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TERMS OF DELIVERY TECNOMETAL SRL (rev. 0.8 - 22 november 2016) 1/11 TECNOMETAL Srl ELECTRONICS CIRCUITS BOARDS TERMS OF DELIVERY (rev. 0.8 - 22 november 2016) TECNOMETAL Srl Via Ancona, 3 – Trezzano Rosa – MI Tel. +39 02 90969935 Fax +39 02 90968707 E-mail: [email protected] www.tecnometal.net

TECNOMETAL - TERMS OF... · TERMS OF DELIVERY TECNOMETAL SRL (rev. 0.8 - 22 november 2016) 2/11 SCOPE The purpose of this specification is to define the requirements and specifications

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TERMS OF DELIVERY TECNOMETAL SRL

(rev. 0.8 - 22 november 2016)

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TECNOMETAL Srl

ELECTRONICS CIRCUITS BOARDS

TERMS OF DELIVERY (rev. 0.8 - 22 november 2016)

TECNOMETAL Srl Via Ancona, 3 – Trezzano Rosa – MI

Tel. +39 02 90969935 Fax +39 02 90968707 E-mail: [email protected]

www.tecnometal.net

TERMS OF DELIVERY TECNOMETAL SRL

(rev. 0.8 - 22 november 2016)

2/11

SCOPE The purpose of this specification is to define the requirements and specifications applicable to the manufacture and testing of printed circuit boards supplied by Tecnometal Srl. This specification defines the requirements and conditions of supply, production and acceptance of printed circuit boards, without prejudice to different directions from the customer. For any aspect not reported in these specifications, are subject to the conditions of acceptability provided for by the IPC A-600 Class 2 standards.

REFERENCE STANDARDS IPC A-600 - Class 2 (On request shall apply the Class 3)

DOCUMENTATION The documentation concerning the printed circuit boards production is provided by the client who remains the owner. The documentation will be returned to the customer at his request. Tecnometal, as a result of the feasibility study, if necessary and subject to authorization by the customer, will be able to edit the customer’s files.

TOOLING The tooling realized by Tecnometal and needed for the printed circuit boards production, are of Tecnometal property.

PRICES The prices are indicated in the Tecnometal order confirmation sent to the customer.

RESPONSABILITY Tecnometal ensures the circuits electrical functionality. The circuits must be duly preserved by the customer in environments with temperature and humidity controlled in accordance with IPC. 1601. Any non-compliance must be reported to Tecnometal within 12 months from manufacture date. In the case where products non-compliant should be confirmed, Tecnometal will substitute them or repairing them according to the procedure laid down by point 3.8 of this Terms of Delivery. In case that it is not possible replacement or repair of non-compliant products, Tecnometal indemnify the customer of the price paid by the latter only for non-compliant products without any direct and/or indirect additional cost. In any case Tecnometal shall not be responsible for not traceable products, or that not showing the Tecnometal logos didentified under point 3.10 of this Terms of delivery.

TERMS OF DELIVERY TECNOMETAL SRL

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SUMMARY:

1 MATERIALS 4_ 1.1 RIGID LAMINATES 4 1.2 MULTYLAYER CIRCUITS 4 1.3 SOLDER MASK 4

2 DIMENSIONAL SPECIFICATIONS 4_ 2.1 TOLERANCES 4 2.2 MINIMUM CONDUCTOR WIDTH 4 2.3 MINIMUM CONDUCTOR SPACING 4 2.4 METALLIZED HOLES 5 2.5 BOW & TWIST 5 2.6 ANULAR RING 5 2.7 FINGERS 6 2.8 SOLDER MASK 6 3 TECHNICAL SPECIFICATIONS 6_ 3.1 COPPER THICKNESS 6 3.2 SURFACE FINISHING THICKNESS 6 3.3 GOLD FINGERS 7 3.4 SOLDER MASK 7 3.5 SILKSCREEN/LOGOS 7 3.6 PEELABLE 7 3.7 ELECTRIC TEST 7 3.8 REPAIRS 7 3.9 SOLDER MASK TOUCH UP 8 3.10 LOGOS 8

4 SURFACE FINISHES 9_ 4.1 OSP (Organic Solderability Preservative) 9 4.2 HOT AIR SOLDER LEVELLING 9 4.3 CHEMICAL TIN 9 4.4 IMMERSION GOLD - ENIG 9 4.5 IMMERSION SILVER 9 4.6 ELECTROLYTIC GOLD – (HARD GOLD) 9 4.7 ELECTROLYTIC SILVER 10 5 SUBMITED PCB DOCUMENTATION 10_ 6 STATEMENT OF CONFORMITY 10_ 7 CERTIFICATIONS 10_ 8 PROFESSIONAL OBJECTION 11_

TERMS OF DELIVERY TECNOMETAL SRL

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1 MATERIALS

1.1 RIGID LAMINATES Without any specification by the customer, Tecnometal will use FR4 with flammability class V0. Without any specification by the customer, types & specifications of will be chosen by Tecnometal within of its suppliers.

1.2 MULTILAYER CIRCUITS Without any specification by the customer, Tecnometal provides to define the build-up choosing the materials relating to the thickness required.

1.3 SOLDER MASK Solder mask application is compliance to IPC A600 class 2.

2 DIMENSIONAL SPECIFICATIONS

2.1 TOLERANCES

TOLERANCES STANDARD LIST

Holes metallized interaxes: +/- 0,08mm

Holes interaxes mechanical profile: - 0.05 + 0.1 mm

Tolerance holes Press-Fit technology: ±0.05mm (solo con finiture chimiche)

Tolerance holes Not metalizzed: ± 0.1mm

Slot sizes: +/- 0,10mm

V-cut size FR4: 0,40mm +/- 0,10mm

V-cut size CEM: 0,70mm +/- 0,10mm

Rounded corners: 0,60mm (without 90° angles)

Counterbores/countersinks depth: +/- 0.20mm

Interaxes between v-cut & outline: +/- 0,15mm

V-cut angle: 30°

2.2 MINIMUM CONDUCTOR WIDTH

COPPER BASE THICKNESS MINIMUM CONDUCTOR WIDTH

17/17 120µm

35/35 150µm

70/70 200µm

105/105 250µm

2.3 MINIMUM CONDUCTORS SPACING

COPPER BASE THICKNESS MINIMUM CONDUCTORS SPACING

17/17 150µm

35/35 180µm

70/70 250µm

TERMS OF DELIVERY TECNOMETAL SRL

(rev. 0.8 - 22 november 2016)

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105/105 300µm

2.4 METALLIZED HOLES

*diameter and depth hole compare

2.5 BOW & / or TWIST The bow &/or twist are defined by IPC A-600 standard:

- SMT technology maximum value admitted 0,75%; - PTH technology maximum value admitted 1,5%.

2.6 ANULAR RING Anular ring Minimum value 25 µm Example:

When the area is connecting by a trace, the anular ring will be 2/3 of the conductor: Example:

This condition is guaranted if the difference between hole diameter and pad are less then > 40µm.

TYPE MINIMUM SIZES

Vias & components holes

Aspect Ratio* 1:8

Min Hole 200µm

Annular Ring 225µm

Blind Holes

Aspect Ratio 1:1

Min diameter 200µm

Annular Ring 225µm

Spacing between conductors & PCB edges Spacing 200µm

Spacing between conductors & holes Spacing 200µm

Minimum solder bridge 120µm

A => to 2/3 of B

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2.7 FINGERS

Finger between finishing and gold contacts must not interfere holes (and its relative pads) gold fingers:

2.8 SOLDER MASK The solderable areas will be free to any solder mask traces. Will be accepted pads partial coverage provided that the coverage is not grater than > 2/3 and in any case the coverage must not interfere the inside PTH. Example:

3 TECHNICAL SPECIFICATIONS

3.1 COPPER THICKNESS Tecnometal guarantee a copper minimum thickness according to IPC 2221.

IPC Class MEDIUM COPPER THICKNESS

2 >20 µm

3 >25 µm

3.2 SURFACE FINISHING THICKNESS

FINISHES THICKNESS

H.A.S.L. 2/50 µm

ENIG (Oro chimico) Ni 3/6 µm Au >0.05 µm

CHEMICAL TIN >0,8 µm

CHEMICAL AG >0,2 µm

Gold area

Finger.

Finishing

1 mm

1 mm

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3.3 GOLD FINGERS

HARD GOLD Ni 3/6 µm Au 0,8 - 1,25µm

3.4 SOLDER MASK Solder mask must coverage without voids between traces, air balls, color variations and foreign particles. Solder mask will mantain its properties without any alterations, to different kind of welding. IPC-SM-840 standard has two classes:

- T (2), industrial and telecommunication equipment (Tecnometal standard). - H (3), defense and security equipment (If requested by the customer).

Minimum thickness: 8 -10µ T classe - 15- 20 µ H class.

3.5 SILKSCREEN / LOGOS Silkscreen and logos will be applied according to IPC A600 class2.

3.6 PEELABLE The minimum peelable mask is 200µm. The peelable mask could be applied on holes with <1,8mm minimum diameter.

3.7 ELECTRICAL TEST Without any specification by the customer, the PCBs are 100% electrically tested.

3.8 REPAIRS Any repairs will be undertaken according to the project specifications. Tecnometal may perform any repair on interrupted conductors that will subsequently protected by solder mask, to the following conditions: - Maximum conductor width interrupted 0,50 mm - Maximum conductor length interrupted 3.00 mm - Minimum distance between interruptions and pads 5,00 mm - Maximum number of interruptions by trace 1 - Maximum number of interruptions per each PCB 2 - Maximum number of repaired PCB by batch 10% Tecnometal may perform any repair on shorted conductors that will subsequently protected by solder mask, to the following conditions: - Minimum distance from plug and direct connectors 10,00 mm - Maximum number of short between two conductors 1 - Maximum number of short per each PCB 2 - Maximum number of repaired PCB by batch 10% Tecnometal doesn’t undertake repairs in presence of:

- Very Fine Pitch

- Gold finger without solder bridge Tecnometal doesn’t undertake mechanical repairs of metallized holes.

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The PCB provide in a panel for the automatic components assembly, doesn’t contain a scrap percentage over the value indicated on the following table:

3.9 SOLDER MASK TOUCH UP Tecnometal undertake touch up on both sides taking care of solder mask property and PCB aesthetic appearance.

3.10 LOGOS In order to unsure the PCB traceability, TECNOMETAL will apply the following logos provided by Tecnometa S.r.l.:

- TECNOMETAL LOGO - Production DATE - “R” RhOS compliance identifies

If the customer specifically asks not to affix logos for traceability, in case of any non-compliant products, not being able to identify their products, Tecnometal shall not be liable as provided in paragraph "WARRANTY AND LIABILITY '" on page 2 of this Terms of delivery.

N° PCB / Panel N° scraps / %

2-4 1-2

6-8 2

10-12 3

14-16 4

18-20 5

over 20 max 25%

NOTA BENE Tecnometal recommends to store the printed circuits, as well as furnished in packages by 25 PCBs wrapped with "bubble wrap" and vacuum heat-shrinkable (not absolute), at a temperature between 20 and 22 ° C and relative humidity lower than 50%.

After 3 months from the PCB production date is recommended to execute the "baking" for the residual moisture removal.

Temperature and time are established according to the type of finishing (baking NOT executable with OSP, chemical tin and chemical silver finishing) and the laminate thickness;

We recommend to execute the baking with properly stacked and aligned PCB. Don’t move the PCB until they’re cooling.

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4 SURFACE TECHNICAL SPECIFICATIONS

4.1 OSP (Organic Solderability Preservative) Shelf Life 3 months

ADVANTAGES DISADVANTAGES Perfect planar pads

Low ionic contamination

Reworkable

Critical handling

Limited Shelf Life

Not recommended for multiple weldings

4.2 HOT AIR SOLDER LEVELLING Shelf Life 12 months

ADVANTAGES DISADVANTAGES Hig level solderability even after more

passages

Durable solderability

Reworkable

ROHS compliant

PCB Thermal shock

Not recommended in presence of BGA <1mm and/or Very Fine Pitch

4.3 IMMERSION TIN Shelf Life 3 months

ADVANTAGES DISADVANTAGES Perfect planar pads

Ideal to Press-fit

Limited Shelf Life

NO Reworkable

Not suitable to multiple soldering

Critical Handling

4.4 IMMERSION GOLD - ENIG Shelf Life 6 months

ADVANTAGES DISADVANTAGES Perfect planar pads

Very fine Pitch & micro BGA suitable

Welding timing lower than HASL

Critical Handling

4.5 IMMERSION SILVER Shelf Life 6 months

ADVANTAGES DISADVANTAGES Perfect planar pads

Excellent mechanical seal joint

Reworkable

Welding timing lower than HASL

Critical Handling

4.6 ELECTROLITIC GOLD (HARD GOLD) Shelf life 12 months

ADVANTAGES DISADVANTAGES Perfect planar pads

Sliding contacts suitable

Welding timing lower than HASL

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4.7 ELECTROLITIC GOLD (HARD GOLD) - Shelf life 12 months

ADVANTAGES DISADVANTAGES Perfect planar pads

Sliding contacts suitable

Welding timing lower than HASL

5 SUBMITTED PCB DOCUMENTATION

At the time of quote request, with PCBS, the customer may also require the following documentation:

- PCB analysis (metallographical samples) Microscopical analysis according to IPC A 600 and IPC TM650 2.1.1

- Ionic Contamination Analysis Ionic contamination tests according to IPC-TM-650 / MIL 28809 (including a complete report with technical comments and results graph)

- Electrolytic plating analysis XRF - X Rays fluorescence by CMI® systems (Surfaces measures of copper, tin, tin-lead, gold, Nichel plating)

- Thermal stress according to IPC-TM-650 2.6.8 Con pozzetto termostatato in lega di Sn Lead Free

- Impedance controlled tests By Polar software IMDS Module Directly on IMDS web portal - www.mdsystem.com

- PPAP Complete (Control plan, FMEA, Materials certified, Dimentional analysis, Flow chart etc..)

- Film - Baking service

(PCB recondtioning before delivery)

6 STATEMENT OF CONFORMITY

Any supply will be accompanied by the Statement of Conformity issued by Tecnometal S.r.l., attesting the performed verifications and test results.

7 CERTIFICATIONS

UL USA

UL Canada

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8 PROFESSIONAL OBJECTION Tecnometal will not produce and/or provide printed circuit boards intended to construction of weapons or any component or part of these useful working or use of a weapon of any type (chemical, nuclear, other). The customer, ordering Tecnometal srl the production and/or supply of printed circuit boards, accepts the condition of this Terms of delivery and will respect the Tecnometal Professional Objection. If the customer knows or become aware that the circuit required final destination were contrary to the Tecnometal Professional Objection, will not ask to Tecnometal srl to produce and/or provide this circuit.