26 June 2001VELO-Overview VELO Overview T. Bowcock University of Liverpool

26 June 2001 VELO-Overview

VELO Overview

T. Bowcock

University of Liverpool


Post-TDR

• Hardware

• Software

• Critical Issues

• Summary


Hardware

• Sensors

• Hybrids

• Thermo-Mechanical Module

• Testbeam

• Production Facilities


Hardware: Sensors (1)

• Two types of sensors produced– Hamamatsu (n+n)- 1998– Micron (p+n) 2000

• In fabrication (mask design at L’pool)– Micron (n+n) 2001



• Laboratory– High precision tests with 1060nm lasers for

both sets of detectors (LHCb note)

• Testbeam at CERN– Under preparation for 2001







• Additional test equipment – Cosmic ray facility – now commissioned

• Shorter wavelength laser (900nm)– Ordered

• Automated Scanning x-y stage



• Simulation complete– First principle analysis of leakage currents and

charge collection as a function voltage

• Agreement with data– Note low voltage phenomena <20V Q/I

amplifiers.



• Identify manufactures for Production– Hamamatsu (withdrawn n+n option)– Micron (n+n, p+n)– CSEM, Eurysis, SEIKO, SINTEF, ST

• Technical discussions Price Enquiry


Hardware: Hybrids(1)

• Hybrid Design&Production to IDE– Delivered – Bonded and mounted with chips– Fan-ins produced– Under test

• 4 chips r/o (26/6)


Hardware: Hybrids(2)

• Kapton version to be ordered early 7/01

• SCT-VELO design (Liverpool)– improved cable connections– Viable pre-production prototype

• Beetle design


Hardware: Module(1)

• Thermal models for TDR

• Cooling system– Safety issues addressed




0

10

20

30

40

50

60

70

0 5 10 15 20 25

Power

Delta(T)(from nominal)

Calibration ModelCalibration Model


Chipglue

kaptonsensor

ceramic

TPG

Chipglue

kaptonsensor

TPG

CF weave

CF(UD)



Hardware: Module (2)

• Prototype and testing of adjustment

• Re-engineering– Carbon fibre base– O CTE materials including adjustment screws


Electronics

Cooling Bracket & Fixings

Carbon Fiber Paddle

Micrometer Adjusters

Paddle Base

Flat Spring

Location Base

Substrates

Silicon Detectors

x

y y

z

z

x(pitch)

(roll)

(slew)






• Curvature of the sensors measured

• We may need to survey (cold?) the modules



Measurement points




Hardware: Testbeam

• Module for October 2001– See also software


Hardware: Production Facilities

• Clean rooms

• Bonding equipment

• Jigs and Assembly– Vacuum compatible glue dispensing


Production Facilities

LHCb

R&D



Software

• TDR analysis and optimisation

• Monte Carlo simulations of VELO

• VELO core software (meeting 5/6 July)

• Alignment

• Testbeam


Software: Optimisation• We generated and analysed over 10m bb

events generated and analysed for different configurations: Physics Section

• Optimisation paper (for TDR) huge effort impossible without substantial effort


Software: Silicon

• Other (non GEANT software) for optimisation of operating conditions



-5-4.9-4.8-4.7-4.6-4.5-4.4-4.3-4.2

0 200 400 600 800

Vop(Volts)

Tem

pe

ratu

re(C

)

(d=200micron,Vdep=70V) (d=200micron,Vdep=31V)

(d=300micron,Vdep=160V) (d=300micron,Vdep=70V)

400

600

800

1000

1200

1400

-20 -10 0 10 20

Tcool(C)

Vd

ep(V

olts

)

Vop=200V

Vop=600V



0.00E+00

1.00E-01

2.00E-01

3.00E-01

4.00E-01

5.00E-01

6.00E-01

-20 -10 0 10 20

Temperature (C)

He

at

(W)

Const. Flux(2.1x10**14)

Const.Flux(3.9x10**14)

LHCmodel(2.1x10**14)

LHCmodel(3.9x10**14)



Software: Alignment(1)

• Alignment: Underway– From HERA code used by H1 – Fast determination of global parameters– Reduced to linear problem


Software: Alignment(2)

• Curvature of detectors


Residuals


Software: Other

• LHCb production

• LHCb Grid– Testbeam as testbed


Critical Issues

• Electronics

• Electronics

• Electronics

• Manufacturers for Silicon

• Grid


Summary

• Sensors

• Hybrid

• Module

• Software

Documents

26 June 2001VELO-Overview VELO Overview T. Bowcock University of Liverpool