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· PDF file 5/18/2020  · Assem bly Code . 0: tinned and polarity . C : water transparent . Z : article m ode . ... C 620 625 D 625 630 Directive Characteristics(Ta=25℃)----- Φ-Angular

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  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 1 of 11

    1L034XV21C0CZ501

    ◆Outline (L* H): 3.16*4.5mm ◆Good thermal dissipation & Optical uniformity

    Table of Contents

    Product Code Method-------------------------------------------2

    Maximum Rating------------------------------------------------2

    Typical Product Characteristics-------------------------------3

    Range of Bins----------------------------------------------------3

    Directive Characteristics---------------------------------------4

    Electronic-Optical Characteristics----------------------------5

    Dimensions ------------------------------------------------------6

    Packing------------------------------------------------------------7

    Precautions ------------------------------------------------------8

    Test Items and Results of Reliability------------------------11

    Features  Forward current: ≦30mA

     Typical view angle 50% Iv: 45°

     Lens color: water transparent

     RoHS and REACH-compliant

     ESD level 2kV(HBM)

    Applications  Indoor decorating

     Outdoor lighting for amusement

     Consumer electronics

     Special applications

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 2 of 11

     Product Code Method -----------------------------------------------------------------------------------------------------------------------------------

    1 - L - 03 - 4X - V21C - 0 - C - Z - 5 - 01 ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩

    ① ② ③ ④ ⑤

    Process Type Product Type Specification Lead Frame Code Dice Wavelength &Luminous Rank

    1 : normal process L: lamp LED 03: round 3.16mm 4X: frame Vxxx: red

    ⑥ ⑦ ⑧ ⑨ ⑩

    Polarity Code Resin Color Code Article Mode

    Code Special Process Requirements Assembly Code

    0: tinned and polarity C: water transparent Z: article mode 5: tinning and cutting

    special frame

    01:no expression above

    meaning for company

     Maximum Rating(Ta=25℃)

    ------------------------------------------------------------------------------------------------------------------------------------

    Characteristics Symbol Rating Unit

    DC Forward Current IF 30 mA

    Pulse Forward Current*3 IPF 100 mA

    Reverse Voltage VR 10 V

    Power Dissipation PD 80 mW

    Junction Temperature TJ 110 oC

    Operating Temperature Range TOP -40-85 oC

    Storage Temperature Range TSTG -40-100 oC

    Soldering Temperature*4 TSD 260 oC

    Notes 1: There is no maximum or typical voltage parameter

    2: For other ambient, limited setting of current will be depended on de-rating curves.

    3: Duty 1/10, pulse width 0.1ms

    4: The maximum of soldering time is 5 seconds in TSD

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 3 of 11

     Typical Product Characteristics(Ta=25℃) ------------------------------------------------------------------------------------------------------------------------------------

    Characteristics Symbol Min. Typ. Max. Unit Test condition

    Forward Voltage VF 1.5 1.9 2.5 V IF=5mA

    Reverse Current IR - - 10 μA VR=10V

    Luminous Intensity IV 120 200 - mcd IF=5mA

    Dominant Wavelength λd 615 - 630 nm IF=5mA

    View Angle 2θ1/2 - 45 - deg IF=5mA

    Notes: 1. Measurement Errors:

    Forward Voltage: ±0.1V, Luminous Intensity: ±10%Iv, Dominant Wavelength: ±1.0nm

    2. Electrical-Optical Characteristics (Ta=25℃)

     Range of Bins ------------------------------------------------------------------------------------------------------------------------------------ 1).Forward Voltage Bins(IF=5mA)

    Bin Code Min. VF

    (V) Max. VF

    (V)

    A 1.5 1.6

    B 1.6 1.7

    C 1.7 1.8

    D 1.8 1.9

    E 1.9 2.0

    F 2.0 2.1

    G 2.1 2.2

    H 2.2 2.3

    I 2.3 2.4

    J 2.4 2.5

    2).Luminous Intensity Bins(IF=5mA)

    Bin code Min. Iv (mcd)

    Max. Iv (mcd)

    10 120 160

    11 160 210

    12 210 270

    13 270 350

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 4 of 11

     Range of Bins ------------------------------------------------------------------------------------------------------------------------------------ 3).Dominant Wavelength Bins(IF=5mA)

    Bin Code Min. λd

    (nm) Max. λd

    (nm)

    B 615 620

    C 620 625

    D 625 630

     Directive Characteristics(Ta=25℃)

    ------------------------------------------------------------------------------------------------------------------------------------

    Φ -A

    ng ul

    ar D

    is pl

    ac em

    en t

    Relative Radiant Intensity vs .Angular Displacement

    20° 30° 40°

    50°

    60°

    70°

    80°

    90°

    10°0°

    Ie r

    el -R

    el at

    iv e

    R ad

    ia nt

    I nt

    en si

    ty

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 5 of 11

     Electronic-Optical Characteristics ------------------------------------------------------------------------------------------------------------------------------------ 1). Forward Current IF-VF 2). Relative Luminous Intensity-IF

    Forward Voltage VF(V) Ta=25°

    Fo rw

    ar d

    Cu rr

    en t I

    F( m

    A)

    0 5 10 15 20 25 30 Forward Current (mA)

    R el

    at iv

    e Lu

    m io

    us F

    lu x(

    % ) 150

    125

    100

    75

    50

    25

    0 40

    3). Relative Luminous Intensity-Ta 4). Forward Current IF-Ta

    120%

    100%

    60%

    40%

    20% 0 20 40 80 100-20

    Junction Temperature(°)

    Re la

    tiv e

    Lu m

    in ou

    s Fl

    ux (%

    ) 140%

    40

    30

    20

    10

    0 0 20 40 60 80 100

    Ambient Temperature(°C)

    M ax

    im um

    C ur

    re nt

    (m A)

    5). Forward Voltage-Ta 6). Wavelength Characteristics (Ta=25OC)

    R el

    at iv

    e F

    or w

    ar d

    V ol

    ta ge

    (% )

    Ambient Temperature(°) Wavelength (nm) Ta=25°

    R el

    at iv

    e L

    u m

    in o

    u s

    In te

    n si

    ty

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 6 of 11

     Dimensions ------------------------------------------------------------------------------------------------------------------------------------

    Notes: 1. All measurements are ±0.3 mm unless otherwise indicated. 2. The appearance of encapsulation tolerance is ±0.25 mm 3. The maximum dimensions of protruded resin flange (NOTE) is 1.0mm

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 7 of 11

     Packing ------------------------------------------------------------------------------------------------------------------------------------ 1. Package bag: vinyl bag(1,000pcs per bag) 2. Label: label as below(label on the left)

    3. Package 3.1. ESD bag: 12bags per carton (12,000pcs per carton) 3.2. Carton size: 330*135*330mm

    4. Falling

    The falling off of the device: we have to ensure the max loss number of LAMP is 2pcs. 5. Different rank

    The product of different rank will be separate in the same box

  • The Red Series

    Version: IS-1.2 BT-L-170829001 Page 8 of 11

     Precautions ------------------------------------------------------------------------------------------------------------------------------------ A. Storage

    It can be stored for 3 months under conditions of Temperature 23+/-5 and humidity 30-65%。During storage, there must not be any damage to the sealed bag, and if opened once, do not store again. After the package is opened, the products should be used within one week under the same temperature and humidity.

    B. Cleaning Do not use any unidentified chemical to clean LEDS, it could damage or crack the LED epoxy surface.

    If necessary, soak LED in alcohol for a time not exceeding one minute in normal temperature. C. Lead Frames Shaping & Trimming

    1. The shaping should be done underneath the wedge point. No pressure should be exerted to the epoxy shell of the LED during shaping. 2. Shaping of the leads should be done before soldering. 3. Lead trimming should only be done at normal temperature.

    D. Soldering 1. When soldering, the soldering iron needs to be at least 1.6mm away from the epoxy edge. Do not apply any pressure to the epoxy encapsulation or the lead frame during the soldering process. 2. Wave soldering, please solder once for less than 5 seconds at a maximum temperature of 265°C. During the soldering process, if the temperature or timing is not controlled within limits, it would cause the epoxy to deform or cause the die or wires within the LED to be damaged.

    3. When using soldering iron, please solder once for less than 5 seconds at a maximum te