5
3D Collage:Expressive Non-Realistic Modeling(NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia Tiberiu Popa,Alla Sheffer

3D Collage:Expressive Non- Realistic Modeling (NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia

Embed Size (px)

Citation preview

Page 1: 3D Collage:Expressive Non- Realistic Modeling (NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia

3D Collage:Expressive Non-Realistic Modeling(NPAR 2007)

Tel Aviv UniversityRan Gal,Daniel Cohen-Or

TU BerlinOlga Sorkine

University of British ColumbiaTiberiu Popa,Alla Sheffer

Page 2: 3D Collage:Expressive Non- Realistic Modeling (NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia

Artistic Tessellations by Growing Curves(NPAR 2011)

Carleton UniversityHua Li,David Mould

Page 3: 3D Collage:Expressive Non- Realistic Modeling (NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia

Digital Micrography(SIGGRAPH 2011)

Mikail Bessmeltsev University of British ColumbiaRon Maharik

University of British Columbia INRIA Rhone-AlpesAlla Sheffer

The Interdisciplinary CenterAriel Shamir

Adobe Systems IncorporatedNathan Carr

Page 4: 3D Collage:Expressive Non- Realistic Modeling (NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia

Making Burr Puzzles from 3D Models(SIGGRAPH 2011)

Nanyang Technological UniversityShiqing Xin,Chi-Fu Lai,Chi-Wing Fu

Chinese University of Hong KongTien-Tsin Wong

Nanyang Technological UniversityYing He

Tel Aviv UniversityDaniel Cohen-Or

Page 5: 3D Collage:Expressive Non- Realistic Modeling (NPAR 2007) Tel Aviv University Ran Gal,Daniel Cohen-Or TU Berlin Olga Sorkine University of British Columbia

3D Polyomino Puzzle(SIGGRAPH ASIA 2009)

The Hong Kong University of Science and TechnologyKui-Yip Lo,Hongwei Li

Nanyang Technological UniversityChi-Wing Fu