2017 MICRO TECHNOLOGIES CALL FOR PAPERS - …spie.org/Documents/ConferencesExhibitions/EMT17-Call-lr.pdfWe welcome you to feel at home in Barcelona, Spain, ... MEMS and NEMS-based

MICRO TECHNOLOGIES CALL FOR PAPERS

CONNECTING MINDS. ADVANCING LIGHT.

THE LEADING EUROPEAN MEETING ON MICRO- AND NANOSCALE SYSTEMS, TECHNOLOGIES, AND APPLICATIONS.

2017

Submit Abstracts by 24 October 2016 www.spie.org/MT17call

Hotel Alimara, Barcelona, Spain

Conferences: 8–10 May 2017

PRESENT YOUR WORK IN BARCELONATHE MICRO- AND NANOSCALE SYSTEMS TECHNOLOGY AND APPLICATIONS CONFERENCE

Conferences: 8–10 May 2017 Hotel Alimara, Barcelona, Spain

• Smart Sensors, Actuators, and MEMS

• Cyber Physical Systems

• Bio-MEMS and Medical Microdevices

2017

www.spie.org/MT17call

TECHNOLOGIES• Nanotechnology

• Integrated Photonics: Materials, Devices, and Applications

Submit Abstracts by 24 OCTOBER 2016

Join us and review the latest research at the 8th SPIE Microtechnologies. Meet colleagues from academia and industrial research groups in Barcelona, the capital of Catalonia (Spain), and plan to participate and share your latest ideas in technological fields essential for shaping of the new millennium.

Five exciting conferences in the field of microtechnologies have been linked together. Take advantage of the synergies created by engineers, scientists, researchers, and managers working on various aspects of microtechnologies. The symposium presents a unique opportunity to hear about the latest advances in microtechnologies for smart sensors, energy harvesting and smart power, reconfigurable hardware, low power electronics and wireless communication for cyber physical systems, network on a chip, nano fabrication and self-assembly, hybrid nanosystems, biomedical applications and bioinspired systems, microfluidics and lab on a chip, silicon and nano photonics, quantum communication, and many other cutting-edge R&D results.

Exchange new ideas, address your shared concerns, and get access to information not yet published in these topical areas. Your paper is permanently archived in the SPIE Digital Library, where it will be available to others in the international scientific community who seek to learn, make discoveries, and innovate.

We welcome you to feel at home in Barcelona, Spain, attend the meeting, and join your colleagues and friends for the most stimulating scientific symposium.

PLAN TO PARTICIPATE

SYMPOSIUM CHAIR

Ulrich Schmid Technische Univ. Wien (Austria)

SYMPOSIUM CO-CHAIRS

Jacopo Iannacci Findazione Bruno Kessler (Italy)

José Luis Sánchez-Rojas Aldavero Univ. de Castilla-La Mancha (Spain)

LOCAL CO-CHAIR

Carles Cané Ctr. Nacional de Microelectronica (Spain)

1

EXECUTIVE ORGANISING COMMITTEE

EMT101 Smart Sensors, Actuators, and MEMS VIII (Prunnila/Fonseca/Peiner) . . . . . . . . . . . . . . . . . . . . .3

EMT102 Cyber Physical Systems 2017 (Brama/Bertacchini/Hammer) . . . . . . . . . . . . . . . . . .4

EMT103 Bio-MEMS and Medical Microdevices III (van den Driesche/Delgado-Restituto/Giouroudi) .6

EMT104 Nanotechnology VIII (Tiginyanu/Adelung/Sarua) .7

EMT105 Integrated Photonics: Materials, Devices, and Applications IV (Fédéli/Vivien) . . . . . . . . . . . . . . . . .8

General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Abstract Submission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SPIE MICROTECHNOLOGIES 2017

ContentsMANAGED BY

SPIE Europe Ltd ., a subsidiary of SPIE, is a not-for-profit UK-registered company serving SPIE constituents throughout Europe as an advocate and liaison to political and industry associations within the European optics and photonics community .

In addition to providing membership services, SPIE Europe Ltd . organises and manages internationally recognised conferences, education programmes, and technical exhibitions featuring emerging technologies in optics and photonics .

SPIE Europe 2 Alexandra GateFfordd Pengam, Cardiff, CF24 2SATel: +44 29 2089 4747Fax: +44 29 2089 4750info@spieeurope .org

CO-OPERATING ORGANISATION

SPONSOR

Rainer Adelung, Christian-Albrechts-Univ . zu Kiel (Germany)Alessandro Bertacchini, Univ . degli Studi di Modena e Reggio Emilia (Italy)Riccardo Brama, CMC Labs . (Italy)Manuel Delgado-Restituto, Instituto de Microelectrónica de Sevilla (Spain)Jean-Marc Fédéli, CEA-LETI (France)Luis Fonseca, Ctr . Nacional de Microelectrónica (Spain)Ioanna Giouroudi, DWI an der RWTH Aachen e .V . (Germany)

Florian Hammer, Linz Ctr . of Mechatronics (Austria)Erwin Peiner, Technische Univ . Braunschweig (Germany)Mika Prunnila, VTT Technical Research Ctr . of Finland Ltd . (Finland)Andrei Sarua, Univ . of Bristol (United Kingdom)Ion M. Tiginyanu, Academy of Sciences of Moldova (Moldova)Sander van den Driesche, Univ . Bremen (Germany)Laurent Vivien, Institut d’Électronique Fondamentale (France)

CALL FOR PAPERS

Smart Sensors, Actuators, and MEMS VIII (EMT101)Conference Chair: Luis Fonseca, Ctr. Nacional de Microelectrónica (Spain)

Conference Co-chairs: Mika Prunnila, VTT Technical Research Ctr. of Finland Ltd. (Finland); Erwin Peiner, Technische Univ. Braunschweig (Germany) (Spain)

Programme Committee: Francisco J. Arregui, Univ. Pública de Navarra (Spain); Joan Bausells, Ctr. Nacional de Microelectrónica (Spain); Achim Bittner, Technische Univ. Wien (Austria); Christian Bolzmacher, Commissariat à l’Énergie Atomique (France); Lionel Buchaillot, IEMN, Univ. Lille 1 (France); Viorel Dragoi, EV Group (Austria); Isabelle Dufour, IMS, Univ. Bordeaux 1 (France); Sören Fricke, Robert Bosch GmbH (Germany); Gerald Gerlach, Technische Univ. Dresden (Germany); Jorge Hernando García, Univ. de Castilla-La Mancha (Germany); Martin Hoffmann, Technische Univ. Ilmenau (Germany);Carmen Horrillo-Guemes, CSIC (Spain); Jacopo Iannacci, Fondazione Bruno Kessler (Italy); Enrique Iborra, Univ. Politécnica de Madrid (Spain); Nathan M. Jackson, Tyndall National Institute (Ireland); Konrad Kapser, Infineon Technologies AG (Germany); Robert J. Lad, Univ. of Maine (United States); Jeong-Bong Lee, The Univ. of Texas at Dallas (United States); Elie Lefeuvre, Univ. Paris-Sud (France); Gemma Garcia, Mandayo CEIT-IK4 (Spain); Fernando Martinez, IKERLAN (Spain); Dean P. Neikirk, The Univ. of Texas at Austin (United States); Patrick Pons, Lab. d’Analyse et d’Architecture des Systèmes, CNRS (France); Michele Pozzi, Newcastle Univ. (United Kingdom); Gabriele Schrag, Technische Univ. München (Germany); Andreas Schütze, Univ. des Saarlandes (Germany); Ashwin Seshia, Univ. Cambridge (United Kingdom); Pietro Siciliano, Istituto per la Microelettronica e Microsistemi (Italy); Consiglio Nazionale delle Ricerche (Italy); Gabriel Vanko, Slovak Academy of Sciences (Slovakia); Jürgen Wöllenstein, Fraunhofer-Institut für Physikalische Messtechnik (Germany)

All submissions must include: a 300-word abstract and a two-page supplemental file (see Submission Guidelines)

This biennial conference is the eighth in a series following its successful launch in 2003. Due to the interdisciplinary spirit of the event, a wide range of topics is covered, related to the design, fabrication, packaging and system integration of MEMS and NEMS-based sensors and actuators, exploiting micro and nanotechnology and ap-plying smart approaches for miniaturization and integration. Furthermore, basic as well as more ap-plication-oriented research topics are addressed, thus stimulating, in a cooperative atmosphere, the exchange between academia and industry. Topics include, but are not limited to: • material research: polymers, organic

materials, piezoelectric materials, nitrides, shape memory alloys, thermoelectric materials, other functional thin film materials, thick and thin films

• processes and fabrication technologies for MEMS and miniaturised systems: deposition techniques, lithography, self-alignment and masking techniques, etching and ablation techniques, hybrid technologies, inkjet or 3D printing

• functional surfaces: hydrophobic/hydrophilic functionalisation, tribological functions, anti-adhesion, biomimetic surfaces

• modelling and simulation of microsystems from packaged systems down to device level, CAD tools

• physical, mechanical, thermal, acoustic or magnetic sensors, actuators and resonators

• optical MEMS (MOEMS), RF MEMS, millimeter/submillimeter-wave and infrared devices, optoelectronic sensors

• chemical and biosensors, microfluidic devices, lab-on-chip, tactile sensing, artificial muscles

• energy harvesting, low power architectures, power management, autonomous sensor nodes

• calibration, characterisation, and testing techniques

• reliability, nanotribology, failure analysis, degradation mechanisms, life time prediction

• system integration, interface electronics, packaging and assembly, substrate technologies, 3D integration techniques, RFID, man-machine interface, micromechatronics and microrobotics applications and markets, distributed sensing and sensor networks, monitoring, control, and measurement systems.

+1 360 676 3290 • [email protected] • #SPIEMicrotech 3

4 SPIE MICROTECHNOLOGY 2017 • www.spie.org/MT17call


Cyber Physical Systems 2017 (EMT102)Conference Chair: Riccardo Brama, CMC Labs. (Italy)

Conference Co-Chairs: Alessandro Bertacchini, Univ. degli Studi di Modena e Reggio Emilia (Italy); Florian Hammer, Linz Ctr. of Mechatronics (Austria)

Programme Committee: Lynne Baillie, Glasgow Caledonian Univ. (United Kingdom); Steve P. Beeby, Univ. of Southampton (United Kingdom); João Canas Ferreira, Univ. do Porto (Portugal); Christian Claudel, King Abdullah Univ. of Science and Technology (Saudi Arabia); Michail E. Kiziroglou, Univ. of California, Berkeley (United States); Roberto Manione, Taskscript.com (Italy); Ian Marsh, Swedish Institute of Computer Science (Sweden); Peter Marwedel, Technische Univ. Dortmund (Germany); Sebastian Möller, Technische Univ. Berlin (Germany); Marilyn C. Wolf, Georgia Institute of Technology (United States)

The SPIE 2017 conference on Cyber Physical Systems (CPS’17), at its second edition, aims to take advantage of the always increasing hype on the Internet of Things (IoT) to cast a new light on CPSs. Progress on microtechnologies, enabling the design of possibly autonomous, miniaturised, sensors and actuators equipped devices allows to spread the adoption of CPSs in an ubiquitous way. This promotes an up-to-now unforecastable and exciting new scenario for CPSs. The attention, thus, will be focused on Cyber Physical Systems smart applications. In the near future social and environmental interactions will benefit deeply from CPSs. Taking advantage from research and development in technical areas such as network-ing, embedded computing, big data processing, energy-efficient system design, modeling and interoperability, among others, they will play a pivotal role as an enabling technology for a new industrial and agricultural revolution, in which more efficiency, less pollution, and a decreased human fingerprint impact on the environment will be fundamental. Moreover, by interacting with hu-mans and their lives, CPS applications need to be designed to be efficient and effective, to maximize the quality-of-experience level, and providing the highest degrees of security and reliability.

ABSTRACT SUBMISSIONAuthors will be required to upload a 300-word supplemental file of their abstract in which results (even if preliminary) must be clearly highlighted, together with experimental tests and method-ologies, in order for the paper to be properly evaluated.

NEW: DEMONSTRATION OPPORTUNITYAuthors are encouraged to enhance their contri-bution by presenting a brief demonstration show-case. This showcase will directly follow the oral presentation, giving attendees the chance to see live CPSs applications at work. Interested authors should choose the “demonstration opportunity” topic towards the end of the submission process to participate. Interested authors will be contacted after the 3 January 2017 Author Notification date with more information.

TOPICSAuthors from both academia and industry, artists, and technology visionaries are welcome to create an extremely stimulating, creative and cooperative atmosphere during the conference event. Paper topics include but are not limited to:• Robotics: personal assistants; self driving

cars; healthcare/medical robots and bots; unmanned aerial vehicles; autonomous underwater vehicles; life support and attendance robots

• Gaming: augmented reality; game design; cooperative games; vehicle simulators; educational games; cloud gaming

• Learning: cyber-valets; cyber-guides; smart museums; applications for smart tourism; artificial intelligence; learning environments; collaborative learning

• Smart Cities: applications for green cities; power grid consumption optimisation; autonomous and efficient plants and micro-plants; renewable energy; smart meters; self-aware/organising traffic control

• Civil Applications: smart home; ambient assisted living; smart/precision agriculture; smart environment; green solutions; zero impact enablers and solutions; green buildings; smart buildings; transportation; disaster relief


CALL FOR PAPERS

• Industrial Applications: industry 4.0; industrial automation; quality control; process optimisation and control; capillary actuation; flexible manufacturing; context awareness; production self-adaptation; enhanced risk management; safety; hazardous environments; explosive environments

• Logistics: Smart reusable transport items; mobile communication; self-organising mesh-networks; opportunistic clustering; environment sensing and monitoring; self and assisted localisation; navigation

• Human-to-Machine and Machine-to-Machine Interaction: human-computer interfaces; augmented reality; user interaction; interaction design; multimodal interaction; opportunistic interaction; user’s identification and rights management; usability; context driven/social interaction between systems; trustfulness and privacy between systems; quality of experience

• Data and Information Management: data mining; big data analysis; predictive algorithms and models for augmenting data informative content; structural health monitoring algorithms; reliability and lifetime prediction; semantic data models; flexible/holistic data ontologies

• Networking: routing protocols and strategies; power and context aware networking; advanced MAC design and simulation; power efficient devices discovery algorithms; network management; self-deploying and self-healing networks

• Modeling and Simulation: system simulation; network simulation; power consumption estimation; system holistic modeling; behavioral modeling; computational; physical and/or human aspects of smart CPSs; tools for assessing/testing interoperability between systems

• Embedded Computing: real-time control of dynamic systems; safety and intrinsic safety of embedded systems from design up to testing; device privacy and trustfulness; reliability and energy efficiency of software and firmware at all levels; distributed systems synchronisation; over-the-air trusted firmware upgrading; device to device communication protocols; real time schedulers; low power oriented operating systems

• System Design: flexible system design; interoperability; standards adoption and compliancy; applications and markets; system security.

Proceedings

PRESENT TO THE ROOM, PUBLISH TO THE WORLDThousands of people from academia, industry and national labs publish their work with SPIE every year. Get the recognition you deserve.

Publish your work in SPIE Proceedings.

SUBMIT YOUR ABSTRACT TODAY!www.spie.org/MT17call



Bio-MEMS and Medical Microdevices III (EMT103)Conference Chair: Sander van den Driesche, Univ. Bremen (Germany)

Conference Co-Chairs: Ioanna Giouroudi, DWI an der RWTH Aachen e.V. (Germany); Manuel Delgado-Restituto, Instituto de Microelectrónica de Sevilla (Spain)

Programme Committee: Artur Dybko, Warsaw Univ. of Technology (Poland); Michael Kraft, Univ. de Liège (Belgium); Laura Maria Lechuga, Ctr. d’ Investigacions en Nanociència i Nanotecnologia (Spain); Konstantinos Misiakos, National Ctr. for Scientific Research Demokritos (Greece); Niclas Roxhed, Royal Institute of Technology (Sweden); Ramón Ruiz-Merino, Univ. Politécnica de Cartagena (Spain); Josep Samitier Martí, Univ. de Barcelona (Spain); Uwe Schnakenberg, RWTH Aachen (Germany); Winnie E. Svendsen, Technical Univ. of Denmark (Denmark); Angeliki Tserepi, National Ctr. for Scientific Research Demokritos (Greece); Thomas Velten, Fraunhofer-Institut für Biomedizinische Technik (Germany); Sabeth Verpoorte, Univ. of Groningen (Netherlands); Fernando Vidal-Verdú, Univ. de Málaga (Spain); Jean-Louis Viovy, Institut Curie (France)

The rapidly expanding interest of the public in health issues provokes progress in research and technology in human-oriented Bio-MEMS and Medical Microdevices.

Fast medical analysis and minimal-invasive mi-cro-implants for patient monitoring and treatment (including early disease diagnosis, disease control, smart drug delivery, individualised treatment, and other aids for patients) strongly relies upon the in-novation and technology of micro- and nano-sen-sors, actuators, and microfluidics, embedded in integrated Bio-MEMS, and Lab-on-a-Chip devices.

In this research field, a synergy between physics, engineering, electronics, biochemistry, medicine, and neuroscience, is a most promising approach for innovation.

This conference is intended to bring together experts in different disciplines, linked by the strong motivation of contributing to this multi-disciplinary field.

Topics include, but are not limited to:• biosensors and medical sensors (optical,

electrical, mechanical, acoustic, etc.) • microfluidics (including lab-on-a-chip, organ-

on-a-chip, membrane-on-a-chip, and drug delivery microsystems)

• biomaterials and Bio-MEMS technologies • microarrays (droplets, pathogens, DNA,

proteins) • bio-inspired systems • neural Interfaces and implantable electronics • wearable biomedical electronics • wireless technology for medical devices • packaging and system integration.

IMPORTANT DATESAbstracts Due: 24 OCTOBER 2016Author Notification: 3 JANARY 2017The contact author will be notified of abstract acceptance by email.

Manuscripts Due: 10 APRIL 2017

PLEASE NOTE: Submissions imply the intent of at least one author to register, attend the conference, present the paper as scheduled, and submit a manuscript for publication in the conference proceedings in the SPIE Digital Library.


CALL FOR PAPERS

Nanotechnology VIII (EMT104)Conference Chair: Ion M. Tiginyanu, Academy of Sciences of Moldova (Moldova)

Conference Co-Chairs: Rainer Adelung, Christian-Albrechts-Univ. zu Kiel (Germany); Andrei Sarua, Univ. of Bristol (United Kingdom)

Programme Committee: Necmi Biyikli, Bilkent Univ. (Turkey); Robert K. Feidenhans’l, Univ. of Copenhagen (Denmark); Jochen Feldmann, Ludwig-Maximilians-Univ. München (Germany); Nicolas Grandjean, Ecole Polytechnique Fédérale de Lausanne (Switzerland); Bianchi Méndez, Univ. Complutense de Madrid (Spain); Arben Merkoçi, Institut Català de Nanotecnologia (Spain); Hidenori Mimura, Shizuoka Univ. (Japan); Teresa Monteiro, Univ. de Aveiro (Portugal); Carlo Ricci, Univ. degli Studi di Cagliari (Italy); Ionel-Valentin Vlad, The Romanian Academy (Romania); Vladimir A. Yuryev, A. M. Prokhorov General Physics Institute (Russian Federation); Anvar A. Zakhidov, The Univ. of Texas at Dallas (United States); Anatoly V. Zayats, King’s College London (United Kingdom)

All submissions must include: a 300-word abstract and a two-page supplemental file (see Submission Guidelines )

Solutions for energy storage problems, elec-tronics, photonics, or health care are based on nanotechnology as an enabling technology. The conference aims towards bringing together scien-tists covering the full range from basic research to applications and from all disciplines of natural sciences and engineering dealing with nanotech-nology. Special emphasis should be given on re-search, technologies and techniques that address latest trends in electronics and energy, photonics, mechanics, and biomedicine as well as nanostruc-ture fabrication and integration routes in general.

The conference covers, but is not limited to the following areas of research:

NANOFABRICATION, NANOLITHOGRAPHY, INTEGRATION, AND MATERIALS Novel bottom-up and top-down techniques and their combination like micro nano integration, self-assembly based fabrication techniques, tem-plate techniques or novel self-organisation and assembling strategies, including 3D nanostruc-tures and composites. Nanomaterials including nanoparticles, nanowires, nanomembranes, nanotubes, nano-scale building blocks, and inte-gration on chip.

NANOSTRUCTURED ELECTRODES, NANOSENSORS, NANOELECTRONICS, AND ENERGY SYSTEMS Electronics utilising the high surface to volume ratio, new sensing approaches, battery electrodes, super capacitors, energy harvesting, graphene and other one-atom or few-atom-thick sheet ma-terials, carbon nanotubes, molecular electronics, single (few) charge effects, spintronics, plasmon-ics, magnonics, phononics, electronics etc.

NANOPHOTONICS Single and few photon sources/detectors, near-field optics, nanophotonics and plasmonics, optical properties of low-dimensional structures, including metallo-dielectric periodic or quasi-pe-riodic structures, novel 3D nanoarchitectures, new concepts for waveguiding etc. considering also nanofabrication techniques.

NANOMECHANICS NEMS employing thin films, nanowires, nanotubes, nanocrystals, ultrathin membranes, nanocom-posite materials, piezoelectric materials in NEMS applications, hierarchical structures and artificially fabricated systems.

NANO BIOMEDICINE Bioinspired nanotechnologies and nanomaterials, nanostructured materials in regenerative med-icine, nanomaterials for drug delivery, sensing, diagnostics, imaging, etc. The focus of the con-tribution should be as well set on the nanoscopic aspects.


Integrated Photonics: Materials, Devices, and Applications IV (EMT105)Conference Chair: Jean-Marc Fédéli, CEA-LETI (France)

Conference Co-Chair: Laurent Vivien, Institut d’Électronique Fondamentale (France)

Programme Committee: Pavel Cheben, National Research Council Canada (Canada); Norbert Grote, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany); Giovanni Isella, Lab. for Epitaxial Nanostructures on Silicon and Spintronics (Italy); Laura Maria Lechuga, CIN2 (Spain); Andrea I. Melloni, Politecnico di Milano (Italy); Iñigo Molina-Fernandez, Univ. de Málaga (Spain); Régis Orobtchouk, Institut National des Sciences Appliquées de Lyon (France); Richard V. Penty, Univ. of Cambridge (United Kingdom); Lorenzo Pavesi, Univ. degli Studi di Trento (Italy); Günther Roelkens, Univ. Gent (Belgium); Kazumi Wada, The Univ. of Tokyo (Japan); Dan-Xia Xu, National Research Council Canada (Canada)


Photonics is having a tremendous impact on human beings and their environment, spanning a wide range of applications such as communica-tions, diagnostics, displays, ranging, sensing, and storage. Recent advances in the development of new integrated photonic materials, devices, sys-tems, and techniques, especially those related to microtechnologies and nanotechnologies, suggest that these areas will play an increasingly important role in the future.

The aim of this conference will be to bring together research scientists and engineers, who work on the different aspects of this fascinating field--and thus to provide an interdisciplinary update and review of innovations in integrated photonic materials, devices, systems, and their applications. The scope of the conference will include microtechnological and nanotechnological manufacturing advances, as well as work on theoretical, numerical, and experimental tools that support and enable these innovations.

The conference includes, but is not limited to, the following topics: • all optical signal processing, advanced signal

processing • displays in 2D and 3D • optical MEMS • integrated photonics, silicon photonics, and

InP photonics • plasmonic devices • laser material synthesis and processing, laser-

induced fabrication of photonic materials • photonic materials, devices, and systems for

communication, sensing, biomedicine, and environment

• linear lightwave circuits, planar lightwave circuits (PLCs), volumetric lightwave circuits (VLCs)

• microcavities, microresonators, photonic atoms, and photonic molecules

• subwavelength engineered metamaterial waveguide structures for integrated photonics

• microwave photonics • nanophotonics, nanostructured materials,

devices, and systems • organic, semiconductor, and hybrid photonic

materials, devices, and systems • photonic bandgap materials, photonic crystal • THz photonics, longwave infrared optics

(LIO).


SPIEDigitalLibrary.orgFind the answer

The paper you present will live far beyond the conference roomAll proceedings from this event will be published in the SPIE Digital Library, promoting breakthrough results, ideas, and organizations to millions of key researchers from around the world. SPIE partners with relevant scientific databases to enable researchers to find the papers in the Proceedings of SPIE easily. The databases that abstract and index these papers include Astrophysical Data System (ADS), Chemical Abstracts (relevant content), Compendex, CrossRef, Current Contents, DeepDyve, Google Scholar, Inspec, Portico, Scopus, SPIN, and Web of Science Conference Proceedings Citation Index.

Helping engineers and scientists stay current

and competitive


CALL FOR PAPERS

General Information

TECHNICAL PROGRAMMEAvailable January 2017The comprehensive Advance Technical Programme for this symposium will list conferences, paper titles, and authors in order of presentation; an outline of all planned special events; and hotel and registration information. All those who submit an abstract will receive a copy.

REGISTRATIONSPIE Microtechnologies registration will be available January 2017All participants, including invited speakers, con-tributed speakers, session chairs, co-chairs, and committee members, must pay a registration fee. Authors, coauthors, program committee members, and session chairs are accorded a reduced sympo-sium registration fee.

Fee information for conferences, a registration form, and technical and general information will be available on the SPIE website in January 2017.

HOTEL INFORMATIONOpening of the hotel reservation process for SPIE Microtechnologies 2017 is scheduled for February 2017. SPIE will arrange special discounted hotel rates for SPIE conference attendees.

The website will be kept current with any updates.

SPIE International Headquarters PO Box 10 Bellingham, WA 98227-0010 USA Tel: +1 360 676 3290 / Fax: +1 360 647 1445 [email protected] / www.SPIE.org

SPIE Europe Office 2 Alexandra Gate Ffordd Pengam, Cardiff, CF24 2SA UK Tel: +44 29 2089 4747 / Fax: +44 29 2089 4750 [email protected] / www.SPIE.org

SPIE MEMBERSHIPSPIE Members receive 15% off conference and course registration fees.

STUDENT TRAVEL GRANTSA limited number of SPIE student travel grants will be awarded based on need. Applications must be received no later than 27 February 2017. Eligible applicants must present an accepted paper at this meeting. Offer applies to undergraduate/graduate students who are enrolled full-time and have not yet received their PhD.

CLEARANCE INFORMATIONIf government and/or company clearance is re-quired to present and publish your presenta tion, start the process now to ensure that you receive clearance if your paper is accepted.

VISA INFORMATION AND INVITATION REQUESTSApply now for your Visa!

Nationals of all Western European countries can visit Spain without a visa; US, Canadian, and Australian passport holders can stay up to 90 days without a visa. For additional details and specific visa re-quirements, please contact the Spanish Embassy in your country.


1. BY SUBMITTING AN ABSTRACT, I AGREE TO THE FOLLOWING CONDITIONS:• An author or coauthor (including keynote, invited, and

solicited speakers) will register at the reduced author registration rate, attend the meeting, and make the presentation as scheduled (current SPIE Members receive an additional discount on the registration fee).

• Authors and coauthors attending the meeting will obtain funding for their registration fees, travel, and accommodations, independent of SPIE, through their sponsoring organizations before submitting abstracts.

• All clearances, including government and company clearance, have been obtained to present and publish. If you are a DoD contractor, allow at least 60 days for clearance.

• Provide abstract information as requested.• Prepare a manuscript (6 pages minimum; 20 pages

maximum) for any accepted oral or poster presenta-tion for publication in the conference Proceedings in the SPIE Digital Library.

SUBMIT AN ABSTRACT AND SUMMARY ONLINE AT : http://www.spie.org/MT17call• Have all contact information (full given and family

names, affiliations, addresses, phone numbers, and emails) for your coauthors ready.

• Only original material should be submitted.• Prepare an expanded abstract of up to two pages as

a supplemental file for review purposes. This file may contain images / graphs / tables. This information will assist the Conference Chairs in determining placement in the program.

• Please submit a 300-word text abstract for the tech-nical abstract digest suitable for publication. Accepted abstracts may be available for download shortly before the meeting.

• Please also submit a 100-word text abstract suitable for early release. If accepted, this abstract text will be published prior to the meeting in the online or printed programs promoting the conference.

• Abstracts should contain enough detail to clearly convey the approach and the results of the research.

• Commercial papers, papers with no new research/development content, and papers where supporting data or a technical description cannot be given for pro-prietary reasons will not be accepted for presentation in this conference.

3. SUBMIT YOUR ABSTRACT ONLINE:• If you have already chosen a conference to submit to,

return to the previous page and click the “Submit an abstract” link.

ABSTRACT SUBMISSION

By submitting an abstract, I agree to the following conditions:

• If you haven’t yet chosen a conference to submit to, browse to locate a conference from the link at: http://spie.org/MT17call. Once you choose a conference, click “submit an abstract” from the conference call for papers.

• You will be prompted to sign in to spie.org and follow the submission wizard. If you have a spie.org account, sign in using your username and password. First-time users of spie.org can create a new account by clicking on the “create new account link”.

REVIEW, NOTIFICATION, PROGRAM PLACEMENT• To ensure a high-quality conference, all abstracts

and Proceedings manuscripts will be reviewed by the Conference Chair/Editor for technical merit and suitability of content. Conference Chair/Editors may require manuscript revision before approving publica-tion, and reserve the right to reject for presentation or publication any paper that does not meet content or presentation expectations. SPIE’s decision on whether to accept a presentation or publish a manuscript is final.

• The contact author will be notified of abstract accep-tance and sent manuscript instructions by e-mail no later than 3 January 2017

• Final placement in an oral or poster session is subject to the Chairs’ discretion. Instructions for oral and poster presentations may be found from the “For Authors/Presenters” link.

INFORMATION ON THE PROCEEDINGS OF SPIE IN THE SPIE DIGITAL LIBRARY• Full-manuscripts will be Chair/Editor-reviewed and

published in the Proceedings of SPIE and in SPIE Digital Library.

• Manuscript instructions will be e-mailed to the contact author and are also available from the “For Authors/Presenters” link on the conference website.

• Authors must be authorized to transfer copyright of the manuscript to SPIE, or provide a suitable publication license.

• Only papers presented at the conference and received according to publication guidelines and timelines will be published in the conference Proceedings in the SPIE Digital Library.

• SPIE partners with relevant scientific databases to enable researchers to find the papers in the Pro-ceedings of SPIE easily. The databases that abstract and index these papers include Astrophysical Data System (ADS), Chemical Abstracts (relevant content), Compendex, CrossRef, Current Contents, DeepDyve, Google Scholar, Inspec, Portico, Scopus, SPIN, and Web of Science Conference Proceedings Citation Index.

Join us in Barcelona and gain career insights as well as some relaxation time at the Hotel Alimara Hotel. Whether you are presenting to your peers, or are looking to gain further knowledge to enhance your research area, we welcome your participation.

Barcelona is located directly on the northeastern Mediterranean coast of Spain, has a rich history. This beautiful city is full of what European cities are known for (outdoor markets, restaurants, shops, museums and churches) and is fantastic for walking with an extensive and reliable Metro system for more far-flung destinations. The core centre of town, focused around the Ciutat Vella (“Old City”) provides days of enjoyment for those looking to experience the life of Barcelona.

SPIE AND BARCELONA ARE BRINGING YOU MORE OF WHAT YOU NEED FOR SUCCESS

• Present a paper and participate in the conference

• Meet the top researchers and experts in the imaging field

• Receive feedback from your peers

• Hear the latest research

• Network with your colleagues

• SPIE conference papers are published in the SPIE Digital Library, the world’s largest collection of optics and photonics research

• Publish an accepted paper in one of the following SPIE Journals: (OE) Optical Engineering, (JBO) Biomedical Optics, (JM3) Micro/Nanolithography, MEMS, and MOEMS, or (JNP) Nanophotonics

PLAN TO BE PART OF SPIE MICROTECHNOLOGIES 2017 IN BARCELONA

GAIN VISIBILITY AT THE PREMIER INTERNATIONAL FORUM ON MICROTECHNOLGY

www.spie.org/MT17callSUBMIT YOUR ABSTRACT TODAY

Hotel Alimara · Barcelona, Spain

CONFERENCE 8–10 May 2017

PARTICIPATE IN THE PREMIER EUROPEAN EVENT FOR MICRO- AND NANOSCALE SYSTEMS

TECHNOLOGY AND APPLICATIONS

Present your work at SPIE Microtechnologies, the European meeting where the latest progress in microtechnology and nanotechnology systems and applications is presented with a focus on development in the areas of smart sensors, cyber-physical systems, bioMEMs, medical devices, and integrated photonics.

200 ATTENDEES

225 PAPERS

• Smart Sensors, Actuators, and MEMS

• Cyber Physical Systems• Bio-MEMS and Medical

Microdevices• Nanotechnology• Integrated Photonics:

Materials, Devices and Applications

SPONSORSHIPS Maximize your visibility to the microtechnologies community: secure a sponsorship at SPIE Microtechnologies 2017

8-10

M

AY 2

017

SUB

MIT

YO

UR

A

BST

RA

CT

TOD

AY

Hot

el A

limar

aB

arce

lona

, Spa

in w

ww

.sp

ie.o

rg/M

T17

call

Pres

ent y

our r

esea

rch

in

mic

rote

chno

logy

+ n

anot

echn

olog

y sy

stem

s and

app

licat

ions

with

a

focu

s on

smar

t sen

sors

, cy

ber-

phys

ical

syst

ems,

bi

oMEM

s, m

edic

al d

evic

es,

and

inte

grat

ed p

hoto

nics

.

2 A

lexa

ndra

Gat

e, F

ford

d Pe

ngam

, C

ardi

ff, C

F24

2SA

, UK