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Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

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Page 1: Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

Accelerating the Chip Design Process

1

Closing the Money Gap

EDAC Panel SessionSeptember 17, 2002

Dan GanousisPresident and CEO

Page 2: Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

Accelerating the Chip Design Process

2

Challenges in New Product Adoption Current Business Climate

Everyone is grumpy because of the economy Most budgets are limited to “must have” purchases

Accessibility No prospect ever has time for you Most prospects are geographically dispersed Most companies have strict travel restrictions

Credibility No designer believes anything an EDA vendor says Designers want to see your new tool work in

THEIR design environment Marketing

Intrusive Internet-based campaigns can be counter productive

Increasing design complexity makes it hard to find the right prospects

Page 3: Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

Accelerating the Chip Design Process

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Affect on an EDA Startup Funding is incredibly difficult

Controlling the cost of sales is paramount Marketing expenditures have to be extremely focused Talent is available, but you don’t have the money to hire them

Need access to a plethora of design flows It’s no longer acceptable just to be a member of a partner’s

alliance program Screenshots and demos won’t convince anyone – you need to

run the real application with the customer’s design data You need to be everywhere

The majority of prospects will need buy-in from designers who are in multiple locations

The majority of revenue is no longer in the US; now an international presence is critical, not a luxury

Page 4: Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

Accelerating the Chip Design Process

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AccelChip’s Solution

Product DevelopmentProduct Development

Design EngineersDesign Engineers

Regional Sales TeamsRegional Sales Teams Regional Sales TeamsRegional Sales Teams

Concept

Solution

Prospects

Requirements

Page 5: Accelerating the Chip Design Process 1 Closing the Money Gap EDAC Panel Session September 17, 2002 Dan Ganousis President and CEO

Accelerating the Chip Design Process

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Benefits Realized We’re reaching the right teams with the right message

Their design data in their design flow with our tool Unlimited accessibility – time zones are the only limitation Marketing with design engineers, not MBAs

Significantly reduced costs Travel expenses are limited to local sales team’s costs Maintenance and support of design flows is centralized Training of regional sales teams and distributors early and often

Improved Pre- and Post-Sales Support Prospects and customers have access to our design engineers

as well as our local Application Engineers and our hot-line Multi-vendor design flows are easily accessible Training as they want it when they want it Problem resolution more efficient with designer to developer

communication – we eliminate the middle man