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3AL 95278 AAAA Ed.01 Technical Handbook Alcatel 1696MSPAN 32 + 32 Channels DWDM System & Compact shelf 1696MSPAN REL.2.2

1696 Technical V2.2

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Page 1: 1696 Technical V2.2

3AL 95278 AAAA Ed.01

Technical Handbook

Alcatel1696MSPAN

32 + 32 Channels DWDM System

& Compact shelf

1696MSPAN REL.2.2

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3AL 95278 AAAA Ed.01

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1696MSPAN REL.2.2 TECHNICAL HDBK

TABLE OF CONTENTS

LIST OF FIGURES AND TABLES 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

HANDBOOK GUIDE 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 General information 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Handbook applicability 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Product-release handbooks 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Handbook Structure 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Handbook configuration check 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5.1 List of the editions and modified parts 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5.2 Notes on Ed.01 Proposal 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 COMPLIANCE WITH EUROPEAN NORMS. 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Electromagnetic Compatibility (EMC) 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Safety 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 SAFETY NORMS AND LABELS 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 First aid for electric shock 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Safety Rules 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2.1 General Rules 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.2 Labels Indicating Danger, Forbiddance, Command 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.3 Dangerous Electrical Voltages 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.4 Harmful Optical Signals 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.5 Risks of Explosions 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.6 Moving Mechanical Parts 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.7 Heat–radiating Mechanical Parts 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.8 Specific safety rules in this handbook 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 OTHER NORMS AND LABELS 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Electromagnetic Compatibility 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1.1 General Norms – Installation 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.2 General Norms – Turn–on, Tests & Operation 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.3 General Norms – Maintenance 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 Electrostatic Dischargers (ESD) 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Suggestions, notes and cautions 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ED DATE CHANGE NOTE APPRAISAL AUTHORITY ORIGINATOR

01 041015 D. LESTERLIN C. GIANNI

1696MS Rel.2.2 Technical Handbook

F. BRUYERE A.MICHAUD

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4.4 Labels affixed to the Equipment 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5 LIST OF ABBREVIATIONS 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.1 Products, product-releases, versions and Customer Documentation 51. . . . . . . . . . . . . . 6.2 Handbook supply to Customers 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3 Aims of standard Customer Documentation 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4 Handbook Updating 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.4.1 Changes introduced in the same product-release (same handbook P/N) 52. . . . . . . . . . . . 6.4.2 Changes due to a new product-release 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5 Customer documentation supply on CD–ROM 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5.1 Contents, creation and production of a CD–ROM 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5.2 Use of the CD–ROM 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5.3 CD–ROM identification 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5.4 CD–ROM updating 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DESCRIPTIONS 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1 FUNCTIONAL DESIGN 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Equipment basic configurations 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1.1 Line terminal 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1.2 Booster + Pre–amplifier Line terminal 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1.3 Optical Add and Drop Multiplexer (OADM) or back–to–back terminal (hub) 61. . . . . . . . . 1.1.4 OADM or back–to–back terminal (hub) repeater 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1.5 In line repeater 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1.6 Customer Premises Equipment (CPE) 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Network architectures 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2.1 Point–to–point links 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2.2 Ring networks 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2.3 Host systems (ADM..) 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 Protection scenario 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 PHYSICAL CONFIGURATION 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Rack design 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 1696MS shelf physical configuration 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2.1 1696MS Empty shelf 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.2 1696MS Shelf configuration rules 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.3 1696MS Part list 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2.4 1696MS shelf front view 88. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 1696MS_C (compact shelf) physical configuration 89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3.1 1696MS_C Empty shelf 90. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3.2 1696MS_C Shelf configuration rules 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3.3 1696MS_C Part list 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.4 Equipment connections 108. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4.1 Optical connections 109. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4.2 Management and maintenance connections 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4.3 Power supply connections 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4.4 User interfaces 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.5 Units front view 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.1 Tributaries front view 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.2 Multiplexers front view 119. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.3 Optical amplifiers front view 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.4 Controller front view 128. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.5 Switching protection, power supply and fans front view 138. . . . . . . . . . . . . . . . . . . . . . . . . . .

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3 FUNCTIONAL DESCRIPTION 143. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 General description 143. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.1 Transponder sub–system 147. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.2 TDM client signal concentrator (4xANY, 4xANY_S, 4xANY_P) sub–system 151. . . . . . . . . 3.1.3 Wavelength Division Multiplexing sub–system 152. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.4 Optical Fiber Amplification sub–system 157. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.5 Optical supervisory channel (OSC) sub–system 158. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.6 Automatic Power Equalization (APE) subsystem 160. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.7 Controller sub–system 162. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.8 Power supply sub–system 167. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.9 Protection sub–system 169. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.10 Performance Monitoring sub–system 175. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 System Configuration 177. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.1 Configuration criteria 177. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.2 1696MS (main shelf) configurations examples 179. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.3 1696 MS_C (Compact Shelf) configurations examples 198. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.4 1696MS configured to connect a CPE 213. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.5 Two 1696MS or 1696MS_C rings connected together 217. . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 UNITS DESCRIPTION 221. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Tributaries 221. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1.1 Multirate Channel Card I (MCC1) 221. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.2 Multirate Channel Card II (MCC2) 233. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.3 Multirate Channel Card III (MCC3) 246. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.4 MCC_RGN 251. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.5 10 Gbps Optical Channel Card (OCC10) 252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.6 4xANY, 4xANY_S and 4xANY_P cards 263. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.7 Small Formfactor Pluggable (SFP) optical modules 267. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.8 Multiple Variable Attenuator Card (MVAC) 269. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 Multiplexers 271. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.1 OMDX unit 271. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.2 OADM units 275. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.3 SPV_F_1310_1550 279. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.4 SPV_F_C 280. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.3 Optical Amplifier (OAC) 282. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3.1 Description 282. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3.2 Way of working 286. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3.3 Optical characteristics 289. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3.4 Optical safety 289. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.4 Controller 290. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4.1 ESC board 290. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4.2 Supervision units (SPVM2, SPVM_H) 291. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4.3 Optical Spectrum Monitoring Card (OSMC) 295. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4.4 1696MS_C Master Intershelf Link (I–LINK_M) 297. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4.5 1696MS_C Slave Intershelf Link (I–LINK_S) 298. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.5 General user interfaces 299. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.1 LAN board 300. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.2 HouseKeeping board (HK) 302. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.3 Rack Alarm Interface (RAI) 302. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.4 User Interfaces Card (UIC) 305. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.6 Switching Protection (OPC) 306. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.6.1 Single and Multi Mode Optical Protection Cards 306. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.7 Power Supply Card (PSC/PSC3) 308. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.8 Power Supply Card (PSC2) 308. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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4.9 Power Management Unit (PMU) 309. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.9.1 Batteries for PMU 310. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.10 FANS unit 312. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.10.1 FANC unit for 1696MS shelf 312. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.10.2 FAN_C unit for 1696MS_C shelf 313. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5 TECHNICAL SPECIFICATIONS 315. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 1696MSPAN System characteristics 315. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1.1 Main system characteristics 315. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 Safety requirements and mechanism 323. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2.1 Electrical safety 323. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2.2 Optical safety 323. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Boards interfaces characteristics 331. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.1 Tributaries optical characteristics 331. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.2 Multiplexer units (OMDX) optical characteristics 344. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.3 Multiplexer units (OADM) optical characteristics 348. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.4 Mux/Demux 1310–1550 + supervision unit optical characteristics 352. . . . . . . . . . . . . . . . . . 5.3.5 SPV_F_C unit optical characteristics 353. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.6 Optical Amplifier Card (OAC) optical characteristics 354. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.7 SPV–M + OW and SPVM_H optical characteristics 355. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.8 OSMC optical characteristics 356. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3.9 Optical Protection Cards (OPC) optical characteristics 357. . . . . . . . . . . . . . . . . . . . . . . . . . .

5.4 Alarm characteristics 358. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Power supply characteristics 360. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5.1 Maximum power consumption of the boards and units 360. . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6 Mechanical characteristics 361. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6.1 Maximum weight of the boards and units 361. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7 Environmental characteristics 362. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.7.1 EMC/EMI 362. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7.2 Environmental constraints 364. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MAINTENANCE 371. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 MAINTENANCE 373. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.1 Maintenance introduction 373. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1.1 General safety rules 373. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.1.2 General rules 373. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.1.3 Maintenance aspects: definitions 374. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.1.4 Instruments And Accessories 374. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2 Preventive maintenance 375. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.2.1 Routine Maintenance every six months 375. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.2.2 Routine Maintenance every year 377. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.2.3 Routine Maintenance every five years 377. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.3 Corrective maintenance (troubleshooting) 378. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.1 Fault location: alarm & status indication 379. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.4 Set of spare parts 381. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.1 Suggested Spare Parts 381. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.2 General rules on spare parts management 381. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.3 Particular rules on spare parts management 381. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.5 Repair Form 381. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

HARDWARE SETTING DOCUMENTATION 383. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UNIT DOCUMENTATION LIST 385. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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LIST OF FIGURES AND TABLES

FIGURESFigure 1. Subrack label 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 2. Subrack label 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 3. Subrack label 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 4. Labels on units with standard cover plate 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5. Modules label 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 6. Internal label for Printed Board Assembly 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 7. Back panels internal label 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 8. Label specifying item not on catalogue (P/N. and serial number) 42. . . . . . . . . . . . . . . . . . . . Figure 9. Label specifying item on catalogue (P/N. and serial number) 42. . . . . . . . . . . . . . . . . . . . . . . Figure 10. Item identification labels – item on catalog 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 11. Label identifying the equipment (example) 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 12. The 1696MSPAN in line terminal configuration 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 13. The 1696MSPAN in Booster + Pre–amplifier Line Terminal (1 x OAC) configuration 60. . Figure 14. The 1696MSPAN in Booster + Pre–amplifier Line Terminal (2 x OACs) configuration 60. Figure 15. The 1696MSPAN in OADM configuration 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 16. The 1696MSPAN in back–to–back terminal configuration 61. . . . . . . . . . . . . . . . . . . . . . . . . Figure 17. The 1696MSPAN in OADM repeater (1 OAC west side + 1 OAC east side) configuration 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 18. The 1696MSPAN in OADM repeater (2 OACs west side + 2 OACs east side) configuration 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 19. The 1696MSPAN in repeater configuration 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 20. Point–to–point link 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 21. Ring configuration 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 22. Interconnected rings with data on customer ports and supervision carried by Optical Super-vision Channel (OSC) 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 23. Interconnected rings with data on customer ports and LAN_Q management transmission 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 24. CPE configuration 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 25. Connection to host equipments 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 26. Optical SNCP protection scheme: with back–to–back terminals or OADM 68. . . . . . . . . . . Figure 27. Optical SNCP way of working 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 28. Rack organization, 32 channel bi–directional terminal 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 29. Shelf dimensions 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 30. Typical fully equipped shelf 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 31. Example of Master shelf front view 88. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 32. Shelf front view with cover 88. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 33. 1696MS_C Rack version 89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 34. 1696MS_C Table version with and without cover 89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 35. 1696 MS_C – Mechanical structure 90. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 36. 1696 MS_C – Main shelf board arrangement 91. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 37. Typical 1696MS_C equipped shelf 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 38. Fan_C board 107. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 39. Simple MU optical connector 109. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 40. Double MU optical connector 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 41. LC/SPC optical connector on SFP modules 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 42. MCC1 and MCC2 boards Front panel 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 43. MCC3 board Front panel 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 44. OCC10 front panel 115. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 45. 4 ANY front panel 116. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 46. MVAC front panel 117. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Figure 47. SFP optical module 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 48. OMDX8100_M_L1_XS board front panel 119. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 49. OMDX8100_M_L2/S2/S1 boards front panel 120. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 50. OADM8100_M_L1_S (L2/S1/S2) boards front panel 121. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 51. OADM4100_M_chxx–yy_S boards front panel 122. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 52. OADM2100_M_xx_yy_S board front panel 123. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 53. OADM1100_M_xx_S board front panel 124. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 54. SPV_F_1310_1550 board front panel 125. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 55. SPV_F_C board front panel 126. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 56. OAC1, OAC2, OAC1_L and OAC2_L front panel 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 57. ESC front panel 128. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 58. SPVM2 front panel 129. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 59. SPVM_H front panel 130. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 60. OSMC front panel 131. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 61. I–Link_M board front panel 132. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 62. I–Link_S board front panel 133. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 63. LAN boards front panel 134. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 64. Housekeeping board front panel 135. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 65. RAI front panel 136. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 66. UIC front panel 137. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 67. OPC front panel 138. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 68. PSC/PSC2/PSC3 front panel 139. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 69. PMU front panel 140. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 70. FANs front panel 141. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 71. Functional synopsis in Line Terminal configuration 144. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 72. Functional synopsis in OADM configuration 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 73. Functional synopsis in Repeater configuration 146. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 74. Line terminal transponder function 147. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 75. Back–to–back terminal or OADM transponder function 147. . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 76. Principle of the 4xANY TDM concentration 151. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 77. 4 and 8 channels optical MUXes 152. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 78. LB and SB aggregate signals expansion MUX 152. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 79. 4 and 8 channels optical DMUX 153. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 80. LB and SB aggregate signals expansion MUX 153. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 81. MUX and DMUX functions of an 8 channels Line Terminal 154. . . . . . . . . . . . . . . . . . . . . . . . Figure 82. MUX and DMUX functions of a 12 channels Line Terminal 154. . . . . . . . . . . . . . . . . . . . . . . . Figure 83. MUX and DMUX functions of a 32 channels Line Terminal 155. . . . . . . . . . . . . . . . . . . . . . . . Figure 84. MUX and DMUX functions of an 8 channels OADM 155. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 85. MUX and DMUX functions of a 32 channels back–to–back terminal 156. . . . . . . . . . . . . . . . Figure 86. 1696MSPAN in back–to–back terminal configuration and with a remote channel 156. . . . . Figure 87. OFA sub–system in line terminal or OADM configuration 157. . . . . . . . . . . . . . . . . . . . . . . . . . Figure 88. OFA sub–system in repeater configuration 157. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 89. Optical Supervisory Channel management in Line Terminal, OADM, OADM repeater andIn–Line–Repeater Equipment 158. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 90. Automatic Power Equalization 161. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 91. Controller sub–system 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 92. Example of control interfaces scheme in 1696MS 165. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 93. Example of control interfaces scheme in 1696MS_C 166. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 94. 1696MSPAN – equipment power supply scheme 168. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 95. Channel level protection in a ring network 169. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 96. O–SNCP principle 170. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 97. Optical SNCP with MCC units 171. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 98. Optical SNCP of the MCC associated with the 4xANY (MCC–4xANY) 171. . . . . . . . . . . . . . Figure 99. Optical SNCP with OCC10 unit 172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Figure 100. Optical SNCP of the MCC associated with the 4xANY (4xANY client protection) 173. . . . Figure 101. Correspondance between OPC slots allocation and 4xANY drawers in protection 174. . . Figure 102. Two possible monitored sections by the MCC 175. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 103. Example of starting configuration 178. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 104. 4 channels OADM board used as a terminal 180. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 105. 4 channels terminal configuration 180. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 106. Example of 8 channels line terminal with expansion and supervision 181. . . . . . . . . . . . . . Figure 107. Example of 8 channels line terminal with supervision (no expansion) 182. . . . . . . . . . . . . . Figure 108. Example of a 16 channels terminal with expansion and SPV upgradability 183. . . . . . . . . Figure 109. Example of a 32 channels terminal + SPV + two stages OAC 184. . . . . . . . . . . . . . . . . . . . . Figure 110. 32 channels terminal + SPV + 2 stages OAC configuration 185. . . . . . . . . . . . . . . . . . . . . . . Figure 111. 4 channels back–to–back terminal / OADM 186. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 112. 8 OADM protected channels 187. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 113. 8 channels OADM with EXP and SPV capabilities 188. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 114. 8 channels OADM with supervision upgrade capability 189. . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 115. 8 West / 4 East channels OADM 190. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 116. 12 channels OADM with supervision and without expansion 191. . . . . . . . . . . . . . . . . . . . . . Figure 117. 16 channels OADM with supervision and without expansion 192. . . . . . . . . . . . . . . . . . . . . . Figure 118. 16 channels OADM with supervision and expansion 193. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 119. 32 protected channels back–to–back with supervision and one OAC per side 194. . . . . . . Figure 120. Repeater with supervision 195. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 121. 4 x ANY node without drawers protection configuration 197. . . . . . . . . . . . . . . . . . . . . . . . . . Figure 122. 4 x ANY node with drawers protection configuration 197. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 123. 8–channel terminal with SPV and OAC 199. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 124. 12–channel terminal without SPV 200. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 125. OADM 4 channels protected back–to–back with supervision and OAC 201. . . . . . . . . . . . . Figure 126. Remote 4xANY 202. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 127. Remote MCC or MCC+4xANY 203. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 128. Unprotected remote MCC or MCC+4xANY 204. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 129. One protected transponderon the same fiber (2 channel wavelengths) 205. . . . . . . . . . . . . Figure 130. Back–to–back 4XANY intended to drop some of the carried services and by–pass the oth-ers. 206. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 131. Remote unprotected MCC 207. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 132. OADM 1 channel protected 208. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 133. Remote Spur 4xANY + protected MCC on 1310 nm 209. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 134. Remote Spur 4xANY + protected MCC on 1550 nm 209. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 135. 2 channels Line Terminal 210. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 136. Remote CPE, 2–channel terminal: MCC + 4xANY with drawers protection 211. . . . . . . . . Figure 137. SPV Manager 212. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 138. 1696MS connected to a CPE through a supervised black–and–white signal 213. . . . . . . . Figure 139. 1696MS connected to a CPE through a supervised black–and–white and colored signaland protected in the ring 214. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 140. 1696MS connected to a CPE through a supervised black–and–white and colored signaland unprotected in the ring 215. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 141. Optical channel optically passed through the NE without being regenerated. 216. . . . . . . Figure 142. Optical channel optically passed through the NE without being regenerated and with OSCinsertion. 216. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 143. Interconnection of two rings with a 1696MS and a 1696MS_C 217. . . . . . . . . . . . . . . . . . . . Figure 144. Two 1696MS rings connected together through user interfaces. 218. . . . . . . . . . . . . . . . . . Figure 145. Two 1696MS rings connected together through user interfaces. 219. . . . . . . . . . . . . . . . . . Figure 146. Block diagram of the MCC1 boards 221. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 147. MCC in default configuration 223. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 148. Drop / Insert without Optical–SNCP (identical 8x8 matrix configuration) 224. . . . . . . . . . . Figure 149. Drop / Insert with Optical–SNCP (identical 8x8 matrix configuration) 225. . . . . . . . . . . . . . .

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Figure 150. Pass–Through 226. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 151. Local Loop–Back 228. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 152. Remote Loop–Back in ring application (back–to–back or OADM) 229. . . . . . . . . . . . . . . . . Figure 153. User Loop–Back 229. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 154. User Loop–Back & pass–through 230. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 155. Remote Loop–Back in ring application (back–to–back or OADM) 231. . . . . . . . . . . . . . . . . Figure 156. Block diagram of the MCC2 unit 233. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 157. MCC2 in default configuration 236. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 158. Drop / Insert without Optical–SNCP (identical 8x8 matrix configuration) 237. . . . . . . . . . . . Figure 159. Drop / Insert with Optical–SNCP (identical 8x8 matrix configuration) 238. . . . . . . . . . . . . . . Figure 160. Pass–through (regeneration configuration) 239. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 161. Local Loop–Back 241. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 162. Remote Loop–Back in ring application (back–to–back or OADM) 241. . . . . . . . . . . . . . . . . Figure 163. User Loop–Back 242. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 164. User Loop–Back & pass–through 243. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 165. Remote Loop–Back in ring application (back–to–back or OADM) 244. . . . . . . . . . . . . . . . . Figure 166. Block diagram of the MCC3 unit 246. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 167. OCC10 unit block diagram 252. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 168. Drop / Insert without Optical–SNCP (identical 8x8 matrix configuration) 256. . . . . . . . . . . . Figure 169. Drop–insert (UNI) 256. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 170. Drop / Insert with Optical–SNCP (identical 8x8 matrix configuration) 257. . . . . . . . . . . . . . . Figure 171. Pass–through (NNI) 258. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 172. Regeneration (two pass–through linked by 10G backpanel) 258. . . . . . . . . . . . . . . . . . . . . . Figure 173. Drop–insert remote loop–back (UNI) in ring application (back–to–back or OADM) 260. . . Figure 174. Local Loop–Back (UNI) 261. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 175. User Loop–Back (UNI) 261. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 176. 4xANY, 4xANY_S, 4xANY_P block diagram 265. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 177. SFP modules general block diagram (with PIN photodetector) 268. . . . . . . . . . . . . . . . . . . . Figure 178. MVAC unit block diagram 269. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 179. Example of MVAC location in the system 270. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 180. OMDX8100_M_L1_XS: block diagram 271. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 181. OMDX8100_M_L1_X: block diagram 273. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 182. OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2 : block diagram 274. . . . . . . Figure 183. OADM8: block–diagram 275. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 184. OADM4: block–diagram 276. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 185. Block diagram of the OADM2100_M_xx_S unit 277. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 186. OADM1100: block diagram 278. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 187. Block diagram of the SPV_F_1310_1550 unit 279. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 188. Block diagram of the SPV_F_C unit 280. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 189. Position of SPV_F_C unit in a transmission line 281. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 190. Amplifier boards block–diagram 285. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 191. Optical amplifiers configuration 286. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 192. Span variation compensation 286. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 193. Amplifier tuning for number of channels changes (previous span loss constant) 288. . . . . Figure 194. SPVM2 block diagram 292. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 195. SPVM board in a Line Terminal configuration 293. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 196. SPVM board in an OADM or Back–To–Back configuration 294. . . . . . . . . . . . . . . . . . . . . . . Figure 197. OMSC block diagram 295. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 198. OSMC connection (measured points) 295. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 199. I–Link_M block diagram 297. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 200. I–Link_S block diagram 298. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 201. Electrical access, slot description 299. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 202. Block diagram of control LAN board 300. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 203. LAN board settings 301. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Figure 204. Electrical links between RAI cards (slot 37) and TRU & PDU 304. . . . . . . . . . . . . . . . . . . . . Figure 205. 2 Mbit/s back–panel links between UIC Cards and the SPVM unit 305. . . . . . . . . . . . . . . . . Figure 206. OPC block diagram 307. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 207. PSC2 block diagram 308. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 208. PMU cabling scheme 309. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 209. PMU block diagram 310. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 210. Minimum configuration of the batteries in 1696MS_C Rel. 2.2, rack version 311. . . . . . . . Figure 211. Maximum configuration of the batteries in 1696MS_C Rel. 2.2, table version 311. . . . . . . Figure 212. Fan shelf description and Rack partitioning 312. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 213. FAN_C description and Rack partitioning 313. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 214. ALS mechanism on WDM line in point–to–point configuration 326. . . . . . . . . . . . . . . . . . . . . Figure 215. ALS in OADM configuration, channel in pass–through or in add/drop 327. . . . . . . . . . . . . . Figure 216. ALS procedure in a ring with Optical SNCP, in case of fiber failure in the ring 328. . . . . . . Figure 217. ALS procedure in a point–to–point amplified transmission without OADM repeater 329. . Figure 218. ALS mechanism with cascaded pre–amplifier and booster 329. . . . . . . . . . . . . . . . . . . . . . . Figure 219. ALS mechanism with single pre–amplifier and booster 329. . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 220. Restart algorithm 330. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 221. Climatogram for hazard level 1.2: not temperature controlled storage location 366. . . . . . Figure 222. Climatogram for hazard level 3.2: partly temperature controlled locations 369. . . . . . . . . . Figure 223. FAN_C: no–dast filter extraction 376. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 224. position of the alarms in a terminal 379. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 225. position of the alarms in an OADM 380. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 226. Repair form 382. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TABLESTable 1. Handbooks related to the product’s hardware 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 2. Handbooks related to the specific product SW management and local product control 14. . Table 3. Handbooks common to Alcatel Network Elements using 1320CT platform 15. . . . . . . . . . . . . Table 4. Documentation on CD–ROM 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 5. Handbook configuration check 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 6. IEC 950 –Table 16: Over–temperature limits, Part 2 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 7. Label references 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 8. 1696MS boards and units list 76. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 9. 1696MS explanatory notes 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 10. 1696MS_C boards and units list 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 11. 1696MS_C explanatory notes 104. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 12. Example of Client signals – supported bit rates 148. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 13. Nominal frequencies allocation plan in C–Band 149. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 14. MCC protection: switching criteria 170. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 15. OCC10 protection: switching criteria 172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 16. 4xANY client protection: switching criteria per each drawer 174. . . . . . . . . . . . . . . . . . . . . . . . . Table 17. Default thresholds for QoS alarms 176. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 18. Configuration criteria 178. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 19. Summary of the way of working in case of ILOS and LOC 224. . . . . . . . . . . . . . . . . . . . . . . . . . Table 20. Summary of the way of working in case of ILOS and LOC 225. . . . . . . . . . . . . . . . . . . . . . . . . . Table 21. Summary of the way of working in case of ILOS and LOC 226. . . . . . . . . . . . . . . . . . . . . . . . . . Table 22. Summary of the way of working in case of ILOS and LOC 227. . . . . . . . . . . . . . . . . . . . . . . . . . Table 23. Summary of the way of working in case of ILOS and LOC 227. . . . . . . . . . . . . . . . . . . . . . . . . . Table 24. Summary of the way of working in case of ILOS and LOC 237. . . . . . . . . . . . . . . . . . . . . . . . . . Table 25. Summary of the way of working in case of ILOS and LOC 238. . . . . . . . . . . . . . . . . . . . . . . . . . Table 26. Summary of the way of working in case of ILOS and LOC 239. . . . . . . . . . . . . . . . . . . . . . . . . . Table 27. Summary of the way of working in case of ILOS and LOC 240. . . . . . . . . . . . . . . . . . . . . . . . . . Table 28. Summary of the way of working in case of ILOS and LOC 240. . . . . . . . . . . . . . . . . . . . . . . . . . Table 29. MCC2 default Lasers and VOA states 245. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Table 30. OCC10 Shut down mode 254. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 31. OCC10 configurations 255. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 32. Remote Loop–Back pass–through (NNI) in ring application (back–to–back or OADM) 259. Table 33. Remote loop–back (NNI) in ring application (back–to–back or OADM) 260. . . . . . . . . . . . . . . Table 34. OCC10 default Lasers and VOA states 262. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 35. Allowed drawers association 266. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 36. Main differences between OAC1, OAC1_L, OAC2 and OAC2_L optical amplifiers 283. . . . . Table 37. Summary of the way of working in case of ILOS - APSD disable 289. . . . . . . . . . . . . . . . . . . . Table 38. Summary of the way of working in case of ILOS - APSD disable forced ON/OFF 289. . . . . . Table 39. Summary of the way of working in case of ILOS - APSD enable 289. . . . . . . . . . . . . . . . . . . . Table 40. PDU Front Panel LED Markings 303. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 41. TRU Front Panel LED Markings 303. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 42. PSC and PSC3 LEDs signification 308. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 43. Nominal frequencies allocation plan in C–Band 320. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 44. Relation between Alarm severity terminology displayed on C.T./O.S. and alarm severity ter-minology used for the ESC leds and ETSI market rack (TRU). 358. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 45. Valid tests and compliance criteria for immunity 362. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 46. Requirements for RF emission 363. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 47. Main climatic conditions 365. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 48. Main climatic conditions 367. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 49. Main climatic conditions 370. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 50. Example of correspondence between CS and ’suffix + ICS’ 385. . . . . . . . . . . . . . . . . . . . . . . . Table 51. Hardware presetting documentation 388. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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HANDBOOK GUIDE

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1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK

1.1 General information

ALCATEL makes no warranty of any kind with regards to this manual, and specifically disclaims theimplied warranties of merchantability and fitness for a particular purpose. ALCATEL will not be liablefor errors contained herein or for damages, whether direct, indirect, consequential, incidental, orspecial, in connection with the furnishing, performance, or use of this material.

NOTICE

The product specification and/or performance levels contained in this document are for informationpurposes only and are subject to change without notice. They do not represent any obligation on thepart of ALCATEL.

COPYRIGHT NOTIFICATION

The technical information of this manual is the property of ALCATEL and must not be copied,reproduced or disclosed to a third party without written consent.

1.2 Handbook applicability

This handbook applies to the following product-releases:

PRODUCT ANV P/N FACTORY P/N

1696MSPAN 3AL 86601 AAAA 521.210.000

PRODUCT RELEASE VERSION (N.B.) ANV P/N FACTORY P/N

1696MSPAN 2.2 – 3AL 95009 ABAA

N.B. See NOTES FOR HANDBOOKS RELEVANT TO SOFTWARE APPLICATIONS in para.6.4.1on page 52.

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1.3 Product-release handbooks

The list of handbooks given here below is valid on the issue date of this Handbook andcan be changed without any obligation for ALCATEL to update it in this Handbook.

Some of the handbooks listed here below may not be available on the issue date of thisHandbook.

The standard Customer Documentation in the English language for the equipment whoseproduct-release-version is stated on the manual’s front page consists of the following handbooks:

Table 1. Handbooks related to the product’s hardware

REF HANDBOOK ANV Part No.FACTORYPart No.

THISHDBK

[1]

1696MSPAN Rel.2.2Technical Handbook

3AL 95278 AAAA ––––––––

[1]Provides information regarding Equipment description, Maintenance, Hardwaresetting documentation.

1696MSPAN Rel.2.2Installation Handbook

3AL 95278 CAAA ––––––––

[2] Provides stepped procedural instructions for unpacking, inspecting, Alcatel PartNumber assembling, and mounting and wiring bays, sub–frames, I/O panels,ancillary items, and cabling.

1696MSPAN Rel.2.2Turn–On & Commissioning Handbook

3AL 95278 DAAA ––––––––

[3] Provides procedures to support visual inspection, module installation, Alcatel PartNumber and provisioning; and local network element verification tests and genericnetwork tests.

Table 2. Handbooks related to the specific product SW management and local product control

REF HANDBOOK ANV Part No.FACTORY

Part No.

THIS

HDBKor note

[4]

1696MSPAN Rel.2.2Operator’s Handbook

3AL 95278 BAAA ––––––––

[4]

Provides information regarding maintenance using the craft terminal

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Table 3. Handbooks common to Alcatel Network Elements using 1320CT platform

REF HANDBOOK ANV Part No.FACTORY

Part No.

THIS

HDBK

[5]

1320CT 3.XBasic Operator’s Handbook

3AL 79551 AAAA 957.140.042 N

[5]Provides general information and operational procedures common to all 1320CT(Craft terminal) of Alcatel Info–Model Network Elements.

[6]

1330AS Rel.6.5Operator’s Handbook

3AL 88876 AAAA

[6]Provides detailed information and operational procedures regarding the alarmSurveillance software embedded in the 1320CT software package.

ELB Rel.2.X Operator’s Handbook 3AL 88877 AAAA

[7]Provide detailed information and operational procedures regarding the Event LogBrowser software embedded in the 1320CT software package.

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Table 4. Documentation on CD–ROM

See para.6.5 on page 53

REF CD–ROM TITLE ANV Part No. FACTORY Part No.

1696MSPAN Rel.2.2 CD–ROM–DOC EN 3AL 95279 AAAA ––––––––

[8]Contains, in electronic format, the following handbooks: REF.[1] to [4]Envisaged after the release of all handbooks.

1320CT 3.X CD–ROM–DOC EN 3AL 79552 AAAA 417.100.032

[9]Contains, in electronic format, the following handbooks: REF.[5] to [7]Envisaged after the release of all handbooks

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1.4 Handbook Structure

This handbook has been edited according to the Alcatel standardized “drawing–up guides” complying withsuch suggestion.

This handbook is divided into the following main topics as described in the table of contents:

HANDBOOK GUIDE: It contains general information on safety norms, EMC and typeof labels that might be affixed to the equipment. Furthermore,it describes the handbook structure and the customerdocumentation. The abbreviation list is supplied too.

DESCRIPTION: It contains all the equipment’s general and detailed systemfeatures including its application in the telecommunicationnetwork. Furthermore, it supplies the equipment description andspecifications (i.e., system, mechanical,electrical and/oroptical).

MAINTENANCE: It contains all the details for periodic checks, fault location andrepair procedures and restore to normal operation through thewithdrawal of faulty units and their replacement with spares (*)

APPENDICES: Section envisaged (but not necessarily included) to describepossible alternative unit.

HARDWARE SETTINGDOCUMENTATION:

It encloses the documents related to unit hardware settingoperations, if envisaged.

ANNEXES: Section envisaged (but not necessarily included) containingadditional documentation or general information on other topicsnot inherent to the chapters making up the handbook.

(*) If the equipment is software integrated and man–machine interfaced (through a PCD, PC, WorkStation or other external processing/displaying system) the maintenance carried out with suchsystem is described in the Operator’s Handbook (see para.1.3 on page 14 )

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1.5 Handbook configuration check

1.5.1 List of the editions and modified parts

The following table indicates the handbook parts new and modified with respect to the previous edition.

Legenda

n = new part p =proposal partm = modified part PR =proposal edition

Table 5. Handbook configuration check

EDITION 01 02 03 04 05 06

DESCRIPTION n

1. GENERAL n

2. PHYSICAL CONFIGURATION n

3. FUNCTIONAL DESCRIPTION n

4. UNITS DESCRIPTION n

5. TECHNICAL SPECIFICATION n

MAINTENANCE n

6. MAINTENANCE n

APPENDICES

Nothing envisaged

HARDWARE SETTING DOCUMENTATION n

Unit documentation list n

ANNEXES

Nothing envisaged

Note: the edition of the enclosed documents (sections HARDWARE SETTING DOCUMENTATIONand ANNEXES) is not subjected to configuration check.

1.5.2 Notes on Ed.01

Ed.01 created on October 2004 is the first validated and officially released issued of this Handbook.

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2 COMPLIANCE WITH EUROPEAN NORMS.

2.1 Electromagnetic Compatibility (EMC)

The CE markings printed on the product denote compliancy with the following Directives:

• 89/336/EEC of May 3rd, 1989 (EMC Directives), amended

– by the 92/31/EEC Directive issued on April 28th, 1992

– by the 93/68/EEC Directive issued on July 22nd, 1993

Compliancy to the above Directives is declared, when the equipment is installed as for the manufacturerhandbooks, according to the following European Norms:

• EN 300 386 (V1.3.1), environment “Telecommunication center”

WARNING

This is a class A product of EN 55022. In domestic, residential and light industry environments, this productmay cause radio interference in which case the user may be required to take adequate measures.

Compliancy Class of Compact shelf on table configuration: B

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2.2 Safety

Compliancy to Safety Norms is declared in that the equipment satisfies standardized Norms :

• IEC 60950–1 ed. 2001 , for electrical safety

• EN 60950–1 ed. 2001 , for electrical safety

• EN 60825–1 ed. 1994 + A11 ed. 1996 + A2 ed. 2001 for optical safety

• IEC 60825–1 ed. 1993 + A2 ed. 2001 (1999) for optical safety

• EN 60825–2 ed. 2000 for optical safety

• IEC 60825–2 ed. 2000 for optical safety

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3 SAFETY NORMS AND LABELS

3.1 First aid for electric shock

Do not touch the patient with bare hands until the circuit has been opened.

Open the circuit by switching off the line switches. If that is not possible, protect yourself with drymaterial and free the patient from the conductor.

ARTIFICIAL RESPIRATION

It is important to start mouth to mouth resuscitation at once and seek medical help immediately.

TREATMENT OF BURNS

This treatment should be used after the patient has regained consciousness. It can also be employed whilethe artificial respiration is being applied (in this case there should be at least two persons present).

WARNING:

• Do not attempt to remove his clothing from the burnt parts;

• Apply dry gauze on the burns;

• Do not apply ointments or other oily substances.

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Mouth to mouth resuscitation method

1

2

3

4

5

6

Lay the patient supine with his arms parallel with the body, if the patient is layingon an inclined plane, make sure that his stomach is slightly lower than his chest.Open the patient’s mouth and check that there are no extraneous bodies in hismouth (dentures, chewing–gum etc.),

Kneel beside the patient level with his head. Puta hand under the patient’s head and one underhis neck (see fig.) Lift the patient’s head and letit recline backwards as far as possible

Shift the hand from the patient’s neck to is chin:place your thumb between his chin and hismouth, the index along his jawbone, and keep theother fingers closed together (see fig.). Whileperforming these operations take a good supplyof oxygen by taking deep breaths with yourmouth open.

With your thumb between the patient’s chin andmouth keep his lips together and blow into hisnasal cavities (see fig.)

While performing these operations observe if thepatient’s chest rises (see fig.) If not it is possiblethat his nose is blocked: in that case open thepatient’s mouth as much as possible by pressingon his chin with your hand, place your lips aroundhis mouth and blow into his oral cavity. Observeif the patient’s chest heaves. This secondmethod can be used instead of the first evenwhen the patient’s nose is kept closed bypressing the nostrils together using the hand youwere holding his head with. The patient’s headmust be kept sloping backwards as much aspossible.

Start with ten rapid expirations, hence continue at a rate of twelve/fifteenexpirations per minute. Go on like this until the patient has regainedconsciousness, or until a doctor has ascertained his death.

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3.2 Safety Rules

3.2.1 General Rules

• Before carrying out any installation, turn–on, tests & operation and maintenance operationscarefully read the relevant Handbooks and chapters.

• Observe safety rules

– When equipment is operating nobody is allowed to have access inside on the equipmentparts which are protected with Cover Plate Shields removable with tools

– In case of absolute need to have access inside, on the equipment parts when it is operatingthis is allowed exclusively to service personnel, where for Service Personnel or Technicalassistance is meant :

”personnel which has adequate Technical Knowledge and experience necessary to beaware of the danger that he might find in carrying out an operation and of the necessarymeasurements to reduce danger to minimum for him and for others”.

The Service Personnel can only replace the faulty units with spare parts.The Service Personnel is not allowed to repair: hence the access to the parts no specifiedis not permitted.

The keys and/or the tools used to open doors, hinged covers to remove parts which giveaccess to compartments in which are present high dangerous voltages must belongexclusively to the service personnel.

– For the eventual cleaning of the external parts of the equipment, absolutely do not use anyinflammable substance or substances which in some way may alter the markings,inscriptions ect.

– It is recommended to use a slightly wet cleaning cloth.

• The Safety Rules stated in the handbook describe the operations and/or precautions to observeto safeguard service personnel during the working phases and to guarantee equipment safety,i.e., not exposing persons, animals, things to the risk of being injured/damaged.

• Whenever the safety protection features have been impaired, REMOVE POWER.To cut off power proceed to switch off the power supply units as well as cut off power stationupstream (rack or station distribution frame).

• Unless fitted into the equipment, an external protection device on power supply will be providedin the building installation. The breaking capacity of the device will be adequate to the maximumshort circuit current which can flow.

• The safety rules described in this handbook are distinguished by the following symbol andstatement:

SAFETY RULES

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3.2.2 Labels Indicating Danger, Forbiddance, Command

It is of utmost importance to follow the instructions printed on the labels affixed to the units and assemblies.

The labels are fully compliant with International Norms ISO 3846–1984. The symbols or statements areenclosed in geometric shapes: ISO 3864–1984.

CONTAINS A SYMBOL STATEMENT

CONTAINS A STATEMENT PROVIDING INFORMATIONOR INSTRUCTION.

CONTAINS A SYMBOLINDICATES WARNING OR DANGER (YELLOWBACKGROUND–BLACK SYMBOL AND RIM)

(YELLOW BACKGROUND–BLACK STATEMENT AND RIM)

INDICATES FORBIDDANCE (WHITE BACKGROUNDWHIT RED RIM–BLACK SYMBOL OR STATEMENT)

IT IS A COMMAND (BLUE BACKGROUND–WHITESYMBOL OR STATEMENT).

The labels have been affixed to indicate a dangerous condition. They may contain any standard–knownsymbol or any statement necessary to safeguard users and service personnel against the most commonones, specifically:

• dangerous electrical voltages

• harmful optical signals

• risk of explosion

• moving mechanical parts

• heat–radiating Mechanical Parts

Pay attention to the information stated in the following, and proceed as instructed

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The symbols presented in para.3.2.3 through 3.2.7 are all the possible symbols that could bepresent on Alcatel equipment, but are not all necessarily present on the equipment thishandbook refers to.

3.2.3 Dangerous Electrical Voltages

3.2.3.1 Labelling

The following warning label is affixed next to dangerous voltages (>42.4 Vp; >60 Vdc).

If it is a Class 1 equipment connected to mains, then the label associated to it will state that the equipmentwill have to be grounded before connecting it to the power supply voltage, e.g.:

WARNING !

Ground protect the equipment beforeconnecting it to manins

Make sure that power has been cut offbefore disconnecting ground protection.

3.2.3.2 Electrical safety: general rules

DANGER! Possibility of personal injury: carefully observe the specific

procedures for installation / turn–up and commissioning / maintenance of equipment parts where A.C. orD.C. power is present, described in the relevant installation / turn–up and commissioning / maintenancedocuments and the following general rules:

a ) Personal injury can be caused by –48 V dc (or by 220 V ac if envisaged in the equipment). Avoidtouching powered terminals with any exposed part of your body.

b ) Short circuiting, low-voltage, low-impedance, dc circuits can cause severe arcing that can result inburns and/or eye damage. Remove rings, watches, and other metal jewelry before working withprimary circuits. Exercise caution to avoid shorting power input terminals.

3.2.3.3 Electrical safety: equipment specific data

Refer to para. 5.2.1 on page 323.

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3.2.4 Harmful Optical Signals

3.2.4.1 Labelling

If the assembly or unit is fitted with a LASER, the labels must comply with the IEC 825–1–1993International Norms.

The symbol indicates the presence of a LASER beam. Danger level is stated within a rectangular label:

If the LASER is a class 1 or 1M product, the label depicting the symbol within a triangle is not compulsory.

The rectangular shaped label bears all the information needed, i.e.:

• LASER class

• Power emitted

• Wavelength

• Ref. Norm

• Precautionary measures taken depend on LASER class

• Indications given on openings, panels and safety interlocks

exemple of power and lenght values

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3.2.4.2 Optical safety: general rules

On handling optical equipments or units or cables always check that laser labels are properly affixed andthat the system complies with applicable optical standards.

DANGER! Possibility of eyes damage: invisible infrared radiations emitted bythe fiber optic transmitters can cause eyes damages. Carefully observe the specific procedures forinstallation / turn–up and commissioning / maintenance of units containing laser devices or cablestransporting optical signals, described in the relevant installation / turn–up and commissioning /maintenance documents and the following general rules:

a ) Laser radiation is not visible by the naked eye or with laser safety glasses. Although it cannot be seen,laser radiation may be present.

b ) Never look directly into a not terminated fiber optic connector or into a broken optical fiber cable,unless it is absolutely known that no laser radiation is present.

c ) Never look at an optical fiber splice, cable or connector, unless it is absolutely known that no laserradiation is present.

d ) All optical connectors, terminating either fibers and transmitters/receivers, are provided withprotective covers that must always be used, as soon as possible, when any optical link isdisconnected for installation/test/maintenance purposes or whatever operation.

e ) Never look directly into a not terminated fiber optic connector or into a broken optical fiber cable bymeans of magnifiers/microscopes, unless it is absolutely known that no laser radiation is present. Amagnifier/microscope greatly increases the damage hazard to the eyes.

f ) Never point a not terminated optical fiber splice, cable or connector to other persons, unless it isabsolutely known that no laser radiation is present.

g ) Always remove electrical power from near and far optical transmitters before disconnecting opticallinks between the transmitter and the receiver.

h ) Wearing of laser safety goggles or eyes shields is recommended for every person working on opticaldevices, whenever the above listed rules cannot be followed.

3.2.4.3 Optical safety: equipment specific data

Refer to para. 5.2.2 on page 323.

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3.2.5 Risks of Explosions

3.2.5.1 Labelling and safety instructions

This risk is present when batteries are used, and it is signalled by the following label:

Therefore, slits or apertures are made to let air circulate freely and allow dangerous gasses to down flow(battery–emitted hydrogen). A 417–IEC–5641 Norm. compliant label is affixed next to it indicating that theopenings must not be covered up.

3.2.6 Moving Mechanical Parts

3.2.6.1 Labelling and safety instructions

The following warning label is affixed next to fans or other moving mechanical parts:

Before carrying out any maintenance operation see that all the moving mechanical parts have beenstopped.

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3.2.7 Heat–radiating Mechanical Parts

3.2.7.1 Labelling and safety instructions

The presence of heat–radiating mechanical parts is indicated by the following warning label in compliancywith IEC 417 Norm, Fig.5041:

As stated by IEC 60950 Norm., para.1.4.7 the touchable mechanical parts carrying the above depicted

warning label, are those whose temperature T exceeds the limits established by the following formula

(temperatures in °C ):

(T–Tamb) (Tmax + 25° – Tmra)

where:

T Temperature of the mechanical part measured at ambient temperature Tamb.Tamb Ambient temperature during the test.

Tmax Value defined by IEC 950 Norm, Table 16 part 2a, para.5.1, and specified in thetable below.

Tmra The maximum room ambient temperature permitted by the equipmentspecification or 25°C, whichever is greater.

Table 6. IEC 950 –Table 16: Over–temperature limits, Part 2

Operator–accessible parts

Maximum over–temperature (°C )

Operator–accessible partsMetal Glass,

porcelainPlastic,rubber

Handle knob, ect., held or touchedfor short periods

35 45 60

Handles, knobs, ect., regularly held 30 40 50

Outer surface of the equipment thatcan be touched

45 55 70

Inner surface of the equipment thatcan be touched

45 55 70

DANGER! Possibility of personal injury: carefully observe the specificprocedures for installation / turn–up and commissioning / maintenance of equipment parts whereheat–radiating mechanical parts are present, described in the relevant installation / turn–up andcommissioning / maintenance documents and the following general rule:

a ) Personal injury can be caused by heat. Avoid touching powered terminals with any exposed part ofyour body.

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3.2.8 Specific safety rules in this handbook

Specific safety rules are specified in the following paragraphs:

– para. 5.2 on page 323

– para. 6.1.1 on page 373

– para. 6.2.1.1 on page 375

– para. 6.2.2.1 on page 377

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4 OTHER NORMS AND LABELS

4.1 Electromagnetic Compatibility

The equipment’s EMC norms depend on the type of installation being carried out (cable termination,grounding etc.,) and on the operating conditions (equipment, setting options of the electrical/electronicunits, presence of dummy covers, etc.).

• Before starting any installation, turn–on, tests & operation and maintenance work refer to therelevant Handbooks and chapters.

• The norms set down to guarantee EMC compatibility, are distinguished inside this handbookby the symbol and term:

ATTENTION EMC NORMS

4.1.1 General Norms – Installation

• All connections (towards the external source of the equipment) made with shielded cables useonly cables and connectors suggested in this technical handbook or in the relevant PlantDocumentation, or those specified in the Customer’s”Installation Norms.” (or similardocuments)

• Shielded cables must be suitably terminated

• Install filters outside the equipment as required

• Ground connect the equipment utilizing a conductor with proper dia. and impedance

• Mount shields (if utilized), previously positioned during the installation phase, but not beforehaving cleaned and degreased it.

• Before inserting the shielded unit proceed to clean and degrease all peripheral surfaces(contact springs and connection points, etc.)

• Screw fasten the units to the subrack.

• To correctly install EMC compatible equipment follow the instructions given.

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4.1.2 General Norms – Turn–on, Tests & Operation

• Preset the electrical units as required to guarantee EMC compatibility

• Check that the equipment is operating with all the shields properly positioned (dummy covers,ESD connector protections, etc.)

• To properly use EMC compatible equipment observe the information given

4.1.3 General Norms – Maintenance

• Before inserting the shielded unit, which will replace the faulty or modified unit, proceed to cleanand degrease all peripheral surfaces (contact springs and connection points, etc.)

• Clean the dummy covers of the spare units as well.

• Screw fasten the units to the subrack.

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4.2 Electrostatic Dischargers (ESD)

Before removing the ESD protections from the monitors, connectors etc., observe the precautionarymeasures stated. Make sure that the ESD protections have been replaced and after having terminatedthe maintenance and monitoring operations.

Most electronic devices are sensitive to electrostatic discharges, to this concern the following warninglabels have been affixed:

Observe the precautionary measures stated when having to touch the electronic parts during theinstallation/maintenance phases.

Workers are supplied with antistatic protection devices consisting of:

ELASTICIZED BAND

COILED CORD

• an elastic band worn around the wrist

• a coiled cord connected to the elastic band and to the stud on the subrack.

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4.3 Suggestions, notes and cautions

Suggestions and special notes are marked by the following symbol:

Suggestion or note....

Cautions to avoid possible equipment damage are marked by the following symbol:

TITLE...

(caution to avoid equipment damage)statement....

4.4 Labels affixed to the Equipment

This paragraph indicates the positions and the information contained on the identification and seriallabels affixed to the equipment.

Figure 1. to Figure 7. illustrate the most common positions of the labels on the units, modules andsubracks.

Figure 8. to Figure 11. illustrate the information (e.g., identification and serial No.) printed on the labels.

The table below relates the reference numbers stated on the figures to the labels used.

Labelling depicted hereafter is for indicative purposes and could be changed without any notice.

Table 7. Label references

Ref. No. Name of Label

1 label specifying item not on catalogue (P/N. and serial num-ber)

2 label specifying item on catalogue (P/N. and serial number)

3 item identification label – item on catalog

4 label identifying the equipment

On contract basis, customized labels can be affixed to the equipment.Standard labels can be affixed to any position on the equipment, as required by the Customer.However, for each of the above are applied the rules defined by each individual Customer.

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NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 1. Subrack label

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NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 2. Subrack label

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NB.1 = The label is present on the support side

NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 3. Subrack label

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NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 4. Labels on units with standard cover plate

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NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 5. Modules label

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NB.1 = The label is present on the p.c.s. component side

NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 6. Internal label for Printed Board Assembly

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NB. 1 = The label is present on p.c.s. components side or rear side on the empty spaces.

NOTE : The above reference numbers are detailed on Table 7. on page 34

Figure 7. Back panels internal label

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FACTORY P/N + CS

FACTORY SERIAL NUMBER

SERIAL NUMBER BAR CODE (format 128; Module = 0,166; EN 799; Subset B/C)

Figure 8. Label specifying item not on catalogue (P/N. and serial number)

ACRONYM

ANV ITEM PART NUMBER + space + ICS

SERIAL NUMBER

ANV ITEM PART NUMBER + ICS BAR CODE(format ALFA 39 (+ * start, stop); Module = 0,166; Ratio = 2)

SERIAL NUMBER BAR CODE(format ALFA 39 (+ * start, stop); Module = 0,166; Ratio = 2)

ALCATEL FACTORY PART NUMBER + SPACE + CS

Figure 9. Label specifying item on catalogue (P/N. and serial number)

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ACRONYMFREQUENCY(Optional)

ANV ITEM PART NUMBER

Figure 10. Item identification labels – item on catalog

EQUIPMENT NAME

Figure 11. Label identifying the equipment (example)

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5 LIST OF ABBREVIATIONS

A/D Add and Drop functionality

ADM Add and Drop Multiplex

AIS Alarm Indication Signal

ALC Automatic Laser Control

ALS Automatic Laser Shutdown

APS Automatic Protection switching

APSD Automatic Power ShutDown

AS Alarm Surveillance

ASAP Alarm Severity Assignment Profile

ASIC Application Specific Integrated Circuit

AT ATtended Alarm

ATTD ATtended (Alarm storing)

AU Administrative Unit

AUI Attachment Unit Interface for LAN connection

BER Bit Error Rate

BOL Beginning of Life

Ch Channel

CID Card IDentifier

CLEI Common Language Equipment Identification

CPE Costumer Premises Equipment

CSF Communication Subsystem Failure

CT Craft Terminal

DWDM Coarse Wavelength Division Multiplex

DCN Data Communication network

DCU Dispersion Compensating Unit

DFB Distributed Feedback Bragg

DL Download

DMUX Demultiplexing

DTMF Dual Tone Modulation FrequencyDTV (Decision Threshold voltage)

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DV Digital Video

DWDM Dense Wavelength Division Multiplex

EC Equipment Controller

ECC Embedded Channel Communication

ECID Enhanced Card IDentifier

ECT Equipment Craft Terminal

ECC Embedded Channel Communication

EEPROM Electrically Erasable Programmable Read Only Memory

EMC Electromagnetic compatibility

EMI Electromagnetic Interference

EML Equipment Management Layer

EOL End Of Life

EOW Engineering Order Wire

ESC Equipment and Shelf Controller

ESD Electrostatic Discharges

ETSI European Telecommunication Standard Institute

EXP Expansion

FC Fiber Channel

FDI Forward Defect Indication

FEC Forward Error Correction

FPGA Field Programmable Gate Array

HDLC High Level Data Link Control

HK HouseKeeping

HW HardWare

HWF HardWare Failure

IEC International Electrotechnical Commission

I/F Interface

ILOS Input Loss Of Signal

IND INDeterminate

I/O Input/Output

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IOPV Input Optical Power Voltage

IP Internet Protocol

ISO International Standard Organization

ISPB Intra Shelf Parallel Bus

ISSB Intra Shelf Serial Bus

IT Inter–stage

ITU_T International Telecommunication Union –Telecommunication

LAN Local Area Network

LAPD Link Access Protocol D

LB Long Band

LOC Loss Of Clock

LOS Loss Of Signal

LED Light Emitting Diode

LSD Laser ShutDown

LT Line Terminal

MAC Medium Access Control

MCC Multi Channel Card

MMF Multi Mode Fiber

MS Multiplex Section

MVAC Multi Variable Attenuation Card

NE Network Element

NDC Negative Dispersion Chromatic

NES Network Element Synthesis

NML Network Management Layer

NMS Network Management System

NNI Network Node Interface

NSAP Network Service Access Point

NTP Network Time Protocol

NURG Not URGent

OAC Optical Amplifier Card

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OADM Optical Add and Drop Multiplexer

OAM Operator Alarm Maintenance

OBPS On Board Power Supply

OCH Optical Channel

OCHA Optical Channel Adaptation

ODU Optical channel Data Unit

OFA Optical Fiber Amplifier

OGPI Optical Generic Physical Interface

OMDX Optical Multiplexer and DemultipleXer

OMS Optical Multiplex Section

OMSA Optical Multiplex Section Adaptation

OOPV Output Optical Power Voltage

OPC Optical Protection Card

OS Operation System

OSC Optical supervisory channel

OSMC Optical Spectrum Monitoring Card

OSNR Optical Signal Noise Ratio

OSPI Optical Generic Physical Interface

OTN Optical Transport Network

OTS Optical Transmission Section

OTU Optical channel Transport Unit

PCB Printed Circuit Board

PDH Plesiochronous Digital Hierarchy

PDL Polarization Dependent Loss

PDU Power Distribution Unit

PI Physical Interface

PM Performance Monitoring

PMU Power Management Unit

PMD Polarization Mode Dispersion

PSC Power Supply Card

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Q3 Interface with Q3 Protocol

QECC Interface with Q protocol for Embedded Control Channel

QoS Quality of Service

RAM Random Access Memory

RAI Remote Alarm Interface cart

RDI Remote Defect Indication

RECT REmote Craft Terminal

RI Remote Inventory

RUM Replaceable Unit Missing

RUP Replaceable Unit Problem

RUTM Replaceable Unit Type Mismatch

RX Receiver

SB Short Band

SC Shelf Controller

SD ShutDown

SDH Synchronous Digital Hierarchy

SFP Small Formfactor Pluggable

SMF Single Mode Fiber

SNCP Sub–Network Connection Protection

SPI Serial Peripheral Interface

SPVF SuPerVision Filter

SPVM SuPerVision Module

SSF Server Signal Failure

SWDL SoftWare DownLoad

SWP SoftWare Product

TCA Threshold Crossed Alarm

TRU Top Rack Unit

TCP/IP Transmission Control Protocol/Internet Protocol

TMN Telecommunication Management Network

TP Termination Point

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TRU Top Rack Unit

TTP Trail Termination Point

TX Transmitter

UEP Unequipped Equipment Present

UIC User Interface Card

UNI User Network Interface

URG URGent

USM User Service Manager

VOA Variable Optical Attenuator

WDM Wavelength Division Multiplexing

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6 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION

6.1 Products, product-releases, versions and Customer Documentation

A ”product” is defined by the network hierarchical level where it can be inserted and by the whole ofperformance and services for which it is meant.A ”product” evolves through successive ”product-releases” which are the real products marketed fortheir delivery at a certain ”product-release” availability date.

So, a ”product–release” defines a set of hardware components and a software package which, as a whole,identify the possible network applications and the equipment performance which the specific”product-release” has been designed, engineered and marketed for.

In some cases a ”product-release” has further development steps, named ”versions”, that are born toimprove or add some performance (mainly software) with respect to the previous version, or for bug fixingpurposes.

A ”product-release” has its own standard Customer Documentation, composed by one or morehandbooks.

A new ”version” of a ”product-release” may or may not produce a change in the status of the CustomerDocumentation set, as described in para.6.4 on page 52.

6.2 Handbook supply to Customers

Handbooks are not automatically delivered together with the equipment they refer to.The number of handbooks per type to be supplied must be decided at contract level.

6.3 Aims of standard Customer Documentation

Standard Customer Documentation, referred to hereafter, must be always meant as plant-independent.Plant-dependent documentation, if envisaged by the contract, is subjected to commercial criteria as faras contents, formats and supply conditions are concerned (plant-dependent documentation is notdescribed here).

Standard hardware and software documentation is meant to give the Customer personnel the possibilityand the information necessary for installing, commissioning, operating and maintaining the equipmentaccording to Alcatel Laboratory design choices.In particular: the contents of the handbooks associated to the software applications focus on theexplanation of the man-machine interface and of the operating procedures allowed by it; maintenance isdescribed down to faulty PCB location and replacement.

Consequently, no supply to the Customers of design documentation (like PCB hardware design andproduction documents and files, software source programs, programming tools, etc.) is envisaged.

The handbooks concerning hardware (usually the ”Technical Handbook”) and software (usually the”Operator’s Handbook”) are kept separate in that any product changes do not necessarily concern theircontents.

For example, only the Technical Handbook might be revised because of hardware configurationchanges (e.g., replacing a unit with one having different P/N but the same function).On the other hand, the Operator’s Handbook is updated because of a new software version but whichdoes not concern the Technical Handbook as long as it does not imply hardware modifications.However, both types of handbooks can be updated to improve contents, correct mistakes, etc..

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6.4 Handbook Updating

The handbooks associated to the ”product–release” are listed in para.1.3 on page 6 .

Each handbook is identified by:– the name of the ”product-release” (and ”version” when the handbook is applicable to the versions

starting from it, but not to the previous ones),– the handbook name,– the handbook P/N,– the handbook edition (usually first edition=01),– the handbook issue date. The date on the handbook does not refer to the date of print but to the date

on which the handbook source file has been completed and released for the production.

6.4.1 Changes introduced in the same product-release (same handbook P/N)

The edition and date of issue might change on future handbook versions for the following reasons:

– only the date changes (pointed out in the Table of Contents) when modifications are made to theeditorial system not changing the technical contents of the handbook.

– the edition, hence the date, is changed because modifications made concern technical contents. Inthis case:

• the chapters modified with respect to the previous edition are listed in Table 5. on page 18;• in affected chapters, revision bars on the left of the page indicate modifications in text and

drawings.

Changes concerning the technical contents of the handbook cause the edition number increase (e.g. fromEd.01 to Ed.02). Slight changes (e.g. for corrections) maintain the same edition but with the addition ofa version character (e.g. from Ed.02 to Ed.02A). Version character can be used for draft or proposaleditions.

NOTES FOR HANDBOOKS RELEVANT TO SOFTWARE APPLICATIONS

Handbooks (or part of the handbook) relevant to software applications (typically the Operator’sHandbooks) are not modified unless the new software ”version” distributed to Customersimplies man–machine interface changes or in case of slight modifications not affecting theunderstanding of the explained procedures.

Moreover, should the screen prints included in the handbook contain the product-release’s”version” marking, they are not replaced in the handbooks related to a subsequent version, ifthe screen contents are unchanged.

6.4.1.1 Supplying updated handbooks to Customers

Supplying updated handbooks to Customers who have already received previous issues is submitted tocommercial criteria.By updated handbook delivery it is meant the supply of a complete copy of the handbook new issue(supplying errata–corrige sheets is not envisaged).

6.4.2 Changes due to a new product-release

A new product-release changes the handbook P/N and the edition starts from 01.In this case the modified parts of the handbook are not listed.

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6.5 Customer documentation supply on CD–ROM

In the following ’CD–ROM’ means ’Customer Documentation on CD–ROM’

6.5.1 Contents, creation and production of a CD–ROM

In most cases, a CD–ROM contains in read–only eletronic format the documentation of oneproduct–release(–version) and for a certain language.In some other cases, the same CD–ROM can contain the documentation of differentproduct–release(–version)s for a certain language.

As a general rule:

– CD–ROMs for Network Management products do not contain:

• the Installation Guides

• the documentation of system optional features that Customers could not buy from Alcateltogether with the main applicative SW.

– CD–ROMs for Network Elements products do not contain:

• the documentation of system optional features (e.g. System Installation Handbooks related toracks that Customers could not buy from Alcatel together with the main equipment).

A CD–ROM is obtained collecting various handbooks and documents in .pdf format. Bookmarks andhyperlinks make the navigation easier. No additional information is added to each handbook, so that thedocumentation present in the CD–ROMs is exactly the same the Customer would receive on paper.

The files processed in this way are added to files/images for managing purpose and a master CD–ROMis recorded.

Suitable checks are made in order to have a virus–free product.

After a complete functional check, the CD–ROM image is electronically transferred to the archive of theProduction Department, so that the CD–ROM can be produced and delivered to Customers.

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6.5.2 Use of the CD–ROM

The CD–ROM can be used both in PC and Unix WS environments.

The CD–ROM starts automatically with autorun and hyperlinks from the opened “Index” document permitto visualize the .pdf handbooksOther hyperlinks permit to get, from the Technical handbooks, the specific .pdf setting documents.

In order to open the .pdf documents Adobe Acrobat Reader Version 4.0 (minimum) must have beeninstalled on the platform.The CD–ROM doesn’t contain the Adobe Acrobat Reader program. The Customer is in charge of gettingand installing it.ReadMe info is present on the CD–ROM to this purpose.

Then the Customer is allowed to read the handbooks on the PC/WS screen, using the navigation andzooming tools included in the tool, and to print selected parts of the documentation through a local printer.

6.5.3 CD–ROM identification

Each CD–ROM is identified:

1 ) by the following external identifiers, that are printed both on the booklet and the CD–ROM uppersurface:– the name of the ”product–release(s)” (and ”version” if applicable),– a writing indicating the language(s),– the CD–ROM P/N (Factory P/N and ANV P/N),– the CD–ROM edition (usually first edition=01)

2 ) and, internally, by the list of the source handbooks and documents (P/Ns and editions) by whosecollection and processing the CD–ROM itself has been created.

6.5.4 CD–ROM updating

The list of source handbook/document P/Ns–editions indicated in section 6.5.3 point 2 ) , in associationwith the CD–ROM own P/N–edition, is also loaded in the Alcatel–Information–System as a structured list.Whenever a new edition of any of such handbooks/documents is released, a check is made in theAlcatel–Information–System to identify the list of CD–ROMs that must be updated to include the neweditions of these handbooks/documents.This causes the planning and creation of a new edition of the CD–ROM.Updating of CD–ROMs always follows, with a certain delay, the updating of the single handbookscomposing the collection.

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DESCRIPTIONS

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1 FUNCTIONAL DESIGN

The 1696MSPAN product is a DWDM equipment intended for the so called ”enterprise” and metropolitanmarket. It is compliant with both ETSI and ANSI standards.

It provides a higher transmission capacity on a single optical fiber by multiplexing up to 32 channels in theC–band at the following bit rates:

• up to 2.5 Gbit/s (STM–16 / OC–48)

• 10 Gbit/s (STM–64/OC–192).

The 1696MSPAN is mainly composed of transponder cards connected to optical Mux/Demux cards tomanage the main DWDM signal (combined signal) and launch it in the fibre.

Client side, all the signals between 100Mbps to 2.7Gbps and 10Gbps native signals are supported.

A ”Compact WDM” architecture, 1696MS_C is proposed. It is a compact 13 slots shelf enabling point–to–point and ring applications monitored by the Optical Supervisory Channel through SPVM board. From Rel. 2.2 up to two 1696MS_C expansion shelves can be connected to the main one allowing 12 chan-nels terminals or 4 channels OADM configurations. Furthermore amplifiers can be placed inside the compact shelf.

The 1696MSPAN has been designed to offer the following main functions:

– Multiple configurations and multiple network architecturesThe 1696MSPAN can be configured as• line terminal• back–to–back terminal• Optical Add and Drop Multiplexer (OADM)• in line repeater (optical amplifier)These basic configurations cover both point–to–point and ring network applications and with or with-out amplifiers.Different optical add–drop (OADM) nodes can be provided: 1, 2, 4, 8, 12, 16, 24, 32 channels OADM(channels in Add/Drop in both direction).

– Possibility to manage a remote NE named Customer Premises (CPE): it is a 1696MS or 1696MS_Clocated far from a Ring that can be linked to a NE of the ring (1696MS or 1696MS_C) or to anotherNE (point–to–point link).

– Multi–rate client signalsThe 1696MS is equipped with multi–rate transponders, which support the following Client signals• from 100 Mbit/s to 2.7 Gbit/s, by means of the MCC boards• 10Gbps by means of the OCC10 board using, over UNI. Supported bit rates are

– 9.953Gbps (STM–64/10Gbe WAN)– 10.3125 Gbps (10Gbe LAN)

– Client signals TDM concentrationUp to 4 client signals may be concentrated by Time Division Multiplexing, on a unique STM–16 trans-ponder access, in order to optimize the use of each wavelength.Three boards are available (4 x ANY, 4 x ANY_S, 4 x ANY_P). Only their optical characteristics forthe 2.5Gb/s are different.In this handbook the approach is the same for the three boards; each time a 4 x ANY is shown thatis also for the 4 x ANY_S and 4 x ANY_P.

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– Up to 32 optical channels in a single NEEach client signal is assigned to one of the 32 optical channels provided by the transponders. Eachchannel is associated to a fixed wavelength chosen in the third window or C–band (1.550 nm).Up to 16 bidirectional transponders (i.e. 8 ch. OADM with 1+1 optical ch. protection) in one shelf.Fully equipped system with up 32+32 bidirectional wavelengths in one rack (4 shelves per rack).

– Flexible and scalable architectureThe 1696MSPAN design allows to begin modestly with a partially equipped configuration (e.g.: 4 or8 channels) that can be progressively upgraded as the traffic demand grows (e.g.: 16, 24, 32 chan-nels). In particular, from the initial configuration, the transmission capacity can be increased withoutinterrupting the existing traffic.

– ProtectionA protection at channel level is provided in ring application (Sub–Network Connection Protection,SNCP) and point–to–point links (1+1). From rel. 2.2 the 4xANY drawers protection is also provided.

– SupervisionAn extra channel at 1510 nm, the Optical Supervision Channel (OSC), can be optionally added tothe aggregate signal before being launched in the fiber.

– SFP modules performing CWDM, GBEthernet... functionsSTM–1/4/16, GbEthernet, CWDM, Fiber Channel... SFP optical modules are provided, replacing, ac-cording to the board type, the MCC3 client interface and the 4xANY_P aggregate interface.It allows to fit the optical interface with the bitrate characteristics (GbE) or to use CWDM wavelengths.It also allows to build access links with MCC3 on the core ring and 4xANY_P CPE.

– Automatic power equalizationIt consists of an automatic adjustment of the power per channel in order to maintain the optical powerat each node output as flat as possible. This functionality needs OSMC (measuring the power perchannel) and MVAC (adjusting the power value) boards.

– 10Gbps backpanelThe 10Gbps backpanel, introduced in rel. 2.2, allows to link two adjacent OCC10s at 10.7 Gbps.

– Performance MonitoringMonitoring the performances of the client signals and the WDM transmission is available for SDH andSONET frames. Up to 32 PM per NE are managed in rel. 2.2.

– Management InterfacesAs the product is intended to both ETSI and ANSI market, Q3 interface and TL1 interface are supported.

– User InterfacesThe product offers user interfaces for various overhead for data channels and orders wires using (64kbit/s, 2Mbit/s, RS232, audio).

– Firmware downloadThe 1696 MSPAN supports non–traffic affecting firmware download.Boards supporting non–traffic affecting firmware download: OAC2, OAC2_L, OCC10, OSMC.In rel. 2.2 the software NE automatically performs non–traffic affecting firmware download of theOCC10 cards. It is the only firmware download performed by the NE software in rel. 2.2.

N.B. When a board is on Firmware download state the Harware failure LED on the front board lightson yellow color. Never unplug a board while this LED is yellow. Should this occur, theboard will not restart and may have to be returned for factory repair.

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1.1 Equipment basic configurations

The 1696MSPAN and 1696MS_C design, allows the following basic configurations of the equipment:

– Line Terminal– Booster + Pre–amplifier Line Terminal– Optical Add and Drop Multiplexer (OADM) or back–to–back terminal (hub)– OADM or back–to–back terminal (hub) repeater– In line repeater– Customer Premises Equipment (CPE).

1.1.1 Line terminal

In line terminal configuration, the 1696MSPAN connects up to 32 clients signals (1696MS_C = up to 12channels) to an optical fibre DWDM line. In this configuration, the equipment takes place at both ends ofpoint–to–point links.

Up to 32DWDM signals

B&W Client signals

Up to 32 client signals

One fibre pair

MuxDmux

SPV

Mux and Dmux can beOADM or OMDX boards

Up to 32WDMsignals

TPD(up to 32)

λ 132

SPV

Figure 12. The 1696MSPAN in line terminal configuration

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1.1.2 Booster + Pre–amplifier Line terminal

1 x OAC board by terminal

This configuration is made up of a line terminal + one OAC.

Up to 32DWDM signals

B&W Client signals

Up to 32 client signals

One fibre pair

TPD

MuxDmux

OFA SPV

Mux and Dmux can beOADM or OMDX boards

Up to 32WDMsignals

(up to 32)

λ 132 12

1

SPV

Figure 13. The 1696MSPAN in Booster + Pre–amplifier Line Terminal (1 x OAC) configuration

2 x OAC board by terminal

This configuration is made up of a line terminal + two OACs.

Up to 32DWDM signals

B&W Client signals

Up to 32 client signals

One fibre pair

TPD

MuxDmux

OFA

Mux and Dmuxcan be OADM orOMDX boards

Up to 32WDMsignals

(up to 32)

λ 132

OFA SPVAtten/DCU1 2

12

VOA

VOA

SPV

Atten/DCU

Figure 14. The 1696MSPAN in Booster + Pre–amplifier Line Terminal (2 x OACs) configuration

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1.1.3 Optical Add and Drop Multiplexer (OADM) or back–to–back terminal (hub)

Optical Add and Drop Multiplexer (OADM)

In OADM configuration, the 1696MSPAN may add and drop a part of the traffic of an optical DWDM line,in both directions. In this configuration the equipment takes place as linear add and drop multiplexerin:– point–to–point links– ring networks.

Client signals

n–xpass through channels

One fibre pair

TPD

MuxDmux

One fibre pair

TPD

MuxDmux

n λ (up to 32)

x added & droppedchannels

DWDMline signals

n λ (up to 32)

Mux and Dmuxcan be OADM orOMDX boards

Up to 32DWDM

line signals

Up to 32SPV

SPV

SPV

SPV

Figure 15. The 1696MSPAN in OADM configuration

The OADM configuration, especially in ring network, allows the Sub–Network Connection Protection(SNCP) of the added and dropped channels.

Back–to–back terminal (hub)

When ALL the DWDM line channels are added and dropped or electrically regenerated, the 1696MSPANis a back–to–back terminal or a hub node. There is no optical pass through channel. SNCP may beperformed on all the DWDM line channels.

Client signals

One fibre pair

TPD

MuxDmux

One fibre pair

TPD

MuxDmux

n λ (up to 32)n λ (up to 32)

n (up to 32)

SPV

SPV

SPV

SPV

DWDMline signals

Up to 32DWDM

line signals

Up to 32

Mux and Dmuxcan be OADM orOMDX boards

Figure 16. The 1696MSPAN in back–to–back terminal configuration

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1.1.4 OADM or back–to–back terminal (hub) repeater

1 x OAC board in West side + 1 x OAC board in East side

This configuration is made up of a OADM or back–to–back (hub) terminal + one OAC. In the example ofFigure 17. an OADM repeater configuration is shown.

Client signals

n–xpass through channels

One fibre pairTPD

MuxDmux

TPD

MuxDmux

OFAOFA

n λ (up to 32)

x added & droppedchannels

n λ (up to 32)

Mux and Dmuxcan be OADM orOMDX boards

DWDM

signals

Up to 32

DWDM

signals

SPV

SPVSPV

SPV

VOA

VOA

1

21

2

Up to 32

One fibre pair

Figure 17. The 1696MSPAN in OADM repeater (1 OAC west side + 1 OAC east side) configuration

OADM or back–to–back terminals can be equipped with amplifiers on West side or East side or both sides.

2 x OAC board in West side + 2 x OAC board in East side

This configuration is made up of a OADM or back–to–back (hub) terminal + two OACs. In the example ofan OADM repeater configuration is shown.

Client signals

n–xpass through channels

One fibre pair

TPD

MuxDmux

One fibre pair

TPD

n λ (up to 32)

x added & droppedchannels

n λ (up to 32)

Mux and Dmux can be OADM or OMDX boards

DWDM

signals

Up to 32

DWDM

signals

Up to 32

OFA OFA SPV

1 2

12 VOA

OFASPV

SPV

VOA

MuxDmux

OFA

2

1 VOA2

1

SPV

TO/FROM MUX/DMUX

TO/FROM OFAVOA

Atten/DCU

Atten/DCU

Atten/DCU

Atten/DCU

Figure 18. The 1696MSPAN in OADM repeater (2 OACs west side + 2 OACs east side) configuration

OADM or back–to–back terminals can be equipped with amplifiers on West side or East side or both sides.

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1.1.5 In line repeater

In repeater configuration, the 1696MSPAN is a bidirectional DWDM amplifier, without transponders norMUX/DEMUX functions. In this configuration the equipment takes place as line repeater in:

– point–to–point links– ring networks.

One fibre pairOne fibre pair

n λ (up to 32)n λ (up to 32)

Attenuator or DCU

Attenuator or DCU

OFA SPV

VOA

SPV

SPV

SPV

VOADWDM

signals

Up to 32

DWDM

signals

Up to 32

2

1

1

2

OFA

Figure 19. The 1696MSPAN in repeater configuration

1.1.6 Customer Premises Equipment (CPE)

A Customer Premises equipment (CPE) is a 1696MS_C or 1696MS located far from a ring which can belinked to a NE of the ring (1696MS or 1696MS_C) or to an other NE in a point to point link.In that configuration it is possible to manage a remote NE with no obligation to multiplex the optical signal(see Figure 24. page 66).

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1.2 Network architectures

1.2.1 Point–to–point links

A point–to–point link, based on 1696MSPAN, is obtained with:

– a 1696MSPAN in line terminal configuration at each end of the link,– eventually, one or more 1696MSPAN in OADM configuration.

LineTerminal

OADM LineTerminal

Clientend

traffic

Client Add & Drop traffic

Repeater

Clientend

traffic

Figure 20. Point–to–point link

1.2.2 Ring networks

A two fibers ring network is obtained with 1696MSPAN equipment in back–to–back terminal and OADMconfigurations.

OADM

B–to–B

Client end traffic

ClientAdd & drop

traffic

In Line Repeater

OADM repeater

ClientAdd & drop

traffic

Figure 21. Ring configuration

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NE

NE NENE

NE

NE

NE

NE

Black & White linkswith supervision

Figure 22. Interconnected rings with data on customer ports and supervision carried by Optical Super-vision Channel (OSC)

Such a ring interconnection is done through interconnection of customer ports of the adjacent NEs of theinterconnected rings. Supervision is transmitted from one ring to the other with optical insertion of the OSCin one Black & White link through a SPV_F_C board. The NEs host of the interconnection do not need tobe colocated.

NE

NE NENE

NE

NE

NE

NE

Supervision throughinterconnected LAN_Q boards

LAN_QLAN_Q

Figure 23. Interconnected rings with data on customer ports and LAN_Q management transmission

Such a ring interconnection is done through interconnection of customer ports of the adjacent NEs of theinterconnected rings. Supervision is transmitted from one ring to the other through the electrical connec-tion of the LAN_Q boards (only the DCC). This type of interconnection can only be performed in ETSI mar-ket. The NEs host of the interconnection need to be colocated.

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CPE

CPE

CPE

CPE

NO OSC

OSC

NE

NE NE

NE

NE

Figure 24. CPE configuration

CPE consists in remote 4xANY or MCC transponders. Management is performed through OSC. Threedifferent channel configurations can be transmitted to/from a CPE:

• one Black & White channel (1310 nm)• one colored channel (1550 nm)• one 1310 nm and one 1550 nm channels.

A NE located on a ring can support several CPE links, but only two of them can be supervised.

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1.2.3 Host systems (ADM..)

Host systems can be all data equipments whose optical output signals have the following bit–rates– between 100 and 2.5 Gbps– 10 Gbps.They can be :– SDH/SONET (STM–1/OC–3, STM–4/OC–12, STM–16/OC–48, STM–64/OC–192 signals) equip-

ments– IP routers– Fast Ethernet, GBEthernet, 10GBEthernet WAN, 10 GBEthernet LAN, FC, FICON, ESCON... equip-

ments

1696MS

4 x ANY Tx

Rx Tx

Rx Tx

Rx

MUX/

Tx1

Rx1

Tx

Rx

DEMUX

SCHEME

Tx

Rx

CLIENT SYSTEM

Tx

RxOCC10

Tx

Rx Tx

Rx Tx5

Rx5

CLIENT SYSTEMSDH/SONET

Tx

Rx

2.5Gbps

10GBE WAN

2.5Gbps B&W

from 100Mbps to 2.5Gbps

2.5Gbps B&W

CLIENT SYSTEM

Tx

RxSONET OCC10Tx

Rx Tx

Rx TxN (32MAX)

RxN (32MAX)10Gbps SDH

10Gbps B&W

10Gbps B&W

2.5GbpsCOLOURED

SIGNAL

Tx

RxCLIENT SYSTEM

GBE/FICONTx

RxCLIENT SYSTEM

FC/ESCON/FE

Tx1

Rx1

Tx4

Rx4

GBE/FICONFC/ESCON/FE

UP TO FOUR

10GbpsCOLOURED

SIGNAL

10GbpsCOLOURED

SIGNAL

AGGREGATEMULTIPLEXED

SIGNAL(UP TO 32 λ)

CLIENT SYSTEM

Tx

RxOCC10

Tx

Rx Tx

Rx Tx4

Rx410Gbps LAN

10Gbps B&W 10GbpsCOLOURED

SIGNAL

STM1/4, OC3/12,

STM1/4, OC3/12,

Tx

Rx

GBE/FICONCLIENT SYSTEM

FC/ESCON/FESTM1/16. OC3/48

MCCTx

Rx Tx3

Rx3

2.5GbpsCOLOURED

SIGNAL

Tx

RxMCC

Tx

Rx Tx2

Rx2

2.5GbpsCOLOURED

SIGNAL

MCC λ1

λ2

λ1λ1

λ1

λ3

λ4

λ5

λ32

Figure 25. Connection to host equipments

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1.3 Protection scenario

In a ring, the SNCP at OCh level can be provided either in back–to–back terminals or in OADM equipment,as shown in Figure 26. on page 68.At the transmit side, the signal is broadcasted on both arms of the ring and the available signal is selectedat the receive side (when failure of the other signal).

back–to–back terminals

MuxDmux

MuxDmux

Split and select performed in opticaldomain (by switching–off the user Tx)

OADM or back–to–back

Split and select performed in opticaldomain (by switching–off the user Tx)

added channelsdropped channels

Figure 26. Optical SNCP protection scheme: with back–to–back terminals or OADM

The split and select function is optically performed.The protection is optically performed, too; the function is ensured by 2 optical splitters.The selection is done by switching–off the user Tx corresponding to the path in failure and re–activatingthe protecting one (see Figure 27. ).

WDM

WDM Tx

WDM Tx WDM Rx

WDM Rx user Tx

user Tx

user Rx

user Rxoptical splitter optical splitter

optical optical opticalelectrical electrical

Figure 27. Optical SNCP way of working

The protection schemes supported are: MCC1/2/3 only; MCC + 4xANY (only MCC is protected); 4xANYonly (each client/drawer can be protected); MCC2/MCC3 + OAC; OCC10 only; OCC10 + OAC.

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2 PHYSICAL CONFIGURATION

The 1696MSPAN has been designed to offer a record size integration to meet the challenging require-ments of the metropolitan environment. A fully loaded 1696MSPAN system with 32 protected channelscan be housed in one standard ETSI or ANSI racks.

The 1696MSPAN employs a common shelf type for the different network elements. Up to four shelves canbe fit into a single rack.

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2.1 Rack design

The 1696MSPAN mechanical design allows to put up to four shelves in a single rack. It is compatible withthe following mechanical standards– a 2000 mm high ETSI rack,– a 1950 mm high NEBS 2000 rack.The depth is compliant with the 300 mm deep ETSI rack (no limitations in ANSI rack).

Top rack unit

Air deflector

600 mm

2000

Fiber storage

OPTINEX RACK

Power Distribution Unit

Air deflector

600 mm

1950

NEBS 2000 RACK(ETSI)

Figure 28. Rack organization, 32 channel bi–directional terminal

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2.2 1696MS shelf physical configuration

The 1696MS shelf is made up by an empty shelf and the boards and units installed in it.One 1696MS system is composed by one mandatory main/master shelf and up to three slave/expansionshelves. The board composition determines the shelf type: master or slave.

2.2.1 1696MS Empty shelf

2.2.1.1 1696MS shelf organization

The shelf is organized into three parts (one main and two extension), hosting 49 boards or unit slots:

– the main part, which is the upper part and comprises the slots from 1 to 24; here are located the 285mm high boards performing the elaboration of the signal.This part hosts the equipment and shelf controller, up to 16 transponders, up to 11 TDM concentrators(4xANY), optical amplifiers, one mux/demux for LT or two mux/demux or OADM boards (east/west)for hub/OADM application, optical supervisory channel...

– the first extension part, which is the middle part and comprises the slots from 25 to 48; here are lo-cated the 88 mm high boards, herebelow listed• two redundant –48V power supply boards• one LAN access board for the CT or the EML (LAN_Q) connection (in master shelf only)• one LAN access board for inter–shelf communication (LAN_I)• one house–keeping board with 8 x input access + 8 x output access (HK) (in master shelf only)• one remote alarms board (RAI) (in master shelf only)• two user interface boards (UIC) (in master shelf only)• one optical protection channel board (OPC) per protected channel (optical SNCP)

– the second extension part, which is the bottom part and comprises slot 49, where are located the fans.

All the optical and electrical connectors are located on the front of the units to be easily accessed.

This chapter illustrates the physical structure, layout and composition, coding and partition of the shelf.The Equipment shelf front view is illustrated herebelow, in Figure 29. on page 72 and in Figure 30. onpage 74.The units codes and partition are listed in Table 8. on page 76.

Main part (slot 1 to 24)

First extension part (slot 25 to 48)

Second extension part (slot 49)

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2.2.1.2 1696MS Shelf dimensions

FANS

21’’ (533.4 mm)

285

40

443

96 TE (24 x 4 TE wide slots)

88

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

49

15

Figure 29. Shelf dimensions

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2.2.2 1696MS Shelf configuration rules

The board composition and placement of a shelf respects some constraints at the hardware, software andfunctional levels.If general rules are followed, a certain number of standard configurations can be obtained in which boardscan be exchanged without functionality loss.

2.2.2.1 1696MS configuration constraints

Optical Sub–Network Channel Protection requires:

– transponder boards (MCC/OCC10) must be placed in consecutive slots. [4,5] or [6,7] or [8,9] or[10,11] or [14,15] or [16,17] or[18,19] or [20,21]

– each Optical Protecting Channel boards (OPC) must be placed• when protecting transponders, in one of the two slots, located under the corresponding trans-

ponder (MCC/OCC10) pair (e.g.: the OPC in slot 28 or 29 corresponds to the slots 4–5). Thetransponder above the OPC is the main one and the other is the protecting transponder (e.g.:OPC in slot 28 implies main transponder in slot 4 and protecting one in slot 5)

• when protecting 4xANY client signals, in the four slots located below the corresponding 4xANYpair; the 4xANY on the right side contains the MAIN/protected drawers. Starting from the leftthe first OPC protects drawer 2, the second one drawer 1, the third one drawer 3, the fourth onedrawer 4; in case of 4xANY in slots 6,7,8,9, the OPC in slot 30 protects drawer 2, that in slot31 protects drawer 1, that in slot 32 protects drawer 3, that OPC in slot 33 protects drawer 4

– if TDM concentrators (4xANY/_S/_P) are used with few channels, all the boards are preferably putin a single shelf.

– if TDM concentrators are used with more than 8 channels, 4xANY(_S/_P) boards are preferably putin one dedicated shelf.

– using MVAC (for power adjustment of external colored wavelengths, of channel or band opticalpassthrough and for transponder post–emphasis, channel/band loop power adjustment) the boardsallocation depends on the needed configuration (for the boards location refer to installation hand-book).

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2.2.2.2 1696MS Typical shelf configuration

Figure 30. shows a typical configuration of a fully equipped shelf and Table 8. resumes the possibilitiesthat satisfy the configuration constraints.

FANS

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

Tran

spon

der

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

49

HK

Mux

/Dem

ux o

r O

AD

M

Mux

/Dem

ux o

r O

AD

M

Opt

ical

am

plifi

erO

ptic

al a

mpl

ifier

(*)

OS

MC

RAI

PSC

SP

VM

(X)

UIC

UIC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

(*) Mastershelf only

Equ

ipm

ent S

helf

cont

role

r

Figure 30. Typical fully equipped shelf

In the first extension part, except for the PSC and the LAN boards, the placement of the boards has nohardware limitation. However, here is the most frequently used configuration:– the slots 28 to 35 and 38 to 45 are dedicated to the Optical Protection Channel board (OPC),– the slot 36 hosts the HouseKeeping board (HK),– the slot 37 hosts the Remote Alarm Interface board (RAI),– the slots 46 and 47 hosts the User Interface Card (UIC).

Mandatory boards are:

– Slot 1 is dedicated to ESC board (Master and expansion (SC) shelves).– Slots 25 and 48 are dedicated to the Power Supply Cards (Master and Expansion shelves).– Slot 26 of the master shelf is dedicated to the LAN_Q card.– Slot 27 of the slave shelf is dedicated to the LAN_I card.– Slot 49 hosts the FANs card (Master and Expansions).

N.B. Particular setting of the LAN board (slot 26) on the Master shelf:On this board, the rotary switch SW3 corresponding to the ”Equipment Type” must be set in 5value (hexadecimal), otherwise the Shelf Controller will not start.When the straps on the board are forced (by pass state) to be LAN #26 or LAN #27 board, takecare to insert the LAN board in the correct slot.

N.B. the slot 2 can be used for OSMC; it is an optional card.

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2.2.3 1696MS Part list

In Table 8. on page 76 of the following paragraph are listed, named and coded the items and units makingup the Equipment Shelf (see paragraph 2.2.3.1 on page 76).

Furthermore, for any item the position and the maximum quantity that can be allocated inside a singleshelf, are indicated too.

Such table reports the following information :

• Item Name

• The ”Acronym” identifying the units

• ANV part numbers (3ALXXXXX XXXX)

• Maximum quantity per each shelf

• Position of the unit inside the equipment. Refer to Figure 29. on page 72 and Figure 30. onpage 74 for slot numbering.

• Number of explanatory notes

Table 9. on page 85 reports the explanatory notes.

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2.2.3.1 1696MS shelf and boards designation and reference

Table 8. 1696MS boards and units list

NAME ACRONYMANV

Part NumberMaxQ.ty

SLOTNote

MECHANICAL STRUCTURE

1696MSPAN shelf 3AL 86607 AA–– – –– [1]

Shelf 1696MSPAN 10G 3AL 95270 AA–– – –– [2]

1696MSPAN FB shelf 3AL 86607 AC–– – ––

Shelf FB 1696MSPAN 10G 3AL 95270 AB–– – –– [2]

21” D.C.U. assembled support 3AL 86607 AC–– 2 ––

TRIBUTARIES

Multirate CH 192.000–192.100 MCC1 192.0–192.1 3AL 86603 AA––

Multirate CH 192.200–192.300 MCC1 192.2–192.3 3AL 86603 AB––

Multirate CH 192.500–192.600 MCC1 192.5–192.6 3AL 86603 AC––

Multirate CH 192.700–192.800 MCC1 192.7–192.8 3AL 86603 AD––

Multirate CH 193.000–193.100 MCC1 193.0–193.1 3AL 86603 AE––

Multirate CH 193.200–193.300 MCC1 193.2–193.3 3AL 86603 AF––

Multirate CH 193.500–193.600 MCC1 193.5–193.6 3AL 86603 AG––

Multirate CH 193.700–193.800 MCC1 193.7–193.8 3AL 86603 AH––16

411[3]

Multirate CH 194.200–194.300 MCC1 194.2–194.3 3AL 86603 AL––16

4111421

[3]

Multirate CH 194.400–194.500 MCC1 194.4–194.5 3AL 86603 AM––

14 21

Multirate CH 194.700–194.800 MCC1 194.7–194.8 3AL 86603 AN––

Multirate CH 194.900–195.000 MCC1 194.9–195.0 3AL 86603 AP––

Multirate CH 195.200–195.300 MCC1 195.2–195.3 3AL 86603 AQ––

Multirate CH 195.400–195.500 MCC1 195.4–195.5 3AL 86603 AR––

Multirate CH 195.700–195.800 MCC1 195.7–195.8 3AL 86603 AS––

Multirate CH 195.900–196.000 MCC1 195.9–196.0 3AL 86603 AT––

MCC2 192.0–192.1 3AL 86603 BA––

MCC2 192.2–192.3 3AL 86603 BB––

MCC2 192.5–192.6 3AL 86603 BC––

MCC2 192.7–192.8 3AL 86603 BD––

MCC2 193.0–193.1 3AL 86603 BE––

MCC2 193.2–193.3 3AL 86603 BF––

MCC2 193.5–193.6 3AL 86603 BG––

Enhanched Multirate CH MCC2 193.7–193.8 3AL 86603 BH––16

411[4]

Enhanched Multirate CH19x.x00–19x.x00 MCC2 194.2–194.3 3AL 86603 BL––

16411

1421[4]

19x.x00–19x.x00

MCC2 194.4–194.5 3AL 86603 BM––

14 21

MCC2 194.7–194.8 3AL 86603 BN––

MCC2 194.9–195.0 3AL 86603 BP––

MCC2 195.2–195.3 3AL 86603 BQ––

MCC2 195.4–195.5 3AL 86603 BR––

MCC2 195.7–195.8 3AL 86603 BS––

MCC2 195.9–196.0 3AL 86603 BT––

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Note

SLOTMaxQ.ty

ANVPart Number

ACRONYMNAME

MCC3 192.0–192.1 3AL 95150 AA––

MCC3 192.2–192.3 3AL 95150 AB––

MCC3 192.5–192.6 3AL 95150 AC––

MCC3 192.7–192.8 3AL 95150 AD––

MCC3 193.0–193.1 3AL 95150 AE––

MCC3 193.2–193.3 3AL 95150 AF––

Enhanched Multirate CHMCC3 193.5–193.6 3AL 95150 AG––

Enhanched Multirate CH19x.x00–19x.x00 with SFP opti-

MCC3 193.7–193.8 3AL 95150 AH––16

411[5]19x.x00–19x.x00 with SFP opti-

cal modulesMCC3 194.2–194.3 3AL 95150 AJ––

16411

1421[5]

cal modulesMCC3 194.4–194.5 3AL 95150AK––

14 21

MCC3 194.7–194.8 3AL 95150 AL––

MCC3 194.9–195.0 3AL 95150 AM––

MCC3 195.2–195.3 3AL 95150 AN––

MCC3 195.4–195.5 3AL 95150 AP––

MCC3 195.7–195.8 3AL 95150 AQ––

MCC3 195.9–196.0 3AL 95150 AR––

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Note

SLOTMaxQ.ty

ANVPart Number

ACRONYMNAME

OCC10 CH 192.000 OCC10 192.000 3AL 86834 AA––

OCC10 CH 192.100 OCC10 192.100 3AL 86834 AB––

OCC10 CH 192.200 OCC10 192.200 3AL 86834 AC––

OCC10 CH 192.300 OCC10 192.300 3AL 86834 AD––

OCC10 CH 192.500 OCC10 192.500 3AL 86834 AE––

OCC10 CH 192.600 OCC10 192.600 3AL 86834 AF––

OCC10 CH 192.700 OCC10 192.700 3AL 86834 AG––

OCC10 CH 192.800 OCC10 192.800 3AL 86834 AH––

OCC10 CH 193.000 OCC10 193.000 3AL 86834 AL––

OCC10 CH 193.100 OCC10 193.100 3AL 86834 AM––

OCC10 CH 193.200 OCC10 193.200 3AL 86834 AN––

OCC10 CH 193.300 OCC10 193.300 3AL 86834 AP––

OCC10 CH 193.500 OCC10 193.500 3AL 86834 AQ––

OCC10 CH 193.600 OCC10 193.600 3AL 86834 AR––

OCC10 CH 193.700 OCC10 193.700 3AL 86834 AS––

OCC10 CH 193.800 OCC10 193.800 3AL 86834 AT––16

411[6]

OCC10 CH 194.200 OCC10 142.200 3AL 86834 BA––16

4111421

[6]

OCC10 CH 194.300 OCC10 194.300 3AL 86834 BB––

14 21

OCC10 CH 194.400 OCC10 194.400 3AL 86834 BC––

OCC10 CH 194.500 OCC10 194.500 3AL 86834 BD––

OCC10 CH 194.700 OCC10 194.700 3AL 86834 BE––

OCC10 CH 194.800 OCC10 194.800 3AL 86834 BF––

OCC10 CH 194.900 OCC10 194.900 3AL 86834 BG––

OCC10 CH 195.000 OCC10 195.000 3AL 86834 BH––

OCC10 CH 195.200 OCC10 195.200 3AL 86834 BL––

OCC10 CH 195.300 OCC10 195.300 3AL 86834 BM––

OCC10 CH 195.400 OCC10 195.400 3AL 86834 BN––

OCC10 CH 195.500 OCC10 195.500 3AL 86834 BP––

OCC10 CH 195.700 OCC10 195.700 3AL 86834 BQ––

OCC10 CH 195.800 OCC10 195.800 3AL 86834 BR––

OCC10 CH 195.900 OCC10 195.900 3AL 86834 BS––

OCC10 CH 196.000 OCC10 196.000 3AL 86834 BT––

4xANY Host I–16.1 i/f 4xANY 3AL 86639 AA––2;4;6;8;

[7][9]

4xANY Host S–16.1 i/f 4xANY_S 3AL 86872 AA–– 11

2;4;6;8;10;12;14;16;18;20;

[8]

[9]

4xANY Host fully pluggable 4xANY_P 3AL 95063 AA––

18;20;22 [10]

[9]

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ANVPart Number

ACRONYMNAME

TRIBUTARY SUBSYSTEM

4 X ANY SDH/SONET cartridge SDH–SONET_1310 Drawer 3AL 86673 AA–– –– –– [11]

4 X ANY Low speed cartridge LF_1310_2 Drawer 3AL 86674 AA–– –– –– [12]

4 X ANY High speed cartridge HF_1310 Drawer 3AL 86672 AA–– –– –– [13]

4 X ANY Low speed optical car-tridge

LF_850 Drawer 3AL 86869 AA–– –– ––[14][9]

4 X ANY High speed optical car-tridge

HF_850 Drawer 3AL 86870 AA–– –– ––[15][9]

4 X ANY Low speed plug–in 1310(OL–I)

3AL 81617 AA–– –– ––[16][9]

Multiple attenuator card MVAC 3AL 86892 AA–– 16411

1421[17]

SFP MODULES

STM–1 SFP (S–1.1, FE, FDDI,100BaseLX)

SFP_Generic 1AB 19467 0001 –– ––

STM–1 SFP S–1.1 W/DDM SFP_Generic contact Alcatel –– ––

STM–1 SFP L–1.1 SFP_Generic 1AB 19467 0002 –– ––

STM–1 SFP L–1.2 SFP_Generic 1AB 19467 0003 –– ––

STM–4 SFP (S–4.1, ESCON) SFP_S4_1 1AB 19636 0001 –– ––

STM–4 SFP S–4.1 W/DDM SFP_S4_1 contact Alcatel –– ––

STM–4 SFP L–4.1SFP_Generic

1AB 19636 0003 –– ––

STM–4 SFP L–4.2SFP_Generic

1AB 19636 0002 –– ––

1.25GBE SFP (Gbe1000LX/LH 1FiberChannel 1300nm stop gap)

SFP_GBE_LX 1AB 18728 0001 –– ––

1.25GBE SFP Gbe 1000 LX/LHW/DDM

SFP_GBE_LX contact Alcatel –– ––

1.25GBE SFP (Gbe 1000 SX, 1 Fi-ber Channel 850 nm stop gap

SFP_GBE_SX 1AB 18728 0002 –– ––[18]

1.25GBE SFP Gbe 1000 SXW/DDM

SFP_GBE_SX contact Alcatel –– ––

[18]

1.25GBE SFP Gbe 1000 ZX SFP_Generic contact Alcatel –– ––

SFP 1FC, 2FC 850 nm W/DDM SFP_FC_S contact Alcatel –– ––

SFP 1FC, 2FC 1310 nm W/DDM SFP_FC_L contact Alcatel –– ––

STM–16 SFP (S–16.1, 2FC stopgap)

SFP_S16_1 1AB 19637 0001 –– ––

STM–16 SFP I–16.1 SFP_I16_1 1AB 19637 0002 –– ––

STM–16 SFP S–16.1 W/DDM SFP_S16_1 contact Alcatel –– ––

STM–16 SFP I–16.1 W/DDM SFP_I16_1 contact Alcatel –– ––

STM–16 SFP S–16.1 multirate/multiformat W/DDM

SFP _S16_1 1AB 19637 0007 –– ––

STM–16 SFP L–16.1 SFP_Generic 1AB 19637 0004 –– ––

STM–16 SFP L–16.2 SFP_Generic 1AB 19637 0003 –– ––

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ANVPart Number

ACRONYMNAME

STM–16 CWDM 1470 NM PIN 1AB 19634 0001 –– ––

STM–16 CWDM 1490 NM PIN 1AB 19634 0002 –– ––

STM–16 CWDM 1510 NM PIN 1AB 19634 0003 –– ––

STM–16 CWDM 1530 NM PINSFP_C_Bronze

1AB 19634 0004 –– ––

STM–16 CWDM 1550 NM PINSFP_C_Bronze

1AB 19634 0005 –– ––

STM–16 CWDM 1570 NM PIN 1AB 19634 0006 –– ––

STM–16 CWDM 1590 NM PIN 1AB 19634 0007 –– ––

STM–16 CWDM 1610 NM PIN 1AB 19634 0008 –– ––

STM–16 CWDM 1470 NM PIN extTemp Range

contact Alcatel –– ––

STM–16 CWDM 1490 NM PIN extTemp Range

contact Alcatel –– –– [18]

STM–16 CWDM 1510 NM PIN extTemp Range

contact Alcatel –– ––[19]

STM–16 CWDM 1530 NM PIN extTemp Range

SFP_C_Bronzecontact Alcatel –– ––

STM–16 CWDM 1550 NM PIN extTemp Range

SFP_C_Bronzecontact Alcatel –– ––

STM–16 CWDM 1570 NM PIN extTemp Range

contact Alcatel –– ––

STM–16 CWDM 1590 NM PIN extTemp Range

contact Alcatel –– ––

STM–16 CWDM 1610 NM PIN extTemp Range

contact Alcatel –– ––

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ACRONYMNAME

STM–16 CWDM 1470 NM APDSTC

1AB19635 0001 –– ––

STM–16 CWDM 1490 NM APDSTC

1AB 19635 0002 –– ––

STM–16 CWDM 1510 NM APDSTC

1AB 19635 0003 –– ––

STM–16 CWDM 1530 NM APDSTC

SFP_C_Silver1AB 19635 0004 –– ––

STM–16 CWDM 1550 NM APDSTC

SFP_C_Silver1AB 19635 0005 –– ––

STM–16 CWDM 1570 NM APDSTC

1AB 19635 0006 –– ––

STM–16 CWDM 1590 NM APDSTC

1AB 19635 0007 –– ––

STM–16 CWDM 1610 NM APDSTC

1AB 19635 0008 –– –– [18]

STM–16 CWDM 1470 NM APDSTC ext Temp Range

contact Alcatel –– –– [20]

STM–16 CWDM 1490 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1510 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1530 NM APDSTC ext Temp Range

SFP_C_Silvercontact Alcatel –– ––

STM–16 CWDM 1550 NM APDSTC ext Temp Range

SFP_C_Silvercontact Alcatel –– ––

STM–16 CWDM 1570 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1590 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1610 NM APDSTC ext Temp Range

contact Alcatel –– ––

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ACRONYMNAME

MULTIPLEXERS

1x8 Mux/Demux 300–380 + EXP+ SPV

OMDX8100_M_L1_XS 3AL 86615 AA––

2;3;4;5;

[21]

1x8Mux/Demux 300–380+EXP OMDX8100_M_L1_X 3AL 86615 AJ––2

2;3;4;5;6;12;13

[22]

1x8 Mux/Demux 200–280 OMDX8100_M_L2 3AL 86615 AB–– 2 6;12;13;22

1x8 Mux/Demux 520–600 OMDX8100_M_S1 3AL 86615 AC––;22

[23]

1x8 Mux/Demux 420–500 OMDX8100_M_S2 3AL 86615 AD––

[23]

OADM 8 CH 300–380 + SPV OADM8100_M_L1_S 3AL 86637 AA––2;3;4;5; [24]OADM 8 CH 200–280 + SPV OADM8100_M_L2_S 3AL 86637 AB––

22;3;4;5;6;12;13

[24]

OADM 8 CH 520–600 + SPV OADM8100_M_S1_S 3AL 86637 AC––2 6;12;13

;22 [25]OADM 8 CH 420–500 + SPV OADM8100_M_S2_S 3AL 86637 AD––

;22 [25]

OADM 4 CH 200–230 + SPV OADM4100_M_ch20–23_S 3AL 86637 BC––

OADM 4 CH 250–280 + SPV OADM4100_M_ch25–28_S 3AL 86637 BD––

OADM 4 CH 300–330 + SPV OADM4100_M_ch30–33_S 3AL 86637 BA––2;3;4;5;OADM 4 CH 350–380 + SPV OADM4100_M_ch35–38_S 3AL 86637 BB––

22;3;4;5;6;12;13

[26]OADM 4 CH 420–450 + SPV OADM4100_M_ch42–45_S 3AL 86637 BG––

2 6;12;13;22

[26][25]

OADM 4 CH 470–500 + SPV OADM4100_M_ch47–50_S 3AL 86637 BH––;22

[25]

OADM 4 CH 520–550 + SPV OADM4100_M_ch52–55_S 3AL 86637 BE––

OADM 4 CH 570–600 + SPV OADM4100_M_ch57–60_S 3AL 86637 BF––

OADM 2 CH 300–310 + SPV OADM2100_M_30–31_S 3AL 86778 AB––

OADM 2 CH 320–330 + SPV OADM2100_M_32–33_S 3AL 86778 AC–– 2;3;4;5;OADM 2 CH 350–360 + SPV OADM2100_M_35–36_S 3AL 86778 AD–– 2

2;3;4;5;6;12;13 [27]

OADM 2 CH 370–380 + SPV OADM2100_M_37–38_S 3AL 86778 AE––

2 6;12;13;22

[27]

OADM 2 CH 470–480 + SPV OADM2100_M_47–48_S 3AL 86778 AF––

OADM 1 CH 300 + SPV OADM1100_M_30_S 3AL 86777 AJ––

OADM 1 CH 310 + SPV OADM1100_M_31_S 3AL 86777 AK––

OADM 1 CH 320 + SPV OADM1100_M_32_S 3AL 86777 AL––

OADM 1 CH 330 + SPV OADM1100_M_33_S 3AL 86777 AM––2;3;4;5;OADM 1 CH 350 + SPV OADM1100_M_35_S 3AL 86777 AN––

22;3;4;5;6;12;13 [28]

OADM 1 CH 360 + SPV OADM1100_M_36_S 3AL 86777 AP––2 6;12;13

;22[28]

OADM 1 CH 370 + SPV OADM1100_M_37_S 3AL 86777 AQ––;22

OADM 1 CH 380 + SPV OADM1100_M_38_S 3AL 86777 AR––

OADM 1 CH 470 + SPV OADM1100_M_47_S 3AL 86777 BE––

OADM 1 CH 480 + SPV OADM1100_M_48_S 3AL 86777 BF––

Mux–Demux 1310–1550+SPV SPV_F_1310_1550 3AL 86779 AA–– 12;3;12;13;22

[29]

1510 SPV COUPLER SMALL SPV_F_C 3AL 86779 BA–– 128353845

[30]

OPTICAL AMPLIFIER

OFA +17 dBm (22/9) OAC1 3AL 86703 AA–– 4; 5;OFA +17 dBm (28/9) OAC1_L 3AL 86703 AB––

8

4; 5;12; 13;

[31]OFA +17 dBm (22/9) OAC2 3AL 86703 AC––

812; 13;20; 21;22; 23

[31]

OFA +17 dBm (28/9) OAC2_L 3AL 86703 AD––

20; 21;22; 23

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ANVPart Number

ACRONYMNAME

CONTROLLER

ESC (Equipment and Shelf Con-troller)

ESC 3AL 86661 AA–– 1 1; 24 [32]

FLASH CARD 80 MB MEM–DEV 1AB 15205 0001 1 1 [33]

SPV–M + OW SPVM2 3AL 86606 AB–– 2 2;22;23 [34]

SPVM_H SPVM_H 3AL 86606 AC–– 2 2;22;23 [35]

LAC (LAN Access card) LAN_Q or LAN_I 3AL 86653 AA–– 1 26 [36]

Housekeeping card HK 3AL 86668 AA–– 1 36 [37]

Alarm Card RAI 3AL 87009 AA–– 1 37 [38]

UAC (User Access Card) UIC 3AL 86654AA–– 2 46;47 [39]

OSM_C (Monitoring Card) OSMC 3AL 86893AA–– 12;12;13;23

[40]

SWITCHING PROTECTION

Passive optical protect. module OPC 3AL 86708 AA–– 8 [41]

Dual MM Optical Splitter OPC OPC 3AL 86708 AB–– 828 35

[42]

SM–OPC CONNECTORS OPC 3AL 86708 AC–– 8 28353845

[43]

MM–OPC CONNECTORS OPC 3AL 86708 AD–– 83845

[44]

MM_OPC_850 OPC 3AL 95113 AA–– 8 [45]

POWER SUPPLY

Power Supply Card PSC 3AL 86652 AA–– 2 25;48 [46]

Power Supply Card PSC3 3AL 86652 AB–– 2 25;48 [47]

FANS

Fan Card FANC 3AL 86625 AA–– 1 49[48]

Fan Card FANC 3AL 86625 AB–– 1 49[48]

NO–DUST FILTER – 3AL 86633 AA–– 1 49

OPTICAL COMPENSATION DEVICE

DCM–5 DCM–5 1AB 15169 0013

DCM–10 DCM–10 1AB 15169 0007

DCM–15 DCM–15 1AB 15169 0014

DCM–20 DCM–20 1AB 15169 00082 – [49]

DCM–30 DCM–30 1AB 15169 00092 – [49]

DCM–40 DCM–40 1AB 15169 0010

DCM–60 DCM–60 1AB 15169 0011

DCM–80 DCM–80 1AB 15169 0012

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NAME ACRONYMANV

Part NumberMaxQ.ty

SLOTNote

EQUIPMENT ACCESSORIESCircuit breaker 15A 72VDC – 1AB 16271 0006 2 – [50]

Alarm chain cable – 3AL 86750 AA–– 1 – [51]

HK user cable – 3AL 86751 AA–– 1 – [52]

ANSI & NEBS installation kit – 3AL 86725 AA–– 1 – [53]

1696MS Optinex installation kit – 3AL 86772 AA–– 1 – [54]

KIT – Optical kit 8–channel – 3AL 95184 AA–– 2 – [55]

Jumper kit 4 lambda OADM – 3AL 86827 AA–– 2 – [56]

Optical kit 4xANY intra–shelf – 3AL 86863 AA–– 4 – [57]

Opt. kit 4xANY intra–shelf Prot – 3AL 86864 AA–– 4 – [58]

Air deflector ETSI – 3AN 51293 AA–– 3 –

UAC user cable – 3AL 86753 AA–– 1 – [59]

Opto jumper SMF MU/PC–SC/PC L = 3MT

– 1AB 1675400010 16 – [60]

SFP module extractor kit – 3AL 81728 AAAA 1 – [61]

KIT – OPC connection SM – 3AL 95185 AAAA 8 – [62]

KIT – OPC connection MM – 3AL 95186 AAAA 8 – [63]

Jumper SM MU/PC–LC/PC cable – 1AB 18577 0004 16 – [64]

KIT–Common optical amplif. – 3AL 95136 AAAA 1 – [65]

KIT–Common optical not amplif – 3AL 95137 AAAA 1 – [66]

Dummy plate 4TE for PBA – 3AN 50555 AA–– 22 –

Dummy plate 4TE for UTILITY – 3AN 50556 AA–– 22 –

INSTALLATION MATERIALSOpto atten MU/PC 1dB plug type 1AB 20480 0001Opto atten MU/PC 2dB plug type 1AB 20480 0002Opto atten MU/PC 3dB plug type 1AB 20480 0003Opto atten MU/PC 4dB plug type 1AB 20480 0004Opto atten MU/PC 5dB plug type 1AB 20480 0005Opto atten MU/PC 6dB plug type 1AB 20480 0006

Opto atten MU/PC 7dB plug type 1AB 20480 0007Opto atten MU/PC 8dB plug type 1AB 20480 0008

–Opto atten MU/PC 9dB plug type 1AB 20480 0009

Opto atten MU/PC 10dB plug type 1AB 20480 0010Opto atten MU/PC 11dB plug type 1AB 20480 0011Opto atten MU/PC 12dB plug type 1AB 20480 0012Opto atten MU/PC 13dB plug type 1AB 20480 0013

Opto atten MU/PC 14dB plug type 1AB 20480 0014Opto atten MU/PC 15dB plug type 1AB 20480 0015Opto atten MU/PC 20dB plug type 1AB 20480 0016

JUMPER SM MU/MU CABLE 2 MM 810 MM

1AB 18240 0042 –

JUMPER SM MU/MU CABLE 2 MM 500 MM

1AB 18240 0050 1 [67]

JUMPER SM MU/MU CABLE 2 MM 650 MM

1AB 18240 0013 8 [68]

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JUMPER SM MU/MU CABLE 2 MM 650 MM

1AB 18240 0012 2 [69]

REMOVAL TOOL MU/PCPLUG_IN ATTEN.

1AD 03860 0002 1 [70]

SOFTWARE [71]

Table 9. 1696MS explanatory notes

Note Explanation

[1] It is the equipment shelf, including the back panel. Up to four subracks can be housed in an ETSI andNEBS compliant rack

[2] Backpanel able to transmit 10G data, able to link two adjacent OCC10s

[3] It is a universal bidirectional multi–clock 3R transponder supporting all the most common bit rates(from 100 Mbps to 2.5 Gbps) and tunable over two coloured wavelenghts in C band. In case of protec-tion, 2 adjacent MCCs and 1 x OPC are required

[4] 3R transponder supporting all the MCC functions (see [3]) plus VOA to adjust the output optical power

[5] It performs all the MCC2 functions but the optical client interface is replaced by SFP (S–1.1, L–1.1,L–1.2, S–4.1, L–4.1, L–4.2, S–16.1, I–16.1, L–16.1, L–16.2, CWDM, GbEthernet, FC, 2 FC, ES-CON...) optical modules

[6] 10Gbps Optical Channel Card designed for 3R transport of 10 Gbps native signals. This transponder,compliant with ITU–T G.709 Rec, can be provisioned to accept the following client signals– any STM–64/OC–192 (9.953Gbps) to serve as UNI and non–SDH/SONET signals (10GbeWAN)– 10.3125 Gbps (10Gbe LAN)

[7] TDM concentrator multiplexing any mix of up to four client signals (100Mbps1.25 Gbps) into a B&W(@ 1310nm) 2.5 Gbps optical channel, SDH/SONET framing standard (STM–16/OC–48) compliant.It is used with a MCC transponder which provides the coloured optic for WDM transmission. 2.5Gbpsinterface is I–16.1. It occupies two slots: the first slot is always an even position (i:e: 2–3; 4–5;..)

[8] Remote application. It differs from the above 4xANY board (see point [7]) only for the optical 2.5Gbpsinterface: it is S–16.1 type, allowing to cover a longer span (15 Km for S–16.1; 2 Km for I–16.1)

[9] To take into account more stringent EMI requirement with the compact shelf using, the end of Alcatelcode must be:– 4xANY High speed 850 nm cartridge HF–850_Drawer 3AL 86870 AAAG– 4xANY Low speed 850 nm cartridge LF–850_Drawer 3AL 86869 AAAG– 4xANY Host w/ S–16.1 i/f 4xANY_S 3AL 86872 AAAC

[10] TDM concentrator (4xAny) with B&W (I–16.1, S–16.1) or CWDM pluggable (by means of SFP opticalmodules) optical interface at 2,5Gbps

[11] 2nd window plug–in cartridge for 4xANY concentrator, supporting STM–1/OC–3 and STM–4/OC–12.If it is set as STM–1, up to four drawers can be housed in one 4xANY board; if it is set as STM–4,up to three drawers can be housed. STM–1 drawers can be plugged on any slot. STM–4 drawerscan be plugged only on ports #3 and #4; for 3 x STM–4 configuration only, port #1 is available, too

[12] 2nd window plug–in cartridge for 4xANY concentrator, supporting Fast Ethernet, FDDI, ESCON, DV.Up to four low frequency (FE, FDDI, ESCON, DV) drawers can be housed on any port of one 4xANY

[13] 2nd window plug–in cartridge for 4xANY concentrator, supporting Gigabit Ethernet, FICON and FCUp to two high frequency drawers can be housed only on ports #3 and #4 of a 4xANY board

[14] 1nd window plug–in cartridge for 4xANY concentrator, supporting Fast Ethernet, FDDI, ESCON, DVUp to four low frequency (FE, FDDI, ESCON, DV) drawers can be housed on any port of a 4xANY

[15] 1nd window plug–in cartridge for 4xANY concentrator, supporting Gigabit Ethernet, FICON and FCUp to two high frequency drawers can be housed only on ports #3 and #4 of a 4xANY board

[16] 2nd window plug–in cartridge for 4xANY concentrator, supporting Digital Video transport. Up to fourlow frequency drawers can be housed on any port of one 4xANY

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ExplanationNote

[17] Allow to manually adjust the optical power budget. Each MVAC board includes two VOAs

[18] STM1/4/16, GBE, C–WDM, Fiber Channel (2FC, 1FC).... SFP optical plugin modules; they can befitted in 4xANY_P and/or MCC3 boards (refer to Figure 47. on page 118 for SFP placing)

[19] It is the “Bronze” CWDM (SFP STM–16)

[20] It is the “Silver” CWDM (SFP STM–16)

[21] 8 x L1 ch Mux/Demux with expansion (LB/SB combiner/splitter) and Supervision, for hub nodes. Slots4,5,6 are available in master shelf only. Starting MUX if 32 channels hub extension is required withoutamplifiers

[22] 8 x L1 ch Mux/Demux with expansion (LB/SB combiner/splitter), for hub nodes. Slots 4,5,6 are avail-able in master shelf only. Starting MUX if 32 supervised channels hub extension is required whenamplifiers are used

[23] 8 x L2/S1/S2 ch Mux/Demux for hub nodes, used to upgrade the L1 Mux/Demux

[24] Allows to add/drop 8 supervised channels in L1 (3038)/L2 (2028)/S1 (5260)/S2 (4250) band

[25] Can be used also as MUX/DEMUX

[26] Allows to add/drop the 4 supervised channels shown in its own acronym

[27] Allows to add/drop the 2 supervised channels shown in its own acronym

[28] Allows to add/drop the supervised channel shown in its own acronym. From 25 to 38 are long bandchannels: From 47 to 57 are short band channels

[29] Allows to mux/demux a 1310nm channel, a 1550nm multiplexed signal and the SPV/OSC (1510nm)channel. This board allows to supervise a CPE

[30] Allows to mux/demux a SPV/OSC (1510nm) channel and a 1310nm or 1550nm channel. This boardallows to supervise a CPE

[31] Double–stage optical amplifiers able to amplify all the 32 channels in C band. Slots 22 and 23 areavailable in expansion shelves only. OAC1_L and OAC2_L provide long spans transmission. OAC2and OAC2_L reduce power dissipation

[32] It includes both the equipment and shelf controller functionalities. It has to be fitted in expansionshelves, too, to only perform the shelf controller function. Instead, in slot 24 it is only used to havea back–up of the slot 1 flash memory, in TL1 management case (North America)

[33] The flash card contains the equipment data base.It must be equipped only on ESC board plugged in slot 1 of the master shelf

[34] 1510nm Optical Supervisory Channel card managing up to 2 x 1510nm OSC, 2 external 2Mps userinterfaces and the EOW (audio channel). Hosted in master shelf only.The SPVM2 board in slot 23 is exclusively linked to an OADM/OMDX or OAC. Another SPVM2 canbe installed whether in slot #2 or #22 but not in both slots #2 and #22

[35] Depopulated SPVM with one 1510 nm laser, managing 1 x OSC channel

[36] Provide the Q3 management interface allowing to the NMS to supervise the equipment:– plugged in slot #26 of the master shelf, it is used as LAN_Q to connect the NMS– plugged in slot #27, it is used as LAN_I to inter connect the expansion shelves.The LAN board code 3AL 86653 AAAD or later must be used for LAN_I installation in slot 27 of theextension shelf. Any variant of 3AL 86653AA–– may be used for LAN_Q in slot 26 of the master shelf

[37] Hosted in master shelf only, provides 8 input accesses and 8 output accesses

[38] Fitted in master shelf only, is used for monitoring the rack alarms

[39] Hosted in master shelf only, manages G.703 user channels. For any SPVM, two cards are required

[40] The Optical Spectrum Monitoring Card measures the power of each channel. Coupled with MVACprovides automatic power equalization

[41] SM optical splitter with SMF MU/PC jumpers, performing passive OCh (linear config.) or O–SNCP(ring config) protection. It is linked to 2 adjacent MCC/OCC boards and plugged below the main one.

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ExplanationNote

[42] MM optical splitter. In addition to the features provided by the SM splitter (ref. [41]), it manages theHWF led on its front plate and the LOS alarm

[43] SM optical splitter with connectors, having the same features of the SM splitter with jumpers (ref. [41]

[44] MM optical splitter with connectors, having the same features of the MM splitter with jumpers (ref.[42]

[45] MM optical splitter with connectors, used for protection of 4xANY drawers with 850nm transceiver

[46] PSCs work in “1+1” protection meaning that only one PSC is active at once

[47] PSC3 is a Power Supply Card (evolution of PSC card for central office shelf)

[48] It is equipped with three fans; an anti–dust filter has to be put just below the fans

[49] Dispersion Compensating Modules providing chromatic dispersion compensation. The number inthe acronym refers to the SMF distance for which the module provides compensation. DCMs can beplaced either in the inter–stage of an optical amplifier or in the booster and preamplifier of a link. OneDCM simultaneously compensates for the chromatic dispersion of all the (up to 32) 1696 channels

[50] To be used for external subrack power protection with optinex subrack only

[51] Allows the chain connection of the rack alarms, between the SUB–D 9p and RJ45 connectors of twoRAI cards in two different shelves

[52] Used to perform the HK connections from the 25p connector of the HK card to the DDF

[53] Used for equipment installation in ANSI & NEBS rack

[54] Used for equipment installation in OPTINEX rack

[55] The kit contains the fibers to connect 8 transponders to the 8–channel MUX/DEMUX (OMDX/OADM)following the installation rules. 2 kits are needed to connect a shelf equipped with 16 transponders

[56] The kit contains the fibers to connect 8 wavelenght adapters and SPVM to the 4–channel MUX follow-ing the installation rules. Optimized solution can be ordered using single MU–MU jumpers

[57] Required to connect 4xANY HOST to MCC in the same shelf, following installation rules

[58] Required to connect 4xANY HOST to the optical splitter (MCC protection) in the same shelf, followingthe installation rules

[59] Used to perform the (2Mbps and 64Kbps) AUX/service channels connection from the 50pin connec-tor of the UIC card to the DDF

[60] MU–SC/PC jumper for plug–in attenuator manager in ODF

[61] Used to extract the SFP modules (plugged in 4xANY_P and MCC3)

[62] It includes the 4 jumpers allowing to connect a SM OPC with a couple of transponders, providing 1+1protection. 8 codes are needed in a fully equipped transponder shelf with sixteen OCC10/MCC (8 + 8).

[63] It includes the 4 jumpers allowing to connect a MM OPC with a couple of transponders, providing 1+1protection. 8 codes are needed in a fully equipped transponder shelf with sixteen OCC10/MCC (8 + 8).

[64] It includes the 4 jumpers allowing to connect an OPC with a couple of 4xANY drawers, providing 1+1protection. 16 codes are needed in a fully equipped shelf with 32 (16 + 16) 4xANY drawers in eigth 4xANY

[65] Allows the common connection in amplified systems, like the Mux/Demux connection with OAC, con-nection between two stages of the same OAC, connection between two different OACs and extra orpass–through channel connections (Extra IN/OUT connector of the Mux–Demux pair). For detailsrefer to the installation handbook

[66] Allows the common connection in non–amplified systems, like the OSC channel (IN/OUT connectorof SPVM) and extra or pass–through channel connections (Extra IN/OUT connector of the Mux–De-mux pair). For details refer to the installation handbook

[67] Used to connect the OSMC to the the OMDX/OADM for monitoring

[68] Used to connect the OSMC to the OAC monitoring points (stage1 IN/OUT, stage 2 IN/OUT)

[69] Used to connect the OMDX/OADM to the OAC

[70] Used to remove the opto attenuator plug–in

[71] Details concerning the software part number are given in the Operator’s Handbook

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2.2.4 1696MS shelf front view

Figure 31. Example of Master shelf front view

Figure 32. Shelf front view with cover

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2.3 1696MS_C (compact shelf) physical configuration

The 1696MS_C shelf is a ”Compact WDM” architecture. It is a compact 6 slots shelf with possible expansion to 3 compact shelves (1 master shelf plus 2 expansionshelves). It is dedicated to receive the units developped for the 1696MSPAN shelf. As the 1696MS, the compact shelf has two redundant power feeds for –48V.

This architecture enables point to point and ring applications– up to 12 channels in LT configuration– up to 4 channels in OADM configuration(colored or black and white) monitored by the SPVM board.

1696MS_C rack version powered from 48V DC voltage source from the rack connected to the PowerSupply Card.

Figure 33. 1696MS_C Rack version

1696MS_C table version

In a table version using, the operator should wear a wrist–strap bracelet connected to the me-chanical ground (available on the rear of the shelf) for each handling a board, optical connectorsor a part of the shelf.

Figure 34. 1696MS_C Table version with and without cover

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1Main features provided by the 1696MS_C shelf

• It is very easy to use due its small size (6 unit slots versus 24 in the 1696MSPAN shelf)• Independent stand alone 1696MS_C shelf can be used• Units of the 1696MS_C are set horizontally• Up to 12 1696MS_C shelves can be set in a 2000 mm high ETSI rack, or a 2150 mm high ANSI

rack, or a 1950 mm high NEBS 2000 rack.

2.3.1 1696MS_C Empty shelf

2.3.1.1 1696MS_C Shelf organization

The 1696MS_C shelf is organized into three parts (one main part and two extensions parts), hosting 13boards or unit slots:

– the main part, which is the middle part and comprises the slots from 1 to 6; here are located the 285mm high boards performing the elaboration of the signal.This part hosts the equipment and shelf controller, up to 4 transponders, up to 2 TDM concentrators(4xANY), one mux/demux for LT or two mux/dmux or OADM boards (east/west) for hub/OADM ap-plication, optical supervisory channel board (optimized application with SPVM_Half, that is a depopu-lated SPVM supporting one transceiver at 1510 nm instead of two, is possible for point to point andspur configuration)...

– the first extension part, which is the right part and comprises the slots from 7 to 12; here are locatedthe 88 mm high boards, herebelow listed• two redundant –48V power supply boards• one LAN access board for the CT or the EML (LAN_Q) connection• one house–keeping board with 8 x input access + 8 x output access (HK)• one remote alarms board (RAI)• one optical protection channel board (OPC) per protected channel

– the second extension part, which is the left part and comprises slot 13, where are located the fans.

All the optical and electrical connectors are located on the front of the units to be easily accessed.

This chapter illustrates the physical structure, layout and composition, coding and partition of the shelf.

The shelf front view is illustrated herebelow, in Figure 36. on page 91 and in Figure 37. on page 93.

The units codes and partition are listed in Table 10. on page 95.

First extension part (slot 7 to 12)Second extension part (slot 13)

Main part (slot 1 to 6)

Figure 35. 1696 MS_C – Mechanical structure

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2.3.1.2 1696MS_C Shelf dimensions

Shelf size:– the size of the 1696MS_C shelf is 446.2mm (19” width) x 274mm (depth with cover) x 132.4 mm

(heigth)– the depth is compliant with the 300 mm deep ETSI rack (no limitation in ANSI rack).

2.3.1.3 Rack partionning

In current release one master shelf and up to two expansion shelves are managed.

19’’(446.2 mm)

Slot 6

Slot 5

Slot 4

Slot 3

Slot 2

Slot 1

F A N _C

PSC

PSC

MASTER

12

11

10

98

713

ESC

Fiber drawer

LAN_Q

132.

4

300 88

N.B. dark boards are mandatory

Slot 6

Slot 5

Slot 4

Slot 3

Slot 2

Slot 1

F A N _C

PSC

PSC

12

1110

98

713

I–link_S

I–link_M

SLAVE

Figure 36. 1696 MS_C – Main shelf board arrangement

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2.3.2 1696MS_C Shelf configuration rules

The board composition and placement of a shelf respects some constraints at the hardware, software andfunctional levels.If general rules are followed, a certain number of standard configurations can be obtained in which boardscan be exchanged without functionality loss.The main configurations available are:

• OADM 1/2/4 channels (protected back–to–back) configuration with/without OPC• up to 12 channels Line Terminal• Remote 4xANY + protected MCC• Remote 4xANY + protected MCC on 1550 nm• SPVM Manager• 2 channels Line Terminal (MCC + 4xANY)...• Local spur (up to two x 4xANY to save cost of one supervision unit).

Amplified configurations are allowed, by means of OAC2 and OAC2_L.The 4xANY drawers 1+1 protection is also allowed, by means of OPCs.

2.3.2.1 1696MS_C configuration constraints

Optical Sub–Network Channel Protection requires:

– Transponder boards (MCC, OCC10) must be placed in consecutive slots (slots [2,3] or [4,5],

– 4xANY(_S/_P) unit must be placed in a 2–slots space beginning with an even address ([2,3] or [4,5]);if two 4xANY are used, they must be installed in in slots ([2,3] and [4,5]);

– if 4xANY is associated with a MCC all the board are put in a single compact shelf.

– Each Optical Protecting Channel board (OPC) must be placed in one of the two slots, located on theright side of the corresponding MCC/OCC10 pair (e.g.: the OPC in slot 9 or 10 corresponds to theslots 2–3). The MCC/OCC10 on the left of the OPC is the main one and the other is the MCC/OCC10in protection (e.g.: OPC in slot 9 implies main MCC/OCC10 in slot 3 and protecting MCC/OCC10 inslot 2).When protecting 4xANY client signals, the OPCs have to be fitted in the four slots located on the rightof the 4xANY couple; the OPC in slot 8 protects drawer #2, the OPC in slot 9 protects drawer #1, theOPC in slot 10 protects drawer #3, the OPC in slot 11 protects drawer #4;

– When expansion shelves are used• in slot 6 of the master shelf have to be plugged the I–Link_M board• in slot 1 of each expansion shelf have to be plugged the I–Link_S board

N.B. There is no specific NE configuration. The behavior is always the same. The OADM is equiva-lent to the back–to back terminal.

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2.3.2.2 1696MS_C typical shelf configuration

Figure 37. shows a typical configuration of an equipped 1696MS_C Master shelf and Table 10. resumesthe possibilities that satisfy the configuration constraints.

Figure 37. Typical 1696MS_C equipped shelf

For Hardware and/or Software organization, boards are located on dedicated slots.

The position of the boards on the 1696MS_C shelf are:

– ESC board (mandatory): dedicated slot 1 of master shelf– I–link_M card (mandatory, only when expansion shelves are used): dedicated slot 6 of master shelf– I–link_S card (mandatory): dedicated slot 1 of each expansion shelf– PSC/PSC2 cards : dedicated small slots (mandatory equipped) 7 and 12– SPVM cards slot #4, #5, or #6

• SPVM in slot #4 must be provisioned to supervise the multiplexed signal• SPVM boards set in slot #5 and #6 are dedicated to an application with no multiplexed signal

– LAN_Q card (mandatory): dedicated small slot 8– HK card can be installed in small slot 11– RAI card can be installed in small slots 9 or 10– OAC2 and OAC2_L cards can be installed in slot 2, 3– FAN_C card (mandatory): dedicated slot 13.

Mandatory boards are:

– ESC board in slot 1 of master shelf– LAN_Q card in slot 8 of master shelf– I–link_M card in slot 6 of the master shelf (only when expansion shelves are used)– I–link_S card in slot 1 of each expansion shelf– PSC/PSC2 cards in slots 7 and 12– FAN_C card in slot 13.

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2.3.3 1696MS_C Part list

In Table 10. on page 95 of the following paragraph are listed, named and coded the items and units mak-ing up the Equipment Shelf (see paragraph 2.2.3.1 on page 76).

Furthermore, for any item the position and the maximum quantity that can be allocated inside the equip-ment, are indicated too.

Such table reports the following information :

• Item Name

• The ”Acronym” identifying the units

• ANV part numbers (3ALXXXXX XXXX)

• Maximum quantity per each shelf

• Position of the unit inside the equipment. Refer to Figure 36. on page 91 for slot numbering.

• Number of explanatory notes

Table 11. on page 104 reports the explanatory notes.

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2.3.3.1 1696MS_C shelf and boards designation and reference

Table 10. 1696MS_C boards and units list

NAME ACRONYMANV

Part NumberMaxQ.ty

SLOTNote

MECHANICAL STRUCTURE

1696MS_C shelf 3AL 86799 AA–– – –– 1

TRIBUTARIES

MCC1 192.0–192.1 3AL 86603 AA––

MCC1 192.2–192.3 3AL 86603 AB––

MCC1 192.5–192.6 3AL 86603 AC––

MCC1 192.7–192.8 3AL 86603 AD––

MCC1 193.0–193.1 3AL 86603 AE––

MCC1 193.2–193.3 3AL 86603 AF––

MCC1 193.5–193.6 3AL 86603 AG––

Multirate Channel CardMCC1 193.7–193.8 3AL 86603 AH––

4 26 2Multirate Channel CardMCC1 194.2–194.3 3AL 86603 AL––

4 26 2

MCC1 194.4–194.5 3AL 86603 AM––

MCC1 194.7–194.8 3AL 86603 AN––

MCC1 194.9–195.0 3AL 86603 AP––

MCC1 195.2–195.3 3AL 86603 AQ––

MCC1 195.4–195.5 3AL 86603 AR––

MCC1 195.7–195.8 3AL 86603 AS––

MCC1 195.9–196.0 3AL 86603 AT––

MCC2 192.0–192.1 3AL 86603 BA––

MCC2 192.2–192.3 3AL 86603 BB––

MCC2 192.5–192.6 3AL 86603 BC––

MCC2 192.7–192.8 3AL 86603 BD––

MCC2 193.0–193.1 3AL 86603 BE––

MCC2 193.2–193.3 3AL 86603 BF––

MCC2 193.5–193.6 3AL 86603 BG––

Enhanced Multirate Channel MCC2 193.7–193.8 3AL 86603 BH––4 26 3

Enhanced Multirate ChannelCard MCC2 194.2–194.3 3AL 86603 BL––

4 26 3Card

MCC2 194.4–194.5 3AL 86603 BM––

MCC2 194.7–194.8 3AL 86603 BN––

MCC2 194.9–195.0 3AL 86603 BP––

MCC2 195.2–195.3 3AL 86603 BQ––

MCC2 195.4–195.5 3AL 86603 BR––

MCC2 195.7–195.8 3AL 86603 BS––

MCC2 195.9–196.0 3AL 86603 BT––

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Note

SLOTMaxQ.ty

ANVPart Number

ACRONYMNAME

MCC3 192.0–192.1 3AL 95150 AA––

MCC3 192.2–192.3 3AL 95150 AB––

MCC3 192.5–192.6 3AL 95150 AC––

MCC3 192.7–192.8 3AL 95150 AD––

MCC3 193.0–193.1 3AL 95150 AE––

MCC3 193.2–193.3 3AL 95150 AF––

Enhanched Multirate CHMCC3 193.5–193.6 3AL 95150 AG––

Enhanched Multirate CH19x.x00–19x.x00 with SFP opti-

MCC3 193.7–193.8 3AL 95150 AH––4 26 419x.x00–19x.x00 with SFP opti-

cal modulesMCC3 194.2–194.3 3AL 95150 AJ––

4 26 4cal modules

MCC3 194.4–194.5 3AL 95150AK––

MCC3 194.7–194.8 3AL 95150 AL––

MCC3 194.9–195.0 3AL 95150 AM––

MCC3 195.2–195.3 3AL 95150 AN––

MCC3 195.4–195.5 3AL 95150 AP––

MCC3 195.7–195.8 3AL 95150 AQ––

MCC3 195.9–196.0 3AL 95150 AR––

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Note

SLOTMaxQ.ty

ANVPart Number

ACRONYMNAME

OCC10 CH 192.000 OCC10 192.000 3AL 86834 AA––

OCC10 CH 192.100 OCC10 192.100 3AL 86834 AB––

OCC10 CH 192.200 OCC10 192.200 3AL 86834 AC––

OCC10 CH 192.300 OCC10 192.300 3AL 86834 AD––

OCC10 CH 192.500 OCC10 192.500 3AL 86834 AE––

OCC10 CH 192.600 OCC10 192.600 3AL 86834 AF––

OCC10 CH 192.700 OCC10 192.700 3AL 86834 AG––

OCC10 CH 192.800 OCC10 192.800 3AL 86834 AH––

OCC10 CH 193.000 OCC10 193.000 3AL 86834 AL––

OCC10 CH 193.100 OCC10 193.100 3AL 86834 AM––

OCC10 CH 193.200 OCC10 193.200 3AL 86834 AN––

OCC10 CH 193.300 OCC10 193.300 3AL 86834 AP––

OCC10 CH 193.500 OCC10 193.500 3AL 86834 AQ––

OCC10 CH 193.600 OCC10 193.600 3AL 86834 AR––

OCC10 CH 193.700 OCC10 193.700 3AL 86834 AS––

OCC10 CH 193.800 OCC10 193.800 3AL 86834 AT––4 26 5

OCC10 CH 194.200 OCC10 142.200 3AL 86834 BA––4 26 5

OCC10 CH 194.300 OCC10 194.300 3AL 86834 BB––

OCC10 CH 194.400 OCC10 194.400 3AL 86834 BC––

OCC10 CH 194.500 OCC10 194.500 3AL 86834 BD––

OCC10 CH 194.700 OCC10 194.700 3AL 86834 BE––

OCC10 CH 194.800 OCC10 194.800 3AL 86834 BF––

OCC10 CH 194.900 OCC10 194.900 3AL 86834 BG––

OCC10 CH 195.000 OCC10 195.000 3AL 86834 BH––

OCC10 CH 195.200 OCC10 195.200 3AL 86834 BL––

OCC10 CH 195.300 OCC10 195.300 3AL 86834 BM––

OCC10 CH 195.400 OCC10 195.400 3AL 86834 BN––

OCC10 CH 195.500 OCC10 195.500 3AL 86834 BP––

OCC10 CH 195.700 OCC10 195.700 3AL 86834 BQ––

OCC10 CH 195.800 OCC10 195.800 3AL 86834 BR––

OCC10 CH 195.900 OCC10 195.900 3AL 86834 BS––

OCC10 CH 196.000 OCC10 196.000 3AL 86834 BT––

4xANY Host w/ I–16.1 i/f 4xANY 3AL 86639 AA––2 2;4

6, 7

4xANY Host w/ S–16.1 i/f 4xANY_S 3AL 86872 AA––2 2;4

8, 7

4xANY Host fully pluggable 4xANY_P 3AL 95063 AA–– 2 2;4 9, 7

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ANVPart Number

ACRONYMNAME

TRIBUTARY SUBSYSTEM (4xANY DRAWERS)

4 X ANY SDH/SONET cartridge SDH–SONET_1310 Drawer 3AL 86673 AA–– –– –– 10

4 X ANY Low speed cartridge LF_1310_2 Drawer 3AL 86674 AA–– –– –– 11

4 X ANY High speed optical car-tridge

HF_1310 Drawer 3AL 86672 AA–– –– –– 12

4 X ANY Low speed optical car-tridge

LF_850 Drawer 3AL 86869 AA–– –– –– 13,7

4 X ANY High speed optical car-tridge

HF_850 Drawer 3AL 86870 AA–– –– –– 14,7

4 X ANY Low speed plug–in 1310(OL–I)

3AL 81617 AA–– –– –– 15,7

SFP MODULES

STM–1 SFP (S–1.1, FE, FDDI,100BaseLX)

SFP_Generic 1AB 19467 0001 –– ––

STM–1 SFP S–1.1 W/DDM SFP_Generic contact Alcatel –– ––

STM–1 SFP L–1.1 SFP_Generic 1AB 19467 0002 –– ––

STM–1 SFP L–1.2 SFP_Generic 1AB 19467 0003 –– ––

STM–4 SFP (S–4.1, ESCON) SFP_S4_1 1AB 19636 0001 –– ––

STM–4 SFP S–4.1 W/DDM SFP_S4_1 contact Alcatel –– ––

STM–4 SFP L–4.1SFP_Generic

1AB 19636 0003 –– ––

STM–4 SFP L–4.2SFP_Generic

1AB 19636 0002 –– ––

1.25GBE SFP (Gbe1000LX/LH 1FiberChannel 1300nm stop gap

SFP_GBE_LX 1AB 18728 0001 –– ––

1.25GBE SFP Gbe 1000 LX/LHW/DDM

SFP_GBE_LX contact Alcatel –– ––

1.25GBE SFP (Gbe 1000 SX, 1 Fi-ber Channel 850 nm stop gap

SFP_GBE_SX 1AB 18728 0002 –– ––16

1.25GBE SFP Gbe 1000 SXW/DDM

SFP_GBE_SX contact Alcatel –– ––

16

1.25GBE SFP Gbe 1000 ZX SFP_Generic contact Alcatel –– ––

SFP 1FC, 2FC 850 nm W/DDM SFP_FC_S contact Alcatel –– ––

SFP 1FC, 2FC 1310 nm W/DDM SFP_FC_L contact Alcatel –– ––

STM–16 SFP (S–16.1, 2FC stopgap)

SFP_S16_1 1AB 19637 0001 –– ––

STM–16 SFP I–16.1 SFP_I16_1 1AB 19637 0002 –– ––

STM–16 SFP S–16.1 W/DDM SFP_S16_1 contact Alcatel –– ––

STM–16 SFP I–16.1 W/DDM SFP_I16_1 contact Alcatel –– ––

STM–16 SFP S–16.1 multirate/multiformat W/DDM

SFP _S16_1 1AB 19637 0007 –– ––

STM–16 SFP L–16.1 SFP_Generic 1AB 19637 0004 –– ––

STM–16 SFP L–16.2 SFP_Generic 1AB 19637 0003 –– ––

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ACRONYMNAME

STM–16 CWDM 1470 NM PIN 1AB 19634 0001 –– ––

STM–16 CWDM 1490 NM PIN 1AB 19634 0002 –– ––

STM–16 CWDM 1510 NM PIN 1AB 19634 0003 –– ––

STM–16 CWDM 1530 NM PINSFP_C_Bronze

1AB 19634 0004 –– ––

STM–16 CWDM 1550 NM PINSFP_C_Bronze

1AB 19634 0005 –– ––

STM–16 CWDM 1570 NM PIN 1AB 19634 0006 –– ––

STM–16 CWDM 1590 NM PIN 1AB 19634 0007 –– ––

STM–16 CWDM 1610 NM PIN 1AB 19634 0008 –– ––

STM–16 CWDM 1470 NM PIN extTemp Range

contact Alcatel –– ––

STM–16 CWDM 1490 NM PIN extTemp Range

contact Alcatel –– –– 16

STM–16 CWDM 1510 NM PIN extTemp Range

contact Alcatel –– ––17

STM–16 CWDM 1530 NM PIN extTemp Range

SFP_C_Bronzecontact Alcatel –– ––

STM–16 CWDM 1550 NM PIN extTemp Range

SFP_C_Bronzecontact Alcatel –– ––

STM–16 CWDM 1570 NM PIN extTemp Range

contact Alcatel –– ––

STM–16 CWDM 1590 NM PIN extTemp Range

contact Alcatel –– ––

STM–16 CWDM 1610 NM PIN extTemp Range

contact Alcatel –– ––

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ACRONYMNAME

STM–16 CWDM 1470 NM APDSTC

1AB19635 0001 –– ––

STM–16 CWDM 1490 NM APDSTC

1AB 19635 0002 –– ––

STM–16 CWDM 1510 NM APDSTC

1AB 19635 0003 –– ––

STM–16 CWDM 1530 NM APDSTC

SFP_C_Silver1AB 19635 0004 –– ––

STM–16 CWDM 1550 NM APDSTC

SFP_C_Silver1AB 19635 0005 –– ––

STM–16 CWDM 1570 NM APDSTC

1AB 19635 0006 –– ––

STM–16 CWDM 1590 NM APDSTC

1AB 19635 0007 –– ––

STM–16 CWDM 1610 NM APDSTC

1AB 19635 0008 –– ––16

STM–16 CWDM 1470 NM APDSTC ext Temp Range

contact Alcatel –– ––

16

18

STM–16 CWDM 1490 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1510 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1530 NM APDSTC ext Temp Range

SFP_C_Silvercontact Alcatel –– ––

STM–16 CWDM 1550 NM APDSTC ext Temp Range

SFP_C_Silvercontact Alcatel –– ––

STM–16 CWDM 1570 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1590 NM APDSTC ext Temp Range

contact Alcatel –– ––

STM–16 CWDM 1610 NM APDSTC ext Temp Range

contact Alcatel –– ––

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ACRONYMNAME

MULTIPLEXERS

1x8 Mux/Demux 300–380 + EXP+ SPV

OMDX8100_M_L1_XS 3AL 86615 AA–– 19

1x8Mux/Demux 300–380+EXP OMDX8100_M_L1_X 3AL 86615 AJ––2 4;5:6

20

1x8 Mux/Demux 200–280 OMDX8100_M_L2 3AL 86615 AB–– 2 4;5:6

1x8 Mux/Demux 520–600 OMDX8100_M_S1 3AL 86615 AC–– 21

1x8 Mux/Demux 420–500 OMDX8100_M_S2 3AL 86615 AD––

21

OADM 8 CH 300–380 + SPV OADM8100_M_L1_S 3AL 86637 AA––22,OADM 8 CH 200–280 + SPV OADM8100_M_L2_S 3AL 86637 AB––

2 4;5;622,23,

OADM 8 CH 520–600 + SPV OADM8100_M_S1_S 3AL 86637 AC––2 4;5;6 23,

24OADM 8 CH 420–500 + SPV OADM8100_M_S2_S 3AL 86637 AD––

24

OADM 4 CH 200–230 + SPV OADM4100_M_ch20–23_S 3AL 86637 BC––

OADM 4 CH 250–280 + SPV OADM4100_M_ch25–28_S 3AL 86637 BD––

OADM 4 CH 300–330 + SPV OADM4100_M_ch30–33_S 3AL 86637 BA––

OADM 4 CH 350–380 + SPV OADM4100_M_ch35–38_S 3AL 86637 BB––2 4;5;6 25,

OADM 4 CH 420–450 + SPV OADM4100_M_ch42–45_S 3AL 86637 BG––2 4;5;6 25,

23

OADM 4 CH 470–500 + SPV OADM4100_M_ch47–50_S 3AL 86637 BH––

23

OADM 4 CH 520–550 + SPV OADM4100_M_ch52–55_S 3AL 86637 BE––

OADM 4 CH 570–600 + SPV OADM4100_M_ch57–60_S 3AL 86637 BF––

OADM2100_M_30–31_S 3AL 86778 AB––

OADM2100_M_32–33_S 3AL 86778 AC––

2 channels OADM with SPV card OADM2100_M_35–36_S 3AL 86778 AD–– 2 4;5;6 262 channels OADM with SPV card

OADM2100_M_37–38_S 3AL 86778 AE––

2 4;5;6 26

OADM2100_M_47–48_S 3AL 86778 AF––

OADM1100_M_25_S 3AL 86777 AE––

OADM1100_M_30_S 3AL 86777 AJ––

OADM1100_M_31_S 3AL 86777 AK––

OADM1100_M_32_S 3AL 86777 AL––

OADM1100_M_33_S 3AL 86777 AM––

1 channel OADM with SPV cardsOADM1100_M_35_S 3AL 86777 AN––

2 4;5;6 271 channel OADM with SPV cardsOADM1100_M_36_S 3AL 86777 AP––

2 4;5;6 27

OADM1100_M_37_S 3AL 86777 AQ––

OADM1100_M_38_S 3AL 86777 AR––

OADM1100_M_47_S 3AL 86777 BE––

OADM1100_M_48_S 3AL 86777 BF––

OADM1100_M_57_S 3AL 86777 BN––

Supervision Filter card(SPV_F_1310_1550)

SPV_F_1310_1550 3AL 86779 AA–– 1 5;6 28

Supervision Filter card SPV_F_C 3AL 86779 BA–– 3 811 29

OPTICAL AMPLIFIER

OFA +17 dBm (22/9) OAC2 3AL 86703 AC––2 2,3 30

OFA +17 dBm (28/9) OAC2_L 3AL 86703 AD––2 2,3 30

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ANVPart Number

ACRONYMNAME

CONTROLLER

Equipment and Shelf Controller ESC 3AL 86661 AA–– 1 1 31

FLASH CARD 80 MB MEM–DEV 1AB 15205 0001 1 1 32

SPVM + OW SPVM2 3AL 86606 AB–– 2 4;5;6 33

SPVM_H SPVM_H 3AL 86606 AC–– 2 4;5;6 34

LAN Access card LAN_Q 3AL 86653 AA–– 1 8 35

Housekeeping card HK 3AL 86668 AA–– 1 11 36

Rack Alarm Interface board RAI 3AL 87009 AA–– 1 9;10 37

I–LINK MASTER I–LINK_M 3AL 86805 AA–– 1 638

I–LINK_SLAVE I–LINK_S 3AL 86808 AA–– 1 138

SWITCHING PROTECTION

Optical Protection Card OPC 3AL 86708 AA–– 39

Dual MM Optical Splitter OPC OPC 3AL 86708 AB––4 811

40

SM–OPC CONNECTORS OPC 3AL 86708 AC––4 811

41

MM–OPC CONNECTORS OPC 3AL 86708 AD–– 42

MM_OPC_850 OPC 3AL 95113 AA–– 43

POWER SUPPLY

PSC_C PSC2 3AL 86888 AA–– 2 7;12 44

Power Management Unit PMU 3AL 86825 AA––1 – 45

Batteries for PMU 3AL 95210 AA––1 – 45

Power supply BOX – 3AL 95239 AA–– – – 46

FANS

COMPACT FAN FAN_C 3AL 86802 AA–– 1 13 47

COMPACT DUST FILTER – 3AN 51151 AA–– 1 13

OPTICAL COMPENSATION DEVICE

DCM–5 DCM–5 1AB 15169 0013

DCM–10 DCM–10 1AB 15169 0007

DCM–15 DCM–15 1AB 15169 0014

DCM–20 DCM–20 1AB 15169 00082 – 48

DCM–30 DCM–30 1AB 15169 00092 – 48

DCM–40 DCM–40 1AB 15169 0010

DCM–60 DCM–60 1AB 15169 0011

DCM–80 DCM–80 1AB 15169 0012

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ACRONYMNAME

EQUIPMENT ACCESSORIES

Circuit breaker 15A 72VDC – 1AB 16271 0006 2 – 49

HK user cable – 3AL 95073 AA–– 1 – 50

1696MS_C ANSI install. kit – 3AL 95101 AAAA 1 – 51

Kit for C_shelf install on ETSI rack – 3AN 51124 AAAA 1 – 52

I–Link cable – 3AL 95179 AA–– 2 – 53

Cable from BOX to PSC/PSC2 – 3AL 95264 AA–– 2 – 54

SFP module extractor kit – 3AL 81728 AAAA 1 – 55

JUMPER SMF MU/MU CABLE2MM 1700MM

– 1AB 18240 0049 4 – 56

JUMPER SMF MU/PC–MU/PC360MM

– 1AB 18240 0004 4 –57

JUMPER SMF MU/PC–MU/PC450MM

– 1AB 18240 0007 4 –57

KIT – OPC connection SM – 3AL 95185 AAAA 2 – 58

KIT – OPC connection MM – 3AL 95186 AAAA 2 – 59

Jumper SM MU/PC–LC/PC cable – 1AB 18240 0004 4 – 60

Dummy plate 4TE for PBA – 3AN 50555 AA–– 6 –

Dummy plate 4TE for UTILITY – 3AN 50556 AA–– 6 –

INSTALLATION MATERIALS

Opto atten MU/PC 1dB plug type 1AB 20480 0001

Opto atten MU/PC 2dB plug type 1AB 20480 0002

Opto atten MU/PC 3dB plug type 1AB 20480 0003

Opto atten MU/PC 4dB plug type 1AB 20480 0004

Opto atten MU/PC 5dB plug type 1AB 20480 0005

Opto atten MU/PC 6dB plug type 1AB 20480 0006

Opto atten MU/PC 7dB plug type 1AB 20480 0007

Opto atten MU/PC 8dB plug type 1AB 20480 0008–

Opto atten MU/PC 9dB plug type 1AB 20480 0009–

Opto atten MU/PC 10dB plug type 1AB 20480 0010

Opto atten MU/PC 11dB plug type 1AB 20480 0011

Opto atten MU/PC 12dB plug type 1AB 20480 0012

Opto atten MU/PC 13dB plug type 1AB 20480 0013

Opto atten MU/PC 14dB plug type 1AB 20480 0014

Opto atten MU/PC 15dB plug type 1AB 20480 0015

Opto atten MU/PC 20dB plug type 1AB 20480 0016

JumperSM MU/MU cable 2mm 810 1AB 18240 0042–

JumperSM MU/MU cable 2mm 500 1AB 18240 0050–

REMOVAL TOOL MU/PCPLUG_IN ATTEN.

1AD 03860 0002 1 61

SOFTWARE 62

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Table 11. 1696MS_C explanatory notes

Note Explanation

1 It is the equipment shelf, including the back panel.

2 It is a universal bidirectional multi–clock 3R transponder supporting all the most common bit rates(from 100 Mbps to 2.5 Gbps) and tunable over two coloured wavelenghts in C band. In case of protec-tion, 2 adjacent MCCs and 1 x OPC are required

3 3R transponder supporting all the MCC functions (see [3]) plus VOA to adjust the output optical power

4 It performs all the MCC2 functions but the optical client interface is replaced by SFP (S–1.1, L–1.1,L–1.2, S–4.1, L–4.1, L–4.2, S–16.1, I–16.1, L–16.1, L–16.2, CWDM, GbEthernet, FC, 2 FC, ES-CON...) optical modules

5 10Gbps Optical Channel Card designed for 3R transport of 10 Gbps native signals. This transponder,compliant with ITU–T G.709 Rec, can be provisioned to accept the following client signals– any STM–64/OC–192 (9.953Gbps) to serve as UNI and non–SDH/SONET signals (10GbeWAN)– 10.3125 Gbps (10Gbe LAN)

6 TDM concentrator multiplexing any mix of up to four client signals (100Mbps1.25 Gbps) into a B&W(@ 1310nm) 2.5 Gbps optical channel, SDH/SONET framing standard (STM–16/OC–48) compliant.It is used with a MCC transponder which provides the coloured optic for WDM transmission. 2.5Gbpsinterface is I–16.1. It occupies two slots: the first slot is always an even position (i:e: 2–3; 4–5;..)

7 To take into account more stringent EMI requirement with the compact shelf using, the 4xANY and4xANY_S, the end of Alcatel code must be:– 4xANY High speed 850 nm cartridge HF–850_Drawer 3AL 86870 AAAG– 4xANY Low speed 850 nm cartridge LF–850_Drawer 3AL 86869 AAAG– 4xANY Host w/ S–16.1 i/f 4xANY_S 3AL 86872 AAAC

8 It differs from the above 4xANY boards (see point [7]) only for the optical 2.5Gbps interface: it isS–16.1 type, allowing to cover a longer span (15 Km for S–16.1; 2 Km for I–16.1)

9 TDM concentrator (4xAny) with B&W (I–16.1, S–16.1) or CWDM pluggable (by means of SFP opticalmodules) 2,5Gbps optical interface

10 2nd window plug–in cartridge for 4xANY concentrator, supporting STM–1/OC–3 and STM–4/OC–12.If it is set as STM–1, up to four drawers can be housed in one 4xANY board; if it is set as STM–4,up to three drawers can be housed. STM–1 drawers can be plugged on any slot. STM–4 drawerscan be plugged only on ports #3 and #4; for 3 x STM–4 configuration only, port #1 is available, too

11 2nd window plug–in cartridge for 4xANY concentrator, supporting Fast Ethernet, FDDI, ESCON, DV.Up to four low frequency (FE, FDDI, ESCON, DV) drawers can be housed on any port of one 4xANY

12 2nd window plug–in cartridge for 4xANY concentrator, supporting Gigabit Ethernet, FICON and FCUp to two high frequency drawers can be housed only on ports #3 and #4 of a 4xANY board

13 1nd window plug–in cartridge for 4xANY concentrator, supporting Fast Ethernet, FDDI, ESCON, DVUp to four low frqeuency (FE, FDDI, ESCON, DV) drawers can be housed on any port of a 4xANY

14 1nd window plug–in cartridge for 4xANY concentrator, supporting Gigabit Ethernet, FICON and FCUp to two high frqeuency drawers can be housed only on ports #3 and #4 of a 4xANY board

15 2nd window plug–in cartridge for 4xANY concentrator, supporting Digital Video transport. Up to fourlow frequency drawers can be housed on any port of one 4xANY

16 STM–1/4/16, GBE, Fiber Channel (2FC, 1FC).... SFP optical plugin modules; they can be fitted in4xANY_P and/or MCC3 boards (refer to Figure 47. on page 118 for SFP placing)

17 It is the “Bronze” CWDM (SFP STM–16)

18 It is the “Silver” CWDM (SFP STM–16)

19 8 x L1 ch Mux/Demux with expansion (LB/SB combiner/splitter) and Supervision, for hub nodes. Slots4,5,6 are available in master shelf only. Starting MUX if 32 channels hub extension is required withoutamplifiers

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ExplanationNote

20 8 x L1 ch Mux/Demux with expansion (LB/SB combiner/splitter), for hub nodes. Slots 4,5,6 are avail-able in master shelf only. Starting MUX if 32 supervised channels hub extension is required whenamplifiers are used

21 8 x L2/S1/S2 ch Mux/Demux for hub nodes, used to upgrade the L1 Mux/Demux

22 Allow to add/drop 8 supervised channels in L1 (3038)/L2 (2028)/S1 (5260)/S2 (4250) band

23 Can be used also as MUX/DEMUX

24 SW managed in future releases

25 Allow to add/drop the 4 supervised channels shown in its own acronym

26 Allow to add/drop the 2 supervised channels shown in its own acronym

27 Allow to add/drop the supervised channel shown in its own acronym. From 25 to 38 are long bandchannels: from 47 to 57 are short band channels

28 Allow to mux/demux a 1310nm channel, a 1550nm multiplexed signal and the SPV/OSC (1510nm)channel. This board allows to supervise a CPE

29 Insert/extract the SPV channel to/from a 1310nm or 1550nm channel, allowing to supervise a CPE;slot 8 is available in expansion shelf only

30 Double–stage optical amplifiers able to amplify all the channels. OAC2 provides short span transmis-sion. OAC2_L provides long spans transmission.

31 It includes both the equipment and shelf controller functionalities.

32 The flash card contains the equipment data base.

33 1510nm Optical Supervisory Channel card managing up to 2 x 1510nm OSC, 2 external 2Mps userinterfaces and the EOW (audio channel).The SPVM2 board in slot 4 is exclusively linked to an OADM/OMDX. Another SPVM2 can be installedwhether in slot #5 or #6 but not in both slots #5 and #6

34 Depopulated SPVM with one 1510 nm laser, managing 1 x OSC channel

35 Provide the Q3 management interface allowing to the NMS to supervise the equipment. It is directlyconnected to the manager

36 Hosted in master shelf only, provides 8 input accesses and 8 output accesses

37 Fitted in master shelf only, is used for monitoring the rack alarms

38 Allow the communication between the master shelf and the up to two expansion shelves, by meansof a direct connection from I–LINK_M (slot 6 of master shelf) and I–LINK_S (slot 1 of each exp. shelf)

39 Single Mode optical splitter with SMF MU/PC jumpers, performing passive OCh (linear config) orO–SNCP (ring) protection. It is linked to 2 adjacent MCC/OCCs and plugged below the main one

40 Multi Mode optical splitter. In addition to the features provided by the SM splitter (ref. 39), it managesthe HWF led on its front plate and the LOS alarm

41 SM optical splitter with connectors, having the same features of the SM splitter with jumpers (ref. 39)

42 MM optical splitter with connectors having the same features of the MM splitter with jumpers (ref. 40)

43 MM optical splitter with connectors, used for protection of 4xANY drawers with 850nm transceiver

44 PSC2 is an evolution of the PSC card for the compact shelf but supply less power. It works in “1+1”protection meaning that only one board is active at once; it can be plugged both in master and slaveshelves

45 External module transforming the alternative 110/230V voltage into a –48V continuous wave, thus al-lowing a 1696MS_C to be plugged directly to a power supply (avoiding the usage of a telecom rackfor feeding)

46 For power distribution; it is used only in table version

47 FAN module for compact shelf. It is equipped with two fans; an anti–dust filter has to be put on theleft side of the fans

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ExplanationNote

48 Dispersion Compensating Modules providing chromatic dispersion compensation. The number inthe acronym refers to the SMF distance for which the module provides compensation. DCMs can beplaced either in the inter–stage of an optical amplifier or in the booster and preamplifier of a link. OneDCM simultaneously compensates for the chromatic dispersion of all the 1696 channels

49 To be used for external subrack power protection with optinex subrack only

50 Used to perform the HK connections from the 25p connector of the HK card to the DDF

51 Used for the 1696MS_C installation in ANSI rack; it includes power supply cable, alarm PDU cable...

52 Used for the 1696MS_C installation in ETSI rack; it includes power supply cable, RAI–TRU cable...

53 Used to connect I–link_M (in master shelf) with I–Link_S (one per each slave shelf)

54 Power supply cable used only in table version. It has to be connected between the BOX and the pow-er supply card (input power connector)

55 Used to extract the SFP modules (plugged in 4xANY_P and MCC3)

56 Used to connect each other boards located in different shelves; i.e. the OCC10/MCC with the relevantMUX/DEMUX and/or the MUX/DEMUX with the OAC

57 Used to connect each other boards located in the same shelf; i.e. the OCC10/MCC with the relevantMUX/DEMUX and/or the MUX/DEMUX with the OAC

58 It includes the 4 jumpers allowing to connect a SM OPC with a couple of transponders, providing 1+1protection. 2 codes are needed in a fully equipped transponder shelf with four OCC10/MCC (2 + 2).

59 It includes the 4 jumpers allowing to connect a MM OPC with a couple of transponders, providing 1+1protection. 2 codes are needed in a fully equipped transponder shelf with four OCC10/MCC (2 + 2).

60 It includes the 4 jumpers allowing to connect an OPC with a couple of 4xANY drawers, providing 1+1protection. 4 codes are needed in a fully equipped shelf with 8 (4 + 4) 4xANY drawers in two 4xANY

61 Used to remove the opto attenuator plug–in

62 Details concerning the software part number are given in the Operator’s Handbook

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2.3.3.2 FAN_C board

A particular board adapted for the compact shelf is available. It also enables to manage the Power Monito-ring Unit to feed the shelf with the alternative mains supply.

Figure 38. Fan_C board

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2.4 Equipment connections

The external connections of the 1696MSPAN may fall into to following categories:

– optical– management– maintenance– power supply– user interfaces

All the equipment connection are detailed in the Installation Handbook.

Next paragraph 2.5 on page 112 presents the front view of all the cards, where the connection points canbe identified.

In the following some general indication and reference to the relevant front view are given.

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2.4.1 Optical connections

2.4.1.1 Optical connections made with simple MU connectors

See Figure 39. The optical connections are made with simple MU connectors on:

– MCC boards, see Figure 42. on page 113

– OPC boards, see Figure 67. on page 138

– SPV–M boards, see Figure 58. on page 129 and Figure 59. on page 130

– MVAC boards, see Figure 46. on page 117.

Figure 39. Simple MU optical connector

2.4.1.2 Optical connections made with double MU connectors

See Figure 40. The optical connections are made with double MU connectors on:

– OMDX and OADM boards, see para. 2.5.2 on page 119

– OAC boards, see Figure 56. on page 127

– OCC10 boards, see Figure 44. on page 115

– SPV_F boards, see Figure 54. on page 125 and Figure 55. on page 126.

– OSMC boards, see on page

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Figure 40. Double MU optical connector

2.4.1.3 Optical connections made with LC connectors

The optical connections are made with LC connectors on:

– 4xANY boards (both client and aggregate sides), see Figure 45. on page 116

– all the Small Formfactor Modules (STM–16, GBEthernet, CWDM..) plugged on 4xANY (aggregateside) and MCC3 (client side) boards, see Figure 41. on page 110, Figure 43. on page 114, Figure 45. on page 116, Figure 47. on page 118.

SFP STM–16 optical module

Optical cables

Figure 41. LC/SPC optical connector on SFP modules

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2.4.2 Management and maintenance connections

2.4.2.1 Housekeeping

The housekeeping alarm signal are available on the front panel connector of the HK board. It is a 25 pinSUB–D Female connector.Note: 25 pin SUB–D connector is connected to GNDM by the 2 screw’s holes called pin 26 and pin 27.See Figure 64. on page 135.

2.4.2.2 Rack Alarm Interfaces

The rack alarm interface signals are available on the two front panel connectors of the RAI board. Thesetwo interfaces are:– A 9 pins SUB–D female connector, which provides the interface between the master shelf and the

TRU (or PDU),– A 6 pins RJ11 connector, which provides the interface between two shelves.See Figure 65. on page 136.

2.4.2.3 LAN accesses

The LAN board provides LAN accesses on both RJ–45 and BNC connectors.

* LAN access code 3AL 86653 AAAD or later must be used for LAN_I installations in slot 27.Any variant of 3AL 86653AA may be used for LAN_Q in master slot 26.

See Figure 63. on page 134.

2.4.2.4 “Q3” Interface

At the ESC front panel, a 9–pin SUB–D female connector provides an access to an ”Q3” interface. It allowsto connect a Craft Terminal.See Figure 57. on page 128.

2.4.2.5 1696MS_C Intershelf link

The 15–pin SUB–D female connector, located on the front panel of the I–link_M and I–link_S boards, al-lows to link the SPI bus and the card presence signal from slave to master 1696MS_C shelves.

2.4.2.6 “DBG” Interface Connector

8–pin RJ45 connectors at the front–panel of the ESC board, are used for the “DBG” interface (factorytests).See Figure 57. on page 128.

2.4.3 Power supply connections

Power supply voltage is distributed to the shelves on a 3 pin SUB–D connector, in front panel of each PSC.See Figure 68. on page 139.It is also available on the M1 and M2 connectors of the Power Monitoring Unit.

2.4.4 User interfaces

The user interfaces are available on the front panel connector of the UIC(s).52 pin SCSI–2 Female connector of the UIC.Note: 50 pin SUB–D connector is connected to GNDM by the 2 screw’s holes called pin 51 and pin 52.See Figure 66. on page 137.

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2.5 Units front view

The following paragraphs show the units front views and the relevant access points (Leds, switches etc.)together with legenda and meaning.

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2.5.1 Tributaries front view

User Rx

User Tx

WDM Rx

WDM Tx

Hardware failure LED

Extractionhandle

Extraction handle

Optical safety label

3AL8

6603

XX

Abnormal Tx LEDAbnormal Rx LEDOut Of Service LEDPower failure LED

APSD restart push–button

ACRONYM

4;5;6;7;MCC18;9;10;11

Name

MCC214;15;16;17;

18;19;20;21

Access points descriptionMeaning

Green ledThis led is ON when the board is plugged in absence ofhardware failure (HWF)

Yellow ledThis led is ON when the board is plugged but not configured bythe software

Yellow led

Rx abnormal: problem on the receive side, depending on the configuration. The LED is ON when1) Add/Drop configuration: WDM Rx alarm or User Tx alarm 2) Pass–through configuration: WDM Rx alarm

Yellow led

Tx abnormal: problem on the transmit side, depending on the configuration. The LED is ON when1) Add/Drop configuration: User Rx alarm or WDM Tx alarm 2) Pass–through configuration: WDM Tx alarm3) Shut–down of the WDM Tx

Green /Yellow /Red led

Hardware failure. The LED is– green when the board is plugged, configured and without failure– yellow when the board is plugged and in firmware download state*– red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms) or C_TYPE

User Rx – User Reception: client input signal (from client)

User Tx – User Transmission: client output signal (to client)

WDM Rx – WDM Reception: WDM input signal from OMDX/OADM

WDM Tx – WDM Transmission: WDM output signal toOMDX/OADM

N.B. * When a board is on firmware download state, the hardware failure ledon the front board lights on yellow colour. Never unplug a board whilethis LED is yellow. Should this occur, the board will not restart andmay have to be returned for factory repair.

1696MSSLOTS

1696MS_CSLOTS

2; 3; 4; 5; 6

N.B. Make sure fibers are disconnected when plugging / unplugging thecard.

Figure 42. MCC1 and MCC2 boards Front panel

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User Tx (SFP)**

User Rx (SFP)**

WDM Rx

WDM Tx

Hardware failure LED

Extractionhandle

Extraction handle

Optical safetylabel

3AL9

5150

AX

Abnormal Tx LEDAbnormal Rx LEDOut Of Service LEDPower failure LED

APSD restart push–button

ACRONYM

4;5;6;7;

MCC38;9;10;11

Name

14;15;16;17;

18;19;20;21

Access points descriptionMeaning

Green ledThis led is ON when the board is plugged in absence ofhardware failure (HWF)

Yellow ledThis led is ON when the board is plugged but not configured bythe software

Yellow led

Rx abnormal: problem on the receive side, depending on the configuration. The LED is ON when1) Add/Drop configuration: WDM Rx alarm or User Tx alarm 2) Pass–through configuration: WDM Rx alarm

Yellow led

Tx abnormal: problem on the transmit side, depending on the configuration. The LED is ON when1) Add/Drop configuration: User Rx alarm or WDM Tx alarm 2) Pass–through configuration: WDM Tx alarm3) Shut–down of the WDM Tx

Green /Yellow /Red led

Hardware failure. The LED is– green when the board is plugged, configured and without failure– red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms) or C_TYPE

User Rx – User Reception: client input signal (from client)*

User Tx – User Transmission: client output signal (to client)*

WDM Rx – WDM Reception: WDM input signal from OMDX/OADM

WDM Tx – WDM Transmission: WDM output signal toOMDX/OADM

N.B. * User TX and User RX access points have to be equipped with SmallFormfactor Pluggable (SFP) optical modules, shown in Figure 47. on page 118

1696MSSLOTS

1696MS_CSLOTS

2; 3; 4; 5; 6

Figure 43. MCC3 board Front panel

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3AL8

6834

XX

User Rx

User Tx

WDM Rx

WDM Tx

Hardware failure Led

Extractionhandle

Extraction

Optical safety

Abnormal Tx LedAbnormal Rx LedOut Of Service LedPower failure Led

APSD restart push–button

Name Meaning

Green ledManaged by hardware. This led is ON when the board isplugged in absence of hardware failure (HWF)

Yellow ledThis led is ON when the board is plugged but not configured bythe software

Yellow led

Rx abnormal: problem on the receive side. Managed by SW.The LED is ON when– (LOS/LOF_OTN/LOM_OTN)_WDM_RX– DEG_OUT_User_TXThe LED is ON only if the alarm is “shown”

Yellow led

Tx abnormal: problem on the transmit side. Managed by SW.The LED is ON when SD or– (LOS_User_RX– (LOS/DEG_OUT/TOR)_WDM_TXThe LED is ON only if the alarm is “shown”

Green /Yellow /Red led

Hardware failure. Managed by SW. The LED is– green when the board is plugged, configur and without failure– yellow when the board is in firmware download state*– red when one of the On Board power supply (OBPS) is in failure(OR on the power supply alarms)

User Rx – User Reception: client input signal (from client)

User Tx – User Transmission: client output signal (to client)

WDM Rx – WDM Reception: WDM input signal fromOMDX/OADMWDM Tx – WDM Transmission: WDM output signal toOMDX/OADM

N.B. * When a board is on firmware download state, the hardware failureled on the front board lights on yellow colour. Never unplug aboard while this LED is yellow. Should this occur, the boardwill not restart and may have to be returned for factory repair.** When the board is configured in loopback, the RXA and TXALEDs are always turned OFF.

Access points description

10 Gbps front panel link to substitute back panel links, when only2.5Gb back panel is present

10Gbps Rx

10Gbps Tx

ACRONYM

4;5;6;7;8;9;10;11

OCC1014;15;16;17;18;19;20;21

1696MSSLOTS

1696MS_CSLOTS

2; 3; 4; 5; 6

label

handle

Figure 44. OCC10 front panel

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Clientsignal 1

Extractionhandle

3ALX

XX

XX

X

Hardware failure LEDAbnormal transmission LED

Abnormal reception LEDOut Of Service LED

Power presence LED

HA

ZA

RD

LEV

EL 1

LAS

ER

PR

OD

UC

T

Drawer 1

Tx

Extractionhandle

Power presence LED

Clientsignal 2

Drawer 2PowerpresenceLED

Clientsignal 3

Drawer 3PowerpresenceLED

Clientsignal 4

Drawer 4PowerpresenceLED

TxRx

TxRx

TxRx

STM16aggregatesignal **

Rx

RxTx

ACRONYM

2–3; 4–5; 6–7;4 X ANY8–9; 10–11;

4 X ANY_S 12–13; 14–15;

16–17; 18–19;

20–21; 22–23

Name Meaning

PWRGreen led

Managed by hardware. It is ON when the board isplugged and no power failure detected

OOSYellow led

This led is ON when the board is plugged but not con-figured by the software

RXAYellowled

Rx abnormal: problem on the receive side. ON means– SD drawers– ILOS on STM–16 side.Managed by software

TXAYellowled

Tx abnormal: problem on the transmit side. ON means– ILOS on drawer side.Managed by software.

Green /Yellow /Red led

Hardware failure. The LED is– Green when the board is plugged, configured andwithout failure– Yellow when the board is plugged and in firmwaredownload state*– Red when one of the On Board power supply(OBPS) is in failure (OR on the power supply alarms)

1696MSSLOTS

1696MS_CSLOTS

2–3;4–5

Access points description

4 X ANY_P

N.B. * When a board is on firmware download state, the hardware fail-ure led on the front board lights on yellow colour. Never unpluga board while this LED is yellow. Should this occur, the boardwill not restart and may have to be returned for factory repair.** On 4xANY_P only, the STM–16 aggregate signal is providedby means of Small Formfactor Pluggable (SFP) optical modules,shown in Figure 47. on page 118

N.B. Make sure fibers are disconnected when plugging / unplug-ging the drawers or the 4xANY host card.

Figure 45. 4ANY front panel

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Extractionhandle

Hardware failure LED

Extractionhandle

Name Meaning

PWRGreen/Redled

Power and hardware failure led. It is– Green when the board is plugged, configured and without failure– Red when the card is plugged and in hardware failure

In1In2

Input signals (cable connection 1 and 2) to be adjusted bythe 2 VOAs of the MVAC board

Access points description

3AL8

6892

AA

VOA1 input

VOA1 output

VOA2 input

VOA2 output

ACRONYM

4;5;6;7;

8;9;10;11MVAC

14;15;16;17;

18;19;20;21

1696MSSLOTS

1696MS_CSLOTS

Not used

Out1Out2

Output signals (cable connection 1 and 2) adjusted/optimizedby the 2 VOAs of the MVAC board

Figure 46. MVAC front panel

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SFP optical module

Optical cables

ACRONYM EQUIPPED ON PORT

INPUT SIGNAL

OUTPUT SIGNAL

STM–16 SFP: S–16.1/2FC; I–16.1;

4xANY_PMCC3

MCC3

1FC SFP: 1FC/2FC 850nm;

STM–4 SFP: S–4.1/ESCON; L–4.1; L–4.2

STM–1 SFP: S–1.1/FE/FDDI/100BaseLX;

1.25GBE SFP: GBE1000LX/LH/1FC 1300nm;

STM–16 SFP: Bronze/PIN CWDM

S–16.1; S–16.1 multirate

L–1.1; L–1.2

GBE1000SX/1FC 850nm; GBE1000ZX

1FC/2FC 1310nm

L–16.1; L–16.2;

STM–16 SFP: Silver/APD CWDM

Figure 47. SFP optical module

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119

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/3AL 95278 AA AA

390

390

2.5.2 Multiplexers front view

3736

3533

3231

30

S

EX

Ch#

38WDM Tx inWDM Rx out

Extra Tx in

Extra Rx out

Monitoring

Line Line Tx outLine Rx in

Extrachannels

SPV Tx in

SPV Rx outSupervision

SB Tx in

SB Rx outExpansion

HardWareFailure LED

Extractionhandle

Optical safetylabel

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

Monitor Tx outMonitor Rx out

3AL8

6615

XX

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

ACRONYM

2; 3; 4; 5; 6;OMDX8100_M_L1_XS

12; 13; 22

MonitorTx out

Output power measurement signal (to optical measurement de-vice)

MonitorRx out

Input power measurement signal (to optical measurement de-vice)

Line Tx out Line Transmission output signal (to line)

Line Rx in Line Reception input signal (from line)

WDM Tx inWDM transmission input signal, from corresponding MCC (Ch.30 38)

WDM Rxout

WDM reception output signal, to corresponding MCC (Ch. 30 38)

Extra Txin

Extra channels input (from other Mux/Demux board)

Extra Rxout

Extra channels output (to other Mux/Demux board)

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

1696MSSLOTS

1696MS_CSLOTS

4,5,6

SB Tx in Short Band transmission channels input (from other Mux/Demux)

SB Rx out Short Band reception channels output (to other Mux/Demux)

OMDX8100_M_L1_X

N.B. The OMDX8100_M_L1_X board is not provided withthe Supervision (SPV Tx in / out) access points

(shown in figure)

Access-channels

Access points description

Figure 48. OMDX8100_M_L1_XS board front panel

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1AA

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4 –

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120

01

/3AL 95278 AA AA

390

390

Line

Extra

HardWareFailure LED

Extractionhandle

Extractionhandle

Optical safetylabel

3AL8

6615

XX

Ch#

2827

2623

2221

2025

WDM Tx inWDM Rx out

Extra Tx in

Extra Rx out

Line Tx outLine Rx in

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

This front panel is similar to that of OMDX8100_M_S2 and S1 boards, except for the set of channels,i.e. Ch. 42 to 50 for S2 band and Ch. 52 to 60 for S1 band. The set of channels is printed on the frontpanel and included in the acronym to identify the board type.

ACRONYM 1696MS

OMDX8100_M_L2

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

Line Tx out Line Transmission output signal (to line or other Mux/Demux)

Line Rx in Line Reception input signal (from line or other Mux/Demux)

WDM Tx inWDM transmission input signal, from corresponding MCC (Ch.2028 for L2 band, 4250 for S2 band, 5260 for S1 band)

WDM Rxout

WDM reception output signal, to corresponding MCC (Ch.2028 for L2 band, 4250 for S2 band, 5260 for S1 band)

Extra Txin

Extra channels input (from other Mux/Demux board)

Extra Rxout

Extra channels output (to other Mux/Demux board)

SLOTS1696MS_C

SLOTS

OMDX8100_M_S2

OMDX8100_M_S1

4, 5, 6

(shown in figure)

Access-channels

Access points description

2; 3; 4; 5; 6;

12; 13; 22

Figure 49. OMDX8100_M_L2/S2/S1 boards front panel

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121

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/3AL 95278 AA AA

390

390

This front panel is similar to that of OADM8100_M_L2/S2/S1_S boards, except for the set of channel, i.e. Ch.20 to 28 for L2 band, Ch. 42 to 50 for S2 band and Ch. 52 to 60 for S1 band. Four different boards are so available.The set of channels is printed on the front panel and included in the acronym to identify the board type.

ACRONYM 1696MS

OADM8100_M_L1_SSLOTS

1696MS_CSLOTS

4; 5; 6

(shown in figure)

3736

3533

3231

30

S

Ch#

38WDM Tx inWDM Rx out

Extra Tx in

Extra Rx out

Monitoring

Line Line Tx outLine Rx in

Extrachannels

SPV Tx in

SPV Rx outSupervision

HardWareFailure LED

Extractionhandle

Extractionhandle

Optical safetylabel

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

Monitor Tx outMonitor Rx out

3AL8

6637

AX

UnusedUnused

OADM8100_M_L2_S

OADM8100_M_S1_S

OADM8100_M_S2_S

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

MonitorTx out

Output power measurement signal (to optical measurement de-vice)

MonitorRx out

Input power measurement signal (to optical measurement de-vice)

Line Tx out Line Transmission output signal (to line)

Line Rx in Line Reception input signal (from line)

WDM Tx inWDM transmission input signal, from corresponding MCC:ch. 30 38 (L1 band), ch. 2028 (L2), ch. 4250 (S2),ch. 5260 (S1)

WDM Rxout

WDM reception output signal, to corresponding MCC: ch. 3038 (L1 band), ch. 2028 (L2), ch. 4250 (S2), ch. 5260 (S1)

Extra Txin

Extra or pass–through channels input (from other Mux/Demuxboard)

Extra Rxout

Extra or pass–through channels output (to other Mux/Demuxboard)

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

Access points description

Channelsaccesses

2; 3; 4; 5; 6;

12; 13; 22

Figure 50. OADM8100_M_L1_S (L2/S1/S2) boards front panel

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122

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/3AL 95278 AA AA

390

390

This front panel is the same for all OADM4100_M_chXX–YY_S four channels boards, except for the setof channels: eight sets of 4 channels are available for this board type; eight different boards are so available.The set of channels is printed on the front panel and included in the acronym to identify the board type.

ACRONYM 1696MS

OADM4100_M_ch20–23_SSLOTS

1696MS_CSLOTS

4; 5; 6

(shown in figure)

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

MonitorTx out

Output power measurement signal (to optical measure-ment device)

MonitorRx out

Input power measurement signal (to optical measure-ment device)

Line Tx out Line Transmission output signal (to line)

Line Rx in Line Reception input signal (from line)

WDM Tx in WDM transmission input signal, from corresponding MCC: ch.2023; 2528; 3033; 3538; 4245; 4750; 5255;5760

WDM Rxout

WDM reception output signal, to corresponding MCC: ch.2023; 2528; 3033; 3538; 4245; 4750; 5255;5760

Extra Txin

Extra or pass–through channels input (from other Mux/De-mux board)

Extra Rxout

Extra or pass–through channels output (to other Mux/De-mux board)

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

OADM4100_M_ch25–28_S

OADM4100_M_ch30–33_S

OADM4100_M_ch35–38_S

OADM4100_M_ch42–45_S

OADM4100_M_ch47–50_S

OADM4100_M_ch52–55_S

OADM4100_M_ch57–60_S

Access points description

Ch#

3332

3130

Monitoring

Line

Channelsaccesses

Supervision

HardWare Failure LED

Extraction handle

Extraction handle

Optical safety label

3AL8

6637

BA

Extra orpass–throughchannels

S

WDM Tx in

WDM Rx out

Line Tx outLine Rx in

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

WDM Tx inWDM Rx out

Monitor Tx outMonitor Rx out

Extra Tx inExtra Rx out

SPV Tx inSPV Rx out

UnusedUnused

2; 3; 4; 5; 6;

12; 13; 22

Figure 51. OADM4100_M_chxx–yy_S boards front panel

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1AA

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(900

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123

01

/3AL 95278 AA AA

390

390

This front panel is the same for all OADM2100_M_chxx_yy_S two channels boards, except for the setof channels: five sets of 2 channels are available for this board type; five different boards are so available.The set of channels is print on the front panel and included in the acronym to identify the board type.

ACRONYM 1696MS

OADM2100_M_30_31_SSLOTS

1696MS_CSLOTS

4; 5; 6

(shown in figure)

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

MonitorTx out

Output power measurement signal (to optical measure-ment device)

MonitorRx out

Input power measurement signal (to optical measure-ment device)

Line Tx out Line Transmission output signal (to line)

Line Rx in Line Reception input signal (from line)

WDM Tx in WDM transmission input signal, from corresponding MCC:ch. 30–31; 32–33; 35–36; 37–38; 47–48

WDM Rxout

WDM reception output signal, to corresponding MCC:ch. 30–31; 32–33; 35–36; 37–38; 47–48

Extra Tx in Extra or pass–through channels input (from other Mux/De-mux board)

Extra Rxout

Extra or pass–through channels output (to other Mux/De-mux board)

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

OADM2100_M_32_33_S

OADM2100_M_35_36_S

OADM2100_M_37_38_S

OADM2100_M_47_48_S

31

S

Ch#

30WDM Tx inWDM Rx out

Extra Tx in

Extra Rx out

Monitoring

Line Line Tx outLine Rx in

Channelaccesses

Extrachannels

SPV Tx in

SPV Rx outSupervision

HardWareFailure LED

Extractionhandle

Extractionhandle

Optical safetylabel

WDM Tx inWDM Rx out

Monitor Tx outMonitor Rx out

UnusedUnused

3AL8

6778

XX

Ch #1

Ch #2

Access points description

2; 3; 4; 5; 6;

12; 13; 22

Figure 52. OADM2100_M_xx_yy_S board front panel

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/3AL 95278 AA AA

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390

This front panel is the same for all OADM1100_M_xx_S one channel boards, except for the channel:12 different channels are available for this board type and then twelve different boards are available.Thenumber of the channel is printed on the front panel and included in the acronym to identify the board type.

ACRONYM 1696MS

OADM1100_M_25_SSLOTS

1696MS_CSLOTS

4; 5; 6

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

MonitorTx out

Output power measurement signal (to optical measure-ment device)

MonitorRx out

Input power measurement signal (to optical measure-ment device)

Line Tx out Line Transmission output signal (to line)

Line Rx in Line Reception input signal (from line)

WDM Tx in WDM transmission input signal, from corresponding MCC:ch. 25; 30; 31; 32; 33; 35; 36; 37; 38; 47; 48; 50

WDM Rxout

WDM reception output signal, to corresponding MCC:ch. ch. 25; 30; 31; 32; 33; 35; 36; 37; 38; 47; 48; 50

Extra Tx in Extra or pass–through channels input (from other Mux/De-mux board)

Extra Rxout

Extra or pass–through channels output (to other Mux/De-mux board)

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

OADM1100_M_30_S

OADM1100_M_31_S

OADM1100_M_32_S

OADM1100_M_33_S

S

Ch#

xx

WDM Tx inWDM Rx out

Extra Tx in

Extra Rx out

Monitoring

Line Line Tx outLine Rx in

Channelaccess

Extrachannels

SPV Tx in

SPV Rx outSupervision

HardWareFailure LED

Extractionhandle

Extractionhandle

Optical safetylabel

Monitor Tx outMonitor Rx out

3AL8

6777

XX

AddDrop

OADM1100_M_35_S

OADM1100_M_36_S

OADM1100_M_37_S

OADM1100_M_38_S

OADM1100_M_47_S

OADM1100_M_48_S

OADM1100_M_50_S

LO

NG

BA

ND

SH

OR

TB

AN

D

Access points description

2; 3; 4; 5; 6;

12; 13; 22

Figure 53. OADM1100_M_xx_S board front panel

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/3AL 95278 AA AA

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390

Name Meaning

ACRONYM 1696MS

2; 3; 12SPV_F_1310_1550

SLOTS1696MS_C

SLOTS

5; 6

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

MonitorTx out

Output power measurement signal (to optical measurementdevice)

Mux InDmux out

Monitoring

LineLine Tx outLine Rx in

Monitor Tx outMonitor Rx out

1310

Mux In

Dmux out1550

SPV Tx in

SPV Rx outSupervision

HardWareFailure LED

Extractionhandle

Extractionhandle

Optical safetylabel

3AL8

6779

AA

1310

S

Common

13; 22

MonitorRx out

Input power measurement signal (to optical measurementdevice)

Line Tx out Line Transmission output signal (to the line)

Line Rx in Line Reception input signal (from the line)

Mux in Input 1310 nm signal

Dmux out Output reception 1310 nm signal

Mux in Input 1550 nm signal

Dmux out Output reception 1550 nm signal

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

Access points description

Figure 54. SPV_F_1310_1550 board front panel

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/3AL 95278 AA AA

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390

Name Meaning

ACRONYM 1696MS

SPV_F_C

SLOTS1696MS_C

SLOTS

9; 10; 11

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

SPV Tx in Supervision transmission input signal (from SPVM board)

SPV Rx out Supervision reception output signal (to SPVM board)

3AL86779BAXX

Rx output

Tx input

SPV Tx in

SPV Rx outSupervision

Extra Tx in

Extra Rx outExtrachannels

S

Client access

Extra In Input extra signal (1310 or 1550 nm)

Extra Out Output extra signal (1310 or 1550 nm)

Line Tx out Line Transmission output signal (to the line)

Line Rx in Line Reception input signal (from the line)

28 3538 45

HardWareFailure LED

Access points description

Figure 55. SPV_F_C board front panel

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/3AL 95278 AA AA

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390

2.5.3 Optical amplifiers front view

3AL8

6703

AX

ACRONYM1696MS

4; 5;OAC1

SLOTS 1696MS_C

SLOTS

2,3**12; 13;

20; 21

4; 5;12; 13;20; 21;22; 23*

Name Meaning

PWGreen led

Power led managed by HW. It is ON whenthe board is plugged and without HWF

OOSYellow led

Managed by SW. It is ON when the board isplugged but not configured by the SW

ABNYellow led

Abnormal input signal alarm. Caused by1) 1st stage input optical signal level has de-creased below the input signal loss threshold2) Output safety shutdown ot the 2nd stage.Managed by SW

APSDYellow led ***

Managed by SW. The LED is – OFF when APSD enable– ON when APSD disable forced ON or OFF

HWFGreen /Yellow /Red led

Hardware failure led, managed by SW. It is– Green when the board is plugged, configu red and without failure– yellow when the board is in firmware down load state****– Red when a) one of the On Board power supply is in failure (OR on the power supply alarms) b) C_TYPE alarm is raised

InputOutputVOA

Input

OutputSupervision

InputUnused

Extra pump

Extractionhandle

Extraction handle

Optical safety label

Stage 1monitoring Mon. Tx (OUT)

Mon. Rx (IN)

Stage 2monitoring Mon. Tx (OUT)

Mon. Rx (IN)

InputOutputStage 2

InputOutput

Stage 1

UnusedUnused

Removable cover

Out Of Service LEDAbnormal input signal alarm LED

APSD status LEDHardware failure LED

Reset push–button

Power ON LED

N.B. * Slots 22 and 23 are available in compact shelf only** Only OAC2 and OAC2_L can be equipped in compact shelf*** The LED is always ON because the APSD enable mode isnot supported**** When the board is on firmware download state, the hard-ware failure led on the front board lights on yellow colour. Neverunplug a board while this LED is yellow. Should this occur,the board will not restart and may have to be returned forfactory repair. Only OAC2 and OAC2_L support FW download

Access points description

L_OAC1

Master Expans

OAC2

L_OAC2

Figure 56. OAC1, OAC2, OAC1_L and OAC2_L front panel

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/3AL 95278 AA AA

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390

2.5.4 Controller front view

Name Meaning

URGRed led

Urgent Alarm (major or critical)

NRGRed led

Not Urgent Alarm (minor)

ATDYellow led

Attended Alarm: acknowledged URG or NURGalarm (alarm storing)

ABNYellow led

Abnormal condition

IND Yellow led

Indicative Alarm (warning)

ACRONYM 1696MS

1ESC

SLOTS1696MS_C

SLOTS1 (master

URG

NRG

ATD

ABN

Indicative alarm LED

Extractionhandle

Extractionhandle

3AL

8666

1AA

XX

Abnormal Condition LED

Attended alarm LEDNot Urgent alarm LEDUrgent Alarm LED

IND

STATUS

EC

SC

Craft

LAT

ACO

RST

Equipment Controller LED

Shelf Controller LED

RESET push button

Lamp Test push button*

Alarm Cut Off push button

”DBG” Interface

”F” Interface for CT connection

”DBG” Interface

ECGreen /Red / Yellow led

Green led means communication OK between EC/SCRed led means no communication between EC/SCbut SC is startedYellow led means start time

SCGreen/Red/Yellow led

Green led means SC started

Yellow led means start timeRed led means SC default

SUB–D 9 pins connector

RJ45 connector

RJ45 connector

NB:*LAT button lights up all leds of the NE except for the ESC ones. When pressing RST button, EC & SC LEDs status doesn’t change When SC is restarted, the EC led is red and the SC led is green. When the communication between EC & SC is re–established, both EC & SC LEDs are green

Access points description

shelf only)

Figure 57. ESC front panel

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Name Meaning

PWRGreen led

PoWeRing led: it is ON when the board is powered andwithout HardWare Failure (HWF). Managed by HW

LBYellow led

Line Busy led: it is ON when the speechchannel is busy

CCYellow led

Conference Call led: it is ON when a conferencecall is occuring on the speech channel

VLYellow led

Vacant Line led: it is ON when the Speech channelis vacant

ACRONYM 1696MS

2; 22; 23

SLOTS1696MS_C

SLOTS

4; 5; 6

Rx1 input

Tx1 output

Rx2 input

Tx2 output

OSC 1

OSC 2

Extraction handle

Optical safety label

HardWare Failure LED

Vacant Line LEDConference Call LED

Line Busy LED

J1: Speech channel handset connector

Board reset push button

Line pick up push button

Speech channel numbercoding wheels

Extraction handle

Power ON LED

SPVM2

Green /Yellow /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Yellow when the board is in firmware download state*– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

RX1 input OSC1 reception input signal, from OAC, OMDX or OADM

TX1 input OSC1 transmssion output signal, to OAC, OMDX or OADM

RX2 input OSC2 reception input signal, from OAC, OMDX or OADM

TX2 input OSC2 transmssion output signal, to OAC, OMDX or OADM

J1 Speech channel handset connection

N.B. * When a board is on firmware download state, the hard-ware failure led on the front board lights on yellow colour.Never unplug a board while this LED is yellow. Shouldthis occur, the board will not restart and may have to bereturned for factory repair.

Access points description

3AL8

6606

AB

Figure 58. SPVM2 front panel

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Name Meaning

PWRGreen led

PoWeRing led: it is ON when the board is powered andwithout HardWare Failure (HWF). Managed by HW

LBYellow led

Line Busy led: it is ON when the speechchannel is busy

CCYellow led

Conference Call led: it is ON when a conferencecall is occuring on the speech channel

VLYellow led

Vacant Line led: it is ON when the Speech channelis vacant

ACRONYM 1696MS

2; 22; 23SPVM_H

SLOTS1696MS_C

SLOTS

4; 5; 6

Rx1 input

Tx1 output

OSC 1

Extraction handle

Optical safety label

HardWare Failure LED

Vacant Line LEDConference Call LEDLine Busy LED

J1: Speech channel handset connector

Board reset push button

Line pick up push button

Speech channel numbercoding wheel

Extraction handle

Power ON LED

Green /Yellow /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Yellow when the board is in firmware download state*– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

RX1 input OSC1 reception input signal, from OAC, OMDX or OADM

TX1 input OSC1 transmssion output signal, to OAC, OMDX or OADM

J Speech channel handset connection

Access points description

3AL8

6606

AC

N.B. * When the board is on firmware download state, the hardwarefailure led on the front board lights on yellow colour. Never un-plug a board while this LED is yellow. Should this occur,the board will not restart and may have to be returned forfactory repair.

Figure 59. SPVM_H front panel

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3AL8

6893

AA

ACRONYM 1696MS

2; 12;OSMC

SLOTS1696MS_C

SLOTS

13; 23Not used

Power ON LED

Out Of Service LED

Name

Access points descriptionMeaning

Green/Red led

The led is GREEN when the board is plugged, configuredand without Hardware failure (HWF). It is RED when the board is plugged and in HWF.

Yellow ledThis led is ON when a firmware download is being per-formed

Input power monitoring points giving the possibility to checkthe power in 8 different locations per each channel

....

Inputs powermonitoring

Inputs powermonitoring

N.B. When the board is on firmware download state, the OOS Ledon the front board lights on yellow colour. Never unplug aboard while this LED is yellow. Should this occur, theboard will not restart and may have to be returned for fac-tory repair

Figure 60. OSMC front panel

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3AL8

6893

AA

ACRONYM 1696MS

6 (masterI–Link_M

SLOTS1696MS_C

SLOTS

shelf only)Not used

Power Failure LED

EXP. shelves 1, 2,3, CONNECTIONSTATUS LEDs

Name

Access points descriptionMeaning

Orange ledThe led is ON when the connection with slave shelf 1 isestablished

SUB–D15P, to beconnected to ex-pansion shelf 1

HW Failure LED

SUB–D15P, to beconnected to ex-pansion shelf 3(not used in cur-rent rel.)

Orange ledThe led is ON when the connection with slave shelf 2 isestablished

Orange ledThe led is ON when the connection with slave shelf 3 isestablished (only 2 slave shelves allowed in current rel.)

Orange ledPower failure led; it is ON when the board is properlypowered

Green/Redled

Hardware failure led. It is – GREEN when the board is plugged, configured and without failure– RED when software reset is being performed

Connection point with 1696MS_C expansion shelf 1

Connection point with 1696MS_C expansion shelf 2

Connection point with 1696MS_C expansion shelf 3(not used in current release)

SUB–D15P, to beconnected to ex-pansion shelf 2

Figure 61. I–Link_M board front panel

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3AL8

6893

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ACRONYM 1696MS

1 (slaveI–Link_S

SLOTS1696MS_C

SLOTS

shelf only)Not used

Power Failure LED

NOT USED

Name

Access points descriptionMeaning

HW Failure LED

Orange ledPower failure led; it is ON when the board is properlypowered

Green/Redled

Hardware failure led. It is – GREEN when the board is plugged, configured and without failure– RED when software reset is being performed

Connection point with 1696MS_C master shelf

NOT USEDNOT USED

SUB–D15P, to beconnected to the1696MS_C mas-ter shelf

Figure 62. I–Link_S board front panel

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Name Meaning

ACRONYM 1696MS

LAC (LAN_Q)

SLOTS1696MS_C

SLOTS

8

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, configured and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

RJ45 connector

RJ45 andBNC con-nectors

HardWareFailure LED

LAC (LAN_I)

26

27 –

BNC connectors

– in master shelf, slot 26, or in compact shelf, slot 8 (LAN_Q), these connec-tors provide the physical access (Q3 interf.) to connect an external supervi-sion equipment (1353..). Slot 26 is linked to the ESC board via backpanel link– a second board can be plugged in master shelf, slot 27 (LAN_I), to allowthe intra–shelf communication via a cascade (BNC) or HUB (RJ45) link withthe same connector of the LAN_I board, slot 27, of each expansion shelf. If a cable is fitted in RJ45 conn., BNC is unavailable and viceversa

NMS / INTRA–SHELFconnections

Access points description

Figure 63. LAN boards front panel

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Name Meaning

ACRONYM 1696MS

HK

SLOTS1696MS_C

SLOTS

11

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

25 pins SUB–D female connector for house-keeping alarms (8 inputs and 8 outputs)

HardWareFailure LED

36

Access points description

Figure 64. Housekeeping board front panel

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ACRONYM 1696MS

RAI

SLOTS1696MS_C

SLOTS

9; 10

9 pins SUB–D female connector (to PDU/TRU)

HardWareFailure LED

37

RJ11, 6 pins connector (tothe 9 pins SUB–D femaleconnector of the shelf below)

RACK ALARMS

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when one of the On Board power supply (OBPS) is in failure (OR on the power supply alarms)

9 pins SUB–D fe-male connector

Used to connect the RAI card of the master shelf with thePDU/TRU

RJ11 6 pinsconnector

Used for intra–shelf communication. It has to be connected tothe 9–pin connector of the slave shelf below. Only for 1696MS

Access points description

Figure 65. RAI front panel

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390

ACRONYM 1696MS

UIC

SLOTS1696MS_C

SLOTS

HardWareFailure LED

46; 47

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is plugged, config and without failure– Red when the board is in hardware failure

52 pins SCSI–2female connector

Access points description

Figure 66. UIC front panel

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2.5.5 Switching protection, power supply and fans front view

ACRONYM 1696MS

OPC

SLOTS1696MS_C

SLOTS

9, 10, 11

Name Meaning

Green /Red led

Hardware failure. The LED is *– Green when the board is plugged, config and without failure– Red when the board is in hardware failure

Access points description

28 3538 45

Rx input

Rx output (Rx1OUT)

Tx output

channel1

channel2

N.B. * The hardware failure led is not managed/provided on the SM optical splitter with jumpers(P/N3AL 86708 AA––)

Optical safety label

HardWare Failure LED*

channel 1 Tx Input

channel 2 Tx Input

channel 1 Rx Output

channel 2 Rx Output

Rx input

Tx output To (Tx Out) /From (Rx IN)

Client

Tx input (Tx1IN)

Rx output (Rx2OUT)Tx input (Tx2IN)

To (Rx OUT) /From (Tx IN)transponders

or 4xANYdrawers

SM & MM OPCwith connectors

SM & MM OPCwith jumpers

To (Tx Out) /From (Rx IN)

Client

3AL86708AC3AL86708AD3AL95113AA

3AL86708AA3AL86708AB

Figure 67. OPC front panel

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ACRONYM 1696MS

PSCSLOTS

1696MS_CSLOTS

7, 12 (master/exp shelves)

Name Meaning

Green /Red led

Hardware failure. The LED is– GREEN when the board is plugged, configured and without failure– RED when the board is in failure or the power supply cable is not connected

Access points description

HardWare Failure LED

1 (male) + VBATT

2 (female) GND

3 (male) – VBATT

3–pin SUB–Dconnector

PSC2

25, 48

PSC3 25, 48

Figure 68. PSC/PSC2/PSC3 front panel

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ACRONYM 1696MS

PMU

SLOTS1696MS_C

SLOTS

Name Meaning

1) GREEN/RED LED

MAJOR alarm. The LED is– GREEN when the board is plugged and without failure– RED when the alarm is present (raised only if PMU_Presence). It is the OR of

• both rectifiers aremissing or both rectifiers input voltage < 85V rms• both rectifiers output voltage <38V or >60V• both fans from PMU case 1 failed (OR fan from PMU case 2 failed)• both rectifiers temperature >55 C or output current < 12A

Access points description

Placed below the 1696MS_CNot used master shelf

RECTIFIER 1 RECTIFIER 2

CONTROL UNIT

in1 in2

1)

OUT

IN

OUT

OUT

5)3) 4)

2)

6)

7)

3)

2) GREEN/RED LED

MINOR alarm. The LED is– GREEN when the board is plugged and without failure– RED when the alarm is present (raised only if PMU_Presence). It is the OR of

• one rectifier is missing or one rectifier input voltage < 85V rms• one rectifier output voltage <38V or >60V• one FAN from PMU case 1 failed or one rectifier temperature >55 C• battery present but battery breaker open

3) GREEN/RED LED

BATTERY CONNECTED. The LED is RED if battery connection is failed.The LED is GREEN if battery is connected.

4) GREEN/RED LED

TEST BATTERY. The LED is RED if test battery is failed.The LED is GREEN if test battery is OK. The LED is LIT OFF if no battery connected

5) BATTERY CONNECTOR. It has to be conncted to the (optional) back–up battery6) OUTPUT POWER CONNECTORS. SUB–D 3p to be connected to the two PSC(2) cards7) PMU ALARMS CONNECTORS. SUB–D 15p to be connected to the FAN_C8) AC INPUT POWER CONNECTORS. To be connected to the primary AC power supply

(100V/50–60Hz, 115V/60Hz, 230V/50Hz)

in1

in2

1)

OUT

IN

OUT

OUT

5) 4) 3)

2)

6)

7)3)

FAN

Two different solutions are provided

Figure 69. PMU front panel

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390

Name Meaning

Green /Red led

Hardware failure. The LED is– Green when the board is powered– Red when the board is in hardware failure

ACRONYM 1696MS

FANC

SLOTS1696MS_C

SLOTS

–49

HardWareFailure LED

FANC (for 1696MS)

FAN_C 13–

15 pins SUB–Dfemale connector(for batteriesalarms raising)

FAN_C (for 1696MS_C)

EXTPMU

FANFILTER

HardWareFailure LED

Access points description

Figure 70. FANs front panel

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3 FUNCTIONAL DESCRIPTION

3.1 General description

This section describes the main functions carried out by the

• 1696MSPAN

• 1696MS_C (CPE, housed in a compact shelf, with reduced functionalities)

Alcatel products.

The functions carried out by the NE, can be splitted in some sub–systems herebelow listed, and describedfrom para. 3.1.1 to para. 3.1.10:

• Transponder sub–system – see para.3.1.1

• TDM client signal concentrator sub–system – optional, see para. 3.1.2

• Optical MUX/DMUX (Wavelength Division Multiplexing) sub–system, see para. 3.1.3

• Optical Fiber Amplification (OFA) sub–system – optional – used in 1696MS only, see para.3.1.4

• Supervision management (Optical Supervisory Channel, OSC) sub–system – optional,see para. 3.1.5

• Automatic Power Equalization sub–system (APE) – optional, see para. 3.1.6

• Controller sub–system, see para. 3.1.7

• Power supply sub–system, see para. 3.1.8

• Protection (O–SNCP) sub–system, see para. 3.1.9

• Performance Monitoring sub–system, see para. 3.1.10.

Before starting with the presentation of the above listed functions / sub–systems, for a better system com-prehension, the 1696MS main configurations (Line Terminal, OADM, back–to–back terminal, Repeater)and the functions implemented in each of them are described in the following.

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Line Terminal configuration

Clientsignals

DWDMline

OFA

OFA

Equipment andshelf control

UserInterfaces

Powersupply

User service accesses Station batteries

Supervision OSC

OSCextraction

OSCinsertion

3.6 V

5.5 VToboards

48 V

To boards

SPI busTDM bus

NE managementapplication

LAN–Q3

2 Mbit/s

2

Transponder

MUX

DMUX

Up to32

LEGEND:

Optical link

Electrical link

Optionalfunction

48 V

Up to32

Up to32

TDMconcentrator

Booster

Pre–amp.

Up to 32

If needed DCU modules can be used (placed before BOFA booster input, in both directions).This type of configuration can be provided with one (as shown in current figure) or two OFAs (seealso para. 1.1.2 on page 60).

Figure 71. Functional synopsis in Line Terminal configuration

In the line terminal configuration all the above functions are needed.

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OADM / back–to–back terminal (Hub) configuration

Client signals

DWDMline

(East)

Up to 32

OSC

Transponder(West)

DMUX

MUX

O–SNCP

MUX

DMUXPass through traffic

Transponder(East)

Equipment andshelf control

UserInterfaces

Powersupply

User service accessesStationbatteries

Pass through traffic

Supervision

OSCextraction

OSCinsertion

OSC

OSCextraction

OSCinsertion

3.6 V5.5 V

To boards

DWDMline

(West)

48 V

To boards

SPI busTDM bus

NE managementapplication

LAN–Q3

2 Mbit/s

2

Back panelelectrical links

OFA

OFA

OFA

OFA

LEGEND:

Optical link

Electrical link

Optionalfunction

TDMconcentrator

Booster

Pre–amp.Booster

Pre–amp.

If needed DCU modules can be used (placed before BOFA booster input, in both directions).This type of configuration can be provided with one (as shown in current figure) or two OFAs (seealso para. 1.1.4 on page 62).

Figure 72. Functional synopsis in OADM configuration

The hub configuration is similar to the OADM one, but without pass–through channels (all the channelsare added/dropped).

In OADM configuration all the optical transmission functions (transponder, MUX and DMUX) are dupli-cated to transmit the client signals in two directions. This configuration allows optical channel protectionfunctions (O–SNCP).

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In line repeater configuration

DWDMline

OSCextraction

OSCinsertion

OFA 1

VOA

Stage 1

OSCextraction

OSCinsertion

VOA

DWDMline

OFA 2

Stage 1

Stage 2

Stage 2

OSC

Equipment andshelf control

UserInterfaces

Powersupply

User service accessesStationbatteries

SupervisionOSC

3.6 V5.5 V

To boards

48 V

To boards

SPI bus TDM bus

NE managementapplication

LAN–Q3

2 Mbit/s

2

LEGEND:

Optical link

Electrical link

Optionalfunction

DCU

DCU

Figure 73. Functional synopsis in Repeater configuration

In In line repeater configuration, the MUX/DEMUX and Transponder functions are not implemented. Theequipment acts as an in line amplifier, which allows nevertheless the Optical Supervision Channel (OSC)and the supervision functions.

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3.1.1 Transponder sub–system

The transponder sub–system is built with– Multi–rate Channel Cards (MCC)– Optical Channel Cards (OCC10)one per client signal. The role of this function is:

– At the transmit side (from client to DWDM line):to adapt the client incoming optical signals to a dedicated wavelength and deliver those optical sig-nals to the multiplexer (MUX) function.

– At the receive side (from DWDM line to client):to restitute the client optical signals from the signal delivered by the demultiplexer (DEMUX) function.

The payload type configuration of the client signal is under control of the operator.

Up to 32 Client signals

To MUX function

From DMUX function

User Tx User Rx

WDM TxWDM Rx

Up to 32MCC / OCC10

Transponder function

8x8 Matrix

Up to 32WDM channels

Figure 74. Line terminal transponder function

In back–to–back and OADM configuration, the transponder function is doubled and is able to transmit andreceive the clients signals in two directions. It provides optionally Optical Sub–Network ConnectionProtection (O–SNCP), see section 3.1.9, page 169.

Up to 32 Client signals

To MUXfunction

From DMUXfunction

WDM Rx

MCC

WDM Rx

User Tx User Rx

WDM TxWDM Rx

Up to 32MCC OCC10 East

Transponder function

8x8 MatrixWDM Rx

MCC

WDM Rx

User Tx User Rx

WDM TxWDM Rx

Up to 32MCC/OCC10 West

Up to 32WDM channels

Up to 32WDM channels

From DMUXfunction

To MUXfunction

Back–panelelectrical

links

O–SNCP

: Options

8x8 Matrix

Figure 75. Back–to–back terminal or OADM transponder function

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3.1.1.1 Client signals

3.1.1.1.1 MCC client signals

The MCC1, MCC2 and MCC3 boards accept all bit rates from 100 Mbit/s to 2.66 Gbit/s in 3R (Re–time,Re–amplify, Re–shape) mode. However beyond 2.5 Gbit/s the performances may be degraded.The typical client signals accepted by the MCCs board are listed in the following table.Some of them are proposed with a 3R regeneration mode for MCC1 and they are indicated with (*) on thetable. All the other signals are in 2R mode in MCC1.

Table 12. Example of Client signals – supported bit rates

MCC1, MCC2, MCC3

Bit rates (Mbit/s) Signal

100.000 FDDI

125.000 FE / FDDI

132.815 FC (12-M6–LE–I)

155.520 STM–1 / OC–3 (*)

200.000 ESCON

265.620 FC (25-M6–LL–I)

270.000 DTV / HDTV

466.560 OC–9

531.250 FC (50-M5–SL–I)

622.080 STM–4 / OC–12 (*)

933.120 OC–18

1062.500FC (100-SM–LL–I) (*)FICON / Inter–System Coupling Channel (ISC) (*)

1244.160 OC–24

1250.000 GBE (*)

1866.240 OC–36

2125.000 2FC (*)

2488.320 STM–16 / OC–48 (*)

2500.000 INFINIBAND

3.1.1.1.2 OCC10 client signals

The OCC10 board accepts the following client signals in 3R (Re–time, Re–amplify, Re–shape) mode:– 9953.28 Gbps (STM–64 / OC–192 / 10GBE WAN)– 10.3125 Gbps (10GBE LAN)

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3.1.1.2 Optical channels

The 1696MSPAN transmits the 32 possible channels in the C–band. Table 13. on page 149 gives thenominal central frequencies allocation plan, based on the 100 GHz channel spacing anchored to a193.100 THz reference (ITU–T standard grid).The C–band is split into 4 sub–bands, which support 8 channels each: the long bands L1 and L2, and theshort bands S1 and S2.Then, each sub–band is composed of 2 sets of 4 consecutive channels. Each set is separated from theadjacent sets by one unused channel, except between L1 and S2, where the separation is 3 unused chan-nels.

Table 13. Nominal frequencies allocation plan in C–Band

Band Central frequency (GHz)(Craft terminal name)

Channel Number Central wavelength (nm)wavelength deviation : 0,12 nm (EOL)

192,000 20 1561,42

192,100 21 1560,61

192,200 22 1559,79

192,300 23 1558,98

L2

192,500 25 1557,36

192,600 26 1556,55

192,700 27 1555,75

BLUE192,800 28 1554,94

BLUEBANDBAND

193,000 30 1553,33

193,100 31 1552,52

193,200 32 1551,72

193,300 33 1550,92

L1

193,500 35 1549,32

193,600 36 1548,51

193,700 37 1547,72

193,800 38 1546,92

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Band Central wavelength (nm)wavelength deviation : 0,12 nm (EOL)

Channel NumberCentral frequency (GHz)(Craft terminal name)

194,200 42 1543,73

194,300 43 1542,94

194,400 44 1542,14

194,500 45 1541,35

S2

194,700 47 1539,77

194,800 48 1538,98

194,900 49 1538,19

RED195,000 50 1537,40

REDBANDBAND

195,200 52 1535,82

195,300 53 1535,04

195,400 54 1534,25

195,500 55 1533,47

S1

195.700 57 1531,90

195.800 58 1531,12

195.900 59 1530,33

196.000 60 1529,55

The Central frequency value (in GHz) is the channel name, visualized on the Craft Terminal.

The Multi–rate Channel Cards (MCC1, MCC2 and MCC3), support two channels each. 16 different MCCs(transponders) are able to cover the 32 channels.

The 10 Gbps Optical Channel Cards (OCC10), support instead one channel each. Then 32 differentOCC10s (transponders) are necessary to cover the 32 channels.

Mixed configuration (MCC and OCC10 in the same equipment) are allowed.

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3.1.2 TDM client signal concentrator (4xANY, 4xANY_S, 4xANY_P) sub–system

The transponder sub–system supports clients signals from 100 Mbit/s to 2.5 Gbit/s. Each client signalconnected to a transponder access uses a WDM channel, a wavelength (λ).

The aim of the 4ANY TDM concentration is to save transponders and to optimize the use of each WDMchannel. Client signals from 100 Mbit/s to 1.25 Gbit/s can be concentrated in one STM16. For example,4 x STM1 client signals can be concentrated on a unique STM16 signal and applied on a unique transpond-er access.

Transponder

Up to 4client signals

Transponder

Transponder

Transponder

Up to 4WDMoptical

channels

4 Transponders

Transponder

4xANYTDM

concent.

1 WDMoptical

channel

1 Transponder

1 STM16

Up to 4client signals

1 Concentrator

Figure 76. Principle of the 4xANY TDM concentration

The available client signal accesses and their maximum number are:

– Low bit rate:• 4 x Fast Ethernet• 4 x FDDI• 4 x ESCON• 4 x Digital Video

– SDH:• 4 x STM1• 3 x STM4

– High bit rate:• 2 x Gigabit Ethernet• 2 x Fiber Channel or FICON

The following mixes are also possible:• 3 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4• 2 x (FDDI or FE or DV or ESCON or STM1) + 2 x STM4• 2 x (FDDI or FE or DV or ESCON or STM1) + 1 x (FC or GbEth or FICON)• 1 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4 +1 x (FC or GbEth or FICON).• 2 x (FC or GbEth or FICON).

Low bit rate and High bit rates are available at 1310 nm and 850 nm. SDH bit rates are only available at1310 nm.

On the aggregate side, the 4xANY_P board is equipped with a SFP optical module providing I–16.1,S–16.1, Silver CWDM or Bronze CWDM interfaces, according to the SFP module used.

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3.1.3 Wavelength Division Multiplexing sub–system

The optical multiplexer function– receives from the transponder sub–system the colored optical channels– multiplexes them into a DWDM signal– launches the DWDM signal on the line.The optical demultiplexer function– receives the DWDM line signal– demultiplexes this signal– sends the recovered optical channels to the transponder sub–system.

The multiplexer/demultiplexer sub–system have a scalable architecture. By combining three sorts of basicMUXes and three sorts of basic DMUXes, 4, 8, 12, 16, 24 and 32 channels, the multiplexing and demulti-plexing capacities can be obtained.

3.1.3.1 Optical multiplexing

The multiplexer function may be obtained with the following optical MUXes:

– 5:1 and 9:1 MUXes:This sort of optical MUX is able to multiplex 4 or 8 channels issued from the transponder function withan extra input aggregate signal. The extra input may be connected to the output of another MUX(MUX cascading), connected to the extra output of a corresponding DMUX (traffic pass through) orsimply not connected.

5:1Aggregate signal output

Extra inputAggregate signal(n channels)

4 Channel inputs4 channelsfrom TPD

Aggregate signal(n+4 channels)

9:1Aggregate signal output

Extra inputAggregate signal(n channels)

8 Channel inputs8 channelsfrom TPD

Aggregate signal(n+8 channels)

Figure 77. 4 and 8 channels optical MUXes

– 2:1 expansion MUX:This sort of optical MUX is able to multiplex 2 aggregate signals, one in the long band and the otherin the short band. It is necessary to reach the multiplexing capacity of 24 and 32 channels and belongsto the OMDX8100_M_L1_XS and OMDX8100_M_L1_X boards.

2:1 Aggregate signal output

LB inputAggregate signal(n1 channels)

Aggregate signal(n1+n2 channels)

SB inputAggregate signal(n2 channels)

EXP

Figure 78. LB and SB aggregate signals expansion MUX

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3.1.3.2 Optical demultiplexing

The demultiplexer function may be obtained with the following optical DMUXes:

– 1:5 and 1:9 DMUXes:This sort of optical DMUX is able to demultiplex an input aggregate signal (n channels) into 4 or 8channels and an output aggregate signal (n–4 or n–8 channels). The extra output may be connectedto the input of another DMUX (DMUX cascading), connected to the extra input of a MUX of the multi-plexer function (traffic pass through) or simply not connected.

1:5Aggregate signal input

Extra outputAggregate signal(n–4 channels)

4 Channel outputs4 channelsto TPD

Aggregate signal(n channels)

1:9Aggregate signal input

Extra outputAggregate signal(n–8 channels)

8 Channel outputs8 channelsto TPD

Aggregate signal(n channels)

Figure 79. 4 and 8 channels optical DMUX

– 2:1 expansion DMUX:This sort of optical DMUX is able to demultiplex the DWDM line signal into two aggregate signals,one in the long band and the other in the short band. It is necessary to reach the demultiplexing capac-ity of 24 and 32 channels and belongs to the OMDX8100_M_L1_XS and OMDX8100_M_L1_Xboards.

1:2 Aggregate signal input

LB outputAggregate signal(n1 channels)

Aggregate signaln1 LB channelsn2 SB channels

SB outputAggregate signal(n2 channels)

EXP

Figure 80. LB and SB aggregate signals expansion MUX

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3.1.3.3 Example of MUX and DMUX functions

Line Terminal configurations

In a 4 or 8–channels Line Terminal, multiplexing and demultiplexing are performed in one step. The extrainput of the MUX and the extra output of the DMUX are not connected.

8 channelsto DWDM line

8 channelsfrom DWDM line

From transpondertransmit functions

9:1

1:9

MUX function

DMUX function

To transponderreceive functions

8

8

NC

NC

Figure 81. MUX and DMUX functions of an 8 channels Line Terminal

In a 12 or 16–channels Line Terminal, multiplexing and demultiplexing are performed in two steps. Theexample of Figure 82. shows how to cascade 2 MUXes and 2 DMUXes to obtain a 12–channels Line Ter-minal.

The extra input of the first MUX is not connected. The 4–channels aggregate signal output of the first MUXis connected to the extra input of the second MUX.The extra output of the first DMUX is connected to the 4 channels aggregate signal input of the secondDMUX. The extra output of the second DMUX is not connected.

12 channelsto DWDM line

12 channelsfrom DWDM line

Fromtransponder

transmitfunctions

5:19:1

1:51:9

MUX function

DMUX functionTo

transponderreceive

functions

8

4

4

8

4 channelsaggregate

4 channelsaggregate

Figure 82. MUX and DMUX functions of a 12 channels Line Terminal

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In a 24 or 32–channels Line Terminal, multiplexing and demultiplexing are performed in three steps. Theexample of Figure 83. shows how the 2:1 expansion MUX multiplexes the 16–channels in long band and16–channels in short band.

32 channelsto DWDM line

32 channelsfrom DWDM line

Fromtransponder

transmitfunctions

16 channels (LB)aggregate9:1

9:1

9:19:1

2:1

1:91:9

1:9

1:2

1:9

MUX function

DMUX function

Totransponder

receivefunctions

8

8

8

8

8

8

8

8

EXP

EXP

8 channelsaggregate

8 channelsaggregate

16 channels (LB)aggregate

16 channels (SB)aggregate

8 channelsaggregate

8 channelsaggregate

16 channels (SB)aggregate

OMDX_L1_X(S)

Figure 83. MUX and DMUX functions of a 32 channels Line Terminal

OADM configurations

The example of Figure 84. is an 8–channels OADM. 8 channels are dropped and added on both east andwest lines. In this configuration, the extra output of each DMUX is connected to the extra input of the MUXof the opposite transmission direction. This allows to place the other 24 channels in pass through.

32 channelsto DWDM line

24 channels aggregatepass through

9:1

1:9

MUX

DMUX

To/fromtransponder

8

8

1:9

9:1

MUX

DMUX

24 channels aggregatepass through

8

8 channelsadded

8 channelsdropped

8 channelsadded

8 channelsdropped

32 channelsfrom DWDM line

32 channelsto DWDM line

To/fromtransponder

32 channelsfrom DWDM line

West line East line

Figure 84. MUX and DMUX functions of an 8 channels OADM

The same configuration is available with 1, 2, 4 and 8–channels (n–channels). In this case, the numberof aggregate channels available in pass through is 32 – n.

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The example of Figure 85. is a 32–channels back–to–back terminal. In this configuration, there no is passthrough traffic, the 1696MSPAN is like a hub–node.

32 channelsto DWDM line

From/totransponder function

9:1

MUX function

8

8

8

8EXP

32 channels

9:1

9:19:1

2:1

32 channelsfrom DWDM line

1:9

DMUX function

8

8

8

8EXP

1:9

1:91:9

1:2

9:1

MUX function

9:1

9:19:1

2:1

1:9DMUX function

EXP

1:9

1:91:9

1:2

8

8

8

8

8

8

8

8

32 channelsto DWDM line

32 channelsfrom DWDM line

32 channels

EXP

West lineEast line

Figure 85. MUX and DMUX functions of a 32 channels back–to–back terminal

Remote channel to/from CPE.

Client signals

One fibre pair

TPD

MuxDmux

One fibre pairTPD

MuxDmux

OFAOFA

n λ (up to 32)

DWDMline

signal

DWDMline

signaln λ (up to 32)

Optionalfunctions

Client signalTo/from CPE

ÉÉÉÉÉÉ

TPD

Passthrough

Remote channel

Figure 86. 1696MSPAN in back–to–back terminal configuration and with a remote channel

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3.1.4 Optical Fiber Amplification sub–system

The Optical Fiber Amplification (OFA) sub–system can deliver:– single or double stages amplification– VOA at the first stage entry– Up to 17 dBm output power.

As shown in Figure 71. and Figure 72. the 1696MSPAN may be equipped with one or two OFAs (one OFAin west side and one in east side or two OFAs in west side and two in east side) in line terminal and OADM/back–to–back configuration. In the following example is shown a double stage amplification.In a single stage amplification, the line terminal or OADM is placed inside the OFA inter–stage (seeFigure 17. on page 62 as an example)

DWDMline

OSCextraction

OSCinsertion

OFA 1

OFA 2

Pump 1

Pump 2

VOA

Stage 1 – Preamp.

Stage 2 – Booster

OFA 2

OFA 1

Pump 2

Pump 1

Stage 2– Booster

Stage 1 – Preamp.

VOA

MUXfunction

Supervision function

LEGEND:Optionalfunction

ATTEN/

WEST SIDE

(OMDX/OADM)

DCU

ATTEN/DCU

Figure 87. OFA sub–system in line terminal or OADM configuration

In repeater configuration, the 1696MSPAN is mainly a bidirectional optical amplifier.

DWDMline

OSCextraction

OSCinsertion

OFA 1

OFA 2

Pump 1

Pump 2

VOA

Stage 1 – Preamp.

Stage 2 – Booster

OFA 2

OFA 1

Pump 2

Pump 1

Stage 2– Booster

Stage 1 – Preamp.

OSCextraction

OSCinsertion

VOA

DWDMline

Supervision function

LEGEND:Optionalfunction

WEST SIDE EAST SIDE

ATTEN/DCU

ATTEN/DCU

Figure 88. OFA sub–system in repeater configuration

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3.1.5 Optical supervisory channel (OSC) sub–system

An optional channel named OSC is allocated to the transport of the supervision data. The OSC allows theremote monitoring of the NE in a network and gives some order–wires (data channel and voice channel)to the users.The OSC channel is managed by the SPV management unit. It is– inserted at the output of the terminal equipment (input of the WDM line),– regenerated in each OADM, back–to–back terminal or repeater,– dropped at the input of the terminal equipment (output of the WDM line).

WDMterminal

WDMterminal

OADM

OADM

OMX

ODX

OSC

ODX

OSC

OMX

SPVMunit

OADM

OSC

OSC

OSC

OSC

SPVMunit

OADM

OADM

SPVMunit

OADM repeater

SPVMunit

OSC

OSC

SPVM Unit

OSC

OSC

OADM

OADM

OADM repeater

OSC

OSC

SPVMunit

In Line Repeater

SPVM SPVM

1

1

1

1

1

1

2

2

2

2

2

2

SPVM

CPE

Figure 89. Optical Supervisory Channel management in Line Terminal, OADM, OADM repeater andIn–Line–Repeater Equipment

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In case of repeaters the SPV is inserted at the output of the NE: either in the amplifier board or in the lastmux board (OMDX or OADM). The optical interfaces are located inside the SPV management unit.

More than one SPVM board can be used in one shelf. A link from/to a Customer Premises Equipment(CPE) carrying only one or two (1550 and/or 1310) data channels can be inserted on any kind of 1696MSnode (terminal or OADM).

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3.1.6 Automatic Power Equalization (APE) subsystem

Automatic Power Equalization (APE) is a function which allows the automatic balancing of the optical spec-trum at node output. The objective is to have a flat spectrum in power per channel.

For all information related to automatic power equalization, refer to the commissioning handbook.

Two kinds of boards are mandatory to perform APE :

– OSMC : OSMC board is a embedded optical spectrum analyser. It can measure 8 different spectraat 8 different points of the NE. Only one OSMC per NE is needed. It must be optically connected tomonitoring ports of the NE

– MVAC : all loop, pass–through bands and external colored channels must be connected to MVAC.

Before launching APE, the operator needs to perform some pre–settings.

Firstly, the operator must declare the cabling between :

– MVAC & OADM or OMDX ports.

– OSMC & monitored boards.

Then, the operator sets the OSMC configuration parameters :

– Calibration factors : Because OSMC is connected to board monitoring outputs, calibration of the at-tenuation path beween real signal on the line and OSMC input is needed. 8 calibration factors are set (one per OSMC input). Calibration can be performed manually or automatically. Each OSMC input can be independently calibrated or not, in automatic or manual mode.

– Optical LOS threshold : OSMC board detects two kinds of LOS of signals :

• Total LOS on input #i : Total LOS is raised on input #i if :Maximum channel power of input #i < Total LOS threshold of input #i

• Relative LOS on channel x of input #i : relative LOS on channel x of input #i is raised if :Maximum channel power of input #i – channel power x > Relative LOS threshold

These thresholds are configurable by the operator

Finally, the operator must load APE parameters :

– Installation or Upgrade

– Direction to equalize

– Interstage attenuation and maximum number of iterations in case of an OADM repeater.

When the operator launches the equalization, the NE asks for some spectrum acquisitions to the OSMC.Spectrum data are sent from OSMC to the NE. The NE calculates required MVAC & transponders attenua-tions so to have a flat spectrum at node output. The process can be iterative in case of an OADM repeater.When the output tilt is optimized, resulting spectrum and tilt at node output are displayed.

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1 2

DEMUX

MUX

MVAC

MVAC

MV

AC OSMC

Figure 90. Automatic Power Equalization

APE is stopped if RUM, RUP, RUTM are raised, in case of communication problem or if maximum numberof iterations is reached.

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3.1.7 Controller sub–system

See Figure 91. on page 164 and Figure 92. The controller sub–system is based on a two levels model:– Shelf Controller (SC)– Equipment Controller (EC)

In current release the ESC (Equipment and Shelf Controller) is the hardware platform designed to supportthe Equipment Controller (EC) functions and the Shelf Controller (SC) functions.The Equipment Shelf Controller (ESC) board provides both features or only one (as needed).It performs both EC and SC when it is located in slot 1 of the Master shelf and only the SC functionalitywhen it is plugged in slot 1 of an expansion shelf.

The Flash memory of the ESC board must be plugged on its socket and in the correctsense. In this case, it is plugged easily without constraint. On the wrong sense the Flashmemory cannot be plugged. Then invert the side to be plugged and try again. Furthermore thatflash card must not be installed in a ESC used in Expansion shelf.

The Control Platform is also provided by the ESC board for the 1696MS_C.

Shelf Controller function

SC provides the resources to support the SW functions related to the physical machine control and mana-gement and configuration provisioning.In a shelf all the boards are connected to the ESC unit via the SPI bus. By means of the SPI bus, the proces-sor of the ESC, can collect the control information of the boards (e.g.: alarms collection, remote inventoryand data EEPROM reading).

Equipment Controller function

The EC supports the Q3 agent and the VHM (Virtual Hardware Machine).It provides the HW resources (physical interfaces) and the SW functionalities (protocol stack) required forthe communication between NE and Management system (OS, craft terminal, etc).It performs as well all the SW functions related to the control and management activities of the ”virtual”(logical) machine: info–model processing, event reporting and logging, equipment data base manage-ment, SW downloading and management, etc.

Control bus

The SPI bus allows:• connection between SC and boards for configuration data provisioning• remote inventory data acquisition• data collection ( alarms ) and commands handling (ex. loops)

The SC processor is master of this bus.

The IS–LINK (10 Mb/s) is used to realize the communication between the EC in the master shelf and theSC in the expansion shelves.

The ISSB bus (not used in current release) connects the Shelf Controllers processor to the ASICs andFPGAs of the different boards in the same shelf. It is used for OCh–OH management and to carry primi-tives for OCC10 performance monitoring. It is terminated in the PSC.

The Intershelf Link (I–LINK) (10 Mb/s) is used in 1696MS_C system only allowing to connect the SPIbus and the Card presence signals from the slave shelves to the ESC board, only provided in master shelf.

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External interfaces toward Craft Terminal, OS...

F interface : available from the EC function for connection to a local Craft Terminal; the electrical interfaceand connector are provided by the ESC card.The standard implementation of the physical layer for the F interface consists of an RS–232 UART portaccessible from the ESC card front panel.

QECC Interface: it is a TMN related communication interface based on the use of the Embedded Commu-nication Channels available in the Optical Supervisory Channel (DCC). Through the QECC interface theequipment can exchange management messages with a remote OS.

QAUX interface: it is provided as an additional TMN communication interface for message exchange be-tween the NE and a Remote OS station based on the use of a 2 Mbit/s proprietary protocol.

Q3/TL1 interface: it is dedicated to an OS station connection. LAN_Q supports Q3 connection to a WANor LAN respectively. The physical interfaces are provided by the LAN_Q card.

RE / HK interface: this interface consists of parallel I/O signals used for remote alarms and for housekeep-ing signals. The relevant electrical interfaces are placed on the HK card, and are controlled by the EC func-tion through parallel I/O ports.

RA interface: it is dedicated to send commands toward the rack to light up the relevant lamps.

Flash backup and Smart Boot

The flash backup capability permits the management system to copy files back and forth using an ftp servi-ce, between the flash card on the ESC in slot 1 and the ESC in slot 24 of the master shelf.

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MASTER SHELF

Rack ledsHousekeeping

Alarms

SC

OPERATIONSYSTEM

SPVM

F

Local

Craft Terminal

Q3/TL1

Remote/

RA

EC

SC

FLASHCARD

IS–LINKTo allboards in the shelf

SLAVE SHELF

ESC BOARD

ESC BOARD

SPI

REMOTEOPERATION

SYSTEM

QE

CC

EXTERNAL INTF

UIC

QA

UX

To allboardsin the shelf

SPI

RE/HK

EXTERNAL INTERFACES

RAI HK LAN_Q

Figure 91. Controller sub–system

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3.1.7.1 Example of control interfaces scheme

M

V

A

C

O

C

C

1

0

M

C

C

4

x

A

N

Y

O

M

D

X

/

O

A

D

M

E

S

C

S

P

V

M

LAN

LAN

HK

RAI

E1/E2

F1

NU

2x2MbpsU

I

C

Q3/TL1

IS–LINK

HK/RE

RA

O

M

D

X

/

O

A

D

M

SPI–A

SPI–B

SPV channel (optical)

PSC PSCPower Supply A

Power Supply BISPB (not used in current release)

PDU/TRUMASTER SHELF

M

V

A

C

O

C

C

1

0

M

C

C

4

x

A

N

Y

O

M

D

X

/

O

A

D

M

E

S

C

LAN

RAI

IS–LINK

RA

O

M

D

X

/

O

A

D

M

SPI–A

SPI–B

PSC PSCPower Supply A

Power Supply BISPB (not used in current release)

EXPANSION SHELF

EC

SC

QECC

Remote / HK Alarms

Rack Leds

F INTERFACELocal Craft

Terminal

QAUX intf (REMOTE OS)

(OPERATION SYSTEM)

O

S

M

C

O

S

M

C

Figure 92. Example of control interfaces scheme in 1696MS

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C

4

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O

M

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D

M

E

S

C

S

P

V

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LAN

LAN

HK

RAI

Audio

Q3/TL1

IS–LINK

HK/RE

RA

O

M

D

X

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O

A

D

M

SPI–A

SPV channel (optical)

PSC/2 PSC/2Power Supply A

Power Supply BISPB (not used in current release)

PDU/TRUMASTER COMPACT SHELF

O

C

C

1

0

M

C

C

4

x

A

N

Y

SPI–A

PSC2 PSC2Power Supply A

Power Supply BISPB (not used in current release)

EXPANSION COMPACT SHELF

EC

SC

QECC

Remote / HK Alarms

Rack Leds

F INTERFACELocal Craft

Terminal

(OPERATION SYSTEM)

I

L

I

N

K

_

S

I

L

I

N

K

_

M

Figure 93. Example of control interfaces scheme in 1696MS_C

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3.1.8 Power supply sub–system

The powering architecture is distributed: two Power Supply Cards are in charge of feeding all the othercards hosted in the shelf by selecting the highest voltage supplied by the two station batteries.

Power Supply Cards are fit in– slot 25 and slot 48 in 1696MS– slot 7 and 12 in 1696MS_C.The main purposes are:– Supply and distribute 48V filtered and protected voltage to all the boards housed in the shelf of the

1696MS/1696MS_C equipment– Supply and distribute +3V service voltage dedicated to SPIDER circuitry in all the boards– Supply and distribute +5V auxiliary voltage– Make a bus termination– Give alarms on fault battery and voltages loss.

The PSC boards work in ”1 + 1” protection; this means that (as concerning 48V) only one PSC may beactive at once. This circuit select the battery more charged and protect against reverse voltage applied.Figure 94. on page 168 shows the equipment power supply scheme housed on the two PSC.

Input power stageIt provides adaptation to the customer central power bus by a main power block and supplies all the SPI-DER FPGA by means of an on–board converter.

Main power blockIt is used to select the input voltage of the system and to supply a surge protection.It contains an EMI filter to permit the equipment to be reliable in presence of external EMI interferencesand to limit the internally generated EMI.The voltages coming from the two station batteries, are applied to PSC A and to PSC B respectively bymeans of the power connector located on the unit front panel ( ex. +BATT A –BATT A to PSC A and +BATTB –BATT B to PSC B).The +Batt can be connected to a mechanical ground through a strap setting.Moreover each PSC receives from the back panel connector the –BATT voltage coming from the otherstation battery (i.e. –BATT B to PSC A and –BATT A to PSC B).Each PSC can therefore select which of the two station batteries provides the highest supply.The selected voltages are ORed and sent to the equipment cards.

Protection CircuitThe protection circuit is present in the PSC and in all the boards where a DC/DC converter is required i.e.input stage and distributed power stages. It is an interface between +BATT –BATT and the DC/DC converter.It provides the following functions:– it insulated the DC/DC converter in case of input short circuit. Fuses are fitted in order to prevent a

failed unit from shortening the input bus. In fact a input short circuit failure can cause severe fluctua-tions on the input power of the other DC/DC converters

– it implements a start–up and an inrush current limiting system in order to provide controlled charge–up for the input hold–up capacitor and therefore it prevents a current surge at the module input whenthe board is plugged in

– it insulated the DC/DC converter in case of input voltage lower than 33 V.

On board power supplyA DC/DC converter generates a +3.3 V voltage used to power the SPIDER FPGA.

Distributed power stageAll the boards receive the +3.6 V and the 5.5 V voltage to power the FPGA device located on each card.Moreover, some boards receive the +BATT –BATT voltages generated by the input stage of the PSC.

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Normal service rangeThe normal input voltage range of the power supply module is either:

– 40,5 V – 48 V – 57,0 V or– 50,0 V – 60 V – 72,0 V.

Abnormal service rangeThe 1696MSPAN equipment operating at –48 V does not suffer any damage when subjected to the follow-ing voltage range : 0 V to –40,5 V and –57 V to –60 V.When the equipment operates at –60 V, the voltage range becomes: 0 V to –50 V and –72 V to –75 V.Protection to the station power supply is provided by 16A circuit breakers at the top of the S9 rack.The maximum power consumption of the main rack is about 400 Watts.

DC/DC Power supply units’ output voltages + 3.6 V 3%– 5.5 V 3%+ 2.5 V 3%

+Batt_A

–Batt_A

+Batt_B

–Batt_B

SPIDERFPGA

PSC A

PSC B

GND

GND

* protection* pre–filter

* fuse

* protection* pre–filter

* fuse

+Batt

–Batt

* OR Batt

* EMI/EMCfilter

* OR Batt

* EMI/EMCfilter

+Batt

–Batt

dual DC/DC

* soft start

* EMI/EMCfilter

* threshold* soft start

* EMI/EMCfilter

* thresholdconverter

dual DC/DC

converter

3.6V

5.5V

3.6V

5.5V

* soft start

* EMI/EMCfilter

* threshold

OBPS

3.6V5.5V2.5V

OR

OR auxilliarypower supply

GENERIC BOARD

DISTRIBUTED POWER STAGE

PRIMARY POWER STAGE

Figure 94. 1696MSPAN – equipment power supply scheme

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3.1.9 Protection sub–system

The protection type used is Optical SNCP (network protection).In a ring network the Sub–Network Connection Protection (SNCP) at optical channel level can be providedeither in ”back–to–back” terminals or in OADM configuration.The transponders (MCC/OCC10) are duplicated for each protected channel. At the transmit side, the sig-nal is broadcasted on the two arms of the ring. At the receive side one of the two available signals is selec-ted. When a failure occurs on the working path, the system switches on the signal of the protecting path.

OADM

Client end traffic

Client Add & drop traffic

ClientAdd & drop

trafficOADM OADM

ClientAdd & drop

traffic

Back–to–backterminal

Transmit side:client signals are splitand launched on thetwo arms of the ring

Receive side:in case of a failure in one arm

of the ring the system selectthe signal of the other one

Figure 95. Channel level protection in a ring network

The Optical SNCP (O–SNCP) is ensured for each client signal by 2 optical splitters, located between theclient interface and the transponder cards:

– At the transmit side, each client signal is split by a 50/50 optical splitter and sent to two transpondercards. Then, one signal is broadcasted to one arm of the ring and the other signal is broadcasted tothe other arm.

– At the receive side, each WDM signal comes from one arm of the ring to one transponder card. Atthe User Tx interface, one transponder card is in working mode (laser ON) and the other is in protect-ing mode (laser OFF). When a fault is detected on the working path, the protection switching is per-formed by turning off the working User Tx laser and by re–activating the protecting one.

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Client signals

Optical splitting

Working:laser ON

Protecting:laser OFF

DMUX

MUX

DWDM line(East)

MUX

DMUX

DWDM line(West)

1696MSPAN

User Tx User Rx

WDM TxWDM Rx

User Tx User Rx

WDM TxWDM Rx

MCC/OCC10West

MCC/OCC10East

Optical coupling

Figure 96. O–SNCP principle

In the following are shown the Optical SNCP types provided by the equipment. They are– the MCC protection (alone and MCC + 4xANY), described on para. 3.1.9.1– the OCC10 protection, described on para. 3.1.9.2.– the 4xANY client signals protection, described on para. 3.1.9.3.

3.1.9.1 MCC protection

Table 14. MCC protection: switching criteria

Alarm Applicable to the following MCCs Default status

HWF All MCCs always enable

C_ABS All MCCs always enable

C_TYPE All MCCs always enable

ILOS_WDM All MCCs always enable

LOC_user / LOC_User_Tx MCC2, MCC3 always enable

When a MCC detects one of the above criteria, the transmitter is shut–down.

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ents

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with

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ion

from

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.

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1AA

000

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7) A

4 –

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/3AL 95278 AA AA

390

390

3.1.9.1.1 MCC alone: MCC1, MCC2, MCC3

Rx

Tx

WDM Tx

WDM Rx

MCC West MCC East

8 x 8Matrix

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

Figure 97. Optical SNCP with MCC units

The function is provided by two optical splitters. The selection is done by switching–off the user Tx corre-sponding to the path in failure and re–activing the protecting one.

3.1.9.1.2 MCC + 4xANY

WDM Rx

WDM Tx

Tx Rx

WDM Tx

WDM Rx

Tx Rx

OPC

Tx Rx

Rx Rx Rx RxTx Tx Tx Tx

4xANY

MCC MCC

Figure 98. Optical SNCP of the MCC associated with the 4xANY (MCC–4xANY)

The function is ensured by two optical splitters (one OPC card). The selection is done by switching–off theMCC user Tx corresponding to the path in failure and re–activing the protecting one.

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3.1.9.2 OCC10 protection

Rx

Tx

WDM Tx

WDM Rx

OCC10 West OCC10 East

8 x 8Matrix

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

Figure 99. Optical SNCP with OCC10 unit

The function is ensured by two optical splitters (one OPC card). The selection is done by switching–off theuser Tx corresponding to the path in failure and re–activing the protecting one.

Table 15. OCC10 protection: switching criteria

Alarm Managed Status

HWF X

C_ABS X

C_TYPE X

LOS_WDM_Rx (or LOC_OTN_WDM_Rx) X always enable

LOS_user_Tx X

always enable

LOF_OTN_WDM_Rx X

LOM_OTN_WDM_Rx X

When an OCC10 detects one of the above criteria then the transmitter is shut–down.

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3.1.9.3 Protection of the 4xANY client

Protection can be performed optically on the 4xANY units.

WDM Rx

WDM Tx

Tx Rx

WDM Tx

WDM Rx

Tx Rx

OPC

MCC MCC

Tx Rx

Rx Rx Rx RxTx Tx Tx Tx

4xANY

Tx Rx

Rx Rx Rx RxTx Tx Tx Tx

4xANYLF Link

OPC OPC OPC

Figure 100. Optical SNCP of the MCC associated with the 4xANY (4xANY client protection)

The function is ensured by eight optical splitters (provided by four OPCs). The selection is done by switch-ing–off the 4xANY user Tx corresponding to the path in failure and re–activing the protecting one.The clients are individually protected: if one is protected, it is not necessary to protect the other ones.In 1696MS, when two 4xANY are used in client protection configuration, the 4xANY on the right side al-ways contains the MAIN/protected drawers, and the 4xANY on the left side, the SPARE/protecting draw-ers.In 1696MS_C, when two 4xANY are used in client protection configuration, the 4xANY above (slots 4 and5) always contains the MAIN/protected drawers, and the 4xANY below (slots 2 and 3), the SPARE/protect-ing drawers.The slot allocation of the OPC according to the drawers in protection of the 4xANY clients is fixed as de-scribed in Figure 101.

N.B. In some configuration, the OPC slot cannot be provided by an OPC board because this is alreadyallocated by other boards. This concerns LAN, HK and RAI boards. This can limit the number ofprotected clients.

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390

DR

AW

ER

#1

DR

AW

ER

#2

DR

AW

ER

#4

DR

AW

ER

#3

DR

AW

ER

#1

DR

AW

ER

#2

DR

AW

ER

#4

DR

AW

ER

#3

OP

C #

2

OP

C #

1

OP

C #

3

OP

C #

4

Figure 101. Correspondance between OPC slots allocation and 4xANY drawers in protection

OPC location for drawers protection– drawer 1: 31, 35, 39, 43– drawer 2: 30, 34, 38, 42– drawer 3: 28, 32, 40, 44– drawer 4: 29, 33, 41, 45.The 4xANY boards in slot 2–3 and 22–23 cannot be protected.

ES

C

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48UI

UI

HK

RA

FANS49I

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Table 16. 4xANY client protection: switching criteria per each drawer

Alarm Managed Status

HWF X

Link_Failure_DRW_U X

C_ABS X

C_ABS_DRW_U X always enable

C_TYPE_DRW_U X

always enable

SSF_U X

Pk_AIS_U X

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3.1.10 Performance Monitoring sub–system

The 1696MSPAN is able to monitor the performance of the optical signal transmission. It is an SDH typePerformance Monitoring, based on B1 counter and performed at the RX accesses (for SDH or SONETframes at system inputs only). This function is available for MCC, OCC10 and 4xANY boards (on the received aggregate signalonly, as regards 4xANY).These boards monitor the B1 byte.The performance monitoring is available:– at the User Rx access in order to monitor the client incoming signal,– at the WDM Rx access in order to monitor the client incoming signal and its transmission through the

WDM network.It is possible to manage up to 32 PM per NE.

PM at WDM Rx side

WDM

WDM

WDM

User

TX

PM on client signal

RX TX

RXUser WDM

TX

WDMRX

UserRX

TXUser

1696MSPAN 1696MSPANADM ADM

Figure 102. Two possible monitored sections by the MCC

What does the system monitor?

Performance monitoring are SDH type. The system monitors:

– performance primitive• 1 CV (Count of Violations). 8 errors by SDH or SONET frame can be detected• Defect Seconds (DS): second during which one of the LOS (Loss Of Signal), LOF (Loss Of

Frame (SDH) or LOC (Loss Of Clock) events occurred.

N.B. In SDH ADM devices, the number of EB (Erroneous Blocks) is accumulated, what is no moretrue here (we perform the count of B1 violations: CV). But we make the approximation that CV= EB for low BER.

– performance events• ES (Erroneous Second): second containing one or more erroneous bits• SES (Severely Erroneous Second): second containing at least 30% of erroneous blocks or at

least one defect (LOS, LOF or LOC)• BBE (Background Blocks Errors): number of B1 erroneous bits outside an SES.

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How does the system store the performance data?

Two counters are provided to store the Performance Monitoring data:– 15 minutes counter:

The current measurement and measurements of the 4 previous hours (15–minute periods) arestored in the NE data base. Measurements of several days are stored in SH base.

– 24 hours counter:The current measurement and the one of the day before are stored in the NE data base. Measure-ments on several months are stored in SH base.

For both periods, 15 minutes and 24 hours, an adjustable threshold alarm (TCA) on each ES, SES andBBE is provided to the operator. A TCA alarm (QoS alarm) is raised when one of these thresholds isreached (all the counter values are available).Individual PM threshold management. It is provided the ability– to set the threshold level on a per entity basis for 15 min or 24 hours on the user side or WDM side

of each transponder and on the STM–16 signal of each 4xANY board– to define user default threshold level on per type of board basis for 15 min or 24 hours.

Table 17. Default thresholds for QoS alarms

QoS_24SET/RESET thresholds

QoS_24alarm

BBE ES SES Implicite RESET after 24 hoursalarm36000 150 15

Implicite RESET after 24 hours

QoS_15SET thresholds RESET thresholds

QoS_15alarm

BBE ES SES BBE ES SESalarm

24000 50 10 200 5 0

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3.2 System Configuration

3.2.1 Configuration criteria

The basic configuration of the relies on the following criteria:

– the traffic demand defines the number of channels (1, 2, 4, 8, 12, 16, 24 or 32 channels)– the network architecture and the position of the equipment in the network defines the NE type (line

terminal, OADM, back–to–back terminal, repeater or CPE).– the optical power budget determines the need of optical amplification in the line terminal and OADM

NEs or the need of repeater NEs.

Once the basic configuration is defined, secondary criteria will be determinant to define the optional featu-res:

– TDM concentrator (4ANY)Up to 4 client signals may be multiplexed on a single STM16. The concentration of 4 client signalson a unique transponder access, requires a 4ANY board but saves 3 MCC board and the corre-sponding optical channels.

– Optical Sub–Network Connection Protection (O–SNCP)In ring networks, both channels and each client signals can be individually protected:

– the protection of a channel/wavelenght requires an OPC board and two transponders (MCC/OCC10)– the protection of the client signal(s) requires up to four OPCs, two 4xANY and two MCC boards.

– Supervision function and User interfaceThe supervision feature requires an SPVM (SPVM2; SPVM_H) board. The 2 Mbit/s user interfacefeature requires in addition an UIC board. These two features also require the OSC insertion MUXand the OSC extraction DMUX implemented in all OADM boards, the OMDX8100_M_L1_XS andin the OAC boards. If the use of one of these features is foreseen, not at the beginning but in the fu-ture, the early choice of a board with the OSC MUX and DMUX will allow a further implementation,without interruption of the traffic.

– Expansion MUX/DEMUXThe 2:1 expansion MUX and DEMUX (OMDX8100_M_L1_X and OMDX8100_M_L1_XS boards)are necessary to reach NE configurations with more than 16 optical channels. An NE can be up-graded up to a 32 channel NE without traffic interruption if the expansion MUX and DMUX are alreadyinstalled.

– Remote NEThe type of Remote NE is defined when few channels are needed for the user to reach from a ringa distant NE or to create a point to point link with CPE using.

N.B. Boards are generally 1696MS shelf and 1696MS_C shelf compatible except boards explicitlydenominated as ”strictly for 1696MS” or ”strictly for Compact shelf”.

When a CPE is used in office version, the customer must provide an appropriate ground.

CPE metallic housing should be connected to the ground,0 V_DC of the External power feeding must be also connected to this ground.

Consequently the ground connection of the positive Battery 48 Vdc should be directly con-nected on the ground (PSC side) of the power cable.

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Let consider the example of Figure 103.

LineTerminal

LineTerminal

8 clientsignals

OADM

4 pass–throughchannels

4 added and droppedclient signals

8 clientsignals

Figure 103. Example of starting configuration

One 8 channel MUX/DMUX card is sufficient to build this configuration. The Table 18. gives three possibili-ties and their characteristics.

Table 18. Configuration criteria

MUX/DMUX board Cost Powerbudget

Upgradability Supervisionchannel

OMDX8100_M_L2 orOMDX8100_M_S2 orOMDX8100_M_S1

minimum maximum 12 or 16 channels withouttraffic interruption.24 or 32 channels with trafficinterruption.

No

OADM8100_M_##_S intermediate intermediate 12 or 16 channels withouttraffic interruption.24 or 32 channels with trafficinterruption.

Yes

OMDX8100_M_L1_XS maximum minimum Up to 32 channels withouttraffic interruption.

Yes

N.B. In the OMDX and OADM board name, the characters of the fourth part if any, have the followingmeaning:S: board with supervision channel extract and insert functions.X: board with expansion MUX.

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3.2.2 1696MS (main shelf) configurations examples

3.2.2.1 Typical configurations

– Terminals• 1 channel terminal• 2 channels terminal• 4 channels terminal with two 4ANY boards• 8 channels terminal with supervision and user interface• 16 channels terminal with expansion and supervision• 24 channels terminal with expansion and supervision• 32 channels terminal with two stages amplification

It is also possible to use 12 and 24 channels terminal.

– Back–to–back terminals / OADM• 1 channel OADM• 2 channels OADM• 4 channels OADM• 8 channels OADM• 8 channels west and 4 channels east b–t–b terminal / OADM• 12 channels b–t–b terminal / OADM• 16 channels b–t–b terminal / OADM• 24 channels b–t–b terminal / OADM• 32 channels b–t–b terminal

– Repeaters:• Without supervision• With supervision.

Some of these configurations are described hereafter.

Examples of configurations with MVAC is also provided.

In protected configuration, the OPCs have to be plugged under the MAIN transponder (see theexamples shown in the following figures).

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3.2.2.2 Line Terminals (one sided multiplexer / demultiplexer)

3.2.2.2.1 4 channels terminal

4 channels terminal can be designed with 4 channels OADM board. In this case the ”pass–through” linkis not connected (Mux/Demux extra–input).the 4xANY board can be used only with MCCs. The 4–channels terminal configuration can be applied alsoto OCC10, but with the 9.953Gbps (STM–64/OC–192/10GBE WAN) client signal.

1

4

4

Tran

spo

nd

er

userinterfaces

1

OADM4100_M_chx–y_S

4 channels

4 channels

Tran

spo

nd

erTr

ansp

on

der

MCC

4 x ANY

MUX

DMUX

OSC in

OSC out

4 x ANY

ClientSignals

UIC SPVM

2Mbpsorder wire

MCCor

OCC10

Figure 104. 4 channels OADM board used as a terminal

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OA

DM

4 c

hann

els

4 x

AN

Y

4 x

AN

Y

16 17 18 19 20 21

Tran

spon

der

ch. 4

Tran

spon

der

ch. 2

Tran

spon

der

ch. 3

Tran

spon

der

ch. 1

RAI

*See note

Equ

ipm

ent S

helf

Con

trol

ler

SP

V m

anag

enem

ent (

opt)

UIC

UIC

Figure 105. 4 channels terminal configuration

* The ESC board is designed in order to support, in the same board, both Equipment and Shelf Controllerfacilities. The ESC unit has two microprocessors, one dedicated for each task.

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3.2.2.2.2 8 channels terminal with expansion, supervision and user interface

Whatever the implementation, all the boards can be placed in a single shelf.

Only L1 band is supported, provided by the OMDX8100_M_L1_XS board.

When OMDX boards are used to design 8 channels terminals, only one set of channels (L1) can be pro-vided with SPV. If an upgrading up to 32 channels is required, OMDX8 board can perform it.

8 channels

8 channels

1 (30)

MUX

DMUX

MCC /

UIC SPVM

8 x

2Mbpsorder wire

OSC in

OSC out

OCC108 (38)

1 (30)

8 (38)

8 clientsignals

OMDX8100_M_L1_XS

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

Tran

spon

der

ch 3

0

RAI

SP

V m

anag

enem

ent (

opt)

OM

DX

8100

_M_L

1_X

S

UIC

Equ

ipm

ent S

helf

Con

trol

ler

UIC

Tran

spon

der

ch 3

1

Tran

spon

der

ch 3

2

Tran

spon

der

ch 3

3

Tran

spon

der

ch 3

5

Tran

spon

der

ch 3

6

Tran

spon

der

ch 3

7

Tran

spon

der

ch 3

8

Figure 106. Example of 8 channels line terminal with expansion and supervision

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3.2.2.2.3 8 channels terminal with supervision and user interface and without expansion

Whatever the implementation, all the boards can be placed in a single shelf.

Four set of channels are supported : L1, L2, S1, S2.

By using OADM boards in terminals, SPV is available for each set of channels. However, if an upgradingup to 32 channels is required, using OADM8 boards is not sufficient (need for expansion).

8 channels

8 channels

1

MUX

DMUX

1

MCC /

UIC SPVM

8 x

2Mbpsorder wire

OSC in

OSC out

OCC10

8 clientsignals 8

8

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

Tran

spon

der

ch 8

RAI

SP

V m

anag

enem

ent (

opt)

OA

DM

8100

_M_x

x_S

UIC

Equ

ipm

ent S

helf

Con

trol

ler

UIC

Tran

spon

der

ch 7

Tran

spon

der

ch 6

Tran

spon

der

ch 5

Tran

spon

der

ch 4

Tran

spon

der

ch 3

Tran

spon

der

ch 2

Tran

spon

der

ch 1

Figure 107. Example of 8 channels line terminal with supervision (no expansion)

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3.2.2.2.4 16 channels terminal with expansion and supervision

Whatever the implementation, all the boards can be placed in a single shelf.

In order to upgrade a 8 channel terminal to a 16 channel one, or to design 16 channel terminals with SPV,one 8 channel OADM and one 8 channel OMDX boards can be used.

OSC in

OSC out

OMDX8100_M_L1_XS

LB

LB

SB

SB

30

38

30

38unused

unused

DMU

MUX

X

DMU

MUX

X

16 channels

16 channels

UNIT 1

UNIT 2

OMDX8100_M_L2

MCC/

8 x

OCC10

MCC/

8 x

OCC10

20

288 clientsignals

8 clientsignals

20

28

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48HK

FANS49

OM

DX

8100

_M_L

1_X

S

OM

DX

8100

_M_L

2

Equ

ipm

ent S

helf

Con

trol

ler

Tran

spon

der

ch 2

8

SP

V m

anag

enem

ent (

opt)

UIC

UIC

Tran

spon

der

ch 3

8Tr

ansp

onde

r ch

27

Tran

spon

der

ch 3

7Tr

ansp

onde

r ch

26

Tran

spon

der

ch 3

6Tr

ansp

onde

r ch

25

Tran

spon

der

ch 3

5

Tran

spon

der

ch 2

3Tr

ansp

onde

r ch

33

Tran

spon

der

ch 2

2Tr

ansp

onde

r ch

32

Tran

spon

der

ch 2

1Tr

ansp

onde

r ch

31

Tran

spon

der

ch 2

0Tr

ansp

onde

r ch

30

Figure 108. Example of a 16 channels terminal with expansion and SPV upgradability

Page 186: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

184

01

/3AL 95278 AA AA

390

390

3.2.2.2.5 32 channels terminal + supervision with two stages amplification

2 shelves are needed for this configuration.

32 channels

OSC in

OSC out

OMDX8100_M_L1_XS

LB

LB

SB

SB

20

28

30

38

42

50

42

50

30

38

52

60

52

60

20

28

DMU

MUX

X

DMU

MUX

X

DMU

MUX

X

DMU

MUX

X

UNIT 1

UNIT 2

UNIT 4

UNIT 3

OMDX8100_M_L2

OMDX8100_M_S1

DMU

MUX

X

OAC OAC

MCC /8

OMDX8100_M_S2

OCC10

MCC /8

OCC10

MCC /8

OCC10

MCC /8

OCC10

OFA

OFA

OFA

OFA

EXP

8 clientsignals

8 clientsignals

8 clientsignals

8 clientsignals

Figure 109. Example of a 32 channels terminal + SPV + two stages OAC

Page 187: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

185

01

/3AL 95278 AA AA

390

390

SP

V m

anag

enem

ent (

opt)

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OM

DX

8100

_M_L

1_X

S

OM

DX

8100

_M_L

2

PSC

PSC

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

FANS49

OM

DX

8100

_M_S

2

LAN

LAN

OM

DX

8100

_M_S

1

RAI

RAI

OA

CO

AC

UIC

UIC

Equ

ipm

ent S

helf

Con

trol

ler

Equ

ipm

ent S

helf

Con

trol

ler

(SC

)

Tran

spon

der

ch 2

8Tr

ansp

onde

r ch

38

Tran

spon

der

ch 2

7Tr

ansp

onde

r ch

37

Tran

spon

der

ch 2

6Tr

ansp

onde

r ch

36

Tran

spon

der

ch 2

5Tr

ansp

onde

r ch

35

Tran

spon

der

ch 2

3Tr

ansp

onde

r ch

33

Tran

spon

der

ch 2

2Tr

ansp

onde

r ch

32

Tran

spon

der

ch 2

1Tr

ansp

onde

r ch

31

Tran

spon

der

ch 2

0Tr

ansp

onde

r ch

30

Tran

spon

der

ch 5

0Tr

ansp

onde

r ch

60

Tran

spon

der

ch 4

9Tr

ansp

onde

r ch

59

Tran

spon

der

ch 4

8Tr

ansp

onde

r ch

58

Tran

spon

der

ch 4

7Tr

ansp

onde

r ch

57

Tran

spon

der

ch 4

6Tr

ansp

onde

r ch

56

Tran

spon

der

ch 4

4Tr

ansp

onde

r ch

54

Tran

spon

der

ch 4

3Tr

ansp

onde

r ch

53

Tran

spon

der

ch 4

2Tr

ansp

onde

r ch

52

Figure 110. 32 channels terminal + SPV + 2 stages OAC configuration

Page 188: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

186

01

/3AL 95278 AA AA

390

390

3.2.2.3 OADM and Back–to–Back Terminals

In the following configurations we can plug MVAC boards in slots 4 to 11 and/or 14 to 21. EachMVAC is used to replace a transponder in the case of a channel loop or to adjust pass–throughport losses.

3.2.2.3.1 4 channels OADM

2.66 Gb/s back–panelelectrical links (MCC only)

DMU

MUX

XUX

DMUX

WEST EAST

OSC out OSC in

OSC outOSC in

OADM4100_M_chy–z_S OADM4100_M_chy–z_S

M

MCC /

4 x

OCC10

MCC /

4 x

OCC10

4 client signals 4 client signals

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OA

DM

4 c

h. W

est

OA

DM

4 c

h. E

ast

Equ

ipm

ent S

helf

Con

trol

ler

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OPC

OPC

OPC

OPC

Figure 111. 4 channels back–to–back terminal / OADM

Every combination of east and west sets of channels are possible.

Page 189: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

187

01

/3AL 95278 AA AA

390

390

3.2.2.3.2 8 channels OADM

The 8–channels configuration can be proposed with or without the expansion and the supervision capabili-ties.

With optical protection of each channel (neither SPV nor EXP)

Mx/DMx 8 ch.

DMU

MUX

X

MUX

DMUX

n channels

WEST EAST

OMDX8100_M_x OMDX8100_M_y

n channels n channels

n channels

(n–8) channels

(n–8) channels

8 add & drop protectedclient signals

OPCs

MCC /

8 x

OCC10

MCC /

8 x

OCC10

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OM

DX

8100

_M_x

Wes

t

OM

DX

8100

_M_y

Eas

t

OPC

OPC

OPC

OPC

OPC

Equ

ipm

ent S

helf

Con

trol

ler

Tran

spon

der

ch 8

WTr

ansp

onde

r ch

8E

Tran

spon

der

ch 7

WTr

ansp

onde

r ch

7E

Tran

spon

der

ch 6

WTr

ansp

onde

r ch

6E

Tran

spon

der

ch 5

WTr

ansp

onde

r ch

5E

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

In protected configuration, the OPCs have to be plugged under the MAIN transponder.

OPC

OPC

OPC

Figure 112. 8 OADM protected channels

Page 190: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

188

01

/3AL 95278 AA AA

390

390

With expansion and supervision upgrade capabilities

Only symmetrical configuration can be provided.

OSC in

OSC out

LB

SB

SB

DMU

MUX

X

OSC out

OSC in

LB

SB

SB

DMU

MUX

X

WEST EAST

OMDX8100_M_L1_XS OMDX8100_M_L1_XS8 add&dropclient signals

8 add&dropclient signals

MCC /8 x

OCC10MCC /

8 x

OCC10

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OM

DX

8100

_M_L

1_X

S

OM

DX

8100

_M_L

1_X

S

Equ

ipm

ent S

helf

Con

trol

ler

SP

V m

anag

enem

ent

Tran

spon

der

ch 3

8Tr

ansp

onde

r ch

38

Tran

spon

der

ch 3

7Tr

ansp

onde

r ch

37

Tran

spon

der

ch 3

6Tr

ansp

onde

r ch

36

Tran

spon

der

ch 3

5Tr

ansp

onde

r ch

35

Tran

spon

der

ch 3

3Tr

ansp

onde

r ch

33

Tran

spon

der

ch 3

2Tr

ansp

onde

r ch

32

Tran

spon

der

ch 3

1Tr

ansp

onde

r ch

31

Tran

spon

der

ch 3

0Tr

ansp

onde

r ch

30

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Figure 113. 8 channels OADM with EXP and SPV capabilities

Page 191: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

189

01

/3AL 95278 AA AA

390

390

With supervision and without expansion upgrade capabilities

Four set of channels are supported : L1, L2, S1, S2.

xx stands for the band used: L1, L2, S1, S2.

DMU

MUX

X

MUX

DMUX

WEST EAST

OADM8100_M_xx_S OADM8100_M_xx_S

OSC in

OSC out

OSC out

OSC in

8 add&dropclient signals

8 add&dropclient signals

MCC /8 x

OCC10MCC /

8 x

OCC10

SP

V m

anag

enem

ent

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

RA

FANS49

OA

DM

8100

_M_x

x_S

Wes

t

OA

DM

8100

_M_x

x_S

Eas

t

I

UIC

UIC

Equ

ipm

ent S

helf

Con

trol

ler

Tran

spon

der

ch 8

WTr

ansp

onde

r ch

8E

Tran

spon

der

ch 7

WTr

ansp

onde

r ch

7E

Tran

spon

der

ch 6

WTr

ansp

onde

r ch

6E

Tran

spon

der

ch 5

WTr

ansp

onde

r ch

5E

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Figure 114. 8 channels OADM with supervision upgrade capability

Page 192: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

190

01

/3AL 95278 AA AA

390

390

3.2.2.3.3 8 channels west and 4 channels east

1

4

4

4 channels

4 channels

1

1

8

8

8 channels

8 channels

1

OADM4100_M_chy–z_SOADM8100_M_x_S

WEST EAST

OSC in

OSC out

OSC out

OSC in

8 client signals 4 client signalsMCC /

8 x

OCC10MCC /

4 x

OCC10

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OA

DM

8100

_M_x

x_S

Wes

t

OA

DM

4100

_M_c

hy–z

_S E

ast

Equ

ipm

ent S

helf

Con

trol

ler

SP

V m

anag

enem

ent

Tran

spon

der

ch 8

W

Tran

spon

der

ch 7

W

Tran

spon

der

ch 6

W

Tran

spon

der

ch 5

W

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OPC

OPC

OPC

OPC

Figure 115. 8 West / 4 East channels OADM

Page 193: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

191

01

/3AL 95278 AA AA

390

390

3.2.2.3.4 12 channels OADM with supervision and without expansion

For the OMDX boards, three set of channels are supported : L2, S1, S2.

xx stands for the band used: L2, S1, S2.

SP

V m

anag

enem

ent (

opt)

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OA

DM

4 c

hann

els

Eas

t

OA

DM

4 c

hann

els

Wes

t

PSC

PSC

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

FANS49

OM

DX

8100

_M_x

x W

est

LAN

LAN

OM

DX

8100

_M_x

x E

ast

RAI

RAI

UIC

UIC

Equ

ipm

ent S

helf

Con

trol

ler

Equ

ipm

ent S

helf

Con

trol

ler

(SC

)

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

Tran

spon

der

ch 8

WTr

ansp

onde

r ch

8E

Tran

spon

der

ch 7

WTr

ansp

onde

r ch

7E

Tran

spon

der

ch 6

WTr

ansp

onde

r ch

6E

Tran

spon

der

ch 5

WTr

ansp

onde

r ch

5E

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Figure 116. 12 channels OADM with supervision and without expansion

Page 194: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

192

01

/3AL 95278 AA AA

390

390

3.2.2.3.5 16 channels OADM with supervision and without expansion

Three set of channels are supported : L2, S1, S2.

xx and yy stands for the band used: L2, S1, S2.

yy has to be different from xx.

SP

V m

anag

enem

ent (

opt)

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OA

DM

8100

_M_x

x_S

Wes

t

PSC

PSC

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

FANS49

OM

DX

8100

_M_y

y_W

est

LAN

LAN

OM

DX

8100

_M_y

y_E

ast

RAI

RAI

UIC

UIC

Equ

ipm

ent S

helf

Con

trol

ler

Equ

ipm

ent S

helf

Con

trol

ler

(SC

)

Tran

spon

der

ch 8

WTr

ansp

onde

r ch

8E

Tran

spon

der

ch 7

WTr

ansp

onde

r ch

7E

Tran

spon

der

ch 6

WTr

ansp

onde

r ch

6E

Tran

spon

der

ch 5

WTr

ansp

onde

r ch

5E

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OA

DM

8100

_M_x

x_S

Eas

t

Tran

spon

der

ch 8

WTr

ansp

onde

r ch

8E

Tran

spon

der

ch 7

WTr

ansp

onde

r ch

7E

Tran

spon

der

ch 6

WTr

ansp

onde

r ch

6E

Tran

spon

der

ch 5

WTr

ansp

onde

r ch

5E

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Figure 117. 16 channels OADM with supervision and without expansion

Page 195: 1696 Technical V2.2

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right

s re

serv

ed. P

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this

docu

men

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e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

193

01

/3AL 95278 AA AA

390

390

3.2.2.3.6 16 channels OADM with supervision and expansion

xx stands for the band used: L2, S1, S2.

yy stands for the band used: L2, S1, S2.

yy can be different from xx.

SP

V m

anag

enem

ent (

opt)

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

HK

FANS49

OM

DX

8100

_M_L

1_X

S

PSC

PSC

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

FANS49

OM

DX

8100

_M_x

x–E

ast

LAN

LAN

OM

DX

8100

_M_y

y_E

ast

RAI

RAI

UIC

UIC

E

quip

men

t She

lf C

ontr

olle

rE

quip

men

t She

lf C

ontr

olle

r (S

C)

Tran

spon

der

ch 3

8Tr

ansp

onde

r ch

38

Tran

spon

der

ch 3

7Tr

ansp

onde

r ch

37

Tran

spon

der

ch 3

6Tr

ansp

onde

r ch

36

Tran

spon

der

ch 3

5Tr

ansp

onde

r ch

35

Tran

spon

der

ch 3

3Tr

ansp

onde

r ch

33

Tran

spon

der

ch 3

2Tr

ansp

onde

r ch

32

Tran

spon

der

ch 3

1Tr

ansp

onde

r ch

31

Tran

spon

der

ch 3

0Tr

ansp

onde

r ch

30

OM

DX

8100

_M_L

1_X

S

Tran

spon

der

ch 8

WTr

ansp

onde

r ch

8E

Tran

spon

der

ch 7

WTr

ansp

onde

r ch

7E

Tran

spon

der

ch 6

WTr

ansp

onde

r ch

6E

Tran

spon

der

ch 5

WTr

ansp

onde

r ch

5E

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Figure 118. 16 channels OADM with supervision and expansion

Page 196: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

pyin

g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

194

01

/3AL 95278 AA AA

390

390

3.2.2.3.7 32 channels OADM/back–to–back terminals

Herebelow is shown a 32 channels back–to–back configuration with the optical protection of each channel,supervision and amplification. In this configuration is there one OAC on west side and one OAC on eastside.

4 shelves are needed for this configuration.

In protected configuration, the OPCs have to be plugged under the MAIN transponder

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 1011 12 1314 15 16 171819 20 2122 23 24

25 26 27 28 29 30 3132 33 3435 36 3738 39 40 414243 44 4546 47 48HK

FANS49

OM

DX

8100

_M_L

1_X

S

OM

DX

8100

_M_L

1_X

S

Equ

ipm

ent S

helf

Con

trol

ler

SP

V m

anag

enem

ent

(opt

)

Tran

spon

der

ch 3

8Tr

ansp

onde

r ch

38

Tran

spon

der

ch 3

7Tr

ansp

onde

r ch

37

Tran

spon

der

ch 3

6Tr

ansp

onde

r ch

36

Tran

spon

der

ch 3

5Tr

ansp

onde

r ch

35

Tran

spon

der

ch 3

3Tr

ansp

onde

r ch

33

Tran

spon

der

ch 3

2Tr

ansp

onde

r ch

32

Tran

spon

der

ch 3

1Tr

ansp

onde

r ch

31

Tran

spon

der

ch 3

0Tr

ansp

onde

r ch

30

LAN

RAI

UIC

UIC

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 1011 12 1314 15 16 171819 20 2122 23 24

25 26 27 28 29 30 3132 33 3435 36 3738 39 40 414243 44 4546 47 48

FANS49

OM

DX

8100

_M_S

2

OM

DX

8100

_M_S

2

ES

C (

SC

)

Tran

spon

der

ch 5

0Tr

ansp

onde

r ch

50

Tran

spon

der

ch 4

9Tr

ansp

onde

r ch

49

Tran

spon

der

ch 4

8Tr

ansp

onde

r ch

48

Tran

spon

der

ch 4

7Tr

ansp

onde

r ch

47

Tran

spon

der

ch 4

5Tr

ansp

onde

r ch

45

Tran

spon

der

ch 4

4Tr

ansp

onde

r ch

44

Tran

spon

der

ch 4

3Tr

ansp

onde

r ch

43

Tran

spon

der

ch 4

2Tr

ansp

onde

r ch

42

LAN

RAI

UIC

UIC

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 1011 12 1314 15 16 171819 20 2122 23 24

25 26 27 28 29 30 3132 33 3435 36 3738 39 40 414243 44 4546 47 48

FANS49

OM

DX

8100

_M_L

2

OM

DX

8100

_M_L

2

ES

C (

SC

)

Tran

spon

der

ch 2

8Tr

ansp

onde

r ch

28

Tran

spon

der

ch 2

7Tr

ansp

onde

r ch

27

Tran

spon

der

ch 2

6Tr

ansp

onde

r ch

26

Tran

spon

der

ch 2

5Tr

ansp

onde

r ch

25

Tran

spon

der

ch 2

3Tr

ansp

onde

r ch

23

Tran

spon

der

ch 2

2Tr

ansp

onde

r ch

22

Tran

spon

der

ch 2

1Tr

ansp

onde

r ch

21

Tran

spon

der

ch 2

0Tr

ansp

onde

r ch

20

LAN

RAI

UIC

UIC

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 1011 12 1314 15 16 171819 20 2122 23 24

25 26 27 28 29 30 3132 33 3435 36 3738 39 40 414243 44 4546 47 48

FANS49

OM

DX

8100

_M_S

1

OM

DX

8100

_M_S

1

ES

C (

SC

)

Tran

spon

der

ch 6

0Tr

ansp

onde

r ch

60

Tran

spon

der

ch 5

9Tr

ansp

onde

r ch

59

Tran

spon

der

ch 5

8Tr

ansp

onde

r ch

58

Tran

spon

der

ch 5

7Tr

ansp

onde

r ch

57

Tran

spon

der

ch 5

5Tr

ansp

onde

r ch

55

Tran

spon

der

ch 5

4Tr

ansp

onde

r ch

54

Tran

spon

der

ch 5

3Tr

ansp

onde

r ch

53

Tran

spon

der

ch 5

2Tr

ansp

onde

r ch

52

LAN

RAI

UIC

UIC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OA

CO

AC

Figure 119. 32 protected channels back–to–back with supervision and one OAC per side

Page 197: 1696 Technical V2.2

All

right

s re

serv

ed. P

assi

ng o

n an

d co

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g of

this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

195

01

/3AL 95278 AA AA

390

390

3.2.2.4 Repeater with supervision

DWDM

Line

OSC SPVM OSC

Preamp

Preamp Booster

Booster

OAC1 OAC2OSC

extractionOSC

insertion

OSCextraction

VOA

VOA

OSCinsertion

DWDM

Line

Attenuatoror DCU

Attenuatoror DCU

SP

V m

anag

enem

ent (

opt)

PSC

PSC

LAN

25 26 27 28 29 30 31

HK

FANS49

RAI

OA

CO

AC

Equ

ipm

ent S

helf

Con

trol

ler

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Figure 120. Repeater with supervision

Page 198: 1696 Technical V2.2

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serv

ed. P

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n an

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this

docu

men

t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

196

01

/3AL 95278 AA AA

390

390

3.2.2.5 Configurations with MVAC

MVAC boards can be used for three main applications:

– channel loop power adjustement

– band pass–through power adjustement• extra–loop• expansion–loop

– power adjustment of external colored wavelengths.

MVAC card can also be used for post emphsys of MCC2, MCC3.

The default configuration depends on the configuration.

Please refer to the installation handboook for card location in the shelf, according to the application.

Page 199: 1696 Technical V2.2

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ed. P

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t, us

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mm

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n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

197

01

/3AL 95278 AA AA

390

390

3.2.2.6 4 x ANY node configuration

Without drawers protection

ES

C

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48UI

UI

HK

RA

FANS49

LAN I

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

Figure 121. 4 x ANY node without drawers protection configuration

With drawers protection

ES

C

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48UI

UI

HK

RA

FANS49I

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

4 x

AN

Y

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

OPC

Figure 122. 4 x ANY node with drawers protection configuration

OPC location for drawers protection– drawer 1: 31, 35, 39, 43– drawer 2: 30, 34, 38, 42– drawer 3: 28, 32, 40, 44– drawer 4: 29, 33, 41, 45.4xANY boards can be partially protected (drawers 3 & 4 for the 1st couple, drawers 1 & 2 for the 2nd couple).

Page 200: 1696 Technical V2.2

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its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

198

01

/3AL 95278 AA AA

390

390

3.2.3 1696 MS_C (Compact Shelf) configurations examples

The 1696MS_C must be able to set many different configurations

– Terminals• up to 12 unprotected channels Line terminal (with/without supervision)• up to 8 channels Line terminal with OAC (with/without supervision)

– Back–to–back terminals or OADM with/without protection• up to 4 channels back–to–back terminal or OADM• asymmetrical configurations are allowed (i.e. 2 channels west and 1 channel east)

– CPE (Customer Premises Equipment) configurations

These configurations are preferably exploited with a 1696MS_C but they can be implementedin a 1696MS, too.

• Remote 4xAny (unprotected)• Remote 4xAny + Protection MCC on 1310 nm or 1550 nm• Remote MCC or MCC+4xANY• OADM 1 channel with or without protection• Remote 4xANY + MCC• One protected transponder (one signal on 2 channels)• Back–to–back 4xANY• SPV manager (used to connect a SH Manager to supervise the ring).• 2–channel terminal: MCC + 4xANY with drawers protection

– 1696MS or 1696MS_C configured to connect a CPE or a 1696MS_C in a small ring• 1696MS or1696MS_C receiving/emitting a supervised black–and–white signal• 1696MS or 1696MS_C receiving/emitting a supervised colored signal• 1696MS or 1696MS connected to a 1696MS_C located in a small ring• 1696MS as a remotization

– Two 1696MS or 1696MS_C rings connected together• With supervision through optical link (DCC)• With supervision through electrical link (LAN_Q)

Some of these configurations are described hereafter.

N.B. All configurations using a 4 x ANY board are also available with the 4 x ANY_S and 4 x ANY_P.

Page 201: 1696 Technical V2.2

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its

cont

ents

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erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

199

01

/3AL 95278 AA AA

390

390

3.2.3.1 Examples of Line Terminal configurations

3.2.3.1.1 8–channel terminal with SPV and OAC

OMDX8100_M_L1_XS

F A

N _

C

PSC(2)

PSC(2)LAN_Q

ESC

HK

OAC / OAC_L (optional)OAC / OAC_L (optional)

RAI

I–Link_M

7

8

9

10

11

12

1

2

3

5

6

13

F A

N _

C

PSC2

PSC2

I–Link_S

Transponder ch 1Transponder ch 2

7

8

9

10

11

12

1

2

3

4

5

6

13

F A

N _

C

PSC2

PSC2

7

8

9

10

11

12

1

2

3

4

5

6

13

8 channels

OSC in

OSC out

OMDX8100_M_L1_XS

LB

LB

SB

SB

30

38

30

38

DMU

MUX

X

DMU

MUX

X

OAC OAC

MCC /

8

OCC10 OFA OFA

EXP

8 clientsignals

UNUSED

UNUSED

L2UNUSED

L2UNUSED

OFA OFA

Transponder ch 4Transponder ch 3

Transponder ch 8

I–Link_S

Transponder ch 7

Transponder ch 5Transponder ch 6

SPVM4

Figure 123. 8–channel terminal with SPV and OAC

Page 202: 1696 Technical V2.2

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serv

ed. P

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n an

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this

docu

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t, us

e an

d co

mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

200

01

/3AL 95278 AA AA

390

390

3.2.3.1.2 12 unprotected channels terminal without SPV

12 channels

OSC in

OSC out

OADM8100_L1_X

LB

LB

SB

SB

1

4

30

38

30

38

1

4

DMU

MUX

X

DMU

MUX

X

OADM4100_M_chx–y_S

DMU

MUX

X

OAC OAC

MCC /4

OCC10

MCC /

8

OCC10

OFA

OFA

OFA

OFA

EXP

4 clientsignals

8 clientsignals

UNUSED

UNUSED

Transponder ch 33

F A

N _

C

PSC(2)

PSC(2)LAN_Q

ESC

HKTransponder ch 32

Transponder ch 30Transponder ch 31

RAI

7

8

9

10

11

12

1

2

3

4

5

13

F A

N _

C

PSC2

PSC2

I–Link_S

Transponder ch 35Transponder ch 36

7

8

9

10

11

12

1

2

3

4

5

6

13

F A

N _

C

PSC2

PSC2

7

8

9

10

11

12

1

2

3

4

5

6

13

Transponder ch 38Transponder ch 37

Transponder ch 4

I–Link_S

Transponder ch 3

Transponder ch 1Transponder ch 2

OADM4100_M_chx–y_S

I–Link_M6

OADM8100_L1_X

Figure 124. 12–channel terminal without SPV

Page 203: 1696 Technical V2.2

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right

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serv

ed. P

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mm

unic

atio

n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

201

01

/3AL 95278 AA AA

390

390

3.2.3.2 OADM 4 channels protected back–to–back with supervision and OAC

Mx/DMx 4ch

DMU

MUX

X

MUX

DMUX

n channels

WEST EAST

OADM4100_M_chx–y_S OADM4100_M_chx–y_S

n–4 ch

n–4 channels

4 add & drop protected client signals

OPC

MCC /

4 x

OCC10

MCC /

4 x

OCC10

OSC out

OAC

OSC in

OFA

Mx/DMx 4ch

OFA

n channels

OFA

OSC out

OFA

OSC in

OAC

OPC OPCOPC

OADM4100_M_chx–y_S

F A

N _

C

PSC(2)

PSC(2)

LAN_Q

ESC

HKSPVM

OAC / OAC_L (opt)OAC / OAC_L (opt)

RAI

7

8

9

10

11

12

1

2

3

4

5

13

F A

N _

C

PSC2

PSC2

I–Link_S

Transponder ch 1 ETransponder ch 1 W

7

8

9

10

11

12

1

2

3

4

5

6

13

F A

N _

C

PSC2

PSC2

7

8

9

10

11

12

1

2

3

4

5

6

13

Transponder ch 2 WTransponder ch 2 E

Transponder ch 4 W

I–Link_S

Transponder ch 4 E

Transponder ch 3 ETransponder ch 3 W

I–Link_M6

OADM4100_M_chx–y_S

OPC

OPC

OPC

OPC

Figure 125. OADM 4 channels protected back–to–back with supervision and OAC

Page 204: 1696 Technical V2.2

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mm

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n of

its

cont

ents

not p

erm

itted

with

out w

ritte

n au

thor

izat

ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

202

01

/3AL 95278 AA AA

390

390

3.2.3.3 CPE (Customer Premises Equipment) configurations

3.2.3.3.1 Remote 4xANY

In this case, OADM is not needed since the data signal is carried by a ”Black & white” 1310 nm wavelength.The OSC is extracted to/from the 1310 nm data signal on a special 1310/1510 filter SPV_F_C card. OSCis managed by the SPVM board.

F A

N _

C

PSC

PSC

LAN_Q

SPV_F_C

HKRAI

SPVM

4xANY

SPVM

4xAN

Y

UI

UICPE

SPV_F_C

1310 nm

1310 nm

OSC1510 nm

1310

Equipment Shelf Controller

to/from

SPVM

4xANY

SPVF

SPVF

MCC

SPVMSPVM

MCC

UI

1310 nm

1550 nm

1310 nm

1696MS

1696MS_C1696MSPAN

Figure 126. Remote 4xANY

N.B. All configurations using a 4 x ANY board are also available with the 4 x ANY_S and 4 x ANY_P.

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ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

203

01

/3AL 95278 AA AA

390

390

3.2.3.3.2 Remote MCC or MCC+4xANY wihtout protection

The situation is the same with or without the 4xANY board : the signal transmitted from the CPE to the1696MS in a core ring or in a point–to–point configuration is colored and carries a 1510 nm OSC.

The Remote MCC is connected to the Metro ring via one MCC or directly from the WDM path. This configu-ration allows a greater Span Budget.

MC

CSPVM

4xAN

Y

UI

UICPE

SPV_F–C

Colored signal

F A

N _

C

PSC

PSC

LAN_Q

SPV_F_C

HKRAI

SPVM

4xANY

MCC

1550

Equipment Shelf Controller

OSC1510 nm

SPVM

4xANY

SPVF

SPVF

MCC

SPVMSPVM

MCC

UI

1310 nm

1550 nm

1310 nm

1696MS

1696MS_C

MCC

1550 nm

Figure 127. Remote MCC or MCC+4xANY

Page 206: 1696 Technical V2.2

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

204

01

/3AL 95278 AA AA

390

390

3.2.3.3.3 Remote 4xANY plus MCC

In this configuration, the CPE supports 2 data channels, one from the 4xANY board (B&W), and one fromthe MCC (colored). The SPV_F_1310_1550 enables to insert/extract them with an OSC. Thus the fibercarries 3 wavelengths : 1510 (OSC), 15xx (MCC) and 1310 (4xANY).

F A

N _

C

PSC

PSC LAN_Q

HKRAI

SPVM

4xANY

MCC

MC

CMCC+4xANY

4xAN

Y

UI

UI

CPE

SPV_F

1310_1550

SPV_F_1310_1550

Equipment Shelf Controller

SPVM

SPV_F

1550 nmSPVM

MCC

UI

OSC

1696MS_C

4xANY

UI

1310 nm

1550 nm + 1310 nm + OSC

1310+1550

Figure 128. Unprotected remote MCC or MCC+4xANY

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with

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ritte

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ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

205

01

/3AL 95278 AA AA

390

390

3.2.3.3.4 One protected transponder

In this configuration OPC card is used to protect transponder cards. The same signal is launched into thefiber on two different wavelengths. This configuration is used in a point–to–point link.

F A

N _

C

PSC

PSC LAN_Q

HKRAISPVM

MCC /OCC10 spare

MCC/OCC10 main

MC

C/O

CC

10

SPVM

MC

C/O

CC

10

User

To/from CPE

Not from 1696 ring

CPE

OPC

OPC interface

User interface

OPC

SPVM must be set in slot 4 of the master shelf when it is linked to OADM board

Equipment Shelf Controller

OADM1100_M_xx_S

MCC/OCC10MCC/OCC10

SPVM

OADM1

User

OPC

1696MS_C

One protected transponder on the same fiber (2 wavelengths) with OADM 2–channel

Figure 129. One protected transponderon the same fiber (2 channel wavelengths)

In this case an OADM is needed to multiplex the main signal and the spare in one fiber if only one fiberis used. When two fibers are available, the main and spare signals do not need to be launched in the samefiber, and they also do not need to have different wavelengths.

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ritte

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thor

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ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

206

01

/3AL 95278 AA AA

390

390

3.2.3.3.5 Back–to–back 4xANY

This configuration is designed to drop/(insert) some of the 4 services carried by the 4XANY functionality.The others are by–passed to a second 4XANY board to be launched to their destination. In the followingfigure, 2 services are dropped (inserted) and 2 are passed–through.

N.B. Less than 4 services can be carried.

4xANY

SPVM

4xAN

Y

UI

UI

CPE

4xAN

Y

4xANY

SPV_F_C

SPV_F_C

F A

N _

C

PSC

PSC LAN_Q

SPV_F_C

HKSPVM

4xANY

4xANY

SPV_F_C

Equipment Shelf Controller

SPVM

Figure 130. Back–to–back 4XANY intended to drop some of the carried services and by–pass the oth-ers.

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ritte

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

207

01

/3AL 95278 AA AA

390

390

3.2.3.3.6 Remote unprotected MCC

Transp1550 nm 1696MS

OADM

OADM

SPVM

SPVF

SPVM

SPVM

SPVF

Transponder

1696MS_C

1550 nm + OSC

OSC

4 ch West

Transp

4 ch East

ch.2E

Transp

Transp

SP

VM

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

UI

UI

HK

RA

FANS49

OA

DM

4 c

h. W

est

I

OA

DM

4 c

h. E

ast

SP

VM

SPV

F A

N _

C

PSC

PSC

LAN_Q

SPV_F_C

HKRAI

SPVM

Transponder ch 2E

45:SPV Filter

Equipment Shelf Controller

Equ

ipm

ent S

helf

Con

trol

ler

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

W

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

3E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

Figure 131. Remote unprotected MCC

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

208

01

/3AL 95278 AA AA

390

390

3.2.3.3.7 1 protected channel OADM

OADM1ch+OSC E

F A

N _

C

PSC

PSC LAN_Q

ESC

OPCHKSPVM

Transponder E

Transponder W

RAIOADM1ch+OSC W

TransponderTransponder

1310 nm

1550 nm

1696MS_C

SPVM

OADM1 OADM1

User

OPC

Figure 132. OADM 1 channel protected

3.2.3.3.8 Remote 4xANY+ Protected MCC

The remote 4xANY + protected MCC is the combination with the 2 MCC protected at each other with anOPC on different NE, and use of the 4xANY on the User side.

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ritte

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

209

01

/3AL 95278 AA AA

390

390

MCCMCC

1550 nm1696MS

OADM OADM

SPVM

SPVF

SPVM

MCC

1550 nm1696MS

OADM OADM

SPVM

SPVF

SPVM

SPVM

4xANY

SPVF

UI

MCC

1696MS_C

1310 nm

MCC

OPC

SPVF

1310 nm on WDM side

Figure 133. Remote Spur 4xANY + protected MCC on 1310 nm

MCC

1550 nm1696MS

OADM OADM

SPVM

SPVF

SPVM

1550 nm

1696MS

OADM

OADM

SPVM

SPVF

SPVM

SPVM

4xANY

SPVF

UI

MCC

1696MS_C

1310 nm

MCC

OPC

SPVF

1550 on WDM side

1550 nm + OSC

OSC

1550 nm + OSC

Figure 134. Remote Spur 4xANY + protected MCC on 1550 nm

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

210

01

/3AL 95278 AA AA

390

390

3.2.3.3.9 2–channel Line Terminal

The line Terminal 2 Channels use OADM 2 in order to deliver 2 different channels.

OADM2

SPVM

MCC/OCC10MCC/OCC10

UI UI

λλ 21

OSC

1696MS_C

OADM1ch+OSC E

F A

N _

C

PSC

PSC LAN_Q

ESC

SPVM

Transponder E

Transponder W

Figure 135. 2 channels Line Terminal

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Alc

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.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

211

01

/3AL 95278 AA AA

390

390

3.2.3.3.10 Remote CPE, 2–channel terminal: MCC + 4xANY with drawers protection

OADM2100_M_chx–y_S

F A

N _

C

PSC(2)

PSC(2)LAN_Q

ESC

HK

MCC ch1MCC ch2

RAI

I–Link_M

7

8

9

10

11

12

1

2

3

5

6

13

F A

N _

C

PSC2

PSC2I–Link_S

4xANY

7

8

9

10

11

12

1

2

3

4

5

6

13

2 channels

OSC in

OSC out

OADM2100_M_chx–y_S

ch1

ch2

ch1

ch2

DMU

MUX

X

SPVM

MCC

4xANY

SPVM4

OPC

Tx

Rx

Rx

Rx

Rx

Rx

Tx

Tx

Tx

Tx

4xANY

Tx

Rx

Rx

Rx

Rx

Rx

Tx

Tx

Tx

Tx

4xANY

OPC

OPC

OPC MCC

ch1

ch2

OPC #4OPC #3OPC #1OPC #2

#1

#2

#3

#4

#1

#1

#2

#2

#3

#3

#4

#4

Figure 136. Remote CPE, 2–channel terminal: MCC + 4xANY with drawers protection

Page 214: 1696 Technical V2.2

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

212

01

/3AL 95278 AA AA

390

390

3.2.3.3.11 SPV manager

The SPV manager is used only when the customer want to connect a SH Manager to supervise the ring.

1696MS_C

F A

N _

C

PSC

PSC LAN_Q

ESC

SPVM SPV_F_C

SPV_F_C

SPVM

SPV_F_CSPV_F_C

LAN_Q

SH

1550 nm + OSC 1550 nm + OSC

OADM OADM

N.B. In this configuration two OADM boards must be provisionned by the software even ifthey are not needed for the Hardware function. Then the associated alarm (RUM) willraise on the craft Equiment even if the working is normal.

Figure 137. SPV Manager

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from

Alc

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.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

213

01

/3AL 95278 AA AA

390

390

3.2.4 1696MS configured to connect a CPE

In this paragraph, we describe the configuration of 1696MS in a core ring, host of a link to a distant CPE.In current release two data signals plus OSC can be managed as such a one fiber link (1310 nm, 1550nm or 1310+1550 nm).

3.2.4.1 1696MS receiving/emitting a supervised B&W signal

This situation is the same as a customer signal arriving on a B&W port of 1696MS, except that the incomingsignal carries the OSC which has to be extracted/inserted in the 1696MS.

OMDX or OADM OMDX or OADM

SPVMSPVM

To/From

To 1696 WDMring

To 1696ringWDM

Transp

on

der

1696MS

1310 nm 1310 nm

CPE

OPC

SPV_F

Transp

on

der

Black & White signal

SP

VM

In this configuration the 1696MS node has to support 3 Optical Supervisory Channels (2 x SPVM boardsneeded).

Figure 138. 1696MS connected to a CPE through a supervised black–and–white signal

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ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

214

01

/3AL 95278 AA AA

390

390

3.2.4.2 1696MS receiving a supervised colored signal

In this configuration, the signal coming from the CPE is plugged on the User Interfaced of the 1696MS.In this case the signal from the 1696MS to the CPE is carried by a 1310 nm wavelength, and the contrapro-pagative signal is carried by a 1550 nm wavelength.The optical budget is then limited by the Black and White span optical budget.

3.2.4.2.1 Protected signal in the ring

The signal coming from the CPE is launched in both directions in the 1696MS ring (East and West).In this case, the 1696MS node has to support 3 Optical Supervisory Channels (2 SPVM boards are need-ed).

OMDX or OADM OMDX or OADM

SPVMSPVM

To/From CPE

To 1696 WDMring

To 1696ringWDM

Transp

on

der

Transp

on

der

1696MS

1310 nm1550 nm

SPV_F_1550

OPC

SP

VM

Figure 139. 1696MS connected to a CPE through a supervised black–and–white and colored signaland protected in the ring

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from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

215

01

/3AL 95278 AA AA

390

390

3.2.4.2.2 Unprotected signal in the ring

In this case the signal coming from the CPE is launched only on one side of the ring.

In this configuration the 1696MS node has to support 3 Optical Supervisory Channels (2 SPVM boardsneeded).

OMDX or OADM OMDX or OADM

SPVM SPVMTo 1696 WDM

ringTo 1696

ringWDM

Transp

on

der

1696MS

1310 nm1550 nm

or 1310 nm

To/FromCPE

SP

VM

Figure 140. 1696MS connected to a CPE through a supervised black–and–white and colored signaland unprotected in the ring

Page 218: 1696 Technical V2.2

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with

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ritte

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ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

216

01

/3AL 95278 AA AA

390

390

3.2.4.3 1696MS as a ”remotization”

In this configuration one channel is demultiplexed and the other one is sent directly to the CPE withoutMCC using.

3.2.4.3.1 Without OSC

OMDX or OADM OMDX or OADM

SPVMSPVM

To/From CPE

To 1696 WDMring

To 1696ringWDM

1696MS

Figure 141. Optical channel optically passed through the NE without being regenerated.

3.2.4.3.2 With OSC

OMDX or OADM OMDX or OADM

SPVM SPVM

SP

VM

To/From CPE

To 1696 WDMring

To 1696ringWDM

1696MS SPV_F SPV_F

Figure 142. Optical channel optically passed through the NE without being regenerated and with OSCinsertion.

When the optical budget is available, this configuration can be used to reach a CPE. In this case, the1696MS node has to support 3 OSC channels and then 2 SPVM boards are needed.

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ritte

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ion

from

Alc

atel

.

ED

1AA

000

14 0

004

(900

7) A

4 –

ALI

CE

04.

10

217

01

/3AL 95278 AA AA

390

390

3.2.5 Two 1696MS or 1696MS_C rings connected together

It is possible to make two 1696MS rings (made up of 1696MS and/or 1696MS_C) communicate. It is notnecessary that both communicating nodes are located on the same spot. User interfaces are intercon-nected (data transmission), and the OSC is launched on one 1310 nm black and white signal from onering to the other through two SPV_F_C boards (one on each ring).

SP

V m

anag

enem

ent (

opt)

PSC

PSC

LAN

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48

UI

UI

HK

RA

FANS49

OA

DM

4 c

h. W

est

I

OA

DM

4 c

h. E

ast

Hal

f SP

VM

Boa

rd

F A

N _

CPSC

PSC

LAN_Q

SPV_F_COPCRAI

SPVM

OADM1

Transponder

Transponder ch. 3E

(1550 nm)

SPV

28: SPV Filter

Equ

ipm

ent S

helf

Con

trol

ler

Equipment Shelf Controller

Tran

spon

der

ch 4

WTr

ansp

onde

r ch

4E

Tran

spon

der

ch 3

W

Tran

spon

der

ch 2

WTr

ansp

onde

r ch

2E

Tran

spon

der

ch 1

WTr

ansp

onde

r ch

1E

Figure 143. Interconnection of two rings with a 1696MS and a 1696MS_C

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Supervision through optical link (DCC)

It is possible to make two 1696MS Rings communicate (made up of 1696MS and/or 1696MS_C). Boththe communicating nodes are not necessary to be located on the same spot. User interfaces are intercon-nected (data transmission), and the OSC is launched on one 1310 nm black–and–white signal from onering to the other through two SPV_F_C boards (one on each ring). Protection is provided for remote MCC Boards of both rings with OPC boards. This protection type allows two failures at a time, one in each ring.

OMDX or OADM 1ch OMDX or OADM 1ch

SPVMSPVM

To 1696 WDMring

To 1696ringWDM

MC

C/O

CC

10

MC

C/O

CC

10

SPVM

User interfaces

OADM 1 channel +OSC

SPVM SPVM To 1696 WDMring

To 1696ringWDM

MC

C/O

CC

10

MC

C/O

CC

10

Pass–Through

OADM 1 channel +OSC

SPVM

SPVM

User interfaces

1696MS_C

1696MS

OPC

OPC

SPV_F_C

SPV_F_C

Figure 144. Two 1696MS rings connected together through user interfaces.

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Supervision through electrical link (LAN_Q)

The supervision is transmitted from one ring to the other through the LAN_Q boards. This avoid to haveone SPVM in the 1696MS shelf and one in the MS_C shelf.

OMDX or OADM 1ch OMDX or OADM 1ch

SPVMSPVM

To 1696 WDMring

To 1696ringWDM

MC

C/O

CC

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C/O

CC

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OADM 1 channel +OSC

SPVMSPVM

To 1696 WDMring

To 1696ringWDM

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10

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C/O

CC

10

Pass–Through

OADM 1 channel +OSC

SPVM

LAN_Q

LAN_QUser interfaces

1696MS_C

1696MS

Figure 145. Two 1696MS rings connected together through user interfaces.

The transponders shown in the figure are not protecting each other, but only transmitting the signal theyreceive. In this configuration both NEs located in the same spot are necessary because of the electricallink length.

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4 UNITS DESCRIPTION

This chapter describes the cards and units of the 1696 Metro Span for this release. It gives for each carda functional diagram, description and interfaces definition.

4.1 Tributaries

4.1.1 Multirate Channel Card I (MCC1)

B1

inputClient

Client

output

inputWDM

WDMoutput

to/fromcorrespondingtransponder

to/fromcorrespondingtransponder

non intrusivemonitoring

2.5 – 2.66 Gb/s back–panel electrical links

User Rx

WDM Rx

User Tx

WDM Tx

Alarm & Controlunit

8 x 8 MATRIX

(optional)

(optional)

to/fromfuture matrix

copy 1

to/fromfuture matrix

copy 0

Figure 146. Block diagram of the MCC1 boards

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4.1.1.1 Description

The MCC1 unit is a bidirectional multi–clock interface. The block–diagram is shown on Figure 146.

The receivers (WDM and user) are 2R. Two multi bit–rate clock–selectable CDR (Clock and Data Recov-ery) units are used so that the MCC is globally 3R for some bit-rates between 100 Mbit/s to 2.5 Gbit/s(155Mbit/s - 622Mbit/s - 1.06Gbit/s - 1.25Gbit/s - 2.5Gbit/s).

The electrical matrix gives some flexibility and additives features:

• drop / Insert with or without Optical–SNCP• electrical pass–through• internal (local) loop–back• line (remote) loop–back• line (remote) loop–back drop–insert• user loop–back• user loop–back pass–through• possibility to broadcast either the user or the WDM signal to the B1 monitoring unit

The alarm and control unit ensures the following functions:• matrix management interface• Clock and Data Recovery (CDR) units management (bit rate selection, pass–through,...)• alarms collection and interface to the craft terminal via the shelf controller• Optical Channel protection control (configuration, switch decision unit) if Optical–SNCP

(O–SNCP): user Tx ON/OFF control• safety procedure management (ALS_WDM).

In OCh protection scheme, each MCC transfers its alarms information to the corresponding one (the MCCjust beside) via parallel back–panel links in order that each one is able to select the unfailed signal.

Each MCC unit is characterized by its particular Tx WDM wavelength (2 wavelengths are selectable sothat one shall be chosen before being able to perform a mismatch).

On the MCC, the set of channels are written on the card support.

Two EEPROM contain both the remote inventory data (construction date, code number, maker number,board identification...) and the set of channels the card support. These information are sent to the ESCboard by means of the SPI bus.

4.1.1.2 Optical characteristics

See para. 5.3.1.1 on page 331.

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4.1.1.3 Optical safety

Alcatel recommends the customers to preset:

– the “APSD enable” mode for all the transponders in terminating nodes– the “APSD disable” mode for all the transponders in regeneration.

Optical safety, fault localization and protection criteria are based on the LOS alarm only.

How does it work?

– ILOS at user Rx input implies a consecutive LOC at WDM or user Tx input and the SD of the WDMTx.

– ILOS at WDM Rx input implies the shutdown of the WDM Tx and the start of the ALS mechanism (ifavailable). A consecutive LOC will appear at user Tx input and this interface will be shut down. Torestart, the WDM Tx will send restart pulses.Shutdown time is defined to be less than (or equal to) 10 ms.

4.1.1.4 MCC cross–connection configurations

On the following schemes, are presented the two adjacent MCCs and the MCC matrix configurations. TheHF back–panel links shown in the following drawings are those between the slots 4&5, 6&7, 8&9, 10&11,14&15, 16&17, 18&19, 20&21.

4.1.1.4.1 Default configuration

By default, both optical transmitters are OFF, the 8x8 matrix has no connection.

After software configuration, the way of working will be one of the following.

WDM Tx

WDM Rx

back–panelconnections

MCC West

Rx

Tx

WDM Tx

WDM Rx

MCC East

8 x 8

Rx

8 x 8Matrix

Tx

Figure 147. MCC in default configuration

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4.1.1.4.2 Drop / Insert without optical channel protection

The MCC can accept this configuration in terminals, back–to–back terminals, and OADM nodes.The two adjacent boards have an independent configuration (one can be in drop–insert, the other one canbe unequipped, in drop/insert configuration, or in local loop–back mode).

Rx

Tx

WDM Tx

WDM Rx

back–panelconnections

MCC West

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

MCC East

8 x 8

Figure 148. Drop / Insert without Optical–SNCP (identical 8x8 matrix configuration)

Table 19. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

ILOS (LOC)* – SD of the WDM Tx

ILOS (LOC)* – shutdown of the WDM Tx laser (same board)and beginning of the ALS_WDM procedure (ifALS enabled)

– shutdown of the user Tx

(LOC)* concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

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4.1.1.4.3 Drop / Insert with Optical channel protection

The MCC can accept this configuration in terminals, back–to–back terminals, and OADM nodes.The two adjacent boards have the same matrix configuration and must be placed in the two adjacent slots4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19 or 20&21 because of Low Frequency links used to passinformation between them.

Rx

Tx

WDM Tx

WDM Rx

MCC West MCC East

8 x 8Matrix

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

Figure 149. Drop / Insert with Optical–SNCP (identical 8x8 matrix configuration)

Table 20. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

ILOS (LOC)* – shutdown of the WDM Tx

ILOS (LOC)* – shutdown of the WDM Tx laser (same board)and beginning of the ALS_WDM procedure (ifALS enabled)

– shutdown of the user Tx– protection action: activation of the protecting

user Tx laser

(LOC)* concerns the LOC alarms consecutive to the ILOS one when the bit–rate is managed by theCDR

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4.1.1.4.4 Electrical pass–through

The MCC can accept this configuration in back–to–back terminals or OADM nodes for flexibility and/orto enable a regeneration of the signal. The user interfaces are not used and this board do not manage theprotection.

WDM Tx

WDM Rx WDM Tx

WDM Rx

Tx

RxTx

Rx

back–panelconnections

MCC West MCC East

optionalinterfaces

8 x 8 8 x 8

Figure 150. Pass–Through

Table 21. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

inhibited inhibited LOC* – no action

ILOS inhibited inhibited (LOC)* – shutdown of the WDM Tx laser (same board)and beginning of the ALS_WDM procedure (ifALS enable)

– ShutDown of the WDM Tx on the adjacentboard

(LOC)* concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

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4.1.1.4.4.1 Master board

The board is refered to as master because its user interfaces are those used and it is this board that man-ages the protection.

Table 22. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

ILOS (LOC)** – SD of the WDM Tx

ILOS (LOC)** – shutdown of the WDM Tx laser (same board)and begining of the ALS_WDM procedure (ifALS enable)

– protection action

LOC* for the bit–rates managed by the CDR(LOC)** concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

4.1.1.4.4.2 Slave board

The user interfaces are not used and this board does not manage the protection.

Table 23. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

inhibited inhibited LOC* – no action

ILOS inhibited inhibited – shutdown of the WDM Tx laser (same board)and begining of the ALS_WDM procedure (ifALS enable)

– transmission of the alarm to the master board(for protection control)

LOC* for the bit–rates managed by the CDR(LOC)** concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

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4.1.1.5 Loop–back

4.1.1.5.1 Local loop–backThis configuration is used for tests only.

Rx

Tx Rx

Tx

WDM Tx

WDM Rx WDM Tx

WDM Rx

back–panelconnections

MCC West MCC East

8 x 88 x 8

Figure 151. Local Loop–Back

The two adjacent board have an independant configuration (one can be in local loop–back, the other onecan be unequipped, in drop/insert configuration, or in local loop–back mode).As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

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4.1.1.5.2 Remote loop–back drop–insert

This configuration is used for tests only.

Rx

Tx Rx

Tx

WDM Tx

WDM TxWDM Rx

WDM Rx

back–panelconnections

MCC ”loop–in” MCC ”loop–out”

8 x 88 x 8

Figure 152. Remote Loop–Back in ring application (back–to–back or OADM)

The two adjacent boards are linked and have a different configuration so that the operator must set theMCC to work in ”loop–in” or ”loop–out” mode.As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

4.1.1.5.3 User loop–back

This configuration is used for tests only.

Rx

Tx Rx

Tx

WDM Tx

WDM Rx WDM Tx

WDM Rx

back–panelconnections

MCC West MCC East

8 x 88 x 8

Figure 153. User Loop–Back

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The two adjacent board have an independant configuration (one can be in local loop–back, the other onecan be unequipped, in drop/insert configuration, or in local loop–back mode).As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

4.1.1.5.4 User loop–back & pass–through

This configuration is used for tests only.

WDM Tx

WDM Rx WDM Tx

WDM Rx

Tx

RxTx

Rx

back–panelconnections

MCC ”loop–in” MCC ”loop–out”

8 x 8 8 x 8

Figure 154. User Loop–Back & pass–through

The two adjacent boards are linked and have a different configuration so that the operator must set theMCC to work in ”loop–in” or ”loop–out” mode.As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

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4.1.1.5.5 Remote loop–back

This configuration is used for tests only.

Rx

Tx

WDM Tx

WDM Rx

back–panelconnections

MCC West

8 x 8

Rx

Tx

WDM Tx

WDM Rx

MCC East

8 x 8

Figure 155. Remote Loop–Back in ring application (back–to–back or OADM)

The two adjacent board have an independant configuration (one can be in local loop–back, the other onecan be unequipped, in drop/insert configuration, or in local loop–back mode).As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

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4.1.1.6 Protection management

In Optical SNCP, if the master MCC (master for protection control) is in failure (Hardware failure, boardabsent,...), the selected path is automatically the protecting one. By this way, when the board in failure isretrieved, there is no impact on the traffic.

At the creation of the protection function, the operator define one main and one spare channel.

The switch criteria and ways of control are the followings:– software locked protection on the main channel– software forced selection of the spare channel– ILOS at WDM Rx access on the current working channel and no alarm on the protecting one nor Hard-

Ware Failure on the board.

The software forcing has the highest priority level. The manual switch has a lower priority level than thealarms on the signals.

A clear function allows, via software, to re–initialize the protection board (clear all the switches com-mands), and a lockout of protection function gives the possibility to block the switch in the main position(whatever the status of the signals). The priority order for the switch criteria is the following (from the high-est to the lowest):– lockout of protection– software forcing– automatic switching

Total switching time < 50 ms.

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4.1.2 Multirate Channel Card II (MCC2)

B1

inputClient

Client

output

inputWDM

WDMoutput

to/fromcorrespondingtransponder

to/from

corresponding

transponder

non intrusivemonitoring

2.5 – 2.66 Gb/s back–panel electrical links

User Rx

WDM Rx

User Tx

WDM Tx

Alarm & Controlunit

8 x 8 MATRIX

(optional)

(optional)

VOA

OPL

OpticalReceiver

OOPV

to/fromfuture matrix

copy 1

to/fromfuture matrix

copy 0

Figure 156. Block diagram of the MCC2 unit

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4.1.2.1 Description

The MCC2 transponder unit is a bidirectional multi–clock interface. The block–diagram is shown onFigure 156.

All the signals are 3R.

The board is configured for application with optical amplifiers.

In the Craft Terminal, the operator can select bit rate by :– selecting it in a list– entering its exact value

A Variable Optical Attenuator (VOA) is inserted after the WDM Tx. The operator monitors the VOA bychoosing a VOA value.

In addition to the optical interfaces (user Rx and Tx, WDM Rx and Tx), an electrical matrix, a B1 perfor-mance monitoring unit and an alarm and control unit are present on the board.

The B1 performance monitoring unit enables the operator to achieve PM on B1 in a non intrusive way onSDH/SONET signals either at user Rx side, or at WDM Rx side (selection made by software provisioning).

The electrical matrix gives some flexibility and additives features:

• drop / Insert with or without Optical–SNCP• electrical pass–through• internal (local) loop–back• line (remote) loop–back• line (remote) loop–back drop–insert• user loop–back• user loop–back pass–through• possibility to broadcast either the user or the WDM signal to the B1 monitoring unit

This matrix is managed by the craft terminal via the SPI interface and the alarm and control unit.

The alarm and control unit ensures a few functions:• matrix management interface• Clock and Data Recovery (CDR) units management (bit rate selection, pass–through,...• B1 device management• alarms collection and interface to the craft terminal via the shelf controller• Optical Channel protection control (configuration, switch decision unit)

– if optical–SNCP: user Tx ON/OFF control• safety procedure management (ALS_WDM, ...)

In OCh protection scheme, each transponder transfers its alarms information to the corresponding one(the transponder just beside) via parallel back–panel links in order that each one is able to select the un-failed signal.

Each transponder unit is characterized by its particular Tx WDM wavelength (2 wavelengths are selectableso that one shall be chosen before being able to perform a mismatch).

Two EEPROMs contain both the remote inventory data (construction date, code number, maker number,board identification...) and the set of channels the card support. These information are sent to the ESCboard by means of the SPI bus.

On the MCC, the set of channels are written on the card support.

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4.1.2.2 Optical characteristics

See para. 5.3.1.1 on page 331.

4.1.2.3 Optical safety

Alcatel recommends the customers to preset:

– the “APSD enable” mode for all the transponders in terminating nodes– the “APSD disable” mode for all the transponders in regeneration.

Two types of alarms are available for optical safety / fault localization / protection criteria:– LOC: Loss Of Clock. Alarm detected by the CDR modules, before Tx inputs for all bit rates between

100 Mbit/s and 2.66 Gbit/s.– ILOS: Input Loss Of signal. Alarm detected by the Rx modules as a low power.

Way of working 1st case :

– ILOS at user Rx input implies a consecutive LOC at WDM or user Tx input and the SD of the WDMTx.

– LOC at WDM Tx input (signal coming either from the user Rx or the WDM Rx) implies the SD of theWDM Tx.

– ILOS at WDM Rx input implies the shutdown of the WDM Tx and the start of the ALS mechanism (ifavailable & enable). A consecutive LOC will appear at user Tx input and this interface will be shut-down. To restart, the WDM Tx will send restart pulses.Shutdown time is defined to be less than (or equal to) 10 ms.

– LOC at user Tx input (signal coming from WDM world) implies shutdown of the user Tx laser andprotection mechanism (if available).

N.B. During the switch on and the switch off time, the output power remains between λ ITU ± 500 pm.

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4.1.2.4 MCC2 configurations

On the following schemes, are presented the two adjacent transponders and the transponder matrix con-figurations. The HF back–panel links shown in the following drawings are those between the slots 4&5,6&7, 8&9, 10&11, 14&15, 16&17, 18&19, 20&21.

4.1.2.4.1 Default configuration

By default, both optical transmitters are OFF, the 8x8 matrix has no connection.

The board is on APSD disable state.

After software configuration, the way of working will be one of the following.

WDM Tx

WDM Rx

back–panelconnections

MCC West

Rx

Tx

WDM Tx

WDM Rx

MCC East

8 x 8

Rx

8 x 8Matrix

Tx

Figure 157. MCC2 in default configuration

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4.1.2.4.2 Drop / Insert without optical channel protection

The transponder can accept this configuration in terminals, back–to–back terminals, and OADM nodes.The two adjacent boards have an independent configuration (one can be in drop–insert, the other one canbe unequipped, in drop/insert configuration, or in local loop–back mode).

Rx

Tx

WDM Tx

WDM Rx

back–panelconnections

MCC West

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

MCC East

8 x 8

Figure 158. Drop / Insert without Optical–SNCP (identical 8x8 matrix configuration)

Table 24. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

ILOS (LOC)** – ShutDown of the WDM Tx

ILOS (LOC)** – shutdown of the WDM Tx laser (same board)and beginning of the ALS_WDM procedure ifALS enable

– ShutDown of the user Tx– activation of the protecting user Tx laser if

protection activated

LOC* – shutdown of the user Tx laser– activation of the protecting user Tx laser if

protection activated

LOC* – shutdown of the WDM Tx laser

LOC* for the bit–rates managed by the CDR(LOC)** concerns the LOC alarms consecutive to the ILOS one.

N.B. If WDM Tx is Forced ON, shut–down of the WDM Tx does not occur.

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4.1.2.4.3 Drop / Insert with optical channel protection

The transponder can accept this configuration in terminals, back–to–back terminals, and OADM nodes.The two adjacent boards have the same matrix configuration and must be placed in the two adjacent slots4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19 or 20&21 because of Low Frequency links used to passinformation between them.

Rx

Tx

WDM Tx

WDM Rx

MCC West MCC East

8 x 8Matrix

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

Figure 159. Drop / Insert with Optical–SNCP (identical 8x8 matrix configuration)

Table 25. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

ILOS (LOC)** – ShutDown of the WDM Tx

ILOS (LOC)** – shutdown of the WDM Tx laser (same board)and beginning of the ALS_WDM procedure ifALS enable

– ShutDown of the user Tx– activation of the protecting user Tx laser if

protection activated

LOC* – shutdown of the user Tx laser– activation of the protecting user Tx laser if

protection activated

LOC* – shutdown of the WDM Tx laser

LOC* for the bit–rates managed by the CDR(LOC)** concerns the LOC alarms consecutive to the ILOS one.

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4.1.2.4.4 Electrical Pass–through (regeneration configuration)

The MCC2 can accept this configuration in back–to–back terminals or OADM nodes for flexibility and/orto enable a regeneration of the signal. The user interfaces are not used and this board do not manage theprotection. The two adjacent boards have the same matrix configuration and must be placed in the two adjacent slots4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19 or 20&21 because of Low Frequency links used to passinformation between them.

WDM Tx

WDM Rx WDM Tx

WDM Rx

Tx

Rx

back–panelconnections

MCC West MCC East

8 x 8 8 x 8

Tx

Rx optionalinterfaces

Figure 160. Pass–through (regeneration configuration)

Table 26. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

inhibited inhibited LOC* – no action

ILOS inhibited inhibited (LOC)* – shutdown of the WDM Tx laser (same board)and beginning of the ALS_WDM procedure (ifALS enable)

– ShutDown of the WDM Tx on the adjacentboard

(LOC)* concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

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4.1.2.4.4.1 Master board

The board is refered to as master because its user interfaces are those used and it is this board that man-ages the protection.

Table 27. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

ILOS (LOC)** – SD of the WDM Tx

ILOS (LOC)** – shutdown of the WDM Tx laser (same board)and begining of the ALS_WDM procedure (ifALS enable)

– protection action

LOC* for the bit–rates managed by the CDR(LOC)** concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

4.1.2.4.4.2 Slave board

The user interfaces are not used and this board does not manage the protection.

Table 28. Summary of the way of working in case of ILOS and LOC

alarms consecutive action

WDM Rx user Tx user Rx WDM Tx

inhibited inhibited LOC* – no action

ILOS inhibited inhibited – shutdown of the WDM Tx laser (same board)and begining of the ALS_WDM procedure (ifALS enable)

– transmission of the alarm to the master board(for protection control)

LOC* for the bit–rates managed by the CDR(LOC)** concerns the LOC alarms consecutive to the ILOS one in when the bit–rate is managed by theCDR

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4.1.2.5 Loop–back

4.1.2.5.1 Local loop–back

This configuration is used for tests only.

Rx

Tx Rx

Tx

WDM Tx

WDM Rx WDM Tx

WDM Rx

back–panelconnections

MCC West MCC East

8 x 88 x 8

Figure 161. Local Loop–Back

The two adjacent board have an independant configuration (one can be in local loop–back, the other onecan be unequipped, in drop/insert configuration, or in local loop–back mode).As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

4.1.2.5.2 Remote loop–back drop–insert

This configuration is used for tests only.

Rx

Tx Rx

Tx

WDM Tx

WDM TxWDM Rx

WDM Rx

back–panelconnections

MCC ”loop–in” MCC ”loop–out”

8 x 88 x 8

Figure 162. Remote Loop–Back in ring application (back–to–back or OADM)

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The two adjacent boards are linked and have a different configuration so that the operator must set theMCC to work in ”loop–in” or ”loop–out” mode.As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

4.1.2.5.3 User loop–back

This configuration is used for tests only.

Rx

Tx Rx

Tx

WDM Tx

WDM Rx WDM Tx

WDM Rx

back–panelconnections

MCC West MCC East

8 x 88 x 8

Figure 163. User Loop–Back

The two adjacent board have an independant configuration (one can be in local loop–back, the other onecan be unequipped, in drop/insert configuration, or in local loop–back mode).As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

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4.1.2.5.4 User loop–back & pass–through

This configuration is used for tests only.

WDM Tx

WDM Rx WDM Tx

WDM Rx

Tx

RxTx

Rx

back–panelconnections

MCC ”loop–in” MCC ”loop–out”

8 x 8 8 x 8

Figure 164. User Loop–Back & pass–through

The two adjacent boards are linked and have a different configuration so that the operator must set theMCC to work in ”loop–in” or ”loop–out” mode.As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

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4.1.2.5.5 Remote loop–back

This configuration is used for tests only.

Rx

Tx

WDM Tx

WDM Rx

back–panelconnections

MCC West

8 x 8

Rx

Tx

WDM Tx

WDM Rx

MCC East

8 x 8

Figure 165. Remote Loop–Back in ring application (back–to–back or OADM)

The two adjacent board have an independant configuration (one can be in local loop–back, the other onecan be unequipped, in drop/insert configuration, or in local loop–back mode).As this configuration is used for tests, the alarm management is controlled by the operator (he should lookat all the alarms and activate or inhibit the ALS_WDM procedure).

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4.1.2.6 Laser and VOA status

The next table gives the default state of the lasers and VOA according to the configuration of the MCC3.The default configuration is APSD_Disable.

Table 29. MCC2 default Lasers and VOA states

MCC3 configuration WDM Tx laser VOA WDM Tx User Tx laser

Plugged not declared OFF 20 dB OFF

Declared but no cross–connection OFF 20 dB OFF

Cross–conn declared but no signal OFF 20 dB OFF

Cross–connection + signal according to configuration according to configuration

4.1.2.7 Protection management

In Optical SNCP, if the master MCC (master for protection control) is in failure (Hardware failure, Card ab-sent,...), the selected path is automatically the protecting one. By this way, when the board in failure is re-trieved, there is no impact on the traffic.

At the creation of the protection function, the operator defines one main and one spare channel.

The switch criteria and ways of control are the followings:– software locked protection on main channel– software forced selection of spare channel– ILOS (on WDM Rx) or LOC (on user Tx for the available bit–rates) on the current working channel

and no alarm on the protecting one– software manual selection of spare channel (forced selection only if no degradation of this spare sig-

nal)

The software forcing is highest priority. The manual switch is less priority than the alarms on the signals.

The priority order for the switch criteria is the following (from the highest to the lowest):– lockout of protection– software forcing– automatic switching

When a software command (lockout or software forcing) is released (clear function), the switch remainsin its current position to avoid the useless switches.

Total switching time < 50 ms.

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4.1.3 Multirate Channel Card III (MCC3)

inputWDM

to/fromadjacent

board

2.5 – 2.66 Gb/s back–panel electrical links

WDM Rx

Alarm &

FPGA

outputWDM

WDM TxVOA

Pinamp

OOPV

2x2

2x2

ControlUnit

US

ER

Tx

US

ER

Rx

to/fromcorrespondingtransponder

inputClient

outputClient

N.B. links from Control Unit to components have been greyed for clarity)

STM–16, GBE, FC,CWDM SFP module

STM–1, STM–4,

Figure 166. Block diagram of the MCC3 unit

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4.1.3.1 Description

The MCC3 transponder unit is a bidirectional multi–clock interface. The block–diagram is shown inFigure 166.

All the signals are 3R.

The board is configured for application with optical amplifiers.

MCC3 is built on the model of the MCC2 board. It is a MCC2 with a SFP Pluggable module in place ofRx–Tx USER Interface. This feature permits to have S–16.1, I–16.1, CWDM ... type optical interfaces. Italso enables to have Bitrate specific optical Interfaces (Gigabit Ethernet, ...).Small Formfactor Pluggable modules are optical transceivers enabling the building of a transponder boardwith a client oriented User Interface.The following SFP modules are supported by the MCC3 board (the complete list is shown in Table 8. onpage 76 and in Figure 47. on page 118):– CWDM Silver/Bronze: 8 CWDM colored modules with APD detector (bitrates = 125 Mb/s 2.7 Gb/s)– I–16.1 / S–16.1 / : STM–16 Inter–office reach / Short reach at 1310 nm– MS–16.1: S–16.1 multi–rate up to 2.66Gb/s at 1310 nm– S–4.1 / S–1.1: STM–4 / STM–1 short reach at 1310 nm– GbE–SX / Gbe–LX: Gigabit Ethernet at 850 nm / 1310 nm– 2FC / FC–S / FC–L: 2 Fiber Channel (2.125 GHz) / Fiber Channel at 850 nm / 1310 nm

In the Craft Terminal, the operator can select the bit rate by– selecting it in a list– entering its exact value

Concerning WDM optics, the MCC3 board is equipped with a 3200 ps/nm WDM Tx.The WDM Rx supports 19 dB OSNR at EOL.

A Variable Optical Attenuator (VOA) is inserted after the WDM Tx. The operator monitors the VOA bychoosing a VOA value.

In addition to the optical interfaces an electrical matrix, an alarm and control unit and a FPGA devoted toB1–based performance monitoring and G.709 optical layer management are present on the board.

The FPGA / PM block enables the operator to achieve PM based on B1 in a non intrusive way on SDH/SO-NET signals either at user Rx side, or at WDM Rx side (selection made by software provisioning). Usersignal is monitored after the 8x8 electrical matrix whereas the line signal is monitored before the matrix.

The electrical matrix gives some flexibility and additives features:

• Drop / Insert with or without Optical–SNCP• Electrical pass–through• internal (local) loop–back• line (remote) loop–back• line (remote) loop–back drop–insert• user loop–back• user loop–back pass–through• possibility to broadcast either the user or the WDM signal to the B1 monitoring unit

This matrix is managed by the craft terminal via the SPI interface and the alarm and control unit.

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The alarm and control unit ensures a few functions:• matrix management interface• Clock and Data Recovery (CDR) units management (bit rate selection, pass–through,...• B1 device management• alarms collection and interface to the craft terminal via the shelf controller• Optical Channel protection control (configuration, switch decision unit)

– if optical–SNCP: user Tx ON/OFF control• safety procedure management (ALS_WDM, ...)

In OCh protection scheme, each transponder transfers its alarms information to the corresponding one(the transponder just beside) via parallel back–panel links in order that each one is able to select the un-failed signal.

Each transponder unit is characterized by its particular Tx WDM wavelength (2 wavelengths are selectableso that one shall be chosen before being able to perform a mismatch).

Two EEPROMs contain both the remote inventory data (construction date, code number, maker number,board identification...) and the set of channels the card support. These information are sent to the ESCboard by means of the SPI bus.

On the MCC, the set of channels are written on the card support.

4.1.3.2 Optical characteristics

See para. 5.3.1.1 on page 331.

4.1.3.3 Optical safety

Alcatel recommends the customers to preset:

– the “APSD enable” mode for all the transponders in terminating nodes– the “APSD disable” mode for all the transponders in regeneration.

Two types of alarms are available for optical safety / fault localization / protection criteria:– LOC: Loss Of Clock. Alarm detected by the CDR modules, before Tx inputs for all bit rates between

100 Mbit/s and 2.66 Gbit/s.– ILOS: Input Loss Of signal. Alarm detected by the Rx modules as a low power.

Way of working 1st case :

– ILOS at user Rx input implies a consecutive LOC at WDM or user Tx input and the SD of the WDMTx.

– LOC at WDM Tx input (signal coming either from the user Rx or the WDM Rx) implies the SD of theWDM Tx.

– ILOS at WDM Rx input implies the shutdown of the WDM Tx and the start of the ALS mechanism (ifavailable & enable). A consecutive LOC will appear at user Tx input and this interface will be shut-down. To restart, the WDM Tx will send restart pulses.Shutdown time is defined to be less than (or equal to) 10 ms.

– LOC at user Tx input (signal coming from WDM world) implies shutdown of the user Tx laser andprotection mechanism (if available).

N.B. During the switch on and the switch off time, the output power remains between λ ITU ± 500 pm.

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4.1.3.4 MCC3 configurations

Refer to para. 4.1.2.4 on page 236

4.1.3.4.1 Default configuration (no cross–connection)

Refer to para. 4.1.2.4.1 on page 236.

4.1.3.4.2 Drop / Insert (with and without optical channel protection)

Refer to para 4.1.2.4.2 on page 237 and para. 4.1.2.4.3 on page 238.

4.1.3.4.3 Electrical pass–through, with/without SPF client interface (regeneration config)

Refer to para 4.1.2.4.4 on page 239.

When two transponders are configured in pass–through, there is no need of User Interfaces, hence theuser interface (SFP modules) in MCC3 can be equipped or not. In case it is not equipped, neither alarms nor measurements should be shown to the operator.

4.1.3.4.4 Loop–backs

Refer to para. 4.1.2.5 on page 241 where are described the following loop–backs:– local loop–back– remote loop–back and drop/insert– user loop–back– user loop–back and pass–through– remote loop–back.

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4.1.3.5 Laser and VOA status

Refer to para. 4.1.2.6 on page 245.

4.1.3.6 Protection management

In Optical SNCP, if the master MCC (master for protection control) is in failure (Hardware failure, Card ab-sent,...), the selected path is automatically the protecting one. By this way, when the board in failure is re-trieved, there is no impact on the traffic.

At the creation of the protection function, the operator defines one main and one spare channel.

The switch criteria and ways of control are the followings:– software locked protection on main channel– software forced selection of spare channel– ILOS (on WDM Rx) or LOC (on user Tx for the available bit–rates) on the current working channel

and no alarm on the protecting one– software manual selection of spare channel (forced selection only if no degradation of this spare sig-

nal)– SFP removed (missing)

The software forcing is highest priority. The manual switch is less priority than the alarms on the signals.

The priority order for the switch criteria is the following (from the highest to the lowest):– lockout of protection– software forcing– automatic switching

When a software command (lockout or software forcing) is released (clear function), the switch remainsin its current position to avoid the useless switches.

Total switching time < 50 ms.

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4.1.4 MCC_RGN

The MCC_RGN board is the same physical board as the MCC2 one without the client optical interfaces(no B&W optics).

It is used in pair in pass–through mode only to form a regenerator.

It is managed on the Q3 interface as a MCC2 and provides the same features (refer to para. 4.1.2), exceptfor the client interfaces.

Due to the missing client optical interfaces, no add–drop configuration is possible, no user nor local loop-backs, no protection...

This board is a legacy card strictly dedicated to pass–through configurations.

The same functionality is provided with two MCC3 without SFP client interfaces and used in pass–throughconfiguration. When the pass–through configuration is required, MCC3 should be used.

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4.1.5 10 Gbps Optical Channel Card (OCC10)

Client input

9.95328 Gbps

User

8 x 8 MATRIX

Client

RxUserTx

Client output

WDMTx

VOA

Photo–diode

WDM output

WDMRx

VOA

Photo–diode

WDM input

some functionalitiescan be short–cut

to/from Matrix 1

WDM

10.709 Gbps

G.709,

CDR CDR

to/fr

om fr

ont p

anel

con

nect

ors

10 Gbps input

10 Gbps output Bac

k pa

nel

FEC, PM

G.709,

FEC, PM

10.3125 Gbps

11.096 Gbps

Figure 167. OCC10 unit block diagram

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4.1.5.1 Description

The OCC10 unit transponder is a bidirectional multi–clock interface for 10 Gbps native signals. It is hard-ware compliant with ITU–T G.709 Rec.

This transponder can be provisioned to accept any digital signal at the nominal bit rate of– 9.953 Gbps (STM–64/OC–192/10 GBE WAN)– 10.3125 (GBE LAN).

All the signals are 3R.

The board is configured for application with optical amplifiers.

Two Variable Optical Attenuators (VOAs) are present on the board: one is inserted after the WDM Tx andthe other one is placed before the WDM Rx in order to maintain the power constant at the Rx input. By O.S. (CT, 1353SH) the operator can set (and monitor) the WDM Tx VOA value.

In addition to the optical interfaces (user Rx and Tx, WDM Rx and Tx), an electrical matrix and an alarmand control unit are present on the board.

The B1 performance monitoring unit enables the operator to achieve PM on B1 in a non intrusive way onSDH/SONET signals at user Rx side and at WDM Rx side simultaneously.

The electrical matrix is managed by the craft terminal via the SPI bus and the Alarm and control unit; itgives some flexibility and additives features:

• drop / Insert with or without Optical–SNCP• electrical pass–through• internal (local) loop–back• line (remote) loop–back• line (remote) loop–back drop–insert• user loop–back• user loop–back pass–through• possibility to broadcast either the user or the WDM signal to the B1 monitoring unit

The alarm and control unit performs the following functions:• matrix management interface• Clock and Data recovery (CDR) units management (bit rate selection, pass–through..)• alarms collection and interface to the craft terminal via the shelf controller• optical channel protection control (configuration, switch decision unit)

– if Optical SNCP: user Tx ON/OFF control• safety procedure management (ALS).

In OCh protection scheme, each transponder transfers its alarms information to the corresponding one (thetransponder just beside) via parallel back–panel links in order that each one is able to select the unfailed signal.Each transponder unit is characterized by its particular Tx WDM wavelength. The channel/wavelength is written on the card support.The card mismatch is managed via information (ECID) contained in an EEPROM present on the board.The Remote Inventory of the module is available via the SPI bus.The EEPROM containing specific data of the board is accessed via the SPI bus.The O/E/O regeneration for OCC10 is– supported by connecting the client interfaces (general). Mandatory with a 2.5 Gbps backpanel– supported via 10 Gbps backpanel links (requires 3AL96270AA–– CO shelf).On the front panel of the OCC10 are located four electrical connectors allowing pass–through configura-tion even with back panel not 10 Gbps compatible (for future rel.).

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4.1.5.2 OCC10 optical characteristics

See para. 5.3.1.2 on page 333.

4.1.5.3 Optical safety

In case of upstream error (fiber break, transponder failure,...) a mechanism that enables to propagate akind of FDI along the trail is proposed (allowing for optical safety / fault localization / protection criteria):– LOC: Loss Of Clock. Alarm detected by the CDR modules, before Tx inputs for the 9953.28 Gbps

bit rate.– LOS: Loss Of Signal. Alarm detected by the Rx modules as a low power.– generic AIS detection.

If the protection is activated, only the shut–down mode is authorized.This mechanism is independant from safety procedure. The next table sums up different OCC10 beha-viour according to safety + LOS + LOC + generic AIS propagation command.

Table 30. OCC10 Shut down mode

Node Type OCC10 stateBehaviour

Node Type OCC10 stateAlarm Consecutive action

APSD enable – –

LOS on User Rx SD of WDM Tx

APSD disableLOS on WDM Rx SD of User Tx

a ) Line TerminalAPSD disable

LOC on User Tx SD of User Txa ) Line Terminalb ) Add & Drop in LOC on WDM Tx SD of WDM Txb ) Add & Drop in

OADM orback–to–back APSD disable

WDM Tx always ONOADM orback–to–backnode

APSD disableforced ON

LOS on WDM Rx SD of User Txnode forced ON

LOC on User Tx SD of User Tx

APSD disableWDM Tx always OFF

APSD disableforced OFF

LOS on WDM Rx SD of User Txforced OFF

LOC on User Tx SD of User Tx

Example of way of working for ADD & DROP with APSD Disable:

– ILOS at user Rx input implies the SD of WDM Tx– LOC at WDM Tx input (signal coming either from user Rx or WDM Rx) implies SD of WDM Tx– ILOS at WDM Rx input implies the shutdown of the WDM Tx and the start of the ALS mechanism (if

available & enable). A consecutive LOC will appear at user Tx input and this interface will be shut-down. To restart, the WDM Tx will send restart pulses.Shutdown time is defined to be less than (or equal to) 5 ms.

– LOC at user Tx input (signal coming from WDM world) implies shutdown of the user Tx laser andprotection mechanism (if available).

N.B. During the switch on and the switch off time, the output power remains between λ ITU ± 500 pm.

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4.1.5.4 OCC10 configurations

On the following schemes, are presented the two adjacent transponders and the transponder matrix con-figurations. The HF back–panel links shown in the following drawings are those between the slots 4&5,6&7, 8&9, 10&11, 14&15, 16&17, 18&19, 20&21.

Table 31. OCC10 configurations

Configuration type UNI NNI

Client bit rate (Gbps) 9.95328 / 10.3125 10.709 / 11.096

Drop–insert YES Future rel.

Optical SNCP YES Future rel.

Pass–through Not Applicable YES

Remote loopback pass–through (IN and OUT) Not Applicable YES

Remote loopback drop/insert YES Future rel.

Remote loopback Not Applicable YES

Local loopback YES Future rel.

User loopback YES Future rel.

In the following tables the alarms which are not shown or not applicable are alarms with potentially conse-quent actions but not displayed to the craft user.Notice that “_User” is used for B&W link or back panel link.

The switch criteria are described in the protection para. 3.1.9 on page 169.

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4.1.5.4.1 Default configuration

By default, both optical transmitters are OFF, the 8x8 matrix has no connection.After software configuration, the way of working will be one of the following.

4.1.5.4.2 Drop / Insert without optical channel protection

The transponder can accept this configuration in terminals, back–to–back terminals, and OADM nodes.The two adjacent boards have an independent configuration (one can be in drop–insert, the other one canbe unequipped, in drop/insert configuration, or in local loop–back mode).

Rx

Tx

WDM Tx

WDM Rx

back–panelconnections

OCC10 West

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

8 x 8

OCC10 East

Figure 168. Drop / Insert without Optical–SNCP (identical 8x8 matrix configuration)

For User to Network Interface (UNI) both ODU and OTU are terminated at the WDM interfaces.

B&W

WDM

9953.28 Gbps

8 x 8Matrix

O/EB&WO/E

OD

U

OT

U

FEC

OD

U

OT

U

DEFEC

O/E

WDMO/E

10.709 Gbps

OT

U

DEFEC

OT

U

FEC

ODU

OTU

Figure 169. Drop–insert (UNI)

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4.1.5.4.3 Drop / Insert with optical channel protection

The transponder can accept this configuration in terminals, back–to–back terminals, and OADM nodes.The two adjacent boards have the same matrix configuration and must be placed in the two adjacent slots4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19 or 20&21 because of Low Frequency links used to passinformation between them.

Rx

Tx

WDM Tx

WDM Rx

OCC10 West OCC10 East

8 x 8Matrix

8 x 8Matrix

Rx

Tx

WDM Tx

WDM Rx

Figure 170. Drop / Insert with Optical–SNCP (identical 8x8 matrix configuration)

4.1.5.4.4 Electrical pass–through

The transponder can accept this configuration in back–to–back terminals or OADM nodes for flexibilityand/or to enable a regeneration of the signal. The user interfaces are not used and this board do not man-age the protection.

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Rx

Rx

Tx

WDM Tx

WDM Rx

front panel (future rel.)OCC10 West OCC10 East

8 x 88 x 8

Tx

WDM Tx

WDM Rx

back–panel10 Gbps

front panel (future rel.)

OR

OR

OR

OR

Figure 171. Pass–through (NNI)

For the regeneration configuration, OTU is terminated at the WDM interfaces and ODU is bypassed. Adummy OTU is sent through the matrix

WDM

8 x 8Matrix

OD

U

OT

U

FEC

OD

U

OT

U

DEFEC

O/E

WDMO/E

10.709 Gbps

OT

U

DEFEC

OT

U

FEC

ODU

OTU

OR

OR

WDM

8 x 8Matrix

OD

U

OT

U

FEC

OD

U

OT

U

DEFEC

O/E

WDMO/E

10.709 Gbps

OT

U

DEFEC

OT

U

FEC

OR

OR

OTUDummy OTU

10 G

bp

s B

P

Front Panel (future rel.)

Front Panel (future rel.)Board 1 Board 2

Figure 172. Regeneration (two pass–through linked by 10G backpanel)

The Dummy OTU does not correspond to a real transmission section: it is used to monitor the matricesconnections.

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4.1.5.4.5 Remote loop–back

When the board is configured in loopback the RXA and TXA LEDs, located on its front plate, arealways turned OFF.

4.1.5.4.5.1 Pass–through remote loop–back

This configuration is used for tests only.

Rx

Rx

Tx

WDM Tx

WDM Rx

OCC10 West OCC10 East

8 x 88 x 8

Tx

WDM Tx

WDM Rx

back–panel10 Gbps

front panel (future rel.)

OR OR

Table 32. Remote Loop–Back pass–through (NNI) in ring application (back–to–back or OADM)

The two adjacent boards are linked and have a different configuration so that the operator must set theOCC10 to work in loop–in or loop–out mode.

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4.1.5.4.5.2 Drop–insert remote loop–back

Rx

Tx Rx

Tx

WDM Tx

WDM TxWDM Rx

WDM Rx

back–panelconnections

OCC10 West OCC10 East

8 x 88 x 8

Figure 173. Drop–insert remote loop–back (UNI) in ring application (back–to–back or OADM)

This configuration is used for tests only. The two adjacent boards have an independent configuration (one canbe in loop–back, the other one can be unequipped, in drop–insert configuration or in local loop–back mode).

4.1.5.4.5.3 Remote loop–back

Rx

Rx

Tx

WDM Tx

WDM TxWDM Rx

WDM Rx

back–panelconnections

OCC10 West OCC10 East

8 x 88 x 8

Tx

Table 33. Remote loop–back (NNI) in ring application (back–to–back or OADM)

This configuration is used for tests only. The two adjacent boards have an independent configuration (one canbe in loop–back, the other one can be unequipped, in drop–insert configuration or in local loop–back mode).

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4.1.5.4.6 Local loop–back

4.1.5.4.6.1 Local loop–back

Tx Rx

Tx

WDM Tx

WDM Rx WDM Tx

WDM Rx

back–panelconnections

OCC10 West OCC10 East

8 x 88 x 8

Rx

Figure 174. Local Loop–Back (UNI)

This configuration is used for tests only. The two adjacent boards have an independent configuration (one canbe in local loop–back, the other one can be unequipped, in drop/insert configuration, or in local loop–backmode).

4.1.5.4.7 User loop–back (UNI): foreseen for Hardware and Software.

Rx

Tx Rx

Tx

WDM Rx WDM Tx

WDM Rx

back–panelconnections

OCC10 West OCC10 East

8 x 88 x 8

WDM Tx

Figure 175. User Loop–Back (UNI)

This configuration is used for tests only. The two adjacent boards have an independent configuration (onecan be in local loop–back, the other one can be unequipped, in drop/insert configuration, or in local loop–back mode).

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4.1.5.5 Laser and VOA status

The next table gives the default state of the lasers and VOA according to the configuration of the OCC10.The default configuration is APSD_Disable and LOS_mode_SD.

Table 34. OCC10 default Lasers and VOA states

OCC10 configuration WDM Tx laser VOA WDM Tx User Tx laser

Plugged not declared OFF 20 dB OFF

Declared but no cross–connection OFF 20 dB OFF

Cross–conn declared but no signal OFF 20 dB OFF

Cross–connection + signal according to configuration according to configuration

4.1.5.6 Protection management

In Optical SNCP, as for MCC, if the master OCC (master for protection control) is in failure (Hardware fail-ure, Card absent,...), the selected path is automatically the protecting one. By this way, when the boardin failure is retrieved, there is no impact on the traffic.

At the creation of the protection function, the operator defines one main and one spare channel.

The switch criteria and ways of control are the followings:– software locked protection on main channel– software forced selection of spare channel– ILOS (on WDM Rx) or LOC (on user Tx) on the current working channel and no alarm on the protect-

ing one– software manual selection of spare channel (forced selection only if no degradation of this spare sig-

nal)

The software lockout of protection is the highest priority.

The priority order for the switch criteria is the following (from the highest to the lowest):– lockout of protection– software forcing– automatic switching

When a software command (lockout or software forcing) is released (clear function), the switch remainsin its current position to avoid useless switches.

Total switching time < 50 ms.

An example of optical protection is given in Figure 170. on page 257.

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4.1.6 4xANY, 4xANY_S and 4xANY_P cards

4.1.6.1 Description

TDM concentrators are able to multiplex in the time domain up to 4 ”low bit–rate” (”client”) signals into a2.5 Gbps B&W WDM signal. The multiplexed client signals are listed below:

• 4 x Fast Ethernet• 4 x FDDI• 4 x ESCON• 4 x Digital Video• 4 x STM1• 3 x STM4• 2 x Gigabit Ethernet• 2 x Fiber Channel or FICON• some mixes are also possible:

– 3 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4– 2 x (FDDI or FE or DV or ESCON or STM1) + 2 x STM4– 2 x (FDDI or FE or DV or ESCON or STM1) + 1 x (FC or GbEth or FICON)– 1 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4 +1 x (FC or GbEth or FICON)– 2 x (FC or GbEth or FICON).

The following type of boards are provided:

– the 4xANY board with an I–16.1 optical port for the 2.5 Gbit/s, is available from release 1.1. It allowsto cover a 2 Km distance approx

– the 4xANY_S board with a S–16.1 optical port for the 2.5 Gbit/s, is available from release 1.3. It al-lows to cover a 15 Km distance approx. This functionality enables to use a 4XANY board without theneed of a transponder to have the necessary optical budget to launch the 1310 nm signal on the fiber.It is then possible to use a 4XANY_S board alone in a 1696MS_C (for example) thus emitting onlyone 1310 nm wavelength.

– the 4xANY_P board with a pluggable 2.5 Gbit/s optical module, hosting a I–16.1 B&W or S–16.1 B&Wor CWDM (Bronze/Silver) transceiver (transmitter + receiver) has been introduced in R.2.0. Thetransceiver is included into a SFP module. The CWDM wavelenght range is 1470 1610 nm andonly one wavelength per module is accessible.

The architecture of the TDM concentrator board is based on the concept of virtual concatenation, and onthe mapping of SDH on OTN:

• the data traffic is packet into VC–4 structures virtually concatenated. Virtually concatenatedmeans that any VC–4 can follow an indpendent path crossing any SDH/SONET network (in-cluded legacy ADM). Each VC4 is then concatenated again in the remote 4xANY.

• the VC–4s are groomed into a STM–16 structure.

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In Figure 176. on page 265 is shown the block diagram.

The board is divided into:• one mother board• one daughter board• 1 to 4 (client) drawers plugged on the mother or daughter board (2 on each one).• a 1310 nm B&W transceiver for 4xAny and 4xANY_S• a 1310 nm B&W or CWDM pluggable transceiver for 4xANY_P only.

The board consists essentially in:• 4 slots for bi–directional client optical interfaces• One 2.5 Gbit/s transceiver

The 4xANY, 4xANY_S, 4xANY_P unit interfaces with the MCC board via the 2.5 Gbit/s transceiver.

Receivers and transmitters can be locked either on the received clock or the local clock:• Default configuration : Tx locked to local clock and Rx locked to the received clock.• Loop–back configuration. LoopBack and Continue managed.

From R.2.2 the B1 performance monitoring is enabled consisting in monitoring the B1 byte of the aggre-gate signal received (WDM Rx).It is also provided the 4xANY 1+1 protection consisting in protecting each client individually.

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to/fromcorresponding

transponder2.5 G

b/s

drawer #1

Alarm & Controlunit

CO

NC

EN

TR

AT

OR S

TM

–16 map

per

Rx

Tx

drawer #3

Rx

Tx

Rx

Tx

drawer #2

Rx

Tx

drawer #4

Rx

Tx

E/OST

M–16 R

egen

erator

Clientsignal

Clientsignal

Clientsignal

Clientsignal

STM–16

CDR

CDR

CDR

CDR

SFP pluggable modulefor 4xANY_P

2Cardpresence

Figure 176. 4xANY, 4xANY_S, 4xANY_P block diagram

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Configuration

Client side, three different kinds of drawers are provided:• high frequency 1310 nm optical interfaces drawers (Gigabit Ethernet, Fiber Channel), which

can be plugged only on the ports #3 et #4 (HF_1310_DRAWER).• STM1/4 drawers, which can be plugged on any slots. But, STM_4 Bit rate can only be set for

ports #3 and #4 (SDH–SONET_1310_DRAWER).Particular Case: For the 3 x STM4 configuration, the slot #1 is exceptionnally occupied by aSTM4 bit rate.

• Low frequency drawers (Fast Ethernet, FDDI, ESCON, Digital Video) with 1310 nm optical inter-faces, which can be plugged in any slots (LF_1310_DRAWER).

• Low frequency drawers equipped with 1310 nm detector and laser. The optical interfaces arehave better jitter figures. The rules followed for the position of these drawers are only imposedby the low frequency nature of the drawer (LF_1310_2_DRAWER).

• High frequency drawers equipped with 850 nm detector and laser. The rules followed for theposition of these drawers are only imposed by the high frequency nature of the drawer(HF_850_DRAWER).

• Low frequency drawers equipped with 850 nm detector and laser. The rules followed for theposition of these drawers are only imposed by the low frequency nature of the drawer(LF_850_DRAWER).

Furthermore, a limited number of configurations of drawers can be provided. Rules must be followed :

• If High Frequency drawer in ports #3, the port #1 must be non provisioned• If High Frequency drawer in ports #4, the port #2 must be non provisioned

The following table lists the allowed configurations.

Table 35. Allowed drawers association

Drawer #1 Drawer #3 Drawer #2 Drawer #4

Not provisioned High Frequency Not provisioned High Frequency

Low Frequency / STM1 Low Frequency / STM1/ STM4

Low Frequency / STM1 Low Frequency / STM1/ STM4

Not provisioned High Frequency / LowFrequency / STM1 /STM4

Low Frequency / STM1 Low Frequency / STM1/ STM4

Low Frequency / STM1 Low Frequency / STM1/ STM4

Not provisioned High Frequency / LowFrequency / STM1 /STM4

STM4 STM4 Not provisioned STM4

Any couple (DRW#1 ; DRW#3) can be associated to any couple (DRW#2 ; DRW#4) except for the lastline (3 x STM–4 configuration is fixed for the 4 drawers).

4.1.6.2 Optical characteristics

See para. 5.3.1.4 on page 336.

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4.1.7 Small Formfactor Pluggable (SFP) optical modules

The SFP optical modules are the optical physical access for the– client (B&W) side of the MCC3– aggregate (STM–16) side of the 4xANY_P.

Various type of optical modules are used (also refer to Table 8. on page 76)– Silver (APD) and Bronze (PIN) CWDM– STM–1 SFP : S–1.1, FE, FDDI, 100BaseLX– STM–1 SFP L–1.1 and L–1.2– STM–4 SFP : S–4.1, ESCON– STM–4 SFP L–4.1 and L–4.2– 1.25GBE SFP : Gbe1000LX/LH, 1 FiberChannel 1300nm stop gap– 1.25GBE SFP : Gbe 1000 SX, 1 Fiber Channel 850 nm stop gap– 1.25GBE SFP Gbe 1000 ZX– SFP 1FC, 2FC 850 / 1310 nm– STM–16 SFP : S–16.1, 2FC stop gap– STM–16 SFP I–16.1– STM–16 SFP S–16.1 multirate/multiformat– STM–16 SFP L–16.1 and L–16.2.

Each module contains on transmitter side an automatic optical output power control circuit, a laser driverand a laser diode module.The transmitter is based on an uncooled DFB laser.The laser safety class for the complete integrated module is CLASS 1 according to IEC 60825 2001 Edition.It can manage command for TX disable and provides TX Fault alarm.Depending on the SFP type, the optical access is compatible with– a single mode fiber (9/125 µm) or– multi mode fiber (50/125 µm or 9/125 µm)with standard LC optical connector.TX Fault indicates a laser fault of some kind. The Transmitter is not disabled when TX Fault signal is active.Tx Disable is an input that is used to shut down the transmitter optical output.

On receiver side each module contains a PIN or APD photodetector for light to electrical current conver-sion and a limiting amplifier.The photo detected current is amplified by a an electrical circuit which delivers two complementary datasignals.The module provides LOS alarm (Loss of input Power Signal alarm). This output signal indicates the re-ceived optical power is below the worst–case receiver sensitivity (as defined by the standard in use).Depending on the SFP type, the optical access is compatible with– a single mode fiber (9/125 µm) or– multi mode fiber (50/125 µm or 9/125 µm)with standard LC optical connector.

The Transceiver has an EEPROM inside to provide Remote Inventory, containing information about trans-ceiver’s capabilities, standard interfaces, manufacturer, and others. The serial interface uses the 2–wireserial CMOS EEPROM protocol defined for the ATMEL AT24C01A/02/04 family of components.Digital diagnostic monitoring (DDM) of analog parameters is supported.

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PIN Laser

LASERDRIVER

APC

Electrical DATA

Optical output

TX Fault

TX Disable

µP

EE

PR

OM Remote Inventory / DDM

TRANSMITTER

RECEIVER

LC

Optical input

LC

diode

PIN*PREMainAmplifierElectrical DATA

DATA–

DATA+

DATA–

DATA+

SFP Optical Module

To board(MCC3 or 4xANY_P)

processing

to/fromMCC3 client or 4xANY_P client

* PIN or APD, according to the SFP type

LOS

Figure 177. SFP modules general block diagram (with PIN photodetector)

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4.1.8 Multiple Variable Attenuator Card (MVAC)

4.1.8.1 Description

The board contains 2 x VOAs (Variable Optical Attenuators). It can be located between the demux andthe mux of an OADM / OMDX. A VOA can be placed between the two stages of an amplifier, too.

Purpose of MVAC is to manually adjust the channel emphasis in order to optimize the transmission.Coupled with the OSMC board it allows an automatic emphasis (automatic power adjustment).

In1

In2Alarm &Control

Unit

PC Electrical Link

Fro

nt

pane

l P

CE

lect

rical

inte

rfac

e 2

Car

d pr

esen

ce

VOAs Photo-diodesF

rom

: – O

AD

M/O

MD

X d

emux

– 1

st s

tage

OA

C

Out1

Out2

To: –

OA

DM

/OM

DX

mux

– a

MC

C

– 2

st s

tage

OA

C

Figure 178. MVAC unit block diagram

In Figure 179. on page 270, some examples of system configuration is given, where MVAC is connected:– between demux and mux of a multiplexer card (OADM/OMDX)– at the input of a MCC2 (dropped channel)– between the first and the second stage of the optical amplifier(s).

MVAC Can be used for any type of equipment connections: looped/expansion/extra/external channel.

4.1.8.2 MVAC optical characteristics

See para. 5.3.1.5 on page 343.

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1

2MVAC

1

2MVAC

In1

In2

Out1

Out2

In1

In2

Out1

Out2

1

2MVAC

In1

In2

Out1

Out2

1

2M

VAC

In1

In2

Out

1

Out

2

MCC2 MCC2

Post Emphasis

Bundle pass–through

MUX MUX

VOA in MCC2

VOA in MVAC

1

2MVAC

In1

In2

Out1

Out2

1st stage2nd stage

1st stage 2nd stage

Optical Amplifier1

VOA in OAC

Single Channel

VOA in OAC

Optical Amplifier2

MUX

1

2MVAC

In1

In2

Out1

Out2

EXTERNALSIGNAL

Figure 179. Example of MVAC location in the system

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4.2 Multiplexers

4.2.1 OMDX unit

The following Mux/Demux (OMDX) boards are used– the Mux/Demux with the LB/SB combiner/splitter and the SPV couplers : OMDX8100_M_L1_XS– the Mux/Demux with the LB/SB combiner/splitter : OMDX8100_M_L1_X– the upgrade Mux/Demux: OMDX8100_M_L2 , OMDX8100_M_S1 and OMDX8100_M_S2

4.2.1.1 OMDX8100_M_L1_XS

ch 30

ch 31

ch 32

ch 33

ch 35

ch 36ch 37

ch 38

WDM9:1

ch 30

ch 31

ch 32

ch 33

ch 35

ch 36ch 37

ch 38

WDM1:9

LB/SBcombiner

LB/SBsplitter

IPLIOPV

OpticalReceiver

Line Rx in

Monitor

Line Tx out

SPV Tx in

Extra Tx in

SB Rx out

SPV Rx out

Monitor Tx out

WDMTx in

Extra Rx out

WDMRx out

SB Tx in

Rx out

OPL

OpticalReceiver

OOPV

MUX

DEMUX

N.B. Monitoring Access: Optical power level at monitoring access is around 20 dB less the mean opti-cal power of the line.

Figure 180. OMDX8100_M_L1_XS: block diagram

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4.2.1.1.1 Description

a ) MUX sideThe wavelength multiplexer component collects the 8 optical signals (corresponding to the first part of theLong Band) and the signal coming from the extra–input (multiplexed signal corresponding to the secondpart of the Long Band) and multiplexes them into one optical signal. The following LB/SB combiner multi-plexes the Long Band and the Short Band.

b ) DEMUX sideAt the receive side, a coupler is used to monitor the input signal (power presence and monitoring connec-tor). Then, a WDM coupler is used to extract the supervisory channel. Then, the Long Band and the ShortBand are separated via the LB/SB splitter. The long Band signal is demultiplexed into 8 channels plus onethat corresponds to the multiplexed 8 other channels of the LB.

4.2.1.2 Optical characteristics

See para. 5.3.2.1 on page 344.

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4.2.1.3 OMDX8100_M_L1_X

ch 30

ch 31

ch 32

ch 33

ch 35

ch 36ch 37

ch 38

WDM9:1

ch 30

ch 31

ch 32

ch 33

ch 35

ch 36ch 37

ch 38

WDM1:9

LB/SBcombiner

LB/SBsplitter

IPLIOPV

SPV filter

OpticalReceiver

Line Rx in

Monitor Rx out

Line Tx out

Extra Tx inMonitor Tx out

WDMTx in

Extra Rx out

WDMRx out

OPL

OpticalReceiver

OOPV

MUX

DEMUX

SB Rx out

SB Tx in

Figure 181. OMDX8100_M_L1_X: block diagram

4.2.1.3.1 Description

a ) MUX sideThe wavelength multiplexer component collects the 8 optical signals (corresponding to the first part of theLong Band) and the signal coming from the extra–input (multiplexed signal corresponding to the secondpart of the Long Band) and multiplexes them into one optical signal. The following LB/SB combiner multi-plexes the Long Band and the Short Band.

b ) DEMUX sideAt the receive side, the Long Band and the Short Band are separated via the LB/SB splitter. The long bandsignal is demultiplexed into 8 channels plus one that corresponds to the multiplexed 8 other LB channels.

The optical characteristics are described in para. 5.3.2 on page 344.

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4.2.1.4 OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2

42

43

4445

47

48

49

50

52

53

5455

57

58

59

60

OR

ch 20

ch 21

ch 22

ch 23

ch 25

ch 26

ch 27

ch 28

OR

L2 S2 S1

42

43

4445

47

48

49

50

52

53

5455

57

58

59

60

OR

ch 20

ch 21

ch 22

ch 23

ch 25

ch 26

ch 27

ch 28

OR

L2 S2 S1

Line Rx in

Line Tx out

Extra Tx in

WDM Tx in

Extra Rx out

WDM Rx out

MUX

DEMUX

Figure 182. OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2 : block diagram

4.2.1.4.1 Description

MUX sideThe wavelength multiplexer component collects the 8 optical signals and the signal coming form the extra–input and multiplexes them into one optical signal, ready to be launched on the WDM line.

DEMUX sideThe wavelength demultiplexer component receives the WDM line signal and demultiplexes it into 8 chan-nel plus one possible extra aggregate signal.

OADM applicationConnecting the Extra Rx out access to the Extra Rx in access allows to pass–through the channels thatare not dropped and added. The board works in OADM configuration.These boards are supplied in power by the PSC.

The optical characteristics are described in para. 5.3.2.2 on page 346.

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4.2.2 OADM units

4.2.2.1 8 channels OADM unit

The components, MUX and DEMUX used in the OADM boards are the same than those used in the OMDXboards. Thus, 4 OADM boards are defined:– OADM8100_M_S2_S, the dropped and added channels are the channels 42 to 50– OADM8100_M_S1_S, the dropped and added channels are the channels 52 to 60– OADM8100_M_L1_S, the dropped and added channels are the channels 30 to 38– OADM8100_M_L2_S, the dropped and added channels are the channels 20 to 28

WDM1–>8

ch #1

ch #2

ch #3

ch #4

ch #5

ch #6

ch #7

ch #8

ch #1

ch #2

ch #3

ch #4

ch #5

ch #6

ch #7

ch #8

WDM8 –> 1

1510 nmfilter

OLOSOptical

ReceiverOOPV

dropped channels

adde

d ch

anne

ls

1510 nmfilter

Line Rx in

Monitor Rx out

Line Tx out

SPV Tx in

Extra Tx in

SPV Rx out

Monitor Tx out

WD

M T

x in

Extra Rx out

WD

M R

x out

OpticalReceiver

OPLOOPV

OpticalReceiver

MUX

DEMUX

IPLIOPV

Figure 183. OADM8: block–diagram

4.2.2.1.1 Description

The OADM8 unit is used on the west or east side.The 8 channels are dropped when all the other channels (pass–through) are sent on the extra–output port.On the transmit side, the 8 concerned channels are added to the pass–through channels via the multiple-xer and thus, the SPV (coming from the SPVM unit) is inserted using a WDM coupler.The optical characteristics are described in para. 5.3.3.1 on page 348.

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4.2.2.2 4 channels OADM unit

The function of the OADM4_x units is to extract and insert 4 channels between the 32 available.

WDM1–>4

ch #1

ch #2

ch #3

ch #4

WDM4–>1

ch #1

ch #2

ch #3

ch #4

1510 nmfilter

OLOS OpticalReceiverOOPV

dropped channels

adde

d ch

anne

ls

Line Rx in

Monitor Rx out

Line Tx out

SPV Tx in

Extra Tx in

SPV Rx out

Monitor Tx out

WD

M T

x in

Extra Rx out

WD

M R

x out

OPL OpticalReceiverOOPV

DEMUX

MUX

IPLIOPV

OpticalReceiver

Figure 184. OADM4: block–diagram

4.2.2.2.1 Description

The SPV channel is extracted and the signal is sent on a front panel connector. The 4 channels aredropped and sent on a front panel connector. The aggregate of all the other channels (pass–through) isalso sent to a front panel connector to be connected to the multiplex.On the transmit side, the 4 concerned channels are added to the pass–through channels via the multiple-xer and thus, the SPV (coming from the SPVM unit). The output signal is monitored (detection of ILOS,OOPV) and an external optical access is given to the operator for monitoring purpose too.The optical characteristics are described in para. 5.3.3.2 on page 349.The different possible sets of channels are the following: 20 to 23 – 25 to 28 – 30 to 33 – 35 to 38 – 42to 45 – 47 to 50 – 52 to 55 – and 57 to 60.

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4.2.2.3 2 channels OADM unit

The function of the OADM2100_M_XX_S is to extract and insert 2 channels between the 32 available.

ch #1

ch #2

Output

SPV IN

SPV OUT

extra–input

extra–output

Input

OLOS

IPLIOPV

Monitor

SPV filter

OpticalReceiver

OOPVMonitor

ch #2

ch #1

IPL

OpticalReceiver

OOPV

OpticalReceiver

MUX

DEMUX

Figure 185. Block diagram of the OADM2100_M_xx_S unit

4.2.2.3.1 Description

The SPV channel is extracted and the signal is sent on a front panel connector. The two channels aredropped while all the other channels are sent to a front–panel connector (extra–output).On the transmit side, the concerned channel is added to the other channels (pass–through or just multipledin an other board) via the multiplexer and thus, the SPV (coming from the SPVM unit) is inserted usinga coupler. The output signal is monitored (detection of ILOS, OOPV) and an external optical access is giv-en to the operator for monitoring purpose too.The optical characteristics are described in para. 5.3.3.3 on page 350.

Available couple of channels per each OADM2 board: 30-31; 32–33; 35–36; 37–38; 47–48.

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4.2.2.4 1 channel OADM unit

The function of the OADM1100_M_XX_S units is to extract and insert 1 channel between the 32 available.

OLOSOOPV

Add Ch

Output

SPV IN

SPV OUT

extra–input

extra–output

Input

IPLIOPV

MonitorSPV filter

OpticalReceiver

OpticalReceiver

Monitor

Drop Ch

OPLOOPV

MUX

DEMUX

OpticalReceiver

Figure 186. OADM1100: block diagram

4.2.2.4.1 Description

The SPV channel is extracted and the signal is sent on a front panel connector. The channel is droppedwhile all the other channels are sent to a front–panel connector.On the transmit side, the concerned channel is added to the other channels (pass–through or just multipledin an other board) via the multiplexer and thus, the SPV (coming from the SPVM unit) is inserted usingcoupler. The output signal is monitored (detection of ILOS, OOPV) and an external optical access is givento the operator for monitoring purpose too.The optical characteristics are described in para. 5.3.3.4 on page 351.

The available channels are 25, 30, 31, 32, 33, 35, 36, 37, 38 in Long Band and 47, 48, 57 in Short Band.

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4.2.3 SPV_F_1310_1550

The function of the SPV_F_1310_1550 unit is used to multiplex / demultiplex one 1310 nm channel (forinstance coming from a 4xANY, one 1550 nm multiplexed signal and the SPV channel.

1550

Output

SPV IN

SPV OUT

Input

OLOS

Monitor

SPV filter

OpticalReceiver

OOPVMonitor

1310

1550

1310

OPL

OpticalReceiver

OOPV

IPLIOPV

OpticalReceiver

SPLITTER

COUPLER

Figure 187. Block diagram of the SPV_F_1310_1550 unit

4.2.3.1 Description

At demux side, the SPV channel is extracted by a filter while at the mux side, a 95/5 coupler is used.

this board should moreover be able to accomodate whatever channel in the C–Band (and not only a chan-nel at 1550 nm).A 95/5 coupler is used to monitor the signal (power presence and monitoring connector) in both directions.The optical characteristics are described in para. 5.3.4 on page 352.

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4.2.4 SPV_F_C

This board is able to insert/extract the OSC channel to/from one 1310 nm channel or one 1550 nm chan-nel.

Common

SPV

Extra

Optical InputPower Detection

In

Extra

Optical OutputPower Detection

Common

LOS

LOS

In

SPV

Out

Out

SPV Coupler

SPV Filter

10dB

10dB

In

Out

IPL

OpticalReceiver

OPL

OpticalReceiver

SPLITTER

COUPLER

N.B. For Input power and Output power alarm detection, the optical receiver is calibrated at 1550 nm.

Figure 188. Block diagram of the SPV_F_C unit

4.2.4.1 Description

The board allows to perform both mux and demux function of two signals which are either C–band WDMsignal or Second window’s signal (B&W or 1310 nm) by extra ports and Supervisory channel (1510 nm)by SPV ports. The single channel can be extracted or inserted to the multiplexed signal.

2 different channel filterings are available:

– 1310 / 1510 nm– 1510 / 1550 nm

This compact board can be plugged in slots 28-35 or 38-45 on a 1696MSPAN shelf and in a slots 9–10or 11 in the 1696MS_C shelf and sub–shelf.

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4.2.4.2 Board location in the system

This board has to take place in both the – 1696MSPAN and 1696MS_C shelves. The basic configurationmay be with one wavelength among predefined WDM range or B&W user signal, however it could be setwith a multiplexed signal.

Transmission Line

Transponder unit

West Side East Side

Transponder unit

SPV_M SPV_M

SPV_F unit SPV_F unit

Figure 189. Position of SPV_F_C unit in a transmission line

4.2.4.3 Optical characteristics

The optical characteristics are described in para. 5.3.5 on page 353.

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4.3 Optical Amplifier (OAC)

4.3.1 Description

The Optical Amplifiers are designed to amplify the C band’s wavelengths in WDM transmission system.This functionality is necessary to extend the transmission capacity of the optical fiber’s network.They can perform optical amplification through the optical line as a booster, in line, OADM repeater andpre–amplifier.

The Optical Amplifiers provide up to +17 dBm output power (for 32 wavelengths) in C Band without exter-nal pump module.A tunable attenuator (VOA) allows a good gain flatness.

This unit contains two independent stages : a pre–amplifier and a booster.

The board receives electrical data from the Equipment Controller and from the Craft Terminal. It receivesoptical data from SPV and from the OADM/OMDX or another optical amplifier.

The aim of this boards is to allow an output Power Per Channel (P/ch) of– 2 dBm for 32 channels max loadingand to allow a correct behaviour whatever the number of channels and whatever the variation of the lossat the input of the pre–amplifier.

There are four types of optical amplifiers

• OAC1 (OFA 22/9), introduced in R.1.1, used for short spans transmission (metro amplifier)

• OAC1_L (OFA 28/9), introduced in R.2.0, used for long spans transmission (regional amplifier).

• OAC2 (OFA 22/9), introduced in R.2.2, used for short spans transmission (metro amplifier)

• OAC2_L (OFA 28/9), introduced in R.2.2, used for long spans transmission (regional amplifier).

OAC2 and OAC2_L, the new boards introduced in R.2.2, compared to OAC1 and OAC1_L are designed to– decrease power consumption.

In the 1696MS_C shelf, only OAC2 and OAC2_L can be used.

Table 36. sums up the main differences between OAC1, OAC1_L, OAC2 and OAC2_L

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Table 36. Main differences between OAC1, OAC1_L, OAC2 and OAC2_L optical amplifiers

Feature Values

Optical amplifier OAC1 OAC1_L OAC2 OAC2_LIntroduced in re-lease

R.1.1 R.2.0 R.2.2 R.2.2

Gain block 22/9 28/9 22/9 28/9Example of Spanperformance (32channels x10Gbps or 2.5Gbps)

– 1 span x 21 dB– 1 span x 28 dB

(with doublestage amplifierat IN and OUTof the node

– up to 7 spansx19 dB

– 1 span x 27 dB– 1 span x 29 dB

(with doublestage amplifierat IN and OUTof the node

– up to 4 spans x22dB

– 1 span x 21 dB– 1 span x 28 dB

(with doublestage amplifierat IN and OUTof the node

– up to 7 spansx19 dB

– 1 span x 27 dB– 1 span x 29 dB

(with doublestage amplifierat IN and OUTof the node

– up to 4 spans x22dB

Pre–amplifier Cooler Cooler

Booster @ 1480 nm @ 980 nmVOA tuning failalarm

Managed from R.2.2

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Block diagram description (see Figure 190. on page 285)

The optical part consists of

• two optical gain block modules, 22/9 for OAC1/OAC2 and 28/9 for OAC1_L/OAC2_L (1stand 2nd stage; they can be a preamplifier and a booster

• an optical attenuator (VOA) allowing to fix the attenuation before the first stage of the amplifierand to compensate the variation of the span attenuation. The VOA input and output are accessi-ble to the operator via front panel connectors.

• four 99/1 couplers for the 1st and 2nd stage signal monitoring (input and output)

• a DEMUX 1550/1510 (SPV filter) for the extraction of the supervisory channel (SPV OUT). Itseparates data and supervisory channel

• a 95/5 coupler for the insertion of the supervisory channel (SPV IN). It couples data and super-visory channel

• monitoring photodiodes (optical recevers).

The electrical part consists of

• two optical gain block modules for regulations, performing

– output optical power regulation : a comparaison is made between the measured opticaloutput power OOPV and the needed optical output power OPAV which is either calculatedby the FPGA (control unit) or fixed by the user

– temperature regulation: in each gain block a thermistance allows to evaluate the tempera-ture inside the gain block. Thereafter a comparison is done between a reference voltageand the thermistance’s voltage to determine the control current

• alarm generation

• card presence indicator

• Remote Inventory

• power supply interface with alarms generation. The board is supplied by –48V voltage frombatteries via backpanel, and by +3.6V voltage from the PSC card. On the board, 3 different vo-latges are used: +5.5V; –5.5V; +3.6V.

• visual system alarming by means of 5 leds located on front panel (PW, OOS, ABN, APSD,HW).

The card mismatch is managed via information (ECID) stored in an EEPROM.As the maximum power is +17 dBm, the amplifiers operates in safety class 1M.In the interconnection stage (between the 1st stage output and the 2nd stage input) can be located a DCUand/or an OADM/OMDX and/or a MVAC board.

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Pum

plaser 1

1

2nd stage

SP

V O

UT

1

SP

V IN

Monitor

Monitor

SP

V filter

VO

AIN

Variable O

pticalA

ttenuator

1st stage

Restart

Button

1st stage

VO

A O

UT

2nd

Alarm

&

Unit

EX

TR

A

Monitor

Monitor

1st stage

ILOS

1O

ptical

Receiver

IOP

V1

OLO

S1

Op

ticalR

eceiverIO

PV

1P

ump

laser 2

12

ILOS

2O

ptical

Receiver

IOP

V2

OLO

S2

IOP

V2

Op

ticalR

eceiver

Op

ticalR

eceiver

Control

2C

ardpresence

EP

OP

V

99/1 coupler99/1 coupler

99/1 coupler99/1 coupler

95/5 coupler

2nd

stage

stage IN

OU

T

IN

OU

T

PU

MP

IN

1550 nm

1510 nm

Figure 190. Amplifier boards block–diagram

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4.3.2 Way of working

The way of working is described in the next figure.

1

P1

P2

2 1

22

P2

2

P1

1

1

INPUT OUTPUT

INPUTOUTPUT

OADMDCU

DCU

VOA

VOA

Figure 191. Optical amplifiers configuration

In order to use the amplifier with its optimum performances, the output power per channel must be constantwhatever the number of channels and whatever the variation of loss of the previous span.In order to achieve such a requirement, two tuning mechanisms are foreseen:– Variation of the span loss, for a given number of channels– Variation of the number of channels, for a given span loss.

4.3.2.1 Variation of the span loss, for a given number of channels

The VOA attenuation is adjusted manually or semi–automatically according to the previous span attenua-tion in order to match with the EOL span losses. At the amplifier installation, the VOA is set in order to matchwith the foreseen EOL span losses. Then, when the span changes, the VOA is tuned in order to alwaysmatch with that EOL span losses.

1

P1

P2

2

Local Board

1

EOL span losses

Current span losses

VOA

Figure 192. Span variation compensation

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/3AL 95278 AA AA

390

390

For a given number of channels, when the previous span loss increases (ie. when the total input powerdecreases), the total output powers of the 1st and 2nd stage have a tendency to follow the correspondinglinear curve. As a consequence, when the span loss variation becomes greater than 1 dB, the VOA attenu-ation must be tuned in order to keep the total losses constant.

The range of variation of the interstage attenuation is included between 1 and 15 dB.

Two VOA tuning functions are foreseen:

– manual setting: the operator enters the value of the VOA (VOA_OP).

– semi–automatic setting: the value of the VOA is calculated by the NE via parameters entered by theoperator. This action is not automatic: the operator must command it.

4.3.2.2 Variation of the number of channels, for a given span loss

Refer to Figure 193. on page 288.

Two pump tuning functions are foreseen:

– manual setting: the output powers of the 1st and 2nd stages are fixed and set by the operator (inde-pendently from the input power)

– automatic setting:• 1st stage: for a given EOL previous span loss, when the number of channels changes, the 1st

stage output power is tuned without operator intervention• 2st stage: for a given interstage (IT) attenuation, when the number of channels changes, the

2st stage output power is tuned without operator intervention

The output power of the 1st and 2nd stage is adjusted automatically according to the input power of thecorresponding stage:

– 1st stage pump: it is enslaved on the 1st stage output power, which value is given as a function ofthe input power and the previous EOL span losses.For a given EOL previous span loss and for a given IT (interstage) attenuation, when the number ofchannels changes (ie. when the total input power changes), the total output power follows the corre-sponding linear curve. The full arrows correspond to a number of channels increasing. The dashedarrows correspond to a number of channels decreasing. When the number of channels is less than4, the output power of the 1st & 2nd stage remains constant.

– 2nd stage: it is enslaved on the 2nd stage output power, which value is given as a function of the inputpower of the second stage and the interstage attenuation.For a given IT attenuation, when the number of channels changes (ie. when the total input powerchanges), the total output power of the 2nd stage follows the corresponding linear curve. The full ar-rows correspond to a number of channels increasing. The dashed arrows correspond to a numberof channels decreasing. When the number of channels is less than 4, the output power of the 1st &2nd stage remains constant.

The nominal operating configuration of the optical amplifiers (Pout = +17dBm) is associated with a 32channels loading. Consequently, when 32 channels are loaded, the output power per channel is about2 dBm.

For a given EOL span losses or IT, the range of variation of the total input and output powers is 9 dB (from32 to 4 channels).When the number of channels is less than 4, the output power of the 1st & 2nd stage remains constant.

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Pin 1 (dBm)

Pout 1 (dBm)

+12

+3

–23 –20 –17 –14 –11 –8 –5 –2 2 4S

PA

N =

31d

B

SP

AN

= 2

8dB

SP

AN

= 2

5dB

SP

AN

= 2

2dB

SP

AN

= 1

9dB

SP

AN

= 1

6dB

SP

AN

= 1

3dB

first stage tuning pump

Pin 2 (dBm)

Pout 2 (dBm)

+17

+8

–12 –9 –6 –3 0 3 6 9

IT =

15d

B

IT =

12d

B

IT =

9d

B

IT =

6dB

IT =

3dB

second stage tuning pump

Figure 193. Amplifier tuning for number of channels changes (previous span loss constant)

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4.3.3 Optical characteristics

See para. 5.3.6 on page 354.

4.3.4 Optical safety

“IEC 60825–2, Ed.03: Safety of Laser ptroducts – Part 2: Safety of optical fibre commu-nication system”: in restricted areas no APSD scheme is required below +21.3 dBm out-put power (see para. 3.6, 4.5.1, table D.1).

Amplified or not amplified equipment is always well below this limit.Alcatel recommend the “APSD disable” mode (default mode).

The next table describes the way of working of the optical amplifiers. The boards may be in– APSD disable state– APSD disable forced ON or OFF state– APSD enable state (not available).The following tables sum up the way of working for each APSD state.

a ) APSD disable state

Table 37. Summary of the way of working in case of ILOS - APSD disable

alarmsconsecutive action

1st stage Input 2nd stage Inputconsecutive action

ILOS1 – ShutDown of the 1st stage

ILOS2 – ShutDown of the 2nd stage

b ) APSD disable forced ON or OFF state

Table 38. Summary of the way of working in case of ILOS - APSD disable forced ON/OFF

alarmsconsecutive action

1st stage Input 2nd stage Inputconsecutive action

ILOS1 – 1st stage forced ON / OFF. No action.

ILOS2 – 2nd stage forced ON / OFF. No action.

c ) APSD enable state (not available)

N.B. In current Release OAC APSD is always disabled.

Table 39. Summary of the way of working in case of ILOS - APSD enable

alarmsconsecutive action

1st stage Input 2nd stage Inputconsecutive action

ILOS1 – Shutdown of the 1st stage and 2nd stage of the sameboard.

ILOS2 – Shutdown of the 2nd stage.

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4.4 Controller

4.4.1 ESC board

The ESC (Equipment and Shelf Controller) board is the hardware platform designed to support the Equip-ment Controller (EC) functions and the Shelf Controller (SC) functions for the 1696 MSPAN and1696MS_C equipment from the release 1.3.

The EC functions has in charge of the processing activities concerning the “Virtual Equipment Control Ele-ment” (VECE) function:

– Virtual Machine Management Function (VMMF)– Message Communication Function (MCF)

The SC function of ESC has in charge of the processing activities concerning the “Physical EquipmentControl Element” (PECE) function:

– Physical Machine Management Function (PMMF)– Basic Process Control Function (BPCF)

It provides the resources to support the SW functions related to the physical machine control and manage-ment and configuration provisioning.

In an Expansion Shelf, the ESC board needs only to provide a SC functionality. It is the same board, andits identification is made through ”shelf id” and ”slot id” numbers.

The ESC consists in a double processor board. It is mainly composed of :– A ESC mother board,– A daughter board achieving the EC function,– A daughter board achieving the SC function,– A non volatile mass storage device PCMCIA 2.1 compatible.

Each of these functions (EC and SC) are realized using a PQSCC daughter board. They are plugged onthe ESC mother board. The PQSCC module is developed in order to provide a common HW (and SW)platform for different applications requiring a Shelf Controller (SC) function. The processors used aremembers of Motorola MPC860 family.

Various kinds of serial communication channels and parallel I/O ports for alarm & status signals are pro-vided by the ESC card.

Thanks to the ESC board, it is no more necessary to plug a LAN_Q card in each shelf since the ESC isnow able to manage the SPI bus. One only needs to plug a LAN_Q card in the master shelf if one needsthe LAN supervision functionality.

The flash backup capability permits the management system to copy files back and forth using an ftpservice, between the flash card on the ESC in slot 1 and the ESC in slot 24 of the master shelf.

4.4.1.1 EQUICO to ESC Upgrade procedure information

When the system software is upgraded from version 1.1, both EQUICO boards (SC+EC) should be re-placed by one ESC board in the master shelf, and one ESC board in expansion shelves in slot 1. The up-grade procedure is perform with the Craft terminal Equipment or OS (1353SH) and for this:

– Refer to 3AL 86602 ABAA–PGZZA document.

N.B. The procedure of NE software management is detailled on the Operator Handbook.

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4.4.2 Supervision units (SPVM2, SPVM_H)

The ”SPV–M” cards are used for the management of the 1696 supervision and service channels.The set of service channels managed by the supervision unit is a subset of the section overhead of STM1frame, as defined in ITU Recommendation G70X (March 1994); the unit will be able to multiplex/demulti-plex the optical service channels in 2048 kb/s or 4864 kb/s proprietary supervision frames.In case of a 4864 kb/s supervision data channels, the SPV–M will multiplex/demultiplex them in two 2048kb/s frames, only one of these contains the supervision information, the other is an extra traffic frames.Furthermore, others four bi–directional 2048 kb/s user auxiliary data channels are provided for extra trafficneeds. A matrix is used to interconnect these channels.

The supervision units types availabale are: SPVM2 and SPVM_H.

The supervision unit (SPVM) is composed of– one optical part (SPV channel receiver and transmitter)– two main electrical blocks:

• a matrix to route the 2 Mbit/s inputs• an FPGA dedicated to the supervision frames management.

From Rel. 1.3, is available the SPVM + OW (SPVM2) board, able to drop the 2 Mb/s extra channels andthe audio channel.

In Rel. 2.0, has been introduced the SPVM_H board; it provides all the features of the SPVM2 board butmanages only one Optical Supervisory Channel (OSC).

In the following is briefly described the block scheme (see Figure 194. on page 292)

The unit is composed of a main board, implementing the larger part of the functionalities, and two daughterboards (TX–SPV–M) devoted to optical transmitter. The board can be split in three main parts:

– 2/4 Mbps MUX/DEMUX (gate array). It multiplexes/demultiplexes a 4864 kb/s stream into two 2048kb/s channels. It extracts and inserts from/to these streams three auxiliary service channels.

– Supervision Manager (FPGA); it can be divided in the cited major functions:• Matrix function between the four users channels at 2048 kb/s, the streams of the supervison

channels processed by the OSC MUXs and two internal streams reserved to the mux/demuxof the service channels contained in the supervision channels. In case of a 2048kb/s supervi-sion frame it can by–pass the OSC MUXs

• Supervision frames and service channel management extract/insert the slots containing F1, E1,E2, from the supervision frames. The F1, E1, E2 service channels and those coming from theOSC MUXs, which is supervision information coming from both sides (EST and WEST), are re–routed to the ESC board

• OSC MUX configuration: this block function gives the access to the configuration and alarm pinsof the two OSC MUXs via internal registers

• SPI interface which assumes the software interface. Through this interface, the register of theSupervision Manager is accessible in read and write sequences. It permits the application soft-ware to configure the SPV–M.

– TX–SPV–M is a daughter board containing the optical unit (transmitter), having in charge of transmit-ting the SPVM frame on an optical fiber support in both sides (east and west), if required. This functionis realized with two LASERS at 1510 nm wavelenght. The LASERS are supported by two identicaldaugter boards (TX–SPV–M), managed by SPV–M.

The Remote Inventory of the board is available via the SPI bus.

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SPI INTERFACE

4Mbps

OSC+UDCλ/E 2/4Mb

MUX/DEMUX

2MbpsOSC

2MbpsUDC

FRONTPANEL

FRONT PANELTELEPHONE

BACK PANEL

EO

W (

E2

at 6

4K)

Voi

ce C

hann

el

UD

C (

2 x

2 M

bps)

TD

M1

(2M

)

4Mbps

OSC+UDCE/λ2/4Mb

MUX/DEMUX

2MbpsOSC

2MbpsUDC

FRONTPANEL

TO ESCTO UIC1

1510

nm

4M

b: O

SC

(D

1–D

3; D

4–D

12)

+ U

DC

1510

nm

4M

b: O

SC

(D

1–D

3; D

4–D

12)

+ U

DC

AGGREGATE(32 CH + OSC)

AGGREGATESIGNAL (32 CH)

1550 NM

AGGREGATE(32 CH + OSC)

AGGREGATESIGNAL (32 CH)

1550 NMADD/DROP

OSCADD/DROP

OSC

FROM/TO LINE FROM/TO LINEOAC

OPTICALINTERFACE

OPTICALINTERFACE

TD

M2

(2M

)

SUPERVISION MANAGER

OAC

HANDSET (J1) TO UIC2

TX–SPVM TX–SPVM

Figure 194. SPVM2 block diagram

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4.4.2.1 Description of the supported functionalities

The following functionalities are supported:

1 ) Management of one or two bidirectional supervision streams at 2 048 Kbit/s, one for Line termi-nal applications and one for each side of the link in back–to–back or OADM applications.

2 ) Management of Data Communication Channels DCCm and DCCr; four data streams are madeavailable to the Equipment Controller (EC) via a backpanel bus, and are used for network mana-gement.

3 ) Management of K1/K2 data stream at 128 Kbit/s; this data stream (terminated in the unit) ismade available to the equipment controller.

4 ) Management of E2 audio channel: The default configuration enables to drop the audio channel.It is possible to call a specific NE or to make a conference call. The phone number of the NEis set with the two front panel coding wheels. dial #00 for a conference call and #XX (with XXstrictly greater than 10 for a specific call).

The Line Terminal or back–to–back terminals and OADM configurations are done by software.

4.4.2.1.1 Functional Description of the configurations

As described on two following figures the data of OSC channel at 1510 nm are sent to the matrix into a2 Mbit/s signal to the supervision frame management functional block. This block generates one/or twoTDM signals according to the NE configuration.

SPVM

WDM Rx

Supervision framemanagement

Matrix

MCC

Tx1 opticaltransmitter

Rx1 opticalreceiver

OSC1510 nm

ESC board

(daughter board)

TDM1

OMDX,OADMor OACboard

Figure 195. SPVM board in a Line Terminal configuration

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SPVM

WDM Rx

MCC

Tx2 opticaltransmitter

Supervision framemanagement

MatrixRx2 optical

receiver

East

MCC

Tx1 opticaltransmitter

Rx1 opticalreceiver

OSC 21510 nm

OSC 11510 nm

TDM2 TDM1

ESC board

(daughter board) (daughter board)

West

OMDX,OADMor OACboard

OMDX,OADMor OACboard

Figure 196. SPVM board in an OADM or Back–To–Back configuration

N.B. When the network comprises NEs connected in a ring, at least one NE must be configured withthe SPVM board in ”Local Clock” configuration (to avoid clock loop). SPVM board for the othersNE can be configured in ”Remote Clock” configuration.

User channels

The 2Mbps and 64Kbps channels exchanged with UIC, are drop–insert connected by default.

4.4.2.2 Optical characteristics

See para. 5.3.7 on page 355.

4.4.2.3 Management of two SPVM boards

From the Release 1.3 and in a configuration where a CPE is linked to a 1696MS in a ring, the 1696MSis able to manage the first SPVM board (East and West of the Ring), plus one SPVM managing the OSCto/from CPE(s).

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4.4.3 Optical Spectrum Monitoring Card (OSMC)

The Optical Spectrum Monitoring Card (OSMC) is used along with the MVAC board as a key element ofthe automatic equalization process into the 1696MS system, providing the ITU–T entire C–band monito-ring function in terms of channel power and wavelength (no OSNR).

OSMC

OpticalChannel

Monitoring

up to 8monitoredpoints)

MP1

MP8

Alarm&Control

Unit

PC Electrical Link

Fro

nt p

anel

PC

elec

tric

al in

terf

aces

card

pre

senc

e

2

1x8 fiber–optic

switch

Figure 197. OMSC block diagram

The purpose of this board is to measure the power per channel at several points of a node. This board receives its optical input signals from any point of the tranmission path and it measures thepower of each channel. Up to 8 locations (4 per direction) are possible on monitoring or direct ports (see Figure 198. on page 295)– before and after first and second stage of an amplifier– before a demultiplexer– after a multiplexer.

OSMC

1

Rx Tx

Rx Tx

2

1

RxTx

RxTx

2

Figure 198. OSMC connection (measured points)

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The front panel PC electrical interface is used to send the data directly to a PC.For the absolute channels power measurement, an offset (called calibration factor) must be available inorder to consider the loss of the monitoring splitter. Each power is given before the monitoring splitter.

Functional Description

The 8 x input ports are connected to a 1 x 8 electro mechanical latching fiber optic switch: when the systemwants to select a specific port, it sends an order thru the SPI bus that in turns make the Control Unit toproperly bias the switch command pins by making it switching to the selected position. As soon as the newposition is raised the switch will rest in that position until a new stimuli occurs.

The output WDM signal is then forwarded to the OCM module through a 90/10 TAP coupler, the 10%branch being devoted to a broadband photo–detection, performed by a PIN photodiode followed by a loga-ritmic amplification in order to provide system calibration.The OCM goal is to perform a spectral analisys of the C–band, from 192 THz (ch#20) to 196 THz (ch#60),every 100 GHz, as regards channel power and wavelength.

The Alarms and Control unit provides a digital interface between peripheral components (OCM, Opticalswitch..) the NE needs to get access to and the SPIDER local interface it is connected to. Main functions are– channel power calibration and board calibration– OCM interfacing, data post–processing and alarms generation– optical switch control and monitoring– photo detection and board temperature digital processing– OOS led control

The SPI interface terminates the SPI bus used for control and monitoring between OSMC (slave) and ESC.The two EEPROMs provides Remote Inventory data and board specific parameters (ECID).

The power supply module performs incoming –48V rails filtering, over–voltage and current protections,board feeding generating the needed voltages (+3.3V, +5V..), alarms monitoring.

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4.4.4 1696MS_C Master Intershelf Link (I–LINK_M)

This board is dedicated to the 1696MS_C shelf and allows to manage up to three shelves (one mastershelf and two slave shelves) by using only one ESC board (cost–saving solution).

The I–LINK_M board is located in the master compact shelf; it has to be used in conjunction with the I–LINK_S board (slave board) located in each slave shelf, to which it has to be linked to be able to stack upto three subracks. Hence– the ESC board has to be plugged in slot 1 of the master shelf– the I–LINK_M board has to be plugged in slot 6 of the master shelf– the I–LINK_S board has to be plugged in slot 1 of each slave shelf.

The I–LINK_M is mainly dedicated to connect the SPI bus (and the card presence signals) from the ESCto the slave shelves, where no ESC unit is provided.The connection between I–LINK_M and each I–LINK_S is done by using dedicated cables.After having provisioned it, swapping cables is not possible.When the connection between I–LINK_M and other I–LINK_S is removed, a Card Absent alarm is raisedon every board of the expansion shelves.

I–Link_MBACKPANEL

M1

SPIInterface(Spider)

EEPROM EEPROM

REMOTEINVENTORY

BOARDDATA(ECID)

RS485Transceivers

card pres

M2

PowerSupplies

RS485Transceiver

SLOT ID

M7

Card PresenceBus SLAVE 1

SPI

Card Presence

sLAVE SHELF 1CONNECTOR

M8

Card PresenceBus SLAVE 2

SPI

Card Presence

sLAVE SHELF 2CONNECTOR

M9

Card PresenceBus SLAVE 3

SPI

Card Presence

sLAVE SHELF 3CONNECTOR(NOT USED)

FPGA

Card Presence Bus

FRONTPANEL

M5

Card Presence

Powersupply

+–48Vdc

VBatt

+5V

+3.3V+2.5V

HWF

+3.6V

Figure 199. I–Link_M block diagram

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4.4.5 1696MS_C Slave Intershelf Link (I–LINK_S)

This board is dedicated to the 1696MS_C slave shelf giving the possibility to add up to two 1696MS_Cslave shelves to the master shelf. Using the I–Link_S unit allows to save the cost of the reuse of an ESC unit giving the possibility to link theSPI bus and the Card Presence signal of each slave shelf to the master shelf, thus connecting these sig-nals to the ESC boards, only provided in Master shelf.

The I–LINK_S board has to be plugged in each slave compact shelf; it has to be used in conjunction withthe I–LINK_M board (master board) located in master shelf, to which it has to be linked to be able to stackup to three subracks (1 master shelf and two slave shelves). Hence– the I–LINK_S board has to be plugged in slot 1 of each slave shelf.– the I–LINK_M board has to be plugged in slot 6 of the master shelf

The connection between I–LINK_M and each I–LINK_S is done by using dedicated cables.After having provisioned it, swapping cables is not possible.When the connection between I–LINK_M and other I–LINK_S is removed, a Card Absent alarm is raisedon every board of the expansion shelves.

The I–Link_S unit includes– SPIDER, Remote Inventory and Data EEPROM (ECID)– 1 connector for the master shelf.

I–Link_SBACKPANEL

M1

SPIInterface(Spider)

EEPROM EEPROM

REMOTEINVENTORY

BOARDDATA(ECID)

RS485Transceivers

card pres

M2

PowerSupplies

RS485Transceiver

SLOT ID

M10

Card Presence Bus

SPI

Card Presence

sLAVE SHELFCONNECTOR

FPGA

Card Presence Bus

FRONTPANEL

M5

Card Presence

Powersupply

+–48Vdc

VBatt

+5V+3.3V

+2.5V

HWF

+3.6V

Figure 200. I–Link_S block diagram

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4.5 General user interfaces

Two main functions are supported by the various small units: provide the power supply to the other unitsand provide the electrical interfaces to the operators.

The various functions are divided into small boards plugged in the bottom of the shelf (cf. Figure 201. ).Each of these boards supports a SPI Bus interface and some card presence wires.

QB

Po

wer

su

pp

ly A

Use

r In

terf

ace

LANaccess

FANC

MC

CM

CC

MC

CM

CC

MC

CM

CC

MC

CM

CC

MC

CM

CC

MC

CM

CC

MC

CM

CC

MC

C

SP

V m

anag

enem

ent (

opt)

ES

CO

MD

X +

EX

P +

SP

VO

MD

X

MC

C

optical protection unitsM

atrix

Slo

tM

atrix

Slo

t

P

CS

PSC

L

optical protection unitsHK

Ho

use

Kee

pin

g

Rac

k al

arm

s

RAI

ANC

UIC

UIC

Po

wer

su

pp

ly B

Use

r In

terf

ace

Figure 201. Electrical access, slot description

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4.5.1 LAN board

ETHERNET

INTERFACE

ADAPTER

COAX TRANSC

TP – RJ45IE–LAN INPUT

IE–LAN OUT

hex rotary switches

EQTYPE

SHELF–ID

N.B. If a wire is plugged on J45, BNC is un-available.

Figure 202. Block diagram of control LAN board

4.5.1.1 Lan board purposes

The purposes of the LAN board are the following:

– to provide the physical layer for the QB interface between the Equipment shelf (ESC board) and anexternal supervisor (e.g. 1353SH),.

– to provide the 4 bits Equipment type Codification, necessary to give to the application stored in theEquuipment Controller.

– to provide the 8 bits Shelf IDentification number (i.e.: MAC address), necessary to build up the IPaddress of the shelf where the LAN board is installed.

4.5.1.2 Lan board description

The LAN board has to be plugged in the slot 26 for the Maser shelf (LAN_Q) or slot #8 of 1696MS_C shelf.It is linked to the ESC board by backpanel link.A second LAN (LAN_I) in the slot 27 is used to link to the Slave shelf with a LAN board on the slot 27.The link to an external supervision equipment is ensured by 2 BNC connectors or by one RJ 45 connector.The Equipment Type Codification is ensured by the hexadecimal rotary switch CW3.The Shelf IDentification is ensured by the two hexadecimal rotary switches CW1 and CW2.

N.B. The LAN_I functionality is not foreseen in a 1696MS_C shelf.

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4.5.1.3 Lan board Hardware setting

Equipment Type Codification

The hexadecimal rotary switch CW3 is in charge of setting up the equipment type. The CW3 factorysetting is the value ’5’, for the 1696MSPAN. It must not be changed.

Shelf Identification number

The hexadecimal rotary switches CW1 and CW2 are in charge of setting up the shelf Identificationnumber. The CW1 factory setting is the value ’B’ and the CW2 factory setting is the value ’F’. Thesedefault values are the identification number of the master shelf.

For the different shelves, the switches setting values are:

Shelf Slot Function Switch settings

CW1 CW2 CW3

Master 26 ELAN B F 5

Master 27 ILAN B F 5

Expansion 1 26 ELAN 7 F 5

Expansion 1 27 ILAN 7 F 5

Expansion 2 26 ELAN 3 F 5

Expansion 2 27 ILAN 3 F 5

Expansion 3 26 ELAN E F 5

Expansion 3 27 ILAN E F 5

A B C

Front Panel

Rotary Wheels 6 pins host for jumper

Back Panel

CW 1 CW 2 CW 3D E F

Figure 203. LAN board settings

It is not necessary to configure expansion shelves in this order, but it is necessary to give the correspondingexpansion number to the craft Terminal.For example if only one drop shelf is present, its LAN baord can be configured (3, F, 5) but then to be de-fined as ”Expansion 2”.

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Jumper configuration

For operation with the ESC, 1696 MS R1.3 and later, the jumper setting equipment for all LAN cards isthe same regardless of which slot they are installed in. Only the following jumper settings are permitted:

• No jumper• Jumper between pins A–D

N.B. During NE upgrade from R1.1, the jumper settings of all installed LAN cards should be checkedand modified as necessary to comply with the above.

For a Compact NE (1696MS_C), the switches setting values are mandatory (B, F, 5).

4.5.2 HouseKeeping board (HK)

8 house–keeping accesses are provided in both direction (8 inputs and 8 outputs).

The HK board is plugged in the slot 36 of the master shelf.

Connector: sub–D 25 pins (see section 2.4.2.1, page 111).

4.5.3 Rack Alarm Interface (RAI)

The RAI board monitors the rack alarms. Each shelf (master and expansion shelf) is equipped with thiscard in the slot 37in 1696MSPAN and in slot 9 or 10 in master shelf of 1696MS_C.

1696 MSPAN alarms are analysed either by the Equipment Shelf Controller or directly by the Rack AlarmInterface board. In function of the importance of these alarms, the ESC generates signals to turn on LEDson PDU or TRU card and so to alert the user.

2 ways of working are available:

– for the Interfacing with the PDUThe RAI cards in the same rack are linked to each other as shown on Figure 204. And the RAIcard in the master shelf is linked with the PDU.

– for the Interfacing with the TRUThe same way of working can be proposed, but also a direct link between each shelf and theTRU (cf. Figure 204. ).

The RAI card inputs are alarms coming from the FAN card, from the PSC, from the shelf just below (if any)and from the Equipment Controller (for the RAI card in the master shelf). Taking the various inputs intoaccount the rack lamps are lit on or off.

Rack lamps are different in ETSI and ANSI worlds. The RAI card is made to interface with both standards.

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Rack Alarms

It is used to connect the rack lamps. These lamps differ from the ETSI rack to the ANSI one.

Table 40. PDU Front Panel LED Markings

Marking LED Color DESCRIPTION

CRI red Critical: critical alarm input from one of the shelves in the rack

MAJ red Major: major alarm input from one of the shelves in the rack

MIN yellow Major: minor alarm input from one of the shelves in the rack

RACK red Rack Alarm: alarm input from one of the shelves in the rack or inthe PDU

Table 41. TRU Front Panel LED Markings

Marking LED Color DESCRIPTION

URG red Urgent: major alarm input from one of the shelves in the rack

NURG yellow Non urgent: minor alarm input from one of the shelves in the rack

ATTD red Attended: aknowledged URG or NURG alarm

SIG PRSC green signal presence (power on)

Connectors: (see section 2.4.2.2, page 111).– SUB–D 9 pins female– RJ11 6pins female.

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Top rack unit

Air deflector Air deflector

Power Distribution Unit

OPTINEX RACKNEBS 2000 RACK

Slot 37

Figure 204. Electrical links between RAI cards (slot 37) and TRU & PDU

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4.5.4 User Interfaces Card (UIC)

4.5.4.1 Description

Some user information are carried by the SPV channel: they are extracted from the SPV frame by theSPVM board and access via dedicated electrical connectors on the User Interfaces cards.Those small boards have to be plugged under the corresponding SPVM board and in the slot beside.

AU

XA

1

AU

XB

1

AU

XA

2

AU

XB

2

SPVM

UICUIC

SPISPI

NRZ

G703

NRZ

G703

NRZ

G703

NRZ

G703

AUX1, AUX2AUX1, AUX2

2Mbps USER ACCESS 2Mbps USER ACCESS

Figure 205. 2 Mbit/s back–panel links between UIC Cards and the SPVM unit

The E2 analogic voice channel is available through a jack in the front panel of the SPVM board.

Auxiliary Channels Interfaces:– up to two 2 Mb/s bi–directional links (user 2 Mb/s) – G 703– one analogic link.

N.B. In default configuration the E2 channel is configured in ”drop/insert” configuration.In a CPE configuation, auxiliary channels are in a hardware configuration (fixed).

N.B. The UIC possibility is provided for 1696MS and not for 1696MS_C Equipment.

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4.6 Switching Protection (OPC)

4.6.1 Single and Multi Mode Optical Protection Cards

4.6.1.1 Description

See Figure 206. on page 307. The purpose of this protection unit is to perform passive OCh protection(linear configuration), OSNC Protection (ring configuration).

There are five types of Optical Protection Card (OPC), listed in the following:• Single Mode OPC with jumpers (SM OPC)• Multi Mode OPC with jumpers (MM OPC)• Single Mode OPC with connectors (SM OPC FCP)• Multi Mode OPC with connectors (MM OPC FCP)• Multi Mode OPC with connectors 850 nm (MM OPC 850)

Only OPC cards with connectors can be used with all interface cards (MCC, OCC10, 4xANY).

The main difference between the Single Mode OPC and the Multi Mode OPC (with connectors and withjumpers) boards is the 50/50 Rx optical splitter:

• the SM OPCs have a single mode splitter• the MM OPCs have a multi mode splitter and a higher optical loss.

The OPC board can be connected to– two transponders (protected channel / protecting channel)– two drawers of two different 4xANY (_S, _P) boards.It can be placed in slots 28 to 35 and in slots 38 to 45, just below the two transponders/4xANY.As an example,– if the two transponders are plugged in slots 4 and 5, to perform the channel protection the OPC is

plugged in slot 28 or 29– if the two 4xANY_P are plugged in slots 4,5 and 6,7 to perform the channel protection the up to four

OPCs (MM OPC 850) are plugged in slots 28, 29, 30, 31.

The signal coming from the client is connected on RX input and crosses the board through a 3 dB splitter.By means of the RX 1&2 OUT OPC cables/connectors, it is then sent to the two transponders (RX userinputs), placed in the slots just above in the double shelf.The signal coming from the WDM world is transmitted by the two adjacent transponders (user Tx outputs)to the inputs of the other splitter of the OCh protection unit (TX1IN and TX2IN). The selected signal is sentto the client via the Tx OUT port.

On each board are located– two broadband (1310 nm and 1550 nm) 3 dB splitters/couplers for SM/MM OPC and SM/MM OPC FCP– two 850 nm 3 dB splitters/couplers for MM OPC 850Depending on the configuration, are available:

• a single mode splitter on RX line of the SM OPC• a multi mode splitter on RX line of the MM OPC• a single mode coupler on TX line of both the SM and MM OPCs.

LOS detection and power measurement are provided on the following input signals• Rx IN, coming from the client• Tx 1 IN and Tx 2 IN, coming from the main and spare transponders / 4xANY_P

by means of three 95/5 couplers (one per monitored signal) which extract the 5% of the received opticalsignals and send each of them to a photodiode (optical receiver) performing LOS detection and measure-ments. The LOS alarm is sent to the Alarm Interface and then to:

• the two transponders / 4xANY_P via backpanel connections• the ESC board via the SPI bus.

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The selection of the signal is made by the transponders.

The Remote Inventory data are available via the SPI bus.

Two external voltages are supplied by the PSC units. On–board fuse protection and hardware failure con-trol are available.

RX OUT

RX IN

Channel1

RX OUT95/5 50/50

Optical LOSReceiver**

95/5

95/5

Optical LOS2Receiver**

Optical LOS1Receiver**

TX IN

TX IN

50/50 TXOUT

AlarmInterface**

2Card

presence

Channel2

Channel1

Channel2

Bac

kpla

ne c

onne

ctor

tow

ards

tran

spon

ders

N.B. * on Multi Mode OPC boards, the RX line is MMF type on Single Mode OPC boards, the RX line is SMF type. The TX line is always SMF.

N.B. ** The optical receivers and the alarm interface are not available on SM OPC without connectors board.

fro

m tr

ansp

on

der

s/4x

AN

Y_P

dra

wer

sfr

om

clie

nt

to c

lien

tto

tra

nsp

on

der

s/4x

AN

Y_P

dra

wer

s

splitter

MMF or SMF*

3dB optical

coupler3dB optical

SMFSMF

MMF or SMF*

Figure 206. OPC block diagram

4.6.1.2 Optical characteristics

See para. 5.3.9 on page 357.

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4.7 Power Supply Card (PSC/PSC3)

Two power supply units are used: working and protecting. They are located at each side of the shelf, in the slots 25 and 48. For the block diagram, refer to Figure 207. on page 308.

The Power Supply Cards are monitored via the SPI bus.PSCs provide some +3.6 V and 5.5 V for service use to all units and a 48 V power supply when needed.The input voltage range of the Power Supply Cards is –36 / –72 V.

Front panel Connector: sub–D 3 poles (see section 2.4.3, page 111).LEDs signification

Table 42. PSC and PSC3 LEDs signification

HardWare Failure:GREEN when the board is plugged, configured and without failureRED when one of the On Board Power Supply (OBPS) is in failure (OR on the power supply alarms)

4.8 Power Supply Card (PSC2)

This board is the same as PSC and PSC3 but needs to supply less power, because it has been designedfor 1696MS_C, hosting only 13 slots.

PSC2 are used in main and slave compact shelves.

Two power supply units are used: working and protecting. They are located at each side of the shelf, inthe slots 7 and 12, and they are monitored via the SPI bus.These boards are with the 0V isolation.PSCs provide some +3.6 V and 5.5 V for service use to all units and a 48 V power supply when needed.The current limit is 6A.The input voltage range of the Power Supply Cards is –36 / –72 V.

Front panel Connector: sub–D 3 poles (see section 2.4.3, page 111).The LEDs signification is shown in Table 42.

+Batt_A

–Batt_A

PSC2

GND* protection* pre–filter* fuse

+Batt

–Batt

* OR Batt

* EMI/EMCfilter

* soft start

* EMI/EMCfilter

* threshold

dual DC/DCconverter

3.6V

5.5V

TO GENERIC BOARD TO GENERIC BOARD

Figure 207. PSC2 block diagram

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4.9 Power Management Unit (PMU)

The PMU is strictly dedicated to the 1696MS_C.It is an external shelf able to feed the compact shelf providing the –48 Vdc to the power supply cards. Hence the 1696MS_C can be fed– by the classical –48Vdc provided by the telecom rack– by the –48Vdc provided by the PMU, able to deliver this powering from any alternative voltage source.

The PMU is an external shelf of the same size that the 1696MS_C, which can be installed in 19“, 21“ and23“ racks. This additional shelf is 1U high (1U = 44.45mm).

The PMU works in a worldwide environment, which applies to the following requirements:– US requirements : NEBS compliant (115V/ 60Hz),– Japan requirements (100V/ 50/60Hz),– Europe requirements (230V/ 50Hz).

PSC boards are connected to the rectifiers of the PMU which provide the power. PMU Control unit is connected to the FAN_C board and the tw0 PSC/PSC2 to provide alarms to the Net-work Element since this unit in not managed by the software.

F A

N _

C

PSC(2)

PSC(2)

7

8

9

10

11

12

1

2

3

4

5

6

13

RECTIFIER 1 RECTIFIER 2CONTROL

UNIT

PMU

from back–up batteries (optional)

in1 in2

–48Vdc

from any alternative voltage source (100Vac, 115Vac, 230Vac)

–48V

dc (

pow

er s

uppl

y)

PMU alarms

Figure 208. PMU cabling scheme

Description

Refer to Figure 209. on page 310. The PMU architecture is made up of:– 2 VAC inputs– 2 VDC outputs without fuses– 1 battery connection– one cintrol unit– 2 rectifiers modules

On DC voltage outputs, no fuses are required because the 1696MS_C has on his PSC unit fuses on inputs.The outputs are connected together, so they can protect each all the DC outputs.

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Two rectifiers modules are present in one PMU. Each modules is able to supply with power up to 4 stacked1696MS_C.One module enables to supply the 4 stacked shelves. If one module fails, the other one can still supplythe 4 shelves.

The Control Unit must be able to provide the following functions– deliver 2 outputs 48VDC– transmit alarms to the host (FAN_C board)– manage the battery– manage Status Leds.

AC input 1

Discarge

–+

–+

Protect

DC output 1

DC output 2

+ Batt

– Batt

AC input 2

AC in1 presence

AC in2 presence

Batt presence

Control

UnitAlarms

To Batt

M1

M2

M3

M4

M5

M6

Figure 209. PMU block diagram

4.9.1 Batteries for PMU

Batteries are optional units used with the PMU in order to supply the –48V to the 1696MS_C in case ofpower outage of the alternative power source (100V/115V/220V supply).Battery units are linked to the Control unit of the PMU by cascading the units. The first battery gives a temperature measurement of the unit to the PMU so as to generate an alarm whenout of the range.It is possible to add up to three optional batteries. This depends of the current consumption of the shelves(150W per battery).

Performance.The battery must be charged in a maximum of 15 hours with 1 PMU and 1 shelf.The battery must be charged in a maximum of 60 hours with 1 PMU and 4 shelves.The Battery duration for 150W must be of 3 hours.

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Mechanical dimension of each battery: W = 446.02 mm; L = 284 mm; H = 133.35 mm.

Batteries can be inserted in a 19“, 21“ (ETSI) and 23“ (ANSI) rack or put on table.

In Rack Version, the batteries are located below the PMU.

F A

N _

C PSC(2)

PSC(2)

789

101112

123456

13

RECTIFIER 1 RECTIFIER 2 CONTROLUNITPMU

in1 in2

–48Vdc

–48V

dc

Battery withcaptor oftemperatureOptional

Figure 210. Minimum configuration of the batteries in 1696MS_C Rel. 2.2, rack version

In table version, batteries are located and stacked besides the PMU and 1696MS_C shelves; only thisconfiguration is supported since a battery is not likely to hold the full stack of batteries, PMU and shelves.

F A

N _

C PSC(2)

PSC(2)

789

101112

123456

13

RECTIFIER 1 RECTIFIER 2 CONTROLUNIT

PMU

in1 in2

–48Vdc

–48V

dc

Battery withcaptor oftemperature

F A

N _

C PSC(2)

PSC(2)

789

101112

123456

13

F A

N _

C PSC(2)

PSC(2)

789

101112

123456

13

–48VdcOptional Battery

–48VdcOptional Battery

Optional

Figure 211. Maximum configuration of the batteries in 1696MS_C Rel. 2.2, table version

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4.10 FANS unit

4.10.1 FANC unit for 1696MS shelf

As the power consumption of the transponder is high enough (about 20–25 W / unit), fans are necessaryto dissipate the heat.

The fans are located at the bottom of the shelf. The use of fans requires to put an air filter just below. Thisis shown on Figure 212.

FANS

TR

SN

AP

ON

DE

RT

RA

NS

PO

ND

ER

TR

AN

SP

ON

DE

RT

RA

NS

PO

ND

ER

TR

AN

SP

ON

DE

R

TR

AN

SP

ON

DE

RT

RA

NS

PO

ND

ER

TR

AN

SP

ON

DE

R

SP

V m

anag

enem

ent (

opt)

ES

CO

MD

X +

EX

P +

SP

VO

MD

X

OA

C (

OP

TIO

NA

L)O

AC

(O

PT

ION

AL)

Air filter

TR

SN

AP

ON

DE

RT

RA

NS

PO

ND

ER

TR

AN

SP

ON

DE

RT

RA

NS

PO

ND

ER

TR

AN

SP

ON

DE

RT

RA

NS

PO

ND

ER

TR

AN

SP

ON

DE

RT

RA

NS

PO

ND

ER

Figure 212. Fan shelf description and Rack partitioning

One FAN module is placed at the bottom of the shelf, in the slot 49.

The FANS are monitored via SPI bus and some direct wires are sent to the House Keeping/Remote Alarmsmodule to monitor a possible failure of the cooling system.

Max Power dissipation per shelf: 400 W.

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4.10.2 FAN_C unit for 1696MS_C shelf

On the 1696MS_C shelf, FAN unit is located on the left side of the compact shelf. The use of fans requiresto put an air filter just below.

ESC

TRNSPONDER

TRNSPONDER

SPV managenement OOADM1ch+OSCW

OOADM1ch+OSCE

FAN

_C

PSC(2)

HkRAI

OPCLan_Q

PSC(2)

Air filter

Figure 213. FAN_C description and Rack partitioning

FAN_C unit takes place in the left slot of 1696MS_C shelf and is equipped with two fans with speedometersensor to dissipate the heat coming from Transponder and 4xANY boards essentially. FAN_C board ismandatory provided.

FAN_C board enables the link to the Power Management Unit (PMU) which is an external frame containingthe rectifier AC/DC to enable the plugging in the main supply).The logical alarms generated by the PMU (PMU presence, Minor and Major) are sent to the FAN_C board’sSPIDER where they are red by the shelf Controller (ESC).

This alarm is used by the software to inhibit or not both others. If the alarm is not raised, (PMU absent),the MAJOR and MINOR alarms are inhibited.

MINOR (resp. MAJOR) alarm means that one (resp. two) rectifier is defective or out of the functioningrange.

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5 TECHNICAL SPECIFICATIONS

5.1 1696MSPAN System characteristics

5.1.1 Main system characteristics

General

Optical bit rate, client side

– MCC2, MCC3

– MCC1

the bit rates indicated with (*) are 3R, the others are 2R (MCC1 only)

any bit rate between 100Mbps and 2.66Gbps (*)

100 Mbps : FDDI125 Mbps : Fast Ethernet, FDDI132.815 Mbps : FC (12-M6–LE–I)155.520 Mbps : STM–1/OC–3 (*)200.00 Mbps : ESCON265.620 Mbps : FC (25-M6–LL–I)270 Mbps : Digital Video (DTV) / HDTV275.176 Mbps : DS4400.352 Mbps : J5466.560 Mbps : OC–9531.250 Mbps : FC (50-M5–SL–I)622.080 Mbps : STM–4/OC–12 (*)933.120 Mbps : OC–181062.5 Mbps : Fiber Channel / FICON (*)1244.160 Mbps : OC–241250 Mbps : Gigabit Ethernet (*)1866.240 Mbps : OC–362125.00 Mbps : 2FC (*)2488.320 Mbps : STM–16/OC–48 (*)2500 Mbps : Infiniband

– 0CC10 9953.28 Mbps : STM–64/OC–192/10 GBE WAN (*)

10.3125 Gbps : 10 GBE LAN (*)

– 4xANY 125 Mbps : Fast Ethernet, FDDI (*)155.520 Mbps : STM–1/OC–3 (*)200.00 Mbps : ESCON (*)270 Mbps : Digital Video (DTV) / HDTV (*)622.080 Mbps : STM–4/OC–12 (*)1062.5 Mbps : Fiber Channel / FICON (*)1250 Mbps : Gigabit Ethernet (*)

Optical bit rate, WDM side

– MCC1/MCC2/MCC3/ MCC_RGN

– 4xANY

– OCC10

the same of all the clients bit rates, in the correspondent wavelength (λ)

2488.320 Mbps : STM–16 / OC–48

10.709 Gbps : STM–64/OC–192/10 GBE WAN + FEC11.096 Gbps : 10 GBE LAN + FEC

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Type of optical fiber According to ITU–T G.652, G.653, G.654, G.655

Central frequencies and wavelength see Table 43. on page 320

Application types Terminal Multiplexer (LT), back–to–back terminals (HUB), OADM inprotected and unprotected linear links and rings, In Line Amplifier,CPE

Interfaces types Electrical interfaces: 2Mbps G.703, 64Kbps (user channels)

Optical interfaces: all the client and WDM interfaces above listed

Applied standards

ITU–T Recommendation G.681 Functional characteristics of interoffice and long–haul line systemsusing optical amplifiers, including optical multiplexing

ITU–T Recommendation G.692 Optical interfaces for multichannel systems with optical amplifiers

ITU–T Recommendation G.693 Optical interfaces for intra–office–systems

ITU–T Recommendation G.709 Network Node Interface for the Optical Transport Network (OTN)

ITU–T Recommendation G.957 Optical interfaces for equipments and systems relating to the syn-chronous digital hierarchy

ITU–T Recommendation G.958 Digital line systems based on the synchronous digital hierarchy foruse on optical fibre cables

ETS 300 232 A1 Transmission and multiplexing; Optical interfaces for equipmentsand systems relating to the Synchronous Digital Hierarchy (SDH)

GR – 253 – CORE Synchronous Optical Network (SONET) Transport Systems: Com-mon Generic Criteria, issue 2C

IEEE G.802.3 Gigabit Ethernet specification

ANSI x 3.184 1993 standards FE and FDDI specification

ANSI x 3.320 standard (100–SM–LL–I) FC and FICON specification

IBM SA–0394–03 ESCON specification

ITU–T BT.656–4, BT1363–1, BT1367 Digital Video specification

SMPTE 292M–1998 Television – Bit Serial Digital Interface for High–Definition TelevisionSystems

IEEE 802.3 Carrier sense multiple access with collision detection (CSMA/CD)access method and physical layer specifications

GR – 63 – CORE Network Equipment – Building System (NEBS) Requirements:Physical Protection, issue 1

ITU–T Recommendation G.664 Optical Safety procedures and requirements for optical transportsystems

IEC 825 Safety of laser products

EN 60950 Safety of information technology equipment, including electricalbusiness equipment

GR – 1089 – CORE Electromagnetic Compatibility and Electrical Safety – Generic Cri-teria for Network Telecommunication equipment

pr ETS 300 386–1pr ETS 300 386–2–2

Equipment Engineering ; Public telecommunication network equip-ment. Electro–magnetic compatibility requirements:Part 1 : Product family overview, compliance criteria and test levelsPart 2–2 : Product specific compliance criteria and operating condi-tions – Transmission equipment, Version : 0.7, 1996.02.29

ITU–T Recommendation G.825 The control of jitter and wander within digital networks which arebased on the synchronous digital hierarchy to be published

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SMPTE RP184–1996 Specification of Jitter in Bit–Serial Digital Systems

T11/98 – 055 Fiber Channel – Methodologies for Jitter Specification

EN 55022 Limits and methods of measurement of radio interference charac-teristics of information technology equipment

ETS 300 019–1–1ETS 300 019–1–2ETS 300 019–1–3

Equipment Engineering: Environmental conditions and environ-mental tests for telecommunications equipment. Classification ofenvironmental conditions (storage/transportation/stationary use)

Add–Drop and Cross–Connect features

Connectivity Tributary to Mux/Demux wavelength assigment

Mux/Demux to Mux/Demux wavelength assigment

Tributary to tributary wavelength assigment

Loopbacks

Protections

Network protections Optical SNCP

Equipment optical protections 1+1 MCC1 / MCC2 / MCC3

1+1 MCC + 4xANY (only MCC is protected)

1+1 4xANY (each client/drawer can be protected)

1+1 (MCC2 / MCC3) + OAC

1+1 OCC10

1+1 OCC10 + OAC

Powering protections 1+1 Power Supply Card

Management interfaces

Functions provided – Q3 interf with PC (ECT/RECT), 1353SH and 1354RM NMS(on terminal)

– Station alarms– Equipment Alarm status (indicated by the front cover LEDs)– Visual indications for card fail.

Management interfaces supported: – Q3/TL1 to connect a Local or Remote Equipment Craft Termi-nal

– Ethernet (on LAN_Q board) to connect the OS 1353SH andother ALCATEL NE’s with ETHERNET Interface

– QECC to connect other Q3 NEs

Local interface: Craft Interface (PC) RS232 SUB–D 9pin, PC compatible at 9600 bps

Remote interface: Craft Interface (PC) RS232 SUB–D 9pin, PC compatible at 9600 bps.It handles up to 32 NEs via DCC (D1D3 and/orD4D12)

Remote interface: Transmission ManagementNetwork (TMN) interface

ITU–T G.773 10 base–2 and 10 base–T

Protocol Stack/Informa-tion Model messages

Q3/QECC or TL1

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Operation processes (management interfaces functions)

Configuration and provisioning Equipment, Units; Add–Drop; Cross–connection, Synchronization,Protection, Alarms status, Maintenance memory for all the equip-ment events

Software download It is made locally as well as remotely on non volatile memories with-out traffic interruption

Performance monitoring (on B1 byte) According to ITU–T G.784, G.826, , G.821, M.2101.1

Remote Inventory At rack, subrack and board level

Unit and equipment acknowledgement Through Remote Inventory: Company id, Unit type, Unit part num-ber, Software part number, CLEI code, Manufacturing Plant, DateIdentifier, Date of construction... For details, refer to the operator’shandbook

Security Password, operator profile, back up for programs and data

Unit substitution characteristics

For transponders, optical amplifiersand Mux/Demux

without traffic interruption in case of Optical SNCP

For 4xANY without traffic interruption if all 4xANY drawers/clients are protected

Housekeeping (HK)

Number of housekeeping accesses 8 inputs and 8 outputs

Connector SUB–D 25 pins

Output HK signals–CPO (Remotealarms used for remote control)

By electronic relay contacts to be connected to the external negativevoltage

– Max. guaranteed current withclosed condition

50 mA

– Max. allowed voltage with opencondition

–72 V

– Voltage drop vs ground withclosed condition

–2 V ÷ 0 V

Input housekeeping signals (CPI)

– Max. guaranteed current withclosed condition

3 mA

– Max. allowed voltage with opencondition

–72 V

– Voltage drop vs ground withclosed condition

–2 V ÷ 0 V

Rack Alarms (RAI)

Connector SUB–D 9 pins

Max. guaranteed current with closedcondition

100 mA

Voltage difference between Common out and OUT < 2,5 Volts

Resistance of the closed relay = 300 Mohm max

Max. allowed voltage with open condition –72 V

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Automatic shutdown

According to IEC 825 and ITU–T Rec. G.958 regarding ALS

Optical Supervisory Channel (OSC) characteristics

Digital signal

Nominal bit rate 4 864 kbit/s (default configuration) => 2Mb for LAPD + 2 Mb for User

Coding asynchr. scrambled (215–1) + synchronous scrambled (27–1) NRZ

SPV Optical Path

Attenuation range 9 ÷ 49 dB

Maximum dispersion 4000 ps/nm

Maximum reflectance 27 dB

Minimum ORL of cable plant at S,including any connector

24 dB

SPV Receiver specification

Sensitivity @ BER = 10–9 –50 dBm ÷ –47 dBm

Overload @ BER = 10–9 –6 dBm

Maximum receiver reflectance –28 dBm

SPV Transmitter specification

Type of source DFB

Wavelength 151010 nm

Maximum –20 dB width 1 nm

Minimum side mode suppression ratio 33 dB

Optical Output power –1 dBm ÷ +4 dBm

Minimum Extinction Ratio 8.2 dB

Clock characteristics

Transponders support 3R regeneration. External clock is not required

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Table 43. Nominal frequencies allocation plan in C–Band

BandCentral frequency (GHz)

(Craft terminal name)Channel Number

Central wavelength (nm)wavelength deviation : 0,12 nm (EOL)

192,000 20 1561,42

192,100 21 1560,61

192,200 22 1559,79

192,300 23 1558,98

L2

192,500 25 1557,36

192,600 26 1556,55

192,700 27 1555,75

BLUE192,800 28 1554,94

BLUEBANDBAND

193,000 30 1553,33

193,100 31 1552,52

193,200 32 1551,72

193,300 33 1550,92

L1

193,500 35 1549,32

193,600 36 1548,51

193,700 37 1547,72

193,800 38 1546,92

194,200 42 1543,73

194,300 43 1542,94

194,400 44 1542,14

194,500 45 1541,35

S2

194,700 47 1539,77

194,800 48 1538,98

194,900 49 1538,19

RED195,000 50 1537,40

REDBANDBAND

195,200 52 1535,82

195,300 53 1535,04

195,400 54 1534,25

195,500 55 1533,47

S1

195,700 57 1531,90

195,800 58 1531,12

195,900 59 1530,33

196,000 60 1529,55

The MCC transponders support two channels each. 16 different boards are able to cover the 32 ch.The OCC10 transponders support one channel each. 32 different boards are needed to cover the 32 ch.

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Main Optical transmission levels

Client signals DWDM line

Up to 32

DMUXTransponderUser TxUser Rx

Line Tx

Line Rx

WDM Tx

WDM Rx

BoosterMUXVOA*

VOA* is used with MCC2 only

Preamp

Optical levels

User Rx (MCC):• sensitivity (BER = 10–10)• overload (BER = 10–10)

–18 dBm 0 dBm

User Tx (MCC):• output power (minimal):• output power (maximal):

–5 dBm0 dBm

MCC

WDM Rx (MCC):• sensitivity (BER = 10–10):• overload (BER = 10–10):

–28 dBm–8 dBm

MCCWDM Tx (MCC):

• output power (minimal):• output power (nominal):• output power (maximal):

6 dBm6.5 dBm9 dBm

(MCC2 and MCC3) with VOA using• output power minimal:

(chip access)–14 dBm

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User Rx (OCC10), including transmission penalty:• sensitivity (BER = 10–12)• overload (BER = 10–12)

–13 dBm 0 dBm

User Tx (OCC10):• output power (minimal):• output power (maximal):

–6 dBm–1 dBm

OCC10WDM Rx (OCC10) after FEC, including transmission penalty:

OCC10 • sensitivity (BER = 10–12):• overload (BER = 10–12)

–13 dBm–5 dBm

WDM Tx (OCC10), VOA min:• output power (minimal):• output power (maximal):

–4 dBm+1.5 dBm

(OCC10) with VOA using• output power minimal:

(chip access)–24 dBm

Line Rx without optical amplification:• input power (minimal):• input power (maximal):

–19 dBm15 dBm

Line Tx without optical amplification:• output power (minimal):• output power (maximal):

–19 dBm15 dBm

Line Rx with optical amplification:• input power (minimal):• input power (maximal):

–32 dBm17 dBm

Line Tx with optical amplification:• output power (minimal):• output power (maximal):

2 dBm17 dBm

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5.2 Safety requirements and mechanism

5.2.1 Electrical safety

The electrical and mechanical safety is compliant with the requirements of the EN 60 950 Standard [17]and the NEBS Level 3 Bellcore GR–63 [19] and GR–1089 [20] Standard.

Electrical safety

Safety status of the connections withother equipment

TNV (Telecommunication Network Voltage) for Remote alarms,Housekeeping (CPO,CPI), Rack lamps (RM) and tributary connec-tions if K20 protected.

SELV (Safety Extra Low Voltage) for all the other.

5.2.2 Optical safety

5.2.2.1 Hazard Level classification and standards

The HAZARD LEVEL of different ports of the system is widely treated in “UNIT DESCRIPTION” – of thisTechnical Handbook (see paragraphs “Automatic shutdown” and “automatic shutdown” for each unit).

HAZARD LEVEL classification:

– HAZARD LEVEL 1M, according to IEC 60825–1 (1998) + Am. 2 (2001), IEC 60825–2 (2000) andITU–T Rec. G.664 standards or

– HAZARD LEVEL 3A, according to IEC 60825–1 (1998), IEC 60825–2 (2000)

can be assigned to all ports of the system with the exception of the 4xANY boards, classified asHAZARD LEVEL 1 laser products.

G.664 standard defines two kinds of optical safety mechanisms :– Automatic Laser Shutdown (ALS) : Procedure to automatically shutdown the output power of laser

transmitters and optical amplifiers to avoid exposure to hazardous levels.– Automatic Power ShutDown (APSD) : Procedure to automatically shutdown the output power of opti-

cal amplifiers to avoid exposure to hazardous levels.In order to be clearer, in the following paragraphs,– safety procedure for transponders is called ALS– safety procedure for amplifiers is called APSD.

5.2.2.2 Equipment classification

The 1696MSPAN equipment is classified as hazard level 1M (optical power in the [10 ÷ 21.3] dBm range).

1696MS_C equipment is also classified as hazard level 1M.

N.B. The classification refers to the IEC 60825–1 and IEC 60825–2 Standards. The OSC alone isclassified as hazard level 1.

5.2.2.3 Location type

The equipment shall be installed in “restricted location” (industrial and commercial premises) or controlledlocations (optical cable ducts and switching centers).

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5.2.2.4 Labelling

The labeling of the optical sources is compliant with the requirements of the IEC 60825 Standard.

The labels reported below are put during factory settings. The labels are affixed on all front covers thatprotect optical connectors located on the front side plate of all the units involved in optical transmission:

The optical interfaces which have HAZARD LEVEL 1 the following explanatory label

The following label indicates the presence of a LASER beam. If the laser is a Hazard Level 1 or 1M product,this label is not compulsory.

Example of EXPLANATORY label.

The optical interfaces which have HAZARD LEVEL 1M according to IEC 60825–1 (2001), IEC 60825–2(2000) and ITU–T Rec. G.664 standards and operate at 3rd window, carry the following explanatory label

The optical interfaces which have HAZARD LEVEL 3A according to IEC 60825–1 (1998), IEC 60825–2(2000) and operate at 3rd window, carry the following explanatory label

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5.2.2.5 Engineering design features

In normal operating conditions, unless intentional manumission, the laser radiation is never accessible.

The laser beam is launched in optical fibre through an opposite connector that totally shuts up the laserradiation.

In case of cable fibre break, to minimize exposure times, ALS procedure is implemented depending onthe location where the fibre break occurred.

ALS procedures are explained in 5.2.2.8, where shutdown and reactivation times are also reported.

5.2.2.6 Safety instructions

The safety instructions for proper assembly, maintenance and safe use including clear warning concerningprecautions to avoid possible exposure to hazardous laser radiation, are reported on:

– section 3.2.4 on page 26 thru 27, as far as this handbook is concerned

– the appropriate parts of the other handbooks envisaged for this equipment (see section 5.2.2.7).

5.2.2.7 Automatic power shutdown with amplifiers

The APSD procedure for the 1696MS amplifiers is not implemented in current release: according to theIEC 60825 standard, APSD is not mandatory.

5.2.2.8 Automatic Laser Shutdown at WDM side (ALS_WDM) with transponders

The ALS procedure is compliant with ITU–T G.664 recommendation.

In the 1696MSPAN the ALS procedure is proposed by the transponder cards (MCC and OCC10). TheWDM receiver shuts down the WDM transmitter in the opposite direction when it detects an Input LossOf Signal (ILOS, i.e.: optical input power MCC1, MCC2 and OCC10 is too low) or a loss of clock (LOC)for MCC2 and OCC10.

The shutdown of all the transponders on the affected link is carried within less than 3 s, as required by theITU–T Rec. G.664.

It is up to the user to enable or disable the ALS. The default configuration is ALS–disable.The possible ALS mode are:– ALS disable with laser ON– ALS disable with laser OFF– ALS disable (default configuration)– ALS enable.During the ALS procedure, the OSC is still working.This configuration is done at equipment point of view and can be sent transponder by transponder or fora set of transponders.

The ALS is implemented in WDM terminal and OADM sites in order to have a safety mechanism indepen-dent from the host systems. During ALS, the optional OSC is still working.

In case of fiber break, a mechanism is proposed in order to shutdown the transponders in the previoussite, before the fiber break.

In case of regenerators (back–to–back terminals) and OADM, the way of working is the same. The ALSprocedure is done in the section when the fiber failure occurred. The WDM receiver shutdowns the WDMtransmitter in the opposite direction when it detects a Loss Of Signal (LOS) (MCC1, MCC2, OCC10) ora Loss Of Clock (LOC) (MCC2, OCC10).

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5.2.2.8.1 ALS in non–amplified networks

In point–to–point configuration, ALS is performed in four steps (see Figure 214. ):

(1) ILOS detection at Rx WDM access of an MCC/OCC10 board of the terminal Band LOC detection at WDM Tx access B (if in pass–through configuration).

(2) ShutDown (SD) command sent to the Tx WDM access of all the terminal B MCC/OCC10 boards of theopposite transmission direction.

(3) Shutting Down all the Tx WDM access of the terminal B (step (2)), causes an ILOS detection at Rx WDMaccess and a LOC detection at WDM Tx access of the MCC/OCC10 boards of the terminal A (if in pass–through configuration).

(4) ShutDown (SD) command sent to the Tx WDM access of all the MCC/OCC10 boards of the terminalA.

(1)

(2)(3)

(4)

T

R

A

N

S

P

O

N

D

E

R

RXWDM

TXWDM

ILOS

SD

T

R

A

N

S

P

O

N

D

E

R

TXWDM

RXWDM

ILOS

SD

terminal A terminal B

MUX

DMUX

DMUX

MUX

SD stands for ShutDownILOS stands for Input Loss Of Signal

LOC

LOC

LOC stands for Los Of Clock

(16 or 32 ch.) (16 or 32 ch.)

Figure 214. ALS mechanism on WDM line in point–to–point configuration

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For a circuit with regeneration/pass–through, ALS is performed in eight steps as described in the following(see Figure 215. ):

(1) ILOS detection at RX WDM access of an MCC/OCC10 board of the terminal Band LOC detection at WDM Tx access.

(2) ShutDown (SD) command sent to the Tx WDM access of all the MCC/OCC10 boards of the same trans-mission direction and ShutDown (SD) command sent to the Tx WDM access of the opposite transmissiondirection.

(3) ILOS detection at Rx WDM access of all MCC/OCC10 boards of the 16 ch. terminalor LOC detection at Tx B&W.

(4) Shutting Down on a Tx WDM access and Tx B&W access of the 16 ch. terminal.

TXWDM

RXWDM

MUX

DMUX

MUX

DMUX

RXWDM

TXWDM

TXWDM

RXWDM

MUX

DMUX

(1)

(2)

(4) ILOS

SD

SD LOCB&WRX

B&WTX

pass–trough channels (terminal B))16 channels terminal

ILOS(3)(4) SD

SD stands for ShutDownILOS stands for Input Loss Of SignalLOC stands for Los Of Clock

pass–trough channels

(2)SD

Figure 215. ALS in OADM configuration, channel in pass–through or in add/drop

The ALS mode for pass–through MCCs/OCC10s must be disabled to insure reliable automaticrestart. Note also that ILOS is propagated through the pass–through MCCs/OCC10s even if theALS mode is disable.

ALS and LOS propagation are 2 inpedendant procedures.

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The ALS procedure in a ring with OSNC–P, is the same of the previous case (circuit with regeneration/pass–through) and the SD on the end node generates a (5) protection switch (see Figure 216. ).

MUX

DMUX

TXWDM

RXWDM

RXB&W

TXB&W

MUX

DMUX

protection

RXB&W

TXB&W

TXWDM

RXWDM

SD

SD

ILOS

(4)

(3)(4)

MUX

DMUX

TXWDM

RXWDM

RXB&W

TXB&W

MUX

DMUX

RXB&W

TXB&W

TXWDM

RXWDM

SD

SD

ILOS

MUX DMUX

RX

WD

M

TX

WD

M

MUXDMUX

TX

WD

M

RX

WD

M

ILO

S(1)

SD

(2)IL

OS

LO

C

SD

request

protectionrequest

SD stands for ShutDownILOS stands for Input Loss Of SignalLOC stands for Los Of Clock

(5)

(5)

Figure 216. ALS procedure in a ring with Optical SNCP, in case of fiber failure in the ring

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5.2.2.8.2 ALS in amplified networks

See Figure 217. , Figure 218. and Figure 219. ALS for transponders is supported in amplified networks. On the contrary, APSD is not supported for ampli-fiers. However, in the particular case of point–to–point amplified transmission without OADM repeater, ALS pro-cedure is enough to provide optical safety thanks to LOS propagation. Amplifiers must be in APSD disable state.

TXWDM

RXWDM

MUX

DMUX

ILOS1

SDSD1

ILOSLOC

21

ILOS2

SD2

ILOS1SD1

2 1

ILOS2SD2

WDMRX

WDM

MUX

DMUX

SD

ILOSLOC

TX

SD stands for ShutDownILOS stands for Input Loss Of SignalLOC stands for Los Of Clock

Figure 217. ALS procedure in a point–to–point amplified transmission without OADM repeater

TXWDM

RXWDM

MUX

DMUX

ILOS1

SDSD1

ILOSLOC

21

ILOS2

SD2

ILOS1SD1

2 1

ILOS2SD2

WDMRX

WDM

MUX

DMUX

SD

ILOSLOC

TX

ILOS1

SD1 21

ILOS2

SD2

ILOS1SD1

2 1

ILOS2SD2

SD stands for ShutDownILOS stands for Input Loss Of SignalLOC stands for Los Of Clock

Figure 218. ALS mechanism with cascaded pre–amplifier and booster

TXWDM

RXWDM

MUX

DMUX

ILOS1

SDSD1

ILOSLOC

1

2

ILOS2SD2

WDMRX

WDM

MUX

DMUX

SD

ILOSLOC

TX

2

ILOS2

SD2

ILOS1SD1

1

SD stands for ShutDownILOS stands for Input Loss Of SignalLOC stands for Los Of Clock

Figure 219. ALS mechanism with single pre–amplifier and booster

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5.2.2.8.3 ALS restart concept

After an ALS occurs, one restart mode is available: Automatic restart. The time values and the restart wayof working in the various restart schemes are described in Figure 220. The restart way of working is de-fined at equipment point of view.

As the ALS is done at MCC/OCC10 unit level, each transponder board will restart independently.When OAC are used, the restart procedure is done by the amplifier board.During the switch on and the switch off time, the channel wavelength remains between λ ITU ± 500 pm.

Start

Section in

operationALS_WDM enable

Receive signalfrom far end?

Loss of received signal

for more than 500 ms ?

Automatic Power Shut Down

Automatic restart

Delay time

18020 s

Tx on for (200.5) s

Yes

No

No

Yes

Figure 220. Restart algorithm

The figures of the ALS timing are compliant with the ITU–T Rec.G.664. The standard recommends a pulselength of 2s except in the case of amplified network where the pulse length can be greater (§ 6.3 of thestandard).

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5.3 Boards interfaces characteristics

5.3.1 Tributaries optical characteristics

5.3.1.1 Multirate Channel Card (MCC1, MCC2, MCC3, MCC_RGN) characteristics

Optical interfaces specification, User side (MCC_RGN doesn’t have B&W interfaces)

Common optical interfaces specification, user side

Bit rate, client side with MCC2 and MCC3 using, all the bit rates are 3Rwith MCC1 using, (*) indicates the 3R bit rates100 Mbps : FDDI125 Mbps : Fast Ethernet, FDDI132.815 Mbps : FC (12-M6–LE–I)155.520 Mbps : STM–1/OC–3 (*)200 Mbps : ESCON265.620 Mbps : FC (25-M6–LL–I)270 Mbps : Digital Video466.560 Mbps : OC–9531.250 Mbps : FC (50-M5–SL–I)622.080 Mbps : STM–4/OC–12 (*)933.120 Mbps : OC–181062.5 Mbps : FICON (*), Fiber Channel (*)1244.160 Mbps : OC–241250 Mbps : Gigabit Ethernet (*)1866.120 Mbps : OC–362125.00 Mbps : 2FC (*)2488.320 Mbps : STM–16/OC–48 (*)2500 Mbps : INFINIBAND

Wavelength range 1260 1360 nm1470 1610 nm for CWDM

User interface type S–16.1

Connector type MU horizontal for MCC1, MCC2 LC (on SFP module) for MCC3

User Rx : optical interfaces specification MCC1 MCC2 MCC3

Fiber type Multi–mode (MMF) 62.5 / 125 um

Sensitivity @ BER = 10–10 –18 dBm –18 dBm see para.Overload @ BER = 10–10 0 dBm 0 dBm

see para.5.3.1.3 on

Maximum optical path penalty 1 dB 1 dB

5.3.1.3 onpage 335

Maximum receiver reflectance –27 dB –27 dB

User Tx : optical interfaces specification MCC1 MCC2 MCC3

Fiber type Single–mode (SMF)

Maximum –20 dB width 1 nm 1 nm

Minimum side mode suppression ratio 30 dB 30 dBsee para.Optical Output power min : –5 dBm

max : 0 dBmmin : –4.5 dBmmax : 0 dBm

see para.5.3.1.3 onpage 335

Minimum Extinction Ratio 8.2 dB 8.2 dBpage 335

Shutdown time < 5 ms < 5 ms

Re–activation time < 30 ms < 30 ms

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Optical interfaces specification, WDM Side

Common optical interfaces specification, WDM side

User interface type L–16.2

Wavelength specification ITU–T G.692, 100 GHz channel spacing

Wavelength tunability tunable over 2 wavelengths

Transmitter wavelength range 1528 1565 nm

Fiber type Single–mode (SMF)

Connector type MU horizontal

Center frequency 19x.y THz; for details refer to Table 43. on page 320and para. 5.3.2.1 on page 344, para. 5.3.2.2 on page346, para. 5.3.2.3 on page 347

Bit rate, WDM side transparent (output bit rate equals input bit rate)

WDM Rx : optical interfaces specification MCC1 MCC2/MCC3/MCC_RGN

Sensitivity @ BER = 10–10 (OSNR = 19 dB) –28 dBm –28 dBm

Overload @ BER = 10–10 –8 dBm –8 dBm

Maximum optical path penalty (over 1800 ps/nm) 2 dB

Maximum optical path penalty (up to 3200 ps/nm) 2 dB

Maximum receiver reflectance –27 dB –27 dB

WDM Tx : optical interfaces specification MCC1 MCC2/MCC3/MCC_RGN

Dispersion accommodation 1800 ps/nm 3200 ps/nm

Maximum –20 dB width with modulation 1 nm 1 nm

Minimum side mode suppression ratio 30 dB 30 dB

Optical Output power typ : 6.5 dBmmin : 6 dBmmax : 7 dBm

typ : 6.5 dBmmin : 6 dBmmax : 9 dBm

Optical power at board output w/ minimum VOA –––

typ : 5.7 dBmmin : 5.2 dBmmax : 8.2 dBm

Minimum Extinction Ratio 8.2 dB 8.2 dB

Maximum EOL Center Frequency Deviation 12.3 GHz 12.3 GHz

N.B. the values are given for EOL characteristics

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5.3.1.2 10 Gbps Optical Channel Card (OCC10) characteristics

Optical interfaces specification, User side

Common optical interfaces specification, user side

Bit rate, client side 9953.28 Mbps : STM–64/OC–192/10 GBE WAN

10.709 Gbps :(STM–64/OC–192/10GBEWAN)+FEC

10.3125 Gbps : 10 GBE LAN

11.096 Gbps : 10 GBE LAN + FEC

User interface type VSR2000–2R1 standard (similar to I–64.1)

Fiber type Single–mode (SMF)

Connector type MU horizontal

User Rx : optical interfaces specification

Wavelength range 1260 1360 nm

Sensitivity @ BER = 10–12 including PP –13 dBm

Overload @ BER = 10–12 0 dBm

Maximum optical path penalty 1 dB

Maximum receiver reflectance –27 dB

User Tx : optical interfaces specification

Wavelength range 1290 1330 nm

Maximum –20 dB width 1 nm

Minimum side mode suppression ratio 30 dB

Optical Output power min : –6 dBmmax : –1 dBm

Transmission length 20 Km

Minimum Extinction Ratio 6 dB

Shutdown time < 5 ms

Re–activation time < 30 ms

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Optical interfaces specification, WDM Side

Common optical interfaces specification, WDM side

WDM interface type L–64.2

Wavelength specification ITU–T G.692, 100 GHz channel spacing. The board is tunable over 1 wavelength

Transmitter wavelength range 1528 1565 nm

Center frequency 19x.y THz; for details refer to Table 43. on page 320

Bit rate, WDM side 10709 Mbps

Fiber type Single–mode (SMF)

Connector type MU horizontal

WDM Rx : optical interfaces specification (board input)

DTV (Decision Threshold voltage) is used to deal with transmission degraded by chromatic dispersion andoptical noise. In R. 2.2 there are two configurable operating points.The VOA placed before the Rx is automatically controlled in order to maintain its otput power constant.The following specification are given for a Tx + Rx couple.

Sensitivity @ BER = 10–12 after FEC correction in-cluding PP and OSNR = 19 dB

–13 dBm

Overload @ BER = 10–10 –5 dBm

VOA dynamic range 20 dB

Maximum optical path penalty (over –500 up to1600 ps/nm)

2 dB

Maximum receiver reflectance –27 dB

WDM Tx : optical interfaces specification (board output)

In order to provide a wide range chromatic dispersion tolerance, two operating points corresponding to highchromatic dispersion and to low chromatic dispersion.

NDC configuration NDC0 NDC1

Max EOL center frequency deviation 100 pm

Dispersion (NDC not configurable in R.2.0)• OSNR = 19 dB• OSNR = 21 dB

0 +1300 ps/nm0 +1600 ps/nm

–500 +800 ps/nm

Maximum –20 dB width 0.3 nm

Minimum side mode suppression ratio 30 dB

Optical Output power (VOA at min) –4 +1.5 dBm –2.5 +3 dBm

VOA dynamic range (configurable) 20 dB, step 1

Minimum Extinction Ratio 8.2 dB

N.B. All the figures are EOL

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5.3.1.3 SPF modules optical characteristics

SFP module type APD CWDM (Silver) PIN CWDM (Bronze)

Addressed wavelength (nm) 1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610

Min. launched power (dBm) 0 0

Max launched power (dBm) 5 5

Allowed bitrates 125 Mbps to 2.7 Gbps 125 Mbps to 2.7 Gbps

Min. extinction ratio (dB) 8.2 8.2

Max. –20dB bandwidth (nm) 1 1

Minimum SMSR (dB) 30 30

Max chromatic disp. (ps/nm) 1600 1000

Minimum sensitivity (dBm) –28 –18

Minimum overload (dBm) –9 –3

Max optic. path penalty (dB) 2 1

Max receiver reflect. (dB) –27 –27

Optical connector (Tx/Rx) LC LC

Fiber type SMF SMF

SFP module type S–4.1 Gbe–Sx Gbe–Lx FC–S FC–L I–16.1 S–16.1 MS–16.1

Addressed wavelength (nm) 1310 850 1310 850 1310 1310 1310 1310

Min. launched power (dBm) –15 –9.5 –11 –10 –12 –15 –5 –5

Max launched power (dBm) –8 –4 –3 –1 –3 –8 0 0

Allowed bit rates (Mbps) 622 1250 1250 1062.5 1062.5 2488 2488 100 to2700

Min. extinction ratio (dB) 8.2 8.2 9 9 9 8.2 8.2 8.2

Minimum sensitivity (dBm) –28 –7 –19 –16 –25 –18 –18 –18

Minimum overload (dBm) –8 –3 –3 0 –3 –3 –3 –3

Max receiver reflect. (dB) –27 –27 –27 –27 –27 –27 –27 –27

Optical connector (Tx/Rx) LC LC LC LC LC LC LC LC

Fiber type SMF MMF SMF/MMF MMF SMF SMF SMF SMF

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5.3.1.4 4 x ANY, 4 x ANY_S, 4xANY_P TDM Concentrators characteristics

Drawers Rx : 1310 nm optical interfaces specification

Drawer Rx : common 1310 nm optical interfaces specification

Fiber type Multi–mode 62.5 / 125 µm (MMF)

Optical connector type LC

Drawer Rx : Low Frequency 1310 nm cartridge specification (Rx)

Data rate 125 Mbps (100ppm) : Fast Ethernet, FDDI200 Mbps (100ppm) : ESCON270 Mbps (100ppm) : Digital Video

Operating wavelength 1270 1380 nm

Sensitivity @ BER = 10–10 -28 dBm

Overload @ BER = 10–10 -8 dBm

Maximum optical path penalty NA dB

Maximum receiver reflectance 12.5 dB

Drawer Rx : STM–1, STM–4 1310 nm cartridge specification (Rx)

Data rate 155.520 Mbps (20ppm) : STM–1622.080 Mbps (20ppm) : STM–4

Operating wavelength 1270 1380 nm

Sensitivity @ BER = 10–10 -28 dBm

Overload @ BER = 10–10 -8 dBm

Maximum optical path penalty NA dB

Maximum receiver reflectance –

Drawer Rx : High Frequency 1310 nm cartridge specification (Rx)

Data rate 1025 Gbps (100ppm) : Gigabit Ethernet1062.5 Gbps (100ppm) : FICON, Fiber Channel

Operating wavelength 1270 1355 nm

Sensitivity @ BER = 10–10 -20 dBm

Overload @ BER = 10–10 -3 dBm

Maximum optical path penalty NA dB

Maximum receiver reflectance 12 dB

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Drawers Tx : 1310 nm optical interfaces specification

Drawer Tx : common 1310 nm optical interfaces specification

Fiber type Single–mode 9 / 125 µm (SMF)

Laser type Class 1 Laser Safety

Optical connector type LC

Drawer Tx : Low Frequency 1310 nm cartridge specification

Data rate 125 Mbps (100ppm) : Fast Ethernet, FDDI200 Mbps (100ppm) : ESCON270 Mbps (100ppm) : Digital Video

Central wavelength 1270 1356 nm

Maximum RMS width 2.5 nm

Minimum side mode suppression ratio NA dB

Optical Output power min : –15 dBmmax : –8 dBm

Minimum Extinction Ratio 8.2 dB

Shutdown time < 5 ms

Re–activation time < 30 ms

Drawer Tx : STM–1, STM–4 1310 nm cartridge specification

Data rate 155.520 Mbps (20ppm) : STM–1622.080 Mbps (20ppm) : STM–4

Central wavelength 1270 1356 nm

Maximum RMS width 2.5 nm

Minimum side mode suppression ratio NA dB

Optical Output power min : –15 dBmmax : –8 dBm

Minimum Extinction Ratio 8.2 dB

Shutdown time < 5 ms

Re–activation time < 30 ms

Drawer Tx : High Frequency 1310 nm cartridge specification

Data rate 1025 Gbps (100ppm) : Gigabit Ethernet1062.5 Gbps (100ppm) : FICON, Fiber Channel

Central wavelength 1270 1355 nm

Maximum RMS width 4 nm

Minimum side mode suppression ratio NA dB

Optical Output power min : –12 dBmmax : –3 dBm

Minimum Extinction Ratio 9 dB

Shutdown time < 5 ms

Re–activation time < 30 ms

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Drawers Rx : 850 nm optical interfaces specification

Drawer Rx : common 850 nm optical interfaces specification

Fiber type Multi–mode 62.5 / 125 µm (MMF)

Optical connector type LC

Drawer Rx : Low Frequency 850 nm cartridge specification

Data rate 125 Mbps (100ppm) : Fast Ethernet, FDDI200 Mbps (100ppm) : ESCON270 Mbps (100ppm) : Digital Video

Operating wavelength 770 860 nm

Sensitivity @ BER = 10–10 -17 dBm

Overload @ BER = 10–10 0 dBm

Maximum optical path penalty NA dB

Maximum receiver reflectance 12 dB

Drawer Rx : High Frequency 850 nm cartridge specification

Data rate 1025 Gbps (100ppm) : Gigabit Ethernet1062.5 Gbps (100ppm) : FICON, Fiber Channel

Operating wavelength 830 860 nm

Sensitivity @ BER = 10–10 -17 dBm

Overload @ BER = 10–10 0 dBm

Maximum optical path penalty NA dB

Maximum receiver reflectance 12 dB

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Drawers Tx : 850 nm optical interfaces specification

Drawer Tx : common 850 nm optical interfaces specification

Fiber type Multi–mode 62.5 / 125 µm (MMF)

Laser type Class 1 Laser Safety

Optical connector type LC

Drawer Tx : Low Frequency 850 nm cartridge specification

Data rate 125 Mbps (100ppm) : Fast Ethernet, FDDI200 Mbps (100ppm) : ESCON270 Mbps (100ppm) : Digital Video

Central wavelength 830 860 nm

Maximum RMS width 30 nm

Minimum side mode suppression ratio NA dB

Optical Output power min : –9.5 dBmmax : –1.5 dBm

Minimum Extinction Ratio 9 dB

Shutdown time < 0.5 ms

Re–activation time < 300 ms

Drawer Tx : High Frequency 850 nm cartridge specification

Data rate 1025 Gbps (100ppm) : Gigabit Ethernet1062.5 Gbps (100ppm) : FICON, Fiber Channel

Central wavelength 830 860 nm

Maximum RMS width 30 nm

Minimum side mode suppression ratio NA dB

Optical Output power min : –9.5 dBmmax : –1.5 dBm

Minimum Extinction Ratio 9 dB

Shutdown time < 0.5 ms

Re–activation time < 300 ms

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2.5 Gbps optical interfaces specification, agregate side (4 x ANY)

Agregate Rx : 2.5 Gbps optical interface specification

User interface type I–16.1

Operating wavelength range 1266 1360 nm

Data rate 2488.320 Mbps 4.6 ppm

Optical connector type LC

Fiber type Multi–mode 62.5 / 125 µm (MMF)

Input power –18 –3 dBm

Sensitivity @ BER = 10–10 –18 dBm

Overload @ BER = 10–10 –3 dBm

Maximum receiver reflectance –27 dB

Agregate side Tx : 2.5 Gbps optical interfaces specification

User interface type I–16.1

Operating wavelength range 1266 1360 nm

Data rate 2488.320 Mbps 4.6 ppm

Optical connector type LC

Fiber type Single–mode 9 / 125 µm (SMF)

Maximum RMS width 4 nm

Minimum side mode suppression ratio NA dB

Optical Output power –10 –3 dBm

Minimum Extinction Ratio 8.2 dB

Shutdown time <5 ms

Re–activation time <30 ms

N.B. the values are given for EOL characteristics

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2.5 Gbps optical interfaces specification, agregate side (4 x ANY_S)

Agregate Rx : 2.5 Gbps optical interface specification

User interface type S–16.1

Operating wavelength range 1270 1360 nm

Data rate 2488.320 Mbps 4.6 ppm

Optical connector type LC

Fiber type Multi–mode 62.5 / 125 µm (MMF)

Input power –18 0 dBm

Sensitivity @ BER = 10–10 –18 dBm

Overload @ BER = 10–10 0 dBm

Maximum optical path penalty 1 dB

Maximum receiver reflectance –27 dB

Agregate Tx : 2.5 Gbps optical interfaces specification

User interface type S–16.1

Operating wavelength range 1270 1360 nm

Data rate 2488.320 Mbps 4.6 ppm

Optical connector type LC

Fiber type Single–mode 9 / 125 µm (SMF)

Maximum RMS width 1 nm

Minimum side mode suppression ratio NA dB

Optical Output power –5 0 dBm

Minimum Extinction Ratio 8.2 dB

Shutdown time <5 ms

Re–activation time <30 ms

N.B. the values are given for EOL characteristics

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2.5 Gbps optical interfaces specification, agregate side (4 x ANY_P)

Refer to para. 5.3.1.3 on page 335.

STM–1/4/16, Gigabit Ethernet, Fiber Channel and CWDM interfaces are used

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5.3.1.5 Multiple Variable Attenuator Card (MVAC) optical characteristics

MVAC optical interfaces specification

Fiber type Single mode (SMF)

Optical connector type MU horizontal

Wavelength range 1528 1610 nm

Insertion losses (IL) 3 dB

Attenuation dynamic range including IL (on each VOA input)

3 20 dB ; step = 0.5 dB

Attenuation accuracy 0.5 dB

Response time < 5 ms

Output measurement –50 +17 dBm

Optical ports levels

Optical input power (on both In1 & In2 inputs) –32 +17 dBm

Optical output power (on both Out1 & Out2 outputs) –52 +17 dBm

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5.3.2 Multiplexer units (OMDX) optical characteristics

5.3.2.1 L1 band Mux/Demux with expansion + supervision (OMDX8100_M_L1_XS) and with ex-pansion (OMDX8100_M_L1_X)

OMDX8100_M_L1_XS optical characteristics

MUX side specification OMDX8100_M_L1_XS OMDX8100_M_L1_X

Input power:

– single channels

– extra–input

– expansion input

– supervision input

– 32 +17 dBm

– 32 +17 dBm

– 32 +17 dBm

– 1 +1 dBm

– 32 +17 dBm

– 32 +17 dBm

– 32 +17 dBm

Insertion loss (max.)

– single channels

– extra–input

– expansion

– supervision

5.35 dB

3.1 dB

1.7 dB

15 dB

4.95 dB

2.7 dB

1.3 dB

Isolation (adjacent channels) – min 15 dB 15 dB

Output power – 32 +17 dBm – 32 +17 dBm

Monitoring Output Typically 18 dB below the associated optical power le-vel measurement

DEMUX side specification OMDX8100_M_L1_XS OMDX8100_M_L1_X

Input power – 32 +17 dBm – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Insertion loss (max.)

– single channels

– extra–output

– expansion

– supervision

5.55 dB

3.3 dB

1.9 dB

2.5 dB

4.95 dB

2.7 dB

1.3 dB

2.5 dB

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Output power

– single channels

– extra–output

– expansion output

– supervision output

– 32 +17 dBm

– 32 +17 dBm

– 32 +17 dBm

– 53 –14 dBm

– 32 +17 dBm

– 32 +17 dBm

– 32 +17 dBm

Isolation (adjacent channels) – min 22 dB 22 dB

Isolation (non adjacent channels), min 30 dB 35 dB

General characteristics OMDX8100_M_L1_XS OMDX8100_M_L1_X

L1 band channels 30; 31; 32; 33; 35; 36; 37; 38

L1 band channels central wavelenght 1553.33 nm (ch 30); 1552.52 nm (ch 31); 1551.72 nm (ch 32); 1550.92 nm (ch 33); 1549.32 nm (ch 35); 1548.51 nm (ch 36); 1547.72 nm (ch 37);1546.92 nm (ch 38)

channel bandwidth at –0.5 dB 0.11 nm 0.25 nm

channel bandwidth at –3 dB 0.15 nm 0.3 nm

end–to–end IL (max) 11.3 dB 10.8 dB

Isolation (LB vs SB) – min 15 dB 15 dB

PMD 0.15 ps 0.15 ps

PDL 0.25 dB 0.25 dB

connector type MU horizontal MU horizontal

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5.3.2.2 L2 and S1 band Mux/Demux

OMDX8100_M_L2 and OMDX8100_M_S1 optical characteristics

MUX side specification

Input power:

– single channels

– extra–input

– 32 +17 dBm

– 32 +17 dBm

Insertion loss (max.)

– single channels

– extra–input

3.75 dB

1.5 dB

Output power – 32 +17 dBm

DEMUX side specification

Input power – 32 +17 dBm

Insertion loss (max.)

– single channels

– extra–output

3.75 dB

1.5 dB

Output power

– single channels

– extra–output

– 32 +17 dBm

– 32 +17 dBm

General characteristics

L2 band channels and central wavelenght 1561.42 nm (ch 20); 1560.61 nm (ch 21); 1559.79 nm (ch 22); 1558.98 nm (ch 23); 1557.36 nm (ch 25); 1556.55 nm (ch 26); 1555.75 nm (ch 27);1554.94 nm (ch 28)

S1 band channels and central wavelenght 1535.82 nm (ch 52); 1535.04 nm (ch 53); 1534.25 nm (ch 54); 1533.47 nm (ch 55); 1531.90 nm (ch 57); 1531.12 nm (ch 58); 1530.33 nm (ch 59);1529.55 nm (ch 60)

channel bandwidth at –0.5 dB 0.11 nm

channel bandwidth at –3 dB 0.15 nm

end–to–end IL (global) (max) 14.7 dB

rejection of dropped channels extra–port (min) 12 dB

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.2.3 S2 band Mux/Demux

OMDX8100_M_S2 optical characteristics

MUX side specification

Input power:

– single channels

– extra–input

– 32 +17 dBm

– 32 +17 dBm

Insertion loss (max.)

– single channels

– extra–input

3.75 dB

1.5 dB

Output power – 32 +17 dBm

DEMUX side specification

Input power – 32 +17 dBm

Insertion loss (max.)

– single channels

– extra–output

3.75 dB

1.5 dB

Output power

– single channels

– extra–output

– 32 +17 dBm

– 32 +17 dBm

General characteristics

S2 band channels 42; 43; 44; 45; 47; 48; 49; 50

S2 band channels central wavelenght 1543.73 nm (ch 42); 1542.94 nm (ch 43); 1542.14 nm (ch 44); 1541.35 nm (ch 45); 1539.77 nm (ch 47); 1538.98 nm (ch 48); 1538.19 nm (ch 49);1537.40 nm (ch 50)

channel bandwidth at –0.5 dB 0.11 nm

channel bandwidth at –3 dB 0.15 nm

end–to–end IL (w/OMDX8100_M_L1_XS) (max) 13.1 dB

rejection of dropped channels extra–port (min) 12 dB

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.3 Multiplexer units (OADM) optical characteristics

5.3.3.1 8 channels OADM with supervision

OADM8100_M_L1(L2/S1/S2)_S optical characteristicsDEMUX side specification

Input power (SPV + 1530 1560 nm) – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Output power– single channels– extra–output– supervision output

– 32 +17 dBm– 32 +17 dBm– 53 –14 dBm

Insertion loss– single channels– extra–output

4.75 dB2.5 dB

MUX side specification

Output power – 32 +17 dBm

Monitoring Output Typically 18 dB below the associated optical power le-vel measurement

Input power:– single channels– extra–input– supervision input

– 32 +17 dBm– 32 +17 dBm– 1 +1 dBm

Insertion loss– single channels– extra–input

4.55 dB2.3 dB

Isolation

in–band (dropped vs added channels) >24 dB

8 dropped channels isolation– adjacent channels– non adjacent channels

>22 dB>35 dB

Supervision

Rx side IL 2.3 dB

Tx side IL 2 dB

SPV rejection (Rx side) >28 dB

General characteristics

L1, L2, S1, S2 band channels and central wave-lenght

see para. 5.3.2.1 on page 344, para. 5.3.2.2 on page346, para. 5.3.2.3 on page 347

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.3.2 4 channels OADM with supervision

OADM4100_M_chxx–yy_S optical characteristicsDEMUX side specification

Input power – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Output power– single channels– extra–output– supervision output

– 32 +17 dBm– 32 +17 dBm– 53 –14 dBm

Insertion loss– single channels– extra–output

4.45 dB2 dB

MUX side specification

Output power – 32 +17 dBm

Monitoring Output Typically 18 dB below the associated optical power le-vel measurement

Input power:– single channels– extra–input– supervision input

– 32 +17 dBm– 32 +17 dBm– 1 +1 dBm

Insertion loss– single channels– extra–input

4.25 dB1.8 dB

Isolation

in–band (dropped vs added channels) >24 dB

4 dropped channels isolation

– adjacent channels

– non adjacent channels

>22 dB

>35 dB

Supervision

Rx side IL 2.3 dB

Tx side IL 2 dB

SPV rejection (Rx side) >28 dB

General characteristics

Channels range per board 2023; 2528; 3033; 3538; 4245; 4750;5255; 5760

Central wavelenght per channel see para. 5.3.2.1 on page 344, para. 5.3.2.2 on page346, para. 5.3.2.3 on page 347

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.3.3 2 channels OADM with supervision

OADM2100_M_chxx–yy_S optical characteristics

MUX side specification

Input power:– single channels– extra–input– supervision input

– 32 +17 dBm– 32 +17 dBm– 1 +1 dBm

Insertion loss (max.):– single channels– extra–input

2.7 dB2.2 dB

Rejection of added channels 13.5 dB

Isolation (adjacent channels) 22 dB

Output power – 32 +17 dBm

Monitoring Output Typically 18 dB below the associated optical power le-vel measurement

DEMUX side specification

Input power – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Insertion loss (max.):– single channels– extra–output

3.9 dB2.4 dB

Output power– single channels– extra–output– supervision output

– 32 +17 dBm– 32 +17 dBm– 53 –14 dBm

Rejection of dropped channels 13.5 dB

Isolation (adjacent channels) 44 dB

General characteristics

Channels range per board 30–31; 32–33; 35–36; 37–38; 47–48

Central wavelenght per channel see para. 5.3.2.1 on page 344 and 5.3.2.3 on page 347

Channel passband at –0.5 dB 0.25 nm

Channel passband at –3 dB 0.3 nm

End–to–end IL (max) 9.4 dB

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.3.4 1 channel OADM with supervision

OADM1100_M_xx_S optical characteristics

MUX side specification

Input power:– single channel– extra–input– supervision input

– 32 +17 dBm– 32 +17 dBm– 1 +1 dBm

Insertion loss (max.):– single channels– extra–input

2.2 dB1.7 dB

Rejection of added channels 13.5 dB

Isolation (adjacent channels) 22 dB

Output power – 32 +17 dBm

Monitoring Output – 49 0 dBm; typically 18 dB below the associated op-tical power level measurement

DEMUX side specification

Input power – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Insertion loss (max.):– single channels– extra–output

3.4 dB1.9 dB

Output power– single channels– extra–output– supervision output

– 32 +17 dBm– 32 +17 dBm– 53 –14 dBm

Rejection of dropped channels 13.5 dB

Isolation (adjacent channels) 44 dB

General characteristics

Channels range per board 30; 31; 32; 33; 35; 36; 37; 38; 47; 48

Central wavelenght per channel see para. 5.3.2.1 on page 344 and 5.3.2.3 on page 347

Channel passband at –0.5 dB 0.25 nm

Channel passband at –3 dB 0.3 nm

End–to–end IL (max) 8 dB

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.4 Mux/Demux 1310–1550 + supervision unit optical characteristics

SPV_F_1310_1550 optical characteristics

MUX side specification

Input power:

– SPV channel

– 1310 nm input

– 1550 nm input

– 1 +1 dBm

– 20 0 dBm

– 32 +17 dBm

Insertion loss (max.):

– SPV channel

– 1310 nm channel

– 1550 nm channel

14.6 dB

2 dB

2 dB

Isolation (1310 nm vs 1550 nm) min 30 dB

Output power – 32 +17 dBm

Monitoring Output Typically 18 dB below the associated optical power le-vel measurement

DEMUX side specification

Input power – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Insertion loss (max.):– SPV channel– 1310 nm channel– 1550 nm channel

2.1 dB2.2 dB2.2 dB

Output power– SPV channel– 1310 nm input– 1550 nm input

– 53 –14 dBm– 20 0 dBm– 32 +17 dBm

Isolation (1310 nm vs 1550 nm) min 30 dB

General characteristics

Channel passband at 1550 nm 1528 1560 nm

Channel passband at 1310 nm 1250 1350 nm

End–to–end IL (max) at 1310 nm 4.2 dB

End–to–end IL (max) at 1550 nm 4.2 dB

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.5 SPV_F_C unit optical characteristics

SPV_F_C optical characteristics

MUX side specification

Input power:

– SPV channel

– extra input

– 1 +1 dBm

– 32 +17 dBm

Insertion loss (max.):

– SPV channel

– extra input

14.2 dB

1.2 dB

Output power – 32 +17 dBm

Monitoring Output Typically 18 dB below the associated optical power le-vel measurement

DEMUX side specification

Input power – 32 +17 dBm

Monitoring Input Typically 18 dB below the associated optical power le-vel measurement

Insertion loss (max.):

– SPV channel

– extra–input

1.7 dB

1.4 dB

Output power

– SPV channel

– extra–output

– 50 –14 dBm

– 32 +17 dBm

General characteristics

Channel passband at 1550 nm 1528 1560 nm

Channel passband at 1310 nm 1250 1350 nm

End–to–end IL (max) 2.6 dB

PMD 0.15 ps

PDL 0.25 dB

connector type MU horizontal

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5.3.6 Optical Amplifier Card (OAC) optical characteristics

Optical Amplifier Card optical interfaces specificationParameter Symbol Min Typ Max Unit

Wavelength range λs 1529.1 1561.8 nm

(32 channels) OAC1 and OAC2 optical characteristics

1st stage output power (EOL) OOPV1 12 dBm

2nd stage output power OOPV2 17 dBm

1st stage spectral gain excursion (1) ∆G 4 4.5 dB

2nd stage spectral gain excursion (1) ∆G1 2 2.2 dB

Noise figure (2) NF 6.8 dB

(1): With an input signal power of –5 dBm and an output power of +17 dBm. (2): With an input signal power of –11 to –5 dBm and an output power of +17 dBm.

(32 channels) OAC1_L and OAC2_L optical characteristics

1st stage output power (EOL) OOPV1 12 dBm

2nd stage output power OOPV2 17 dBm

1st stage spectral gain excursion (1) ∆G 4 5 dB

2nd stage spectral gain excursion (1) ∆G1 2 2.2 dB

Noise figure (2) NF 6 dB

(1): With an input signal power of –11 dBm and an output power of +17 dBm.(2): With an input signal power of –17 to –11 dBm and an output power of +17 dBm.

Optical ports specification

Fiber type single mode (SMF)

Optical connector type MU/PC ; MU/APC for extra pump

I/O Function OAC1, OAC2 level OAC1_L, OAC2_L level

VOA attenuation range 1 15 dB 1 15 dB

I VOA input –24.5 +6.5 dBm –32 +17 dBm

O VOA output –26 +5 dBm –47 +17 dBm

I 1st stage input –26 +5 dBm –47 +17 dBm

O 1st stage output –3 +12 dBm –3 +12 dBm

I 2nd stage input –18 +9 dBm –32 +17 dBm

O 2nd stage output +2 +17 dBm +2 +17 dBm

I SPV extraction

O SPV insertion

O 1st stage input monitor Typically 20dB below the associated level measurement

O 1st stage output monitor Typically 20dB below the associated level measurement

O 2nd stage input monitor Typically 20dB below the associated level measurement

O 2nd stage output monitor Typically 20dB below the associated level measurement

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5.3.7 SPV–M + OW and SPVM_H optical characteristics

SPVM2 and SPVM_H optical characteristics

SPV Receiver specification

Sensitivity @ BER = 10–9 –50 dBm to –47 dBm

Overload @ BER = 10–9 –6 dbm

Maximum receiver reflectance –28 dbm

N.B. The 1510 nm receiver has a specified sensibility of –50 dBm. If the incident power is lower thanthat value, the OSC BER is higher, but the supervision LAP–D protocol corrects the errors sothat the supervision is correctly transmitted down to a power value of –53 dBm

SPV Transmitter specification

Type of source DFB

Wavelength 151010 nm

Maximum –20 dB width 1 nm

Minimum side mode suppression ratio 33 dB

Optical Output power min : –1 dBmmax : +1 dBm

Minimum Extinction Ratio 8.2 dB

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5.3.8 OSMC optical characteristics

OSMC optical characteristics

OSMC specification

Fiber type Single mode (SMF)

Optical connector type MU horizontal

Selectable input ports (switch) 8

Wavelength range 1529.55 to 1561.42 nm

OCM channel power dynamic range –51 to –3 dBm

Total input power –52 to +17 dBm

OCM power channel power accuracy 1 dB

OCM power repeatability 0.25 dB

OCM absolute wavelength accuracy 100 pm

OCM acquisition time 1 s

OSMC optical ports

Port_p input ; p = [1 8] –52 to +17 dBm

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5.3.9 Optical Protection Cards (OPC) optical characteristics

SM/MM OPC BOARDS WIT/WITHOUT CONNECTORS SPECIFICATION

TX side SM OPC withjumpers

MM OPC withjumpers

MM OPC withconnectors

SM OPC withconnectors

Connector type MU MU MU MU

Fiber type SMF SMF SMF SMF

Max. insertion loss 4.4 dB 4.4 dB 4.4 dB 4.4 dB

Optical level at TX–IN Ch. 1&2 –15 +8 dBm –15 +8 dBm –15 +8 dBm –15 +8 dBm

RX side SM OPC withjumpers

MM OPC withjumpers

MM OPC withconnectors

SM OPC withconnectors

Connector type MU MU MU MU

Fiber type SMF MMF SMF MMF

Max. insertion loss 4.4 dB 6 dB 4.4 dB 6 dB

Optical level at RX–IN –24 0 dBm –24 0 dBm –24 0 dBm –24 0 dBm

TX side MM OPC 850with connect.

Connector type MU

Fiber type MMF

Max. insertion loss 5 dB

Optical level at TX–IN Ch. 1&2 –15 +8 dBm

RX side MM OPC 850with connect.

Connector type MU

Fiber type MMF

Max. insertion loss 5 dB

Optical level at RX–IN –28 0 dBm

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5.4 Alarm characteristics

Units Alarms:

Each port card or access card of the equipment is provided with a bicolor (green/red) or three–color (green/yellow/red) HardWare Failure LED on the front coverplate.

This LED indicates:

– when red, internal failure– when green, in service unit– when yellow, board in firmware download state (only for MCC, OCC10, 4xANY, SPVM).

Centralized Equipment Alarms:

All the alarms detected on the units are collected by the ESC unit which will deliver centralized opticalindications (by means of LEDs on its front coverplate). Specifically:

• Red LED “URG“: detection of an URGENT (MAJOR OR CRITICAL) alarm

• Red LED ”NRG”: detection of a NOT URGENT (MINOR) alarm

• Yellow LED ”ABN”: detection of an ABNORMAL operative condition. Type: active loopbacks,forcing the unit into service, laser forced ON or OFF, try to restore after ALS

• Yellow LED ”IND”: detection of an INDICATIVE (WARNING) alarm

• Yellow LED ”ATD”: alarm condition ATTENDED

Refer to para. 2.5, page 112, where the front view of each unit and the LED locations are illustrated.

N.B. On the Craft Terminal (C.T.) and on the Operation System (O.S). application the URGENT(URG), NOT URGENT (NURG) and INDICATIVE alarm are named in a different way; the rela-tion between this two terminology is explained in Table 44. on page 358.

Table 44. Relation between Alarm severity terminology displayed on C.T./O.S. and alarm severity ter-minology used for the ESC leds and ETSI market rack (TRU).

Alarm severity terminology on C.T. and O.S. Alarm severity terminology used for ESC ledsand for TRU in the rack

CRITICAL or MAJOR URG, T*URG, T*RURG,

MINOR NURG, T*NURG, T*RNURG

WARNING INDICATIVE

INDETERMINATE (not used) ––

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Rack Alarms:

Some equipment alarms are carried to a connector and used to light–up alarm rack–lamps. Rack alarmsare physically available on the RAI board connectors.

Rack lamps are different in ETSI and ANSI worlds. The RAI card is made to interface with both standards.

The available alarms are the following:

PDU Front Panel LED Markings (ANSI):

• CRI: critical alarm from one of the shelves in the rack• MAJ: major alarm from one of the shelves in the rack• MIN: minor alarm from one of the shelves in the rack• RACK: alarm storing from one of the shelves in the rack

TRU Front Panel LED Markings (ETSI):

• URG: Urgent: major alarm input from one of the shelves in the rack• NURG: Non urgent: minor alarm input from one of the shelves in the rack• ATTD: Attended: aknowledged URG or NURG alarm• SIG PRES: signal presence (power on)

HouseKeeping Alarms/Commands:

A set of housekeeping contacts are available, located on the 25 poles connector of the housekeepingboard.

Alarm Attending:

The detected units alarm condition can be stored through the ACO (Alarms Cut Off) push–button on theESC unit (Attended).This operation will turn OFF the general red LED “URG” and will light up the “ATD” yellow LED on theESC unit (Attended); the attended command is also sent to the rack lamps (if present) through the RAIboard.

Trouble–shooting:

This equipment has been designed to dialog with a Personal Computer (PC) for service, activation andtrouble–shooting purpose.Trouble–shooting procedure for the equipment and details of the alarms for each card and relevant indica-tions are described in the Operator’s Handbook.

Connection with the PC is achieved through the 9 poles connector (F interface) on the ESC board.

The unit can be connected to an Operation System associated to the Transmission Management Networkin order to execute operations similar to those carried out by the PC.

Characteristics of the cited rack alarms and Housekeeping contacts interface (EM type) are inserted inChapter 5.1 on page 315.

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5.5 Power supply characteristics

Input Voltage range (from station batteries) – 40,5 V – 48 V – 57,0 V– 50,0 V – 60 V – 72,0 V

DC/DC Power supply units’ output voltages + 3.6 V 3%– 5.5 V 3%+ 5.5 V 3%+ 2.5 V 3%

Input current Compact shelf = 4 A max1696MS shelf = 15 A max

Estimated max 1696MS power consumption <400W – a fully equipped shelf with 16 transpondersEstimated max 1696MS_C power consumption <150W – 4 channels line terminal (1 shelf)Power supply interface according to ETS 300132–2

5.5.1 Maximum power consumption of the boards and units

Unit Maximum power consumption [W]OMDX8100_M_xx, OADM1/2/4/8 0.5

ESC 9.3MCC1/ MCC2 16.8

MCC3 13.9OCC10 22.6

4xANY(_S) without drawers 204x ANY(_S) with 4 drawers 32

Drawer 3 (each)OAC1 and OAC1_L 23.5OAC2 and OAC2_L 18.5

SPV_F_C_1310_1550, SPV_F_C 0.5SPVM, SPVM2 12

SPVM_H 11MVAC 2OSMC 9.7OPC 0,5LAN 2.4PSC 0.4 + Psec (*)PSC2 0.4 + Psec (*) + (Ibatx0.4x2)PSC3 0.4 + Psec (*) + (Ibatx0.4)

HK 2.5RAI 2UIC 2.6FAN 20

FAN_C 9.6

(*) For each PSC board, Psec = 1/2(Pshelf 5V + Pshelf 3.3V)(1–0.85).Pshelf 5V is the power consumption of the 5V feed,Pshelf 3.3V is the power consumption of the 3.3V.

Abnormal service range

The 1696MSPAN equipment operating at –48 V does not suffer any damage when subjected to the follow-ing voltage range : 0 V to –40,5 V and –57 V to –60 V.When the equipment operates at –60 V the voltage range becomes: 0 V to –50 V and –72 V to –75 V.Protection to the station power supply is provided by 16A circuit breakers at the top of the rack.

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5.6 Mechanical characteristics

Rack mechanical compatibility ETSI ETS/E3, NEBS2000, Optinex compatible

1696MS subrack size 534 W x 270 D x 443 H mm

1696MS_C subrack size 446 W x 270 D x 132 H mm

Board size 213 D x 265 H mm

1696MS Subrack weight 8.5 Kg

Cooling Fans located at the bottom of the shelf

Rack cabling Vertical between rack and subrack front access

Electrical Connectors IEC 603/DIN 41612IEC 807 (Sub–D)IEC 169–1 (coax. 1.0/2.3)BNC 50 Ω BNC 75 Ω RJ45RJ11

Back–to–back installation Yes

5.6.1 Maximum weight of the boards and units

Unit Weight [Kg]OMDX8100_M_xx 1.1OADM4, OADM8 1.1OADM1, OADM2 0.9

ESC 0.85MCC/ MCC2 0.9

OCC10 0.934xANY(_S) without drawers 1.254x ANY(_S) with 4 drawers 1.65

Drawer 0.1 (each)OAC 1.14

SPV_F_C_1310_1550 0.9SPV_F_C 0.21

SPVM, SPVM2 0.79MVAC 0.9OSMC 1.1OPC 0.18LAN 0.13

PSC, PSC2, PSC3 0.28HK 0.13RAI 0.12UIC 0.12FAN 2.1 (Fan module +filter)

FAN_C 0.330

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5.7 Environmental characteristics

The 1696MSPAN is designed to be compliant to both ETSI and ANSI standards.

The technical data of this chapter are referred to ITU–T Recommendations, ETSI Standards or Telcordia(former Bellcore) standard.

5.7.1 EMC/EMI

5.7.1.1 ETSI compliancy

The electromagnetic compatibility requirements for the system are specified in the ETSI EN 300 386(2000).The following features are applicable :– environmental class 1,– normal priority of service.

Immunity

The following table specifies the valid tests and their compliance criteria for immunity. All the items makereference to the chapters of the ETSI EN 300 386 (2000).

Table 45. Valid tests and compliance criteria for immunity

Phenomenon Coupling(port)

Testmethod

Test level Compliancecriterion

Electrostaticdischarge

chapter 6.2 4 kV (contact) / 4 kV (air)6 kV (contact) / 8 kV (air)

NPLFS

Electrical fasttransients

DC power chapter 6.3 500 V NPtransients

signal chapter 6.3 500 V1 kV

NPLFS

Radiatedelectromagneticfield

chapter 6.6 3 V/m10 V/m

NPLFS

Continuousconducted

DC power chapter 6.7.2 3V NPconductedsignals signal chapter 6.5 3V NP

NP: Normal performance within specified limits

LFS: Loss of function (self recovery)• no corruption of data management• temporary loss of function following application of test• self recovery to normal performance occurs at the cessation of the test.

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Emission

The following table specifies the requirements for the RF emissions of the equipment. All the items makereference to the chapters of the ETSI EN 300 386 (2000).

Table 46. Requirements for RF emission

Phenomenon Coupling (port) Test method Maximum level

Conducted emissions DC power chapter 7.2.3 chapter 7.2.3

signal chapter 7.2.1 hazard level A

Radiated emissions chapter 7.3 hazard level A

The designation ”hazard level A” is defined in the EN 55 022 document.

The electromagnetic compatibility requirements for the system are specified in the GR–1089. The recom-mendation related to immunity and the radiated emission are located on section 3–1 & 3–2.

5.7.1.2 ANSI compliancy

The electromagnetic compatibility requirements for the system are specified in the GR – 1089 (see note).The recommendation related to immunity and the radiated emission are located section 3–1 & 3–2.

N.B. GR – 1089 – COREElectromagnetic Compatibility and Electrical Safety – Generic Criteria for Network Telecommu-nication equipmentissue 2, December 1997

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5.7.2 Environmental constraints

5.7.2.1 ETSI compliancy

The technical data of this chapter are, where it is possible, referred to ITU–T Recommendations or ETSIStandards.

The system is designed for indoor operation with controlled air temperature. The complete environmentalconditions, including climatic, atmospheric and mechanical conditions are specified in the ETS 300 019.The following environmental hazard levels of this standard is applied.

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5.7.2.1.1 Storage

The equipment meets the following requirements Vs. Storage:

ETS 300 019–1–2 : 1992, hazard level 1.2

hazard level 1.2 : weatherproofed, not temperature controlled storage location.This hazard level applies to weatherproofed storage having neither temperature nor humidity control. Thelocation may have openings directly to the open air, i.e., it may be only partly weatherproofed. Theclimatogram is shown in Figure 221. on page 366.

This hazard level applies to storage locations :

– where equipment may be exposed to solar radiation and temporarily to heat radiation: They may alsobe exposed to movements of the surrounding air due to draughts, e.g. through doors, windows orother openings. They may be subjected to condensed water, dripping water and to icing. They mayalso be subjected to limited wind–driven precipitation including snow;

– where mould growth or attacks by animals, except termites, may occur;– with normal levels of contaminants experienced in urban areas with industrial activities scattered

over the whole area, and/or with heavy traffic;– in areas with sources of sand or dust, including urban areas;– with vibration of low significance and insignificant shock.

The conditions of this hazard level may occur in :– unattended buildings ;– some entrances of buildings ;– some garages and shacks.

Table 47. Main climatic conditions

Environmental parameter Unit Value

Low air temperature °C –25

High air temperature °C 55

Low relative humidity % 10

High relative humidity % 100

Low absolute humidity g/m3 0,5

High absolute humidity g/m3 29

Rain intensity mm/min no

Rate of change of temperature °C/min 0,5

Low air pressure kPa 70

High air pressure kPa 106

Solar radiation W/m2 1120

Movement of the surrounding air m/s 30

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Environmental parameter ValueUnit

Condition of condensation – yes

Condition of precipitation – yes, wind–drivenprecipitation

Condition of icing and frosting – yes

Climatogram 2 (ETS 300019–1–1)

0 10 20 30 40 50 60 70 80 90 100

20

RELATIVE AIR HUMIDITY %

AIR

TE

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IR H

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0

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Figure 221. Climatogram for hazard level 1.2: not temperature controlled storage location

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5.7.2.1.2 Transportation

The equipment meets the following requirements Vs. transportation :

ETS 300 019–1–1 : 1992, hazard level 2.2 (Careful transportation).

This hazard level applies to transportation where special care has been taken e.g. with respect to low tem-perature and handling.

hazard level 2.2 covers the condition of hazard level 2.1. In addition hazard level 2.2 includes transporta-tion in all types of lorries and trailers in areas with well–developed road system.

It also includes transportation by ship and by train specially designed, shock–reducing buffers. Manualloading and unloading of to 20 Kg is included.

Table 48. Main climatic conditions

Environmental parameter Unit Value

Low air temperature °C –25

High air temperature, air in unventilated enclosures °C 70

High air temperature, air in ventilated enclosures or outdoor air °C 40

Relative humidity % 95

Absolute humidity g/m3 60

Low air pressure kPa 70

Movement of the surrounding air m/s 20

Rain intensity mm/min 6

Solar radiation W/m2 1120

Heat radiation W/m2 600

Condition of condensation – yes

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5.7.2.1.3 Climatic for operating conditions

The Equipment meets the requirements of ETSI Stand. without use of fans.

The functionality of the Equipment, Vs. Temperature, is in compliance with :

ETS 300 019–1–3 :1992 , hazard level 3.2.

hazard level 3.2: Partly temperature–controlled locations.

This hazard level applies to locations :

– where installed equipment may be exposed to solar radiation and heat radiation. They may also beexposed to movements of the surrounding air due to draughts in buildings, e.g. through open win-dows. They may be subjected to condensed water and to water from sources other than rain andicing. They are not subjected to precipitation;

– where mould growth or attacks by animals, except termites, may occur;

– with normal levels of contaminants experienced in urban areas with industrial activities scatteredover the whole area and/or with heavy traffic;

– In close proximity to sources of sand or dust;

– with vibration of low significance, e.g. for products fastened to light supporting structures subjectedto negligible vibrations.

The conditions of this hazard level may be found in:

– entrances and staircases of buildings;

– garages;

– cellars;

– certain workshops;

– buildings in factories and industrial process plants;

– unattended equipment stations;

– certain telecommunication buildings;

– ordinary storage rooms for frost resistant products and farm buildings...

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0 10 20 30 40 50 60 70 80 90 100

1

20

RELATIVE AIR HUMIDITY %

AIR

TE

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Figure 222. Climatogram for hazard level 3.2: partly temperature controlled locations

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Table 49. Main climatic conditions

Environmental parameter Unit Value

Low air temperature °C –5

High air temperature °C 45

Low relative humidity % 5

High relative humidity % 95

Low absolute humidity g/m3 1

High absolute humidity g/m3 29

Rate of change of temperature °C/min 0,5

Low air pressure kPa 70

High air pressure kPa 106

Solar radiation W/m2 700

Heat radiation W/m2 600

Movement of the surrounding air m/s 5

Condition of condensation – yes

Condition of wind–driven rain, snow,... – no

Condition of icing – yes

Climatogram 2 (ETS 300019–1–3)

5.7.2.2 ANSI compliancy

The environmental constraints requirements for the system are also compliant with the GR – 63 (see note).

N.B. GR – 63 – CORENetwork Equipment – Building System (NEBS) Requirements : Physical Protectionissue 1, October 1995

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MAINTENANCE

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6 MAINTENANCE

ATTENTION EMC NORMS

WHEN CARRYING OUT THE GIVEN OPERATIONS OBSERVE THE NORMS STATED IN PARA.4.1.3 ON PAGE 32

6.1 Maintenance introduction

6.1.1 General safety rules

SAFETY RULES

Carefully observe the front–panel warning labels prior to working on optical con-nections while the equipment is in–service.

Should it be necessary to cut off power during the maintenance phase, proceedto switch off the power supply units as well as cut off power station upstream(rack or station distribution frame)

SAFETY RULES

DANGER: Possibility of personal injury. Personal injury can be caused by–48 V dc.

DANGER: Possibility of personal injury. Short circuiting, low-voltage, low-im-pedance, dc circuits can cause severe arcing that can result in burns and/or eyedamage. Remove rings, watches, and other metal jewelry before working withprimary circuits. Exercise caution to avoid shorting power input terminals.

SAFETY RULES

DANGER: Possibility of eyes damage: read carefully and strictly observe therules pointed out in para.3.2.4.2 on page 27.

6.1.2 General rules

• Check that the equipment is operating with all the shields properly positioned (dummy covers,ESD connector protections, etc)

• In order to reduce the risk of damage the electrostatic sensitive devices, is mandatory to usethe elasticized band (around the wrist) and the coiled cord joined connect with the ground rackduring the touching of the equipment

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6.1.3 Maintenance aspects: definitions

Maintenance consists of a set of operations which maintain or bring back the assembly to optimumoperating conditions in a very short time, with the aim of obtaining maximum operational availability.

Maintenance is classified as:

• ROUTINE (PREVENTIVE)

Routine (preventive) maintenance consists in carrying out a number of periodic operations tominimize the risk of a failure on a link.

These operations can be scheduled or initiated by the equipment supervision system.

• CORRECTIVE

Corrective maintenance consists in carrying out a minimum number of operations to repair afault as rapidly as possible.

These operations are initiated by the equipment supervision system and limited to replacementof boards.

Definition of the technical level of the maintenance agent:

It is mandatory for the technicians in charge of the equipment maintenance to be familiar with themeasurement techniques used on equipment fitted with optical connectors.

6.1.4 Instruments And Accessories

There is a local terminal (PC) which permits to display all the alarms and manages the Equipment.The relative processing is described in the operator’s handbook.

Where TMN is implemented, an Operation System displays alarms and manages all the connected Equip-ments of the network. Refer to the relevant handbooks.

The need of special tools and accessories to perform possible routine and corrective maintenance proce-dures is described inside the procedures themselves.

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6.2 Preventive maintenance

The ALCATEL1696MSPAN or 1696MS–C equipment requires no systematic preventive maintenance.Only a routine maintenance is performed on the fans Equipment.

6.2.1 Routine Maintenance every six months

It is suggested to carry out the following operations every six months:

• no–dust filter cleaning (ETSI rack) / substitution (ANSI rack)

6.2.1.1 No–dust filter cleaning / substitution

NO–DUST FILTER CLEANING / SUBSTITUTION

(caution to avoid equipment damage)

WARNING: BEFORE INSTALLING OR REMOVING THE NO–DUST FILTER, CHECKTHAT THE PROTECTIVE ADHESIVE FILM HAS BEEN REMOVED.

SAFETY RULES

DANGER: Possibility of personal injury. Personal injury can be caused by–48 V dc.

DANGER: Possibility of personal injury. Short circuiting, low-voltage, low-im-pedance, dc circuits can cause severe arcing that can result in burns and/or eyedamage. Remove rings, watches, and other metal jewelry before working withprimary circuits. Exercise caution to avoid shorting power input terminals.

SAFETY RULES

DANGER: Possibility of personal injury. Personal injury can be caused by rotat-ing fans.

Every six months is has to be performed the following operations

• ETSI rack: cleaning the no–dust filter, either on FAN and FAN_C units

• ANSI rack: substitute the no–dust filter, either on FAN and FAN_C units

Note: the period of one year is only indicative; according to the environmental conditions could be neces-sary to reduce this period.

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See Figure 223. on page 376. Only on FAN_C no–dust filter, it is necessary to pull out the FAN_C unitfollowing the procedure below described:

• unscrew the two screws (1) ensuring the FAN_C to the compact shelf

• insert the extractor in (2) and pull out to extract the FAN_C from the shelf

• unscrew the screw (3) ensuring the no–dust filter to the FAN_C and extract the no–dust filter(4).

To re–insert the FAN_C into the shelf

• insert the no–dust filter (4) to the FAN_C

• screw the screw (3) to ensure the no–dust filter into the FAN_C

• properly insert the FAN_C into the shelf

• screw the two screws (1) to ensure the FAN_C to the compact shelf

FAN_C (for 1696MS_C)EXTPMU

FANFIL-TER

1 3

4

2

no–dust filter

Figure 223. FAN_C: no–dast filter extraction

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6.2.2 Routine Maintenance every year

It is suggested to carry out the following operations yearly:

• power cables check

6.2.2.1 Power cables check

SAFETY RULES

DANGER: Possibility of personal injury. Personal injury can be caused by–48 V dc.

DANGER: Possibility of personal injury. Short circuiting, low-voltage, low-im-pedance, dc circuits can cause severe arcing that can result in burns and/or eyedamage. Remove rings, watches, and other metal jewelry before working withprimary circuits. Exercise caution to avoid shorting power input terminals.

It is suggested to carry out the following operations yearly:

– Check that the power cable is perfectly safety grounded.

– Make sure that the subrack has been tightly fastened to the rack with screws, to guarantee grounding(the rack is connected to the station ground).

6.2.3 Routine Maintenance every five years

It is suggested the replacement of each FANS unit (FAN and FAN_C) after five years of working.

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6.3 Corrective maintenance (troubleshooting)

Since the Troubleshooting procedure is carried out with the use of the Craft Terminal , please refer ,fordetails, to the Maintenance Section of the Operator’s Handbook.

FIXING THE UNITS (AND MODULES) INTO THE SUBRACK

(caution to avoid equipment damage)The screw tightening torque for fixing the units (and modules, if any and if fixed by screws) intothe subrack must be:

2.8 kg x cm (0.28 Newton x m) 10 %

Exceeding this value may result in screw breaking.

The following paragraph can be used as an help during corrective actions.

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6.3.1 Fault location: alarm & status indication

This chapter guides you to localize the defaults occurring on the NE. Starting from an alarm indication,it helps you to find the cause of the default and decide what has to be done to correct it.Fault location can be performed by following simple rules. First, transmission domain alarms have to bechecked to locate the degraded NE. Then, when the faulty NE is identified, equipment domain alarms arechecked to locate degraded board or the faulty optical connection.

To give the operator the possibility to localize the faults, a few alarms are available:

– in a terminal:• on each transponder MCC (no OCh–overhead):

– Loss of power at Rx side (WDM or user side)– Loss Of Clock at Tx side (given by the CDR, WDM or user side)– Laser degradation (WDM or user side)

• LOS detection at equipment output (OLOS)

• LOS detection at equipment input (ILOS)

TXWDM

RXWDM

MUX

ILOS

B&WRX

B&WTX

LOCLDG

ILOS LDGLOC

SPVLB

SB

MUX

LB

SB

SPV

DMUX

DMUX

ILOS

OLOS

Figure 224. position of the alarms in a terminal

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– in an OADM:• on each transponder MCC (no OCh–overhead):

– Loss of power at Rx side (WDM or user side)– Loss Of Clock at Tx side (given by the CDR, WDM or user side)– Laser degradation (WDM or user side)– LBER at user Rx (based on B1 calculation – only for SDH/SONET signals)

• LOS detection at equipment output (OLOS)

• LOS detection at equipment input (ILOS)

pass–through channels

RXWDM

TXWDMB&W

TXB&W

RX

RXWDM

TXWDM

B&WTX

B&WRX

MUX

DMUX

MUX

DMUX

pass–through channels

SPV &

SPV

SPV

ILOS LDGLOC ILOS LDGLOC

ILOSLOCLDG ILOSLOCLDGILOS

SPV & ILOSOLOS

OLOS

Figure 225. position of the alarms in an OADM

Alarms on transponders are described in the corresponding chapter (4.1).Alarms on terminals input/output and on OADM output are described with OMDX and OADM units.

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6.4 Set of spare parts

6.4.1 Suggested Spare Parts

The overall number of spares depends on Customer requirements, and should be based on the averageamount of transmission circuits available to be accounted for not only during MTBF but also during MTTR;the latter depending on the amount of spare parts available.The set of spare parts is inclusive of a minimum number of spares for each type of replaceable plug–inunit (see unit list in paragraph 2.2.3 on page 75).

6.4.2 General rules on spare parts management

Before storing the spare units make sure that they are working by inserting them in an operating equipmentIt is suggested to periodically check those spare units have not been utilized for over a year.If the spare parts and the equipment are stored in the same environment, make sure that the spare partsare placed in cabinets to safeguard them from dust and damp.Moreover, they should also be well grounded to avoid electrostatic discharges.

If the spare parts are stored in another room, or have to be moved from another place, building or site,make sure that the following is observed:

– the spare parts must be wrapped in anti–static and padded envelopes;

– the spare parts must not touch wet surfaces or chemical agents that might damage them (e.g., gas);

– if during transport the temperature is lower than that of the room where they had been kept, makesure that before using them they pass a certain period in a climatic chamber to prevent thermalshocks and/or the possibility of steaming up.

When replacing a unit/sub–unit, make sure that the spare unit/sub–unit is set exactly as thereplaced one. For the presettings procedures see section HARDWARE SETTING DOCUMEN-TATION.

6.4.3 Particular rules on spare parts management

Whenever some units with flash-memories are common to different kinds of equipment or to different ver-sions of the same type of equipment, it is possible to maintain one spare part only: this allows spare partstock saving, even though software downloading will be necessary when the software loaded into the unit(program part or data part) is different from that necessary in the equipment where the spare unit mustbe used.At the end of the commissioning phase or after an equipment data change, it is suggested to save theequipment data, e.g. on floppy disk, and store this floppy disk in the spare part stock pointing out the equip-ment it refers to.

6.5 Repair Form

To facilitate repair operation, data on the faulty unit must be reported on the form shown in Figure 226. onpage 382.The repair form must be filled–in with as much data as possible and returned to Alcatel together with thefaulty unit.

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REPAIR FORMFill in this form and affix it to the faulty unit to be returned to Alcatel

TO

BE

FIL

LED

IN B

Y T

HE

SE

ND

ER

FAULT PHASE

INSTALLATION /

OPERATION

MAINTENANCE

REASON FOR REPAIR

CLEAR FAULT

INTERMITTENT FAULT

TEMPERATURE FAULT

DROP IN PERFORMANCE

UPGRADE/QUALITY ALERT

PRESUMED CAUSE

INTERNAL

LIGHTNING

AIR COND.

OTHER

EXTERNAL

FAULT STILL PRESENTAFTER REPAIR

COMMENTS

NAME OF SENDER

PROCESSING

NO FAULTS FOUND

STANDARD REPAIRING

QUALITY ALERT

UPGRADE

NOT REPAIRABLE

SUBSTITUTED

(REJECTED)

TURN ONTURN ON

A

B–D

I

I

M

S–X

FAULTS DETECTED

SOLDERING / ADJUSTMENT

CORROSION

C P

V3

COMPONENT

MECHANICAL PRINTED

F–L

V1 V1

DIRT

OTHER

V2

CIRCUIT BOARD

DATE REPAIRING NUMBER REPAIRING CENTRE NAME OF REPAIR OPERATOR

COMMENTS

TO

BE

FIL

LED

IN B

Y T

HE

RE

PA

IR O

PE

RA

TO

R

DATE

CUSTOMER NAME ORDER NUMBER/CONTRACT NUMBER

SITE BRANCH/UNIT/COUNTRY

SYSTEM/EQUIPMENT PRODUCT RELEASE EQUIPMENT SOFTWARE PART NUMBER

SLOTSUBRACKSTATION/RACK

MNEMONIC

SERIAL NUMBER

ALCATEL PART NUMBER

FAULTY UNIT SOFTWARE VERSION

NOTE : LETTERS ARE FOR FACTORY USE

WIRING

A L C A T E L

Figure 226. Repair form

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HARDWARE SETTING DOCUMENTATION

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UNIT DOCUMENTATION LIST

This section contains the documents sheets to refer to for unit/sub–unit hardware setting options.The list of the enclosed documents is given in Table 51. on page 388, according to the ANV part number.

TABLE EXPLANATION:

– UNIT IDENTIFICATION P/Ns AND CHANGE STATUS

Each unit or sub-unit is distinguished by:

• a dual Part No.:

– Factory P/N (4xx.xxx.xxx xx)

– ANV P/N (xxx.xxxxx xxxx) (NOTE)

NOTE The last two ANV-P/N letters (in the following stated as ’suffix’) stand for a ”feasiblealternative”, they might differentiate two units even though still functionallycompatible. For this reason the indicated ANV P/N does not include the last twoletters.For example : the units having P/Ns ”3AL–34065–AAAA” and ”3AL–34065–AABA”are functionally compatible and, as regards to hardware settings, the MSxxxdocument (described hereafter) 3AL–34065–AAAA-MSxxx is applicable for both.

• and by a pair of design & production series (change status):

– CS, associated to the Factory P/N (4xx.xxx.xxx x)

– ICS, associated to ANV P/N (xxx.xxxxx xx)

The following table shows an example of correspondence between ”FACTORY P/N + CS” and”ANV P/N + ICS”

Table 50. Example of correspondence between CS and ’suffix + ICS’

N.B. The P/Ns used in this example have no correspondence with those of the actual equipment partlist!

FACTORY CODE ANV CODE

P/N CS P/N ICS

487.156.612 01 3AL 34422 AA AA 01

487.156.612 02 3AL 34422 AA AB 01

487.156.612 03 3AL 34422 AA AC 01

In this example you can see that the production series is identified only by the CS as far as theFactory code is concerned, and by the ’suffix + ICS’ if the ANV code is referred to.

Some of the possible positions of the label indicating the unit’s P/Ns and CS–ICS are illustratedin para.4.4 on page 34.

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– CROSS–REFERENCE

• Id. Unit alphabetical notation. It indicates the unit containing one or more subunits.

• App. It reports the unit notation (Id) to which the sub–unit belongs.

The hardware settings can be executed after having checked all the sub–units belonging to a unit,by considering the above cited cross–reference, and by using the presetting documents indicatedin the table and presented in the following point.

– ENCLOSED DOCUMENTS

For each type of unit or sub-unit having setting options that can be customized, the document

”ANV P/N”–MSxxx

is annexed to this handbook (in the case of Documentation on CD-ROM the MSxxx documents maybe given in a CD-ROM different from that containing this Technical Handbook).

The MSxxx documents are enclosed in numerical order. The Edition of the enclosed MSxxxdocument is the highest available on the date on which the Technical Handbook is assembled.

Use of the document MSxxx:

• MSxxx means ”document for hardware presetting options” (the MSxxx document’s Part No.is as that of the unit or sub-unit and its MS acronym defines type).The xxx part of MSxxx is relevant to ANV internal identification codes.

• As the Customer may have to manage many units of the same type (same P/N) but with differentCS–ICS, the document MSxxx describes with possible different chapters the different settingoptions, according to all the possible CSs–ICSs. For this purpose, a table at the beginning ofdocument (PREFACE) indicates the chapter to be used according to the CS or thecorresponding ’suffix + ICS’, taking into account that:– a change of the production series does not necessarily imply a change in the setting

options;– a change of the ANV P/N suffix does not imply a new MSxxx document;– the CS, SUFFIX and ICS must be meant as:

• from specified CS, SUFFIX or ICS (included)• to next CS, SUFFIX or ICS (excluded) if listed

– the sequence of CSs is increasing from alphanumeric to numeric (e.g. CS=A0 is lowerthan CS=01).

Each chapter contains:

– one or more tables defining the relationship between the functions achievable and thesetting options to make;

– the unit layout drawing which shows the exact location of all the setting options.

N.B. IDENTIFIES PIN 1 OF COMPONENT

The setting options described in the documents MSxxx must be used according to3AL377470001 (962.000.022 F) MSxxx document, inserted in Table 51. on page 388, whichshows the ’ON’ (closed) position of micro–switches.Those setting options that on the table are indicated by the caption For factory use only shouldnever be modified.

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EXAMPLE

N.B. The P/Ns used in this example have no correspondence with those of the actual equipment partlist!

Taking into account the same unit of Table 50. on page 385:

FACTORY CODE ANV CODE

P/N CS P/N ICS

487.156.612 01 3AL 34422 AAAA 01

487.156.612 02 3AL 34422 AAAB 01

487.156.612 03 3AL 34422 AAAC 01

and supposing that the setting options valid for CS=01 are equal to those for CS=02, but changefor CS=03, the table at the beginning of the document 3AL 34422 AAAA MSZZQ will be:

CHAPTER

FACTORY P/NCODICE DI FABBRICA

ANV P/NCODICE ANVCHAPTER

CAPITOLO FROM CSDA CS

FROM SUFFIXDA SUFFISSO

FROM ICSDA ICS

1 01 ––AA 01

2 03 ––AC 01

If you have the unit identified by one of this identification data:

FACTORY CODE ANV CODE

P/N CS P/N ICS

487.156.612 01 3AL 34422 AAAA 01

487.156.612 02 3AL 34422 AAAB 01

you will use Chapter 1 of document 3AL 34422 AAAA MSZZQ

If you have the unit identified by one of this identification data:

FACTORY CODE ANV CODE

P/N CS P/N ICS

487.156.612 03 3AL 34422 AAAC 01

487.156.612 04 3AL 34422 AAAD 01

you will use Chapter 2 of document 3AL 34422 AAAA MSZZQ

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Table 51. Hardware presetting documentation

The edition of the documents (listed in this table) that are physically enclosed in the handbook isthe highest available when this handbook is assembled. The edition of enclosed documents isnot specified in this table.

Only the boards that need hardware settings are listed in this table

Id NAME AppANV P/N

(Factory P/N)

Documentfor hardware

presetting

1 OMDX_8100_M_L1_XS3AL 86615 AA––

(474 156 215)–

2 OMDX_8100_M_L1_X3AL 86615 AJ––

(474 156 065)–

3 OMDX_8100_M_L23AL 86615 AB––

(474 156 216)–

4 OMDX_8100_M_S13AL 86615 AC––

(474 156 217)–

5 OMDX_8100_M_S23AL 86615 AD––

(474 156 218)–

6 OADM_8100_M_L1_S3AL 86637 AA––

(474 156 008)–

7 OADM_8100_M_L2_S3AL 86637 AB––

(474 156 009)–

8 OADM_8100_M_S1_S3AL 86637 AC––

(474 156 010)–

9 OADM_8100_M_S2_S3AL 86637 AD––

(474 156 011)–

10 OADM_4100_M_ch20–23_S3AL 86637 BC––

(474 156 013)–

11 OADM_4100_M_ch25–28_S3AL 86637 BD––

(474 156 014)–

12 OADM_4100_M_ch30–33_S3AL 86637 BA––

(474 156 003)–

13 OADM_4100_M_ch35–38_S3AL 86637 BB––

(474 156 012)–

14 OADM_4100_M_ch42–45_S3AL 86637 BG––

(474 156 017)–

15 OADM_4100_M_ch47–50_S3AL 86637 BH––

(474 156 018)–

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IdDocument

for hardwarepresetting

ANV P/N

(Factory P/N)AppNAME

16 OADM_4100_M_ch52–55_S3AL 86637 BE––

(474 156 015)–

17 OADM_4100_M_ch57–60_S3AL 86637 BF––

(474 156 016)–

18 OADM1_100_M–ch30_S3AL 86777AJ––(474 156 079)

19 OADM1_100_M–ch31_S3AL 86777AK––(474 156 080)

20 OADM1_100_M–ch32_S3AL 86777AL––(474 156 081)

21 OADM1_100_M–ch33_S3AL 86777AM––

(474 156 082)–

22 OADM1_100_M–ch35_S3AL 86777AN––(474 156 083)

23 OADM1_100_M–ch36_S3AL 86777AP––(474 156 084)

24 OADM1_100_M–ch37_S3AL 86777AQ––

(474 156 085)–

25 OADM1_100_M–ch38_S3AL 86777AR––(474 156 086)

26 OADM1_100_M–ch47_S3AL 86777BE––(474 156 091)

27 OADM1_100_M–ch48_S3AL 86777BF––(474 156 092)

28 OADM2_100_M–ch30_31_S3AL 86778AB––(474 156 135)

29 OADM2_100_M–ch32_33_S3AL 86778AC––(474 156 136)

30 OADM2_100_M–ch35_36_S3AL 86778AD––(474 156 137)

31 OADM2_100_M–ch37_38_S3AL 86778AE––(474 156 138)

32 OADM2_100_M–ch47_48_S3AL 86778AF––(474 156 139)

33 SPV_F_1310_15503AL86779AA––

(474156140)–

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IdDocument

for hardwarepresetting

ANV P/N

(Factory P/N)AppNAME

34 ESC3AL 86661 AA––

(411 101 428)–

35 SPVM3AL 86606 AA––

(411 101 255)–

36 SPVM23AL 86606 AB––

(411 102 193)–

37 SPVM_H3AL 86606 AC––

(411 102 534)–

38 LANC3AL 86653 AA––

(474 156 024)–

Table continues with MSZZQ document list

Id NAME AppANV P/N

(Factory P/N)

Documentfor hardware

presetting

METRO OAMDX CONTROL BOARD 1 to 333AL 86638 AA––

(487 156 039)3AL 86638 AAAA

MSZZQ

EQUIPMENT CONTROLLER 343AL 86662 AA––

(483 100 286)3AL 79747 AAAA

MSZZQ

PBA–CONTROL SPV–M 35, 36, 373AL 86612 AA––

(483 100 262)3AL 86612 AAAA

MSZZQ

PBA–CONTROL LANC 383AL 86617 AA––

(487 156 957)3AL 86617 AAAA

MSZZQ

END OF DOCUMENT

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LABELS AND ASSEMBLY INSTRUCTIONSTARGHETTE E INFORMAZIONI PER IL CENTRO STAMPA

QUESTA PAGINA NON VA INSERITA NEL MANUALETHIS PAGE MUST NOT BE INCLUDED IN THE HANDBOOK

COD.MANUALE HDBK P/N: 3AL 95278 AAAA ED 01

1696MSPAN Rel.2.2 1696MSPAN Rel.2.2 TECHNICAL HANDBOOK

ORIGINALE INTERLEAF: FILE ARCHIVIAZIONE: cod ANV (PD1-PD2)

– No PAGINE TOTALI PER ARCHIVIAZIONE: 392+4=396– DIMENSIONE BINDER SORGENTE (du –ks): 33.127 kBytes

INFORMAZIONI PER IL CENTRO STAMPA - ASSEMBLY INSTRUCTIONS

– STAMPARE FRONTE/RETRO RECTO-VERSO PRINTING

– COMPOSIZIONE ED ASSIEMAGGIO DEL MANUALE:HANDBOOK COMPOSITION AND ASSEMBLY:

No pagine(facciate)

numeratenumbered(facciate)

No pages da from a to

TARGHETTE - LABELS

3AL 95278 AAAA ED 01

frontespiziofront

2

3AL 95278 AAAA ED 01manualemanual

390 1/390 390/390

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

ALLEGATI DI UNITÀ (MSZZQ)UNIT PRESETTING DOCUMENTS (MSZZQ)

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

Vedere lista da pagina:See list from page:

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

No documenti MSZZQNo documents MSZZQ

ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

UNIT PRESETTING DOCUMENTS (MSZZQ)ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

390 ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ

4

TOTALE PAGINE A4 (FACCIATE) TOTAL A4 PAGES: 392

TOTALE FOGLI A4 TOTAL A4 SHEETS: 196

WARNING FOR A-UNITS OTHER THAN A-ITALY

• The documents MSZZQ cited in section ’HARDWARE SETTING DOCUMENTATION’ arestored in eMATRIX.

• Labels are done according to A-Italy binder format.• Source file: ALICE 6.10

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QUESTA PAGINA NON VA INSERITA NEL MANUALETHIS PAGE MUST NOT BE INCLUDED IN THE HANDBOOK

FCGSite

Originators

VIMERCATE

:

Domain

1696MSPAN REL.2.2

Division

Rubric

TECHNICAL HANDBOOK

TypeDistribution Codes Internal External

::::

ONDWDM1696 MS1696MSPAN REL.2.2 TECHNICAL HDBK

:

C. GIANNI

Approvals

NameApp.

App.Name

F. BRUYERE

A. MICHAUD

D. LESTERLIN

INFORMAZIONI EDITORIALI

– ORIGINALE SU FILE: ALICE 6.10• sistemazione ’toc’ e ’figlist’

I SEGUENTI DATI sono RIPORTATI IN AUTOMATICO SU ETICHETTE e FRONTALE

3AL 95278 AAAAED 01

1696MSPAN Rel.2.2

32 + 32 Channels DWDM System1696MSPAN Rel.2.2

TECHNICAL HANDBOOK

VOL. 1/1

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32 + 32 Channels DWDM System

1696MSPAN Rel.2.2

TECHNICAL HANDBOOK

3AL 95278 AAAA ED 01

VOL.1/1

32 + 32 Channels DWDM System

1696MSPAN Rel.2.2

TECHNICAL HANDBOOK

3AL 95278 AAAA ED 01

VOL.1/1

32 + 32 Channels DWDM System

1696MSPAN Rel.2.2TECHNICAL HANDBOOK

3AL 95278 AAAA ED 01 VOL.1/1

32 + 32 Channels DWDM System

1696MSPAN Rel.2.2 TECHNICAL HANDBOOK 3AL 95278 AAAA ED 01 VOL.1/1

32 + 32 Channels DWDM System

1696MSPAN Rel.2.2TECHNICAL HANDBOOK

3AL 95278 AAAA ED 01 VOL.1/1

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FINE DEL DOCUMENTO INTERNO – END OF INTERNAL DOCUMENT