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Defense Guide
Analog
Digital Signal Processors (DSPs)
First-In First-Out (FIFOs)
Logic
www.ti.com/defense 2012
2High Reliability Guide Texas Instruments 2010
➔
HiRel Guide
Introduction and Contents
IntroductionThe Texas Instruments (TI) High Reliability (HiRel) division focuses on increasing system-level reliability in applications subjected to unusually demanding and harsh conditions, offering an extended range of temperature characterization, special packaging and special qualification options.
Devices designed into challenging applications must be able to perform seamlessly. Beyond offering products that can withstand extreme temperatures, TI’s HiRel group also offers features in its radiation-tolerant products (for example) that can improve performance, such as limiting total irradiated dosage to lower leakage currents.
Radiation tolerance is necessary not only for space and aircraft but for today’s medical applications. Now that images are captured electronically rather than stored on photographic film, circuits and data converters in dental and medical X-ray diagnostic equipment must be able to withstand low doses of radiation daily.
The benefits of HiRel devices include:• Increased long-term reliability• Lower maintenance, repair and
replacement costs• Fewer incoming inspection/testing
criteria and fewer system-level shielding requirements
Among TI’s broad device portfolio, products in the HiRel family include:• Amplifiers• Data converters
Power management integrated circuits
• Advanced CMOS (AC) logic devices
• DSPs
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Enhanced Products (EP)Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Analog-to-Digital Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Digital Isolators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Digital Media Systems-on-Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
SpaceOverview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Data Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Digital Signal Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
High TemperatureOverview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Featured Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Die/Wafer Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
DefenseOverview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Featured Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Analog Family. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Digital Signal Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
First-In, First-Out Memory (FIFOs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Logic Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
CD4000 Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Process Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Resources
Worldwide Technical Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
➔
3High Reliability Guide Texas Instruments 2010
HiRel Guide
Introduction
The HiRel products found in this guide are organized into five segments:
Enhanced Products (EP). These products have the benefits of a controlled production baseline (one assembly/test site, one fabrication site), extended product change notification and a qualification pedigree in industry-standard packaging. TI guarantees that EP products will perform in environments with temperatures from -55°C to 125°C.
The EP line is certified to the Aerospace Qualified Electronic Component standard, which the aerospace and semiconductor industries developed for components used in military, avionic, aerospace and medical applications. In fact, TI is focusing on the emerging medical market for EP.
Space. Products in this segment are designed to be tolerant to the extreme radiation levels found beyond the Earth’s atmosphere. TI’s military performance (MIL-PRF)-38535 Qualified Manufacturer List (QML) Class V (space) products can be placed into satellite systems, space stations, launch vehicles, exploration vehicles and planetary robots.
High Temperature (HT). Designed for such applications as downhole drilling, geothermal drilling, aerospace, heavy industrial, and automotive, HT products are operable in temperatures from -55°C to 210°C for 1,000 hours. The components in this portfolio span a complete signal chain roadmap and are able to accommodate the unique requirements of signal conditioning, data capture and processing in both surface-mount ceramic or known good die packaging options.
Die/Wafer Solutions. This segment meets demand for bare die – also known as unpackaged integrated circuits – as well as known good die and wafers for automotive, computing, communication, medical, defense and entertainment applications. In addition to meeting customer requests for specific test platforms, end applications and packaging options, TI specializes in value-added processes like hybrid circuits, multichip modules, chips on board, flip chips and bumping.
Defense. This is the HiRel division’s original segment and remains its broadest. Like the Space portfolio, these products are QML-certified, qualified to MIL-PRF-38535, but also compliant with MIL-STD-883; ISO 9001; and Classes B, Q and V, with extended temperature and radiation-tolerant operating ranges.
HiRel parts support specific requirements where reliability, qualification, vendor item drawings, standard microcircuit drawings and baseline control are critical.
For more information, visit www.ti.com/hirel
4High Reliability Guide Texas Instruments 2010
➔
Enhanced Products (EP))
Overview
TI’s Enhanced Product (EP) line offers design flexibility while still meeting HiRel and Medical standards for operating environments where high reliability and long service life are a requirement. The EP line offering can benefit avionic, defense, aerospace, medical, and industrial designers. In addition, designers in other rugged operating environments and long service life application fields can benefit from the EP line.
TI’s Enhanced Product line is a commercial of-the-shelf (COTS) solution with the following key benefits:
• Fabricationandassembly controlled baseline
• Extendedproductchange notification (PCN)
• Extendedtemperatureperformance(typically -55°C to +125°C)
• Standalonedatasheet
• Qualificationpedigree
• Producttraceability
• Longlifecycles
TI’s EP line offers an additional benefit which is the availability of TI’s High Reliability Group to work with our designers to offer capabilities that surpass TI’s standard catalog offering, among them:
• SnPdsolderballpackageoptionsDifferent choice of packages from our TI standard catalog offering.
• Enhancedtestingcoveragefordevices.
TI HiRel group can work with the customer to understand their requirements to release EP devices with the features specified above. Examples of devices released under this program are as follow:
• TheMSP430F2618-EPaBGASnPdsolder ball release for implantable medical applications.
• TheADS1258-EPaQFPpackagerelease for an avionic application.
TI’s EP products are guaranteed to perform to data sheet specifications in environments that require extended temperatures (typically -55°C to +125°C).
To ensure that a device exhibits the highest quality and reliability possible for targeted applications, TI performs the following qualification procedures before the device is released:
• AllEPdevicesundergoextensiverequalification
• Qualificationdataisreviewedand audited for accuracy and compliance
• Reliabilityandelectromigrationmonitoring is performed at maximum recommended operating conditions in the targeted package.
• Certifiedtestprogramsandtesthardware
• Electricalcharacterizationisperformed across specified temperature range
• Packageperformanceisconfirmedover extended temperatures (some mold compounds are not suitable for extended temperatures).
• Nickel/palladium/gold/leadfinisheliminates “tin whisker” reliability issues
EP versus upscreening:TI’s EP portfolio offers an alternative to third party upscreening for designers who believe that an enhanced product is suitable for their particular application. Although our EP products receive additional testing and process verification over and above their commercial counterparts, they may still not be suitable for all environments, so TI strongly suggests that OEMs qualify devices for their applications. For designers with applications requiring a
ceramic/hermetic packaged integrated circuit, TI has an expansive product line to meet their needs.
TI’s EP line eliminates:• Yieldlossanddamagecausedby
electrical overstress and handling.
• Mechanicaldamage,whichcausesmoisture issues.
• Burn-in,whichcancauseleadfinishdegradation.
• LackofsupportbyICmanufacturers.
• Fewupscreeningtestfacilitieshavethe ability to test complex parts.
• NoaccesstoTI’swaferprocessinghistory by third parties.
Additional value that can be expected from TI’s EP line:• Qualificationsummaryreport
• Accesstoleading-edgecommercialtechnology
• CommitmenttotheIndustrial,Medical, Avionic and Defense markets
• Customer-drivenportfolio
• Enhancedobsolescencemanagement
In addition to the active EP products listed in this guide and on our website, TI will evaluate the release of other TI’s catalog devices in an EP versions based on customer requirements.
Please contact TI’s Product Information Center to discuss your needs. (Contact information on back cover.)
➔
5High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Analog-to-Digital ConvertersADS6445-EP
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/ADS6445-EP
The ADS6445-EP high-performance, 14-bit, quad-channel analog-to-digital converter operates at a 125-MSPS sample rate. Serial LVDS outputs reduce the number of interface lines, allowing for a 64-pin QFN package and thus high system integration density. The device includes 3.5-dB coarse gain and 1-dB to 6-dB programmable fine gain options for SFDR/SNR trade-off.
Key Features• -55°C to 125°C operating junction
temperature range• 3.3-V analog and digital supply• 1680-mW power consumption (typ)•Simultaneous sample and hold
Applications•Base-station IF receivers•Diversity receivers•Medical imaging•Radar systems•Test equipment
ADS1258-EP
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/ADS1258-EP
The ADS1258-EP 16-channel 24-bit analog-to-digital converter provides single-cycle settled data at channel scan rates from 1.8 to 23.7 kSPS per channel. A flexible input multiplexer accepts combinations of eight differential or 16 single-ended inputs with a full-scale differential range of 5 V or true bipolar range of ±2.5 V when operating with a 5-V reference. The fourth-order delta-sigma modulator is followed by a fifth-order sinc digital filter optimized for low-noise performance.
The differential output of the multiplexer is accessible to allow signal conditioning before the input of the ADC. Internal system monitor registers provide supply voltage, temperature, reference voltage, gain and offset data.
Key Features•Fixed- or automatic-channel scan• 125 kSPS fixed-channel data rate or
23.7 kSPS/channel auto-scan data rate
• 42-mW power consumption (typ)• 48-pin HTQFP or VQFN package• 16 single-ended or 8 differential
inputs
Applications•Medical, avionics and process
control•Machine and system monitoring•Fast scan multichannel
instrumentation• Industrial systems•Test and measurement systems
AIN0
AVDDMux
Access VREFN GPIO(7:0) DVDD
PDWN
VREFP
AVSS
AIN1AIN2AIN3AIN4AIN5AIN6AIN7AIN8AIN9
AIN10AIN11AIN12AIN13AIN14AIN15
AINCOM
Flex Muxand
Temp Monitor
andVDD
Monitorand
SensorDetect
∆ΣModulator
ProgrammableDigitalFilter
RESETCS
STARTDRDYDINDOUT
DGNDPLLCAPCLKSEL CLKIN/CLKOUT
XTAL1XTAL2
SerialInterface
General-PurposeI/O
Clock Generator and 32 kHz PLL
➔
6High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Digital IsolatorsISO721-EP
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/ISO721M-EP
The ISO721-EP digital isolator has a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. This barrier provides galvanic isolation of up to 400 V. Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry.
Key Features• 4000-V(peak) Isolation, 560-Vpeak
VIORM • UL 1577, IEC 60747-5-2 (VDE
0884, Rev. 2)• IEC 61010-1, IEC 60950-1 and
CSA approved• 50-kV/µs transient immunity (typ)
• 0- to 150-Mbps signaling rate• Low-power sleep mode•High electromagnetic immunity• Low input-current requirement•Failsafe output
Applications• Industrial fieldbus
• Modbus• Profitbus• DeviceNet data buses• Smart Distributed Systems
•Computer peripheral interface•Servo control interface•Data acquisition
Data120 Ω
CAN
Amp Amp
ISO ISO
DSPSensor
DSP
ISO ISO
CAN
120 Ω
2xISO721M
SN65HVD233
Fan
SN65HVD233
2xISO721M
TMP101
SM320F2812 DSPwith CAN controller
M
SM320DM355-EP
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/SM320DM355-EP
The SM320DM355-EP combines high-performance MPEG-4 HD (720p) codecs and JPEG codecs (up to 50 megapixels per second) with low-power consumption. The DM355 also enables a seamless interface to most additional external devices required for a complete digital camera implementation. The interface is flexible enough to support various types of CCD and CMOS sensors.
Key Features•ARM926EJ-S core•ARM9 memory architecture•MPEG4/JPEG coprocessor•Video processing subsystem•Temperature range -55oC to +125oC
Applications•Digital still cameras•Digital photo frames• IP security cameras•Four-channel digital video recorders•Video doorbells•Portable digital video applications
➔ Digital Media System-on-Chip
Peripherals
JTAG(optional)
CCD/CMOSModule
CLOCKPLLPLLs
JTAJTAGI/F
Clocks
ARM
z )
ARM926EJ-S_Z8
I-cach
e16 K
B
l-cache16KBB
RA
M32 K
B
RAM32KBB
D-cache8K
D-cache8KB
RO
M8KROM8KB
CCDC
3AH3A
DDR
MH
z )
DDRcontroller
DLDLL/PHY
CCDCIPIPE
VPBE
Vide
oEncod
er
VideoEncoder
10bDAC OS
D
OSD
erc
ARM
Enhanced
channels3PCC /TC(100 MHz
Nand /Nand/SM/
(AEMIF)
USB 2.0
Speakermicrophone
ASP (2x)
cig
VPSS
UART (x3)
I2C
Timer/
GIO
RTO
VPFE
Enhanced
channels3PCC /TC(100 MHz
MPEG4/JPEGCoprocessor
➔
7High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Microcontrollers
MSP430F2274-EP
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/MSP430F2274-EP
The MSP430F2274-EP is the first extended temperature mixed-signal microcontroller from Texas Instruments designed specifically for ultra-low-power applications. A flexible clocking system, multiple operation modes and zero-power, always-on, brown-out reset (BOR) can reduce power consumption and dramatically extend battery life. The MSP430 BOR function is always active, even in low-power modes, to ensure the most reliable performance possible.
The MSP430 CPU architecture, with 16 registers and 16-bit data and address buses, minimizes power-consuming fetches to memory, while a fast vectored-interrupt structure reduces the need for wasteful CPU software flagpolling. Intelligent hardware peripheral features were also designed to allow tasks to be completed more efficiently and independently of the CPU.
Key Features•Two 16-bit timers with three
capture/compare registers•Universal serial communication
interface• 10-bit 200-kSPS A/D converter with
integrated reference and data transfer controller
• 32 I/O pins• 40-pin QFN package
Applications •Handheld defense devices requiring
low power •Avionics • Industrial •Control and monitoring equipment •High-temperature electronics •Metering equipment
Flash ClockSystem
Watchdog
RISC CPU16-Bit
JTAG
/Deb
ug
ACLK
SMCLK
MAB
MDB
AnalogPeripheral
DigitalPeripheral
MCLK
ACLK
SMCLK
RAM Port
MSP430F249-EP
Get samples, datasheets and evaluation modules at www.ti.com/sc/device/MSP430F249-EP
The MSP430F249-EP microcontroller has two built-in 16-bit timers, a fast 12-bit A/D converter, a comparator, four universal serial communication interface modules and as many as 48 I/O pins. A calibrated digitally controlled oscillator facilitates ultra-fast >1µs wakeup from standby mode.
Like other devices in the MSP430™ microcontroller family, the MSP430F249-EP features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
Key Features• 1.8-V to 3.6-V range•Temperature range -55oC to +125oC
• 64-pin LQFP package
Applications•Control systems•Sensor systems• Industrial control applications•Handheld meters•High temperature electronics
XIN/XOUTXT2IN XT2OUT
2 2
DVCC DVSS AVCC AVSS P1X/P2.XP3.X/P4.XP5.X/P6.X
2xB 4xB
OscillatorsBase Clock
System+
ACLK
SMCLK
Flash
60 kB56 kB48 kB32 kB
RAM
2 kB4 kB4 kB4 kB
ADC 1212-Bit
8 Channels
PortsP1/P2
2x8 I/Ointerruptcapability
PortsP3/P4P5/Pg
4x8 I/O
USCI A1UART/
LIN,IrDA, SPI
USCI B1SPI, I2C
USCI A0UART/
LIN,IrDA, SPI
USCI B0SPI, I2C
Comp_A+
Timer_B7
7 CCRegisters,Shadow
Reg
Timer_A3
3CCRegisters
WatchdogWDT+
15/16-Bit
HardwareMultiplier
MPY,MPYS,MAC,MACS
BORSVS/SVM
RST/NMI
JTAGInterface
Emulation
MDB
MAB16 MhzCPU
Incl. 16Registers
MCLK
➔
8High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Operational Amplifiers
Device Description
Iq Per Channel
(Max) (mA)
Number of
Channels
VIO (25 deg C) (Max) (mV)
Slew Rate
(typ) (V/µs)
Total Supply Voltage (V) (Max) (+5 V = 5, +/-5 V
= 10) Pin/
Package(s)
INA159-EP Precision gain of 0.2 level translation difference amplifier 2 1 1.45 15 5.5 8MSOP
INA193A-EP Current shunt monitor: -16 V to +80 V common-mode range 1.3 1 2 1 18 5SOT-23
LM258A-EP Dual operational amplifier 0.6 2 7 0.3 32 8SOIC
LM2902-EP Quad operational amplifier 0.3 4 7 0.5 26 14TSSOP
LT1014D-EP Quad precision operational amplifier 0.55 4 7 0.5 32 16SOIC
MC33078-EP Dual high-speed, low-noise operational amplifier 2.5 2 3 7 10 8SOIC
OPA2333A-EP 1.8-V micropower CMOS operational amplifier, zero-drift series 0.025 2 0.01 0.16 5.5 8SOIC
OPA333A-EP 1.8-V micropower CMOS operational amplifier, zero-drift series 0.025 1 0.01 0.16 5.5 5SC70, 5SOT-23
OPA336-EP Single-supply micropower CMOS MicroAmplifier™ operational amplifier in miniature packages 0.035 1 0.5 0.03 5.5 5SOT-23
OPA340-EP Single-supply rail-to-rail MicroAmplifier operational amplifier in miniature packages 0.95 1 0.5 6 5.5 5SOT-23
THS3201-EP 1.8-GHz, low-distortion current, feedback amplifier 22 1 4 10500 15 8MSOP PowerPAD™
THS4503-EP Wideband, low-distortion, fully differential amplifier 28 1 7 1300 15 8MSOP PowerPAD
TLC2252A-EP Advanced LinCMOS™ technology-based rail-to-rail very low-power operational amplifier 0.063 2 0.85 0.12 16 8SOIC
TLC2252-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.063 2 1.5 0.12 16 8SOIC
TLC2254A-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.063 4 0.85 0.12 16 14SOIC
TLC2254-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.063 4 1.5 0.12 16 14SOIC
TLC2272A-EP Advanced LinCMOS technology-based rail-to-rail dual operational amplifier 1.5 2 0.95 3.6 4.4 8SOIC
TLC2274A-EP Advanced LinCMOS technology-based rail-to-rail operational amplifier 1.5 4 0.95 3.6 16 14SOIC, 14TSSOP
TLC2274-EP Advanced LinCMOS technology-based rail-to-rail operational amplifier 1.5 4 2.5 3.6 16 14SOIC, 14TSSOP
TLE2021A-EP Excalibur™ high-speed, low-power precision operational amplifier 0.3 1 0.4 0.5 40 8SOIC
TLE2021-EP Excalibur high-speed, low-power precision operational amplifier 0.3 1 0.6 0.5 40 8SOIC
TLE2022A-EP Excalibur high-speed, low-power precision operational amplifier 0.3 2 0.4 0.5 40 8SOIC
TLE2022-EP Excalibur high-speed, low-power precision operational amplifier 0.3 2 0.6 0.5 40 8SOIC
TLE2024A-EP Excalibur high-speed, low-power precision operational amplifier 0.3 4 0.85 0.5 40 16SOIC
TLE2024-EP Excalibur high-speed, low-power precision operational amplifier 0.3 4 1.1 0.5 40 16SOIC
Comparators
Device Description
Iq Per Channel
(Max) (mA)
Number of
Channels
VIO (25 deg C) (Max) (mV)
Total Supply Voltage (V)
(Max) (+5 V = 5, +/-5 V = 10)
Single Supply Pin/Package(s)
LM211-EP Differential comparator with strobes 6 1 3 30 8SOIC
LM239A-EP Quad differential comparator 0.5 4 2.5 30 14SOIC, 14TSSOP
LM293-EP Dual differential comparator 0.5 2 5 30 8SOIC
TLC3702-EP Micropower LinCMOS™ technology-based voltage comparator 0.02 2 5 16 Yes 8SOIC
TLC372-EP LinCMOS dual differential comparator, nanopower 0.15 2 5 16 8SOIC
TLV3011-EP 1.8-V, SOT-23 comparator with voltage reference 0.005 1 12 5.5 Yes 6SOT-23
TLV3492A-EP Nanopower, push-pull output comparator 0.002 2 15 5.5 Yes 8SOIC
TLV3701-EP Nanopower, push-pull output comparator 0.001 1 5 16 Yes 5SOT-23
➔
9High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Operational Amplifiers
Device Description
Iq Per Channel
(Max) (mA)
Number of
Channels
VIO (25 deg C) (Max) (mV)
Slew Rate
(typ) (V/µs)
Total Supply Voltage (V) (Max) (+5 V = 5, +/-5 V
= 10) Pin/
Package(s)
TLE2027-EP Excalibur™, low-noise, high-speed, precision operational amplifier 5.3 1 0.1 2.8 38 8SOIC
TLE2141-EP Excalibur low-noise high-speed precision operational amplifier 4.4 1 1.4 45 44 8SOIC
TLE2144-EP Excalibur low-noise, high-speed precision quad operational amplifier 4.4 4 1.4 45 44 16SOIC
TLV2252A-EP Advanced LinCMOS™ technology-based rail-to-rail very low-power operational amplifier 0.15 2 0.85 0.1 16 8SOIC
TLV2252-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.15 2 1.5 0.1 16 8SOIC
TLV2254-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier — 4 1.5 0.1 16 14SOIC
TLV2254A-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier — 4 0.85 0.1 16 14SOIC
TLV2371-EP 550-µA/ch, 3-MHz, rail-to-rail input/output operational amplifier 0.56 1 4.5 2 16 5SOT-23
TLV2374-EP 550-µA/ch, 3-MHz, rail-to-rail input/output operational amplifier 0.56 4 4.5 2 16 14SOIC
TLV2462A-EP Low-power, rail-to-rail input/output operational amplifier with shutdown 0.575 2 1.5 1.6 6 8SOIC
TLV2464A-EP Low-power, rail-to-rail, input/output operational amplifier with shutdown 0.9 1 1.5 1.6 6 14SOIC, 14TSSOP
TLV2772A-EP 2.7-V high-slew-rate rail-to-rail output operational amplifier with shutdown 2 2 1.6 6, 9 6 8SOIC
TLV2774A-EP 2.7-V, high slew rate rail-to-rail output operational amplifier with shutdown 2 4 2.1 6 5.5 14SOIC
TLV2774-EP 2.7-V, high slew rate rail-to-rail output operational amplifier with shutdown 2 4 2.7 6 5.5 14SOIC
TLV4113-EP Dual high-output drive operational amplifier with shutdown 1 2 3.5 1.57 6 10MSOP PowerPAD
High-Speed Operational Amplifiers
THS4032-EP 100-MHz low-noise high-speed amplifier 11 2 100 90 100 8MSOP-PowerPAD™
THS4271-EP Low-noise, high slew rate, unity gain, stable voltage feedback amplifier 24 1 400 160 1000 8MSOP-PowerPAD
Instrumentation Amplifier
Device Description Gain (V/V)
CMRR (Min) (dB)
Non-Linearity
(+/-) (Max) (%)
Output Offset (+/-) (Max) (uV)
Bandwidth at G=100 (Min)
(kHz)Pin/
Package(s)
INA129-EP Precision, low-power instrumentation amplifier 1 to 10000 120 0.002 500/G 200 8SOIC
Special FunctionsDevice Description Pin/Package(s)
OPA4872-EP 4:1 high-speed multiplexer 14SOIC
TL441-EP Logarithmic amplifier 16SO
Clocks
Device Description VCC (V) No. of
Outputs Output Drive
(mA) Input Level
Output Level
Static Current (mA)
Pin/Package(s)
CDC2351-EP 1- to 10-line clock driver with three state outputs 3.3 10 -12/12 LVTTL LVTTL 15 24SSOP
CDCP1803-EP 1:3 LVPECL clock buffer with programmable divider 3.3 3 — multiple LVPECL — 24VQFN
(continued)
➔
10High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Interface Isolators
Device Description
Supply Voltage(s)
(V) Footprint# of
Channels
Insulation Rating (VRMS)
Thermal Shutdown
Input Threshold
Data Rate (MBPS)
Channel Conf.
Prop. Delay (Max) (ns)
Input Noise Filter
Pin/Package
ISO721M-EP Single 150 MBSPS digital isolator 3.3, 5 ADuM1100 1 1500 No CMOS 150 1/0 16 None 8SOIC
ISO7241A-EP 1-MBPS quad ch, 3/1 digital isolator 3.3, 5 ADuM1401 4 2500 No TTL 1 3/1 80 Yes 16SOIC
Analog-to-Digital Converters
Device DescriptionRes. (bits)
Sample Rate
(MSPS)
No. of Input
Channels Architecture SINAD (dB)
SNR (dB)
SFDR (dB)
DNL +/-LSB
INL +/-LSB
Supply Voltage
(V) Power (mW)
Pin/Package(s)
ADS1258-EP 16-channel, 24-bit analog-to-digital converter 24 0.13 16 Delta-Sigma — — — 1 — 4.75,
5.25 42 48QFN, 48QFP
ADS5440-EP 13-bit, 210-MSPS analog-to-digital converter 13 210 1 Pipeline 68 68 80 0.95 1.5 4.75,
5.25 2250 80HTQFP
ADS5444-EP 13-bit, 250-MSPS analog-to-digital converter 13 250 1 Pipeline 68 69 73 — — 4.75,
5.25 2250 80HTQFP
ADS5463-EP 12-bit, 500-MSPS analog-to-digital converter 12 500 1 Pipeline 65.1 65.2 84 0.95 1.5 4.75,
5.25 2250 80HTQFP
ADS5500-EP 14-bit, 125-MSPS analog-to-digital converter 14 125 1 Pipeline 70 71 84 1.1 8 3, 3.6 780 64HTQFP
ADS6445-EP Quad-channel, 14-bit, 125-/105-/80-/65-MSPS ADC with serial LVDS outputs
14 125 4 Pipeline 72.3 73.2 83 2.5 5 3, 3.6 1680 64VQFN
THS1206-EP 12-bit, 6-MSPS, ADC quad-channel (config.), DSP/up if, integrated 16x FIFO
12 6 4 Pipeline 65 68 71 1 1.8 4.75, 5.25 186 32TSSOP
THS1401-EP 14-bit, 1-MSPS, DSP-compatible analog-to-digital converter 14 1 1 Pipeline 70 72 80 1 5 3, 3.6 270 48HTQFP
THS1403-EP 14-bit, 3-MSPS, DSP-compatible analog-to-digital converter 14 3 1 Pipeline 70 72 80 1 5 3, 3.6 270 48HTQFP
THS1408-EP 14-bit, 8-MSPS, DSP-compatible analog-to-digital converter 14 8 1 Pipeline 70 72 80 1 5 3, 3.6 270 48HTQFP
TLC1543-EP 10-bit analog-to-digital converters with serial control and 11 analog inputs
10 .038 11 SAR — — — 1 1 — 4 20SOIC
TLC2543-EP 12-bit ADC with serial control and 11 analog inputs 12-bit 200-kSPS ADC ser.
12 .066 11 SAR — — — 1 1 4.5, 5.5 5 20SOIC, 20SSOP
TLV1548-EP Low-voltage 10-bit ADC with serial control and 8 analog inputs 10 .085 8 SAR — — — 1 1 2.7, 5.5 — 20SSOP
TLV2548-EP
12-bit, 200-kSPS ADC serial output, auto powerdown (software and hardware), low power with 8x FIFO with 8 channels
12 0.2 8 SAR 65 — 75 1.2 1.2 3, 5.5 1375 —
TLV2556-EP 12-bit, 200-kSPS, 11-channel, low-power serial ADC with internal reference
12 0.2 11 SAR — — — 1 1 2.7, 5.5 — 20TSSSOP
➔
11High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Audio Analog-to-Digital Converters
Device Description
Supply Voltage(s)
(V) No. of Inputs
No. of Outputs
Control interface
Pd (typ) (mW)
Resolution (bits)
Additional Features
Sampling Rate (Max)
(kHz) Pin/
Package(s)
PCM4202-EP 118-dB SNR stereo audio analog-to-digital converter (extended qualification)
3.3 V digital, 5 V
analog 2 0 H/W 300 24 Int. PLL 216 28SSOP
Digital-to-Analog Converters
Device Description Res. (bits)
Sample/Update
Rate (MSPS)
Setting Time (μs)
DAC Channels Architecture
SNR (dB)
SFDR (dB)
DNL +/- LSB
INL +/- LSB
Supply Voltage
(V)Power (mW)
Pin/Package(s)
DAC5652-EP 10-bit, 275-MSPS, dual digital-to-analog converter 10 275 0.02 2 I-steering 63 80 1 0.5 3, 3.6 290 48TQFP
DAC5662-EP Dual 12-bit, 200-MSPS 12 275 0.02 2 l-steering 73 81 2 2 3, 3.6 330 48TQFP
DAC5672-EP Dual 14-bit, 200-MSPS 14 275 0.02 2 l-steering 77 84 3 4 3, 3.6 330 48TQFP
DAC5675-EP 14-bit, 400-MSPS 14 400 0.012 1 l-steering — 77 2 4 315, 3.6 820 48HTQFP
DAC5687-EP 16-bit, 500-MSPS, 2x-8x interpolating dual-channel DAC 16 500 0.012 2 l-steering 75 80 3 6 3, 3.6 — 100HTQFP
DAC8830-EP 16-bit, ultra-low-power voltage output 16 1 1 1 R-2R — — 1 1 2.7, 5.5 0.015 8SOIC
DAC8831-EP 16-bit, ultra-low-power voltage output 16 2 1 1 R-2R — — 1 1 2.7, 5.5 0.015 14SOIC
TLV5614-EPQuad, serial-in, programmable settling time, low power, hardware or software powerdown
12 0.102 3 4 String 74 70 1 4 2.7, 5.5 3.6 16TSSOP
TLV5618A-EP Digital-to-analog converter with power down 12 0.093 3 2 String 76 72 1 4 2.7, 5.5 1.8 8SOIC
TLV5619-EP 12-bit, single-channel DAC, parallel, voltage out, low power 12 1 1 1 String 78 72 1 4 2.7, 5.5 4.3 20SOIC
TLV5638-EP 12-bit, 1-µs serial input dual DAC, programmable internal reference, settling time 12-bit, 1 or 3.5 µs
12 0.233 1 2 String 74 72 1 4 2.7, 5.5 4.5 8SOIC
Digital to Analog Audio Converters
Device Description
SNR (typ) (dB) # DAC
Sampling Rate (Max) (kHz)
Resolution (bits)
Digital Audio
InterfaceControl
Interface
Pd (Typ) (mW)
Pin/Package(s)
PCM4104-EP 118dB SNR 4-channel audio DAC 118 4 192 24 I2S TDM H/W SPI 200 48TQFP
PCM4202-EP 118dB SNR stereo audio ADC 118 2 216 24 PCM/DSD H/W 300 28SSOP
Video Decoder
Device Description
Supply Voltage
(V) Input
Format Output Format
Analog Inputs
Input Standard(s) ADC
Output Standards Pin/Package
TVP5150AM1-EP Ultra-low-power NTSC/PAL/SECAM video decoder w/robust sync detector 3.3 CVBS
S-Video8bit 4:2:2
YCbCr 2 NTSC/PAL/SECAM
9-bit 20MHz
ITU-R BT.656 32TQFP
➔
12High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
LDOs
Device Description
Regulated outputs
(No.) Output voltage
options (V)
Vin (Min)
(V) Vin
(Max) (V)
Iout (Max)
(A) Iq (typ) (mA)
Pin/Package(s)
TPS70345-EP Dual-output low-dropout voltage regulators with power-up sequencing 2 1.2, 3.3 2.7 6 2.35 0.25 24HTSSOP
TPS70751-EP Dual-output low-dropout voltage regulators with power-up sequencing 2 1.8, 3.3 2.7 6 0.25 0.187 20HTSSOP
TPS71202-EP Dual, 250-mA output, ultra-low-noise, high PSRR, low-dropout linear regulator 2 Adj. — — — — 10SON
TPS71501-EP 50-mA, 24-V, 3.2-µA supply current, low-dropout linear regulator 1 Adj. 2.5 24 0.05 0.003 5SC70
TPS72118-EP Low-input voltage, cap-free, 150-mA low-dropout linear regulators 1 1.8 1.8 5.5 0.15 850 5SOT-23
TPS731xx-EP Cap-free NMOS 150-mA low-dropout regulator with reverse current protection 1 Adj., 1.5, 1.8, 2.5, 3.0,
3.2, 3.3, 5.0 1.7 5.5 0.15 0.4 5SOT-23
TPS732xx-EP Cap-free NMOS 250-mA low-dropout regulator with reverse current protection 1 Adj., 1.5, 1.6, 1.8, 2.5,
3.0, 3.3, 5.0 1.7 5.5 0.25 0.4 5SOT-23
TPS736xx-EP Cap-free NMOS 400-mA low-dropout regulator with reverse current protection 1 Adj., 1.5, 1.8, 2.5, 3.0,
3.2, 3.3 1.7 5.5 0.4 0.001 5SOT-23, 6SOT-223,
8SON
TPS75125-EP Fast transient response 1.5-A low-dropout voltage regulator with power good 1 2.5 2.7 5.5 1.5 0.075 20HTSSOP
TPS752xx-EP Fast transient response voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3 2.7 5 2 0.075 20HTSSOP
TPS752xxM-EP Fast transient response voltage regulators 1 1.5 2.7 5 2 — 20HTSSOP
TPS753xx-EP Fast transient response 1.5-A low-dropout voltage regulator 1 Adj., 1.5, 1.5, 2.5, 3.3 2.7 5 1.5 0.075 20HTSSOP
TPS767xx-EP Fast transient response 1-A low-dropout voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3, 5.0 2.7 10 1 0.085 20HTSSOP
TPS767D301-EP Dual-output low-dropout voltage regulators 2 Adj., 3.3 2.7 10 1 0.085 28HTSSOP
TPS768xx-EP Fast transient response 1-A low-dropout voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3, 5.0 2.7 10 1 0.085 20HTSSOP
TPS76901-EP Ultra-low-power, 100mA low-dropout linear regulator 1 1.2 to 5.5 2.7 10 0.1 0.018 5SOT
TPS77401-EP 250-mA low-dropout voltage regulator with power-good output 1 Adj. 2.7 10 0.25 0.09 8MSOP
TPS775xx-EP Fast transient response 500-mA low-dropout voltage regulators 1 Adj., 1.5, 1.8,2.5, 3.3 2.7 10 0.5 0.085 20HTSSOP
TPS776xx-EP Fast transient response 500-mA low-dropout voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3 2.7 10 0.5 0.085 20HTSSOP
TPS791xx-EP Ultra-low-noise, high PSRR, fast RF, 100-mA low-dropout linear regulator 1 Adj., 1.8, 3.3, 4.7 2.7 5.5 0.1 0.17 6SOT-23
TPS79318-EP Ultra-low-noise, high PSRR, fast RF, 200-mA low-dropout linear regulator 1 1.8 2.7 5.5 0.2 0.17 5SOT-23
TPS793xx-EP Ultra-low-noise, high PSRR, fast RF, 200-mA low-dropout linear regulator 1 Adj., 1.8, 2.5, 3.3,
4.75 2.7 5.5 0.2 0.17 6SOT-23
TPS79718-EP Ultra-low-power, 10-mA low-dropout linear regulators with power good 1 1.8 2 5.5 0.01 0.005 5SC70
TPS79730-EP Ultra-low-power, 10-mA low-droput linear regulators with programmable output 1 3 1.8 5.5 0.01 0.005 5SC70
DC/DC Controllers
Device Description Vin (Min)
(V)
Vin (Max)
(V) Duty Cycle (Max) (%)
Iout (Max)
(A)
Iq (typ) (mA)
Switching Frequency (Max)
(kHz) Type Pin/
Package(s)
TL1451A-EP Dual pulse-width-modulation control circuits 3.6 50 100 3 1.7 500 Non-synchronous 16SOIC
TPS40055-EP Wide-input synchronous buck controller 8 40 94 20 1.5 1000 Synchronous 16HTSSOP
TPS40200-EP Wide-input-range non-synchronous voltage-mode controller 4.5 52 90 3 1.5 500 Non-
synchronous 8SOIC
TPS5120-EP Dual-output two-phase synchronous buck DC/DC controller 4.5 28 100 1.5 1.1 500 Synchronous 30TSSOP
➔
13High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
LDOs (continued)
Device Description
Regulated outputs
(No.) Output voltage
options (V)
Vin (Min)
(V) Vin
(Max) (V)
Iout (Max)
(A) Iq (typ) (mA)
Pin/Package(s)
UC2832-EP Precision low-dropout linear controllers 1 2 3.3 36 0.1 3.3 16SOIC
UCC284-EP Single-output LDO, 500-mA, fixed (5 V), low quiescent current, wide-input, voltage range — -5 -5.2 -16 0.5 0.2 8SOIC
PWM Power Driver
Device Description Vs (mim) (V) Vs (Max) (V) Iq (Max) (mA)
Saturation Voltage (Max)
(V)Output Current
(Min) (A) Pin/Package(s)
DRV401-EP Sensor signal conditioning for close-loop magnetic current sensor 4.5 5.5 6.8 0.4 0.2 20SO PowerPAD
20VQFN
MOSFET Drivers
Device Description
Rise Time (ns)
Peak Output Current (A)
No. of Outputs
Input Threshold
Driver Configuration
Vcc (Min)
(V)
Vcc (Max)
(V)
Prop Delay (ns)
Fall Time (ns)
Pin/Package(s)
TPS2818-EP Inverting high-speed MOSFET driver with internal regulator 25 2 1 CMOS Inverting 5 14 50 35 5SOT-23
TPS2819-EP Non-inverting high-speed MOSFET driver with internal regulator 25 2 1 CMOS Non-Inverting 5 14 50 35 5SOT-23
UCC27423-EP Dual 4A, MOSFET driver with enable 20 4 2 CMOS Inverting 4 15 30 15 8SOIC
UCC27424-EP Dual 4A, high-speed, low-side MOSFET driver with enable 20 4 2 CMOS Non-Inverting 5 15 25 15 8MSOP-
PowerPAD™
Multi-Channel IC (PMIC) Solutions
Device Description
Regulated outputs
(No.) LDO
Vin (Min)
(V)
Vin (Max)
(V) Processor
Name
Step-Down DC/DC
ControllerPin/
Package(s)
TPS75003-EP Triple supply power management IC for powering FPGAs and DSPs 3 1 2.2 6.5 Altera, Xilinx 2 20QFN
Power Factor Correction ICs
Device Description
Practical Operating Frequency (Max)
(MHz)
Duty Cycle (Max) (%)
Startup Current
(mA)
Vref tol (%)
Vref (V)
Operating Supply Current
(mA)
Operating Supply
(Max) (V)
UVLO Thresholds On/Off (V)
Pin/Package(s)
UC2854B-EP Advanced high-power factor preregulator 0.2 95 0.25 1.3 7.5 12 20 10.5/10 16SOIC
UCC2818-EP BiCMOS power factor preregulator 0.25 100 0.15 1.5 7.5 4 18 10.5/10 16SOIC
PWM Power Supply Controllers
Device Description Topology
PWM Outputs
(#)
UVLO Thresholds On/Off (V) Control Method
Frequency (Max) (kHz)
Duty Cycle (Max) (%)
Regulated Output (#)
Pin/Package
UC1842A-EP Current-mode PWM controller Boost, Flyback, Forward 1 16/10 Current mode 500 100 1 8SOIC
UC1843-HIREL Current-mode PWM controller Boost, Flyback, Forward 1 8.4/7.6 Current mode 450 100 1
UC1843A-EP Current-mode PWM controller Boost, Flyback, Forward 1 8.5/7.9 Current mode 500 100 1 8SOIC
UC1844A-EP Current-mode PWM controller Boost, Flyback, Forward 1 16/10 Current mode 500 50 1 8SOIC
UC1846-EP Current-mode PWM controller Boost, Flyback,
Forward, Full-Bridge, Half-Bride, Push-Pull
2 7.7/6.95 Current mode 450 50 2 16SOIC
UCC2800-EP Low-power BiCMOS current-mode PWM
Boost, Flyback, Forward 1 7.2/6.9 Current mode 1000 100 1 8SOIC
UCC2801-EP Low-power BiCMOS current-mode PWM
Boost, Flyback, Forward 1 9.4/7.4 Current mode 1000 50 1 8SOIC
➔
14High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
PWM Power Supply Controllers (continued)
Device Description Topology
PWM Outputs
(#)
UVLO Thresholds On/Off (V) Control Method
Frequency (Max) (kHz)
Duty Cycle (Max) (%)
Regulated Output (#)
Pin/Package
UCC2802-EP Low-power BiCMOS current-mode PWM
Boost, Flyback, Forward 1 12.5/8.3 Current mode 1000 100 1 8SOIC
UCC2803-EP Low-power BiCMOS current-mode PWM
Boost, Flyback, Forward 1 4.1/3.6 Current mode 1000 100 1 8SOIC
UCC2804-EP Low-power BiCMOS current-mode PWM
Boost, Flyback, Forward 1 12.5/8.3 Current mode 1000 50 1 8SOIC
UCC2805-EP Low-power BiCMOS current-mode PWM
Boost, Flyback, Forward 1 4.1/3.6 Current mode 1000 50 1 8SOIC
UCC2808A-1EP Low-power current mode push-pull PWM
Full-Bridge, Half-Bridge, Push-Pull 2 12.5/8.3 Current mode 1000 50 2 8SOIC
UCC2808A-2EP Low-power current mode push-pull PWM
Full-Bridge, Half-Bridge, Push-Pull 2 4.3/4.1 Current mode 1000 50 2 8SOIC
UC2825A-EP High-speed PWM controller Boost, Flyback,
Forward, Full-Bridge, Half-Bride, Push-Pull
2 9.6 Current mode, Voltage mode 1000 50 2 16SOIC
UC2875-EP Phase shift resonant controller Full-Bridge 4 10/7/9.2 Current mode, Voltage mode 1000 100 4 28SOIC
UCC2895-EP BiCMOS advanced phase shift PWM controller Full-Bridge 4 11.8/9.8 Current mode 527 100 4 20SOIC
UCC28C43-EP Low-power BiCMOS current-mode PWM
Boost Buck Flyback Forward 1 8.4/7.6 Current mode 1000 100 1 8SOIC
UCC28C45-EP Low-power BiCMOS current-mode PWM
Boost Buck Flyback Forward 1 8.4/7.6 Current mode 1000 50 1 8SOIC
SWIFT™ DC/DC Converters
Device Description
Vin (Min)
(V)
Vin (Max)
(V)
Vout (Min)
(V)
Vout (Max)
(V) Preset Vout (V)
Iout (Max)
(A)
Switching Frequency (Max) (kHz)
Pin/Package(s)
TPS5410-EP 5.5V to 36-V, 1A, 500-kHz step-down SWIFT converter 5.5 36 1.23 31 — 1 500 8SOIC
TPS5420-EP 5.5V to 36V, 2A, 500-kHz step-down SWIFT converter 5.5 36 1.23 31 — 2 500 8SOIC
TPS5430-EP 5.5V to 36V, 3A, 500-kHz step-down SWIFT converter 3.6 5.5 1.23 31 — 3 500 8SO, PowerPAD™
TPS54310-EP 3V to 6V, 3A Synchronous Step Down SWIFT converter 3 6 0.9 3.3 — 3 700 20HTSSOP
TPS54311-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 0.9 3 700 20HTSSOP
TPS54312-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 1.2 3 700 20HTSSOP
TPS54313-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 1.5 3 700 20HTSSOP
TPS54314-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 1.8 3 700 20HTSSOP
TPS54315-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 2.5 3 700 20HTSSOP
TPS54316-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 3.3 3 700 20HTSSOP
TPS54350-EP 4.5V to 20V input, 3A output synchronous PWM switcher with integrated FET 4.5 20 0.891 12 — 3 700 16HTSSOP
TPS54354-EP 4.5V to 20V input, 3A output synchronous PWM switcher with integrated FET 4.5 20 — — 1.8 3 600 16HTSSOP
TPS54356-EP 4.5V to 20V input, 3A output synchronous PWM switcher with integrated FET 5.5 20 — — 3.3 3 600 16HTSSOP
TPS5450-EP 5.5V to 36V, 5A, 500kHz Step Down SWIFT converter 5.5 36 1.22 31 — 5 500 8SO PowerPAD
TPS54610-EP 3V to 6V, 6A output synchronous buck PWM switcher with integrated FETs 3 6 0.9 4.5 — 6 700 28HTSSOP
➔
15High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
SWIFT™ DC/DC Converters (continued)
Device Description
Vin (Min)
(V)
Vin (Max)
(V)
Vout (Min)
(V)
Vout (Max)
(V) Preset Vout (V)
Iout (Max)
(A)
Switching Frequency (Max) (kHz)
Pin/Package(s)
TPS54613-EP 3V to 6V input, 6A output synchronous buck PWM switcher with integrated FETs 3 6 — — 1.5 6 700 28HTSSOP
TPS54615-EP 3V to 6V input, 6A output synchronous buck PWM switcher with integrated FETs 3 6 — — 2.5 6 700 28HTSSOP
TPS54680-EP 3V to 6V Input, 6A output tracking synchronous buck PWM switcher 3 6 0.9 3.3 — 6 700 28HTSSOP
TPS62110-EP 17V, 1.5A synchronous step-down converter 3.1 17 1.153 16 — 1.5 1000 16QFN
TPS62111-EP 17V, 1.5A synchronous step-down converter 3.1 17 3.8 17 — 1.5 1000 16QFN
TPS62112-EP 17V, 1.5A synchronous step-down converter 3.1 17 5.5 17 — 1.5 1000 16QFN
Supervisory Circuits (Voltage Supervisors)
Device Description No. of
Supervisors
Vit1 (typ) (V)
Vit2 (typ) (V)
Programmable Delay
Manual Reset
Reset Active Low
IDD (typ) (uA)
Pin/Package
TLC7701-EP Micropower supply voltage supervisor 1 Adj — — — Yes 9 8SOIC, 8TSSOP
TLC7705-EP Micropower supply voltage supervisor 1 4.5 — — — Yes 9 8TSSOP
TLC7733-EP Micropower supply voltage supervisor 1 2.93 — — — Yes 9 8TSSOP
TPS3106-EP Ultra-low supply-current/supply-voltage supervisory circuit 2 2.94 Adj — — — 1.2 6SOT-23
TPS3307-18-EP Triple processor supervisors 3 2.93 1.68 — — Yes 15 8SOIC
TPS3307-33-EP Triple processor supervisors 3 4.55 2.93 — — Yes 15 8MSOP-PowerPAD™
TPS3619-33-EP Backup-battery supervisors for RAM retention 1 2.93 — — — Yes 15 8MSOP
TPS3620-33-EP Backup-battery supervisors for RAM retention 1 2.93 — — — Yes 15 8MSOP
TPS3803-01-EP Single voltage detector 1 Adj — — — Yes 3 5SC70
TPS3803G15-EP Single voltage detector 1 1.4 — — — Yes 3 5SC70
TPS3805H33-EP Dual voltage detector 2 3.05 Adj — — Yes 3 5SC70
TPS3808-EP Low-quiescent current, programmable delay supervisory circuit 1 Adj — Yes Yes Yes 2.4 6SOT-23
TPS3809I50-EP 3-pin supply voltage supervisor 1 4.55 — — — Yes 9 3SOT-23
TPS3809K33-EP 3-pin supply voltage supervisor 1 2.93 — — — Yes 9 3SOT-23
TPS3809L30-EP 3-pin supply voltage supervisor 1 2.64 — — — Yes 9 3SOT-23
TPS3813K33-EP Processor supervisory circuit with window watchdog 1 2.93 — — — — 9 6SOT-23
TPS3836J25-EP Nanopower supervisory circuit 1 2.25 — — Yes Yes 0.22 5SOT-23
TPS3836L30-EP Nanopower supervisory circuit 1 2.64 — — Yes Yes 0.25 5SOT-23
TPS3837K33-EP Nanopower supervisory circuit 1 2.93 3.3 — Yes — 0.22 5SOT-23
➔
16High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Voltage References
Device Description Sub Family VO (V)
VI (Max)
(V)
VI (Min)
(V)
Temp Coeff (Max) (ppm/
degree C) Iq (Max)
(uA)
Iout/Iz (Max) (mA)
Pin/Package
REF3212-EP 4 Ppm/Degreesc 100 Ua Sot23-6 series voltage references
4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 1.25 5.5 1.8 7 120 10 6SOT-23
REF3220-EP 4 Ppm/Degreesc 100 Ua Sot23-6 series voltage references
4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 2.052 — — — 120 — 6SOT-23
REF3225-EP 4 Ppm/Degreesc 100 Ua Sot23-6 series voltage references
4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 2.5 5.5 2.55 7 120 10 6SOT-23
REF3230-EP 4 Ppm/Degreesc 100 Ua Sot23-6 series voltage references
4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 3 5.5 3.05 7 120 10 6SOT-23
REF3233-EP 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References
4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 3.307 — — — 120 — 6SOT-23
REF3240-EP 4 Ppm/Degreesc 100 Ua Sot23-6 series voltage references
4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 4.096 5.5 4.146 7 120 10 6SOT-23
TL1431-EP Precision adjustable (programmable) shunt reference
Precision adjustable (programmable) shunt reference — — — — — 100 8SOIC
Digital Signal Processors
Device Description CPU Freq
uenc
y (M
Hz)
PWM EMIF DMA
Core Supply (Volts) McBSP I2C SPI CAN
IO Supply (Volts)
Pin/Package(s)
DaVinci™ Video Processors
SM320DM355-EP Digital media system-on-chip (DMSoC)
1 ARM9; DaVinci Video
216 4
1 16-Bit mDDR/DDR2, 1 8/16-Bit EMIFA
64-Ch EDMA 1.3 — 1 3 — 1.8 337NFBGA
SM320DM642-EP Video/imaging fixed-point DSP
1 C64; Video — — 1 64-Bit 64-Ch EDMA 1.4 2 2 — — 3.3 548GDK,
548ZDK
Fixed-Point Digital Signal Processors
SM320C6201-EP Fixed-point DSP 1 C62x 200 — 1 32-Bit 4-Ch 1.8 2 — — — 3.3 352FC/CSP
SM320C6202-EP Fixed-point DSP 1 C62x 200 — 1 32-Bit 4-Ch 1.5 3 — — — 3.3 352FCBGA
SM320C6424-EP Fixed-point DSP 1 C64x+ 600 3
1 16/8-Bit EMIFA, 1 32/16-Bit
DDR2
64-Ch EDMA 1.05, 1.2 2 1 — — 1.8, 3.3 376BGA
SM320C6455-EP Fixed-point DSP 1 C64x+ 1000 —
1 32-Bit DDR@
EMIF, 1 64-Bit EMIFA
64-Ch EDMA 1.25 2 2 — —3.3, 1.8,
1.5, 1.2
697BGA
SM320VC5409-EP Fixed-point DSP 1 C54x 100 — — 6-Ch Ext 1.8 3 — — — 3.3 144BGA MicroStar™
SM320VC5416-EP Digital signal processor 1 C54x 120, 160 — 1 16-Bit 6-Ch Ext 1.5, 1.6 3 — — — 3.3
144LQFP, 144BGA
MicroStar
SM320VC5421-EP Digital signal processor 2 C54x 100 — 1 16-Bit 2 6Ch Ext 1.8 6 — — — 3.3 144LQFP
SM320VC5507-EP Fixed-point DSP 1 C55x108, 144, 200
— 1 16-Bit 6-Ch 1.2, 1.35, 1.6 3 — — — 2.7 to
3.6 144LQFP
SM320VC5510A-EP Fixed-point DSP 1 C55x 200 — 1 32-Bit 6-Ch Int/Ext 1.6 3 — — — 3.3 240BGA MicroStar
SM320C6414-EP Fixed-point DSP 1C64x — — 1 16-Bit, 1 64-Bit 64-Ch EDMA — 3 — — — — —
SM320C6415-EP Fixed-point DSP 1C64x — — 1 16-Bit, 1 64-Bit 64-Ch EDMA — 3 — — — — —
SM320C6416-EP Fixed-point DSP 1C64x — — 1 16-Bit, 1 64-Bit 64-Ch EDMA — 3 — — — — —
➔
17High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Digital Signal Processors (continued)
Device Description CPU Freq
uenc
y (M
Hz)
PWM EMIF DMA
Core Supply (Volts) McBSP I2C SPI CAN
IO Supply (Volts)
Pin/Package(s)
Floating-Point Digital Signal Processors
SM320C6701-EP Flosting-point DSP 1 C67x 167 — 1 32-Bit 4-Ch 1.8 2 — — — 3.3 352FC/CSP
SM320C6711D-EP Flosting-point DSP 1 C67x 167, 200 — 1 32-Bit 16-Ch EDMA 1.2 2 — — — 3.3 272BGA
SM320C6712D-EP Flosting-point DSP 1 C67x 167 — 1 16-Bit 16-Ch EDMA 1.2 2 — — — 3.3 272BGA
SM320C6713B-EP Flosting-point DSP 1 C67x 200, 300 — 1 32-Bit 16-Ch EDMA 1.4 2 2 — — 3.3 272BGA
OMAP™ Processors
OMAP3530-HIREL Applications processor1 64x+; 1 ARM
Cortex-A8— —
1 16-Bit GPMC,
1 32-Bit SDRC
32-Bit Ch SDMA, 64Ch
EDMA
0.8 to 1.35 5 3 — — 1.8 to
3.0515 POP-
FCBGA
OMAP3525-HIREL Applications processor1 64x+; 1 ARM
Cortex-A8— —
1 16-Bit GPMC,
1 32-Bit SDRC
32-Bit Ch SDMA, 64Ch
EDMA
0.8 to 1.35 5 3 — — 1.8 to
3.0515 POP-
FCBGA
C2000™ Microcontrollers
SM320F2801-EP 32-bit, digital signal controller with flash 1 C28x 100 8-Ch — — 1.8 — 1 2 1 3.3 100LQFP
SM320F2808-EP 32-bit, digital signal controller with flash 1 C28x 100 16-Ch — — 1.8 — 1 4 2 3,3 100LQFP
SM320F2812-EP 32-bit, digital signal controller with flash 1 C28x 150 16-Ch 1 16-Bit — 1.9 1 — 1 1 3.3
176LQFP, 179BGA
MicroStar™
SM320F28335-EP Delfino microcontroller 1 C28x 250 18-Ch 1 32/16-Bit 6-Ch DMA 1.9 2 1 1 2 3.3
176BGA, 176HLQFP,
179BGA MicroStar
SM320LF2407A-EP DSP controller 1 C24x 40 16-Ch — — 3.3 — — 1 2 3.3 144LQFP
MSP430™ Microcontrollers
Device Description Sub Family Frequency ADC RAM GPIOPin/
Package(s)
MSP430F2274-EP 16-bit ultra-low-power microcontroller, 32-KB flash, 1-K RAM 2xx 16-MHz series 16 10-bit SAR — 32 40QFN
MSP430F249-EP 16-bit ultra-low-power microcontroller, 60-KB flash, 2-KB RAM, 12-bit ADC, 2 USCIs 2xx 16-MHz series 16 12-bit SAR — 48 64LQFP
MSP430F2618-EP 16-bit ultra-low-power MCU, 92-KB flash, 8-KB RAM, 12-bit ADC, dual DAC, 2 USCIs 2xx 16-MHz series 16 12-bit SAR 8 KB 48, 64
113BGA, MicroStar™
Junior
➔
18High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Buffers, Drivers and Transceivers
Device Description No. of Gates
Static Current
IOL (mA)
Voltage Nodes
(V)Output
Drive (mA)
tpd Max (ns)
Vcc Range
(V)ICC (uA)
Pin/Package(s)
Buffers and Drivers
SN74ABT244A-EP Octal buffer/driver with 3-state outputs — — — 5 -24/48 — 4.5 to 5.5 — 20SSOP
SN74ABT541B-EP Octal buffer/driver with 3-state outputs — 30 — 5 -32/64 3.5 4.5 to 5.5 — 20TSSOP
SN74AC04-EP Hex inverter 6 0.02 — 5, 3.3 -24/24 7 2.0 to 6.0 — 14SOIC
SN74AC244-EP Octal buffer/driver with 3-state outputs — 0.04 — 5, 3.3 -24/24 7 2.0 to 6.0 — 20SO, 20SOIC
SN74ACT04-EP Hex inverter 6 0.002 — 5 -24/24 8.5 4.5 to 5.5 — 14SOIC
SN74ACT244-EP Octal buffer/driver with 3-state outputs — 0.04 — 5 -24/24 9 4.5 to 5.5 — 20SO, 20SOIC
SN74AHC04-EP Hex inverter 6 0.02 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 14SOIC, 14TSSOP
SN74AHC125-EP Quadruple bus buffer gates with 3-state outputs 4 0.04 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 14SOIC,
14TSSOP
SN74AHC14-EP Hex Schmitt-Trigger inverter 6 0.02 — 5, 3.3 -8/8 12 2.0 to 5.5 — 14SOIC, 14TSSOP
SN74AHC244-EP Quadruple bus buffer gate with 3-state outputs 8 0.04 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 20SOIC, 20TSSOP
SN74AHC245-EP Octal bus transceiver with 3-state outputs — 0.04 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 20SOIC, 20TSSOP
SN74AHCT125-EP Quadruple bus buffer gate with 3-state outputs — 0.02 — 5 -8/8 8.5 4.5 to 5.5 — 14SOIC, 14TSSOP
SN74AHCT126-EP Quadruple bus buffer gate with 3-state outputs — 0.02 — 5 -8/8 8.5 4.5 to 5.5 — 14SOIC, 14TSSOP
SN74AHCT14-EP Hex Schmitt-Trigger inverter 6 0.02 — 5 -8/8 9 4.5 to 5.5 — 14SOIC, 14TSSOP
SN74AHCT244-EP Octal buffer/driver with 3-state outputs 8 0.04 — 5 -8/8 9.5 4.5 to 5.5 — 20SOIC, 20TSSOP
SN74AHCT541-EP Octal buffer/driver with 3-state outputs 8 0.04 — 5 -8/8 9.5 4.5 to 5.5 — 20SOIC
SN74AHCU04-EP Hex inverter — — — — — — 2 to 5.5 — 14TSSOP
SN74ALVC244-EP Octal buffer/driver with 3-state outputs — 0.01 — 3.3, 2.7, 2.5, 1.8 -24/24 2.8 1.65 to
3.6 — 20TSSOP
SN74ALVCH16827-EP 20-bit buffer/driver with 3-state outputs — 0.04 — 1.8, 2.5, 2.7, 3.3 -24/24 4 1.65 — 56SSOP
SN74AUC1G125-EP Single bus buffer gate with 3-state output — — — — — — — — 5SC70
SN74AUC1G14-EP Single Schmitt-Trigger inverter — — 0.7, 3, 5, 8, 9 — —
2, 4, 4.5, 5.5,
5.8— 10 5SOT-23
SN74AUC1G14-EP Single Schmitt-Triger inverter — — — — —2, 4,
4.5, 5.5, 5.8
— — 5SOT-23
SN74AUP1G17-EP Low-power single Schmitt-Trigger buffer — — — — — — 0.8 to 3.6 0.5 5SC70
SN74BCT760-EP Octal buffer/driver with open-collector outputs — — — — — — -0.5 to 7 — 20SOIC
SN74HC244-EP Octal buffer and line driver with 3-state outputs 10 0.16 — 6, 4.5, 2 7.8/7.8 34 2.0 to 6.0 — 20SOIC, 20TSSOP
SN74HCT04-EP Hex inverter 6 0.02 — 5 -4/4 20 4.5 to 5.5 — 14SOIC
SN74HCT244-EP Octal buffer and line driver with 3-state outputs — 0.16 — 5 -6/6 38 4.5 to 5.5 — 20TSSOP
SN74LV04A-EP Hex inverter 6 0.02 — 5, 3.3, 2.5 -12/12 7.5 2.0 to 5.5 — 14TSSOP
SN74LV14A-EP Hex Schmitt-trigger inverter 6 0.02 — 5, 3.3, 2.5 -12/12 14 2.0 to 5.5 — 14SOIC, 14TSSOP
SN74LV244A-EP Octal buffer and line driver with 3-state outputs — — — 5/3.3/2.5 — 8.5 2 to 5.5 — 20SOIC
SN74LVC04A-EP Hex inverter 6 0.01 — 3.3, 2.7 -24/24 4.5 2.0 to 3.6 — 14SOIC, 14TSSOP
➔
19High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Buffers, Drivers and Transceivers (continued)
Device Description No. of Gates
Static Current
IOL (mA)
Voltage Nodes
(V)Output
Drive (mA)
tpd Max (ns)
Vcc Range
(V)ICC (uA)
Pin/Package(s)
Buffers and Drivers (continued)
SN74LVC06A-EP Hex inverter buffer/driver with open-drain outputs — — — 3.3 — 5 1.65 to
3.6 — 14SOIC
SN74LVC07A-EP Hex buffer/driver with open-drain outputs — 0.01 —5, 3.3,
2.7, 2.5, 1.8
24 2.6 1.65 to 5.5 — 14TSSOP
SN74LVC125A-EP Quadruple bus buffer gate with 3-state outputs — 0.01 — 3.3, 2.7, 2.5, 1.8 -24/24 4.8 1.65 to
3.6 — 14SOIC, 14TSSOP
SN74LVC14A-EP Hex Schmitt-Trigger inverter 6 0.01 — 3.3, 2.7 -24/24 6.4 2.0 to 3.6 — 14SOIC, 14TSSOP
SN74LVC16244A-EP 16-bit buffer/driver with 3-state outputs — 0.02 — 3.3, 2.7, 2.5, 1.8 -24/24 4.1 1.65 to
3.6 — 48TSSOP
SN74LVC1G04-EP Single inverter gate 1 — — — — — 1.65 to 5.5 10 5SOT-23
SN74LVC1G06-EP Single inverter buffer/driver with open-drain output 1 — — — — — 1.65 to
5.5 — 5SC70
SN74LVC1G07-EP Single buffer/driver with open-drain output — — — — — — — 10 5SC70
SN74LVC1G125-EP Single bus buffer gate with 3-state outputs — — 32 1.8, 2.5, 3.3, 5 4 1.65 to
5.5 10 5SC70
SN74LVC1G126-EP Single bus buffer gate with 3-state outputs 1 — 32 1.8, 2.5 3.3,5 +\-24 4 1.65 to
5.5 10 5SC70
SN74LVC1G14-EP Single Schmitt-Trigger inverter 1 — — — — — 1.65 to 5.5 10 5SOT-23
SN74LVC1G17-EP Single Schmitt-Trigger buffer — — 32 — +\-24 4.6 up to 6.5 10 5SC70, 5SOT-23
SN74LVC1G97-EP Configurable multiple-function gate 1 — 32 — — 5.1 1.65 to 5.5 10 6SC70
SN74LVC1G98-EP Configurable multiple-function gate — — 32 — — 5.1 1.65 to 5.5 10 6SC70
SN74LVC1GX04-EP Crystal oscillator driver — — 32 — — 5 1.65 to 5.5 10 6SOT
SN74LVC2G04-EP Dual inverter gate 2 — — — — — 1.65 to 5.5 10 6SC70
SN74LVC2G06-EP Dual inverter buffer/driver with open-drain output 2 — — — — — 1.65 to
5.5 10 6SC70
SN74LVC2G07-EP Dual buffer/driver with open-drain output 2 — 24 5 +24, -24 5.7 1.65 to 5 10 6SC70
SN74LVC2G17-EP Dual Schmitt-Trigger buffer 2 — — — — — 1.65 to 5.5 10 6SC70
SN74LVC2G34-EP Dual buffer gate — — — — — — 1.65 to 5.5 10 6SC70
SN74LVC3G07-EP Triple buffer/driver with open-drain output — — 32 — — — 1.65 to 5.5 10 8US8
SN74LVC540A-EP Octal buffer/driver with 3-state outputs — 0.01 — 3.3, 2.7 -24/24 5.3 2.0 to 3.6 — 20SOIC, 20TSSOP
SN74LVC541A-EP Octal buffer/driver with 3-state outputs 8 0.01 — 3.3, 2.7, 2.5, 1.8 -24/24 5.1 2.0 to 3.6 — 20SOIC,
20TSSOP
SN74LVT125-EP 3.3-V ABT quadruple bus buffers with 3-state outputs — 7 — 3.3, 2.7 -32/32 4.2 2.7 to 3.6 — 14TSSOP
SN74LVTH125-EP 3.3-V ABT quadruple bus buffers with 3-state outputs 4 7 — 3.3, 2.7 -32/64 3.9 2.7 to 3.6 — 14TSSOP
SN74LVTH162240-EP 3.3-V ABT, 16-bit buffer/driver with 3-state outputs — 5 — 3.3, 2.7 -12/12 4 2.7 to 3.6 — 48TSSOP
SN74LVTH162244-EP 3.3-V ABT, quadruple bus buffer with 3-state outputs — 5 — 3.3, 2.7 -12/12 4 2.7 to 3.6 — 48TSSOP
SN74LVTH16240-EP 3.3-V ABT, 16-bit buffer/driver with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 48TSSOP
➔
20High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Buffers, Drivers and Transceivers (continued)
Device Description No. of Gates
Static Current
IOL (mA)
Voltage Nodes
(V)Output
Drive (mA)
tpd Max (ns)
Vcc Range
(V)ICC (uA)
Pin/Package(s)
Buffers and Drivers (continued)
SN74LVTH16244A-EP 3.3-V ABT, 16-bit buffer/driver with 3-state outputs — 5 — 3.3, 2.7 -24/24 4.4 2.7 to 3.6 —
48SSOP, 48TSSOP, 48TVSOP,
56BGA MicroStar™
Junior
SN74LVTH240-EP 3.3-V ABT, octal buffer/driver with 3-state outputs — 5 — 3.3, 2.7 -32/64 4 2.7 to 3.6 — 20TSSOP
SN74LVTH241-EP 3.3-V ABT, octal buffer/driver with 3-state outputs 8 5 — 3.3, 2.7 -32/64 3.5 2.7 to 3.6 — 20TSSOP
SN74LVTH244A-EP 3.3-V ABT, octal buffer/driver with 3-state outputs — 14 mA — 3.3, 2.7 -24/32 4.7 2.7 to 3.6 — 20SSOP,
20TSSOP
SN74LVTH32244-EP 3.3-V ABT, 32-bit buffer/driver with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 96LFBGA
Transceivers
SN74ABT16245A-EP 16-bit bus transceiver with 3-state outputs — — — — — — — — 48SSOP
SN74ABT245B-EP Octal bus transceivers with 3-state outputs — 30 — 5 -24/32 3.5 4.5 to 5.5 — 20SSOP
SN74AC245-EP Octal bus transceivers with 3-state outputs — 0.004 — 5, 3.3 -24/32 7 2.0 to 6.0 — 20SOIC
SN74ACT16245-EP 16-bit bus transceiver with 3-state outputs — 160 uA — 5 — 9.3 4.5 to 5.5 — 48SSOP
SN74LVC245A-EP Octal bus transceiver with 3-state outputs — 0.001 — 3.3, 2.7, 2.5, 1.8 -24/24 6.1 1.65 to
3.6 — 20TSSOP
SN74ALVCH16245-EP 16-bit bus transceiver with 3-state outputs — 0.04 — 3.3, 2.7, 2.5, 1.8 -24/24 3 1.65 to
3.6 — 48SSOP
SN74LVCH16652A-EP 16-bit bus transceiver and register with 3-state outputs — 0.02 — 3.3, 2.7,
2.5, 1.8 -24/24 6.3 1.65 to 3.6 — 56TSSOP
SN74LVTH162245-EP 3.3-V ABT, 16-bit bus transceiver with 3-state outputs — 5 — 3.3, 2.7 -32/64 4 2.7 to 3.6 — 48SSOP,
48TSSOP
SN74LVTH16245A-EP 3.3-V ABT, 16-bit bus transceiver with 3-state outputs — 5 — 3.3, 2.7 -24/24 4.5 2.7 to 3.6 —
48SSOP, 48TSSOP, 48TVSOP,
56BGA MicroStar
Junior
SN74LVTH16543-EP 3.3-V ABT, 16-bit registered transceiver with 3-state outputs — — — 3.3, 2.7 — — — — 56SSOP,
56TSSOP
SN74LVTH16646-EP 3.3 V ABT, 16-bit bus transceiver and register with 3-state outputs — — — 3.3, 2.7 — — — — 56TSSOP
SN74LVTH16652-EP 3.3 V ABT, 16-bit bus transceiver and register with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 56TSSOP
SN74LVTH16952-EP 3.3-V ABT, 16-bit registered transceiver with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 56TSSOP
SN74LVTH245A-EP 3.3-V ABT, octal bus transceiver with 3-state outputs — 5 — 3.3, 2.7 -32/64 3.5 2.7 to 3.6 — 20SSOP,
20TSSOP
SN74LVTH543-EP 3.3-V ABT, octal registered transceiver with 3-state outputs — 5 — 3.3, 2.7 -32/64 3.7 2.7 to 3.6 — 24TSSOP
SN74LVTH646-EP 3.3-V ABT, octal bus transceiver and register with 3-state outputs — 5 — 3.3, 2.7 -32/64 4.7 2.7 to 3.6 — 24TSSOP
SN74LVTH652-EP 3.3-V ABT, octal bus transceiver and register with 3-state outputs — 5 — 3.3, 2.7 -32/64 4.7 2.7 to 3.6 — 24TSSOP
➔
21High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Flip-Flop Latches and Registers
Device Description
Output Drive (mA)
th (ns)
tpd Max (ns)
Vcc range
(V) Static
Current tsu (ns)
Voltage Nodes
(V) Pin/
Package
Flip-flops
SN74ACT16374-EP 16-bit, D-type edge-triggered flip-flop with 3-state outputs -16/16 1 10.9 4.5 to 5.5 160 uA 6.5 5 48SSOP
SN74ACT74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -24/24 1 — CMOS 0.02 4 5 14SOIC
SN74AHC74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -8/8 0.5 11 2.0 to
5.5 0.02 5 5, 3.3 14SOIC, 14TSSOP
SN74AHCT74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -8/8 0 13 4.5 to
5.5 0.02 5 5 14SOIC, 14TSSOP
SN74HC74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset — — 345 — — 150 — 14TSSOP
SN74LV374A-EP Octal edge-triggered D-type flip-flop with 3-state outputs -16/16 2 — 2 to 5.5 0.02 3 5, 3.3, 2.5 20TSSOP
SN74LVC1G175-EP Single D-type flip-flop with asynchronous clear — — — 1.65 to. 5.5 10 — — 6SC70
SN74LVC1G79-EP Single positive-edge-triggered D-type tlip-tlop 24 — 3.8 1.65 to. 5.5 10 — — 5SC70
SN74LVC2G74-EP Single positive-edge-triggered D-type flip-flop with clear and preset — — 7.9 1.65 to 5 10 — 3.3 8US8
SN74LVC374A-EP Octal edge-triggered D-type flip-flop with 3-state outputs -24/24 1.5 8.5 2.0 to 3.6 0.01 2 3.3, 2.7 20SOIC,
20TSSOP
SN74LVC574A-EP Octal edge-triggered D-type flip-flop with 3-state outputs -24/24 2 8 2.0 to 3.6 0.01 2 3.3, 2.7 20SOIC,
20TSSOP
SN74LVC74A-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -24/24 1 5.2 2.0 to
3.6 0.01 3 3.3, 2.7 14SOIC, 14TSSOP
SN74LVTH16374-EP 3.3-V ABT, 16-bit edge-triggered D-type flip-flop with 3-state outputs — — — 2.7 to
3.6 — — 3.3, 2.7 48SSOP, 48TSSOP
SN74LVTH273-EP 3.3-V ABT, octal D-type flip-flops with clear -32/+64 0 4.9 2.7 to 3.6 5 2.3 3.3, 2.7 20SO,
20TSSOP
SN74LVTH32374-EP 3.3-V ABT, 32-bit edge-triggered D-type flip-flop with 3-state outputs — — — 2.7 to
3.6 — — 3.3, 2.7 96LFBGA
SN74LVTH374-EP 3.3-V ABT, octal edge-triggered D-type flip-flop with 3-state outputs -32/+64 0.8 4.5 2.7 to
3.6 5 1.5 3.3, 2.7 20TSSOP
SN74LVTH574-EP 3.3-V ABT, octal edge-triggered D-type flip-flops with 3-state outputs -32/+64 0.3 4.5 2.7 to
3.6 5 2 3.3, 2.7 20TSSOP
Latches
SN74ABT16373A-EP 16-bit, transparent D-type latches with 3-state outputs — 2.2 3.3 4.5 to 5.5 — 2.4 — 48SSOP
SN74AC373-EP Octal D-type transparent latche with 3-state outputs -24/24 1 9.5 2.0 to 6.0 0.04 4 5, 3.3 20SOIC
SN74ACT16373-EP 16-bit, transparent D-type latches with 3-state outputs -16/16 5 10.8 4.5 to 5.5 160 uA 1 5 48SSOP
SN74ACT373-EP Octal D-type transparent latche with 3-state outputs -24/24 1 12.5 4.5 to 5.5 0.04 8.5 5 20SOIC
SN74LVC16373A-EP D-type latch with 3-state outputs — 1.6 4.2 1.65 to 3.6 — 1.7 — 48SSOP
SN74LVC373A-EP D-type latch with 3-state outputs -24/24 2 7.5 2.0 to 3.6 0.01 2 3.3, 2.7
20SOIC, 20SSOP, 20TSSOP
SN74LVC573A-EP D-type latch with 3-state outputs -24/24 2.5 7.7 2.0 to 3.6 0.01 2 3.3, 2.7 20SOIC,
20TSSOP
SN74LVTH162373-EP 3.3-V ABT, 16-bit transparent D-type latche with 3-state outputs — — — — — — — 48SSOP
➔
22High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Flip-Flop Latches and Registers (continued)
Device Description
Output Drive (mA)
th (ns)
tpd Max (ns)
Vcc range
(V) Static
Current tsu (ns)
Voltage Nodes
(V) Pin/
Package
Latches (continued)
SN74LVTH16373-EP 3.3-V ABT, 16-bit transparent D-type latche with 3-state outputs — — — 2.7 to 3.6 — — 3.3, 2.7
48SSOP, 48TSSOP,
56BGA Microstar™
Junior
SN74LVTH32373-EP 3.3-V ABT, 32-bit transparent D-type latche with 3-state outputs — — — 2.7 to 3.6 — — 3.3, 2.7 96LFBGA
SN74LVTH373-EP 3.3-V ABT, octal transparent D-type latche with 3-state outputs -32/+64 1.4 3.9 2.7 to 3.6 5 1.1 3.3, 2.7 20TSSOP
SN74LVTH573-EP 3.3-V ABT, octal transparent D-type latche with 3-state outputs -32/+64 1.5 3.9 2.7 to 3.6 5 0.7 3.3, 2.7 20TSSOP
Registers
SN74HC165-EP 8-bit parallel-load shift registers -4/4 5 30 2.0 to 6.0 0.008 30 6, 5, 2 16SOIC,
16TSSOP
SN74LV165A-EP 8-bit parallel-load shift registers 0.02 0.5 12.5 2 to 5.5 — 5 5, 3.3, 2.5 16TSSOP
SN74HC166A-EP 8-bit parallel-load shift registers +/-4 5 — 2 to 6 0.008 29 2, 4.5, 6 16SOIC
SN74LV595A-EP 8-bit shift register with 3-state output register -16/16 1.5 11.9 2 to 5.5 0.02 8 5, 3.3, 2.5 16TSSOP
SN74LV74A-EP 8-bit shift register with 3-state output register -16/16 1.5 11.9 2 to 5.5 0.02 8 5, 3.3, 2.5 16TSSOP
Line Drivers, Receivers and Transceivers
Device Description Signaling
Rate (Mbps)
Supply Voltage(s)
(V) No. of TX/RX
ICC (Max) (mA)
Pin/Package(s)
AM26C31-EP Quadruple differential line driver — 5 4 TX 3.2 16SOIC
AM26C32-EP Quadruple differential line receiver — 5 4 RX 15 16SOIC
AM26LS32AM-EP Quadruple differential line receiver — 5 4 RX 70 16SOIC
AM26LV31E-EP Low-voltage high-speed quad differential line driver, +/-15-kV IEC ESD protection 32 3.3 4 TX 0.1 16SOIC
AM26LV32E-EP Low-voltage high-speed quad differential line receiver, +/-15-kV IEC ESD 32 3.3 4 RX — 16SOIC
MAX3221-EP 3-V to 5.5-V single-channel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 1 TX/1 RX 1 16SSOP
MAX3223-EP 3-V to 5.5-V multichannel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 2 TX/2RX 1 20SSOP
Dual-Supply Translators and Tranceivers
Device Description No. of Outputs tpd Max (ns) Vcc Range
(V) Pin/
Package(s)
CD4504B-EP CMOS hex voltage-level shifter for TTL-to-CMOS or CMOS-to-CMOS operation 6 — 5.0 to 20 16TSSOP
SN74ALVC164245-EP 16-bit 2.5-V to 3.3-V/3.3-V to 5-V level-shifting transceiver, 3-state output 16 5.8 SplitRail 48SSOP, 48TSSOP
SN74AVCH4T245-EP 4-bit dual-supply bus transceiver with configurable voltage translation and 3-state outputs — — 1.2 to 3.6 16QFN
SN74LVC1T45-EP Single-bit dual-supply bus transceiver, configurable voltage translation and 3-state outputs 1 — 1.65 to 5.5 6SC70
SN74LVC2T45-EP Dual-bit dual supply transceiver with configurable voltage translation and 3-state outputs — — 1.65 to 5.5 8SM8
SN74LVC4245A-EP Octal bus transceiver and 3.3-V to 5-V shifter with 3-state outputs 8 6.7 SplitRail 24TSSOP
SN74LVC8T245-EP 8-bit dual-supply bus transceiver with configurable voltage translation and 3-state outputs 8 — 1.65 to 5.5 24TSSOP
SN74LVCC3245A-EP Octal bus transceiver with adjustable output voltage and 3-state outputs — 7.6 SplitRail 24SOIC, 24SSOP, 24TSSOP
SN74LVCC4245A-EP Octal dual-supply bus transceiver with configurable output voltage and 3-state outputs — — SplitRail 24TSSOP
SN74LVCH16T245-EP 16-bit dual-supply bus transceiver, configurable voltage translation, 3-state outputs 16 — 1.65 to 5.5 48TSSOP,
48TVSOP
➔
23High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Line Drivers, Receivers and Transceivers (continued)
Device Description Signaling
Rate (Mbps)
Supply Voltage(s)
(V) No. of TX/RX
ICC (Max) (mA)
Pin/Package(s)
MAX3232-EP 3-V to 5.5-V multichannel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 2 TX/2RX 1 16SSOP, 16TSSOP
MAX3243-EP 3-V to 5.5-V multichannel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 3 TX/5 RX 1 28SSOP, 28TSSOP
PCI1520-EP PC card controllers data manual N/A 3.3 — n/a 208LQFP, 209BGA
MicroStar™
SN65HVD1050-EP EMC-optimized CAN transceiver 1 5 1 TX / 1 RX 10, 70 8SOIC
SN65HVD10-EP 3.3-V RS-485 transceiver 25 3.3 1 TX/1 RX 15.5 8SOIC
SN65HVD12-EP 3.3-V RS-485 transceiver 1 3.3 1 TX/1 RX 15.5 8SOIC
SN65HVD21M-EP Extended common-mode RS-485 transceiver 5 5 1 TX/1 RX 15 8SOIC
SN65HVD230M-EP 3.3-V CAN transceiver with standby mode 1 3.3 1 TX / 1 RX 17 8SOIC
SN65HVD233-EP 3.3-V CAN tranceiver 1 3.3 1 TX / 1 RX 6 8SOIC
SN65HVD30-EP 3.3-V full-duplex RS-485 driver and receiver 25 3.3 1 TX/1 RX 2.1 8SOIC
SN65HVD33-EP 3.3-V full-duplex RS-485 drivers and receiver 25 3.3 1 TX/1 RX 2 14SOIC
SN65LBC174A-EP Quadruple RS-485 differential line driver 30 5 4 TX/0 RX 23 20SOIC
SN65LBC176A-EP Differential bus transceivers 30 5 1 TX/1 RX 15 8SOIC
SN65LV1023A-EP 10:1 LVDS SERDES transmitter 100-660 Mbps 660 3.3 1 TX 25 28SSOP
SN65LV1224B-EP 1:10 LVDS SERDES receiver 100-660 Mbps 660 3.3 1 RX 35 28SSOP
SN65LVDS179-EP High-speed differential line drivers and receivers 400 3.3 — 12 8MSOP
SN65LVDS33-EP High-speed differential receivers 400 3.3 — 25 16SOIC
SN65LVDS95-EP 23:1 LVDS SERDES transmitter 1,360 3.3 1 TX 110 48TSSOP
SN65LVDT14-EP Memorystick interconnect extender chipset 125 3.3 1 TX/4 RX 25 20TSSOP
SN65LVDT41-EP Memorystick interconnect extender chipset 125 3.3 4 TX/1 RX 25 20TSSOP
SN75976A-EP 9-channel differential transceiver 20 5 9 TX/9 RX 10, 45, 60 56TSSOP
TFP401A-EP PanelBus DVI receiver 165 MHz, HSYNC fix 495 3.3 3 RX 400 100HTQFP
TFP410-EP PanelBus digital transmitter 495 3.3 3 TX 250 64HTQFP
TL16C752B-EP 3.3-V dual UART with 64-byte FIFO 3 3.3 2 TX/2 RX 20 48LQFP
Gates
Device Description Vcc Range
(V) Voltage
Nodes (V) IOL
(mA)
tpd Max (ns)
No. of Gates
IOH (mA)
ICC (uA)
Output Drive (mA)
Pin/Package(s)
Single Input Gates
SN74AHC1G02-EP Single 2-input positive-NOR gate 2 to 5.5 — 8 — — -8 10 — 5SC70
SN74AHC1G86-EP Single 2-input exclusive-OR gate 2 to 5.5 — 8 — 1 -8 10 — 5SC70
SN74LVC1G00-EP Single 2-input positive-NAND gate 1.65 to 5.5 1.8, 2.5, 3.3, 5 32 4 — -32 10 — 5SC70,
5SOT-23
SN74LVC1G02-EP Single 2-input positive-Nor gate 1.65 to 5.5 — — — 1 — 10 — 5SC70
SN74LVC1G08-EP Single 2-input positive-AND gate 1.65 to 5.5 1.8, 2.5, 3.3, 5 32 4 — -32 10 — 5SC70,
5SOT-23
SN74LVC1G11-EP Single 3-input positive-AND gate 1.65 to 5.5 — 32 5.9 1 -32 10 24 6SC70
SN74LVC1G32-EP Single 2-input positive-OR gate 1.65 to 5.5 1.8, 2.5, 3.3, 5 32 4 — -32 10 — 5SC70,
5SOT-23
SN74LVC1G86-EP Single 2-input exclusive-OR gate 1.65 to 5.5 — 32 — 1 -32 10 — 5SC70
➔
24High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Gates (continued)
Device Description Vcc Range
(V) Voltage
Nodes (V) IOL
(mA)
tpd Max (ns)
No. of Gates
IOH (mA)
ICC (uA)
Output Drive (mA)
Pin/Package(s)
Dual Input Gates
SN74LVC2G00W-EP Dual 2-input positive-NAND gate 1.65 to 5.5 — 32 3.3 2 -32 10 — 8SM*
SN74LVC2G02-EP Dual 2-input positive-NOR gate 1.65 to 5.5 — 24 5.4 — -24 10 — 8US8
SN74LVC2G08-EP Dual 2-input positive-AND gate 1.65 to 5.5 — 24 4.8 2 -24 10 — 8US8
SN74LVC2G32-EP Dual 2-input positive-OR gate — — — — 2 — — 10 8US8
Triple Input Gates
SN74AC11-EP Triple 3-input positive-AND gate 2.0 to 6.0 5, 3.3 — 8 3 — — -24/24 14TSSOP
SN74HC10-EP Triple 3-input positive-NAND gate 2.0 to 6.0 6, 5, 2 — 19 3 — — -4/4 14SOIC, 14TSSOP
SN74LV11A-EP Triple 3-input positive-AND gate 2.0 to 5.5 5, 3.3, 2.5 — 7.9 3 — — -12/12 14TSSOP
Quadruple Input Gates
CD74ACT86-EP Quadruple 2-input exclusive-OR gate -0.5 to 6 — — — — — — 0.08 14SOIC
CD74HC08-EP Quadruple 2-input positive-AND gate 2 to 6 2, 4.5, 6 — 18 4 — — — 14SOIC
SN74AC08-EP Quadruple 2-input positive-AND gate 2.0 to 6.0 5, 3.3 — 7.5 4 — — -24/24 14SOIC
SN74AC32-EP Quadruple 2-input positive-OR gate 2 to 6 5, 3.3 — 7.5 4 — — -24/24 14SOIC
SN74ACT08-EP Quadruple 2-input positive-AND gate 4.5 to 5.5 5 — 10 4 — — -24/24 14SOIC
SN74AHC00-EP Quadruple 2-input positive-NAND gate 2.0 to 5.5 5, 3.3 — 9.5 4 — — -8/8 14SOIC, 14TSSOP
SN74AHC02-EP Quadruple 2-input positive-NOR gate 2.0 to 5.5 5, 3.3 — 8.5 4 — — -8/8 14TSSOP
SN74AHC08-EP Quadruple 2-input positive-AND gate 2.0 to 5.5 5, 3.3 — 9 4 — — -8/8 14SOIC, 14TSSOP
SN74AHC32-EP Quadruple 2-input positive-OR gate 2.0 to 5.5 5, 3.3 — 8.5 4 — — -8/8 14SOIC, 14TSSOP
SN74AHCT00-EP Quadruple 2-input positive-NAND gate 4.5 to 5.5 5 — 9 4 — — -8/8 14SOIC, 14TSSOP
SN74AHCT08-EP Quadruple 2-input positive-AND gate 4.5 to 5.5 5 — 9 4 — — -8/8 14SOIC, 14TSSOP
SN74AHCT32-EP Quadruple 2-input positive-OR gate 4.5 to 5.5 5 — 9 4 — — -8/8 14SOIC, 14TSSOP
SN74LV08A-EP Quadruple 2-input positive-AND gate 2.0 to 5.5 5, 3.3, 2.5 — 12 4 — — -12/12 14TSSOP
SN74LV32A-EP Quadruple 2-input positive-OR gate 2.0 to 5.5 5, 3.3, 2.5 — 12 4 — — 7.5 14TSSOP
SN74LV86A-EP Quadruple 2-input exclusive-OR gate 2 to 5.5 3.3, 2.5, 5 — 8.8 4 — — -12/12 14TSSOP
SN74ALVC00-EP Quadruple 2-input positive-NAND gate 1.65 to 3.6 3.3, 2.7, 2.5, 1.8 — 3 4 — — -24/24 14SOIC
SN74ALVC08-EP Quadruple 2-input positive-AND gate 1.65 to 3.6 3.3, 2.7, 2.5, 1.8 — 2.9 4 — — -24/24 14SOIC
SN74LVC08A-EP Quadruple 2-input positive-AND gate 2.0 to 3.6 3.3, 2.7 — 4.1 4 — — -24/24 14SOIC, 14TSSOP
SN74LVC86A-EP Quadruple 2-input exclusive-OR gate 2.0 to 3.6 3.3, 2.7 — 4.6 4 — — -24/24 14SOIC, 14TSSOP
SN74LVC00A-EP Quadruple 2-input positive-NAND gate 2.0 to 3.6 3.3, 2.7 — 4.3 4 — — -24/24 14SOIC, 14TSSOP
SN74LVC02A-EP Quadruple 2-input positive-NOR gate 2.0 to 3.6 3.3, 2.7 — 5.5 4 — — -24/24 14TSSOP
SN74LVC32A-EP Quadruple 2-input positive-OR gate 2 to 3.6 3.3, 2.7 — 3.8 4 — — -24/24 14SOIC, 14TSSOP
➔
25High Reliability Guide Texas Instruments 2010
Enhanced Products (EP)
Selection Tables
Specialty Logic
Device Description Sub Family Output Drive
(mA)
Vcc range
(V) Static
Current
Voltage Nodes
(V)
tpd Max (ns) Pin/Package
SN74LVTH182512-EP 3.3-V ABT, scan test device with 18-bit universal bus transceiver
Boundary Scan (JTAG) Bus Devices -32/64 2.7 to
3.6 24 3.3, 2.7 5.7 64TSSOP
SN74LVTH18502A-EP 3.3-V ABT, scan test device with 18-bit universal bus transceiver
Boundary Scan (JTAG) Bus Devices -32/64 2.7 to
3.6 24 3.3, 2.7 4.9 64LQFP
SN74LVTH18646A-EP 3.3-V ABT, scan test device with 18-bit universal bus transceiver
Boundary Scan (JTAG) Bus Devices -32/64 2.7 to
3.6 24 3.3, 2.7 4.7 64LQFP
SN74LVT8980A-EP Test-bus controller IEEE Std 1149.1 (Jtag) tap master Boundary Scan (JTAG) Support Devices — 2.7 to
3.6 — 3.3, 2.7 — 24SOIC
SN74LVT8996-EP 3.3-V ABT, 10-bit multidrop-addressable IEEE Std 1149.1 tap transceiver
Boundary Scan (JTAG) Support Devices — 2.7 to
3.6 — 3.3, 2.7 — 24TSSOP
SN74SSTV32852-EP 24- to 48-bit registered buffer with Sstl_2-inputs and outputs
DIMM Memory Drivers and Transceivers — — — 2.5 3.1 114BGA
MICROSTAR
SN74SSTV32867-EP 26-bit registered buffer with Sstl_2-inputs and LvCMOS outputs
DIMM Memory Drivers and Transceivers — — — — — 96LFBGA
SN74AHC123A-EP Dual retriggerable monostable multivibrator Monostable Multivibrators — 2 tp
5.5 — 5, 3.3 — 16SOIC
SN74LV123A-EP Dual retriggerable monostable multivibrator Monostable Multivibrators — 2 to
5.5 — 5, 3.3, 2.5 — 16TSSOP
SN74V263-EP 8192 X 18 synchronous FIFO memory Synchronous FIFOs -2/8 3.15 to 3.45 — 3.3 — 80LQFP
SN74V273-EP 16384 X 18 synchronous FIFO memory Synchronous FIFOs -2/8 3.15 to 3.45 — 3.3 — 80LQFP
SN74V283-EP 32768 X 18 synchronous FIFO memory Synchronous FIFOs -2/8 3.15 to 3.45 — 3.3 — 80LQFP
SN74V293-EP 65536 X 18 synchronous FIFO memory Synchronous FIFOs -2/8 3.15 to 3.45 — 3.3 — 80LQFP
Gates (continued)
Device Description Sub Family
tpd Max (ns) Configuration
# of Channels
ron(Max) (ohms)
Vcc range
(V) ICC (uA)
Voltage Nodes
(V) Pin/
Package
Signal Switches
CD74HC4051-EP High-speed CMOS logic analog multiplexer/demultiplexer
Analog Switches and Multiplexers (less than or equal to 5V)
60 1 X 1:8 MUX 8 180 — — 2, 4.5, 6 16SOIC
SN74LV4051A-EP 8-channel analog multiplexer/demultiplexer
Analog Switches and Multiplexers (less than or equal to 5V)
7 1 X 1:8 MUX 8 190 2.0 to 5.5 20 5, 3.3,
2.5 16SOIC,
16TSSOP
SN74LV4052A-EP Dual 4-channel analog multiplexer/demultiplexer
Analog Switches and Multiplexers (less than or equal to 5V)
8 2 X 1:4 MUX 4 190 2.0 to 5.5 20 5, 3.3,
2.5 16SOIC,
16TSSOP
SN74LV4053A-EP Triple 2-channel analog multiplexer/demultiplexer
Analog Switches and Multiplexers (less than or equal to 5V)
16 3 X SPDT 2 190 2.0 to 5.5 20 5, 3.3,
2.5 16SOIC,
16TSSOP
TS5A3159-EP 1-Ohm Spdt analog switch Analog Switches and Multiplexers (less than or equal to 5V)
— 1 X SPDT 1 1.3 1.65 to 5.5 0.01
1.8, 2.5, 3.0, 3.3,
5.0 6SOT-23
SN74CBTLV3257-EP Low-voltage, 4-bit, 1-Of-2 FET multiplexer/demultiplexer
Digital Bus Exchange/Multiplexing Switches — — — 7 2.3 to
3.6 10 3.3, 2.5 16TSSOP
26High Reliability Guide Texas Instruments 2010
➔
Space
Overview
TI-HiRel Radiation-Tolerant Space ProductsTo support the demanding nature of space applications, TI HiRel has introduced MILPRF-38535 radiation-tolerant products to our extensive qualified manufacturer listing (QML) Class V family.
Benefits of TI HiRel QML Class V Products:
• Broadproductoffering
• Designer-drivenportfolio
• High-performancedevices
• Latestavailabletechnology
• Radiationreportsavailable upon request
Potential Applications:
• Commercialanddefense space-based systems
• Dataprocessing
• Flightcriticalcontrolsystems
• Gaschromatographs
• Particledetectors
• Photometers
• Space-basedimagingandsurveillance
• Spectrometers
• Waveanalyzers
For more information on TI-HiRel space products, see www.ti.com/space.
Radiation EffectsHigh-energy protons, electrons and charged particles in natural space environments can strongly affect the operation of electronic circuits used in space applications.
Radiation is energy in transit, taking the form of high-speed particles and electromagnetic waves. We encounter electromagnetic waves every day. They make up our visible light, radio and television waves, ultraviolet (UV) light and microwaves with a large spectrum of energies. These examples of electromagnetic waves do not cause ionizations of atoms because they do not carry enough energy to separate molecules or remove electrons from atoms.
Ionizing radiation is radiation with enough energy so that during an interaction with an atom, it can remove tightly bound electrons from their orbits, causing the atom to become charged or ionized. Examples are gamma rays, protons and neutrons.
The most common radiation requirement in the aerospace design community is total ionizing dose (TID), also known as total dose. Total
dose irradiation is primarily caused by electrons and protons that penetrate into the silicon and can result in device degradation and/or device failure.
Charge buildup affects the current-voltage characteristics of transistors used in semiconductor circuits. Proper operation of a transistor relies on the ability to switch it from a low-conductance (off) state to a high-conductance (on) state as the gate voltage passes through a threshold. Extended exposure to radiation can shift the threshold voltages making the transistors easier or harder to switch. Radiation may also increase the leakage current, causing the on and off states of the transistors to become less distinguishable. Either effect can ultimately cause circuit failure. HiRel performs total dose testing on all space-qualified, QML Class V new product releases in order to determine how much radiation our devices can absorb before device degradation occurs. The test results for each device are available on request.
➔
27High Reliability Guide Texas Instruments 2010
Space
Overview
Single-event effectsAlthough total dose is the most common measure of radiation tolerance used in the industry, single-event effects, or SEE, rank as the number-one concern for space system designers. There are three common SEEs. The first is single-event upset, or “SEU.” In digital devices an SEU results in a bit flipping states from “1” to “0” or “0” to “1,” whereas in analog devices, an electrical transient can propagate through the signal chain, causing electrical errors or worse.
The second SEE is a single event latch-up, which can lead to severe disruption or even catastrophic device failure. Once a device latches, it can be recovered if caught soon enough, but only by powering down the system within approximately 500 mS of latch-up.
If not, the unchecked increase in current flow will result in the third SEE, which is single-event burnout. All of these failure modes are difficult enough to diagnose in terrestrial-based applications, but in a closed system such as a satellite can result in a very expensive repair trip.
TI’s complementary bipolar (BiCOM) processes are manufactured using “silicon over insulator,” deep-trench isolated wafer construction techniques that result in devices that are inherently immune to latch-up.
Radiation test servicesTI offers additional radiation test characterization services to accommodate specific program requirements.
• ELDRSandSEEtesting • Promptdosecharacterization
Radiation test methodTo assure reliable performance under the aforementioned environmental conditions, the HiRel space product line is thoroughly tested for radiation performance as part of the qualification process. The flow diagram shown here illustrates the HiRel radiation test procedure.
The devices are electrically tested before irradiation, with parametrics recorded and datalogged for later comparison. Devices are electrically biased in specialized fixtures within the radiation chamber and exposed to a predetermined radiation level. They are then electrically tested after irradiation
to determine if degradation or device failure has occurred. If no measurable degradation has occurred, the devices are irradiated again at a higher dose level and tested once more. This process repeats until the devices fail or reach the maximum predetermined radiation level.
Start
End
Pre-radmeasurements
Record Data
Record Data
Device Failure
Irradiate sample underbias conditions
Increment Dose
YesNo
Radiation test method
Logic
DataConverter
Clocks & Timing
Power Management
EmbeddedProcessing
DataConverter
Low-PowerRFInterface
Amplifier
Amplifier
Temperature
Pressure
Position
Speed
Flow
Humidity
Sound
Light
Identification
The RealWorld
TI space solutionsTI has radiation-tolerant, hermetically packaged devices released for each one of the blocks shown in the block diagram.
➔
28High Reliability Guide Texas Instruments 2010
Space
Data Converters
001
PhaseDetector
LoopFilter
VariableDelay
÷2 ÷2
2.4GspsDAC
001001
InputRegisters
Demuxand
Format
DA_P[13:0]
DA_N[13:0]
DB_P[13:0]
DB_N[13:0]
DLYCLK_P
DLYCLK_N
DTCLK_P
DTCLK_N
P_KLCCA
D
N_KLCCA
D
BandgapRef
REFIO_IN
REFIO
RBIASOUTRBIASIN
CSBIASCSBIAS_IN
IOUT_P
IOUT_N
BTH_S
DVL
INV_CLK
LAMR
ON
YLN
O_A
VNI_YL
NO_A
SZ_YLN
O_A
RESTARTLOCK
SLEEP
001
LoopFilter
VariableDelay
÷2 ÷2
2.4Gsps14-bit
DAC
001001
InputRegisters
Demuxand
Format
_ _
BandgapRef
_
The DAC5670-SP is a 14-bit, 2.4-GSPS digital-to-analog converter (DAC) with dual demultiplexed differential input ports. The DAC5670-SP is clocked at the DAC sample rate and the two input ports run at a maximum of 1.2 GSPS. An additional reference bit input sequence is used to adjust the output clock delay to the data source, optimizing the internal data latching clock relative to this reference bit with a delay lock loop.
Functional block diagram DAC5670-SP
Digital-to-Analog ConverterDAC5670-SPGet samples, datasheets, and evaluation modules at: www.ti.com/sc/device/DAC5670-SP
Key Features
• Radiationperformance: TID = 150kRad (Si)
• 3.3-Vanalogsupplyoperation
• 2-Wpowerdissipation
• 5-mAto30-mAdifferentialscalablecurrent outputs
•On-chip1.2-Vreference
• 192-ballCBGA(GEM)package
•QML-Vqualified,SMD5962-07247
• Defensetemperaturerange-55°Cto125°C
Applications
•Orbitaldataprocessing
• Point-to-pointmicrowave
• Radarandsatellitecommunications
• Space-basedcriticalcontrolsystems
The ADS5463-SP is a 12-bit, 500-MSPS analog-to-digital converter (ADC) that operates from both a 5-V supply and 3.3-V supply, providing LVDS-compatible digital outputs from the 3.3-V supply. The input buffer isolates the internal switch-ing of the onboard track and hold from disturbing the signal source while providing a high-impedance input.
Analog-to-Digital ConverterADS5463-SP Get samples, datasheets, and evaluation modules at: www.ti.com/sc/device/ADS5463-SP
Key Features
• Radiationperformance: TID = 150kRad (Si)
• SNR>64.5dBFSat450MHz and 500 MSPS
• 2.2-VPPdifferentialinputvoltage
• 2.2-Wtotalpowerdissipation
•On-chipanalogbuffer,trackandhold and reference circuit
• 84-pinceramicnonconductive tie-bar package (HFG)
• Defensetemperaturerange -55°C to 125°C
Applications
•Orbitalcommunication
•Orbitalcontrolsystems
• Spacecraftcommunications
Functional block diagram ADS5463-SP
AV DD DVDD
OVR OVR DRY
5
+ +
– –
5 5
D[12:0] GND
AIN
AIN
VREF
CLK
CLK
TH1A1 A2TH2
ADC1 DAC1 ADC2
ADC3
DAC2
TH3 A3
Reference
Timing Digital Error Correction
DRY
➔
29High Reliability Guide Texas Instruments 2010
Space
Interface
The TLK2711-SP is a member of the WizardLink transceiver family of multi-gigabit transceivers, intended for use in ultra-high-speed, bidirectional, point-to-point data transmission systems. The TLK2711-SP supports an effective serial interface speed of 1.6 Gbps to 2.5 Gbps, providing up to 2 Gbps of data bandwidth. The primary application of this transceiver is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled imped-ance media of approximately 50Ω.
LOOPEN
RXN
RXP
BIAS PRE
RecoveredClock
TXP
TXN
RXCLK
RKMSB
RKLSB
TXD0−TXD15
9
9
RXD0−RXD15
PRBSVerification
ClockSynthesizer
Interpolator andClock Recovery
ENABLE
10
PRBSEN
TESTEN
10
10
Controls:PLL, Bias, RX,
TX
8b/1
0bEn
code
r
18 B
itR
egis
ter
Enco
der
18 B
itR
egis
ter
PRBSGenerator
MUX
TXCLK
2:1MUX
Parallel toSerial10
2:1MUX
2:1MUX
Serial toParallel101:2
MUX
10
10
9
9
2:1MUX
Data
CommaDetect
and 8b/10bDecoding
10
CommaDetect
and 8b/10bDecoding
Signal Detect(LOS)
TKLSB
PRBSEN
TKMSB
PRBSEN
PRBSEN
Clock
8b/1
0b
Functional block diagram TLK2711-SP
SerDes Interface TransceiverTLK2711-SPGet samples, datasheets, evaluation modules and application reports at: www.ti.com/sc/device/TLK2711-SP Key Features• Radiationperformance:
TID = 40kRad (Si)
• Hot-plugprotection
• High-performance68-pinceramicquad flat pack package (HFG)
• Low-poweroperation
• InterfacestoPCBs,coppercablesorfiber-optic cable
•On-chipPLLprovidesclocksynthe-sis from low-speed reference
• Receiverdifferentialinputthresholds200-mV minimum
• Lowpower:<500mW
• Idealforhigh-speedbackplaneinter-connect and point-to-point data link
Applications• Flightcriticalcontrolsystems
• Launchvehicles
• Satellitecommunications
• Space-basedimagingand surveillance
➔
30High Reliability Guide Texas Instruments 2010
Space
Clocks
The CDCM7005-SP high-performance, low-phase noise and low-skew clock synchronizer synchronizes a voltage-controlled crystal oscillator (VCXO) or voltage-controlled oscillator (VCO) frequency to one of two reference clocks. The CDCM7005-SP can lock to one of two reference clock inputs and supports frequency hold-over mode and fast frequency locking for fail-safe and increased system redundancy.
PECLto
LVCMOS
N
PECLINPUT
CTRL_LECTRL_DATACTRL_CLK
VCXO_IN
VCXO_IN
CP_OUT
PLL_LOCK
STATUS_VCXO/
STATUS_REF/PRI_SEC_CLK
I_REF_CP
RESET orHOLD
PD
V 1.3VCC –VBB
VCC_CPVC
GND
PRI_REF
SEC_REF
REF_SEL
RE
F_M
UX
LVCMOS
FB_MUX
LVCMOS
Y0B
Y0ALV
CMOS
LVPECL
LVCMOS
Y1B
Y1ALV
CMOS
LVPECL
LVCMOS
Y2B
Y2ALV
CMOS
LVPECL
LVCMOS
Y3B
Y3ALV
CMOS
LVPECL
LVCMOS
Y4B
Y4ALV
CMOS
LVPECL
Automatic
CurrentReference
ReferenceClock
N 212
P Divider
/8
90o
90o
LOCK
ChargePumpPFD
Y0_
MU
X
HOLD
P16-Div
M 10
FeedbackClock
Y1_
MU
XY
2_M
UX
Y3_
MU
XY
4_M
UX
AVCC
Functional block diagram CDCM7005-SP
Clock Synchronizer/Jitter CleanerCDCM7005-SP Get samples, datasheets, evaluation modules and application reports at: www.ti.com/sc/device/CDCM7005-SP Watch our video “Clocking a High-Speed ADC”.
Key Features• Radiationperformance:
TID = 50kRad (Si)
• Tworeferenceclockinputs(primaryand secondary clock) for redundancy support with manual or automatic selection
• AcceptsLVCMOSinputfrequenciesup to 200 MHz
• VCXOINoperatingfrequenciesupto2.2 GHz (LVPECL)
• UptofivedifferentialLVPECLout-puts or up to 10 LVCMOS outputs
• Frequencyisindividuallyselectableon each output
• SPI-controllabledevicesetting
• 3.3-Vpowersupply
• High-performance52-pinceramicquad flat pack (HFG)
Applications• High-speeddataacquisitionand
generation
•MRI:magneticresonanceimaging
•Orbitaldataaquisition
• Satellitecommunications
• Softwaredefinedradio(SDR)
• Space-basedimaging&surveillance
• Spacecraftwirelessinfrastructure
• Ultrasoundsystem
• X-ray:baggagescanner
• X-ray:medical
➔
31High Reliability Guide Texas Instruments 2010
Space
Digital Signal Processor
The C6701 DSP is based on TI’s high-performance VelociTI™ very-long-instruc-tion-word architecture, making it ideal for multichannel, multifunction applications. The C6701 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. This processor has 32 general-purpose registers of 32-bit word lengths and eight highly independent functional units.
The land grid array (LGA) package configuration is designed for column attachment, yielding a column grid array (CGA) package.
The LGA facilitates ease of socketing for testing before column attachment, giving designers a choice in vendors for column attachment and the flexibility to specify column width and column length.
Prog
ram
ControlLogic
Test
C67x CPU
Data Path B
B Register File
ProgramAccess/Cache
Controller
Instruction Fetch
Instruction Dispatch
Instruction Decode
Data Path A
A Register File
DataAccess
ControllerPower-DownLogic
.L1† .S1† .M1† .D1 .D2 .M2† .S2† .L2†
32
ROM/FLASH
SRAM
I/O Devices
16
Timer 0
Timer 1
External MemoryInterface (EMIF)
MultichannelBuffered Serial
Port 0
MultichannelBuffered Serial
Port 1
Direct MemoryAccess Controller
(DMA)(4 Channels)
Host PortInterface
(HPI)
Internal Program Memory1 Block Program/Cache
(64K Bytes)
ControlRegisters
Internal DataMemory
(64K Bytes)2 Blocks of 8 Banks
Each
In-CircuitEmulation
InterruptControl
Framing Chips:H.100, MVIP,SCSA, T1, E1
AC97 Devices,SPI Devices,Codecs
DM
A B
uses
Dat
a B
usC6701 Digital Signal Processor
PLL(x1, x4)
Bus
SBSRAM
SDRAM
HOST CONNECTIONMC68360 GluelessMPC860 GluelessPCI9050 Bridge + InverterMC68302 + PALMPC750 + PALMPC960 (Jx/Rx) + PAL
† These functional units execute floating-point instructions.
Functional block diagram C6701-SP
Floating-Point DSPSMJ320C6701-SP Get samples, datasheets, evaluation modules and application reports at: www.ti.com/sc/device/SMJ320C6701-SP Key Features• Radiationperformance:
TID = 100kRad (Si)
• 1GFLOPperformanceata 167-MHz clock rate
•QualifiedtoQMLClass-V MIL-PRF-38535 standards
•Operatingtemperatureranges
• Extended (W) -55°C to 115°C
• TwoMACspercycleforatotalof334 million MMACs
• 1MBon-chipSRAM
• 64KBblockofprogrammemoryconfigurable as cache or memory-mapped program space
• Peripherals:
• Two McBSPs
• Two general-purpose timers
• HPI
• Glueless EMIF
Applications•Multichannelandmultifunction
applications
➔
32High Reliability Guide Texas Instruments 2010
Space
Power Management/Selection Tables
Unitrode Radiation Improvement Releases
Device SMD Orderable Description
UC1825J-SP/FK-SP 5962-8768104VEA/V2A Dual output, 1-MHz voltage/current mode PWM Controller
UC1825AJ-SP 5962-8768105VEA Dual output, 1-MHz voltage/current mode PWM Controller
UC1525BFK-SP 5962-8951106V2A Dual output, 250KHz voltage mode PWM Controller
UC1846J-SP/FK-SP 5962-8680603VEA/V2A Dual output, 500KHz voltage/current mode PWM Controller
UC1843AJG-SP 5962-8670409VPA Single ended, 500KHz voltage/current mode PWM Controller
UC19432-SP TBD Precision analog controller
UC1637-SP 5962-8995701VSA Switched-mode controller for DC motor drive
AC Logic Family Releases
Device SMD Orderable Description
SN54AC14-SP 5962-8762402VDA Hex Inverter, Schmitt Trigger
SN54AC02-SP 5962-8761203VDA Quadruple 2-Input Positive-NOR Gates
SN54AC00-SP 5962-8754903VCA Quadruple 2-Input Positive-NAND Gates
Enhanced low-dose-rate sensitivity (ELDRS) has become an issue in total dose radiation-tolerant analog applica-tions. To help mitigate this effect, TI improved the radiation performance on its UC18xx power management devices to achieve > 40kRad (Si) toler-ance to low-dose-rate radiation.
TI also released new versions of its AC logic device family, which reach total irradiated dose levels of 100 Krads. These improvements provide lower leakage current and improve radia-tion performance for high-temperature aerospace applications.
Unitrode UC18xx PWM Controllers and AC Logic Devices. Get samples, datasheets, evaluation modules at: www.ti.com/sc/device/space
Device SMD Orderable Description
VI/O (25 ºC)
(Max) (mV)
Vs (Max)
(V) Lib
(Max)
Slew Rate (typ)
(V/µs)
GBW (typ)
(MHz) Packages
LM124-SP 5962-7704301VCA Quadruple op amp, 4 channels 3 32 50 nA 100 1.2 14-CDIP
THS4511-SP 5962-0722201VFA Rad-tolerant Class V, wideband, fully differential amplifier, 100 MHz, 1 channel 4 5.25 20 uA 5100 1100 16-CFP
THS4513-SP 5962-0722301VFA Rad-tolerant Class V, wideband, fully differential amplifier, 100 MHz, 1 channel 5 5.5 20 uA 5100 1100 16-CFP
Device SMD Orderable Description Channels tRESP Low to High (µs) VS (Min) VS (Max) Output Type Package
LM139-SP 5962-7700801VCA Quad differential comparator 4 0.3 2 30 Open collector 14-CDIP
Comparator
Operational Amplifiers
Device SMD Orderable Description
SampleRate
(MSPS)SNR(dB)
SFDR(dB)
DNLLSB
INLLSB
SupplyVoltage
(V)Power(mW) Packages
ADS5424-SP 5962-0720601VXC 100kRad tolerant class V, 14-bit, 105-MSPS ADC w/one input channel 105 64 65.4 1.5 6.9 4.75, 5.25 1900 52-CFP
ADS5444-SP 5962-0720701VXC 100kRad tolerant class V, 13-bit, 250-MSPS ADC w/one input channel 250 6.5 60.5 2 4.8 4.75, 5.25 2000 84-CFP
ADS5463-SP 5962-0720801VXC 100kRad tolerant class V, 12-bit, 500-MSPS ADC w/one input channel 500 62.2 51.6 1.2 2.9 4.75, 5.25 2425 84-CFP
➔ Selection Tables
Analog-to-Digital Converters
➔
33High Reliability Guide Texas Instruments 2010
Space
Selection Tables
Device SMD Orderable Description Operating Supply
Current (mA) VIN (Min)
(V) VIN (Max)
(V) Reference Voltage (V) Tolerance (%) Package
UC1901-SP 5962-8944101VCA Isolated feedback generator 5 4.5 40 1.5 1 14-CDIP
Device SMD Orderable Description Idrive (Max) (mA) VO (Min) (V) VIN (Max) (V) Packages
UC1832-SP 5962-9326501VCA/V2A Precision low-dropout linear controller 100 2 40 14-CDIP, 20-LCCC
UC1834-SP 5962-8774201VEA/V2A High-efficiency linear regulator 200 1.5 40 16-CDIP, 20-LCCC
LDO Controllers
Device SMD Orderable Description ESD HBM (kV) Packages
SN55182-SP 5962-7900801VXA Rad-tolerant Class V dual differential line receiver 2 14-CDIP, CFP
SN55183-SP 5962-7900901VCA Rad-tolerant Class V dual differential line driver 2 14-CDIP
SN55LVDS31-SP 5962-9762101VFA 100kRad tolerant quad LVDS transmitter 8 16-CFP
SN55LVDS32-SP 5962-9762201VFA 100kRad tolerant quad LVDS receiver 8 16-CFP
SN55LVDS33-SP 5962-0724801VFA 100kRad tolerant high-speed differential receiver 15 16-CFP
TLK2711-SP 5962-0522101VXC 1.6- to 2.5-Gbps, low-power serializer/deserializer 2 HFG
Interface
Feedback Signal Generator
Contact a Product Information Center near you for ELDRS free version. Contact information on back.
Contact a Product Information Center near you for ELDRS free version. Contact information on back.
Device SMD Orderable Description Input levelOutput Frequency
(Max) (Mhz)Output Level
VCC (V)
No. of Outputs Package
CDCM7005-SP 5962-0723001VXC 3.3-V, high performance rad-tolerant class V, clock synchronizer and jitter cleaner
LVCMOS, LVPECL 1500 LVPECL,
LVCMOS 3.3 5 52-HFG
Digital-to-Analog Converters
Power Supply Controllers
Device SMD Orderable Description VIN (Min)
(V) VIN (Max)
(V) Duty Cycle (Max)(%)
PWM Outputs (#) Packages
UCC1805-SP 5962-9451305VPA Low-power BiCMOS current-mode PWM 3.6 12 50 1 8-CDIP
UCC1806-SP 5962-9457501VEA/V2A Low-power, dual-output, current-mode PWM controller 6.75 15 50 2 16-CDIP, 20-LCCC
UC1823A-SP 5962-8990502VEA/V2A High-speed PWM controller 8.4 22 100 1 16-CDIP, 20-LCCC
UC1842-SP 5962-8670401VPA/VXA Current-mode PWM controller 10 30 100 1 8-CDIP, 20-LCCC
UC1842A-SP 5962-8670405VPA/VXA Current-mode PWM controller 10 30 100 1 8-CDIP, 20-LCCC
UC1844-SP 5962-8670403VPA/VXA Current-mode PWM controller 10 30 50 1 8-CDIP, 20-LCCC
UC1844A-SP 5962-8670407VPA/VXA Current-mode PWM controller 10 30 50 1 8-CDIP, 20-LCCC
UC1845-SP 5962-8670404VPA/VXA Current-mode PWM controller 7.6 30 50 1 8-CDIP, 20-LCCC
UC1845A-SP 5962-8670408VPA/VXA Current-mode PWM controller 7.6 30 50 1 8-CDIP, 20-LCCC
UC1863-SP 5962-9203103VEA/V2A Resonant-mode power-supply controller 7 22 50 2 16-CDIP, 20-LCCC
UC1875-SP 5962-9455501VRA/V3A Phase-shift resonant controller 9.25 20 100 4 20-CDIP, 28-LCCC
Contact a Product Information Center near you for ELDRS free version. Contact information on back.
Device SMD Orderable DescriptionSample/Update
Rate (MSPS)Settling
Time (µs)SNR(dB)
SFDR(dB)
DNLLSB
INLLSB
SupplyVoltage (V)
Power(mW) Packages
DAC5670-SP 5962-0724701VXA 14-bit, 2.4-GSPS DAC with two DAC channels 2400 0.0035 60 55 1.75 7.5 3.0, 3.6 2000 192-CBGA
DAC5675A-SP 5962-0720401VXC Class V, 14-bit, 400-MSPS DAC w/one DAC ch. 400 0.012 67 82 2.5 4.6 3.15, 3.6 660 52-CFP
Clocks
➔
34High Reliability Guide Texas Instruments 2010
Space
Selection Tables
Device SMD Orderable Description Output Current (A) VIN (Min) (V) VIN (Max) (V) Number of outputs (#) Packages
UC1611-SP 5962-9053801VPA/V2A Quad Schottky diode array 1 0 50 100 8-CDIP, 20-LCCC
Device SMD orderable Description Initial Accuracy
at 25°C (%) V0 Adj
(Min) (V)
V0 Adj (Max)
(V)
Min Iz for Regulation
(μA) Package
TL1431-SP 5962-9962001VPA 30kRad ELDRS free precision-adjustable (programmable) shunt reference 0.4 2.5 36 1000 8-CDIP
Schottky Diode Arrays
Shunt Voltage Reference
MOSFET Drivers
Device SMD Orderable Description Peak Output Current (A)
VIN (Min) (V)
VIN (Max) (V)
Number of Outputs (#) Packages
UC1705-SP 5962-9579801VPA Complementary high-speed power driver w/internal regulator 1.5 5 40 1 8-CDIP
UC1707-SP 5962-8761901VEA/V2A, 5962-0051401VPA Complementary high-speed power driver 1.5 5 40 2 8, 16-CDIP, 20-LCCC,
UC1708-SP 5962-0051401VEA/V2A Non-inverting high-speed power driver 3 5 35 2 16-CDIP, 20-LCCC
UC1709-SP 5962-0151201VPA Inverting high-speed MOSFET driver 1.5 5 40 2 8-CDIP
UC1710-SP 5962-0152001VPA Complementary high-current MOSFET driver 6 4.7 18 1 8-CDIP
Contact a Product Information Center near you for ELDRS free version. Contact information on back.
Device SMD Orderable Description VIN (Min)
(V) VIN (Max)
(V) Duty Cycle (Max)(%)
PWM Outputs (#)
Radiation Tolerance (TID [Si]) Packages
UC1825-SP 5962-8768101VEA/V2A High-speed PWM controller 8.4 22 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC
UC1525B-SP 5962-8951105VEA/V2A Regulating pulse-width modulator 8 35 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC
UC1825A-SP 5962-8768102VEA/V2A High-speed PWM controller 8.4 30 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC
UC1843-SP 5962-8670402VPA/VXA Current-mode PWM controller 7.6 30 100 1 40 KRad (ELDRS-free) 8-CDIP, 20-LCCC
UC1843A-SP 5962-8670406VPA/VXA Current-mode PWM controller 7.6 30 100 1 40 KRad (ELDRS-free) 8-CDIP, 20-LCCC
UC1846-SP 5962-8680601VEA/V2A Current-mode PWM controller 7 40 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC
Radiation-Tolerant PWM Power Supply Controllers
Digital Signal Processor
Device SMD Orderable Description DMA Core Supply
(V) I/O Supply
(V) Rating Timers Radiation Tolerance Packages
SMJ320C6701-SP 5962-9866102V Rad-tolerant, Class V, floating-point digital signal processor 4 1.9 3.3 Space (2) 32-bit 100kRad 429-CFCBGA,
429-FCLGA
Device SMD Orderable Description Packages
54ALS244-SP 5962-8683901 Octal buffer and line driver with 3-state outputs VRA, VSA
54LVT162244-SP 5962-9680901 3.3-V ABT, 16-bit buffer/driver with 3-state outputs VXA
54LVTH16244A-SP 5962-9668501 3.3-V ABT, 16-bit buffer/driver with 3-state outputs VXA
54HC244-SP 5962-8409601 Octal buffer and line driver with 3-state outputs VRA, VSA
54HCT244-SP 5962-8513001 Octal buffer and line driver with 3-state outputs VRA, VSA
54LVTH244A-SP 5962-9584401 3.3-V ABT, 16-bit octal buffer/driver with 3-state outputs V2A, VRA, VSA
54LVTH162245-SP 5962-9678001 3.3-V ABT, 16-bit bus transceiver with 3-state outputs VXA
54LVTH162373-SP 5962-9763801 3.3-V ABT, 16-bit transparent D-type latch with 3-state outputs VXA
54HC273-SP 5962-8409901 Octal D-type flip-flop VRA, VSA
Logic
To view more of our Logic portfolio for space applications, visit www.ti.com/space.
35High Reliability Guide Texas Instruments 2010
➔
High Temperature
Overview
Design considerationsThe Texas Instruments High Reliability (HiRel) group offers a wide range of semiconductors for use in High Temperature. Many applications need electronics that operate outside the typical industrial operating temperature range and even beyond the standard defense temperature range of -55°C to +125°C. These applications have special requirements for qualification and packaging. TI has developed semiconductors to satisfy the needs for quality and reliability in areas that need detailed characterization, operating life tests and special packaging.
High Temperature applications: •Oil and gas exploration and
production•Undersea cabling• Industrial•Medical•Aerospace
High temperatureTexas Instruments introduced a new line of devices that can withstand operating temperatures from -55°C to +210°C. These High Temperature (HT) offerings provide a solution to the needs of customers requiring extreme temperature operation for a variety of applications. TI HiRel continues to expand these offerings with new parts to provide a complete signal chain solution for customers.
High temperature offerings:•Standard off-the-shelf parts offering
-55°C to +210°C operation•High temperature characterization
+200°C•+200°C operation for 1,000 hours•Packaging
• Ceramic packages• Known good die
•Support for long product lifecycles•Standard HT datasheet
• High temp data• Operating life curve
•Small size and low-power offerings
For more information about TI’s HiRel and HT products, see www.ti.com/ht.
Featured ProductsHT ARM7TDMI(tm) Flash MicrocontrollerSM470R1B1M-HT
The SM470R1B1M(3) devices are members of the Texas Instruments SM470R1x family of general-purpose 16/32-bit reduced instruction set computer (RISC) microcontrollers. The B1M microcontroller offers high performance utilizing the high-speed ARM7TDMI 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The ARM7TDMI 16/32-bit RISC CPU views memory as a linear collection of bytes numbered upwards from zero. The SM470R1B1M utilizes the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest numbered byte.
Key Features• High-Performance Static CMOS
Technology • 60-MHz System Clock (Pipeline Mode) • Independent 16/32-Bit Instruction Set • Open Architecture With Third-Party
Support • Built-In Debug Module• 1M-Byte Program Flash • 64K-Byte Static RAM (SRAM) • Memory Security Module (MSM) • JTAG Security Module• Low-PowerModes:STANDBYandHALT
ApplicationsSupports extreme temperature applications • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Available in Extreme (–55°C/210°C)
Temperature Range(1)
Memory
SYSTEM Module
PeripheralLibrary
CAN
J1850 Digital
MibADC 10 -bit
SPI
CPU BusOscillator
PLL
Program Flash
DataRAM
WatchdogRTI
SCI
I2C
High End Timer
DMAI/Os / EBM
ECPIEM
SystemDecoder
MemoryProtection
ARM7TDMI
16-b
it Th
umb
Inst
ruct
ion
Set
Deco
mpr
essi
on
Registers
Shifter
Deb
ugM
odul
e
Addr . Registers
32- bit ALU-
INC
Multiplier
JTAG
Iin
terfa
ce
➔
➔
36High Reliability Guide Texas Instruments 2010
High Temperature
Featured Products
Quad/Octal, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters ADS1278-HT
Based on the single-channel ADS1271, the ADS1278 (octal) is a 24-bit, delta-sigma () analog-to-digital converter (ADC) with data rates up to 128 k samples per second (SPS), allowing simultaneous sampling of eight channels. Traditionally, industrial delta-sigma ADCs offering good drift performance use digital filters with large passband droop. As a result, they have limited signal bandwidth and are mostly suited for dc measurements. High-resolution ADCs in audio applications offer larger usable bandwidths, but the offset and drift specifications are significantly weaker than respective industrial counterparts. The ADS1278 combines these types of converters, allowing high-precision industrial measurement with excellent dc and ac specifications.
AVDD DVDD IOVDD
PDWN[8:1]
DOUT[8:1]
MODE[1:0]
FMAT[2:0]
IN1
IN2
IN3
IN4
SCLK
DRDY/FS
DIN
SYNC
TEST[1:0]
CLKDIV
CLK
Serial
Interface
AGND
REFNREFP
DGND
Control Logic
5V 1.8V - 3.3V1.8V
X 8
FIR Filters
With
Bypass Mode
IN5
IN6
IN7
IN8
ADS1278
Key Features• Simultaneously Measure Eight Channels • Up to 128-kSPS Data Rate • Linear Phase Digital Filter • SPI™ or Frame-Sync Serial Interface • Low Sampling Aperture Error • Modulator Output Option (digital filter
bypass) • Analog Supply: 5 V • Digital Core: 1.8 V • I/O Supply: 1.8 V to 3.3 V • Currently Available in an 84-Pin HFQ
Package and a KGD Chip tray Option
ApplicationsSupports extreme temperature applications •Controlled Baseline •One Assembly/Test Site •One Fabrication Site •Available in Extreme (–55°C/210°C)
Temperature Range(1)
➔
37High Reliability Guide Texas Instruments 2010
High Temperature
Featured Products
Low Noise, Very Low Drift, Precision Voltage ReferencesREF5025-HT
The REF5025 is a low-noise, low-drift, very high precision voltage reference. This reference is capable of both sinking and sourcing, and is very robust with regard to line and load changes. Temperature drift (20 ppm/°C) from –55°C to 210°C is achieved using proprietary design techniques. These features combined with very low noise make the REF5025 ideal for use in down-hole drilling applications.
Key Feature• Low Temperature Drift: 20 ppm/°C • Low Noise: 3 µVPP/V •High Output Current: ±7 mA ApplicationsSupports extreme temperature applications•Down-Hole Drilling •High Temperature Environments• Controlled Baseline •One Assembly/Test Site •One Fabrication Site •Available in Extreme (–55°C/210°C)
Temperature Range(1)
1.8-V Micropower CMOS Operational Amplifier Zero-Drift SeriesOPA2333-HT
The OPA2333 series of CMOS operational amplifiers uses a proprietary auto-calibration technique to simultaneously provide very low offset voltage and near-zero drift over time and temperature. These miniature, high-precision, low-quiescent-current amplifiers offer high-impedance inputs that have a common-mode range 100 mV beyond the rails, and rail-to-rail output that swings within 150 mV of the rails. Single or dual supplies as low as 1.8 V (±0.9 V) and up to
5.5 V (±2.75 V) may be used. They are optimized for low-voltage single-supply operation.Key Feature• Low Offset Voltage: 26 µV (Max) • 0.01-Hz to 10-Hz Noise: 1.5 µVPP •Quiescent Current: 50 µA •Single-Supply Operation •Supply Voltage: 1.8 V to 5.5 V •Rail-to-Rail Input/Output
ApplicationsSupports extreme temperature applications •Down-Hole Drilling •High Temperature Environments•Controlled Baseline •One Assembly/Test Site •One Fabrication Site •Available in Extreme (–55°C/210°C)
Temperature Range(1)
ADS8326
REF5025
REF
VOUT
GND
+IN
IN
VIN+5 V
OPA365
InputSignal
0 V to 4 V
5 V 5 V
VDD
GND
C1 F
BYPASS
R50
1
C1.2 nF
1
C22 F
2
R1VEX
VOUT
VREF
R1
OPA2333RR
R R+5V
➔
38High Reliability Guide Texas Instruments 2010
High Temperature Product PortfolioDevice Description Package
Amplifiers
OPA2333-HT 1.8-V Micropower CMOS Operational Amplifier Zero-Drift Series KGD, 8CFP
OPA211-HT Low Noise Precision Operational Amplifier KGD, 8CFP
Analog-to-Digital Converters
ADS1278-HT Octal, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters KGD, 84CQFP
Interface
SN65HVD233-HT 3.3-V CAN Transceiver KGD, 8CFP, 8CDIP
SN65HVD11-HT 3.3-V RS-485 Transciever KGD, 8CFP, 8CDIP
Processors
SM320F2812-HT 32-Bit Digital Signal Controller with Flash KGD, 172CQFP
SM470R1B1M-HT ARM7TDMI Flash Microcontroller KGD, 84CQFP
Power Management
TPS62000-HT High-Efficiency, Step-Down, Low-Power DC-DC Converter KGD, 10CFP
TPS76901-HT Single-Output LDO, 100-mA, Adjustable KGD, 8CFP
REF5025-HT Low-Noise, Very Low Drift Voltage Reference KGD, 8CFP
TPS40200-HT Wide-Input Non-Synchronous Buck DC/DC Controller KGD, 8CFP
Standard Ceramic HiRel Parts Used in High TemperatureDevice Description Package
Amplifiers
LM124J Quad Op Amp 14CDIP
LT1014AMJ Quad Precision Operational Amplifier 14CDIP
TL074MJB High-Speed, Low-Noise, JFET-Input Quad Operational Amplifier 14CDIP
TLC2272MJG Low-Noise Advanced LinCMOS Dual Operational Amplifier 8CDIP
TLE2022MJGB High-Speed, Low-Power Precision Dual Operational Amplifier 8CDIP
TLV2262MJGB Low-Voltage, Low-Power Advanced LinCMOS technology based (TM) Dual Op Amp 8CDIP
OPA2335AMJG 0.05-uV/C max, Single-Supply CMOS Operational Amplifier 8CDIP
Analog-to-Digital Converters
TLV5638MJGB Low-Power 12-bit Dual DAC 8CDIP
TLC2543MJ 12-Bit, 66 kSPS ADC Serial Out 20CDIP
Power Management
TLC7705MFKB Single Power SVS (5V) with Programmable Time Delay 20LCCC
UC1845J Current-Mode PWM Controller 8CDIP
UC1903J Quad Supply and Line Monitor 18CDIP
UCC1801J Low-Power BiCMOS Current-Mode PWM 8CDIP
UCC1806J Low-Power, Dual-Output, Current-Mode PWM Controller 16CDIP
Processors
SMJ320C30 Third Generation Digital Signal Processor KGD, 181CPGA, 196CFP
SMJ320C40 Fourth Generation Digital Signal Processor KGD, 325CPGA,352CFP
SM320F240HFPM40 16-bit, 5-V Fixed Point DSP with Flash 132 CQFP
High Temperature
Selection Tables
39High Reliability Guide Texas Instruments 2010
➔
Die/Wafer Solutions
Overview
Texas Instruments offers bare die/wafer solutions for applications that require higher levels of integration to reduce board space. TI provides a wide range of products in bare die and wafer form. A variety of testing and qualification options are available based on product maturity and complexity, as well as customer requirements.
Typical screening options include DC probe or AC/DC probe at temperature.
TI offers three categories of die screening:•Commercial wafers and die
• Standard TI wafer fabrication•Known good die (KGD)
• Stand-alone data sheet and warranted over temperature
•Customer-defined qualification• QML Class Q (MIL-STD)• QML Class V (Space)• Additional options available
Typical processing and capabilities include:•Mount and bond diagrams•Probed die – 55°C to +210°C or
special temp•Shipping: tape and reel, waffle
packs, custom trays, Gel-Pak•Sidewall and visual inspections
For more information regarding TI’s die and wafer offerings, visit www.ti.com/hirel or email [email protected].
Known Good DieDevice Description Tempature Range
OPA2348CKGD4 1-MHz, 45-µA, RRIO, dual operational amplifier (0/70°C)
LT1009MKGD1 2.5-V integrated reference circuit (–55°C/125°C)
TPS40200SKDG1 Wide-input, non-synchronous buck DC/DC controller (–55°C/210°C)
TPS62000SKGD1 High-efficiency, step-down, low-power DC/DC converter (–55°C/210°C)
TPS76901SKGD1 Ultra-low-power 100-mA low-dropout line regulator (–55°C/210°C)
REF5025SKGD1 Low noise, very low drift precision voltage reference (–55°C/210°C)
OPA211SKGD1 1.1-nV/rtHz noise, low-power precision operational amplifier (–55°C/210°C)
OPA2333SKGD1 1.8-V micropower CMOS operational amplifier zero-drift series (–55°C/210°C)
ADS1278SKGDA Octal, 144-kHz, simultaneous sampling 24-bit delta-sigma ADC (–55°C/210°C)
ADS1282SKGDA Ultra-high resolution delta-sigma ADC with PGA for seismic and energy exploration (–55°C/210°C)
INA129SKGD1 Precision low-power instrumentation amplifier (–55°C/210°C)
SN65HVD11SKGDA 3.3-V RS-485 transceiver (–55°C/210°C)
SN65HVD233SKGDA 3.3-V CAN transceiver (–55°C/210°C)
SM320F2812KGDS150A 32-bit digital signal controller with flash (–55°C/220°C)
SM470R1B1MKGDS1 16-/32-bit RISC flash microcontroller (–55°C/220°C)
40High Reliability Guide Texas Instruments 2010
➔
Defense
Overview
TI’sHighReliabilityDefense&Aerospace (TI HiRel) Group (CAGE code number 01295) was created in 1978 to serve the special requirements of the defense customer. Today, TI HiRel is one of the world’s largest ISO 9001 certified broad-line suppliers, operating as a dedicated business unit under TI’s corporate umbrella.
This position enables us to leverage the latest technology, manufactur-ing capability and product mix for advanced and critical aerospace and defense applications. TI HiRel offers a broad selection of semiconductor
technology, foundry services, compo-nents, advanced packaging and sup-port for specific requirements where reliability, qualification, vendor item drawings (VIDs), standard microcircuit drawings (SMDs) and baseline control are critical.
TI’s HiRel portfolio provides devices as enhanced products (EP) in plastic pack-ages and full military-class ceramic (QML) packages with extended operating-temperature ranges. We offer an expanding portfolio of QML Class Q and V (qualified to MIL-PRF- 38535) product lines with extended
temperature and radiation-tolerant operating ranges. Complexity ranges from a low-voltage single op amp to a complete system on a chip.
It is TI HiRel’s vision to be the world’s leading supplier of semiconductor-based products and services to the defense and aerospace markets, achieving customer satisfaction by providing innovative solutions through standard and differentiated inte-grated circuits. In order to meet this aggressive goal, we must continue to both meet and exceed customer expectations.
Featured Products➔
3-V to 5.5-V, 12-Bit, 200-kSPS, 4-/8-Channel, Low-Power Serial Analog-to-Digital ConverterTLV2548M
Digitization
RFTransmit
Radar
RadarReceiver
ADC
DACSDRAM FIFO
Data CorrectionProcessor
Flash/EPROM
ImageProcessor
SupportLogic
Image Processing
System Control
System Communication
Display
BusInterface
SystemProcessor
SupportLogic
ADC
SupportLogic
CommunicationsProcessor
VRAM VRAM ASIC
DisplayProcessor
CommunicationsRS-465, 1394, LVDS, SerDes
LCD DisplayDrivers
RAMDAC
CRT
FPDJTAGPower Management
Key Features•Maximum throughput 200 kSPS•Built-in reference, conversion clock
and 8x FIFO•Differential/integral nonlinearity error:
±1.2 LSB at –55°C to 125°C•Signal-to-noise and distortion ratio:
65 dB, fi = 12 kHz at –55°C to 125°C•Spurious-free dynamic range: 75 dB,
fi = 12 kHz•SPI-/DSP-compatible serial
interfaces with SCLK up to 20 MHz•Single wide-range supply: 3 VDC to
5.5 VDC•Analog input range: 0 V to supply
The TLV2548M is a high-performance, 12-bit, low-power, 3.5-µs CMOS analog-to-digital converter (ADC) operating from a single 3-V to 5.5-V power supply. This device has three digital inputs and a three-state output (chip select [CS], serial input/output clock [SCLK], serial data input [SDI], and serial data output [SDO]) that provide a direct four-wire interface to the serial port of most popular host microprocessors (with an SPI interface). For interface with a DSP, a frame sync (FS) signal is used to indicate the start of a serial data frame.
voltage with 500-kHz BW• Low operating current:
• 1 mA at 3.3 V• 1.7 mA at 3.3 V• 2 mA at 5.5 V with external ref• 2.4 mA at 5.5 V with internal ref
•Power down:• Software/hardware power-down
mode (1 µA typ, ext ref)• Auto power-down mode (1 µA typ,
ext ref)•Programmable auto-channel sweep
➔
41High Reliability Guide Texas Instruments 2010
Defense
Featured Products
Defense Digital Signal ProcessorSMJ320F2812
The SMJ320F2812 device, member of the TMS320C28x™ DSP generation, is a highly integrated, high-performance solution for demanding control applications.
Key Features• High-performance static CMOS
technology• 150 MHz (6.67-ns cycle time)• Low power (1.8-V core at 135 MHz,
1.9-V core at 150 MHz, 3.3-V I/O)• 3.3-V flash voltage• JTAG boundary-scan support• High-performance 32-bit CPU (C28x™
DSP)• 16 x 16 and 32 x 32 MAC operations• 16 x 16 dual MAC• Harvard bus architecture• Atomic operations• Fast interrupt response and
processing• Unified memory programming model• 4M linear program address reach• 4M linear data address reach• Code-efficient (in C/C++ and
assembly)• TMS320F24x/LF240x processor,
source-code compatible• On-chip memory
Seeker
Front-EndDown
Conversion
VRAM SDRAM FIFO
Data CorrectionProcessor
Flash/EPROM
ImageProcessor
SupportLogic
Image Processing
Seeker
ADC
CommunicationsRS-465, 1394, LVDS, SerDes
DataCommunications
Fin
Fin
Motor
Motor
Display
DisplayProcessor
RAMDAC
Flight Control
Host SystemProcessor
Navigation/Guidance
InertialMeasurement
GPS Processor
Boot-Load
EPROMFlash
SupportLogic
JTAGPower Management
Defense Floating-Point Digital Signal ProcessorSMJ320C40
Key Features•SMJ: QML processing to MIL-PRF-
38535•SM: Standard processing•TMP: Commercial-level processing
TAB•Operating temperature ranges:
• Defense (M): –55°C to 125°C• Special (S): –55°C to 100°C• Commercial (C): –25°C to 85°C• Commercial (L): 0°C to 70°C
•Highest-performance floating-point DSP
•Six communication ports•Six-channel direct memory access
(DMA) coprocessor •Single-cycle 1/x, 1/√–x•Twelve 40-bit registers, 8 auxiliary
registers, 14 control registers and 2 timers
SMJ320C40 digital signal processors (DSPs) are 32-bit, floating-point processors manufactured in 0.72-µm, double-level metal CMOS technology. They are part of the fourth-generation DSP family from TI and are designed primarily for parallel processing.
Digitization
RFTransmit
Radar
RadarReceiver
ADC
DACSDRAM FIFO
Data CorrectionProcessor
Flash/EPROM
ImageProcessor
SupportLogic
Image Processing
System Control
System Communication
Display
BusInterface
SystemProcessor
SupportLogic
ADC
SupportLogic
CommunicationsProcessor
VRAM VRAM ASIC
DisplayProcessor
CommunicationsRS-465, 1394, LVDS, SerDes
LCD DisplayDrivers
RAMDAC
CRT
FPDJTAGPower Management
➔
42High Reliability Guide Texas Instruments 2010
Defense
Analog Family
OverviewTI HiRel offers a strong mixed-signal and analog portfolio. The process/screening levels available include Department of Defense (DoD) and Defense Supply Center Columbus (DSCC) endorsed Standard Micro-circuit Drawing (SMD) and MIL-PRF- 38535 (QML), comprehending best commer cial practices. Mil-temp ceramic and enhanced products (EP) are also available.
Product Nomenclature (Typical Analog Products)Example: TLE2022AMJGBPrefix—TLESNJ = TI interface, MIL-PRF-38535
(QML)SN = commercial processingTL = TI linear control circuitTLC = TI LinCMOS™ technologyTLE = TI Excalibur™ technologyTLV = TI linear low voltageTPIC = TI intelligent powerAD = analog devices1
AM = advanced micro devices1
LM = National Semiconductor1
LT = linear technology1
OP = PMI1
SE = Signetics1
μA = Fairchild1
THS = TI high powerTPS = TI power supplyUnique Device Designator—2022AA or B in last position = upgradeTemperature Range—MM = –55°C to 125°C (applicable to all
TI prefixes except SNJ)Q = –40°C to 125°CI = –40°C to 85°CT = –40°C to 105°CPackage Type/Pin Count—JGDA = plastic small-outline package/28,
30, 32 or 38
FK = ceramic leadless chip carrier (CLCC)/20 or 28
GA = ceramic pin grid array/84HFG = ceramic flatpack/84 or 164J = ceramic DIP/8, 14, 16, 20 or 28JG = ceramic DIP/8U = ceramic flatpack/10W = ceramic flatpack/14 or 16WD = ceramic flatpack/56L = ceramic leadless chip carrier
(CLCC)/20 or 28PHP = plastic quad flatpack
PowerPAD™ integrated circuit package/48
PCE = plastic quad flatpack/144 or 160
PWP = plastic power TSSOP/14, 16, 20, 24 or 28
DW = plastic widebody (30 mil) SOIC/16, 20, 24 or 28
TCP = tape carrier package/customPFB = plastic quad flatpack/48Process Level—BBlank = standard suffix, commercial
processingB = MIL-PRF-38535 (QML)Enhanced Product—EPSelect enhanced products are available. The part numbers for those devices end in EP.
Product Nomenclature (TI-Unitrode Power Management Products)Example: UC1825BJ883BPrefix—UCUC = linear integrated circuitsUCC = BiCMOSPart Number—1825First digit “1” = defense temperature
range2
First digit “2” = industrial temperature range2
First digit “3” = commerical temperature range2
Optional Grades—BA or B = improved versionProcess Level—J883B3
J, JE = ceramic DIP (300 mil and 600 mil)
L, L20 = ceramic leadless chip carrier (CLCC)
Enhanced Product—EPSelect enhanced products are available. The part numbers for those devices end in EP.
1Second source.2Consult individual data sheets for specific temperature ranges on each part.3The “883B” designator was retained to be consistent with the original Unitrode naming convention.
➔
43High Reliability Guide Texas Instruments 2010
Defense
Analog Family
Analog-to-Digital Converters
Device BitsAnalog Input
ChannelsSupply Voltage
Range (V) Sample Rate
Output Interface
Type
V. Ref Internal/External
Power (Typ)(mW)
DNL (Max) (±LSB)
INL (Max) (±LSB) Package
THS1408M(5962-0051101NXD) 14 1 3.0 to 3.6 8 MSPS Parallel Int. 270 1 5 PHP (QML plastic)
THS1206M(5962-9957701NXD) 12 4 3.0 to 5.5 6 MSPS Parallel Int. 186 1 1.8 PWP (QML plastic)
TLC876M 10 1 4.5 to 5.2 20 MSPS Parallel Ext./Special 107 1 1.6 DW
TLC2543M 12 11 4.5 to 5.5 66 kSPS Serial Ext. 12 1 1 J, FK
TLV1548M 10 8 2.7 to 5.5 85 kSPS Serial Ext. 4 1 1 J, FK
TLV1543M 10 11 3.0 to 3.6 38 kSPS Serial Ext. 8 1 1 J, FK
TLC1542M 10 11 4.5 to 5.5 38 kSPS Serial Ext. 12 1 1 J
TLV2548M 12 8 2.7 to 5.5 200 kSPS Serial Int. or Ext. 9.5 1 1 FK
Digital-to-Analog Converters
Device BitsAnalog Input
ChannelsSupply Voltage
Range (V) Sample Rate
Output Interface
Type
V. Ref Internal/External
Power (Typ)(mW)
DNL (Max) (±LSB)
INL (Max) (±LSB) Package
TLV5638M 12 2 2.7 to 5.5 0.233 MSPS Serial Int. 7.5 to 22 1 4 JG, FK
TLC5618AM 12 2 4.5 to 5.5 0.093 MSPS Serial Ext. 9 1 4 JG, FK
TLV5618AM 12 2 2.7 to 5.5 0.093 MSPS Serial Ext. 5.4 1 4 JG, FK
TLV5619M 12 1 2.7 to 5.5 1 MSPS Parallel Int. 2.7 0.5 3 J, FK
Interface (Data Transmission)
DeviceDrivers/Receivers
Per PackagePropagationDelay
tpd (ns)ICC
(mA) Package
EIA-RS-422A, CCITT v.11
AM26LS32AM 0/4 35 70 J, FK, W
AM26LS33AM 0/4 35 70 J, FK, W
SN55173 0/4 35 70 J, FK
AM26C32M 0/4 27 15 J, FK, W
SN55LBC173 0/4 30 20 J, FK, W
SN55LBC175 0/4 30 20 J, FK, W
AM26C31M 4/0 12 3 J, FK, W
EIA-RS-232
SN55189A 0/4 85 26 J, FK, W
SN55188 4/0 350 34 J, FK, W
Miscellaneous Standards
SN55189A 0/4 85 26 J, FK, W
SN55188 4/0 350 34 J, FK, W
AM26C32M 0/4 RS-423 15 J, FK, W
AM26C31M 4/0 RS-423 3 J, FK, W
SN55976A1 9/9 SCSI 60/45 WD
AM26LS32AM 0/4 RS-423 70 J, FK, W
AM26LS33AM 0/4 RS-423 70 J, FK, W
SN55LBC173 0/4 RS-423 20 J, FK, W
SN55LBC175 0/4 RS-423 20 J, FK, W
SN55173 0/4 RS-423 70 J, FK
➔
44High Reliability Guide Texas Instruments 2010
Defense
Analog Family
Voltage-Mode Pulse-Width-Modulator (PWM) Controllers
Device
Maximum Practical
Freq.StartupCurrent
OperatingCurrent
SupplyVoltage
(V)
UVLO:On/Off
(V)
Maximum Duty Cycle
(%)SoftStart Shutdown
Drive (Sink/Source)
(A) Package Topology
TL5001 500 kHz 1.0 mA 20 mA 3.6 to 40 3.0/3.0 Prog. Yes No 0.02 8-JG, 20-FK For, fly, buck, boost
TL1451A 500 kHz 1.3 mA 20 mA 3.6 to 50 2.7/2.6 Prog. No No 0.02 16-JG, 20-FK For, fly, buck, boost
UC1524A 250 kHz 4 mA 5 mA 8 to 40 7.5/7 Prog. Yes Yes 0.2/0.2 16-J, 20-L Full, half bridge
UC1525A 450 kHz — 14 mA 8 to 35 7.0/6.8 Prog. Yes Yes 0.1/0.4 16-J, 20-FK For, fly, buck, boost, full, half bridge
UC1525B 450 kHz — 14 mA 8 to 35 7.0/6.8 Prog. Yes Yes 0.1/0.4 16-J, 20-FK For, fly, buck, boost, full, half bridge
UC1526 250 kHz — 14 mA 8 to 35 — Prog. Yes Yes 0.2/0.2 18-J, 20-L Full, half bridge
UC1527A 250 kHz — 14 mA 8 to 35 7.0/7.0 Prog. Yes Yes 0.2/0.2 16-J, 20-L Full, half bridge
Current-Mode PWM Controllers
Device
Maximum Practical
Freq.StartupCurrent
OperatingCurrent
SupplyVoltage
(V)
UVLO:On/Off
(V)
Maximum Duty Cycle
(%)SoftStart Shutdown
Drive (Sink/Source)
(A) Package Topology
UCC1800 1 MHz 100 μA 500 μA 7.2 to 15 7.2/6.9 100 Yes No 1.0/1.0 8-J, 20-L Buck, boost
UCC1801 1 MHz 100 μA 500 μA 9.4 to 15 9.4/7.4 50 Yes No 1.0/1.0 8-J, 20-L Buck, boost
UCC1802 1 MHz 100 μA 500 μA 12.5 to 15 12.5/8.3 100 Yes No 1.0/1.0 8-J, 20-L Forward, flyback
UCC1803 1 MHz 100 μA 500 μA 4.1 to 15 4.1/3.6 100 Yes No 1.0/1.0 8-J, 20-L Buck, boost
UCC1804 1 MHz 100 μA 500 μA 12.5 to 15 12.5/8.3 50 Yes No 1.0/1.0 8-J, 20-L Forward, flyback
UCC1805 1 MHz 100 μA 500 μA 4.1 to 15 4.1/3.6 50 Yes No 1.0/1.0 8-J, 20-L Forward, flyback
UCC1806 350 kHz 100 μA 1.4 mA 7 to 15 7.5/6.7 Prog. Yes Yes 0.5/0.5 16-J, 20-L Full, half, push-pull
UC1842 500 kHz 0.5 mA 11 mA 10 to 30 16.0/10.0 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1842A 500 kHz 0.3 mA 11 mA 10 to 30 16.0/10.0 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1843 500 kHz 0.5 mA 11 mA 7.6 to 30 8.4/7.6 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1843A 500 kHz 0.3 mA 11 mA 7.9 to 30 8.5/7.9 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1844 500 kHz 0.5 mA 11 mA 10 to 30 16.0/10.0 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1844A 500 kHz 0.3 mA 11 mA 10 to 30 16.0/10.0 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1845 500 kHz 0.5 mA 11 mA 7.6 to 30 8.4/7.6 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1845A 500 kHz 0.3 mA 11 mA 7.9 to 30 8.5/7.9 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost
UC1846 500 kHz 1.5 mA 17 mA 8 to 40 7.7/7 Prog. Yes No 0.5/0.5 8-J, 20-L Full, half, push-pull
Voltage and Current Mode Compatible
Device
Maximum Practical
Freq.StartupCurrent
OperatingCurrent
SupplyVoltage
(V)
UVLO:On/Off
(V)
Maximum Duty Cycle
(%)SoftStart Shutdown
Drive (Sink/Source)
(A) Package Topology
UC1823 1 MHz 1.1 mA 22 mA 9 to 30 9.2/8.4 Prog. Yes No 1.5/1.5 16-J, 10-L Buck, boost
UC1823A 1 MHz 1.1 mA 22 mA 9 to 22 9.2/8.4 Prog. Yes No 1.5/1.5 16-J, 10-L Buck, boost
UC1825 1 MHz 1.1 mA 22 mA 9 to 30 9.2/8.4 Prog. Yes No 1.5/1.5 16-J, 10-L Full, half, push-pull
UC1825A 1 MHz 100 μA 28 mA 9 to 22 16/10 Prog. Yes No 2.0/2.0 16-J, 10-L Full, half, push-pull
Soft-Switching PWM—Resonant Mode
Device
Maximum Practical
Freq.StartupCurrent
OperatingCurrent
SupplyVoltage
(V)
UVLO:On/Off
(V)
Maximum Duty Cycle
(%)SoftStart Shutdown
Drive (Sink/Source)
(A) Package Topology
UCC1895 1 MHz 150 μA 5 mA 11 to 17 11/9.0 100 Yes Yes 0.1/0.1 20-J Full bridge
UC1875 1 MHz 150 μA 45 mA 10.7 to 20 10.7/9.3 100 Yes No 2.0/2.0 20-J, 28-L Full bridge
Power-Factor-Correction Products
Device
Maximum Practical
Freq.
CurrentError AmpBandwidth
AverageCurrentMode
WorldwideInput Voltage
Operation
OutputDrive(A)
StartupCurrent
(mA)
Under-VoltageLockout
(V)EnableInput
Multiplier/Divider
Feedforward Package
UC1854 200 kHz 800 kHz Yes Yes 1 1.5 16/10 Yes Yes 16-J
UC1854B 200 kHz 5 MHz Yes Yes 1 0.3 10.5/10 Yes Yes 16-J
➔
45High Reliability Guide Texas Instruments 2010
Defense
Analog Family
DC Motor Controllers
DeviceOutput Clamps
Diodes Hall Logic
Output Current Per Output
(A)Operating Voltage
(V)Differential Current
Sense Amplifier Current Limit Package
UC1637 — 0.1 ±2.5 to ±20 — Yes 18-J (through-hole package and surface-mount package)
Power-Supply Support Products—Supervisory and Monitoring (SVS) Circuits
Device AttributesVCC (Nom)
(V)VIT– (V)
Tolerance (%)
VIN (Min)
(V)Number of SVS’s
Complementary Outputs
ICC (Max) (mA)
Over- Voltage Sense WDI Package
TLC7733M Single micropower with programmable delay 3.3 2.93 2.4 1 1 Yes 0.016 No No JG, FK
TLC7705M Single micropower with programmable delay 5 4.55 1.5 1 1 Yes 0.016 No No JG, FK, U
PWM-Supply Support ProductsDevice Description Key Application Features Package
UC1611 Quad Schottky Four-diode array for high-current bridges and voltage clamps
Matched, four-diode monolithic array, high peak current, low forward voltage, can be connected in parallel for higher current or lower drop 8-J, 20-L
UC1901 Isolated feedbackgenerator
Amplitude modulation system used to couple a control signal across a voltage-isolation barrier
Transformer couples isolated feedback error signal. Low-cost alternative to optocouplers. 5-MHz carrier provides fast-response capability. Modulator synchronizable to an external clock.
14-J, 20-L
PWM Support Products—Power FET Drivers
Device Output FET DriverOutput
ConfigurationPeak Rise Time
(ns)Maximum Voltage
(V)Output Current
(A) Package
UC1709 Single Complementary 80 40 1.5 8-J, 20-L
UC1710 Single Complementary 35 20 6.0 8-J
PWM Support Products—Power Drivers
Device Power DriverOutput
Configuration Enable Inhibit Analog StopOutput Rise Time
(ns)Maximum Voltage
(V)
Peak Output Current
(A) Package
UC1705 Single Complementary — — — 60 40 1.5 8-J, 20-L
UC1706 Dual Complementary — Yes Yes 130 40 1.5 16-J, 20-L
UC1707 Dual Complementary — Yes Yes 50 40 1.5 16-J, 20-L
UC1708 Dual Non-Inverting Yes — — 25 35 3.0 8-J, 16-E, 20-L
Power-Supply Support Products—Quad Line Monitors
Device AttributesVIN Range
(V)Window Adjust
Proj. Fault Threshold
Prog. Time Delay Current Limit
Power-Supply Monitor Package
UC1903 Quad 8 to 40 Yes Yes Yes No Quad J, L
Linear-Regulation Products—Defense Precision Programmable Voltage References
Device AttributesVref(V)
Output Voltage
Tolerance (%)
Sink Current Temp. Coeff.(Type)
(ppm/°C)
Input Voltage (Max)
(V) Package(Min)(V)
(Max)(V)
(Min)(mA)
(Max)(mA)
TL1431 Adjustable shunt 2.5 Vref 36 0.4 1 100 23 36 JG, FK
Linear-Regulation Products—Linear Controllers
Device
Type of
Output
Maximum Input Voltage
(V)
Minimum Output Voltage
(V)Output Drive
(mA)
Type of Short-Circuit
Limit
Reference-Voltage
Accuracy (%)Special
Features Package
UC1832 Positive adjustable 36 2.0 300 Duty cycle 2 Multiple pins 14-J, 20-L
UC1834 Positive or negative adjustable 40 1.5/–2.0 350 Foldback 3/4 — 16-J, 20-L
UC1836 Positive adjustable 40 2.5 500 Foldback 2 Built-in Rsense 8-J
➔
46High Reliability Guide Texas Instruments 2010
Defense
Analog Family
ComparatorsDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) IOL (mA) Response Time (Typ) (ns) Package
LM111 4 to 30 4 150 8 165 JG, FK
LM139 4 to 30 9 –300 6 300 JG, FK, W
LM139A 4 to 30 4 –300 6 300 JG, FK, W
LM193 4 to 30 9 –300 6 300 JG, FK
TLC139M 4 to 16 10 30 6 1100 JG, FK, W
TLC193M 4 to 16 10 30 6 1100 JG, FK
TLC372M 4 to 16 10 20 6 200 JG, FK, U
TLC374M 4 to 16 10 20 6 200 JG, FK, W
TLC3702M 4 to 16 10 30 20 1100 JG, FK, U
TLC3704M 4 to 16 10 30 20 1100 JG, FK, W
TLV2352M 2 to 8 10 20 6 1400 JG, FK, U
TLV2354M 2 to 8 10 20 6 1400 JG, FK, W
Operational Amplifiers—SingleDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package
OP27A ±4/±22 0.06 60 600 8 2.8 JG, FK
OP27C ±4/±22 0.3 150 300 8 2.8 JG
OPA688M ±5 6 1200 1 530 1000 JG
OPA689M ±5 5 1200 1 280 1600 JG
TLC2201M ±4.6/±16 0.1 0.5 45 1.8 2.5 JG, FK
TLC2201AM ±4.6/±16 0.1 0.5 45 1.8 2.5 JG, FK
TLC2652M ±4.4/±16 0.01 0.5 1000 1.9 2.8 J, JG, FK
TLC2652AM ±4.4/±16 0.008 0.5 1000 1.9 2.8 J, JG, FK
TLC2654M ±4.4/±16 0.05 0.5 1000 1.9 2 J, JG, FK
TLC2654AM ±4.4/±16 0.04 0.5 1000 1.9 2 J, JG, FK
TLE2021M ±2/±20 1 70 500 2 0.65 JG, JG
TLE2021AM ±2/±20 0.5 65 500 2 0.65 JG, FK
TLE2021BM ±2/±20 0.2 60 500 2 0.65 JG, FK
TLE2027M ±4/±22 0.2 150 2500 13 2.8 JG, FK
TLE2027AM ±4/±22 0.1 150 3500 13 2.8 JG, FK
TLE2061M ±3.5/±18 6 40 20 2 3.4 JG, FK, U
TLE2061AM ±3.5/±18 3.6 40 20 2 3.4 JG, FK, U
TLE2061BM ±3.5/±18 1.7 40 20 2 3.4 JG
TLE2071M ±2.3/±19 9.2 65 88 10 40 JG, FK, U
TLE2071AM ±2.3/±19 7.2 65 88 10 40 JG, FK, U
TLE2161M ±3.5/±20 6 40 20 6.4 10 JG, FK
TLE2161AM ±3.5/±20 3.6 40 20 6.4 10 JG, FK
TLE2161BM ±3.5/±20 1.7 40 20 6.4 10 JG, FK
TLE2141M ±2/±22 1.7 –1800 20 6 45 JG, FK
Operational Amplifiers—High SpeedDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package
THS4011M ±5/±15 6 25 290 290 310 JG, FK
THS4031M ±5/±15 2 75 100 100 100 JG, FK
THS4051M ±5/±15 8 9 70 70 240 JG, FK
THS4061M ±5/±15 9 9 180 180 400 JG, FK
➔
47High Reliability Guide Texas Instruments 2010
Defense
Analog Family
Operational Amplifiers—Single (Continued)Device Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package
TLE2141AM ±2/±22 1.2 –1800 20 6 45 JG, FK
TLV2460M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U
TLV2460AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK, U
TLV2461M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U
TLV2461AM ±2/±6 1.7 14 32 5.2 1.6 JG, FK, U
Operational Amplifiers—DualDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package
LM158 ±1.5/±15 7 300 25 0.6 0.2 JG, FK
LM158A ±1.5/±15 7 300 25 0.6 0.2 JG, FK
LT1013M ±5/±22 0.6 45 250 0.7 0.4 JG, FK
LT1013AM ±5/±22 0.3 30 500 0.7 0.4 JG, FK
MC1558 ±5/±15 0.6 1500 25 1 0.5 JG, FK
TLC2202M ±4.6/±16 1 0.5 100 1.9 2.7 JG, FK
TLC2202AM ±4.6/±16 0.75 0.5 100 1.9 2.7 JG, FK
TLC2252M ±4.4/±16 1.75 0.5 10 0.21 0.12 JG, FK, U
TLC2252AM ±4.4/±16 1 0.5 10 0.21 0.12 JG, FK, U
TLC2262M ±4.4/±16 3 0.5 50 0.73 0.55 JG, FK, U
TLC2262AM ±4.4/±16 1.5 0.5 50 0.73 0.55 JG, FK, U
TLC2272M ±4.4/±16 3 0.1 15 2.18 3.6 JG, FK, U
TLC2272AM ±4.4/±16 1.5 0.1 15 2.18 3.6 JG, FK, U
TLC4502M ±4/±6 100 10 200 4.7 2.5 JG, FK, U
TLC4502AM ±4/±6 50 10 200 4.7 2.5 JG, FK, U
TLE2022M ±2/±20 0.7 90 800 2.8 0.65 JG, FK
TLE2022AM ±2/±20 0.45 90 1000 2.8 0.65 JG, FK
TLE2022BM ±2/±20 0.3 90 1000 2.8 0.65 JG, FK
TLE2062M ±3.5/±18 6 40 20 2 3.4 JG, FK, U
TLE2062AM ±3.5/±18 4 40 20 2 3.4 JG, FK, U
TLE2062BM ±3.5/±18 3 40 20 2 3.4 JG, FK
TLE2072M ±2.3/±19 10.5 60 93 10 40 JG, FK, U
TLE2072AM ±2.3/±19 8 60 93 10 40 JG, FK, U
TLE2082M ±2.3/±20 9.5 60 93 10 40 JG, FK
TLE2082AM ±2.3/±20 6.5 60 93 10 40 JG, FK
TLE2142M ±2/±22 1.6 1.8 20 6 45 JG, FK, U
TLE2142AM ±2/±22 2 1.8 20 6 45 JG, FK, U
TLV2262M ±2.7/±8 3 0.5 50 0.71 0.55 JG, FK, U
TLV2262AM ±2.7/±8 1.5 0.5 50 0.71 0.55 JG, FK, U
TLV2252M ±2.7/±8 1.75 0.5 10 0.2 0.12 JG, FK, U
TLV2252AM ±2.7/±8 1 0.5 10 0.2 0.12 JG, FK, U
TLV2422M ±2.7/±10 0.95 0.3 700 0.052 0.02 JG, FK, U
TLV2422AM ±2.7/±10 2 0.3 700 0.052 0.02 JG, FK, U
TLV2442M ±2.7/±10 2.5 0.3 750 (typ) 1.75 1.3 JG, FK, U
TLV2442AM ±2.7/±10 1.6 0.3 750 (typ) 1.75 1.3 JG, FK, U
TLV2432M ±2.7/±10 2.5 0.3 950 (typ) 0.55 0.25 JG, FK, U
TLV2432AM ±2.7/±10 2 0.3 950 (typ) 0.55 0.25 JG, FK, U
TLV2462M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U
TLV2462AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK, U
TLV2463M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK
TLV2463AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK
TLV2772M ±2.5/±5.5 2.5 0.006 20 4.8 9 JG, FK, U
TLV2772AM ±2.5/±5.5 1.6 0.006 20 4.8 9 JG, FK, U
TL062M ±5/±15 9 50 4 1 3.5 JG, FK
TL072M ±5/±15 9 50 15 3 13 JG, FK, U
TL082M ±5/±15 9 50 15 3 13 JG, FK
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48High Reliability Guide Texas Instruments 2010
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Analog Family
Operational Amplifiers—QuadDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package
LM124 ±1.5/±15 7 300 25 0.6 0.13 J, FK, W
LM124A ±1.5/±15 4 100 25 — — J, FK
LM148 ±4/±18 6 325 25 1 0.5 J, FK, W
LT1014M ±5/±22 0.55 45 250 0.7 0.4 J, FK
LT1014AM ±5/±22 0.35 30 400 0.7 0.4 J, FK
OPA4684M ±5 4 13 — 250 750 J, FK
TLC2264M ±4.4/±16 3 0.5 50 0.73 0.55 J, FK, W
TLC2264AM ±4.4/±16 1.5 0.5 50 0.73 0.55 J, FK, W
TLC2274M ±4.4/±16 3 0.5 20 2.3 3.6 J, FK, W
TLC2274AM ±4.4/±16 1.5 0.5 20 2.3 3.6 J, FK, W
TLC54M ±4.4/±16 1.75 0.5 10 0.21 0.12 J, FK, W
TLC2254AM ±4.4/±16 1 0.5 10 0.21 0.12 J, FK, W
TLE2024M ±2/±20 1.2 90 400 2.8 0.7 J, FK, W
TLE2024AM ±2/±20 0.95 90 800 2.8 0.7 J, FK
TLE2024BM ±2/±20 0.7 90 1000 2.8 0.7 J, FK
TLE2064M ±3.5/±18 8 40 20 2 3.4 J, FK
TLE2064AM ±3.5/±18 6 40 20 2 3.4 J, FK
TLE2064BM ±3.5/±18 4 40 20 2 3.4 J, FK
TLE2074M ±2.3/±19 10.5 60 93 10 40 J, FK, W
TLE2074AM ±2.3/±19 8.5 60 93 10 40 J, FK
TLE2144M ±2/±22 4 1800 20 6 45 J, FK
TLE2144AM ±2/±22 3.2 1800 20 6 45 J, FK
TLV2254M ±2.7/±8 1.75 0.5 10 0.2 0.12 J, FK, W
TLV2254AM ±2.7/±8 1 0.5 10 0.2 0.12 J, FK, W
TLV2264M ±2.7/±8 3 0.5 50 0.71 0.55 J, FK, W
TLV2264AM ±2.7/±8 1.5 0.5 50 0.71 0.55 J, FK, W
TL064M ±5/±15 15 50 4 1 3.5 J, FK, W
TL074M ±5/±15 15 50 15 3 13 J, FK, W
TL084M ±5/±15 15 50 15 3 13 J, FK
TLV2464EP ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U
TLV2464AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK, U
TLV2465M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U
Special Functions—Precision Timers
DeviceSupply Voltage
(V)Supply Current
(mA)Bandwidth (Typ)
(MHz)Differential Output
Offset (mV)Log Linearity
(30-dB Sections) Package
SE555 4.5 to 18 5 ±200 Single 10 μs to hours JG, FK
SE556 4.5 to 18 8 ±200 Dual 10 μs to hours J, FK
TLC555M 2 to 15 0.7 +100/–10 Single 1 μs to hours JG, FK
TLC556M 2 to 15 1.4 +100/–10 Dual 1 μs to hours J, FK
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49High Reliability Guide Texas Instruments 2010
Defense
Digital Signal Processors (DSPs)
OverviewTI is a recognized leader in the field of DSP and DSP product support. Spanning nine product generations, our SMJ320 family of DSP chips offers cost-effective HiRel solutions for computationally intensive applications.
Continuing the tradition of providing leading-edge processing capability to high-reliability products, TI introduced the HiRel C6201 in 1998, and the C6201B and C6701 were released in 2000. The HiRel C6201B offers fixed-point performance of 1200 million instructions per second (MIPS). The HiRel C6701 supports up to 1 billion floating-point operations per second (GFLOPS). In the third quarter of 2001, TI released the HiRel VC33, which offers performance of up to 150 MFLOPS in the smallest available package. The C6203 was released in 2002. This fixed-point DSP features 1600-MIPS performance at 200 MHz over the full HiRel temperature range and offers 7 Mbits of on-chip SRAM. Continuing our commitment to the HiRel DSP market, TI released the ceramic- packaged C6415, which provides up to 4800 MIPS of processing perform-ance at a 600-MHz clock rate. We also offer a HiRel graphics processor in the 34020A.
In recognition of the continually changing demands of the HiRel market, TI DSPs are offered with a variety of processing options, includ-ing MIL-PRF-38535 (QML Class Q), enhanced products, and QML Class V for space applications.
Product Nomenclature1 (Typical Analog Products)Example: SMJ320C40GBM40Prefix—SMJSM = commercial processingSMJ = MIL-PRF-38535 (QML Class Q)SMQ = MIL-PRF-38535 (QML Class N)
(order by SMD)SMP = production prototypeSMX = defense preproductionTMS = commercial qualifiedTMP = commercial gradeSMV = MIL-PRF-38535 (QML Class V)
(order by SMD)320 DSP Family Designator—320 or 32320 DSP Product Designator—C40BC = CMOS bootC = CMOSE = CMOS EPROMF = CMOS flashLC = CMOS 3.3 VVC = CMOS 1.5 V/3.3 V14 = E1415 = C1525 = C2526 = C2630 = C3031 = C3132 = C3233 = VC3340 = C40Package Type/Pin Count—GBJD = CDIPFD/FJ = LCCCGB/GF = CPGAGFA = CFGPGLG/GLP = FC/CSPHFH/HFG = CFPHFP = CFPKGD = KGDPCM/PQ = QFP
GNM = FBGAGAD = FCμBGAGJC = FC/CSPGJL = FC/CSPGLZ = FCBGAGDP = LQFPPGE = Plastic LQFPGGU = BGAGGW = MicroStar BGA™ integrated
circuit packagePGF = LQFPGHH = PBGATemperature Range—MM = –55°C to 125°CA = –40°C to 105°C (TMS320C6000™
DSP)L = 0°C to 70°CW = –55°C to 115°CS = special per data sheetBlank = 25°CSpeed Designator—4012 = 120 MHz16 = 160 MIPS (VC5416)20 = 200 MIPS (VC5421)33 = 33 MHz40 = 40 MHz50 = 500 MHz (C64xx)60 = 60 MHz (600-MHz C6415)60 = 60 MIPS (TMS320C54x™ DSP)66 = 66 MHz10 = 100 MIPS (C54x™)14 = 140 MHz15 = 150 MHz16 = 167 MHz17 = 175 MHz20 = 200 MHz120 = 120 MFLOPS (VC33)150 = 150 MFLOPS (VC33)
1Not all speed, package, process or temperature combinations are available.
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50High Reliability Guide Texas Instruments 2010
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Digital Signal Processors (DSPs)
DSPsDevice Feature Size (μ) Data Format Bits Cycle Time (ns) Performance Package Compiler
320LC31EP 1.6 Fixed 16 4/5 12.5/10 MIPS FD/68, FJ/68, GB/68 C
320C15 2 Fixed 16 4/5 6.25/5 MIPS JD/40, FJ/44 —
320C30 0.72 Floating 32 4/5 50/40 MFLOPS GB/181, HFG/196, KGD/181 Ada, C
320C31 0.72 Floating 32 4/5 50/40 MFLOPS GFA/141, HFG/132, KGD/132 Ada, C
320C40 0.72 Floating 32 33/40/50 60/50/40 MFLOPS GF/325, HFH/352, TAB/TBB/324, KGD/325 Ada, C
320C50 0.72 Fixed 16 3/4 33/25 MIPS GFA/141, HFG/132, KGD/115, PQ/132 C
320C32 0.72 Floating 32 33/40 60/50 MFLOPS PCM/144 Ada, C
320C80 0.5 Fixed/Floating — 1/2 50 MIPS/250 MIPS/ 100 MFLOPS GF/305, HFH/320 —
320LC31 0.72 Floating 32 50 40 MFLOPS KGD/132, PQ/132 Ada, C
320F240 0.72 Fixed 16 50 20 MIPS HFP/132 C
320C6201B 0.18 Fixed 16 6.7 1200 MIPS GLP/429 Ada, C
320C6701 0.18 Floating 32 7 840 MFLOPS GLP/429 Ada, C
320C6203 0.15 Fixed 16 5 1600 MIPS GLP/429 C
320VC33 0.18 Floating 32 20 150 MFLOPS GNM/144 C
320C6414-EP 0.12 Fixed 32 2 4000 MIPS GL2/532 C
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51High Reliability Guide Texas Instruments 2010
Defense
First In, First Out Memory Family (FIFOs)
OverviewTI’s first-in, first-out (FIFO) memory products provide the speed and features necessary to optimize system performance by eliminating the data bottlenecks common between DSPs, high-speed processors, memory devices and analog front ends (AFEs).
DSP Synchronous FIFO Benefits•Optimizes system performance•Eliminates data bottlenecks between
DSPs, high-speed processors, industry-standard buses, memory devices and AFEs
•Designed for a variety of systems, including real-time DSP applications, telecommunications, internetworking, instrumentation and high-bandwidth computing
•Glueless interface with C6x and newer TMS320C5x™ DSPs
•Output edge control (OEC): Reduces simultaneous-switching noise and
Synchronous FIFOsDevice Organization Technology Process Level Pins Package DSCC SMD Number
SN54ABT3614 64 x 36 x 2 BiCMOS SN 132 HFP NA
SN54ABT3614 64 x 36 x 2 BiCMOS QML Plastic 120 PCB 5962-9560901NXD
SN54ABT7819 512 x 18 x2 BiCMOS SNJ 84 GB 5962-9470401QXA
SN54ACT3632 512 x 36 x 2 CMOS SN 132 HFP NA
SN54ACT3641 1K x 36 CMOS SN 132 HFP NA
SN54ACT3641 1K x 36 CMOS QML Plastic 120 PCB 5962-9560801NXD
SN54ACT7881 1K x 18 CMOS QML Plastic 80 PN 5962-9562701NXD
SN54ABT3614 64 x 36 x 2 BiCMOS SN 132 HFP NA
Asynchronous FIFOsDevice Organization Technology Process Level Pins Package DSCC SMD Number
SN54ABT7820 512 x 18 x 2 BiCMOS SNJ 84 GB 5962-9650901QXA
CD54HC40105 4 x 16 HCMOS SNJ 16 J NA
CD54HCT40105 4 x 16 HCMOS SNJ 16 J NA
CD40105 4 x 16 HCMOS SN 16 J NA
SN54ABT7820 512 x 18 x 2 BiCMOS SNJ 84 GB 5962-9650901QXA
CD54HC40105 4 x 16 HCMOS SNJ 16 J NA
CD54HCT40105 4 x 16 HCMOS SNJ 16 J NA
package inductance•Distributed VCC and GND reduce
package inductance•Programmable flags provide design
flexibility and control•Generates and checks parity to
ensure data integrity in fault-control systems
•Synchronous retransmit feature provides a user-defined point to transmit data
•Mailbox-bypass registers permit the user to bypass the internal SRAM
•Bus-mapping feature sizes data from 36 bits to either 9, 16 or 18 bits
•Byte-swapping feature converts data from big endian (Motorola) to little endian (Intel), ideal for mixed systems
Product NomenclatureExample: SN54ABT36148HFPPrefix—SNSN = commercial processingSNJ = MIL-PRF-38535 (QML Class Q)
Defense Temperature—5454 = –55°C to 125°C74 = 0°C to 70°CTechnology—ABTABT = advanced BiCMOSACT = advanced CMOSLS = low-power SchottkyHC = high-speed CMOS (CMOS input
levels)HCT = high-speed CMOS (TTL input
levels)Circuit Designator—3614J, JE = ceramic DIP (300 mil and
600 mil)L, L20 = ceramic leadless chip carrier
(CLCC)Package Type—8HFPJ = CDIPHFP = CFPKGD = KGDPCB/PN = QFPFK = LCCCGB = MicroStar BGA™ integrated
circuit package
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52High Reliability Guide Texas Instruments 2010
Defense
Logic Family
OverviewTI offers a full spectrum of defense-grade logic devices to support the rigorous demands of the defense and aerospace markets. Standard process options include MIL-PRF-38535 (QML Class Q) (SNJ prefix) and commercial processing only (SN prefix). TI HiRel is committed to supporting defense and aerospace system requirements and will continue to release new logic devices that leverage TI’s most advanced processing technology to create world-class performance.
18 = SCOPE/JTAG Widebus32 = Widebus+™Options—22 = series-damping resistors on
outputsDevice Function—245(See page 18 for device listing by
function.)Package Type—WDPZ = LQFPPW = TSSOPDW = SOICDL = SSOPD = SOICDB = TSSOPDGG = TSSOPDCK = SOPGQL = MicroStar Junior™ BGAZQL = MicroStar Junior BGAJ, JT = CDIPW/WD = ceramic flatpackFK = ceramic leadless chip carrier
(CLCC)HV, HT, HFP = ceramic quad flatpackGB = pin grid array (PGA)
Product Nomenclature (Standard Logic)Example: SNJ54ABTH162245WDPrefix—SNJSNJ = MIL-PRF-38535 (QML Class Q)SN = commercial processingSNV = MIL-PRF-38535 (QML Class V)
(order by SMD)Type—54Technology—ABTNo designator = TTLALS/AS = advanced low-power
Schottky diodes and advanced Schottky diodes
AHC/AHCT = advanced high-speed CMOS
HC/HCT = high-speed CMOSBCT = BiCMOSAC/ACT = advanced CMOSABT = advanced BiCMOSLVC = low-voltage CMOSLVTH = low-voltage advanced CMOS
with bus holdCDC = clock distribution circuitCBT = crossbar bus switchGTL = gunning transceiver logicFCT = fast-CMOS technologyF = fast logicSpecial Features—HD = level-shifting diode (CBTD)H = bus hold (LVTH)Bus/Scan Options—168 = SCOPE™/JTAG16 = Widebus™
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53High Reliability Guide Texas Instruments 2010
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Logic Family
Definitions
Advanced BiCMOS Technology (ABT) —54ABTABT devices offer high-speed switch-ing with the benefit of low noise, low power consumption and high-output drive current. Based on EPIC-IIB BiCMOS design, ABT offers numer-ous improvements over BiCMOS technology (BCT) while retaining TTL compatibility.
Advanced Bipolar—54ALS, 54AS, 54FAdvanced Schottky (AS) diodes and advanced low-power Schottky (ALS) diodes combine to provide the designer with a broad range of func-tions that aid in optimizing designs. The 54ALS, 54AS and 54F families enable a socket-by-socket selection of devices for optimum speed and power.
Advanced CMOS—54AC, 54ACTAdvanced CMOS devices offer advanced bipolar speed with low power consumption and low noise. Industry-standard pinouts allow for ease of design and cross-referencing.
Advanced High-Speed CMOS (AHC)—54AHC, 54AHCTAHC and AHC with TTL (AHCT) provide the HCMOS user with an excellent migration path to upgrade speed performance in low-power, low-noise, low-drive applications. Standard offer-ings include compatible functions for both CMOS (AHC) and TTL (AHCT).
Advanced Low-Voltage CMOS (ALVC) —54ALVCALVC has typical propagation delays of less than 2 ns, a current drive of 24 mA and static power consumption of 40 μA for bus-interface functions. It is the industry standard for speed-critical 3.3-V designs.
BiCMOS Technology (BCT)—54BCTA standard bipolar/CMOS process fea-turing high drive, low noise, low power consumption and TTL compatibility.
CD4000 Series—CD4This series of high-voltage CMOS devices offers a spectrum of functions that range from simple gates to com-plex counters, registers and arithmetic circuits.
Crossbar Technology (CBT)—54CBTCBT enables a bus-interface device to function as a very fast bus switch, effectively isolating buses when the switch is open and offering very little propagation delay when the switch is closed. CBT devices can also be used to translate 5 V to 3.3 V, allowing designers to mix 5-V or 3.3-V compo-nents in the same system.
First In, First Out (FIFO)—54ABT, 54ACTFIFO memories can connect data buses operating at different clock rates. These memories offer different flag configurations and different data widths/depths to allow greater system optimization.
High-Speed CMOS (HC)—54HC, 54HCTHC and HC with TTL (HCT) deliver low power and low noise at a low price. The HC family offers CMOS-compatible inputs, while the HCT family offers TTL-compatible inputs.
Low-Voltage Advanced CMOS—54LVTHThe low-voltage technology (LVTH) product line consists of bus interface functions with bus hold designed to operate at VCC = 3.3 V. These devices feature very low power consumption and provide performance comparable to that of 5-V advanced BiCMOS tech-nology (ABT). LVT input- and output-voltage levels are compatible with 5-V TTL levels, making them ideal for mixed-level systems.
Low-Voltage CMOS (LVC)—54LV, 54LVCWith a range of functions that includes gates, MSI and octals, LVC gives the designer a solid choice for migrating to low voltage in mid-range applications. This family supports mixed-mode sig-nal operations on all ports (5-V input/output voltage with 3.3-V VCC).
SCOPE™—54BCT8, 54ABT8, 54ABT18, 54LVTH18SCOPE devices blend test circuitry with standard logic functions to facili-tate testing of complex circuit-board assemblies. In the normal mode, the SCOPE device is functionally equiva-lent to a standard device. In the test mode, the test circuitry can be acti-vated via the four-wire test access port (TAP) to take snapshot samples of the data appearing at the device pins or to perform a self-test on the boundary test cells. These functions are offered in both standard and Widebus™ pack-aging and are compatible with 5-V and 3.3-V components.
Standard TTL—54LS, 54S, 54Standard TTL devices offer a large number of general-purpose logic func-tions with standard pinouts and stan-dard packaging.
Widebus and Widebus+™—ABT16, ACT16, LVTH116, ABT32Widebus devices offer 16, 18 and 20 bits of bus interface logic in one space-saving package. Widebus+ devices offer 32 and 36 bits of bus interface logic in one package.
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54High Reliability Guide Texas Instruments 2010
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Logic Family
Function1 Description
00 Quad 2-input NAND
01 Quad 2-input NAND
02 Quad 2-input NOR
03 Quad 2-input NAND
04 Hex inverter
04 Unbuffered ’04
04U Hex inverter (OC)
05 Hex inverter buffer
06 Hex inverter buffer
07 Quad 2-input AND
08 Quad 2-input AND
09 Triple 3-input NAND
10 Triple 3-input AND
11 Triple 3-input NAND
12 Hex Schmitt-trigger
14 Triple 3-input AND
15 Hex inverter buffer
16 Hex buffer
17 Dual 4-input NAND
20 Dual 4-input AND
21 Dual 4-input NOR
23 Dual 4-input NOR
25 Quad 2-input NAND
26 Triple 3-input NOR
27 Quad 2-input NOR
28 8-input NAND
30 Quad 2-input OR
32 Quad 2-input NOR
33 Quad 2-input NAND buffer
37 Quad 2-input NAND buffer
40 Dual 4-input NAND buffer
42 4-to-10 BCD-to-decimal decoder
45 BCD-to-decimal decoder
47 BCD-to-7 seg. decoder
49 BCD-to-7 seg. decoder
50 Dual AND-OR-INVERT (expandable)
51 Dual AND-OR-INVERT
54 4-wide AND-OR-INVERT
64 4-2-3-2 AND-OR-INVERT
72 J-K master-slave flip-flop
73 Dual J-K flip-flop w/reset
74 Dual D-type flip-flop w/set/reset
75 4-bit bistable latches
Function1 Description
76 Dual J-K flip-flop
83 4-bit full adder
85 4-bit mag. comparator
86 Quad exclusive-OR
90 Decade counter
91 8-bit shift register
92 Divide-by-12 counter
93 4-bit binary counter
95 4-bit shift register
96 5-bit shift register
97 Sync. 6-bit binary rate mult
107 Dual J-K flip-flop w/reset
109 Dual J-K flip-flop w/set/reset
112 Dual J-K flip-flop w/set/reset
114 Dual J-K flip-flop
121 Monostable multivibrators
123 Dual ’122
124 Dual VCO
125 Quad bus buffer (/OE)
126 Quad bus buffer (OE)
128 75-W line driver
132 Quad NAND Schmitt-trigger
133 13-input NAND
134 12-input NAND
136 Quad exclusive-OR (OC)
137 3-to-8 decoder/mux
138 3-to-8 decoder/mux
139 Dual 3-to-4 decoder/mux
140 Dual 4-input NAND (50 W)
145 BCD-to-decimal decoder
147 10-to-4 line priority encoder
148 8-to-3 line decoder
150 1-of-16 data sel/mux
151 1-of-8 data sel/mux
153 Dual 4-to-1 sel/mux
154 4-to-16 line decoder/demux
155 Dual 2-to-4 decoder
156 Dual 1-to-4 demux (OC)
157 Quad 2-to-1 sel/mux
158 Quad 2-to-1 INV. sel/mux
161 Sync. 4-bit binary counter
162Sync. BCD decade counter/ synchronous
reset
Function1 Description
163 Sync. 4-bit binary counter
164 8-bit shift register
165 8-bit shift register (serial-in/parallel out)
166 8-bit shift register (serial-in/parallel out)
169 Sync. 4-bit U/D counter
170 4-by-4 register file
173 Quad D-type register
174 Hex D-type flip-flop w/reset
175 Quad D-type flip-flop w/reset
177 Binary counter/latch
180 9-bit odd/even parity generator
181 4-bit ALU
182 Look-ahead carry generator
190Presettable sync. BCD decade w/ U/D
counter
192 Sync. U/D BCD counter
193 Sync. U/D binary counter
194 4-bit shift register
195 4-bit shift register
197 4-bit counter/latch
221 Dual monostable multivibrator
AbbreviationsALU Arithmetic logic unit
ASP Addressable scan ports
C-O Complementary output
FIFO First-in first-out memory
Gen Generator
Inv Inverting
Mult Multiplier
Mux Multiplexer
OC Open collector outputs
Reg Register
Sel Selector
Sync Synchronous
XCVR Transceiver
UBE Universal bus exchanger
UBT Universal bus transceiver
UD Up/down
VCO Voltage-controlled oscillator
1Logic devices are available in a number of technologies. See Product Nomenclature on page 16 for details or visit www.ti.com/defense and click on Logic.
Devices by Function
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55High Reliability Guide Texas Instruments 2010
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Logic Family
Function1 Description
222 16K x 4 bipolar FIFO
224 16K x 4 bipolar FIFO
2373-to-8 line decoder/mux w/address
latches
238 3-to-8 line decoder/demux
240 8-bit buffer
241 8-bit buffer
243 4-bit transceiver
244 8-bit buffer
245 8-bit transceiver
250 16-to-1 line decoder
251 8-input multiplexer
253 Dual 4-to-1 sel/mux
257 Quad 2-to-1 sel/mux
258 Quad 2-to-4 sel/mux (INV.)
259 8-bit addressable latch
260 Dual 5-input NOR
266 Quad exclusive-NOR (OC)
273 Octal D-type flip-flop w/reset
279 Quad S-R latch
280 9-bit odd/even parity gen
283 4-bit binary full adder
286 9-bit parity checker/gen
298 Quad 2-input mux
299 8-bit shift register
323 8-bit shift register
348 8-to-3 priority encoder
354 8-input mux/reg, three state
356 8-input mux/reg, three state
365 Hex buffer
366 Hex driver
367 Hex buffer (4-bit and 2-bit)
368 Hex driver
373 8-bit latch
374 8-bit D-type flip-flop
375 4-bit latch
377 8-bit D-type flip-flop
378 6-bit D-type flip-flop
379 4-bit D-type flip-flop
381 ALU function generator
390 Dual decade counter
393 Dual 4-bit counter
396 8-bit storage register
Function1 Description
399 Quad 2-input mux
423Dual retriggerable monostable
multivibrator w/reset
480 8-bit dual parity generator/checker
521 8-bit identity comparators
533 8-bit D-type transp. latch
534 8-bit D-type flip-flop
540 8-bit buffer/driver
541 8-bit buffer/driver
543 8-bit reg. transceiver
563 8-bit D-type transp. latch
564 8-bit D-type flip-flop
569 4-bit up/down counter
573 8-bit latch
574 8-bit D-type flip-flop
576 8-bit D-type flip-flop
580 8-bit D-type transp. latch
590 8-bit counter
592 8-bit counter
593 8-bit counter
595 8-bit shift register
597 8-bit shift register
598 8-bit shift register
620 8-bit transceiver
623 8-bit transceiver
628 Volt. contr. oscillator
629 Volt. contr. oscillator
640 8-bit transceiver
645 8-bit transceiver
646 8-bit transceiver
648 8-bit XCVR and register
652 8-bit transceiver
653 8-bit XCVR and register
669 Sync. 4-bit counter
670 4-by-4 register file
673 16-bit shift register
674 16-bit shift register
682 8-bit identity comparator
684 8-bit identity comparator
688 8-bit identity comparator
697 Sync. up/down counter
756 8-bit buffer/driver
760 8-bit buffer (OC)
Function1 Description
804 Hex 2-input NAND driver
805 Hex 2-input NOR driver
808 Hex 2-input AND driver
821 10-bit interface flip-flop
823 9-bit interface flip-flop
825 8-bit interface flip-flop
827 10-bit buffer/driver
832 Hex 2-input OR driver
841 10-bit D-type latch
843 9-bit D-type latch
853 8- to 9-bit parity transceiver
857 Hex 2- to 1-line multiplier
867 8-bit up/down counter
869 8-bit up/down counter
873 8-bit D-type transparent latch
874 8-bit D-type flip-flop
885 8-bit magnitude comparator
996 8-bit read-back latch
1000 Quad 2-input NAND buffer
1004 Hex inverting driver
1032 Quad 2-input OR buffer
1034 Hex non-invert. driver
1035 Hex non-invert. driver
1244 8-bit buffer
1245 8-bit transceiver
1645 8-bit transceiver
2240 240 w/output damping R
2244 244 w/output damping R
2245 245 w/output damping R
2827 10-bit MOS driver
2952 8-bit transceiver and register
3614 36-bit x 64 x 2 FIFO
3641 36-bit x 1K FIFO
4002 Dual 4-input NOR
4015Dual 4-bit serial-in/parallel-out shift
register
4017Johnson decade counter w/10 decoded
outputs
4020 14-bit counter
4024 7-bit counter
4040 12-bit counter
4046 Phase lock loop w/VCO
4049 Hex inverting high-to-low level shifter
1Logic devices are available in a number of technologies. See Product Nomenclature on page 16 for details or visit www.ti.com/defense and click on Logic.
Devices by Function
➔
56High Reliability Guide Texas Instruments 2010
Defense
Logic Family
Function1 Description
4050 Hex high-to-low level shifter
4051 8-channel analog mux/demux
4052 Dual 4-channel analog mux/demux
4053 Triple 2-channel analog mux/demux
4059 Prog divided by “n” counter
4060 14-stage binary ripple counter w/oscillator
4066 Quad bilateral switch
4075 Triple 3-input OR gate
4094 8-stage shift and store bus reg
4316 Quad analog switch
4351 Analog mux w/latch
45144-to-16 line decoder/demux w/input
latches
4520 Dual 4-bit sync binary counter
4538 Dual precision monostable multivibrator
7266 Quad exclusive NOR
7819 512 x 18 x 2 FIFO
7820 512 x 18 x 2 FIFO
8240 ’240 with JTAG
8244 ’244 with JTAG
Function1 Description
8245 ’245 with JTAG
8373 ’373 with JTAG
8374 ’374 with JTAG
8543 ’543 with JTAG
8646 ’646 with JTAG
8652 ’652 with JTAG
8990 Scan test controller
8996 10-bit ASP
8997 Scan path linker
16240 16-bit ’240
16241 16-bit ’241
16244 16-bit ’244
16245 16-bit ’245
16260 12- to 24-bit mux D-type latch
16373 16-bit ’373
16374 16-bit ’374
16543 16-bit ’543
16601 18-bit UBT
16640 16 bit ’640
16646 16-bit ’646
Function1 Description
16652 16-bit ’652
16823 18-bit ’823
16841 20-bit D-type latch
16952 16-bit reg. transceiver
18245 JTAG ’16245
18502 JTAG ’16502
18646 JTAG ’16646
29520 8-bit identity comparators
29818 Diagnostic scan register
29821 10-bit bus interf. flip-flop
29823 9-bit bus interf. flip-flop
32245 36-bit ’245
32316 16-bit 3-port UBE
32501 36-bit UBT
32543 36-bit ’543
40103 8-bit binary down counter
40105 4 bits x 16 words FIFO register
162244 16-bit ’2244
162245 16-bit ’2245
162373 3.3-V ’162373 w/output damping R
1Logic devices are available in a number of technologies. See Product Nomenclature on page 16 for details or visit www.ti.com/defense and click on Logic.
Devices by Function
➔
57High Reliability Guide Texas Instruments 2010
Defense
CD4000 Series
Device Functional Description
CD4001B Quad 2-input NOR gate
CD4001UB Quad 2-input NOR gate (unbuffered)
CD4002B Dual 4-input NOR gate
CD4006B 18-stage static shift register
CD4007UB Dual complementary pair plus inverter (unbuffered)
CD4009UB Hex buffer/converter (inverting, unbuffered)
CD4010B Hex buffer/converter (non-inverting)
CD4011A Quad 2-input NAND gate
CD4011B Quad 2-input NAND gate
CD4011UB Quad 2-input NAND gate
CD4012B Dual 4-input NAND gate
CD4013B Dual D-type flip-flop with set/reset capability
CD4014B 8-stage static shift register
CD4015B Dual 4-stage static shift register
CD4016B Quad bilateral switch
CD4017B Decade counter/divider
CD4018B Presettable divide-by-n counter
CD4019B Quad and/or select gate
CD4020B 14-stage ripple-carry binary counter/divider
CD4021B 8-stage static shift register
CD4022B Divide-by-8 counter/divider
CD4023B Triple 3-input NAND gate
CD4024B 7-stage ripple-carry binary counter/divider
CD4025A Triple 3-input NOR gate
CD4025B Triple 3-input NOR gate
CD4027B Dual J-K master-slave flip-flop w/set/reset capability
CD4028B BCD-to-decimal decoder
CD4029B Presettable up/down counter
CD4030B Quad exclusive-OR gate
CD4031B 64-stage static shift register
CD4034B 8-stage static bus register
CD4035B 4-stage parallel-in/parallel-out shift register
CD4040B 12-stage ripple-carry binary counter/divider
CD4041UB Quad true/complement buffer
CD4042B Quad clocked D-type latch
CD4043B Quad NOR R/S latch (3-state outputs)
Product Nomenclature (CD4000)Example: CD4XXXXXXXXPrefix—CDDevice Function (up to 5 digits)—4XXXXSupply Voltage—XXA = 2 V max
Device Functional Description
CD4044B Quad NAND R/S latch (3-state outputs)
CD4046B Micropower phase lock loop
CD4047B Low-power monostable/astable multivibrator
CD4048B Multi-function expandable 8-input gate (3-state outputs)
CD4049UB Hex buffer/converter (inverting, unbuffered)
CD4050B Hex buffer/converter (non-inverting)
CD4051B 8-channel analog multiplexer/demultiplexer
CD4052B 4-channel analog multiplexer/demultiplexer
CD4053B Triple 2-channel analog multiplexer/demultiplexer
CD4054B 4-segment LCD display driver
CD4056B BCD-to-7-segment LCD driver
CD4060B 14-stage ripple-carry binary counter/divider and oscillator
CD4063B 4-bit magnitude comparator
CD4066B Quad bilateral switch
CD4067B 16-channel analog multiplexer/demultiplexer
CD4068B 8-input NAND/AND gate
CD4069UB Hex inverter
CD4070B Quad exclusive-OR gate
CD4071B Quad 2-input OR gate
CD4072B Dual 4-input OR gate
CD4073B Triple 3-input AND gate
CD4075B Triple 3-input OR gate
CD4076B 4-bit D-type register
CD4077B Quad exclusive-NOR gate
CD4078B 8-input NOR/OR gate
CD4081B Quad 2-input AND gate
CD4082B Dual 4-input AND gate
CD4085B Dual 2-wide 2-input AND-OR-INVERT gate
CD4086B Expandable 4-wide 2-input AND-OR-INVERT gate
CD4089B Binary rate multiplier
CD4093B Quad 2-input NAND Schmitt triggers
CD4094B 8-stage shift-and-store bus register
CD4097B 8-channel analog multiplexer/demultiplexer
CD4098B Dual monostable multivibrator
CD4099B 8-bit addressable latch
Device Functional Description
CD4502B Strobed hex inverter/buffer
CD4503B Hex buffer (non-inverting) (3-state outputs)
CD4504B Hex voltage-level shifter (for TTL-to CMOS or CMOS-to-CMOS operation)
CD4508B Dual 4-bit latch
CD4511B BCD-to-7-segment latch decoder drivers
CD4512B 8-channel data selector (3-state outputs)
CD4514B 4-bit latch/4-to-16 line decoder (outputs low)
CD4515B 4-bit latch/4-to-16 decoder (outputs low)
CD4516B Presettable 4-bit binary up/down counter
CD4517B Dual 64-stage static shift register
CD4518B Dual BCD up counter
CD4520B Dual binary up counter
CD4532B 8-bit priority encoder
CD4536B Programmable timer
CD4541B Programmable timer
CD4555B Dual 1-of-4 decoder/demultiplexer (outputs high)
CD4556B Dual 1-of-4 decoder/demultiplexer (outputs low)
CD4585B 4-bit magnitude comparator
CD4724B 8-bit addressable latch
CD14538B Dual precision monostable multivibrator
CD40103B 8-stage presettable synchronous down counter
CD40105B 4-bit by 16-word FIFO register
CD40106B Hex Schmitt triggers
CD40107B Dual 2-input NAND buffer/driver
CD40109B Quad low-to-high-voltage-level shifter
CD40160B Sync programmable 4-bit decade counter w/async clear
CD40161B Sync programmable 4-bit binary counter w/async clear
CD40174B Hex D-type flip-flop
CD40175B Quad D-type flip-flop
CD40192B Presettable BCD up/down counter
CD40193B Presettable binary up/down counter
CD40257B Quad 2-line-to-1 line data selector/multiplexer
B = 18 V maxUB = 18 V max unbufferedPackage Designation—XF = ceramic dual-in-line package
(CDIP)K = ceramic flatpackD = metal seal CDIP
Process Levels—X3 = mil-temp commercial processing3A = MIL-PRF-38535 (QML)B = MIL-M-38510 electrical (QPL)
Product Functions
➔
58High Reliability Guide Texas Instruments 2010
Defense
Process Flow
OverviewSeveral process flows are available for TI HiRel products. The flows are typical and may vary depending on changes to applicable defense standards such as MIL-PRF-38535.
TI offers three different types of QML products, processed under MIL-PRF- 38535 Class Q:• JM38510—Processed under MIL-
PRF-38535 and electrically tested to the JAN slash sheet
Process FlowProcess Flows Description
DSCC/SMD (See Note 1) Standard microcircuit drawing products processed to a MIL-PRF-38535 flow. Electricals controlled by DSCC/SMD.
SNJ/SMJ Products processed to MIL-PRF-38535 Class B for defense applications. Electricals controlled by current TI data sheet.
SN/SM Commercial-level ceramic processing. Test flow defined in this section. Electricals defined by current TI data sheet but may not be production tested.
SMX/SNX (See Note 2) Experimental products assembled and tested by TI HiRel before qualification. No minimum screening or testing required. Electricals controlled by current TI data sheet.
SMP/SNP (See Note 2) Prototype devices representative of production material with defense temperature-range testing. Shipped before completion of qualification testing. Electricals controlled by current TI data sheet.
JAN Processed per QML MIL-PRF-38535 flow. Electricals controlled by JAN slash sheet.
EP Processed in compliance with ISO 9001. Testing and screening performed in accordance with TI data sheet.
Note 1: Although TI offers SCDs, it is not the standard or preferred method of procurement.
Note 2: These devices have not met or completed TI HiRel Semiconductors internal qualification requirements. These devices are for prototyping purposes only, and standard TI warranties do not apply. Supply of these devices does not constitute a commitment by TI to release them to production.
Note 3: Per MIL-PRF-38535, if sufficient quality and reliability data is available, the manufacturer, through the QML program and the Technical Review Board (TRB) may modify, substitute or delete tests.
Note 4: Condition A or D at manufacturer’s option.Note 5: According to device type, electrical parameters are defined by the slash
sheet, DSCC/SMD or TI data sheet and method 5004.Note 6: Ceramic packages only.Note 9: Lead-finish options must be specified by ordering the DSCC/SMD
number.
QML Processing Flow Covering DSCC/SMD, SNJ/SMJ and JAN (See Note 3)
Wafer fab certification DSCC/TRB
Certified manufacturing lines DSCC/TRB
Wafer fabrication and device assembly
Traceability to diffusion lot
Internal visual, method 2010, condition B
Bond pull and die shear (sampled), methods 2011 and 2019, condition D
Sealing
Temperature cycle, method 1010,condition C
Constant acceleration
Optional pre-burn-in, electrical parameters
Burn-in test, method 1015,condition A or D (see Note 4)
Post-burn-in electrical parameters
Final electrical test (see Note 5)
Quality conformance inspection, group A(method 5005), sample size = 116/0
Fine/gross leak detection, method 1014,conditions A/B and C (see Note 6)
External visual, method 2009
Group B, method 5005
Group C, method 5005
Top-side symbol
Percent defective allowable (PDA)calculation
Group D, method 5005
•DSCC standard microcircuit drawing (SMD)—Processed under MIL-PRF-38535 and electrically tested to the DSCC/SMD:• SMQ—Processed under MIL-PRF-
38535 Class N (order by SMD)• SMV—Processed under MIL-PRF-
38535 Class V (order by SMD)•SNJ/SMJ—Processed under MIL-
PRF-38535 Class Q and electrically tested to the TI data sheet
All QML products are marked with the quality designator “Q” on the top side.
Enhanced Products (EP)Testing and screening of an EP product is performed in accordance with its TI data sheet. TI performs configuration control and processes EP products per best commercial practices. Proc ess ing and screening is documented in the TI Quality System Manual and is in compliance with ISO 9001.
➔
59High Reliability Guide Texas Instruments 2010
Defense
Process Flow and Symbolization
SN/SM Processing Flow (See Notes 3 and 7)
Assembly
Top-side symbol
Burn-in (optional)
Final electrical test (see Note 8)
Fine/gross leak detection, method 1014,conditions A/B and C (see Note 6)
External visual, method 2009
Note 3: Per MIL-PRF-38535, if sufficient quality and reliability data is available, the manufacturer, through the QML program and the Technical Review Board (TRB) may modify, substitute or delete tests.
Note 6: Ceramic packages only.Note 7: Lead finish may vary. For example, ceramic PGA and ceramic QFP
packages may be gold finish. Contact the PIC for detailed information.
Note 8: Contact the TI Product Information Center (PIC) for detailed test information.
Note 9: Lead-finish options must be specified by ordering the DSCC/SMD number.
ESD Markings (Optional)MIL-PRF-38535 ESD Class Designation Marking
ESD Voltage Range (V)
1 1 Triangle 0 to 1999
2 2 Triangles 2000 to 3999
3 No Triangles 4000
Offshore Class V Process Flow (Texas Instruments/Unitrode)
Wafer fab acceptance
SPC bond process monitor
100%/100x internal visual, method 2010,condition A
Temperature cycling condition C,50 cycles, centrifuge condition E
PIND, 100, 0 rejects or 5 cycles
Serialization (symbol) 100%
X-ray monitor, real-time video inspection
Burn-in 240 hr
Post-burn-in 240 hr
Post-burn-in electricals, PDA = 3%
100% high/low electricals
Quality conformance inspection (QCI),group A (method 5005) SS + 116/0
Pre-burn-in electrical test (as required)
Fine/gross leak detection (see Note 6),method 1014, conditions B and C
External visual, method 2009
QCI groups B and D, group C by wafer lot
Fine/gross leak detection, method 1014,conditions A/B and C (see Note 6)
Symbolization
YQBF† YYWWLLZ § USAJM38510/30003BCA
*Q¥
SNJ54LS161AJ 00XXY7600801EA #
YQBF† THAILAND^*Q¥
SN54LS161AJ 00XXY
THAILAND^¥
SNJ54S381J 00XXY
THAILAND^¥
TI bug is optional
¥ = ESD marking is optional
† YQ = diffusion date, B = die revision,F = wafer fab code (optional)
§ YYWW = seal date,LL = lot window,Z = B/I split lot
* Q marking denotes QML-compliant product
# Where TI is an approved source
^ Country of origin may belocated on package underside.
Example: JANB 54LS161A
Order as: JM38510/3003BCA
Example: SNJ 54LS161A
Order as: SNJ54LS161AJ or 7600801EA
Example: SN 54LS161A
Order as: SN54LS161AJ
Example: SNJ with no SMD
Order as: SNJ54S381J
SMJ YQBF†
320C30GBM405962-9052604MXA¥ 00XXY Q *
YQBF†
UCC1806JQMLV5962-9457501VEAYYWWLLZ§ THAILAND^
*Q¥
Example: SMJ 320C30GBM40Order as: SMJ320C30GBM40
or 5962-9052604MXA
Example: UCC 1806JQMLV
Order as: 5962-9457501VEA
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