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Loadpoint Loadpoint MEMS MEMS

TechnologyTechnology

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Loadpoint BackgroundLoadpoint Background European SME, Involved in MEMS since 1976

– Pressure sensors, Medical Ultra-Sonics, ink jet printers, actuators.

Direct process development service Consumable support 890 Dicing machines, 3,600 Dicing spindles

in operation world wide 40 years experience of electronics industry

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Division of the MST Division of the MST Market by SectorMarket by Sector

World Market for MST 2005: $68 billion

TransportationTelecomOtherIT PeripheralsMedical

Based on Nexus market analysis

4%3%

7%

58%

28%

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Nanotechnology Nanotechnology SectorsSectors

Nano Biotechnology 19%

Nano Chemicals 3%

Nano Devices 19%

Nano Instruments 18%

Nano Materials 11%

Nano Powders 13%

Nano Processes 1%

MEMS 14%

Consulting 2%

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Global Funding of Global Funding of Nanotechnology Nanotechnology **

0

500

1000

1500

2000

2500

3000

3500

1999 2000 2001 2002 2003

Am

ou

nt

(US

$ m

il.)

* Approximate figures based on NanoInvestorNews.com

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MEMMEMSS

Countries developing

innovative fields

Germany:Automotive and RF MEMS for ‘phones

Nordic Zone: Maritime

Italy and Spain:Food Quality + Biosensors

Israel: Anti-terror devices

Japan: Optics

Singapore: Biosensors and Optical-Networks

Canada, Benelux: Microfluidics for Medi-MEMS

Switzerland: Unsurprisingly, watches

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MEMS The role of SME’sMEMS The role of SME’s

Highest costs are in Test and Packaging Unavailability of machinery for flexible or small

batch production leading to specialist service providers Small flexible SME’s providing appropriate

technology

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MEMS ChinaMEMS China China, 2002 200 Million Yuan approved for MEMS

special project under five years plan 863 (high Tech and Development Research Programme

Fundamental Research Programme 973 (since 1997): 134 projects, 2.5B Yuan, MOEMS project, Nano Materials Project and Nano Electronics projects included

One of the few countries including agricultural research as part of nanotechnology.

13th Institute of China Electronics Technology Group offering flexible 3/4 inch MEMS fabrication line with test and packaging equipment

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MEMS DirectionsMEMS DirectionsMedical Italian and Japanese sensors applied to genomics

and DNA/RNA Ultrasonic transducers for diagnosis and

endoscopy Benelux and Japan: Intra-vascular blood sensor Canada and Benelux - blood lab on a chip with

micro-needles for thumb blot. Canada: diagnosis integration of Micro-fluidics,

MEMS and Optical devices

CardioMEMS

Intravascular MEMS

Micro-needles

Ultrasonic transducers

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MEMS DirectionsMEMS Directions

Automotive Sensors becoming the key to the Safe-Car

– Micro-accelerometers– Crash Sensors– Roll Sensors– Tyre pressure sensors

– Vision Assistance etc.

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CommunicationsCommunications RF MEMS and Optical devices are the

focus Australian development in relays Canada showing particular interest in RF

and now X-ray MEMS Taiwan, biggest government investment

of MST is in this area - US$ 200 Million Optical and DisplayOptical and Display USA & Israel Micro-mirror arrays

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Fuel injectors for automotive industry Blood sampling and other medical uses

MicrofluidicsMicrofluidics

MicroassemblyMicroassembly Synchrotron Projects - for imaging at

molecular levelAustralia spending $206M, other projects in Canada and Germany

Microfluidics will be important for this area, fine spraying seems to be the best emerging method of production for nano-materials

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MEMS, demandsMEMS, demandsOne MEMS structure

Needs to be be connected to and protected from the outside world

So the mirror structure material, cover and possible interconnect layer need to be diced

Source Competence Centre for Microactuators and non-Silicon microsystems

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Applications, driving forces Applications, driving forces for convergence for MEMS for convergence for MEMS dicingdicing MEMS CSP WSP BGA, UBGA, FR3 / FR4 & copper sub-frame Silicon, Glass, Quartz, Ceramic substrates, LTCC and similar PZT integrated transducers & actuators Stainless steel, copper etc. GaAs and SAWF materials and similar

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MEMS Process Points 1MEMS Process Points 1 MEMS, BGA, BGA or similar converge at

WSP level Material thickness, hardness and poly-

material layers Cutting energy dissipation and strength of

material Sensitive surface topography and

coatings. Process Temperature control Keeping cutting swarf out of mechanisms

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MEMS Process Points 2MEMS Process Points 2 Some structures

have special needs Dicing Lab on Chip

has considerable demands

Temporary seals for chemical / compound needed

Protection of bonding pads

Source:Competence Centre for Microactuators and non-Silicon

microsystems

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MEMS MEMS OutlinesOutlinesPackages have standard features and these outlines indicate some seen.

Solutions exist for all of these although some development is usually needed to determine full process

Combination with BGA coming

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Wafer Scale PackagingWafer Scale Packaging

Practical Considerations

Interconnect Bonding Moulded cover

material Flatness of

moulded package

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Large Area MEMSLarge Area MEMS

Specialist application with points to watch– Frame material– Flatness – Work holding– In line v stand

alone Next generation of

multi layer devices

Integration of BGA & BGA dicing techniques

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MEMS Future PackagesMEMS Future Packages Integration of other materials will mean

that multi-layer devices could evolve from forms currently seen, for example: -

Fibre board with interconnect & external connection Signal processing

layer

Sensor layer

Actuation layer

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MEMS - the futureMEMS - the future Integration of more materials into the structure, up

to at least 6 layers Move to low profile wafer scale packaging with

BGA concepts Issues

– Grinding and surface finishing for layer bonding– Dicing a mixture of materials with diverse

characteristics, design for dicing Accurate break down into process elements for

process development Design for dicing!

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Our Major ProductsOur Major Products NanoAce

Dicer/Grinder 300mm diameter

material

PicoAce Nanogrinder 300mm diameter material

MicroAce Dicer 150mm diameter material

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Chelworth IE, Cricklade, Swindon, Wiltshire, SN6 6HE, UK

Tel ++441 793 751160; email john.sweet@loadpoint.co.uk

Web: www.loadpoint.co.uk

The information outlined in this presentation is considered in the public domain so free of any IPR restrictions other than that protecting Loadpoint’s general IPR by copyright © and registered design ®. All ideas and concepts offered are in good faith and require confirmation by either sampling or through extended research and development programmes. Sources of pictures from the WWW have been acknowledged as far as practical, there is no intention of infringing the IPR of the owners of those images as their sole purpose is to illustrate the point made in the presentation

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