Embed Size (px)
Citation preview
1 © 2013
3D Circuitry on Thermoplastics Creating Molded Interconnect Devices with Laser Direct Structuring
2
Shane Stafford Creative Marketing Specialist LPKF Laser & Electronics North America Stephan Schmidt President LPKF Laser & Electronics North America Don Porter Global Account Manager LPKF Laser & Electronics North America
Our presenters
© 2013
3
Questions
• Submit questions via…
- Your GoTo Webinar panel - Twitter: @LPKF_USA
© 2013
4
What’s on slate for today
1. The rise, fall, and rise of MIDs
2. MID manufacturing methods
3. An analysis of the laser direct structuring process
4. Applications
5. Next steps
© 2013
5
Molded Interconnect Device (MID)
© 2013
Circuit board Housing Connector Cable
6
MID features
• Fewer components/parts
• Saves space, reduces weight,
lowers cost • 3D workspace opens up design
possibilities
© 2013
7
MID history
• Broke onto the scene in the 1980s
• Despite early fanfare, didn’t catch
on - High threshold for entry
• In recent years, demand for MIDs
has picked up - Miniaturization - New methods lower threshold
© 2013
8
MID apps
© 2013
What’s important about MIDs? • Stephan: 3D workspace
• Don: Reducing components
9
Common MID manufacturing methods
© 2013
Method Parts Moldings App. size Circuit design Manufacturing volume
Two-shot molding
- 1 platable plastic part, 1 non-platable plastic part
- Complex - Large - Medium
- Tied to molding of part - Ideal for simple designs
- Large batch
Laser direct structuring
- 1 platable plastic part - Simple - Medium - Small - Micro
- Independent of molding - Ideal for complex designs
- Large batch - Small batch - Prototyping
10
What is laser direct structuring (LDS)?
© 2013
• 3-step physiochemical process for
creating 3D circuitry on MIDs
1. Injection molding 2. Laser activation 3. Metallization
11
Injection Molding
• 1-shot injection molding of doped
thermoplastics
© 2013
12
Result - Injection Molding
© 2013
13
Laser activation
• Physiochemical reaction etches the
wiring pattern on the plastic and prepares material for selective metallization
© 2013
14
Laser activation
© 2013
Laser radiation
Metal Nitrogen Oxygen
polymer + metal-organic complex
15
metal seeds
polymer + metallorganic complex
Laser activation
© 2013
organic ligands
metal atom
Metal Nitrogen Oxygen
16
Laser activation
© 2013
Micro-etched, laser activated surface
Smooth, unactivated surface
17
Animation
© 2013
18
Result - Laser Activation
© 2013
19
Metallization
• Electroless copper plating
- Metallization only in the laser activated areas
© 2013
20
Metallization
© 2013
Immersion Au 0.1µm
Ni 3 µm
Cu 5 µm
Modified polymer
21
Result - Selective Metallization
© 2013
22
Applications
• Telecommunications
- You probably have an LDS antenna in your pocket right now!
© 2013
23
Applications
• Automotive
- Steering wheel
© 2013
24
Applications
• Automotive
- Motorcycle handlebar
© 2013
25
Applications
• Automotive
- Motorcycle handlebar
© 2013
26
Applications
• Medical
- Hearing aids
© 2013
27
Applications
• Security
- Drill shield
© 2013
28
Applications
• Fine pitch capabilities
- 6 mil trace/6 mil space or smaller
© 2013
29
Applications
• RFID
- Transponder
© 2013
30
• Sensors
- Pressure sensor
© 2013
Source: VTI Oy
Applications
31
Why should you consider MIDs?
• Fewer components
• Lighter parts • 3D workspace/design versatility
© 2013
32
Why should you consider LDS?
• Ideal for high mix manufacturing
environments • Complex circuitry
• Cost-effective entry into the world of
MIDs
© 2013
33
Where to go from here?
If you’re interested in laser direct structuring… We can help you… • Find an LDS service provider
© 2013
34
Where to go from here?
Or… • Start working with LDS yourself
© 2013
35
LPKF Laser & Electronics · 503-454-4219
www.lpkfusa.com · [email protected]
© 2013
Thank you for your attention!
LPKF Laser & Electronics · 503-454-4208 www.lpkfusa.com · [email protected]
