Embed Size (px)
Citation preview
22 Bd. Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
3D NAND FLASH MEMORIESComparison of Leading Edge 3D NAND MemoriesTOSHIBA-SanDisk /SAMSUNG/SK HYNIX/INTEL- MICRONMemory report by Belinda DubeDecember 2018
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Toshiba/SanDisk
o Samsung
o SK Hynix
o Micron/Intel
Technology & Market 8
o NAND Roadmap
o NAND Revenue
Physical Analysis 14
o Toshiba Synthesis of the Physical Analysis
o Toshiba Physical Analysis Methodology
o Toshiba Physical analysis
Die
Cross-Section
o Toshiba Patents
o Samsung Synthesis of the Physical Analysis 53
o Samsung Physical Analysis Methodology
o Samsung Physical analysis
Die
Cross-Section
o Samsung Patents
o SK Hynix 80
Synthesis
Die design
Cross-Section
Patents
o Intel/ Micron 110
Synthesis
Die design
Cross-Section
Patents
Manufacturing Process Flow 146
o Global Overview
o Wafer Fabrication Unit
o Front-End Process
Cost Analysis 179
o Synthesis of the cost analysis
Yields Explanation & Hypotheses
NAND wafer and die cost
Front-End Cost
Component Cost
Estimated Price and Manufacturer Gross Margin 228
Company services 239
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Executive Summary
The memory semiconductor industry continues to grow due to higher memory demand in consumer electronics andmass storage. Remarkable investments are channeled into the memory manufacturing business. IoT escalates thisdemand and hence manufacturers continue to increase the die density of memories at the same time aiming onreduction of the NAND die. The manufacturing process is complex compared to most semiconductor products. Eachmanufacturer proposes different manufacturing techniques with each generation in order to lower the wafermanufacturing by reducing the patterning count and cost.
This report details each process and features found in the latest NAND Memories. This full reverse costing study hasbeen conducted to provide insight on technology data, detailed analysis of microstructural features, wafermanufacturing cost and die selling price of the latest LEADING EDGE 3D NAND MEMORIES produced by the four topmanufacturers in the NAND memory industry.
Toshiba/SanDisk, Samsung , Micron/Intel have produced 64 Layers in their latest 3D NAND and SK Hynix have the
highest number of layers in their NAND Memory having 72 layers in their latest 3D NAND.
Based on complete teardown analyses of the 3D, the reports provide the physical analysis and detailed manufacturing
methods and cost estimation of each 3D NAND wafer. Comparison is made on the technology used, feature differences
and the wafer fabrication technics used by each manufacturer and their estimated cost.
Moreover, the report proposes a comparison of the four different NAND memories, highlights the differences in design
and manufacturing process.
All the 3D NAND memory manufacturers use the 12 inch wafer (300mm).
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Executive Summary
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Toshiba NAND- Packaging (with mesurements)
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Toshiba NAND - Multiple Layer Etch
Dielectric support pillar :
• High Aspect Ratio etching is perfomed through dielectric material oxide and alternating stack
• The opening extending through the terrace is filled with SiO2
• This support pillar is useful in providing mechanical support to the terrace structure to avoid collapse during SiN wet etching.
Channel Hole• High Aspect Ratio etch is also perfomed in
creation, of channel hole and memory slits.
Cell Vertical structure (full view) –SEM©2018 by System Plus Consulting
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Toshiba NAND- Logic Area : Transistor Technology
620nm
620nm
320nm
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Samsung Memory- Memory Cross section- staircase
NAND Memory Staircase©2018 by System Plus Consulting
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Samsung Memory- Memory Cross section- staircase
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
SK Hynix Memory- Effective unit Area
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Intel/Micron Memory- Double stack technic
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Die comparison
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Physical analysis summary
Overview / Introduction
Company ProfileTechnology and market
Physical Analysis o NAND Synthesiso Toshiba/SanDisk Synthesiso Toshiba/SanDisk Packageo Toshiba/SanDisk Physical
Analysiso Toshiba/SanDisk Patento Toshiba Outlineo Samsung Synthesiso Samsung Packageo Samsung Physical Analysiso Samsung Patento Samsung Outlineo SK Hynix Synthesiso SK Hynix Packageo SK Hynix Physical Analysiso SK Hynix Patento SK Hynix Outlineo Intel/Micron Synthesiso Intel/Micron Packageo Intel/Micron Physical
Analysiso Intel/Micron Patento Intel/Micron outlineo Comparison
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Physical analysis summary -staircase
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flowo Toshiba Overviewo Toshiba Front-End Processo Samsung Overviewo Samsung Front End processo SK Hynix Overviewo SK Hynix Front End Processo Intel/Micron Overviewo Intel/Micron Front End
Processo Comparison
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
SK Hynix- Bit line contact and bit line
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flowo Toshiba Overviewo Toshiba Front-End Processo Samsung Overviewo Samsung Front End processo SK Hynix Overviewo SK Hynix Front End Processo Intel/Micron Overviewo Intel/Micron Front End
Processo Comparison
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
Intel/Micron – First deck: channel hole and slit formation
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Toshiba/SanDisk Supply
Chain/Yieldo Toshiba/SanDisk Wafer & Die Costo Toshiba/ SanDisk Package Costo Toshiba/SanDisk Back-End Costo Toshiba/SanDisk Component Costo Synthesiso Samsung Supply Chain/Yieldo Samsung Wafer & Die Costo Samsung Package Costo Samsung Back-End Costo Samsung Component Costo Synthesiso SK Hynix Supply Chain/Yieldo SK Hynix Wafer & Die Costo SK Hynix Package Costo SK Hynix Back-End Costo SK Hynix Component Costo Synthesiso Intel/Micron Supply Chain/Yieldo Intel/Micron Wafer & Die Costo Intel/Micron Package Costo Intel/Micron Back-End Costo Intel/Micron Component Cost
Estimated Price Analysis
Related Reports
About System Plus
Memory – CMOS and Last Metal Layers Front End Cost
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Toshiba/SanDisk Supply
Chain/Yieldo Toshiba/SanDisk Wafer & Die Costo Toshiba/ SanDisk Package Costo Toshiba/SanDisk Back-End Costo Toshiba/SanDisk Component Costo Synthesiso Samsung Supply Chain/Yieldo Samsung Wafer & Die Costo Samsung Package Costo Samsung Back-End Costo Samsung Component Costo Synthesiso SK Hynix Supply Chain/Yieldo SK Hynix Wafer & Die Costo SK Hynix Package Costo SK Hynix Back-End Costo SK Hynix Component Costo Synthesiso Intel/Micron Supply Chain/Yieldo Intel/Micron Wafer & Die Costo Intel/Micron Package Costo Intel/Micron Back-End Costo Intel/Micron Component Cost
Estimated Price Analysis
Related Reports
About System Plus
Memory 3D Front-End Cost
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Toshiba/SanDisk Supply
Chain/Yieldo Toshiba/SanDisk Wafer & Die Costo Toshiba/ SanDisk Package Costo Toshiba/SanDisk Back-End Costo Toshiba/SanDisk Component Costo Synthesiso Samsung Supply Chain/Yieldo Samsung Wafer & Die Costo Samsung Package Costo Samsung Back-End Costo Samsung Component Costo Synthesiso SK Hynix Supply Chain/Yieldo SK Hynix Wafer & Die Costo SK Hynix Package Costo SK Hynix Back-End Costo SK Hynix Component Costo Synthesiso Intel/Micron Supply Chain/Yieldo Intel/Micron Wafer & Die Costo Intel/Micron Package Costo Intel/Micron Back-End Costo Intel/Micron Component Cost
Estimated Price Analysis
Related Reports
About System Plus
Memory Wafer & Die Cost
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Toshiba/SanDisk Supply
Chain/Yieldo Toshiba/SanDisk Wafer & Die Costo Toshiba/ SanDisk Package Costo Toshiba/SanDisk Back-End Costo Toshiba/SanDisk Component Costo Synthesiso Samsung Supply Chain/Yieldo Samsung Wafer & Die Costo Samsung Package Costo Samsung Back-End Costo Samsung Component Costo Synthesiso SK Hynix Supply Chain/Yieldo SK Hynix Wafer & Die Costo SK Hynix Package Costo SK Hynix Back-End Costo SK Hynix Component Costo Synthesiso Intel/Micron Supply Chain/Yieldo Intel/Micron Wafer & Die Costo Intel/Micron Package Costo Intel/Micron Back-End Costo Intel/Micron Component Cost
Estimated Price Analysis
Related Reports
About System Plus
Memory : Packaging Cost
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Cost Comparisono Wafer Cost o Die Costo CMOS o NAND Memory Cellso Top metallizationo Cost/Gb
Related Reports
About System Plus
Wafer Cost Comparison- Medium Yield
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Cost Comparisono Wafer Cost o Die Costo CMOS o NAND Memory Cellso Top metallizationo Cost/Gb
Related Reports
About System Plus
Die Cost Comparison- Medium Yield
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Cost Comparisono Wafer Cost o Die Costo CMOS o NAND Memory Cellso Top metallizationo Cost/Gb
Related Reports
About System Plus
CMOS Cost Comparison
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Plus
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMORY• Emerging Non-Volatile Memory 2018
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IC • Toshiba-SanDisk 3D NAND Flash
Related Reports
SystemPlusConsultingSERVI CES
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Pluso Company Serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
Overview / Introduction
Company Profile
Technology and market
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Estimated Price Analysis
Related Reports
About System Pluso Company Serviceso Contact
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]
Troy BlanchetteEASTERN UST : +1 704 859 [email protected]
www.systemplus.fr
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]
Mavis WANGTAIWANT :+886 979 336 [email protected]
NANTESHeadquarter
FRANKFURT/MAINEurope Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
PHOENIXYOLE Inc.
KOREAYOLE
ORDER FORMPlease process my order for “Leading-edge 3D NAND Memory Comparison 2018” Reverse Costing® – Structure, Process & Cost Report Ref: SP18422
Full Structure, Process & Cost Report : EUR 4,990* Annual Subscription offers possible from 3 reports, including this
report as the first of the year. Contact us for more information.
SHIP TO
Name (Mr/Ms/Dr/Pr): .............................................................
Job Title: …….............................................................................
Company: ….............................................................................
Address: …….............................................................................
City: ………………………………… State: ..........................................
Postcode/Zip: ..........................................................................
Country: ……............................................................................
VAT ID Number for EU members: ..........................................
Tel: ……………….........................................................................
Email: .....................................................................................
Date: ......................................................................................
Signature: ..............................................................................
BILLING CONTACT
First Name : ............................................................................
Last Name: …….......................................................................
Email: …..................................................................................
Phone: ……..............................................................................
PAYMENT
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|
|__|__|__|__|
Expiration date: |__|__|/|__|__|
Card Verification Value: |__|__|__|
By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP• In EUR
Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439
• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTLEADING-EDGE 3D NAND MEMORY COMPARISON 2018
Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.
Up to 47% discount!
More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer
– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure
• Power: GaN - IGBT - MOSFET - Si Diode - SiC
• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -
White/blue LED• Packaging: 3D Packaging -
Embedded - SIP - WLP• Integrated Circuits: IPD –
Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer
- Energy - Telecom
ANNUAL SUBSCRIPTIONS
Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING
22, bd Benoni GoullinNantes Biotech44200 Nantes – France
EMAIL: [email protected]
*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: December 2018
1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.
3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.
4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the
total invoice amount when placing his order.
5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.
7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.
11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES
