112/14/2010

PCB COST

DRIVERS

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OverviewOverviewMaterial Type Minimum Trace / Space

Layer Count Hole Count

Lead Time Electrical Test Points

Quantity Specification (IPC Class 2,3 / Military)

Filled Vias (via in pad) X-Outs

Board Size (Panel Utilization) Repairs

Minimum Core Thickness Gold Fingers

Copper Weight Heat Sinks

Blind/Buried Vias IST Testing

3

Layer CountLayer Count

Layer Count Factor2 1.04 1.56 2.08 2.7

10 3.212 3.914 4.516 5.018 6.520 8.022 9.524 12.0

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Panelization

Panelization is the process of placing one or more Printed Circuit Boards (PCB’s) on a manufacturing panel and incorporating features to assist manufacturing (such as tooling holes, fiducials, coupons, resin vents, panel thieving, etc.). This is one of the highest impact factors in the cost of a PCB.

The useable area is measured as a percentage (total area for PCB’s divided by the total panel area). PCB’s are arranged in the useable area. Any area outside the useable area is designated for tooling to optimize manufacturing. A target panel utilization of greater than 75% is considered cost effective material utilization.

Useable Panel Area

16.50” x 22.50”

18 inches

16.50 inches

22.5

0 inc

hes

24.0

inch

es

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Assuming a cost of $100.00 per panel the single board price would be $1.00

6

Assuming a cost of $100.00 per panel the single board price would be $1.11

7

Assuming a cost of $100.00 per panel the single board price would be $1.19

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Assuming a cost of $100.00 per panel the single board price would be $1.39

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Assuming a cost of $100.00 per panel the single board price would be $1.39

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Material TypeMaterial Type FactorFactor

Panasonic 1755V 1.0Isola FR408 2.5

Nelco N4000-13 3.0Polyimide (Nelco N7000-2) 4.5

Panasonic Megtron 6 4.8Taconic RF-35 5.0

Rogers RO4350 8.3

Copper weight AddersCopper weight Addersper square foot per per square foot per

sidesideCopper 1/2 oz & 1 oz 0.0

2 oz $2.003 oz $4.00>3oz exponential

Materials Materials ((based on 0.012 1/1)based on 0.012 1/1)

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LEAD TIME Multiplier

4 Weeks 1.0

3 Weeks 1.2

2 Weeks 1.5

7 Days 1.7

5 Days 1.9

3 Days 2.3

1 Days 2.5

Lead TimesLead Times

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Drill Operations Factor

1 1

2 1.4

3 1.5

4 1.6

5 1.8

Blind / Buried ViasBlind / Buried Vias

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ThicknessThickness

PCB Thickness Factor

<= 0.062" 1

0.093 1.05

0.125 1.1

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DrillingDrilling

Drill Size Quantity Factor< 14 1.00

> 15 1.05

Smallest Hole Size

>.008 1.00

<.008 1.05

Hole Count>8000 per panel 0.03 cents per hole

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Line Width / Spacing Factor

>= 0.005" 1.00

0.004" 1.07

0.003" 1.10

Feature GeometryFeature Geometry

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SpecificationSpecification

Requirement Factor

IPC 6012 Class 2 1

IPC 6012 Class 3 1.15

Military 1.25

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Layer Count

double sided $300.00

per additional layer $80.00

Electrical Test

Test Points Cost

< 2000 $500

2001 - 3000 +$100

3001 - 4000 +$100

4001 - 5000 +$100

> 5000 exponential

NRE ChargesNRE Charges

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Via Fill TypeCost / panel

Conductive $125.00 $500 minimumNon Conductive $100.00 $300 minimum

Filled Vias (viaFilled Vias (via--inin--pad)pad)

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Miscellaneous adders

Gold Fingers$30

per panel

X-outs not allowed x1.10

Repairs not allowed x1.05

Edge Plating x1.10

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Online Tools

Cost Change Estimator

http://www.dapc.com/cost/CostAdd.html

http://www.dapc.com/panel/panel

Panel and Array Calculator