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#807 Byucksan Technopia, #807 Byucksan Technopia, 196-5, Ojeon-Dong, 196-5, Ojeon-Dong,
Uiwang-City,Uiwang-City, Gyunggi-Do,Gyunggi-Do, 437-821, Korea437-821, Korea
www.sejungtr.comwww.sejungtr.com
SEJUNG SEJUNG Trading Co, LtdTrading Co, Ltdwww.sejungtr.comwww.sejungtr.com
I. Salutation
II. Vision & Mission
III. Introduction & History
IV. Business
V. Organization Chart
VI. Business Performance
VI. Customer & Partnership
▣ SalutationSejung trading Co. provide technical support and process Sejung trading Co. provide technical support and process
solutionsolution
Established in 2004, Sejung Trading Co. Ltd keeps growing and expanding, and is now one of the most well-known solution providers in Semiconductor packaging assembly business and used equipment market and in Korea, with seven engineers specialized at various technical expertise and field application experiences.
All engineers are with >10 years’ experience in Semiconductor assembly know-hows, providing technical supports and process solutions, not just only equipment.
Sejung Trading Co. is now specialized in promoting advanced bonding equipment from Hesse & Knipps, and Peco capillaries.
We have 2700 members of Internet café which is a profound sales network for Sejung Trading Co., inside which members can share technical information and request technical support as well.
We conduct regular technical seminars and equipment trainings on quarterly basis.
Sejung Trading Co. handles more than 100 units of used equipment yearly, and monthly 50,000 capillaries’ sales and service, as well as technical supports.
We do have joint-development projects with various customers, collaborating with our customers and pot. We provide technical support and process solution and equipment as well.
CorporateCorporate : Sejung Trading Co, Ltd: Sejung Trading Co, Ltd LocationLocation : #807 Byucksan Technopia, 196-5, Ojeon-Dong, Uiwang-City, : #807 Byucksan Technopia, 196-5, Ojeon-Dong, Uiwang-City,
Gyunggi-Do,Gyunggi-Do, 437-821, Korea437-821, Korea Http://www.sejungtr.com
Area Area : Building: Building 300300 ㎡㎡ Office : 90Office : 90 ㎡㎡ Refurbish room : 170Refurbish room : 170 ㎡㎡ Clean room:40Clean room:40 ㎡ ㎡ Class 10,000Class 10,000
Pilot Line Equip Current StatePilot Line Equip Current State (2011.3)(2011.3) SAW : DISCO DFD640 SAW : DISCO DFD640 WEDGE BONDER : KNS 8060WEDGE BONDER : KNS 8060 WIRE BONDER : KNS 8028 WIRE BONDER : KNS 8028 KAIJO FB170KAIJO FB170 DIE BONDER : ALPHASEM SL9002 DIE BONDER : ALPHASEM SL9002 ASM AD896 / ASM AD829AASM AD896 / ASM AD829A DISPENSOR : VOIM RS2000 DISPENSOR : VOIM RS2000 TESTER : ROYCE 552 TESTER : ROYCE 552 HIGH POWER SCOPE : LEICA INM20HIGH POWER SCOPE : LEICA INM20
Ware House 1Ware House 1 : Building: Building 200200 ㎡㎡ Ware House 2Ware House 2 : Building: Building 390390 ㎡㎡
▣ Introduction
▣ History
HistoryHistory
20112011 .03 Samsung Electro-Mechanics.03 Samsung Electro-Mechanics .02 CLEAN ROOM .02 CLEAN ROOM SamjinSamjin BJ820 x 3setBJ820 x 3set PO PO .01 AMST BJ820 x 1set PO.01 AMST BJ820 x 1set PO
2010 2010 .04 AMST BJ820 3.04 AMST BJ820 3rdrd PO PO .02 SL-TECH Joint Project Military device.02 SL-TECH Joint Project Military device
2009 2009 .12 Samsung Advanced Institute Technology.12 Samsung Advanced Institute Technology BJ820 x 1set POBJ820 x 1set PO .10 S-PECKAGE JOINT PROJECT.10 S-PECKAGE JOINT PROJECT .06 SEMIMC Refurbishment Team .06 SEMIMC Refurbishment Team 2008 .07 AMST BJ820 2nd.07 AMST BJ820 2nd POPO .05 .05 LG Innotek .03 AMST BJ820 1.03 AMST BJ820 1stst PO PO .03 Internet .03 Internet Cafe Open-Semiconductor http://café.naver.com/semimc No. of members : 2700 (Mar.2011)
20072007 .09 Hynix Semiconductor .09 Hynix Semiconductor 10 ASE Weihai Wire Bonder /Saw 10 ASE Weihai Wire Bonder /Saw .08 AMKOR Korea
2006 2006 .06 Samjin.06 Samjin BJ815 x 1set POBJ815 x 1set PO .04 Samjin.04 Samjin BJ715 x 1set POBJ715 x 1set PO .03 Samsung Electronics.03 Samsung Electronics .01 Samjin.01 Samjin BJ815 x 1set POBJ815 x 1set PO .01 HESSE & KNIPPS Agent.01 HESSE & KNIPPS Agent
2005 2005 .10 Signetics .10 Signetics 05 STATS CHIPPACK05 STATS CHIPPACK .07 ASE Korea .07 ASE Korea .06 STS Capillary .06 STS Capillary .03 Hanamicron.03 Hanamicron Capillary Capillary
20042004 .12 PECO Capillary Agent.12 PECO Capillary Agent .10 Sejung Trading Co. start.10 Sejung Trading Co. start
Partner Ship ☞ PECO Capillary Agent : Capillary
☞ Hesse & Knipps Korea Agent : Fully automatic thin wire bonder: BONDJET BJ820 BONDJET BJ715/815 Fully automatic heavy wire bonder BONDJET BJ93X BONDJET BJ920 BONDJET BJ915L Available options: PiQC E-Box
▣ Business
☞ Korea Business
Semiconductor Ass’y Equip ReFurb& Sales
Wire Bonder / Wedge Bonder / Die Bonder / Saw Dispenser / ETC - ASM / K&S / Shinkawa /KAIJO
PKG Development sample Business
PKG Process Technical Application
PKG OEM Production
☞ Korea Business
Semiconductor Ass’y Equip ReFurb& Sales
Wire Bonder / Wedge Bonder / Die Bonder / Saw Dispenser / ETC - ASM / K&S / Shinkawa /KAIJO
PKG Development sample Business
PKG Process Technical Application
PKG OEM Production
Alliance Agent CompanyAlliance Agent Company
▣ Business–Joint project
SL-TechSL-Tech - Military PKG 24CDIP : Production Start Dec. - Military PKG 24CDIP : Production Start Dec. 20112011–– need BJ820 need BJ820 - Production Volume: Min. US$ 400K - Production Volume: Min. US$ 400K (enough budget for BJ820($40K x 5years)(enough budget for BJ820($40K x 5years) - 10 years contract project - 10 years contract project - Sejung Trading support R&D and Equipment- Sejung Trading support R&D and Equipment (Furnace, Dispenser, Laser marker)(Furnace, Dispenser, Laser marker)
S-Pack SolutionS-Pack Solution - Temp & Humidity sensor- Temp & Humidity sensor - Sejung Trading support R&D and Equipment- Sejung Trading support R&D and Equipment (Package Saw, Wire Bond, Dispenser)(Package Saw, Wire Bond, Dispenser) -CEO is from KEC R&D center, -CEO is from KEC R&D center, he was director of R&D center.he was director of R&D center.
GE SensingGE Sensing - - Automotive pressure sensor / TPMS SensorAutomotive pressure sensor / TPMS Sensor / Temp pressure sensor/ Temp pressure sensor - Packaging Sub Assembly contract- Packaging Sub Assembly contract - Wafer Sawing, Die Bonding, Wire Bonding, Welding,- Wafer Sawing, Die Bonding, Wire Bonding, Welding, Encap, Testing etc. Encap, Testing etc.
▣ Organization Chart
DirectorBS Min
Technical Support Team Sales Team Refurbishment Team
Administer
SAW & D/B
WIRE BONDER
H&K
Capillary
▣ Staff Profile
Sales & C/S Team
YK Lee Thin Wedge BonderSL-Tech Process Engineer TeamSTATS ChipPAC Korea Equip Eng’rHynix Semiconductor Equip Eng’r
Wedge – KNS 8060Wire – KNS 8028 / KNS Maxum
Technical Support Team
HJ Yoon Heavy Wedge Bonder / Wire BonderASE Weihai Discrete Line SupportTSPS Korea Power PKG Set-upKEC Thailand Power PKG Set-up Woosuk Semiconductor Equip Eng’r
Wire - KNS14xx / 80xxHeavy Wedge- Orthodyne M360, Orthodyne 7200Plus Die – NEC CPS400 / CPS4000 Tosok DBD2500 / DBD3550
▣ Staff Profile
Technical Support Team
JY Kim Die Bonder / SawSignetics Equip Die Bonder Overhaul AMKOR Korea Equip Technical TeamDie Bonder / Saw Overhaul Die – Alphasem- SL9002 ASM AD809 / AD889 / AD898 / AD8912 Saw- Disco DFD6xx / DAD6xx
Equipment Technique Team
WY Ban Wire Bonder / Die Bonder ITM Semiconductor Product Team Manager Seoul Semiconductor Process Manager AMKOR Korea TQFP Maintenance
Wire- ASM AB339 / AB330Eagle AB Eagle60AP / I-hawk Twin Eagle Kaijo FB780 Die- ASM AD809 / AD896 /AD8930 Canon Bestem D01
▣ Staff Profile
Equipment Technique Team
MJ Kim Wire BonderSignetics Equip Wire Bonder Overhaul AMKOR Korea Equip Technical TeamWire Bonder Overhaul
Wire : KNS 14xx / KNS 80XX ASM AB339 / AB339 EAGLE AB Eagle60AP / I-hawk Twin Eagle Kaijo FB118 / FB128 / FB137 / FB150
Technical Support Team
DJ Kim Wire BonderHeesung Metal Wire R&DAMKOR Korea QFP/TQFP/MLF Maintenance
Wire : KNS 14xx / KNS 80XX ASM AB339 / AB339 EAGLE AB Eagle60AP / I-hawk Twin Eagle
▣ Business Performance
Revenue
Revenue H&K Wedge Bonder
0
500
1000
1500
2000
2500
3000
3500
4000
KR\(Million)
2005 2006 2007 2008 2009 2010
Sales
0
1
2
3
4
5
2006 2007 2008 2009 2010 2011
BJ715 BJ815 BJ820
▣ Customer
Capillary sales-Major customerCapillary sales-Major customer H&K Wedge Bonder Sales-Major Customer
▣ Customer
Corporation
Optowell SPACKAGESamsung Electro-Mechanics GE SENSING Asia Semiconductor InsemCOBON Sangsin ElecomGE SENSING Mikwang ElectronGlotech PoongsanOpticisSeoul TechnopiaEpivalleyLumitechSamsung LEDDS LCDMICROINFINITYPoint Engineering
Equipment Refurbish sales-Major customerEquipment Refurbish sales-Major customer
▣ Customer
National InstitutionNational Institution
Korea Sensor Research Association
Educational InstitutionYeungjin CollegeChungbuk Semiconductor High School
Defense Industry Automotive
PeopleWorks Co, Ltd Brodern Co, LtdICHIPS co.Ltd GE SensingPoongSan F&S
Equipment Refurbish sales-Major customerEquipment Refurbish sales-Major customer
▣ PartnershipInternet Café http://cafe.naver.com/semimc
* Technical internet Café for Semiconductor Assembly Equipment engineers. Technical Support between members Wafer Sawing, Die Bonding, Wire Bonding, Dispensing, etc. Customer join café to get technical information and make technical network. Most powerful sales tool for Sejung trading Co. Conductor Technical Seminar 2-3 times per year
No. of Member : 2700 (Mar. 2011)
Café Statistics
78%
13%9%
Semiconductor Student Researcher
59.716.8
6.5
12.4 4.6
Semiconductor LEDDisplay Educational InstitutionGovernment Branch
▣ Partnership
Strategic Alliances
SEJUNGSEJUNGTRADINGTRADING
Strategic Strategic
AlliancesAlliances
CAPILLARY
Agent
WEDGE
BONDER Agent
BS TEKPartner
for SE
Korea
Bond tool Korea Sales
Bond tool Korea Sales
Sales partner for SE Korea
Sales partner for SE Korea
H&K Wedge Bonder
-Thin Wire Bonder
-Heavy Wire Bonder
H&K Wedge Bonder
-Thin Wire Bonder
-Heavy Wire Bonder
Thank You.