Upload
sanjay-agarwal
View
214
Download
1
Embed Size (px)
Citation preview
A probabilistic approach to predict surface roughness in ceramic grinding
Sanjay Agarwal, P. Venkateswara Rao*
Department of Mechanical Engineering, Indian Institute of Technology, New Delhi 110 016, India
Received 29 July 2004; accepted 13 October 2004
Available online 23 November 2004
Abstract
The quality of the surface produced during ceramic grinding is important as it influences the performance of the finished part to great
extent. Hence, the estimation of surface roughness can cater to the requirements of performance evaluation. But, the surface finish is
governed by many factors and its experimental determination is laborious and time consuming. So the establishment of a model for the
reliable prediction of surface roughness is still a key issue for ceramic grinding. In this study, a new analytical surface roughness model is
developed on the basis of stochastic nature of the grinding process, governed mainly by the random geometry and the random distribution of
cutting edges. This model has been validated by the experimental results of silicon carbide grinding. The theoretical analysis yielded values
which agree reasonably well with the experimental results.
q 2004 Elsevier Ltd. All rights reserved.
Keywords: Analytical model; Ceramic grinding; Surface roughness; Chip thickness
1. Introduction
Advanced ceramics have been widely used in the
manufacturing of the workpieces with complex demands
in which materials of high performance are required due to
the unique combination of properties [1]. The advantage of
ceramics over other materials includes high hardness and
strength at elevated temperatures, chemical stability,
attractive high temperature wear resistance and low density
[2]. Structural ceramics such as silicon nitride, silicon
carbide are now being increasingly used in valves, packing
(sealing) elements, bearings, pistons, rotors and other
applications where a close dimensional tolerances, high
accuracy and good surface finish is required. However, the
benefits mentioned above are accompanied by difficulties
associated with machining in general and with grinding in
particular because of the high values of hardness and
stiffness of the ceramics and very low fracture toughness as
compared to metallic materials and alloys. Precision
ceramic components require strict adherence to close
tolerances and surface finish as the performance and
0890-6955/$ - see front matter q 2004 Elsevier Ltd. All rights reserved.
doi:10.1016/j.ijmachtools.2004.10.005
* Corresponding author. Tel.: C91 11 2659 1443; fax: C91 11 2658
2053.
E-mail address: [email protected] (P.V. Rao).
reliability of these components are greatly affected by the
accuracy and surface finish produced during the grinding
process. The grinding process, the most important step of
the advanced ceramic machining process, is highly complex
and involves the contact between a large number of abrasive
particles with the surface of the workpiece. The grinding
process allows a precise dimensional control and a good
superficial finishing but requires good decision making and
ability from the machine operator. Furthermore, the
grinding characteristics of advanced ceramics are very
much different from the ones for metals [3] and therefore, it
is necessary to perform further studies to achieve a more
comprehensive understanding and a better control of the
parameters in order to achieve good surface finish. The
finish produced on the workpiece surface is one of the most
important parameters in finish grinding. Despite various
research efforts in ceramic grinding over last two decades,
much needs to be established to standardize the theoretical
models for the prediction of surface roughness for
improving product quality and increasing productivity to
reduce machining cost. The effective use of ceramics in
industrial applications demands the machining of ceramics
with good surface finish and low surface damage. In order to
assess the effectiveness of ceramic grinding, experimental
or theoretical evaluation of surface roughness is essential.
International Journal of Machine Tools & Manufacture 45 (2005) 609–616
www.elsevier.com/locate/ijmactool
Nomenclature
t undeformed chip thickness, mm
b parameter of probability density function
E expected value
ycl center line distance, mm
p probability
A shaded area, mm2
ae wheel depth of cut, mm
vw table feed rate, m/min
vs wheel speed, m/s
Ra surface roughness, mm
erf error function
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616610
But, the experimental methods of surface finish evaluation
are costly and time consuming. So, an attempt has been
made to develop a theoretical model for the prediction of
surface roughness for the grinding of silicon carbide with
diamond abrasive.
A ground surface is produced by the action of large
number of cutting edges on the surface of the grinding
wheel. The groove produced on the workpiece surface by an
individual grain closely reflects the geometry of the grain tip
with little side flow of the work material. Thus, it is possible
to evaluate the surface roughness from the considerations of
the grain tip geometry. Since the size of these cutting edges
on the wheel surface is random in nature, the surface
roughness produced during grinding cannot be predicted in
a deterministic manner. Because of this randomness, a
probabilistic approach for the evaluation of surface rough-
ness is more appropriate and hence any attempt to estimate
surface roughness should be probabilistic in nature.
2. Literature review
The development of ceramic materials with enhanced
properties is leading to their widespread consideration for
structural applications. However, the actual utilization of
advanced ceramics has been quite limited mainly because of
the high cost of the machining these materials by grinding
while ensuring the workpiece quality. A technological basis
to achieve more efficient utilization of the grinding process
for ceramics requires an understanding of the interaction
between the abrasive and the workpiece which has direct
bearing on the surface finish produced. Extensive research
has been carried out to predict the surface roughness of the
workpiece manufactured by grinding. On the basis of
information available in the literature, theoretical methods
of surface roughness evaluation can be classified into
empirical and analytical methods. In the empirical method,
surface roughness models are normally developed as a
function of kinematic conditions [4]. The empirical model
developed by Suto and Sata [5] relates surface finish to the
number of active cutting edges using the experimental data
and it has been found to be having a logarithmic
relationship. Although empirical models have the advantage
that they require minimum efforts to develop and are used in
all fields of grinding technology but the inherent problem
associated with this method is that the model developed
under one grinding condition, cannot be used for surface
roughness prediction at other conditions, i.e. it can be used
for accurate description of the process within the limited
range of chosen parameters only. Hence the scope is limited.
To overcome the above-mentioned problem, analytical
models for surface roughness were tried out to predict the
surface roughness at different grinding conditions. The
analytical models are always preferred to empirical models
as these models are based on the fundamental laws which
use mathematical formulations of qualitative models.
Hence, these results can be made applicable to a wide
range of process conditions. The analytical models for
surface roughness have always been characterized by the
description of the microstructure of the grinding wheel in
one dimensional form taking the grain distance, the width of
cutting edge and the grain diameter into account and in two
dimensional forms by considering the grain count and the
ratio of width of cut to depth of cut. Lal and Shaw [6] used
similar approach to describe the surface roughness based on
chip thickness model. But this model does not require the
microstructure of the grinding wheel, thus it is more
successful in industry as it does not need the effort of wheel
characterization. Tonshoff et al. [7] have described the state
of art in the modeling and simulation of grinding processes
comparing different approaches to modeling. Furthermore,
the benefits as well as the limitations of the model
applications and simulation were discussed. This work
identified one simple basic model where all the parameters
such as wheel topography, material properties, etc. are
lumped into the empirical constant. Models developed for
the grinding process in the surface roughness analysis
[8–10] have assumed an orderly arrangement of the abrasive
grains on the grinding wheel. Zhou and Xi [11] have used a
conventional method to determine the surface roughness
based on the model using the mean value of the grain
protrusion heights. However, the predicted value of the
surface roughness based on traditional method is found to be
less than the measured value. To overcome this problem,
proposed method takes into consideration the random
distribution of the grain protrusion heights.
Several random models have been proposed [12–15] to
simulate the surface profile generated during grinding based
on the stochastic nature of the grinding process. In these
models, the abrasive grains on the grinding wheel have been
Fig. 1. Schematic view of the workpiece in Cartesian coordinate system.
Fig. 2. Sectional view showing the shape of groove generated.
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616 611
thought of as a number of small cutting points distributed
randomly over the wheel surface. Assuming a particular
probability distribution of these random cutting points,
output surface profiles have been generated for known input
surface profile and input grinding conditions. To simulate
the relative cutting path of grains, Steffens [16] has
performed a closed loop simulation, presupposing that
thermo-mechanical equilibrium has been established during
the grinding process. The input for this simulation program
will be the quantities like grinding wheel topography,
physical quantities of the system, set-up parameters of the
machine tool, and the temperature dependent material
properties, etc. Simulations can closely reproduce the
ground surface using probabilistic analysis; however,
the applicability of this programme is limited since the
simulation programme is based on the measurement of
microstructure of grinding wheel. This method is time-
consuming. Although many analytical models have been
developed based on the stochastic nature of the grinding
process but Basuray et al. [17] have proposed a simple
model for evaluating surface roughness in fine grinding
based on probabilistic approach. The concept of radial
distribution parameter and an effective profile depth
associated with the stochastic model have been used to
obtain the distribution of the grains on the wheel surface.
Results of the approximate analysis yield values that agree
reasonably well with the experimental results. However
many parameters and properties of materials were merged
into the empirical constants in this analysis. Hecker and
Liang [18] have also developed an analytical model for the
prediction of the arithmetic mean surface roughness based
on the probabilistic undeformed chip thickness model. This
model uses ground finish as a function of the wheel
microstructure, the process kinematic conditions and the
material properties. The material properties and the wheel
microstructure are considered in the surface roughness
through the chip thickness model. A simple expression that
relates the surface roughness with chip thickness was found,
which was verified using experimental data from cylindrical
grinding; however, the geometrical analysis of the grooves
left on the surface has been carried out considering the ideal
conic shape of grains which may not be true.
In most of the models developed so far, the transverse
shape of the grooves produced has been assumed to be
triangular. A simple abrasive grain on the wheel surface
generally has many tiny cutting points on its surface.
Experiments conducted by Lal and Shaw [19] with single
abrasive grain under fine grinding conditions indicates that
the grain tip could be better approximated by circular arc.
Therefore, it is evident that the groove produced by an
individual grain can be better approximated by an arc of a
circle. Based on the above analysis, it can be observed that
there is a need to develop an analytical model to predict the
surface roughness based on probabilistic approach to
represent the stochastic nature of the grinding process
considering the grooves to be a part of circular arc.
In this paper, an analytical model has been developed to
evaluate the arithmetic mean surface roughness from the
chip thickness probability density function and the relation-
ship between surface roughness and the chip thickness has
been established with the chip thickness as random variable.
3. Mathematical model for estimation
of surface roughness
A schematic diagram showing the interaction of the grain
tip to the workpiece is given in Fig. 1. At any transverse
section m–m, the profile of groove generated by any grain is
as shown in Fig. 2. Since an individual grain has many tiny
cutting points on its surface and the speed ratio is high, the
groove produced by an individual grain can be assumed to
be an arc of a circle.
It can be further assumed that the material is either
plowed with little side pile-up or removed in the form of
chips whenever grain-workpiece interference occurs. Since
the occurrence of grains on the wheel surface is random, a
probability density function is required to describe the
surface roughness for all the grains engaged. Thus, the
undeformed chip thickness t can be better described by
Rayleigh’s probability density function f(t) [18] as
f ðtÞ ¼t
b2
� �exp �
1
2
t
b
� �2� �for tR0
0 for t!0
8<: (1)
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616612
where b is a parameter that completely defines the
probability density function and it depends upon the cutting
conditions, the direction of grinding wheel, the properties of
workpiece material, etc. The expected value of the above
function is given as
EðtÞ Z
ffiffiffiffip
2
rb
The surface roughness, Ra, is defined as the arithmetic
average of the absolute values of the deviations of the
surface profile height from the mean line within the
sampling length l. Therefore, the surface roughness Ra can
be expressed as
Ra Z1
l
ðl
0jy Kycljdl (2)
where ycl denotes the distance of the center line, drawn in
such a way that the areas above and below it are equal (Fig. 3).
It can also be expressed statistically as
Ra Z1
l
ðymax
ymin
jy KycljpðyÞdy
where ymax and ymin are the lowest and highest peak height of
the surface profile and p(y) is the probability that height of
grain has a particular value y and may be expressed as
pðyÞ Z limDy/0
probabilityfy K ð1=2ÞDy%y%y C ð1=2ÞDyg
Dy
The surface roughness, Ra, can be calculated using
probability density function defined in Eq. (1). The complete
description of surface generated is very difficult due to the
complex behavior of different grains producing grooves
because of the random grain-work interaction. Thus, certain
assumptions have to be made while predicting the surface
roughness. The assumptions are given below:
(1)
An individual grain has many tiny cutting points in itssurface, therefore, for simplicity, the grain tips are
approximated as hemispheres of diameter dg (Z2t),
randomly distributed throughout the wheel volume.
Fig. 3. Profile of groo
(2)
ves g
The profile of the grooves generated is same and
completely defined by the depth of engagement or
undeformed chip thickness t
(3)
There is no groove overlapping(4)
On an average, the expected area of interference of graintip and workpiece surface is about half of the area of a
circle.
Under these assumptions, the profile generated by the
grain is as shown in Fig. 3.
As per definition of surface roughness, the area above and
below the centre line must be equal. Hence the total expected
area can be written as
EfAðtÞg Z 0 (3)
The above expression can be represented in terms of the
probability density function f(t) asðN
0AðtÞf ðtÞdt Z 0 (4)
During the grain–work interaction in the grinding, two
types of grooves are generated depending upon their depth of
engagement is either less or greater than centre line ycl. For
the case when the depth of engagement is less than ycl, the
expected value of area can be expressed as
EfAðt1Þg Z
ðycl
0Aðt1Þf ðtÞdt Z
ðycl
0A1f ðtÞdt (4a)
Similarly, for the groove with depth of engagement
greater than ycl, it can be expressed as
EfAðt2Þg Z
ðN
ycl
Aðt2Þf ðtÞdt Z
ðN
ycl
ðAupper2 KAlower
2 Þf ðtÞdt
(4b)
Substituting the values from Eqs. (4a) and (4b), in Eq. (3),
equation becomesðycl
0A1f ðtÞdt C
ðN
ycl
ðAupper2 KAlower
2 Þf ðtÞdt Z 0 (5)
or,
p1EðA1ÞCp2fEðAupper2 ÞKEðAlower
2 Þg Z 0 (6)
enerated.
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616 613
where p1 and p2 are the probabilities defined in terms of the
chip thickness probability density function f(t) and are given
by
p1 Z
ðycl
0f ðtÞdt for t!ycl (7)
p2 Z
ðN
ycl
f ðtÞdt for tOycl (8)
The expected area value, for the groove with depth less
than centre line contributing to surface roughness Ra, can be
calculated as
EðA1Þ Z 2yclEðt1ÞKp
2Eðt2
1Þ (9)
where A1 is the intercepted area between grain and the centre
line contributing to surface roughness (Ra) as shown in Fig. 3.
Similarly, the expected area value for the groove with
depth greater than the centre line contributing to surface
roughness (Ra) will be given as
EðAupper2 Þ Z 2yclEðt2ÞK
p
2Eðt2
2ÞCE t22 sinK1 k
t2
� �� �
KE k
ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiðt2
2 Kk2Þ
q� �ð10Þ
EðAlower2 Þ Z E t2
2 sinK1 k
t2
� �� �KE k
ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiðt2
2 Kk2Þ
q� �(11)
where 2k is the intercepted length on the center line by the
grain having depth of engagement greater than center line
distance and, Alower2 and A
upper2 are the areas below and above
the centre line as shown in Fig. 3. Rewriting the Eq. (6) after
substituting the expected values from Eqs. (9)–(11) as
2yclfp1Eðt1ÞCp2Eðt2Þg Zp
2fp1Eðt2
1ÞCp2Eðt22Þg (12)
To calculate the expected values in the above equation
requires another probability density function for the cases
where the chip thickness is smaller and greater than the centre
line ycl. Therefore, for the grains having depth of engagement
lying between 0 and ycl, the probability density function of
the chip thickness will be given by the conditional probability
density function f1(t) as
f1ðtÞ Z f1ðtj0% t!yclÞ Zf ðtÞÐ ycl
0 f ðtÞdt(13)
and for rest of the chip thickness, i.e. for the grains lying
above ycl, the conditional probability density function f(t2)
will be given by
f2ðtÞ Z f2ðtjycl% t!NÞ Zf ðtÞÐN
yclf ðtÞdt
(14)
Substituting the Eqs. (7), (8), (13) and (14) in Eq. (12) to find
ycl. After simplification the expression for centre line can be
expressed as
ycl Zp
4
� Eðt2Þ
EðtÞ
� �(15)
substituting the expected values from Eqs. (A2) and (A4), and
after mathematical simplification, the value of the centre line
will be
ycl Z
ffiffiffiffip
2
rb (16)
For the calculation of surface roughness, two types of
grooves are considered. Since the contribution of the two
types of grooves considered is different, thus, the total
expected value of surface roughness can be calculated as
EðRaÞ Z p1EðRa1ÞCp2EðRa2Þ (17)
where E(Ra1) and E(Ra2) are the expected values of the
surface roughness for depth of engagement smaller or greater
than ycl and these values can be calculated by the definition of
the surface roughness. As per this, the surface roughness can
be calculated by adding the area between the profile and the
centre line and divide it by the total profile length. Hence
from Fig. 3, the values can be written as
EðRa1Þ Z EA1
2t1
� �(18)
EðRa2Þ Z EA
upper2 CAlower
2
2t2
� �(19)
Rewriting the Eqs. (18) and (19) after substituting the
expressions of A1, Aupper2 and Alower
2 from Eqs. (9)–(11) as
EðRa1Þ Z ycl Kp
4
�Eðt1Þ (20)
EðRa2Þ Z ycl Kp
4
�Eðt2ÞCE t2 sinK1
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !
KyclE
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !(21)
Substituting the expected values of E(t1), E(t2),
E t2 sinK1
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !and E
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !
from Eqs. (A8), (A10), (A13) and (A16) in Eqs. (20) and (21)
and then from Eq. (17), the expected value of surface
roughness can be expressed as
EðRaÞ Z 0:532b (22)
It can also be expressed in terms of the expected value of
chip thickness E(t) by replacing b in terms of E(t) from
Eq. (A2) as given below:
b Z 0:795EðtÞ
Table 1
Experimental values of surface roughness at different values of kinematic parameters
Experiment no. 1 2 3 4 5 6 7 8 9
ae (mm) 5 5 5 10 10 10 15 15 15
vs/vw 440 220 146 440 220 146 440 220 146
Ra,experimental (mm) 0.184 0.271 0.329 0.206 0.297 0.367 0.220 0.331 0.394
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616614
substituting this value in Eq. (22), expression becomes
EðRaÞ Z 0:423EðtÞ (23)
Eq. (23) shows a proportional relationship between the
surface roughness and the chip thickness expected value
under the assumption that the profile of grove generated by an
individual grain to be a semi-circular in shape and the
phenomena like back transferring of material, grain overlap-
ping, etc. are absent.
4. Validation of the surface roughness model
The grinding process has been the object of technological
research for last few decades. Grinding processes, from a
very early period, have been described by means of the
models. These models have their own domain of application
and hence the selection of the required model depends on the
need. In order to reduce the difficulty associated with the
experimental analysis, grinding processes are modeled
theoretically. Models contribute significantly to the compre-
hension of the process itself, and form the basis for the
simulation of the grinding process. They, thus create a
precondition for increased efficiency while ensuring a high
quality. The present work focuses on the prediction of surface
roughness based on the chip thickness model. The chip
thickness models play a major role in predicting the surface
quality. The chip thickness is a variable often used to describe
the quality of ground surfaces as well as to evaluate the
competitiveness of the overall grinding system. A new chip
thickness model has been developed for the performance
assessment of SiC grinding by incorporating the modulus
Fig. 4. Comparison of calculated and experimental va
elasticity of the grinding wheel and workpiece system into
account for elastic deformation in addition to other factors
such as speed ratio, depth of cut, the equivalent diameter of
the wheel, etc. [20]. This model is based on the deflections of
the wheel caused by grinding forces.
A model has to be evaluated to determine its validity. The
validity of the model is assessed through a comparison
between the predicted value and measured value of the
surface roughness within the predefined range of parameters.
The analytical surface roughness model has to be validated
by comparing the results obtained at different kinematic
conditions with the experimental results of the earlier study
[20]. The work material taken was silicon carbide with
hardness 2700 Hv and modulus of elasticity 410 GPa and the
tool was diamond grinding wheel (ASD240R100 B2) with
modulus of elasticity 70 GPa and aluminium as core material.
The other conditions taken for the experimentation are as
follows: wheel speed 36.6 m/s, wheel diameter 250 mm,
wheel width 19 mm. The kinematic parameters considered
for each experiment are depth of cut (ae) and the speed ratio
(vs/vw) where vw is the feed rate and vs is the wheel speed,
along with the experimental value of surface roughness as
shown in Table 1.
By making use of model developed in [20], the expected
value of chip thickness was calculated for each experiment.
The deviation of the surface roughness calculated with the
new model from the experimental values, for various values
of feeds and depth of cut is shown in Fig. 4. The center-line
average value of surface roughness (Ra) has been
compared with results obtained from theoretical model. It
can be found from Fig. 4 that there is a good agreement
between the two.
lues of surface roughness in ceramic grinding.
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616 615
5. Conclusions
In this paper, a simple analytical model is proposed for
estimating the surface roughness by considering the random
distribution of the grain protrusion heights and by assuming
the profile of groove generated by an individual grain to be an
arc of a circle. The values obtained with the proposed model
yields results that are consistent with the experimental values.
This model can be used for the performance evaluation of the
ceramic grinding process without conducting laborious
experimentation.
Appendix A
While developing the mathematical model for the
estimation of surface roughness, various expected values
are required to be calculated. These expected values are
required for the calculation of center line position and
establishment of surface roughness equation. These expected
values are substituted at various stages of mathematical
analysis. Calculations for these expected values are given
below.
A.1. Calculation of center line position, ycl (Eq. (15)
The calculation of the center line position, ycl, Eq. (15)
requires the calculation of the value of the undeformed chip
thickness t and square of the undeformed chip thickness t2.
These expected values can be calculated as
EðtÞ Z
ðN
0tf ðtÞdt Z Kt eKt2=2b2
C
ffiffiffiffip
2
rb erf
tffiffiffiffiffiffiffi2b2
p !" #N
0
(A1)
that gives the value of E(t) as
EðtÞ Z
ffiffiffiffip
2
rb Z 1:257b (A2)
Similarly,
Eðt2Þ Z
ðN
0t2f ðtÞdt Z
ðN
0
t3
b2eKt2=2b2
dt (A3)
it will give the value as
Eðt2Þ Z ½eKt2=2b2
ðK2b2 K t2ÞN0 Z 2b2 (A4)
where b is the parameter that completely defines the
probability density function as in Eq. (1).
A.2. Calculation of surface roughness, Ra (Eqs. (17), (20),
and (21))
The probability that an undeformed chip thickness value t
is smaller than the center line position, ycl, can be calculated
as
p1 Z
ðycl
0f ðtÞdt Z 1 KeKy2
cl=2b2
(A5)
Thus, as per definition of probability density function, the
probability of a undeformed chip thickness to be greater than
center line position, ycl, will be
p2 Z 1 Kp1 Z eKy2cl=2b2
(A6)
The expected value of chip thickness smaller than ycl can
be calculated by using the conditional probability density
function (Eq. (13)), giving the expected value in this region
as:
Eðt1Þ Z1
p1
ðycl
0tf ðtÞdt (A7)
after solving the above integration and limit evaluation, it can
be expressed as
Eðt1Þ ¼1
1 KeKy2cl=2b2 Ky cl eKy2
cl=2b2
þ
ffiffiffiffip
2
rb erf
yclffiffiffiffiffiffiffi2b2
p !" #
After simplification, it can be written as
Eðt1Þ Z 0:76b (A8)
In the same way, the expected value of chip thickness
greater than center line position, ycl, can be calculated as
Eðt2Þ Z1
p2
ðN
ycl
tf ðtÞdt (A9)
Using the Eq. (14), the above integration after limit
evaluation can be expressed as
Eðt2Þ Z1
eKy2cl=2b2
ffiffiffiffip
2
rCeKy2
cl=2b2
ycl K
ffiffiffiffip
2
rerf
yclffiffiffiffiffiffiffi2b2
p !" #
or,
Eðt2Þ Z 1:85b (A10)
Two more expected values are required to be calculated to
compute the surface roughness for the chips whose chip
thickness value is more than ycl, as given by Eq. (21).
Expected value,
E
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !;
can be calculated as
EfFðt2Þg Z1
p2
ðN
ycl
FðtÞf ðtÞdt (A11)
where
Fðt2Þ Z
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s
S. Agarwal, P.V. Rao / International Journal of Machine Tools & Manufacture 45 (2005) 609–616616
After transformation of Eq. (A11) in terms of z, which is a
function of t, the equation becomes
EfFðt2Þg Z
ðN
0eKzf ðzÞdz (A12)
where
z Zt2
2b2and f ðzÞ Z eK
ffiffiffiffipz
p
ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 C
ffiffiffiffip
z
rs
Solving the above integration gives the value asðN
0eKzf ðzÞdz Z 0:534
Therefore, the expected value is
E
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !Z 0:534 (A13)
In the same way, the expected value,
E t2 sinK1
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !
can be written as
EfGðt2Þg Z1
p2
ðN
ycl
GðtÞf ðtÞdt (A14)
where
Gðt2Þ Z t2 sinK1
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s
It can be expressed, in terms of z, which is a function of t,
as
EfGðt2Þg Z b
ðN
0eKzf ðzÞdz (A15)
where
z Zt2
2b2and f ðzÞ Z eK
ffiffiffiffipz
pffiffiffiffiffi2z
pC
ffiffiffip2
p� �2ffiffiffiffiffi2z
p
!sinK1
ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
1
2ffiffiffizp
pC1
�2
vuutAfter solving the above integration, the expected value
can be written as
E t2 sinK1
ffiffiffiffiffiffiffiffiffiffiffiffiffiffi1 K
y2cl
t22
s !Z 1:23b (A16)
References
[1] E.C. Bianchi, P.R. Aguiar, E.J. da Silva, C.E. da Silva Jr.,
C.A. Fortulan, Advanced ceramics: evaluation of ground surface,
Ceramica 49 (2003) 174–177.
[2] B.P. Bandyoupadhyay, The effects of grinding parameters on the
strength and surface finish of two silicon nitride ceramics, Journal of
Material Processing Technology 53 (1995) 533–543.
[3] J.E. Mayar Jr., G.P. Fang, Diamond grinding of silicon nitride, NIST
S.P. 647 (1993) 205–222.
[4] S. Malkin, Grinding Technology: Theory and Applications of
Machining with Abrasives, Ellis Horwood, Chichester, 1989.
[5] T. Suto, T. Sata, Simulation of grinding process based on wheel surface
characteristics, Bulletin of Japan Society of Precision Engineering 15
(1) (1981) 27–33.
[6] G.K. Lal, M.C. Shaw, The role of grain tip radius in fine
grinding, Journal of Engineering for Industry August (1975) 1119–
1125.
[7] H. Tonshoff, J. Peters, I. Inasaki, T. Paul, Modeling and simulation of
grinding processes, Annals of CIRP 41 (2) (1992) 677–688.
[8] K. Nakayama, M.C. Shaw, Study of finish produced in surface grinding,
part 2, Proceeding of the Institution of Mechanical Engineers 182
(1967–68) 179–194.
[9] K. Sato, On the surface roughness in grinding, Technology Reports,
Tohoku University 20 (1955) 59–70.
[10] C. Yang, M.C. Shaw, The grinding of titanium alloys, Transactions of
ASME 77 (1955) 645–660.
[11] X. Zhou, F. Xi, Modeling and predicting surface roughness of the
grinding process, International Journal of Machine Tools and
Manufacture 42 (2002) 969–977.
[12] H. Yoshikawa, T. Sata, Simulated grinding process by Monte-Carlo
method, Annals of CIRP 16 (1968) 297–302.
[13] J. Peklenik, Contribution to the correlation theory for the grinding
process, Journal of Engineering for Industry 86 (1964) 85–94.
[14] S.J. Deutsch, S.M. Wu, Selection of sampling parameters for modeling
grinding wheels, Journal of Engineering for Industry 92 (1970) 667–
676.
[15] S.S. Law, S.M. Wu, Simulation study of the grinding process, Journal of
Engineering for Industry 95 (1973) 972–978.
[16] K. Steffens, Closed loop simulation of grinding, Annals of CIRP 32 (1)
(1983) 255–259.
[17] P. Basuray, B. Sahay, G. Lal, A simple model for evaluating surface
roughness in fine grinding, International Journal of Machine Tool
Design and Research 20 (1980) 265–273.
[18] R.L. Hecker, S. Liang, Predictive modeling of surface roughness in
grinding, International Journal of Machine Tools and Manufacture 43
(2003) 755–761.
[19] G.K. Lal, M.C. Shaw, Wear of single abrasive grain in fine grinding,
Proceedings of the International Grinding Conference, Carnegie-
Mellon university, Pittsburgh, USA 1972; 107.
[20] A.V. Gopal, P. Venkateswara Rao, A new chip thickness model
for performance assessment of silicon carbide grinding, Inter-
national Journal of Advanced Manufacturing Technology 2004;
in press.