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323-1521-102 Nortel Networks OPTera Connect DX optical switch Circuit Pack Descriptions What’s inside... Circuit pack descriptions Standard Rel 6 Issue 1 April 2004

323-1521-102.r06 Circuit Pack Descriptions

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Nortel Optera DX Circuit Pack Descriptions (text and block diagrams describing functions)

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Page 1: 323-1521-102.r06 Circuit Pack Descriptions

323-1521-102

Nortel Networks

OPTera Connect DX optical switch Circuit Pack Descriptions

What’s inside...

Circuit pack descriptions

Standard Rel 6 Issue 1 April 2004

Page 2: 323-1521-102.r06 Circuit Pack Descriptions

Copyright 2000–2004 Nortel Networks, All Rights Reserved

The information contained herein is the property of Nortel Networks and is strictly confidential. Except as expressly authorized in writing by Nortel Networks, the holder shall keep all information contained herein confidential, shall disclose the information only to its employees with a need to know, and shall protect the information, in whole or in part, from disclosure and dissemination to third parties with the same degree of care it uses to protect its own confidential information, but with no less than reasonable care. Except as expressly authorized in writing by Nortel Networks, the holder is granted no rights to use the information contained herein.

Nortel Networks, the Nortel Networks logo, the Globemark, OPTera, and Preside are trademarks of Nortel Networks.

Printed in Canada and in the United Kingdom

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iii

Contents 0About this document v

Circuit pack descriptions 1-1Circuit pack LEDs 1-4

Optical interface circuit pack LEDs 1-5Quad T/R interfaces (NTCA33, NTCA36) 1-7HD OC-3 T/R interfaces (NTCA35AA, NTCA35AB) 1-13OC-12 half-height T/R interface (NTCA31B) 1-18OC-48 short reach T/R interface (NTCA30AL/CK) 1-22OC-48 long reach T/R interface (NTCA30AN) 1-26OC-48 DWDM T/R interface (NTCA30xK) 1-30Quad OC-48 T/R interfaces (NTWR31) 1-34Dual OC-48 short reach T/R interface (NTWR30AA) 1-38Dual OC-48 intermediate reach T/R interface (NTWR30BA) 1-41Dual OC-48 long reach T/R interface (NTWR30CA) 1-44STS-48 T/R electrical interface (NTCA34) 1-47Dual Gigabit Ethernet extended reach interface (NTCA90GA) 1-49Dual Gigabit Ethernet long reach interface (NTCA90CA) 1-55Dual Gigabit Ethernet short reach interface (NTCA90EA) 1-61OC-192 T/R interface (NTCA06) 1-67OC-192 DWDM TriFEC T/R interface (NTCF06) 1-74OC-192 short reach T/R interface (NTWR06AB) 1-78OC-192 intermediate reach T/R interface (NTWR06CA) 1-82OC-192 long reach T/R with APD interface (NTWR06B) 1-86OC-192 XR (NTCA04) 1-90OC-192 merged XR/WT (NTCF04) 1-94OC-192 DWDM transmit interface (NTCA01) 1-99OC-192 DWDM regenerator/transmit interface (NTCA03) 1-103OC-192 short reach receive interface (NTCA02) 1-106OC-192 demultiplexer (NTCA05) 1-110Switch module (NTCA26, NTCA24) 1-113MOR (NTCA11) 1-123MOR Plus (NTCA11) 1-129Partitioned OPC 1-134OPC controller (NTCA50) 1-136OPC interface (NTCA52) 1-139OPC storage (NTCA51AA and NTCA51AB) 1-142OPC removable media (NTCA53) 1-145Orderwire (NTCA47) 1-146

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iv Contents

Shelf controller (NTCA41) 1-146Maintenance interface (NTCA42) 1-151External synchronization interface (NTCA44, NTCE44) 1-155Message exchange (NTCA48) 1-160Parallel telemetry (NTCA45AA) 1-163Breaker/filter module (NTCA40AA) 1-166Fan module (NTCA85BA, NTCA85EA) 1-169Filler card (NTCA49/59) 1-172

OPTera Connect DX optical switch 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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v

About this documentThis document describes the OPTera Connect DX optical switch (referred to as OPTera Connect DX in this document) and OC-192 circuit packs.

AudienceThe following members of your company are the intended audience of this Nortel Networks technical publication (NTP):

• planners

• provisioners

• network administrators

• transmission standards engineers

Circuit Pack Descriptions 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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vi About this document

OPC User Interface Description

(323-1521-196)

NE User Interface Description

(323-1521-195)

TL1 Interface Description

(323-1521-190)

About the OPTeraConnect DX SONET

NTP Library(323-1521-090)

OPTera Connect DXSONET Planning and

Ordering Guide(NTRR10DG)

External Interface Configuration Procedures

(323-1521-302)

Performance Monitoring Procedures

(323-1521-520)

Trouble Clearing and Module Replacement

(323-1521-543)

Log Reference (323-1521-840)

Circuit Pack Descriptions(323-1521-102)

Gigabit EthernetData User Guide

(NTCA65YA)

Network Interworking Guide

(NTCA68CA)

SONET OrderwireUser Guide (NTCA66CA)

Managing andProvisioninga Network

Maintaining andTroubleshooting

a Network

Installing,Commissioning andTesting a Network

Supportingdocumentation for the OPTera Connect DX SONET Library

Installation Procedures

(323-1521-201)

SONET NetworkElement Deployment

Guide(NTCA67CG)

Powering up and Commissioning

Procedures(323-1521-220)

SystemCommissioning andTesting Procedures

(323-1521-222)

User Interface Connection Procedures

(323-1521-301)

Data Administration Procedures

(323-1521-304)

SoftwareAdministration

Procedures(323-1521-303)

Security Management Procedures

(323-1521-305)

Provisioning and Operations Procedures

(323-1521-310)

Protection Switching Description

and Procedures(323-1521-311)

OPTera Connect DX SONET NTP Library

Planning aNetwork

NetworkInteroperability Guide

(NTCA68CB)

Application Guide forOPTera Connect DXusing OPTera Metro

5200 OFA(NTCA69ZB)

Change ApplicationProcedures

(CAPs)

OC-3/OC-12 NE TBMNTP Library

OC-48 DWDMTributary Application

Note(NTRR12AC)

OC-48 Lite MultiplexerNTP Library

OC-48 NTP Library

OPTera Long Haul1600 NTP Library

OPTera MetroConnect SONET

User Guide(NTCA69XA)

Optical NetworksApplications Library

Presidedocumentation

Data CommunicationsNetwork Planning

Guide(NTR710AM)

OPTera Connect DX optical switch 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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About this document vii

ReferencesThis document refers to the following Nortel Networks technical publications (NTPs) that are specific to the OPTera Connect DX NTP Library:

• SONET Planning and Ordering Guide NTRR10DG

This document refers to the following supporting documentation:

• OC-48 DWDM Tributary Application Note (NTRR12AC)

• Optical Networks Applications Library (NTCA66BA)

• OPTera Long Haul 1600 Release 7 Repeater NE Network Application Guide (NTY316AG)

Circuit Pack Descriptions 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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viii About this document

OPTera Connect DX optical switch 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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1-1

Circuit pack descriptions 1-This chapter describes the circuit packs that are supported in the OPTera Connect DX and OC-192 network elements, and Regenerators (Regens). Each description includes a functional block diagram and a mechanical view of the circuit pack.

In the circuit pack descriptions contained in this chapter, the ‘transmit direction’ is from line to tributary. The ‘receive direction’ is from tributary to line.

Note: References to ‘OC-192 network elements’ in this chapter are to OC-192 network elements running OPTera Connect DX software.

Table 1-1 lists the circuit packs supported in the OPTera Connect DX and OC-192 network elements and Regenerators. For a full description of the variants of each circuit pack supported in the OPTera Connect DX network element, refer to SONET Planning and Ordering Guide NTRR10DG . For a full description of the variants of each circuit pack supported on the OC-192 network element and Regenerator, refer to SONET Planning and Ordering Guide NTRR10DG.

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1-2 Circuit pack descriptions

Table 1-1Summary of circuit pack usage

Circuit pack PEC OPTera Connect DX

OC-192 Regen Page

Tributaries

Quad OC-3 transmit/receive (T/R) interface with one SDCC

NTCA33B � � 1-7

Quad OC-3 T/R interface with four SDCC NTCA33C � 1-7

Quad OC-12 T/R interface with one SDCC NTCA36B � � 1-7

Quad OC-12 T/R interface with four SDCC NTCA36C � 1-7

Hexadeca (HD) OC-3 T/R interface with 0 SDCC NTCA35AA � 1-13

HD OC-3 T/R interface with 16 SDCC NTCA35AB � 1-13

OC-12 half-height T/R interface NTCA31B � 1-18

OC-48 short reach T/R interface NTCA30AL/CK � � 1-22

OC-48 long reach T/R interface NTCA30AN � � 1-26

OC-48 DWDM T/R interface NTCA30xK � � 1-30

Quad OC-48 short reach T/R interface NTWR31AB � 1-34

Quad OC-48 intermediate reach T/R interface NTWR31BA � 1-34

Dual OC-48 short reach T/R interface NTWR30AA � 1-38

Dual OC-48 intermediate reach T/R interface NTWR30BA � 1-41

Dual OC-48 long reach T/R interface NTWR30CA � 1-44

STS-48 electrical T/R interface NTCA34 � � 1-47

Dual Gigabit Ethernet (GE) long reach (ZX) interface

NTCA90GA � � 1-49

Dual Gigabit Ethernet (GE) long reach (LX) interface

NTCA90CA � � 1-55

Dual GE short reach (SX) interface NTCA90EA � � 1-61

Line

OC-192 T/R interface NTCA06 � 1-67

OC-192 DWDM triple forward error correction (TriFEC) T/R interface

NTCF06 � 1-74

OC-192 short reach T/R interface NTWR06AB � 1-78

OC-192 intermediate reach T/R interface NTWR06CA � 1-82

OC-192 long reach T/R with Avalanche Photo Diode (APD) interface

NTWR06Bx � 1-86

OC-192 XR interface NTCA04 � 1-90

OC-192 merged XR/WT interface NTCF04 � 1-94

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Circuit pack descriptions 1-3

OC-192 DWDM transmit interface NTCA01 � 1-99

OC-192 DWDM Rg/Tx interface NTCA03 � 1-103

OC-192 short reach receive interface NTCA02 � 1-106

OC-192 demultiplexer NTCA05 � 1-110

Switch modules

DX65 switch module NTCA26AA � 1-113

DX100 switch module NTCA26BA � 1-113

DX140 switch module NTCA26CA � 1-113

DOS switch module NTCA24 � 1-113

MOR and MOR Plus circuit packs

MOR NTCA11AKNTCA11BKNTCA11CK

1-123

MOR plus NTCA11NKNTCA11PKNTCA11JKNTCA11KK

1-129

Control shelf

OPC controller NTCA50BA � � � 1-136

OPC interface NTCA52AA � � � 1-139

OPC storage NTCA51AANTCA51AB

� � 1-142

OPC removable media NTCA53AANTCA53BA

1-145

Orderwire NTCA47AA � � � 1-146

Shelf controller NTCA41BANTCA41CA �

1-146

Maintenance interface (MI) NTCA42AANTCA42BA

1-151

1.544 Mbit/s External synchronization interface (ESI)

NTCA44AA � � 1-155

2 Mbit/s/2 MHz External synchronization interface (ESI)

NTCE44AA � 1-155

2 MHz External synchronization interface (ESI) NTCE44BA � � 1-155

Message exchange (MX) NTCA48AA � � � 1-160

Table 1-1 (continued)Summary of circuit pack usage

Circuit pack PEC OPTera Connect DX

OC-192 Regen Page

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1-4 Circuit pack descriptions

Circuit pack LEDsTwo or more LEDs are present on each OPTera Connect DX circuit pack to indicate the status of the circuit pack. A green LED indicates that the circuit pack is active and a red LED indicates a failure (an “Autoprovisioning mismatch” alarm can also turn the red LED on).

See Figure 1-1 for the circuit pack LED symbols.

Red LED Each circuit pack has a red LED. When on, the red LED indicates that there is a provision mismatch or the circuit pack is partially or completely failed. The red LED turns off when the circuit pack is out of service.

Yellow LEDOnly circuit packs that receive a signal external to the shelf (for example the OC-192 T/R interface) have a yellow LED. When on, the yellow LED indicates a loss of signal (LOS) condition on the circuit pack where the signal terminates. The facility state has an effect on the yellow LED. When the facility is out of service, the yellow LED turns off.

Parallel telemetry NTCA45AA � � � 1-163

Breaker/filter module NTCA40AANTCA40BA �

� � 1-166

Fan module NTCA85BANTCA85EA �

� � 1-169

Filler card (transport shelf - tributary or line) NTCA49AA � � 1-172

Filler card (double-width switch module slot) NTCA49AB � 1-172

Filler card (single, half-height) NTCA49AC � 1-172

Filler card (Control shelf) NTCA59AA � � � 1-172

CAUTIONRisk of service interruptionDo not take any trouble clearing actions based only on the LED states. Always review the active alarms and follow the required alarm-clearing procedures. Before you remove a circuit pack, use the NE UI to make sure that the circuit pack does not carry any live traffic.

Table 1-1 (continued)Summary of circuit pack usage

Circuit pack PEC OPTera Connect DX

OC-192 Regen Page

OPTera Connect DX optical switch 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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Circuit pack descriptions 1-5

Note: For the Dual GE circuit pack, when the yellow LED is on this indicates an LOS condition or auto-negotiation issue.

Green LEDWhen on, this LED indicates the service providing status of the circuit pack. Normally the green LED is off when the red LED is on. If there is an unprotected failure on the circuit pack, both the green and red LEDs are on.

Figure 1-1Circuit pack LED symbols for OPTera Connect DX bay

F3189

Optical interface circuit pack LEDsTable 1-2 lists the number of LEDs on optical interface circuit packs.

Each optical interface circuit pack, except the HD OC-3 circuit pack, includes the following LEDs:

• one red LED

• one green LED

• one yellow LED for each port

Table 1-2Number of LEDs on optical interface circuit packs

Circuit pack Number of LEDs

Dual GE 4

Quad OC-3 6

HD OC-3 6

Quad OC-12 6

OC-48 3

STS-48 3

Dual OC-48 4

Quad OC-48 6

OC-192 T/R 3

Yellow

Red

Green

FW-3189

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1-6 Circuit pack descriptions

The HD OC-3 circuit pack includes the following LEDs:

• two yellow LEDs (one yellow LED for ports 1 though 8, and one yellow LED for ports 9 through 16)

Note: When on, a yellow LED indicates that at least one of the 8 corresponding ports has an LOS.

• 2 green circular LEDs that indicate the status of receive traffic only (one green circular LED for ports 1 through 8, and one green circular LED for ports 9 through 16)

Note: When on, a green circular LED indicates that at least one of the 8 corresponding ports is in service and carrying traffic.

• one green rectangular LED that indicates the service providing status of the circuit pack.

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Circuit pack descriptions 1-7

Quad T/R interfaces (NTCA33, NTCA36) The Quad transmit/receive (T/R) interfaces include:

• four low-speed interface circuits for processing SONET based traffic

• a backplane interface circuit, which interfaces the tributaries with the switch modules

• a distributed processing control architecture

The main transport shelf (and the extension shelf on the OPTera Connect DX bay) can contain the following types of Quad circuit pack:

• Quad OC-3 T/R interface (NTCA33Bx) with one section data communications channels (SDCC)

• Quad OC-3 T/R interface with four SDCC (NTCA33Cx)

• Quad OC-12 T/R interface with one SDCC (NTCA36Bx)

• Quad OC-12 T/R interface with four SDCC (NTCA36Cx)

Note: The Quad OC-3 and Quad OC-12 circuit packs operate as Class 1 laser devices (IEC hazard level 1).

The NTCA33, and NTCA36 interfaces have a vertically mounted handling tray that provides access to the optical fiber connections for connector cleaning.

The Quad OC-3 and Quad OC-12 interfaces with one SDCC (NTCA33B and NTCA36B) support SDCC on port 1 and line DCC (LDCC) on port 2. The Quad OC-3 Quad OC-12 interfaces (NTCA33C and NTCA36C) supports SDCC on all four ports and line DCC (LDCC) on port 1.

In OPTera Connect DX and OC-192 network elements running OPTera Connect DX Release 4 or earlier, circuit packs NTCA33C and NTCA36C provide SDCC on port 1 only. In OPTera Connect DX and OC-192 network elements running OPTera Connect DX Release 4.1 or later, circuit packs NTCA33C and NTCA36C provide SDCC on all four ports.

The Quad T/R interface circuit pack performs the following functions:

• provide OC-12 or OC-3 transmit and receive facility terminations

• process overhead

• perform performance monitoring

• synchronize data to shelf timing

Figure 1-2 and Figure 1-3 show functional block diagrams for the Quad optical interface circuit packs. Figure 1-4 shows an external view of a Quad optical interface circuit pack. Except for the identification label, both types of Quad optical interface circuit pack have the same external appearance.

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1-8 Circuit pack descriptions

Transmit directionThe bidirectional backplane interface (BIBI) receives data inputs from switch module A or switch module B, depending on which is active. Each input consists of four 622 Mbit/s data streams. Switch modules A and B form a working and protection pair.

The BIBI divides the 311 MHz backplane clock down to 19 MHz and uses this as reference for the phase-locked loop (PLL). The PLL contains a 155 MHz voltage-controlled crystal oscillator (VCXO) that provides 19 MHz and 39 MHz timing for the circuit pack. The BIBI demultiplexes the 622 Mbit/s serial data streams down to byte-wide 78 Mbit/s data streams for four STS-3 or STS-12 channels.

The BIBI passes the byte-wide 78 Mbit/s data to each of the four overhead processor and synchronizer (OOPS) circuits together with a 78 MHz clock. The OOPS inserts the line and section overhead.

Following overhead processing, the OOPS scrambles the data to remove long sequences of 1’s or 0’s, and outputs the data as:

• eight 78 Mbit/s data streams (STS-12 interface circuit packs)

• eight 19 Mbit/s data streams (STS-3 interface circuit packs)

Each OOPS passes the tributary data to an associated tributary interface circuit.

The electro-optical interface (EOI) circuits perform electrical to optical conversion. Each EOI contains the following circuits:

• A SONET transmit interface (STX) multiplexes the parallel data from the OOPS into a serial data stream. The serial output is:

— 622 Mbit/s for the OC-12 interface circuit packs

— 155 Mbit/s for the OC-3 interface circuit packs

• A laser driver accepts the data stream and generates a modulation current to drive the laser diode module (LDM). The laser driver provides a bias current to maintain the LDM at the correct bias threshold.

• The LDM converts the electrical data stream into an amplitude modulated optical output for transmission.

Receive directionThe photodiode module (PDM) in the EOI converts the incoming optical signal into an electrical signal. For OC-3 interfaces, the incoming signal is 155 Mbit/s. For OC-12 interfaces the input is at 622 Mbit/s. The PDM drives a post amplifier through a low pass filter, which limits the bandwidth of the receive channel. The SONET receive interface (SRX) demultiplexes the signal

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Circuit pack descriptions 1-9

into a byte-wide parallel output with a recovered clock and parity. For the OC-3 optical interfaces the byte-wide parallel output is at 19 Mbit/s. For the OC-12 optical interfaces, the parallel output is at 78 Mbit/s.

Each OOPS receives the signal from the EOI. The main functions of the OOPS are as follows:

• synchronize the incoming optical fiber data to system (shelf) timing

• terminate and process the transport overhead

• monitor the path overhead

• pass the output as 78 Mbit/s byte-wide data to the BIBI

Note: This output is 78 Mbit/s byte-wide for all versions of the circuit pack. The Quad OC-3 interfaces use only 25% of the data.

The BIBI multiplexes the incoming byte-wide data from the four OOPS circuits to four 622 Mbit/s serial data streams. The BIBI produces two groups of four 622 Mbit/s outputs. One group goes to switch module A and the other to switch module B. The OOPS then sends the data to the switch modules by way of the shelf backplane.

Support circuitsFour circuits support the Quad OC-12 and Quad OC-3 T/R interfaces, they are as follows:

• the EOI controller

• the transport control subsystem, second generation (TCS+)

• the phase-locked loop (PLL)

• the point-of-use power supply (PUPS)

The EOI controller subsystem monitors control signals from the Rx and Tx channels. The EOI controller also provides status and alarm information to the TCS+ processor through a synchronous serial peripheral interface (SPI).

The TCS+ provides performance monitoring, fault handling, propagation of status information to the shelf controller, and circuit pack provisioning.

The PLL uses the backplane clock to the BIBI to produce the 19 MHz clock.

The PLL provides system timing to the circuit pack. The PUPS uses the –48 V battery voltage from the shelf to produce the supplies required by the Quad T/R interface.

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1-10 Circuit pack descriptions

Figure 1-2Quad OC-3 T/R optical interface block diagram

DX1382_SONET

Laserdriver

EOI 1

STX

EOI controller

Analog MUX

OC-3

OC-3

OC-3

OC-3

OC-3

OC-3

OC-3

OC-3

TCS+

Tobackplane

OOPS 1

BIBI

Tx data8

8

SPI

Tx data 1Data 1Data 3Data 2Data 4

A

Rx data 1 Rx data

Laserdiode

module

622M

bit/s

dat

a fr

om th

e S

witc

h M

odul

es62

2Mbi

t/s d

ata

to th

e S

witc

h M

odul

es

Tx data 2Data 1Data 3Data 2Data 4

B

Rx data 2

Boardpowerrails

Tx data 3Data 1Data 3Data 2Data 4

A

Rx data 3

Tx data 4Data 1Data 3Data 2Data 4

B

Rx data 4

OOPS 3

Tx data

Rx data

OOPS 4

PUPSLegend

Tx data

Rx data

Laserdriver

EOI 2

STX

SRX

Laserdriver

EOI 3

STXLaserdiode

module

EOI 4

STX

SRX

Laserdiode

module

DC to DCconverter

+5.0V-48V

BATRET+3.3V

-4.5V

8

8

19 Mbit/s

8

19 Mbit/s

8

8

8

8

19 Mbit/s

819 Mbit/s

19 Mbit/s

8

19 Mbit/s

19 Mbit/s

8

19 Mbit/s

78 Mbit/s

78 Mbit/s

8

8

78 Mbit/s

78 Mbit/s

8

8

78 Mbit/s

78 Mbit/s

78 Mbit/s

78 Mbit/s 155 Mbit/s

155 Mbit/s

155 Mbit/s

ClampPLL

155 MHzVCXO

Bi-directional backplane interfaceElectro-optical interfaceLow passOC-3 overhead processor and synchronizerPhase-locked loopPoint-of-use power supplySONET receive interfaceSONET transmit interfaceTransport control subsystem, 2nd generationVoltage controller crystal oscillator

BIBIEOILPOOPSPLLPUPSSRXSTXTCSVCXO

==========

Laserdriver

LPfilter

Postamp

Photodiode

module

LPfilter

Postamp

Photodiode

module

LPfilter

Postamp

LPfilter

Postamp

SRX

155 Mbit/s

155 Mbit/s

155 Mbit/s

155 Mbit/s

Photodiode

module

SRX

Laserdiode

module

Photodiode

moduleCLK1

CLK1

CLK2

CLK2

311 MHz

311 MHz

311 MHz

311 MHz

OOPS 2

Tx data

Rx data

OPTera Connect DX optical switch 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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Circuit pack descriptions 1-11

Figure 1-3Quad OC-12 T/R optical interface block diagram

DX1381_SONET

Laserdriver

EOI 1

STX

EOI controller

Analog MUX

OC-12

OC-12

OC-12

OC-12

OC-12

OC-12

OC-12

OC-12

TCS+

Tobackplane

OOPS 1

BIBI

Tx data8

8

SPI

Tx data 1Data 1Data 3Data 2Data 4

A

Rx data 1 Rx data

Laserdiode

module

622M

bit/s

dat

a fr

om th

e S

witc

h M

odul

es62

2Mbi

t/s d

ata

to th

e S

witc

h M

odul

es

Tx data 2Data 1Data 3Data 2Data 4

B

Rx data 2

Boardpowerrails

Tx data 3Data 1Data 3Data 2Data 4

A

Rx data 3

Tx data 4Data 1Data 3Data 2Data 4

B

Rx data 4

OOPS 3

Tx data

Rx data

OOPS 4

PUPSLegend

Tx data

Rx data

Laserdriver

EOI 2

STX

SRX

Laserdriver

EOI 3

STXLaserdiode

module

EOI 4

STX

SRX

Laserdiode

module

DC to DCconverter

+5.0V-48V

BATRET+3.3V

-4.5V

8

8

78 Mbit/s8

8

78 Mbit/s

78 Mbit/s8

878 Mbit/s

78 Mbit/s8

8

78 Mbit/s

78 Mbit/s8

8

78 Mbit/s

78 Mbit/s

78 Mbit/s

8

8

78 Mbit/s

78 Mbit/s

8

8

78 Mbit/s

78 Mbit/s

78 Mbit/s

78 Mbit/s 622 Mbit/s

622 Mbit/s

622 Mbit/s

622 Mbit/s

622 Mbit/s

622 Mbit/s

622 Mbit/s

ClampPLL

155 MHzVCXO

Bi-directional backplane interfaceElectro-optical interfaceLow passOC-12 overhead processor and synchronizerPhase-locked loopPoint-of-use power supplySONET receive interfaceSONET transmit interfaceTransport control subsystem, 2nd generationVoltage controller crystal oscillator

BIBIEOILPOOPSPLLPUPSSRXSTXTCSVCXO

==========

Laserdriver

LPfilter

Postamp

Photodiode

module

LPfilter

Postamp

Photodiode

module

LPfilter

Postamp

LPfilter

Postamp

SRX

622 Mbit/s Photodiode

module

SRX

Laserdiode

module

Photodiode

moduleCLK1

CLK1

CLK2

CLK2

311 MHz

311 MHz

311 MHz

311 MHz

OOPS 2

Tx data

Rx data

Circuit Pack Descriptions 323-1521-102 Rel 6 Iss 1 Standard Apr 2004

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1-12 Circuit pack descriptions

Figure 1-4Quad T/R optical interface circuit pack (external view)

DX0410

QUADOC-12STM-4T/R

Opticalconnectors

Carrierhandle

Fiber carrier

Dual fibercables

1234

3OUT IN

4OUT IN

1-2 3-4

QUAD

OC-12

STM-4

T/R

1234

4OUT IN

3OUT IN

Latch

Latch

Front viewSide view

Carrierhandles

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Circuit pack descriptions 1-13

HD OC-3 T/R interfaces (NTCA35AA, NTCA35AB)Note: The hexadeca (HD) transmit/receive (T/R) interface circuit pack is used in OPTera Connect DX bays only.

The HD OC-3 T/R interface is a high density, tributary circuit pack that can process up to 16 facilities at OC-3 rates, allowing access to 2.5 Gbit/s of bandwidth.

The shelf can contain the following types of HD circuit pack.

• HD OC-3 T/R optical interface (NTCA35AA):

This circuit pack does not support SDCC, unidirectional path switched ring (UPSR) configuration, and intermediate path performance monitoring (IPPM).

• HD OC-3 T/R optical interface with 16 section data communications channels (SDCC) (NTCA35AB):

This circuit pack supports SDCC, unidirectional path switched ring (UPSR) configuration, and intermediate path performance monitoring (IPPM).

Figure 1-5 shows an interface block diagram of the HD OC-3 T/R optical interface (NTCA35AA). Figure 1-6 shows an interface block diagram of the HD OC-3 T/R optical interface with 16 SDCC (NTCA35AB). Figure 1-7 shows an external view of an HD OC-3 T/R optical interface.

Transmit directionThe backplane receiver (BPR) in the bidirectional backplane interface (BIBI) receives two sets of four STS-12 data streams one from switch module A and the other from switch module B, depending on which switch module is active.

Switch modules A and B form a working and protection pair. Each STS-12 data stream is accompanied by two 311 MHz clock signals. The BPR divides the 311 MHz backplane clock down to 19 MHz and uses this as reference for the on-board 155.52 MHz phase-locked loop (PLL).

The BPR locates the frame boundary in the incoming data, performs interchip integrity checking and then unscrambles the incoming data. The BIBI outputs four byte-wide STS-12 data streams at 78 Mbit/s.

The PLL contains an on-board 155 MHz voltage-controlled crystal oscillator (VCXO) and provides 38 MHz and 622 MHz timing for the circuit pack.

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1-14 Circuit pack descriptions

The BIBI passes the four byte-wide 78 Mbit/s data streams to the HEX ASIC. Within the HEX ASIC, each OC-3 Tx circuit demultiplexes the 78 Mbit/s STS-12 data from the BIBI down to 19 Mbit/s for the Tx framer. The framer then formats the data into a SONET frame and inserts the section and line overhead.

Each of the 16 serial Tx output streams pass to the daughter card. The optical daughter card translates the scrambled serial NRZ STM-1 signal to a 1310 nm optical signal.

Receive directionIn each of the 16 OC-3 optical interfaces, 16 optical modules receive the optical signal and converts it to a serial STS-3 NRZ signal. Each of these signals connects to the mother board HEX ASIC.

In the optical interface circuit packs, each Rx circuit receives the signal from the EOI. The main functions of the Rx circuit are as follows:

• synchronize the incoming optical fiber data to system (shelf) timing

• terminate and process the transport overhead

• monitor the path overhead

• pass the output as 78 Mbit/s byte-wide data to the BIBI

The first stage of the HEX ASIC Rx circuit performs clock and data recovery on the inputs from the 16 optical serial data streams. The deserialized and decoded data is passed to the SONET Rx framer, which locates the SONET frame and extracts the section and line overhead. The path overhead is monitored, but passed through unchanged. The circuit then performs write and read pointer processing and calculates bit interleave parity (BIP).

The BIBI converts the incoming byte-wide data from the HEX ASIC to four 622 Mbit/s serial data streams. The BIBI produces two groups of four 622 Mbit/s outputs. One group goes to switch module A and the other to switch module B. The backplane drivers (BPD) of the BIBI then sends the data to the switch modules by way of the shelf backplane.

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Circuit pack descriptions 1-15

Figure 1-5HD OC-3 T/R optical interface block diagram

DX2987_R3_SON

622M

bit/s

data

and 3

11 M

Hz c

lock

s to/fro

m the S

witch M

odule

s

Boardpowerrails

PUPS

DC to DCconverter

+5.0V-48V

BATRET+3.3V

+1.8V

8

8

8 EOI-1

BIBI

EOI-16

OC-3opticaloutput

OC-3opticalinput

2

311 MHz

311 MHz

4

4

2

78 MHz

155.52 MbitsNRZ Tx data

155.52 MbitsNRZ Rx data

8

8

2

8

8

78 MHz

Da

taC

lock

BPRSTS-3

Tx framer FIF

O

Clockgeneration

622 Mbit/s

622 Mbit/s

8

8

8

8

78 MHz

Da

ta

BPD Clockgeneration

BIP

CD

RSTS-3Rx framer

Clo

ck

8 STS-3 Rx/Tx

TCS

Clamp

16 channels

PLL

155 MHzVCXO

2

Tobackplane

1:4

4:1

1:4

4:1

Legend= Bi-directional backplane interface= Bit interleaved parity= Backplane driver= Backplane receiver= Clock data recovery= Electro-optical interface= First-in first-out= Low pass

BIBIBIPBPDBPRCDREOIFIFOLP

= Phase-locked loop= Point-of-use power supply= Transport control subsystem= Voltage controller crystal oscillator

PLLPUPSTCSVCXO

Lasermodule

Optical Rxmodule

SDSignal detect

16 OC-3 Optical line interfaces

HEX ASIC

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1-16 Circuit pack descriptions

Figure 1-6HD OC-3 T/R optical interface with 16 SDCC block diagram

DX4707p

622M

bit/s

dat

a an

d 31

1 M

Hz

cloc

ks to

/from

the

Sw

itch

Mod

ules

Boardpowerrails

PUPS

DC to DCconverter

+5.0V-48V

BATRET+3.3V

+1.8V

8

8

8 EOI-1

BIBI

EOI-16

OC-3opticaloutput

OC-3opticalinput

2

311 MHz

311 MHz

4

4

2

78 MHz

155.52 MbitsNRZ Tx data

155.52 MbitsNRZ Rx data

8

8

2

8

8

78 MHz

Dat

aC

lock

BPRSTS-3

Tx framer FIF

O

Clockgeneration

622 Mbit/s

622 Mbit/s

8

8

8

8

78 MHz

Dat

a

BPD Clockgeneration

BIP

CD

RSTS-3Rx framer

Clo

ck

8

2 2 2 2

2 2 2 2

STS-3 Rx/Tx

TCS

Clamp

16 channels

PLL

155 MHzVCXO

2

Tobackplane

1:4

4:1

1:4

4:1

Legend= Bi-directional backplane interface= Bit interleaved parity= Backplane driver= Backplane receiver= Clock data recovery= Electro-optical interface= First-in first-out

BIBIBIPBPDBPRCDREOIFIFO

= Line data communications channel= Low pass= Phase-locked loop= Point-of-use power supply= Section data communications channel= Transport control subsystem= Voltage controller crystal oscillator

LDCCLPPLLPUPSSDCCTCSVCXO

Lasermodule

Optical Rxmodule

SDSignal detect

16 OC-3 Optical line interfaces

HEX ASIC

RSDCC+clk

TSDCC+clk

RLDCC+clk

TLDCC+clk

Line/section interface

SDCC processing LDCC processing

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Circuit pack descriptions 1-17

Figure 1-7HD OC-3 T/R optical interface circuit pack (external view)

DX2655p

Optical connector(Output) Port #2

Optical connector(Input) Port #2

Optical connector(Output) Port #1

Optical connector(Input) Port #1

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1-18 Circuit pack descriptions

OC-12 half-height T/R interface (NTCA31B)Note: The half-height T/R interface is used in the OC-192 bays only.

The OC-12 transmit/receive (T/R) interface is a low-speed T/R tributary interface. The OC-12 T/R interface circuit pack performs the following functions:

• provide OC-12 transmit and receive facility terminations

• process overhead

• synchronize data to shelf timing

Figure 1-8 shows a functional block diagram. Figure 1-9 shows an external view of the OC-12 T/R interface circuit pack.

Transmit directionIn the transmit direction, the backplane receive (BPR) interface receives 622 Mbit/s data from the switch module and demultiplexes it to byte-wide 78 Mbit/s. The overhead processor and synchronizer (OOPS) receives the data, and processes line and section overhead.

The BPR divides the 311 MHz backplane clock to 19 MHz and uses this as a reference for the phase-locked loop (PLL) in the backplane driver (BPD).

The electro-optical interface (EOI) receives the signal from the overhead processor and synchronizer (OOPS). The EOI contains the following circuits:

• SONET transmit (STX) multiplexes the 78 Mbit/s byte-wide data from the OOPS into a 622 Mbit/s, STS-12 data stream

• a laser driver in the laser module accepts the data stream and generates a modulation current to drive a laser diode (the laser driver provides a bias current to maintain the laser diode at the correct threshold)

• the LDM converts the electrical data stream into an amplitude modulated OC-12 optical output for transmission

Receive directionIn the receive direction, the photodiode module in the EOI converts the incoming OC-12 optical signal into an STS-12 electrical signal at 622 Mbit/s. The SONET receive (SRX) demultiplexes the signal into byte-wide 78 Mbit/s parallel output with a recovered clock and parity.

The OOPS receives the byte-wide data from the EOI, processes transport overhead, and passes the signal to the backplane driver (BPD). The BPD multiplexes the data to 622 Mbit/s and sends it to the switch module by way of the shelf backplane.

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Circuit pack descriptions 1-19

Support circuitsThree circuits support the OC-12 T/R interface:

• the electro-optical controller (EOC)

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The EOC monitors control signals from the Rx and Tx channels. The EOC also interfaces with the TCS processor through a serial interface.

The TCS provides communication between the shelf controller and the OC-12 T/R interface. The TCS also generates alarms and activates the light-emitting diodes (LEDs) on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-12 T/R interface.

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1-20 Circuit pack descriptions

Figure 1-8OC-12 T/R interface block diagram

DX1374_SONET

OOPS

STX8

PUPS

TCS

-48 V+3.3 V

+5 V

OC-12

Legend:

Lasermodule

To/fromshelf controller

To/from EOC

From switchmodules A and B

To switchmodules A and B

BPD =BPR =EOC =EOI =

OOPS =PUPS =

SRX =STX =TCS =

Backplane DriverBackplane ReceiveElectro-Optical ControllerElectro-Optical InterfaceOverhead Processor and SynchronizerPoint-of-Use Power SupplySONET ReceiveSONET TransmitTransport Control Subsystem

SRX

EOC

OC-12Photodiode

module

Active (green)

Optical signalfail (yellow)Fail (red)

8

622 Mbit/s

311 MHz Clk 622 Mbit/s

622 Mbit/s

78 Mbit/s 78 Mbit/s

8

78 Mbit/s

8

78 Mbit/s

A

B622 Mbit/s

311 MHz Clk

19 MHz ref

622 Mbit/s

311 MHz ClkA

B

622 Mbit/s

311 MHz Clk

BPR

BPD

EOI

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Circuit pack descriptions 1-21

Figure 1-9OC-12 T/R interface circuit pack (external view)

F3480-192

Optical signalfail (Yellow)

Active(Green)

Fail (Red)

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1-22 Circuit pack descriptions

OC-48 short reach T/R interface (NTCA30AL/CK)The OC-48 short reach (SR) transmit/receive (T/R) interface is a low-speed tributary T/R interface that combines a 1310 nm short reach transmitter, a positive intrinsic negative (PIN) receiver and a demultiplexer into one circuit pack.

Note: The OC-48 SR T/R circuit pack operates as a Class 1 laser device (IEC hazard level 1).

The OC-48 SR T/R interface circuit pack performs the following functions:

• provide OC-48 transmit and receive interface ports

• process the overhead

• synchronize data to shelf timing

This circuit pack features a bottom latch release sensor. The sensor alerts the system of circuit pack removal and switches the traffic if the circuit pack is active and protection is available. Figure 1-10 shows a functional block diagram. Figure 1-11 shows an external view of the OC-48 SR T/R interface circuit pack.

Transmit directionIn the transmit direction, the backplane receive (BPR) interface receives OC-48 data in the form of four 622 Mbit/s data streams from each switch module and demultiplexes it. The transmit overhead processor (TOHP) receives the data and then multiplexes it.

The parallel to serial (P/S) module multiplexes the signal again to provide an STS-48 serial signal for the laser module. The 1310 nm laser module converts the OC-48 electrical signal into an OC-48 optical signal and launches it into the optical fiber.

Receive directionIn the receive direction, the PIN converts the incoming OC-48 optical signal into an electrical signal. The automatic gain control (AGC) module receives the STS-48 signal and maintains a constant output level.

The data regenerator module receives the STS-48 serial signal and demultiplexes it into a parallel STS-48 signal. The receive overhead processor (ROHP) receives the STS-48 signal. The ROHP finds the SONET frame and extracts overhead and demultiplexes the data. The synchronizer (SYNC) module receives and aligns the data with the shelf clock and then passes it to the backplane driver (BPD). The BPD multiplexes the incoming data then sends it to the switch module by way of the shelf backplane.

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Circuit pack descriptions 1-23

Support circuitsThe following three circuits support the OC-48 SR T/R interface:

• the receive (Rx) controller

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The PUPS generates all the voltages required by the OC-48 SR T/R interface.

The Rx controller samples the quality of the data streams and controls the phase adjustment of the data and the PIN bias. The Rx controller also provides the TCS with status information.

The TCS controls the operation of the OC-48 SR T/R interface. The TCS provides communication between the shelf controller and the OC-48 SR T/R interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

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1-24 Circuit pack descriptions

Figure 1-10OC-48 SR T/R interface block diagram

DX4978p

BPR TOHP

PUPS-48 V

OC-48

OC-48

STS-48

+12V-12V+3.3V+5V-5.2V

STS-48A

B

Legend:

TCS+

To/fromshelf controller

To SwitchModulesA and B

Active(green)

Fail(red)

P/Smodule

From Switch ModulesA and B

Lasermodule

Optical signal fail(yellow)

ROHP

A

B

AGCBPDBPRPINPUPSROHPTCSTOHPSYNC

= Automatic Gain Control= Backplane Driver= Backplane Receive= Positive Intrinsic Negative= Point-of-Use Power Supply= Receive OverHead Processor= Transport Control Subsystem= Transmit Overhead Processor= Synchronizer

4 x 622 Mbit/s

Dataregenerator

module

AGCmodule

SYNCmodule

BPDmodule

PINmodule

RxControl

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Circuit pack descriptions 1-25

Figure 1-11OC-48 SR T/R interface circuit pack (external view)

DX4979p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector(Output)

Optical connector(Input)

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1-26 Circuit pack descriptions

OC-48 long reach T/R interface (NTCA30AN)The OC-48 LR T/R interface is a low-speed tributary T/R interface that combines transmit, receive and demultiplex functions in one circuit pack. The OC-48 T/R interface circuit pack performs the following functions:

• provide OC-48 transmit and receive facility terminations

• process the overhead

• synchronize data to shelf timing

This circuit pack features a bottom latch release sensor. The sensor alerts the system of circuit pack removal and switches the traffic if the circuit pack is active and protection is available. Figure 1-12 shows a functional block diagram. Figure 1-13 shows an external view of the OC-48 LR T/R interface circuit pack.

Transmit directionIn the transmit direction, the backplane receive (BPR) interface receives OC-48 data in the form of four 622 Mbit/s data streams from each switch module and demultiplexes it. The transmit overhead processor (TOHP) receives the data and then multiplexes it.

The parallel to serial (P/S) module multiplexes the signal again to provide an STS-48 serial signal for the external modulated DFB laser module. The external modulated DFB laser module converts the OC-48 electrical signal into an OC-48 optical signal with a wavelength locked to an ITU-T grid and launches it into the optical fiber.

Receive directionIn the receive direction, the avalanche photodiode (APD) converts the incoming OC-48 optical signal into an electrical signal. The automatic gain control (AGC) module receives the STS-48 signal and maintains a constant output level.

The data regenerator module receives the STS-48 serial signal and demultiplexes it into a parallel STS-48 signal. The receive overhead processor (ROHP) receives the STS-48 signal. The ROHP finds the SONET frame and extracts overhead and demultiplexes the data. The synchronizer (SYNC) module receives and aligns the data with the shelf clock and then passes it to the backplane driver (BPD). The BPD multiplexes the incoming data then sends it to the switch module by way of the shelf backplane.

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Circuit pack descriptions 1-27

Support circuitsThe following three circuits support the OC-48 LR T/R interface:

• the receive (Rx) controller

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The PUPS generates all the voltages required by the OC-48 LR T/R interface.

The Rx controller samples the quality of the data streams and controls the phase adjustment of the data and the APD bias. The Rx controller also provides the TCS with status information.

The TCS controls the operation of the OC-48 LR T/R interface. The TCS provides communication between the shelf controller and the OC-48 LR T/R interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

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1-28 Circuit pack descriptions

Figure 1-12OC-48 LR T/R interface block diagram

DX1375_SONET

BPR TOHP

PUPS-48 V

OC-48

OC-48

STS-48

+12V-12V+3.3V+5V-5.2V

STS-48A

B

Legend:

TCS+

To/fromshelf controller

To SwitchModulesA and B

Active(green)

Fail(red)

P/Smodule

From Switch ModulesA and B

Lasermodule

Optical signal fail(yellow)

ROHP

A

B

APDAGCBPDBPRPUPSROHPTCSTOHPSYNC

= Avalanche Photo-Detector= Automatic Gain Control= Backplane Driver= Backplane Receive= Point-of-Use Power Supply= Receive OverHead Processor= Transport Control Subsystem= Transmit Overhead Processor= Synchronizer

4 x 622 Mbit/s

Dataregenerator

module

AGCmodule

SYNCmodule

BPDmodule

APDmodule

RxControl

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Circuit pack descriptions 1-29

Figure 1-13OC-48 LR T/R interface circuit pack (external view)

DX4979p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector(Output)

Optical connector(Input)

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OC-48 DWDM T/R interface (NTCA30xK)The OC-48 DWDM T/R interface is a low-speed tributary T/R interface that combines transmit, receive and demultiplex functions in one circuit pack. The OC-48 T/R interface circuit pack performs the following functions:

• provide OC-48 transmit and receive facility terminations

• process the overhead

• synchronize data to shelf timing

This circuit pack features a bottom latch release sensor. The sensor alerts the system of circuit pack removal and switches the traffic if the circuit pack is active and protection is available. Figure 1-14 shows a functional block diagram. Figure 1-15 shows an external view of the OC-48 DWDM T/R interface circuit pack.

Transmit directionIn the transmit direction, the backplane receive (BPR) interface receives OC-48 data in the form of four 622 Mbit/s data streams from each switch module and demultiplexes it. The transmit overhead processor (TOHP) receives the data and then multiplexes it.

The parallel to serial (P/S) module multiplexes the signal again to provide an STS-48 serial signal for the external modulated DFB laser module. The external modulated DFB laser module converts the OC-48 electrical signal into an OC-48 optical signal with a wavelength locked to an ITU-T grid and launches it into the optical fiber.

Receive directionIn the receive direction, the avalanche photodiode (APD) converts the incoming OC-48 optical signal into an electrical signal. The automatic gain control (AGC) module receives the STS-48 signal and maintains a constant output level.

The data regenerator module receives the STS-48 serial signal and demultiplexes it into a parallel STS-48 signal. The receive overhead processor (ROHP) receives the STS-48 signal. The ROHP finds the SONET frame and extracts overhead and demultiplexes the data. The synchronizer (SYNC) module receives and aligns the data with the shelf clock and then passes it to the backplane driver (BPD). The BPD multiplexes the incoming data then sends it to the switch module by way of the shelf backplane.

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Circuit pack descriptions 1-31

OC-48 DWDM T/R wavelengthsFor information on the variants of this circuit pack refer to SONET Planning and Ordering Guide NTRR10DG.

For information on OC-48 DWDM tributary applications, refer to the OC-48 DWDM Tributary Application Note (NTRR12AC).

Support circuitsThe following three circuits support the OC-48 DWDM T/R interface:

• the receive (Rx) controller

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The PUPS generates all the voltages required by the OC-48 DWDM T/R interface.

The Rx controller samples the quality of the data streams and controls the phase adjustment of the data and the APD bias. The Rx controller also provides the TCS with status information.

The TCS controls the operation of the OC-48 DWDM T/R interface. The TCS provides communication between the shelf controller and the OC-48 DWDM T/R interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

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1-32 Circuit pack descriptions

Figure 1-14OC-48 DWDM T/R interface block diagram

DX1375_SONET

BPR TOHP

PUPS-48 V

OC-48

OC-48

STS-48

+12V-12V+3.3V+5V-5.2V

STS-48A

B

Legend:

TCS+

To/fromshelf controller

To SwitchModulesA and B

Active(green)

Fail(red)

P/Smodule

From Switch ModulesA and B

Lasermodule

Optical signal fail(yellow)

ROHP

A

B

APDAGCBPDBPRPUPSROHPTCSTOHPSYNC

= Avalanche Photo-Detector= Automatic Gain Control= Backplane Driver= Backplane Receive= Point-of-Use Power Supply= Receive OverHead Processor= Transport Control Subsystem= Transmit Overhead Processor= Synchronizer

4 x 622 Mbit/s

Dataregenerator

module

AGCmodule

SYNCmodule

BPDmodule

APDmodule

RxControl

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Circuit pack descriptions 1-33

Figure 1-15OC-48 DWDM T/R interface circuit pack (external view)

DX4979p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector(Output)

Optical connector(Input)

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1-34 Circuit pack descriptions

Quad OC-48 T/R interfaces (NTWR31) The Quad OC-48 transmit/receive (T/R) interfaces include:

• four low-speed interface circuits for processing SONET based traffic

• a backplane interface circuit, which interfaces the tributaries with the switch modules

• a distributed processing control architecture

The universal slots on main transport shelf can contain the following types of Quad OC-48 circuit pack:

• Quad OC-48 short reach T/R interface (NTWR31AB)

• Quad OC-48 intermediate reach T/R interface (NTWR31BA)

Note: The Quad OC-48 circuit packs operate as Class 1 laser devices (IEC hazard level 1).

The Quad OC-48 transmit/receive (T/R) interfaces have a vertically mounted handling tray that provides access to the optical fiber connections for connector cleaning.

The Quad OC-48 interfaces (NTWR31AB/BA) support SDCC and LDCC on all four ports.

The Quad OC-48T/R interface circuit pack performs the following functions:

• provide OC-48 transmit and receive facility terminations

• process overhead

• perform performance monitoring

• synchronize data to shelf timing

Figure 1-16 show functional block diagrams for the Quad OC-48 optical interface circuit packs.Figure 1-17 shows an external view of a Quad OC-48 optical interface circuit pack. Except for the identification label, both types of Quad OC-48optical interface circuit pack have the same external appearance.

Transmit directionFor each independent port, the Columbo Overhead Processor/Synchronizer (OPS) receives 622 Mbit/s data and associated 311 MHz clock from switch module A and switch module B. The Columbo OPS selects between the two groups of data, depending on the active switch, and provides overhead processing (insertion) for the transmit path data. The Columbo OPS provides nibble-wide 622 Mbit/s data and clock to the electrical transceiver which converts the data to a 2.5 Gbit/s serial stream. The electro-optic components convert the electrical data stream into a modulated optical output for transmission.

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Circuit pack descriptions 1-35

Receive directionFor each independent port, the opto-electric components convert the incoming 2.5 Gbit/s optical signal into an electrical signal. The electrical transceiver converts the serial 2.5 Gbit/s signal into nibble-wide 622 Mbit/s data and clock. The 622 Mbit/s data and clock are provided to the Columbo Overhead Processor/Synchronizer (OPS) which provides the SONET framing, error monitoring, overhead processing (extraction) and shelf synchronization on the incoming data. The Columbo OPS generates 2 copies of the data at 622 Mbit/s, one group goes to switch module A and the other to switch module B.

Support circuitsFour circuits support the Quad OC-48 T/R interfaces, they are as follows:

• Columbo Overhead Processor/Synchronizer (OPS)

• Optical/Electric and Electric/Optical convertor (O/E, E/O Conversion)

• clock distribution

• electrical transceiver

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The Columbo Overhead Processor/Synchronizer (OPS) provides the system synchronization, SONET framing, error monitoring, and overhead processing on a 2.5 Gbit/s data path.

The clock distribution block receives 39 MHz reference clocks from the switch modules (A and B). The reference from the active module is used to synchronize the clock reference on the design to the system timing. The clock distribution block provides shelf synchronous clocks to the Columbo OPS and the electrical transceivers.

The electrical transceiver converts the serial 2.5 Gbit/s signal into nibble-wide 622 Mbit/s data and clock.

The TCS provides performance monitoring, fault handling, propagation of status information to the shelf controller, and circuit pack provisioning.

The PUPS use the -48V battery voltage from the shelf to produce the supplies required by the Quad OC-48 interface.

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Figure 1-16Quad OC-48 T/R optical interface block diagram

DX5510p

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Circuit pack descriptions 1-37

Figure 1-17Quad OC-48 T/R optical interface circuit pack (external view)

DX5509p

QUADOC-48

STM-16

Opticalconnectors

Carrierhandle

Fibercarrier

Dual fibercables

1234

3OUT IN

4OUT IN

1-2 3-4

QUAD

OC-48

STM-16

1234

4OUT IN

3OUT IN

Latch

Latch

Front viewSide view

Carrierhandles

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Dual OC-48 short reach T/R interface (NTWR30AA)The Dual OC-48 short reach T/R is a full-height circuit pack that supports two OC-48 facilities for a maximum capacity of 5.0 Gbit/s.

Note 1: The Dual OC-48 SR T/R interface circuit pack is used in OPTera Connect DX bays running Release 4.1 or above.

Note 2: The Dual OC-48 SR T/R circuit pack operates as a Class 1 laser device.

Figure 1-18 shows a functional block diagram of the Dual OC-48 SR T/R interface. Figure 1-19 shows an external view of the Dual OC-48 SR T/R interface circuit pack.

Support circuitsThe following three circuits support the Dual OC-48 SR T/R interface:

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

• the electro-optics controller (EOC)

The TCS controls the operation of the Dual OC-48 SR T/R interface. The TCS provides communication between the shelf controller and the Dual OC-48 SR T/R interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the Dual OC-48 SR T/R interface.

The electro-optics controller controls the receive and transmit optical channels. The EOC also provides the TCS with status information about the optical control loops and alarms.

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Circuit pack descriptions 1-39

Figure 1-18Dual OC-48 SR T/R interface block diagram

DX4003p

Dual digital card Dual short reach optics card

PUPS

Bac

kpla

ne c

onne

ctor

-48V

622M

622M

622M SYDR

MagicFPGA

TCS

MPC860Merge

SCG

622M

622M

PLL

311M

311M 311M

311M

Rx39M

SYDR311M

311M

311M

2xDCC1xOH

2xDCC1xOH

39M

39M

~622MVCXO

Rx39M

Ck Sel

TROHP

311M

Ck Sel

TROHP

PIN/Preamp

PIN/Preamp

EOC860

39MMUX

2.5G 2.5G

AGC

MUX

Demux

Demux2.5G 2.5G

2.5G 2.5G

2.5G 2.5G

AGC

Drvr

Drvr

8-pin Mini DIL

8-pin Mini DILOC-48 In SR

OC-48In SR

OC-48Out SR8-pin Mini DIL

FP laser

8-pin Mini DILFP laser

OC-48Out SR

AGCCk Sel

DILDemux

DrvrEOC

FPFPGAMUX

= Automatic gain control= Clock selector= Dual in line= Demultiplexer= Driver= Electro-optical controller= Fabry-Perot= Field programmable gate array= Multiplexer

Legend

PINPLL

PUPSSCG

SRSYDR

TROHPVCXO

= Positive intrinsic negative= Phase-locked loop= Point of use power supply= System clock generator= Short reach= Sync driver/receiver= Transmit/receive overhead processor= Voltage controlled crystal oscillator

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Figure 1-19Dual OC-48 SR T/R interface circuit pack (external view)

DX4693

LOS for port #1(Yellow)

LOS for port #2(Yellow)

Fail (Red)

Active (Green)

Optical connector(Output) Port #2

Optical connector(Input) Port #2

Optical connector(Output) Port #1

Optical connector(Input) Port #1

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Circuit pack descriptions 1-41

Dual OC-48 intermediate reach T/R interface (NTWR30BA)The Dual OC-48 intermediate reach (IR) T/R is a full-height circuit pack that supports two OC-48 facilities for a maximum capacity of 5.0 Gbit/s.

Note 1: The Dual OC-48 IR T/R interface circuit pack is used in OPTera Connect DX bays running Release 4.1 or above.

Note 2: The OC-48 IR T/R circuit pack operates as a Class 1 laser device (IEC hazard level 1).

Figure 1-20 shows a functional block diagram of the Dual OC-48 IR T/R interface. Figure 1-21 shows an external view of the Dual OC-48 IR T/R interface circuit pack.

Support circuitsThe following three circuits support the Dual OC-48 IR T/R interface:

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

• the electro-optics controller (EOC)

The TCS controls the operation of the Dual OC-48 IR T/R interface. The TCS provides communication between the shelf controller and the Dual OC-48 IR T/R interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the Dual OC-48 IR T/R interface.

The electro-optics controller controls the receive and transmit optical channels. The EOC also provides the TCS with status information about the optical control loops and alarms.

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Figure 1-20Dual OC-48 IR T/R interface block diagram

DX4696p

Dual digital card Dual optics card

PUPS

Bac

kpla

ne c

onne

ctor

-48V

622M

622M

622M SYDR

MagicFPGA

TCS

MPC860Merge

SCG

622M

622M

PLL

311M

311M 311M

311M

Rx39M

SYDR311M

311M

311M

2xDCC1xOH

2xDCC1xOH

39M

39M

~622MVCXO

Rx39M

Ck Sel

TROHP

311M

Ck Sel

TROHP

PIN/Receiver

PIN/Receiver

EOC860

39MMUX

2.5G 2.5G

AGC

MUX

Demux

Demux2.5G 2.5G

2.5G 2.5G

2.5G 2.5G

AGC

Drvr

Drvr

OC-48 In IR

OC-48In IR

OC-48Out IR

Uncooled DFBlaser

Uncooled DFBlaser

OC-48Out IR

AGCCk Sel

DILDemux

DFBDrvr

EOCFPGA

IR

= Automatic gain control= Clock selector= Dual in line= Demultiplexer= Distributed feedback= Driver= Electro-optical controller= Field programmable gate array= Intermediate reach

Legend

MUXPINPLL

PUPSSCG

SYDRTROHP

VCXO

= Multiplexer= Positive intrinsic negative= Phase-locked loop= Point of use power supply= System clock generator= Sync driver/receiver= Transmit/receive overhead processor= Voltage controlled crystal oscillator

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Circuit pack descriptions 1-43

Figure 1-21Dual OC-48 IR T/R interface circuit pack (external view)

DX4693p

LOS for port #1(Yellow)

LOS for port #2(Yellow)

Fail (Red)

Active (Green)

Optical connector(Output) Port #2

Optical connector(Input) Port #2

Optical connector(Output) Port #1

Optical connector(Input) Port #1

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Dual OC-48 long reach T/R interface (NTWR30CA)The Dual OC-48 long reach (LR) T/R is a full-height circuit pack that supports two OC-48 facilities for a maximum capacity of 5.0 Gbit/s.

Note 1: The Dual OC-48 LR T/R interface circuit pack is used in OPTera Connect DX bays running Release 5 or above.

Note 2: The OC-48 LR T/R circuit pack operates as a Class IIIb laser device (IEC hazard level 1).

Figure 1-22 shows a functional block diagram of the Dual OC-48 LR T/R interface. Figure 1-23 shows an external view of the Dual OC-48 LR T/R interface circuit pack.

Support circuitsThe following three circuits support the Dual OC-48 LR T/R interface:

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

• the electro-optics controller (EOC)

The TCS controls the operation of the Dual OC-48 LR T/R interface. The TCS provides communication between the shelf controller and the Dual OC-48 LR T/R interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the Dual OC-48 LR T/R interface.

The electro-optics controller controls the receive and transmit optical channels. The EOC also provides the TCS with status information about the optical control loops and alarms.

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Circuit pack descriptions 1-45

Figure 1-22Dual OC-48 LR T/R interface block diagram

DX4870p

Dual digital card Dual optics card

PUPS

Bac

kpla

ne c

onne

ctor

-48V

622M

622M

622M SYDR

MagicFPGA

TCS

MPC860Merge

SCG

622M

622M

PLL

311M

311M 311M

311M

Rx39M

SYDR311M

311M

311M

2xDCC1xOH

2xDCC1xOH

39M

39M

~622MVCXO

Rx39M

Ck Sel

TROHP

311M

Ck Sel

TROHP

APD/Receiver

APD/Receiver

EOC860

39MMUX

2.5G 2.5G

AGC

MUX

Demux

Demux2.5G 2.5G

2.5G 2.5G

2.5G 2.5G

AGC

Drvr

Drvr

OC-48 In LR

OC-48In LR

OC-48Out LR

Uncooled DFBlaser

Uncooled DFBlaser

OC-48Out LR

AGCAPD

Ck SelDIL

DemuxDFBDrvr

EOCFPGA

= Automatic gain control= Avalanche photodiode= Clock selector= Dual in line= Demultiplexer= Distributed feedback= Driver= Electro-optical controller= Field programmable gate array

Legend

LRMUXPLL

PUPSSCG

SYDRTROHP

VCXO

= Long reach= Multiplexer= Phase-locked loop= Point of use power supply= System clock generator= Sync driver/receiver= Transmit/receive overhead processor= Voltage controlled crystal oscillator

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1-46 Circuit pack descriptions

Figure 1-23Dual OC-48 LR T/R interface circuit pack (external view)

DX4693p

LOS for port #1(Yellow)

LOS for port #2(Yellow)

Fail (Red)

Active (Green)

Optical connector(Output) Port #2

Optical connector(Input) Port #2

Optical connector(Output) Port #1

Optical connector(Input) Port #1

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Circuit pack descriptions 1-47

STS-48 T/R electrical interface (NTCA34)The STS-48 T/R electrical interface is a low-speed tributary transmit/receive (T/R) interface that combines STS-48 transmit, receive and demultiplex functions into one circuit pack. The STS-48 T/R circuit pack performs the following functions:

• provide STS-48 transmit and receive facility terminations

• process the overhead

• synchronize data to shelf timing

Figure 1-24 shows a functional block diagram. Apart from the external label, the T/R interface circuit pack looks identical to the OC-48 T/R interface circuit pack shown in Figure 1-11.

Transmit directionIn the transmit direction, the backplane receive (BPR) interface receives data from the switch module and demultiplexes it. The transmit overhead processor (TOHP) receives and multiplexes the data. The P/S module multiplexes the signal again to provide an STS-48 serial signal that it sends through a coaxial link.

Receive directionThe automatic gain control module (AGC) receives the STS-48 signal and maintains a constant output level. The data regenerator module receives this serial signal and demultiplexes it to a parallel signal. The ROHP receives the STS-48 signal and finds the SONET frame. The ROHP also extracts overhead and demultiplexes the data. The SYNC module receives and aligns the data with the shelf clock, then passes the data to the BPD. The BPD multiplexes the incoming data before sending it to the switch module by way of the shelf backplane.

Support circuitsThree circuits support the STS-48 T/R interface:

• the Rx controller

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The Rx controller samples the quality of the data streams and controls the phase adjustment of the data. The Rx controller also provides the TCS with status information.

The TCS controls the operation of the STS-48 T/R interface and TCS provides communication with the shelf controller. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the STS-48 T/R interface.

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1-48 Circuit pack descriptions

Figure 1-24STS-48 T/R interface block diagram

DX1369_SONET

TOHPP/S

moduleSTS-48

A

4

4

B

TCS+

ROHP

Rxcontrol

To/fromshelf controller

Active(green)

Fail(red)

Optical signal fail(yellow)

SYNCmodule

BPDmodule

A

B

4 x 622 Mbit/sfrom Switchmodules A and B

4 x 622 Mbit/sto Switchmodules A and B

+12V

-12V

+3.3V

+5V

-5.2V

STS-48

LegendAGCBPDBPRFECP/SPUPSROHPRxTCSTOHPSYNC

= Automatic gain control= Backplane driver= Backplane receive= Forward error correction= Parallel to serial= Point-of-use power supply= Receive overhead processor= Receive= Transport control subsystem= Transmit overhead processor= Synchronizer

PUPS-48 V

Dataregenerator

module

AGCmodule

BPR

4

4

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Circuit pack descriptions 1-49

Dual Gigabit Ethernet extended reach interface (NTCA90GA)The Dual Gigabit Ethernet (GE) extended reach (ZX) circuit pack allows native Ethernet traffic to be mapped and carried in the SONET synchronous payload envelope. This allows for Ethernet traffic to be carried over an OC-192 SONET backbone in a point-to-point configuration.

The Dual GE ZX circuit pack is a full height circuit with two independent Ethernet ports.

Note 1: The Dual GE ZX circuit pack can only be used as an unprotected tributary circuit pack. However, the network element in which it is provisioned can be either protected or unprotected. Matched nodes are not supported where the Dual GE ZX circuit pack is the gateway.

Note 2: The Dual GE ZX interface circuit pack is used in OPTera Connect DX bays running Release 5 or above.

Figure 1-27 shows a block diagram of the Dual GE ZX circuit pack. Figure 1-28 shows an external view of the Dual GE ZX circuit pack.

The Dual GE ZX circuit pack has the following characteristics:

• two optical interfaces that support 1000Base-ZX (1550 nm) single-mode optical fiber (80 km reach) for each port

• support for IEEE 802.3 (1998) provisionable automatic negotiation and flow control (pause frame capability in the transmit direction only)

• support for transparent pass through of IEEE 802.1Q VLAN tags

• support for transparent pass through of IEEE 802.1p priority fields

• ability to handle Ethernet frames up to 2048 bytes

• support for signal label for terminated Dual GE payloads

• layer 3 transparency support for transparent pass through of routing information protocol (RIP) and OSPF information

• supports point-to-point Ethernet connection provisioning (STS-3c, STS-6c, STS-12c or STS-24c per port)

• supports mixed tributaries, subject to protection group restrictions

• supports Internet Protocol (IP), according to RFC79; User Data Protocol (UDP) according to RFC768; and, TCP according to RFC791

• support for ICMP echo in accordance with RFC792

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The hardware consists of the following functional blocks:

• Electro-optical interfaces (EOI)

• Serializer/deserializer (SERDES)

• Gigabit Media Access Control (GMAC)

• Dual scalable mapper (DSCAM)

• Bi-directional backplane interlace (BIBI)

Transmit directionThe backplane receiver (BPR) in the BIBI receives data inputs from either switch module A or switch module B, depending on which switch module is active. The input from the active switch module consists of four 622 Mbit/s data streams. The data is accompanied by two 311 MHz clocks. Switch modules A and B form a working and protection pair.

The backplane receiver in the BIBI performs the following functions:

• locates the frame boundary

• performs inter-chip integrity checking

• unscrambles the incoming data streams

• outputs four STS-12 byte-wide data busses.

The BIBI divides the 311 MHz backplane clock down to 19 MHz and uses this as reference for the phase-locked loop (PLL). The PLL contains a 155 MHz voltage-controlled crystal oscillator (VCXO) that provides 19 MHz and 39 MHz timing for the circuit pack. The BIBI demultiplexes the 622 Mbit/s serial data streams down to four byte wide 77.76 Mbit/s data streams (referred to as 78 Mbit/s data streams in this document) and passes these to the DSCAM circuit.

The BPR in the BIBI extracts an 8 kHz system timing signal from the position of the framing pattern in the incoming data and uses this as a reference signal for the PLL. The locked outputs of the PLL are fed back into the BIBI and used as a clock for the BPR.

The DSCAM provides point-to-point connections between the byte-wide STS-12 outputs from the BIBI and the GMAC devices. The DSCAM uses up to 8 Mbytes of external Synchronous Dynamic RAM (SDRAM) in the GE to SONET direction in order to buffer frames for data bursts into a port that supports a lower data rate. No buffering is provided in the SONET to GE direction since there is no flow control mechanism on the SONET side. The DSCAM uses the 8 kHz timing signal from the BIBI as a reference for pointer processing. The DSCAM performs the following functions:

• processes the SONET overhead

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Circuit pack descriptions 1-51

• performs a demapping function, in which the Internet Protocol (IP) frames are extracted from the SONET payload

• sends the IP data to the GMAC devices at 78 Mbit/s

In each GMAC device, the IP data is fed into a 2 kbytes first-in-first-out (FIFO). Using the data contained in the FIFO, the GMAC devices generate the following as part of the outgoing Ethernet packet:

• preamble

• start of frame delimiter (SFD)

• 32-bit cyclic redundancy check (CRC) data.

An 8-bit to 10-bit encoder in each GMAC device encodes the 32-bit data stream into 10-bit symbols, in accordance with IEEE 802.3z. A 125 MHz clock signal from the SERDES transfers the data from each GMAC device to the SERDES.

The SERDES accepts the two streams of 10-bit symbols at 125 Mbit/s and serializes the data into two single 1.25 Gbit/s data streams at ports 1 and 2.

The electro-optical interface (EOI) circuits perform electrical to optical conversion. A laser driver in the EOI accepts the data stream and generates a modulation current to drive the laser diode module (LDM). The laser driver provides a bias current to maintain the LDM at the correct bias threshold. The LDM converts the electrical data stream into an amplitude modulated optical output for transmission.

Receive directionThe Dual GE ZX circuit pack receives two optical data streams at 1.25 Gbit/s. The two data streams are applied to associated EOI circuits, which convert the optical signals to electrical signals. The two electrical data streams are passed to the SERDES, which deserializes the data into two parallel 10-bit outputs at 125 Mbit/s. The SERDES recovers a clock from the incoming 1.25 Gbit/s data to produce two 62.5 MHz clocks, which are used to latch out the 10-bit data from the SERDES to each GMAC device.

Each GMAC device accepts the input data in the form of 10-bit parallel symbols and clocks each group of four symbols into a 40-bit register at 125 MHz. An encoder converts each group of four 10-bit symbols to 8-bit form in accordance with IEEE 802.3z, producing a 32-bit word, which is output every fourth clock cycle.

The GMAC device receive module operates on each incoming Ethernet frame as follows:

• removes the preamble symbols

• removes the SFD

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1-52 Circuit pack descriptions

• checks the frame check sequence (FCS)

• checks for the correct frame length

• captures the MAC control frames in the receive direction and initiates a response along the transmit direction

• captures and stores statistics from the received frames, allowing the receive statistics to be appended to frames sent to the DSCAM

The DSCAM maps the data between the Ethernet side and the OC-12side. The receive circuits in the DSCAM accept the 32-bit data at 78 Mbit/s from the GMAC device and the DSCAM performs point-to-point mapping, inserting the IP frames into the SONET payload. The DSCAM outputs four groups of 8-bit parallel data at 78 Mbit/s and passes these to the BIBI.

The outputs from the DSCAM are passed to the backplane driver (BPD) circuits of the BIBI. The BPD has a programmable frame offset that can be adjusted to align the SONET framing pattern with the system 8 kHz framing pulse on the switch module. This keeps the Dual GE ZX circuit pack locked to the OC-192 system timing. The BPD scrambles the data and outputs the data as two groups of four data streams at 622 Mbit/s to the backplane. One group of four data streams is routed via the backplane to switch module A and the other group to switch module B.

Support circuitsThe following three circuits support the Dual GE ZX circuit pack:

• the transport control subsystem, second generation (TCSII)

• the phase-locked loop (PLL)

• the point-of-use power supply (PUPS)

The TCSII provides performance monitoring, fault handling, propagation of status information to the shelf controller, and circuit pack provisioning.

The PLL uses the backplane clock to the BIBI to produce the 19 MHz clock. The PLL provides system timing to the circuit pack.

The PUPS uses the –48 V battery voltage from the shelf to produce the supplies required by the Dual GE ZX circuit pack.

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Circuit pack descriptions 1-53

Figure 1-25Dual GE ZX circuit pack interface block diagram

DX3067_R3_SON

8

8

8

8

78 MHz1 Gbit/s

1.25 Gbit/sGE traffic

1.25 Gbit/s

125Mbit/s

78 Mbit/sSTS-Nc

4

LegendBIBI =

DSCAM =EOI =GE =

GMAC =N =

SERDES =STS =TCS =

Bi-directional Backplane InterfaceDual scalable mapperElectro-optical interfaceGigabit EthernetGigabit Ethernet Media Access Control3, 6, 12, or 24Serializer/deserializerSynchronous Transport SignalTransport Control Subsystem

G-MAC

G-MAC

EOI432

EOI

DualSERDES

TCS

BIBIDSCAM

622 Mbit/s(STS-Nc)

10

10 32

SwitchA

SwitchB

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1-54 Circuit pack descriptions

Figure 1-26Dual GE ZX circuit pack (external view)

DX3650p

1OUT IN

2OUT IN

Side view

iDual G E

12

2OUT IN

1OUT IN

1-2

Dual GE

12

1-2

Front view

Carrierhandle

Upperlatch

Lowerlatch

Fiber clip

Fiber carrier Optical connectors(4 places)

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Circuit pack descriptions 1-55

Dual Gigabit Ethernet long reach interface (NTCA90CA)The Dual Gigabit Ethernet (GE) long reach (LX) circuit pack allows native Ethernet traffic to be mapped and carried in the SONET synchronous payload envelope. This allows for Ethernet traffic to be carried over an OC-192 SONET backbone in a point-to-point configuration.

The Dual GE LX circuit pack is a full height circuit with two independent Ethernet ports.

Note: The Dual GE LX circuit pack can only be used as an unprotected tributary circuit pack. However, the network element in which it is provisioned can be either protected or unprotected. Matched nodes are not supported where the Dual GE LX circuit pack is the gateway.

Figure 1-27 shows a block diagram of the Dual GE LX circuit pack. Figure 1-28 shows an external view of the Dual GE LX circuit pack.

The Dual GE LX circuit pack has the following characteristics:

• two optical interfaces that support 1000Base-LX (1300 nm) single-mode optical fiber (10 km reach) for each port

• support for IEEE 802.3 (1998) provisionable automatic negotiation and flow control (pause frame capability in the transmit direction only)

• support for transparent pass through of IEEE 802.1Q VLAN tags

• support for transparent pass through of IEEE 802.1p priority fields

• ability to handle Ethernet frames up to 2048 bytes

• support for signal label for terminated Dual GE payloads

• layer 3 transparency support for transparent pass through of routing information protocol (RIP) and OSPF information

• supports point-to-point Ethernet connection provisioning (STS-3c, STS-6c, STS-12c or STS-24c per port)

• supports mixed tributaries, subject to protection group restrictions

• supports Internet Protocol (IP), according to RFC79; User Data Protocol (UDP) according to RFC768; and, TCP according to RFC791

• support for ICMP echo in accordance with RFC792

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1-56 Circuit pack descriptions

The hardware consists of the following functional blocks:

• Electro-optical interfaces (EOI)

• Serializer/deserializer (SERDES)

• Gigabit Media Access Control (GMAC)

• Dual scalable mapper (DSCAM)

• Bi-directional backplane interlace (BIBI)

Transmit directionThe backplane receiver (BPR) in the BIBI receives data inputs from either switch module A or switch module B, depending on which switch module is active. The input from the active switch module consists of four 622 Mbit/s data streams. The data is accompanied by two 311 MHz clocks. Switch modules A and B form a working and protection pair.

The backplane receiver in the BIBI performs the following functions:

• locates the frame boundary

• performs inter-chip integrity checking

• unscrambles the incoming data streams

• outputs four STS-12 byte-wide data busses.

The BIBI divides the 311 MHz backplane clock down to 19 MHz and uses this as reference for the phase-locked loop (PLL). The PLL contains a 155 MHz voltage-controlled crystal oscillator (VCXO) that provides 19 MHz and 39 MHz timing for the circuit pack. The BIBI demultiplexes the 622 Mbit/s serial data streams down to four byte wide 77.76 Mbit/s data streams (referred to as 78 Mbit/s data streams in this document) and passes these to the DSCAM circuit.

The BPR in the BIBI extracts an 8 kHz system timing signal from the position of the framing pattern in the incoming data and uses this as a reference signal for the PLL. The locked outputs of the PLL are fed back into the BIBI and used as a clock for the BPR.

The DSCAM provides point-to-point connections between the byte-wide STS-12 outputs from the BIBI and the GMAC devices. The DSCAM uses up to 8 Mbytes of external Synchronous Dynamic RAM (SDRAM) in the GE to SONET direction in order to buffer frames for data bursts into a port that supports a lower data rate. No buffering is provided in the SONET to GE direction since there is no flow control mechanism on the SONET side. The DSCAM uses the 8 kHz timing signal from the BIBI as a reference for pointer processing. The DSCAM performs the following functions:

• processes the SONET overhead

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• performs a demapping function, in which the Internet Protocol (IP) frames are extracted from the SONET payload

• sends the IP data to the GMAC devices at 78 Mbit/s

In each GMAC device, the IP data is fed into a 2 kbytes first-in-first-out (FIFO). Using the data contained in the FIFO, the GMAC devices generate the following as part of the outgoing Ethernet packet:

• preamble

• start of frame delimiter (SFD)

• 32-bit cyclic redundancy check (CRC) data.

An 8-bit to 10-bit encoder in each GMAC device encodes the 32-bit data stream into 10-bit symbols, in accordance with IEEE 802.3z. A 125 MHz clock signal from the SERDES transfers the data from each GMAC device to the SERDES.

The SERDES accepts the two streams of 10-bit symbols at 125 Mbit/s and serializes the data into two single 1.25 Gbit/s data streams at ports 1 and 2.

The electro-optical interface (EOI) circuits perform electrical to optical conversion. A laser driver in the EOI accepts the data stream and generates a modulation current to drive the laser diode module (LDM). The laser driver provides a bias current to maintain the LDM at the correct bias threshold. The LDM converts the electrical data stream into an amplitude modulated optical output for transmission.

Receive directionThe Dual GE LX circuit pack receives two optical data streams at 1.25 Gbit/s. The two data streams are applied to associated EOI circuits, which convert the optical signals to electrical signals. The two electrical data streams are passed to the SERDES, which deserializes the data into two parallel 10-bit outputs at 125 Mbit/s. The SERDES recovers a clock from the incoming 1.25 Gbit/s data to produce two 62.5 MHz clocks, which are used to latch out the 10-bit data from the SERDES to each GMAC device.

Each GMAC device accepts the input data in the form of 10-bit parallel symbols and clocks each group of four symbols into a 40-bit register at 125 MHz. An encoder converts each group of four 10-bit symbols to 8-bit form in accordance with IEEE 802.3z, producing a 32-bit word, which is output every fourth clock cycle.

The GMAC device receive module operates on each incoming Ethernet frame as follows:

• removes the preamble symbols

• removes the SFD

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• checks the frame check sequence (FCS)

• checks for the correct frame length

• captures the MAC control frames in the receive direction and initiates a response along the transmit direction

• captures and stores statistics from the received frames, allowing the receive statistics to be appended to frames sent to the DSCAM

The DSCAM maps the data between the Ethernet side and the OC-12side. The receive circuits in the DSCAM accept the 32-bit data at 78 Mbit/s from the GMAC device and the DSCAM performs point-to-point mapping, inserting the IP frames into the SONET payload. The DSCAM outputs four groups of 8-bit parallel data at 78 Mbit/s and passes these to the BIBI.

The outputs from the DSCAM are passed to the backplane driver (BPD) circuits of the BIBI. The BPD has a programmable frame offset that can be adjusted to align the SONET framing pattern with the system 8 kHz framing pulse on the switch module. This keeps the Dual GE LX circuit pack locked to the OC-192 system timing. The BPD scrambles the data and outputs the data as two groups of four data streams at 622 Mbit/s to the backplane. One group of four data streams is routed via the backplane to switch module A and the other group to switch module B.

Support circuitsThe following three circuits support the Dual GE LX circuit pack:

• the transport control subsystem, second generation (TCSII)

• the phase-locked loop (PLL)

• the point-of-use power supply (PUPS)

The TCSII provides performance monitoring, fault handling, propagation of status information to the shelf controller, and circuit pack provisioning.

The PLL uses the backplane clock to the BIBI to produce the 19 MHz clock. The PLL provides system timing to the circuit pack.

The PUPS uses the –48 V battery voltage from the shelf to produce the supplies required by the Dual GE LX circuit pack.

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Figure 1-27Dual GE LX circuit pack interface block diagram

DX3067_R3_SON

8

8

8

8

78 MHz1 Gbit/s

1.25 Gbit/sGE traffic

1.25 Gbit/s

125Mbit/s

78 Mbit/sSTS-Nc

4

LegendBIBI =

DSCAM =EOI =GE =

GMAC =N =

SERDES =STS =TCS =

Bi-directional Backplane InterfaceDual scalable mapperElectro-optical interfaceGigabit EthernetGigabit Ethernet Media Access Control3, 6, 12, or 24Serializer/deserializerSynchronous Transport SignalTransport Control Subsystem

G-MAC

G-MAC

EOI432

EOI

DualSERDES

TCS

BIBIDSCAM

622 Mbit/s(STS-Nc)

10

10 32

SwitchA

SwitchB

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Figure 1-28Dual GE LX circuit pack (external view)

DX3650p

1OUT IN

2OUT IN

Side view

iDual G E

12

2OUT IN

1OUT IN

1-2

Dual GE

12

1-2

Front view

Carrierhandle

Upperlatch

Lowerlatch

Fiber clip

Fiber carrier Optical connectors(4 places)

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Dual Gigabit Ethernet short reach interface (NTCA90EA)The Dual Gigabit Ethernet (GE) short reach (SX) circuit pack allows native Ethernet traffic to be mapped and carried in the SONET synchronous payload envelope. This allows for Ethernet traffic to be carried over an OC-192 SONET backbone in a point-to-point configuration.

The Dual GE SX circuit pack is a full height circuit with two independent Ethernet ports.

Note: The Dual GE SX circuit pack can only be used as an unprotected tributary circuit pack. However, the network element in which it is provisioned can be either protected or unprotected. Matched nodes are not supported where the Dual GE SX circuit pack is the gateway.

Figure 1-29 shows a block diagram of the Dual GE SX circuit pack. Figure 1-30 shows an external view of the Dual GE SX circuit pack.

The Dual GE SX circuit pack has the following characteristics:

• two optical interfaces that support 1000Base-SX (850 nm) multi-mode fiber (550 m reach using 50um multi-mode fiber) for each port

• support for IEEE 802.3 (1998) provisionable automatic negotiation and flow control (pause frame capability in the transmit direction only)

• support for transparent pass through of IEEE 802.1Q VLAN tags

• support for transparent pass through of IEEE 802.1p priority fields

• ability to handle Ethernet frames up to 2048 bytes

• support for signal label for terminated Dual GE payloads

• layer 3 transparency support for transparent pass through of routing information protocol (RIP) and OSPF information

• supports point-to-point Ethernet connection provisioning (STS-3c, STS-6c, STS-12c or STS-24c per port)

• supports mixed tributaries, subject to protection group restrictions

• supports Internet Protocol (IP), according to RFC79; User Data Protocol (UDP) according to RFC768; and, TCP according to RFC791

• support for ICMP echo in accordance with RFC792

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The hardware consists of the following functional blocks:

• Electro-optical interfaces (EOI)

• Serializer/deserializer (SERDES)

• Gigabit Media Access Control (GMAC)

• Dual scalable mapper (DSCAM)

• Bi-directional backplane interlace (BIBI)

Transmit directionThe backplane receiver (BPR) in the BIBI receives data inputs from either switch module A or switch module B, depending on which switch module is active. The input from the active switch module consists of four 622 Mbit/s data streams. The data is accompanied by two 311 MHz clocks. Switch modules A and B form a working and protection pair.

The backplane receiver in the BIBI performs the following functions:

• locates the frame boundary

• performs inter-chip integrity checking

• unscrambles the incoming data streams

• outputs four STS-12 byte-wide data busses.

The BIBI divides the 311 MHz backplane clock down to 19 MHz and uses this as reference for the phase-locked loop (PLL). The PLL contains a 155 MHz voltage-controlled crystal oscillator (VCXO) that provides 19 MHz and 39 MHz timing for the circuit pack. The BIBI demultiplexes the 622 Mbit/s serial data streams down to four byte wide 78 Mbit/s data streams and passes these to the DSCAM circuit.

The BPR in the BIBI extracts an 8 kHz system timing signal from the position of the framing pattern in the incoming data and uses this as a reference signal for the PLL. The locked outputs of the PLL are fed back into the BIBI and used as a clock for the BPR.

The DSCAM provides point-to-point connections between the byte-wide STS-12 outputs from the BIBI and the GMAC circuits. The DSCAM uses up to 8 Mbytes of external Synchronous Dynamic RAM (SDRAM) in the GE to SONET direction in order to buffer frames for data bursts into a port that supports a lower data rate. No buffering is provided in the SONET to GE direction since there is no flow control mechanism on the SONET side. The DSCAM uses the 8 kHz timing signal from the BIBI as a reference for pointer processing. The DSCAM performs the following functions:

• processes the SONET overhead

• performs a demapping function, in which the Internet Protocol (IP) frames are extracted from the SONET payload

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• sends the IP data to the GMAC circuits at 77.76 Mbit/s

In each GMAC, the IP data is fed into a 2 kbytes first-in-first-out (FIFO). Using the data contained in the FIFO, the GMAC transmit circuits generate the following as part of the outgoing Ethernet packet:

• preamble

• start of frame delimiter (SFD)

• 32-bit cyclic redundancy check (CRC) data.

An 8-bit to 10-bit encoder in each GMAC encodes the 32-bit data stream into 10-bit symbols, in accordance with IEEE 802.3z. A 125 MHz clock signal from the SERDES transfers the data from each GMAC to the SERDES.

The SERDES accepts the two streams of 10-bit symbols at 125 Mbit/s and serializes the data into two single 1.25 Gbit/s data streams at ports 1 and 2.

The electro-optical interface (EOI) circuits perform electrical to optical conversion. A laser driver in the EOI accepts the data stream and generates a modulation current to drive the laser diode module (LDM). The laser driver provides a bias current to maintain the LDM at the correct bias threshold. The LDM converts the electrical data stream into an amplitude modulated optical output for transmission.

Receive directionThe Dual GE SX circuit pack receives two optical data streams at 1.25 Gbit/s. The two data streams are applied to associated EOI circuits, which convert the optical signals to electrical signals. The two electrical data streams are passed to the SERDES, which deserializes the data into two parallel 10-bit outputs at 125 Mbit/s. The SERDES recovers a clock from the incoming 1.25 Gbit/s data to produce two 62.5 MHz clocks, which are used to latch out the 10-bit data from the SERDES to each GMAC.

Each GMAC accepts the input data in the form of 10-bit parallel symbols and clocks each group of four symbols into a 40-bit register at 125 MHz. An encoder converts each group of four 10-bit symbols to 8-bit form in accordance with IEEE 802.3z, producing a 32-bit word, which is output every fourth clock cycle.

The GMAC receive module operates on each incoming Ethernet frame as follows:

• removes the preamble symbols

• removes the SFD

• checks the frame check sequence (FCS)

• checks for the correct frame length

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• captures the MAC control frames in the receive direction and initiates a response along the transmit direction

• captures and stores statistics from the received frames, allowing the receive statistics to be appended to frames sent to the DSCAM

The DSCAM maps the data between the Ethernet side and the OC-12 side. The receive circuits in the DSCAM accept the 32-bit data at 78 Mbit/s from the GMAC and the DSCAM performs point-to-point mapping, inserting the IP frames into the SONET payload. The DSCAM outputs four groups of 8-bit parallel data at 78 Mbit/s and passes these to the BIBI.

The outputs from the DSCAM are passed to the backplane driver (BPD) circuits of the BIBI. The BPD has a programmable frame offset that can be adjusted to align the SONET framing pattern with the system 8 kHz framing pulse on the switch module. This keeps the Dual GE SX circuit pack locked to the OC-192 system timing. The BPD scrambles the data and outputs the data as two groups of four data streams at 622 Mbit/s to the backplane. One group of four data streams is routed via the backplane to switch module A and the other group to switch module B.

Support circuitsThe following three circuits support the Dual GE SX circuit pack:

• the transport control subsystem, second generation (TCSII)

• the phase-locked loop (PLL)

• the point-of-use power supply (PUPS)

The TCSII provides performance monitoring, fault handling, propagation of status information to the shelf controller, and circuit pack provisioning.

The PLL uses the backplane clock to the BIBI to produce the 19 MHz clock. The PLL provides system timing to the circuit pack.

The PUPS uses the –48 V battery voltage from the shelf to produce the supplies required by the Dual GE SX circuit pack.

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Figure 1-29Dual GE SX circuit pack interface block diagram

DX3067_R3_SON

8

8

8

8

78 MHz1 Gbit/s

1.25 Gbit/sGE traffic

1.25 Gbit/s

125Mbit/s

78 Mbit/sSTS-Nc

4

LegendBIBI =

DSCAM =EOI =GE =

GMAC =N =

SERDES =STS =TCS =

Bi-directional Backplane InterfaceDual scalable mapperElectro-optical interfaceGigabit EthernetGigabit Ethernet Media Access Control3, 6, 12, or 24Serializer/deserializerSynchronous Transport SignalTransport Control Subsystem

G-MAC

G-MAC

EOI432

EOI

DualSERDES

TCS

BIBIDSCAM

622 Mbit/s(STS-Nc)

10

10 32

SwitchA

SwitchB

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Figure 1-30Dual GE SX circuit pack (external view)

DX3650p

1OUT IN

2OUT IN

Side view

iDual G E

12

2OUT IN

1OUT IN

1-2

Dual GE

12

1-2

Front view

Carrierhandle

Upperlatch

Lowerlatch

Fiber clip

Fiber carrier Optical connectors(4 places)

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OC-192 T/R interface (NTCA06)Note: The OC-192 transmit/receive (T/R) circuit pack is used in OPTera Connect DX bays only.

The OC-192 T/R interface circuit pack transmits and receives aggregate OC-192 traffic signals. Forty different variants of the circuit pack provide forty optical wavelength options. For more information, refer to SONET Planning and Ordering Guide NTRR10DG.

In the receive direction, the OC-192 T/R interface circuit pack performs the following functions:

• receive optical OC-192 traffic from the line and convert the traffic data to an STS-192 electrical signal

• remove the overhead bytes and demultiplex the electrical traffic data into 16 STS-12 (622 Mbit/s) data streams

• pass the 16 data streams through the backplane to the switch modules.

In the transmit direction, the OC-192 T/R interface circuit pack performs the following functions:

• receive 16 STS-12 data streams through the backplane from the switch modules

• multiplex the data streams up to the STS-192 data rate and insert the overhead bytes

• convert the signal from electrical to optical form and transmit the signal as OC-192 to the line

A microcontroller performs the control and monitoring functions for the T/R circuit pack and communicates with the shelf controller. An electro-optical controller (EOC) controls the electrical and optical functions in the circuit pack.

The circuit pack contains a motherboard and a daughterboard. The motherboard is the transmitter/receiver digital assembly (TRDA). The daughterboard is the optical transmit/receive (OTR) circuit. Figure 1-31 shows a block diagram of the OC-192 T/R circuit pack. Figure 1-32 shows an external view of the circuit pack.

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Transmitter/receiver digital assembly (TRDA)The TRDA contains the following functional blocks:

• synchronization driver receiver (SYDR)

• transmit/receive overhead processor (TROHP)

• 622 MHz voltage controlled crystal oscillator (VCXO)

• system clock generator (SCG)

• transmit control subsystem (TCS)

• phase detector

SYDRFour SYDR circuits provide a total of 16 STS-12 (622 Mbit/s) T/R interfaces, each SYDR containing four interfaces.

In the transmit direction, the function of the SYDR is as follows:

• receive data through the backplane bus from either of the switch modules A or B

• locate the frame in the incoming data and descramble the data streams

• perform forward error correction (FEC) and arrange the overhead (OH) bytes

• pass the data to the TROHP as 32 311 Mbit/s data streams with a clock signal

In the receive direction, the function of SYDR is as follows:

• accept 32 311 Mbit/s data streams from the TROHP with a 311 MHz clock

• locate the frame in the incoming data and descramble the data streams

• perform error correction and arrange the OH bytes

• arrange the data into 16 622 Mbit/s data streams and pass the data to the backplane bus to the switch modules

TROHPThe TROHP performs overhead processing in both the transmit and receive directions.

In the transmit direction, the function of the TROHP is as follows:

• receive 32 311 Mbit/s data streams from the four SYDRs and perform frame location and parity checking

• descramble the incoming data streams and convert the data from STS-12 to STS-192 format

• generate and insert line and section overhead information and scramble the data

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• convert the data to eight 1.2 Gbit/s data streams and pass the data to the multiplexer driver on the OTR circuit

In the receive direction, the function of the TROHP is as follows:

• receive eight 1.2 Gbit/s data streams from the multiplexer driver on the OTR circuit

• perform frame location and parity checking

• descramble the data streams

• calculate line and section errors and extract the K-bytes

• extract the overhead bytes

• format the data into 32 311 Mbit/s data streams and pass the data to the SYDR circuits

• generate a 39 MHz clock which drives a phase detector

VCXOThe VCXO provides the master clock signal for the system clock generator.

System clock generator (SCG)The SCG functions as a transmit clock generator. The SCG receives a 39 MHz clock signal from each of the switch modules and a 622 MHz clock from the VCXO. The circuit provides a differential phase output to lock the VCXO. The SCG also provides clock signals of 39 MHz and 622 MHz for the SYDRs.

Clock selection circuitIn this application, the clock selection circuit defaults to selection of the 39 MHz clock signal from the SCG. The output from the circuit drives a phase detector that provides a control output for the 10 GHz PLL on the OTR.

Optical transmit/receive (OTR)The OTR contains the following functional blocks:

• T/R optical assembly

• 1:8 demultiplexer

• electro-optical controller (EOC)

• 8:1 multiplexer

• phase-locked loop (PLL)

• continuous wave (CW) laser

• modulator

T/R optical assemblyThe T/R optical assembly receives an optical OC-192 signal from the line and converts it to an electrical signal using a photodiode. A low noise preamplifier then amplifies the signal to provide the STS-192 output to the demultiplexer module.

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Demultiplexer moduleThe demultiplexer module receives STS-192 traffic data from the T/R optical assembly and recovers a clock signal from the incoming data. The recovered clock signal clocks the 1:8 demultiplexer, producing 8-bit wide data at 1.2 Gbit/s. The module passes the eight data streams to the TROHP on the TRDA motherboard. The module also performs automatic gain control (AGC) on the incoming data.

Multiplexer driverThe multiplexer driver module contains a multiplexer and a driver. The multiplexer part multiplexes the 8-bit wide data from the TROHP into a single 10 Gbit/s (STS-192) data stream. The driver part of the module then amplifies the signal and passes it to the modulator.

ModulatorThe modulator receives the output signal from the multiplexer driver module and modulates this signal onto the light source from a continuous wave (CW) laser. The optical wavelength of the laser depends on the variant of OC-192 T/R circuit pack fitted. The modulator transmits the signal with enough power to launch the signal through 80 km of optical fiber.

PLLThe PLL circuit provides the 10 GHz line timing for the multiplexer driver module. The control input for the PLL is from the phase detector circuit on the TRDA.

DitherThe analog maintenance (AM) dither signal is a low frequency signal that is modulated into the laser output. The signal consists of a transmitted pattern representing the optical power level. The AM dither signal is recovered at the receiving end, where it is used to set the optical power of the outgoing signal to the correct level.

To reduce the occurrence of crosstalk with certain optical frequencies, two AM dither frequency options are provided, AM1 and AM2.

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Support circuitsThe following three circuits support the OC-192 T/R circuit pack:

• electro-optical controller (EOC)

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

EOCThe EOC circuit monitors the optical and electrical performance of the receiver modules and generates alarms. The EOC communicates its status and the condition of the input signal with the transport control subsystem (TCS) through a serial link. The TCS monitors this information and reports to the shelf controller (SC) if necessary. The EOC also stores calibration data.

PUPSThe PUPS generates all the voltages required by the OC-192 T/R interface.

TCSThe TCS controls the operation of the OC-192 T/R circuit pack and allows it to communicate with the shelf controller. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

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Figure 1-31OC-192 T/R interface block diagram

DX0632_SONET

8 8311 Mbit/s

data

8 81.

2 G

Hz

cloc

k

1.2

Gbi

t/s d

ata

4 4 4 4 4 4 4 4 4 44 4 4

A B A B

OC-192 STS-192 STS-192 OC-192

CWLaserEOC

1:8demux

Driver

PLL

10 GHzclock (rec)

SCG

SC

EOC

TCS

Phasedetector

VCXO

PUPS

8:1mux

Photo-diode,

preamp,AGC

d.c.supplies

Clockrecovery

d.c. supplies

48V d.c.

39 MHz

TRDA

OTR

16 x 622 Mbit/s data + 311MHz clocksto/from Switch Modules A and B

1.2

Gbi

t/s d

ata

1.2

GH

z cl

ock

Con

trol

Con

trol

CWEOCOTRPLLPUPSSCSCGSYDRTCSTRDATROHPVCXO

= Continuous wave= Electro-optical controller= Optical Transmit Receive= Phase-locked loop= Point of use power supply= Shelf Controller= System clock generator= Sync driver/receiver= Transport control subsystem= Transmitter receiver digital assembly= Transmit/receive overhead processor= Voltage controlled crystal oscillator

Legend

8 8311 Mbit/s

data

8 8311 Mbit/s

data

8 8311 Mbit/s

data

4

A B

4

A B

4

A B

SYDR

TROHP

SYDR SYDR SYDR

Modulator

TCS

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Figure 1-32OC-192 T/R interface circuit pack (external view)

DX0631

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector (Output)

Optical connector (Input)

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OC-192 DWDM TriFEC T/R interface (NTCF06)Note: The OC-192 DWDM T/R with triple forward error correction (TriFEC) interface circuit pack is only used in OPTera Connect DX network elements running OPTera Connect DX Release 2 or above.

The OC-192 DWDM TriFEC T/R interface circuit pack includes the functionality of the existing OC-192 DWDM T/R circuit pack with TriFEC. The OC-192 DWDM TriFEC T/R interface circuit pack provides TriFEC encoding in the transmit direction and TriFEC decoding in the receive direction. The OC-192 DWDM T/R circuit pack uses a single forward error correction (FEC) scheme to correct bit errors. To increase the FEC capability, TriFEC is implemented in the current SYDR 3 ASIC. This new ASIC (called TriFEC1 ASIC) is capable of performing: no FEC, FEC and TriFEC.

Transmit directionThe transmit circuitry of the OC-192 DWDM TriFEC T/R interface circuit pack receives 16 STS-12 serial streams from the backplane in switched applications. These signals are multiplexed together to form a serial NRZ electrical signal that is then converted to an optical signal. The OC-192 DWDM TriFEC T/R interface circuit pack performs the transmit and receive functions simultaneously.

Receive directionThe receive circuitry of the OC-192 DWDM TriFEC T/R interface circuit pack receives an optical signal and converts it to an electrical NRZ signal. The signal then demultiplexes to 16 STS-12 serial streams. The backplane interface is differential current mode logic (CML) with clocks for every two data links. Section and line overhead bytes are also monitored and inserted in both the transmit and receive paths. Selective path overhead monitoring is also performed. Backplane data can be active on either one of the two planes (‘A’ or ‘B’) in switched applications. The OC-192 DWDM TriFEC T/R interface circuit pack also receives two external clock signals, one from each switch for synchronization. One is selected to synchronize both the 622MHz and 10GHz phase locked loops (PLL).

See Figure 1-33 for a functional block diagram of the OC-192 DWDM TriFEC T/R interface. See Figure 1-34 for an external view of the OC-192 DWDM TriFEC T/R interface circuit pack.

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OC-192 DWDM TriFEC T/R wavelengthsFor information on the variants of this circuit pack refer to SONET Planning and Ordering Guide NTRR10DG.

For information on the plan of DWDM wavelength allocation, refer to the Optical Networks Applications Library (NTCA66BA).

Support circuitsThe following four circuits support the OC-192 DWDM TriFEC T/R interface:

• electro-optical controller (EOC)

• transport control subsystem (TCSII)

• point-of-use power supply (PUPS)

• phase-locked loops (PLLs)

The EOC controls:

• the operation of the electro-optical module and multiplexer driver

• the Receive supermodule

• the modulator

• the positive-intrinsic-negative (PIN) preamplifier module.

The TCSII controls the operation of the OC-192 DWDM TriFEC interface and provides communication between the shelf controller and this circuit pack. The TCSII also generates alarms and activates the LEDs on the OC-192 DWDM TriFEC circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 DWDM TriFEC interface.

Phase-locked loops are used to generate low-jitter, highly stable OC-192 data and clock signals.

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Figure 1-33OC-192 DWDM TriFEC T/R interface block diagram

DX4698p

TriFEC

622M 39M

2 2

5 7 6 8

TriFEC

622M 39M

39M

2 2

13 15 14 16

TriFEC

622M 39M

2 2

1 2 3 4

TriFEC

TROHP

CML

4x622M Data differential2xCKD311M differential

8 DataREF1 CK differential

8 DataREF1 CK differential

11

11

Tx

88

622M 39M

2 2

TIM_CLK

ERRSIG

2

Tx

Rx

STS12

9 11 10 12

XOR

FRMD8N, P

8KHz FramingPulse for BPD

FRM8QN, P

D9, 11 (A,B)

D10, 12

Q9, 11

D5, 7

Q5, 7

D1, 3

Q(1, 3)

D6, 8

D2, 4Q2, 4Q6, 8

C

P1SA1.2G

Socket

1.2GSocket

Clock Selection

Logic

STS12

A

P1SB

STS12

D

P1SC

STS12

B

P1SD

From BPR10 ECL8 Data1 CK differential

FRMD8N, P

FRMD8N, P

FRMD8N, P

1:4 ClockDistribution

FRMD8N, P

From modules

To modules

To 10G PLLon module board

REF_CLK

Switch or TDC

4x39MCKdifferential

4x622MCK

differential

SCG/PLL622M VCXO

Q10, 12

D13, 15

Q13, 15

Q14, 16

D14, 16

Legend

PLL = Phased-locked loopRx = ReceiveSCG = System clock generationTriFEC = Triple forward error correctionTROHP = Transmit receive overhead processorTx = TransmitVCXO = Voltage control crystal oscillator

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Circuit pack descriptions 1-77

Figure 1-34OC-192 DWDM TriFEC T/R interface circuit pack (external view)

DX3686p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector (Output)

Optical connector (Input)

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1-78 Circuit pack descriptions

OC-192 short reach T/R interface (NTWR06AB)Note: The OC-192 short reach (SR) T/R interface circuit pack is only used in OPTera Connect DX network elements running OPTera Connect DX Release 2 or above.

The OC-192 SR T/R interface circuit pack combines the functionality of the existing OC-192 SR T/R interface circuit pack with TriFEC. The existing circuit pack uses a single FEC scheme to correct bit errors. To increase forward error correction capabilities, an ASIC (called TriFEC1 ASIC) is introduced that is capable of performing no FEC, FEC and TriFEC.

Note: Although the OC-192 SR TriFEC T/R interface circuit pack is equipped with the new TriFEC1 ASIC, only no FEC and single FEC are performed in OPTera Connect DX Releases 3 and 4.

Transmit directionThe transmit circuitry of the OC-192 SR T/R interface circuit pack receives 16 STS-12 serial streams from the backplane in switched applications. These signals are multiplexed together to form a serial NRZ electrical signal that is then converted to an optical signal (the OC-192 SR T/R interface circuit pack performs the transmit and receive functions simultaneously).

Receive directionThe receive circuitry of the OC-192 SR T/R interface circuit pack receives an optical signal and converts it to an electrical NRZ signal. The signal then demultiplexes to 16 STS-12 serial streams. The backplane interface is differential CML with clocks for every two data links. Section and line overhead bytes are also monitored and inserted in both the transmit and receive paths. Selective path overhead monitoring is also performed. Backplane data can be active on either one of the two planes (‘A’ or ‘B’) in switched applications. The OC-192 SR T/R interface circuit pack also receives two external clock signals, one from each switch for synchronization. One is selected to synchronize both the 622MHz and 10GHz phase locked loops (PLL).

Figure 1-35 shows a functional block diagram of the OC-192 SR TriFEC T/R interface. Figure 1-36 shows an external view of the OC-192 SR TriFEC T/R interface circuit pack.

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Circuit pack descriptions 1-79

Support circuitsThe following four circuits support the OC-192 SR T/R interface circuit pack:

• electro-optical controller (EOC)

• transport control subsystem (TCS)

• point-of-use power supply (PUPS)

• phase-locked loops (PLL)

The EOC controls the operation of both the electro-optical module and multiplexer driver, the Receive supermodule, the modulator and the positive-intrinsic-negative (PIN) preamplifier module.

The TCS controls the operation of the OC-192 SR T/R interface circuit pack and provides communication between the shelf controller and this circuit pack. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 SR T/R interface circuit pack.

Phase-locked loops are used to generate low-jitter, highly stable OC-192 data and clock signals.

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1-80 Circuit pack descriptions

Figure 1-35OC-192 SR T/R interface block diagram

DX3699p_SONET

8 8

1.2

GH

z cl

ock

1.2

Gbi

t/s d

ata

A B

OC-192 STS-192 OC-192 OC-192

EOC

1:8Demux

Driver

PLL

10 GHzclock(rec)

SCG

SC

EOC

TCS

Phasedetector

VCXO

PUPS

8:1Mux

Photo-diode,

preamp,AGC

d.c. supplies

Clockrecovery

d.c. supplies

48V d.c.39 MHz

TRDA

OTR

16 x 622 Mbit/s data + 311MHz clocksto/from Switch Modules A and B

1.2

Gbi

t/s d

ata

1.2

GH

z cl

ock

Con

trol

Con

trol

TROHP

EML

TCS

TriFEC

4 4

A B

4 4

8 8311

Mbit/sdata

TriFEC

4 4

A B

4 4

8 8311

Mbit/sdata

TriFEC

4 4

A B

4 4

8 8311

Mbit/sdata

TriFEC

4 4

A B

4 4

8 8311

Mbit/sdata

EMLEOCOTRPLL

PUPSSC

= Electroabsorption modulated laser = Electro-optical controller= Optical transmit receive= Phase-locked loop= Point-of-use power supply= Shelf controller

Legend

SCGTCS

TRDATriFEC TROHP

VCXO

= System clock generator= Transport control subsystem= Transmitter receiver digital assembly= Triple forward error correction ASIC= Transmit/receive overhead processor= Voltage controlled crystal oscillator

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Circuit pack descriptions 1-81

Figure 1-36OC-192 SR T/R interface circuit pack

DX3686p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector (Output)

Optical connector (Input)

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1-82 Circuit pack descriptions

OC-192 intermediate reach T/R interface (NTWR06CA)Note: The OC-192 intermediate reach (IR) T/R interface circuit pack is only used in OPTera Connect DX network elements running OPTera Connect DX Release 4.1 or above.

The OC-192 IR T/R interface circuit pack is specifically designed for intermediate reach (within 40 km) applications.

The OC-192 IR T/R interface circuit pack can be installed in the same slots supported by the OC-192 SR T/R interface circuit pack. The OC-192 IR T/R interface circuit pack supports single FEC and no FEC.

Transmit directionThe transmit circuitry of the OC-192 IR T/R interface circuit pack receives 16 STS-12 serial streams from the backplane in switched applications. These signals are multiplexed together to form a serial NRZ electrical signal that is then converted to an optical signal (the OC-192 IR T/R interface circuit pack performs the transmit and receive functions simultaneously).

Receive directionThe receive circuitry of the OC-192 IR T/R interface circuit pack receives an optical signal and converts it to an electrical NRZ signal. The signal then demultiplexes to 16 STS-12 serial streams. The backplane interface is differential CML with clocks for every two data links. Section and line overhead bytes are also monitored and inserted in both the transmit and receive paths. Selective path overhead monitoring is also performed. Backplane data can be active on either one of the two planes (‘A’ or ‘B’) in switched applications. The OC-192 IR T/R interface circuit pack also receives two external clock signals, one from each switch for synchronization. One is selected to synchronize both the 622MHz and 10GHz phase locked loops (PLLs).

Figure 1-37 shows a functional block diagram of the OC-192 IR T/R interface. Figure 1-38 shows an external view of the OC-192 IR T/R interface circuit pack.

Support circuitsThe following four circuits support the OC-192 IR T/R interface circuit pack:

• electro-optical controller (EOC)

• transport control subsystem (TCS)

• point-of-use power supply (PUPS)

• phase-locked loops (PLL)

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Circuit pack descriptions 1-83

The EOC controls the operation of both the electro-optical module and multiplexer driver, the Receive supermodule, the modulator and the positive-intrinsic-negative (PIN) preamplifier module.

The TCS controls the operation of the OC-192 IR T/R interface circuit pack and provides communication between the shelf controller and this circuit pack. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 IR T/R interface circuit pack.

Phase-locked loops are used to generate low-jitter, highly stable OC-192 data and clock signals.

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1-84 Circuit pack descriptions

Figure 1-37OC-192 IR T/R interface block diagram

DX0632_SONET

8 8311 Mbit/s

data

8 81.

2 G

Hz

cloc

k

1.2

Gbi

t/s d

ata

4 4 4 4 4 4 4 4 4 44 4 4

A B A B

OC-192 STS-192 STS-192 OC-192

CWLaserEOC

1:8demux

Driver

PLL

10 GHzclock (rec)

SCG

SC

EOC

TCS

Phasedetector

VCXO

PUPS

8:1mux

Photo-diode,

preamp,AGC

d.c.supplies

Clockrecovery

d.c. supplies

48V d.c.

39 MHz

TRDA

OTR

16 x 622 Mbit/s data + 311MHz clocksto/from Switch Modules A and B

1.2

Gbi

t/s d

ata

1.2

GH

z cl

ock

Con

trol

Con

trol

CWEOCOTRPLLPUPSSCSCGSYDRTCSTRDATROHPVCXO

= Continuous wave= Electro-optical controller= Optical Transmit Receive= Phase-locked loop= Point of use power supply= Shelf Controller= System clock generator= Sync driver/receiver= Transport control subsystem= Transmitter receiver digital assembly= Transmit/receive overhead processor= Voltage controlled crystal oscillator

Legend

8 8311 Mbit/s

data

8 8311 Mbit/s

data

8 8311 Mbit/s

data

4

A B

4

A B

4

A B

SYDR

TROHP

SYDR SYDR SYDR

Modulator

TCS

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Circuit pack descriptions 1-85

Figure 1-38OC-192 IR T/R interface circuit pack

DX3686p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector (Output)

Optical connector (Input)

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1-86 Circuit pack descriptions

OC-192 long reach T/R with APD interface (NTWR06B)The OC-192 long reach (LR) T/R with avalanche photo diode (APD) interface circuit pack replaces the functionality of the existing OC-192 DWDM TriFEC T/R circuit pack in specific applications. The OC-192 LR T/R with APD interface circuit pack does not function as a DWDM network element, but operates in the transmission windows of 1533 ± 2.5nm and 1557 ± 2.5nm.

The triple forward error correction (TriFEC) function is implemented in the SYDR 4 ASIC. This ASIC is capable of performing no FEC, FEC and TriFEC. The TriFEC encoding is applied in the transmit direction and TriFEC decoding in the receive direction. In OPTera Connect DX network elements running OPTera Connect DX Release 1, the OC-192 LR T/R with APD interface circuit pack provides only single forward error correction (FEC) to correct bit errors. In OPTera Connect DX network elements running OPTera Connect DX Release 3 and above, the OC-192 LR T/R with APD interface circuit pack uses the TriFEC scheme.

Transmit directionThe transmit circuitry of the OC-192 LR T/R with APD interface circuit pack receives 16 STS-12 serial streams from the backplane in switched applications. These signals are multiplexed together to form a serial NRZ electrical signal that is then converted to an optical signal. The OC-192 LR T/R with APD interface circuit pack performs the transmit and receive functions simultaneously.

Receive directionThe receive circuitry of the OC-192 LR T/R with APD interface circuit pack receives an optical signal and converts it to an electrical NRZ signal. This signal is then demultiplexed to 16 STS-12 serial streams. The backplane interface is differential CML with clocks for every two data links. Section and line overhead bytes are also monitored and inserted in both the transmit and receive paths. Selective path overhead monitoring is also performed. Backplane data can be active on either one of the two planes (‘A’ or ‘B’) in switched applications. The OC-192 LR T/R with APD interface circuit pack also receives two external clock signals, one from each switch for synchronization. One is selected to synchronize both the 622MHz and 10GHz phase-locked loops (PLL).

Figure 1-39 shows a functional block diagram of the OC-192 LR T/R with APD interface. Figure 1-40 shows an external view of the OC-192 LR T/R with APD interface circuit pack.

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Circuit pack descriptions 1-87

Support circuitsThe following four circuits support the OC-192 LR T/R with APD interface:

• electro-optical controller (EOC)

• transport control subsystem (TCSII)

• point-of-use power supply (PUPS)

• phase-locked loops (PLL)

The EOC controls:

• the operation of the electro-optical module and multiplexer driver

• the Receive supermodule

• the modulator

• the avalanche photo diode (APD) preamplifier module.

The TCSII controls the operation of the OC-192 LR T/R with APD interface and provides communication between the shelf controller and this circuit pack. The TCSII also generates alarms and activates the LEDs on the faceplate of this circuit pack.

The PUPS generates all the voltages required by the OC-192 LR T/R with APD interface.

PLLs are used to generate low-jitter, highly stable OC-192 data and clock signals.

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1-88 Circuit pack descriptions

Figure 1-39OC-192 LR T/R with APD interface block diagram

DX4698p

TriFEC

622M 39M

2 2

5 7 6 8

TriFEC

622M 39M

39M

2 2

13 15 14 16

TriFEC

622M 39M

2 2

1 2 3 4

TriFEC

TROHP

CML

4x622M Data differential2xCKD311M differential

8 DataREF1 CK differential

8 DataREF1 CK differential

11

11

Tx

88

622M 39M

2 2

TIM_CLK

ERRSIG

2

Tx

Rx

STS12

9 11 10 12

XOR

FRMD8N, P

8KHz FramingPulse for BPD

FRM8QN, P

D9, 11 (A,B)

D10, 12

Q9, 11

D5, 7

Q5, 7

D1, 3

Q(1, 3)

D6, 8

D2, 4Q2, 4Q6, 8

C

P1SA1.2G

Socket

1.2GSocket

Clock Selection

Logic

STS12

A

P1SB

STS12

D

P1SC

STS12

B

P1SD

From BPR10 ECL8 Data1 CK differential

FRMD8N, P

FRMD8N, P

FRMD8N, P

1:4 ClockDistribution

FRMD8N, P

From modules

To modules

To 10G PLLon module board

REF_CLK

Switch or TDC

4x39MCKdifferential

4x622MCK

differential

SCG/PLL622M VCXO

Q10, 12

D13, 15

Q13, 15

Q14, 16

D14, 16

Legend

PLL = Phased-locked loopRx = ReceiveSCG = System clock generationTriFEC = Triple forward error correctionTROHP = Transmit receive overhead processorTx = TransmitVCXO = Voltage control crystal oscillator

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Circuit pack descriptions 1-89

Figure 1-40OC-192 LR T/R with APD interface circuit pack (external view)

DX3686p

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector (Output)

Optical connector (Input)

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1-90 Circuit pack descriptions

OC-192 XR (NTCA04)Note: The XR circuit pack is used in OC-192 regenerator bays only.

The OC-192 XR is a single regenerator interface that receives an OC-192 optical signal and processes the section overhead. The circuit also inserts the overheads into the outgoing payload. The XR multiplexes the data to a single serial STS-192 data stream and then converts this data stream to an optical OC-192 signal. The XR transmits the signal with enough power to drive 80 km of stream mode, seamless messaging (SM) optical fiber.

The OC-192 XR performs the following functions:

• receive OC-192 optical signals and demultiplex to 1.2 Gbit/s buses to the transmit receive overhead processor (TROHP)

• extract section overhead bytes

• transmit overhead bytes through the second generation transport control subsystem (TCS+) to the regenerator in the opposite direction

• insert the section overhead into the outgoing data

• support through timing

• multiplex 311 MHz, 32-bit wide data to serial STS-192

• convert serial STS-192 to optical OC-192 with 1528 nm to 1560 nm wavelengths, positive or negative chirp

• transmit the optical output signal with enough power to drive 80 km of optical fiber

The XR circuit pack also provides the following features:

• support downloadable firmware and software

• generate alarm indication signal (AIS) under input failure conditions—green, red and yellow faceplate LEDs

• provide unit control and maintenance at the TCS+, that also has a bottom latch release sensor

• provide software provisionable output power and chirp polarity using the Equipment menu of the NE UI

• provide editable circuit pack wavelength using the Equipment menu of the NE UI

See Figure 1-41 for a functional block diagram of the OC-192 XR. See Figure 1-42 for an external view of the OC-192 XR.

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Circuit pack descriptions 1-91

Support circuitsThe following three circuits support the OC-192 XR:

• separate electro-optical controllers (EOC) for electro-optical and high-speed module control

• the second generation transport control subsystem (TCS+)

• point-of-use power supply (PUPS)

The EOC controls the operation of both the electro-optical module and the multiplexer driver.

The TCS+ controls the operation of the OC-192 XR. The TCS+ provides communication between the shelf controller and the XR. The TCS+ also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 XR. The TCS+ monitors the supply voltage levels for lower than normal conditions.

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1-92 Circuit pack descriptions

Figure 1-41OC-192 XR block diagram

DX1383_SONET

SuperDemuxmodule

TROHP MUXDrivermodule

Electro-optic

module

STS-192STS-192 1.2 Gbit/s1.2 Gbit/s

8

TCS+

10 GHz VCO

EOC

ROA

Active(green)

To/fromShelf controller

Fail(red)

Legend:

EOCPUPSTCSTROHPROAVCO

= Electro-Optic Controller= Point-of-Use Power Supply= Transport Control Subsystem= Transmit Receive OverHead Processor= Receive Optical Amplifier= Voltage Controlled Oscillator

PUPS-48 V

+12 V

-12V

+3.3V

+5V

-5V

-12V

OC-192 OC-192

8

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Circuit pack descriptions 1-93

Figure 1-42OC-192 XR circuit pack (external view)

F5512-192_R60

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector(Output)

Optical connector(Input)

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1-94 Circuit pack descriptions

OC-192 merged XR/WT (NTCF04)Note: The transponder/regenerator (XR) circuit pack is used in OC-192 regenerator bays only.

The OC-192 merged XR/wavelength translator (WT) is a single regenerator interface that receives an OC-192 optical signal and processes the section overhead. The circuit also inserts the overheads into the outgoing payload. The merged XR/WT multiplexes the data to a single serial STS-192 data stream and then converts this data stream to an optical OC-192 signal. The merged XR/WT transmits the signal with enough power to drive 80 km of single mode optical fiber.

Note: When installed in a OC-192 bay, the NTCF04 circuit pack operates only as an XR. The NTCF04 circuit pack can be equipped as a WT in an OPTera Long Haul 1600 Repeater network element. The added functionality of Traffic Mode provisioning to (3R) is supported. For more information, refer to the OPTera Long Haul 1600 Release 7 Repeater NE Network Application Guide, NTY316AG.

The OC-192 merged XR/WT circuit pack performs the following functions:

• receive OC-192 optical signals and demultiplex to 1.2 Gbit/s buses to the transmit receive overhead processor (TROHP)

• extract section overhead bytes

• transmit overhead bytes through the second generation transport control subsystem (TCS+) to the regenerator in the opposite direction

• insert the section overhead into the outgoing data

• support through timing

• multiplex 311 MHz, 32-bit wide data to serial STS-192

• convert serial STS-192 to optical OC-192 with 1528 nm to 1560 nm wavelengths, positive or negative chirp

• transmit the optical output signal with enough power to drive 80 km of optical fiber

The merged XR/WT circuit pack also provides the following features:

• support for downloadable firmware and software

• generation of alarm indication signal (AIS) under input failure conditions (green, red and yellow faceplate LEDs)

• unit control and maintenance at the TCS+

• a bottom latch release sensor

• software provisionable output power and chirp polarity using the Equipment menu of the NE UI

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Circuit pack descriptions 1-95

See Figure 1-43 for a functional block diagram of the OC-192 merged XR/WT. See Figure 1-44 for an external view of the OC-192 merged XR/WT.

Support circuitsThe following three circuits support the OC-192 merged XR/WT:

• separate electro-optical controllers (EOCs) for electro-optical and high-speed module control

• the second generation transport control subsystem (TCS+)

• point-of-use power supply (PUPS)

The EOC controls the operation of both the electro-optical module and the multiplexer driver.

The TCS+ controls the operation of the OC-192 merged XR/WT. The TCS+ provides communication between the shelf controller and the merged XR/WT. The TCS+ also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 merged XR/WT. The TCS+ monitors the supply voltage levels for lower than normal conditions.

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1-96 Circuit pack descriptions

Figure 1-43OC-192 merged XR/WT block diagram

DX1383_SONET

SuperDemuxmodule

TROHP MUXDrivermodule

Electro-optic

module

STS-192STS-192 1.2 Gbit/s1.2 Gbit/s

8

TCS+

10 GHz VCO

EOC

ROA

Active(green)

To/fromShelf controller

Fail(red)

Legend:

EOCPUPSTCSTROHPROAVCO

= Electro-Optic Controller= Point-of-Use Power Supply= Transport Control Subsystem= Transmit Receive OverHead Processor= Receive Optical Amplifier= Voltage Controlled Oscillator

PUPS-48 V

+12 V

-12V

+3.3V

+5V

-5V

-12V

OC-192 OC-192

8

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Circuit pack descriptions 1-97

Figure 1-44OC-192 merged XR/WT circuit pack (external view)

F5512-192_R60

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector(Output)

Optical connector(Input)

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1-98 Circuit pack descriptions

DX1383_SDH

SuperDemuxmodule

TROHP MUXDrivermodule

Electro-optic

module

STM-64STM-64 1.2 Gbit/s1.2 Gbit/s

TCS+

10 GHz VCO

EOC

ROA

Active(green)

To/fromShelf controller

Fail(red)

Legend:

EOCPUPSTCSTROHPROAVCO

= Electro-Optic Controller= Point-of-Use Power Supply= Transport Control Subsystem= Transmit Receive OverHead Processor= Receive Optical Amplifier= Voltage Controlled Oscillator

PUPS-48 V

+12 V

-12V

+3.3V

+5V

-5V

-12V

STM-64 STM-64

8 8

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Circuit pack descriptions 1-99

OC-192 DWDM transmit interface (NTCA01)Note: The OC-192 DWDM transmit interface circuit pack is used in the OC-192 bays only.

The OC-192 DWDM transmit interface aligns with a 100 GHz optical frequency grid that is a subset of the complete ITU-T grid. The DWDM transmit interface receives traffic as sixteen STS-12 serial links from both switch modules and transmits these as an OC-192 signal.

The OC-192 DWDM transmit interface is available in 32 different wavelengths.

The OC-192 DWDM transmit interface performs the following functions:

• insert section and line overhead bytes

• encode the overhead for forward error correction (FEC)

• select the data and clock coming from switch module A or B

• synchronize the data with the system clock

• transmit the OC-192 signal with enough power to drive 80 km of optical fiber

The OC-192 DWDM transmit interface also provides the following features:

• software provisionable output power and chirp polarity using the Equipment menu of the NE UI.

• editable circuit pack wavelength using the Equipment menu of the NE UI screen

See Figure 1-45 for a functional block diagram of the OC-192 DWDM transmit interface. See Figure 1-46 for an external view of the OC-192 DWDM transmit interface circuit pack.

Each backplane receiver (BPR) interface receives four groups of four data streams of 622 Mbit/s STS-12 data from switch module A or B. The forward error correction (FEC) circuit receives the sixteen data signals and encodes the overhead for FEC.

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1-100 Circuit pack descriptions

The transmit overhead processor (TOHP) has the following functions:

• descramble the incoming data

• generate and insert line and section framing bytes

• insert overhead bus information

• scramble the data

The TOHP then passes the data to the transmit intermediate multiplexer (TIM) which outputs eight data lines. The multiplexer driver module then converts the eight data lines to one STS-192 electrical signal. The electro-optical module then converts the STS-192 electrical signal to an OC-192 optical signal, and launches the signal through optical fiber.

This circuit pack also features a bottom latch release sensor, which alerts the system of circuit pack removal.

OC-192 DWDM transmitter wavelengthsFor information on the variants of this circuit pack refer to SONET Planning and Ordering Guide NTRR10DG.

For information on the plan of DWDM wavelength allocation, refer to the Optical Networks Applications Library (NTCA66BA).

Support circuitsThe following three circuits support the OC-192 DWDM transmit interface:

• the electro-optical controller (EOC)

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The EOC controls the operation of both the electro-optical module and multiplexer driver.

The TCS controls the operation of the OC-192 DWDM transmit interface. The TCS provides communication between the shelf controller and the OC-192 DWDM transmit interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 DWDM transmit interface.

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Circuit pack descriptions 1-101

Figure 1-45OC-192 DWDM transmit interface block diagram

DX1370_SONET

BPR

TOHPFEC TIM MUXDrivermodule

Electro-optic

module

BPR

BPR

BPR

OC-192STS-192

A

B

A

B

A

B

A

B

16 x

622

Mbi

t/s fr

om S

witc

h m

odul

e A

16 x

622

Mbi

t/s fr

om S

witc

h m

odul

e B

TCS+

10 GHz VCO

EOC

Legend:BPREOCFECPUPSTCSTOHPTIMVCO

= BackPlane Receiver= Electro-Optical Controller= Forward Error Correction= Point-of-Use Power Supply= Transport Control Subsystem= Transmit OverHead Processor= Transmit Intermediate Multiplexer= Voltage Controlled Oscillator PUPS-48 V

+12 V

-12V

+3.3V

+5V

-5V

-8V

Active(green)

To/fromShelf controller

Fail(red)

4

4

4

4

4

4

4

4

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Figure 1-46OC-192 DWDM transmit interface circuit pack (external view)

F5514-192_R60

Fail (Red)

Active (Green)

Optical connector(Output)

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OC-192 DWDM regenerator/transmit interface (NTCA03)Note: The OC-192 regenerator/transmit interface circuit pack is used in the OC-192 regenerator bays only.

The OC-192 DWDM regenerator/transmit (Rg/Tx) interface receives an STS-192 electrical signal from the OC-192 receive interface and transmits an OC-192 optical signal. The OC-192 DWDM Rg/Tx interfaces are available with the same wavelengths as the OC-192 DWDM transmit interfaces.

The OC-192 DWDM Rg/Tx interface performs the following functions:

• process the section overhead

• convert the serial STS-192 electrical signal into an optical signal

The OC-192 DWDM Rg/Tx interface also makes available the following features:

• software provisionable output power and chirp polarity from the NE UI Equipment menu

• edit circuit pack wavelengths from the NE UI Equipment menu

Note: The previous two features are only available with Release 3 or above of the OC-192 software load.

Figure 1-47 shows a functional block diagram of the OC-192 DWDM Rg/Tx interface. Except for the external label, the OC-192 DWDM Rg/Tx circuit pack looks identical to the OC-192 DWDM transmit interface circuit pack shown in Figure 1-46.

The OC-192 DWDM Rg/Tx interface receives a 32-bit wide 311 Mbit/s electrical signal from the OC-192 receiver through the shelf backplane. The circuit outputs the data as sixteen STS-12 data streams.

The TOHP performs the following tasks:

• descrambles the incoming data

• generates and inserts section framing bytes

• inserts overhead information

• scrambles the data again

• passes the data to the TIM, which outputs eight data lines

The multiplexer driver module converts the eight data lines to one STS-192 serial signal. The electro-optical module converts the STS-192 electrical signal to an optical signal, and launches the optical signal through optical fiber.

This circuit pack also has a bottom latch release sensor, which alerts the system of circuit pack removal.

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Support circuitsThe following three support circuits are part of the OC-192 DWDM Rg/Tx interface:

• the electro-optical controller (EOC)

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The EOC controls the operation of the electro-optical module and multiplexer driver.

The TCS controls the operation of the OC-192 DWDM Rg/Tx interface. The TCS provides communication between the shelf controller and the OC-192 DWDM Rg/Tx interface. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 DWDM Rg/Tx interface.

VariantsFor information on the variants of this circuit pack, refer to SONET Planning and Ordering Guide NTRR10DG.

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Figure 1-47OC-192 DWDM regenerator/transmit interface block diagram

DX1371_SONET

TOHP TIM MUXDrivermodule

Electro-optic

module

OC-192STS-192

TCS+

10 GHz VCO

EOC

ROHP311 Mbit/s

32

Legend:

EOCPUPSTCSROHPTIMTOHPVCO

= Electro-Optic Controller= Point-of-Use Power Supply= Transport Control Subsystem= Receive OverHead Processor= Transmit Intermediate Multiplexer= Transmit OverHead Processor= Voltage Controlled Oscillator

Active(green)

Fail(red)

To/fromShelf controller

PUPS-48 V

+12 V

-12V

+3.3V

+5V

-5V

-12V

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OC-192 short reach receive interface (NTCA02)Note: The OC-192 short reach (SR) receive interface is used in the OC-192 bays only.

The OC-192 SR receive circuit pack acts as the interface between the incoming optical signal and the OC-192 demultiplexer.

The OC-192 SR receive interface performs the following functions:

• amplify the incoming optical signal

Note: For the OC-192 SR receive interface, the signal goes into the positive-intrinsic-negative (PIN) preamplifier module.

• convert the OC-192 optical signal into an STS-192 electrical signal

• demultiplex the STS-192 into a 32-bit wide signal

• provide optical performance information

Figure 1-48 shows a functional block diagram of the OC-192 SR receive interface. Figure 1-49 shows an external view of the OC-192 SR receive interface circuit pack.

The incoming OC-192 optical signal first goes to the PIN preamplifier module where the signal converts to an STS-192 electrical signal. The equalizer and demultiplexer convert the STS-192 signal into eight data streams and transmit them to the receiver intermediate demultiplexer (RID). The RID accepts these signals and demultiplexes them to a 32-bit wide STS-192 output. This signal then goes to the OC-192 demultiplexer through the shelf backplane.

The OC-192 SR receive interface also has a bottom latch release sensor, which alerts the system of circuit pack removal. If the circuit pack is active and protection is available, the circuit pack switches the traffic.

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Support circuitsThe following circuits support the OC-192 SR receive interfaces:

• the electro-optical controller (EOC)

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The main functions of the EOC are as follows:

• generate the alarms, optimize the parameters of the received STS-192 signal (overall gain, clock and data timing, and threshold level)

• monitor the optical and electrical performances of the receiver modules

The TCS is the on board computer for the supervision of the OC-192 SR receive interfaces. The TCS provides communication between the shelf controller and the EOC.

The TCS receives information about the module status, the condition of the input signal from the EOC and other information. The TCS sends this information to the shelf controller. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 SR receive interfaces.

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Figure 1-48OC-192 SR receive interface block diagram

DX1372_SONET

OC-192 STS-192

Legend

TCS+

PIN/preamp

Superdemuxmodule

Equalizer RIDSR Rx

EOC

STS-192to OC-192 Demux

32

PUPS-48 V

EOCPUPSRIDSR RxTCS

= Electro-optic controller= Point-of-use power supply= Receive interface demultiplexer= Short reach receiver= Transport controlled subsystem

Active(green)

Fail(red)

LOS(yellow)

To/fromShelf controller

+12 V

-12V

+5V

-5V

-6.5V

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Figure 1-49OC-192 SR receive interface circuit pack (external view)

F5513-192_R60

LOS (Yellow)

Fail (Red)

Active (Green)

Optical connector(Input)

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OC-192 demultiplexer (NTCA05)Note: The OC-192 demultiplexer is used in the OC-192 bays only.

The OC-192 demultiplexer processes the STS-192 data sent by the receive interface and sends it to the switch modules.

The main functions of the OC-192 demultiplexer are as follows:

• extract the transport overhead and send it to the shelf backplane

• synchronize the incoming signal with the shelf clock

• transmit section data communications channel (SDCC) and line data communications channel (LDCC) to the shelf backplane

Figure 1-50 shows a functional block diagram of the OC-192 demultiplexer. Figure 1-51 shows an external view of the OC-192 demultiplexer circuit pack.

Incoming STS-192 data from the OC-192 receive interface goes through the receive overhead processor (ROHP), which reads and processes the overhead. The STS-192 signal then splits into STS-48 data streams and goes to the FEC, which performs forward error correction. The synchronization (SYNC) module receives the data streams and synchronizes them to the shelf clock before passing them to the BPD. Two identical signals (each equivalent to an STS-48) from each of the four BPDs, go to the switch modules through the shelf backplane.

This circuit pack also features a bottom latch release sensor. The sensor alerts the system of circuit pack removal, and switches the traffic if the circuit pack is active and protection is available.

Support circuitsThe following two circuits support the OC-192 demultiplexer:

• the transport control subsystem (TCS)

• the point-of-use power supply (PUPS)

The TCS controls the operation of the OC-192 demultiplexer. The TCS provides communication between the shelf controller and the different modules on the OC-192 demultiplexer. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 demultiplexer.

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Figure 1-50OC-192 demultiplexer block diagram

DX1260_SONET

TCS+

32

FEC SYNC

FEC

FEC

FEC

SYNC

SYNC

SYNC

ROHP

BPD

BPD

BPD

BPD

A4

44

4

4

4

4

4

B

A

B

A

B

A

B

ParallelSTS-192 fromRx Interface

LDCC/SDCCto OC-192

16 x 622 Mbit/s toSwitch module A

16 x 622 Mbit/s toSwitch module B

+3.3 V

+5V

-5V

-2V

Legend

BPDFECLDCCPUPSROHPSCGSDCCSYNCTCS

= Backplane driver= Forward error correction= Line data communications channel= Point-of-use power supply= Receive overhead processor= System clock generation= Section data communications channel= Synchronization module= Transport controlled subsystem

Active(green)

Fail(red)

To/fromShelf controller

PUPS-48 V

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Figure 1-51OC-192 demultiplexer circuit pack (external view)

F3183-2-192

Latch

Fail (Red)

Active (Green)

Latch

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Switch module (NTCA26, NTCA24)The switch module supports the OC-192 optical units required in add/drop multiplexer (ADM) configurations. The switch module performs all the switching functions required for the OC-192 system. The two switch modules, A and B, operate as a working and protection pair in a 1+1 configuration.

This section describes the following switch modules:

• DX65 (NTCA26AA) - OPTera Connect DX bays only

• DX100 (NTCA26BA) - OPTera Connect DX bays only

• DX140 (NTCA26CA) - OPTera Connect DX bays only

• Data overhead switch (DOS) switch module (NTCA24AA) - OC-192 bays only

Note 1: The functional architectures of the DX65 and DOS switch modules are common to each other and throughput is the same.

Note 2: The DX140 switch module is required when the network element is configured as the hub network element in a dual 4-Fiber Ring configuration and when the network element is configured as an unprotected hub. The DX100 switch module is used in the single 4-Fiber Ring configuration.

The DX65, DX100, and DX140 switch modules are used in OPTera Connect DX network elements with the following circuit packs:

• OC-192 DWDM T/R interface (NTCA06)

• OC-192 DWDM TriFEC T/R (NTCF06)

• OC-192 short reach (SR) T/R (NTWR06AA)

• OC-192 intermediate reach (IR) T/R (NTWR06CA)

• OC-192 SR TriFEC T/R (NTWR06AB)

• OC-192 long reach (LR) T/R with APD (NTWR06B)

The DOS switch module NTCA24 is used in OC-192 network elements with the following circuit packs:

• OC-192 DWDM transmit interface (NTCA01)

• OC-192 DWDM Rg/Tx (NTCA03)

• OC-192 SR receive interface (NTCA02)

• OC-192 demultiplexer (NTCA05)

• OC-192 XR (NTCA04)

• OC-192 merged XR/WT (NTCF04)

• OC-192 RxVOA merged XR/WT (NTCF14)

• MOR (NTCA11AK, NTCA11BK or NTCA11CK)

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• MOR Plus (NTCA11NK, NTCA11PK, NTCA11JK or NTCA11KK)

The switch modules perform the following functions:

• synchronization

• traffic handling

• protection switching

• overhead switching

• other control functions

This circuit pack features a bottom latch release sensor. The sensor alerts the system of circuit pack removal, and switches the traffic if the circuit pack is active and protection is available.

Figure 1-52 shows a block diagram for the DX65 and standard DOS switch module. Figure 1-53 shows a block diagram for the DX100 and DX140 switch modules. Figure 1-54 shows an external view of the switch module.

Data overhead switchThe main switch processing circuit consists of three DOS stages: first, mid and third stage (see Figure 1-52). All outputs from the first DOS stage cross-connect to all inputs of the second stage. The connections between the mid and third stages are a mirror image of those between the first and mid stages. The first and third DOS stages perform timeslot interchange functions. The required interchange pattern is programmed into the memory of the stage. The mid stage performs the main routing and switching function.

SynchronizationThe switch module receives three different reference clock signals: two come from the external synchronization interface (ESI), and one from the other switch module. From these three clock signals, the switch module selects a reference and locks its local voltage-controlled crystal oscillator (VCXO) to that clock signal.

The switch module provides clock and frame signals for the OC-192 demultiplexers and OC-192 transmit interfaces of the main shelf. The switch module also performs clock and frame handoff at each input port to align the data before time slot interchange (TSI). The switch module also performs reference switches while maintaining the least possible phase error between the VCXOs of the two switch modules.

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Traffic handlingThe switch module handles the traffic data passing between the OC-192 T/R circuit pack and the tributaries. The traffic handling capacity of the switch module is determined by the DOS TSI arrays. All circuit packs in the main transport shelf operate as working and protection pairs. There are no unprotected tributaries.

DX65The DX65 switch module has a maximum bandwidth capacity of 60 Gbit/s of traffic. The bandwidth is divided as follows:

• four OC-192 (total 40 Gbit/s) line traffic

• eight OC-48 tributaries (total 20 Gbit/s)

A maximum of eight OC-48 or Quad OC-12 tributaries are used in this application. The maximum total usage for the switch module is 60 Gbit/s.

The DX65 switch module does not support the extension shelf.

DX100The DX100 switch module has a maximum bandwidth capacity of 100 Gbit/s of traffic, the bandwidth is divided as follows:

• four OC-192 (total 40 Gbit/s) line traffic

• sixteen OC-48 tributaries (total 40 Gbit/s) in the main shelf

• eight OC-48 tributaries (total 20 Gbit/s) in the extension shelf

Only a maximum of eight OC-48 or eight Quad OC-12 tributaries (total 20 Gbit/s) are used in the main shelf for this application, so that the maximum total usage for the switch module is 80 Gbit/s.

DX140The DX140 switch module has a maximum bandwidth capacity of 140 Gbit/s of traffic, the bandwidth is divided as follows:

• eight OC-192 (total 80 Gbit/s) line traffic

• sixteen OC-48 tributaries (total 40 Gbit/s) in the main shelf

• eight OC-48 tributaries (total 20 Gbit/s) in the extension shelf

Only a maximum of eight OC-48, eight Quad OC-3 or eight Quad OC-12tributaries (possible total 20 Gbit/s) are used in the main shelf of this application, so that the maximum total usage for the switch module is 120 Gbit/s.

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TributariesThe rules that determine the maximum number of working and protection tributaries for which the switch module handles traffic are summarized in Table 1-3. The number given in the table is the maximum number of circuit packs of that type with no other tributary interfaces present:

The following rules state the maximum number of working and protection tributaries for which the switch module handles traffic:

• a maximum of four working and four protection Quad OC-3 T/R interfaces with no other tributary interfaces present

• a maximum of four working and four protection HD OC-3 T/R interfaces with no other tributary interfaces present (with either the DX100 or DX140 switch module only)

• a maximum of eight working and eight protection half-height OC-12 T/R interfaces with no other tributary interfaces present (OC-192 network elements only)

• a maximum of four working and four protection Quad OC-12 T/R interfaces with no other tributary interfaces present

Table 1-3Tributary allocation

T/R Interface(see Note1)

Main shelf Extension shelf(see Note2)

OPTera Connect DX OC-192

Working Protection Working Protection Working Protection

Quad OC-3 4 4 4 4 4 4

HD OC-3 4 4 - - 4 4

Half-height OC-12 - - 4 4 - -

Quad OC-12 4 4 4 4 4 4

OC-48 4 4 4 4 4 4

Dual OC-48(see Note3)

4 4 - - - -

Quad OC-48 4 4 - - - -

Dual GE 4 4 - - 4 4

Note 1: If the network element protection mode set to protected, all tributary circuit packs operate as working and protection pairs (there are no unprotected tributaries). If the network element protection mode is set to unprotected, there can be mixed unprotected and protected tributaries on a port-basis.

Note 2: The extension shelf is not applicable if the switch module is a DX65.

Note 3: The Dual OC-48 tributary circuit packs are not supported in the extension shelf.

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• a maximum of four working and four protection OC-48 T/R interfaces with no other tributary interfaces present

• a maximum of four working and four protection Dual OC-48 T/R interfaces with no other tributary interfaces present (with either the DX100 or DX140 switch module only)

• a maximum of four working and four protection Dual GE interfaces with no other tributary interfaces present

• combinations of working and protection circuit packs, adding up to a maximum bandwidth of 192 STS-1 signals

– Quad OC-3 T/R

– HD OC-3 T/R

– half-height OC-12 T/R (OC-192 only)

– Quad OC-12 T/R

– OC-48 T/R

– Dual OC-48 T/R (SR, IR and LR)

– STS-48 T/R electrical

– Dual GE (unprotected) (see Note 3)

Note 1: Each working circuit pack of any type must have the same type of protection circuit pack in the adjacent slot in the shelf.

Note 2: The circuit packs used are dependant on the shelf configuration.

Note 3: The Dual GE circuit pack can only be used as an unprotected tributary circuit pack. However, the network element in which it is provisioned can be either protected or unprotected.

The data from the tributaries arrives as differential serial STS-12. Each STS-12 data stream demultiplexes to STS-1 data streams and calculates the appropriate connection map to perform time slot interchange on the data.

The data multiplexes to its original format before transmitting to the appropriate transmit interface.

Protection switchingThe switch module calculates and stores appropriate connection map contents for each possible line or tributary protection switch scenario, according to the network element configuration. If a line or tributary equipment protection switch is necessary, the system writes the appropriate DOS connection memory locations to perform the required protection switch.

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When a network protection switch is necessary, the switch module performs K-byte processing and insertion. The switch module also calculates connection map changes, and updates the connection memories within SONET protection switching time limits.

Overhead switchingThe switch module also performs overhead switching. To perform overhead switching, the DOS array uses an overhead connection map instead of a data connection map. During the overhead time slots, the circuit routes some internal overhead bytes in the STS-12 data streams along separate paths through the DOS. Some overhead bytes then arrive at a different destination to that of the data with which they arrived.

The overhead connection map forms a pair of internal Rx buffers and a pair of internal Tx buffers. Each frame transmits the content of the Rx buffers over a pair of receive overhead (RXOH) links. The frame also receives the content of the Tx buffers over a pair of transmit overhead (TXOH) links. The switch module sets up the overhead connection map to switch each set of overhead bytes of any STS-1 output exiting the DOS.

Other control functionsThe switch module provides the following other control functions:

• illuminate the front panel green LED when carrying traffic, and extinguish the LED when traffic fails

• communicate with the microcontroller on the second switch module through a dedicated link to exchange status and control information

• communicate with the control shelf through a GraceLAN link

• monitor DOS circuits, phase-locked loop (PLL) and PUPS for failure

• provide an RS-232 debug port for testing and background debug mode (BDM) port for initial programming

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Support circuitsThe following two circuits support the OC-192 switch modules:

• TCS

• PUPS

The TCS controls the operation of the OC-192 switch module. The TCS provides communication between the shelf controller and other circuits on the switch module. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the OC-192 switch module.

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Figure 1-52DX65 and DOS switch modules functional block diagram

DX1478_SONET

To/fromShelf controller

via MX

ESI A

PLL

622 MHz,frame62

2 M

Hz,

fram

e

622 MHz, frame

622 MHz,frame39 MHz

39 MHz

622 MHz

To main shelf,extension shelfshelf (if used)

Timinginterlock

FrompartnerSwitch

ESI B

622 MHzVCXO

PrimarySCG

SecondarySCG

6464

32 32

64 x 622 Mbit/sto Line interfaces(= 4 x STS-192)

64 x 622 Mbit/sfrom Line interfaces(= 4 x STS-192)

32 x 622 Mbit/sto tributary interfaces = 8 x STS-48 (max) = 32 x STS-12 (max) = 32 x STS-3 (max)(Max available = 64 x STS-12)

32 x 622 Mbit/sfrom tributary interfaces = 8 x STS-48 (max) = 32 x STS-12 (max) = 32 x STS-3 (max)(Max available = 64 x STS-12)

FIRSTDOS

STAGE

THIRDDOS

STAGE

MIDDOS

STAGE

TSI ARRAY

RXOH TXOH

+12V+5V+3.3V-5 V-12V

-48V PUPS

PUPSmonitors

Active (green)

Fail (red)

Optical signal fail(yellow)

TCS

Legend

DOS = Data overhead switchESI = External Synchronization interfaceMX = Message exchangePLL = Phase-locked loopPUPS = Point-of-use power supplyRXOH = Receive overheadTCS = Transport control subsystemTSI = Time slot interchangeTXOH = Transmit overheadVCXO = Voltage controller crystal oscillator

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Figure 1-53DX100 and DX140 switch modules functional block diagram

DX1479_SONET

To/fromShelf controller

via MX

ESI A

PLL

622 MHz,frame62

2 M

Hz,

fram

e

622 MHz, frame

622 MHz,frame39 MHz

39 MHz

622 MHz

To main shelf,extension shelfshelf (if used)

Timinginterlock

FrompartnerSwitch

ESI B

622 MHzVCXO

PrimarySCG

SecondarySCG

64 or 128 64 or 128

64 64

From Line interfaces:DX100: 64 x 622 Mbit/s(= 4 x STS-192)DX140: 128 x 622 Mbit/s(= 8 x STS-192)

To Line interfaces:DX100: 64 x 622 Mbit/s(= 4 x STS-192)DX140: 128 x 622 Mbit/s(= 8 x STS-192)

From tributary interfaces(main + extension shelves):64 x 622 Mbit/s = 16 x STS-48 (max) = 64 x STS-12 (max) = 64 x STS-3 (max)(Max available = 96 x STS-12)

To tributary interfaces(main + extension shelves):64 x 622 Mbit/s = 16 x STS-48 (max) = 64 x STS-12 (max) = 64 x STS-3 (max)(Max available = 96 x STS-12)

FIRSTDOS

STAGE

THIRDDOS

STAGE

MIDDOS

STAGE

TSI ARRAY

RXOH TXOH

+12V+5V+3.3V-5 V-12V

-48V PUPS

PUPSmonitors

Active (green)

Fail (red)

Optical signal fail(yellow)

TCS

Legend

DOS = Data overhead switchESI = External Synchronization interfaceMX = Message exchangePLL = Phase-locked loopPUPS = Point-of-use power supplyRXOH = Receive overheadTCS = Transport control subsystemTSI = Time slot interchangeTXOH = Transmit overheadVCXO = Voltage controller crystal oscillator

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Figure 1-54Switch module (external view)

DX2990p

Active(Green)

Circuit pack fail (Red)

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MOR (NTCA11)The multiwavelength optical repeater (MOR) operates in bidirectional DWDM line amplified systems. Figure 1-57 shows an external view of the MOR circuit pack.

MOR and optical service channel module optionsThe following three versions of the MOR amplifier circuit pack are supported (see Figure 1-55):

• MOR with 1510 nm optical service channel (OSC), NTCA11AK

• MOR without OSC, NTCA11BK

• 1625 nm OSC, NTCA11CK

Figure 1-55MOR and OSC unit options

F3752

OSCλ1510

•••

λ1B Ch

λ4B Ch

•••

λ1R Ch

λ4R Ch

λ OSC 1510

OSCλ1625

λ OSC 1625

•••

λ1B Ch

λ4B Ch

•••

λ1R Ch

λ4R Ch

NTCA11Bx NTCA11Ax NTCA11Cx

Legend

B = BlueCh = ChannelOSC = Optical service channelR = Red

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DescriptionThe MOR circuit pack contains the following components.

MOR with 1510 nm OSC - NTCA11AKThe MOR with 1510 nm OSC optically amplifies counter-propagating optical signals which are symmetrically allocated into two wavelength bands: the Red band and the Blue band. The MOR can amplify a total of sixteen wavelengths (16 λ), with eight wavelengths (8 λ) assigned to co-propagate in each wavelength band.

The MOR unit also supports a unidirectional out-of-band 1510 nm OSC for supervisory purposes. The 1510 nm supervisory channel co-propagates with the Red band channel.

Add/drop wavelength division multiplexing (WDM) couplers embedded into the MOR Red band amplifier path provide optical access to the 1510 nm OSC. Because the OSC integrates into the MOR amplifier gain block, you do not require external add/drop couplers and optical fiber patches. Support of integrated 1510 nm OSC option on MOR does not erode loss budgets between sites. Figure 1-56 shows the functional block diagram of the MOR with 1510 nm OSC.

MOR without OSC - NTCA11BKThis MOR optically amplifies counter-propagating optical signals that are symmetrically allocated into two wavelength bands: the Red band and the Blue band. The MOR can amplify a total of sixteen wavelengths (16 λ), with eight wavelengths (8 λ) assigned to co-propagate in each wavelength band.

The MOR does not include the OSC option.

The block diagram is identical to that of the MOR with 1510 nm OSC amplifier as shown in Figure 1-56, with the exception that it does not include the OSC module assembly.

1625 nm OSC - NTCA11CKThe 1625 nm OSC supports a unidirectional out-of-band optical service channel at 1625 nm for supervisory purposes. You must configure the 1625 nm service channel to co-propagate with the Blue Band channels. The 1625 nm OSC module uses the same platform as the MOR unit, but does not support the optical amplifier gain blocks provided on the MOR. This unit version does not support optical amplification or power monitoring functionality as provided with the MOR circuit pack.

Use the 1625 nm OSC module in conjunction with the MOR with 1510 nm OSC on limited fiber, route diverse or ring applications where all channels need to propagate through a single line amplified path. You require external 1550/1625 nm WDM couplers for optical access to OSC at 1625 nm.

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The block diagram is identical to that of the MOR with OSC amplifier (Figure 1-56), except there is no erbium-doped fiber amplifier (EDFA) gain block module.

MOR EDFA gain block module The MOR unit is based on a two pump, bidirectional optical amplifier architecture.

Connectors located on the MOR circuit pack faceplate provide optical signal access. The connector assignments are Blue In/Red Out and Red In/Blue Out. The counter-propagating Red and Blue band channels route between the EDFA module and optical connectors located on the circuit pack faceplate. The 1510 nm OSC signal designment is to co-propagate with Red Band channels. Access to the 1510 nm OSC is internal to the MOR.

The EDFA module is the core of the MOR amplifier. The main functions of the EDFA module are as follows:

• amplify bidirectional optical signals

• extract received optical supervisory traffic

• insert transmitted optical supervisory traffic

• monitor bidirectional input and output signal power

Each direction of a transmission routes through separate amplifier gain regions. The input optical signals get energy from a dedicated 980 nm pump source, producing amplification in both directions. Each optical path includes WDM splitters and combiners for the pump laser and signal, optical isolator, and optical gain flattening filters. The Red band gain path also includes a WDM splitter and combiner for OSC access.

Four PIN photodiodes at the input/output ports of the EDFA gain block module monitor the power.

MOR motherboardThe motherboard includes a transport control subsystem (TCS), point of use power supplies (PUPS), and different digital processing components. The motherboard monitors and controls all MOR functions and acts as the communication bridge with the OC-192 shelf controller installed in the same bay.

OSC moduleThe optional OSC module includes a 1510 nm or 1625 nm transmitter, receiver, and a service channel overhead processor. This module performs electro-optical conversion of optical supervisory traffic and routes optical overhead based data.

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Support circuitsThe following circuits also support MOR circuit packs and the 1625 nm OSC circuit pack:

• TCS

• PUPS

The TCS controls the operation of the MOR circuit packs and the 1625 nm OSC circuit pack. The TCS provides communication between the shelf processor and other circuits on the MOR circuit packs and the 1625 nm OSC circuit pack. The TCS also generates alarms and activates the LEDs on the circuit pack faceplate.

The PUPS generates all the voltages required by the MOR circuit packs and the 1625 nm OSC circuit pack.

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Figure 1-56MOR block diagram

F3733

EDFA Module

EDFA&

components

BlueOut

RedIn

BlueIn

RedOut

Blue Band Out/Red Band In

Red Band Out/Blue Band In

OpticalService

Channel Tx

OpticalService

Channel Rx

TCS& DSP

Optical OverheadProcessor

Backplane Interface

OOH Bus

PUPS

-48 V

LAN

FaceplateLED control

LOS (yellow)

LOS (yellow)

Active (green)

Fail (red)

Red

BlueOSCλ1510

Red

BlueOSCλ1510

Legend

EDFA = Erbium-doped fiber amplifierLED = Light emitting diodeLOS = Loss of signalOSC = Optical service channelPUPS = Point-of-use power supplyRx = ReceiveTCS = Transport control subsystemTx = Transmit

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Figure 1-57MOR circuit pack (external view)

F5275-MOR_R70

LOS blue band (Yellow)

LOS red band (Yellow)

Fail (Red)

Active (Green)

Optical connector(Output)

Optical connector(Input)

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MOR Plus (NTCA11)MOR Plus provides access to each signal band directly at the faceplate of the circuit pack. MOR Plus has three optical connectors: input, output, and common. MOR Plus also has one less WDM coupler than the normal MOR. Figure 1-62 shows an external view of the MOR Plus circuit pack.

The MOR Plus, in comparison to the original MOR, has the following advantages:

• improved performance in preamplifier and post amplifier applications

• increase in wavelength capacity and reach

• per band dispersion compensation

• improvement in compatibility with future optical networking devices that includes wavelength add/drop multiplexers (ADM) at line amplifier sites

• you can insert optical components into the link without reducing the maximum supported system reach

MOR Plus circuit pack optionsThere are four versions of the MOR Plus amplifier circuit pack supported:

• MOR Plus with Blue-Pre/Red-Post amplifier and unidirectional 1510 nm OSC, NTCA11NK

• MOR Plus with Red-Pre/Blue-Post amplifier and unidirectional 1510 nm OSC, NTCA11PK

• MOR Plus with Blue-Pre/Red-Post amplifier without unidirectional OSC, NTCA11JK

• MOR Plus with Red-Pre/Blue-Post amplifier without unidirectional OSC, NTCA11KK

DescriptionThe MOR Plus amplifier circuit pack includes the following components.

MOR Plus with Blue-Pre/Red-Post amplifier with 1510 nm OSC - NTCA11NKThe MOR Plus circuit pack provides:

• one bidirectional port (the common port for Blue Input and Red Output signals)

• two unidirectional ports (Blue Output and Red Input).

The MOR Plus circuit pack also supports a unidirectional out-of-band 1510 nm OSC for supervisory purposes. The 1510 nm supervisory channel co-propagates with the Red band channel. Add/drop WDM couplers embedded into the MOR Red band amplifier path provide optical access to the 1510 nm OSC.

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As the OSC integrates into the MOR amplifier gain block, you do not require external add/drop WDM couplers and associated optical fiber patches. Support of the integrated 1510 nm OSC option on MOR does not erode the inter-site loss budget. Figure 1-58 shows the block diagram of the MOR Plus.

MOR Plus with Red-Pre/Blue-Post amplifier with 1510 nm OSC - NTCA11PKThis MOR Plus circuit pack provides:

• one bidirectional port (common port for Red Input, Blue Output signals)

• two unidirectional ports (Red Output and Blue Input).

This version of the MOR Plus circuit pack also supports a unidirectional out-of-band 1510 nm OSC for supervisory purposes. The 1510 nm supervisory channel co-propagates with the Red band channel. Add/drop WDM couplers embedded into the MOR Red band amplifier path provide optical access to the 1510 nm OSC. As the OSC integrates into the MOR amplifier gain block, you do not require external add/drop WDM couplers and associated optical fiber patches. Support of the integrated 1510 nm OSC option on MOR does not erode the inter-site loss budget. Figure 1-59 shows a block diagram for this type of MOR Plus.

MOR Plus with Blue-Pre/Red-Post amplifier without OSC - NTCA11JKThis MOR Plus circuit pack provides:

• one bidirectional port (common port for Blue Input, Red Output signals)

• two unidirectional ports (Blue Output and Red Input).

This version of the MOR Plus does not include the OSC option. The block diagram is identical to that of the MOR Plus with Blue-Pre/Red-Post and OSC, except that there is no OSC module assembly. Figure 1-60 shows a block diagram for this type of MOR Plus.

MOR Plus with Red-Pre/Blue-Post amplifier without OSC - NTCA11KKThis MOR Plus circuit pack provides:

• one bidirectional port (common port used for Red Input and Blue Output signals)

• two unidirectional ports (Red Output and Blue Input).

This version of the MOR Plus does not include the OSC option. The block diagram is identical to the MOR Plus with Red-Pre/Blue-Post and OSC, except that there is no OSC module assembly. Figure 1-61 shows a block diagram for this type of MOR Plus.

EDFA gain block module, OSC module, motherboard, and support circuitsMOR Plus internal circuits such as the motherboard, OSC module, and support circuit packs are like the normal MOR circuit pack. The main difference is that MOR Plus has one less WDM coupler than the normal MOR.

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Figure 1-58MOR Plus with Blue-Pre/Red-Post amplifier and 1510 nm OSC

DX1379

Figure 1-59MOR Plus with Red-Pre/Blue-Post amplifier and 1510 nm OSC

DX1380

Red band and1510 nm OSC

output

Red bandpost amplifier

OSC1510 nm Tx

Blue bandpre amplifier

Red

Red bandinput

Blue bandinput

Blue bandoutput

Blue

= MOR Plus faceplate connector

= WDM optical coupler

Legend

Red band and1510 nm OSC

input

Red bandpre amplifier

OSC1510 nm Rx

Blue bandpost amplifier

Red

Red bandoutput

Blue bandoutput Blue band

input

Blue

= MOR Plus faceplate connector

= WDM optical coupler

Legend

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Figure 1-60MOR Plus with Blue-Pre/Red-Post amplifier and no OSC

DX1378

Figure 1-61MOR Plus with Red-Pre/Blue-Post amplifier and no OSC

DX1377

Red bandoutput

Red bandpost amplifier

Blue bandpre amplifier

Red

Red bandinput

Blue bandinput

Blue bandoutput

Blue

= MOR Plus faceplate connector

= WDM optical coupler

Legend

Red bandoutput

Red bandpre amplifier

Blue bandpost amplifier

Red

Red bandinput

Blue bandinput

Blue bandoutput

Blue

= MOR Plus faceplate connector

= WDM optical coupler

Legend

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Figure 1-62MOR Plus circuit pack (external view)

F5142-MOR_R70

LOS blue band (Yellow)

LOS red band (Yellow)

Fail or mismatch (Red)

Optical connector (Blue output)

Optical connector (Red input)

Optical connector (Common)

Active (Green)

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Partitioned OPCThe partitioned operations controller (OPC) has three separate circuit packs:

• OPC controller (NTCA50)

• OPC interface (NTCA52)

• OPC storage (NTCA51AA and NTCA51AB)

If you install a partitioned OPC, the network element control shelf must contain all three of these circuit packs.

Together, these three circuit packs perform the following tasks:

• provide storage and software load upgrades

• communicate with the shelf controller circuit pack and maintenance interface circuit pack

• provide operations, administration, maintenance, and provisioning (OAM&P) functionality

• allow the control shelf to communicate with the outside world

The OPC storage circuit pack provides one interface for the OPC removable media (NTCA53).

Figure 1-63 shows the functional block diagram of the OPC.

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Figure 1-63Partitioned OPC block diagram

F3746-192_R21

OPCstoragecircuitpack

OPCI/F

circuitpack

MaintenanceI/F

SCA and B

MX Aand MX B

GraceLanOPC controllercard presence

OPCcontroller

circuitpack

card presence

card presence

Ethernet

LED driver

NM Ethernet

Serial Signals

SCSI bus

LED driver

OPC storagecard presence

To/fromback-plane

To/fromOPC removablemedia

9-pinRS-232 I/F9-pin10 Base T Ethernet I/F25-pinRS-232

I/F =LED =

MX =

NM =

OPC =

SC =

SCSI =

InterfaceLight emittingdiodeMaintenanceexchangecircuit packNetworkManagerOperationscontrollerShelf controllercircuit packSmall ComputerSystem Interface

Legend:

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OPC controller (NTCA50)The OPC controller circuit pack provides OAM&P functionality. The OPC controller communicates with the OPC interface circuit pack, the OPC storage circuit pack, the shelf controller circuit pack, and the maintenance interface circuit pack.

Figure 1-64 shows a functional block diagram of the OPC controller. Figure 1-65 shows an external view of the OPC controller circuit pack.

The OPC controller contains the following components.

External communicationsThe OPC controller circuit pack has one 10BaseT Ethernet connection (using the backplane) for external communications through the OPC interface circuit pack.

Internal communicationsThe OPC controller circuit pack has one 10BaseT Ethernet connection (using the backplane) for internal shelf controller communications through the maintenance interface circuit pack. The OPC controller circuit pack also has buses to communicate with the OPC storage circuit pack and the OPC interface circuit pack.

LED controlThe OPC controller circuit pack drives the LEDs for all three OPC circuit packs: the OPC controller, the OPC interface, and the OPC storage circuit pack. The OPC storage circuit pack controls the hard drive activity LED on the OPC storage circuit pack only.

Point-of-use power supply (PUPS)The OPC controller circuit pack comes with a point-of-use power supply (PUPS) that generates all the voltages required for the correct operation of the unit.

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Figure 1-64OPC controller circuit pack block diagram

F3750-192_R21

CPU

NM

CPU =DRAM =

NM =PUPS =

SC =

Central Processor UnitDynamic Random Access MemoryNetwork ManagerPoint of Use Power SupplyShelf Controller

Legend:

Flashmemory

PUPS

Green(active)

Red(fail)

-48V+5V

DRAM SC

Port A & B

+3.3V

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Figure 1-65OPC controller circuit pack (external view)

F3757_R21

Active(Green)

Fail (Red)

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OPC interface (NTCA52)The OPC interface circuit pack provides the external customer interfaces for the control shelf. The OPC also communicates with the maintenance interface circuit pack, and with the OPC controller circuit pack. Figure 1-66 shows a functional block diagram. Figure 1-67 shows an external view of the OPC interface circuit pack.

The OPC interface contains the following components.

External communicationsThe OPC interface circuit pack has three ports on its faceplate:

• one 9-pin RS-232 interface for X.25 communication

• one 25-pin RS-232 interface for printer, terminal, and modem support

• one 10BaseT Ethernet port

Internal communicationsThe OPC controller has an Ethernet bus and a serial processor extension bus to communicate through the backplane with the OPC controller circuit pack.

LED controlThe OPC controller circuit pack controls the faceplate LEDs of the OPC interface circuit pack.

Point-of-use power supplyThe OPC interface circuit pack is equipped with a point-of-use power supply (PUPS) that generates all the voltages required for the correct operation of the unit.

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Figure 1-66OPC interface block diagram

F3748-192_R21

Tx/RxTransformer

9-pin RS-232

FPGA =LED =

MI =OPC =

PUPS =Rx =Tx =

Field Programmable Gate ArrayLight Emitting DiodeMaintenance InterfaceOperations ControllerPoint of Use Power SupplyReceiveTransmit

Legend:

FPGA

PUPS

Green(active)

Red(fail)

-48V

To/fromOPC controller

To/fromMI

+5V

LEDinput

To/frombackplane

Tx/Rxcontrol

25-pin RS-232

9-pin 10BaseT Ethernet

FromOPC

controller

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Figure 1-67OPC interface circuit pack (external view)

F3760_R21

9-Pin X.25 RS-232connector

9-Pin 10 Base TEthernet connector

Fail (Red)

Active (Green)

25-Pin RS-232connector

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OPC storage (NTCA51AA and NTCA51AB) The OPC storage circuit pack includes a small computer system interface (SCSI) drive, electrically erasable programmable read-only memory (EEPROM), and a removable media interface. There are two types of OPC storage circuit pack:

• hard disk drive (NTCA51AA)

• solid state disk drive (NTCA51AB)

Both types of circuit pack support the OPC removable media NTCA53.

Figure 1-68 shows a functional block diagram of the OPC storage. Figure 1-69 shows an external view of the OPC storage circuit pack.

The OPC storage contains the following components.

Removable media interfaceThe OPC storage circuit pack provides one interface for the removable media. The removable media interface provides software download, save, and restore capabilities for the network element.

Internal communicationsThe OPC storage circuit pack has a processor bus and a SCSI bus to communicate through the backplane with the OPC controller circuit pack.

Hard disk driveThe SCSI hard disk drive comes as part of the OPC storage circuit pack for UNIX applications.

EEPROMThe EEPROM contains information about the OPC storage circuit pack, such as flash memory size, circuit pack serial number, hardware or software interface vintage. The EEPROM also contains the product engineering code (PEC) and Common Language Equipment Identifier (CLEI) code bytes.

LED controlThe OPC controller circuit pack controls the faceplate LEDs of the OPC storage circuit pack. The OPC storage circuit pack controls the hard drive activity LED on the OPC storage circuit pack only.

Point of use power supply (PUPS)The OPC storage circuit pack comes with a PUPS that generates all the voltages required for the correct operation of the unit.

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Figure 1-68OPC storage block diagram

DX1561

Removablemedia

I/F

OPCcontroller

circuitpack

+5V

I/F =LED =NVS =OPC =

PUPS =

InterFaceLight Emitting DiodeNon Volatile StorageOPerations ControllerPoint of Use Power Supply

Legend:

NVS

Hard driveor solid-state

drive

LEDinput

PUPS

Green(Hard drive activity)

Green(active)

Yellow(card shutdownin progress)Red(card fail)

+12V-12V

-48V

To/fromremovablemedia

OPC storage circuit pack

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Figure 1-69OPC storage circuit pack (external view)

F3759-192_R60

Removing OPC prior to

shut-down will corrupt

the operating system.

Do not remove OPC when

Hard Disk Activity or

Shutdown In Progress

LED is lit.

Shutdown In Progress

Hard Disk Activity

CAUTION

CAUTION

IMPACT

DETECTOR

If the detector h

as been tripped, th

is circuit pack

has been dropped or otherwise mishandled

and must be replaced.SENSITIVE PRODUCT

Removable mediainterface

Card shutdown inprogress (Yellow)

Card fail (Red)

Active (Green)

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OPC removable media (NTCA53)The 122 M/byte OPC removable media provides software download, save, and restore capabilities for network elements under the OPC span of control.

You insert the OPC removable media in the slot on the faceplate of the OPC storage circuit pack.

Figure 1-70 shows a view of the OPC removable media.

Figure 1-70OPC removable media

F3758_R21

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Orderwire (NTCA47)The orderwire circuit pack is supported in OPTera Connect DX and OC-192 network elements. For information on the orderwire facility, please refer to the Orderwire User Guide, NTCA66CA.

Shelf controller (NTCA41)The shelf controller (SC) is the central processor for the system.

The main functions of the shelf controller are as follows:

• report alarms

• support the network element user interface (NE UI)

• provide RS-232 and Ethernet communication ports

• handle data communications channel (DCC) routing

• collect performance monitoring data

• coordinate network element software download and upgrade

See Figure 1-71 for a functional block diagram of the shelf controller. Figure 1-72 shows an external view of the shelf controller circuit pack.

The 32 MBytes RAM SC is used in add-drop multiplexer (ADM) configurations only. The 16 Mbytes RAM is used in regenerators only.

RS-232 and Ethernet portsThe shelf controller supports two RS-232 ports and one Ethernet port. One RS-232 port is available through a 25-pin D-subminiature connector located on the local craft access panel (LCAP). The second RS-232 port, and the Ethernet port, are available through 9-pin D-subminiature connectors located on the faceplate of the maintenance interface circuit pack.

Internal communicationsThe shelf controller communicates with all the circuit packs in the OPTera Connect DX bay and OC-192 bay. The shelf controller controls alarm reporting, fault detection, protection, performance monitoring data collection, and software management.

The shelf controller communicates with the following transport control subsystem (TCS) based circuit packs supported in the OPTera Connect DX and OC-192 bays through the message exchange circuit pack:

• Quad T/R interfaces (NTCA33, NTCA36)

• HD OC-3 T/R interfaces (NTCA35AA, NTCA35AB) (OPTera Connect DX network elements only)

• OC-12 half-height T/R interface (NTCA31B) (OC-192 network elements only)

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• OC-48 short reach T/R interface (NTCA30AL/CK)

• OC-48 long reach T/R interface (NTCA30AN)

• Quad OC-48 T/R interfaces (NTWR31) (OPTera Connect DX network elements only)

• Dual OC-48 short reach T/R interface (NTWR30AA) (OPTera Connect DX network elements only)

• Dual OC-48 intermediate reach T/R interface (NTWR30BA) (OPTera Connect DX network elements only)

• Dual OC-48 long reach T/R interface (NTWR30CA) (OPTera Connect DX network elements only)

• STS-48 T/R electrical interface (NTCA34)

• Dual Gigabit Ethernet extended reach interface (NTCA90GA)

• Dual Gigabit Ethernet long reach interface (NTCA90CA)

• Dual Gigabit Ethernet short reach interface (NTCA90EA)

• OC-192 T/R interface (NTCA06) (OPTera Connect DX network elements only)

• OC-192 DWDM TriFEC T/R interface (NTCF06) (OPTera Connect DX network elements only)

• OC-192 short reach T/R interface (NTWR06AB) (OPTera Connect DX network elements only)

• OC-192 intermediate reach T/R interface (NTWR06CA) (OPTera Connect DX network elements only)

• OC-192 long reach T/R with APD interface (NTWR06B) (OPTera Connect DX network elements only)

• OC-192 XR (NTCA04) (OC-192 network elements only)

• OC-192 merged XR/WT (NTCF04) (OC-192 network elements only)

• OC-192 DWDM transmit interface (NTCA01) (OC-192 network elements only)

• OC-192 DWDM regenerator/transmit interface (NTCA03) (OC-192 network elements only)

• OC-192 short reach receive interface (NTCA02) (OC-192 network elements only)

• OC-192 demultiplexer (NTCA05) (OC-192 network elements only)

• Switch module (NTCA26, NTCA24) (NTCA24 is used in OC-192 network elements only)

• External synchronization interface (NTCA44, NTCE44)

• Orderwire (NTCA47) (OC-192 network elements only)

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• MOR (NTCA11) (OC-192 network elements only)

• MOR Plus (NTCA11) (OC-192 network elements only)

The shelf controller also communicates with the OPC circuit packs (through the maintenance interface circuit pack), the message exchange circuit pack, and the parallel telemetry circuit pack.

Flash memoryThe shelf controller flash memory contains one copy of its software, one copy of the system provisioning data, and a software library.

You use the software library when you replace a circuit pack. The software library makes sure that the circuit pack you are inserting runs the appropriate software version, according to the system’s provisioning data.

Support circuitsThe PUPS generates all the voltages required by the shelf controller.

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Figure 1-71Shelf controller block diagram

F3236-192_R21

Flashmemory

DRAM

CPU

Buffer

Buffer

GraceLan

Filters and

interface

Transformers

to/from MX Aand MX B

Ethernet

Legend:

CPU =DRAM =LCAP =

MI =MX =

LED =

Central Processing UnitDynamic Random Access MemoryLocal Craft Access PanelMaintenance InterfaceMessage eXchangeLight Emitting Diode

RS-232 (MI)RS-232 (LCAP)RS-530 (MI)

(future)

input bit portsoutput bit portsMI LEDs control

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Figure 1-72Shelf controller circuit pack (external view)

F3192-192

Active(Green)

Fail (Red)

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Maintenance interface (NTCA42)The maintenance interface (MI) works with the shelf processor. The MI circuit pack contains the RS-232 and the Ethernet interfaces.

Two MI versions are available: the 32 MByte (NTCA42AA) and the 128 MByte (NTCA42BA). The OPTera Connect DX bay supports only the 128 Mbyte MI. The OC-192 bay supports both MI types.

The MI performs the following functions:

• provide access to RS-232 and Ethernet interfaces

• support circuit pack inventory

• collect status signals

• monitor processor sanity

• provide interface between the LCAP and the shelf controller

• provide flash memory storage

• drive bay level alarm indicators

• support a software library

• communicate with the OPC

Figure 1-73 shows a functional block diagram of the MI. Figure 1-74 shows an external view of the MI circuit pack.

RS-232 and EthernetThe maintenance interface supports two RS-232 interfaces (A and B) from the shelf controller. Interface A connects to a male 9-pin D-subminiature connector located on the faceplate of the maintenance interface. Interface B connects to the LCAP through the control shelf backplane.

The maintenance interface provides three Ethernet connections for the Ethernet port provided by the shelf controller circuit pack. You can access this Ethernet interface through three 9-pin D-subminiature connectors located on the faceplate of the maintenance interface.

Circuit pack inventoryThe MI circuit pack reads circuit pack inventory from the circuit packs that are not connected to the shelf controller. These circuit packs include the breaker/filter modules, the LCAP, and the synchronization, alarm, and telemetry terminations (SATT).

Status signalsStatus signals go to the MI by the fan modules and the breaker/filter modules. The MI reports these signals to the shelf controller.

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Processor sanityThe MI monitors the status of the shelf controller. The shelf controller uses a sanity timer. The shelf controller refreshes the timer every 30 seconds. The MI activates major visual and audible alarms if the shelf processor does not refresh the timer.

LCAP interfaceThe MI acts as an interface between the shelf controller and the LCAP. The MI detects the alarm cutoff (ACO) and lamp test signals originated by the LCAP and notifies the shelf controller. The MI controls and monitors the state of the relays (located on the LCAP) that control the ACO circuit.

Flash memoryThe flash memory located on the MI stores a second copy of the network element shelf controller software and provisioning data. The flash memory also stores the software library. The first copy in the shelf controller flash memory is only for shelf controller software and provisioning data.

Data backup and software storage between the shelf controller and MI allows replacement of both circuit packs while the system is in service. Do not replace both circuit packs at the same time.

Use the software library when you replace a circuit pack that contains transport control subsystems (TCS). The software library makes sure that the circuit packs you are inserting run the appropriate software version, according to the system software. The software library also updates with a software upgrade.

Bay alarmsThe shelf controller controls the critical, major, and minor alarm relays. Both critical and minor alarm relays appear on the MI. The major alarm relay is on the SATT. The relay raises a major alarm if the MI fails or if you remove the MI.

The shelf controller controls the LEDs on the MI.

The MI also comes with a PUPS that generates all the voltages required for the correct operation of the unit.

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Figure 1-73MI block diagram

F3237-192_R21

RS-232Interface

EthernetInterfaces

RS-232Interface

MILEDs

Alarm status

Sanity timer

Bay I/Falarms

StatusFans

Inventory

Flashmemory

to SATT

ACO/Lamp testfrom LCAP

DB9 connector on faceplate

3 DB9 connectors on faceplate

DB25 connector on LCAP

RS-232 to SC

RS-232 to SC

Ethernet to SC

To/from SC

To/from SC

From SC

ACO to SC

PUPS-48 V-5 V

+5 V

Legend:

ACO =I/F =

LCAP =LED =

MI =PUPS =SATT =

SC =

Alarm Cut OffInterfaceLocal Craft Access PanelLight Emitting DiodeMaintenance InterfacePoint of Use Power SupplySynchronization, Alarms and Telemetry TerminationsShelf Controller

Ethernet to OPC controllercircuit pack

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Figure 1-74MI circuit pack (external view)

DX1562

FW-3187

Port 1

Port 2

Port 3

RS-232port

10BaseTEthernet ports

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External synchronization interface (NTCA44, NTCE44) There are three types of ESI circuit packs:

• NTCA44AA, which provides external inputs and outputs at the DS1 line rate of 1.544 Mbit/s

• NTCE44AA, which provides external inputs and outputs at the E1 line rate of 2 Mbit/s or the 2 MHz line rate

• NTCE44BA, which provides external inputs and outputs at the 2 MHz line rate

The external synchronization interface (ESI) circuit pack provides a 38 MHz reference output for shelf timing. The ESI circuit pack adjusts the clock rate according to the specifications for external timing (to either 1.544 Mbit/s, 2 Mbit/s or 2 MHz).

The control shelf is fitted with two ESI circuit packs that operate as a working and protection pair.

If the synchronization references are being supplied to the bay, ESI circuit pack NTCE44AA must be fitted into the control shelf of a network element with a universal synchronization, alarms, and telemetry terminations (uniSATT) connector block so that both the E1 (2 Mbit/s) and 2 MHz line rates are supported. This circuit pack can operate at the 2 MHz line rate in a network element with a 2 MHz SATT. This circuit pack cannot operate in a network element with a 1.544 Mbit/s SATT, unless the network element is using line timing (instead of external synchronization references).

The main functions of the ESI are as follows:

• provide a stable reference timing source for the system

• provide one reference output at the DS1 line rate of 1.544 Mbit/s, the E1 line rate of 2 Mbit/s, or the 2 MHz line rate

Figure 1-75 shows a functional block diagram of the 1.544 Mbit/s ESI circuit pack. Figure 1-76 shows a functional block diagram of the 2 Mbit/s ESI circuit pack. Figure 1-77 shows a functional block diagram of the 2 MHz ESI circuit pack. The ESI circuit packs look identical to the circuit pack shown in Figure 1-72.

For the 1.544 Mbit/s and 2 MHz ESI circuit packs, the building-integrated timing supply (BITS) and OC-192 interfaces are used for timing generation, while only OC-192 interfaces are used for timing distribution. These ESI circuit packs reduce these input signals to the rate of 8 kHz. The system monitors the input signals for frequency and forms one timing reference pool for timing generation and another for timing distribution. These ESI circuit packs select one reference for timing generation and another for timing distribution from these timing reference pools.

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For the 2 Mbit/s ESI circuit pack, the building-integrated timing supply (BITS) and OC-192 interfaces are used for both timing generation and timing distribution. This ESI circuit pack reduces these input signals to the rate of 8 kHz. The system monitors the input signals for frequency and forms a timing reference pool. This ESI circuit pack selects one reference from this timing reference pool to provide both timing generation and timing distribution.

In the event of a failure of all timing distribution sources:

• for the 1.544 Mbit/s ESI circuit pack, the external timing output sends an alarm indication signal (AIS) and a “Tx AIS” alarm becomes active

• for the 2 MHz ESI circuit pack, the external timing output signal is squelched and a “Tx AIS” alarm becomes active

• for the 2 Mbit/s ESI circuit pack, either the external timing output sends an AIS and a “Tx AIS” alarm becomes active (with the E1 line rate), or the external timing output is squelched and a “Tx AIS” alarm becomes active (with the 2 MHz line rate)

Note: There is only one timing reference pool for the 2 Mbit/s ESI circuit pack. A failure of all timing generation sources implies a failure of all timing distribution sources.

In the event of a failure of all timing generation sources, the ESI circuit pack operates in freerun or holdover mode. When the ESI circuit pack operates in freerun or holdover mode, the internal oscillator of the ESI circuit pack generates the timing. If the ESI circuit pack does not generate the timing, it selects the same reference and both ESI circuit packs follow in parallel. The selection of the timing generation reference does not depend on the selection of the timing distribution reference.

In freerun or holdover mode, the ESI circuit pack provides a slave equipment clock (SEC) output of accuracy 4.6 ppm. The shelf clock located on the switch module derives its timing output from the ESI circuit pack. In the event of failure or removal of both ESI circuit packs, the shelf clock will run in freerun mode with an accuracy of 20 ppm.

The shelf controller controls the LEDs on the ESI circuit pack through the transport control subsystem (TCS).

The ESI circuit pack comes with a PUPS that generates all the voltages required for the correct operation of the unit.

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Figure 1-751.544 Mbit/s ESI block diagram

DX4867p

TCS+

To/from shelf controller

External

Backplane

input I/F

I/F

To/from mate ESI

OutputI/F

Timingdistribution

Timing generation

Timing filter

Timingreference

pool

Input froma BITS

Input fromOC-192 orSTM-64 I/F

DS1 outputsto SATT

Timing output toswitch modules A & B

Timing output tomate ESI

PUPS-48 V

+12 V

-12 V

-5 V

+5 V

Active(green)

Fail(red)

BITS =ESI =I/F =

PUPS =SATT =

TCS =

Building-Integrated Timing SupplyExternal Synchronization InterfaceInterfacePoint of Use Power SupplySynchronization, Alarms and Telemetry TerminationsTransport Controlled Subsystem

Legend

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Figure 1-762 Mbit/s ESI block diagram

DX4868p

TCS+

To/from shelf controller

External

Backplane

input I/F

I/F

To/from mate ESI

OutputI/F

Timingdistribution

Timing generation

Timing filter

Timingreference

pool

Input fromOC-192 orSTM-64 I/F

Input froma BITS

E1 or 2 MHzoutputs to SATT

Timing output toswitch modules A & B

Timing output tomate ESI

PUPS-48 V

+12 V

-12 V

-5 V

+5 V

Active(green)

Fail(red)

BITS =ESI =I/F =

PUPS =SATT =

TCS =

Building-Integrated Timing SupplyExternal Synchronization InterfaceInterfacePoint of Use Power SupplySynchronization, Alarms and Telemetry TerminationsTransport Controlled Subsystem

Legend

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Circuit pack descriptions 1-159

Figure 1-772 MHz ESI block diagram

DX4869p

TCS+

To/from shelf controller

External

Backplane

input I/F

I/F

To/from mate ESI

OutputI/F

Timingdistribution

Timing generation

Timing filter

Timingreference

pool

Input fromOC-192 orSTM-64 I/F

Input froma BITS

2 MHz outputsto SATT

Timing output toswitch modules A & B

Timing output tomate ESI

PUPS-48 V

+12 V

-12 V

-5 V

+5 V

Active(green)

Fail(red)

BITS =ESI =I/F =

PUPS =SATT =

TCS =

Building-Integrated Timing SupplyExternal Synchronization InterfaceInterfacePoint of Use Power SupplySynchronization, Alarms and Telemetry TerminationsTransport Controlled Subsystem

Legend

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Message exchange (NTCA48)The message exchange (MX) circuit pack routes the data communications channel (DCC) and enables communications between circuit packs supplied with a processor. The MX circuit pack also enables communication between the shelf controller and circuit packs supplied with a processor or transport control subsystem (TCS). See Figure 1-78.

Note: You must install at least one MX circuit pack in the control shelf. If you install two MX circuit packs, one can act as the working circuit pack, and one can act as the protection circuit pack. Installing two MX circuit packs is optional, but highly recommended.

The MX circuit pack performs the following functions:

• support circuit pack presence detection with the shelf controller

• support DCC messaging

• support operations, administration, and maintenance (OAM) messages between circuit packs supplied with a processor

See Figure 1-79 for a functional block diagram of the MX circuit pack. The MX circuit pack is identical to the circuit pack shown in Figure 1-72.

Circuit pack presenceThe MX circuit pack stores a circuit pack presence bit for every circuit pack that has a processor (TCS). The shelf controller reads these bits through the maintenance interface (MI). If you remove a circuit pack, the shelf controller detects a change in circuit pack presence and passes this information to the shelf controller.

The shelf controller controls the LEDs on the MX circuit pack.

The MX circuit pack also comes with a PUPS that generates all the voltages required for the correct operation of the unit.

GraceLan/MMSBGraceLan is the protocol used by the system for both DCC routing and internal system control messages. System control functions include:

• fault reporting

• performance monitoring

• data collection

• software upgrade

• circuit pack configuration

The GraceLan messaging system connects the SC and the GraceLan nodes together at the two MX circuit packs.

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The following circuit packs form GraceLan nodes:

• shelf controller

• ESI

• all circuit packs in the main shelf

Each GraceLan node has a separate connection to each of the MX circuit packs identified by a slot ID number, which identifies its position in the network element.

Figure 1-78Communications between the MX circuit pack and other circuit packs in the system

F3239-192_R40

MI

MX G1 MX G2 SC

Circuit packs equipped with a processor (TCS)

Circuitpack 1

Circuitpack x

Circuitpack y

MI =MX =

OPC-C =OPC-I =

OPC-S =SC =

Maintenance Interface moduleMessage eXchange moduleOperations Controller Control moduleOperations Controller Input/Output moduleOperations Controller Storage moduleShelf Controller module

Legend:

OPC-C

OPC-IOPC-S

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Figure 1-79MX circuit pack block diagram

F3240

Card 1

S_PEZinterface

GraceLaninterface

MMSBinterface

Control/Timing

Timing

Selector

distributionTo SC

Card x

System cardpresence to SC

To/from SC

To MIActive(green)

Fail(red)

PUPS-48 V

-5 V

+5 V

MI =MMSB =S_PEZ =PUPS =

SC =

Maintenance InterfaceMulti-Master Serial BusSerial Processor Extension busPoint of Use Power SupplyShelf Controller

Legend:

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Parallel telemetry (NTCA45AA)The parallel telemetry circuit packs provide the interface to the customer’s central alarm reporting equipment. Relay contact outputs and digital detection inputs provide access.

The main functions of the parallel telemetry circuit pack are as follows:

• provide 32 dry contact compatible inputs

• provide eight “Form C” (break before make) relay outputs

Figure 1-80 shows a functional block diagram of the parallel telemetry circuit pack. Figure 1-81 shows an external view of the parallel telemetry circuit pack.

Telemetry input interfaceThe 32 parallel telemetry inputs connect through a 44-pin D-subminiature connector located on the circuit pack faceplate. They connect a network element to the external triggers for events (such as an open door or a high shelf temperature). The parallel telemetry inputs are active when connected to 0V. When an open input changes to closed, a trigger trips and the network element software raises an environmental alarm.

The parallel telemetry circuit pack maps the state of all 32 parallel telemetry inputs into the shelf controller addressing space.

Telemetry output interfaceThe parallel telemetry circuit packs access the eight telemetry outputs through a 25-pin D-subminiature connector located on the circuit pack faceplate. Each output includes a three wire set: a common connection (COM), normally opened (NO) signal, and a normally closed (NC) signal.

There are two possible states for each output, they are as follows:

• NC connected to COM and NO floating

• NO connected to COM and NC floating

The parallel telemetry circuit pack maps each of the eight parallel telemetry outputs into the shelf controller addressing space.

The field programmable gate array (FPGA) controls the circuit pack LEDs. The parallel telemetry circuit pack also comes with a PUPS that generates all the voltages required for the correct operation of the unit.

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Figure 1-80Parallel telemetry circuit pack block diagram

F3241

FPGA

OutputI/F1

OutputI/F8

InputI/F32

InputI/F1

NO

NC

COM

NO

NC

COM

input

ground

input

ground

S_PEZ to/from shelf controller

Active(green)

Fail(red)

PUPS-48 V +5 V

Legend:

COM = COMmonFPGA = Field Programmable Gate ArrayI/F = InterFaceNC = Normally ClosedNO = Normally OpenedPUPS = Point-of-Use Power SupplyS_PEZ = Serial Processor Extension bus

All inputs areActive Low

Note: The parallel telemetry cable has only eight ground pins. Each input can be grounded to any of the ground pins.

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Figure 1-81Parallel telemetry circuit pack (external view)

F3195-192

Active(Green)

Fail (Red)

44-Pin telemetryinput connector

25-Pin telemetryoutput connector

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Breaker/filter module (NTCA40AA)Located in the control shelf, the breaker/filter module accepts three 30 Amp feeds from the customer power plant. The module provides current limited power outputs required by the system.

The main functions of the breaker/filter module are as follows:

• provide low frequency filtering

• balance load for input feeds

• provide seven current limited outputs

• provide a 60 W cooling unit output

Figure 1-82 shows a functional block diagram of the breaker/filter module. Figure 1-83 shows an external view of the breaker/filter module.

Each of the three input feeds has a dedicated filter to prevent battery oscillation. A low voltage monitor generates an alarm if the voltage of a feed drops below −41.5 V ± 1.5 V. The three input feeds are current limited by circuit breakers.

The breaker/filter module can generate filter failures, power losses, trip alarms, and low voltage warnings. The power on and alarm detection circuits control the circuit pack LEDs, and communicate with the shelf controller.

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Figure 1-82Breaker module functional block diagram

F3242-192_R40

CircuitBreaker 2

CircuitBreaker 3

CircuitBreaker 4

CircuitBreaker 5

CircuitBreaker 1

CircuitBreaker 6

CircuitBreaker 7

Lowvoltagemonitor

Lowvoltagemonitor

Lowvoltagemonitor

Filter

Filter

Filter

Feed frompower plant

Feed frompower plant

Feed frompower plant

−48 V totransport shelf

−48 V totransport shelf

−48 V totransport shelf

−48 V totransport shelf

−48 V tocontrol shelf

48 V totributary, or dense regenerator, or line extension shelf

−48 V tocooling unit

Alarm and

Pwr Ondetection

To shelf controller

Active(green)

Fail(red)

48 V totributary, or dense regenerator, or line extension shelf

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Figure 1-83Breaker/filter module (external view)

F3191-192

Input feeds

Circuit breakerswitches (7)

Active (Green)

Fail (Red)

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Fan module (NTCA85BA, NTCA85EA)Note: Fan module NTCA85BA is used in OC-192 bays only. Fan module NTCA85EA is used in OPTera Connect DX bays only.

The environmental control panel (ECP) has three fan modules that operate at approximately 80% of maximum speed under normal conditions. The temperature threshold set at the factory increases or decreases the speed of the fan module.

The fan controller monitors all operations of the fan including: speed, state of the remote temperature sensors, and the reporting of alarms to the shelf controller. In the event of a failure, the fan controller sends an alarm signal to the shelf controller and to the other fans.

During normal operation of the unit, a green LED illuminates on the front panel of the fan. In the event of a failure, a red LED on the front panel of the fan illuminates.

At low temperatures (below 0ºC), the fan is off. At high temperatures (above 55ºC) the fan operates at a higher speed and signals other fans to increase their speed. When the sensor temperature exceeds 70ºC, the fan controller sends a high shelf temperature alarm to the shelf controller.

Figure 1-84 shows a functional block diagram of the fan module. Figure 1-85 shows an external view of a fan module used in OPTera Connect DX bays (NTCA85EA). Figure 1-86 shows an external view of a fan module used in OC-192 bays (NTCA85BA).

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Figure 1-84Fan module functional block diagram

F3243

GREEN RED

Supply (-35V -75Vl)

Supply return (GND)

Temperature

interface

Sensor

Ulog

+50oC

0oC

Sensor OK

LED control

Fan speed

Control

Speedcontrol

Fan position R

Fan position L

Fan present

All fans OK

Operationsmonitor

LED control

Fan failed

Fan OK out

Fan OK in

High temp (+70°C)

Green/Red

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Figure 1-85OPTera Connect DX fan module - NTCA85EA (external view)

DX0468p

Figure 1-86OC-192 fan module - NTCA85BA (external view)

DX2647p

Unlock position

Lock position

Lock

Active (Green)

Fail (Red)

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Filler card (NTCA49/59)The filler cards are available in the following four formats:

• transport shelf, tributary extension shelf, and line extension shelf filler card (single slot, NTCA49AA)

• transport shelf filler card (double slot, slots 14 and 15 only, NTCA49AB)

• control shelf filler card (single slot, 1 inch, NTCA59AA)

• transport shelf and tributary extension shelf half-height filler card (single slot, NTCA49AC)

Note: If there is one half-height OC-12 circuit pack in a slot, use a half-height filler card NTCA49AC for the other half slot. In other cases, you must use a single slot full-height filler card (NTCA49AA).

All unused or empty slots in the control shelf, transport shelf, tributary extension shelf, and line extension shelf must contain the appropriate filler card. The filler cards have two distinct purposes. The main transport shelf and the tributary extension shelf require filler cards for correct cooling. The control shelf requires filler cards to protect against electromagnetic interference (EMI) emissions.

Filler cards have no LEDs on their faceplate, nor do they contain any internal circuits. Figure 1-87 shows the four available filler cards.

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Figure 1-87Filler cards

F3526-192_R40

Transport shelf, tributary extensionshelf, dense regeneratorextension shelf, and line extensionshelf filler card, single slot

Transport shelffiller card, doubleslot, slots 14 and 15

Control shelffiller card,single slot

Transport andtributary extension

shelf half-height fillercard, single slot

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Nortel Networks

OPTera Connect DX optical switch Circuit Pack Descriptions

Copyright � 2000–2004 Nortel Networks, All Rights Reserved

The information contained herein is the property of Nortel Networks and is strictly confidential. Except as expressly authorized in writing by Nortel Networks, the holder shall keep all information contained herein confidential, shall disclose the information only to its employees with a need to know, and shall protect the information, in whole or in part, from disclosure and dissemination to third parties with the same degree of care it uses to protect its own confidential information, but with no less than reasonable care. Except as expressly authorized in writing by Nortel Networks, the holder is granted no rights to use the information contained herein.

Nortel Networks, the Nortel Networks logo, the Globemark, OPTera, and Preside are trademarks of Nortel Networks.

323-1521-102Standard Rel 6 April 2004Printed in Canada and in the United Kingdom