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A 2 4 Processors System on Chip FP GA Design w ith Netw ork on Chip By Zhoukun WANG and Omar HAMMAMI, ENSTA ParisTech Paris, France Abstract : In this paper we present a single FPGA chip implementation of a NOC based shared memory multiprocessor system with 24 processors connected to a main memory composed of 4 DDR2 banks. All the processors and DDR2 memories ar e connected to a NOC through Ope n Core Protocol (OCP-IP) interfac e. The MPSOC have been validated and evaluated through actual execution with matrix multiplication application. A Global Asynchronous Local Synchronous (GALS) design methodology have been adopted throughout the design cycle and exploited for clock trees designs. I. I ntroduction To reduce the pressure of time-to-market and tackle the increasin g complexity of SoC, the need of fast prototyping and testing is growing [1]. Taking advantage of deep submicron technology, modern FPGAs provide a fast and low-cost prototyping with large logic resources and high performance. As Multiprocessor Systems-on-Chip (MPSoCs ) [2] are strongly emerging for i mplementing embedded systems, the convention al interconn ecting modes, such as buses and crossbars, cannot satisfy MPSOC's requirements of performance, area as well as scalabilit y and reliability. Network On-Chip (NOC) [3] has been propos ed as a systematic approach to deal with the communication-centric design challenge. Modular structure of NoC makes multiprocessor architecture scalable and improves reliability and operation frequency of on chip modules. Furthermore the NoC approach offers matchless opportunities for implementing Globally Asynchronous, Locally Synchronous (GALS) design, which make clock distribution an d timing closure problems more manageable. In this paper we present a NOC based shared memory multiprocessor system with 24 Processing Elements (PEs) and four DDR2 memory banks. All the PEs and memory controllers are connect ed with a scalable NOC developed with Arteris Danube library[7]. The rest of paper is organiz ed as follow. In section II, we will introduce the overall architecture, detail of PE and NOC connection. Section III will discuss GALS clock strategy. The results of evaluation and implementation will be shown in section IV. Relate d work on multiprocessor on chip is described Section V. Finally, we will conclude in Section VI. II. Architecture A. Overall Architecture We target a shared memory multiprocess or architecture with 4 external memory banks (M) and 24 proc essor element (P) connected through 2 network-on-chip: (1) request network (2) response network. Fig.1 Shared Memory Multiprocessor with Request and Response Network-on-Chip The IOs are not described as this is a parametrizable element of the architecture. Our IP base design will be based on Xilinx IP for the e mbedded processor [10 ], Arteris Danube Library for NOC I Ps [5, 6, 7] and custom designed IPs for OCP-IP compliant interfaces [4]. The block diagram of the overall multiprocessor architecture is illustrated in Fig.2. The multiprocessor system comprises 24 Processing Elements A 24 Processors Sy stem on Chip FP GA Desig n wit h Network on Ch ip h tt p://www .d es ig n-r euse.c om /ar ti cles/?id=21 58 3& pr int= y e 1 of 8 11/ 29/2011 6: 41 P

A 24 Processors System on Chip FPGA Design With Network on Chip

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A 24 Processors System on Chip FPGA Design w ith

Network on Chip

By Zhoukun WANG and Omar HAMMAMI, ENSTA ParisTech

Paris, France

Abstract :

In this paper we present a single FPGA chip implementation of a NOC based shared memory multiprocessor

system with 24 processors connected to a main memory composed of 4 DDR2 banks. All the processors and DDR2memories are connected to a NOC through Open Core Protocol (OCP-IP) interface. The MPSOC have been

validated and evaluated through actual execution with matrix multiplication application. A Global Asynchronous

Local Synchronous (GALS) design methodology have been adopted throughout the design cycle and exploited forclock trees designs.

I. I ntroduction

To reduce the pressure of time-to-market and tackle the increasing complexity of SoC, the need of fast

prototyping and testing is growing [1]. Taking advantage of deep submicron technology, modern FPGAs provide a

fast and low-cost prototyping with large logic resources and high performance. As Multiprocessor Systems-on-Chip(MPSoCs) [2] are strongly emerging for implementing embedded systems, the conventional interconnecting

modes, such as buses and crossbars, cannot satisfy MPSOC's requirements of performance, area as well as

scalability and reliability. Network On-Chip (NOC) [3] has been proposed as a systematic approach to deal withthe communication-centric design challenge. Modular structure of NoC makes multiprocessor architecture scalable

and improves reliability and operation frequency of on chip modules. Furthermore the NoC approach offers

matchless opportunities for implementing Globally Asynchronous, Locally Synchronous (GALS) design, which make

clock distribution and timing closure problems more manageable.

In this paper we present a NOC based shared memory multiprocessor system with 24 Processing Elements (PEs)

and four DDR2 memory banks. All the PEs and memory controllers are connected with a scalable NOC developedwith Arteris Danube library[7].

The rest of paper is organized as follow. In section II, we will introduce the overall architecture, detail of PE andNOC connection. Section III will discuss GALS clock strategy. The results of evaluation and implementation will be

shown in section IV. Related work on multiprocessor on chip is described Section V. Finally, we will conclude in

Section VI.

II. Architecture

A. Overall Architecture

We target a shared memory multiprocessor architecture with 4 external memory banks (M) and 24 processor

element (P) connected through 2 network-on-chip: (1) request network (2) response network.

Fig.1 Shared Memory Multiprocessor with Request and Response Network-on-Chip

The IOs are not described as this is a parametrizable element of the architecture.

Our IP base design will be based on Xilinx IP for the embedded processor [10], Arteris Danube Library for NOC IPs[5, 6, 7] and custom designed IPs for OCP-IP compliant interfaces [4]. The block diagram of the overall

multiprocessor architecture is illustrated in Fig.2. The multiprocessor system comprises 24 Processing Elements

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(PE), which can independently run their own program code and operating system. These MicroBlaze processorbased PEs are connected to switches through OCP-to-NTTP Network Interface Units (NI). The OCP-to-NTTP NI, or

called Master NI, translates OCP to our NOC protocol: Arteris NoC Transaction and Transport Protocol (NTTP). The

switching system is connected to four NTTP-to-OCP NIs (Slave NI), which in turn connect to the respective DDR2

memory controller. Each DDR2 controller controls an off-chip DDR2 memory bank (256Mbytes).

Fig.2 Block diagram of overall architecture

B. Processing Element

To increase the compatibility and to ease the reutilization of the architecture, the OCP-IP standard is used for the

connection of PEs and NOC. Benefiting from the OCP standard, any processor with OCP interface can be easily

connected on our system. The MicroBlaze based computing system is integrated as a PE in our FPGA design.

Fig.3 MicroBlaze based Processing Element

The Xilinx processing soft-core MicroBlaze V7.00 [10] is a 32bit reduced instruction set computer (RISC) optimized

for implementation in Xilinx Field Programmable Gate Array (FPGA), and MicroBlaze processor IP and its memory

connecting IPs are provided in the library of our FPGA design environment: Xilinx Embedded Development Kit(EDK) [10]. The MicroBlaze processor is implemented with Harvard memory architecture; instruction and data

accesses are done in separate address spaces and it is highly configurable. A set of parameters can be configured

at design time to fit design requirement, such as number of pipeline stages, cache size, interfaces and executionunits like: selectable Barrel Shifter (BS), Floating Point Unit (FPU), hardware divider (HWD), hardware multiplier

(HWM), Memory Management Unit (MMU). The performance and the maximum execution frequency vary

depending on processor configuration. For its communication purposes, MicroBlaze v7.00 offers a Processor Local

Bus (PLB) interface and up to 16 Fast Simplex Link (FSL) interfaces which is a point to point FIFO-basedcommunication channel. As shown in Fig.3, the MicroBlaze is connected to its Instruction side Local Memory Bus

(ILMB) controller and Data side Local Memory Bus (DLMB) controller through ILMB and DLMB respectively. Twomemory controllers control 32KByte BRAM based local on-chip memory. As OCP interface is not provided byMicroBlaze, an OCP adapter, which can translate FSL interface to OCP interface have been designed and integrated

in PE subsystem for the connection to the NOC.

C. NOC

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Our Network On-Chip connection system is developed with the NoCcompiler and the Danube library from theArteris [4,5,6]. The NOC is composed of a request part and a response part, and the request and response

transactions are exchanged between Master NI and Slave NI. The NOC protocol, NTTP, is a three-layered approach

comprising transaction, transport and physical layers. NTTP uses the packet-based wormhole scheduling technique.

As shown in Fig.4, the request packets are composed of three different cells: (1) a header cell, (2) a necker celland possibly one or more (3) data cells.

Fig.4 NTTP request packet and response packet

The header cells contain information relative to routing, payload size, packet type, and the packet target address.

The necker cell provides detailed addressing information of the target. The necker cell is not needed in response

packet.

The transaction layer is compatible with bus-based transaction protocol implemented in NIs. NI translates

third-party protocols to NTTP at the boundary of NoC. We used OCP-to-NTTP NIs to convert OCP 2.2 protocol toNTTP protocol. The OCP basic signals, burst extensions signals and "MFlag" signal are used, as listed in Table1. The

data width of MData and SDatae are 64bits. The OCP initiator can optionally associate a pressure level to requestsin order to indicate service priorities at arbitration points. The pressure-level is passed to the NoC via the "MFlag"

input signal, and applies to the "Pressure" field in the packet header cell, as well as the "press" signals in thephysical link layer. The locked synchronization is support in our NOC. OCP initiator can use the ReadExcusive

(ReadEX) command and Write or WriteNonpost command to perform a read-modify-write atomic transaction. NI

sends a Lock request packet when it receives the ReadEX command. The Lock request locks the path from OCPmaster to the OCP slave. During the locked period, the other Masters cannot access the locked slave until the OCP

master that requested ReadEX send Write or WriteNonPost command to unlock the path.

TABLE 1: The signals for the implemented OCP interface

Function

MCmd master Transfer command basic

MAddr master Transfer address basic

MBurstLen master Burst length burst

MData master Write data basic

MDataValid master Write data valid basic

MDataLast master Last write data in burst burst

MRespAcc master accepts response basic

MFlag master flag for pressure level press

SCmdAcc Slave accepts transfer basic

SDataAcc Slave accepts write data basic

SResp slave Transfer response basic

SData slave Read data basic

SRespLast slave Last response in burst burst

As shown in Fig.2, the NOC is a cascading multistage interconnection network (MIN), which contains 8 switches for

request as well as 8 switches for response. 24 OCP-to-NTTP NIs and 4 NTTP-to-OCP NIs are integrated at theboundary of NOC. The OCP-to-NTTP NI converts the OCP master interface to NTTP interface and connects PE to

first stage switches. First stage switches are comprised of three 8*4 switches, while the second stage contains four

3*1 switches. Each output port of switch in second stage is connected to a NTTP-to-OCP NI, which in turn connectsto DDR2 memory controller.

III . Bi-Synchronous FIFO in GALS architecture

To improve the performance and reduce the power consumption of system, the GALS approach is adopted by using

Bi-Synchronization method in our design. The GALS approach has been proposed to solve the timing closureproblem in deep sub-micron processes by partitioning the SoC into isolated synchronous subsystems that hold ownindependent frequency.

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Fig.5 Block diagram of OCP adapter

To tackle the communication issue between two different clock domains, The Bi-synchronous FSL has beenintegrated between MicroBlaze and OCP Adapter (shown in Fig 5). The FIFO based Bi-synchronous FSL [10] makes

PE and NOC as isolated synchronous islands with independent clock frequencies. Each Bi-synchronous FIFO has 2clock inputs: M_CLK and S_CLK. The master of FSL operates at the frequency of M_CLK, while the slave of FSL

runs at the frequency of S_CLK. In our FPGA design, on chip Virtex-4 Xilinx Digital Clock Managers (DCM) [9]generate different frequencies for each clock island. Thus each PE and NOC run at their own clock frequencies

which eases the clock distribution problem and reduces the length of clock signal.

IV. Implementation and Per formance Evaluation

A. Implementation

The whole multiprocessor system have been implemented on Xilinx FPGA Virtex-4 FX140 device [9] and

Alpha-Data FPGA platform card ADPe-XRC-4 [8]. The ADPe-XRC-4 is a high performance reconfigurable PCI

express board based on the Virtex-4 FX140 including 1 GByte DDR2 SDRAM in 4 independent banks andprogrammable Clock generator. The multiprocessor have been synthesized, place dand routed with Xilinx ISE [11]

tool. The resulting floorplan is shown in Fig. 6.

Fig.6 Floorplan of 24 PE SoC on Xilinx Virtex4FX140

The percentage of FPGA resource utilization is presented in Table2.

TABLE 2: FPGA resource utilization

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Resource Number Percentage

RAMB16s 384 /552 69%

DSP48s 72 / 192 37%

Slices 55266 / 63168 87%

Clearly it is possible to add hardware accelerators in order to exploit the remaining 13% of slices and 63% of theDSP48. In addition local memories and cache memories can be extended to exploit the remaining 31% of 

RAMB16s. This allows customization of the multiprocessor platforms to various needs. It should be noted as well

that both hardcore PPC405 on the Virtex-4 FX140 have not been used and could be obviously used with little extradesign effort for additional customization.

B. Performance Evaluation

For the evaluation of our NOC based MPSoC platform, we chose the matrix multiplication as our evaluating target,

which is wildly used in scientific application. Due to its large multi-dimensional data array, it is extremely

demanding in computation power and meanwhile it is potential to achieve its best performance in a parallelarchitecture. We used a course-grained parallel algorithm. We suppose that A is an M*K matrix, B is a K*N matrix,

and the result C is an M*N matrix. In the phase of task dispatch, A is partitioned into M/b1 blocks, where b1

indicates the buffer size of each processing element for the first matrix, i.e. each PE can buffer b rows of Kelements at each iteration. If M cannot be divided by b evenly, the last block contains the remaining rows which

are less than b. In same fashion, B is partitioned into N/b2 blocks, where b2 indicates the buffer size within each

node for the second matrix. After this partitioning is done, each calculating node works with the blocks from Acorresponding to its node number, i.e. the nth node works on the bth block where (b mod n = P) (P: Total number

of processing elements.) and the entire B. So at each iteration, it reads in the one block of A, which is thenmultiplied with all the blocks of B, resulting in a b1 * N partial result matrix. The partial result is first stored in theresult buffer of each node and is stored in the corresponding memory location (according to the row number, the

column is complete) before the start of the following iteration.

Fig.7 Evaluation of platform with 96*96 matrix multiplication application

We take the size of matrix A as 96*96, while the size of matrix B is 96*96. Both of buffer size b1 and b2 equal 4,

thus when all 24 PEs work in parallel, the matrix A and matrix B can be partitioned into 24 blocks. As shown in Fig.

7, we use different number of PEs to do this matrix multiplication. The speedup of 12 PEs is 11.28 in comparisonwith single PE, while the speedup of 24 PEs is 22.

V. Related w ork

Multiprocessors System on Chips are strongly emerging and several products or ongoing R&D projects are tackling

the issues related to multiprocessors [12-22].

Table 3 provides a few examples of commercial multicore implementations. They can be globally divided in 2

categories: (1) general purpose (2) application specific. In the first category we can place the ARM ARM11MPcore[13], the MIPS MIPS32 1004 Core [14] and the Renesas/Hitachi SH-X3 [15]. In the second category we can place

Texas Instruments TMS320C6474/TMS320VC5441 DSP [18, 19], Freescale QorIQ P4080 [20] and the Toshiba

Venezia multicore [21]. Other worth noting are Ambric [16], MAPS-TCT [22] and [12].

TABLE 3: Multicore Implementation

MPSOC Part Com PE nbr

ARM ARM11 Shared Bus 4

Texas Instruments TMS320C6474 Switch Central Resource 3

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Texas Instruments TMS320VC5441 Shared Bus/HPI 4

Freescale QorIQ™ P4080 Corenet Coherency fabric 8

MIPS 1004K™ Core Coherence Manager 4

Toshiba Venezia EX Bus 8

The ARM11 MPcore [13] is a classical shared memory 4 processors based multiprocessor based on a shared busarchitecture with a snoopy cache coherency protocol (MESI). The MIPS32 1004 [14] is a 1 to 4 multi-threaded

"base" cores (up to 8 hardware threads) with Coherence Management (CM) unit - the system "glue" for managing

coherent operation between cores and I/O, I/O Coherence Unit (IOCU) - hardware block for offloading I/Ocoherence from software implementation on CPUs. Several multicore architectures are proposed by Texas

Instruments [17]. The Texas Instruments TMS320C6474 [18] is a 3 DSP based multicore architecture with switch

central resource (SRC) as the interconnection between the 3 DSP and the memories. The 6474 device contains 2switch fabrics through which masters and slaves communicate: (1) data switch (2) configuration switch. The data

switch fabric is a high-throughput intreconnect mainly used to move data across the system and connects masters

to slaves via 128-bits data buses (SCR B) and 64-bit data buses (SCR A). The configuration switch is used to accessperipheral registers. The Texas Instruments TMS320VC5441 [19] is a 4 core multicore with shared bus between 2

cores and HPI for external accesses. The Freescale QorIQ™ P4080 [17] is an 8 core multicore architecture with a

Corenet coherency fabric. Each core is a high-performance Power Architecture e500mc cores, each with a

32-KByte Instruction and Data L1 Cache and a private 128-KByte L2 Cache. The CoreNet fabric is Freescale's nextgeneration front-side interconnect standard for multicore products. CoreNet is presented as a highly concurrent

fully cache coherent multi-ported fabric. CoreNet's point-to-point connectivity with flexible protocol architcture

allows for pipelined interconnection between CPUs, platform caches, memory controllers. No details are available.

Finally Toshiba proposes the Venezia architecture [21]. Our work differs from all the previously described work bya larger number of processors of smaller size emphasizing the choice of coarse grain concurrency over fine grain

concurrency exploited by more sophisticated processors (VLIW e.g. MEP). It remains that we are working onarchitectural support for fine grained parallelism [23] through SIMD coprocessing.

VI. Conclusion

Multiprocessor System on Chip (MPSOC) are strongly emerging as best candidates for complex embedded

applications. In this paper we presented a single FPGA implementation of a NOC-based 24 processors shared

memory MPSOC system. IP reuse has been intensive based on various specialized IP libraries (processor, NOC)with OCP-IP interfaces for quick plug-in. First performance evaluations of this MPSOC have been conducted through

a parallel code of the matrix multiplication on our multiprocessor platform which achieved a 22 speedup on the 24

processors system in comparison with single processor platform.

Future work will include more parallel applications (software defined radio, cognitive radio, image, video, military)

as well as selected HLS based coprocessing on the platform.

Acknowledgement

We wish to thank Arteris support team for their kind support and their good and efficient collaboration. Alltrademarks are property of their respective owners.

References

1. ITRS

2. A.A. Jerraya and Wayne Wolf, "Multiprocessor Systems-on-Chip", Morgan Kaufman Pub, 2004

3. Benini, L. ; De Micheli, G., "Networks on Chips: Technology and Tools", Morgan Kaufmann, 2006.

4. OCP-IP Open Core Protocol Specification 2.2, 2008

5. Arteris

6. NoC Solution 1.12, NoC NTTP technical reference, o3446v8, April 2008

7. Arteris Danube 1.12, Packet Transport Units technical reference, o4277v11, April 2008

8. Alpha-data ADPe-XRC-4 FPGA card

9. Xilinx Virtex-4

10. Xilinx EDK 9.2

11. Xilinx I SE 9.2

12. Ito, M.; Hattori, T.; Yoshida, Y.; Hayase, K.; Hayashi, T.; Nishii, O.; Yasu, Y.; Hasegawa, A.; Takada, M.;Mizuno, H.; Uchiyama, K.; Odaka, T.; Shirako, J.; Mase, M.; Kimura, K.; Kasahara, H.;, An 8640 MIPS SoC withIndependent Power-Off Control of 8 CPUs and 8 RAMs by An Automatic Parallelizing Compiler, 3-7 Feb. 2008

Page(s):90 – 598

13. ARM 11 MPCore

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14. MIPS32® 1004K™ Core

15. S.Shibahara, M.Takada, T.Kamei, K. Hayase, Y.Yoshida, O. Nishii, T. Hattori, SH-X3: SuperH Multi-Core for

Embedded Systems, Hot Chips 19th, Aug. 19-21 2007, Stanford, USA.

16. M.Butts, A.M.Jones, TeraOPS Hardw are & Software: A New Massively-Parallel, MIMD Computing

Fabric IC, Hot Chips 18th, Aug. 20-22 2006, Stanford, USA.

17. Texas Instruments Multicore Fact Sheet SC-07175

18. Texas Instruments TMS320C6474 Multicore DSP SPRS552 – Oct. 2008

19. Texas Instruments TMS320VC5441 Fixed-Point DSP data manual SPRS122F – Oct. 2008

20. QorIQ™ P4080 Communications Processor

21. T.Miyamori, Venezia: a Scalable Multicore Subsystem for Multimedia Applications, 8th International Forum on

Application-Specific Multi-Processor SoC 23 - 27 June 2008, Aachen, Germany.

22. T.Isshiki, MAPS-TCT: MPSoC Application Parallelization and Architecture Exploration Framework, 8th

International Forum on Application-Specific Multi-Processor SoC 23 - 27 June 2008, Aachen, Germany

23. S.Kumar and al., Architectural Support for Fine-Grained Parallelism on Multi-core Architectures, Vol. 11 Issue 3

(August 2007) Tera-scale Computing, Intel technology Journal.

Fig 8 – ARM 11 MPcore

Fig 9 – Texas Instruments TMS320VC5441

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Fig 10 – QorIQ™ P4080

Fig 11 – Toshiba Venezia Architecture

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