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2009 IEEE BTW Update Fort Collins, Colorado September 16, 2009

2009 IEEE BTW Update

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2009 IEEE BTW Update. Fort Collins, Colorado September 16, 2009. IEEE Board Test Workshop Update. Agenda iNEMI Test TIG Update 2010 Test Projects. Introductions. Board & Systems Test TIG Chair: Rosa Reinosa (HP) Co-Chair: James Grealish (Intel). Objective & Scope. Test - PowerPoint PPT Presentation

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Page 1: 2009 IEEE BTW Update

2009 IEEE BTW Update

Fort Collins, Colorado

September 16, 2009

Page 2: 2009 IEEE BTW Update

2

IEEE Board Test Workshop UpdateIEEE Board Test Workshop Update

• Agenda

– iNEMI Test TIG Update

– 2010 Test Projects

Page 3: 2009 IEEE BTW Update

Introductions Introductions

Board & Systems Test TIG

• Chair: Rosa Reinosa (HP)

• Co-Chair: James Grealish (Intel)

Page 4: 2009 IEEE BTW Update

Objective & Scope Objective & Scope

Test

• To improve the effectiveness of the test process and the quality of electronic products in a global manufacturing environment

• Scope includes test technology and process improvement for boards and systems (e.g. automated inspection, electrical test, boundary scan, functional test, system test)

Page 5: 2009 IEEE BTW Update

Test TIG Projects 2010

Board Flexure Initiative

Chair: Rosa Reinosa (HP)

Co-Chair: Alan McAllister (Intel)

TEST TIG

Chair: Rosa Reinosa

Co-Chair: JJ Grealish

Boundary Scan (Phase II)

Chair: Phil Geiger (Dell)

Co-Chair: Steve Butkovitch (Cisco)

BIST

Chair: Zoe Conroy

Co-Chair: TBD

Test Economic Model (Phase II)

Chair: TBD

Co-Chair: TBD

Page 6: 2009 IEEE BTW Update

Summary of 2009 activities

Accomplishments• Completion of iNEMI 5 Year Test Technology Roadmap to

be published by iNEMI

• Completed gap analysis

• Identified and reviewed proposals for 2010 projects

• Completed Functional Test Coverage project

Page 7: 2009 IEEE BTW Update

Board Flexure Initiative Project

2009 Update

• New Spherical Bend Test Method Standard (IPC/JEDEC 9707) is being completed

• Feedback from JEDEC and IPC 6-10d committees has been gathered

• Proposal will go for ballot in IPC & JEDEC in Oct 2009

Phase II

• Starting in 2010

• Goal: Update IPC 9702 (Monotonic Bend Test Method) and IPC 9704 (Strain Gauge Standard)

Page 8: 2009 IEEE BTW Update

Boundary Scan Project

2009 Update

• Industry Survey (completed)

• Survey analysis (completed)

• ITC paper (To be published)

• Move forward recommendations

Phase II

• To be determined

Page 9: 2009 IEEE BTW Update

Functional Test Coverage Project

2009 Update

• Project has been completed

• Webinar held on 8/12/09 (hosted by iNEMI)

• Results will be made available to iNEMI participating companies

• Completed in 2009

Page 10: 2009 IEEE BTW Update

BIST Project

New in 2010• Currently in project definition phase• Need more companies to join• Chair: Zoe Conroy from Cisco ([email protected])• Introduced by Huawei

Potential Project Steps:• Survey (current state of BIST in the industry)• BIST as an ICT alternative Investigation• Development of Related Standards• New BIST Board Level Standard Proposal• White Paper

Page 11: 2009 IEEE BTW Update

iNEMI Test Cost Model (Phase II)

New in 2010

• Seeking to optimize iNEMI Test Cost Model

• Currently in project definition phase

• Need more companies to join

• Contact: Haley Fu if interested ([email protected])

• Introduced by Huawei