20142014CorporateCorporate

OVERVIEWOVERVIEW

Presented to Presented to ------------------------------------

- PCB Layout

Routing Services

Library Services

- Mechanical Design

- Signal Integrity

- Quick Turn

- High Mix Low Volume

- Medium to High Volume

- Single Sided

- Multilayer

- Metal Core

- High Speed I/O Connectors

- Push/Pull Connectors

- RJ45 W/ Magnetics

- USB, SATA, HDMI Connectors

- HDMI/USB Cable Assemblies

- Discrete Magnetic Products

- B2B Connectors

- AOC Assemblies

- MEMS

- E-Bike

- Battery Management

Engineering Division

Printed CircuitBoard Division

ComponentDivision

NewTechnologies

Division

INTRODUCTION

Taiwan Design Facility Established / 1988

China Operation Center (COC) Formed / Began China PCB Production / 2001Taiwan Operation Center (TOC) Formed / Began Taiwan PCB Production / 1999N. & S. California Facility Established / 1993 / 1997

Invested in Corporation, PALWONN Group Established / 2010

Component Division Formally Established, Invested in / 2007

Opened Fast Print North America / 2013

1988 1993 2007 2011 2013

Magnetic, PalCELL and PalMEMS Divisions / 2012

merged Sitor / 2011

Suzhou (ZPW) Starts Production,

Invested in / 2011

MILESTONES

PALPILOT ALLIANCE PARTNERS

GLOBAL LOCATIONS

Corporate Offices / Design Center Regional Sales Offices PCB Manufacturing / Design Center

PalPilot Taiwan Magnetic ManufacturingConnector Manufacturing

Revenue Totals Based on all Combined PalPilot Business UnitsRevenue Totals Based on all Combined PalPilot Business Units

2009 2010 2011 2012 2013 2014*50 US$ Million

60 US$ Million

70 US$ Million

80 US$ Million

90 US$ Million

100 US$ Million

110 US$ Million

*Projected

NORTH AMERICA REVENUE / 2009-2013

GLOBAL REVENUE / 09-13

2009 2010 2011 2012 2013 2014*0 US$ Million

200 US$ Million

400 US$ Million

600 US$ Million

800 US$ Million

1000 US$ Million

1200US$ Million

*Projected

PCB

Connector

PCB Design

Revenue Totals Based on Global Alliance Partners.Revenue Totals Based on Global Alliance Partners.

GLOBAL REVENUE / 2009-2013

EngineeringDivision

PCB DESIGN SERVICES

- Full Project Place-and-Route

- Schematic Re-Capture

- 24-Hour Library Support- Schematic Symbol Creation- Footprint Creation

- IPC-7251/ IPC-7351- JEDEC Standards- Custom Land Pattern- Z-axis Dimension

- 24-Hour Routing Services- Constraint Rules Driven- 100% Manual Hand Routing- Multiple Shifts (24 hours / 7 days)- Design Partitioning, Multiple Designers

- Valor Enterprise DFM Pre-Fabrication Check

1. Signal Integrity- Pre-layout- Post-layout

2. Power Integrity

3. Verification and Measurement Lab

1. Industrial Design (ID)

2. Mechanical Design (MD)

3. Soft Tooling

4. Prototyping

5. Hard Tooling

HIGH-SPEED SIMULATION & LAB MEASUREMENT SERVICES

MECHANICAL ENGINEERING SERVICES

PrintedCircuit Board

Division

- Quick Turn Around

5-10 days from Asia

- High Mix Low Volume (HMLV) Production

For Low and High technology PCB’s

- Medium Volume Production

1 -40 layer

- High Volume Production

1-40 Layer

- Single Sided PCB

- Metal Clad PCB

- IC Substrate

- High Density Interconnect (HDI)

- Flex and Rigid Flex

Proto-type, small, medium, and high volume production

MANUFACTURING DISCIPLINES

PALPILOT’S FACTORIES OFFER

- Layers 1-40 (layers)

- Max Board Size 24’’*24’’

- Max Board Thickness .250”

- Min.Board Thickness 4 layers 16mil/ 6 layers 24mil/ 8 layers 40mil/ 10 layers 48mil/ 12~16 layers 63mil

- Min.Line Width 3mil

- Min.Line Space 3mil

- Min.Hole Size 8mil/4mil (micro vias)

- PTH Wall Thickness 1mil

- PTH Dia.Tolerance +3mil

- NPTH Dia.Tolerance +1mil

- Hole Position Deviation +2mil

- Outline Tolerance +4mil

- S/M Pitch 4mil

- Aspect Ratio 10:1

- Thermal Shock 6×10sec@288℃- Warp and Twist ≤0.7%

- Electric Strength >1.3kv/mm

- Peel Strength 1.4N/mm

- Solder Mask Abrasion >6H

- Flammability 94V-0

- Impedance Control +/-7%

PCB DIVISIONCAPABILITIES / RIGID PCB

- Tin Lead- Lead Free HASL- Immersion Gold- Immersion Silver- OSP- Flash Gold- Selective Gold- Immersion Tin

MATERIALS & SURFACE FINISH

- FR-4- High Tg FR-4- Polyimide Materials- High Speed Materials- Low Loss Materials- Mixed Dielectric Constructions

MATERIALSSURFACEFINISHES

MATERIALSUPPLIERS

- Isola

- Sheng Yi

- Ventec

- Nelco

- Megtron- Rogers- Taconic

ComponentsDivision

- nQSFP+ 100G/112G

25~28Gbps/Channel

- nSFP+ 25~28Gbps

Data Rate

- QSFP+ 40G~56G

- 10~14Gbps/Channel

- Press-Fit or Solder Tail

- Light Pipe

- Heat Sink

- SFP+ 10~14Gbps

Data Rate

- Press-Fit or Solder Tail

- Light Pipe

- Heat Sink

- SFP 1~5Gbps Data Rate

- Press-Fit or Solder Tail

- Light Pipe

- Heat Sink

HIGH SPEED I/O CONNECTORMeet SFF Committee Specification & Fully MSA CompliantMeet SFF Committee Specification & Fully MSA Compliant

nQSFP+nSFP+

QSFP+ SFPSFP+

- Flex-Pin Design with

Beryllium Copper material

- The best solution for resisting

vibration and shock

- Small contact size, 50 mil pitch

- Ø 0.27” outer housing with 12 contacts

- Tail options for pre-wired,

solder cup, and solid straight tail

- PSU or PEI plastic housing

- Peek insulator for

high performance

- Autoclave sterilization

& disinfection levels

- Tough-proof design

- Color identification

& Keying options

- Disposable types

- Robust self-latch mechanism

- DIP and Solder cup contacts

- Error-proof keying options

- Fully EMC protected

- 2 to 32 contact options

- Water tight IP67 F0K/F1K/

F2K series

- Robust self-latch mechanism

- DIP and Solder cup contacts

- Error-proof keying options

- Fully EMC protected

- 2 to 32 contact options

- IP50

Segment View

PUSH-PULL-LOCKING CIRCULAR CONNECTOR

MicroCircular

P SeriesPush-Pull

K SeriesPush-Pull

B-Series Push-Pull

- 10/100/1000 Base-T

- 10GBase-T

- RJ45 + USB Combo-PoE/PoE Plus with

Internal Diode Bridge

- Single Port

- Multiple Port

- Stacked Port

- Low Profile

- Vertical

- Custom Configurations

- Optional Emi Tabs

- Integrated Magnetics

- Tab Up or Tab Down

- LED Color Options

- Surge Protection

- RoHS Compliant

RJ45 W/MAGNETICS

Types Packages Features

DISCRETE MAGNETIC PRODUCTS

LANModules Inductors Filters

CommonMode

ChokesTransformers

- 10/100/1000 Base-T LAN Magnetic Discrete Modules- PoE/PoE+ Modules

- Power- Signal- Energy Storage- Power Supply

- Signal Filtering- Noise Filtering- Power Supply

- Noise Suppression- Power Supply- Telecom

- Flyback- Coupling- Analog- RF - Switching- PoE/PoE+- T1/E1

- USB 3.0 - USB 2.0- USB Type A- USB Type B- USB Type AB- Mini USB- Micro USB

- SATA- eSATA- Micro SATA

- Type A (1.0 Spec)- Type B (1.0 Spec)- Type C (1.3 Spec)- Type D (1.4 Spec)- Type E (1.4 Spec)- Mini-HDMI- Micro-HDMI

USB, SATA & HDMI CONNECTORS

USB SATA HDMI

BTB, FPC, RF & CUSTOMER MADE CONNECTOR & MEMORY CARD

- 0.4 Pitch. 0.8H/0.9H/ 1.0H/1.5/H2.0H.- 10 Pin~60 Pin- Designed to Prevent Tin Wicking- Narrow Design to Reduce Space for PCB

- 0.3mm,0.5mm Pitch 1.0H- 6 Pin ~ 67 Pin- Front and Backflip Lock

- Designed to Prevent Tin Wicking- Superior Solder Peg

- 1.2H/1.5H/2.5H Plug and Socket Series 0.81/1.00/1.13/1.32 /1.37 Wire- Supports Insert Molding Process for Sealing- Strong Chamber for Better Molding and Mating Guide

- 1.5/1.30H Push Pull Type Micro SD- Locking Feature for the Design- Anti Card Fast Eject Function- Detection Switch Pin Attached- Low Profile Sim Card

- Plastic Cover- Stamping Contact- Insert Molding Mechanical Structure

BTBConnector

FPCConnector

MemoryCard

Customer Made

Connector

RF Connector

CABLE ASSEMBLY CAPABILITES

HDMIHDMI USB LVDSSATA

AOCAOC RFRF

- 56G QSFP + AOC -40G QSFP+AOC-10G SFP+AOC-HDMI + AOC-Hot Pluggable-Fiber to 100M-QSFP+MSA Compliant Form Factor-HDMI Compliant with version 1.4a

- HMDI 19 Pin Male to Male

- HDMI 19 Pin Male to DVI-D

- Custom Design - Low Noise- High Volume

Manufacturing Capabilities

- USB 2.0 A to B- USB 3.0 to 3.0- Low Noise - Custom Design- High Volume

Capabilities- USB Committee

Member

- Crimp Terminal LVDS

- Housing LVDS- SATA 7pin/

7+6pin/7+15pin/

- Matches high frequency characteristics

- 1.2H/1.5H/2.5H plug and socket series 0.81/1.00/1.13/1.32/1.37 wire

NewTechnologies

Division

NEW TECHNOLOGIES

MEMS E-BIKEBattery

Management

- Micro-electro-mechanical systems

- LiGA/LIKE Process that enable us

to print micr-3D structures on a six

inch ceramic wafer

- Across Nano and Micro Technology

- Light Weight Electrical Motor

- e-Torc

- E-Bike

- E-wheelchair

- Robotics

- Scalable Smart Battery

- BMS/Battery Monitoring Software

- Custom Engineering Design

- Co-Op Design

- Form-fit to existing, using our

Lego-Technology

- PalPilot involves itself supporting global disaster relief and

charitable causes.

- PalPilot audits it’s manufacturing facilities & partners for

compliance to social standards that meet North American

OEM expectations. All facilities are certified or in the process

of being certified to OHSAS 18001 requirements.

SOCIAL RESPONSIBILITY

“PalPilot is committed to adding value to all of our customer and business relationships, utilizing

the highest degree of ethical standards and integrity as our core value!”

— Eddy C. Niu, President & C.E.O

EMS CUSTOMERS

OEM CUSTOMERS

THANK THANK YOUYOU