TS-SSC 92-033

10-Stack Studies of

Polyimide-Epoxy Insulation Systems

R.E. Sims 2/12/92

Revised 2/12/92

Perceived disadyantges of Glass Tape System:

1. Breaks down at lower pressure (high voltage breakdown, BNL study).

2. Tears during winding - sharp comers on torn glass (usually requiring hand repair).

3. High friction in mold => Less uniform distribution of conductors and more size variation.

4. Larger epoxy volume => Hydraulically stretching Kapton can lead to insulation failure.

5. Limits current density. An all polyimide insulation wrap can permit lower insulation volume and allow an additional turn of superconductor.

Perceived disadvantges of eliminating Glass Tape:

1. Change cross-section. (Assumes minimum insulation approach).

2. Increases creep. Higher initial collaring forces would be required.

3. Reduced control of coil size variation from component size variation.

4. Lower modulus (but this may partially compensate for #3).

5. Larger thermal contraction.

Author; Perceived advanfaees ofelimina~ Glass Tape <assumine all Polyimide Film): ·'

1. Greater high voltage breakdown in midplane.

2. Lower overall labor.

3. Although these experiments have shown that utilizing adhesive on every layer improves creep, microscopic studies reveal "adhesive leakage" onto cable strands. An optimum configuration may be to utilize adhesive on both sides of the outer layers of insulation with no adhesive on the inside layers of insulaiion (per contribution by Amanda Spindel.)

Revised 2/12192

CONCLUSIONS

Based on small quantities of ten stacks made from DuPont Kapton types H, HA, and LT. The epoxy used on the Kapton was 3M #2290

1. Removing the Glass-Epoxy tape increases stress relaxation as much as 2 to 3 times (unless under layers ofpolyimide utilize adhesive. See 5 below).

2. This stress relaxation can be minimized by:

a. Use as few layers of Kapton as possible. b. Use high molding pressures(~ 10 KPSI) c. Stay in the mold longer, preferably at the curing temperature d. A single ten stack made using DuPont CI and RCI at 225°C (438°F)

showed a stress relaxation about 16% greater than Glass-epoxy, i.e., very close to glass epoxy.

3. The Glass-Tape system accommodates approximately twice the material tolerance variation that 3 layers of Kapton can. (.015" for glass tape, .007" for 3 layers ofKapton).

4. Single Kapton insulation systems with no inner layer adhesive have 10% to 25% lower final coil modulus of elasticity.

5. It appears that coils made with inner and outer layer adhesives would have creep levels equal to or better than ~lass tape.

6. It is difficult to extrapolate coil size from ten stack size with good accuracy. (Curved stacks would be better.)

7. Allied Signal Apical type NP film appears to provide lower creep than DuPont Kapton type K (by apprx. 22% to 50% depending on wraps and layers of adhesive).

8. Apical type NP film also appears to make ten stacks with slightly higher modulus of elasticity properties (by roughly 15%).

9. If "Loaded" films have lower cryogenic shrink and lower bulk modulus than non-loaded films, then DuPont "LT" film should be the "top" layer of insulation.

10. When adhesive is utilized on layers closest to cable, small amounts of adhesive can be found on the cable. (Could these small amounts of adhesive crack, exotherm, and cause a quench?)

11. A Spindel (SSCL) suggested utilizing adhesive on .b.Qth sides of the top insulation layers, but not on the bottom layers. This should produce a good compromise which cannot leak adhesive onto the cable.

Follow-on Steps (R.E. Sims, Revised 2-20-92)

1. Examine "cookies" of the coils to determine the "flow" of the Kapton epoxy system. (DSI340 & DSI341)

2. Take apart Kapton epoxy stacks with first layer adhesives and search for any epoxy leakage on cable. (Cryorad done, do Kapton +2290)

3. Make some Kapton and Apical ten stacks with increased cure temperatures ( +20°F) and increased time ( +30 min) to gauge reductions in creep, etc.

4. Make cryogenic shrinkage measurement of an assortment of ten stacks while under constant pressure (12 K psi).

5. Obtain Apical NP film coated on both sides with Cryorad adhesive and Kapton LT film coated on both sides with 2290 adhesive. Evaluate the creep and modulus of elas~icity of the following ten stacks:

'i> $ ft'.> 3 '1_

IJCf!:3Z2..) 3 2.-3

a . 112 NP, but~d 2 sidei> 2- l 2.. i" 1) Cured at 275°F, 90 min, 10 KPSI r I I 2) Cured at 295°F, 90 min, 10 KPSI 1 1 ,_.,,..<,.,

D~A-~32

3) Cured at 275°F, 120 min, 10 KPSI i z ._ J.A 4) Cured at 275°F, 90 min, 6 KPSI ·

.~1..

'j,) C.43 l. "l ,.3 ?.3 b. ~

112 NP, 112 NP coated 2 sides. 1) through 4) same as above.

c. lf2·H, butt LT coated 2 sides. 1) through 4) same as above.

d. 112 H, 112 LT coated 2 sides. 1) through 4) same as above.

6. Measure cryogenic shrinkage of the "1" and "4" ten stacks in #5 above.

COMPARISON OF POLYIMIDE FILM DATA All data on 1 mll thick lllm unless noted

RICHARD E. SIMS Febru1ry 41 1992

Physical Properllea at tTemDJ 23° C 173°Fl 2oo•c 13s2°F1 2a0 c 2a0 c 23°C 2a•c 23•c 23°C, 1.2 Mil 23°C, 1.35 Mil

Ultlmate Tensile (MD) 231 139 (32 K psi) (31 K psi) (24 K psi) (35 K psi) (44 K psi) (30 K psi) (20 K psi) Strenath MPa (pal) (36.000) (33 500} l20 000} Yield Point (MD) 69 41 (10,000) at 3%, MPa (pal) (10,0001 (6 000) Stress to Produce (MD) 90 61 5% Elonaatlon, MP• (pal) 113 OOOl 19 0001 (13 000}

Ulllmate Elonaatlon lMD),% 72 83 70 83 80 95 90 85 65 Tensile Modulus, GPa 2.5 2 2.92 4.26 (MO) (pal) 1370,000l 1290 0001 (400,0001 1310,000l 1500,000) (460,000) (600 000) (350,000) (475 000) Impact Strenath, Ka-cm Cft-lb} 8( .58l Foldlna Endurance lMITI cvclea 285000 >1 000,000 >l 000,000 >150,000 Tear Strength (MD)·Propagatlng 7 16 35 8 7 (Elmendorf\.n Tear Strength (MD) • lnltlal CGravH\.a 729 520 600 Density, a/cm3 1.42 1.42 1.45 Coefficient of Friction • 0.48 0.40 Kinetic (Fllm•IO·Fllm) Coefficient of Friction • 0.63 0.5 Static CFllm to Fiim} Refracllve Index (Becke Une} 1.66 Poisson's Ratio 0.34 Low Temperature Flex Life Pass Dielectric Constant 3.4 3.4 3.3 3.5 3.8 Dlelectrlc Strenath V/Mll 7 700 6500 3500 7800 8000 6000 4500

NOTE: All Information supplied by the manufacturers.

Meltlna Point

Thermal Coefficient of Expansion

Coefficient of Thermal Conductivity , W/m*K

(Cal) Ccm)(Hc){°C)

Soeclflc Heat

Shrinkage,%

Umlllna Oxygen Index, %

none

20 ppm/°C ( 11 ppm/°F)

none

-14 to 38°C (7 to 100*F)

.1 2 I 296°K

(2.87 x 10·4l I 23•c

1.09(.261) I "J/ g 'K(caVg/°C)

.17 130 min@ 1so•c 1.25 120 min@ 4oo•c 37

NOTE: All Information supplled by the Manufacturers.

THERMAL PROPERTIES

RICHARD E. SIMS February 4, 1992

2.1 X 10·8 I .8 X 10·50°C ln/ ln /° C

poss I f>L~ ..:sc.eNAl2.lO L~A.Dll\J6i T 0 DI eL..e~T'2-IC.... e12,e~l<I;>Z)ws.J DF

PO L.:"·l JM\ 1.) e"' MID P LAJJ G' I t--J Su L.ATIOJJ

qL~SS TP<~~ BULK A'-1"S AS J.-.l'-J'DRAIJ U C... MeOJA T'° STA~f s-re ell:. 1-\ nJ" () ,: poi---t 1 Ma De

BULK M.Oth1£..vs· · · · ·~ ·· ·· · ~· . .. .. ~

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. PoL~1~·1~e- ovetz... s l-JA'2..P

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(l~A?ION H) NofE[ !i--JA--(

l )J 51)(.,4-J/o;J SH?WS 8i.Jt..1<. MODvt.-IJS ftypJfc.;(5 r/K. VM 11.,r.:r( ~if /2.AND }')g_tfA.5 .. JH1 s vJ~"i)1GR. -s nz.ess [NtJ~i~ KA-PION AGA-JJJfi>-( 2>>-1A-i

~~GDGG C'J:;;. sr

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51-res A~e Al SJJ2.~ IZ.1.> G' fZ. ~}'irnz.¥ enGes e>P '5'/f!.. A 'ND 5

SGVelZAL 1.- OC41' lo).),S I t-.1 TH if kl?..e'A t>y }¥16 0 z:;21~1)J-*l­

ISJ2 e'Pr KD?W >-1 S}i.DWaD

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·- ·-·~

SSC 50 mm INNER COJl STRESS RELAXATION AT 12 KPSI WITH VARIOUS INSULATIONS

0.000 ~---"':~:: ·,_____;_~-;_-_----ii---~! -----11

l--==~-===\t~~~~~~: 1=--:--.: ___ • :_ -· :_t ==--=-=- -:=~

-0.004

+-----------~---~'.\~-:~~~<~. . --1- - ----- -~ 'k-~~1'ff --------- -- ---,-\- ~-'t<-~1 ----- -----ct IL-;; l~~U4$

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+--- - -- + --- --- -~ __ _ J __ ---- ---- ~ ~ _'g ___ --lfJ133,1/2HA,BLT +------- --- _J _ ~-- -- ~ --1--------- ---- -- +-~\ -- -- -1 H\ tJ\O~ I I ',; I ' 'fl + 131,2/3H,1/2H PU!>S· -

J --- --L---- _ -- 1>" __ · r·· --- _ ~- __ l@130,2/3H,1/2H14ff~~ J . -· -· ··---- ----·------ j ___ ···---- _____ ________ ..J . -----_>,~ . ······-·· __ I_ · ----· ---·· ---·-- --··-· - _ _j l I I ~' !

~- ..... ······-·· ··· ··--··- ·-·-- !···-··········· ······ ··-··· .............. i . ···-..... ...... :~.- ..... ·····-······ ............... -··· ----···-! I l \ I i ~ ..... .......... ..... .. -!- --· - ·· ····· - .... 7 .. - . . .. . @l · ... . .... ··-·· ..... , I ! I f\, I

I I ' r=--:~--= - -:._- ~~~:- -== = \: -~---~- - ~: _ --_--:. =~:~=::=~ 1 _ ~-- · ·· · -····-- ............. .. .. . . .................. .... ... . . ....................

1

-· -- -.. ....... ............... . . . . . ! ......... ............. ~ .. .......... ··-- ~ 129,1/2H,1/2H I 1

1 veR.--1 Low_ 1--··-···-········· ···---- -···-·-·· ---- ··--···-·-······-·--·--·-............................ ----· ··-· -·-····· ............. ... -·· .. --r---·---····· ··---·--.. -- -··········- fv\Ot..D p iz.e:ss vie"

I I I I I I! I ,.. 0 0

,.. 0 ,.. 0 0 0

Data from 'S~EVTIM.CGO' R.E.SIMS 12·13·91 ICSR TIME (SEC.)

T"'"

0 0 0 0 ,..

SSC 50 mm OUTER COIL STRESS RELAXATION AT 12 KPSI WITH VARIOUS INSULATIONS

0.000 ~~o---T----+-----t-------;I

J:::=_ :::.: :.:_t : '\::::::::::f: _=:= ::·:.::~:j a 233, 1/2HA,BLT L-oW ~" ""'-+·-· ·-·· ... ........ ·-·· ·-["-·· .. .... '. -·· · ·· ... 1 __ \ ,< ... -·- ···· .... _ .. ~~>~ .......... J+227,1/2H

1BGT

~ :::_:-_ :_: :::::J : ::: :\- ,:.: = :: ::~ ~ :t ·: __ : ~ ::· :i fi 232, 1/ 2 H ,BUTT H( •. 054 'SHIM)

t~· ·:··-. : ... : ... -. ·-· ~.:::~ :· ·-!!· .·~-.·: ::. :.:··:· .... ~ ... ·\~· .. : ·.· -·-... :.~ : -:~,.: :~: .. : ... ~~~ ... -.: .. ~j I ... l\ I ' l

I I I 1 \ J T ...... .. ... . ·-· 1--·-- ..... ... ·- . -· ... T .. ..... -.. ... ............. ·-·- .... - -· \ ........... :

f : - _: ; --: ---l ----• -- :_:::J: :\ :::· j + 230 1/2H 1/2H

f : ~: : -:-l===: :- ~.-r-==: = ~:~-- r: : =---=-1 L~W 1

1'-\o <--D Piu:ss uv4

I ! I I I I . I

T:-:~-~·::-···~- ~· · . ··:·~~~--J:~~: ~~---_ -~--.-.--~-~ ~--~:L~.· . ·_ :·--.-~:~~-<~·_:!·~:~-. : ... :_ ~-.--_: :::_::~::: .. ·1 I I I i

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,.. 0 0 ,.. 0 ,.. Data from 'INSTKOAT.CGD'

0 0 0 ,..

0 0 0 0 ,.. R.E.SIMS 12-16-91

OUTCSTRS.CGG TIME (SEC)

I . I

\ )

TEN STACK STRESS RELAXATION WITH 12 KPSI FOR ONE HOUR (SSC 50mm INNER CABLE)

0.0001 .~ 0.0000 rn ~ -0.0001 0 -0.0002 z ~ -0.0003 v

z -0.0004 0 ·0.0005 ).-(

~ ·0.0006

I -!

i

I I l

-l I i

J I i

i .....

:

I

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-l I I

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l I

I

i --i

i

i I I

1 I

' I

1 I i I l' I I I I I : I

T"'

Data from 'STKRLXA.CGD' R.E.SIMS 12-27-91

I

0 ,.. 0 0 T"'

T1ME (SEC)

0 0 0 ,..

0 0 0 0 ,..

CREEP VS MATERIAL COMBINATIONS FOR GLASS-EPOXY AND KAPTON BRAND FILMS

0 0 0

I

0

,.. 0 0

t

0

N 0 0

t

0

(t) ~ 0 0 0 0

I I

0 0

!

LO 0 0

I

0

m EQUIV .IN.COil RlX.

~ LT

~ H

mn GT

il 6AS~LINE:" I

I

f.O ""' I -

0 0 0 0

' I

00 0 0

• 0 0 ·o

Data from 1STKANALA.CGD1

R.E.SIMS 1·28·92 CREEP/MATERIAL THICKNESS (INCHES)

VARIOUS KA PT ON H AND LT COMBINATIONS VS CREEP ( C.HO\ c-ers c L~s~ TD DASGL1>-1e)

l I ;

' '

GT10,1/2H,BGT,20%,10K ~

POLY 1, 1/2CI, 1/2RCI, 10K ~

HL501"1/2H,1/2LT110K ~1·

~· BASl~LlN~ ~--- l

I l

l

HL 1, 1/2H,BLT, 10K

H3,1/2H,BH,10K

H1,2/3H, 1/2H, 10K I I I

. i

0 ~ 0 ~ 0 0 0 r r N 0 0 0 0 0 0 0 q q 0

• • • 0 0 0 0 0

COIL EQUIVALENT CREEP llNCHES)

l.8m, 4cm SSC MAGNET DATA Inner CoLL CooLdown Stress Loss

100

90 /11-'l ,,-..... CDI L.S MA-JJ~ W ~ Li PJA\J6" Low e-e. ..._,,

80 (J) C 00 L JX> LU tJ ::::, 1 iZ.e:55 (/) Lt:\S.5 0 70 _J

(() 60 (I)

w Ci::: t- 50 ff)

8 40 ~ .q- 30 I ~ 0 20 g

10

0 DSS019 DSS020 DSS021 050201 DS0202 DS0203 DS0204 0$0213

MAGNET · ~~~..,, ReASD~ ·~Og_ vAVOJ?..\N{;,z LT (i..oADe'"D P t> L'"ll\N\\D0 J'v\.AN~'2GLLA flLM ['>(5 IY-~~ u?'Pe.12-- t...A'-lE:J<.(s) or- \r-J'5ut-ATtDN' BNL-

~-b-'tl

CREEP COMPARISON OF VARIOUS COMBINATIONS OF APICAL BRAND FILMS INCLUDING SOME WITH KAPiON BRANO LT FILM

NC2NC1· i, 10K

NC2LTE1· 1,10K

VC2LTE1· 1,10K

GT10, 1/2H,8GT, 10K,20%

N2LTE2·3,10K

POLY1,1/2Cl,1/2RCl,10K

N2LTE-11'002, 10K

N2NC1·2,10K

N2NC2· 1,10K

N2LTE1·6,10K

N2LTE2· 1,.002,10K

V3NC1·2,10K

Data from 1STKANAPA.CGD1

R.E.SIMS 2· 14-92 APCPMATL.CGG

0 r

0 0 0 0

I

' 0 0

i I

I

C\J Cf) 0 0 0 0

I • ·o 0

'1' 0 0

I

0

e EQUIV.IN.COIL CREEP

fil1 NP OR H MATER!Al ~ GT MATERIAL

UITI AV MATERIAL

~ LT MATERIAl

I ! :

lO (0 " 0 0 0 0 0 0

I I I

0 0 0

EQUIVALENT CREEP I MATERIAL USED (INCHES\

I \

!

()j 0 0

I

0

COMPARISON OF VARIOUS POLYIMIDE ADHESIVE LAYERING SCHEMES LAYERS OF

ADHESIVE

I

I 2 !

i 3 . I

t 4 I

i

I 3 i

l 1

l 2 1

1 1 . J

l 1 i

l 1 ~ i

; 1 i l i I 1 I i i i I \ .

Data from 1STKCOMPR.CGD' R.E.SIMS 2· 11·92

0 0 0 0

• 0

l() 0 lO 0 0

,. ,. C\I

0 0 0 0 0 0 0 0 • . • 0 0 • 0 0

COIL EQUIVAlENT CREEP (INCHES)

LO 0 C\I (t)

0 0 0 0

• • 0 0

0.004

COMPARING INNER COIL CREEP TO TEN STACK CREEP ( 12 KPSI FOR 60 MINUTES )

,~. INNER COIL CREEP

~ STACK CREEP x ~.033 = COIL EQUIVALENT MALERIAL VOLUME

' GENERALY: STAGK CREEP INDICATES !COIL CREEP i

I

' I

J i '

I 1

l COIL 12911/2H,1/2H, <f WITH .OWSHIM I ! (VERY LOW MOLD PSij ! I t

i I 0.003 _ !'---i - - --"---- ---+-

1-----l: . j

~

. ~ 0.002 I 0 z

i I

i _! ; I()!

i i ~ -1 1 I

!0! I

l

d:-i $ ! i + COIL

1 132fi/2H,

fc.1·.081 SHIM

-r I

! I COIL 131,2/3H, 1/2H, i -~WliH .011'SHIM

'COIL 13t2/3H,1/2H, I W/0 .OWSHIM I

' ~ •-T-' l COIL 13S,1/2H,BlT, ~

a.. + CIOL 1,1\81/?H BGT !_! • • osrsHIM ,!;.

W Q .QQ 1 ~ (BASELIN1

E)1-" ' _ __,_! _ - - - ----, - - - - ----;

w ~~ cc l.{;

0 ~

0.000 ---~-~---,---r-------,..--LO

COISTCRP.CGG RE.SIMS 2· 13·92

lAYERS OF KAPTON

COMPARING MODUUI OF ELASTICITY OF STACKS MADE WITH VARIOUS KAPTON BRAND FILMS

0 0 0 0 Data from 1STKANALA.CGD1 0 0 0 0 R.E.SIMS 2· 14·92 0 0 0 0

0 0 0 0 0 1l) 0 LO ~ iq LO lO

0 0 0 0 0 (!)

MODULUS OF ELASTICITY (PSI)

0 0 0 0 0 0 0 0 ll) 0 (0 "

~ I I I

i I i !

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0

R.E.SIMS 2· 14·92 0 LO 0 LO 0 Ll) Ll) (0 (0 ~

MODULUS OF ELASTtCITY (PSI)

KAPTON CREEP VS CURE PRESSURE

TEN STACKS WERE CURED AT BOTH 6 KPSI AND 10 KPSI AT 275 F FOR 90 MINUTES

,.... 0.0030 ::''·-,· ,,__ j i NOTE $AT LESS LAYERS MEANS LESS v'J : '·-------t 1 SENSlilVITY TO MOlDING PRESSURE VARIATIONS ~ ~- 1"'-,·-.,-,"_i (WHICHiALSO MEANS LESS VARIATION WITH o 0.0025 ~1_ ·., ._ i ·--., ____ Affffi~L TOLER~ES) Z 7-, --... ·. ·. I I "- ! I

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~ . . . ·-1 ' ·., '--J ! -.... . J . ·-. !----. __ ··- . ---... r------, ; ---... _____ I fu 0.0020 , ; · ~',<t ""·-+. "'t -tt- HA5&6,2/3HMLT

6 J ·· ., ~. ! '·....... .. ·., i ~ i

W ; .. :.----.. I • . I ··, : , . i ---......_ I - ·, i ···-... . ' · i '·"'-- j

a: l ·-1~-J.~·-. -,·- ~~t .. Y < cHAL1&2,1/2HA,1/2LT () . I ' - ··. . '· ··. . I

· 0 0015 1 1 l ----~__, ··:-~-~:·~----~ I ~ H1&2,2/3H, 1/2H ::! . i I ! I . . ··~" -® HA502&31~2HA,Bl T 0 : l i '· --J, -/,,.... H~&41/2i\ H

·-· I ; ' ( I/ J M, () ~ ! I I ! ~:S,>- HL501&2,1/2H,1/2l T r- 0 0010 +~----- : :

I • ------~-- ! -l I - - ------ !

Z i I - --+-- I -1 ! i ---------L.. I

~ j i 1 ! -------i + GT10& 11, 1/2H,BGT,20%

~ 0.0005 j i I I

- i J ~ a . ~ w 0.0000 l .__,_____.____.,----!----...,.-~~

i

0 0 0 co

0 0 0

" 0 0 0 0 0 0 co a>

CURE PRESS.(PSI)

0 0 0 o Data lrom 1STKANALA.CG01

,.. R.E.SIMS 2· 13-92 KCRCPSl.CGG

CREEP VS CURING PRESSURE FOR APICAL BRAND FILMS

0.0030 ii?

' : ,-..... -i

(J) w I

0.0025 0 z -~ 0.. w w [ 0.0020 ()

:

I- !

' ; z ~

i

w 1

_J

<( 0,0015 -<(;'-V2NC1 (10o MIN.}

> try @V3NC1 - ! ~ -::Q I J ' I

' I

a l i ;

! w -i ;

' ' ;

..J !

' - ,:~+N2NCi 0 0.0010 I

0 !

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 (0 t'- CX) m 0

Data irom 1STKANAPP.CG01 ,..

r,1 JR~ PR~~~ /P~I) 0 C C:IU(' 2· 12-92 l!.L..\JflYll,l V VI 11111 I I I .. VVt\1 V '!

650000

,,-.. -

0 0 0 co

MODULUS OF ELASTICITY VS CURING PRESSURE FOR KAPTON BRAND FILMS

0 0 0 0 0 0 0 0 0 0 0 0 f'- co O> 0

~l !RF PPF~~ f P~I\ ,..

MODULUS OF ELASTICITY VS CURING PRESSURE

600000 ; rDR APICAL BRAND FILMS I

_J

I ' I

.J ! I

1". I - -;

~ 550000 ---1-; -----~

LL 0

j •.. . ····· I . ..... . · ~r I !

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, /

,.:· .-

,· /

en 450000 ..........---: - __ ~..- _.,. -------< ~ : ... _, i ,.

....1 : / ! ,.

J , _, ~

f"'\ j u -j

0 J ~ I

400000 -+--: ~-,---.-~-,--~! - , ---1

Data from 1STKANAPP.CGD1

R.E.SIMS 2-12-92

0 0 0 co

0 0 0 f'

0 0 0 00

·cuRE PRESS. (PSI)

0 0 0 0)

0 0 0 0 """

EFFECT OF ADHESNE LAYERS ON CREEP

§] ASSORTED APICAL STACKS +ASSORTED KAPTON STACKS 0.0020 ~: --~~----,---,

,...... '

(/) ~

w ' I I j

0 ~

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Data from 1STKANAPA.CGD1

R.E.SIMS 2-4·92 LAYERS OF GLUE

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KAPTON AND APICAL STACK MODULUS VS CREEP L2J KAPTON STACKS y = 649967.376 • 135490324.0SSx (2 = 0.613 ~ APICAL STACKS y ~ 670800.971 a 198359223,301x (2 ~ 0.482

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STACK CREEP AFTER ONE HOUR AT 12 KPSI (INCHES) Data from 'STKANA6.CGD' R.E.SIMS 1-22·92

KAPTON AND APICAL TEN STACKS BEFORE VS AFTER CURING

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Data from 1STKANAP.CGD1 UNCURED STACK @ 3KPSI RE.SIMS 1-22·92

6 KPSI-10 KPSI MOLDING PRESSURE STACK SIZE VARIATION

~ 6kpsi-10kpsl SIZE DELTA

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Data from 1STKANA6.CGD1

R.E.SIMS

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R.E.SIMS 2·3·92

0 0 0 0 T"' ~

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. MODULUS OF ELASTICITY VS LAYERS OF GLUE FOR ~ MOD.OF ELAST.,INNER COILS MODEL INNER COILS, KAPTON AND APICAL STACKS :::J MOD.OF ELAST.KAPTON STACKS

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BARECARCGG RE.SIMS 1-30-92

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PREDICTING COIL SIZE FROM STACK SIZE

LAYERS OF KAPTON

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