1410 Martin Avenue • Santa Clara, CA 95050 • 408.727.1418 www.streamlinecircuits.com

“Our strong executive team, state of the art facility and extensive engineering support provide a comprehensive approach to printed circuit board manufacturing that is unparalleled.”

- Chuck Dimick / CEO and Founder of Streamline Circuits

Previously Founder and CEO of Dynamic Details Inc.

Management Team

With over 300 cumulative years of time sensitive PCB experience, our management team knows what it takes to build and sustain a quality facility that can produce the most advanced technology product in the most efficient way. Our team’s reputation for advanced technology leadership and superior quality is widely recognized throughout the industry.

Chuck Dimick CEO and Founder

With over 36 years of industry experience, Chuck Dimick has ultimate responsibility for all areas of the company strategy including operations, finance, product engineering, marketing, and business development. Chuck is the former Chairman and Co-CEO of Dynamic Details Inc. and co-founded the company’s prede- cessor, Dynamic Circuits Inc. DCI was the fastest grow Printed Circuit Board facility of all time, until Stream- line Circuits took the title. He holds a Bachelor of Science in Business Administration from California State University, Chico.

Greg Halvorson President and Founder

Greg Halvorson brings over 31 years of industry experience to Streamline Circuits. As President and Found- er of the company, he is responsible for Engineering Support, Quality and Manufacturing Process Control, while driving the long-term company vision. Prior to joining Streamline Circuits, Greg was the former VP of Operations for Dynamic Details Inc., as well as the Senior Vice President of Operations of Dynamic Circuits, Inc. His expertise includes operations, quality, and engineering, and new product development of cost-effec- tive supply procurement. He holds a Bachelor of Science degree in business Administration from Bemidji State University.

Tom Doslak Vice President of Sales and Marketing and Founder

Tom Doslak brings more than 24 years of PCB sales experience to Streamline Circuits where he is re- sponsible for driving worldwide sales and marketing. Tom joins Streamline Circuits from Braztek, where he was the Director of Worldwide Sales. Prior to that, Tom was Western Regional Sales Manager for Dynamic Details Inc. and was Account Executive for Dynamic Circuits Inc. His responsibilities in addition to driving sales included technical and sales recruiting and training programs. He holds a Bachelor of Science degree in Organizational Communication with a Minor in Marketing from California State University, Chico.

Ed Pitney Operations Manager

Ed Pitney joins Streamline Circuits with 34 years of PCB experience in manufacturing operations management. Ed spent his early career with NTI inc. as operations manager and later transferred to NTI’s Colorado facility as Director of manufacturing Operations. Dynamic Details Inc. then purchased NTI, making Ed part of the corporate management team that analyzed potential acquisitions and that specialized in high tech manufacturing. He then settled into a manufacturing management position. He attended California State University, San Jose.

1410 Martin Avenue • Santa Clara, CA 95050 • 408.727.1418 www.streamlinecircuits.com

Management Te am (cont.)

Lorraine Hook Director of Quality

With over 45 years of industry experience in the quality arena, Lorraine Hook is responsible for the Quality Management Systems of Streamline Circuits. She has contributed to the success of many successful compa- nies including Dynamic Circuits and Dynamic Details. Lorraine has held dual positions as Corporate Quality Systems Manager and Director of Quality.

JR Ramirez Production Manager and Founder

JR Ramirez brings over 32 years of experience to Streamline Circuits.As Production manager he is respon- sible for all of the day-to-day manufacturing through out the facility. Prior to joining Streamline Circuits, JR was the former Production Manager for Dynamic Details Inc. as well as Dynamic Circuits Inc. His expertise includes real time production management and process control.

Steve Morris Director of Engineering

Steve Morris brings over 30 years of PWB Design, Engineering and Support to Streamline Circuits. As Director of Engineering, he is responsible for Engineering Support, Process Control and Implementation. Prior to joining Streamline Circuits, Steve was the VP of Advanced Technology for Multek, a division of Flextronics. Steve was also a key member of the HP PWB Corporate commodity team and PWB Design Manager for HP and Tandem Computers; as well as the Engineering manager of Sigma Circuits.

Louis Oliveira Pre-Production Engineering Manager

Louis Oliveira brings over 27 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. He joined Streamline Circuits in September 2006 as Pre-Production Engineering Manager. From 1998 to 2006, he was Pre-Production Engineering at Dynamic Details, a leading global provider of PCB manufacturing services. From 1987 to 1998, Mr. Oliveira held various key positions at Davila International Circuits.

Phil Ramon Pre-Production Engineering Supervisor

Phil Ramon brings over 36 years of experience in the PCB manufacturing industry. Prior to joining the team at Streamline Circuits he worked for 16 years on the management team for South Bay Circuits, More than 9 years as Pre-Production Engineering Manger and 10 years at CTS Printex. Experience ranges from working in quick turn prototype to volume manufacturing environment and from pre-production to final product.

1 4 1 0 Martin Aven ue • Santa Clara, CA 95050 • 408.727.141 8 www.streamli neci rcuits.com

Let us know how we can help your company get your product to market

faster and more efficiently at the best possible quality & price.

Capabilities

Streamline Circuits Standard Advanced Emerging

Conductor Finishes HASL Yes Yes Yes

Solder with Reflow Yes Yes Yes

White Tin Yes Yes Yes

Carbon Ink (touch pads) Yes Yes Yes

All Body Gold or Selective Yes Yes Yes

Lead Free Electroless Nickel Yes Yes Yes

Immersion Gold Yes Yes Yes

Immersion Silver Yes Yes Yes

Entek I06A HT Yes Yes Yes

HASL Yes Yes Yes

Tolerances Drilled Hole To Copper .008" .005" <.005"

Plated Hole Tolerances [+/-] .003" .002" <.002''

Non Plated Hole Tolerances [+/-] .001" .001" <.001"

Fabrication Tolerances [+/-] .005" .003" <.003"

Via Hole Finish Laser Micro Vias .004 .002 <.002

Blind I Buried Vias .004 .002 <.002

Via Under Pad Yes Yes Yes

Castellation Yes Yes Yes

Laser Drill .004 .002 <.002

Micro Via Mechanical .0059 .0047 <.0047

Tented LPI Coated With LPI Coated/plugged Coated/plugged

Plugged UV Curable [no solvent]Maximum .020" Yes Yes

CopperVia Fill Yes Yes Yes

Silver Conductive Via Fill Yes Yes Yes

Non-conductive Via Fill Yes Yes Yes

Soldermask and Legend Minimum Mask Clearance [LPI] .003" .002" <.002"

Minimum Soldermask Thickness 0.0004 0.0004 0.0004

Soldermask Type LPI Dry Film N/A

Soldermask Color Green Any Color N/A

Soldermask Web Minimum .004'" .003"' <.003"

Legend Color White Any Color Any Color

Legend Feature Size .008"Wide X .030" High Min. .006" Wide X .030" High Min. .003" Wide X .020" High Min.

Flatness (Symmetrical construction) IPC Standard IPC Standard IPC Standard

Flatness (Aymmetrical construction) IPC Standard Review required Review required

1 41 0 Marti n Avenue • Santa Clara, CA 95050 • 408.727.1 4 1 8 www.streamli neci rcuits.com

Streamline Circuits is proud to promote that we are always striving to make advanced

technologies at a standard cost for our customers.

Capabilities

Streamline Circuits Standard Advanced Emerging

Layer Count 2 to 36 48+ 60+

Laminate Material FR4Tg 140 Yes Yes Yes

FR4 Tg 1 70 Yes Yes Yes

Getek Yes Yes Yes

Rogers - All High Frequencies Yes Yes Yes

PTFE Double Sided Yes Yes Yes

BT Double Sided Yes Yes Yes

Polyi mide Yes Yes Yes

Duroid Yes Yes Yes

RoHs Materials Polyclad 370 HR Yes Yes Yes

Isola IS 410 Yes Yes Yes

TUC Yes Yes Yes

Halogen Free Yes Yes Yes

Exotic Material Types 25+ 25+ 25+

Finished Thickness Finished Thickness (Double sided) .005" to .350" >.350" See Advanced

Finished Thickness (Multilayer) .005" to .220" .220"-.250" Greater than .250"

Minimum Core Thickness .002" .002" .001"

Finished Thickness Tolerance [+/-] 10% 7% 5%

Multiple Lami nations 5 9 12+

Copper Foil Weights Internal 1 /4 to 2 oz. 4 to 5 oz. > 5 oz.

Copper Foil Weights External 1/8 to 3 4 to S oz. > 6 oz.

Lines, Spaces & Pad Diameter Internal Line Width .0035" .002" < .002"

Internal Spacing .0035" .002" < .002"

External Line Width .0035" .002" < .002"

External Spacing .0035" .002" < .002"

Int. Pad Size-AIR Per Side (Fin.-.00 I ) .005" .004" Less than .004"

Ext. Pad Size-AIR Per Side (Fin.-.002) .003" .003" Less than .003"

SMT Pitch .011" .010" Less than .0 I O"

Impedance 10% 5% < 5%

Electroplating Tin Lead Plating Thickness .0003 - .0005 >.0005 >.0005

Tin Nickel Plating Thickness 1 50 Microinches 250 Microinches >250 Microinches

Low Stress Nickel I 00 Microinches 250 Microinches >250 Microi nches

Gold Plating Thickness 30 Microinches As Specified As Specified

Minimum Drilled Hole Size .0010" .0059" < .0059"

Hole Aspect Ratio 10 to 1 1 5 to 1 >20 to 1

PREPRODUCTION ENGINEERING Frontline Genesis 2000 Cam Systems (Multiple Seats) In Plan Automated Rule Based Traveler System (Multiple Seats) Xact Predictive Modeling Software, Full Integration with InCam In Cam Advanced Engineering Cam System (Multiple Seats) Applied Simulation CI Field Solver (integrated into InPlan) Polar S.I. 8000 Impedance Field Solver Direct Logix Control Center DFM Optimizer Infinite Graphics (Test Preparation Software) GCA (Fixture Software with Repair Stations) Pentalogix Board Test Fixturing & Verification System Multiple Seats) Internet FTP File Transfer Site-Full TI Connection Fully Integrated Quality/Engineering/Floor Tracking System (2) Fuji High Speed High Resolution Laser Oce Electrostatic D Size printer scanner Oce Scanner D Size Printer

PHOTO Camtek FT 303 Photo Plotter 1/16th mil X-rite film densitometer Morton Diazo Developer Fuji Processor Nuarc Diazo Fliptop Diazo Imager

DRY FILM IMAGING Clean Room Orbotech 8800 (LDI) Paragon Laser Direct Imaging System (2) Orbotech SM20 (LDI) Paragon Laser Direct Imaging System (2) McDermid 410 Pre-Clean-Ultra Thin Core Capability IS Pumiflex Scrub System Teknek Clean Machines (3) Morton Cut-Sheet Laminator 1600D (Inner & Outers) (2) Hakuto Cut-Sheet Laminator Dynachem Vacuum Laminator Dupont Magnum Laminator (2) Dynachem Preheat Transport Spartanic automatic Optical Punch (2) Olec Printer 5-8k (2) VIP Developer Outer Layer Schmid Conveyorized Develop Etch Strip Inner layer Line

LAMINATION OEM Hot Oil lam Press automated 8 Cavity (Hot & Cold) system (2) TMP High Temperature Press for PTFE Bonding Environmentally Controlled Prepreg Storage Room Excellon EX 200 Flash Router Pluritec Inspecta Plotter Diamond High Resolution Post Lamination X-Ray JJA Spot Facer Layer Drying Oven Walbash Press

DRILL/ROUT Excellon Century 2001 Drills High Velocity (4) Excellon 529 High Speed Micro Drill with Vision and Routing Capablity Pluritec MultiStation 6 Station Micro High Speed Drilling Systems Hitachi ND-4L18E High speed Drilling, Vision & Depth Drilling (2) Hitachi ND-5L21E Drill (4) Capacitance & Linear Scale Drilling Network- Window Based Accu Score Jump Score Barnaby Bevel Master Glennbrook Real time X-Ray (2) Hitachi High Speed Router Excellon Mark VI Drill Routers (2) Excellon Mark V Drill Router Excellon EX-200 Drill Router

PLATING IPS Automated Cuposit/Electroless Copper Line Deep Au/Ni Plate Line (Soft Bondable & Hard Gold) Copper/Tin Plate Line Integrated Processing Systems Au/Ni Immersion Line with ENEPIG Silver immersion Line IS Conveyorized Dryfilm Resist Stripper IS Conveyorized Tin Lead Stripper IS Conveyorized Etcher IS Deburr with high pressure and ultrasonic micro hole cleaning Entek106A Plus Line HT (Lead Free Process) Pulse Plating Square Wave and Complex Wave

Integrated Processings Systems Alternative Oxide Inner Layer Adhesion Advanced Plasma System 2400 Plasma Etch System

SILKSCREEN/SOLDERMASK Orbotech InkJet Automated Legend Printing System Sprint 8 DP 1500-Automatic Screening System (2) Palomar screening tables Assorted Cure Ovens VIP Developer LPI Hyoki Aluminum Oxide Jet Scrubber with Acid Pre-clean IS Pumiflex 3Scrub System Lunaire Final Cure Ovens (7)

QUALITY ASSURANCE SUPPORT 2 Complete Laboratories Fully Equiped on Site QPulse Integrated Software Quality Management System Orbotech Power Vison 309 Blaser Large Format (Multiple Systems) (2) Orbotech Discovery OLB New Generation AOI System Orbotech Discovery Micro Technology VeriSmart High Resolution Large Panel Verification Systems (2) Dyna-Scope Verification System (2) Micro Craft Flying Probe Feather Touch Tester (2) ATG A6 16 Head High Speed Flying Probe Tester (soft Gold) ATG A2 16 Head High Speed Flying Probe Tester (Resistor Test Capability 500V) (4) ATG E6 Eliminator High Speed Scanner head (Mil-spec) Polar T.D.R. Machine-CITS 500, Embedded Stripline, Microstrip,

Differential Probing System (2) CMI XRX-XRF Coating Measurement Instrument ( 2 systems fully auto- mated motorized tables) MicroVu Metrology CMM with XYZ Capability (Fully Automatic) Full in House Wet Chemical Analysis Lab Buehler Minimet Polishers Axiovert Metallurgical 600X Microscope with Digital Camera Unico 2800 Uv/Vis Spectrophotometer BioRad Smartspec 3000 Spectrophotometer Perkin Elmer Aanalyst 200 Atomic Absorbtion Spectrometer Hi-Pot Tester Stereo Microscopes (6) Calipers, Hole and Plug Gauges, Optical Comparators True Chem Software

HDI (High Density Interconnect) Equipment ITC Via Plug System (conductive and non-conductive) 100% copper via filling (processing system) - ( 2 lines) Mass SV100 Plannerization System WISE FlatStar, Automated Surface Planarizer CMI PTX200 Eddy Current Copper Thickness Meter (2) ESI 5200 Laser High Speed Drilling/Routing System (4 ) Hitachi CO2 Laser LC1C21E High speed Laser Drill / Router Macdermid Via Filling Plating Systems (2) Dyanachem Vacuum Laminator

ENVIRONMENTAL CONTROL Continuous Flow Pollution Control System 4 Closed Loop Water Cooling System Reverse Osmosis Water Recycling System 47 GPM Continuous Flow Ion Exchange 45 GPM Demonize Water System (40 GPM)

QUALITY CERTIFICATIONS ISO 9001:2000 Registered Military Mil-PRF-55110 Certified International Traffic in Arms Regulations (ITAR) UL Approved for Lead Free, RoHs and Halogen Free Materials AS 9100 Registered Scheduled for NADCAP June 2012 Target Completion of Mil - PRF - 31032 December 2012

REV2012