36-00-012C Design Review - Reliability

PRODUCT SPECIFICATIONS

Normalisation Renault Automobiles

36 - 00 - 012 / - - C

DESIGN REVIEW TOOL FOR ELECTRONIC PARTS

AND SYSTEM RELIABILITY

<< CIRCUIT PARTS MOUNTING CHECK LIST >>

RE-DS / Service 65850

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page 2

This document is to be considered as a whole, the parts of which shall not be separated. © RENAULT 2008. No duplication permitted without the consent of the issuing department. No circulation permitted without the consent of RENAULT and NISSAN. DATE OF ISSUE September 2002 - - - First edition in RENAULT S.A.S.

Common specifications between RENAULT – NISSAN. REVISIONS October 2003 - - A Complete re-edition

Common specifications between RENAULT – NISSAN. March 2005 - - B Addition of items about Ag TH

Modification of the item II-2-1 1 Common specifications between RENAULT – NISSAN.

November 2008 - - C Foreword Paragraph : Special note added to mention the use of IPC-A-610 Class 3. Paragraph 1: Deletion of item related to EMC design review. EMC design rules will not be reviewed during this activity. Paragraph 4 : Addition of the figures number in the table. Changed paragraphs : Point I-1-1-2 : New check points are added. Point I-1-1-9 :

• Check point (2) is modified. • Descriptions are corrected.

Point I-1-1-11 : Indication "Perforated line" in the diagram is deleted. Point I-2-1-3 : Tapping screws item is added. Point II-1-2-1 : Reference values are changed. Point II-1-4-9 :

• Item name is changed. • Additional diagram is added. • Reference values of check point (2) are eliminated. • Criteria to be consulted separately are specified.

Point II-1-4-10 : • Item name is changed. • Reference values of check point (4) are eliminated. • Additional comments in diagram are added.

Point II-1-4-11 : • Item name is modified. • Comments and criteria are corrected.

Point II-1-6-9 : Comments are added to the diagram. Point II-1-8-8 : Item is moved from an old item II-2-3-1 to other items concerning BGA and CSP. Point II-2-3 : Paragraph renamed "Other" instead of "Finition < BGA, CSP >".

RENAULT 36 - 00 - 012 / - - C


Point II-2-3-1 : “BGA underfill items” is moved to be with other items concerning BGA and CSP (general BGA paragraph) and changed to II-1-8-8. Additional items : Point I-1-1-18 : New item is added : Prevention of core cable core wire dispersion. Point I-1-1-19 : New item is added : Condition of Cu plating on the inner wall of the via hole. Point II-1-3-11 : New item about lead-free is added : Whiskers. Point II-1-3-12 : New item about lead-free is added : Decrease in solder strength. Point II-1-3-13 : New item about lead-free is added : Deformation of solder. Point II-1-4-12 : New item about press fitting design : Damage of adjacent solder mounted parts. Point II-1-4-13 : New item about press fitting design : Electrical characteristics of press fitting (insulation resistance). Point II-1-4-14 : New item about press fitting design : Mechanical strength characteristics of press fitting (durability retention force). Point II-2-2-3 : New item about coating material design : Coating material that has intruded under the bottom of parts. Additional paragraphs : I-1-5 – Paste jumper (7 items) I-1-6 – Metallic core circuit board (2 items) I-1-7 – Metal circuit board (2 items) Common specifications between RENAULT – NISSAN. This issue originates from Draft NC 2008 0850 / - - -

REFERENCED DOCUMENTS External Document IPC-A-610 Class 3

RENAULT 36 - 00 - 012 / - - C


CONTENTS

Page

1. PURPOSE 5

2. SCOPE 5

3. HOW TO USE 5

4. CHECK LIST 6

5. DETAILED CHECK ITEMS 31

< I > CIRCUIT BOARD MOUNTING DESIGN CHECK ITEMS I-1 (32)

< I-1 > CIRCUIT BOARD DESIGN I-2 (33)

< I-1-1 > CIRCUIT BOARD DESIGN <COMMON> I-2 (33)

< I-1-2 > CIRCUIT BOARD DESIGN <CERAMICS> I-21 (52)

< I-1-3 > CIRCUIT BOARD DESIGN <FLEXIBLE> I-61 (92)

< I-1-4 > CIRCUIT BOARD DESIGN <Ag-TH CIRCUIT BOARD> I-64 (95)

< I-1-5 > CIRCUIT BOARD DESIGN <PASTE JUMPER> I-67 (98)

< I-1-6 > CIRCUIT BOARD DESIGN < METALLIC CORE CIRCUIT BOARD> I-74 (105)

< I-1-7 > CIRCUIT BOARD DESIGN <METAL CIRCUIT BOARD> I-76 (107)

< I-2 > CASING DESIGN I-78 (109)

< I-2-1 > CASING DESIGN <COMMON> I-78 (109)

< I-2-2 > CASING DESIGN CHECK ITEMS TO BE COMPLETED

< I-2-3 > CASING DESIGN CHECK ITEMS TO BE COMPLETED

< II > PRODUCT MOUNTING QUALITY CHECK ITEMS II-1 (119)

< II-1 > ELECTRICAL CONNECTION II-1 (119)

< II-1-1 > ELECTRICAL CONNECTION <COMMON> TO BE COMPLETED

< II-1-2 > ELECTRICAL CONNECTION <SOLDERING – COMMON> II-2 (120)

< II-1-3> ELECTRICAL CONNECTION <SOLDERING – LEAD FREE> II-10 (129)

< II-1-4> ELECTRICAL CONNECTION <PRESS FITTING> II-24 (142)

< II-1-5> ELECTRICAL CONNECTION <DIE BONDING> II-38 (156)

< II-1-6 > ELECTRICAL CONNECTION <WIRE BONDING> II-44 (162)

< II-1-7 > ELECTRICAL CONNECTION <CONDUCTIVE ADHESIVE> II-54 (172)

< II-1-8 > ELECTRICAL CONNECTION <BGA, CSP> II-55 (173)

< II-2 > FINITION II-63 (181)

< II-2-1 > ASSEMBLY <COMMON> II-63 (181)

< II-2-2 > FINITION <COMMON> II-64 (182)

RENAULT 36 - 00 - 012 / - - C


FOREWORD

This document is identical to NISSAN document 28400NDS52 [11]. When it is altered a notice shall be given to RENAULT secretariat. It complies with the agreement reached between RENAULT and NISSAN in November 2008. SPECIAL NOTE : This standard shall be as per IPC-A-610 CLASS-3 in principle.

1. PURPOSE

This is a Design Review Tool providing a guideline for electronic circuit parts mounting and for the design reviews of electronic parts and systems reliability.

This tool should be used as a practical guide for design works (mounting layout, material selection for electronic parts) to best fit to reliability and environmental resistance requirements. This tool does not aim at establishing standard judgement criteria, but at identifying potential weaknesses and effective safety allowances and notify them to the designers.

2. SCOPE

This standard is applicable for the design reviews of either electronic parts and systems. It should be mainly used for circuit board design, mounting, and exterior design (non-PCB related parts).

3. HOW TO USE

1) Checks should be done using the following materials and samples :

• Actual unit, Prototype A, B, C, D • Electrical diagram • Layout diagram • Circuit calculation form • Technology test results (In the case of a new material or construction method introduction)

The review should be performed after confirming that the analyzed unit was designed and manufactured according to the specifications.

2) The review should be performed with the following method :

• For each item to check in the check list (4), judge the conformity with an actual unit. (Take into account the design tolerances and production variations when judging the conformity). If more accurate explanations are needed, refer to the Detailed Check Items section (5) Concerning the influence of current load and the heat generating elements, please refer to the circuit calculation sheet. Concerning the solder joints appearance and the effects of the material used, please refer to the technology test results.

• Fill the “Conformity” column of the check list (4) with the following items

In case of dubious item : CA (Caution) In case of OK : P (Pass) In case of NOK : FA (Fail)

• In the "Comments" column, explain or comment the results of the conformity check.

36-00-012 Check list of conform mounting - Circuit board design - Mounting design - Exterior design

(non-PCB related parts)

RENAULT 36 - 00 - 012 / - - C


4. CHECK LIST

RENAULT 36 - 00 - 012 / - - CI Circuit board design check items

N° Item Points to check Fig. Status Comments(1)(2)(3)

Check if there is any heat sensible part (electrolytic capacitors, etc..) near the heat generating parts.

(1)

Check if the heat resistance of the casing is sufficient. (2)

If there are any heat generating parts/elements, confirm that adjacent heat generating parts/elements are extracted.Check if heat conduction and radiation heat from the extracted parts/elements besides self-heating dose not impair the function.

(3)

(1)

(2)

(1)(2)(3)

(1)

(2)

(1)

(2)

Check that the forming leads can absorb the stresses due to the materials heat expansion.

(3)

Check if the heat generating elements(power tr, etc...) and the heat radiation plate are secured properly. (Ensure the heat radiation requirements are met)

(1)

Check if a heat radiation plate is provided for the heat generating elements.

(2)

Check if the heat generation has any effect on the solder joints.

(3)

Check that the length of the heat radiation passage is sufficient. (4)

Check the width and thickness of the circuit board pattern are adequate. (1)

Check if the number of via is adequate, and the diameter of via is sufficient.

(2)

Check that the distance between conductive lines is sufficient to ensure insulation.

(1)

Check that the distance between lands and circuit patterns is adequate for insulation resistance.

(2)

10 Location of test pad Check that the layout of the test pads is adequate. I-11 42

(1)

(2)

I-8

Distance between patterns

Leads forming shape

8

Distance from the pattern to the edge of the PCB

11 Check that measures to prevent damages on the pattern are provided during the singulation operation.

Clinching5

Check that the leads forming shape is adequate so the parts are not damaged during the forming process. (Check for cracks on the lead surface or damages on the part’s body caused by mechanical stress).

36

37Check that the clinching operation does not damage the concerned part or the PCB.

Check if the distances between adjacent conductors are sufficient for good insulation.

I-7

34

35Check that some securing has been provided for the large parts and the parts with a high center of gravity.

Mounting direction of parts

1I-2

Mechanical securing of parts

Location of heat generating parts

2

3

38

39

41

43

I - 1 Circuit board design

9

7

6

Clearance provided for heat radiation

4 Distance between lead and adjacent conductor

Pattern width

I - 1 - 1 Circuit board design < Common >

Check the mounting conditions of the parts that may move and enter in contact with other parts or structure.

Page

I-10

I-12

I-3

I-4

I-5

I-6

33

40I-9

© RENAULT 2008 7


N° Item Points to check Fig. Status CommentsCheck that the insulation between components leads and adjacent VIA holes or empty plated through holes ismaintained even if soldering rises up the hole.

(1)

Check that the insulation between metal casing components (tuner, etc...) and empty plated through holes or VIA holes is provided. (A rise of soldering through the holes should be taken into account).

(2)

13 Via hole Check that the solder resist and the coating application in the VIA holes is appropriate.

I-14 45

14 Parts likely to hinder the rising of soldering in the plated through hole

Check that a vent passage is provided under the through hole components that may seal completely the upper side of the plated through hole. (soldering would thus not be able to rise up the hole.)

I-15 46

Check that measures for insulation are taken.

ALL

Check that measures to prevent disconnection are taken.

ALL

Check that sufficient clearance is provided.

ALL

Check that measures to prevent jamming when assembling are provided

no fig

Check that there is no interference with adjacent parts when cables are moved.

(5)

(1)

(2)

17 Diameter of the cable

Check that the diameter and the length of the cable are adequate.

I-18 49

18 Prevention of core cable core wire dispersion

Check if the core wires are joined to the terminals while being dispersed. I-19 50

Confirm that the plating thickness of the via hale is appropriate.Confirm that the roughness of the inner wall of the via hole is appropriate.

Page

Condition of Cu plating on the inner wall of the via hole

47

48Check that the length of the cables and the securing method of the cables are adequate

19

Cable layout

I - 1 - 1 Circuit board design < Common >

Securing cable


15

12 Layout of via hole

16

I-20 51

I-17

I-13

I-16

44

© RENAULT 2008 8


N° Item Points to check Fig. Status CommentsCheck the minimum pattern width.Check the minimum pattern spacing.Check the pattern design.

2 Distance between the pattern and the edge of the circuit board

Check the distance between the edge of the circuit board and the pattern. I-22 53

3 Distance between the connection points

Check the distance between the connection points of different conductors.

I-23 54

4 Location of the connection points

Check the relative position of the connection points between different layers.

I-24 55

5 Location of the connection points

Check the direction of the pattern where the connection points are located.

I-25 56

6 Connection between the pads and the wires

Check the connection between the pads and the pattern. I-26 57

Check the overlap between the pattern of the upper layer and the pattern of the lower layer.

(1)

Check the distance between the edge of the connection point and the overlap of pattern.

(2)

Check the minimum value of the overlap of pattern between upper and lower layers.

(1)

Check the minimum distance between the edge of the pattern on the bottom layer and the edge of the insulation glass.

(2)

Check the minimum distance between the edge of the insulation glass and the connection point.

(3)

9 Connection points between different layers

Check the design measures that are available when a multi-layer pattern lay very close to another pattern.

I-29 60

Check the distance between the die bond pads and the W/B pads.

(1)

Check the distance between adjacent W/B pads.

(2)

Check the width of the W/B pads. (3)Check the length of the W/B pads. (4)Check the overlap between the W/B pads and the wiring.

(5)

11 Distance between the part land and the board edge

Check the distance between the part lands and the edge of the circuit board.

I-31 62

12 Part land and pattern

Check the distances between the parts lands and the neighboring pattern.

I-32 63

13 Distance between lands

Check the distance between the parts lands.

I-33 64

14 Distance between the thick film resistances and the insulation glass

Check the distance between the insulation glass and the thick film resistances. I-34 65

52

7

61

58

59

10 Dimensions of the wire bonding pad

8

Connection points dimension

Cross over pattern dimensions

I-27

I-28

I-30

I - 1 Circuit board design I - 1 - 2 Ceramics board

1 Pattern width and intervals

Page

I-21

© RENAULT 2008 9

RENAULT 36 - 00 - 012 / - - CI Circuit board design check itemsI - 1 Circuit board design

N° Item Points to check Fig. Status CommentsCheck the length of the resistance. (1)Check the width of the resistance. (2)Check the overlap of the thick film resistance and the pattern.

(3)

Check the distance between the resistance and adjacent pattern.

(4)

Check the distance from the overlap between the thick film resistance and the pattern, to the edge of the pattern.

(5)

Check the width of the pattern that overlaps the thick film resistance.

(6)

16 Location of the thick film resistances

Check the location of the thick film resistances I-36 67

Check the range of the overglass

Check the distance between the edge of the overglass and the pattern.

(1)

Check the distance between the overglass and the edge of the circuit board.

(2)

Check the distance between pads and the edge of the overglass.

(3)

Check the distance between the edge of the resistance and the edge of the overglass.

(4)

18 Overglass and insulation glass

Check the relative positions of the overglass and the insulation glass

I-38 69

Check the distance between the edge of the circuit board and the hole ( A)Check the hole intervals (B)

Check the diameter (C)

Check the diameter of the VIA hole. (1)Check the diameter of the VIA hole (When inserting lead). (1)

Check the diameter of the VIA hole land.

(2)

Check the connection between the VIA hole and the pattern.

(3)

21 VIA holes and parts lands

Check the relative position of VIA holes and parts lands.

I-41 72

22 VIA hole and test pad

Check the location of the test pads for continuity test

I-42 73

23 VIA hole and pattern

Check the distance between VIA holes and adjacent pattern.

I-43 74

24 Flaws, cracks, chipping or disconnection

Check for flaws, cracks, chipping or discoloration I-44 75

25 Camber Check the camber of the ceramic board.

I-45 76

Check for cracks

Check that the resistor material is removed completely.Check the starting position of the trimming

27 Alignment Check the contact area of the thick film resistance and the pattern. I-47 78

28 Trimming margin Check the trimming margin I-48 79Check for chippings

Check for pinholes

30 Extrusion of resistor Check for extrusions of resistor I-50 8131 Impurities, blistering

and foamingCheck for impurities, blistering or foaming

I-51 82

32 Insulation resistance

Check the insulation resistanceI-52 83

80

68

19 Location of the VIA holes

70

Shape of the VIA holes

71

77

17

15 Dimensions of the thick film resistance

66

26 Trimming status

29 Chipping and pinhole

Dimensions of the overglass

20

I - 1 - 2 Ceramics board

I-46

I-49

Page

I-35

I-37

I-39

I-40

© RENAULT 2008 10

RENAULT 36 - 00 - 012 / - - CI Circuit board design check itemsI - 1 Circuit board design

N° Item Points to check Fig. Status Comments33 Protrusions or

recessesCheck for protrusions or recesses I-53 84

34 Flaws and test probe traces (1)

Check for flaws and traces of the test probes.

I-54 85

35 Flaws and test probes traces (2)

Check for flaws and traces of the test probes.

I-55 86

36 Flaws and probe inspection (3)

Check for flaws and traces of the test probes

I-56 87

37 Flaws and probe inspection (4)

Check for flaws and traces of the test probes

I-57 88

38 Extrusion Check for extrusion of pattern. I-58 8939 Void Check for voids I-59 9040 Corrosion, foaming

or blisteringCheck for corrosion or defective adhesion I-60 91

I - 1 - 2 Ceramics boardPage

© RENAULT 2008 11


N° Item Points to check Fig. Status CommentsCheck if there are any corners in the pattern. (1)

Check that the lands and the VIA holes are designed to avoid any concentration of stress.

(2)

(1)(2)(1)(2)(3)(4)

(5)

3

94

Check that the pattern is designed to avoid stress concentration.

Pattern layout

I - 1 Circuit board design I - 1 - 3 Flexible Printed Circuit

92

Shape of the pattern

1

93Check that the parts lands are designed to avoid peeling.

Shape of the solder resist

2

I-61

I-62

I-63

Page

© RENAULT 2008 12


N° Item Points to check Fig. Status CommentsConfirm that sufficient spacing between the interior surface of the Viahole and the silver paste edge is provided.Confirm that sufficient spacing between the silver paste and the adjacent copper foil traces is provided.

2 Overcoat shape Confirm that the overcoat is formed properly.

I-65 96

3 SMD Check if there is no via hole under the surface mounted devices. I-66 97


1 Spacing between traces

95

I - 1 - 4 Ag-TH circuit board

I-64

Page

© RENAULT 2008 13


N° Item Points to check Fig. Status Comments1 Overcoat width Check that the overcoat fully covers

the conductive paste.I-67 98

2 Undercoat width Check that the overlapping width of the undercoat and conductive paste issufficient.

I-68 99

3 Configuration of insulation layer

Check that the conductive layer is not easily cut or easily thinned by the surface height difference.

I-69 100

4 Insulation layer structure of connecting land

Check that the conductive layer is not easily cut or easily thinned by the surface height difference.

I-70 101

Check that the jumper width is adequate.Check that the clearance between jumpers is adequate.Check that the thickness of the conductive paste is sufficient.Check that the connection of the Cu and paste is satisfactory.Check that the specified base material is adequate.


103

5 Conductor width and clearance between conductors (LINE/SPACE)

102

6 Paste thickness

I-71

I-72

7I-73

I - 1 - 5 Paste jumperPage

Applicable circuit Check that the use of the conductive paste jumper is adequate. 104

© RENAULT 2008 14


N° Item Points to check Fig. Status Comments

2 Parts to be mounted

Check that the proper size is used for the surface mounted chip resistor of the metallic core circuit board.

I-75 106

I - 1 - 6 Metallic core circuit boardI - 1 Circuit board design

1 Circuit board through hole, via hole

Check that there is no problem with the condition of the filling resin between the through hole and the metallic core of the metallic core circuit board and material selection.

105I-74

Page

© RENAULT 2008 15


N° Item Points to check Fig. Status Comments1 Circuit configuration

based on circuit board

Check that the circuit configuration at the base metal area of the metal circuit board can avoid any migration of the insulation layer.

I-76 107

I - 1 - 7 Metal circuit boardI - 1 Circuit board design

2 Insulation performance of metal circuit board

There shall be no decrease or deterioration in the insulation performance before and after part mounting.

108I-77

Page

© RENAULT 2008 16

RENAULT 36 - 00 - 012 / - - CI Circuit board design check itemsI - 2 Casing design

N° Item Points to check Fig. Status Comments(1)(2)(3)(4)(5)

(1)

(2)

(3)

Check that measures to prevent loosening of the screws have been taken.

(1)

Check that the clearances between the end of the circuit board and the internal surface of the holes are sufficient.

(2)

(1)

(2)

(3)

5 Prevention of drosses when screws are tightened.

Check that the holes into aluminium base materials are all passing through holes.

I-82 113

(1)

(2)

Check if the relative position of the case opening and the end of the connector is adequate.Check that the attaching and detaching operations are not too stressful for the connector (PCB side) and its solder joints.

(1)

Check that the circuit board is not damaged when attaching and detaching the connector (vertical type).

(2)

8 Sealing of the case Check that the generation of dew inside the casing has been taken into consideration for the design of the case.

I-85 116

9 Case opening Check that static electricity from the circuit board is discharged into the opening of the case.

I-86 117

10 PCB support arrangement

Check if the PCB is surely secured in the casing. I-87 118

2

I-83

I-84

I - 2 - 1 Casing design < Common >

3 Fastening of parts – strength

6

7 Position of the case and the connectors

4

1

I-78

115

112

Check that the fastening method is appropriate.

Fastening of parts – electrical connection

Check that the mounting design of the connectors is taking into account the ECU’s mounting conditions aboard the vehicle.

Direction of the connectors

114

Page

110

Check that the specified clearance is provided.

I-81

111

I-79

I-80

Interferences between parts

Check that the specified clearance is provided.

Part clearance - short- circuiting

109

© RENAULT 2008 17

RENAULT 36 - 00 - 012 / - - CII Product confirmation check itemsII - 1 Electrical connection Fig.


TO BE COMPLETED

II - 1 - 1 Electrical connection < Common > Page

© RENAULT 2008 18

RENAULT 36 - 00 - 012 / - - CII Product confirmation check itemsII - 1 Electrical connection

N° Item Points to check Fig. Status Comments(1)(2)(3)(4)(5)(6)(7)(8)(1)(2)(3)(4)(5)(6)(7)(1)(2)(3)(4)(5)(1)(2)(3)(4)(1)(2)(3)(4)(1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)

7 Shape of the solder fillet (empty through holes)

Check that the wetting of the solder is adequate. II-8 126

8 Solder ball Check that the materials, the process settings and the facilities (printing shape and the amount of soldering) make it hard to produce solder balls.

II-9 127

Check that the insulation characteristics are not affected by residual flux.

(1)

Check that the residual flux cannot be responsible of short contact failure between the contact patterns.

(2)

9 Insulation resistance

128

II - 1 - 2 Soldering - Common

120

Check that the solder joint’s shape is adequate.

Shape of the solder fillet (plated through hole)

1

121


Shape of the solder fillet (non plated through hole)

2

125

124

123

122


Shape of the solder fillet (chip parts)

3



Shape of the solder fillet (gull wing lead)

4

Shape of the solder fillet (cable and lead parts)

6


Shape of the solder fillet (J shape lead)

5

II-6

II-7

II-10

Page

II-2

II-3

II-4

II-5

© RENAULT 2008 19


N° Item Points to check Fig. Status Comments1 Fillet lifting Check for fillet lifting. II-11 129

Check for land lifting. (1)Check for damages on the pattern due to land lifting. (2)

3 Separation of the lead terminal

Check that the lead terminal does not separate.

II-13 131

4 Shrinkage cavity Check that there is no cavity. II-14 1325 Separation of the

SMD terminalCheck that the SMD terminals do not separate from the solder joint..

II-15 133

6 Separation of the SMD land

Check that the SMD land do not separate from the solder joint.

II-16 134

7 Separation of the SMD fillet

Check if a local remelting of the solder joints during the flow process occurs.

II-17 135

8 Separation of the BGA ball

Check if a local remelting of the BGA ball’s solder joints during the flow process occurs.

II-18 136

Check for any delamination of the through hole (separation between the plating and the epoxy resin).

(1)

Check that there is no damage on the pattern of the inner layer and its connection with the plating.

(2)

10 Copper erosion Check for any wane of copper (lands, plated through hole, via hole) due to erosion.

II-20 138

11 Whiskers Check that no whiskers have formed (thin areas of parts plating and solder fillet).

II-21 139

12 Decrease in solder strength

Check that there is no decrease in thejoint strength.

II-22 140

13 Solder deformation Check that there is no solder deformation. II-23 141

II - 1 - 3 Soldering - Lead free

9 Plated through hole damages

137

2 Land lifting130II-12

II-19

Page

© RENAULT 2008 20


N° Item Points to check Fig. Status Comments1 Press fitting

process II-24 142

(1)(2)(3)(4)

(1)

(2)

(1)(2)(3)(4)

(1)

(2)

(1)

(2)

Check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.Check that the accuracy of the pin location is adequate.There should be no buckling of the pin and no stress or deformation of the resin or land due to inclined insertion.

8 Extension of the pattern

Check that some measures have been taken to avoid stress on the pattern due to press fitting.

II-31 149

Check that the materials used for the pin and the plated through hole are adequate.

(1)

Check that the finish tolerances of the plated through hole and the tolerances for the outside diameter of the pin are adequate.

(2)

Check that the materials used for the pins and the plated through holes are adequate.

(1)

(2)

(3)

(4)Check that the materials used for the pin and through hole are adequate.


7 Inclined press fitted pins

148

II - 1 - 4 Press fitting

145

Check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate..

Plated through hole damages

4

3 Resin damages

9 Electrical characteristics of press-fitting (connection resistance)

150

151Check that the finish tolerances of the plated through hole and the tolerances for the outside diameter of the pin are adequate.

Mechanical strength characteristics of press-fitting (insertion force, initial retention force)

Check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

144

143

Check that the shape and the dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

II-25

II-26

Land damages2

6 Peeling of the surface of the PTH or pin

Inner layer pattern damages

5


147

146


10

152

Characteristics of mechanical press-fitting strength

11

12 Damage of adjacent solder mounted parts 153

Check that the solder mounted parts are arranged with enough clearance to avoid damage due to the press-fitting stress.

Page

II-32

II-33

II-34

II-35

II-27

II-28

II-29

II-30

© RENAULT 2008 21



Check that the materials used for the pin and through hole are adequate.


14 Mechanical strength characteristics of press-fitting (durability retention force)

155

II - 1 - 4 Press fitting

13 Electrical characteristics of press-fitting (connection resistance)

154

Check that the shape and the dimensions of the press fitting pin and the finish diameter of the through hole are adequate.

II-36

Page

II-37

© RENAULT 2008 22


N° Item Points to check Fig. Status CommentsCheck the surface of the chip. (1)Check the silver paste extrusions around the chip. (2)

Check the adherence of the silver paste on any other metal film.

2 Uncured silver paste status

Check the shape of the uncured silver paste.

II-39 157

Check the dimensions of the soldered areaCheck for voids in the contacting surface

4 Die shear strength Measure the die shear strength II-41 1595 Inclination of the

chipCheck the inclination of the chip II-42 160

6 Deviation of the chip

Check the deviation between the chip and the die pad. II-43 161

II - 1 - 5 Die bonding

3 Void

158

1 Status of silver paste

156II-38

II-40

Page

© RENAULT 2008 23


N° Item Points to check Fig. Status CommentsCheck the diameter of the ball bond (1)Check the location where the wire is rising from the all. (2)

Check the deviation of the ball bond from the bonding pad.

(1)

Check the intermetallic compounds. (2)Check the bond width W. (1)Check the bond length L. (2)Check the trace of the bonding tool. (3)

4 Location of pad and bonding (2)

Check the deviation of the bond. II-47 165

Check the bond width. (1)Check the bond length. (2)Check the deviation of the bond. (1)Check the wire tail. (2)Check the shape of the wire loop. (1)Check the height of the wire loop. (2)Check for damages on the wire. (1,2)Check the course of the wires.

9 Tensile strength Measure the tensile strength of the wires.

II-52 170

(1)(2)(3)(4)

(5)

Position of the pad and the bond (3) 167

7 Wire shape (1)168

II-49

II-50

II - 1 - 6 Wire bonding

8 Wire shape (2)

2 Position of the pad and the bond (1)

5 Bond shape (3)

1 Bond shape (1)

6

Check the rupture mode.Rupture mode10

162

163

3 Bond shape (2)

164

II-44

II-45

II-51

II-53

Page

171

II-46

169

166II-48

© RENAULT 2008 24


N° Item Points to check Fig. Status CommentsCheck that the contact angle (wetness) between the material of the electrodes, the filler and the base adhesive material (resin) are adequate.Check that the electrodes and the conductive adhesive are adequate.

1 State of the joint between electrode and conductive adhesive 172

II - 1 - 7 Conductive adhesive

II-54

Page

© RENAULT 2008 25


N° Item Points to check Fig. Status Comments1 BGA chip mounting

process II-55 173

Check that the melting of the BGA balls and the solder paste are sufficient.

(1)

Check that no strong residual stress remains for the package and the BGA balls.

(2)

(1)(2)(3)(4)(5)(6)(7)(8)

(1)

(2)5 Extension of pattern

from landCheck that materials, process settings and facilities likely to reduce solder balls are provided.

II-59 177

6 Extension of pattern from land

Check that the extension pattern design is not easy to disconnect.

II-60 178

Underfill is mandatory for BGAs to ensure reliability.Check that material selection for the underfill is adequate.

II - 1 - 8 BGA, CSP

2 Melting condition of the BGA balls

174II-56

Page

3

176Check for any design which may affect reliability or likely to cause cracks.

Package side connection design

4

175

Check if there is any design of the land or mounting that is likely to cause distortion, deformation or cracking on the BGA ball, and deteriorate the reliability.

Shape of the solder balls

II-57

II-58

7 Underfill

179

180

Check the conditions of the filling of the underfill.

Filling condition of the underfill

8

II-61

II-62

© RENAULT 2008 26


N° Item Points to check Fig. Status CommentsII - 1 - 9 Weld

Page

© RENAULT 2008 27

RENAULT 36 - 00 - 012 / - - CII Product confirmation check itemsII - 2 ASSEMBLY


Check if the structure is designed so that the Ag electrode is not exposed.Confirm that the exposed Ag electrode is protected by circuit board Confirm that the overcoat glass prevents the Ag electrode from being exposed.Check if there are materials that emit sulfurous gas near the ECU in the same closed space.

II - 2 - 1 Assembly < common >

1 Corrosion on Ag electrode by sulfurated gas

181

- Regardless of the check results, conduct the corrosive gas resistance test (28401NDS01, 36-00-012 CH12) to prove that no sign of corrosion is identified.- If sign of corrosion is identified, estimate remaining longevity to determine through individualconsultation.- Regarding 25% of the initial coating thickness as longevity, determine remaining longevity inreference to the corrosion rate at 0.5 µm/year.- The 4th check point shall be verified subject to gas emission from an actual device.

II-63

Page

© RENAULT 2008 28


N° Item Points to check Fig. Status Comments1 Defective

conductivity of contact

Check that the type of adhesive, sealant, sealing agent and grease are adequate.

II-64 182

Check that the potting of the solder joints is adequate.Check that the material for potting is appropriate.Check that the material characteristics are according to the design.Check that coating material that has intruded into the space between the part and circuit board does not apply stress to the soldered joints.

II - 2 - 2 Resin, Coating, Potting

3 Coating material that has intruded under the bottom of parts 184

183

Potting using hard resin

2

II-65

II-66

Page

© RENAULT 2008 29


N° Item Points to check Fig. Status CommentsII - 2 - 3 Other

Page

© RENAULT 2008 30

RENAULT 36 - 00 - 012 / - - C


5. DETAILED CHECK ITEMS

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 1 (32)

< I >

Circuit board mounting DESIGN check items

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 1

Items Circuit board design

< Common > Items to check Mounting direction of parts

Concerned parts All parts (1)

(2)

(3)

Cases that are not concerned by this specification

Points to check Conformity status Alternate if not reachable

! Check the mounting conditions of the parts that may move and enter in contact with other parts or structure.

" There should be no contact possible in the concerned parts movement free area.

# If it is not possible to change the mounting direction because of the layout, enough clearance or insulation material should be provided so no short circuit could occur even if the part’s body falls down.

Interference

Short-circuits because of contact between parts leads.

NOK

NOK

Parts not able to move

Parts with hard leads

Parts glued with adhesive

Adhesive

OK NOK

OK

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 2


< Common > Items to check Location of heat generating parts

Concerned parts Heat generating parts (1)

1.0 Ω 2.2 µF

⋅ Example of heat generating elements: Shunt resistances, Power transistors, power source ICs, etc…

(2)

(3)

Example of heating elements : shunt resistor, power transitor, power source IC, bulbs, etc.


! Check if there are any low heat resistant

elements such as an electrolytic capacitor

near the heating elements. (1)

" Enough clearance shall be provided,

taking into account the heat source

temperature, the heat resistant

temperature of adjacent parts and the

heat conduction rate of pattern. (1)

! Confirm that the heat resistance of the case,

circuit board, etc. is sufficient. (2)

" There shall be no breakage due to heat.

(2)

# There should be no functional failure after

the durability test.

! If there are any heat generating

parts/elements, confirm that adjacent heat

generating parts/elements are extracted.

! Check if heat conduction and radiation heat

from the extracted parts/elements besides

self-heating dose not impair the function. (3)

" There shall be no breakage of the part's

body and the joints due to heat. (3)

# There shall be no functional failures after

the durability test. (Verification shall be

performed under which temperature rise is

the most significant.)

Heat Radiation

Temperature increase

Heat generating

element (Tr, etc)

Plastic case

Heat generation

Heat generation

Heat Radiation

NOK

NOK

NOK

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 3


< Common >

Items to check Mechanical securing of parts

Concerned parts Large parts

(1)

Block condenser with claw seat

Claw Securing

Crack X'tal

(2)

* If the reinforcement on the left could not be applied, a plated through-hole should be used (if a single side PCB is not enough)


! Check that some securing has been provided for the large parts and the parts with a high center of gravity.

" Securing or reinforcing material should be provided.

# There should be no functional failure and no damage on both lead and soldering after vibration resistance test.

Ex : Si potting

Ex : Si potting PCB

OK

OK NOK

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 4


< Common >

Items to check Distance between lead and adjacent conductor

Concerned parts Through hole components

Clinched leads may be too close

Watch for shorts

Clinched lead to clinched lead

a

Clinched lead to pattern Lead to Pattern

a a

a


! Check if the distances between adjacent conductors are sufficient for good insulation.

" The clearance between conductors with different voltage should be:

a > 1.0 mm

" The clearance between conductors with equal voltage should be :

a > 0.5 mm.

# Insulation test, high temperature and high humidity bias test should be performed to check if there is any functional failure possible due to poor insulation resistance or electromigration.

(1)

(2) (3)

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 5


< Common >

Items to check Clinching


(1)

Cracks appear because of the clinching operation stress → Silicone gas may enter the case, adhere the contact pins insidethe relay and cause defects.

LeadCase

Sealing resin

Crack

(2)

Deformation of the circuit board

D

PCB

Damages on the part (cracks)

D

No clinching


" There should be no damage on the base of the leads or the molding. (1)

! Check that the clinching operation does not damage the concerned part or the PCB.

" There should be no deformation of the PCB and no damage of the pattern. (2)

# It is acceptable to use a top hat for flow soldering instead of clinching.

If a thick or hard lead part is used, the PCB may be deformed because of the clinching.

NOK

NOK OK

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 6


< Common >

Items to check Leads forming shape

Concerned parts Through hole components (1)

Cracks on the molding

b

R

(2)

b R

(3)

Cracks

Suppression of the stresses due to the materials heat expansion with the use of a formed lead


! Check that the leads forming shape is adequate so the parts are not damaged during the forming process. (Check for cracks on the lead surface or damages on the part’s body caused by mechanical stress). (1,2)

Lead diameter

0.8 mm or less

0.8 - 1.2 mm 1.2 mm or more

Bending radius

0.8 mm or more

1.5 times or more of lead diameter

2.0 times or more of lead diameter

Bending point b

The bending point should be at least 0.8 mm away from the base of the part and away by at least 2 times the lead diameter.

! Check that the forming leads can absorb the stresses due to the materials heat expansion. (3)

" Measures should be taken to increase the resistance against the stresses due to the materials heat expansion.

# Check if there is any deterioration of the electrical characteristics after the durability tests (thermal cycle and power cycle)

NOK NOK

NOK OK

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 7


< Common >

Items to check Clearance provided for heat radiation

Concerned parts Heat radiation plate

PCB

No measures to prevent screws from loosening No measures to prevent rotation of the heat sink

Power transistor Screw Insulation board

Heat sink

Stopper Locking paint

(3) (4)

Open circuits due to the repetitive application of mechanical stress on the solder joints (because of the materials expansion variation due to heating and cooling cycles)

Cracks

Relay

Cracks

Void

Power transistor

Soldering


! Check if the heat generating elements (power tr, etc...) and the heat radiation plate are secured properly (1). (Ensure the heat radiation requirements are met)

" Measures to prevent screws, rivets, clips, etc. from loosening should be taken.

" Measures to prevent rotation of the parts should be taken.

! Check if a heat radiation plate is provided for the heat generating elements. (2)

" Heat should not deteriorate the electrical characteristics of the concerned parts.

! Check if the heat generation has any effect on the solder joints. (3)

" Expansion variations of the materials should not deteriorate the reliability of the solder joints.

! Check that the length of the heat radiation passage is sufficient. (4)

" Heat should not deteriorate the electrical characteristics of the concerned parts.

Too short Too short

(1) (2) NOK

NOK OK

OK

RENAULT 36 - 00 - 012 / - - C


Check No. I – 1 – 1 8


< Common >

Items to check Pattern width

Concerned parts PCB pattern (1) (2)

Width of the copper pattern Th

ickn

ess

of th

e co

pper

patte

rn

Substrate

Cross-sectional area o f conductor


Check if the design is adequate, and that sufficient current load capacity is ensured.

! Check that the width and thickness of the copper pattern is adequate. (1)

! Check if the diameter and the amount of via holes is adequate. (2)

" The current load capacity of the copper pattern and the vias holes should exceed the maximum specified current.

See below.

Cross-sectional surface of the copper

0.64 3.23

6.45 12.90

19.35 32.26

161.29193.55

258.06 45.1664.51

96.77129.03 322.58

387.10451.61

mil2

×10-3

mm2

Cur

rent

(A)

Increase in temperature

Relationship between the cross sectional area of the conductor

and the allowable current capacity (External layer)

Cross-sectional surface of the copper foil

0.643.23

6.4512.90

19.3532.26

161.29193.55

258.06 45.1664.51

96.77129.03 322.58

387.10451.61

mil2

×10-3

mm2

Cur

rent

(A)

Increase in temperature

Relationship between the cross sectional area of the conductor and the allowable current capacity (Internal layer)

Note) Above values are applicable for copper plated circuit board and flexible printed circuits.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 10 (41)

Check No. I – 1 – 1 9


< Common >

Items to check Distance between patterns

Concerned parts PCB pattern

(1)

A A’

A A’

⋅ Measure the shortest distance.

Cross section

(2)

Land

Plated through hole

Line


! Check that the distance between conductive lines is sufficient to ensure insulation. (1)

! Check that the distance between lands and circuit patterns is adequate for insulation resistance. (2)

" Check that the required insulation resistance is provided between conductors.

" The minimum distance as shown below should be maintained depending on the voltage.

# Perform durability (humid resistance) test to check if there is any functional failure due to poor insulation resistance and electromigration.

Minimum conductor to conductor distance DC or AC peak

voltage Minimum distance between parts leads, lands or external conductive pattern (With coating)

Minimum distance between parts leads, lands or external conductive pattern (Without coating)

0-15 0.13 mm 0.13 mm 16-30 0.13 mm 0.25 mm 31-50 0.13 mm 0.4 mm 51-100 0.13 mm 0.5 mm 101-150 0.4 mm 0.8 mm 151-170 0.4 mm 0.8 mm 171-250 0.4 mm 0.8 mm 251-300 0.4 mm 0.8 mm 301-500 0.8 mm 1.5 mm > 500 (V-500)(V) × 0.00305 (mm/V) + 0.8 (mm) (V-500)(V) × 0.00305(mm/V) + 1.5(mm) Note) Above values are applicable for copper plated circuit board and flexible printed circuits.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 11 (42)

Check No. I – 1 – 1 10


< Common > Items to check Location of test pad

Concerned parts Test pad

Branched off from pattern Not branched off from the pattern

Not soldered Soldered


! Check that the layout of the test pads is adequate.

" The test pads should be branched off from the pattern or soldered.

# Check the corrosion resistance of the pattern if the lands are located on the pattern and not soldered.

NOK OK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 12 (43)

Check No. I – 1 – 1 11


< Common >

Items to check Distance from the pattern to the edge of the PCB

Concerned parts Edge of the PCB (1)

a

Pattern

Excessive section

b

Ground Pattern

(2)

Via hole or plated through hole

Edge of the PCB a a

Land


! Check that measures to prevent damages on the pattern are provided during the singulation operation.

" a > 1.25 mm for internal and surface pattern. (1) b > 0.3 mm for ground internal and surface pattern. (1)

" There should be no damage to the pattern when a circuit board is divided. (2)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 13 (44)

Check No. I – 1 – 1 12


< Common >

Items to check Layout of via hole

Concerned parts Via holes

(1) (2)

Short circuit

Via holes

Via hole filled with soldering


! Check that the insulation between components leads and adjacent VIA holes or empty plated through holes is maintained even if soldering rises up the hole. (1)

! Check that the insulation between metal casing components (tuner, etc...) and empty plated through holes or VIA holes is provided. (2) (A rise of soldering through the holes should be taken into account)

" Necessary insulation should be provided between the VIA holes and the adjacent conductors.

# Insulation should be ensured by inserting an insulation sheet or providing resist, etc… to prevent the rising of soldering

Metal casing (GND)

Via holes

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 14 (45)

Check No. I – 1 – 1 13


< Common >

Items to check Via hole

Concerned parts Via holes

The holes is open only on one side of the board

Land Solder resist

Circuit board

Resist Land


! Check that the solder resist and the coating application in the VIA holes is appropriate.

" A structure that prevents accumulation of corrosive solution in the VIA holes should be provided.

NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 15 (46)

Check No. I – 1 – 1 14


< Common >

Items to check Parts likely to hinder the rising of soldering in the plated through hole



! Check that a vent passage is provided under the through hole components that may seal completely the upper side of the plated through hole. (soldering would thus not be able to rise up the hole.)

" A vent passage under the component should be provided.

# The solder joint’s durability should be determined by thermal cycling test, using a part with an worst case elevation of soldering.

Land pattern on the bottom of PCB

PCB Stick on to PCB

Part Vent

Part NOK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 16 (47)

Check No. I – 1 – 1 15


< Common >

Items to check Cable layout

Concerned parts Inside case cables

Metal case There are interferences between the cable and the case when the case moves

Circuit board

Case

Circuit board


! Check that measures for insulation are taken.

! Check that measures to prevent disconnection are taken.

! Check that sufficient clearance is provided.

! Check that measures to prevent jamming when assembling are provided

" The layout of the cable should be appropriate.

" The cables should be fixed in order to prevent any interference.

! Check that there is no interference with adjacent parts when cables are moved.

" There should be no interference.

# Protections should be provided when there are interferences.

Tensile force

Lead

Circuit board

Contact

Shrinks

Soldering iron Coating is softened by heat Soldering

(1) (2)

(4) (3)

(5)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 17 (48)

Check No. I – 1 – 1 16


< Common >

Items to check Securing cable


(1)

(2)

Clamp cable Secured by applying adhesive

(Note) Check if there is any damage caused by the clamp (ex: if excessively tightened, the cable resistor may break and the conductor wires get exposed to contacts with case, parts electrodes, circuit board pattern, etc…, and make short circuits)


! Check that the length of the cables and the securing method of the cables are adequate.

" Measures should be taken so that the cable or the soldered area could not be disconnected.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 18 (49)

Check No. I – 1 – 1 17


< Common >

Items to check Diameter of the cable


Length

Diameter


! Check that the diameter and the length of the cable are adequate.

" Wire diameter and length shall be appropriate considering current and impedance.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 19 (50)

Check No. I – 1 – 1 18


< Common >

Items to check Prevention of core cable core wire dispersion

Concerned parts Cables inside the case and connector

芯線の分散防止処理芯線の分散防止処理

ケーブル

芯線金属端子

超音波溶着接合

ケーブル

芯線金属端子

超音波溶着接合Ultrasonic welding

Cable

Core wire Metal terminal

Prevention of core wire dispersion

The prevention of core wire dispersion shall be processed before joining to the metal terminals.

If core wires are left dispersed, sufficient welding will not be provided, which results in poor contact due to separation.

Points to check Conformity status Index for individual consultation

! Check if the core wires are joined to the terminals while being dispersed.

" When welding the core wires and metal terminals, prevention of core wire dispersion shall be processed.

When joining the metal terminals and the core wires by ultrasonic welding or resistance welding, study the required strength (tensile strength, detaching strength, etc.) and the requirements shall be met.

NOK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 20 (51)

Check No. I – 1 – 1 19


< Common >

Items to check Condition of Cu plating on the inner wall of the via hole

Concerned parts Via hole other than that for mounting the part

Circuit board

(1) Cu plating thickness does not meet the standard.

(2) Thickness of the via hole inner wall is not even.

Barrel crack occurs due to temperature stress, which results in disconnection of the signal. The main cause for this concern is production quality of the circuit board; however, the objective is to identify this concern at an early stage by reviewing the design requirements.

(1)

(2)

Points to check Conformity status Index for individual consultation

! Confirm that the plating thickness of the via hole is appropriate.

" Plating thickness: 15 µm or more.

! Confirm that the roughness of the inner wall of the via hole is appropriate.

" Roughness: The difference in inner wall thickness between the top and bottom of an area adjacent each other shall not exceed the plating thickness.

Perform the cross-sectional analysis using a circuit board equivalent to the mass production part after the thermal cycle test, and confirm that there is no harmful cracking.

Shall be 15 µm or more.

The difference in inner wall thickness between the top and bottom of the through hole shall not exceed plating thickness.

NOK

OK

Difference in inner wall thickness between the top and bottom of an area adjacent each other ≤ plating thickness Plating thickness ≥ 15 µm

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 21 (52)

Check No. I – 1 – 2 1

Items Circuit board design < Ceramics >

Items to check Pattern width and intervals Applicable parts Film conductors Type of circuit board Circuit board design < Ceramics > Printed circuit board Conductor application process Thick film printing Thin film Etching copper foil Items Sintered

circuit board Green tape

Film thickness (µm) 10 ~ 20 10 ~ 20 ~ 1 35 Resistance (mΩ / ) 2 ~ 100 2 ~ 100 100 ~ 1 Minimum conductor width (mm) 0.2 0.1 0.05 0.1 Minimum conductor spacing (mm) 0.2 0.1 0.05 0.1


! Check the minimum pattern width " 0.2 mm or more

! Check the minimum pattern spacing

" 0.2 mm or more

! Check the pattern design. " Pattern should be vertical or parallel to the outer edge of the circuit board. Pattern with an angle of 45° is allowed.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 22 (53)

Check No. I – 1 – 2 2


< Ceramics > Items to check Distance between the pattern and the

edge of the circuit board Applicable parts Pattern located near the edge of the circuit board

0.3 mm or more

Lead pad

0.3 mm or more

Not relevant


! Check the distance between the edge of the circuit board and the pattern

" The distance should be at least 0.3 mm

(excluding lead pad)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 23 (54)

Check No. I – 1 – 2 3


< Ceramics > Items to check Distance between the connection points

Applicable parts Connection points between layers

0.3 mm or more


! Check the distance between the connection points of different conductors.

" The distance should be at least 0.3 mm.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 24 (55)

Check No. I – 1 – 2 4


< Ceramics > Items to check Location of the connection points

Applicable parts Connection points between different layers

NOK OK


! Check the relative position of the connection points between different layers

" When the pattern is going the same direction, try not to put the connection points in an aligned position

NOK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 25 (56)

Check No. I – 1 – 2 5


< Ceramics > Items to check Location of the connection points


NOK OK


! Check the direction of the pattern where the connection points are located.

" The connection points should be located on conductor lines perpendicular or parallel to the main line direction..

NOK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 26 (57)

Check No. I – 1 – 2 6


< Ceramics > Items to check Connection between the pads and the

wires Applicable parts Lead pad, W/B pad and part land

NOK OK OK

OR


! Check the connection between the pads and the pattern.

" Connection between different layers should not be done over a pad.

NOK OK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 27 (58)

Check No. I – 1 – 2 7


< Ceramics > Items to check Connection points dimension


Pattern on the lower layer

(1) 0.3 mm or more Pattern on theupper layer

(1) 0.3 mm or more

(2) 0.1 mm or more

(2) 0.1 mm or more

Open area of the Mask


! Check the overlap between the pattern of the upper layer and the pattern of the lower layer. (1)

" The overlap should be at least 0.3 mm square.

! Check the distance between the edge of the connection point and the overlap of pattern. (2)


RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 28 (59)

Check No. I – 1 – 2 8


< Ceramics > Items to check Cross over pattern dimensions

Applicable parts Cross over pattern

(1) ≥ 0.3 mm (3) ≥ 0.1 mm

(2) ≥ 0.3 mm

(2) ≥ 0.3 mm


! Check the minimum value of the overlap of pattern between upper and lower layers. (1)

" Minimum value should be at least 0.3 mm.

! Check the minimum distance between the edge of the pattern on the bottom layer and the edge of the insulation glass. (2)

" Minimum distance should be at least 0.3 mm.

! Check the minimum distance between the edge of the insulation glass and the connection point. (3)

" Minimum distance should be at least 0.1 mm.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 29 (60)

Check No. I – 1 – 2 9


< Ceramics > Items to check Connection points between different

layers Applicable parts Multi-layer pattern with adjacent pattern

0.2 mm or more

0.5 mm or more


! Check the design measures that are available when a multi-layer pattern lay very close to another pattern.

" A dam to prevent exudation of conductor should be provided.

Dam

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 30 (61)

Check No. I – 1 – 2 10


< Ceramics > Items to check Dimensions of the wire bonding pad

Applicable parts Die bond pads and W/B pads

(1)

Die bond pad

(1) 0.3 or more (3) 0.3 or more

Unit: mm


! Check the distance between the die bond pads and the W/B pads. (1)

" The distance should be between 0.3 mm and 3.0 mm.

! Check the distance between adjacent W/B pads. (2)


! Check the width of the W/B pads. (3)

" The width should be at least 0.3 mm.

! Check the length of the W/B pads. (4)

" The length should be at least 0.4 mm.

! Check the overlap between the W/B pads and the wiring. (5)

" The overlap should be at least 0.3 mm.

W/B pad

Overlap between W/B pad and wiring

(2) 0

.3 o

r mor

e

(5) 0.3 or more(4) 0.4 or more

Wiring

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 31 (62)

Check No. I – 1 – 2 11


< Ceramics > Items to check Distance between the part land and the

board edge Applicable parts Part land


! Check the distance between the part lands and the edge of the circuit board


Edge of the circuit board

SMD

0.5

mm

or

mor

e

0.5 mm or more Edge of the circuit board

Land of SMD part

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 32 (63)

Check No. I – 1 – 2 12


< Ceramics > Items to check Part land and pattern

Applicable parts Part land

a ≥ 0.3 mm a

a

a


! Check the distances between the parts lands and the neighboring pattern.

" The distances should be at least 0.3 mm.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 33 (64)

Check No. I – 1 – 2 13


< Ceramics > Items to check Distance between lands

Applicable parts Part land


! Check the distance between the parts lands


0.5 mm or more

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 34 (65)

Check No. I – 1 – 2 14


< Ceramics > Items to check Distance between the thick film

resistances and the insulation glass Applicable parts Thick film resistances


! Check the distance between the insulation glass and the thick film resistances

" The distance should be at least 0.5 mm

Pattern of the upper layer

Insulation glass

Thic

k fil

m

resi

stan

ce

0.5 mm or more

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 35 (66)

Check No. I – 1 – 2 15


< Ceramics > Items to check Dimensions of the thick film resistance

Applicable parts Thick film resistance


! Check the length of the resistance. (1)

" The length should be at least 0.7 mm.

! Check the width of the resistance. (2)


! Check the overlap of the thick film resistance and the pattern. (3)

" The overlap should be at least 0.2 mm.

! Check the distance between the resistance and adjacent pattern. (4)


! Check the distance from the overlap between the thick film resistance and the pattern, to the edge of the pattern (5)


! Check the width of the pattern that overlaps the thick film resistance. (6)


Thick film resistance

(4) 0.5 mm or more

(2) 0.7 mm or more

(1) 0.7 mm or more

(5) 0.2 mm or more

(3) 0.2 mm or more

(6) 0.3 mm or more

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 36 (67)

Check No. I – 1 – 2 16


< Ceramics > Items to check Location of the thick film resistances

Applicable parts Thick film resistances


! Check the location of the thick film resistances

" The thick film resistances should be perpendicular or parallel to the outer edges

NOK


OK

OK



OK

NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 37 (68)

Check No. I – 1 – 2 17


< Ceramics > Items to check Dimensions of the overglass

Applicable parts Overglass

③④


! Check the range of the overglass " The pattern should be completely covered except the pads and the lands.

! Check the distance between the edge of the overglass and the pattern. (1)


! Check the distance between the overglass and the edge of the circuit board. (2)


! Check the distance between pads and the edge of the overglass. (3)


! Check the distance between the edge of the resistance and the edge of the overglass. (4)


(1) 0.15 mm or more

(2) 0.15 mm or more

(4) 0.15 mm or more (3) 0.2 mm or more


RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 38 (69)

Check No. I – 1 – 2 18


< Ceramics > Items to check Overglass and insulation glass

Applicable parts Overglass and insulation glass


! Check the relative positions of the overglass and the insulation glass

" The overglass should cover the insulation glass completely

Failed: Insulation glass not completely covered by the overglass

Insulation glass

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 39 (70)

Check No. I – 1 – 2 19


< Ceramics > Items to check Location of the VIA holes

Applicable parts VIA hole

Edge of the circuit board

T = Circuit board thickness A ≥ 0.8 × t & A ≥ 0.5 mm B ≥ 0.8 × t & A ≥ 0.5 mm C ≥ 0.4 × t & A ≥ 0.25 mm


! Check the distance between the edge of the circuit board and the hole ( A)

" A ≥ Thickness of the board × 0.8 and A ≥ 0.5 mm

! Check the hole intervals (B) " B ≥ Thickness of the board × 0.8 and B ≥ 0.5 mm

! Check the diameter (C) " C≥Thickness of the board × 0.4 and C ≥ 0.25 mm

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 40 (71)

Check No. I – 1 – 2 20


< Ceramics > Items to check Shape of the VIA holes



! Check the diameter of the VIA hole. (1)

" The diameter of the VIA hole should be between 0.4 mm and 1.0 mm φ

! Check the diameter of the VIA hole (When inserting lead). (1)

" The diameter of the VIA hole should be at least equal to the diameter of the lead + 0.15 mm.

! Check the diameter of the VIA hole land. (2)

" The diameter of the VIA hole land should be at least equal to the hole’s diameter + 0.8 mm.

! Check the connection between the VIA hole and the pattern. (3)

" The connection should be smooth.

(2)

(1)

(1) 0.4 mm to 1.0 mm φ (2) (1) + 0.8 mm or more 0.4 mm or more

(3) The connection to the pattern should be smooth.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 41 (72)

Check No. I – 1 – 2 21


< Ceramics > Items to check VIA holes and parts lands



! Check the relative position of VIA holes and parts lands.

" The VIA holes should not be located on the parts land. Overglass should be coated over the VIA hole.

NOK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 42 (73)

Check No. I – 1 – 2 22


< Ceramics > Items to check VIA hole and test pad



! Check the location of the test pads for continuity test

" The VIA holes should not be used as test pads.

Test pad (0.5 mm )

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 43 (74)

Check No. I – 1 – 2 23


< Ceramics > Items to check VIA hole and pattern



! Check the distance between VIA holes and adjacent pattern.


0.3 mm or more

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 44 (75)

Check No. I – 1 – 2 24


< Ceramics > Items to check Flaws, cracks, chipping or

disconnection Applicable parts Circuit board


! Check for flaws, cracks, chipping or discoloration

" The requirements in the drawing should be met, and there should be no flaw, crack or discoloration that may affect appearance.

" Chipping with a size smaller than 0.25 × 0.25 mm are acceptable.

Chipping OK : a < 0.25 mm

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 45 (76)

Check No. I – 1 – 2 25


< Ceramics > Items to check Camber

Applicable parts Circuit board


! Check the camber of the ceramic board.

" The camber should be less than 0.1 mm per 30 mm.

Circuit board

OK : a < 0.1 mm

The specification is for ceramic boards before mounting of components

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 46 (77)

Check No. I – 1 – 2 26


< Ceramics > Items to check Trimming status



! Check for cracks " Cracks should stop at the edge of the trimming.

! Check that the resistor material is removed completely.

" It is recommended to cut the ceramic board by approximately 5µm. (Cut both the resistor layer and the alumina circuit board)

! Check the starting position of the trimming

" The trimming should start outside of the resistance.

NOK Excessive cracking Cracks are only at the end of cut area of the trim NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 47 (78)

Check No. I – 1 – 2 27


< Ceramics > Items to check Alignment

Applicable parts Overlap between pattern and thick film resistance


! Check the contact area of the thick film resistance and the pattern.

" There should be an overlap of at least 0.2 mm. Entire width of the resistance should be overlapped.

# x ≥ 0 is the reference value used in inspection after sintering. Margin should be provided for design. (Refer to Section II-1-2-15.)


Pattern

x ≥ 0 y ≥ 0.2 mm

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 48 (79)

Check No. I – 1 – 2 28


< Ceramics > Items to check Trimming margin



! Check the trimming margin

" Remaining width of resistor after trimming should be at least 1/3 of the total width.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 49 (80)

Check No. I – 1 – 2 29


< Ceramics > Items to check Chipping and pinhole



! Check for chippings " The chippings exceeding 1/2 of the resistance width are unacceptable.

" Check also if there are any cracks around the chipping.

! Check for pinholes " The pinholes exceeding 1/2 of the resistance width are unacceptable.

" Pinholes longer than 0.5 mm are unacceptable.

" Check also if there are any cracks around the pinhole.

Chipping Pinhole

NOK

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 50 (81)

Check No. I – 1 – 2 30


< Ceramics > Items to check Extrusion of resistor


NOK : W > 1/2 Wo NOK : a ≤ 0.4 mm


! Check for extrusions of resistor

" Extrusions exceeding 1/2 of the resistance width are unacceptable.

" Extrusions coming 0.4mm close to the adjacent pattern are unacceptable.

Pattern

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 51 (82)

Check No. I – 1 – 2 31


< Ceramics > Items to check Impurities, blistering and foaming


NOK : W < 1/2 Wo NOK : L > 0.5 mm


! Check for impurities, blistering or foaming

" Impurities, blistering and foaming that exceed 1/2 of the resistance width are unacceptable.

" Those with a length of 0.5 mm or more are unacceptable.

* Composition and origin of impurities must be studied.

Impurities Blistering and foaming

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 52 (83)

Check No. I – 1 – 2 32


< Ceramics > Items to check Insulation resistance

Applicable parts Insulation glass


! Check the insulation resistance

" The resistance should be at least 109 Ohms at normal temperature and under DC 50V.

Insulation glass

Overglass Pattern

When the insulation resistance lowers below 109, it is relatively relevant of the electric circuit and shows a substantial reduction in its characteristics.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 53 (84)

Check No. I – 1 – 2 33


< Ceramics > Items to check Protrusions or recesses

Applicable parts Lower layer pattern in cross over wiring


! Check for protrusions or recesses " Protrusions or recesses going out from the lower layer through the upper layer are unacceptable.

Protrusions or recesses of the conductive line going out from the lower layer through the upper layer are unacceptable.

Protrusions or recesses of the conductive line not coming out from the lower through the upper layer are acceptable.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 54 (85)

Check No. I – 1 – 2 34


< Ceramics > Items to check Flaws and test probe traces (1)

Applicable parts Upper layer pattern in cross over pattern


! Check for flaws and traces of the test probes.

" Flaws in the conductive line through which the insulation glass is exposed are unacceptable.

Flaws in the pattern through which the insulation glass is exposed are unacceptable.

Insulation glass

Upper layer pattern

Lower layer pattern

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 55 (86)

Check No. I – 1 – 2 35


< Ceramics > Items to check Flaws and test probes traces (2)

Applicable parts All metallic films


! Check for flaws and traces of the test probes.

" Flaws on the metal film that make the ceramic board or the insulation layer appearant by more than 25% of the metallic film width are unacceptable.

OK : x ≥ 3/4 d

NOK : x < 3/4 d

Circuit board

NOK

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 56 (87)

Check No. I – 1 – 2 36


< Ceramics > Items to check Flaws and probe inspection (3)

Applicable parts Multilayer metallic films


! Check for flaws and traces of the test probes

" Flaws on the metal film that make the lower layer metal exposed, as well as those uncovering more than 25% of the metallic film are unacceptable.

Unacceptable : x < 3/4d or x < 25 µm

Acceptable : x ≥ 1/2d and x ≥ 25 µmMetal from the lower layer (multilayer metal

film)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 57 (88)

Check No. I – 1 – 2 37


< Ceramics > Items to check Flaws and probe inspection (4)

Applicable parts Overlap between pad and pattern


! Check for flaws and traces of the test probes

" Flaws on the metal film that make the ceramic board exposed, and uncovering more than 25% of the patterns are unacceptable.

NOK

Exposed ceramic Pattern

Pad Land

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 58 (89)

Check No. I – 1 – 2 38


< Ceramics > Items to check Extrusion

Applicable parts Pattern

L ≤ 1.0 mm W ≤ W/2 and w ≤ 0.5 mm


! Check for extrusion of pattern.

" The width of the extrusion should be less than1/2 of the distance between patterns, or less than 0.5 mm.

" The length of the extrusion should be less than 1.0 mm

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 59 (90)

Check No. I – 1 – 2 39


< Ceramics > Items to check Void



! Check for voids

" The maximum width of the allowed voids is 25% of the pattern.

NOK : x < 3/4 d

OK : x ≥ 3/4 d

Dielectric, metal or ceramic board of the lower layer

Voids refer to a flow of metal film with exposed underneath dielectric, metal or circuit.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 60 (91)

Check No. I – 1 – 2 40


< Ceramics > Items to check Corrosion, foaming or blistering



! Check for corrosion or defective adhesion

" No corrosion, no foaming and no blistering are acceptable.

Foaming and blistering

Corrosion

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 61 (92)

Check No. I – 1 – 3 1

Items Circuit board design < Flexible >

Items to check Shape of the pattern

Applicable parts Lands and pattern

2R

R

The corner of patterns even without a90 degrees angle should also be round

Tear drop shape

The corner of the land should be round VIA hole Land

Points to check Conformity Status Alternate if not reachable ! Check if there are any corners in

the pattern. (1) " Radius should be provided to the

corner. ! Check that the lands and the VIA

holes are designed to avoid any concentration of stress. (2)

" All the wires should end up in a tear drop shape.

# The thermal cycle test should be performed on the flexible printed circuit for confirmation.

(1) (2)

NOK OK

OKNOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 62 (93)

Check No. I – 1 – 3 2


Items to check Shape of the solder resist

Applicable parts Lands

Resist

Lands

1）SOP, QFP Land pattern

Round shape

Recommendation: Apply solder resist between the lands

: Resist : Land : Land covered with resist

: PCB with no resist

Other land patterns

: Resist : Land

Resist

Land

: Land covered with resist

Round shape

: PCB with no resist

Points to check Conformity Status Alternate if not reachable ! Check that the parts lands are

designed to avoid peeling. " Solder resist should cover all the

land’s edges. " When some borders of the lands

could not be covered by solder resist, at least the short edges should be covered.


NOK OK

OKNOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 63 (94)

Check No. I – 1 – 3 3


Items to check Pattern layout

Applicable parts Bending area of the flexible printed circuit

(1) Pattern on both sides.

(2) VIA holes and part land in the bending area.

(1) Pattern not parallel to the bending direction

(4) Pattern width ≥ 0.25 mm

(5) R ≥ 1mm

(3) Pattern thickness = 18 – 50µm

Points to check Conformity Status Alternate if not reachable ! Check that the pattern is

designed to avoid stress concentration.

" The pattern should be printed on only one side and be parallel to the FPC bending direction. (1)

" There should not be any part land nor VIA hole in the bending area. (2)

" The thickness of the pattern should be from 18 to 50 µm. (3)

" The width of the pattern should be at least 0.25 mm. (4)

" The bending radius should be at least 1 mm. (5)


NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 64 (95)

Check No. I – 1 – 4 1

Items Circuit board design < Ag-TH circuit board >

Items to check Spacing between traces

Applicable parts PCB pattern

Points to check Conformity Status Alternate if not reachable ! Confirm that sufficient spacing

between the interior surface of the via hole and the silver paste edge is provided.

" 0.20 mm or greater spacing shall be provided between the interior surface of the via hole and silver paste edge.

! Confirm that sufficient spacing between the silver paste and the adjacent copper foil traces is provided.

" Silver paste shall not protrude from the copper foil land.

Note: 0.30 mm or greater spacing shall be provided between the copper foil traces extended from the adjacent through hole lands.

# Let the distance between the adjacent edges of the silver paste and copper foil pattern be "b"

b < 0.20 mm ........ Unacceptable 0.20 mm ≤ b < 0.30 mm

Conduct the humidity durability test (LT/02 in 28401NDS01 and 36-00-802) to confirm that improper distance could not lead to failure in function due to insulation resistance or migration.

0.30 mm ≤ b ........OK

a = Distance between the Cu PTH edge and the Ag paste edge b = Distance between the Cu PTH land edge and the Ag paste edge

(1) The distance between the interior surface of PTH and silver paste edge shall be 0.20 mm MIN.

Ag paste does not bias over the Cu PTH

land.

a > 0.20 mm

b > 0.30 mm

Silver paste

Copper foil land

a < 0.20 mm

b < 0.20 mm

(2) Silver paste shall not protrude from the copper foil land.

OK ACCEPTABLE Unacceptable

Unacceptable OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 65 (96)

Check No. I – 1 – 4 2


Items to check Overcoat shape

Applicable parts Via hole

The hole is clogged.

Overcoat

Silver paste

Through hole

Through hole land solder resist

Check point Reference value Index for individual consultation ! Confirm that the overcoat is

formed properly. " The overcoat shall not clog up

the via hole.

OK

Unacceptable

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 66 (97)

Check No. I – 1 – 4 3


Items to check Via hole location

Applicable parts Via hole, SMD

Separation of SMT terminal

Via hole Overcoat

SMD

Ag-TH PCB

Check point Reference value Index for individual consultation ! Check if there is no via hole

under the surface-mounted devices.

" Via holes shall be located away from the surface-mounted devices by a distance equal to or greater than the overcoat diameter.

# It shall be guaranteed that the overcoat over the Via holes has been designed so that overcoat does not come in contact with the surface-mounted device.

OK

Unacceptable

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 67 (98)

Check No. I – 1 – 5 1

Items Circuit board design <Paste jumper>

Items to check Overcoat width

Applicable parts Overcoat

Check point Reference value Criteria to be consulted separately! Check that the overcoat fully

covers the conductive paste. " The design value for the overcoat

width shall be +1.20 mm or more, relative to the paste width.

A ≥ a + 1.20 mm B ≥ b + 1.20 mm

# The width of overcoat overlap in the printing inspection pattern for each circuit board: Carry out the inspection with C=(A-a)/2 and (B-b)/2 ≥ 0.20 mm. Or guarantee with C ≥ 0.10 mm on the entire surface of the circuit board.

OK

Overcoat

A ≥ a + 1.20 mm and

B ≥ b + 1.20 mm

Conductive paste

C

B

A

b

a

The overcoat width is +1.20 mm or more, relative to the paste width.

NOK

Overcoat

A < a + 1.20 mm or

B < b + 1.20 mm

The overcoat width is less than +1.20 mm, relative to the paste width.

B

b

A

a Conductive paste

C

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 68 (99)

Check No. I – 1 – 5 2


Items to check Undercoat width

Applicable parts Insulation layer

Check point Reference value Criteria to be consulted separately! Check that the overlap width of

the undercoat and conductive paste is sufficient.

" The design value for the width of either undercoat shall be +1.00 mm or more, relative to the paste width. B ≥ A + 1.00 mm and C ≥ A + 1.00 mm

# With B ≥ A+1.00 mm or C ≥ A+1.00 mm, shall ensure the insulation resistance value between the conductive paste and the copper foil of the circuit board, for the resist layer and undercoat 1 layer alone, is 1 x 10E +8 Ω.

OK

The width of each undercoat layer shall be +1.00 mm or more, relative to the paste width. B ≥ A + 1.00 mm

and C ≥ A + 1.00 mm

Conductive paste

B

A

C

Insulation layer (3) (e.g., undercoat (2))


Insulation layer (1) (e.g., solder resist)

Even when there is displacement in the printing, the insulation layer, including the resist layer, shall cover 3 layers.

Relative to the paste width, undercoat 1 layer or 2 layers is less than +1.00 mm. B < A + 1.00 mm

or C < A + 1.00 mm

NOK

B

A

C

When there is displacement in the printing, there is a possibility that the insulation layer will not cover 3 layers.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 69 (100)

Check No. I – 1 – 5 3


Items to check Composition of insulation layer


Check point Reference value Criteria to be consulted separately! Check that the conductive layer is

not easily cut or easily thinned by the surface height difference.

" The insulation layer, consisting of resist and undercoat layers, shall be comprised of 3 layers or more, and shall be confirmed through a cross-section to be a structure that is not easily severed.

# In a worst case scenario for the design tolerances, carry out a test assuming the insulation layer is severed (guaranteed by the circuit board supplier). The resistance value shall not increase.

OK

Circuit board

Copper foil

Conductive paste Insulation layer (3) (e.g., undercoat (2)) Insulation layer (2) (e.g., undercoat (1)) Insulation layer (1) (e.g., solder resist)

The insulation layer is composed of a 3 layer structure.

Conductive paste

Copper foil pattern

Insulation layer (1)



Structure of insulation layer of point which crosses the copper foil pattern

NOK

Conductive paste


Insulation layer (1) (e.g., solder resist)

There are less then 3 insulation layers.

Circuit board

Copper foil

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 70 (101)

Check No. I – 1 – 5 4


Items to check Insulation layer structure of connected

land part




" Shall confirm through a cross-section observation that the paste is an insulation structure with good difference following capability and that there are no points where the electro conductive paste has thinned locally on the insulation layer and copper land edge.

# The thickness of the conductive paste shall satisfy the circuit board specifications in the specified resistance stress test.

A thin point has been generated in the conductive paste, according to the insulation thickness and the land edge.

NOK

Builds up regardless of insulation layer displacement The copper foil shall not be covered by any of the insulation layer.

Solder resist

Undercoat I

Undercoat II

Conductive paste

It is an insulation structure with good difference following capability and the conductive paste has not thinned too much locally.

Copper foil land

OK

Circuit board

Insulation layer structure of connected land part

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 71 (102)

Check No. I – 1 – 5 5


Items to check Conductor width and clearance between conductors (LINE/SPACE)

Applicable parts Conductive paste



" The jumper width shall be 1000 µm or more.

# Carry out resistance evaluation and the rate of conversion rate of the connected resistance of the pattern shall be within 100%.

! Check that the width of the jumper width is adequate.

" The jumper width shall be 1000 µm or more.

# Further, non-conductivity of 10E8 ohms or more shall be ensured between patterns.

OK

Conductive paste jumper width (LINE)

Clearance between conductive paste jumpers (SPACE)

1000 µm

Conductive paste jumper LINE/SPACE shall be 1000/1000 µm or more.

Conductive paste jumper

1000 µm

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 72 (103)

Check No. I – 1 – 5 6


Items to check Paste thickness


Check point Reference value Criteria to be consulted separately! Check that the thickness of the

conductive paste is sufficient. " The thickness of the conductive

paste shall be 15 µm or more over the entire jumper. (The flat and edge sections on the copper foil pattern are essential measurement points.)

! Check that the connection of the Cu and paste is satisfactory.

" The connection resistance of Cu and the paste shall have no effect on system functions.

! Check that the base material to be used is adequate.

" The base material to be used shall be the same grade as FR4 or CEM3, or higher.

# The conversion rate for the thickness of the conductive paste and the base material being used etc., shall be within 100% in the specified resistance stress test.

OK

Check that the structure is capable of passing a specified resistance test.

Conductive paste Method of measuring resistance value

Copper foil land

Copper foil pattern

Circuit board

Conductive paste Undercoat

Resist

Cross-section

Cu CuCu

I

V

Flat section

Edge section

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 73 (104)

Check No. I – 1 – 5 7


Items to check Applied circuit


Check point Reference value Criteria to be consulted separately! Check that the use of the

conductive paste jumper is adequate.

" The jumper is only used for the signal line. (Shall not be used on the GND and power supply line.)

" The wiring resistance of paste jumper shall have no effect on system functions.

" Shall be used on circuits where a resistance conversion rate of 100% is permissible.

OK

Copper foil pattern

Conductive paste

Used for signal line.

NOK

GND or power supply line

Used for GND and power supply line.

Conductive paste

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 74 (105)

Check No. I – 1 – 6 1

Items Metallic core circuit board Items to check Circuit board through hole, via hole

Applicable parts Resin filling section between the through hole and metallic core

Check point Reference value Criteria to be consulted separately! Check that there are no problems

with the state and material selection of the resin filling section for the space between the metallic core circuit board through hole and the metallic core.

" After increasing the mounting stress, there shall be no decrease in non-conductivity due to the advancement of voids and cracks, etc., in the resin filling section (1).

" There shall be no decrease in the connection resistance of the through hole and via hole due to the advancement of voids and cracks, etc., in the resin filling section (2).

# Carry out the migration test. There shall be no concerns with insulation resistance leakage, etc.

# Carry out the heat cycle test. There shall be no increase in the connection resistance of the through hole and via hole

NOK OK

The space between the through hole and metal core is completely covered by the resin.

There are voids and cracks in the resin filling section between the through hole and metallic core.

Glass cloth Glass cloth

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 75 (106)

Check No. I – 1 – 6 2

Items Metallic core circuit board Items to check Mounting parts

Applicable parts Surface mounting parts (chip resistor)

Check point Reference value Criteria to be consulted separately! Check that no inappropriately

sized parts are used in the metallic core circuit board surface mounted chip resistors

" Shall not use surface mounted parts with inferior durability when compared to the deterioration of solder joints on general FR4 resin circuit boards.

# Carry out the heat cycle test. There shall be no problems in the reliability (connection resistance, solder connection strength) of parts due to breaks in the solder.

Num

ber o

f stre

ss c

ycle

s un

til a

bnor

mal

ities

app

ear i

n th

e so

lder

con

nect

ion

resi

stan

ce: N

f

1608 2012 3216 5025

X Not acceptable: Example using 2-layer aluminum

Durability within general FR4 resin circuit board material (Image)

Acceptable: Example using stress releasing material such as low α, high Tg material

For the size of the resistance chip (example)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 76 (107)

Check No. I – 1 – 7 1

Items Metal circuit board

Items to check Circuit configuration based on circuit board

Applicable parts Base metal of metal circuit board

Check point Reference value Criteria to be consulted separately! Check that the circuit composition

of the base metal of the metal circuit board is capable of avoiding migration of the insulation layer.

" The base metal of the metal circuit board shall not be connected to circuits (GND, etc.).

# Carry out the migration test. There shall be no concerns with insulation resistance leakage, etc.

NOK OK

Base metal of metal circuit board shall have floating which does not conduct electrically.

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 77 (108)

Check No. I – 1 – 7 2

Items Metal circuit board

Items to check Insulation performance of metal circuit board


Check point Reference value Criteria to be consulted separately! The insulation performance

before and after mounting parts shall not decrease nor deteriorate.

" There shall be no decrease in the insulation resistance value of 1.0E8 Ω or more and the resistance of 1.0E1 Ω or more after mounting parts. (1)

" There shall be no deterioration in insulation performance due to migration, etc. (2).

# There shall be no deterioration in insulation performance due to migration, etc. (2).

Bare circuit board (un-mounted circuit board)

OK

On the bare circuit board, measure the insulation resistance between the land of the largest sized part (not covered with a resist layer) and the base metal.

After mounting parts, measure the insulation resistance between the land of the above-mentioned part and the base metal.

Based on an insulation resistance value of less than 1.0E8 Ω in an indoor environment or a bare circuit board (un-mounted circuit board), the insulation resistance value of 1.0E1 Ω or more of a mounted circuit board decreases.

Insulation resistance meter

Insulation resistance meter

NOK

Based on an insulation resistance value of 1.0E8 Ω or more in an indoor environment and a bare circuit board (un-mounted circuit board), the insulation resistance value of 1.0E1 Ω or more of a mounted board does not decrease.

Example of measurement method

Mounted circuit board

Before mounting

After mounting

1.0E8

1.0E1 or more

Insu

latio

n re

sist

ance

va

lue

[Ω]

Before mounting

After mounting

1.0E8

1.0E1 or less

Insu

latio

n re

sist

ance

va

lue

[Ω]

Before mounting After

mounting

1.0E8

1.0E1 or less

Insu

latio

n re

sist

ance

va

lue

[Ω]

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 78 (109)

Check No. I – 2 – 1 1

Items Casing design < Common >

Items to check Part clearance - short-circuiting

Applicable parts All parts

(1)

(2)

(3) (4)

(5)

Points to check Conformity Status Alternate if not reachable ! Check that the specified

clearances are provided. " Between parts at a different

electrical potential, the clearance should be at least 2.0 mm.

" Between parts at a same electrical potential the clearance should be at least 1.0 mm.

# Even if the specified clearance is not maintained, there should be no functional failure during the vibration resistance test.

Casing

PCB Clearance

Circuit board

Casing

Pattern Screw

Casing

PCB

Pattern

Clearance

Washer Short Washer

Short

Contact between the washer and solder

PCB

Pattern

Clearance

* The maximum guaranteed bending load for the PCB should be the applied to measure the clearance.

Pattern

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 79 (110)

Check No. I – 2 – 1 2


Items to check Interferences between parts

Applicable parts All parts

(1)

(2)

(3)

Points to check Conformity Status Alternate if not reachable ! Check that the specified

clearance is provided. " There should be no interferences. " The guaranteed maximum

deflection load for the PCB should be the applied to confirm the clearance.

# If there is any interference, there should be no noise during the vibration resistance test. Attenuators may also be used between parts.

Clearance

PCB

Casing

Parts contact Clearance

Clearance ClearancePCB

PCB

PCB

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 80 (111)

Check No. I – 2 – 1 3


Items to check Fastening of parts – strength

Applicable parts Screws

(1) (2) NOK OK

Separated with spring washer

Stud

PCB

casing Pattern

LOCTITE

Heat sink

Tapping screw

Points to check Reference value Criteria to be consulted separately ! Check that measures to

prevent loosening of the screws have been taken. (1)

" Loosening should be prevented by the use of Loctite, etc... or spring washer equipped screws.

! Check that the clearances between the end of the circuit board and the internal surface of the holes are sufficient. (2)

" The clearance between the end of the circuit board and the internal surface of the hole shall be 1 mm or more and the washer (or the screw’s head if washer is not provided) shall not protrude from circuit board.

# There shall be no loosening of the screws (check the torque) or deterioration of the function of the equipment or the performance of EMC before and after the compound thermal cycle test (thermal cycle and vibration tests). (Contact resistance may deteriorate without rotation of the screw. Pay particular attention to situations when electric contact with the fastening section is possible, which could affect the function of the equipment or the performance of EMC.)

Cracks

Check that the bearing surface for the screw tightening is provided.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 81 (112)

Check No. I – 2 – 1 4


Items to check Fastening of parts – electrical

connection

Applicable parts Screws

(1)

(2)

(3)

Contraction (large)

Rivet

PCB

Rivet used only to fix mechanically

Pattern

Casing

Contraction (small)

(Poor electrical contact due to the differences of thermal expansion coefficient)

Points to check Conformity Status Alternate if not reachable " When Loctite is used to prevent

loosening, no Loctite should interfere the electrical contact. Loctite should thus be applied after fastening. (1)

" Spring washer, bolt or screw and washer assembly (separate spring washer) could be used. (2)

! Check that the fastening method is appropriate.

" Rivets should not be used for electrical connection. (3)

# There should be no loosening of the screws (check the torque) or deterioration of the function or the EMC performances before and after the combined thermal cycle test (thermal cycle and vibration tests). (Contact resistance may deteriorate without rotation of the screw. Pay particular attention to situations when electric contact with the fastening section is possible, which could affect the function of equipment or the EMC performances)

(When short circuiting is not necessary)

Casing Heat sink

PCB

Loctite should be used after screwing

PCB

Screw

Pattern

Stud

Screw with Loctite

Vehicle body GND

NOK OK

OKNOK

OKNOK

*Loctite generates function errors at electrical contact.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 82 (113)

Check No. I – 2 – 1 5


Items to check Prevention of drosses when screws are

tightened.

Applicable parts Aluminum casings and heat sinks

Aluminum material (case base or heat sink)

When screwing into a soft metal, drosses are produced and fastened into the casing, and lead to short circuits

Case cover

Aluminum material

Nut press fitted into the aluminum plate

Stud (brass, etc.)

Casing cover

Casing base

Points to check Conformity Status Alternate if not reachable ! Check that the holes into

aluminium base materials are all passing through holes.

" Holes in aluminum base materials should no be tap holes.

# The internal area of the case should not be polluted with metallic drosses.

NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 83 (114)

Check No. I – 2 – 1 6


Items to check Direction of the connectors

Applicable parts Connectors

Horizontal and downward directions are acceptable.

CAUTION

C/U

↓ GROUND

An inclination of 1° or more with the horizontal direction is unacceptable.

Connector

Harness

Direction of connector

↑ TOP

(1)

(2)

(3)

(4)

In the case of a horizontal connector

Horizon

Points to check Conformity Status Alternate if not reachable

! Check that the mounting design of the connectors is taking into account the ECU’s mounting conditions aboard the vehicle.

" Connector should not be directed upward.

" Check that the harness connected to the connector is directed to prevent any intrusion of water

# Measures to prevent intrusion of water into the ECU (structure, etc.) should be taken.

OK

NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 84 (115)

Check No. I – 2 – 1 7


Items to check Position of the case and the connectors

Applicable parts Connectors housing and case openings

(1)

(2) Connection and

disconnection of the connector on the vehicle body harness side

When the connector is mounted vertically to the circuit board, stress is applied to the circuit board during the connection and disconnection operations.

Points to check Conformity Status Alternate if not reachable ! Check if the relative position of

the case opening and the end of the connector is adequate.

" The circuit board connector should not be inside the case..

! Check that the attaching and detaching operations are not too stressful for the connector (PCB side) and its solder joints. (1)

" The mechanical support of the connector (PCB side) should not be ensured by the only solder joints.

! Check that the circuit board is not damaged when attaching and detaching the connector (vertical type). (2)

" Measures should be taken to prevent the board bending.

Protrusion Unit case

Connector on vehicle body harness side

Cracks in the solder joints caused by stress

Connector on PCB side out of the case

NOKNOK

OK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 85 (116)

Check No. I – 2 – 1 8


Items to check Sealing of the case

Applicable parts Cases

Vent hole

Air

Completely sealed

Dry air or N2 etc.

Completely sealed

Air

Completely sealed

Potting material

Points to check Conformity Status Alternate if not reachable ! Check that the generation of dew

inside the casing has been taken into consideration for the design of the case.

" Measures for dewing should be taken.

# There should be no functional failure after the durability test (condensation test).

* Dry air Atmospheric air under which the dew point is lower than the guaranteed minimum restoration temperature

Based on an insulation resistance value of less than 1.0E8 Ω in an indoor

i t b

OK

OK OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 86 (117)

Check No. I – 2 – 1 9


Items to check Case opening

Applicable parts Cases

Points to check Conformity Status Alternate if not reachable ! Check that static electricity from

the circuit board is discharged into the opening of the case.

" Check that static electricity is not discharged on the circuit board or on the parts.

# There should be no functional failure after the static discharge test.

Circuit board

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page I - 87 (118)

Check No. I – 2 – 1 10


Items to check PCB support arrangement

Applicable parts PCB [PCB support arrangements]

Connector PCB

Support points (Screws)

Components layout area

① Supported by screws

PCB

Connector


High vibration stress line

High vibration stresses on components

PCB

Connector


PCB Connector

Supress


Addition of support points

OR

②Supported by the case tabs

PCB

Connector

case

Slide in Slide in

PCB supports(tab)

Points to check Conformity Status Alternate if not reachable ! Check if the PCB is surely

supported in the case. " The PCB should be supported on

three edges at least. " The components should be wired

within the area that is enclosed by the support points.

# Any support method that can surely reduce the vibration stress is acceptable under an agreed council.

※ If some components’ package

are outside of the red area,

there is a possibility of

component-dropping because of

the vibration stresses.

NOK OK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 1 (119)

< II >

Product mounting QUALITY check items

RENAULT 36 - 00 - 012 / - - C


Check No. II – 1 – 2 1

Items Electrical connection

< Soldering - common > Items to check Shape of the solder fillet

Applicable parts Through hole components (in plated through holes)

(1) Amount of solder

WS < D + 0.6 mm Amount of soldering inside the hole: Less than 100%

WS : Diameter of wetted surface

D : Hole diameter

WS D

Ws ≥ D + 0.6 mmAmount of soldering filled inside the hole: 100%

(2) Wetting

A A

A < 90°

Max

Others (undesired shape)

(3) Icicle (4) Lead not discernible

(5) Excessive rise (6) Blowhole (7) Cold joint (8) Disturbed joint

Icicle

Solder surface

Solder contacting component’s body

Blowhole

Poor wetting due to insufficient heating. The surface of the solder is not shiny.

Abnormalities in the fillet due to the vibration at solder solidification. Soldering surface is not smooth and tluster on the surface is insufficient.

Points to check Conformity status Alternate if not reachable ! Check that the

solder joint’s shape is adequate.

" Refer to the chart below.

# There should be no functional failure after the durability test (thermal cycle test) when using the soldered parts under the worst conditions.

# In the case of a non-HASL finished PCB, there should be no deterioration of insulation and corrosion resistance after the humidity resistance test.

Amount of solder (1) Wetting (2) Others (3) - (7) Part surface - At least 75% of the land and the

hole diameter + at least 0.6 mm should be covered. - The total circumference of the lead has to be covered and A < 90°.

- For parts with bent leads, soldering should not contact the component’s body.

- There should be no disturbed joints nor cold joints

Plated through hole

The holes should be filled at 100% with solder

- There should be no blowholes. - There should be no disturbed joints nor cold joints

Soldering surface

100% of the land has to be covered with soldering, the total circumference of the lead has to be covered and A < 90°.

- Lead should be discernable. - There should be no icicle - There should be no disturbed joints nor cold joints.

NOK OK

OKNOK

NOK NOK NOK NOK NOK NOK

RENAULT 36 - 00 - 012 / - - C




< Soldering - common >

Items to check Shape of the solder fillet

Applicable parts Through hole components (in non-plated through hole)


WS < D + 0.8 mm

WS : Diameter of expansion of soldering surface

D : Hole diameter

Ws

D Ws ≥ D + 0.8 mm or more

(2) Wetting

Soldering not covering the lead

Soldering not covering the land

Copper foil of land exposed

Soldering

A

A

A < 90° Max

Others (undesired shape)

(3) Icicle (4) Lead not discernable

(5) Blowhole (6) Cold joint (7) Disturbed joint


! Check that the solder joint’s shape is adequate.




Amount of solder (1) Wetting (2) Others (3) - (6) Soldered surface

- 100% of the land and the hole diameter + at least 0.6 mm should be covered with soldering. - The total circumference of the lead has to be covered and A < 90°.

- There should be no blowholes. - Lead should be discernable. - There should be no icicle. - There should be no disturbed joints nor cold joints

NOK

NOK OK

OK

Blowholes

NOK NOK NOK Soldering surface is not smooth and the luster on the surface is insufficient

NOK NOK Poor wetting due to insufficient heating. The surface of the solder is not shiny.

RENAULT 36 - 00 - 012 / - - C






Applicable parts Surface mounted parts (Chip form)


Fillet height is 25% or less of thickness of part electrode.

h

b

ts

w

w

b : Length of connection on edge surface side of electrode

h : Fillet height w : Land width ts : Soldering thickness H : Thickness of part

electrode

H

h ≥ (ts + 25% of H) or 0.5 mm b ≥ 75% or more of electrode width

(2) Wetting

A

A A < 90°

Max

(3) Part deviation

Lateral deviation

Electrode width

Land

Deviation in thedirection of edge surface

Side: Deviation of 25% or more of electrode width End overhang: Land and edge side of the electrodes do not overlap

(Top view)

Others (4) Solder fillet extends onto the part’s body

Solder extends onto part’s body

(5) Leaching of electrode

Corrosion of more than 25% of the thickness or width of a component’s electrode.






Amount of solder (1) Wetting (2) Part deviation (3) Others (4) (5) Fillet height (h): h ≥ (ts + 25% of H) or 0.5 mm Length of connection on the side of electrode (b): b ≥ 75% of the electrode’s

width

Contact angle (A): A<90° Coverage of the bottom side of the electrodes: The bottom side must be completely covered with solder

Lateral deviation: At least 75% of the width of the component’s electrode should stay over the land. End overhang: The edge surfaces of the electrodes should stay over the land.

- Solder should no extend onto the part’s body.

- There should be no corrosion extending onto more than 25% of the thickness of a part electrode or the electrode width. (Consider the combination of materials for electrodes and soldering making corrosion unlikely to happen)

Corrosion of electrode

Residual part of electrode

<Arrows> Soldering does not completely cover parts causing insufficient mechanical and electric connection.

OKNOK

OKNOK

NOK

NOKNOK

RENAULT 36 - 00 - 012 / - - C






Applicable parts Surface mounting part (gull wing lead)


h < t + ts b < 75% of b

h : Height of part side fillet b : Length of connection on edge

surface side of electrode t : Lead thickness ts : Soldering thickness w : Lead width

h

bw

t ts

h ≥ t + ts b ≥ 75% of w

(2) Wetting

The side of the lead is not covered.

The edge of the lead is not covered.

A A

A

A < 90°

(3) Deviation

Lateral deviation

Deviation equal to the smallest between 25% of lead width and 0.5mm

Deviation in the direction of edge surface

Bottom surface of the lead

Lead bottom surface protrudes from the land

(4) Others

Solder contacts part’s body






Amount of solder (1) Wetting (2) Deviation (3) Others (4) h: Height of the back fillet:

(Solder thickness + lead thickness) or more

b: Length of connection on edge side of lead:

At least 75% of the lead width

Land should be completely covered (100%) and the contact angle be < 90°.

Side: Less than the smallest between 25% of lead and 0.5 mm.

Direction of edge surface: Lead bottom surface should stay on land.

Soldering should not contact the part’s body.

NOK OK

OK NOK NOK

NOK NOK

NOK

RENAULT 36 - 00 - 012 / - - C





Items to check Shape of the solder filet

Applicable parts Surface mounting part (J-shaped lead)


t + ts

h < t + ts I < 200% of w b < 75% of b

b : Length of connection on edge side of lead

l : Length of connection on lateral side of lead

h : Height of fillet w : Lead width t : Lead thickness ts : Soldering thickness

h

I

b w

ts

t

h ≥ t + ts 1 ≥ 200% of w b ≥ 75% of w

(2) Wetting

Lead is not covered.

A

AAA < 90°

Side of lead is not covered.

(3) Deviation

Deviation in the direction of edge surface Lateral deviation

Deviation which is equal to 25% or more of lead width

Lead protrudes from land

(4) Others

Excessive solder

Solder contacts the part’s body






Amount of solder (1) Wetting (2) Deviation (3) Others (4) h: Height of fillet:

(Solder thickness + lead thickness) or more

Length of connection on edge surface side of lead:

75% or more of lead width Length of connection on lateral side of lead:

200% or more of lead width

The land should be completely covered (100%) and the contact angle be < 90°.

Side: Less than 25% of lead width

Direction of edge surface: Lead bottom surface should stay on the land.

Solder should not contact the part’s body

NOK OK

OKNOKNOK

NOK

NOK

RENAULT 36 - 00 - 012 / - - C






Applicable parts Cable and lead parts


Overlapping is insufficient . Overlapping

Soldering

(2) Wetting

A > 90° (Cable and lead not covered by solder )

Solder

Cable or lead AA A < 90°

Others (3)

(4) Rosin flux

Soldering Cable

Flux

(5) Loose contact

Covered by solder but no intermetallic is formed

(6) Fractured joint

Crack Cracks can occur if thewire is moved whilecooling

(7) Disturbed joint and overheat

- It looks white due to overheating. - Due to insufficient temperature for solder and

lack of time, soldered surface is grained resulting in insufficient smoothness and luster.

(8)

Damage to the wire (due to melting)

(9)

Excessive removal of coating

(10)

Damage on core cable while removing coating

(11)

Core cable spread apart

Points to check Conformity status Alternate if not reachable ! Check that the

solder shape is appropriate.


# There shall be no functional failure after the durability test (thermal cycle test) using soldered part under the worst conditions.

# In the case of a land not covered with soldering (not a leveler circuit plate, there shall be no deterioration in insulation and corrosion resistance after the humidity resistance test.

Amount of solder (1) Wetting (2) Others (3) - (12) Overlap between the wire and the connected material (land):

Joint length should be more than 5 times the wire diameter.

100% of the land should be covered and A < 90°.

(3) The base of the wire should be soldered so it would not fall over.

(4) There should be no bonding by flux. (5) There should be no loose contact. (6) There should be no fractured joint. (7) There should be no disturbed joint or overheating. (8) There should be no damage on coating. (9) There should be no excessive removal of coating. (10) There should be no damage on the copper cable. (11) The copper cable should not spread apart.

Solder is absorbed under the coating of the lead, making the lead unable to fall over

Amount of overlapping ≥ 5 × wire diameter

NOK OK

OKNOK

NOK NOK

NOKNOK

NOK NOK NOK NOK

RENAULT 36 - 00 - 012 / - - C






Applicable parts Empty plated through hole not covered by resist (only flow soldering process)

Points to check Conformity status Alternate if not reachable ! Check that the wetting of the

solder is adequate.

" The inner surface of the plated through hole should be entirely covered with solder. The surface angle A should be less than 90°.

# If the conformity status is not reachable, the durability test (thermal cycle and humidity resistance tests) should be performed with soldered product and there should be no functional failure.

A

NOK

OK

RENAULT 36 - 00 - 012 / - - C





Items to check Solder ball

Applicable parts Surface of the circuit board

Corner chip part Gull wind lead element J lead element

Element main unit


! Check that the materials, the process settings and the facilities (printing shape and the amount of soldering) make it hard to produce solder balls.

" There should not be any solder ball with a diameter bigger than 0.13 mm, or 50% of the minimum pitch.

# Measures should be taken to prevent any functional failure caused by the movement of a solder ball.

(Ex: Coating, etc... to prevent movement of the solder balls)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 10 (128)




Items to check Insulation resistance

Applicable parts Residual flux

(1)

(2)

Push SW

Insulation resistance lowered by absorption of humidity ormigration of residual flux between the patterns

Residual flux

Dial SW

Pattern of contact point

Circuit board

R432

ON/OFF

Circuit board


! Check that the insulation characteristics are not affected by residual flux.

" Insulation resistance should be 100mΩ or more. (Measurement should be performed under predetermined test conditions.)

! Check that the residual flux cannot be responsible of short contact failure between the contact patterns.

" The flux residue should be removed by washing. (by air blow or flux removal solution and drying)

# An insulation resistance of 10MΩ under humid condition is acceptable if there is no functional failure at high temperature.

Insulation resistance lowered by absorption of humidity or migration of residual flux

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 11 (129)



< Soldering – lead free> Items to check Fillet lifting

Applicable parts Through hole components


! Check for fillet lifting. " There should be no fillet lifting. # When there are fillet liftings, perform the durability tests to check that the lifting does not lead to a functional failure.

Land

Separation Solder

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 12 (130)



< Soldering – lead free > Items to check Separation of the lead



! Check that the lead terminal does not separate.

" There should be no separation. # When there are separations, perform durability test to check that the separation does not lead to a functional failure.

Solder

Separation of the lead

Land

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 13 (131)



< Soldering – lead free > Items to check Land lifting



! Check for land lifting. " There should be no land lifting.

! Check for damages on the pattern due to land lifting.

" There should be no damages.

# When there is some land lifting or damages on the pattern, perform the durability tests to check that the damages do not lead to a functional failure

(2) Damage on the pattern

(1) Land lifting

Solder

Land / pattern

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 14 (132)



< Soldering – lead free > Items to check Shrinkage cavity

Applicable parts Through hole components and SMD parts


! Check that there is no cavity. " There should be no cavity due to shrinkage.

# When there are cavities, perform the durability tests to check that the cavities do not lead to a functional failure.

Solder

Shrinkage cavity

Land

Soldering

Shrinkage cavity

Land

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 15 (133)



< Soldering – lead free > Items to check Separation of the SMD terminal

Applicable parts Surface mounted parts


! Check that the SMD terminals do not separate from the solder joint..

" There should be no separation. # When there are separations, perform the durability tests to check that the separations do not lead to a functional failure

Separation of the SMT terminals

Land Lead

Separation of the SMT terminals

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 16 (134)



< Soldering – lead free > Items to check Separation of the SMD land

Applicable parts Surface mounted part


! Check that the SMD land do not separate from the solder joint.

" There should be no separation. # When there are separations, perform the durability tests to check that the separations do not lead to a functional failure

Separation of the SMT land interface (cracks)

Land

Lead

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 17 (135)



< Soldering – lead free > Items to check Separation of the SMD fillet

Applicable parts Surface mounted parts (Reflow plus flow process)


! Check if a local remelting of the solder joints during the flow process occurs.

" There should be no cracks, no voids and no separation due to remelting.

# When there is some cracks, or voids due to remelting, perform the durability tests to check that the separation does not lead to a functional failure

Crack Void

Cracks and voids in the solder joint appear after flow because of remelting of a portion of the reflow solder

Separation Separation

Crack Void

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 18 (136)



< Soldering – lead free > Items to check Separation of the BGA ball

Applicable parts BGA, CSP


! Check if a local remelting of the BGA ball’s solder joints during the flow process occurs.

" There should be no cracks, no voids and no separation due to remelting.

# When there are some cracks, or voids due to remelting, perform the durability tests to check that the separation does not lead to a functional failure

Cracks and voids in the solder joint appear after flow because of remelting of a portion of the reflow solder

Separation

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 19 (137)



< Soldering – lead free > Items to check Plated through hole damages



! Check for any delamination of the through hole (separation between the plating and the epoxy resin). (1)

! Check that there is no damage on the pattern of the inner layer and its connection with the plating. (2)

" There should be no damage, no any delamination of the plated through hole.

# If there are damages on the plated through hole and the inner layer pattern, perform the durability tests to check that the damages do not lead to a functional failure.

(1) Delamination of the plated through hole

(2) Damages on the internal layer pattern

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 20 (138)

Check No. II – 1 – 3 10


< Soldering – lead free > Items to check Copper erosion

Applicable parts Circuit board


! Check for any wane of copper (lands, plated through hole, via hole) due to erosion.

" There should be no wane.

Solder

Land

Erosion of the copper Damage of the

plated through hole

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 21 (139)

Check No. II – 1 – 3 11


< Soldering – lead free > Items to check Whiskers

Applicable parts Inserted parts and surface mounted parts


! Check that no whiskers have formed (thin areas of parts plating and solder fillet).

" Whiskers shall not form. # In high temperature and high humidity exposure tests (85°C/85% RH, 1000 h), whiskers shall not form in 1/2 or more of the smallest electrode space. However, when the time specified in the indicated specifications document (36-00-802_LT02) is longer, the specifications test time requirement shall be adopted.

NOK Whiskers (Plating surface of part electrode)

Whiskers (Plating surface of part electrode)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 22 (140)

Check No. II – 1 – 3 12


< Soldering – lead free > Items to check Decrease in solder strength


Points to check Reference value Criteria to be consulted separately ! Check that there is no decrease

in the joint strength. " There shall be no decrease in

solder strength. # In high temperature and high

humidity exposure tests (85C/85% RH, 1000 h), strength shall not decrease by 30% or more.

(121)

Joint strength Strength

Before testing 1000 h

30%

Lead Decrease in joint strength on the joint interface occurs.

Circuit board

NOK

NOK

OK

High temperature and high humidity exposure tests (85°C/85% RH, 1000 h)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 23 (141)

Check No. II – 1 – 3 13


< Soldering – lead free > Items to check Deformation of solder


Points to check Reference value Criteria to be consulted separately ! Check that there is no solder

deformation. " Shall be free from deformation

such as solder protruding from the land..

# Confirm that there is no deformation in a heat cycle longevity test. If there is deformation, judgment shall be made after consultation.

NOK OK

Part body

Part electrode

Solder protrudes from land.

Part body

Part electrode

Solder protrudes from land.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 24 (142)


Items Electrical connection < Press fitting >

Items to check Press fitting process

Applicable parts PCB land

Circuit board

Land

Pin to be press fitted

Press fitting direction

Through hole

Construction method to ensure electric conductivity by contact between press fitted pinand through hole land

Points to check Conformity status Alternate if unreachable ! Check that the press fitting

process is adequate

" The press fitting process should be the same as the one described over.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 25 (143)



Items to check Land damages

Applicable parts Press fitted pin’s land

Pressing direction

Press fitted pin

Plated throughhole

(1) Deformation (lifting)

Land OUT side

View of the land on IN side

(2) Deformation (blistering)

Land width

Length of the deformation

Pressing direction

Pressing direction

View of the land on OUT side

(1) Deformation (lifting)(4) Scratches, recesses, chipping, etc…

(3) Cracks

Land IN side

<75%

Points to check Conformity status Alternate if unreachable

! Check that the shape and the dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

" There should be no deformation or separation of the land. (1)

" The length of the deformation and the blistering should be 75% Max of the total width of the land. (2)

" There should be no cracking. (3) " There should be no scratch on the

land and the plated through hole. (4)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 26 (144)



Items to check Resin damages

Applicable parts PCB’s resin

Cross section view

(1) Whitening and separation of the resin

(1) Whitening of the resin

Resin

Pin

Upper view of the surface OUT side

Cu plated through hole

Press fitted pin

Solder resist

Land

(2) Cracks in the solder resist

Pressing direction

Press fitted pin

Plated through hole

Land OUT side

Land IN side

Points to check Conformity status Alternate if unreachable ! Check that the shape and

dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

" There should be no blushing or separation of the circuit board resin. (1)

" There should be no cracks in the solder resist. (2)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 27 (145)



Items to check Plated through hole damages

Applicable parts Plated through hole

Cross section view

(1) Peeling of the copper plating

Resin

Press fitted pin

Surface section view

(3) Deformation of the copper plating

(4) Residual thickness of the copper plating

Peeling of the copper plating (chip peeled off)

Pin

Resin Cu plated through hole

(2) Cracks in the copper plating


dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate..

" There should be no peeling of the copper plating. (1)

" There should be no cracking in the copper plating. (2)

" The deformation of the copper plating should be less than 25 µm. (3)

" The residual thickness of the copper plating should be at least 8 µm. (4)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 28 (146)



Items to check Inner layer pattern damages

Applicable parts PCB’s inner layer pattern

Cross section view

(2) Cracks or disconnection of the inner layer pattern

a

b

a: (1) Amount of deformation of the inner layer pattern

b: Thickness of the inner layer pattern


dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

" Deformation a of the inner layer pattern should be smaller than its thickness b. (a < b). (1)

" There should be no cracking or disconnection of the inner layer pattern connection point. (2)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 29 (147)



Items to check Peeling of the surface of the PTH or pin

Applicable parts Plated through hole press fitted pin

(2) Scraping or peeling of the pin surface

(1) Peeling or protrusion of the plated and soldered section of the PTH (ex: tin silver)


! Check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

" There should be no peeling of the plating and the soldering finition of the plated through hole and no protrusion (ex: tin silver) on the board surface. (1)

" There should be no chipping and peeling of the pin surface. (2)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 30 (148)



Items to check Inclined press fitted pins

Applicable parts Press fitted pin

Inclined press fitted pin (deviated)

Deformation of the resin and the land caused by inclined press fitted pin


! Check that the shape and dimensions of the pin to be press fitted and the internal diameter of the plated through hole are adequate.

! Check that the accuracy of the pin location is adequate.

! There should be no buckling of the pin and no stress or deformation of the resin or land due to inclined insertion.

" There should be no inclined press fitted pin.

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 31 (149)



Items to check Extension of the pattern

Applicable parts Press fitting land and pattern

Pin

Land IN side OUT side

Pressing direction

Pattern (surface layer and internal layer)

Extension in a direction where concentrated stress is avoided

Extension in a direction wherestrong stress is applied

Area where highest stress is likely to be applied during press fitting

Land

Pin

Surface view

Points to check Conformity status Alternate if unreachable ! Check that some measures have

been taken to avoid stress on the pattern due to press fitting.

" The pattern should extend from press fitting holes in the direction where the stress would be the lowest.

NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 32 (150)



Items to check Electrical characteristics of press fitting (connection resistance)

Applicable parts Press fitted joint

mA µV

0 100 500 1000

Number of cycles or time

Durability graph

Maximum diameter of through hole Minimum diameter of through hole

Use range

Ele

ctric

al c

onne

ctio

n re

sist

ance

1 mΩ

Minimum outside diameter of the pin

Maximum outside diameter of the pin

Through hole diameter Maximum Minimum

Initial characteristic graph

Ele

ctric

al c

onne

ctio

n re

sist

ance

∆1 mΩ

Measure the low current and voltage by the range of mA and µV.

Points to check Reference value Criteria to be consulted separately ! Check that the materials used for

the pin and the plated through hole are adequate.

! Check that the internal diameter of the plated through hole and the tolerances for the outside diameter of the pin are adequate.

The requirements for the outside diameter and the dimensional tolerances for the pin hole internal diameter within the entire range (minimum to maximum tightening margin of pin) should be decided so: " Contact resistance should be less

than 1mΩ.

# Resistance fluctuation shall be 1 mΩ or less after the durability evaluation test.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 33 (151)

Check No. II – 1 – 4 10


Items to check Mechanical strength characteristics of the press fitting pin (insertion force, initial retention force)

Applicable parts Press fitting joint

Pressing fitting insertion force

Use range Minimum Maximum

Inse

rtion

forc

e

Pressing direction

Pin

Push-out direction

Retention force (push-out)

Tool for pushing out

(2) 20N

(1) 200N

Ret

entio

n fo

rce

(3)


! Check that the materials used for the pins and the plated through holes are adequate.

! Check that the internal diameter of the plated through hole and the tolerance for the outside diameter of the pin are adequate.

The following requirements shall be met for the entire range of the tolerances of the outside diameter of the pin and the through hole diameter (minimum to maximum tightening section of the pin): " The insertion force should be less

than 200N. (1) " The retention force should not be

less than 20N. (2) " There should be no reduction of

the retention force even if the diameter of the through hole is reduced. (3)

NOK

OK

OK

NOK

Through hole diameter

*1 The test speed of the insertion force shall be 25 to 50 mm/min. *2 The test speed of the retention force shall be 12 mm/min or less. *3 The retention force measurement shall be made for 24h or more after press-fitting pin insertion.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 34 (152)

Check No. II – 1 – 4 11


Items to check Mechanical strength characteristics of the press fitting pin

Applicable parts Press fitted pin

Range of use

Maximum displacement

Press fitting pin compliant area (flat area in the deformed section)

Load

Compression tool - (Compress using a semicircular cylinder tool designed in accordance with the diameter tolerance of the through hole)

Load

Deformation

Amount of elasticity recovery

Press fitting pin compression characteristics

ｒ

The elasticity recovery is stable for the entire operated range

Deformation and elasticity recovery characteristics in accordance with the maximum diameter of the through hole

Deformation and elasticity recovery characteristics in accordance with the minimum diameter of the through hole

Minimum displacement

OK

Points to check Conformity status Alternate if unreachable ! Check that the materials used for

the pin and through hole are adequate.

! Check that the internal diameter of the plated through hole and the tolerance for the outside diameter of the pin are adequate.

" The elasticity recovery shall be stable in the entire deformation range of the pin. (There shall be no reduction of elasticity recovery.)

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 35 (153)

Check No. II – 1 – 4 12


Items to check Damage of adjacent solder mounted parts

Applicable parts Solder mounted parts adjacent to the press fitting pin (including land)

Press fitting pin OUT side IN side Press fitting direction

Solder mounted part

Distance from the through hole center: 2.5 mm

OK

a a

a: Distance from the through hole center

Kept away 2.5 mm or more from the through hole center

NOK

Electrical part or land is located within 2.5 mm from the through hole center.

Press fitting pin

Points to check Reference value Criteria to be consulted separately ! Check that the solder mounted

parts are arranged with enough clearance to avoid damage due to the press fitting stress.

" Solder mounted parts or lands adjacent to the press fitting pin shall be kept away 2.5 mm or more from the press fitting pin center. (1)

" When press fitting, the strain gauge shall read 1500 µS or less at the area where solder mounted parts are located. (2)

# There shall be no cracks of the solder mounted parts originating from the press fitting before or after the durability testing.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 36 (154)

Check No. II – 1 – 4 13


Items to check Electrical characteristics of press fitting (insulation resistance)

Applicable parts Press fitting connection part

Testing m ethod: high tem perature-hum idity bias test +85°C/85% RH V = 14 V 1000 h

V = 50 V 1000 h

106Ω

Insulation resistance value V/1

Tim e

OK

106Ω

Insulation resistance value V/1

Tim e

NOK

Migration or CAF due to resistance dam age on the outer layer, etc.

A

I

V Pattern

Points to check Reference value Criteria to be consulted separately ! Check that the shape and the

dimensions of the press fitting pin and the finish diameter of the through hole are adequate.

Insulating property shall be satisfied with the maximum outside diameter of the pin and the minimum diameter of the through hole in the tolerance ranges at the following areas, including decrease in insulation performance, " There shall be no decrease in

insulation performance between through holes due to press fitting damage. (1)

" There shall be no decrease in insulation performance between through hole and pattern due to press fitting damage. (2)

# Conduct the migration and CAF test. The insulation resistance (at normal humidity) shall be 10E+6 Ω or more.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 37 (155)

Check No. II – 1 – 4 14


Items to check Mechanical strength characteristics of press fitting (durability retention force)

Applicable parts Press fitting connection part

Press fitting pin

Pushing out direction

Retention force (pushing out)

Tool for pushing out

*1 The test speed of the retention force shall be 12 mm/min or less. *2 The retention force measurement shall be made for

24h or more after the press fitting pin insertion. *3 Sampling time and number of cycles for durability

test: Specify the time within which the lower limit value of decrease in retention force due to stress relief after press fitting and the afterward transition shall be sampled.

20N

20%

0 10 50 100 500 1000

20N

20%

20N

20%

20N

20%

20N

20%

20N 20%

OK

OK

OK

NOK

NOK

NOK

Retention force is increased from the early stage.

Retention force decreases within 20% but increases afterward in comparison with the one at the early stage.

The retention force remains stable after decrease of within 20%.

Deterioration of 20% or more is observed with age.

Deterioration of 20% or more is observed during the durability test.

The retention force becomes 20N or less during the durability test.

0 10 50 100 500 1000

0 10 50 100 500 1000

0 10 50 100 500 1000

0 10 50 100 500 1000

0 10 50 100 500 1000

Points to check Reference value Criteria to be consulted separately

! Check that the materials used for pins and through holes are adequate.

! Check that the finish tolerances for the diameter of the through hole and the outside diameter of the pin are adequate.

" Check that the minimum contact load between the pin and the wall side of the through hole is secured adequately in the through hole for stabilization of electrical durability. (1)

" The lowest retention force 20N in the preceding clause shall ensure the lowest limit value of the contact load of (1). (2)

The following requirements shall be met for the entire range of the tolerances of the outside diameter of the pin and the diameter of the through hole (minimum to maximum tightening section of the pin): # Through the total range of deterioration

with age due to durability stress, the retention force shall remain 20N or more.

# Through the total range of deterioration with age due to durability stress, the decrease in retention force shall be within 20%.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 38 (156)


Items Electrical connection < Die bonding >

Items to check Status of silver paste

Applicable parts Die bonding (silver paste)


! Check the surface of the chip. (1) " Adherence of silver paste on the surface of the chip is unacceptable.

! Check the silver paste extrusions around the chip. (2)

" Silver paste’s height exceeding the height of the chip is unacceptable.

! Check the adherence of the silver paste on any other metal film.

" Adherence on an area other than the metal film is unacceptable.

(1) Unacceptable silver paste on the chip surface

(2) Unacceptable silver paste exceeding chip height

Silver paste

Die bond pad

Chip

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 39 (157)



Items to check Uncured silver paste status


0.05t < H < 0.5t (For the four sides)


! Check the shape of the uncured silver paste.

" Silver paste extrusions should be from 10% to 50% of the height of the chip.

Silver paste

Chip

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 40 (158)



Items to check Void


In the case of a device such as a power transistor for which heat radiation is required

Points to check Die bonding Alternate if unreachableElement requiring heat

radiation Other dies

! Check the dimensions of the soldered area

95% or more of the entire area of the chip. Entire outer circumference of the chip should be surrounded with silver paste.

50% or more of entire area of the chip. 75% of outer circumference of the chip should be surrounded with silver paste.

! Check for voids in the contacting surface

No void with a diameter exceeding 0.1 mm should be allowed

No void covering more than 10% of the area under the chip should be allowed

Silver paste

Circumference of chip

0.1 mm or less

Void

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 41 (159)



Items to check Die shear strength

Applicable parts Die bonding

Points to check Conformity status Alternate if unreachable ! Measure the die shear strength " The measured strength should be

in accordance with the requirements stated above.

Area of die [mm2]

Min

imum

stre

ngth

[k

gf]

Die Measurement

jig

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 42 (160)



Items to check Inclination of the chip



! Check the inclination of the chip " Any inclination over 10° should not be allowed.

10° or less Chip

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 43 (161)



Items to check Deviation of the chip



! Check the deviation between the chip and the die pad.

" Any deviation over 10° should not be allowed

10° or less

Chip

Die pad

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 44 (162)


Items Electrical connection < Wire bonding >

Items to check Bond shape (1)

Applicable parts Ball bond

(1) (2)


! Check the diameter of the ball bond W (1)

" The ball bond diameter should be between 200% to 500% of the wire diameter

! Check the location where the wire is rising from the ball. (2)

" The wire should be completely covered by the ball bound (top view).

NOK OK

D: Wire diameter W: Ball bond diameter

2D ≤ W ≤ 5D

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 45 (163)



Items to check Position of the pad and the ball bond (1)

Applicable parts Ball bond

(1) (2)


! Check the deviation of the ball bond from the bonding pad. (1)

" It should not be allowed that more than half of the bond surface is not over the pad.

" Any bond closer than 0.3mm from a metallic part is unacceptable.

! Check the intermetallic compounds. (2)

" Any intermetallic compound extending radially from the circumference of a ball bond is unacceptable.

OK

Intermetallic compound

NOKNOKOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 46 (164)




Applicable parts Tails bond (semi lunar bond)

D: Wire diameter W: Bond width L : Bond length

1.2 D ≤ W ≤ 5.0 D 0.5 D ≤ L ≤ 3.0 D


! Check the bond width W. (1) " The bond width should be between 120% to 500% of the wire diameter.

! Check the bond length L. (2) " The bond length should be between 50% to 300% of the wire diameter.

! Check the trace of the bonding tool (3)

" The trace of the bonding tool should cover entirely the width of the wire.

(1)

(3)

Top view

(2)

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 47 (165)



Items to check Position of the pad and the bond (2)

Applicable parts Tails bond (semi lunar bond)

Points to check Conformity status Alternate if unreachable ! Check the deviation of the bond. " It should not be allowed that more

than half of the bond surface is not over the pad.

" Any bond closer than 0.3 mm from a metallic part is unacceptable.

0.3 mm or more

Dimensions of application area S

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 48 (166)




Applicable parts Wedge bond

D : Wire diameter W : Bond width L : Bond length

1.5 D ≤ W ≤ 3.0 D 1.5 D ≤ L ≤ 5.0 D


! Check the bond width (1) " The width of the bond should be between 150% to 300% of the wire diameter

! Check the bond length (2) " The length of the bond should be between 150% to 500% of the wire diameter

(1)

(2)

Wire tail

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 49 (167)



Items to check Position of the pad and the bond (3)

Applicable parts Wedge bond

(1) (2)

D: Wire diameter W: Bond width L: Bond length

Tail length ≤ 2D


! Check the deviation of the bond. (1)

" It should not be allowed that more than half of the bond surface is not over the pad.

" Any bond closer than 0.3 mm from a metallic part is unacceptable.

! Check the wire tail. (2) " It should not be allowed for the wire tail to contact any metallic film not connected to the relevant wire neither to extend above a metal film.

" The length of the tail should not be more than 200% of the wire diameter or 250 µm.

Wire tail

Dimensions of the bond area S

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 50 (168)



Items to check Wire shape (1)

Applicable parts All wires (1) (2)

h ≥ 0.1 mm a ≥ 2 D (D: Wire diameter)


! Check the shape of the wire loop. (1)

" Excessive deflection, kinks, twisting or loosening of the wire are unacceptable.

! Check the height of the wire loop. (2)

" The height of the wire loop above the chip surface should be at least 0.1 mm. The wire should stay at least twice the wire diameter away from the chip surface.

NOK NOK NOK NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 51 (169)



Items to check Wire shape (2)

Applicable parts All wires (1)

Depth ≤41

D

D: Wire diameter

(2)

Points to check Conformity status Alternate if unreachable ! Check for damages on the wire.

(1,2) " Dent, cut, shrinkage, cracking or

recess bigger than 25% of the wire diameter are unacceptable. Flaws on the bond connection should not be accepted regardless of the depth.

! Check the course of the wires " Wires with different electrical potential should not cross.

Flaw

Recess

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 52 (170)



Items to check Tensile strength

Applicable parts Wire bonding

Points to check Conformity status Alternate if unreachable ! Tensile strength of the wires. " Au and Al wires should meet the

tensile strength requirements specified in the above diagram.

Au wire

Min

imum

bon

ding

stre

ngth

[g.m

.s-2

] M

inim

um b

ondi

ng s

treng

th [g

.m.s

-2]

Al wire

Wire diameter [µm]

Wire diameter [µm]

*The tensile strength is the minimum bonding strength which is determined by the breakage load solely used for lines AI and Au. The actual W/B strength is determined by the wire length, bonding location and test method, and in actual use, is higher than the values in the graph above.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 53 (171)

Check No. II – 1 – 6 10


Items to check Rupture mode

Applicable parts All wires

Points to check Conformity status Alternate if unreachable (1)

Mode name: Peeling of the 1st bond

There should be no peeling.

(2)

Mode name: Breakage of the neck on 1st bond side

The standard strength requirements should be met and occurrence rate should not be more than 50%.

(3)

Mode name: Midstream rupture of wire

The standard strength requirementsshould be met.

(4)

Mode name: Breakage of the neck on the 2nd bond side

The standard strength requirements should be met and occurrence rate should not be more than 50%.

(5)

Mode name: Peeling of the 2nd bond

There should be no peeling.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 54 (172)


Items Electrical connection < Conductive adhesive>

Items to check State of the joint between electrode and conductive adhesive

Applicable parts Part electrode and circuit board land


! Check that the contact angle (wetness) between the material of the electrodes, the filler and the base adhesive material (resin) are adequate.

" The requirements for the contact angle (wetness) between the materials of electrode / binder and material of filler / binder should be met.

! Check that the electrodes and the conductive adhesive are adequate.

" The resistance should be less than 50 mΩ before and after the durability tests.

Apply probe to this area

Conductive adhesive

Circuit board

Part electrode

Circuit board electrode

Circuit board electrode

Gauge: Milli-ohm gauge (HP 4338B, etc.)

Use a 4 wires measurement probe (Kelvin type). For measurement, 1µA is recommended to keep the insulation film from being damaged.

Do not apply a probe to this area. (It may damage the insulation film.)

* When there is a difference of wetness, binders will concentrate on the material with the highest wetness and will lowerthe conductivity because of contact between the electrode and the filler.

Binder (Filler is removed from conductive adhesive) Measured using contact

angle gauge a b

Electrode material

a

Filler material

b a >> b a << b

Electrode

Filler

Binder

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 55 (173)


Items Electrical connection < BGA, CSP >

Items to check BGA chip mounting process

Applicable parts BGA balls and packages

Printed circuit board BGA/CSP BGA ball

Printed solder paste Cu land

[Solder printing] [Mount] [Reflow heating]

Curing to melt

Interposer

Points to check Conformity status Alternate if unreachable ! Check that the assembly process

of the BGAs is adequate " The assembly process should be

as described above

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 56 (174)



Items to check Melting condition of the BGA balls


Inclination

Camber (The height of BGA balls at the side is greater)

Camber (Vertical diameter of the BGA ball at the center is greater.)

Height a

Size of package L

(1) Inclination and camber : W = (b – a)/L ≤ 5/1000

(2) Difference in height of the BGA ball : Дh = (c - d)/d ≤ 5/100

Height a

Height a Height b

Height b

Height b

Height c

Height c

Height c

Height d

Height d

Height d

Points to check Conformity status Alternate if unreachable ! Check that the melting of the BGA

balls and the solder paste are sufficient.

! Check that no strong residual stress remains for the package and the BGA balls.

" Inclination and camber of the package should be less than 0.5%. (1)

" The maximum difference of height between the BGA balls under a component package should be less than 5%. (2)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 57 (175)



Items to check Shape of the solder balls

Applicable parts BGA balls

d

(6) Voids in the BGA ball

Voids

(7) Stress lines

Stress lines(8) Cracking

Crack

(5) Incomplete melting of BGA ball and solder paste

Not completelymelted solder

(3) BGA ball is too large

(2) Offset of the land (mountingdisplacement)

(4) BGA ball is too small

d

Land (PCB side)

BGA ball Pattern

Land diameter φL

deformation d

Distance to adjacent land D

Land (package side)

(1) BGA ball deformed

d d

d

Joint diameter c

Points to check Conformity status ! Check if there is any design of

the land or mounting that is likely to cause distortion, deformation or cracking on the BGA ball, and deteriorate the reliability.

" The deformation d of the BGA balls (overhang from the land) should be less than 25% of the land diameter (φL) and less than 25% of the distance to adjacent land (D). (1)

" The deformation of the BGA balls caused by an offset of the land and by the displacement of mounting should be less than 5% of the land diameter (φL). (2)

" The protrusion from the land (d) should not exceed 25% of land diameter φL and should not exceed 25% of the distance to adjacent land (D). (3)

" The deformation d between the ball edge and the exterior of the land should not be less than 5% of land diameter (φL) and the BGA ball should not be smaller than 25% of the distance to adjacent land (D). (4)

" There should not be any poor melting of BGA ball or solder paste. (5) " There shall be less than 10% void in the BGA balls. (6) " No stress line or wrinkling should be seen on the surface of the BGA ball. (7) " There should be no cracking on the BGA ball. (8)

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 58 (176)



Items to check Package side connection design


(1) Cracks in the solder constricted section

(2) Cracks caused by a difference in the land diameter

BGA interposer (substrate)

BGA side land

Stress concentration id avoided by use of two lands with the same diameter. BGA side land

PCB side land

a

a

b

Solderi

PCB side land PCB


! Check for any design which may affect reliability or likely to cause cracks.

" Constrictions should be avoided, because it may cause cracks in the joint between the BGA ball and the BGA’s land.

" The specified requirements for the diameter of the land on the BGA (a) and the diameter of the land on the PCB (b) should be met. (Maximum 10% of difference between the two lands).

OK

NOK NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 59 (177)



Items to check Solder ball under the BGA


conductive foreign substance (ex :solder ball, etc...)

Distance between adjacent lands D

Size of the conductive foreign substance (ex :solder ball, etc...)


! Check that materials, process settings and facilities likely to reduce solder balls are provided.

" There should be no conductive foreign material (soldering ball, etc…) with a size greater than 10% of the distance between adjacent lands D.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 60 (178)



Items to check Extension of pattern from land

Applicable parts BGA ball land and wiring pattern

PCB land

Extension pattern

Resist opening

Tear drop-shaped

PCB top view

Without tear drop

Wiring width W

Wiring width at the border of resist opening L

L

Points to check Conformity status Alternate if unreachable ! Check that the extension pattern

design is not easy to disconnect. " The extension pattern design

should be tear-drop shaped and the width of the pattern L at the border of resist opening should be twice the extension pattern width W and at least 200 µm.

NOK

OK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 61 (179)


Items Environmental protection < BGA, CSP >

Items to check Underfill

Applicable parts Underfill

[Filling of underfill] [Filling of underfill completed and hardening]

Filling nozzle of under-fill material

Under-fill material

Fillet BGA package

BGA ball

PCB


! Underfill is mandatory for BGAs to ensure reliability

" Underfill should be provided.

! Check that material selection for the underfill is adequate.

" Glass transition point of the material used for under-fill (Tg) should be much higher than the temperature to which underfill is exposed (Tg>>Tf) peripheral temperature and self-heating).

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 62 (180)


Items Environmental protection < BGA, CSP >

Items to check Filling condition of the underfill

Applicable parts Underfill

Appropriate fillet Without void

OK (1) Void

(2) Excessive filling (3) Insufficient filling

Fillet length d


! Underfill is mandatory for BGA components.

! Check if the conditions of filling of the underfill.

" There should be no void between balls or no void making the ball uncovered. There should be no void bigger than 10% or more of the package area (total area of void). (1)

" There should be no excessive filling over the surface of the package. (2)

" There should be no insufficient filling (Length of fillet d should be at least 0.2 mm). (3)

OK

NOK

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 63 (181)


Items Assembly < Common >

Items to check Corrosion on Ag electrode by sulfurated gas

Applicable parts Corrosion-prone electrode (Ag electrode etc.)

Circuit board Land Soldering

Electrode

Adverse effect of corrosion gas on the Ag electrode may cause disconnection and increase in resistance, resulting in functional failure.

Gas

Corrosion on electrode

Growth of silver sulfide

[Mechanism of electrode disconnection] Corrosive gas reacts with the Ag electrode to form silver sulfide. Diffuse migration of Ag occurs while silver sulfide is growing outwards. The amount of the migration will result in void that could lead to disconnection. [Sources of gas generation] Consider not only atmospheric and exhaust gases but also gases emitted from the materials as corrosive gases. Cardboard and vulcanized rubbers are commonly-known materials.

Ni plating Sn platingAg paste

Registor

Overcoat glass

Inside Ag electrode

Cross sectional view of electrode structure

* H2S and SO2 are among the representative corrosive gases, and the following are reaction formulas for each of them.

[Oxygen is required for H2S reaction.] 4Ag + 2H2S + O2 → 2Ag2S + 2H2O

[Water is required for SO2 reaction.] SO2 + H2O → H2SO3 2Ag + H2SO3 → Ag2S + H2O + O2

Check point Reference value Index for individual consultation/Remarks

* Regardless of the check results, conduct the corrosive gas resistance test (36-00-802, CH12) to prove that no sign of corrosion is identified. * If any sign of corrosion is identified, estimate the remaining longevity to determine through individual consultation. * Determine the remaining longevity considering the corrosion rate to 0.5 µm/year and 25% of the initial thickness as longevity limit. * The 4th check point shall be verified subject to gas emission from an actual device.

! Check if the structure is designed so that the Ag electrode is not exposed.

" The structure shall be designed so that the Ag electrode is not exposed.

" If exposure is inevitable, conduct the corrosive gas resistance test (36-00-802, CH12, method 4) to prove that no sign of corrosion is identified.

" If any sign of corrosion is identified, estimate the remaining longevity to determine through individual consultation.

# Considering the corrosion rate to 0.5µm/year and 25% of the initial thickness as the longevity limit, determine the remaining longevity.

! Confirm that the exposed Ag electrode is protected by circuit board coating.

" Protect the Ag electrode with coating agent such as acrylic and rubber-based ones which gas permeability resistance is high. Coating agents with low gas permeability resistance such as silicon-based ones shall not be used.

! Confirm that the overcoat glass prevents the Ag electrode from being exposed.

" Prevention of Ag exposure shall be ensured in the resistor fabrication process.

# Determine whether there is no problem or not based on the actual results (installation position, destination etc) of the equivalent ECUs.

! Check if there are materials that emit sulfurous gas near the ECU in the same closed space.

" The ECU shall not be mounted in a closed space with materials that will emit sulfurous gas.

" If it is inevitable to mount the ECU under the above conditions, perform a corrosion test in a realistic mounting condition - with the ECU and the sulfurous gas emitting materials together in the test chamber. Check for any sign of corrosion on the Ag electrode.

# If any sign of corrosion is identified, determine the remaining longevity.

# The test conditions shall conform for the duration, temperature and humidity settings to the conditions of the corrosive gas resistance test (36-00-802, CH12, Method 4). Gas to which the ECU will be subject in real condition shall be emitted by the material.

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 64 (182)


Items Assembly

<Coating, Potting, Gel, Grease>

Items to check Defective conductivity of contact

Applicable parts Adhesive, sealant, sealing agent and grease


! Check that the type of adhesive, sealant, sealing agent and grease are adequate.

" Any material that could create bad contact failures should be avoided.

# When using silicone material, use an electrical and electronic material after removing the low molecular siloxane.

If silicone material is used, low molecular siloxane contained in the silicone evaporates and re-adheres to the joint of electronic parts such as relay, switch, etc. Silicone dioxide decomposed during the re-adherence is activated as an electrical insulating agent, and creates bad connection problems.

* Low molecular siloxane Silicone rubber including a high molecular material is low molecular siloxane (material of silicone rubber) prior to polymerization. For silicone rubber, non-polymerized low molecular siloxane remains and causes poor connection failures.

Relay contact

Area where conductivity is poor due to the adhesion of gas

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 65 (183)


Items Assembly


Items to check Potting using hard resin

Applicable parts Potted parts

Potting material (hard)

Lead Soldering

Circuit board

Void and residual flux (soft)

Land

Due to thermal expansion variation of the potting material, the solder joints are deformed and collapse in the areas where the potting material is not filled, like voids or the soft residual flux area, and makes shorts between the terminals.

Points to check Reference value Alternate if unreachable

! Check that the potting of the solder joints is adequate.

" Potting material shall be filled around the solder joints. There should be no void or flux residue.

! Check that the material for potting is appropriate.

" An appropriate potting material should be selected, taking into consideration the expansion variation properties.

# The potting should be validated with the thermal cycle tests.

Short may occur

NOK

RENAULT 36 - 00 - 012 / - - C

© RENAULT 2008 Page II - 66 (184)


Items Assembly


Items to check Coating material that has intruded under

the bottom of parts

Applicable parts Coating material

IC package body Terminal

Coating material

Soldering

Circuit board


Coating material

Soldering

Circuit board


Coating material

Soldering

Circuit board


Coating material

Soldering

Circuit board

Terminal

Soldering

Points to check Reference value Individual consultation indices

! Check that the material characteristics are according to the design.

" The conditions recommended by the material manufacturer shall be incorporated into the processing design.

! Check that the material characteristics are according to the design.

" Material that has been designed for longevity in consideration of the mechanical characteristics shall be selected.

" The sample test conditions used in the bench quality check shall be identical to the mass production manufacturing conditions. The bench quality check shall be identical to the mass production manufacturing conditions.

# Confirm that there are no abnormalities in the soldered joints with the thermal cycle tests.

NOK (1)

Excessive stress

Repeated stress

(2)

Generation of cracks in soldered sections

OK

Repeated stress

When coating material, that has been designed for longevity in consideration of mechanical characteristics, has been made under appropriate manufacturing conditions, it will not affect the soldered section of the terminals.

Generation of stress that causes terminals to peel

(1) Incompatible manufacturing conditions

(2) Inadequate design

Generation of stress that causes terminals to peel

Example:

There shall be no problem when the mechanical characteristics of the coating material satisfies the design values. However, when the design values are not met due to the manufacturing requirements, stress is generated in the terminal detaching direction, resulting in peeling of the terminal. * In particular, it is necessary to pay special attention to the hardening conditions of silicon rubber bases.

When the mechanical characteristics of the coating material has not been designed for longevity, cracks are generated before the end of the guarantee period, resulting in it either being electrically open or highly resistant.

Deformation of mechanical characteristics due to insufficient curing of the coating material

Documents

36-00-012C Design Review - Reliability