07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

Status MVD Demonstrator:System Integration

T.Tischler, S. Amar-Youcef, M. Deveaux, D. Doering, J. Heuser,

I. Fröhlich, J. Michel, C. Müntz, C.Schrader, S. Seddiki, J. Stroth, C. Trageser

and B. Wiedemann

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

Status MVD Demonstrator:Mechanics & Integration

Outline:

MVD DemonstratorDesignMaterial overviewMechanical supportBonding and DemoAux-Board

Demonstrator in the Lab

Demonstrator for the Beam test

Summary and Outlook

Demonstrator

Prototype

Final MVD

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Design

2x MIMOSA-20 Sensors

ZIF connectorFlex-rigid R/O

Demo-Aux board

Liquid cooledCu heat sink

TPG/RVC/TPG sandwich

Flexprint Cable

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Material overview

MIMOSA-20

- 320 x 640 pixels- 30 µm pixel pitch- 750 µm thickness- ~ 2 ms time resolution- ~ 2 cm² active surface- 2 serial analogue outputs- Differential output lines

FlexPrint Cable

- 36 µm copper in 3 layers- minimized set of lines for 2 MIMOSA-20- individiual readout for two sensors

with one cable- 60 pads for chip bonding- 0.21 % X

0

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Mechanical support – setting up

Structure of the support:

TPG (Thermal Pyrolytic Graphite) ultra high heat conduction ( 1500 W/mK in two dimensions = 4x value of copper )

RVC (Reticulated Vitreous Carbon foam)

ultra light and stiff material

Thickness [μm]

1x Splicing tape glue 35 ± 52x TPG (C) 500 ± 102x Liquid glue 100 ± 201x RVC (C foam) 3000 ± 100

Sum 4235 ± 102

2x

Currently 0.6 % X0

plus sensors

TPG

TPG

RVC

Glue

Glue

Currently :schematic view:

Glue: 2-component Araldite 2011Huntsman

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Mechanical support – setting up

Glueing TPG to RVC,TPG-RVC to TPG.

Accurate knowledge of thethickness and surfaceis needed.

Several thickness measurementswere accomplished.

Measurements were used toselect good samples for the support needed.

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Mechanical support – setting up

Comparisons betweenTPG-RVC-TPGplate surface before and aftercutting out the “stripe”were done.

Cutting does not trigger relevanteffects on the surface in termsof damage or bending.

Cutted “stripes” ready for bendingand cooling tests as well as forintegration into experimentalsetup.

before cutting

after cutting

Area without chips

fittet radius15000 mm

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Mechanical support – bending

schematic view:

No load

??? g / kg

??? g / kg

Load range 10 – 100 gramms

Bending tests with the support (Sandwich) and 1mm TPG (for comparison) were arrangedto gain knowledge on the maximum load which can be handled by the supportwithout lasting damages.In addition a value for the Young Modulus was calculated based on measured data.

TPG gauge

F

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Mechanical support – bending

manufacture specificationfor TPG

Fit pol0 => 550 Fit pol0 => 61233

32

)(2xxL

IxD

FE

2mm

N2mm

N

234500mm

NE

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Mechanical support – vibration

With the measured effective Youngs Modulus it is possible to calculate the vibration modesof the Sandwich.

The knowledge of the vibration modes of the support is important to be sure that vibration modes due to the vacuum pumps will have no effect on ourSupport ( microphony).

The first five modes are

Mode k Frequency [kHz]

1 1.875 587.355

2 4.694 3681.319

3 7.855 10307.873

4 10.996 20200.786

5 14.137 33389.761

To be compared withvacuum pumpsand liquid cooling

222

2

2 hb

IE

l

kf

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:Bonding and DemoAux-Board

Chips were bonded to the FPC and connected to the DemoAux-Board for testingthe whole readout chain.

Datatransferto PCfor storageand analysis

Bonding support

MIMOSA20 sensors

FPC

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:in the Lab

Demonstrator in Lab ( in PVC-Box ) for first series of test mesurements.

Allowsreadout of maximal 2 MIMOSA20 senors through FPC and DemoAux-Boardreadout with a Fe55 sourcereadout with a running cooling systemsearch for the best calibration of the MIMOSA20 sensorstests related to the heat conductivity of the whole Demonstratortemperature monitoring

DemoAux FPC sensors

Sandwichcooling

schematic view:

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

sensorsglue TPGcopper

RVC

Cooling system

- 40 °C- 20 °C

glue

MVD Demonstrator:in the Lab

Cooling transport through the Demonstrator - 10,3 °C with running sensors- 12,6 °C without running sensors

Measured temperatures within the PVC-Box show no big differences on the TPGwith and without running sensors.

Nevertheless temperature transport between cooling system and the copper supportas well as between the TPG and the copper support has to be improved further.

All measurements in the PVC-Box were taken under normal pressure.

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:for the beam test

Beam test @ CERN, 120 GeV Pions, together IPHC Strasbourg fromNovember the 5th till the 13th .

Using their beam telescope TAPI, which is equipped with

2 Scintillators, one left, one right, for trigger4 MIMOSA18 planes, two left, two right, for reference measurements

variable keep in volume ( 75 to 105 mm ) in the middle

for the DUT.

Intention for the beam test is testing the full

Demonstrator including mechanics, electronics andanalysis

with a moveable structure in plane orthogonal to thebeam axis, which is electrically isolated andoperates under normal pressure.

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:for the beam test

Two mechanical setups are constructed,one with single sided readout for two MIMOSA20 sensorsone with double sided readout for four MIMOSA20 sensors

Assembled are two Aluminium frames for holding and cooling the Demonstrator.

In addtion two cases are build to minimize condensation and to open the possibility of N

2-flow.

Autodesk Inventor 10

Double sidedSingle sided

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

MVD Demonstrator:for the beam test

From the CAD-model to a real support structure for the beam test:

07.10.2009, T. Tischler, CBM Collaboration Meeting, Split

Summary and Outlook

Summary:

• Global design of the MVD Demonstrator adapted for the test in the Lab.

• Mechanical support was build and tested focused on materialcharacterisation and quality checks.

• Tests in the Lab under controlled environment show promising resultse.g. in respect to noise.

• Global design was changed due to given constrains for the beam test.

• For the upcoming beam test an one sided and a double sided versionwere constructed and build.

Outlook:

This phase: building the MVD Demonstrator will be concluded with a hopefullysuccessful beam test.

( Demonstrator++ versions under debate with improved support (CVD),different sensors, optimized FPC )