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By Ben Kowalewski

Ben kowalewski final presentation

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MAE 477 Final Project on Computer Chassis Cooling

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Page 1: Ben kowalewski final presentation

By Ben Kowalewski

Page 2: Ben kowalewski final presentation

Maximizing Cooling Efficiency within desktop computer chassis by studying various fan configurations and orientations, and performing a CFD flow/thermal analysis.

Waste heat from the circuits can be problematic if there is lack of airflow and ventilation.

Overheating can cause performance losses and/or damage to system components.

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Full Tower

Mid Tower

Micro Tower

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Flow Domain

CPU Fan

GPU Fan

Fan Pressure vs. Flowrate Curves

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120mm Case Fans

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CPU Heat Load (125 W)

GPU Heat Load (160 W)

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No Conduction Modeling

Adiabatic Fluid Boundaries, except the flow inlets and outlets.

Restricted Ventilation

Fan curves not perfectly accurate

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Solution 5 has the lowest critical component surface temperatures.

Solution

Max Temp

(F) Ave Temp (F)

CPU Pressure

(PSIe-4)

CPU Flow Rate

(in/s)

CPU Temp

(F)

GPU Pressure

(PSIe-4)

GPU Mass Flux

(lbm/s-in^2)e-3

GPU Temp

(F)

1 184.563 94.628 7.38 36.1 120.4 5.46 2.29 110.60

2 213.394 74.297 2.69 44.5 100.7 7.46 -1.12 119.70

3 165.323 73.002 6.45 41.7 98.85 10.17 -2.36 102.60

4 280.687 73.981 3.52 46.1 95.21 3.95 0.00 146.50

5 151.673 75.421 14.00 34.9 102.5 12.34 -4.93 83.99

Solution

Average

CPU/GPU

Temp

1 115.50

2 110.20

3 100.73

4 120.86

5 93.25

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Fans are placed to blow air in the front of the case, in the side panel, in the top, and out the back.

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