1
8800 Platform Evolution 8800 CHAMEO TC 8800 TC 8800 TC advanced 8800 CHAMEO advanced 8800 FC QUANTUM 8800 FC QUANTUM plus 2008 2014 2012 2016 2004 2011 10μ 6μ 5μ 10μ 6μ 3μ 3μ 2μ 3μ 8800 FC QUANTUM sigma 8800 CHAMEO plus 8800 CHAMEO 5μ 8800 FC QUANTUM advanced

8800 Flip Chip Platform Evolution

Embed Size (px)

Citation preview

Page 1: 8800 Flip Chip Platform Evolution

8800 Platform Evolution

8800

CHAMEOTC

8800

TC

8800

TCadvanced

8800

CHAMEOadvanced

8800 FC

QUANTUM

8800 FC

QUANTUM plus

2008 2014 2012 2016 2004 2011

10µ 6µ 5µ

10µ 6µ

3µ

3µ 2µ

3µ

8800 FC

QUANTUM sigma

8800

CHAMEOplus

8800

CHAMEO

5µ

8800 FC

QUANTUM advanced

Flip Chip Technology

Flip Chip Technology

Documents
Flip-chip integration of differential CMOS power amplifier

Flip-chip integration of differential CMOS power amplifier

Documents
Flip Chip Assembly in Air

Flip Chip Assembly in Air

Documents
Flip-Chip Technology

Flip-Chip Technology

Documents
Flip-chip bonding : how to meet the high accuracy ...proxy.siteo.com.s3.amazonaws.com/.../file/empcvarsovie2017.pdf · What is flip-chip ? 2 EMPC 2017 - Warsaw, POLAND Advantages

Flip-chip bonding : how to meet the high accuracy ...proxy.siteo.com.s3.amazonaws.com/.../file/empcvarsovie2017.pdf · What is flip-chip ? 2 EMPC 2017 - Warsaw, POLAND Advantages

Documents
Transfer Molding Encapsulation of Flip Chip Array · PDF fileTransfer Molding Encapsulation of Flip Chip Array Packages ... with suitable mold design, ... Shrinkage of the molding

Transfer Molding Encapsulation of Flip Chip Array · PDF fileTransfer Molding Encapsulation of Flip Chip Array Packages ... with suitable mold design, ... Shrinkage of the molding

Documents
Indium Bump Fabrication using Electroplating for Flip Chip Bonding936704/... · 2016-06-14 · Indium Bump Fabrication using Electroplating for Flip Chip Bonding Saron Anteneh Sjödin,

Indium Bump Fabrication using Electroplating for Flip Chip Bonding936704/... · 2016-06-14 · Indium Bump Fabrication using Electroplating for Flip Chip Bonding Saron Anteneh Sjödin,

Documents
FLIP-CHIP Market and Technology Trends - … · FLIP-CHIP Market and Technology Trends ... solutions to serve the most advanced packaging technologies like 3DIC and 2.5D Interposer

FLIP-CHIP Market and Technology Trends - … · FLIP-CHIP Market and Technology Trends ... solutions to serve the most advanced packaging technologies like 3DIC and 2.5D Interposer

Documents
Flip Chip on Laminate Reliability - Failure Mechanisms · Flip Chip on Laminate Reliability – Failure Mechanisms ... Flip Chip on Laminate Reliability - Failure ... This paper experimentally

Flip Chip on Laminate Reliability - Failure Mechanisms · Flip Chip on Laminate Reliability – Failure Mechanisms ... Flip Chip on Laminate Reliability - Failure ... This paper experimentally

Documents
Measurement of Deformation and Strain in Flip Chip on …akrometrix.com/.../uploads/2016/02/DIC_C4_Analysis.pdf ·  · 2016-06-17Measurement of Deformation and Strain in Flip Chip

Measurement of Deformation and Strain in Flip Chip on …akrometrix.com/.../uploads/2016/02/DIC_C4_Analysis.pdf ·  · 2016-06-17Measurement of Deformation and Strain in Flip Chip

Documents
thermal investigations of flip chip microelectronic package with non

thermal investigations of flip chip microelectronic package with non

Documents
FC-PBGA, Flip Chip Plastic Ball Grid Array (FC-PBGA) of a flip chip Ball Grid Array ... Package Substrate BGA Solder Ball Lid / Heat Spreader Thermal Interface ... FC-PBGA, Flip Chip

FC-PBGA, Flip Chip Plastic Ball Grid Array (FC-PBGA) of a flip chip Ball Grid Array ... Package Substrate BGA Solder Ball Lid / Heat Spreader Thermal Interface ... FC-PBGA, Flip Chip

Documents
Flip-chip assembly of VCSELs to silicon grating couplers

Flip-chip assembly of VCSELs to silicon grating couplers

Documents
Contact Resistance Comparison of Flip-Chip Joints Produced

Contact Resistance Comparison of Flip-Chip Joints Produced

Documents
Flip Chip Ball Grid Array Package Reference Guide (Rev. A)€¦ · This document provides application guidelines for effective flip chip BGA device handling and management, including

Flip Chip Ball Grid Array Package Reference Guide (Rev. A)€¦ · This document provides application guidelines for effective flip chip BGA device handling and management, including

Documents
Xilinx Advanced Packaging · 2019-10-13 · Cavity-down BGAs, high performance Flip-Chip BGAs and Flip-Chip CCGAs, Quad Flat No-Lead packages,and small form factor CSPs (Chip Scale

Xilinx Advanced Packaging · 2019-10-13 · Cavity-down BGAs, high performance Flip-Chip BGAs and Flip-Chip CCGAs, Quad Flat No-Lead packages,and small form factor CSPs (Chip Scale

Documents
characterization of flip chip bump failure modes using high

characterization of flip chip bump failure modes using high

Documents
"50 Micron Pitch Flip Chip Bumping Technology: Processes ...ewh.ieee.org/soc/cpmt/presentations/cpmt0609a.pdf · 50 Micron Pitch Flip Chip Bumping Technology: Processes and Applications

"50 Micron Pitch Flip Chip Bumping Technology: Processes ...ewh.ieee.org/soc/cpmt/presentations/cpmt0609a.pdf · 50 Micron Pitch Flip Chip Bumping Technology: Processes and Applications

Documents
A Novel Flip Chip Bonding Technology using Au Stud … Novel Flip Chip Bonding Technology using Au ... A cost-effective Au-solder flip-chip bonding technology working with unique

A Novel Flip Chip Bonding Technology using Au Stud … Novel Flip Chip Bonding Technology using Au ... A cost-effective Au-solder flip-chip bonding technology working with unique

Documents
Datacon 8800 FC Quantum advanced -2015 - Besi · Datacon 8800 FC QUANTUM advanced As Mass Reflow Flip Chip becomes dominant in IC packaging, we do set a new benchmark for speed and

Datacon 8800 FC Quantum advanced -2015 - Besi · Datacon 8800 FC QUANTUM advanced As Mass Reflow Flip Chip becomes dominant in IC packaging, we do set a new benchmark for speed and

Documents
Flip Chip Technology MDCL EE SNU Flip Chip Technology 2005/6/16 Kim Dong Hwan School of Electrical Engineering and Computer Science Seoul National University,

Flip Chip Technology MDCL EE SNU Flip Chip Technology 2005/6/16 Kim Dong Hwan School of Electrical Engineering and Computer Science Seoul National University,

Documents
High-power flip-chip mounted photodiode arraypeople.virginia.edu/~ab3pj/Files/Other/pdf3.pdf · High-power flip-chip mounted photodiode array ... antenna remoting, optically-fed phased

High-power flip-chip mounted photodiode arraypeople.virginia.edu/~ab3pj/Files/Other/pdf3.pdf · High-power flip-chip mounted photodiode array ... antenna remoting, optically-fed phased

Documents
Flip Chip End User Market - imaps.org Presentations/Session1... · identified Flip Chip CSP/BGA as the package ... wide implementation of Flip Chip today? 5 ... Three Flip Chip Applications

Flip Chip End User Market - imaps.org Presentations/Session1... · identified Flip Chip CSP/BGA as the package ... wide implementation of Flip Chip today? 5 ... Three Flip Chip Applications

Documents
FLIP CHIP BACK END DESIGN PARAMETERS TO REDUCE …

FLIP CHIP BACK END DESIGN PARAMETERS TO REDUCE …

Documents
Plasma for Underfill Process in Flip Chip Packaging

Plasma for Underfill Process in Flip Chip Packaging

Documents
Silver Flip-chip Technology : The Infinitesimal Joint Possibility

Silver Flip-chip Technology : The Infinitesimal Joint Possibility

Documents
FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT

FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT

Documents
Die / Flip Chip Bonding Nanoimprint Lithographyproxy.siteo.com.s3.amazonaws.com/...Die / Flip Chip Bonding Nanoimprint Lithography ExpLorE thE worLD oF aBsoLutE prECisioN. ExCELLENCE

Die / Flip Chip Bonding Nanoimprint Lithographyproxy.siteo.com.s3.amazonaws.com/...Die / Flip Chip Bonding Nanoimprint Lithography ExpLorE thE worLD oF aBsoLutE prECisioN. ExCELLENCE

Documents
SOLDER JOINT RELIABILITY OF FLIP CHIP BGA PACKAGEeprints.usm.my/3572/1/Solder_Joint_Reliability_Of... · SOLDER JOINT RELIABILITY OF FLIP CHIP BGA PACKAGE. BY . LEE KOR OON . Thesis

SOLDER JOINT RELIABILITY OF FLIP CHIP BGA PACKAGEeprints.usm.my/3572/1/Solder_Joint_Reliability_Of... · SOLDER JOINT RELIABILITY OF FLIP CHIP BGA PACKAGE. BY . LEE KOR OON . Thesis

Documents
Status and Outlooks of Flip Chip Technology...Status and Outlooks of Flip Chip Technology John H. Lau ASM Pacific Technology, Hong Kong john.lau@asmpt.com Abstract Status of flip chip

Status and Outlooks of Flip Chip Technology...Status and Outlooks of Flip Chip Technology John H. Lau ASM Pacific Technology, Hong Kong [email protected] Abstract Status of flip chip

Documents