73451

Vishay SiliconixSi7686DP

Document Number: 73451S-80440-Rev. C, 03-Mar-08

www.vishay.com1

N-Channel 30-V (D-S) MOSFET

FEATURES • Halogen-free available • TrenchFET® Power MOSFET • New Low Thermal Resistance PowerPAK®

Package with Low 1.07 mm Profile • Optimized for High-Side Synchronous Rectifier

Operation • 100 % Rg Tested

APPLICATIONS • DC/DC Converters

PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A)a Qg (Typ.)

300.0095 at VGS = 10 V 35

9.2 nC0.014 at VGS = 4.5 V 35

Ordering Information: Si7686DP-T1-E3 (Lead (Pb)-free) Si7686DP-T1-GE3 (Lead (Pb)-free and Halogen-free)

1

2

3

4

5

6

7

8

S

S

S

G

D

D

D

D

6.15 mm 5.15 mm

PowerPAK SO-8

Bottom View

N-Channel MOSFET

G

D

S

Notes: a. Package Limited.b. Surface Mounted on 1" x 1" FR4 board.c. t = 10 s.d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed andis not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.f. Maximum under Steady State conditions is 70 °C/W.

ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise notedParameter Symbol Limit Unit Drain-Source Voltage VDS 30

VGate-Source Voltage VGS ± 20

Continuous Drain Current (TJ = 150 °C)

TC = 25 °C

ID

35a

A

TC = 70 °C 35a

TA = 25 °C 17.9b, c

TA = 70 °C 14.3b, c

Pulsed Drain Current IDM 50

Continuous Source-Drain Diode CurrentTC = 25 °C

IS31.5

TA = 25 °C 4.2b, c

Single Pulse Avalanche CurrentL = 0.1 mH

IAS 10Avalanche Energy EAS 5 mJ

Maximum Power Dissipation

TC = 25 °C

PD

37.9

WTC = 70 °C 24.2TA = 25 °C 5b, c

TA = 70 °C 3.2b, c

Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150°C

Soldering Recommendations (Peak Temperature)d, e 260

THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit

Maximum Junction-to-Ambientb, f t ≤ 10 s RthJA 21 25°C/W

Maximum Junction-to-Case (Drain) Steady State RthJC 2.8 3.3

RoHSCOMPLIANT

www.vishay.com2



Notes:a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operationof the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximumrating conditions for extended periods may affect device reliability.

SPECIFICATIONS TJ = 25 °C, unless otherwise notedParameter Symbol Test Conditions Min. Typ. Max. Unit

Static

Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 30 V

VDS Temperature Coefficient ΔVDS/TJ ID = 250 µA

31.5mV/°C

VGS(th) Temperature Coefficient ΔVGS(th)/TJ - 6

Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 1 3 V

Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA

Zero Gate Voltage Drain Current IDSSVDS = 30 V, VGS = 0 V 1

µAVDS = 30 V, VGS = 0 V, TJ = 55 °C 10

On-State Drain Currenta ID(on) VDS ≥ 5 V, VGS = 10 V 50 A

Drain-Source On-State Resistancea RDS(on) VGS = 10 V, ID = 13.8 A 0.0078 0.0095

ΩVGS = 4.5 V, ID = 11.4 A 0.011 0.014

Forward Transconductancea gfs VDS = 15 V, ID = 13.8 A 56 S

Dynamicb

Input Capacitance Ciss

VDS = 15 V, VGS = 0 V, f = 1 MHz

1220

pFOutput Capacitance Coss 230

Reverse Transfer Capacitance Crss 98

Total Gate Charge QgVDS = 15 V, VGS = 10 V, ID = 13.8 A 17 26

nCVDS = 15 V, VGS = 5 V, ID = 13.8 A

9.2 14

Gate-Source Charge Qgs 4.1

Gate-Drain Charge Qgd 2.8

Gate Resistance Rg f = 1 MHz 0.8 1.2 Ω

Turn-On Delay Time td(on)

VDD = 15 V, RL = 1.5 Ω ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω

20 30

ns

Rise Time tr 20 30

Turn-Off Delay Time td(off) 20 30

Fall Time tf 8 15

Turn-On Delay Time td(on)

VDD = 15 V, RL = 1.5 Ω ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω

13 20

Rise Time tr 16 25

Turn-Off Delay Time td(off) 23 35

Fall Time tf 8 15

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current IS TC = 25 °C 31.5A

Pulse Diode Forward Currenta ISM 50

Body Diode Voltage VSD IS = 2.6 A 0.8 1.2 V

Body Diode Reverse Recovery Time trr

IF = 2.6 A, di/dt = 100 A/µs, TJ = 25 °C

25 50 ns

Body Diode Reverse Recovery Charge Qrr 15 30 nC

Reverse Recovery Fall Time ta 12.5ns

Reverse Recovery Rise Time tb 12.5


www.vishay.com3


TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

Output Characteristics

On-Resistance vs. Drain Current and Gate Voltage

Gate Charge

0

10

20

30

40

50

0.0 0.4 0.8 1.2 1.6 2.0

VGS = 10 thru 4 V

VDS - Drain-to-Source Voltage (V)

- D

rain

Cur

rent

(A

)I D

3 V

0.0040

0.0060

0.0080

0.0100

0.0120

0.0140

0 10 20 30 40 50

VGS = 10 V

ID - Drain Current (A)

VGS = 4.5 V

RD

S(o

n) -

On-

Res

ista

nce

(mΩ

)

0

2

4

6

8

10

0 4 8 12 16 20

ID = 13.8 A

- G

ate-

to-S

ourc

e V

olta

ge (

V)

Qg - Total Gate Charge (nC)

VG

S

VDS = 21 V

VDS = 15 V

Transfer Characteristics

Capacitance

On-Resistance vs. Junction Temperature

0

2

4

6

8

10

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

25 °C

TC = 125 °C

- 55 °C

VGS - Gate-to-Source Voltage (V)

- D

rain

Cur

rent

(A

)I D

0

300

600

900

1200

1500

0 5 10 15 20 25 30

Crss

Coss

Ciss


C -

Cap

acita

nce

(pF

)

0.6

0.8

1.0

1.2

1.4

1.6

1.8

- 50 - 25 0 25 50 75 100 125 150

VGS = 10 V

TJ - Junction Temperature (°C)

RD

S(o

n) -

On-

Res

ista

nce

(Nor

mal

ized

)

VGS = 4.5 V

ID = 13.8 A

www.vishay.com4




Source-Drain Diode Forward Voltage

Threshold Voltage

1.0 1.2

1

10

50

0.00 0.2 0.4 0.6 0.8

TJ = 25 °C

VSD - Source-to-Drain Voltage (V)

- S

ourc

e C

urre

nt (

A)

I S

TJ = 150 °C

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

2.6

- 50 - 25 0 25 50 75 100 125 150

ID = 250 µA

TJ - Temperature (°C)

VG

S(t

h) (

V)

On-Resistance vs. Gate-to-Source Voltage

Single Pulse Power, Junction-to-Ambient

0.005

0.010

0.015

0.020

0.025

0.030

3 4 5 6 7 8 9 10

ID = 13.8 A

VGS - Gate-to-Source Voltage (V)

RD

S(o

n) -

Dra

in-t

o-S

ourc

e O

n-R

esis

tanc

e (Ω

)

TJ = 25 °C

TJ = 125 °C

0

30

50

10

20Pow

er (

W)

Time (s)

40

10 60010.10.01 100

Safe Operating Area, Junction-to-Ambient

100

1

0.1 1 10 1000.001

- D

rain

Cur

rent

(A

)I D

0.1

TA = 25 °CSingle Pulse


* VGS > minimum VGS at which RDS(on) is specified

1 ms

10 ms

100 ms

DC

1 s10 s

0.01

Limited byRDS(on)*

10


www.vishay.com5



* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upperdissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the packagelimit.

Current Derating*

0

10

20

30

40

50

60

0 25 50 75 100 125 150

I D -

Dra

in C

urre

nt (

A)

TC - Case Temperature (°C)

Package Limited

Power Derating

0

5

10

15

20

25

30

35

40

25 50 75 100 125 150

TC - Case Temperature (°C)

Pow

er (

W)

www.vishay.com6




Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for SiliconTechnology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, andreliability data, see http://www.vishay.com/ppg?73451.

Normalized Thermal Transient Impedance, Junction-to-Ambient

10-2 1 10 60010-110-4 100

2

1

0.1

0.01

0.2

0.1

0.05

0.02

Single Pulse

Duty Cycle = 0.5

Square Wave Pulse Duration (s)

Nor

mal

ized

Effe

ctiv

e Tr

ansi

ent

The

rmal

Impe

danc

e

1. Duty Cycle, D =

2. Per Unit Base = RthJA = 70 °C/W

3. TJM - TA = PDMZthJA(t)

t1t2

t1t2

Notes:

4. Surface Mounted

PDM

10-3

Normalized Thermal Transient Impedance, Junction-to-Case

10-3 10-2 110-110-4

2

1

0.1

0.01

0.2

0.1

Duty Cycle = 0.5

Square Wave Pulse Duration (s)

Nor

mal

ized

Effe

ctiv

e Tr

ansi

ent

The

rmal

Impe

danc

e

0.02

0.05

Single Pulse

Package Informationwww.vishay.com Vishay Siliconix

Revison: 20-May-13 1 Document Number: 71655

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PowerPAK® SO-8, (Single/Dual)

MILLIMETERS INCHES

DIM. MIN. NOM. MAX. MIN. NOM. MAX.

A 0.97 1.04 1.12 0.038 0.041 0.044A1 - 0.05 0 - 0.002b 0.33 0.41 0.51 0.013 0.016 0.020c 0.23 0.28 0.33 0.009 0.011 0.013D 5.05 5.15 5.26 0.199 0.203 0.207

D1 4.80 4.90 5.00 0.189 0.193 0.197D2 3.56 3.76 3.91 0.140 0.148 0.154D3 1.32 1.50 1.68 0.052 0.059 0.066D4 0.57 typ. 0.0225 typ.D5 3.98 typ. 0.157 typ.E 6.05 6.15 6.25 0.238 0.242 0.246

E1 5.79 5.89 5.99 0.228 0.232 0.236E2 (for AL product) 3.30 3.48 3.66 0.130 0.137 0.144

E2 (for other product) 3.48 3.66 3.84 0.137 0.144 0.151E3 3.68 3.78 3.91 0.145 0.149 0.154

E4 (for AL product) 0.58 typ. 0.023 typ. E4 (for other product) 0.75 typ. 0.030 typ.

e 1.27 BSC 0.050 BSCK (for AL product) 1.45 typ. 0.057 typ.

K (for other product) 1.27 typ. 0.050 typ.K1 0.56 - - 0.022 - -H 0.51 0.61 0.71 0.020 0.024 0.028L 0.51 0.61 0.71 0.020 0.024 0.028

L1 0.06 0.13 0.20 0.002 0.005 0.008 0° - 12° 0° - 12°W 0.15 0.25 0.36 0.006 0.010 0.014M 0.125 typ. 0.005 typ.

ECN: C13-0702-Rev. K, 20-May-13DWG: 5881

3. Dimensions exclusive of mold flash and cutting burrs.

1.Notes

2Inch will govern.Dimensions exclusive of mold gate burrs.

Backside View of Single Pad

Backside View of Dual Pad

Detail Z

D

D1

D2

c

θA

θ

E1θ

D1

E2

D2e

b

1

2

3

4

H

4

3

2

1

θ1

2

3

4 b

L

D2

D3

(2x)

Z

A1

K1

K

D

E

W

L1

D5

E3

D4

E4

E4K

LHE2

D4

D5

M

E3

2

2

http://www.vishay.com

V I S H A Y S I L I C O N I X

Power MOSFETs Application Note AN821

PowerPAK® SO-8 Mounting and Thermal Considerations

AP

PL

ICA

TIO

N N

OT

E

Revision: 16-Mai-13 1 Document Number: 71622

For technical questions, contact: [email protected] DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

www.vishay.com

by Wharton McDanielMOSFETs for switching applications are now available withdie on resistances around 1 m and with the capability tohandle 85 A. While these die capabilities represent a majoradvance over what was available just a few years ago, it isimportant for power MOSFET packaging technology to keeppace. It should be obvious that degradation of a highperformance die by the package is undesirable. PowerPAKis a new package technology that addresses these issues.In this application note, PowerPAK’s construction isdescribed. Following this mounting information is presentedincluding land patterns and soldering profiles for maximumreliability. Finally, thermal and electrical performance isdiscussed.

THE PowerPAK PACKAGEThe PowerPAK package was developed around the SO-8package (figure 1). The PowerPAK SO-8 utilizes the samefootprint and the same pin-outs as the standard SO-8. Thisallows PowerPAK to be substituted directly for a standardSO-8 package. Being a leadless package, PowerPAK SO-8utilizes the entire SO-8 footprint, freeing space normallyoccupied by the leads, and thus allowing it to hold a largerdie than a standard SO-8. In fact, this larger die is slightlylarger than a full sized DPAK die. The bottom of the dieattach pad is exposed for the purpose of providing a direct,low resistance thermal path to the substrate the device ismounted on. Finally, the package height is lower than thestandard SO-8, making it an excellent choice forapplications with space constraints.

Fig. 1 PowerPAK 1212 Devices

PowerPAK SO-8 SINGLE MOUNTINGThe PowerPAK single is simple to use. The pin arrangement(drain, source, gate pins) and the pin dimensions are thesame as standard SO-8 devices (see figure 2). Therefore, thePowerPAK connection pads match directly to those of theSO-8. The only difference is the extended drain connectionarea. To take immediate advantage of the PowerPAK SO-8single devices, they can be mounted to existing SO-8 landpatterns.

Fig. 2

The minimum land pattern recommended to take fulladvantage of the PowerPAK thermal performance seeApplication Note 826, Recommended Minimum PadPatterns With Outline Drawing Access for Vishay SiliconixMOSFETs. Click on the PowerPAK SO-8 single in the indexof this document.

In this figure, the drain land pattern is given to make fullcontact to the drain pad on the PowerPAK package.

This land pattern can be extended to the left, right, and topof the drawn pattern. This extension will serve to increasethe heat dissipation by decreasing the thermal resistancefrom the foot of the PowerPAK to the PC board andtherefore to the ambient. Note that increasing the drain landarea beyond a certain point will yield little decreasein foot-to-board and foot-to-ambient thermal resistance.Under specific conditions of board configuration, copperweight and layer stack, experiments have found thatmore than about 0.25 in2 to 0.5 in2 of additional copper(in addition to the drain land) will yield little improvement inthermal performance.

Standard SO-8 PowerPAK SO-8


AP

PL

ICA

TIO

N N

OT

EApplication Note AN821

www.vishay.com Vishay Siliconix




PowerPAK SO-8 DUALThe pin arrangement (drain, source, gate pins) and the pindimensions of the PowerPAK SO-8 dual are the same asstandard SO-8 dual devices. Therefore, the PowerPAKdevice connection pads match directly to those of the SO-8.As in the single-channel package, the only exception is theextended drain connection area. Manufacturers can likewisetake immediate advantage of the PowerPAK SO-8 dualdevices by mounting them to existing SO-8 dual landpatterns.

To take the advantage of the dual PowerPAK SO-8’sthermal performance, the minimum recommended landpattern can be found in Application Note 826,Recommended Minimum Pad Patterns With OutlineDrawing Access for Vishay Siliconix MOSFETs. Click on thePowerPAK 1212-8 dual in the index of this document.

The gap between the two drain pads is 24 mils. Thismatches the spacing of the two drain pads on thePowerPAK SO-8 dual package.

REFLOW SOLDERINGVishay Siliconix surface-mount packages meet solder reflowreliability requirements. Devices are subjected to solderreflow as a test preconditioning and are thenreliability-tested using temperature cycle, bias humidity,HAST, or pressure pot. The solder reflow temperature profileused, and the temperatures and time duration, are shown infigures 3 and 4.

For the lead (Pb)-free solder profile, seewww.vishay.com/doc?73257.

Fig. 3 Solder Reflow Temperature Profile

Fig. 4 Solder Reflow Temperatures and Time Durations

Ramp-Up Rate + 3 °C /s max.

Temperature at 150 - 200 °C 120 s max.

Temperature Above 217 °C 60 - 150 s

Maximum Temperature 255 + 5/- 0 °C

Time at MaximumTemperature 30 s

Ramp-Down Rate + 6 °C/s max.

260 °C

3 °C(max) 6 ° C/s (max.)

30 s

217 °C

150 s (max.)

Reflow Zone 60 s (min.)

Pre-Heating Zone

150 - 200 °C

Maximum peak temperature at 240 °C is allowed.


AP

PL

ICA

TIO

N N

OT






THERMAL PERFORMANCE

Introduction

A basic measure of a device’s thermal performanceis the junction-to-case thermal resistance, RthJC, or thejunction-to-foot thermal resistance, RthJF This parameter ismeasured for the device mounted to an infinite heat sink andis therefore a characterization of the device only, in otherwords, independent of the properties of the object to whichthe device is mounted. Table 1 shows a comparison ofthe DPAK, PowerPAK SO-8, and standard SO-8. ThePowerPAK has thermal performance equivalent to theDPAK, while having an order of magnitude better thermalperformance over the SO-8.

Thermal Performance on Standard SO-8 Pad Pattern

Because of the common footprint, a PowerPAK SO-8can be mounted on an existing standard SO-8 pad pattern.The question then arises as to the thermal performanceof the PowerPAK device under these conditions. Acharacterization was made comparing a standard SO-8 anda PowerPAK device on a board with a trough cut outunderneath the PowerPAK drain pad. This configurationrestricted the heat flow to the SO-8 land pads. The resultsare shown in figure 5.

Fig. 5 PowerPAK SO-8 and Standard SO-0 Land Pad Thermal Path

Because of the presence of the trough, this result suggestsa minimum performance improvement of 10 °C/W by usinga PowerPAK SO-8 in a standard SO-8 PC board mount.

The only concern when mounting a PowerPAK on astandard SO-8 pad pattern is that there should be no tracesrunning between the body of the MOSFET. Where thestandard SO-8 body is spaced away from the pc board,allowing traces to run underneath, the PowerPAK sitsdirectly on the pc board.

Thermal Performance - Spreading Copper

Designers may add additional copper, spreading copper, tothe drain pad to aid in conducting heat from a device. It ishelpful to have some information about the thermalperformance for a given area of spreading copper.

Figure 6 shows the thermal resistance of a PowerPAK SO-8device mounted on a 2-in. 2-in., four-layer FR-4 PC board.The two internal layers and the backside layer are solidcopper. The internal layers were chosen as solid copper tomodel the large power and ground planes common in manyapplications. The top layer was cut back to a smaller areaand at each step junction-to-ambient thermal resistancemeasurements were taken. The results indicate that an areaabove 0.3 to 0.4 square inches of spreading copper gives noadditional thermal performance improvement. Asubsequent experiment was run where the copper on theback-side was reduced, first to 50 % in stripes to mimiccircuit traces, and then totally removed. No significant effectwas observed.

Fig. 6 Spreading Copper Junction-to-Ambient Performance

TABLE 1 - DPAK AND POWERPAK SO-8EQUIVALENT STEADY STATE PERFORMANCE

DPAK PowerPAKSO-8

StandardSO-8

Thermal Resistance RthJC

1.2 °C/W 1 °C/W 16 °C/W

Si4874DY vs. Si7446DP PPAK on a 4-Layer BoardSO-8 Pattern, Trough Under Drain

Pulse Duration (sec)

)sttaw/

C( e cnadepmI

0.0001

0

1

50

60

10

100000.01

40

20

Si4874DY

Si7446DP

100

30

Rth vs. Spreading Copper(0 %, 50 %, 100 % Back Copper)

Spreading Copper (sq in)

)sttaw/

C( ecnadepmI

0.00

56

51

46

41

36

0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00

0 %

50 %

100 %


AP

PL

ICA

TIO

N N

OT






SYSTEM AND ELECTRICAL IMPACT OFPowerPAK SO-8In any design, one must take into account the change inMOSFET RDS(on) with temperature (figure 7).

Fig. 7 MOSFET RDS(on) vs. Temperature

A MOSFET generates internal heat due to the currentpassing through the channel. This self-heating raises thejunction temperature of the device above that of the PCboard to which it is mounted, causing increased powerdissipation in the device. A major source of this problem liesin the large values of the junction-to-foot thermal resistanceof the SO-8 package.

PowerPAK SO-8 minimizes the junction-to-board thermalresistance to where the MOSFET die temperature is veryclose to the temperature of the PC board. Consider twodevices mounted on a PC board heated to 105 °C by othercomponents on the board (figure 8).

Fig. 8 Temperature of Devices on a PC Board

Suppose each device is dissipating 2.7 W. Using thejunction-to-foot thermal resistance characteristics of thePowerPAK SO-8 and the standard SO-8, the dietemperature is determined to be 107 °C for the PowerPAK(and for DPAK) and 148 °C for the standard SO-8. This is a2 °C rise above the board temperature for the PowerPAKand a 43 °C rise for the standard SO-8. Referring to figure 7,a 2 °C difference has minimal effect on RDS(on) whereas a43 °C difference has a significant effect on RDS(on).

Minimizing the thermal rise above the board temperature byusing PowerPAK has not only eased the thermal design butit has allowed the device to run cooler, keep rDS(on) low, andpermits the device to handle more current than the sameMOSFET die in the standard SO-8 package.

CONCLUSIONSPowerPAK SO-8 has been shown to have the same thermalperformance as the DPAK package while having the samefootprint as the standard SO-8 package. The PowerPAKSO-8 can hold larger die approximately equal in size to themaximum that the DPAK can accommodate implying nosacrifice in performance because of package limitations.

Recommended PowerPAK SO-8 land patterns are providedto aid in PC board layout for designs using this newpackage.

Thermal considerations have indicated that significantadvantages can be gained by using PowerPAK SO-8devices in designs where the PC board was laid out forthe standard SO-8. Applications experimental data gavethermal performance data showing minimum andtypical thermal performance in a SO-8 environment, plusinformation on the optimum thermal performanceobtainable including spreading copper. This furtheremphasized the DPAK equivalency.

PowerPAK SO-8 therefore has the desired small sizecharacteristics of the SO-8 combined with the attractivethermal characteristics of the DPAK package.

0.6

0.8

1.0

1.2

1.4

1.6

1.8

-50 -25 0 25 50 75 100 125 150

V GS = 10 V I D = 23 A

On-Resistance vs. Junction Temperature

T J - Junction Temperature (°C)

)dezilamro

N(( ecnatsise

R-nO -

R)no(

SD

)

0.8 °C/W

107 °C

PowerPAK SO-8

16 C/W

148 °C

Standard SO-8

PC Board at 105 °C

Application Note 826Vishay Siliconix

Document Number: 72599 www.vishay.comRevision: 21-Jan-08 15

AP

PL

ICA

TIO

N N

OT

E

RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single

0.17

4

(4.4

2)

Recommended Minimum PadsDimensions in Inches/(mm)

0.260

(6.61)

0.024(0.61)

0.15

4

(3.9

1)

0.150

(3.81)

0.05

0

(1.2

7)

0.050

(1.27)

0.032

(0.82)

0.040

(1.02)

0.026(0.66)

Return to IndexReturn to Index

Legal Disclaimer Noticewww.vishay.com Vishay

Revision: 02-Oct-12 1 Document Number: 91000

DisclaimerALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVERELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any otherdisclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose orthe continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and allliability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particularpurpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typicalrequirements that are often placed on Vishay products in generic applications. Such statements are not binding statementsabout the suitability of products for a particular application. It is the customer’s responsibility to validate that a particularproduct with the properties described in the product specification is suitable for use in a particular application. Parametersprovided in datasheets and/or specifications may vary in different applications and performance may vary over time. Alloperating parameters, including typical parameters, must be validated for each customer application by the customer’stechnical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustainingapplications or for any other application in which the failure of the Vishay product could result in personal injury or death.Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Pleasecontact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or byany conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Material Category PolicyVishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill thedefinitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Councilof June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment(EEE) - recast, unless otherwise specified as non-compliant.

Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm thatall the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Freerequirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make referenceto the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21conform to JEDEC JS709A standards.

Documents

73451