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Rev. 5 (2013.08.08)
(ZIP)429-912
1254-8, Jeongwang-Dong, Siheung-si , GyeongGi-Do, Korea
(New Address : 32 (#509-1Na Dong), 79 Beon-Gil, Gong Dan 1 Daero, (Jeong Wang Dong ShiWha Industrial CPLX ) Shi-Heung City,
Kyoung-Ki Do, S. Korea )
TEL : +82-31-500-6700 (REP)
FAX : +82-31-500-6699
www.atc-kr.com/eng
The motto of ATC is to make differences in providing a technical quality services. The company is carrying out and [Open Book Management, Operational Accountability, and Value Based Management], which are the corporate philosophy of ATC. ATC is doing its very best efforts to gain high level of trust from its clients.
Ace Tech Circuit Presentation
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 1/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
1998 year
04. Ace Tech Circuit (ATC) was established.
07. Developed Multilayer technology up to 24 Layers.
2001 year
09. Developed Multilayer up to 40Layers.
11. Acquired “ISO 9001” from Authorized Institute.
12. Expanded Production Line Capacity (MLB : 30,000㎡/month)
2003 year
06. Started exporting products to USA
2000 year
02 Incorporated from private company to public company.
2002 year
02. Acquired “UL” Certification (E225596)
11. Registered as Prospective Enterprise to Kookmin bank
2004 year
05. Recognized from Administration of Korea as “High Technical Venture Company”
06. Recognized from Korea Technology Credit Fund as “Super Technology Company”
◈ Brief Company History
1998 2000 200120022003
2004 2005
2005 year
04. Moved to new factory and increased its production capacity.
04. Authorized from Government for “R & D Institution”
07. Selected as a technological innovation Business ( Inno – Biz)
10. Gained “Best Venture Grand Gold Metal” among all Korean venture company
11. Acquired “ISO14001” from Authorized Institute.
11. Gained "One million Dollar Export Golden Tower" from Government
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 2/26 Rev. 5 (2013.08.08)
Ace Tech Circuit◈ Brief Company History
2007 year
09. Gained " Promising Small & Medium Enterprise" from Gyeong Gi local government.
10. Commended by Gyeong Gi Provincial governor as Venture Business.
2006 year
11. Gained "Three Million Dollar Export Golden Tower" from Government
2008 year 2011 year
11. Gained “Five Million Dollar Export Golden Tower" from Government
12. 2011. Korea Technology AwardsHave gained award fromKnowledge and Economy Minister
01. Newly equipped with Reverse Pulse Plating LINE
2009 year
05. Newly equipped with Image LINE & PSR LINE
(Starting to set-up LDI Machine)
06. Additional establishment
of Reverse Pulse Plating LINE
2010 year
12. Pending Patent for OSCILLATION AND SHOCKING APPARATUS of PCB
2006 200720082009
2010 2011 2013
2013 year
06. Selected “The Best Firm for
working” (Small and medium
Business Corporation)
06. Selected “Promising Export
Firm” (kyeonggi Regional Small
Medium Business Administration)
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 3/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Emphasize
Quality
Emphasize QualityWe understand and conform to our customer’s quality requirements in PCB
business and We deliver error-free products and services on time delivery.
(Please see our quality systems’ page)
Overall
ManufacturingProcess inHouse
Overall Manufacturing process in houseEvery each process of manufacturing is done in house all without any other outsourcing, so it is possible to not only shorten the lead time, but alsoreduce the cost.
Measure
Performance
Measure PerformanceWe manage by timely feedback – Quality, Delivery and Customer inputsfor inquiries as well as orders
DevelopmentPrograms
Development ProgramsWe analysis the defect data to generate Process Improvement actions anddevelop new technologies continuously.
◈ Company Philosophy
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 4/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
President
Executive Director
Produce Sector Support Sector
Institute of technology
Managing Director
Production Team
Production Management
QualityTeam
Domestic Sales Team
Overseas Sales Team
Engineering/Cam Team
Production &Technique
Human Resources &manager
Team
laminatingPART
ImagingPART
Gold Plating PART
PSRPART
Quality Assurance
PART
Quality ControlPART
EngineeringPART
CAMPART
Facilities manageme
nt PART
Human Resources/Accounts
PART
ManagerPART
◈ Organization
Production Management
PART
Sales Management
PART
Production& Technique
PART
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 5/26 Rev. 5 (2013.08.08)
Ace Tech Circuit◈ ATC’s Main Customers
IndustrialBusiness
MicroelectronicsBusiness
OverseasBusiness
End User
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 6/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
CAMApplying to the PCB manufacturing with designs for the productions by accuracy, speedy and stored specifications in computers.Equipments : Orbotech-Genesis
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 7/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
IMAGEThe conductive patterns are formed by etching process of Dry Films.The Imaged Dry Films with the patterns, are contacted to the Copper Foils closely.
(Utilize 100% Laser Direct Imaging on UV (light Exposure)
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 8/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
AOI
During the manufacturing the PCB, the all patterns are inspected by optical equipments with Halogen lamp.
Equipments :Orbotech , GIGAVIS
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 9/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
HOT PRESSEach layer's Copper foil & Prepreg are laid up by heat and press.The lay up should be performed a controlled environment room for best result.Equipments : MEIKI, FUSEI MENIX
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 10/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
DRILLINGDrills for making holes are performed for plating holes to be electrical connecting between the top and bottom, and component's mounting on the boards.
Equipments : HITACHI
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 11/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
CU PLATINGThe hole's plating process is one of the most important process for PCB manufacturing, and its process is requiring special analysis for checking plating's situations in technical specialized plating shop. We have a reverse pulse type plating for a reliability.
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 12/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
PSRThe specification of significant parameters of solder paste are important to repeatable high quality results. It should be sufficient to meet process variable and products requirements.
Legend is worked by using Inkjet Marking machine.
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 13/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
SURFACE FINISHING
We do surface finishing with Gold plating, Tin plating, Silver plating and HASL
Hard Gold Plating : 50 µ”
Flash Gold Plating : 2~20µ”
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 14/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
ROUTER
The boards are cut as customer's required specifications.
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 15/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
B.B.T
The all boards are tested with the checking of all patterns and holes by electrical testing.Equipments : MicroCraft(EMMA), ATG, MANIA
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 16/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
FINAL INSPECTIONFor final board's inspection would be effected by the checking the board's specifications with customer's requirements and the general things, including the its shipping packages.
◈ Facilities & Process
CAM
AOI
HOT PRESS
DRILLING
CU PLATING
OUTER LAYER IMAGE
PSR
SURFACE FINISHING
ROUTER
B.B.T
FINAL INSPECTION
INNER LAYER IMAGE
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 17/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Probe Cards/Boards Burn-in Boards
Hi-fix Boards Load Boards / SOC Boards
◈ Product Types
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 18/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Typical ATC Controlled Impedance Boards
◈ Probe Cards/Boards (Controlled Impedance Boards)
SpecificationUnits
mm inch
Layers 14~52 14~52
Base materialFR-4
FR-4 High Tg
FR-4
FR-4 High Tg
Thickness 4.8~6.5 0.19~0.26
Conductor width 0.075 0.003
Conductor space 0.1 0.004
Min. Hole diameter ø 0.30 ø 0.012
Surface treatment
(Electro Hard /
Electroless Au Plating)
1.3µ m 50µ”
etc. HPL
Applications :
Semiconductor wafer probing & IC testing High-speed signal processing units High frequency communication equipment
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 19/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Typical ATC Burn-in Boards
◈ Burn-In Boards
SpecificationUnits
mm inch
Layers 4~22 4~22
Base material
FR-4, polyimide,
FR-4 High Tg,
BT-Resin
FR-4, polyimide,
FR-4 High Tg,
BT-Resin
Thickness 0.3~2.4 0.012~0.096
Conductor width 0.075 0.003
Conductor space 0.075 0.003
Min. Hole diameter ø 0.15 ø 0.006
Surface treatment
(Electro Hard /
Electroless Au Plating)
1.3µ m 50µ”
Pitch 0.4 0.016
Applications :
Semiconductor IC burn-in testing
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 20/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Typical ATC Hi-Fix Boards
◈ Hi-Fix Boards
SpecificationUnits
mm inch
Layers 12~68 12~68
Base material
FR-4
N4000-13SI
FR-4 High Tg
FR-4
N4000-13SI
FR-4 High Tg
Thickness 1.6-6.5 0.063-0.256
Conductor width 0.06 0.0024
Conductor space 0.075 0.003
Min. Hole diameter Φ 0.125 Φ 0.005
Surface treatment
(Electro Hard /
Electroless Au Plating)
1.3µ m 50µ”
Pitch 0.35 0.014
etc. HPL, Back Drill
Applications :
This is for evaluation of Electrical function and characteristic. This can be installed to multi type of Tester and Handler
68 Layers 6.5T IVH 0.4 Pitch
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 21/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Typical ATC Load Boards
◈ Load Boards / SOC Boards
SpecificationUnits
mm inch
Max. Number of Layers 62 62
Base materialFR-4
FR-4 High Tg
FR-4
FR-4 High Tg
Thickness 1.6~6.35 0.063~0.250
Conductor width 0.06 0.0024
Conductor space 0.075 0.003
Min. Hole diameter Φ 0.15 Φ 0.006
Surface treatment
(Electroless Au Plating)0.07µ m 2.8µ”
Pitch 0.4 0.016
etc. HPL, BUILD-UP
Applications :
This is for evaluation of Electrical function and characteristic. Used for evaluation of device function as from one to many quantity.
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 22/26 Rev. 5 (2013.08.08)
Ace Tech Circuit◈ Product Types Ⅱ
Build-Up Boards
DUT Boards
etc.
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 23/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
No. Model Manufacturer Purpose
1 CITS500S Polar Instruments Measuring Impedance
2 DSA8200 Tektronix Measuring Impedance
3 CMI900 Oxford Instruments Measuring thickness of gold plating
4 CMI700 Oxford Instruments Measuring thickness of copper plating
5 Premium-800C INTEK IMS Measuring in 3 Dimensions
6 Video Microscope IT System Sometech Measuring in 2 Dimensions (inner/outer Trace width)
7 PMG3 OLYMPUS Microscope (Cross Section , thickness of , Surface)
8 QM-HEIGHT 350 Mitutoyo Bow & Twist Test
9 U3B DAESUNG TECH Copper Peeling Test
10 Solder Pot YuYu measuring instrument Soldering Test & Thermal Stress Test
11 Labopol-5 Struers Grinding & Polishing
◈ Measuring instrument
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 24/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
General ATC Capabilities Overview
TEL:+82-31-500-6700, FAX :+82-31-500-6699 http://www.atc-kr.com/eng 25/26 Rev. 5 (2013.08.08)
Ace Tech Circuit◈ General ATC PCB Capabilities
DivisionStandard Advanced
mm inch mm inch
Impedance Control 10% 8%
PatternWidth
Inner Layer 0.075 0.003 0.06 0.0024
Outer Layer 0.090 0.0036 0.07 0.0028
BGA pitch 0.5 0.02 0.3 0.012
Immersion Gold 0.03µ m 1.2µ” 0.5µ m 20µ”
Electrolytic Hard Gold 0.5µ m 20µ” 1.5µ m 60µ”
Max. Number of Layers 48 70
Min. Hole Size 0.20 0.008 0.1 0.004
Max. Panel size 610 × 660 24.0 × 26.0 620 × 780 24.4 × 30.7
Max. Board Thickness 4.8 0.189 7.2 0.288
Max. Aspect Ratio on0.248" thickness
12 : 1 26 : 1
TEL : 031-500-6600, FAX : 031-500-6699 http://www.atc-kr.com 26/26 Rev. 5 (2013.08.08)
Ace Tech Circuit
Possibility of Operating Throwing Power for HighAspect Ratio
It is able to be handle
0.05~0.5um Gold thickness
by using ENIG
Minimize deviation of the rate of contraction byunused Exposure Film
The Realization of an Accurate Pattern
Get high reliability by
Hole plugging automation
Operate Marking Processwithout a Plate-Marking Net
Print out a Minute Typography, Be excellentin Location of its Typography/Marking
For special process
<Reverse Pulse Plating>
<LDI>
<Inkjet Marking>
<Flash Gold facility>
<Plugging M/C>
<Half Etching facility >
ATC leads technique markets of PCB testing semiconductor by using modern facilities
Such as Reverse Pulse Copper plating, LDI, Inkjet Marking machines.
◈ General ATC PCB Capabilities
