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Pushing Performance
HARTING AGMitronics
Nouhad Bachnak 3D-MID Reliability and Profitability with Control of Manufacturing Process
3D MIDTechnology
g
Technology
People | Power | Partnership
232010-09-29S. /1
OutlinePushing Performance
HARTING GroupHARTING AG
Mitronics The 3D-MID TechnologyBarriers for the MID Technology
Nouhad Bachnak
Barriers for the MID TechnologyHistorical ViewManufacturing Processes
3D MIDTechnology
MID Process Optimisation
Technology
Conclusion
MID Process Automation
People | Power | Partnership
2322010-09-29S. /
HARTING Group – Production Facilities
Pushing Performance
DE/Espelkamp 3DE/Espelkamp 4DE/Espelkamp 2
HARTING AGMitronics
DE/Espel-kamp 1
DE/Espel-kamp 5
p pp p
Nouhad Bachnak
kamp 1 kamp 5
3D MIDTechnology RO/SibiuGB/NorthamptonTechnology p
People | Power | Partnership
US/Elgin
23 InhaltCN/ZhuhaiCH/Biel32010-09-29S. /
HARTING Groupe – Global Business Units
Pushing Performance
Connectivity & Networks Integrated SolutionsHARTING AG
Mitronics
Connectivity & Networks Integrated Solutions
Nouhad Bachnak Connectors and Networks for power supply and data transfer. Telecommunication, Industry, Transportation …
Design and production of customised Backplanes
3D MIDTechnology
Applied TechnologiesMitronics
Technology
Tooling design and manufacturing3D MID Technology for diverse industrial applications
People | Power | Partnership
Automotive Systems
23 Mechatronics parts for steering and security applications
Housing and Shop Systems42010-09-29S. /
Pushing Performance
HARTING AGMitronics
Nouhad Bachnak
The 3D MID Technology3D MID
Technology
The 3D-MID-TechnologyTechnology
People | Power | Partnership
2352010-09-29S. /
Barriers for the MID TechnologyPushing Performance
Extract from the appraised questionnaire of the 8. International HARTING AG
MitronicsCongress MID 2008
Nouhad Bachnak
3D MIDTechnologyTechnology
People | Power | Partnership
236Low Profitability Low Reliability2010-09-29
S. /
Historical ViewPushing Performance
First research works on MID-Technology at the beginning of the 80´sHARTING AG
Mitronics
gy g g
At this time the MID technology was not able to become accepted .Reasons: absence of qualified materials, manufacturing processes and MIDspecific kno ho
Nouhad Bachnak
specific know how
Revival from 19961996: first high volume production of 2S product (2 shot moulding )
3D MIDTechnology
g p p ( g )
1997: development of the LDS process (Laser Direct Structuring)
1997-2004: development of new materials for the LDS processTechnology p p
2002: high volume production of MID Antennas (2S)
2005: serial production of LDS productsPeople | Power | Partnership 2005: serial production of LDS products
2008 und 2009: jump of MID products in the market
2372010-09-29S. /
Historical View- Comparison with PCB
Pushing Performance
250
Estimated MID-Turnover in Mio. €
HARTING AGMitronics 200
Nouhad Bachnak
100
150
3D MIDTechnology
50
Technology
01982 1984 1986 1988 1990 1992 1994 1996 1998 2000 2002 2004 2006 2008 2010 2012 2014 2016 2018 2020
Research Phase Development Phase Growth Phase
YearMID
People | Power | Partnership Research Phase Development Phase Growth Phase
aten
t-at
ion
PCB
m s bl
y esside
d
PCB
23
PCB
Pa
regi
stra
Firs
t Se
rial- P
Dry
film
proc
ess
Ass
emb
mas
hin
Dou
ble
PCB
82010-09-29S. /
Manufacturing Process: LDS (Laser Direct Structuring)
Pushing Performance
Si l h t i j ti ld d d
( g)
HARTING AGMitronics
Single shot injection mould doped with metal-complex
Nouhad Bachnak Laser activation
3D MIDTechnology
Cleaning
C l tiTechnology Cu plating
Ni P l tiPeople | Power | Partnership Ni-P plating
Au plating
239
Au plating2010-09-29S. /
Manufacturing Process: LDS (Laser Direct Strukturing)
Pushing Performance
( g)
Laser Activation Cleaning1s MouldingHARTING AG
Mitronics
Laser Activation Cleaning1s-Moulding
Nouhad Bachnak
3D MIDTechnologyTechnology
Metallisation Electro Optical Test Electronic Assembly
People | Power | Partnership
23102010-09-29S. /
Manufacturing Process: 2S2 Sh t M ldi MID
Pushing Performance2 Shot-Moulding MID
HARTING AGMitronics
Composite of two plastics
Nouhad Bachnak 1. Component: plateable
3D MIDTechnology
2. Component: not plateableTechnology
Chemical activationPeople | Power | Partnership
Metallisation (similar to LDS)
2311
( )
2010-09-29S. /
Manufacturing Process: 2S2 Sh t M ldi MID
Pushing Performance
1 Component 1 + 2 Component2S Moulding
2 Shot-Moulding MID
HARTING AGMitronics
1. Component 1. + 2. Component2S-Moulding
Nouhad Bachnak
3D MIDTechnologyTechnology
Metallisation Electro Optical Test Electronic Assembly
People | Power | Partnership
23122010-09-29S. /
Pushing Performance
HARTING AGMitronics
Nouhad Bachnak MID Process Optimisation and Automation
3D MIDTechnology
Optimisation and Automation
Technology
People | Power | Partnership
23132010-09-29S. /
MID Process: Overview and DependencyPushing Performance
HARTING AGMitronics
Electr.Assembly
Laser & CleaningMoulding MetallisationDesign
Nouhad Bachnak
AssemblyCleaning
3D MIDTechnologyTechnology
Glob TopWire Bonding CuringChip Gluing
Electr.AssemblyPeople | Power | Partnership
Chip PositioningDispensing Soldering
Assembly
23142010-09-29S. /
MID Process: Overview and DependencyPushing Performance
HARTING AGMitronics
Electr.Assembly
Laser & CleaningMoulding MetallisationDesign
Nouhad Bachnak
AssemblyCleaning
3D MIDTechnologyTechnology
Glob TopWire Bonding SolderingChip Gluing
Electr.AssemblyPeople | Power | Partnership
Chip PositioningDispensing Soldering
Assembly
23152010-09-29S. /
MID Process: Overview and DependencyPushing Performance
High Temperature Resistance
HARTING AGMitronics
Stiffness of the Adhesives
Covering of theWire Bond
Nouhad Bachnak
Adhesives Wire Bond
3D MIDTechnology
Glob TopWire Bonding SolderingChip Gluing
Electr.A blTechnology
Chip PositioningDispensing Soldering
Assembly
People | Power | Partnership
23162010-09-29S. /
Dependency between different ProcessesE l El t i A bl P
Pushing PerformanceExample: Electronic Assembly Process
HARTING AGMitronics
• Planarity• Metall. for
Bonding
Nouhad Bachnak
• Roughness and Porosity
• Planarity• Moulding Flow
Direction(CTE Anisotr.)• etc.
• Rouphness of TracksBonding• Chip Dimensions• SMD-Pad-Dim.• High Temperature
Resistance• CTE Compensation
3D MIDTechnology
• Cleanness of the Surface• Thickness of Ni
• CTE-Compensation
Technology
Electr.Assembly
Laser & CleaningMoulding MetallisationDesign
People | Power | Partnership
23172010-09-29S. /
MID Process Optimisation
Pushing Performance Project Definition
P j t Ch tHARTING AG
Mitronics
Project Charter
CTQ
Parameter Q-Characteristic
Prozess-Stepp
Nouhad Bachnak
Stepp
Q-Characteristic
3D MIDTechnology
C + E
ozes
s-ra
met
er
Technology
Pro
par
FMEA
People | Power | Partnership
CTQ: Critical to Quality
DOE
2318
CTQ: Critical to QualityC+E: Cause and EffectsDOE: Design of Experiment
Design Rules DefinitionImplementation
Process Window DefinitionImplementation2010-09-29
S. /
Output of the Optimisation Process
Pushing Performance
D i R l D fi iti P Wi d D fi itiHARTING AGMitronics
Design Rules Definition Process Window Definition
Nouhad Bachnak
3D MIDTechnologyTechnology
People | Power | Partnership
23192010-09-29S. /
Process Automation: Moulding, Laser & Cleaning
Pushing Performance
Moulding: MouldingHARTING AG
Mitronics
g
- Automated Handling- Process Control (Temperature, Pressure)
Moulding
Nouhad Bachnak
3D MIDTechnology Laser & CleaningTechnology
Laser & Cleaning:
Laser & Cleaning
People | Power | Partnership - Automated Robot Cell- Continuous Process Control
23202010-09-29S. /
Process Automation: Metallisation, Electronic Assembly
Pushing Performance
Assembly
HARTING AGMitronics Metallisation:
- Semi automated Batch Handling
Metallisation
Nouhad Bachnak
Semi automated Batch Handling- Automated Bath Control
3D MIDTechnologyTechnology
Electronic Assembly: - Inline Manufacturing
C ti T ki f P P t
Electronic Assembly
People | Power | Partnership - Continuous Tracking of Process Parameter
23212010-09-29S. /
ConclusionPushing Performance
HARTING AGMitronics
Increasing product quality and Higher Production Output
Nouhad Bachnakincreasing yield due to process optimisation and process control
due to Automation
3D MIDTechnology Increasing technolog kno ho and increasing a tomation alloTechnology Increasing technology know how and increasing automation allow
an economical manufacturing of high reliable 3D-MID Products
People | Power | Partnership
23222010-09-29S. /
Pushing Performance Thank You Thank You For Your AttentionFor Your Attention
HARTING AGMitronics
For Your AttentionFor Your Attention
Nouhad Bachnak
3D MIDTechnologyTechnology
People | Power | Partnership
23232010-09-29S. /