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2016 IEEE International Electron Devices Meeting December 3rd—7th, 2016 Hilton San Francisco Union Square, San Francisco, California IEDM 2016 Highlights Plenary Speakers Monday, December 5 Technology Scaling Challenges and Opportunities of Memory Devices, Seok-Hee Lee, Hynix Brain-Inspired Computing, Dharmendra S. Mohda, IBM Symbiotic Low-Power, Smart and Secure Technologies in the Age of Hyperconnectivity, Marie-Noëlle Semeria, CEA-Leti Special Focus Sessions System-Level Impact of Power Devices Wearable Electronics and Internet of Things Ultra High Speed Electronics Quantum Computing IEDM Luncheon Tuesday, December 6th Prof. Roberto Cingolani, Istituto Italiano di Tecnologia Translating Evolution into Technology: From Biochemical Robots to Autonomous Anthropomorphic Machines Evening Panel Discussions Tuesday, December 6th How Will the Semiconductor Industry Change to Enable 50B Connected Devices? Challenges and Opportunities for Neuromorphic and Machine Learning Entrepreneur Luncheon Wednesday, December 7th (Sponsored by IEEE Women in Engineering) Vamsee Pamula, Founder of Baebies, a newborn screening and pediatric testing company using digital microfluidics technology. Professional Development The Struggle to Keep Scaling BEOL, and What We Can Do Next Physical Characterization of Advanced Devices Spinelectronics: From Basic Phenomena to Magnetoresistive Memory (MRAM) Applications Electronic Circuits and Architectures for Neuromorphic Computing Platforms Present and Future of FEOL Reliability - From Dielectric Trap Properties to Reliable Circuit Operation Embedded Systems and Innovative Technologies for IoT Applications IEDM’s program consists of more than 200 papers from the world’s leading experts from industry, government & academia, covering the following topics: Circuit and Device Interaction Characterization, Reliability and Yield Compound Semiconductor and High Speed Devices Memory Technology Modeling and Simulation Nano Device Technology Optoelectronics, Displays, and Imagers Power Devices Process and Manufacturing Technology Sensors, MEMS, and BioMEMS Technology Options at the 5 Nanometer Node Tutorials Saturday, December 3 Short Courses Sunday, December 4 IEDM Online: ieee-iedm.org Social Networks: ieee-iedm.org/social-media Patterning Technology for the 5nm Node Options Beyond FinFETs at 5nm Node Front-End Parasitic Resistance and Capacitance Extending FinFETs to 5nm Node Back-End Parasitic Resistance and Capacitance Mitigation Advanced Metrology Design/Technology Enablers for Computing Applications The Rise of Massively Parallel Processing: Why the Demands of Big Data and Power Efficiency Are Changing the Computing Landscape Interconnect Challenges for Computing Breaking the Memory Bottleneck in Computing Applications with Emerging Memory Technologies: A Design Perspective (Circuit Level) Breaking the Memory Bottleneck in Computing Applications with Emerging Memory Technologies: A Technology Perspective (Device Level) Power Management Integrated Circuits for Computing…and How GaN Changes the Story Advanced Packaging Technologies for System Integration

2016 IEEE International Electron Devices Meeting · IEDM’s program consists of more than 200 papers from the world’s leading experts from industry, government & academia, covering

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Page 1: 2016 IEEE International Electron Devices Meeting · IEDM’s program consists of more than 200 papers from the world’s leading experts from industry, government & academia, covering

2016 IEEE International Electron Devices MeetingDecember 3rd—7th, 2016

Hilton San Francisco Union Square, San Francisco, California

IEDM 2016 HighlightsPlenary Speakers Monday, December 5

Technology Scaling Challenges and Opportunities of Memory Devices, Seok-Hee Lee, Hynix

Brain-Inspired Computing, Dharmendra S. Mohda, IBM Symbiotic Low-Power, Smart and Secure Technologies in the Age of Hyperconnectivity, Marie-Noëlle Semeria, CEA-Leti

Special Focus Sessions System-Level Impact of Power Devices Wearable Electronics and Internet of Things Ultra High Speed Electronics Quantum Computing

IEDM Luncheon Tuesday, December 6th

Prof. Roberto Cingolani, Istituto Italiano di TecnologiaTranslating Evolution into Technology: From Biochemical Robots to Autonomous

Anthropomorphic Machines

Evening Panel Discussions Tuesday, December 6th

How Will the Semiconductor Industry Change to Enable 50B Connected Devices? Challenges and Opportunities for Neuromorphic and Machine Learning

Entrepreneur Luncheon Wednesday, December 7th

(Sponsored by IEEE Women in Engineering)Vamsee Pamula, Founder of Baebies, a newborn screening and pediatric testing

company using digital microfluidics technology.

Professional Development

The Struggle to Keep Scaling BEOL, and What We Can Do Next

Physical Characterization of Advanced Devices

Spinelectronics: From Basic Phenomena to Magnetoresistive Memory (MRAM) Applications

Electronic Circuits and Architectures for Neuromorphic Computing Platforms

Present and Future of FEOL Reliability - From Dielectric Trap Properties to Reliable Circuit Operation

Embedded Systems and Innovative Technologies for IoT Applications

IEDM’s program consists of more than 200 papers from the world’s leading experts from industry, government & academia, covering the following topics:Circuit and Device Interaction Characterization, Reliability and Yield Compound Semiconductor and High Speed Devices Memory Technology Modeling and Simulation

Nano Device Technology Optoelectronics, Displays, and Imagers Power Devices Process and Manufacturing Technology Sensors, MEMS, and BioMEMS

Technology Options at the 5 Nanometer Node

Tutorials Saturday, December 3

Short Courses Sunday, December 4

IEDM Online: ieee-iedm.orgSocial Networks: ieee-iedm.org/social-media

Patterning Technology for the 5nm Node Options Beyond FinFETs at 5nm Node Front-End Parasitic Resistance and Capacitance

Extending FinFETs to 5nm Node Back-End Parasitic Resistance and Capacitance Mitigation Advanced Metrology

Design/Technology Enablers for Computing Applications

The Rise of Massively Parallel Processing: Why the Demands of Big Data and Power Efficiency Are Changing the Computing Landscape Interconnect Challenges for Computing Breaking the Memory Bottleneck in Computing Applications with Emerging Memory Technologies: A Design Perspective (Circuit Level)

Breaking the Memory Bottleneck in Computing Applications with Emerging Memory Technologies: A Technology Perspective (Device Level) Power Management Integrated Circuits for Computing…and How GaN Changes the Story Advanced Packaging Technologies for System Integration