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Productivity Tools Productivity Tools for HFSS: for HFSS: Increasing Speed Increasing Speed and Size with DSO and Size with DSO and HPC and HPC Productivity Tools Productivity Tools for HFSS: for HFSS: Increasing Speed Increasing Speed and Size with DSO and Size with DSO and HPC and HPC © 2010 ANSYS, Inc. All rights reserved. 1 2010 ANSYS Regional Conferences

03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

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Page 1: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Productivity Tools Productivity Tools for HFSS: for HFSS: Increasing Speed Increasing Speed and Size with DSO and Size with DSO and HPCand HPC

Productivity Tools Productivity Tools for HFSS: for HFSS: Increasing Speed Increasing Speed and Size with DSO and Size with DSO and HPCand HPC

© 2010 ANSYS, Inc. All rights reserved. 1 2010 ANSYS Regional Conferences

Page 2: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Objectives

• Introduction

• Brief overview of technology and acronyms

• Licensing options & Enabling technologies

– DSO– DSO

– HPC

• Case studies

• Conclusions

Page 3: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Introduction

• This talk will focus on additions to a standard HFSS solver to:

– Increase efficiency

• Solve more models in less time

• Solve a single model in less time

– Increase capacity

• Solve larger models

Page 4: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Technology Technology OverviewOverviewTechnology Technology OverviewOverview

© 2010 ANSYS, Inc. All rights reserved. 4 2010 ANSYS Regional Conferences

Page 5: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Computing Terminology

• HPC – High Performance Computing

– Uses supercomputers and computer clusters (connected

groups of computers) to solve advanced computation

problems [From Wikipedia]

• Socket – Part on computer motherboard to place Processor packaged devicepackaged device

– Modern motherboard contain as few as 1 socket, and as

many as 4 sockets

• Core – Single computing unit

– Modern processors packages contain as few as 2 cores,

and as many as 12

• Common configuration

• Dual-socket, Quad-core package � 8 cores in a box

Page 6: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

ANSYS Terminology

• On top of all these hardware choices, we’ve added license choices to improve productivity for different classes of problems

– DSO – Distributed Solve Option

– DDM – Domain Decomposition Method

• Feature of HPC licensing

– MPO – Multi-processing option

• Feature of HPC licensing

Page 7: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

HFSS Adaptive Mesh

Page 8: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

HFSS Solver Terminology

• Each time HFSS solves the Volumetric Field Solution it must solve a matrix of unknowns.

– The solution describes the field behavior for that particular mesh

– This is done for each adaptive pass and directly solved frequency point.

• HFSS offers 3 Solvers Options to apply to this matrix equation:

bAx =• HFSS offers 3 Solvers Options to apply to this matrix equation:

1. Direct Solver (Default)

• Traditional solver used in HFSS

• Very stable

• Can be memory and time intensive for large matrices

2. Iterative Solver

• Added in HFSSv11

• More memory efficient than the Direct Solver

• Can be more time efficient than the Direct Solver

3. Domain Decomposition (more on this later…)

• Added in HFSSv12

Page 9: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

HFSS Solver Terminology

Direct Solver

• The Direct Solver obtains an exact solution to the matrix equation

• Common Direct Matrix Solver Methods:

– Gaussian Elimination

– LU Decomposition

bAx =

– LU Decomposition

• Best uses for the Direct Solver

– Moderately sized matrices

– Large number of excitations

=

4

3

2

1

4

3

2

1

44

3433

242322

14131211

000

00

0

b

b

b

b

x

x

x

x

a

aa

aaa

aaaa

Page 10: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

HFSS Solver Terminology

Iterative Solver

• How does it work?– The Iterative Matrix Solver works by “guessing” a

solution to the matrix of unknowns, and then recursively updating the “guess” until an error tolerance has been reached

• What is the advantage?– Reduced RAM and Simulation Time

Best uses for the Iterative Solver

Initial guess

Preconditioner

Update solution and search direction

• Best uses for the Iterative Solver– Large Matrices (>30,000 Tets)

– Moderate Port Count (2 Ports Per Processor)

– For 1st, 2nd and Mixed Order Basis Functions only

Converges ?

yes

no

MPCG

Page 11: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Iterative Matrix Solver

Increases Simulation Capacity

• Compared direct and iterative matrix solvers for JSF example

• Iterative solver requires 3-4x less RAM than direct solver

Page 12: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Productivity Option #1Productivity Option #1Distributed Solve Distributed Solve (DSO)(DSO)

Productivity Option #1Productivity Option #1Distributed Solve Distributed Solve (DSO)(DSO)

© 2010 ANSYS, Inc. All rights reserved. 12 2010 ANSYS Regional Conferences

Page 13: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

• Distributed Solve Option (DSO)

• Distributed Solve is a productivity

enhancement option that accelerates solution

times for frequency sweeps and model

variations by leveraging a network of

processors.

• Offers a near-linear speed-up over

conventional single license simulation

sweeps by distributing and

Distributed Solve Option (DSO)

Design VariationsOptimetrics / ANSYS DesignXplorer sweeps by distributing and

simultaneously solving across a network

of computers

• Increases throughput by speeding up turn-

around time for individual simulations

Optimetrics / ANSYS DesignXplorer

Frequency SweepsHFSS

Page 14: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Distributed Solve - Applications

• Applications

• What-if studies

• Design of experiments (DOE)

• Dynamic circuit model generation

• Design for Six Sigma (DFSS)

• Broad-band frequency sweeps

• Licensing•Hardware Independent

•Mix different CPU/Cores and RAM

•User defined machine selection

•Group setting for solver MP

•OS Independent

•Supports Windows and/or Linux

•LSF/PBS/SunGrid/HPC EnabledBroad-band frequency sweeps •LSF/PBS/SunGrid/HPC Enabled

•Solver independent•Common license for supported solvers

•MP ready

•Flexible•Share the licenses in the pool between

multiple users or simulations

•License Options:•Singles - 1 Design Point

•Saver Pack – 10 Design Points

Page 15: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

DSO Examples: Parametric

• Optimetrics analysis of circularwaveguide phased array

• Parametric sweep over 45 scan

angles

• 5X faster when distributed to 6 CPUs

• Optimetrics analysis of PIFA

radiating element

• Parametric sweep of antenna geometry

• 7.5X faster when distributed to 8 CPUs

2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0Freq [GHz]

-35

-30

-25

-20

-15

-10

-5

0

dB

(S(P

1,P

1))

Ansoft Corporation isolationS11 for Element 1 Parametric Sweep

Curve Info

dB(S(P1,P1))Setup1 : Sweep1extra_element_lengt

dB(S(P1,P1))Setup1 : Sweep1extra_element_lengt

dB(S(P1,P1))Setup1 : Sweep1extra_element_lengt

dB(S(P1,P1))Setup1 : Sweep1extra_element_lengt

dB(S(P1,P1))Scan Impedance

Page 16: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

DSO Example

Investigating Solution Space

• Distributed analysis used to quickly explore multi-dimensional design space

– Wire radius

– Pitch spacing

– Helix radius

• DSO distributes frequency and parametric sweeps to network of

DSO distributes frequency and parametricsweeps to networked processors

parametric sweeps to network of processors

• Approximately linear increase in simulation throughput

• Highly scalable to large numbers of processors

• Multi-processor nodes can be utilized

Page 17: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Solution Space Exploration

Helical Wire Antenna

• Wire radius varied to determine impact on input impedance

– Used DSO to solve 27X faster

• 3D plots created in HFSS to easily visualize solution space

– Return loss as function of frequency and wire radius

Wire Radius

Fre

qu

en

cy

0.15 in0.06 in3GHz

Return Loss

Acceptable wire radius

4GHz

Wire Radius

Page 18: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

DSO Example: Molex Connector

Frequency Sweep Distribution

• Adaptive process completed on one machine with frequency sweep sub-bands sent to multiple machines

Mesh Adaptive Frequency

SolutionSolutionSolutionSolutionSetupSetupSetupSetup

Parametric yes

Sweep #1Sweep #1Sweep #1Sweep #1

Sweep #2Sweep #2Sweep #2Sweep #2

Sweep #3Sweep #3Sweep #3Sweep #3

Sweep #NSweep #NSweep #NSweep #N

#pts to Converge

Clock Time Delta to Reference

Reference 76 22h26m 1x

DSO Interpolating 78 3h52m 5.8x

DSO Discrete NA 2h41m 8.4x

Mesh

Generation

Adaptive Mesh

Refinement

Frequency

SweepConvergence

no

Parametric Model

Generation

yes

Page 19: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Productivity Option #2Productivity Option #2High Performance High Performance Computing OptionComputing Option(HPC)(HPC)

Productivity Option #2Productivity Option #2High Performance High Performance Computing OptionComputing Option(HPC)(HPC)

© 2010 ANSYS, Inc. All rights reserved. 19 2010 ANSYS Regional Conferences

Page 20: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Ansoft HPC Overview

Bigger

• Domain Decomposition (DDM)

• A distributed memory parallel solver

technique that distributes mesh sub-

domains to a network of processors.

• This method is a hybrid iterative and

direct solver technique that

significantly increases the simulation

capacity by distributing the RAM Domain Decomposition

Multi-Processing

Faster• Multi-Processing (MP)

• The MP option is used for solving models

on a single machine with multiple

processors/cores which share RAM.

• Increases throughput by speeding up

turn-around time for individual

simulations

capacity by distributing the RAM

usage across multiple computers.

• Enables the solution of higher fidelity

and larger models

Page 21: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Ansoft HPC - Applications

• Applications

• Electrically Large RF/Antenna Designs

• Antenna Placement

• Radome Design

• Radar Cross-Section (RCS)

• EMC Analysis

Cell Tower

EMC Analysis

• Industries

• Aerospace and Defense

• Wireless/Mobile Platforms

• Communications

• Healthcare

RCS – 24GHZ

Friend or Foe Antenna

Satellite

Medical

Page 22: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Domain Decomposition for HFSS

• New feature in HFSS v12

• Distributes mesh sub-domains to network of processors

• Distributed memory parallel technique

• Significantly increases

HPC distributes mesh subdomainsto networked processors and memory

• Significantly increases simulation capacity

– 64-bit meshing

• Highly scalable to large numbers of processors

• Multi-processor nodes can be utilized

Page 23: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Domain Decomposition Example

Cellular Base Station Array

• GSM base station tower with radome-enclosed antenna arrays

– 950 MHz

– Electronic downtilt

• Domain solver used to predict installed antenna patterns

– 34 domains– 34 domains

– 3.5 GB average RAM per domain

– 16M unknowns

– 119 GB Total Effective RAM used Base Station Printed Dipole Arrays

Page 24: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Technology Comparison

HPC for MP HPC for DDMGeometric Complexity

Excitations/RHS

Solv

er

Fitness

Direct Iterative DDM

Electrical Size/Fidelity

Solv

er

Fitness

Page 25: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Ansoft HPC - Licensing

• Allocation

– Each Simulation consumes one or more HPC packs

• Each individual pack enables 8 Parallel

• Parallel count increases quickly with multiple packs

• Flexible Technology Access

– Enable MP or DDM or DDM with MP

2048

32

8

128

512

Parallel

Enabled

Packs per Simulation

1 2 3 4 5

– Enable MP or DDM or DDM with MP

• Scalable Licensing

– HPC Packs

– HPC Workgroup (Volume access to parallel)

• 128 to 2048 Parallel shared across any number of Simulations

– EnterpriseHPC License count is determined by the larger of the two:

1. # of Simulations (Solvers)2. # of Cores

Page 26: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Ansoft HPC

Multi-Processor Option

• Single workstation solution to increase simulation throughput

– Takes advantage of multi-core and/or multi-processor computing resources

• Capability introduced in HFSS v8 for direct matrix solver

– Parallelized matrix solver for multiple – Parallelized matrix solver for multiple

processors with shared memory

• Enhanced by addition of iterative matrix solver in HFSS

– Parallelized matrix pre-conditioner

– Parallelized excitations

Page 27: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

MP Option for Helix Design

• Element model converges with 30k mesh elements

• Multi-processor option reduces direct solver time by factor of 2x

– 20 seconds vs 40 seconds

• Array model converges with 330k mesh elements

• Multi-processor option reduces iterative solver time by factor of 2.5x

– 8 minutes vs 20 minutes

Multi-processor option significantly decreases design iteration time at element and array levels

Page 28: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Case StudiesCase StudiesCase StudiesCase Studies

© 2010 ANSYS, Inc. All rights reserved. 28 2010 ANSYS Regional Conferences

Page 29: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Finite Array on Spacecraft

• Electrically very large model with high level of geometrical detail

• Historically beyond the realm of full-wave EM solvers

– Typically analyzed using – Typically analyzed using asymptotic approximations which may sacrifice accuracy

– Challenging but important design problem

• Full-wave analysis now possible using HFSS v12

Page 30: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Array on Spacecraft

• Efficiently solved using HPC Option

– Domain solver

• Solution profile

– 25M unknowns

– 34 domains– 34 domains

– 6 GB average RAM per domain

– 204 GB Total Effective RAM used

Page 31: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

• Domain solver used to

predict on-vehicle patterns

– 11 domains

– 1.7 GB average RAM per

domain

– 19 GB Total Effective

RAM used

Automobile with GSM Antenna

Surface Currents

Electric Fields Around Vehicle

Far-field Radiation Pattern

Radiation Pattern

Page 32: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Apache Helicopter RCS

• Military rotary-wing aircraft

– 1 GHz

– Monostatic RCS

• Domain solver used to predict scattering signature

– 12 domains

– 4.5 GB average RAM per domain– 4.5 GB average RAM per domain

– 6M unknowns

– 54 GB Total Effective RAM used

Surface Currents

Monostatic RCS

Page 33: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Ground Transport Vehicle with

Covert Patch Antennas

• Domain solver used to predict installed antenna patterns

– Two L-band patch elements

mounted on Humvee roof

• Solution profile

– 6 domains

– 0.75 GB average RAM per domain– 0.75 GB average RAM per domain

– 4.5 GB Total Effective RAM used

Page 34: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

RFID System in Loading Dock

• Domain solver used to solve RFID system in industrial dock door environment

– 900 MHz system

– 2 patch antenna readers

on pedestalson pedestals

– 12 tags distributed throughout pallet of

packaged items

• Solution profile

– 7 domains

– 2 GB average RAM per

domain

– 14 GB Total Effective RAM used

Field due to reader

Field due to tag

Page 35: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

How big can you go?

• HumVee with 1 L-band patch antenna

• In proximity to cement wall with rebar

• Freq = 1.8 GHz

• 14,424 λλλλ3• 14,424 λλλλ

• 64 Domains

• 2 procs / domain

• 128 cores

• 50M Unknowns

• 409 GB Total RAM

Page 36: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

SummarySummarySummarySummary

© 2010 ANSYS, Inc. All rights reserved. 36 2010 ANSYS Regional Conferences

Page 37: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Summary: DSO

• Many parametric variations / design space exploration

– DoE & ANSYS DesignXplorer

• Broadband Frequency Sweeps

– Signal Integrity / EMI problems

• In both cases, each parametric variation or frequency point will be limited by the available RAM per core in the Distributed machine list

Page 38: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Licensing: DSO

• DSO licensed in either single-task or multi-task bundles

– License enables MP functionality for each task

– Typical bundle is 10 tasks

Page 39: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Summary: HPC

• Solving the previously unsolvable models

– electrically HUGE

• Solving the existing problems on one machine, faster than before

Page 40: 03_HFSS_HPC_and_DSO Recent Advances and Case Studies.pdf

Licensing: HPC

• HPC is licensed in either Packs or Workgroup/Enterprise

– 1 Pack enables 8 cores for 1 problem

• Up to 8 cores for domains OR MP

– 2 Packs enables– 2 Packs enables

• 8 cores each for 2 problems OR

• 32 cores for 1 problem

– 3 Packs enables

• 8 cores each for 3 problems OR

• 32 cores for 2 problems AND 8 cores for 1 problem OR

• 128 cores for 1 problem

• Count the cores!