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General DescriptionThe MAXQ7667 smart system-on-a-chip (SoC) provides atime-of-flight ultrasonic distance-measuring solution. Thedevice is optimized for applications involving large dis-tance measurement with weak input signals or multipletarget identification. The MAXQ7667 features high signal-to-noise ratio achieved by combining flexible electronicswith the intelligence necessary to optimize each functionas environmental and target conditions change.
An integrated burst signal generator and echo receptioncomponents process ultrasonic signals between 25kHzand 100kHz. Echo reception components include a pro-grammable gain low-noise amplifier (LNA), a 16-bitsigma-delta ADC to digitize the received echo signals,and digital signal processing (DSP). DSP limits noisewith a bandpass filter, and creates an echo envelopethrough demodulation and lowpass filtering. Inputreferred noise is a low 0.7µVRMS. A programmablephase-locked loop (PLL) frequency synthesizer suppliesthe reference frequency for the burst generator and theclock for the echo receiver’s digital filter. An embedded16-bit MAXQ20 microcontroller (µC) controls all the pre-ceding functions.
The µC optimizes the burst frequency and receptionfrequency for each transmission at any temperature.The MAXQ7667 achieves smart sensing by monitoringthe echo signals and then actively changing the trans-mitted and received parameters to obtain optimumresults. Digital filtering and burst synthesis do notrequire CPU intervention. This leaves all the CPU poweravailable for echo optimization, communication, diag-nostics, and additional signal processing.
The MAXQ7667 operates with three different powersupply voltages: +5V, +3.3V, and +2.5V. Two internallinear regulators allow operation from a single +5V sup-ply when three external power supplies are not avail-able. Alternatively, the MAXQ7667 can control anexternal pass transistor to allow operation from a singlesupply voltage of +8V to +65V or more, depending onthe external component tolerance. The device is avail-able in a 48-pin LQFP package and is specified tooperate from -40°C to +125°C.
Applications
Features Smart Analog Peripherals
Dedicated Ultrasonic Burst GeneratorEcho Receiving Path (Includes LNA, Sigma-Delta ADC)5-Channel, 12-Bit SAR ADC with 250ksps Sampling RateInternal Bandgap Voltage Reference for theADCs (Also Accepts External Voltage Reference)
Timer/Digital I/O Peripherals High-Performance, Low-Power, 16-Bit RISC Core Program and Data Memory Crystal/Clock Module 16 x 16 Hardware Multiplier with 48-Bit
Accumulator, Single Clock Cycle Power-Management Module JTAG Interface Universal Asynchronous Receiver-Transmitter
(UART) Local Interconnect Network (LIN)
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________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-4598; Rev 1; 7/09
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any devicemay be simultaneously available through various sales channels. For information about device errata, go to: ww.maxim-ic.com/errata.
Pin Configuration appears at end of data sheet.
See the Detailed Features section for complete list of features.
Note: All devices are specified over the -40°C to +125°C oper-ating temperature range./V denotes an automotive qualified part.+Denotes a lead(Pb)-free/RoHS-compliant package.
PART PIN-PACKAGERAM (KB)
FLASH (KB)
MAXQ7667AACM/V+ 48 LQFP 4 32
Automotive Parking
Vehicle Security
Industrial Processing
Automation
Handheld Devices
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2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functionaloperation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure toabsolute maximum rating conditions for extended periods may affect device reliability.
DVDDIO, GATE5, REG3P3, REG2P5 to DGND................................................................-0.3V to +6.0V
AVDD to AGND .....................................................-0.3V to +4.0VDVDD to DGND.....................................................-0.3V to +3.0VDVDDIO to DVDD..................................................-0.3V to +6.0VAVDD to DVDD......................................................-0.3V to +4.0VAGND to DGND.....................................................-0.3V to +0.3VDigital Inputs/Outputs to DGND..........-0.3V to (VDVDDIO + 0.3V)
Analog Inputs/Outputs to AGND............-0.3V to (VAVDD + 0.3V)XIN, XOUT to DGND ..............................-0.3V to (VDVDD + 0.3V)Maximum Current into Any Pin............................................50mAContinuous Power Dissipation (TA = +70°C)
48-Pin LQFP (derate 21.7mW/°C above +70°C).....1739.1mWOperating Temperature Range .........................-40°C to +125°CStorage Temperature Range .............................-60°C to +150°CLead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ECHO INPUT (Low-Noise Amplifier and Sigma-Delta ADC)
VGA gain adjust = 1.55µVP-P/LSB 5.6 Input-Referred Noise (Note 1) VGA gain adjust = 0.1µVP-P/LSB 0.7
µVRMS
VGA gain adjust = 1.55µVP-P/LSB 80 Minimum Detectable Signal
VGA gain adjust = 0.1µVP-P/LSB 10 µVP-P
VGA gain adjust = 1.55µVP-P/LSB, unclipped
100
Operating Input Range VGA gain adjust = 0.1µVP-P/LSB, unclipped
6.7
mVP-P
VGA gain adjust = 1.55µVP-P/LSB
1.55
Programmable Gain From echo input to bandpass filter in reply to input VGA gain adjust
= 0.1µVP-P/LSB 0.1
µVP-P/LSB
Programmable-Gain Adjust Resolution
(Note 2) 10 %
LNA Bandwidth 150 kHz
ADC Sampling Rate 80 x fBPF kHz
ADC Output Data Rate 10 x fBPF kHz
ADC Output Data Resolution 16 Bits
Echo-Input Resistance RIN For each echo input 14 k
Echo-Input Capacitance 14 pF
Echo-Input DC Bias Voltage VAVDD/2 V
Maximum Overvoltage Recovery Time
Recover from 2VP-P input 10 µs
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ELECTRICAL CHARACTERISTICS (continued)(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
BANDPASS FILTER
Center Frequency fBPF 25 100 kHz
Passband Width -3dB 0.14 x fBPF kHz
Minimum Stopband Rejection
One decade away from center frequency
-60 dB
Output Data Rate 10 x fBPF ksps
Output Data Resolution 16 Bits
LOWPASS FILTER
Corner Frequency fLPF -3dB 0.1 x fBPF kHz
Rolloff 40 dB/Decade
Output Data Rate 5 x fBPF ksps
Output Data Resolution 16 Bits
SAR ADC
Measurement 12 Resolution
No missing codes 11 Bits
Integral Nonlinearity Tested at 125ksps ±1 ±2 LSB
Differential Nonlinearity Tested at 125ksps -2 +2 LSB
Offset Error ±1 ±3 mV
Offset-Error Drift ±5 µV/°C
Gain Error ±1 %
Gain-Error Temperature Coefficient
±0.4 ppmFS/°C
Input-Referred Noise At ADC inputs 400 µVRMS
Unipolar 0 VREFDifferential Input Range
Bipolar -VREF/2 +VREF/2V
Absolute Input Range 0 VAVDD V
Input Leakage Current ±0.1 µA
Conversion Time 13 ADCCLK cycles at 2MHz 6.5 µs
Input Capacitance 14 pF
Track-and-Hold Acquisition Time
Three ADCCLK cycles at 2MHz 1.5 µs
Turn-On Time Eight ADCCLK cycles at 2MHz 4 µs Conversion Clock fADCCLK 0.5 4 MHz
Conversion Rate fADCCLK = 4MHz (not production tested)
250 ksps
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ELECTRICAL CHARACTERISTICS (continued)(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
REFERENCE BUFFER
Offset 5 mV
Minimum Load 2.5 kΩOutput Bypass Capacitor 0.47 µF
EXTERNAL VOLTAGE REFERENCE (Reference Buffer Disabled)
Reference Input Range Applied at REF 1.0 VAVDD V
Reference Input ImpedanceMeasured at REF with the SAR andsigma-delta ADCs running atmaximum frequency
50 kΩ
INTERNAL VOLTAGE REFERENCE (REFBG)
Initial Accuracy 2.45 2.5 2.55 V
Maximum TemperatureCoefficient
100 ppm/°C
Output Impedance 1.1 kΩPower-Supply Rejection Ratio VAVDD = 3.0V to 3.6V 60 dB
Output Noise 0.5 mVRMS
PROGRAMMABLE BURST-FREQUENCY OSCILLATOR
Burst-Frequency Range 0.025 1.335 MHz
Burst-Frequency Resolution 0.1 %
Change from 40kHz to 60kHz 5Burst-Frequency LockingTime Change from 50kHz to 50.5kHz 2
ms
CRYSTAL OSCILLATOR
Tested crystal frequency 16
Minimum crystal frequency 4Frequency Range
External clock input 4 16
MHz
Temperature Stability Excluding crystal 25 ppm/°C
Startup Time 16MHz crystal 10 ms
XIN Input Low Voltage When driven with external clock source0.3 x
VDVDDV
XIN Input High Voltage When driven with external clock source0.7 x
VDVDDV
INTERNAL RC OSCILLATOR
Frequency 13.5 MHz
Initial Accuracy 10.5 %
Temperature Drift TA = TMIN to TMAX 700 ppm
Supply Rejection VDVDD = 2.25V to 2.75V -1.5 %
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ELECTRICAL CHARACTERISTICS (continued)(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Adjustable Frequency Range Using the RCTRM register -40 +40 %
Frequency AdjustmentResolution
0.2 %
SUPPLY VOLTAGE SUPERVISORS
DVDD Reset ThresholdAsserts RESET if VDVDD falls belowthis threshold
2.10 2.25 V
DVDD Interrupt ThresholdGenerates an interrupt if VDVDD fallsbelow this threshold
2.25 2.38 V
Minimum Reset and InterruptThreshold Difference
150 mV
AVDD Interrupt ThresholdGenerates an interrupt if VAVDD fallsbelow this threshold
2.95 3.15 V
DVDDIO Interrupt ThresholdGenerates an interrupt if VDVDDIO fallsbelow this threshold
4.5 4.75 V
Supervisor Operating Range At DVDD 1.5 2.75 V
Supervisor Hysteresis 1 %
RESET Release DelayAfter VDVDD rises above the resetthreshold
35 µs
Power-Up TimeTime from RESET is released to theexecution of the first instruction (serialbootloader off)
1 µs
+5V LINEAR REGULATOR (DVDDIO, GATE5, Requires External Pass Transistor, see the Typical ApplicationCircuit/Functional Diagram)
Regulator Output Voltage At DVDDIO 4.75 5.25 V
GATE5 Output High Voltage ISOURCE = 0µA (no load)VDVDDIO
- 0.1V
GATE5 Output Low Voltage ISINK = 500µA 2 V
GATE5 Output Resistance ISINK = 0µA to 50µA 330 ΩGain Bandwidth DVDDIO to GATE5 1.58 kHz
Gain DVDDIO to GATE5 1700 V/V
GATE5 Slew Rate 4.3 V/ms
Maximum Load CapacitanceMaximum capacitance on DVDDIOwhen using an external pass transistor
1 µF
+3.3V LINEAR REGULATOR (REG3P3)
REG3P3 Output Voltage 3.15 3.45 V
Load Current 50 mA
Output Short-Circuit Current REG3P3 shorted to AGND 150 mA
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ELECTRICAL CHARACTERISTICS (continued)(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
+2.5V LINEAR REGULATOR (REG2P5)
REG2P5 Output Voltage 2.38 2.62 V
Load Current 50 mA
Output Short-Circuit Current REG2P5 shorted to DGND 100 mA
POWER REQUIREMENTS
DVDD 2.25 2.5 2.75
AVDD 3.00 3.3 3.6 Supply Voltage Range
DVDDIO 4.5 5.0 5.5
V
All analog functions enabled 12 18 mA
All analog functions disabled 3 10 µA
LNA 2.4
Sigma-delta ADC 12 mA
SAR ADC, 250ksps, fADCCLK = 4MHz
600
PLL 300
Supply voltage supervisors
3
Internal voltage reference
220
Reference buffer 300
µA
AVDD Supply Current Incremental AVDD supply current
Bias (any AVDD module enabled)
1.5 mA
DVDD Supply Current 11 mA
DVDDIO Supply Current 2.5 mA
DIGITAL INPUTS (GPIO, UART, JTAG, SPI™)
Input High Voltage VDVDDIO
- 1 V
Input Low Voltage 0.8 V
Input Hysteresis VDVDDIO = 5.0V 500 mV
Input Leakage Current Digital input voltage = DGND or DVDDIO, pullup disabled
±0.01 ±1 µA
Pullup/Pulldown Resistance Pulled up to DVDDIO internally, pulled down to DGND internally
150 k
Input Capacitance 15 pF
SPI is a trademark of Motorola, Inc.
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_______________________________________________________________________________________ 7
ELECTRICAL CHARACTERISTICS (continued)(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DIGITAL OUTPUTS (GPIO, UART, JTAG, SPI)
ISINK = 0.5mA, drive strength = low 0.4 Output Low Voltage
ISINK = 1.0mA, drive strength = high 0.4 V
ISOURCE = 0.5mA, drive strength = low
VDVDDIO - 0.5
Output High Voltage ISOURCE = 1.0mA, drive strength = high
VDVDDIO - 0.5
V
Drive strength = low 880 Maximum Output Impedance Drive strength = high 450
Three-State Leakage ±0.01 ±1 µA
Three-State Capacitance 15 pF
BURST OUTPUT
Output Low Voltage ISINK = 8mA 0.4 V
Output High Voltage ISOURCE = 8mA VDVDDIO -
0.5 V
Drive strength = low 90 Maximum Output Impedance Drive strength = high 45
Three-State Leakage ±0.01 ±1 µA
Three-State Capacitance 15 pF
Short-Circuit Current Burst drive set to high 50 mA
RESET
Internal Pullup Resistance Pulled up to DVDDIO 120 k
Output Low Voltage ISINK = 0.5mA 0.4 V
Output High Voltage No external load VDVDDIO -
0.5 V
Input Low Voltage When driven by external source 0.8 V
Input High Voltage When driven by external source VDVDDIO -
1 V
UART/LIN INTERFACE (UTX, URX)
Asynchronous mode (system clock/32)
500
Synchronous mode (system clock/8) 2000 UART Baud Rates
LIN 2.0 compatibility (Note 3) 1 20
kbps
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8 _______________________________________________________________________________________
Note 1: Noise measured at bandpass filter output with ECHO+ and ECHO- shorted divided by the gain with fBPF = 50kHz.Note 2: Gain adjust resolution typically ranges between 6.25% and 12.5%.Note 3: LIN 2.0 specifies a maximim data rate of 20kbps. Higher data rates could be possible with compatible devices and suitable
line conditions.
ELECTRICAL CHARACTERISTICS (continued)(VDVDDIO = +5V, VAVDD = +3.3V; VDVDD = +2.5V, system clock (fSYSCLK) = 16MHz, burst frequency (fBURST) = bandpass frequency(fBPF) = 50kHz, CREFBG = CREF = 1µF in parallel with 0.01µF, fADCCLK = 2MHz (SAR data rate = 125ksps), TA = TMIN to TMAX, unlessotherwise specified. Typical values are at TA = +25°C.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SPI INTERFACE TIMING (Figures 11 and 12)
SPI Master OperatingFrequency
1/tMCK 0.5 x fSYSCLK 8 MHz
SPI Slave OperatingFrequency
1/tSCK 0.25 x fSYSCLK 4 MHz
SCLK Output Pulse-WidthHigh/Low
tMCH,tMCL
tMCK/2- 25
ns
MOSI Output Hold TimeAfter SCLK Sample Edge
tMOHtMCK/2
- 25ns
MOSI Output Valid to SampleEdge
tMOVtMCK/2
- 25ns
MISO Input Valid to SCLKSample Edge
tMIS 25 ns
MISO Input Hold Time AfterSCLK Sample Edge
tMIH 0 ns
SCLK Inactive to MOSIInactive
tMLH 0 ns
SCLK Input Pulse-WidthHigh/Low
tSCH,tSCL
tSCK/2 ns
SS Active to First Shift Edge tSSE 4tSYSCLK ns
MOSI Input Setup Time toSCLK Sample Edge
tSIS 25 ns
MOSI Input Hold Time AfterSCLK Sample Edge
tSIH 25 ns
MISO Output Valid AfterSCLK Shift Edge Transition
tSOV 50 ns
SS Inactive Duration tSSHtSYSCLK +
25ns
SCLK Inactive to SS RisingEdge
tSDtSYSCLK +
25ns
FLASH PROGRAMMING
Mass erase 200Flash Erase Time
Page erase (512 bytes per page) 20ms
Flash Programming Time 20µs per word 657 ms
Write/Erase Cycles 10,000 Cycles
Data Retention Average temperature = +85°C 15 Years
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BURST OUTPUT FREQUENCY vs. TEMPERATURE
MAX
Q766
7 to
c01
TEMPERATURE (°C)
BURS
T OU
TPUT
FRE
QUEN
CY (k
Hz)
5025 100750-25
49.96
49.97
49.98
49.99
50.00
50.01
50.02
50.03
50.04
50.05
49.95-50 125
USING PLL
LOWPASS FILTER OUTPUTvs. ECHO INPUT AMPLITUDE
MAX
Q766
7 to
c02
ECHO INPUT AMPLITUDE (VP-P)
LPF
OUTP
UT (L
SB)
0.040.02 0.080.06
24,576
32,768
8192
16,384
40,960
49,152
57,344
65,536
00 0.10
PROGRAMMABLE ECHO GAIN = MINIMUM
LOWPASS FILTER OUTPUTvs. ECHO INPUT FREQUENCY
MAX
Q766
7 to
c03
ECHO INPUT FREQUENCY (kHz)
LPF
OUTP
UT (L
SB)
5540 8570
1000
100
10,000
100,000
1025 100
PROGRAMMABLE ECHO GAIN = MINIMUMECHO INPUT AMPLITUDE = 20mVP-P
BANDPASS FILTER OUTPUT NOISE FLOOR vs. BANDPASS FILTER CENTER FREQUENCY
MAX
Q766
7 to
c04
FREQUENCY (kHz)
BAND
PASS
FIL
TER
OUTP
UT (L
SBRM
S)
806040
9
3
6
12
15
020 100
RECEIVE PATH GAIN AT MAXIMUM
TA = +105°C
TA = +25°C
TA = -40°C
RECEIVE PATH RESPONSE TIME(ECHO INPUT TO LOWPASS FILTER OUTPUT)
MAX
Q766
7 to
c05
TIME (µs)
ADC
COUN
T (L
SB)
400200 800600
6000
4000
10,000
2000
8000
14,000
12,000
16,000
00 1000
MINIMUM ECHO GAIN20mVP-P ECHO AMPLITUDE
50kHz ECHO FREQUENCY250ksps
INPUT ON
INPUT OFF
LOWPASS FILTER OUTPUT RIPPLE vs. TIME
MAX
Q766
7 to
c06
TIME (ms)
LPF
OUTP
UT (L
SB)
2 4 6 108
12,500
12,000
14,500
11,500
14,000
10,500
13,000
11,000
13,500
15,000
10,0000 12
MINIMUM ECHO GAIN20mVP-P ECHO AMPLITUDE50kHz ECHO FREQUENCY250ksps
SAR ADC OFFSET ERRORvs. TEMPERATURE
MAX
Q766
7 to
c07
TEMPERATURE (°C)
OFFS
ET E
RROR
(mV)
0 7525-25 10050
0.5
-0.5
0
1.0
1.5
2.0
-1.0-50 125
VAVDD = 3.3V
VAVDD = 3.6V
VAVDD = 3V
Typical Operating Characteristics(VDVDDIO = +5V, VAVDD = +3.3V, VDVDD = +2.5V, fSYSCLK = 16MHz, burst frequency = bandpass frequency = 50kHz, TA = +25°C,unless otherwise noted.)
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SAR ADC GAIN ERRORvs. TEMPERATURE
MAX
Q766
7 to
c08
TEMPERATURE (°C)
GAIN
ERR
OR (m
V)
0 7525-25 10050
2.0
1.0
1.5
2.5
3.0
0.5-50 125
VAVDD = 3.3V
VAVDD = 3.6V
VAVDD = 3V
SAR ADC INL vs. CODE
MAX
Q766
7 to
c09
CODE
INL
(LSB
)
307220481024
0
-0.5
1.5
-1.0
1.0
-1.5
0.5
2.0
-2.00 409625601536512 3584
SAR ADC DNL vs. CODE
MAX
Q766
7 to
c10
CODE
DNL
(LSB
)
307220481024
0
-0.5
1.5
-1.0
1.0
-1.5
0.5
2.0
-2.00 409625601536512 3584
REFERENCE OUTPUT VOLTAGEvs. SUPPLY VOLTAGE
MAX
Q766
7 to
c11
AVDD SUPPLY VOLTAGE (V)
REF
OUTP
UT V
OLTA
GE (V
)
3.53.33.2
2.516
2.515
2.519
2.514
2.518
2.513
2.517
2.520
2.5123.0 3.63.1 3.4
REFERENCE OUTPUT VOLTAGEvs. TEMPERATURE
MAX
Q766
7 to
c12
TEMPERATURE (°C)
REF
OUTP
UT V
OLTA
GE (V
)
0 25 10075
2.53
2.51
2.49
2.47
2.55
2.45-50 12550-25
SUPPLY BROWNOUT THRESHOLDSvs. TEMPERATURE
MAX
Q766
7 to
c13
TEMPERATURE (°C)
SUPP
LY T
HRES
HOLD
(V)
25 1000-25 75
4.5
4.0
3.5
3.0
2.5
5.0
2.0-50 12550
DVDDIO INTERRUPT
AVDD INTERRUPT
DVDD INTERRUPTDVDD RESET
TEMPERATURE (°C)25 1000-25 75-50 12550
REGULATOR OUTPUT VOLTAGEvs. TEMPERATURE
MAX
Q766
7 to
c14
REGU
LATO
R OU
TPUT
VOL
TAGE
(V)
4.5
4.0
3.5
3.0
2.5
5.0
2.0
DVDDIO
AVDD
DVDD
Typical Operating Characteristics (continued)(VDVDDIO = +5V, VAVDD = +3.3V, VDVDD = +2.5V, fSYSCLK = 16MHz, burst frequency = bandpass frequency = 50kHz, TA = +25°C,unless otherwise noted.)
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REG2P5 REGULATOR OUTPUT VOLTAGEvs. LOAD CURRENT
MAX
Q766
7 to
c17
REG2P5 LOAD CURRENT (mA)
REG2
P5 R
EGUL
ATOR
OUT
PUT
VOLT
AGE
(V)
6040
2.5
2.0
1.5
1.0
0.5
3.0
00 12010020 80
RC OSCILLATOR FREQUENCYvs. TEMPERATURE
MAX
Q766
7 to
c18
TEMPERATURE (°C)
RC O
SCIL
LATO
R FR
EQUE
NCY
(MHz
)
0 7525-25 10050
13.5
12.5
13.0
14.0
14.5
15.0
12.0-50 125
VDVDD = 2.25V
VDVDD = 2.75V
VDVDD = 2.50V
DVDDIO REGULATOR OUTPUT VOLTAGEvs. LOAD CURRENT
MAX
Q766
7 to
c15
DVDDIO LOAD CURRENT (mA)
DVDD
IO R
EGUL
ATOR
OUT
PUT
VOLT
AGE
(V)
10050
5.0
4.5
4.0
3.5
5.5
3.00 200150
DRAIN = 8V
DRAIN = 14V
EXTERNAL VOLTAGE SOURCE CONNECTEDTO THE DRAIN OF EXTERNAL PASSTRANSISTOR BSP129
REG3P3 REGULATOR OUTPUT VOLTAGEvs. LOAD CURRENT
MAX
Q766
7 to
c16
REG3P3 LOAD CURRENT (mA)RE
G3P3
REG
ULAT
OR O
UTPU
T VO
LTAG
E (V
)
6040
3.0
2.5
2.0
1.5
1.0
0.5
3.5
00 12010020 80
Typical Operating Characteristics (continued)(VDVDDIO = +5V, VAVDD = +3.3V, VDVDD = +2.5V, fSYSCLK = 16MHz, burst frequency = bandpass frequency = 50kHz, TA = +25°C,unless otherwise noted.)
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Pin DescriptionPIN NAME FUNCTION
1 P1.3/TCK Port 1 Data 3/JTAG Serial Clock Input. P1.3 is a general-purpose digital I/O. TCK is the JTAG serial test clock input. Refer to the MAXQ7667 User’s Guide Sections 5 and 11.
2 P1.4/MOSI Port 1 Data 4/SPI Serial Data Output. P1.4 is a general-purpose digital I/O. MOSI is the master output, slave input for the SPI interface. Refer to the MAXQ7667 User’s Guide Sections 5 and 9.
3 P1.5/MISO Port 1 Data 5/SPI Serial Data Input. P1.5 is a general-purpose digital I/O. MISO is the master input, slave output for the SPI interface. Refer to the MAXQ7667 User’s Guide Sections 5 and 9.
4 P1.6/SCLK Port 1 Data 6/SPI Serial Clock Output. P1.6 is a general-purpose digital I/O. SCLK is the serial clock for the SPI interface. SCLK is an input when operating as a slave and an output when operating as a master. Refer to the MAXQ7667 User’s Guide Sections 5 and 9.
5 P1.7/SYNC/SS
Port 1 Data 7/Schedule Timer Sync Input/SPI Slave Select. P1.7 is a general-purpose digital I/O. A rising edge on the SYNC input resets the schedule timer. In SPI slave mode, SS is the SPI slave-select input. In SPI master mode, use SS or a GPIO to manually select an external slave. Refer to the MAXQ7667 User’s Guide Sections 5, 7, and 9.
6, 19, 42 DVDD Digital Supply Voltage. Connect DVDD directly to a +2.5V external source or to REG2P5 output for single supply operation. Bypass DVDD to DGND with a 0.1µF capacitor as close as possible to the device. Connect all DVDD nodes together.
7, 18, 43 DGND Digital Ground. Connect all DGND nodes together. Connect to AGND at a single point.
8, 17, 44 DVDDIO Digital I/O Supply Voltage. DVDDIO powers all digital I/Os except for XIN and XOUT. Bypass DVDDIO to DGND with a 0.1µF capacitor as close as possible to the device. Connect all DVDDIO nodes together.
9 P0.0/URX Port 0 Data 0/UART Receive Data Input. P0.0 is a general-purpose digital I/O. URX is a UART or LIN data receive input. Refer to the MAXQ7667 User’s Guide Sections 5 and 8.
10 P0.1/UTX Port 0 Data 1/UART Transmit Data Output. P0.1 is a general-purpose digital I/O. UTX is a UART or LIN data transmit output. Refer to the MAXQ7667 User’s Guide Sections 5 and 8.
11 P0.2/TXENPort 0 Data 2/UART Transmit Output. P0.2 is a general-purpose digital I/O. TXEN asserts low when the UART is transmitting. Use TXEN to enable an external LIN/UART transceiver. Refer to the MAXQ7667 User’s Guide Sections 5 and 8.
12P0.3/T0/ ADCCTL
Port 0 Data 3/Timer 0 I/O/ADC Control Input. P0.3 is a general-purpose digital I/O. T0 is the primary Type 2 timer/counter 0 output or input. ADCCTL is a sampling/conversion trigger input for the SAR ADC. Refer to the MAXQ7667 User’s Guide Sections 5, 6, and 14.
13 P0.4/T0B Port 0 Data 4/Timer 0B I/O/Comparator Output. P0.4 is a general-purpose digital I/O. T0B is the secondary Type 2 timer/counter 0 output or input. Refer to the MAXQ7667 User’s Guide Sections 5 and 6.
14 P0.5/T1 Port 0 Data 5/Timer 1 I/O. P0.5 is a general-purpose digital I/O. T1 is the primary Type 2 timer/counter 1 output or input. Refer to the MAXQ7667 User’s Guide Sections 5 and 6.
15 P0.6/T2 Port 0 Data 6/Timer 2 I/O. P0.6 is a general-purpose digital I/O. T2 is the primary Type 2 timer/counter 2 output or input. Refer to the MAXQ7667 User’s Guide Sections 5 and 6.
16 P0.7/T2B Port 0 Data 7/Timer 2B I/O. P0.7 is a general-purpose digital I/O. T2B is the secondary Type 2 timer/counter 2 output or input. Refer to the MAXQ7667 User’s Guide Sections 5 and 6.
20 XIN Crystal Oscillator Input. Connect an external crystal or resonator between XIN and XOUT. When using an external clock source drive XIN with 2.5V level clock while leaving XOUT unconnected. Connect XIN to DGND when an external clock source is not used.
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Pin Description (continued)PIN NAME FUNCTION
21 XOUT Crystal Oscillator Output. Connect an external crystal or resonator between XIN and XOUT. Leave XOUT unconnected when driving XIN with a 2.5V level clock or when an external clock source is not used.
22 REG2P5 +2.5V Voltage Regulator Output
23 REG3P3 +3.3V Voltage Regulator Output
24 GATE5 +5V DVDDIO Voltage Regulator Control Output. GATE5 controls an external npn or nMOS transistor that passes power to DVDDIO.
25 RESETReset Input/Output. RESET is open drain with an internal pullup resistor to DVDDIO. Internal circuitry pulls RESET low when VDVDDIO falls below its brownout reset value or watchdog reset is enabled and the watchdog timeout period expires. Force RESET low externally for manual reset.
26 FILT PLL VCO Control Input. Connect external filter components on FILT for the internal PLL circuit. See the Typical Application Circuit/Functional Diagram.
27, 32 AVDD Analog Supply Voltage. Connect all AVDD inputs directly to a +3.3V source or to REG3P3 for self-powered operation. Bypass each AVDD to AGND with a 0.1µF capacitor as close as possible to the device.
28, 31, 33 AGND Analog Ground. Connect all AGND nodes together. Connect to DGND at a single point.
29 ECHON Negative Echo Input. AC-couple ECHON to an ultrasonic transducer.
30 ECHOP Positive Echo Input. AC-couple ECHOP to an ultrasonic transducer.
34 REF
ADC Reference Input/Reference Buffer Output. When using the internal reference, the buffered bandgap reference voltage (VREF) is provided for both SAR and sigma-delta ADCs. When using an external reference, apply an external voltage source ranging between 1V and VAVDD at REF. Disable the reference buffer when applying an external reference at REF. Bypass REF to AGND with a 0.47µF capacitor.
35 REFBG +2.5V Reference Output/Reference Buffer Input. Bypass to AGND with a 0.47µF capacitor.
36 AIN0 SAR ADC Input 0. AIN0 pairs with AIN1 in differential mode.
37 AIN1 SAR ADC Input 1. AIN1 pairs with AIN0 in differential mode.
38 AIN2 SAR ADC Input 2. AIN2 pairs with AIN3 in differential mode.
49 AIN3 SAR ADC Input 3. AIN3 pairs with AIN2 in differential mode.
40 AIN4 SAR ADC Input 4
41 N.C. No Connection. Internally connected. Leave unconnected.
45 BURST Burst Output. Burst is the ultrasonic transducer excitation pulse output. BURST remains in three-state mode on power-up.
46 P1.0/TDO Port 1 Data 0/JTAG Output. P1.0 is a general-purpose digital I/O. TDO is the JTAG serial data output. Refer to the MAXQ7667 User’s Guide Sections 5 and 11.
47 P1.1/TMS Port 1 Data 1/JTAG Test Mode-Select Input. P1.1 is a general-purpose digital I/O. TMS is the JTAG mode-select input. Refer to the MAXQ7667 User’s Guide Sections 5 and 11.
48 P1.2/TDI Port 1 Data 2/JTAG Input. P1.2 is a general-purpose digital I/O. TDI is the JTAG serial data input. Refer to the MAXQ7667 User’s Guide Sections 5 and 11.
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BURST ENABLEBURST
TRANSDUCER
ECHON
ECHOP
GATE5
DVDDIO
BSP129
BURST OUTPUT DUTY CYCLE AND PULSE COUNTER
2mVP-P0V
SIGMA- DELTA ADC
12-BIT SAR ADC
0.47µF 0.47µF
VOLTAGE REFERENCE
THRESHOLD ADJUST
MAXQ20 RISC µC
PROGRAMMABLE PLL
CLOCK PRESCALER DIVIDE BY 1 TO 128
DIGITAL BANDPASS
FILTERLNA
SCHEDULE TIMER
CRYSTAL OSCILLATOR
13.5MHz RC
OSCILLATORWATCHDOGPOR/
BROWNOUT
INTERFACE MODULE
LIN TRANSCEIVER
CONN
ECTO
R
TIMER 2
PO.6/T2
PO.7/T2B
PO.3/T0/ADCCTL
PO.4/T0B
PO.5/T1
RESETAGND
TIMER 1 TIMER 0
FULL- WAVE
RECTIFIER
DIGITAL LOWPASS
FILTER
INTERRUPT
FIFO
ROM
FLASH
RAM
16 x 16 HW MULT
PLUS ACCUM
AIN0
REFREFBG
AIN1AIN2
AIN3 THERMISTOR
BATTERY+
AIN4
FILT
24kΩ
33nF
330pF
AVDD
20pF
XIN XOUT
16MHz
0.1µF
0.01µF
0.01µF
470pF
470pF
20pF
REG3P3
AVDD0.1µF
REG2P5
DVDD
DGND
GPIO/JTAG
GPIO/SPI
P0.0/URXRx
LIN
+8V TO +20V
LIN
GND
V+
TxP0.1/UTX
0.1µF
MAXQ7667
Typical Application Circuit/Functional Diagram
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Detailed Features Smart Analog Peripherals
Dedicated Ultrasonic Burst GeneratorEcho Receiving Path
Low-Noise AmplifierTime Variable Gain Amplifier16-Bit Sigma-Delta ADCDigital Bandpass FilterFull-Wave Rectifier and Digital Lowpass Filter8-Deep, 16-Bit Wide FIFO Simplifies Real-TimeProcessingMagnitude Comparator
5-Channel, 12-Bit SAR ADC with 250kspsSampling RateInternal Bandgap Voltage Reference for the ADCs(Also Accepts External Voltage Reference)
Timer/Digital I/O PeripheralsSPI InterfaceThree 16-Bit (or Six 8-Bit) Programmable Type 2Timers/Counters16-Bit Schedule TimerProgrammable Watchdog Timer16 General-Purpose Digital I/Os withMultipurpose Capability
High-Performance, Low-Power, 16-Bit RISC Core1MHz–16MHz Operation, Approaching 1MIPS per1MHzLow Power (< 2.5mA/MIPS, DVDD = +2.5V)16-Bit Instruction Word, 16-Bit Data Bus33 Instructions (Most Require Only One ClockCycle)16-Level Hardware StackThree Independent Data Pointers with AutomaticIncrement/Decrement
Program and Data MemoryInternal 32KB Program FlashInternal 4KB Data RAMInternal 8KB Utility ROM
Crystal/Clock Module1MHz–16MHz External Crystal Oscillator13.5MHz Internal RC OscillatorExternal Clock Source Operation
16 x 16 Hardware Multiplier with 48-BitAccumulator, Single Clock Cycle Operation
Power-Management ModulePower-On Reset (POR)Power-Supply Supervisor/Brownout Detection forAll SuppliesOn-Chip +5V, +3.3V, and +2.5V Regulators forSingle Supply Operation
JTAG InterfaceExtensive Debug and Emulation SupportIn-System Test CapabilityFlash-Memory-Program Download
UARTSynchronous and Asynchronous TransfersIndependent Baud-Rate Generator2-Wire InterfaceTransmit and Receive FIFOs
LINSupports LIN 1.3, LIN 2.0, and SAE J2602Automatic Baud-Rate Detection and LIN FrameSynchronizationUp to 64 Bytes Frame LengthAutomatic Calculation of Standard (LIN 1.3) andEnhanced (LIN 2.0) Checksums
7mm x 7mm, 48-Pin LQFP Package -40°C to +125°C Operating Temperature Range
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Detailed DescriptionThe ultrasonic distance-measurement peripherals in theMAXQ7667 include a burst signal generator foracoustic transmission and mixed signal circuits foramplifying and digitizing echo signals ranging between25kHz and 100kHz. The burst signal is a square wavewith adjustable duty cycle and pulse count. The burst isderived either directly from the system clock or from aprogrammable PLL locked to the system clock. TheMAXQ7667 effectively digitizes the echo signalsreceived at the ECHOP and ECHON inputs using anLNA, sigma-delta ADC with variable analog gain ampli-fier, noise-limiting digital bandpass filter, digital full-wave rectifier, and a digital lowpass filter (see theTypical Application Circuit/Functional Diagram). Thedevice detects echo signals at the burst frequency withamplitudes ranging from 10µVP-P to 100mVP-P. Echoesgreater than 100mVP-P and less than 2VP-P are internal-ly clipped but do not saturate the receiver. To optimizeecho reception, the clock used for processing the echolocks to the burst frequency. The MAXQ7667’s burstgenerator can generate higher frequencies, but themaximum usable frequency for the echo receive path is100kHz . For applications requiring transducer frequen-cies above 100kHz, implement an external echoreceive path. The SAR ADC can then digitize the fil-tered echo envelope.
An integrated 16-bit RISC µC (MAXQ20) provides tim-ing control, signal processing, and data I/O. The 16-bitHarvard architecture RISC core executes most instruc-tions in a single clock cycle from instruction fetch tocycle completion. The MAXQ20 provides optimal per-formance for noise-sensitive analog applications.
The MAXQ7667 includes a 13.5MHz RC oscillator,external crystal oscillator, watchdog timer, scheduletimer, three general-purpose Type 2 timers/counters,two 8-bit GPIO ports, SPI interface, JTAG interface, LINcapable UART interface, 12-bit SAR ADC with five mul-tiplexed input channels, supply-voltage monitors, and avoltage reference for communication, diagnostics, andmiscellaneous support.
Burst ControllerThe MAXQ7667 provides a square-wave burst signal atthe BURST output. Use the burst control to transmit anultrasonic signal. Typical applications use the burst sig-nal to switch an external transistor that drives a high-voltage transformer, which excites the transducer (seethe Typical Application Circuit/Functional Diagram).Use software to configure the duty cycle, frequency,number of pulses, and drive current of the burst. SeeSection 17 of the MAXQ7667 User’s Guide.
Derive the burst signal either directly from the systemclock or from a programmable oscillator phase lockedto the system clock (Figure 1). Using the system clocklimits the burst frequency to one of 16 choices. Integerdivision of the system clock generates these 16 fre-quencies. The PLL allows a fractional division of thesystem clock. Any frequency within the PLL range isselectable to a resolution of 0.13% or better.
When using the internal PLL, connect external filtercomponents (C1, R1, and C2) to FILT as shown inFigure 1. These components filter the analog voltagethat controls the VCO in the PLL. The filter componentvalues shown in the figure are suitable for the entirePLL frequency range.
MAXQ7667
C2330pF
SYSTEMCLOCK
(fSYSCLK)
ECHORECEIVECLOCK
PLL
C133nF
FILT
R124kΩ
PWM
2mVP-PDIAGNOSTIC
BURST
1
0
BTRN.10:BCKS
BPH[9:0]
PLLF[10:9]:PLLC[1:0]
BTRN[15:12]:BDIV[3:0]
BTRN[7:0]:BCNT[7:0]
BPH.15:BSTT
BTRN.9:BTRI
BPH.14:BDSBTRN.11:BPOL
BTRN.8:BGT
BURST
PLLF[8:0]
BURST CLOCKGENERATOR
RECEIVE CLOCKPRESCALE
Figure 1. Burst Transmission Stage
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Echo Receive PathLow-Noise Amplifier (LNA)
The LNA provides a 40V/V fixed gain to the input signal.The differential inputs of the LNA are ECHOP andECHON. For proper biasing of the LNA, AC-couple thetransducer or any external circuitry to ECHOP andECHON. For a single-ended input signal, AC-couple thesignal to ECHOP with a 0.01µF capacitor and connectECHON to AGND through a 0.01µF capacitor placed asclose as possible to the signal source. The outputs of theLNA connect to the inputs of a 16-bit sigma-delta ADCand can connect internally to the AIN0 and AIN1 inputsof the SAR ADC for external monitoring (Figure 2).
Diagnostic SignalsAn analog multiplexer located at the input of the LNAselects one of three possible signals for processing bythe echo receive path; the normal echo signal AC-cou-pled to the ECHOP and ECHON inputs, 0V signal, or a2mVP-P internally generated signal (Figure 2). The2mVP-P square-wave signal, with frequency and dutycycle matching the burst signal, allows the echoreceive chain to process a simulated echo.
MAXQ7667
0.47µF
AGND
REFGB
0.47µF
TO EXTERNAL VOLTAGEREFERENCE
AGND
REF
VARIABLEGAIN SIGMA-DELTA ADC
FIFO8 x 16
FIFOCONTROL
BANDPASSFILTER
CLOCKCONTROL
ECHORECEIVECLOCK
RCVC[4:0]:RCVGN[4:0]RCVC[7:6]:LNAISEL[1:0]
RCVC.8:LNAOSEL
BPFI[15:0]
APE.13:RSARE
2.5VBANDGAP REF
APE.12:BGE
FULL-WAVERECTIFIER PLUSLOWPASS FILTER
R*
R*
*R = ECHO INPUT RESISTANCE. SEE THE ELECTRICAL CHARACTERISTICS SECTION.
40R*
AIN0TO SAR ADC
AIN1
0V
2mVP-P
40R*
LNAAVDD/2
ECHOP
ECHON
MUX
BPFO[15:0]
LPFD[15:0]
CMPC[14:0]:CMPH[14:0]
CMPT[15:0]
LPFC[15:12]:FFIL[3:0]
LPFC[2.0]:FFLS[2:0]LPFC.7:FFOV
ASR.2:LPFFL
LPFC[11:8]:FFDP[3:0]
CMPC.15:CMPP
ASR.12:CMPLVL
AIE.3:CMPIE
LPFF[15:0]
ASR.3:CMPI
COM
PARA
TOR
AIE.1:LPFIE
ASR.1:LPFRDY
LPFC.3:FFLD
TIMER 0TIMER 1TIMER 2
DATA READYINTERRUPT
AIE.2:LFLIE
Figure 2. Echo Receive Path
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
______________________________________________________________________________________ 17
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Sigma-Delta ADCThe MAXQ7667 features a 16-bit sigma-delta ADC withan analog gain adjustable from 38dB to 60dB (includ-ing the fixed LNA gain) with a maximum gain step of12.5% (typical). Gain changes settle within one ADCconversion. Use software to create a virtual time vari-able gain amplifier. A digital bandpass and lowpass fil-ters remove switching glitches and DC offset at theoutput of the ADC.
In a typical application, the software sets the gain to alow value when the burst is first sent and increases thegain as the time from when the burst was sent increas-es. As a result, strong echoes from nearby objects areprocessed without clipping while small signals from dis-tant objects are processed with the maximum gain. TheADC samples the amplified echo signal from the LNA at80 times the burst output frequency. The ADC providesconversion results at a data rate equal to 10 times theburst output frequency. The ADC conversion resultsalso load to an 8-deep first-in-first-out (FIFO) at thenative data rate or a separate time base without loadingthe CPU.
Digital Bandpass FilterThe digital bandpass filter has a center frequency thattracks the burst output frequency. The bandpass widthis 14% of the center frequency. The bandpass filter pro-vides the 16-bit output data at a data rate equal to 10times the burst output frequency.
Full-Wave RectifierThe full-wave rectifier detects the envelope of the digitalbandwidth filter output to generate a DC output propor-tional to the peak-to-peak amplitude of the input signal.Full-wave rectification allows the digital lowpass filter torespond faster without excessive ripple.
Digital Lowpass FilterThe lowpass filter removes the ripple from the full-wavedetector output. The output of the lowpass filter is avail-able at a data rate equal to five times the burst outputfrequency. The corner frequency is 1/5 the burst fre-quency with approximately 40dB per decade rolloff.The 16-bit output data of the lowpass filter is stored in aFIFO register with a depth of eight samples. TheMAXQ7667 allows data transfer from the lowpass filter
SARC[2:0]:SARS[2:0]
SARC[11:9]:SARMX[2:0]
REFERENCE TOSIGMA-DELTA ADC
ADC DATAREADY INTERRUPT
ASR.0:SARRDY
APE.12:BGE
APE.14:RBUFE
AIE.0:SARIE
BANDGAPREF
SARC.3:SARBY
SARC.6:SARDUL
SARC.4:SARASD
SARC.7:SARBIP
SARC.8:SARDIF
OSCC[3:2]:SARCD[1:0]
ADCCLOCK
DIV
TIMER 0TIMER 1TIMER 2
APE.4:SARE ADCCLK
AVDDVREF
MUX
SARC[11:9]:SARMX[2:0]
12-BITADC
AIN0
MUX
AIN1AIN2AIN3
DATA BUS[15:0]
AIN4VREF
AGND
AVDDAGND
REFBG
ADCCTL
REF
SYSCLK
BUFx1.0
Figure 3. SAR ADC Block Diagram
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output to the FIFO automatically each time the lowpassfilter output updates, through the control of one of thetimer outputs, or through software. The device includesa FIFO depth counter with programmable interrupt lev-els and generates an interrupt if a FIFO overflow condi-tion occurs. The output of the digital lowpass filterconnects to a digital comparator that can generate aninterrupt for a specified echo signal level.
Digital Comparator and Threshold AdjustThe digital comparator output asserts when the echoamplitude at the output of the digital lowpass filter cross-es a given threshold. The comparator’s threshold level,hysteresis, and interrupt polarity are programmable.
SAR ADCThe MAXQ7667 incorporates a 12-bit unbuffered SARADC with sample-and-hold and conversion rate up to250ksps. The ADC allows measurements of tempera-
ture, battery voltage, or other parameters using five sin-gle-ended or two fully differential analog inputs(AIN0–AIN4). All of the analog inputs have a range of 0to VREF in unipolar mode and ±VREF/2 in bipolar mode.
The SAR ADC supports three different conversion startsources: timers, ADC control input (ADCCTL), and soft-ware write. The conversion start source triggers theADC acquisition and conversion. The system clock pro-vides the ADC clock frequency programmable to 1/2,1/4, 1/8, or 1/16 of the system clock. Use internalbandgap reference, external reference, or AVDD forvoltage reference of the SAR ADC. Figure 3 shows asimplified block diagram of the SAR ADC.
The output of the SAR ADC is straight binary in unipolarmode and two’s complement in bipolar mode. Figures 4and 5 show the ADC transfer functions in unipolarmode and bipolar mode.
000
001
002
003
004
FFC
FFB
FFD
FFE
FFF
0 1 2 3 4 FSFS - 1.5 LSB
FULL-SCALETRANSITIONFS = REF
ZS = 01 LSB = REF/4096
OUTP
UT C
ODE
(hex
)
DIFFERENTIAL INPUT VOLTAGE (LSB)
Figure 4. Unipolar Transfer Function
800
801
FFE
001
000
FFF
7FE
7FF
-FS 0 +FS
OUTP
UT C
ODE
(hex
)
DIFFERENTIAL INPUT VOLTAGE (LSB)
+FS - 1.5 LSB
FULL-SCALETRANSITION+FS = REF/2
ZS = 0-FS = -REF/21 LSB = REF/4096
-FS + 0.5 LSB
Figure 5. Bipolar Transfer Function
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SAR ADC Analog Input Track-and-Hold (T/H)Figures 6 and 7 show the equivalent input circuit of theMAXQ7667 analog input architecture. During acquisi-tion (track), a sampling capacitor charges to the posi-tive input voltage at AIN0–AIN4 in single-ended modeor AIN0 and AIN2 in differential mode while a secondsampling capacitor connects to AGND in single-endedmode or AIN1 and AIN3 in differential mode. The ADCconversion start source and the ADC dual mode selec-tion bits control the T/H timing.
Voltage ReferenceThe MAXQ7667 supports three possible voltage refer-ence sources for ADC conversion; 2.5V internalbuffered bandgap reference, external source, andAVDD. The internal 2.5V bandgap reference has highinitial accuracy and temperature coefficient of typicallyless than 100ppm/°C. When operating in internal refer-ence mode, either the buffered output of the internalreference or AVDD connects to the SAR ADC while thebuffered output of the internal reference connects to thesigma-delta ADC. When operating in external referencemode, an external source ranging between 1V andVAVDD applied at either the REF or REFBG inputs pro-
vides the reference to the SAR ADC and sigma-deltaADC. Bypass REFBG and REF to AGND with a 0.47µFcapacitor for optimum performance. See Section 14 ofthe MAXQ7667 User’s Guide.
Schedule TimerThe MAXQ7667’s schedule timer provides general time-keeping and software synchronization to an external I/O.The schedule timer features include the following:
• 16-bit autoreload up-counter for the timer
• Programmable 16-bit alarm register
• Alarm interrupts
• Schedule timer incremented by a programmablesystem clock prescaler (1, 1/2, 1/4, 1/8, 1/16, 1/32,1/64, 1/128)
• Schedule timer up-counter resettable through anexternal I/O pin, which allows synchronization of aschedule timer to an external event
• Wake-up alarm to pull the system clock from stop-mode to normal operation
Figure 8 shows a simplified block diagram of theschedule timer.
AGND
AIN+
AIN-
CIN+
AVDD
CIN-
RIN+
RIN-
Figure 6. Equivalent Input Circuit (Track/Acquisition Mode)
AGND
AIN+
AIN-
CIN+
CIN-
RIN+
RIN-
AVDD
Figure 7. Equivalent Input Circuit (Hold/Conversion Mode)
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MAXQ is a registered trademark of Maxim Integrated Products, Inc.
Type 2 Timers/CountersThe MAXQ7667 includes three 16-bit timers/counterswith programmable I/O (Figure 9). Each timer is a Type2 timer implemented in the MAXQ® family. The Type 2timer is an autoreload 16-bit timer/counter offering thefollowing functions:
• 8-bit/16-bit timer/counter
• Up/down autoreload
• Counter function of external pulse
• Capture
• Compare
Clock SourcesThe MAXQ7667 oscillator module supplies the systemclock for the µC core and all of the peripheral modules.The high-frequency oscillator operates with a 1MHz to16MHz crystal. Use the internal RC oscillator as thesystem clock for applications that do not require pre-cise timing. See Section 15 of the MAXQ7667 User’sGuide.
The MAXQ7667 supports the following master clocksources:
• Internal high-frequency oscillator drives an exter-nal 1MHz–16MHz crystal or ceramic resonator
• Internal, fast-starting, 13.5MHz RC oscillator(default oscillator at startup and in the event theexternal crystal fails)
• External 4MHz–16MHz clock input
Crystal SelectionThe MAXQ7667 requires a crystal with the followingspecifications:
Frequency: 1MHz–16MHz
CLOAD: 6pF (min)
Drive level: 5µW
Series resonance resistance: 30Ω (max)
Note: Quartz crystal vendors often specify series reso-nance resistance (R1). Series resonance resistance isthe resistance observed when the resonator is in theseries resonant condition. When a resonator is used inthe parallel resonant mode with an external load capac-itance, as is the case with the MAXQ7667 oscillator cir-cuit, the effective resistance at the loaded frequency ofoscillation is:
R1 x (1 + (CO/CLOAD))2
For typical shunt capacitance (CO) and load capaci-tance (CLOAD) values, the effective resistance poten-tially exceeds R1 by a factor of 2.
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T2Vx REGISTER16-BIT UP-COUNTER
T2Rx REGISTER16-BIT RELOAD
CAPTURE
EQUAL
OVERFLOW
RELOAD
CLOCK
T2Cx REGISTER16-BIT CAPTURE/COMPARE
OUTPUT CONDITIONINGPOLARITY SELECTION
INPUT CONDITIONINGSCALINGGATING
Figure 9. Type 2 Timer/Counter in 16-Bit Mode
PROGRAMMABLEDIVIDE BY
1, 2, 4, ..., 128
COMPARATORSTIM = SALM
SALMREGISTER
SALM
[15:
0]
STIM16-BIT UP-COUNTER
SCNT.11:STDIV2
SCNT.0:STIME
CLR
CLR
SCHEDULE TIMER
SYSTEMCLOCK
MAXQ7667
SCNT.8:SSYNC_EN
SCNT.7:SALIE
SCNT.1:SALME
INT
AN INTERRUPT ISGENERATED WHEN
SALIE = 1 ANDSALMF = 1
SCNT.6:SALMF
STIM
[15:
0]
P1.7/SYNC
Figure 8. Schedule-Timer Module Block Diagram
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7 6 5 4 3 2 1 0 S1 S0
4 3 2 1 0SYSTEM PROGRAMMING REGISTER
2 P1.0/TDO1 0P1.2/TDI
P1.1/TMS
P1.3/TCK
DVDDIOINSTRUCTION REGISTER
POWER-ONRESET
TAPCONTROLLER
BYPASS
DEBUG REGISTER
SHADOW REGISTER
DVDDIO
READ
WRITE
DVDDIO
UPDATE-DR
UPDATE-DR
MAXQ7667
MUX
MUX
MUX
DVDDIO
MUX
TO DEBUGENGINE
Figure 10. JTAG Interface Block Diagram
JTAG InterfaceThe joint test action group (JTAG) IEEE 1149.1 standarddefines a unique method for in-circuit testing and pro-gramming. The MAXQ7667 conforms to this standard,implementing an external test access port (TAP) andinternal TAP controller for communication with a JTAGbus master, such as an automatic test equipment (ATE)system. The MAXQ7667 JTAG interface does not allowboundary scan. For detailed information on the TAP andTAP controller, refer to IEEE Std 1149.1 “IEEE StandardTest Access Port and Boundary-Scan Architecture” onthe IEEE website at www.standards.ieee.org.
The TAP controller communicates synchronously withthe host system (bus master) through four digital I/Os:test mode select (TMS), test clock (TCK), test datainput (TDI), and test data output (TDO). The internalTAP module consists of shift registers and a TAP con-troller (Figure 10). The shift registers serve as transmitand receive data buffers for a debugger. Maintain themaximum TCK clock frequency to below 1/8 the systemclock frequency for proper operation.
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The following four digital I/Os form the TAP interface:
• TDO—Serial output signal for test instruction anddata. Data transitions on the falling edge of TCK.TDO idles high when inactive. TDO serially trans-fers internal data to the external host. Data trans-fers lease significant bit first.
• TDI—Serial input signal for test instruction anddata. Transition data on the rising edge of TCK.TDO pulls high when unconnected. TDI seriallytransfers data from the external host to the internalTAP module shift registers. Data transfers leastsignificant bit first.
• TCK—Serial clock for the test logic. When TCKstops at 0, storage elements in the test logic mustretain their data indefinitely. Force TCK high wheninactive.
• TMS—Test mode selection. The rising edge of TCKsamples the test signals at TMS. The TAP controllerdecodes the test signals at TMS to control the testoperation. Force TMS high when inactive.
UART/LIN InterfaceThe MAXQ7667 includes a UART/LIN transceiver com-bination that supports communication speeds up2MBd. The LIN standard for example limits communica-tion speed to 20kBd or less. Connect a LIN transceiveror other UART connections such as RS-232 and RS-485directly to the MAXQ7667’s 2-wire interface: URX andUTX. The MAXQ7667 operates as a LIN slave or LINmaster device. The UART provides the programmablebaud-rate generators to communicate effectively to orfrom the LIN transceiver. The device holds up to 8bytes of data in each of the transmit and receive FIFOs.The following characteristics apply to the MAXQ7667UART/LIN interface:
• Full-duplex operation for asynchronous data trans-fers up to 500kBd (system clock/32)
• Half-duplex operation for synchronous data trans-fers up to 2MBd (system clock/8)
• 8-deep receive and transmit FIFO with program-mable interrupt for receive and transmit
• Independent baud-rate generator
• Programmable 9th data bit (commonly used forparity or address/data selection)—UART modeonly
• Hardware support for LIN including break detec-tion, autobaud, address identity filtering, check-sum calculation, and block length checking
• Supports common RS-232 and LIN baud rates:1000, 1200, 2400, 4800, 9600, 19,200, 20,000,38,400, 57,600, and 115,200 with system clock =16MHz.
SPI InterfaceThe MAXQ7667 supports 4-wire SPI interface communi-cation with 8-bit or 16-bit data streams operating ineither master mode or slave mode. The SPI interfaceallows synchronous half-duplex or full-duplex serialdata transfers to a wide variety of external serialdevices using MISO, MOSI, SS, and SCLK signals.Collision detection is provided when two or more mas-ters attempt a data transfer at the same time. SeeSection 9 of the MAXQ7667 User’s Guide.
General-Purpose Digital I/O PortsTwo 8-bit digital I/O ports (P0._ and P1._), with dedicat-ed one or more alternative functions, are available asgeneral-purpose I/Os (GPIOs) under the control of theintegrated MAXQ20. Set each I/O within each port indi-vidually as an input or output. The GPIOs incorporate aSchmitt trigger receiver and a full CMOS output driver(Figure 13). Each GPIO configures as an input withpullup to DVDDIO at power-up. When programmed asan input, each I/O is configurable for high-impedance,weak pullup to DVDDIO or pulldown to DGND. Whenprogrammed as an output, writing to the port outputregister (PO) controls the output logic state. The out-puts source or sink at least 1.6mA. Configure the drivestrength for each I/O within each port to high or lowusing the pad drive strength register for optimum EMIperformance. All the I/O ports have interrupt capabilitythat wake up the device while in stop mode and haveprotection circuitry to DVDDIO and DGND.
Supply-Voltage RegulatorsThe MAXQ7667 requires three different power-supplyvoltages. DVDDIO, nominally +5V, allows interfacing tostandard 5V logic on all the digital I/Os including theLIN/UART, JTAG, and SPI ports. DVDD, nominally+2.5V, powers all the high-speed digital circuits. AVDD,nominally 3.3V, powers the analog circuits.
External power supplies or internal voltage regulatorsprovide each of the supply voltages. The internal volt-age regulators provide 3.3V and 2.5V supplies from the5V DVDDIO input. Obtain the 5V supply from a higherexternal voltage supply by using a few external compo-nents. The MAXQ7667 includes an internal error ampli-fier used to regulate the voltage on DVDDIO by drivingthe gate or base of an external pass transistor. Refer tothe MAXQ7667 User’s Guide for more details on theexternal components needed for 5V regulation.
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SCLKCKPOL/CKPHA
0/1 OR 1/0
SS
MISO
MOSI
SCLKCKPOL/CKPHA
0/0 OR 1/1
SHIFT SAMPLE SHIFT
MSB - 1
MSB - 1
SAMPLE
tMCH
tMCK
tMCL
tMOH
tMOV
tMIS tMIH
MSB LSB
MSB LSB
tMLH
Figure 11. SPI Timing Diagram in Master Mode
SCLKCKPOL/CKPHA
0/1 OR 1/0
SS
SCLKCKPOL/CKPHA
0/0 OR 1/1
SHIFT SAMPLE SHIFT SAMPLE
tSCK
tSCLtSCH
tSSE
tSOV
tSIHtSIS
tSSH
MOSI
MISO
MSB LSBMSB - 1
MSB MSB - 1
tSD
Figure 12. SPI Timing Diagram in Slave Mode
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Connect bypass capacitors at each power-supply inputas close as possible to the device. Use a bypasscapacitor less than 0.47µF on DVDDIO. For most appli-cations, 0.1µF bypass capacitors are adequate.
Supply Brownout MonitorPower supplies DVDD, AVDD, and DVDDIO eachinclude a brownout monitor/supervisor that alerts theµC when their corresponding supply voltages dropbelow the interrupt threshold. Activate each brownoutmonitor independently using the correspondingbrownout enable bits: VDBE, VIBE, and VABE.
ResetIn reset mode, no instruction execution occurs and allinputs/outputs return to their default states. Code exe-cution resumes at address 8000h (in the utility ROM)once the reset condition is removed.
Four different sources reset the MAXQ7667: POR,watchdog timer reset, external reset, and internal sys-tem reset.
During normal operation, force RESET low for at leastfour system clock cycles for an external reset. Set theROD bit in the SC register, while the SPE bit in the ICDFregister is set, for an internal system reset. See Section16 of the MAXQ7667 User’s Guide.
Power-On Reset (POR)The MAXQ7667 includes a DVDD voltage supervisor tocontrol the µC POR. On power-up, internal circuitrypulls RESET low and resets all the internal registers.RESET is held low for the duration of the power-ondelay after VDVDD rises above the DVDD reset thresh-old. The internal RC oscillator starts up and softwareexecution begins at the reset vector location 8000himmediately after the device exits POR while RESET is
I/O PAD DVDDIO
P0._
100ΩK
100ΩK
DGND
DGND
EIE0._
EIES0._
DETECTCIRCUIT
INTERRUPTFLAG
PS0._
PR0._
PD0._
PO0._
SF DIRECTION
SF ENABLE
SF OUTPUT
PI0._ ORSF INPUT
FLAG
MUX
MUX
MAXQ7667
Figure 13. Port 0 Digital I/O Basic Circuitry. Port 1 Circuitry is the Same as Port 2.
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not externally forced low. An internal POR flag indicatesthe source of a reset. Ramp up the DVDD supply at aminimum rate of 60mV/ms to keep the device in PORuntil DVDD fully settles.
Watchdog TimerThe primary function of the watchdog timer is to watchfor stalled or stuck software. The watchdog timer per-forms a controlled system restart when the µP fails towrite to the watchdog timer register before a selectabletimeout interval expires. The internal 13.5MHz RC oscil-lator drives the MAXQ7667’s watchdog timer.
Figure 14 shows the watchdog timer functions as thesource of both the watchdog interrupt and watchdogreset. The watchdog interrupt timeout period is pro-grammable to 212, 215, 218, or 221 cycles of the RCoscillator resulting in a nominal range of 273µs to139.8ms. The watchdog reset timeout period is a fixed512 RC clock cycles (34µs). When enabled, the watch-dog generates an interrupt upon expiration; then, if notreset within 512 RC clock cycles, the watchdog assertsRESET low for eight RC clock cycles.
Hardware Multiplier/AccumulatorA hardware multiplier supports high-speed multiplica-tions. The multiplier completes a 16-bit x 16-bit multipli-cation in a single clock cycle and contains a 48-bitaccumulator. The multiplier is a peripheral that per-forms seven different multiplication operations:
• Unsigned 16-bit multiplication
• Unsigned 16-bit multiplication and accumulation
• Unsigned 16-bit multiplication and subtraction
• Signed 16-bit multiplication
• Signed 16-bit multiplication and negation
• Signed 16-bit multiplication and accumulation
• Signed 16-bit multiplication and subtraction
MAXQ Core ArchitectureThe MAXQ20 µC is an accumulator-based Harvardmemory architecture. Fetch and execution operationscomplete in one clock cycle without pipelining becausethe instruction contains both the op code and data. TheµC streamlines 16 million instructions per second(MIPS). Integrated 16-level hardware stack enables fastsubroutine calling and task switching. Manipulate dataquickly and efficiently with three internal data pointers.Multiple data pointers allow more than one function toaccess data memory without having to save andrestore data pointers each time. The data pointers auto-matically increment or decrement following an opera-tion, eliminating the need for software intervention.
Instruction SetThe instruction set consists of a total of 33 fixed-length16-bit instructions that operate on registers and memo-ry locations. The highly orthogonal instruction set allowsarithmetic and logical operations to use any registeralong with the accumulator. System registers controlfunctionality common to all MAXQ µCs, while peripheralregisters control peripherals and functions specific tothe MAXQ7667. All registers are subdivided into regis-ter modules.
The architecture is transport-triggered. Writes or readsfrom certain register locations potentially have sideeffects. These side effects form the basis for the higherlevel op codes defined by the assembler, such asADDC, OR, JUMP, etc. The op codes are implementedas MOVE instructions between system registers. Theassembler handles all the instruction encoding.
Memory OrganizationIn addition to the internal register space, the deviceincorporates several memory areas:
• 16Kwords of flash memory for program storage
• 2Kword of SRAM for storage of temporary variables
• 4Kwords utility ROM
• 16-level, 16-bit-wide hardware stack for storage ofprogram return addresses and general-purpose use
Use the internal memory-management unit (MMU) tomap data memory space into a predefined programmemory segment for code execution from data memory.Use the MMU to map program memory space as dataspace for access to constant data stored in program
EWDI
WD0RWT
WD1
RC CLOCK (13.5MHz)
INTERRUPT
WTRF
RESET
WDIF
TIMEOUT
TIME212
DIV 212 DIV 23 DIV 23 DIV 23
215 218 221
EWT
RESET
Figure 14. Watchdog Functional Diagram
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memory. Access physical memory segments (otherthan the stack and register memories) as either pro-gram memory or data memory, but not both at once.
By default, the memory is arranged in a Harvard archi-tecture, with separate address spaces for program anddata memory. The configuration of program and dataspace depends on the current execution location.
• When executing code from flash memory, accessthe SRAM and utility ROM in data space.
• When executing code from SRAM, access theflash memory and utility ROM in data space.
• When executing code from the utility ROM, accessthe flash memory and SRAM in data space.
Utility ROM (see Section 18 ofthe MAXQ7667 User’s Guide)
The utility ROM is a 4K x 16 block of internal ROMmemory that defaults to a starting address of 8000h.The utility ROM consists of subroutines called fromapplication software. The subroutines include:
• In-system programming (bootloader) over theJTAG or UART interface
• In-circuit debug routines
• Test routines (internal memory tests, memoryloader, etc.)
• User-callable routines for in-application flash pro-gramming and code space table lookup
Following any reset, execution begins in the utility ROM.The ROM software determines whether the programexecution immediately jumps to the start of the user-application code (located at address 0000h) or to oneof the special routines mentioned above. Call the rou-tines within the utility ROM using the application soft-ware. Refer to the MAXQ7667 User’s Guide for moreinformation on the utility ROM contents.
Password protect in-system programming, in-applica-tion programming, and in-circuit debugging functionsusing a password-lock (PWL) bit. The PWL bit is imple-mented in the SC register. When the PWL bit is set toone (POR default), the password is required to accessthe utility ROM, including in-circuit debug and in-sys-tem programming routines that allow reading or writingof internal memory. When the PWL bit is cleared tozero, these utilities are fully accessible without thepassword. The password is automatically set to all onesfollowing a mass erase.
Data MemoryThe 2K x 16 internal data SRAM maps into either pro-gram or data space. The contents of the SRAM aremaintained during stop mode and across non-PORresets, as long as DVDD remains within the operatingvoltage range.
A data memory cycle requires only one system clockperiod to support fast internal execution. This allows acomplete read or write operation on SRAM in one clockcycle. The MMU handles data memory mapping andaccess control. Read or write to the data memory withword or byte-wide commands.
Stack MemoryThe MAXQ7667 provides a 16 x 16 hardware stack tosupport subroutine calls and system interrupts. A 16-bitwide internal hardware stack provides storage for pro-gram return addresses and general-purpose use. Thestack is used automatically by the processor when theCALL, RET, and RETI instructions are executed andinterrupts serviced.
Register SetSets of registers control most functions. These registersprovide a working space for memory operations as wellas configuring and addressing peripheral registers onthe device. Registers are divided into two major types;system registers and peripheral registers. The registerset common to most MAXQ-based devices, also knownas the system registers, includes the ALU, accumulatorregisters, data pointers, interrupt vectors and control,and stack pointer. The peripheral registers define addi-tional functionality. Tables 1 and 3 show the MAXQ7667register set.
ProgrammingTwo different methods program the flash memory: in-system programming and in-application programming.Both methods afford great flexibility in system designas well as reduce the life-cycle cost of the embeddedsystem. The MAXQ7667 password protects these fea-tures to prevent unauthorized access to code memory.
In-System ProgrammingAn internal bootstrap loader reloads the device over asimple JTAG or UART interface allowing cost savings insystem software upgrade. During power-up, theMAXQ7667 first checks for activity on the JTAG port. Ifno activity is present, the device checks if a password-protected program is present. If the password is set,
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the application code executes. The application codesinitiate reprogramming. If the password is not set, theMAXQ7667 monitors the UART for an autobaud char-acter (0x0D). If this character is received, the devicesets its serial baud rate and initiates a boot loader pro-cedure. If 0x0D is not received after five seconds, thedevice begins execution of the application code.
The following bootloader functions are supported:
• Load
• Dump
• CRC
• Verify
• Erase
In-Application ProgrammingThe in-application programming feature allows the µCto modify its own flash program memory while simulta-neously executing its application software. This allowson the fly software updates in mission-critical applica-tions that cannot afford downtime. Erase and programthe flash memory using the flash programming func-tions in the utility ROM. Refer to Section 18 of theMAXQ7667 User’s Guide for a detailed description ofthe utility ROM functions.
Stop ModePower consumption reaches its minimum in stop mode(STOP = 1). In this mode, the external oscillator, inter-nal RC oscillator, system clock, and all processinghalts. Trigger an enabled external interrupt input ordirectly apply an external reset on RESET to exit stopmode. Upon exiting stop mode, the µC either waits forthe external high-frequency crystal to complete itswarmup period or starts execution immediately from itsinternal RC oscillator while the crystal warms up.
InterruptsMultiple interrupt sources quickly respond to internaland external events. The MAXQ architecture uses asingle interrupt vector (IV) and single interrupt-serviceroutine (ISR) design. Enable interrupts globally,
individually, or by module. When an interrupt conditionoccurs, its individual flag is set even if the interruptsource is disabled at the local, module, or global level.Clear interrupt flags within the interrupt routine to avoidrepeated false interrupts from the same source.Provide an adequate delay between the write to theflag and the RETI instruction using application softwareto allow time for the interrupt hardware to remove theinternal interrupt condition. Asynchronous interruptflags require a one-instruction delay and synchronousinterrupt flags require a two-instruction delay.
When an enabled interrupt is detected, software jumpsto a user-programmable interrupt vector location. TheIV register defaults to 0000h on reset or power-up.Once software control transfers to the ISR, use theinterrupt identification register (IIR) to determine if thesource of the interrupt is a system register or peripheralregister. The specified module identifies the specificinterrupt source. The following interrupt sources areavailable:
• Watchdog interrupt
• External interrupts 0–7 on port 0 and port 1
• Timer 0 low compare, low overflow, capture/com-pare, and overflow interrupts
• Timer 1 low compare, low overflow, capture/com-pare, and overflow interrupts
• Timer 2 low compare, low overflow, and overflowinterrupts
• Schedule timer alarm interrupt
• SPI data transfer complete, mode fault, write colli-sion and receive overrun interrupts
• UART transmit, receive interrupts
• LIN mode master or slave interrupt
• SAR ADC data ready interrupt
• Echo envelope LPF output, FIFO full, and com-parator interrupts
• Digital and I/O voltage brownout interrupts
• High-frequency oscillator failure interrupt
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MODULE NAME (BASE SPECIFIER) REGISTER INDEX AP (8h) A (9h) PFX (Bh) IP (Ch) SP (Dh) DPC (Eh) DP (Fh)
0h AP A[0] PFX[0] IP — — —
1h APC A[1] PFX[1] — SP — —
2h — A[2] PFX[2] — IV — —
3h — A[3] PFX[3] — — OFFS DP[0]
4h PSF A[4] PFX[4] — — DPC —
5h IC A[5] PFX[5] — — GR —
6h IMR A[6] PFX[6] — LC[0] GRL —
7h — A[7] PFX[7] — LC[1] BP DP[1]
8h SC A[8] — — GRS —
9h — A[9] — — — GRH —
Ah — A[10] — — — GRXL —
Bh IIR A[11] — — — FP —
Ch — A[12] — — — — —
Dh — A[13] — — — — —
Eh CKCN A[14] — — — — —
Fh WDCN A[15] — — — — —
Table 1. System Register Map
Note: Registers in italics are read-only. Registers in bold are 16-bit wide.
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RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0
—
—
—
—
A
P (
4 B
its)
AP
0 0
0 0
0 0
0 0
C
LR
IDS
—
—
—
M
OD
2 M
OD
1 M
OD
0 A
PC
0 0
0 0
0 0
0 0
Z
S
—
G
PF1
G
PF0
O
V
C
E
PS
F
1 0
0 0
0 0
0 0
—
—
C
GD
S
—
—
—
INS
IG
E
IC
0 0
0 0
0 0
0 0
IM
S
—
IM5
IM4
IM3
IM2
IM1
IM0
IMR
0 0
0 0
0 0
0 0
TA
P
—
CD
A1
CD
A0
—
RO
D
PW
L —
S
C
1
0 0
0 0
0 s*
0
IIS
—
II5
II4
II3
II2
II1
II0
IIR
0 0
0 0
0 0
0 0
X
TRC
—
R
GM
D
STO
P
SW
B
PM
ME
C
D1
CD
0 C
KC
N
s*
0
0 0
0 0
0 0
P
OR
E
WD
I W
D1
WD
0 W
DIF
W
TRF
EW
T R
WT
WD
CN
s*
s*
0 0
0 s*
s*
0
A[n
] (1
6 B
its)
A[n
] (0
..15)
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
PFX
[n]
(16
Bits
) P
FX[n
] (0
..7)
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
IP (
16 B
its)
IP
1 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
—
—
—
—
SP
(4
Bits
) S
P0
0 0
0 0
0 0
0 0
0 0
0 1
1 1
1
IV (
16 B
its)
IV
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
LC[0
] (1
6 B
its)
LC[0
] 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
LC[1
] (1
6 B
its)
LC[1
] 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
Tab
le 2
. Sys
tem
Reg
iste
r B
it a
nd
Res
et V
alu
es
*Bits
ind
icat
ed b
y an
“s”
are
onl
y af
fect
ed b
y a
PO
R a
nd n
ot b
y ot
her
form
s of
res
et. T
hese
bits
are
set
to 0
afte
r a
PO
R. R
efer
to th
e M
AX
Q76
67 U
ser’s
Gui
de
for
mor
e in
form
atio
n.
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RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0
O
FFS
(8
Bits
) O
FFS
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
—
—
—
WB
S2
WB
S1
WB
S0
SD
PS
1 S
DP
S0
DP
C
0 0
0 0
0 0
0 0
0 0
0 1
1 1
0 0
GR
15
GR
14
GR
13
GR
12
GR
11
GR
10
GR
9 G
R8
GR
7 G
R6
GR
5 G
R4
GR
3 G
R2
GR
1 G
R0
GR
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
G
RL7
G
RL6
G
RL5
G
RL4
G
RL3
G
RL2
G
RL1
G
RL0
G
RL
0
0 0
0 0
0 0
0
BP
(16
Bits
) B
P
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
GR
S15
G
RS
14
GR
S13
G
RS
12
GR
S11
G
RS
10
GR
S9
GR
S8
GR
S7
GR
S6
GR
S5
GR
S4
GR
S3
GR
S2
GR
S1
GR
S0
GR
S
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
G
R15
G
R14
G
R13
G
R12
G
R11
G
R10
G
R9
GR
8 G
RH
0 0
0 0
0 0
0 0
GR
XL1
5 G
RX
L14
GR
XL1
3 G
RX
L12
GR
XL1
1 G
RX
L10
GR
XL9
G
RX
L8
GR
XL7
G
RX
L6
GR
XL5
G
RX
L4
GR
XL3
G
RX
L2
GR
XL1
G
RX
L0
GR
XL
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
FP (
16 B
its)
FP
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
DP
[0]
(16
Bits
) D
P[0
] 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
DP
[1]
(16
Bits
) D
P[1
] 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
Tab
le 2
. Sys
tem
Reg
iste
r B
it a
nd
Res
et V
alu
es (
con
tin
ued
)
*Bits
ind
icat
ed b
y an
“s”
are
onl
y af
fect
ed b
y a
PO
R a
nd n
ot b
y ot
her
form
s of
res
et. T
hese
bits
are
set
to 0
afte
r a
PO
R. R
efer
to th
e M
AX
Q76
67 U
ser’s
Gui
de
for
mor
e in
form
atio
n.
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
______________________________________________________________________________________ 33
MODULE NAME (BASE SPECIFIER)REGISTERINDEX M0 (0h) M1 (1h) M2 (2h) M3 (3h) M4 (4h) M5 (5h)
0h PO0 MCNT T2CNA0 T2CNA2 — BPH
1h PO1 MA T2H0 T2H2 — BTRN
2h — MB T2RH0 T2RH2 — SARC
3h EIF0 MC2 T2CH0 T2CH2 — RCVC
4h EIF1 MC1 T2CNA1 — — PLLF
5h — MC0 T2H1 CNT1 — AIE
6h — SPIB T2RH1 SCON — CMPC
7h — SPICN T2CH1 SBUF — CMPT
8h PI0 SPICF T2CNB0 T2CNB2 — ASR
9h PI1 SPICK T2V0 T2V2 — SARD
Ah — — T2R0 T2R2 — LPFC
Bh EIE0 — T2C0 T2C2 — OSCC
Ch EIE1 MC1R T2CNB1 FSTAT — BPFI
Dh — MC0R T2V1 ERRR — BPFO
Eh — SCNT T2R1 CHKSUM — LPFD
Fh — STIM T2C1 ISVEC — LPFF
10h PD0 SALM T2CFG0 T2CFG2 — APE
11h PD1 FPCTL T2CFG1 STA0 — —
12h — — — SMD — FGAIN
13h EIES0 — — FCON — B1COEF
14h EIES1 — — CNT0 — B2COEF
15h — — — CNT2 — B3COEF
16h — — — IDFB — A2A
17h — RCTRM — SADDR — A2B
18h PS0 — ICDT0 SADEN — —
19h PS1 — ICDT1 BT — A2D
1Ah — — ICDC TMR — —
1Bh PR0 — ICDF — — A3A
1Ch PR1 ID0 ICDB — — A3B
1Dh — ID1 ICDA — — —
1Eh — — ICDD — — A3D
1Fh — — — — — —
Table 3. Peripheral Register Map
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
34 ______________________________________________________________________________________
RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0—
——
——
——
—
PO
07
PO
06
PO
05
PO
04
PO
03
PO
02
PO
01
PO
00
PO
0 0
00
00
00
0 1
1 1
1 1
1 1
1 —
——
——
——
—
PO
17
PO
16
PO
15
PO
14
PO
13
PO
12
PO
11
PO
10
PO
1 0
00
00
00
0 1
1 1
1 1
1 1
1 —
——
——
——
—
IE7
IE6
IE5
IE4
IE3
IE2
IE1
IE0
EIF
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
IE7
IE6
IE5
IE4
IE3
IE2
IE1
IE0
EIF
1 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
PI0
7 P
I06
PI0
5 P
I04
PI0
3 P
I02
PI0
1 P
I00
PI0
0
00
00
00
0 S
T S
T S
T S
T S
T S
T S
T S
T —
——
——
——
—
PI1
7 P
I16
PI1
5 P
I14
PI1
3 P
I12
PI1
1 P
I10
PI1
0
00
00
00
0 S
T S
T S
T S
T S
T S
T S
T S
T —
——
——
——
—
EX
7 E
X6
EX
5 E
X4
EX
3 E
X2
EX
1 E
X0
EIE
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
EX
7 E
X6
EX
5 E
X4
EX
3 E
X2
EX
1 E
X0
EIE
1 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
PD
07
PD
06
PD
05
PD
04
PD
03
PD
02
PD
01
PD
00
PD
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
PD
17
PD
16
PD
15
PD
14
PD
13
PD
12
PD
11
PD
10
PD
1 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
IT7
IT6
IT5
IT4
IT3
IT2
IT1
IT0
EIE
S0
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
IT
7 IT
6 IT
5 IT
4 IT
3 IT
2 IT
1 IT
0 E
IES
1 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
PS
07
PS
06
PS
05
PS
04
PS
03
PS
02
PS
01
PS
00
PS
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
PS
17
PS
16
PS
15
PS
14
PS
13
PS
12
PS
11
PS
10
PS
1 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
PR
07
PR
06
PR
05
PR
04
PR
03
PR
02
PR
01
PR
00
PR
0 0
00
00
00
0 1
1 1
1 1
1 1
1 —
——
——
——
—
PR
17
PR
16
PR
15
PR
14
PR
13
PR
12
PR
11
PR
10
PR
1 0
00
00
00
0 1
1 1
1 1
1 1
1 —
——
——
——
—
OF
MC
W
CLD
S
QU
O
PC
S
MS
UB
M
MA
C
SU
S
MC
NT
00
00
00
00
0 0
0 0
0 0
0 0
MA
15
MA
14
MA
13
MA
12
MA
11
MA
10
MA
9 M
A8
MA
7 M
A6
MA
5 M
A4
MA
3 M
A2
MA
1 M
A0
MA
0
00
00
00
0 0
0 0
0 0
0 0
0 M
B15
M
B14
M
B13
M
B12
M
B11
M
B10
M
B9
MB
8 M
B7
MB
6 M
B5
MB
4 M
B3
MB
2 M
B1
MB
0 M
B
00
00
00
00
0 0
0 0
0 0
0 0
MC
215
MC
214
MC
213
MC
212
MC
211
MC
210
MC
29
MC
28
MC
27
MC
26
MC
25
MC
24
MC
23
MC
22
MC
21
MC
20
MC
2 0
00
00
00
0 0
0 0
0 0
0 0
0 M
C11
5 M
C11
4 M
C11
3 M
C11
2 M
C11
1 M
C11
0 M
C19
M
C18
M
C17
M
C16
M
C15
M
C14
M
C13
M
C12
M
C11
M
C10
M
C1
00
00
00
00
0 0
0 0
0 0
0 0
MC
015
MC
014
MC
013
MC
012
MC
011
MC
010
MC
09
MC
08
MC
07
MC
06
MC
05
MC
04
MC
03
MC
02
MC
01
MC
00
MC
0 0
00
00
00
0 0
0 0
0 0
0 0
0 S
PIB
15
SP
IB14
S
PIB
13
SP
IB12
S
PIB
11
SP
IB10
S
PIB
9 S
PIB
8 S
PIB
7 S
PIB
6 S
PIB
5 S
PIB
4 S
PIB
3 S
PIB
2 S
PIB
1 S
PIB
0 S
PIB
0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
STB
Y
SP
IC
RO
VR
W
CO
L M
OD
F M
OD
FE
MS
TM
SP
IEN
S
PIC
N
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
E
SP
II S
AS
—
—
—
C
HR
C
KP
HA
C
KP
OL
SP
ICF
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
S
PIC
K7
SP
ICK
6 S
PIC
K5
SP
ICK
4 S
PIC
K3
SP
ICK
2 S
PIC
K1
SP
ICK
0 S
PIC
K
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
FB
US
Y
—
—
—
—
FC2
FC1
FC0
FCN
TL
00
00
00
00
1 0
0 0
0 0
0 0
MC
1R15
M
C1R
14
MC
1R13
M
C1R
12
MC
1R11
M
C1R
10
MC
1R9
MC
1R8
MC
1R7
MC
1R6
MC
1R5
MC
1R4
MC
1R3
MC
1R2
MC
1R1
MC
1R0
MC
1R
00
00
00
00
0 0
0 0
0 0
0 0
MC
0R15
M
C0R
14
MC
0R13
M
C0R
12
MC
0R11
M
C0R
10
MC
0R9
MC
0R8
MC
0R7
MC
0R6
MC
0R5
MC
0R4
MC
0R3
MC
0R2
MC
0R1
MC
0R0
MC
0R
00
00
00
00
0 0
0 0
0 0
0 0
Tab
le 4
. Per
iph
eral
Reg
iste
r B
it F
un
ctio
ns
and
Res
et V
alu
es
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
______________________________________________________________________________________ 35
RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0—
——
—S
TDIV
2 S
TDIV
1 S
TDIV
0 S
SY
NC
_EN
S
ALI
E
SA
LMF
—
—
—
—
SA
LME
S
TIM
E
SC
NT
00
00
00
00
0 0
0 0
0 0
0 0
STI
M15
S
TIM
14
STI
M13
S
TIM
12
STI
M11
S
TIM
10
STI
M9
STI
M8
STI
M7
STI
M6
STI
M5
STI
M4
STI
M3
STI
M2
STI
M1
STI
M0
STI
M
00
00
00
00
0 0
0 0
0 0
0 0
SA
LM15
S
ALM
14
SA
LM13
S
ALM
12
SA
LM11
S
ALM
10
SA
LM9
SA
LM8
SA
LM7
SA
LM6
SA
LM5
SA
LM4
SA
LM3
SA
LM2
SA
LM1
SA
LM0
SA
LM
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
—
—
—
—
—
—
—
D
PM
G
FPC
NTL
0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
RC
TRM
8 R
CTR
M7
RC
TRM
6 R
CTR
M5
RC
TRM
4 R
CTR
M3
RC
TRM
2 R
CTR
M1
RC
TRM
0 R
CTR
M
00
00
00
00
0 0
0 0
0 0
0 0
ID01
5 ID
014
ID01
3 ID
012
ID01
1 ID
010
ID09
ID
08
ID07
ID
06
ID05
ID
04
ID03
ID
02
ID01
ID
00
ID0
00
00
00
00
0 0
0 0
0 0
0 0
ID11
5 ID
114
ID11
3 ID
112
ID11
1 ID
110
ID19
ID
18
ID17
ID
16
ID15
ID
14
ID13
ID
12
ID11
ID
10
ID1
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
E
T2
T2O
E0
T2P
OL0
TR
2L
TR2
CP
RL2
S
S2
G2E
N
T2C
NA
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
T2H
07
T2H
06
T2H
05
T2H
04
T2H
03
T2H
02
T2H
01
T2H
00
T2H
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
T2R
H07
T2
RH
06
T2R
H05
T2
RH
04
T2R
H03
T2
RH
02
T2R
H01
T2
RH
00
T2R
H0
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
T2
CH
07
T2C
H06
T2
CH
05
T2C
H04
T2
CH
03
T2C
H02
T2
CH
01
T2C
H00
T2
CH
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
ET2
T2
OE
0 T2
PO
L0
TR2L
TR
2 C
PR
L2
SS
2 G
2EN
T2
CN
A1
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
T2
H17
T2
H16
T2
H15
T2
H14
T2
H13
T2
H12
T2
H.1
T2
H10
T2
H1
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
T2
RH
17
T2R
H16
T2
RH
15
T2R
H14
T2
RH
13
T2R
H12
T2
RH
11
T2R
H10
T2
RH
1 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
T2C
H17
T2
CH
16
T2C
H15
T2
CH
14
T2C
H13
T2
CH
12
T2C
H11
T2
CH
10
T2C
H1
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
E
T2L
T2O
E1
T2P
OL1
—
TF
2 TF
2L
TCC
2 TC
2L
T2C
NB
0 0
00
00
00
0 0
0 0
0 0
0 0
0 T2
V01
5 T2
V01
4 T2
V01
3 T2
V01
2 T2
V01
1 T2
V01
0 T2
V09
T2
V08
T2
V07
T2
V06
T2
V05
T2
V04
T2
V03
T2
V02
T2
V01
T2
V00
T2
V0
00
00
00
00
0 0
0 0
0 0
0 0
T2R
015
T2R
014
T2R
013
T2R
012
T2R
011
T2R
010
T2R
09
T2R
08
T2R
07
T2R
06
T2R
05
T2R
04
T2R
03
T2R
02
T2R
01
T2R
00
T2R
0 0
00
00
00
0 0
0 0
0 0
0 0
0 T2
C01
5 T2
C01
4 T2
C01
3 T2
C01
2 T2
C01
1 T2
C01
0 T2
C09
T2
C08
T2
C07
T2
C06
T2
C05
T2
C04
T2
C03
T2
C02
T2
C01
T2
C00
T2
C0
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
E
T2L
T2O
E1
T2P
OL1
—
TF
2 TF
2L
TCC
2 TC
2L
T2C
NB
1 0
00
00
00
0 0
0 0
0 0
0 0
0 T2
V11
5 T2
V11
4 T2
V11
3 T2
V11
2 T2
V11
1 T2
V11
0 T2
V19
T2
V18
T2
V17
T2
V16
T2
V15
T2
V14
T2
V13
T2
V12
T2
V11
T2
V10
T2
V1
00
00
00
00
0 0
0 0
0 0
0 0
T2R
115
T2R
114
T2R
113
T2R
112
T2R
111
T2R
110
T2R
19
T2R
18
T2R
17
T2R
16
T2R
15
T2R
14
T2R
13
T2R
12
T2R
11
T2R
10
T2R
1 0
00
00
00
0 0
0 0
0 0
0 0
0 T2
C11
5 T2
C11
4 T2
C11
3 T2
C11
2 T2
C11
1 T2
C11
0 T2
C19
T2
C18
T2
C17
T2
C16
T2
C15
T2
C14
T2
C13
T2
C12
T2
C11
T2
C10
T2
C1
00
00
00
00
0 0
0 0
0 0
0 0
——
——
——
——
T2
C1
T2D
IV2
T2D
IV1
T2D
IV0
T2M
D
CC
F1
CC
F0
C/T
2 T2
CFG
0 0
00
00
00
0 0
0 0
0 0
0 0
0 —
——
——
——
—
T2C
1 T2
DIV
2 T2
DIV
1 T2
DIV
0 T2
MD
C
CF1
C
CF0
C
/T2
T2C
FG1
00
00
00
00
0 0
0 0
0 0
0 0
ICD
T015
IC
DT0
14
ICD
T013
IC
DT0
12
ICD
T011
IC
DT0
10
ICD
T09
ICD
T08
ICD
T07
ICD
T06
ICD
T05
ICD
T04
ICD
T03
ICD
T02
ICD
T01
ICD
T00
ICD
T0
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
ICD
T115
IC
DT1
14
ICD
T113
IC
DT1
12
ICD
T111
IC
DT1
10
ICD
T19
ICD
T18
ICD
T17
ICD
T16
ICD
T15
ICD
T14
ICD
T13
ICD
T12
ICD
T11
ICD
T10
ICD
T1
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
DB
D
B
——
——
——
——
D
ME
—
R
EG
E
—
CM
D3
CM
D2
CM
D1
CM
D0
ICD
C0
00
00
00
0 D
W
0 D
W
0 D
W
DW
D
W
DW
Tab
le 4
. Per
iph
eral
Reg
iste
r B
it F
un
ctio
ns
and
Res
et V
alu
es (
con
tin
ued
)
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
36 ______________________________________________________________________________________
RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0—
—
—
—
—
—
—
—
—
—
—
—
P
SS
1 P
SS
0 S
PE
TX
C
ICD
F 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
IC
DB
.7
ICD
B.6
IC
DB
.5
ICD
B.4
IC
DB
.3
ICD
B.2
IC
DB
.1
ICD
B.0
IC
DB
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 IC
DA
15
ICD
A14
IC
DA
13
ICD
A12
IC
DA
11
ICD
A10
IC
DA
9 IC
DA
8 IC
DA
7 IC
DA
6 IC
DA
5 IC
DA
4 IC
DA
3 IC
DA
2 IC
DA
1 IC
DA
0 IC
DA
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 IC
DD
15
ICD
D14
IC
DD
13
ICD
D12
IC
DD
11
ICD
D10
IC
DD
9 IC
DD
8 IC
DD
7 IC
DD
6 IC
DD
5 IC
DD
4 IC
DD
3 IC
DD
2 IC
DD
1 IC
DD
0 IC
DD
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
ET2
T2
OE
0 T2
PO
L0
TR2L
TR
2 C
PR
L2
SS
2 G
2EN
T2
CN
A2
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
T2H
27
T2H
26
T2H
25
T2H
24
T2H
23
T2H
22
T2H
21
T2H
20
T2H
2 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
T2
RH
27
T2R
H26
T2
RH
25
T2R
H24
T2
RH
23
T2R
H22
T2
RH
21
T2R
H20
T2
RH
2 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
T2
CH
27
T2C
H26
T2
CH
25
T2C
H24
T2
CH
23
T2C
H22
T2
CH
21
T2C
H20
T2
CH
2 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
R
TN
CK
FL
5 FL
4 FL
3 FL
2 FL
1 FL
0 C
NT1
0
0 0
0 0
0 0
0 1
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
S
M0/
FE
SM
1 S
M2
RE
N
TB8
RB
8 TI
R
I S
CO
N
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
SB
UF7
S
BU
F6
SB
UF5
S
BU
F4
SB
UF3
S
BU
F2
SB
UF1
S
BU
F0
SB
UF
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
ET2
L T2
OE
1 T2
PO
L1
—
TF2
TF2L
TC
C2
TC2L
T2
CN
B2
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
T2V
215
T2V
214
T2V
213
T2V
212
T2V
211
T2V
210
T2V
29
T2V
28
T2V
27
T2V
26
T2V
25
T2V
24
T2V
23
T2V
22
T2V
21
T2V
20
T2V
2 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 T2
R21
5 T2
R21
4 T2
R21
3 T2
R21
2 T2
R21
1 T2
R21
0 T2
R29
T2
R28
T2
R27
T2
R26
T2
R25
T2
R24
T2
R23
T2
R22
T2
R21
T2
R20
T2
R2
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
T2C
215
T2C
214
T2C
213
T2C
212
T2C
211
T2C
210
T2C
29
T2C
28
T2C
27
T2C
26
T2C
25
T2C
24
T2C
23
T2C
22
T2C
21
T2C
20
T2C
2 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
—
—
TF
F TF
AE
TF
E
RFF
R
FAF
RFE
FS
TAT
0 0
0 0
0 0
0 0
0 0
0 0
1 0
0 1
—
—
—
—
—
—
—
—
—
OTE
D
ME
C
KE
P
1 P
IE
P0
PO
E
ER
RR
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 C
HK
SUM
15
CH
KSU
M14
C
HK
SUM
13
CH
KSU
M12
C
HK
SUM
11
CH
KSU
M10
C
HK
SUM
9 C
HK
SUM
8 C
HK
SUM
7 C
HK
SUM
6 C
HK
SUM
5 C
HK
SUM
4 C
HK
SUM
3 C
HK
SUM
2 C
HK
SUM
1 C
HK
SUM
0 C
HK
SU
M
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
—
—
—
—
ISV
EC
3 IS
VE
C2
ISV
EC
1 IS
VE
C0
ISV
EC
0
0 0
0 0
0 0
0 0
0 0
0 1
1 1
1 —
—
—
—
—
—
—
—
T2
C1
T2D
IV2
T2D
IV1
T2D
IV0
T2M
D
CC
F1
CC
F0
C/T
2 T2
CFG
2 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
—
—
—
—
—
—
IN
P
BU
SY
S
TA0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
—
—
—
EIR
O
FS
—
—
—
IE
SM
OD
FE
DE
S
MD
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
FT
F FR
F TX
FT1
TXFT
0 R
XFT
1 R
XFT
0 O
E
FEN
FC
ON
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
W
U
FP1
FP0
INE
A
UT
INIT
LU
N1
LUN
0 C
NT0
0
0 0
0 0
0 0
0 1
0 0
0 1
0 0
0 —
—
—
—
—
—
—
—
—
—
—
D
MIS
P
M
HD
O
FBS
B
TH
CN
T2
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
IDFB
H5
IDFB
H4
IDFB
H3
IDFB
H2
IDFB
H1
IDFB
H0
—
—
IDFB
L5
IDFB
L4
IDFB
L3
IDFB
L2
IDFB
L1
IDFB
L0
IDFB
0
0 1
1 1
1 1
1 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
S
AD
DR
7 S
AD
DR
6 S
AD
DR
5 S
AD
DR
4 S
AD
DR
3 S
AD
DR
2 S
AD
DR
1 S
AD
DR
0 S
AD
DR
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
S
AD
EN
7 S
AD
EN
6 S
AD
EN
5 S
AD
EN
4 S
AD
EN
3 S
AD
EN
2 S
AD
EN
1 S
AD
EN
0 S
AD
EN
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0
Tab
le 4
. Per
iph
eral
Reg
iste
r B
it F
un
ctio
ns
and
Res
et V
alu
es (
con
tin
ued
)
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
______________________________________________________________________________________ 37
RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0B
T15
BT1
4 B
T13
BT1
2 B
T11
BT1
0 B
T9
BT8
B
T7
BT6
B
T5
BT4
B
T3
BT2
B
T1
BT0
B
T 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 TM
R15
TM
R14
TM
R13
TM
R12
TM
R11
TM
R10
TM
R9
TMR
8 TM
R7
TMR
6 TM
R5
TMR
4 TM
R3
TMR
2 TM
R1
TMR
0 TM
R
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
BS
TT
BD
S
—
—
—
—
BP
H9
BP
H8
BP
H7
BP
H6
BP
H5
BP
H4
BP
H3
BP
H2
BP
H1
BP
H0
BP
H
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
BD
IV3
BD
IV2
BD
IV1
BD
IV0
BP
OL
BC
KS
B
TRI
BG
T B
CTN
7 B
CTN
6 B
CTN
5 B
CTN
4 B
CTN
3 B
CTN
2 B
CTN
1 B
CTN
0 B
TRN
1
0 0
1 0
1 0
0 0
0 0
0 0
0 0
0 —
—
—
—
S
AR
MX
2 S
AR
MX
1 S
AR
MX
0 S
AR
DIF
S
AR
BIP
S
AR
DU
L S
AR
RS
EL
SA
RA
SD
S
AR
BY
S
AR
C2
SA
RC
1 S
AR
C0
SA
RC
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
LN
AO
SE
L LN
AIS
EL1
LN
AIS
EL0
—
R
CV
GN
4 R
CV
GN
3 R
CV
GN
2 R
CV
GN
1 R
CV
GN
0 R
CV
C
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
—
—
—
—
—
PLL
C1
PLL
C0
PLL
F8
PLL
F7
PLL
F6
PLL
F5
PLL
F4
PLL
F3
PLL
F2
PLL
F1
PLL
F0
PLL
F 0
0 0
0 0
0 0
1 0
0 0
0 0
0 0
0 —
—
—
—
—
—
—
—
X
TIE
V
IBIE
V
DB
IE
VA
BIE
C
MP
IE
LFLI
E
LPFI
E
SA
RIE
A
IE
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
CM
PP
C
MP
H14
C
MP
H13
C
MP
H12
C
MP
H11
C
MP
H10
C
MP
H9
CM
PH
8 C
MP
H7
CM
PH
6 C
MP
H5
CM
PH
4 C
MP
H3
CM
PH
2 C
MP
H1
CM
PH
0 C
MP
C
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
CM
PT1
5 C
MP
T14
CM
PT1
3 C
MP
T12
CM
PT1
1 C
MP
T10
CM
PT9
C
MP
T8
CM
PT7
C
MP
T6
CM
PT5
C
MP
T4
CM
PT3
C
MP
T2
CM
PT1
C
MP
T0
CM
PT
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
VIO
LVL
DV
LVL
AV
LVL
CM
PLV
L —
—
—
X
TRD
Y
XTI
V
IBI
VD
BI
VA
BI
CM
PI
LPFF
L LP
FRD
Y
SA
RR
DY
A
SR
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 —
—
—
—
S
AR
D11
S
AR
D10
S
AR
D9
SA
RD
8 S
AR
D7
SA
RD
6 S
AR
D5
SA
RD
4 S
AR
D3
SA
RD
2 S
AR
D1
SA
RD
0 S
AR
D
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
FFIL
3 FF
IL2
FFIL
1 FF
IL0
FFD
P3
FFD
P2
FFD
P1
FFD
P0
FFO
V
—
—
—
FFLD
FF
LS2
FFLS
1 FF
LS0
LPFC
0
0 0
0 0
0 0
0 0
0 0
0 0
1 1
1 —
—
—
—
—
—
—
—
—
—
—
—
S
AR
CD
1 S
AR
CD
0 X
TE
RC
E
OS
CC
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 B
PFI
15
BP
FI14
B
PFI
13
BP
FI12
B
PFI
11
BP
FI10
B
PFI
9 B
PFI
8 B
PFI
7 B
PFI
6 B
PFI
5 B
PFI
4 B
PFI
3 B
PFI
2 B
PFI
1 B
PFI
0 B
PFI
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 B
PFO
15
BP
FO14
B
PFO
13
BP
FO12
B
PFO
11
BP
FO10
B
PFO
9 B
PFO
8 B
PFO
7 B
PFO
6 B
PFO
5 B
PFO
4 B
PFO
3 B
PFO
2 B
PFO
1 B
PFO
0 B
PFO
0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 LP
FD15
LP
FD14
LP
FD13
LP
FD12
LP
FD11
LP
FD10
LP
FD9
LPFD
8 LP
FD7
LPFD
6 LP
FD5
LPFD
4 LP
FD3
LPFD
2 LP
FD1
LPFD
0 LP
FD
0 0
0 0
0 0
0 0
0 0
0 0
0 0
0 0
LPFF
15
LPFF
14
LPFF
13
LPFF
12
LPFF
11
LPFF
10
LPFF
9 LP
FF8
LPFF
7 LP
FF6
LPFF
5 LP
FF4
LPFF
3 LP
FF2
LPFF
1 LP
FF0
LPFF
N
OT
INIT
IALI
ZE
D
—
RB
UFE
R
SA
RE
B
GE
LR
IOP
D
LRD
PD
LR
AP
D
VIB
E
VD
PE
V
DB
E
VA
BE
S
AR
E
PLL
E
MD
E
LNA
E
BIA
SE
A
PE
0
0 0
0 0
0 0
0 1
0 0
0 0
0 0
0
Tab
le 4
. Per
iph
eral
Reg
iste
r B
it F
un
ctio
ns
and
Res
et V
alu
es (
con
tin
ued
)
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
38 ______________________________________________________________________________________
RE
GIS
TE
R B
IT
RE
GIS
TE
R15
1413
1211
109
87
65
43
21
0[1
5:0]
FG
AIN
0x
7B5C
[1
5:0]
B
1CO
EF
0x24
92
[15:
0]
B2C
OE
F 0x
5820
[1
5:0]
B
3CO
EF
0x24
10
[15:
0]
A2A
0x
30F4
[1
5:0]
A
2B
0x33
69
[15:
0]
A2D
0x
3A28
[1
5:0]
A
3A
0xE
20E
[1
5:0]
A
3B
0xE
1E3
[15:
0]
A3D
0x
E55
9
Tab
le 4
. Per
iph
eral
Reg
iste
r B
it F
un
ctio
ns
and
Res
et V
alu
es (
con
tin
ued
)
Bits
ind
icat
ed b
y “S
T” r
efle
ct th
e in
put
sig
nal s
tate
.
Bits
ind
icat
ed b
y “P
” ar
e cl
eare
d to
00h
on
PO
R a
nd th
en, i
f req
uire
d, i
nitia
lized
to a
val
ue s
tore
d w
ithin
the
flash
info
rmat
ion
blo
ck.
Bits
ind
icat
ed b
y “D
B”
have
rea
d/w
rite
acce
ss o
nly
in b
ackg
roun
d o
r d
ebug
mod
e. T
hese
bits
are
cle
ared
afte
r a
PO
R.
Bits
ind
icat
ed b
y “D
W”
are
only
writ
ten
to in
deb
ug m
ode.
The
se b
its a
re c
lear
ed a
fter
a P
OR
.
The
OS
CC
reg
iste
r is
cle
ared
to 0
002h
afte
r a
PO
R a
nd is
not
affe
cted
by
othe
r fo
rms
of r
eset
.
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
______________________________________________________________________________________ 39
Applications InformationDevelopment and Technical Support
A variety of highly versatile, affordably priced develop-ment tools for this µC are available from Maxim andthird-party suppliers, including:
– Compilers
– Evaluation kit
– Integrated development environments (IDEs)
– JTAG-to-serial converters for programming anddebugging
A partial list of development tool vendors can be found at www.maxim-ic.com/MAXQ_tools.
Technical support is available at https://support.maxim-ic.com/micro.
Additional DocumentationDesigners must have the following documents to fullyuse all the features of this device. This data sheet con-tains pin descriptions, feature overviews, and electricalspecifications. Errata sheets contain deviations frompublished specifications. The user’s guides offerdetailed information about device features and opera-tion. The following documents can be downloaded from www.maxim-ic.com/microcontrollers.
• This MAXQ7667 data sheet, which contains electri-cal/timing specifications and pin descriptions.
• The MAXQ7667 revision-specific errata sheet(www.maxim-ic.com/errata).
• The MAXQ7667 Family User's Guide, which containsdetailed information on core features and operation,including programming.
Package InformationFor the latest package outline information and land patterns, goto www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
48 LQFP C48+2 21-0054
LQFP
+
MAXQ7667
TOP VIEW
AIN1 37
AIN2 38
AIN3 39
AIN4 40
N.C. 41
DGND 43
DVDDIO 44
BURST 45
42DVDD
47P1.1/TMS48 P1.2/TDI
46P1.0/TDO
1
P1.3
/TCK
2
P1.4
/MOS
I
3
P1.5
/MIS
O
4
P1.6
/SCL
K
5
P1.7
/SYN
C/SS
6
DVDD
7
DGND
8
DVDD
IO
9
PO.O
/URX
10
PO.1
/UTX
11
PO.2
/TXE
N
12
PO.3
/TO/
ADCC
TL
GATE524
REG3P323
REG2P522
XOUT21
XIN20
DGND18
DVDDIO17
PO.7/T2B16
DVDD19
PO.5/T114
PO.4/TOB13
PO.6/T215
AINO
3536
REFB
G
34
REF
33
AGND
32
AVDD
31
AGND
30
ECHO
P
29
ECHO
N
28
AGND
27
AVDD
26
FILT
25
RESE
T
Pin Configuration
Chip InformationPROCESS: CMOS
MA
XQ
76
67
16-Bit, RISC, Microcontroller-Based,Ultrasonic Distance-Measuring System
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses areimplied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
40 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION NUMBER
REVISION DATE
DESCRIPTION PAGES CHANGED
0 4/09 Initial release —
1 7/09 Updated Ordering Information to indicate automotive qualified part 1