DISABLE Input

Logic Low Input Voltage -0.3 0 0.91 V

21 GND Power Ground

Logic High Input Voltage 1.69 2.6 2.9 V22 PERST Input


23 NC


25 NC

26 GND Power Ground

27 GND Power Ground

28 NC

29 GND Power Ground

30 NC

31 NC


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32 NC

33 NC

34 GND Power Ground

35 GND Power Ground

36 USB_D- Input / Output Termination Voltage 3.0 3.3 3.6 V

37 GND Power Ground

38 USB_D+ Input / Output Termination Voltage 3.0 3.3 3.6 V


40 GND Power Ground


42 LED_WWAN Output Driver current 0 150 mA

43 GND Power Ground

44 LED_WLAN Output Driver current 0 150 mA

45 NC

46 LED_WPAN Output Driver current 0 300 mA

47 NC

48 NC

49 NC

50 GND Power Ground

51 NC


Digital interfaceParameter Min Typ Max Unit

Logic High Input Voltage 1.69 2.6 2.9 V


Logic High Output Voltage 2.15 2.6 2.6 V

Logic Low Output Voltage -0.3 0 0.45 V

USB Transceiver DC characteristicsThe USB interface is powered from 3.3V power source.

Parameter Comments Min Typ Max Unit

Input sensitivity (differential) |D+ D-|, VIN=0.8 to 2.5V 0.2 V

Output voltage

Logic LOW

Logic HIGH

RL=1.5K to 3.6V

RL=1.5K to GND, IO=1mA 2.8

0.3

3.6

V

V

Series output resistance D+, D- 28 33 44


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Internal pull-up resistor 3.3V to D+, 3.3V to D- 1.425 1.5 1.575 K

Internal pull-down resistor D+ to GND, D- to GND 14.3 15 24.8 K

USIM InterfaceThe USIM signals are defined on system connector to provide the interface between theremovable User Identity Module. USIM interface usually run off either 1.8V or 3.0V.

Pin Name Direction Description

8 UIM_PWR Output Power source for the USIM 10 UIM_DATA Input / Output USIM data signal 12 UIM_CLK Output USIM clock signal 14 UIM_RESET Output USIM reset signal

Parameter Comments Min Typ Max Unit

Logic High Input Voltage 1.8525 2.85 3.15 V


Logic High Output Voltage 2.4 2.85 2.85 V

Logic Low Output Voltage -0.3 0 0.45 V

Schmitt Hysteresis 150 mV

Logic input leakage current -200 200 nA

Internal pull-up resistor Programmable range 1 30 K


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3.6 EnvironmentalOperational temperature: -20 ~ +60 Functional temperature: -20 ~ +70 Storage temperature: -40 ~ +85

Note: The maximum case temperature (Tc) of shielding cover should be under 90

(@RF TX power = 24dBm) for ensure all of the characteristics of H10 module can befulfilled the ETSI specification.


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3.7 Physical PackageTop View


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Bottom View


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Side View


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Actualizar Bios benq s6