Micro Nano Technology CenterVirtual Tour

MNTC Cleanroom Floor Layout

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MNTCGowning Room

What is the Gowning Room?

Things you will find in the gowning room:

Latex Gloves – Protection against fingerprint contamination

Hair Net – Protection against hair contamination

Cleanroom Garments – Designed to cover your clothing and remaining exposed skin

Beard cover – Protection against facial hair contamination

Shoe Covers – To maintain a clean decontaminated floor inside the lab

Telephone – For emergency calls

Sticky Mats – Removes dirt from shoe soles

Lab Sink - For decontamination and safety procedures

In order to protect the lab from impurities, a gowning protocol must be followed prior to entering the lab. Cleanroom gowning is specific to the cleanliness level of the cleanroom environment you are preparing to enter. The MNTC Cleanroom is rated cleanliness level class 100 in all bays and class 10 in the lithography room.

Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot

Safety glasses - Protection for your eyes

MNTCThermal Bay

What is the Thermal Bay?

Equipment you will find in the thermal bay:

The thermal bay is the area inside the lab where thermal microfabrication processing occurs. Thermal oxidations and annealing for film growth are amongst the most common processes performed.

The RTP uses high-intensity visible radiation to heat a single wafer for a short time at precisely controlled temperatures and allows us to quickly grow oxides on wafers

The Thermal spinner bench is used primarily for application of spin-on dopants and spin-on glass compound.

The Lindberg furnaces are used for very high temperature laboratory processes such as oxidation and doping

The LPCVD are furnaces that are capable of Low Pressure Chemical Vapor Deposition.

The Bio MEMS Room is a room used for creating custom PDMS molds

Safety Showers are located in every bay for safety purposes.

Fact : The RTP can heat up a wafer to 1000 C in 1 min

MNTCDeposition Bay

What is the Deposition Bay?

Equipment you will find in the Deposition bay:

The deposition bay is where we place down layers of metallic materials on a wafer of silicon or silicon oxide. The two basic methods for this is to evaporate the desired metal onto it or shooting plasma ions into the metal causing pieces of the metal to shoot out and land on the wafer. This is essential for the lift off process. The photoresist is then stripped off leaving behind the patterned area of metal.

The E-beam Evaporator is a versatile thin film deposition tool that fires super heated metal onto a wafer which forms a thin and near flat film on the wafer.

The thin film deposition tool featuring 3 sputter guns for the deposition of both metals and dielectrics

The Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas state to a solid state on one side of a substrate

The Molecular Vapor Deposition is set up with chemical precursors leading either a hydrophobic or hydrophilic coating

The sputtering system series is a thin film deposition tool that uses a sputter gun for the deposition of both metals and dielectrics

The TF-200 puts down layers of material in multiple layers, each layer is an atom thick. The materials commonly used are aluminum oxide and silicon oxide

Fact : Why is technology expensive. Can you guess?

MNTCWet Etch Bay

What is the Wet Etch Bay?

Things you will find in the Wet Etch Bay:

Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot

The Spin Rinse Dryer (SRD) is used to clean off wafers by rotating them at high rpms which locks them in place with centrifugal force

The Acid Hood is used exclusively for Acid processing

The Solvent s hood is used exclusively for solvent processing

The Base Hood is a hood used exclusively for Base Processing

The Etch Hood is used exclusively for processing with certain etchants

The Coway Megasonic Cleaner is a megasonic based wafer cleaning tool that makes tiny bubbles with a 1.6Mhz megasonic wave that removes impurities

The wet etch bay is the area where most chemistry work occurs, wet processes that are used in film manufacturing, chemical etching and general cleaning processes. Toxic fumes are eliminated via exhaust hoods on the wet benches.

MNTCDry Etch Bay

What is the Dry Etch Bay?

Things you will find in the Dry Etch Bay:

Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot

The DRIE (Deep Reactive Ion Etcher) copies a specific pattern onto silicon wafers which is achieved through etching using specific gases.

The RIE is a Reactive Ion Etching device used to strip resist or etch patterns in wafers after the photolithography process

The Zeiss Zxiolmageer M2m microscope is a high-end light microscope featuring reflectance and transmittance mode

The KJL Ion Milling System is a two source Ion beam based etching system capable of nanometer scale etching of numerous materials

The XeF2 System is a table top etcher that uses Xenon Di-fluoride (XeF2) as the etching gas

The Flip Chip Bonder is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers.

The dry etch bay is the area where we use plasma to etch away materials on a wafer. The main method we use in this bay for etching through materials is to use reactive ions in a plasma to cause the material on wafers to vaporize and collect elsewhere.

Photolithography Bay 2

What is the Photolithography Bay 2?

Things you will find in the Photolithography Bay 2:

Photolithography is the process of making photomasks to easily produce multiple wafer samples with the same structures on them. This is done by using photoresists that react to UV exposure by ether strengthening or weakening it's molecular structure. To weaken the photomask, photoresist is knocked off the wafer exposing what ever materials underneath. This material will either be etched in wet etch bay or have additional layers be placed on top of it in deposition bay.

Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot

The Raith 150 e-beam lithography system is an e-beam based lithography tool capable of minimum feature sizes in the 10’s of nanometer range.

The Heidelberg DWL66FS performs lithography by weakening positive photoresist or strengthening negative photoresist on a wafer by exposing photoresist with high power UV laser

The YES Polyimide Curing Oven is a high temperature vacuum oven capable of operating at up to 550C with controllable atmosphere and pressure.

The SF-100 is an easy to use micro patterning system, which allows users to fabricate micro devices quickly and easily

MNTC

MNTCPhotolithography Bay 1

What is the Photolithography Bay 1?

Things you will find in the Photolithography Bay 1:

Photolithography is the process of making photomasks to easily produce multiple wafer samples with the same structures on them. This is done by using photoresists that react to UV exposure by ether strengthening or weakening it's molecular structure. To weaken the photomask, photoresist is knocked off the wafer exposing what ever materials underneath. This material will either be etched in wet etch bay or have additional layers be placed on top of it in deposition bay.

Fact : The maximum allowable contaminant particle volume for a Class 1 Cleanroom is 0.5 µm per cubic foot

The CPK Spin Dev/Etch Bench is a spinner based system for MF-319 based photolithographic development and chromium etching

The SUSS Mask Aligner is used to align and/or exposure device for substrates used in semiconductor and microsystem technology

The ABM Aligner is used with photomasks to copy designs to a substrate

The SUSS Wafer Bonder is a machine used to bond multiple substrates together