2012 Meeting Program - gistexel.comgistexel.com/wp-content/uploads/2014/09/2-Applications-of-graphene... · GreenDroid: A Post-Multicore Architecture for the Dark Silicon Era 15:50

2012 Meeting

July 18-20, 2012

Vancouver, British Columbia, Canada

Thank You to Our Sponsors:

Program

February-04-12 Page 1

1Plenary TalksTrack P

July 18, 2012

Plenary ISession P1 8:30

Chair1 Dan Gale, CMC Microsystems ([email protected])

Chair2: Andre Ivanov, University of British Columbia ([email protected])

8:30 Jan Rabaey, University of California ([email protected])

The Swarm at the Edge of the Cloud - the New Face of Wireless

8:55 Walden C. Rhines, Mentor Graphics ([email protected])

Semiconductor Industry Deconsolidation

9:20 Nitish Thakor, Johns Hopkins University ([email protected])

From Chip to Applications or How to Enable Scientific Discovery or Practical Solutions

9:45 Pierre Khuri-Yakub, Stanford University ([email protected])

Capacitive Micromachined Ultrasonic Transducers as a Platform Technology

July 19, 2012

Plenary IISession P2 8:30

Chair1 Stephen Bates, Raithlin ([email protected])

Chair2: Kris Iniewski, CMOS Emerging Technologies ([email protected])

8:30 Joshua Smith, Washington University ([email protected])

Wirelessly Powered Sensing Platforms

8:55 Radu Marculescu, Carnegie Mellon University ([email protected])

Design of Thousand Core Systems

9:45 Markus J. Buehler, Massachusetts Institute of Technology ([email protected])

Tu(r)ning Weakness to Strength

10:10 Derek Abbott, University of Adelaide ([email protected])

How Do We Solve the World's Energy Supply Problem? Finding Scalable Solutions

July 20, 2012

Plenary IIISession P3 8:30

Chair1 Sandro Carrera, École Polytechnique Fédérale de Lausanne ([email protected])

Chair2: Guiseppe Elli, Clemson University ([email protected])

8:30 Yusuf Leblebici, École Polytechnique Fédérale de Lausanne ([email protected])

Nanowire-Based Ambipolar Devices and Logic Arrays

8:55 Jean Paul Allain, Purdue University ([email protected])

Nanopatterning Bio-interfaces


9:20 Maksim Skorobogatiy, Ecole Polytechnique Montreal ([email protected])

Photonic, Sensing and Energy-Generating Textiles

9:45 Thomas Webster, Brown University ([email protected])

Wireless Nanotechnology Derived In Situ Sensors for Ensuring Medical Device Success

10:10 Rob Gilmore, Qualcomm ([email protected])

Building the Smartphone of Tomorrow

2VLSI and Semiconductor Technologies and MaterialsTrack A

July 18, 2012

MaterialsSession A1 10:30

Chair1

Chair2:

10:30 Mona Hella, Rensselaer Polytechnic Institute ([email protected])

Wide-band Semiconductors for High Switching Speed Power Converter Circuits

10:55 Manuel Quevedo, University of Texas at Dallas ([email protected])

Materials for Flexible Electronics

11:20 Katsuaki Suganuma, Osaka University ([email protected]) with M. Nogi

High Performance Metallic Nano-inks for Printed Electronics

11:45 Eric Vogel, University of Texas at Dallas ([email protected])

Nanoscale Devices and Materials for a Neuromorphic Architecture

12:10 Konrad Walus, University of British Columbia ([email protected])

Printable Materials and Devices for Sensing

12:35 Ferran Martin, Universitat Autònoma de Barcelona ([email protected])

Split Ring Metamaterials: Applications to Microwave Circuit and Antenna Design

VLSISession A2 13:30

Chair1

Chair2:

13:30 Nasirul Chowdhury, Intel ( [email protected])

Intel® Core™ i5/i7 QuickPath Interconnent Phase Interpolator

13:55 José Flich, Universita Politecnica de Valencia ([email protected])

Network-on-chip Architecture

14:20 Bal Sandhu, ARM ([email protected])

Thermal Management for SOC on Sub-Nanometer Process Technology Nodes

Thermal management is becoming more critical for SoC design on sub-nanometer technology nodes due to the significant increase in both active and leakage power consumption. A good thermal solution allows the system architect to design a more cost effective cooling solution based on system operating conditions. The design of accurate on-die temperature sensors have traditional been designed with large complex analog blocks which require extensive design effort and scale


poorly with technology. In this talk, an ultra-low power digital based temperature sensor for monitoring the silicon junction temperature is presented. The sensor design considers technology scaling and allows a more efficient power/performance/area trade-off with accuracy. Furthermore, the talk describes how multiple instances of the temperature sensor can be implemented in a microprocessor based system to observe temperature gradients that can be caused due to local hotspots, allowing for better thermal management at the system level.

14:45 Dmitri Strukov, University of California, Santa Barbara ([email protected])

Memristive Devices and Circuits

15:10 Michael Taylor, University of California, San Diego ([email protected])

GreenDroid: A Post-Multicore Architecture for the Dark Silicon Era

15:50 Christof Teuscher, Portland University ([email protected])

Non-Boolean Computation in Emerging Nano and Bio Devices

16:15 Bich Yen, SOITEC ([email protected])

CMOS Technologies Beyond 28 nm

16:40 Masahiko Yoshimoto, Kobe University ([email protected])

17:05 Takahiro Hanyu, Tohoku University ([email protected])

Prospects of Nonvolatile Logic-in-Memory Architecture Using Magnetic Tunnel Junction Devices

17:55 M. Reza Hashemi, University of California, Los Angeles ([email protected])

18:20 Fred Y. Fu, Crosslight Software, Inc. ([email protected])

3D TCAD Simulation of Power Semiconductor Devices

18:45 Dheeraj Mohata, Penn State University ([email protected])

Heterojunction Tunnel Field Effect Transistors as an Alternative Emerging Low Power Digital Switch

July 19, 2012

Semiconductor TechnologiesSession A3 10:30

Chair1 Ken Cadien, University of Alberta ([email protected])

Chair2:

10:30 Victor Moroz, Synopsis ([email protected])

Future Transistor Scaling and Patterning Based on Crystal Self-Assembly

10:55 Malgorzata Chrzanowska-Jeske, Penn State University ([email protected])

Advantages and Challenges of 3D ICs from the Perspective of a 3D Layout Designer

11:20 Gianluca Fiori, University of Pisa ([email protected])

Nanoscale Graphene Device Simulations

11:45 Stephen Hersee, University of New Mexico ([email protected])

Challenges of 3D Nanoscale Processing in Advanced Semiconductors

12:10 Chung-Hsun Lin, IBM ([email protected])

FDSOI, FinFET, ETSOI, and PDSOI Technology for 22nm and Beyond


12:35 Khaldoun Torki, CMP ([email protected])

3-D Integration

13:00 Ignacio Martín Bragado, Instituto Madrileño de Estudios Avanzados ([email protected])

Defect Modeling using Kinetic Monte Carlo Modeling

Semiconductor TechnologiesSession A4 13:30

Chair1 Ken Cadien, University of Alberta ([email protected])

Chair2:

13:30 Tomasz Brozek, University of California, Davis ([email protected])

Yield Modeling at Nanoscale

13:55 Nethaji Dharmarasu, Nanyang Technological University ([email protected]) with K. Radhakrishnan

Development of AlGaN/GaN Heterostructures on 100mm Silicon by Molecular Beam Epitaxy

14:20 Scott Dunham, University of Washington ([email protected])

Nanoscale Interconnects

14:45 Charvaka Duvvury, Texas Instruments ([email protected])

Advanced ESD in Relation to the Emerging Technologies

15:10 Tibor Grasser, Technische Universität Wien ([email protected])

VLSI Reliability Challenges

15:50 Jiro Ida, Kanazawa Institute of Technology ([email protected])

Status of Super Steep Cut off FETs and Contribution of Floating Body Effect for Ultra Low Power Application

16:15 Byoung Hun Lee, GIST ([email protected])

Applications of Graphene in Electronics Devices

16:40 James Li, HRL Laboratories ([email protected])

The Next Generation of Heterogeneously Integrated InPHBTs

17:05 Thibaut David, CEA/LETI ([email protected])

Emerging Solutions for Pattern Transfer at the Nanometric Scale

17:30 Meishoku Masahara, AIST Japan ([email protected])

Double-Gate FinFET Device Technology for 22nm Node and Beyond

17:55 Jerry W. Zimmer, sp3 Diamond Technologies ([email protected])

The Role of High Thermal Conductivity Substrates in Future CMOS Technologies

18:20 Nobuyuki Sugii, Low-power Electronics Association & Project (LEAP) ([email protected])

Silicon on Thin Buried Oxide (SOTB) Technology for Ultralow-Power (ULP) Applications

18:45 Anis Daami, CEA-LITEN ([email protected])

Organic Semiconductor Technology: From Process to Device Applications on Flexible Substrates

Large-area organic semiconductor technologies have opened a wide range of more or less complex applications in electronics. The main challenges of these nowadays technologies are the stability and the reproducibility of the process flow they use. In CEA/LITEN we have chosen a fully printed process on flexible substrates to develop our organic devices and applications. This process mainly uses laser ablation for gold electrodes and screen printing for all other layers, such as organic dielectrics or semiconductors or even metallic pastes. We will, present in our talk a brief overview of the


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CEA/LITEN organic technologies, show different results on active and passive devices such as photodetectors, filters, OTFTs…Some applications based on the presented devices will be also presented to show the feasibilities of these technologie.

19:10 Mike Shuo-Wei Chen, University of Southern California ([email protected])

July 20, 2012

CircuitsSession A5 10:30

Chair1 Sorin Voinigescu, University of Toronto ([email protected])

Chair2: Shahriar Mirabbasi, University of British Columbia ([email protected])

10:30 Stuart S.P. Parkin, IBM Almaden Research Center ([email protected])

Racetrack Memories

11:20 Dieter Bimberg, Technische Universität Berlin ([email protected])

Quantum Dot Nanoflash Memories: Merging DRAM and Flash

11:45 Yu (Kevin) Cao, Arizona State University ([email protected])

Design Exploration of Heterogeneous Memory Technologies

A hierarchical modeling methodology is proposed for emerging memory devices. It starts from the generic behavioral model of a digital memory, the finite-state-machine (FSM), and then maps the FSM to a common structural model, using an equivalent circuit. Furthermore, it integrates device-level models of various memory types, in order to comprehend the underlying physical mechanisms. Finally, this framework investigates leading reliability concerns and develops external modules for them. Such a generic modeling methodology is capable of pathfinding at the early stage, evaluating the tradeoffs among different process/design choices, and adaptively developing reliable design solutions.

12:10 Sorin Cristoloveanu, ENSERG ([email protected])

SOI Floating Body Memories

12:35 Harish Krishnaswamy, Columbia University ([email protected])

mmWave and Sub-mmWave Power Generation in CMOS

13:00 Omeed Momeni, University of California, Davis ([email protected])

CMOS Terahertz and mm-Wave Electronics: Reaching the Fundamental Limits

13:25 Kenichi Okada, Tokyo Institute of Technology ([email protected])

A Millimeter-wave CMOS Transceiver for 10Gb/s Wireless Communication

In this presentation, a 60-GHz direct-conversion transceiver using 60-GHz quadrature oscillators is demonstrated for more than 10Gb/s Wireless Communication. A 60-GHz frequency synthesizer is implemented by a combination of a 20-GHz PLL and a 60-GHz quadrature injection-locked oscillator, which achieves a phase noise of -95dBc/Hz@1MHz-offset at 60GHz. A transceiver chip fabricated by a 65nm CMOS process is capable of 16Gb/s in 16QAM mode. The transmitter and the receiver consume 181mW and 138mW, respectively.

13:50 Yasunao Katayama, IBM ([email protected])

60GHz mmWave System Demonstrations with High-Performance and Low-Power Single-Carrier Baseband

14:15 Hao Yu, Nanyang Technological University ([email protected])

Internal State Variables and New Modified Nodal Analysis for Non-Volatile Memory Devices

14:40 Andrea Ferrero, Politecnico di Torino ([email protected])


14:40 Bipin Rajendran, IBM Thomas J. Watson Research Center ([email protected])

Phase Change Memory

CircuitsSession A6 13:30

Chair1 Shahriar Mirabbasi, University of British Columbia ([email protected])

Chair2: Hormoz Djahanshahi, PMC-Sierra ([email protected])

13:30 Alyssa B. Apsel, Cornell University ([email protected])

Process Invariant Circuit Design

13:55 Denis Flandre, UC Louvain ([email protected])

Disruptive Ultra-low-Leakage Design Techniques for Ultra-low-power CMOS Circuits

14:20 Chulwoo Kim, Korea University ([email protected])

Cost-effective Spread Spectrum Clock Generator

14:45 Mustafa Badaroglu, IMEC ([email protected])

Circuit and Product Level Assessment of Emerging Fully Depleted Channel Devices: FinFET and UTBOX-SOI

15:10 Alexios Birbas, Universidad Autónoma Metropolitana-Iztapalapa ([email protected]) with Nikos Petrellis

Noise Modeling at Various Levels Including ADCs

15:50 Mehmet Soyuer, IBM Thomas J. Watson Research Center ([email protected])

Advances in Power-Efficient Serial Links

16:15 Akil K Sutton, IBM ([email protected])

Analog Performance Benchmarking Techniques for 32 and 22 nm SOI CMOS

16:40 Xiaoqing Wen, Kyushu Institute of Technology ([email protected])

Towards the Next Generation of Power-Aware VLSI Test Technologies

Advances in hardware/software-based power management techniques are effectively driving down the function-mode power dissipation of a VLSI design; however, power dissipation during test, which is indispensable for screening out bad VLSI chips with manufacturing defects, often becomes excessively high due to the use of non-functional test data and/or test clocking. In order to avoid severe yield loss due to test-power-induced false failures, test power must be properly managed during test. Numerous power-aware test techniques have been developed in the past decade for this purpose, which can be classified as first-generation solutions. Their major drawback is that they are aimed at simply reducing global test power, which results in (1) unguaranteed test power safety, (2) test data inflation, and (3) compromised test quality. These problems are calling for the development of next-generation power-aware VLSI test technologies. This presentation first describes test power basics and then comprehensively reviews major first-generation power-aware test techniques. After that, the needs for developing the next-generation power-aware test technologies are explained and the necessary characteristics required for these technologies are highlighted. Finally, as a pioneering next-generation power-aware test technology, the so-called right-power testing based on sophisticated pinpoint test power management, is introduced for inspiring more research and development activities in this emerging field.

17:05 Hiroshi Fuketa, University of Tokyo ([email protected])

Ultra-Low Voltage Logic Design for Extremely Low-Power Circuits

17:30 Marc Riedel, University of Minnesota ([email protected])

Logic Synthesis for Nanoscale Switching Lattices

18:55 Jeremy Popp, Boeing Research and Technology ([email protected])

An Improved mm-Wave DAC, 20Gsps+ ADC, and Associated SerDes Interfaces


19:20 Hosang Yoon, Harvard University ([email protected])

Inertia-Based Negative Refraction

A circuit using 2-dimensional plasmons on GaAs 2DEGs that exhibits negative refraction by a new mechanism.

19:45 Francisco Gamiz, University of Grenada ([email protected])

3Sensors and DetectorsTrack B

July 18, 2012

SensorsSession B1 10:30

Chair1 Bozena Kaminska, Simon Fraser University ([email protected])

Chair2: Vamsy Chodavarapu, McGill University ([email protected])

10:30 Zeljko Zilic, McGill University ([email protected])

Multi-sensor Integration

10:55 Vamsy Chodavarapu, McGill University ([email protected])

Integrated Silicon Neural Prosthetic Microsystems

11:20 Chris Bleakley, University College Dublin ([email protected])

Wideband Ultrasonic Local Positioning

11:45 Chris Giacoponello, Ntera ([email protected])

Sensor Integration for Smart Cards, Smart Packaging, and Smart Objects

12:10 Qing Liu, Duke University ([email protected])

Acoustic Sensing

13:00 Gerard Wysocki, Princeton University ([email protected])

New Sensing Technologies: CLADS and Compact FRS


Chair1 Alex Simonian, National Science Foundation ([email protected])

Chair2: Vamsy Chodavarapu, McGill University ([email protected])

13:30 Sameer Sonkusale, Tufts University ([email protected])

CMOS-Nanoscale Sensor Integration

13:55 Sam Musallam, McGill University ([email protected])

Integrated Cognitive Brain Machine Interfaces

14:20 Chih-Yang Chen, National Tsing-Hua University ([email protected])

Low-Temperature Poly-Silicon Sensors in Bio-applications

14:45 George Cobb, The Institute of Environmental and Human Health (TIEHH) ([email protected])

Personal Diagnostic Sensor for Airborne Toxicants

15:10 Jean-Pierre Delplanque, University of California, Davis ([email protected])

Breath Sensors


15:50 Daniel Filippini, Linköping University ([email protected])

Interfacing Diagnostics with Consumer Electronics

The ability to evaluate disposable lab-on-a-chip (LOC) devices on pervasive platforms, such as cell phones, is relevant to bring the analytical strength of LOC solutions to routine biomedical targets and home medical monitoring.The design of LOC and supporting elements that permit such use of smart phones is the focus of our research, and involve interfacing illumination and imaging from arbitrary phone brands and models. In this presentation adaptive focusing elements, which can be integrated in disposable LOC devices, and optical detection principles compatible with LOC evaluation on cell phones will be discussed.

16:15 Jay Grate, Pacific Northwest National Laboratory ([email protected])

Fluorescent Oxygen Sensing--Methods and Applications in Life Sciences Research

Oxygen is the most important electron acceptor in biology. Furthermore, significant oxygen gradients exist at many biological and geochemical interfaces where important processes occur. Fluorescence techniques enable in situ sensing of oxygen as point sensors, and imaging of oxygen across two dimensional surfaces. Methods and materials for oxygen sensing, and applications to sensing and chemical imaging in microenvironments will be described.

16:40 Alvaro Peña-Quevedo, Pontificial Catholic University of Puerto Rico ([email protected])

Mass Spectrometry for Organic Compounds Detection

17:05 Danxia Xu, National Research Council Canada ([email protected])

Biosensors Using SOI Technology

17:30 Jerald Yoo, Masdar Institute of Science and Technology ([email protected])

Patch Sensors for Ambulatory Healthcare: From Technologies to Examples

17:55 Zhiping (James) Zhou, Peking University ([email protected])

Silicon Microring Sensors

18:10 Zhigang Zhu, City University of New York ([email protected])

Vision-Aided Automated Vibrometry for Remote Acoustic and Vibration Sensing

July 19, 2012


Chair1 Edmond Cretu, University of British Columbia ([email protected])

Chair2:

10:30 Massimo De Vittorio, IIT/NNL University of Salento Lecce ([email protected])

Advanced Technologies for Tactile Sensing and Actuation

10:55 Mutsumi Kimura, Ryukoku University ([email protected])

Thin-film Sensors Using Thin-film Transistor Technologies

11:20 H. B. Lim, Dankook University ([email protected]) with J.S. Lee

Chemical Sensing for Contaminant Control in Microelectronics Manufacturing

11:45 Sari Merilampi, Satakunta University of Applied Sciences ([email protected])

Wearable Polymer Thick Film Strain Sensors

Sensors are an essential part of a smart system. In many applications it would be useful if the sensing element could be embedded as a part of the structure which is monitored. In this presentation embedded strain sensors are discussed. Especially their use in wearable applications and sensing of relatively large displacement is examined. Printing has been used to fabricate the sensors and the strain sensitivity of the prototype sensors is based on the materials used. Two


approaches are taken; strain sensitive stretchable conductors and strain sensitive stretchable RFID- tags. Both the performance and the modification possibilities of the prototypes are evaluated and their potential applications are discussed.

DetectorsSession B4 13:30

Chair1 Juha Kalliopuska, VTT ([email protected])

Chair2:

13:30 Martin van Beuzekom, NIKHEF ([email protected])

Measuring Time in Hybrid Pixel Detectors for High-Energy Physics

13:55 Gabriella Carini, Stanford University ([email protected])

X-Ray Fluorescence Spectrometer

14:20 Dietmar Fink, Universidad Autónoma Metropolitana-Iztapalapa ([email protected]) with Salvador Cruz, Yohai Mandabi, G

The Use of Confinement in Enzyme-Clad Nanopores for Biosensing

14:45 Antonio Lopez-Martin, Public University of Navarra ([email protected])

High-performance Industrial and Automotive Angle Detection Based on GMR Sensors

15:10 Lucio Pancheri, Fondazione Bruno Kessler ([email protected])

Advances in SPAD Arrays for Time-gated Fluorescence Detection

15:50 Renato Turchetta, Samsung ([email protected])

CMOS Image Sensors for Scientific Imaging

16:15 Joseph J. Talghader, University of Minnesota ([email protected])

High-Sensitivity Infrared Detection and Spectroscopy

16:40 Paul Charette, University of Sherbrooke ([email protected])

CMOS Buried Quad p-n Junction Photodetector

for Multi-Wavelength Analysis

17:05 Brian Donohoe, Trinity College ([email protected])

17:30 Uwe Hampel, Helmholtz-Zentrum Dresden-Rossendorf ([email protected])

17:55 Young-Geun Han, Hanyang University ([email protected])


4Nanotechnology, Nanoelectronics, and SpintronicsTrack C

July 18, 2012

NanoelectronicsSession C1 10:30

Chair1

Chair2:

10:30 Cherie R. Kagan, University of Pennsylvania ([email protected])

Ambipolar and Unipolar PbSe Nanowire Field-Effect Transistors

10:55 Joachim Knoch, Technische Universität Dortmund ([email protected])

III-V Nanowire FETs

11:20 Jeremy Levy, University of Pittsburgh ( [email protected])

Use of Atomic Force Microscopy to Create Nanoelectronic Devices

11:45 Alan Seabaugh, University of Notre Dame ([email protected])

Tunnel Field-effect Transistors - A CMOS Replacement?

12:10 Andras Kis, École polytechnique fédérale de Lausanne (EPFL) ([email protected])

Single-layer MoS2 Transistors and Circuits

12:35 Xiaodong Xu, University of Washington ([email protected])

Ultrafast Graphene Optoelectronics Assisted by Hot-Electron Transport

NanotechnologySession C2 13:30

Chair1 Alireza Nojeh, University of British Columbia ([email protected])

Chair2:

13:30 Yong P. Chen, Purdue University ([email protected])

Large Scale Transferrable Graphene for Device and Sensing Applications

13:55 Sung-Yool Choi, KAIST ([email protected])

Nonvolatile Memory Applications of Graphene Oxide Thin Films

14:20 Jeffry Kelber, University of North Texas ([email protected])

Graphene Growth on Nitrides and Oxides: Implications for Charge and Spin Devices

14:45 Shuenn-Yuh Lee, National Chung Cheng University ([email protected])

Electrical Characterization Methods for Graphene Devices

15:10 Ming Liu, University of California, Berkeley ([email protected])

Graphene-based Optical Modulator

15:50 Saroj K. Nayak, Rensselaer Polytechnic Institute ([email protected])

Band Gap Engineering of Graphene-based Structures from Large Scale Quantum Simulations

16:15 Eric Pop, University of Illinois at Urbana-Champaign ([email protected])

Carbon Nanoelectronics: Towards Energy-Efficient Computing?


16:40 Sang-Woo Kim, Sungkyunkwan University ([email protected])

Piezoelectric Semiconducting Nanostructure-Based Energy Harvesting: Fundamentals and Technical Issues

17:05 Thomas Szkopek, McGill University ([email protected])

Emerging Applications of Graphene Field Effect Transistors

17:30 Vivek Shenoy, Brown University ([email protected])

Graphene

17:55 Sven Stauss, University of Tokyo ([email protected])

18:20 Azad Naeemi, Georgia Institute of Technology ([email protected])

July 19, 2012


Chair1 Konrad Walus, University of British Columbia ([email protected])

Chair2:

10:30 Paul R. Berger, Ohio State University ([email protected])

10:55 Thomas Dekorsy, Universität Konstanz ([email protected])

Coherent Acoustic Excitation of Nanoparticles: An Approach to Nanoscale Heat Transfer

11:20 Mikhail Dorojevets, Stony Brook University ([email protected])

Processor Design with Superconductor Single-flux Quantum Technology

Single-flux quantum circuits with their ultra-low power consumption at very high frequencies make superconductor technology one of the candidates for use in future high-performance systems. We will discuss design approaches and recent successful demonstrations of complex processing units implemented with the canonical rapid singe-flux quantum logic. Two new superconductor logics with zero-static-energy consumption and their use for energy-efficient processor design will also be discussed.

11:45 Supratik Guha, IBM Thomas J. Watson Research Center ([email protected])

12:10 Jeremy Hilton, D-Wave Systems ([email protected])

D-Wave One: The World’s First Commercially Available Quantum Computer

12:35 Subhasish Mitra, Stanford University ([email protected])

Carbon Nanotube Imperfection-Immune Digital VLSI

13:00 Takeo Ohno, National Institute for Materials Science ([email protected])

Psychological Memorization Model and Biological Synaptic Behavior

Demonstrated by Atomic Switches


Chair1


Chair2:

13:30 Massimo Fischetti, University of Texas at Dallas ([email protected])

Post-Si-CMOS Devices

13:55 Michael Shur, Rensselaer Polytechnic Institute ([email protected])

Field Effect Transistors for THz Applications

14:20 John Suehle, NIST ([email protected])

Characterization Challenges for Novel Electronic Devices

Proposed electronic devices for extending CMOS and beyond will exploit new principals of operation and exotic materials systems. Novel electrical, optical, and physical characterization techniques will be required to validate device operation and physical structure. More importantly, for nano-scale devices, almost every atomic bond in the structure needs to be accounted for. This presentation will provide an overview of techniques based on optical photo emission, ultra-fast current measurements, and micro electron spin resonance to characterize buried hetero-semiconductor interfaces and electrically active defects in novel electronic devices.

14:45 Dominique Drouin, University of Sherbrooke ([email protected])

Room-temperature Single Electron Transistors and Their Potential Integration on CMOS

15:10 Robert A. Wolkow, University of Alberta ([email protected])

15:50 Doug Kezler, Oregon State University ([email protected])

July 20, 2012

SpintronicsSession C5 10:30

Chair1

Chair2:

10:30 Nadia El-Masry, National Science Foundation ([email protected])

New Materials for Spintronics

10:55 Sandipan Pramik, University of Alberta ([email protected])

Organic Nano-Spintronics

11:20 Alberto Riminucci, Consiglio Nazionale delle Ricerche Bologna ([email protected])

Applications of Organic Spintronics to CMOS

11:45 Gerrit Bauer, Tohoku University ([email protected])

Spin Caloritronics

12:10 Jaroslav Fabian, University Regensburg ([email protected])

Graphene Spintronics

12:35 Kazuya Ando, Tohoku University ([email protected])

Dynamical Spin Injection into Semiconductors

13:00 Sergio Valenzuela, Institut Català de Nanotecnologia ([email protected]; [email protected])


SpintronicsSession C6 13:30

Chair1 Hanan Dery, Rochester University ([email protected])

Chair2:

13:30 Byoung-Chul Choi, University of Victoria ([email protected])

Magnetization Dynamics in Spin-torque Magnetic Random Access Memory (ST-MRAM) Elements

13:55 Russell Cowburn, University of Cambridge ([email protected])

3-dimensional Spintronics

14:20 Erol Girt, Simon Fraser University ([email protected])

Spin Memory Devices

14:45 Andrea Morello, University of New South Wales ([email protected])

Coherent Control and Readout of Individual Dopant Spins in a Silicon MOS Nanostructure

15:10 Pavle Radovanovic, University of Waterloo ([email protected])

Tuning Optical and Magnetic Properties in Transparent Semiconductor Nanostructures for Spintronic and Photonic

Applications

15:50 Siegfried Selberherr, Technische Universität Wien ([email protected]) with Viktor Sverdlov

MOSFET and Spin Transistor Simulations

The breathtaking increase in performance and speed of ICs became possible by continuous miniaturization of CMOS devices. The success of the microelectronics technology has been enabled and supported by sophisticated TCAD tools. The TCAD related cost reduction share amounts to 40%. Employing spin of an electron is promising for boosting the efficiency of future low-power ICs, and TCAD tools must include spin transport in order to meet the demands. Because of recent ground-breaking experiments on spin injection and spin transport at room temperature silicon is gaining momentum for applications involving spin. Requirements for making a spinFET are discussed. Alternative spin-based switches will be shortly reviewed.

16:15 Hidekazu Kurebayashi, University of Cambridge ([email protected])

Spintronics Using Rotationally Asymmetric Interactions and Magnetic Dynamics

16:40 Ian Applebaum, University of Maryland ([email protected])

Nonequilibrium Spin-Polarized Electron Transport in Semiconducting Silicon

17:05 Hanan Dery, Rochester University ([email protected]) with Igor Zutic

Silicon Spin Communication

17:30 Ron Jansen, NAIST ([email protected])

Electrical and Thermal Spintronics in Silicon

17:55 Kohei Hamaya, Kyushu University ([email protected])

Electrical Detection of Spin Accumulation in a Si Channel Using a High-Quality Schottky Tunnel Contact


5Embedded Systems and MicrosystemsTrack D

July 18, 2012

Embedded SystemsSession D1 10:30

Chair1 Dan Gale, CMC Microsystems ([email protected])

Chair2: Lesley Shannon, Simon Fraser University ([email protected])

10:30 Ian McWalter, CMC Microsystems ([email protected])

emSYSCAN R&D Infrastructure for Microsystems Development

10:45 Sebastian Fischmeister, University of Waterloo ([email protected])

Instrumentation and monitoring of real-time embedded software systems

10:55 Markus Mann, Deutscher Technologiedienst GmbH ([email protected])

Roadblocks on the way to Open Innovation

11:20 Gene Frantz, Texas Instruments ([email protected])

DSP Architectures

11:45 Sathish Gopalakrishnan, University of British Columbia ([email protected])

12:10 Vijay Narayanan, Penn State University ([email protected])

Embedded Systems for Video Analytics

12:35 Frederik Zilly, Fraunhofer Institute ([email protected])

3D Stereo Acquisistion

13:00 Joachim Rodrigues, Lund University ([email protected])

Embedded SystemsSession D2 13:30

Chair1 Lesley Shannon, Simon Fraser University ([email protected])

Chair2: Dan Gale, CMC Microsystems ([email protected])

13:30 Mark Benson, Logic PD ([email protected])

Trading Power and Performance to Achieve Optimal Thermal Design for Battery-powered Devices

13:55 Leonardo Barboni, Universidad de la República ([email protected])

Toward the Collaborative Data Processing in Pervarsive Wireless Sensors Network: Emerging Challenges for Microsystems

and Programming Models

14:20 Ikhwana Elfitri, University of Surrey ([email protected])

Multichannel Audio Coding Based on Analysis by Synthesis

14:45 Jonathan How, Massachusetts Institute of Technology ([email protected])

Spacecraft Navigation, Control, and Autonomy


15:10 Emil Jovanov, University of Alabama ([email protected])

Hardware development for wearable technology

15:50 Markus Levy, Embedded Microprocessor Benchmark Consortium ([email protected])

Embedded Processor Benchmarking Strategy: From the Microcontroller to the System

16:40 Brett Smolenski, US Army ([email protected])

Usable Signal Processing: A Filterless Approach to Interference and Distortion

17:30 Khan Wahid, University of Saskatchewan ([email protected])

iBRIDGE2 – Low Cost VLSI Architecture for Random Access of Pixel-Blocks in Modern Image Sensors

17:55 Pierluigi Nuzzo, University of California, Berkeley ([email protected])

System-level Design of Analog and Mixed-Signal Circuits Using Contracts

18:20 Sherief Reda, Brown University ([email protected])

Addressing the Thermal Challenges in Emerging Computing Platforms

Elevated temperature is a major physical challenge for emerging computing systems. I this talk, I will describe infrared characterization techniques to identify the locations of temperature hot spots in real processors, and to use these locations to drive an optimal thermal sensor allocation technique. Using the measurements from the thermal sensors, I will describe techniques for dynamic thermal management of multi-core processors where the performance of a real processor is optimally adapted depending on the thermal slack measured by the sensors during runtime. In addition, the experimental techniques required for data acquisition of power and temperatures of real systems will be overviewed.

18:45 Gul N. Khan, Ryerson University ([email protected])

NoC Simulation Techniques Covering NoC Power and Layout

July 19, 2012

Integrated MicrosystemsSession D3 10:30

Chair1 Heike Riel, IBM Zurich ([email protected])

Chair2: Laurent Francis, Université catholique de Louvain ([email protected])

10:30 Yvon Savaria, Ecole Polytechnique Montreal ([email protected])

DreamWafer Project

10:55 Theresa S. Mayer, Penn State University ([email protected])

Deterministic Assembly to Add New Biosensing Capabilities to Si CMOS

11:20 Kris Myny, IMEC ([email protected])

An Organic Microprocessor on Plastic Foil

11:45 Kiyokazu Yasuda, University of Nagoya ([email protected])

Micro-joining by Means of Self-Organization Method

12:10 Luca Benini, University of Bologna ([email protected])

Managing SoCs Beyond Their Thermal Design Power

The current trend in mobile computing is to design platforms with negative thermal margins: their die can dissipate (in a sustainable way) significantly more than the thermal design power of the package and the handheld's chassis. Such an apparently suicidal policy is dictated by market pressure form the smart phone and tablet markets: the CPUs of new platforms are marketed on their peak clock frequency, as maximum-speed sequential execution is required for a few critical use cases (e.g., first-time loading of script-rich web page). As a consequence we need to learn how to manage


platforms which are inherently thermally unstable. In this talk I will highlight the key points of the looming thermal crisis, and discuss promising hardware-software evolutions which can help us design and manage SoCs in a thermally-constrained environment.

12:35 Jayna Sheats, Terapac ([email protected])

MEMSSession D4 13:30

Chair1 Boris Stoeber, University of British Columbia ([email protected])

Chair2: Mu Chiao, University of British Columbia ([email protected])

13:30 Elad Alon, University of California, Berkeley ([email protected])

Integrated Circuit Design with Nano-Electro-Mechanical Relays

13:55 Vikas Choudhary, Analog Devices ([email protected])

2-axis MEMS Gyroscope System for Optical Image Stabilization (OIS).

14:20 André Guedes, University of California, Berkeley ([email protected])

Micromechanically-Enhanced Magnetoresistive Sensors

14:45 Matiar Howlader, McMaster University ([email protected])

Emerging systems integration of Bio-MEMS and –MOEMS

15:10 Dongwook Kim, Samsung ([email protected])

Analog Front-End ASIC Design for Capacitive Micromachined Ultrasonic Transcucer (CMUT)

15:50 Nicholas Swart, Analog Devices ([email protected])

CAD software for MEMs design

16:15 Dana Weinstein, Massachusetts Institute of Technology ([email protected])

Hybrid Resonant Devices

16:40 Jalinous Esfandyari, STMicroelectronics Inc. ([email protected])

Emerging MEMS Sensor Fusion Enables New Applications

17:05 Mu Chiao, University of British Columbia ([email protected])

Drug Delivery Using MEMS Device or

Bioimaging Using MEMS Microlens

17:30 Laurent Francis, Université catholique de Louvain ([email protected])

Magnetic Sensors Enabled by MEMS and SOI Technologies

17:55 Yu-Ting Cheng, Chiao Tung University ([email protected])

July 20, 2012

Energy HarvestingSession D6 13:30

Chair1 Brian von Herzen, Bright Energy Storage Technology ([email protected])

Chair2: Peyman Servati, University of British Columbia ([email protected])


13:30 Shantanu Chakrabartty, Michigan State University ([email protected])

Asynchronous Self-powered CMOS Circuits for Structural Health Monitoring

13:55 Terry J. Hendricks, Pacific Northwest National Laboratory ([email protected])

New Progress and Frontiers in Thermoelectric Power Generation

14:20 Bozena Kaminska, Simon Fraser University ([email protected]) with Bernard Courtois

Polymer Printable System for Powering Handheld Devices and Houses: Solar Energy Harvested and Stored

14:45 I. Kanno, Kyoto University ([email protected])

Piezoelectric Energy Harvesters of Lead-free (K, Na)NbO3 Thin Films

15:10 Marcin Marzencki, Simon Fraser University ([email protected])

MEMs Energy Harvesting

15:50 Gabriel Rincón-Mora, Georgia Institute of Technology ([email protected])

Energy-harvesting Integrated Circuits

16:15 E. Rusli, Nanyang Technological University ([email protected])

Highly Efficient SiNWs/Organic PV Devices

16:40 Sharath Sriram, RMIT University ([email protected]) with Madhu Bhaskaran, Simon Ruffell, and Arnan Mitchell

Nanoscale Characterisation of Energy Generation from Piezoelectric Thin Films

Nanoindentation is used to characterize in situ the energy generation from piezoelectric thin films. This work presents the controlled observation of nanoscale piezoelectric energy generation, allowing accurate quantification and mapping of force function variations. We characterize both continuous thin films and lithographically patterned nanoislands with constrained interaction area. The influence of size on energy generation parameters is reported, demonstrating that nanoislands can exhibit more effective current generation than continuous films. This quantitative finding indicates further research into the impact of nanoscale patterning of piezoelectric thin films will yield an improved platform for integrated microscale energy scavenging systems.

17:05 Radhakrishna (Suresh) Sureshkumar, Syracuse University ([email protected]) with T. Cong, S.N. Wani, and P. Paynter

Multicomponent Plasmonic Nanogels for Solar Energy Capture

17:30 Jordi Colomer Farrarons, University of Barcelona ([email protected])

Ultra Low-Power Harvesting Body Centered Electronics for Next Portable Devices

17:55 Sang-Gook Kim, Massachusetts Institute of Technology ([email protected])

6Biomedical and ImagingTrack E

July 18, 2012

BioelectronicsSession E2 13:30

Chair1 Sandro Carrera, École Polytechnique Fédérale de Lausanne ([email protected])

Chair2: Anthony Guiseppi-Elie, Clemson University ([email protected])

13:30 J-C Chiao, University of Texas at Arlington ([email protected])

Implantable Wireless Medical Devices for Endoluminal Applications


13:55 Phil Collins, University of California, Irvine ([email protected])

Robust Nanocircuits for Sensing Real Time Biomolecule Dynamics

14:20 Urs Frey, RIKEN ([email protected])

Interfacing Neurons with CMOS-based Microelectrode Arrays

14:45 Albert Titus, University at Buffalo ([email protected])

CMOS Neural Information Processing Microsystems

15:10 Seila Selimovic, Harvard University ([email protected])

State-of-the-Art Lab-on-a-Chip: Advances in Microfluidic Screening for Cell and Drug Development Applications

Lab-on-a-chip technologies, specifically those utilizing microfluidic approaches, have in the last two decades penetrated research disciplines as varied as physics, chemistry, geology, and biology. In addiYon, applied fields including biological and Yssue engineering have also benefitted from these technologies, specifically efforts to culture cells for tissue generation and for drug screening. We will present our recent advances in this field, with a focus on cell manipulation techniques including cell storage, culture, and drug screening on microfluidic devices, as well as solutions for culturing cardiac tissues for biosensing applications.

15:50 Orly Yadid-Pecht, University of Calgary ([email protected])

Biology Meeting Electronics

16:15 Hogan Yu, Simon Fraser University ([email protected])

Computer-Readable bioDiscs for Molecular Diagnostics

16:40 Toshihiko Noda, NAIST ([email protected])

Flexible Retinal Prosthesis Device with CMOS Micorochip

17:05 Ali Tehrani, Zymeworks ([email protected])

Building Better Biologics

17:30 Jitendran Muthuswamy, Arizona State University ([email protected])

July 19, 2012

Medical ImagingSession E3 10:30

Chair1 Purang Abolmaesumi, University of British Columbia ([email protected])

Chair2:

10:30 Aaron Fenster, Robarts Research Institute ([email protected])

3D Ultrasound Imaging for Diagnosis and Therapy

10:55 Réjean Fontaine, Sherbrooke University ([email protected])

Design of Avalanche Photodiode – based Positron Emission Tomography Scanners

11:20 Adam Wax, Duke University ([email protected])

Molecular Imaging True Color Optical Coherence Tomography

11:45 Ching-Ting Lee, National Cheng-Kung University ([email protected])

Silicon Photomultiplier (SiPM) PET/MRI


12:10 Mary-Ann Mycek, University of Michigan ([email protected])

Optical Diagnostics for Cancer Detection

12:35 Vesna Sossi, University of British Columbia ([email protected])

Recent Advances in PET Imaging

13:00 James Lacefield, University of Western Ontario ([email protected])

Automated Tuning of Power Doppler Ultrasound Acquisition Parameters for Microvascular Imaging

ImagingSession E4 13:30

Chair1 Orly Yadid-Pecht, University of Calgary ([email protected])

Chair2:

13:30 Feruz Ganikhanov, West Virginia University ([email protected])

Multi-Modal Molecular Sensitive Imaging Using Two Independently Tunable Optical Parametric Oscillators

13:55 Kenneth Hawkins, PATH ([email protected])

A Strategy for Creating Low-Cost, Optical-Detection, Diagnostic Systems Appropriate for the Developing World

14:20 Masayuki Ikebe, Hokkaido University ([email protected])

An Intelligent CMOS Imager with Negative Feedback Resetting and its Application

14:45 Rainer Martini, Stevens Institute of Technology ([email protected])

New Concept for Mid- and Far IR Imaging Technology and Application in Marine Systems

15:10 Ian Papautsky, University of Cincinnati ([email protected])

CMOS Fluorescence Imaging for Point-of-Care Sensing and Microfluidics

15:50 Klaus Suhling, King's College London ([email protected])

Fluorescent Molecular Rotors to Map Microviscosity in Cells

16:15 Sorin Voinigescu, University of Toronto ([email protected])

D-Band Transceivers with on-die antennas for active and passive imaging applications

16:40 Sabine Susstrunk, École Polytechnique Fédérale de Lausanne ([email protected])

The Opportunities and Challenges of 4-Channel (RGB+NIR) Image cquisition on a Single Sensor

17:05 Zachary Smith, University of California, Davis ([email protected]) with Kaiqin Chu and Sebastian Wachsmann-Hogiu

Cell Phone Microscopy and Spectroscopy for Biomedical and Education Applications

July 20, 2012

BionanotechnologySession E5 10:30

Chair1 Karen C. Cheung, University of British Columbia ([email protected])

Chair2:

10:30 Brian T. Cunningham, University of Illinois at Urbana-Champaign ([email protected])

Flexible Optical Nanosensors in Disposable Biomedical Tubing

10:55 Ali Khademhosseini, Harvard Medical School ([email protected])

Microengineered Biomaterials for Tissue Fabrication and Stem Cell Bioengineering


11:20 Marco Rolandi, University of Washington ([email protected])

Polysaccharide Nanofibers for Implantable Protonics and Neural Interfacing

11:45 Micha E. Spira, The Hebrew University of Jerusalem ([email protected])

Neurobiology

12:10 Dong Sun, City University HK ([email protected])

Manipulating and Characterization of Hemapotoietic Cells

12:35 Haitao Liu, University of Pittsburgh ([email protected])

DNA-Based Molecular Lithography with Sub-10 nm Resolution

13:00 John Luong, National Research Council Canada ([email protected])

BionanotechnologySession E6 13:30

Chair1 Karen C. Cheung, University of British Columbia ([email protected])

Chair2:

13:30 Ramesh Agarwal, Washington University in St. Louis ([email protected])

Multiscale Simulations of Atmospheric Aerosols and Nanoparticles, for Understanding of Health Effects

13:55 Murat Elcin, Ankara University ([email protected])

Stem Cells and Biomimetic Materials for Tissue Engineering and Regenerative Medicine

14:20 Ashwin Gopanath, Caltech University ([email protected])

DNA Nanostructures Integration

14:45 Josh Hihath, Arizona State University ([email protected])

Molecular Diodes and Transistors

15:10 Aihua Liu, Chinese Academy of Sciences ([email protected])

Nanoparticles-Enhanced DNA Microarray

15:50 Hao Zeng, Buffalo University ([email protected])

Magnetic Nanoparticles for Biological Applications

16:15 Hongbin Yu, Arizona State University ([email protected])

Interconnecting Gold Islands on Surface with DNA Origami Nanotubes

16:40 Monika Weber, Yale University ([email protected])

CMOS Nanowire Biosensing Systems


7Energy, Communications, and PhotonicsTrack F

July 18, 2012

NanophotonicsSession F1 10:30

Chair1 Lukas Chrostowski, University of British Columbia ([email protected])

Chair2: Reuven Gordon, University of Victoria ([email protected])

10:30 James Chon, Swinburne University of Technology ([email protected])

Metallic Nanorod-Based Optical Storage and Patterning: Challenges Ahead

10:55 Will Green, IBM ([email protected])

Chip-Scale Mid-Infrared Applications Enabled by Nonlinear Silicon Nanophotonics

11:20 Bahram Jalali, University of California, Los Angeles ([email protected])

Silicon Nanoparticles (SiNPs) and Their Applications

11:45 Mo Li, University of Minnesota ([email protected])

Make Light Do the Work: Harnessing Optical Forces in Nanophotonics

12:10 Marko Lončar, Harvard University ([email protected])

Nanophotonics with Diamond and Silicon

12:35 James Schuck, Lawrence Berkeley National Laboratory ([email protected])

Nanoscale Optical Imaging Spectroscopy

13:00 Emily Chan, Nano and Advanced Materials Institute Limited ([email protected])

Nanostructures on a Solar Cell and Its Novel Configuration

13:25 Trevor James Hall, University of Ottawa ([email protected])

PhotonicsSession F2 13:30

Chair1 Lukas Chrostowski, University of British Columbia ([email protected])

Chair2:

13:30 George Barbastathis, Massachusetts Institute of Technology ([email protected])

On the Application of the Wigner Distribution Function to Quantitative Imaging

13:55 Nader Engheta, University of Pennsylvania ([email protected])

Optical Metatronics

14:20 Reuven Gordon, University of Victoria ([email protected])

Optical Antennas: Theory, Experiment and Applications

14:45 Jian Liu, PolarOnyx ([email protected])

Ultrafast Fiber Lasers for Biomedical Imaging and Material Processing

Ultrafast pulsed fiber lasers have been considered to be an enabling technology to many applications such as biomedical imaging, spectrscopy, and material processing. This talk will discuss a variety of fs fiber lasers in the market and their research perspectives. It will cover both high power and high energy fs fiber lasers. Their applications in biomedical


applications (such as multiphoton imaging, CARS, OCT, Terahertz imaging, molecular imaging, etc.) and material processing (waveguide writing, grating, bonding, marking, cutting, etc..) will be present.

15:10 Paul vanna Nayaki, Kuwait University ([email protected])

Opto-Electronic Sensor System for Online Corrosion mapping

15:50 Dragomir Neshev, Australian National University ([email protected])

Non-Diffracting Plasmon Beams: Steering Surface Plasmons on a Chip

16:15 Gottipaty Rao, Adelphi University ([email protected])

High Sensitivity Detection of NO2 at ppt Level

16:40 Mark Zondlo, Princeton University ([email protected])

Laser-Based Sensors From the Surface to the Stratosphere: New Insights Into Global Climate Change

17:05 Dayan Ban, University of Waterloo ([email protected])

Terahertz Quantum Cascade Lasers

17:30 Joyce Poon, University of Toronto ([email protected])

Dynamics of Micro- and Nano-Scale Resonators

17:55 Peter Loock, Queens University ([email protected])

18:20 Leda Lunardi, North Carolina State University ([email protected])

18:45 Jan Dubowski, University of Sherbrooke ([email protected])

19:10 Steve Blair, Utah University ([email protected])

19:35 Sasan Fathpour, University of Central Florida ([email protected])

July 19, 2012

Silicon PhotonicsSession F3 10:30

Chair1 Michael Hochberg, University of Washington ([email protected])

Chair2:

10:30 Solomon Assefa, IBM ([email protected])

CMOS-Integrated Nanophotonics for Optical Interconnects in Exascale Supercomputers

10:55 Keren Bergman, Columbia University ([email protected])

Design Methodologies and Challenges of Chip-Scale Silicon Photonic Interconnects for High-Performance Computing

11:20 Siegfried Janz, National Research Council Canada ([email protected])

Silicon Photonic Wire Sensor Array

11:45 Shayan Mookherjea, University of California, San Diego ([email protected])

Hundreds of Microring Resonators: Towards Overcoming Disorder Effects in Silicon Photonics


12:10 Jeremy Witzens, RWTH Aachen ([email protected])

Silicon Photonics for Interconnect and Computing

12:35 Davide Bertozzi, Università di Ferrara ([email protected])

A Cross-Layer Approach to Optical Network-on-Chip Design and Evaluation

Smart Grids and Green EnergySession F4 13:30

Chair1 Brian von Herzen, Bright Energy Storage Technology ([email protected])

Chair2: Juri Jatskevich, University of British Columbia ([email protected])

13:30 Steven Jenks, Drexel University ([email protected])

Quantum Dot Solar Cell

13:55 Andras G. Pattantyus-Abraham, Quantum Solar Power Corp. ([email protected])

Quantum Solar Technology

14:20 Arash Takshi, University of British Columbia ([email protected])

Organic Solar Cells

14:45 Jianyu Huang, Sandia ([email protected])

Nano-Batteries

15:10 Abdou Hassanien, AIST Japan ([email protected])

Superconducting Systems

15:50 Kip Morison, BC Hydro ([email protected])

Smart Grid Developments

16:15 Xavier Fernando, Ryerson University ([email protected])

Communication Requirements for Smart Buildings and Smart Grid

16:40 Chi Zhou, Illinois Institute of Technology ([email protected])

Frequency Agility in a ZigBee Network for Smart Grid Application

17:05 Bert Nelson, Zenergy Power ([email protected])

Fault Current Limiter

17:30 Alireza Nojeh, University of British Columbia ([email protected])

Interaction of Light with Carbon Nanotubes: Opportunities for Solar Devices

17:55 Damir Novosel, Quanta Technology, LLC ([email protected]) with Farnoosh Rahmatian

July 20, 2012

Wireless CommunicationsSession F5 10:30

Chair1 Stephen Bates, Raithlin ([email protected])

Chair2: Claudio Rey, Fujitsu ([email protected])

13:30 Shamik Sengupta, John Jay College ([email protected])

Wireless Cognitive Radio Networks


13:55 Stephen So, Sentinel Photonics ([email protected])

Wireless Sensor Networks of Laser-Based Gas Sensors

14:20 Fei Yuan, Ryerson University ([email protected])

Passive Wireless Microsystems

14:45 Ahmed Abdelgawad, University of Louisiana at Lafayette ([email protected])

Resource-Aware Data Fusion Algorithms for Wireless Sensor Networks

15:10 Gaurav Bansal, Toyota InfoTechnology Center ([email protected])

Vehicular Communications

15:50 Masoud Ardakani, University of Alberta ([email protected])

Reliable Communication on Channels with Timing Errors

16:15 Hazem Refai, University of Oklahoma ([email protected])

16:15 Jan Beutel, ETH ([email protected])

Wireless CircuitsSession F6 13:30

Chair1 Shahriar Mirabbasi, University of British Columbia ([email protected])

Chair2: Sorin Voinigescu, University of Toronto ([email protected])

13:30 Hossein Hashemi, University of Southern California ([email protected])

Human-Feature-Detection Wireless CMOS Sensor

13:55 Shuenn-Yuh Lee, National Chung Cheng University ([email protected])

A Programmable Implantable Micro-Stimulator SoC with Wireless Telemetry

14:20 Donald Lie, Texas Tech University ([email protected])

Design of Si-Based High-Efficiency RF Power Amplifiers and Transmitters Using Envelope-Tracking for Mobile Broadband

Wireless Communications

14:45 Marc Rocchi, OMMIC ([email protected])

RF Innovations in III-V

15:10 Zhihua Wang, Tsinghua University ([email protected])

Low Power Wireless Integrated Circuits for Medical Application

15:50 Patrick Yue, University of California, Santa Barbara ([email protected])

On-Wafer Wireless Testing and On-Chip Antenna Characterization

16:15 Gary Zhang, Skyworks ([email protected])

RFIC Mobile Power Amplifiers: Their Semiconductor Technologies and Circuit Design Techniques

16:40 David Wentzloff, University of Michigan ([email protected])

Harvesting Clocks from Ambient Wireless Signals for Synchronizing Sensor Networks

17:05 David R. Jackson, University of Houston ([email protected])

Directive Beaming at Microwave and Optical Frequencies using Artificial Surfaces


17:30 John L. Volakis, Ohio State University ([email protected])

17:55 Jacques C. Rudell, University of Washington ([email protected])

8Special Session on Microsystems and Nanotechnology organized by ECE UBC

Track U

July 21, 2011

Microsystems and NanotechnologySession U 9:00

Chair1

Chair2:

9:00 Purang Abolmaesumi, University of British Columbia ([email protected])

Robotics and Control Laboratory Tour

9:30 Lukas Chrostowski, University of British Columbia ([email protected])

Photonics Laboratory Tour

10:00 Andre Ivanov, University of British Columbia ([email protected])

Microsystems and Nanotechnology for Sustainability

10:30 Alireza Nojeh, University of British Columbia ([email protected])

Nanotechnology Laboratory Tour


Documents

2012 Meeting Program - gistexel.comgistexel.com/wp-content/uploads/2014/09/2-Applications-of-graphene... · GreenDroid: A Post-Multicore Architecture for the Dark Silicon Era 15:50