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www.we-online.com/embedding
WebinarECT Best Practice:How to handle a PCB project with embedded components?
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
Jürgen Wolf
Würth Elektronik GmbH & Co. KGProduct Manager
Embedded Component Technology
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 2
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 3
Embedded Component Technology – ECTAdvantages of „buried“ components?
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 4
Miniaturization
Performance/Function
Reliability
• Integrated shielding• Short signal paths• Protection against plagiarism
• Protected against influences• Secure fixing• Thermal management
• Package replacement• Space savings of assembly
area on the outer layers
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 5
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
ECT–µVia ManufacturingECT–µVia Manufacturing
Assembly(Gluing/Sintering/
Soldering)
Multilayerpressing
Drilling ofvias and microvias
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 6
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
Non-plated microviaon embeddedcapacitor withCu termination
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 7
length: 58,97 µm
length: 21,96 µm
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
ECT–µVia ManufacturingECT–µVia Manufacturing
Assembly(Gluing/Sintering/
Soldering)
Multilayerpressing
Drilling ofvias and microvias
Plating andstructuring
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 8
Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices
Plated Microviaon embeddedcapacitor withCu termination
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 9
Embedded Component Technology – ECTECT–Flip Chip: Embedded active devices
ECT-Flip Chip ProductionECT-Flip Chip Production
Core with footprintfor Flip Chip
Assembly(Flip Chip – ACA)
Multilayerpressing
Remaining PCBprocesses
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 10
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 11
Embedded Component Technology – ECTAvailability of components
Passive Components with Cu-Termination
mounting form0402
Thicknesses from150 µm to 300 µm
CapacitorsResistors
Bare Die Silicon ICs with process compatible pads
Generallya customerprovision
ECT–Flip Chip Pads
• Wirebond Au Stud-Bumps
• Wafer-level Au-Bumps
ECT–µVia Pads
• Cu
• NiPd
150 µm150 µm
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 12
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 13
Embedded Component Technology – ECTCollaboration in the development
Very close collaborationis needed at a very early stage
in the concept and design phaseto be successful
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 14
product idea
concept
design
draft
development
prototypes
optimisation
Serial production
Products usingECT
BOM – Analysis of an existing predecessor-layout (if available)
Embedded Component Technology – ECTAnalysis of existing boards with regard to usability of embedded components
Designator Value Quantity Manufacturer Manufacturer Part Number Supplier 1 Supplier Device Package Supplier Part Number 1 Supplier Unit Price 1 Comment Footprint
nHIB, RST 2 C&K Components KMR231G ULC LFS Digi-Key CKN10245CT-ND 0.71 Value Taster_Miniatur
ANT 1 Cinch Connectivity Solutions Johnson 128-0711-201 Digi-Key J983CT-ND 0.99 U.FL-R-SMT U.FL-R-SMT
PROG 1 SAMTEC FTS-104-03-F-DV-TR Farnell 1928283 Stecker_8Pin SAMTEC_FTS_104
R1, R2, R3, R4, R6, R8, R9, R10, R11, R13, R14 100k 11 Yageo RC'0402JR-07100KL Digi-Key '0402 311-100KJRCT-ND 0.10 Res3 '0402
R12, R15, R16, R18, R19 N.C. 5 Res3 '0402
R17, R20 100 2 Panasonic Electronic Components ERJ-2GEJ101X Digi-Key '0402 P100JCT-ND 0.10 Res3 '0402
R5, R7 10k 2 Yageo RC'0402JR-0710KL Digi-Key '0402 311-10KJRCT-ND 0.10 Res3 '0402
T1, T2 N.C. 2 N.C. Testpin_0.8
U2 1 Micron Technology Inc M25PX80-VMN6TP Digi-Key 8-SO M25PX80-VMN6TPCT-ND 0.90 M25PX80-VMN6TP MICT-MN-8_N
L1, L3 2.2uH 2 Murata Electronics North America LQM2HPN2R2MG0L Digi-Key 1008 (2520 Metric) 490-5114-1-ND 0.36 LQM2HPN2R2MG0L 1008_inductor
L2 1uH 1 Murata Electronics North America LQM2HPN1R0MJ0L Digi-Key 1008 (2520 Metric) 490-6699-1-ND 0.42 LQM2HPN1R0MJ0L 1008_inductor
AUX N.C. 1 Header 2 PIN2 _1.27
J1, J2, J3 3 Hirose Electric Co Ltd DF40C-20DP-0.4V(51) Digi-Key H11618CT-ND 0.83 DF40C-20DP-0.4V DF40C-20DP-0.4V
FL1 1 TDK Corporation DEA202450BT-1294C1-H Digi-Key 445-172335-1-ND 0.54 DEA202450BT-1294C1-H DEA202450BT-1294C1-H
U1 1 TEXAS INSTRUMENTS CC3100R11MRGC Farnell 2445381 Dez 21 CC3100 PVQFN-64
C1, C6, C7, C9, C10, C15, C16, C21, C22, C23, C27 100nF 11 Taiyo Yuden LMK105BJ104KV-F Digi-Key 587-1227-1-ND 0.034 Cap Semi '0402
C12 1uF 1 Murata Electronics North America GRM155R61A105ME15D Digi-Key 490-5409-1-ND Cap Semi '0402
C13, C14 22uF 2 Taiyo Yuden AMK107BBJ226MAHT Digi-Key 587-3262-1-ND 0.66 Cap Semi J1-0603
C18, C19, C20 4.7uF 3 Samsung Electro-Mechanics America, Inc CL05A475MQ5NRNC Digi-Key 1276-1056-1-ND 0.22 Cap Semi '0402
C2, C3 6.2pF 2 Murata Electronics North America GRM1555C1H6R2BA01D Digi-Key 490-8224-1-ND 0.10 Cap Semi '0402
C24, C25 100uF 2 TDK Corporation C3216X5R0J107M160AB Digi-Key 445-6008-1-ND Jan 32 Cap Semi C1206
C4, C5, C26 10pF 3 AVX Corporation '04025U100CAT2A Digi-Key 478-5991-1-ND 0.14 Cap Semi '0402
C8, C11, C17 10uF 3 Murata Electronics North America GRM188R60J106ME47D Digi-Key 490-3896-2-ND Cap Semi J1-0603
XT2 1 Abracon Corporation ABS07-32.768KHZ-T Digi-Key 535-9542-1-ND Jan 24 ABS07-32.768KHZ-T ABS07
XT1 1 AVX Corp/Kyocera Corp CX3225GB40000D0HEQCC Digi-Key 1253-1222-1-ND 0.75 40MHz CMAC-XTAL_2.5x3.2
Designator Value Quantity Manufacturer Manufacturer Part Number Supplier 1 Supplier Device Package Supplier Part Number 1 Supplier Unit Price 1 Comment Footprint
nHIB, RST 2 C&K Components KMR231G ULC LFS Digi-Key CKN10245CT-ND 0.71 Value Taster_Miniatur
ANT 1 Cinch Connectivity Solutions Johnson 128-0711-201 Digi-Key J983CT-ND 0.99 U.FL-R-SMT U.FL-R-SMT
PROG 1 SAMTEC FTS-104-03-F-DV-TR Farnell 1928283 Stecker_8Pin SAMTEC_FTS_104
R1, R2, R3, R4, R6, R8, R9, R10, R11, R13, R14 100k 11 Yageo RC'0402JR-07100KL Digi-Key '0402 311-100KJRCT-ND 0.10 Res3 '0402
R12, R15, R16, R18, R19 N.C. 5 Res3 '0402
R17, R20 100 2 Panasonic Electronic Components ERJ-2GEJ101X Digi-Key '0402 P100JCT-ND 0.10 Res3 '0402
R5, R7 10k 2 Yageo RC'0402JR-0710KL Digi-Key '0402 311-10KJRCT-ND 0.10 Res3 '0402
T1, T2 N.C. 2 N.C. Testpin_0.8
U2 1 Micron Technology Inc M25PX80-VMN6TP Digi-Key 8-SO M25PX80-VMN6TPCT-ND 0.90 M25PX80-VMN6TP MICT-MN-8_N
L1, L3 2.2uH 2 Murata Electronics North America LQM2HPN2R2MG0L Digi-Key 1008 (2520 Metric) 490-5114-1-ND 0.36 LQM2HPN2R2MG0L 1008_inductor
L2 1uH 1 Murata Electronics North America LQM2HPN1R0MJ0L Digi-Key 1008 (2520 Metric) 490-6699-1-ND 0.42 LQM2HPN1R0MJ0L 1008_inductor
AUX N.C. 1 Header 2 PIN2 _1.27
J1, J2, J3 3 Hirose Electric Co Ltd DF40C-20DP-0.4V(51) Digi-Key H11618CT-ND 0.83 DF40C-20DP-0.4V DF40C-20DP-0.4V
FL1 1 TDK Corporation DEA202450BT-1294C1-H Digi-Key 445-172335-1-ND 0.54 DEA202450BT-1294C1-H DEA202450BT-1294C1-H
U1 1 TEXAS INSTRUMENTS CC3100R11MRGC Farnell 2445381 Dez 21 CC3100 PVQFN-64
C1, C6, C7, C9, C10, C15, C16, C21, C22, C23, C27 100nF 11 Taiyo Yuden LMK105BJ104KV-F Digi-Key 587-1227-1-ND 0.034 Cap Semi '0402
C12 1uF 1 Murata Electronics North America GRM155R61A105ME15D Digi-Key 490-5409-1-ND Cap Semi '0402
C13, C14 22uF 2 Taiyo Yuden AMK107BBJ226MAHT Digi-Key 587-3262-1-ND 0.66 Cap Semi J1-0603
C18, C19, C20 4.7uF 3 Samsung Electro-Mechanics America, Inc CL05A475MQ5NRNC Digi-Key 1276-1056-1-ND 0.22 Cap Semi '0402
C2, C3 6.2pF 2 Murata Electronics North America GRM1555C1H6R2BA01D Digi-Key 490-8224-1-ND 0.10 Cap Semi '0402
C24, C25 100uF 2 TDK Corporation C3216X5R0J107M160AB Digi-Key 445-6008-1-ND Jan 32 Cap Semi C1206
C4, C5, C26 10pF 3 AVX Corporation '04025U100CAT2A Digi-Key 478-5991-1-ND 0.14 Cap Semi '0402
C8, C11, C17 10uF 3 Murata Electronics North America GRM188R60J106ME47D Digi-Key 490-3896-2-ND Cap Semi J1-0603
XT2 1 Abracon Corporation ABS07-32.768KHZ-T Digi-Key 535-9542-1-ND Jan 24 ABS07-32.768KHZ-T ABS07
XT1 1 AVX Corp/Kyocera Corp CX3225GB40000D0HEQCC Digi-Key 1253-1222-1-ND 0.75 40MHz CMAC-XTAL_2.5x3.2
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 15
BOM – Analysis of an existing predecessor-layout (if available)
Embedded Component Technology – ECTAnalysis of existing boards with regard to usability of embedded components
Embeddable Componentsidentified in BOM
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 16
Embedding of active and passive components:
Initial meeting Final implementation
Embedded Component Technology – ECTCollaboration in the concept phase
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 17
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 18
EDA-Tools for ECT:
The latest versions of these tools:
Embedded Component Technology – ECTDesign and layout?
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 19
Allegro® PCB DesignerMiniaturization Option
Further toolspossible,
but with limitations
with limitations
EDA-Tools for ECT:
Main differences between these tools
ECT capable tools:
Central part libraries,footprints may be moved toany Layer of the layout
3D Design Rule Checkincluding mechanical checks
ECT incapable tools:
Application specific partlibrary, same layer stack forlibrary and application boardwith footprint on dedicatedlayer
Only 2D Design Rule Check,no Z-axis-check
Embedded Component Technology – ECTDesign and layout?
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 20
Embedded Component Technology – ECTDesign Rules ECT–µVia and ECT–Flip Chip
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 21
distancechip / sidewall
≥ 500 µm
core
prepreg
pad 175 µm
end 70 µm
componentheight
≥ 150 µm (<150 µm
uponrequest)
pitch≥ 250 µm
pad metallization≥ 6 µm Cu or≥ 5 µm Ni + flash Pd
adhesive
embedded component≤ 5 mm x 5 mm
distancenext component
≥ 300 µm
dielectricthickness
≥ 50 µm
dielectricthickness
20 – 25 µm
pad ≥ 125 µm
distancepad / pad≥ 75 µm
≈
backside contact (microvia or ICA) available upon request
distancepad / pad≥ 50 µm
componentheight≥ 150 µm
dielectricthickness≥ 50 µm
pitch≥ 100 µm
embedded flip chip≤ 5 mm x 5 mm
pad≥ 50 µm
adhesiveACA / NCA /
ESC (EncapsulatedSolder Connection)
How to handle a PCB projectwith embedded components?
Basic Motivation
Brief overview of technologies toembed discrete components
Possible components
Conceptual phase and layer constructions
Design & layout
Summary
Embedded Component Technology – ECTECT Best Practice
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 22
How to handle a PCB projectwith embedded components?
Summary
Different technologies possible
Components must meet certain conditions
Würth Elektronik already provides supportduring conceptual phase for
layer constructions,
design and
layout
Embedded Component Technology – ECTECT Best Practice
Jürgen Wolf
Würth Elektronik GmbH & Co. KGProduct Manager
Embedded Component Technology
05.05.2015www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 Page 23