7371

February 2003 1/23

UNDERVOLTAGE

OVERTEMPERATURE

VCC

GND

INPUTOUTPUT

OVERVOLTAGE

CURRENT LIMITER

LOGIC

DRIVER

Power CLAMP

VCCCLAMP

VDS LIMITER

DETECTION

DETECTION

DETECTION

KIOUT CURRENT

SENSE

VN920/ VN920-B5 / VN920SO

SINGLE CHANNEL HIGH SIDE SOLID STATE RELAY

n CMOS COMPATIBLE INPUTn PROPORTIONAL LOAD CURRENT SENSEn SHORTED LOAD PROTECTIONn UNDERVOLTAGE AND OVERVOLTAGE

SHUTDOWNn OVERVOLTAGE CLAMPn THERMAL SHUTDOWNn CURRENT LIMITATIONn PROTECTION AGAINST LOSS OF GROUND

AND LOSS OF VCCn VERY LOW STAND-BY POWER DISSIPATIONn REVERSE BATTERY PROTECTION (*)

DESCRIPTIONThe VN920, VN920-B5, VN920SO is a monolithicdevice made by using STMicroelectronicsVIPower M0-3 Technology, intended for drivingany kind of load with one side connected to

ground. Active VCC pin voltage clamp protects thedevice against low energy spikes (see ISO7637transient compatibility table). Active currentlimitation combined with thermal shutdown andautomatic restart protect the device againstoverload. The device integrates an analog currentsense output which delivers a current proportionalto the load current. Device automatically turns offin case of ground pin disconnection.

TYPE RDS(on) IOUT VCCVN920VN920-B5VN920SO

16m 30 A 36 V

PENTAWATT P2PAK

SO-16L

ORDER CODESPACKAGE TUBE T&R

PENTAWATT VN920 -P2PAK VN920-B5 VN920-B513TRSO-16L VN920SO VN920SO13TR

BLOCK DIAGRAM

(*) See application schematic at page 8

2/23

VN920 / VN920-B5 / VN920SO

ABSOLUTE MAXIMUM RATING

CONNECTION DIAGRAM (TOP VIEW)

CURRENT AND VOLTAGE CONVENTIONS

Symbol Parameter Value UnitPENTAWATT P2PAK SO-16LVCC DC Supply Voltage 41 V

- VCC Reverse DC Supply Voltage - 0.3 V- IGND DC Reverse Ground Pin Current - 200 mAIOUT DC Output Current Internally Limited A

- IOUT Reverse DC Output Current - 21 AIIN DC Input Current +/- 10 mA

VCSENSECurrent Sense Maximum Voltage -3

+15VV

VESD

Electrostatic Discharge(Human Body Model: R=1.5K; C=100pF)- INPUT- CURRENT SENSE- OUTPUT- VCC

4000200050005000

VVVV

EMAXMaximum Switching Energy(L=0.25mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=45A)

364 352 mJ

PTOT Power Dissipation TC25C 96.1 96.1 8.3 WTj Junction Operating Temperature Internally limited CTc Case Operating Temperature - 40 to 150 C

TSTG Storage Temperature - 55 to 150 C

1

54

3

21

VCC

GNDINPUT

CSENSEOUTPUT

PENTAWATT

3

2

1

4

5

VCC

GNDINPUT

CSENSE

OUTPUT

P2PAK

IS

IGND

VCCVCC

VSENSE

OUTPUTIOUT

CURRENT SENSE ISENSE

INPUTIIN

VIN

VOUT

GND

VCCOUTPUTOUTPUTOUTPUTOUTPUT

VCC

OUTPUTOUTPUT

VCC

N.C.N.C.CSENSEINPUT

VCC

GNDN.C.

1

8 9

16

SO-16L

3/23

VN920 / VN920-B5 / VN920SO

THERMAL DATA

(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick).(**) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick) connected to all VCC pins.ELECTRICAL CHARACTERISTICS (8V

4/23

VN920 / VN920-B5 / VN920SO

1

ELECTRICAL CHARACTERISTICS (continued)CURRENT SENSE (9VVCC16V) (See Fig. 1)

PROTECTIONS

Note 2: current sense signal delay after positive input slopeNote: sense pin doesnt have to be left floating.

Symbol Parameter Test Conditions Min Typ Max Unit

K1 IOUT/ISENSEIOUT=1A; VSENSE=0.5V; Tj= -40C...150C

3300 4400 6000

dK1/K1 Current Sense Ratio DriftIOUT=1A; VSENSE=0.5V; Tj= -40C...+150C

-10 +10 %

K2 IOUT/ISENSEIOUT=10A; VSENSE=4V; Tj=-40CTj=25C...150C

42004400

49004900

60005750

dK2/K2 Current Sense Ratio DriftIOUT=10A; VSENSE=4V; Tj=-40C...+150C

-8 +8 %

K3 IOUT/ISENSEIOUT=30A; VSENSE=4V; Tj=-40CTj=25C...150C

42004400

49004900

55005250

dK3/K3 Current Sense Ratio DriftIOUT=30A; VSENSE=4V; Tj=-40C...+150C

-6 +6 %

ISENSEOAnalog Sense Leakage Current

VCC=6...16V; IOUT=0A;VSENSE=0V;Tj=-40C...+150C

0 10 A

VSENSEMax Analog Sense Output Voltage

VCC=5.5V; IOUT=5A; RSENSE=10KVCC>8V; IOUT=10A; RSENSE=10K

24

VV

VSENSEHSense Voltage in Overtemperature conditions

VCC=13V; RSENSE=3.9K 5.5 V

RVSENSEH

Analog Sense Output Impedance in Overtemperature Condition

VCC=13V; Tj>TTSD; Output Open 400

tDSENSECurrent sense delay response to 90% ISENSE (see note 2) 500 s

Symbol Parameter Test Conditions Min Typ Max UnitTTSD Shut-down Temperature 150 175 200 CTR Reset Temperature 135 C

Thyst Thermal Hysteresis 7 15 C

Ilim DC Short Circuit CurrentVCC=13V5V

5/23

VN920 / VN920-B5 / VN920SO

1 1

Figure 2: Switching Characteristics (Resistive load RL=1.3)

0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 323000

3500

4000

4500

5000

5500

6000

6500

min.Tj=-40C

max.Tj=-40C

min.Tj=25...150C

max.Tj=25...150C

typical value

Figure 1: IOUT/ISENSE versus IOUT

IOUT (A)

IOUT/ISENSE

VOUT

dVOUT/dt(on)tr

80%

10% tf

dVOUT/dt(off)

ISENSEt

t

90%

td(off)INPUT

t

90%

td(on)tDSENSE

6/23

VN920 / VN920-B5 / VN920SO

1

TRUTH TABLE

ELECTRICAL TRANSIENT REQUIREMENTS

CONDITIONS INPUT OUTPUT SENSE

Normal operation LH

LH

0Nominal

Overtemperature LH

LL

0VSENSEH

Undervoltage LH

LL

00

Overvoltage LH

LL

00

Short circuit to GNDLHH

LLL

0(TjTTSD) VSENSEH

Short circuit to VCCLH

HH

0< Nominal

Negative output voltage clamp L L 0

ISO T/R 7637/1Test Pulse

TEST LEVELSI II III IV Delays and

Impedance1 -25 V -50 V -75 V -100 V 2 ms 10 2 +25 V +50 V +75 V +100 V 0.2 ms 10

3a -25 V -50 V -100 V -150 V 0.1 s 50 3b +25 V +50 V +75 V +100 V 0.1 s 50 4 -4 V -5 V -6 V -7 V 100 ms, 0.01 5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2

ISO T/R 7637/1Test Pulse

TEST LEVELS RESULTSI II III IV

1 C C C C2 C C C C

3a C C C C3b C C C C4 C C C C5 C E E E

CLASS CONTENTSC All functions of the device are performed as designed after exposure to disturbance.E One or more functions of the device is not performed as designed after exposure to disturbance

and cannot be returned to proper operation without replacing the device.

7/23

VN920 / VN920-B5 / VN920SO

SENSE

INPUTNORMAL OPERATION

UNDERVOLTAGEVCC

VUSD

VUSDhyst

INPUT

OVERVOLTAGE

VCC

SENSE

INPUT

SENSE

Figure 3: Waveforms

LOAD CURRENT

LOAD CURRENT

LOAD CURRENT

OVERTEMPERATURE

INPUT

SENSE

TTSDTR

Tj

LOAD CURRENT

VOV

VOVhystVCC > VUSD

SHORT TO GROUNDINPUTLOAD CURRENT

SENSELOAD VOLTAGE

INPUTLOAD VOLTAGE

SENSELOAD CURRENT

8/23

VN920 / VN920-B5 / VN920SO

GND PROTECTION NETWORK AGAINSTREVERSE BATTERY Solution 1: Resistor in the ground line (RGND only). Thiscan be used with any type of load.The following is an indication on how to dimension theRGND resistor.

1) RGND 600mV / (IS(on)max). 2) RGND (VCC) / (-IGND)

where -IGND is the DC reverse ground pin current and canbe found in the absolute maximum rating section of thedevices datasheet.Power Dissipation in RGND (when VCC

9/23

VN920 / VN920-B5 / VN920SO

111

High Level Input Current

Input Clamp Voltage

Off State Output Current

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5Iih (uA)

Vin=3.25V

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

6

6.2

6.4

6.6

6.8

7

7.2

7.4

7.6

7.8

8Vicl (V)

Iin=1mA

Input High Level

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

2

2.2

2.4

2.6

2.8

3

3.2

3.4

3.6Vih (V)

Input Hysteresis VoltageInput Low Level

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

1

1.2

1.4

1.6

1.8

2

2.2

2.4

2.6Vil (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

0.5

0.6

0.7

0.8

0.9

1

1.1

1.2

1.3

1.4

1.5Vhyst (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

0

1

2

3

4

5

6

7

8

9IL(off1) (uA)

10/23

VN920 / VN920-B5 / VN920SO

1

Overvoltage Shutdown

Turn-on Voltage Slope Turn-off Voltage Slope

ILIM Vs Tcase

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

30

32

34

36

38

40

42

44

46

48

50Vov (V)

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

250

300

350

400

450

500

550

600

650

700dVout/dt(on) (V/ms)

Vcc=13VRl=1.3Ohm

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

0

50

100

150

200

250

300

350

400

450

500

550dVout/dt(off) (V/ms)

Vcc=13VRl=1.3Ohm

On State Resistance Vs Tcase On State Resistance Vs VCC

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

0

10

20

30

40

50

60

70

80

90

100Ilim (A)

Vcc=13V

-50 -25 0 25 50 75 100 125 150 175

Tc (C)

0

5

10

15

20

25

30

35

40

45

50Ron (mOhm)

Iout=10AVcc=8V; 36V

5 10 15 20 25 30 35 40

Vcc (V)

0

5

10

15

20

25

30

35

40

45

50Ron (mOhm)

Tc= - 40C

Tc= 25C

Tc= 150C

11/23

VN920 / VN920-B5 / VN920SO

SO-16L Maximum turn off current versus load inductance

A = Single Pulse at TJstart=150CB= Repetitive pulse at TJstart=100CC= Repetitive Pulse at TJstart=125C

Conditions:VCC=13.5VValues are generated with RL=0In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceedthe temperature specified above for curves B and C.

VIN, IL

t

Demagnetization Demagnetization Demagnetization

1

10

100

0.01 0.1 1 10 100L(mH)

ILMAX (A)

A

BC

12/23

VN920 / VN920-B5 / VN920SO

P2PAK Maximum turn off current versus load inductance

A = Single Pulse at TJstart=150CB= Repetitive pulse at TJstart=100CC= Repetitive Pulse at TJstart=125C

Conditions:VCC=13.5VValues are generated with RL=0In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceedthe temperature specified above for curves B and C.

VIN, IL

t

Demagnetization Demagnetization Demagnetization

1

10

100

0.01 0.1 1 10 100

L(mH)

ILMAX (A)

AB

C

13/23

VN920 / VN920-B5 / VN920SO

P2PAK PC Board

Rthj-amb Vs PCB copper area in open box free air condition

P2PAK THERMAL DATA

Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,Cu thickness=35m, Copper areas: 0.97cm2, 8cm2).

30

35

40

45

50

55

0 2 4 6 8 10PCB Cu heatsink area (cm^2)

RTHj_amb (C/W)

Tj-Tamb=50C

14/23

VN920 / VN920-B5 / VN920SO

1

SO-16L PC Board

Rthj-amb Vs PCB copper area in open box free air condition

SO-16L THERMAL DATA

Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm,Cu thickness=35m, Copper areas: 0.5cm2, 6cm2).

40

45

50

55

60

65

70

0 1 2 3 4 5 6 7PCB Cu heatsink area (cm^2)

RTH j-amb (C/W)

15/23

VN920 / VN920-B5 / VN920SO

Thermal fitting model of a single channel HSDin SO-16L

Pulse calculation formula

Thermal ParameterArea/island (cm2) 0.5 6

R1 (C/W) 0.02R2 (C/W) 0.1R3 ( C/W) 2.2R4 (C/W) 12R5 (C/W) 15R6 (C/W) 35 20C1 (W.s/C) 0.0015C2 (W.s/C) 7.00E-03C3 (W.s/C) 1.50E-02C4 (W.s/C) 0.14C5 (W.s/C) 1C6 (W.s/C) 5 8

ZTH RTH ZTHtp 1 ( )+=where tp T=

SO-16L Thermal Impedance Junction Ambient Single Pulse

0.01

0.1

1

10

100

0.0001 0.001 0.01 0.1 1 10 100 1000Time (s)

ZTH (C/W)

0.5 cm2

6 cm2

T_amb

C1

R1 R2

C2

R3

C3

R4

C4

R5

C5

R6

C6

Pd

Tj

16/23

VN920 / VN920-B5 / VN920SO

Thermal fitting model of a single channel HSDin P2PAK

Pulse calculation formula

Thermal ParameterArea/island (cm2) 0.97 6

R1 (C/W) 0.02R2 (C/W) 0.1R3 ( C/W) 0.22R4 (C/W) 4R5 (C/W) 9R6 (C/W) 37 22C1 (W.s/C) 0.0015C2 (W.s/C) 0.007C3 (W.s/C) 0.015C4 (W.s/C) 0.4C5 (W.s/C) 2C6 (W.s/C) 3 5

ZTH RTH ZTHtp 1 ( )+=where tp T=

P2PAK Thermal Impedance Junction Ambient Single Pulse

T_amb

C1

R1 R2

C2

R3

C3

R4

C4

R5

C5

R6

C6

Pd

Tj

0.01

0.1

1

10

100

1000

0.0001 0.001 0.01 0.1 1 10 100 1000Time (s)

ZTH (C/W)

0.97 cm2

6 cm2

17/23

VN920 / VN920-B5 / VN920SO

DIM.mm. inch

MIN. TYP MAX. MIN. TYP. MAX.A 2.65 0.104a1 0.1 0.2 0.004 0.008a2 2.45 0.096b 0.35 0.49 0.014 0.019

b1 0.23 0.32 0.009 0.012C 0.5 0.020c1 45 (typ.)D 10.1 10.5 0.397 0.413E 10.0 10.65 0.393 0.419e 1.27 0.050

e3 8.89 0.350F 7.4 7.6 0.291 0.300L 0.5 1.27 0.020 0.050M 0.75 0.029S 8 (max.)

SO-16L MECHANICAL DATA

18/23

VN920 / VN920-B5 / VN920SO

DIM.mm. inch

MIN. TYP MAX. MIN. TYP. MAX.A 4.8 0.189C 1.37 0.054D 2.4 2.8 0.094 0.110

D1 1.2 1.35 0.047 0.053E 0.35 0.55 0.014 0.022F 0.8 1.05 0.031 0.041

F1 1 1.4 0.039 0.055G 3.2 3.4 3.6 0.126 0.134 0.142

G1 6.6 6.8 7 0.260 0.268 0.276H2 10.4 0.409H3 10.05 10.4 0.396 0.409L 17.85 0.703

L1 15.75 0.620L2 21.4 0.843L3 22.5 0.886L5 2.6 3 0.102 0.118L6 15.1 15.8 0.594 0.622L7 6 6.6 0.236 0.260M 4.5 0.177

M1 4 0.157Diam. 3.65 3.85 0.144 0.152

PENTAWATT (VERTICAL) MECHANICAL DATA

19/23

VN920 / VN920-B5 / VN920SO

DIM.mm.

MIN. TYP MAX.A 4.30 4.80A1 2.40 2.80A2 0.03 0.23b 0.80 1.05c 0.45 0.60c2 1.17 1.37D 8.95 9.35

D2 8.00E 10.00 10.40E1 8.50e 3.20 3.60e1 6.60 7.00L 13.70 14.50L2 1.25 1.40L3 0.90 1.70L5 1.55 2.40R 0.40V2 0 8

Package Weight 1.40 Gr (typ)

P010R

P2PAK MECHANICAL DATA

20/23

VN920 / VN920-B5 / VN920SOSO-16L TUBE SHIPMENT (no suffix)

1

All dimensions are in mm.

Base Q.ty 50Bulk Q.ty 1000Tube length ( 0.5) 532A 3.5B 13.8C ( 0.1) 0.6

TAPE AND REEL SHIPMENT (suffix 13TR)

Base Q.ty 1000Bulk Q.ty 1000A (max) 330B (min) 1.5C ( 0.2) 13F 20.2G (+ 2 / -0) 16.4N (min) 60T (max) 22.4

TAPE DIMENSIONSAccording to Electronic Industries Association(EIA) Standard 481 rev. A, Feb 1986


Tape width W 16Tape Hole Spacing P0 ( 0.1) 4Component Spacing P 12Hole Diameter D ( 0.1/-0) 1.5Hole Diameter D1 (min) 1.5Hole Position F ( 0.05) 7.5Compartment Depth K (max) 6.5Hole Spacing P1 ( 0.1) 2

Topcover

tape

End

Start

No componentsNo components Components

500mm min500mm minEmpty components pockets

saled with cover tape.

User direction of feed

A

CB

REEL DIMENSIONS

21/23

VN920 / VN920-B5 / VN920SO

PENTAWATT TUBE SHIPMENT (no suffix)


Base Q.ty 50Bulk Q.ty 1000Tube length ( 0.5) 532A 18B 33.1C ( 0.1) 1C

B

A

22/23

VN920 / VN920-B5 / VN920SOP2PAK TUBE SHIPMENT (no suffix)


Base Q.ty 50Bulk Q.ty 1000Tube length ( 0.5) 532A 18B 33.1C ( 0.1) 1

TAPE AND REEL SHIPMENT (suffix 13TR)


Base Q.ty 1000Bulk Q.ty 1000A (max) 330B (min) 1.5C ( 0.2) 13F 20.2G (+ 2 / -0) 24.4N (min) 60T (max) 30.4

TAPE DIMENSIONSAccording to Electronic Industries Association(EIA) Standard 481 rev. A, Feb 1986


Tape width W 24Tape Hole Spacing P0 ( 0.1) 4Component Spacing P 16Hole Diameter D ( 0.1/-0) 1.5Hole Diameter D1 (min) 1.5Hole Position F ( 0.05) 11.5Compartment Depth K (max) 6.5Hole Spacing P1 ( 0.1) 2

Topcover

tape

End

Start

No componentsNo components Components

500mm min500mm minEmpty components pockets

saled with cover tape.

User direction of feed

REEL DIMENSIONS

C

B

A

23/23

VN920 / VN920-B5 / VN920SO

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequencesof use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license isgranted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication aresubject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics productsare not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

The ST logo is a trademark of STMicroelectronics

2003 STMicroelectronics - Printed in ITALY- All Rights Reserved.

STMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia -

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7371